{"meta":{"name":"SEMICON-DB","title":"SEMICON-DB — Global Semiconductor Equipment Intelligence Graph","schema_version":"2.0.0","evidence_as_of":"2026-10-05","batch1_as_of":"2026-09-29","built":"2026-09-29","batches":[{"batch":"Batch 1","date":"2026-09-29","companies":186,"products":154,"sources":351,"customer_links":61,"startups":5,"note":"Legacy public edition (single-file atlas)"},{"batch":"Batch 10","date":"2026-10-05","companies":10,"products":37,"sources":48,"customer_links":0,"startups":0,"facilities":0,"note":"Keyword web search (titles and search-result summaries; egress-restricted, pages not read). Targets: empty equipment categories and thin OEM portfolios."},{"batch":"Batch 11","date":"2026-10-05","companies":0,"products":0,"sources":19,"customer_links":0,"startups":0,"facilities":13,"note":"Facility-level records for India from government releases (pmindia.gov.in, newsonair.gov.in) and national/industry news, located by web search; facts from titles and search-result summaries."},{"batch":"Batch 12","date":"2026-10-05","companies":0,"products":0,"sources":10,"customer_links":0,"startups":0,"facilities":7,"note":"Site-level facilities outside India (leading-edge and mature-node fabs) from industry news located by web search; facts from titles and search-result summaries."},{"batch":"Batch 13","date":"2026-10-05","companies":0,"products":0,"sources":17,"customer_links":0,"startups":0,"facilities":5,"note":"More site-level facilities (one cancelled project, US advanced packaging, memory fabs) and semiconductor policy programmes (US, EU, Japan, Korea), from government pages, filings and industry news located by web search; titles and search-result summaries."},{"batch":"Batch 2","date":"2026-09-30","companies":6,"products":144,"sources":142,"customer_links":0,"startups":0,"facilities":0,"note":"Official manufacturer pages, press releases, brochures and SEC filings located by web search; titles and URLs captured; page content not read (egress-restricted capture environment). All records PARTIALLY_VERIFIED / MEDIUM; no specifications captured."},{"batch":"Batch 3","date":"2026-09-30","companies":68,"products":123,"sources":220,"customer_links":13,"startups":9,"facilities":0,"note":"Small companies and startups found by web search (official product pages, press releases, trade-association directories, investor announcements and industry news). URLs and titles captured; page content not read (egress-restricted capture environment). Company profile facts marked SEARCH_SUMMARY come from search-result summaries of the cited source. All records PARTIALLY_VERIFIED; no specifications captured."},{"batch":"Batch 4","date":"2026-09-30","companies":25,"products":33,"sources":54,"customer_links":0,"startups":2,"facilities":0,"note":"Keyword-driven discovery: equipment and process keywords (e.g. wedge bonder, die sorter, film assisted molding, molecular beam epitaxy, sputtering system, wafer flatness, EUV pellicle, photomask repair, MES, dry vacuum pump, abatement scrubber, process chiller, MEMS release etch, OLED inkjet) searched on the web, prioritising equipment categories with no companies. Each company records its discovery keywords. URLs and titles captured; pages not read. All records PARTIALLY_VERIFIED; no specifications."},{"batch":"Batch 5","date":"2026-09-30","companies":15,"products":26,"sources":43,"customer_links":0,"startups":0,"facilities":0,"note":"Ecosystem widening by keyword search: lapping / polishing, probe cards, power-device test, gas delivery, mask writers, microLED transfer, silicon wafers and CMP / FOUP consumables. URLs and titles captured; pages not read. All records PARTIALLY_VERIFIED; no specifications."},{"batch":"Batch 6","date":"2026-09-30","companies":11,"products":26,"sources":37,"customer_links":0,"startups":0,"facilities":0,"note":"Keyword search across dispensing, wire / die bonding, EFEM and load ports, wafer robots, wet stations, plasma etch, particle monitoring, glass (TGV) processing, temporary bonding and thermo-compression bonders. URLs and titles captured; pages not read. All records PARTIALLY_VERIFIED; no specifications."},{"batch":"Batch 7","date":"2026-09-30","companies":7,"products":0,"sources":8,"customer_links":0,"startups":1,"facilities":0,"note":"Regional and layer discovery: Singapore, Malaysia, India (photonics / lasers) and machine vision. URLs and titles captured; pages not read; directory-level evidence for most. All records PARTIALLY_VERIFIED; no specifications."},{"batch":"Batch 8","date":"2026-09-30","companies":8,"products":18,"sources":25,"customer_links":0,"startups":0,"facilities":0,"note":"Keyword search across PVD / sputtering, packaging wet processing, ion implantation, AOI, lifetime metrology, motion and vacuum components. URLs and titles captured; pages not read. All records PARTIALLY_VERIFIED; no specifications."},{"batch":"Batch 9","date":"2026-10-05","companies":19,"products":7,"sources":31,"customer_links":0,"startups":0,"facilities":0,"note":"Materials and subfab layer plus second-tier equipment: photoresists, wet chemicals, CMP materials, electronic / specialty gases, gas delivery, scrubbers / chillers, wet cleaning, crystal growth, thermal processing, wafer stages. URLs and titles captured from official pages via web search; pages not read. Materials suppliers are recorded at company level (no product models). All records PARTIALLY_VERIFIED; no specifications."},{"batch":"2.0 migration","date":"2026-09-29","note":"Totals after 2.0 normalisation (schema, reference taxonomy, derived relationships) over Batch 1 plus Batch 10, Batch 11, Batch 12, Batch 13, Batch 2, Batch 3, Batch 4, Batch 5, Batch 6, Batch 7, Batch 8, Batch 9","companies":355,"product_families":403,"models":568,"equipment":258,"processes":61,"technologies":83,"materials":47,"applications":20,"subsystems":16,"components":61,"suppliers":355,"fabs":22,"osats":9,"customers":6,"facilities":25,"countries":37,"deals":44,"relationships":6184,"sources":1005}],"counts":{"companies":355,"product_families":403,"models":568,"equipment":258,"processes":61,"technologies":83,"materials":47,"applications":20,"subsystems":16,"components":61,"suppliers":355,"fabs":22,"osats":9,"customers":6,"facilities":25,"countries":37,"deals":44,"relationships":6184,"sources":1005},"id_prefixes":{"company":"CMP","product_family":"PRD","model":"MDL","equipment":"EQP","process":"PRS","technology":"TEC","material":"MAT","application":"APP","subsystem":"SUB","component":"CMPN","fab":"FAB","osat":"OSAT","customer":"CUS","facility":"FAC","country":"CTY","deal":"DEAL","relationship":"REL","source":"SRC","conflict":"CNF","duplicate":"DUP"}},"reference":{"stages":[{"id":"WM","name":"Wafer manufacturing","note":"Substrate production before device processing"},{"id":"FE","name":"Front-end (wafer processing)","note":"Device and interconnect fabrication on the wafer"},{"id":"TS","name":"Wafer test","note":"Electrical test at wafer level"},{"id":"BE","name":"Back-end (assembly & packaging)","note":"Singulation, assembly, encapsulation and final test"},{"id":"AP","name":"Advanced packaging","note":"Heterogeneous integration, wafer- and panel-level packaging"},{"id":"DS","name":"Display & MicroLED","note":"Panel and MicroLED processing that shares laser/thin-film tools"},{"id":"FA","name":"Fab infrastructure & subfab","note":"Automation, vacuum, abatement, utilities supporting the tools"}],"segments":["Wafer Manufacturing","Front-End","Test","Back-End","Advanced Packaging","Display","Automation & Facilities","Device class","Other"],"equipment_groups":[{"code":"A","name":"Wafer Fab / Front-End Equipment"},{"code":"B","name":"Mask / Reticle Equipment"},{"code":"C","name":"Back-End / Packaging"},{"code":"D","name":"Advanced Packaging"},{"code":"E","name":"ATMP / OSAT"},{"code":"F","name":"Power Semiconductor"},{"code":"G","name":"Compound Semiconductors"},{"code":"H","name":"MEMS"},{"code":"I","name":"Display / MicroLED"},{"code":"J","name":"Semiconductor Factory Automation"},{"code":"K","name":"Wafer Manufacturing / Substrate Equipment"},{"code":"L","name":"Subfab & Fab Facilities"}],"synonyms":[["semiconductor equipment","semicon equipment","chip manufacturing equipment","wafer fab equipment","wfe"],["etch","etching","etcher"],["cvd","chemical vapor deposition","chemical vapour deposition"],["pecvd","plasma enhanced cvd","plasma-enhanced chemical vapor deposition"],["pvd","physical vapor deposition","physical vapour deposition","sputtering","sputter"],["ald","atomic layer deposition"],["ate","automated test equipment","tester"],["cmp","chemical mechanical planarization","chemical mechanical polishing","chemical mechanical planarisation"],["euv","extreme ultraviolet"],["duv","deep ultraviolet"],["dicing","wafer dicing"],["stealth dicing","sd engine"],["die attach","die bonding","die bonder"],["tcb","thermo compression bonding","thermocompression bonding","tc bonding","tc bonder"],["hybrid bonding","direct bonding","cu-cu bonding"],["hbm","high bandwidth memory"],["fowlp","fan-out wafer level packaging","fan out","fan-out"],["wlp","wafer level packaging","wafer-level packaging"],["osat","outsourced semiconductor assembly and test"],["atmp","assembly test marking packaging"],["amhs","automated material handling","oht","overhead hoist transport"],["efem","equipment front end module"],["mfc","mass flow controller"],["rf","radio frequency"],["llo","laser lift-off","laser lift off"],["metrology","measurement"],["inspection","defect inspection"],["litho","lithography"],["implant","ion implantation","implanter"],["anneal","annealing"],["galvo","galvanometer scanner","scan head"],["ultrafast","ultrashort pulse","usp"],["tgv","through glass via","glass core"],["tsv","through silicon via"]]},"quality":{"conflicts":[{"id":"CNF-0001","entity":"MDL-000099","also":["CMP-000107"],"field":"Deployment status (SMEE SSA/800)","claims":[{"source_id":"SRC-000187","value":"Never deployed"},{"source_id":"SRC-000189","value":"Reported as scaled / in use (Tier 4)"}],"status":"OPEN","note":"Recorded as NOT_DEPLOYED / Development in Batch 1 pending an official source."},{"id":"CNF-0002","entity":"CMP-000112","also":["CMP-000109"],"field":"Corporate relationship (Skyverse ↔ SiCarrier)","claims":[{"source_id":"SRC-000188","value":"Skyverse described as a SiCarrier materials subsidiary"},{"source_id":null,"value":"Other reporting differs (not captured as a numbered source)"}],"status":"OPEN","note":"Legacy relationship RL032 classified UNKNOWN."},{"id":"CNF-0003","entity":"CMP-000135","field":"Official website domain","claims":[{"source_id":null,"value":"Two domains observed during capture"}],"status":"OPEN","note":"Legacy note: CONFLICT_REVIEW."},{"id":"CNF-0004","entity":"MDL-000073","field":"Stated process speed (Plasma-Therm Singulator)","claims":[{"source_id":"SRC-000231","value":"up to 3,000 mm/s (recorded verbatim, flagged)"}],"status":"REVIEW","note":"Figure recorded verbatim from the source; flagged for technical review, not corrected."},{"id":"CNF-0005","entity":"CMP-000049","field":"Financial unit (Revenue, FY3/26 (Apr 2025-Mar 2026))","claims":[{"source_id":"SRC-000237","value":"JPY 54360"},{"source_id":"SRC-000238","value":"JPY 54360"}],"status":"OPEN","note":"Fetch rendered '543.6 bn yen'; interpreted as 543.6 x 100M yen. Verify unit before use"},{"id":"CNF-0006","entity":"CMP-000049","field":"Financial unit (Operating income, FY3/26 (Apr 2025-Mar 2026))","claims":[{"source_id":"SRC-000237","value":"JPY 6910"}],"status":"OPEN","note":"Rendered '69.1'; interpreted x 100M yen"},{"id":"CNF-0007","entity":"CMP-000049","field":"Financial unit (Revenue guidance, FY3/27 (Apr 2026-Mar 2027))","claims":[{"source_id":"SRC-000237","value":"JPY 64000"},{"source_id":"SRC-000238","value":"JPY 64000"}],"status":"OPEN","note":"+17.7% (S0238 headline +17%)"},{"id":"CNF-0008","entity":"FAC-000003","field":"Investment","claims":[{"source_id":"SRC-000961","value":"about ₹7,500 crore"},{"source_id":"SRC-000968","value":"over ₹7,600 crore over five years (G1 + G2)"}],"status":"OPEN","note":"Several investment figures were reported for this site; they may cover different scopes or phases. Not reconciled."},{"id":"CNF-0009","entity":"FAC-000010","field":"Investment","claims":[{"source_id":"SRC-000969","value":"over ₹460 crore (initial phase, per coverage)"},{"source_id":"SRC-000969","value":"US$260 million (headline figure)"}],"status":"OPEN","note":"Several investment figures were reported for this site; they may cover different scopes or phases. Not reconciled."}],"duplicate_candidates":[{"id":"DUP-0001","entity_type":"company","a":"CMP-000001","b":"CMP-000006","a_name":"ASML Holding","b_name":"ASM International (ASMI)","similarity":0.8,"reasons":["name similarity 0.80"],"known_relationship":null,"resolution":"Distinct entities (name overlap)","decision":{"a":"C0001","b":"C0006","status":"DISTINCT_ENTITIES","reviewed":"2026-10-05","resolution":"Distinct entities (name overlap)","note":"ASML Holding and ASM International are separate companies with separate records, websites and product lines; the shared letters are not an alias."}},{"id":"DUP-0002","entity_type":"company","a":"CMP-000001","b":"CMP-000192","a_name":"ASML Holding","b_name":"ASM Technologies","similarity":0.8,"reasons":["name similarity 0.80"],"known_relationship":null,"resolution":"Distinct entities (name overlap)","decision":{"a":"C0001","b":"C0192","status":"DISTINCT_ENTITIES","reviewed":"2026-10-05","resolution":"Distinct entities (name overlap)","note":"Different companies; name overlap only."}},{"id":"DUP-0003","entity_type":"company","a":"CMP-000003","b":"CMP-000104","a_name":"Lam Research","b_name":"ACM Research","similarity":0.82,"reasons":["name similarity 0.82"],"known_relationship":null,"resolution":"Needs review — not merged","decision":null},{"id":"DUP-0004","entity_type":"company","a":"CMP-000006","b":"CMP-000192","a_name":"ASM International (ASMI)","b_name":"ASM Technologies","similarity":1,"reasons":["name similarity 1.00","shared resolution key “asm”"],"known_relationship":null,"resolution":"Distinct entities (name overlap)","decision":{"a":"C0006","b":"C0192","status":"DISTINCT_ENTITIES","reviewed":"2026-10-05","resolution":"Distinct entities (name overlap)","note":"ASM International (Netherlands, deposition equipment) and ASM Technologies (India) are different companies."}},{"id":"DUP-0005","entity_type":"company","a":"CMP-000013","b":"CMP-000335","a_name":"Canon Inc.","b_name":"CANON ANELVA","similarity":0.53,"reasons":["one name contains the other"],"known_relationship":null,"resolution":"Needs review — not merged","decision":null},{"id":"DUP-0006","entity_type":"company","a":"CMP-000014","b":"CMP-000148","a_name":"Veeco Instruments","b_name":"MKS Instruments","similarity":0.73,"reasons":["name similarity 0.73"],"known_relationship":null,"resolution":"Needs review — not merged","decision":null},{"id":"DUP-0007","entity_type":"company","a":"CMP-000016","b":"CMP-000017","a_name":"Onto Innovation","b_name":"Nova Ltd.","similarity":0.35,"reasons":["one name contains the other"],"known_relationship":null,"resolution":"Needs review — not merged","decision":null},{"id":"DUP-0008","entity_type":"company","a":"CMP-000017","b":"CMP-000142","a_name":"Nova Ltd.","b_name":"Synova","similarity":0.75,"reasons":["name similarity 0.75","one name contains the other"],"known_relationship":null,"resolution":"Needs review — not merged","decision":null},{"id":"DUP-0009","entity_type":"company","a":"CMP-000017","b":"CMP-000151","a_name":"Nova Ltd.","b_name":"Novanta (Cambridge Technology / Synrad)","similarity":0.67,"reasons":["one name contains the other"],"known_relationship":null,"resolution":"Needs review — not merged","decision":null},{"id":"DUP-0010","entity_type":"company","a":"CMP-000017","b":"CMP-000217","a_name":"Nova Ltd.","b_name":"SVCS Process Innovation","similarity":0.24,"reasons":["one name contains the other"],"known_relationship":null,"resolution":"Needs review — not merged","decision":null},{"id":"DUP-0011","entity_type":"company","a":"CMP-000043","b":"CMP-000227","a_name":"BE Semiconductor Industries (BESI)","b_name":"Halo Industries","similarity":0.77,"reasons":["name similarity 0.77"],"known_relationship":null,"resolution":"Needs review — not merged","decision":null},{"id":"DUP-0012","entity_type":"company","a":"CMP-000044","b":"CMP-000045","a_name":"ASMPT","b_name":"ASMPT ALSI (Advanced Laser Separation International)","similarity":0.62,"reasons":["one name contains the other"],"known_relationship":"SUBSIDIARY","resolution":"Known relationship recorded — kept as separate entities","decision":null},{"id":"DUP-0013","entity_type":"company","a":"CMP-000048","b":"CMP-000280","a_name":"Hanwha Semitech","b_name":"ITEC","similarity":0.35,"reasons":["one name contains the other"],"known_relationship":null,"resolution":"Needs review — not merged","decision":null},{"id":"DUP-0014","entity_type":"company","a":"CMP-000056","b":"CMP-000264","a_name":"PacTech","b_name":"KCTech","similarity":0.73,"reasons":["name similarity 0.73"],"known_relationship":null,"resolution":"Needs review — not merged","decision":null},{"id":"DUP-0015","entity_type":"company","a":"CMP-000059","b":"CMP-000131","a_name":"Lintec","b_name":"Intech Technologies","similarity":0.8,"reasons":["name similarity 0.80"],"known_relationship":null,"resolution":"Needs review — not merged","decision":null},{"id":"DUP-0016","entity_type":"company","a":"CMP-000068","b":"CMP-000075","a_name":"SFA Engineering","b_name":"Top Engineering","similarity":0.79,"reasons":["name similarity 0.79"],"known_relationship":null,"resolution":"Needs review — not merged","decision":null},{"id":"DUP-0017","entity_type":"company","a":"CMP-000068","b":"CMP-000368","a_name":"SFA Engineering","b_name":"Charm Engineering","similarity":0.73,"reasons":["name similarity 0.73"],"known_relationship":null,"resolution":"Needs review — not merged","decision":null},{"id":"DUP-0018","entity_type":"company","a":"CMP-000068","b":"CMP-000221","a_name":"SFA Engineering","b_name":"Yield Engineering Systems (YES)","similarity":0.73,"reasons":["name similarity 0.73"],"known_relationship":null,"resolution":"Needs review — not merged","decision":null},{"id":"DUP-0019","entity_type":"company","a":"CMP-000068","b":"CMP-000233","a_name":"SFA Engineering","b_name":"Toray Engineering","similarity":0.73,"reasons":["name similarity 0.73"],"known_relationship":null,"resolution":"Needs review — not merged","decision":null},{"id":"DUP-0020","entity_type":"company","a":"CMP-000075","b":"CMP-000368","a_name":"Top Engineering","b_name":"Charm Engineering","similarity":0.73,"reasons":["name similarity 0.73"],"known_relationship":null,"resolution":"Needs review — not merged","decision":null},{"id":"DUP-0021","entity_type":"company","a":"CMP-000075","b":"CMP-000221","a_name":"Top Engineering","b_name":"Yield Engineering Systems (YES)","similarity":0.73,"reasons":["name similarity 0.73"],"known_relationship":null,"resolution":"Needs review — not merged","decision":null},{"id":"DUP-0022","entity_type":"company","a":"CMP-000075","b":"CMP-000233","a_name":"Top Engineering","b_name":"Toray Engineering","similarity":0.8,"reasons":["name similarity 0.80"],"known_relationship":null,"resolution":"Needs review — not merged","decision":null},{"id":"DUP-0023","entity_type":"company","a":"CMP-000116","b":"CMP-000357","a_name":"JSG","b_name":"Zhejiang Jingsheng Mechanical & Electrical (JSG)","similarity":0,"reasons":["shared resolution key “jsg”"],"known_relationship":null,"resolution":"Probable same entity — not merged","decision":{"a":"C0116","b":"C0357","status":"PROBABLE_SAME_ENTITY","reviewed":"2026-10-05","resolution":"Probable same entity — not merged","note":"“JSG” (Batch 1, wafer thinning, China, directory-level source) matches the short form used by Zhejiang Jingsheng Mechanical & Electrical (Batch 9, official site jsjd.cc). Kept as two records until a source ties the Batch-1 entry to Jingsheng; read them together."}},{"id":"DUP-0024","entity_type":"company","a":"CMP-000124","b":"CMP-000224","a_name":"HSET","b_name":"SET (Smart Equipment Technology)","similarity":0.8,"reasons":["name similarity 0.80"],"known_relationship":null,"resolution":"Needs review — not merged","decision":null},{"id":"DUP-0025","entity_type":"company","a":"CMP-000132","b":"CMP-000146","a_name":"HiPA Photonics","b_name":"IPG Photonics","similarity":0.8,"reasons":["name similarity 0.80"],"known_relationship":null,"resolution":"Needs review — not merged","decision":null},{"id":"DUP-0026","entity_type":"company","a":"CMP-000132","b":"CMP-000178","a_name":"HiPA Photonics","b_name":"NKT Photonics","similarity":0.72,"reasons":["name similarity 0.72"],"known_relationship":null,"resolution":"Needs review — not merged","decision":null},{"id":"DUP-0027","entity_type":"company","a":"CMP-000146","b":"CMP-000178","a_name":"IPG Photonics","b_name":"NKT Photonics","similarity":0.75,"reasons":["name similarity 0.75"],"known_relationship":null,"resolution":"Needs review — not merged","decision":null},{"id":"DUP-0028","entity_type":"company","a":"CMP-000148","b":"CMP-000275","a_name":"MKS Instruments","b_name":"Excel Instruments","similarity":0.73,"reasons":["name similarity 0.73"],"known_relationship":null,"resolution":"Needs review — not merged","decision":null},{"id":"DUP-0029","entity_type":"company","a":"CMP-000199","b":"CMP-000349","a_name":"Linde India","b_name":"Linde (Electronics)","similarity":0.57,"reasons":["one name contains the other"],"known_relationship":null,"resolution":"Needs review — not merged","decision":null},{"id":"DUP-0030","entity_type":"company","a":"CMP-000211","b":"CMP-000341","a_name":"Heidelberg Instruments","b_name":"Freiberg Instruments","similarity":0.8,"reasons":["name similarity 0.80"],"known_relationship":null,"resolution":"Needs review — not merged","decision":null},{"id":"DUP-0031","entity_type":"company","a":"CMP-000241","b":"CMP-000300","a_name":"Evatec","b_name":"Kateeva","similarity":0.73,"reasons":["name similarity 0.73"],"known_relationship":null,"resolution":"Needs review — not merged","decision":null},{"id":"DUP-0032","entity_type":"company","a":"CMP-000249","b":"CMP-000356","a_name":"UNISERS","b_name":"UNISEM (Korea)","similarity":0.73,"reasons":["name similarity 0.73"],"known_relationship":null,"resolution":"Needs review — not merged","decision":null},{"id":"DUP-0033","entity_type":"company","a":"CMP-000280","b":"CMP-000302","a_name":"ITEC","b_name":"Logitech","similarity":0.6,"reasons":["one name contains the other"],"known_relationship":null,"resolution":"Needs review — not merged","decision":null}],"validation":{"checked_records":9204,"errors":[],"warnings":[{"rule":"normalize.wafer","message":"Laser grooving platform · LASER1205 - Grooving UV USP: wafer value \"10-250 um thick wafers\" not normalised to a diameter","id":"MDL-000015"},{"rule":"normalize.wafer","message":"Laser dicing platform · LASER1205 - Dicing UVP: wafer value \"10-250 um thick\" not normalised to a diameter","id":"MDL-000017"},{"rule":"source.date","message":"SRC-000006 has no publication / evidence date","id":"SRC-000006"},{"rule":"source.date","message":"SRC-000013 has no publication / evidence date","id":"SRC-000013"},{"rule":"source.date","message":"SRC-000014 has no publication / evidence date","id":"SRC-000014"},{"rule":"source.date","message":"SRC-000039 has no publication / evidence date","id":"SRC-000039"},{"rule":"source.date","message":"SRC-000052 has no publication / evidence date","id":"SRC-000052"},{"rule":"source.access","message":"SRC-000052 was not accessible at capture","id":"SRC-000052"},{"rule":"source.date","message":"SRC-000054 has no publication / evidence date","id":"SRC-000054"},{"rule":"source.date","message":"SRC-000055 has no publication / evidence date","id":"SRC-000055"},{"rule":"source.date","message":"SRC-000056 has no publication / evidence date","id":"SRC-000056"},{"rule":"source.date","message":"SRC-000057 has no publication / evidence date","id":"SRC-000057"},{"rule":"source.date","message":"SRC-000058 has no publication / evidence date","id":"SRC-000058"},{"rule":"source.date","message":"SRC-000059 has no publication / evidence date","id":"SRC-000059"},{"rule":"source.date","message":"SRC-000060 has no publication / evidence date","id":"SRC-000060"},{"rule":"source.date","message":"SRC-000061 has no publication / evidence date","id":"SRC-000061"},{"rule":"source.date","message":"SRC-000062 has no publication / evidence date","id":"SRC-000062"},{"rule":"source.date","message":"SRC-000063 has no publication / evidence date","id":"SRC-000063"},{"rule":"source.date","message":"SRC-000065 has no publication / evidence date","id":"SRC-000065"},{"rule":"source.date","message":"SRC-000067 has no publication / evidence date","id":"SRC-000067"},{"rule":"source.date","message":"SRC-000068 has no publication / evidence date","id":"SRC-000068"},{"rule":"source.date","message":"SRC-000069 has no publication / evidence date","id":"SRC-000069"},{"rule":"source.date","message":"SRC-000075 has no publication / evidence date","id":"SRC-000075"},{"rule":"source.date","message":"SRC-000077 has no publication / evidence date","id":"SRC-000077"},{"rule":"source.date","message":"SRC-000078 has no publication / evidence date","id":"SRC-000078"},{"rule":"source.date","message":"SRC-000083 has no publication / evidence date","id":"SRC-000083"},{"rule":"source.date","message":"SRC-000089 has no publication / evidence date","id":"SRC-000089"},{"rule":"source.date","message":"SRC-000093 has no publication / evidence date","id":"SRC-000093"},{"rule":"source.date","message":"SRC-000096 has no publication / evidence date","id":"SRC-000096"},{"rule":"source.date","message":"SRC-000097 has no publication / evidence date","id":"SRC-000097"},{"rule":"source.date","message":"SRC-000098 has no publication / evidence date","id":"SRC-000098"},{"rule":"source.date","message":"SRC-000099 has no publication / evidence date","id":"SRC-000099"},{"rule":"source.date","message":"SRC-000102 has no publication / evidence date","id":"SRC-000102"},{"rule":"source.date","message":"SRC-000103 has no publication / evidence date","id":"SRC-000103"},{"rule":"source.date","message":"SRC-000104 has no publication / evidence date","id":"SRC-000104"},{"rule":"source.date","message":"SRC-000105 has no publication / evidence date","id":"SRC-000105"},{"rule":"source.date","message":"SRC-000106 has no publication / evidence date","id":"SRC-000106"},{"rule":"source.date","message":"SRC-000108 has no publication / evidence date","id":"SRC-000108"},{"rule":"source.date","message":"SRC-000111 has no publication / evidence date","id":"SRC-000111"},{"rule":"source.date","message":"SRC-000112 has no publication / evidence date","id":"SRC-000112"},{"rule":"source.date","message":"SRC-000113 has no publication / evidence date","id":"SRC-000113"},{"rule":"source.date","message":"SRC-000123 has no publication / evidence date","id":"SRC-000123"},{"rule":"source.date","message":"SRC-000164 has no publication / evidence date","id":"SRC-000164"},{"rule":"source.date","message":"SRC-000168 has no publication / evidence date","id":"SRC-000168"},{"rule":"source.date","message":"SRC-000181 has no publication / evidence date","id":"SRC-000181"},{"rule":"source.date","message":"SRC-000200 has no publication / evidence date","id":"SRC-000200"},{"rule":"source.access","message":"SRC-000202 was not accessible at capture","id":"SRC-000202"},{"rule":"source.access","message":"SRC-000204 was not accessible at capture","id":"SRC-000204"},{"rule":"source.date","message":"SRC-000208 has no publication / evidence date","id":"SRC-000208"},{"rule":"source.date","message":"SRC-000213 has no publication / evidence date","id":"SRC-000213"},{"rule":"source.access","message":"SRC-000215 was not accessible at capture","id":"SRC-000215"},{"rule":"source.date","message":"SRC-000216 has no publication / evidence date","id":"SRC-000216"},{"rule":"source.date","message":"SRC-000218 has no publication / evidence date","id":"SRC-000218"},{"rule":"source.access","message":"SRC-000218 was not accessible at capture","id":"SRC-000218"},{"rule":"source.date","message":"SRC-000223 has no publication / evidence date","id":"SRC-000223"},{"rule":"source.date","message":"SRC-000224 has no publication / evidence date","id":"SRC-000224"},{"rule":"source.date","message":"SRC-000225 has no publication / evidence date","id":"SRC-000225"},{"rule":"source.date","message":"SRC-000226 has no publication / evidence date","id":"SRC-000226"},{"rule":"source.date","message":"SRC-000229 has no publication / evidence date","id":"SRC-000229"},{"rule":"source.date","message":"SRC-000231 has no publication / evidence date","id":"SRC-000231"},{"rule":"source.date","message":"SRC-000232 has no publication / evidence date","id":"SRC-000232"},{"rule":"source.date","message":"SRC-000234 has no publication / evidence date","id":"SRC-000234"},{"rule":"source.date","message":"SRC-000235 has no publication / evidence date","id":"SRC-000235"},{"rule":"source.access","message":"SRC-000235 was not accessible at capture","id":"SRC-000235"},{"rule":"source.date","message":"SRC-000236 has no publication / evidence date","id":"SRC-000236"},{"rule":"source.date","message":"SRC-000239 has no publication / evidence date","id":"SRC-000239"},{"rule":"source.date","message":"SRC-000240 has no publication / evidence date","id":"SRC-000240"},{"rule":"source.date","message":"SRC-000243 has no publication / evidence date","id":"SRC-000243"},{"rule":"source.date","message":"SRC-000244 has no publication / evidence date","id":"SRC-000244"},{"rule":"source.date","message":"SRC-000245 has no publication / evidence date","id":"SRC-000245"},{"rule":"source.date","message":"SRC-000247 has no publication / evidence date","id":"SRC-000247"},{"rule":"source.date","message":"SRC-000248 has no publication / evidence date","id":"SRC-000248"},{"rule":"source.date","message":"SRC-000249 has no publication / evidence date","id":"SRC-000249"},{"rule":"source.access","message":"SRC-000249 was not accessible at capture","id":"SRC-000249"},{"rule":"source.date","message":"SRC-000251 has no publication / evidence date","id":"SRC-000251"},{"rule":"source.date","message":"SRC-000252 has no publication / evidence date","id":"SRC-000252"},{"rule":"source.date","message":"SRC-000253 has no publication / evidence date","id":"SRC-000253"},{"rule":"source.date","message":"SRC-000254 has no publication / evidence date","id":"SRC-000254"},{"rule":"source.date","message":"SRC-000255 has no publication / evidence date","id":"SRC-000255"},{"rule":"source.date","message":"SRC-000256 has no publication / evidence date","id":"SRC-000256"},{"rule":"source.date","message":"SRC-000257 has no publication / evidence date","id":"SRC-000257"},{"rule":"source.date","message":"SRC-000258 has no publication / evidence date","id":"SRC-000258"},{"rule":"source.date","message":"SRC-000259 has no publication / evidence date","id":"SRC-000259"},{"rule":"source.date","message":"SRC-000260 has no publication / evidence date","id":"SRC-000260"},{"rule":"source.date","message":"SRC-000261 has no publication / evidence date","id":"SRC-000261"},{"rule":"source.date","message":"SRC-000262 has no publication / evidence date","id":"SRC-000262"},{"rule":"source.date","message":"SRC-000263 has no publication / evidence date","id":"SRC-000263"},{"rule":"source.date","message":"SRC-000264 has no publication / evidence date","id":"SRC-000264"},{"rule":"source.date","message":"SRC-000265 has no publication / evidence date","id":"SRC-000265"},{"rule":"source.date","message":"SRC-000266 has no publication / evidence date","id":"SRC-000266"},{"rule":"source.date","message":"SRC-000267 has no publication / evidence date","id":"SRC-000267"},{"rule":"source.date","message":"SRC-000268 has no publication / evidence date","id":"SRC-000268"},{"rule":"source.date","message":"SRC-000269 has no publication / evidence date","id":"SRC-000269"},{"rule":"source.date","message":"SRC-000270 has no publication / evidence date","id":"SRC-000270"},{"rule":"source.date","message":"SRC-000271 has no publication / evidence date","id":"SRC-000271"},{"rule":"source.date","message":"SRC-000272 has no publication / evidence date","id":"SRC-000272"},{"rule":"source.date","message":"SRC-000273 has no publication / evidence date","id":"SRC-000273"},{"rule":"source.date","message":"SRC-000274 has no publication / evidence date","id":"SRC-000274"},{"rule":"source.date","message":"SRC-000275 has no publication / evidence date","id":"SRC-000275"},{"rule":"source.date","message":"SRC-000276 has no publication / evidence date","id":"SRC-000276"},{"rule":"source.date","message":"SRC-000277 has no publication / evidence date","id":"SRC-000277"},{"rule":"source.date","message":"SRC-000278 has no publication / evidence date","id":"SRC-000278"},{"rule":"source.date","message":"SRC-000280 has no publication / evidence date","id":"SRC-000280"},{"rule":"source.date","message":"SRC-000281 has no publication / evidence date","id":"SRC-000281"},{"rule":"source.date","message":"SRC-000283 has no publication / evidence date","id":"SRC-000283"},{"rule":"source.date","message":"SRC-000284 has no publication / evidence date","id":"SRC-000284"},{"rule":"source.date","message":"SRC-000285 has no publication / evidence date","id":"SRC-000285"},{"rule":"source.date","message":"SRC-000286 has no publication / evidence date","id":"SRC-000286"},{"rule":"source.date","message":"SRC-000287 has no publication / evidence date","id":"SRC-000287"},{"rule":"source.date","message":"SRC-000290 has no publication / evidence date","id":"SRC-000290"},{"rule":"source.date","message":"SRC-000291 has no publication / evidence date","id":"SRC-000291"},{"rule":"source.date","message":"SRC-000292 has no publication / evidence date","id":"SRC-000292"},{"rule":"source.date","message":"SRC-000293 has no publication / evidence date","id":"SRC-000293"},{"rule":"source.date","message":"SRC-000294 has no publication / evidence date","id":"SRC-000294"},{"rule":"source.date","message":"SRC-000296 has no publication / evidence date","id":"SRC-000296"},{"rule":"source.date","message":"SRC-000298 has no publication / evidence date","id":"SRC-000298"},{"rule":"source.date","message":"SRC-000300 has no publication / evidence date","id":"SRC-000300"},{"rule":"source.date","message":"SRC-000301 has no publication / evidence date","id":"SRC-000301"},{"rule":"source.date","message":"SRC-000304 has no publication / evidence date","id":"SRC-000304"},{"rule":"source.date","message":"SRC-000305 has no publication / evidence date","id":"SRC-000305"},{"rule":"source.date","message":"SRC-000307 has no publication / evidence date","id":"SRC-000307"},{"rule":"source.access","message":"SRC-000307 was not accessible at capture","id":"SRC-000307"},{"rule":"source.date","message":"SRC-000310 has no publication / evidence date","id":"SRC-000310"},{"rule":"source.date","message":"SRC-000311 has no publication / evidence date","id":"SRC-000311"},{"rule":"source.date","message":"SRC-000312 has no publication / evidence date","id":"SRC-000312"},{"rule":"source.date","message":"SRC-000318 has no publication / evidence date","id":"SRC-000318"},{"rule":"source.date","message":"SRC-000319 has no publication / evidence date","id":"SRC-000319"},{"rule":"source.date","message":"SRC-000320 has no publication / evidence date","id":"SRC-000320"},{"rule":"source.date","message":"SRC-000321 has no publication / evidence date","id":"SRC-000321"},{"rule":"source.date","message":"SRC-000322 has no publication / evidence date","id":"SRC-000322"},{"rule":"source.date","message":"SRC-000323 has no publication / evidence date","id":"SRC-000323"},{"rule":"source.date","message":"SRC-000324 has no publication / evidence date","id":"SRC-000324"},{"rule":"source.date","message":"SRC-000325 has no publication / evidence date","id":"SRC-000325"},{"rule":"source.date","message":"SRC-000328 has no publication / evidence date","id":"SRC-000328"},{"rule":"source.date","message":"SRC-000329 has no publication / evidence date","id":"SRC-000329"},{"rule":"source.date","message":"SRC-000330 has no publication / evidence date","id":"SRC-000330"},{"rule":"source.date","message":"SRC-000331 has no publication / evidence date","id":"SRC-000331"},{"rule":"source.date","message":"SRC-000332 has no publication / evidence date","id":"SRC-000332"},{"rule":"source.date","message":"SRC-000334 has no publication / evidence date","id":"SRC-000334"},{"rule":"source.date","message":"SRC-000335 has no publication / evidence date","id":"SRC-000335"},{"rule":"source.date","message":"SRC-000336 has no publication / evidence date","id":"SRC-000336"},{"rule":"source.date","message":"SRC-000339 has no publication / evidence date","id":"SRC-000339"},{"rule":"source.date","message":"SRC-000340 has no publication / evidence date","id":"SRC-000340"},{"rule":"source.date","message":"SRC-000341 has no publication / evidence date","id":"SRC-000341"},{"rule":"source.date","message":"SRC-000342 has no publication / evidence date","id":"SRC-000342"},{"rule":"source.date","message":"SRC-000343 has no publication / evidence date","id":"SRC-000343"},{"rule":"source.date","message":"SRC-000344 has no publication / evidence date","id":"SRC-000344"},{"rule":"source.date","message":"SRC-000347 has no publication / evidence date","id":"SRC-000347"},{"rule":"source.date","message":"SRC-000348 has no publication / evidence date","id":"SRC-000348"},{"rule":"source.date","message":"SRC-000349 has no publication / evidence date","id":"SRC-000349"},{"rule":"source.date","message":"SRC-000910 has no publication / evidence date","id":"SRC-000910"},{"rule":"source.search_index","message":"SRC-000910: official URL/title confirmed via web search only; page not read","id":"SRC-000910"},{"rule":"source.date","message":"SRC-000911 has no publication / evidence date","id":"SRC-000911"},{"rule":"source.search_index","message":"SRC-000911: official URL/title confirmed via web search only; page not read","id":"SRC-000911"},{"rule":"source.date","message":"SRC-000912 has no publication / evidence date","id":"SRC-000912"},{"rule":"source.search_index","message":"SRC-000912: official URL/title confirmed via web search only; page not read","id":"SRC-000912"},{"rule":"source.date","message":"SRC-000913 has no publication / evidence date","id":"SRC-000913"},{"rule":"source.search_index","message":"SRC-000913: official URL/title confirmed via web search only; page not read","id":"SRC-000913"},{"rule":"source.date","message":"SRC-000914 has no publication / evidence date","id":"SRC-000914"},{"rule":"source.search_index","message":"SRC-000914: official URL/title confirmed via web search only; page not read","id":"SRC-000914"},{"rule":"source.date","message":"SRC-000915 has no publication / evidence date","id":"SRC-000915"},{"rule":"source.search_index","message":"SRC-000915: official URL/title confirmed via web search only; page not read","id":"SRC-000915"},{"rule":"source.date","message":"SRC-000916 has no publication / evidence date","id":"SRC-000916"},{"rule":"source.search_index","message":"SRC-000916: official URL/title confirmed via web search only; page not read","id":"SRC-000916"},{"rule":"source.date","message":"SRC-000917 has no publication / evidence date","id":"SRC-000917"},{"rule":"source.search_index","message":"SRC-000917: official URL/title confirmed via web search only; page not read","id":"SRC-000917"},{"rule":"source.date","message":"SRC-000918 has no publication / evidence date","id":"SRC-000918"},{"rule":"source.search_index","message":"SRC-000918: official URL/title confirmed via web search only; page not read","id":"SRC-000918"},{"rule":"source.date","message":"SRC-000919 has no publication / evidence date","id":"SRC-000919"},{"rule":"source.search_index","message":"SRC-000919: official URL/title confirmed via web search only; page not read","id":"SRC-000919"},{"rule":"source.date","message":"SRC-000920 has no publication / evidence date","id":"SRC-000920"},{"rule":"source.search_index","message":"SRC-000920: official URL/title confirmed via web search only; page not read","id":"SRC-000920"},{"rule":"source.date","message":"SRC-000921 has no publication / evidence date","id":"SRC-000921"},{"rule":"source.search_index","message":"SRC-000921: official URL/title confirmed via web search only; page not read","id":"SRC-000921"},{"rule":"source.search_index","message":"SRC-000922: official URL/title confirmed via web search only; page not read","id":"SRC-000922"},{"rule":"source.date","message":"SRC-000923 has no publication / evidence date","id":"SRC-000923"},{"rule":"source.search_index","message":"SRC-000923: official URL/title confirmed via web search only; page not read","id":"SRC-000923"},{"rule":"source.date","message":"SRC-000924 has no publication / evidence date","id":"SRC-000924"},{"rule":"source.search_index","message":"SRC-000924: official URL/title confirmed via web search only; page not read","id":"SRC-000924"},{"rule":"source.date","message":"SRC-000925 has no publication / evidence date","id":"SRC-000925"},{"rule":"source.search_index","message":"SRC-000925: official URL/title confirmed via web search only; page not read","id":"SRC-000925"},{"rule":"source.date","message":"SRC-000926 has no publication / evidence date","id":"SRC-000926"},{"rule":"source.search_index","message":"SRC-000926: official URL/title confirmed via web search only; page not read","id":"SRC-000926"},{"rule":"source.date","message":"SRC-000927 has no publication / evidence date","id":"SRC-000927"},{"rule":"source.search_index","message":"SRC-000927: official URL/title confirmed via web search only; page not read","id":"SRC-000927"},{"rule":"source.date","message":"SRC-000928 has no publication / evidence date","id":"SRC-000928"},{"rule":"source.search_index","message":"SRC-000928: official URL/title confirmed via web search only; page not read","id":"SRC-000928"},{"rule":"source.date","message":"SRC-000929 has no publication / evidence date","id":"SRC-000929"},{"rule":"source.search_index","message":"SRC-000929: official URL/title confirmed via web search only; page not read","id":"SRC-000929"},{"rule":"source.date","message":"SRC-000930 has no publication / evidence date","id":"SRC-000930"},{"rule":"source.search_index","message":"SRC-000930: official URL/title confirmed via web search only; page not read","id":"SRC-000930"},{"rule":"source.date","message":"SRC-000931 has no publication / evidence date","id":"SRC-000931"},{"rule":"source.search_index","message":"SRC-000931: official URL/title confirmed via web search only; page not read","id":"SRC-000931"},{"rule":"source.date","message":"SRC-000932 has no publication / evidence date","id":"SRC-000932"},{"rule":"source.search_index","message":"SRC-000932: official URL/title confirmed via web search only; page not read","id":"SRC-000932"},{"rule":"source.date","message":"SRC-000933 has no publication / evidence date","id":"SRC-000933"},{"rule":"source.search_index","message":"SRC-000933: official URL/title confirmed via web search only; page not read","id":"SRC-000933"},{"rule":"source.search_index","message":"SRC-000934: official URL/title confirmed via web search only; page not read","id":"SRC-000934"},{"rule":"source.date","message":"SRC-000935 has no publication / evidence date","id":"SRC-000935"},{"rule":"source.search_index","message":"SRC-000935: official URL/title confirmed via web search only; page not read","id":"SRC-000935"},{"rule":"source.date","message":"SRC-000936 has no publication / evidence date","id":"SRC-000936"},{"rule":"source.search_index","message":"SRC-000936: official URL/title confirmed via web search only; page not read","id":"SRC-000936"},{"rule":"source.date","message":"SRC-000937 has no publication / evidence date","id":"SRC-000937"},{"rule":"source.search_index","message":"SRC-000937: official URL/title confirmed via web search only; page not read","id":"SRC-000937"},{"rule":"source.date","message":"SRC-000938 has no publication / evidence date","id":"SRC-000938"},{"rule":"source.search_index","message":"SRC-000938: official URL/title confirmed via web search only; page not read","id":"SRC-000938"},{"rule":"source.date","message":"SRC-000939 has no publication / evidence date","id":"SRC-000939"},{"rule":"source.search_index","message":"SRC-000939: official URL/title confirmed via web search only; page not read","id":"SRC-000939"},{"rule":"source.date","message":"SRC-000940 has no publication / evidence date","id":"SRC-000940"},{"rule":"source.search_index","message":"SRC-000940: official URL/title confirmed via web search only; page not read","id":"SRC-000940"},{"rule":"source.date","message":"SRC-000941 has no publication / evidence date","id":"SRC-000941"},{"rule":"source.search_index","message":"SRC-000941: official URL/title confirmed via web search only; page not read","id":"SRC-000941"},{"rule":"source.search_index","message":"SRC-000942: official URL/title confirmed via web search only; page not read","id":"SRC-000942"},{"rule":"source.search_index","message":"SRC-000943: official URL/title confirmed via web search only; page not read","id":"SRC-000943"},{"rule":"source.date","message":"SRC-000944 has no publication / evidence date","id":"SRC-000944"},{"rule":"source.search_index","message":"SRC-000944: official URL/title confirmed via web search only; page not read","id":"SRC-000944"},{"rule":"source.search_index","message":"SRC-000945: official URL/title confirmed via web search only; page not read","id":"SRC-000945"},{"rule":"source.search_index","message":"SRC-000946: official URL/title confirmed via web search only; page not read","id":"SRC-000946"},{"rule":"source.date","message":"SRC-000947 has no publication / evidence date","id":"SRC-000947"},{"rule":"source.search_index","message":"SRC-000947: official URL/title confirmed via web search only; page not read","id":"SRC-000947"},{"rule":"source.date","message":"SRC-000948 has no publication / evidence date","id":"SRC-000948"},{"rule":"source.search_index","message":"SRC-000948: official URL/title confirmed via web search only; page not read","id":"SRC-000948"},{"rule":"source.date","message":"SRC-000949 has no publication / evidence date","id":"SRC-000949"},{"rule":"source.search_index","message":"SRC-000949: official URL/title confirmed via web search only; page not read","id":"SRC-000949"},{"rule":"source.date","message":"SRC-000950 has no publication / evidence date","id":"SRC-000950"},{"rule":"source.search_index","message":"SRC-000950: official URL/title confirmed via web search only; page not read","id":"SRC-000950"},{"rule":"source.date","message":"SRC-000951 has no publication / evidence date","id":"SRC-000951"},{"rule":"source.search_index","message":"SRC-000951: official URL/title confirmed via web search only; page not read","id":"SRC-000951"},{"rule":"source.search_index","message":"SRC-000952: official URL/title confirmed via web search only; page not read","id":"SRC-000952"},{"rule":"source.date","message":"SRC-000953 has no publication / evidence date","id":"SRC-000953"},{"rule":"source.search_index","message":"SRC-000953: official URL/title confirmed via web search only; page not read","id":"SRC-000953"},{"rule":"source.date","message":"SRC-000954 has no publication / evidence date","id":"SRC-000954"},{"rule":"source.search_index","message":"SRC-000954: official URL/title confirmed via web search only; page not read","id":"SRC-000954"},{"rule":"source.date","message":"SRC-000955 has no publication / evidence date","id":"SRC-000955"},{"rule":"source.search_index","message":"SRC-000955: official URL/title confirmed via web search only; page not read","id":"SRC-000955"},{"rule":"source.date","message":"SRC-000956 has no publication / evidence date","id":"SRC-000956"},{"rule":"source.search_index","message":"SRC-000956: official URL/title confirmed via web search only; page not read","id":"SRC-000956"},{"rule":"source.date","message":"SRC-000957 has no publication / evidence date","id":"SRC-000957"},{"rule":"source.search_index","message":"SRC-000957: official URL/title confirmed via web search only; page not read","id":"SRC-000957"},{"rule":"source.search_index","message":"SRC-000958: official URL/title confirmed via web search only; page not read","id":"SRC-000958"},{"rule":"source.search_index","message":"SRC-000959: official URL/title confirmed via web search only; page not read","id":"SRC-000959"},{"rule":"source.search_index","message":"SRC-000960: official URL/title confirmed via web search only; page not read","id":"SRC-000960"},{"rule":"source.search_index","message":"SRC-000961: official URL/title confirmed via web search only; page not read","id":"SRC-000961"},{"rule":"source.search_index","message":"SRC-000962: official URL/title confirmed via web search only; page not read","id":"SRC-000962"},{"rule":"source.search_index","message":"SRC-000963: official URL/title confirmed via web search only; page not read","id":"SRC-000963"},{"rule":"source.search_index","message":"SRC-000964: official URL/title confirmed via web search only; page not read","id":"SRC-000964"},{"rule":"source.search_index","message":"SRC-000965: official URL/title confirmed via web search only; page not read","id":"SRC-000965"},{"rule":"source.search_index","message":"SRC-000966: official URL/title confirmed via web search only; page not read","id":"SRC-000966"},{"rule":"source.search_index","message":"SRC-000967: official URL/title confirmed via web search only; page not read","id":"SRC-000967"},{"rule":"source.search_index","message":"SRC-000968: official URL/title confirmed via web search only; page not read","id":"SRC-000968"},{"rule":"source.search_index","message":"SRC-000969: official URL/title confirmed via web search only; page not read","id":"SRC-000969"},{"rule":"source.search_index","message":"SRC-000970: official URL/title confirmed via web search only; page not read","id":"SRC-000970"},{"rule":"source.search_index","message":"SRC-000971: official URL/title confirmed via web search only; page not read","id":"SRC-000971"},{"rule":"source.date","message":"SRC-000972 has no publication / evidence date","id":"SRC-000972"},{"rule":"source.search_index","message":"SRC-000972: official URL/title confirmed via web search only; page not read","id":"SRC-000972"},{"rule":"source.search_index","message":"SRC-000973: official URL/title confirmed via web search only; page not read","id":"SRC-000973"},{"rule":"source.search_index","message":"SRC-000974: official URL/title confirmed via web search only; page not read","id":"SRC-000974"},{"rule":"source.search_index","message":"SRC-000975: official URL/title confirmed via web search only; page not read","id":"SRC-000975"},{"rule":"source.search_index","message":"SRC-000976: official URL/title confirmed via web search only; page not read","id":"SRC-000976"},{"rule":"source.search_index","message":"SRC-000977: official URL/title confirmed via web search only; page not read","id":"SRC-000977"},{"rule":"source.search_index","message":"SRC-000978: official URL/title confirmed via web search only; page not read","id":"SRC-000978"},{"rule":"source.search_index","message":"SRC-000979: official URL/title confirmed via web search only; page not read","id":"SRC-000979"},{"rule":"source.search_index","message":"SRC-000980: official URL/title confirmed via web search only; page not read","id":"SRC-000980"},{"rule":"source.search_index","message":"SRC-000981: official URL/title confirmed via web search only; page not read","id":"SRC-000981"},{"rule":"source.search_index","message":"SRC-000982: official URL/title confirmed via web search only; page not read","id":"SRC-000982"},{"rule":"source.search_index","message":"SRC-000983: official URL/title confirmed via web search only; page not read","id":"SRC-000983"},{"rule":"source.date","message":"SRC-000984 has no publication / evidence date","id":"SRC-000984"},{"rule":"source.search_index","message":"SRC-000984: official URL/title confirmed via web search only; page not read","id":"SRC-000984"},{"rule":"source.search_index","message":"SRC-000985: official URL/title confirmed via web search only; page not read","id":"SRC-000985"},{"rule":"source.search_index","message":"SRC-000986: official URL/title confirmed via web search only; page not read","id":"SRC-000986"},{"rule":"source.search_index","message":"SRC-000987: official URL/title confirmed via web search only; page not read","id":"SRC-000987"},{"rule":"source.search_index","message":"SRC-000988: official URL/title confirmed via web search only; page not read","id":"SRC-000988"},{"rule":"source.search_index","message":"SRC-000989: official URL/title confirmed via web search only; page not read","id":"SRC-000989"},{"rule":"source.search_index","message":"SRC-000990: official URL/title confirmed via web search only; page not read","id":"SRC-000990"},{"rule":"source.search_index","message":"SRC-000991: official URL/title confirmed via web search only; page not read","id":"SRC-000991"},{"rule":"source.search_index","message":"SRC-000992: official URL/title confirmed via web search only; page not read","id":"SRC-000992"},{"rule":"source.search_index","message":"SRC-000993: official URL/title confirmed via web search only; page not read","id":"SRC-000993"},{"rule":"source.search_index","message":"SRC-000994: official URL/title confirmed via web search only; page not read","id":"SRC-000994"},{"rule":"source.date","message":"SRC-000995 has no publication / evidence date","id":"SRC-000995"},{"rule":"source.search_index","message":"SRC-000995: official URL/title confirmed via web search only; page not read","id":"SRC-000995"},{"rule":"source.search_index","message":"SRC-000996: official URL/title confirmed via web search only; page not read","id":"SRC-000996"},{"rule":"source.search_index","message":"SRC-000997: official URL/title confirmed via web search only; page not read","id":"SRC-000997"},{"rule":"source.search_index","message":"SRC-000998: official URL/title confirmed via web search only; page not read","id":"SRC-000998"},{"rule":"source.search_index","message":"SRC-000999: official URL/title confirmed via web search only; page not read","id":"SRC-000999"},{"rule":"source.date","message":"SRC-001000 has no publication / evidence date","id":"SRC-001000"},{"rule":"source.search_index","message":"SRC-001000: official URL/title confirmed via web search only; page not read","id":"SRC-001000"},{"rule":"source.search_index","message":"SRC-001001: official URL/title confirmed via web search only; page not read","id":"SRC-001001"},{"rule":"source.search_index","message":"SRC-001002: official URL/title confirmed via web search only; page not read","id":"SRC-001002"},{"rule":"source.search_index","message":"SRC-001003: official URL/title confirmed via web search only; page not read","id":"SRC-001003"},{"rule":"source.search_index","message":"SRC-000350: official URL/title confirmed via web search only; page not read","id":"SRC-000350"},{"rule":"source.date","message":"SRC-000351 has no publication / evidence date","id":"SRC-000351"},{"rule":"source.search_index","message":"SRC-000351: official URL/title confirmed via web search only; page not read","id":"SRC-000351"},{"rule":"source.date","message":"SRC-000352 has no publication / evidence date","id":"SRC-000352"},{"rule":"source.search_index","message":"SRC-000352: official URL/title confirmed via web search only; page not read","id":"SRC-000352"},{"rule":"source.date","message":"SRC-000353 has no publication / evidence date","id":"SRC-000353"},{"rule":"source.search_index","message":"SRC-000353: official URL/title confirmed via web search only; page not read","id":"SRC-000353"},{"rule":"source.date","message":"SRC-000354 has no publication / evidence date","id":"SRC-000354"},{"rule":"source.search_index","message":"SRC-000354: official URL/title confirmed via web search only; page not read","id":"SRC-000354"},{"rule":"source.date","message":"SRC-000355 has no publication / evidence date","id":"SRC-000355"},{"rule":"source.search_index","message":"SRC-000355: official URL/title confirmed via web search only; page not read","id":"SRC-000355"},{"rule":"source.date","message":"SRC-000356 has no publication / evidence date","id":"SRC-000356"},{"rule":"source.search_index","message":"SRC-000356: official URL/title confirmed via web search only; page not read","id":"SRC-000356"},{"rule":"source.date","message":"SRC-000357 has no publication / evidence date","id":"SRC-000357"},{"rule":"source.search_index","message":"SRC-000357: official URL/title confirmed via web search only; page not read","id":"SRC-000357"},{"rule":"source.date","message":"SRC-000358 has no publication / evidence date","id":"SRC-000358"},{"rule":"source.search_index","message":"SRC-000358: official URL/title confirmed via web search only; page not read","id":"SRC-000358"},{"rule":"source.date","message":"SRC-000359 has no publication / evidence date","id":"SRC-000359"},{"rule":"source.search_index","message":"SRC-000359: official URL/title confirmed via web search only; page not read","id":"SRC-000359"},{"rule":"source.date","message":"SRC-000360 has no publication / evidence date","id":"SRC-000360"},{"rule":"source.search_index","message":"SRC-000360: official URL/title confirmed via web search only; page not read","id":"SRC-000360"},{"rule":"source.date","message":"SRC-000361 has no publication / evidence date","id":"SRC-000361"},{"rule":"source.search_index","message":"SRC-000361: official URL/title confirmed via web search only; page not read","id":"SRC-000361"},{"rule":"source.date","message":"SRC-000362 has no publication / evidence date","id":"SRC-000362"},{"rule":"source.search_index","message":"SRC-000362: official URL/title confirmed via web search only; page not read","id":"SRC-000362"},{"rule":"source.date","message":"SRC-000363 has no publication / evidence date","id":"SRC-000363"},{"rule":"source.search_index","message":"SRC-000363: official URL/title confirmed via web search only; page not read","id":"SRC-000363"},{"rule":"source.date","message":"SRC-000364 has no publication / evidence date","id":"SRC-000364"},{"rule":"source.search_index","message":"SRC-000364: official URL/title confirmed via web search only; page not read","id":"SRC-000364"},{"rule":"source.date","message":"SRC-000365 has no publication / evidence date","id":"SRC-000365"},{"rule":"source.search_index","message":"SRC-000365: official URL/title confirmed via web search only; page not read","id":"SRC-000365"},{"rule":"source.date","message":"SRC-000366 has no publication / evidence date","id":"SRC-000366"},{"rule":"source.search_index","message":"SRC-000366: official URL/title confirmed via web search only; page not read","id":"SRC-000366"},{"rule":"source.date","message":"SRC-000367 has no publication / evidence date","id":"SRC-000367"},{"rule":"source.search_index","message":"SRC-000367: official URL/title confirmed via web search only; page not read","id":"SRC-000367"},{"rule":"source.date","message":"SRC-000368 has no publication / evidence date","id":"SRC-000368"},{"rule":"source.search_index","message":"SRC-000368: official URL/title confirmed via web search only; page not read","id":"SRC-000368"},{"rule":"source.date","message":"SRC-000369 has no publication / evidence date","id":"SRC-000369"},{"rule":"source.search_index","message":"SRC-000369: official URL/title confirmed via web search only; page not read","id":"SRC-000369"},{"rule":"source.date","message":"SRC-000370 has no publication / evidence date","id":"SRC-000370"},{"rule":"source.search_index","message":"SRC-000370: official URL/title confirmed via web search only; page not read","id":"SRC-000370"},{"rule":"source.date","message":"SRC-000371 has no publication / evidence date","id":"SRC-000371"},{"rule":"source.search_index","message":"SRC-000371: official URL/title confirmed via web search only; page not read","id":"SRC-000371"},{"rule":"source.date","message":"SRC-000372 has no publication / evidence date","id":"SRC-000372"},{"rule":"source.search_index","message":"SRC-000372: official URL/title confirmed via web search only; page not read","id":"SRC-000372"},{"rule":"source.date","message":"SRC-000373 has no publication / evidence date","id":"SRC-000373"},{"rule":"source.search_index","message":"SRC-000373: official URL/title confirmed via web search only; page not read","id":"SRC-000373"},{"rule":"source.date","message":"SRC-000374 has no publication / evidence date","id":"SRC-000374"},{"rule":"source.search_index","message":"SRC-000374: official URL/title confirmed via web search only; page not read","id":"SRC-000374"},{"rule":"source.date","message":"SRC-000375 has no publication / evidence date","id":"SRC-000375"},{"rule":"source.search_index","message":"SRC-000375: official URL/title confirmed via web search only; page not read","id":"SRC-000375"},{"rule":"source.date","message":"SRC-000376 has no publication / evidence date","id":"SRC-000376"},{"rule":"source.search_index","message":"SRC-000376: official URL/title confirmed via web search only; page not read","id":"SRC-000376"},{"rule":"source.date","message":"SRC-000377 has no publication / evidence date","id":"SRC-000377"},{"rule":"source.search_index","message":"SRC-000377: official URL/title confirmed via web search only; page not read","id":"SRC-000377"},{"rule":"source.date","message":"SRC-000378 has no publication / evidence date","id":"SRC-000378"},{"rule":"source.search_index","message":"SRC-000378: official URL/title confirmed via web search only; page not read","id":"SRC-000378"},{"rule":"source.date","message":"SRC-000379 has no publication / evidence date","id":"SRC-000379"},{"rule":"source.search_index","message":"SRC-000379: official URL/title confirmed via web search only; page not read","id":"SRC-000379"},{"rule":"source.search_index","message":"SRC-000380: official URL/title confirmed via web search only; page not read","id":"SRC-000380"},{"rule":"source.date","message":"SRC-000381 has no publication / evidence date","id":"SRC-000381"},{"rule":"source.search_index","message":"SRC-000381: official URL/title confirmed via web search only; page not read","id":"SRC-000381"},{"rule":"source.search_index","message":"SRC-000382: official URL/title confirmed via web search only; page not read","id":"SRC-000382"},{"rule":"source.date","message":"SRC-000383 has no publication / evidence date","id":"SRC-000383"},{"rule":"source.search_index","message":"SRC-000383: official URL/title confirmed via web search only; page not read","id":"SRC-000383"},{"rule":"source.date","message":"SRC-000384 has no publication / evidence date","id":"SRC-000384"},{"rule":"source.search_index","message":"SRC-000384: official URL/title confirmed via web search only; page not read","id":"SRC-000384"},{"rule":"source.date","message":"SRC-000385 has no publication / evidence date","id":"SRC-000385"},{"rule":"source.search_index","message":"SRC-000385: official URL/title confirmed via web search only; page not read","id":"SRC-000385"},{"rule":"source.search_index","message":"SRC-000386: official URL/title confirmed via web search only; page not read","id":"SRC-000386"},{"rule":"source.date","message":"SRC-000387 has no publication / evidence date","id":"SRC-000387"},{"rule":"source.search_index","message":"SRC-000387: official URL/title confirmed via web search only; page not read","id":"SRC-000387"},{"rule":"source.date","message":"SRC-000388 has no publication / evidence date","id":"SRC-000388"},{"rule":"source.search_index","message":"SRC-000388: official URL/title confirmed via web search only; page not read","id":"SRC-000388"},{"rule":"source.search_index","message":"SRC-000389: official URL/title confirmed via web search only; page not read","id":"SRC-000389"},{"rule":"source.search_index","message":"SRC-000390: official URL/title confirmed via web search only; page not read","id":"SRC-000390"},{"rule":"source.search_index","message":"SRC-000391: official URL/title confirmed via web search only; page not read","id":"SRC-000391"},{"rule":"source.search_index","message":"SRC-000392: official URL/title confirmed via web search only; page not read","id":"SRC-000392"},{"rule":"source.date","message":"SRC-000393 has no publication / evidence date","id":"SRC-000393"},{"rule":"source.search_index","message":"SRC-000393: official URL/title confirmed via web search only; page not read","id":"SRC-000393"},{"rule":"source.search_index","message":"SRC-000394: official URL/title confirmed via web search only; page not read","id":"SRC-000394"},{"rule":"source.search_index","message":"SRC-000395: official URL/title confirmed via web search only; page not read","id":"SRC-000395"},{"rule":"source.date","message":"SRC-000396 has no publication / evidence date","id":"SRC-000396"},{"rule":"source.search_index","message":"SRC-000396: official URL/title confirmed via web search only; page not read","id":"SRC-000396"},{"rule":"source.date","message":"SRC-000397 has no publication / evidence date","id":"SRC-000397"},{"rule":"source.search_index","message":"SRC-000397: official URL/title confirmed via web search only; page not read","id":"SRC-000397"},{"rule":"source.date","message":"SRC-000398 has no publication / evidence date","id":"SRC-000398"},{"rule":"source.search_index","message":"SRC-000398: official URL/title confirmed via web search only; page not read","id":"SRC-000398"},{"rule":"source.date","message":"SRC-000399 has no publication / evidence date","id":"SRC-000399"},{"rule":"source.search_index","message":"SRC-000399: official URL/title confirmed via web search only; page not read","id":"SRC-000399"},{"rule":"source.date","message":"SRC-000400 has no publication / evidence date","id":"SRC-000400"},{"rule":"source.search_index","message":"SRC-000400: official URL/title confirmed via web search only; page not read","id":"SRC-000400"},{"rule":"source.date","message":"SRC-000401 has no publication / evidence date","id":"SRC-000401"},{"rule":"source.search_index","message":"SRC-000401: official URL/title confirmed via web search only; page not read","id":"SRC-000401"},{"rule":"source.date","message":"SRC-000402 has no publication / evidence date","id":"SRC-000402"},{"rule":"source.search_index","message":"SRC-000402: official URL/title confirmed via web search only; page not read","id":"SRC-000402"},{"rule":"source.date","message":"SRC-000403 has no publication / evidence date","id":"SRC-000403"},{"rule":"source.search_index","message":"SRC-000403: official URL/title confirmed via web search only; page not read","id":"SRC-000403"},{"rule":"source.date","message":"SRC-000404 has no publication / evidence date","id":"SRC-000404"},{"rule":"source.search_index","message":"SRC-000404: official URL/title confirmed via web search only; page not read","id":"SRC-000404"},{"rule":"source.date","message":"SRC-000405 has no publication / evidence date","id":"SRC-000405"},{"rule":"source.search_index","message":"SRC-000405: official URL/title confirmed via web search only; page not read","id":"SRC-000405"},{"rule":"source.date","message":"SRC-000406 has no publication / evidence date","id":"SRC-000406"},{"rule":"source.search_index","message":"SRC-000406: official URL/title confirmed via web search only; page not read","id":"SRC-000406"},{"rule":"source.date","message":"SRC-000407 has no publication / evidence date","id":"SRC-000407"},{"rule":"source.search_index","message":"SRC-000407: official URL/title confirmed via web search only; page not read","id":"SRC-000407"},{"rule":"source.date","message":"SRC-000408 has no publication / evidence date","id":"SRC-000408"},{"rule":"source.search_index","message":"SRC-000408: official URL/title confirmed via web search only; page not read","id":"SRC-000408"},{"rule":"source.date","message":"SRC-000409 has no publication / evidence date","id":"SRC-000409"},{"rule":"source.search_index","message":"SRC-000409: official URL/title confirmed via web search only; page not read","id":"SRC-000409"},{"rule":"source.date","message":"SRC-000410 has no publication / evidence date","id":"SRC-000410"},{"rule":"source.search_index","message":"SRC-000410: official URL/title confirmed via web search only; page not read","id":"SRC-000410"},{"rule":"source.date","message":"SRC-000411 has no publication / evidence date","id":"SRC-000411"},{"rule":"source.search_index","message":"SRC-000411: official URL/title confirmed via web search only; page not read","id":"SRC-000411"},{"rule":"source.search_index","message":"SRC-000412: official URL/title confirmed via web search only; page not read","id":"SRC-000412"},{"rule":"source.date","message":"SRC-000413 has no publication / evidence date","id":"SRC-000413"},{"rule":"source.search_index","message":"SRC-000413: official URL/title confirmed via web search only; page not read","id":"SRC-000413"},{"rule":"source.date","message":"SRC-000414 has no publication / evidence date","id":"SRC-000414"},{"rule":"source.search_index","message":"SRC-000414: official URL/title confirmed via web search only; page not read","id":"SRC-000414"},{"rule":"source.search_index","message":"SRC-000415: official URL/title confirmed via web search only; page not read","id":"SRC-000415"},{"rule":"source.date","message":"SRC-000416 has no publication / evidence date","id":"SRC-000416"},{"rule":"source.search_index","message":"SRC-000416: official URL/title confirmed via web search only; page not read","id":"SRC-000416"},{"rule":"source.date","message":"SRC-000417 has no publication / evidence date","id":"SRC-000417"},{"rule":"source.search_index","message":"SRC-000417: official URL/title confirmed via web search only; page not read","id":"SRC-000417"},{"rule":"source.date","message":"SRC-000418 has no publication / evidence date","id":"SRC-000418"},{"rule":"source.search_index","message":"SRC-000418: official URL/title confirmed via web search only; page not read","id":"SRC-000418"},{"rule":"source.date","message":"SRC-000419 has no publication / evidence date","id":"SRC-000419"},{"rule":"source.search_index","message":"SRC-000419: official URL/title confirmed via web search only; page not read","id":"SRC-000419"},{"rule":"source.date","message":"SRC-000420 has no publication / evidence date","id":"SRC-000420"},{"rule":"source.search_index","message":"SRC-000420: official URL/title confirmed via web search only; page not read","id":"SRC-000420"},{"rule":"source.date","message":"SRC-000421 has no publication / evidence date","id":"SRC-000421"},{"rule":"source.search_index","message":"SRC-000421: official URL/title confirmed via web search only; page not read","id":"SRC-000421"},{"rule":"source.date","message":"SRC-000422 has no publication / evidence date","id":"SRC-000422"},{"rule":"source.search_index","message":"SRC-000422: official URL/title confirmed via web search only; page not read","id":"SRC-000422"},{"rule":"source.date","message":"SRC-000423 has no publication / evidence date","id":"SRC-000423"},{"rule":"source.search_index","message":"SRC-000423: official URL/title confirmed via web search only; page not read","id":"SRC-000423"},{"rule":"source.date","message":"SRC-000424 has no publication / evidence date","id":"SRC-000424"},{"rule":"source.search_index","message":"SRC-000424: official URL/title confirmed via web search only; page not read","id":"SRC-000424"},{"rule":"source.date","message":"SRC-000425 has no publication / evidence date","id":"SRC-000425"},{"rule":"source.search_index","message":"SRC-000425: official URL/title confirmed via web search only; page not read","id":"SRC-000425"},{"rule":"source.date","message":"SRC-000426 has no publication / evidence date","id":"SRC-000426"},{"rule":"source.search_index","message":"SRC-000426: official URL/title confirmed via web search only; page not read","id":"SRC-000426"},{"rule":"source.date","message":"SRC-000427 has no publication / evidence date","id":"SRC-000427"},{"rule":"source.search_index","message":"SRC-000427: official URL/title confirmed via web search only; page not read","id":"SRC-000427"},{"rule":"source.date","message":"SRC-000428 has no publication / evidence date","id":"SRC-000428"},{"rule":"source.search_index","message":"SRC-000428: official URL/title confirmed via web search only; page not read","id":"SRC-000428"},{"rule":"source.date","message":"SRC-000429 has no publication / evidence date","id":"SRC-000429"},{"rule":"source.search_index","message":"SRC-000429: official URL/title confirmed via web search only; page not read","id":"SRC-000429"},{"rule":"source.search_index","message":"SRC-000430: official URL/title confirmed via web search only; page not read","id":"SRC-000430"},{"rule":"source.date","message":"SRC-000431 has no publication / evidence date","id":"SRC-000431"},{"rule":"source.search_index","message":"SRC-000431: official URL/title confirmed via web search only; page not read","id":"SRC-000431"},{"rule":"source.date","message":"SRC-000432 has no publication / evidence date","id":"SRC-000432"},{"rule":"source.search_index","message":"SRC-000432: official URL/title confirmed via web search only; page not read","id":"SRC-000432"},{"rule":"source.date","message":"SRC-000433 has no publication / evidence date","id":"SRC-000433"},{"rule":"source.search_index","message":"SRC-000433: official URL/title confirmed via web search only; page not read","id":"SRC-000433"},{"rule":"source.search_index","message":"SRC-000434: official URL/title confirmed via web search only; page not read","id":"SRC-000434"},{"rule":"source.date","message":"SRC-000435 has no publication / evidence date","id":"SRC-000435"},{"rule":"source.search_index","message":"SRC-000435: official URL/title confirmed via web search only; page not read","id":"SRC-000435"},{"rule":"source.date","message":"SRC-000436 has no publication / evidence date","id":"SRC-000436"},{"rule":"source.search_index","message":"SRC-000436: official URL/title confirmed via web search only; page not read","id":"SRC-000436"},{"rule":"source.date","message":"SRC-000437 has no publication / evidence date","id":"SRC-000437"},{"rule":"source.search_index","message":"SRC-000437: official URL/title confirmed via web search only; page not read","id":"SRC-000437"},{"rule":"source.date","message":"SRC-000438 has no publication / evidence date","id":"SRC-000438"},{"rule":"source.search_index","message":"SRC-000438: official URL/title confirmed via web search only; page not read","id":"SRC-000438"},{"rule":"source.date","message":"SRC-000439 has no publication / evidence date","id":"SRC-000439"},{"rule":"source.search_index","message":"SRC-000439: official URL/title confirmed via web search only; page not read","id":"SRC-000439"},{"rule":"source.date","message":"SRC-000440 has no publication / evidence date","id":"SRC-000440"},{"rule":"source.search_index","message":"SRC-000440: official URL/title confirmed via web search only; page not read","id":"SRC-000440"},{"rule":"source.date","message":"SRC-000441 has no publication / evidence date","id":"SRC-000441"},{"rule":"source.search_index","message":"SRC-000441: official URL/title confirmed via web search only; page not read","id":"SRC-000441"},{"rule":"source.date","message":"SRC-000442 has no publication / evidence date","id":"SRC-000442"},{"rule":"source.search_index","message":"SRC-000442: official URL/title confirmed via web search only; page not read","id":"SRC-000442"},{"rule":"source.date","message":"SRC-000443 has no publication / evidence date","id":"SRC-000443"},{"rule":"source.search_index","message":"SRC-000443: official URL/title confirmed via web search only; page not read","id":"SRC-000443"},{"rule":"source.date","message":"SRC-000444 has no publication / evidence date","id":"SRC-000444"},{"rule":"source.search_index","message":"SRC-000444: official URL/title confirmed via web search only; page not read","id":"SRC-000444"},{"rule":"source.search_index","message":"SRC-000445: official URL/title confirmed via web search only; page not read","id":"SRC-000445"},{"rule":"source.date","message":"SRC-000446 has no publication / evidence date","id":"SRC-000446"},{"rule":"source.search_index","message":"SRC-000446: official URL/title confirmed via web search only; page not read","id":"SRC-000446"},{"rule":"source.date","message":"SRC-000447 has no publication / evidence date","id":"SRC-000447"},{"rule":"source.search_index","message":"SRC-000447: official URL/title confirmed via web search only; page not read","id":"SRC-000447"},{"rule":"source.date","message":"SRC-000448 has no publication / evidence date","id":"SRC-000448"},{"rule":"source.search_index","message":"SRC-000448: official URL/title confirmed via web search only; page not read","id":"SRC-000448"},{"rule":"source.date","message":"SRC-000449 has no publication / evidence date","id":"SRC-000449"},{"rule":"source.search_index","message":"SRC-000449: official URL/title confirmed via web search only; page not read","id":"SRC-000449"},{"rule":"source.date","message":"SRC-000450 has no publication / evidence date","id":"SRC-000450"},{"rule":"source.search_index","message":"SRC-000450: official URL/title confirmed via web search only; page not read","id":"SRC-000450"},{"rule":"source.date","message":"SRC-000451 has no publication / evidence date","id":"SRC-000451"},{"rule":"source.search_index","message":"SRC-000451: official URL/title confirmed via web search only; page not read","id":"SRC-000451"},{"rule":"source.date","message":"SRC-000452 has no publication / evidence date","id":"SRC-000452"},{"rule":"source.search_index","message":"SRC-000452: official URL/title confirmed via web search only; page not read","id":"SRC-000452"},{"rule":"source.date","message":"SRC-000453 has no publication / evidence date","id":"SRC-000453"},{"rule":"source.search_index","message":"SRC-000453: official URL/title confirmed via web search only; page not read","id":"SRC-000453"},{"rule":"source.date","message":"SRC-000454 has no publication / evidence date","id":"SRC-000454"},{"rule":"source.search_index","message":"SRC-000454: official URL/title confirmed via web search only; page not read","id":"SRC-000454"},{"rule":"source.date","message":"SRC-000455 has no publication / evidence date","id":"SRC-000455"},{"rule":"source.search_index","message":"SRC-000455: official URL/title confirmed via web search only; page not read","id":"SRC-000455"},{"rule":"source.date","message":"SRC-000456 has no publication / evidence date","id":"SRC-000456"},{"rule":"source.search_index","message":"SRC-000456: official URL/title confirmed via web search only; page not read","id":"SRC-000456"},{"rule":"source.date","message":"SRC-000457 has no publication / evidence date","id":"SRC-000457"},{"rule":"source.search_index","message":"SRC-000457: official URL/title confirmed via web search only; page not read","id":"SRC-000457"},{"rule":"source.date","message":"SRC-000458 has no publication / evidence date","id":"SRC-000458"},{"rule":"source.search_index","message":"SRC-000458: official URL/title confirmed via web search only; page not read","id":"SRC-000458"},{"rule":"source.search_index","message":"SRC-000459: official URL/title confirmed via web search only; page not read","id":"SRC-000459"},{"rule":"source.date","message":"SRC-000460 has no publication / evidence date","id":"SRC-000460"},{"rule":"source.search_index","message":"SRC-000460: official URL/title confirmed via web search only; page not read","id":"SRC-000460"},{"rule":"source.date","message":"SRC-000461 has no publication / evidence date","id":"SRC-000461"},{"rule":"source.search_index","message":"SRC-000461: official URL/title confirmed via web search only; page not read","id":"SRC-000461"},{"rule":"source.date","message":"SRC-000462 has no publication / evidence date","id":"SRC-000462"},{"rule":"source.search_index","message":"SRC-000462: official URL/title confirmed via web search only; page not read","id":"SRC-000462"},{"rule":"source.date","message":"SRC-000463 has no publication / evidence date","id":"SRC-000463"},{"rule":"source.search_index","message":"SRC-000463: official URL/title confirmed via web search only; page not read","id":"SRC-000463"},{"rule":"source.date","message":"SRC-000464 has no publication / evidence date","id":"SRC-000464"},{"rule":"source.search_index","message":"SRC-000464: official URL/title confirmed via web search only; page not read","id":"SRC-000464"},{"rule":"source.date","message":"SRC-000465 has no publication / evidence date","id":"SRC-000465"},{"rule":"source.search_index","message":"SRC-000465: official URL/title confirmed via web search only; page not read","id":"SRC-000465"},{"rule":"source.date","message":"SRC-000466 has no publication / evidence date","id":"SRC-000466"},{"rule":"source.search_index","message":"SRC-000466: official URL/title confirmed via web search only; page not read","id":"SRC-000466"},{"rule":"source.date","message":"SRC-000467 has no publication / evidence date","id":"SRC-000467"},{"rule":"source.search_index","message":"SRC-000467: official URL/title confirmed via web search only; page not read","id":"SRC-000467"},{"rule":"source.date","message":"SRC-000468 has no publication / evidence date","id":"SRC-000468"},{"rule":"source.search_index","message":"SRC-000468: official URL/title confirmed via web search only; page not read","id":"SRC-000468"},{"rule":"source.date","message":"SRC-000469 has no publication / evidence date","id":"SRC-000469"},{"rule":"source.search_index","message":"SRC-000469: official URL/title confirmed via web search only; page not read","id":"SRC-000469"},{"rule":"source.date","message":"SRC-000470 has no publication / evidence date","id":"SRC-000470"},{"rule":"source.search_index","message":"SRC-000470: official URL/title confirmed via web search only; page not read","id":"SRC-000470"},{"rule":"source.date","message":"SRC-000471 has no publication / evidence date","id":"SRC-000471"},{"rule":"source.search_index","message":"SRC-000471: official URL/title confirmed via web search only; page not read","id":"SRC-000471"},{"rule":"source.date","message":"SRC-000472 has no publication / evidence date","id":"SRC-000472"},{"rule":"source.search_index","message":"SRC-000472: official URL/title confirmed via web search only; page not read","id":"SRC-000472"},{"rule":"source.date","message":"SRC-000473 has no publication / evidence date","id":"SRC-000473"},{"rule":"source.search_index","message":"SRC-000473: official URL/title confirmed via web search only; page not read","id":"SRC-000473"},{"rule":"source.date","message":"SRC-000474 has no publication / evidence date","id":"SRC-000474"},{"rule":"source.search_index","message":"SRC-000474: official URL/title confirmed via web search only; page not read","id":"SRC-000474"},{"rule":"source.date","message":"SRC-000475 has no publication / evidence date","id":"SRC-000475"},{"rule":"source.search_index","message":"SRC-000475: official URL/title confirmed via web search only; page not read","id":"SRC-000475"},{"rule":"source.search_index","message":"SRC-000476: official URL/title confirmed via web search only; page not read","id":"SRC-000476"},{"rule":"source.date","message":"SRC-000477 has no publication / evidence date","id":"SRC-000477"},{"rule":"source.search_index","message":"SRC-000477: official URL/title confirmed via web search only; page not read","id":"SRC-000477"},{"rule":"source.date","message":"SRC-000478 has no publication / evidence date","id":"SRC-000478"},{"rule":"source.search_index","message":"SRC-000478: official URL/title confirmed via web search only; page not read","id":"SRC-000478"},{"rule":"source.date","message":"SRC-000479 has no publication / evidence date","id":"SRC-000479"},{"rule":"source.search_index","message":"SRC-000479: official URL/title confirmed via web search only; page not read","id":"SRC-000479"},{"rule":"source.date","message":"SRC-000480 has no publication / evidence date","id":"SRC-000480"},{"rule":"source.search_index","message":"SRC-000480: official URL/title confirmed via web search only; page not read","id":"SRC-000480"},{"rule":"source.date","message":"SRC-000481 has no publication / evidence date","id":"SRC-000481"},{"rule":"source.search_index","message":"SRC-000481: official URL/title confirmed via web search only; page not read","id":"SRC-000481"},{"rule":"source.date","message":"SRC-000482 has no publication / evidence date","id":"SRC-000482"},{"rule":"source.search_index","message":"SRC-000482: official URL/title confirmed via web search only; page not read","id":"SRC-000482"},{"rule":"source.date","message":"SRC-000483 has no publication / evidence date","id":"SRC-000483"},{"rule":"source.search_index","message":"SRC-000483: official URL/title confirmed via web search only; page not read","id":"SRC-000483"},{"rule":"source.date","message":"SRC-000484 has no publication / evidence date","id":"SRC-000484"},{"rule":"source.search_index","message":"SRC-000484: official URL/title confirmed via web search only; page not read","id":"SRC-000484"},{"rule":"source.date","message":"SRC-000485 has no publication / evidence date","id":"SRC-000485"},{"rule":"source.search_index","message":"SRC-000485: official URL/title confirmed via web search only; page not read","id":"SRC-000485"},{"rule":"source.date","message":"SRC-000486 has no publication / evidence date","id":"SRC-000486"},{"rule":"source.search_index","message":"SRC-000486: official URL/title confirmed via web search only; page not read","id":"SRC-000486"},{"rule":"source.date","message":"SRC-000487 has no publication / evidence date","id":"SRC-000487"},{"rule":"source.search_index","message":"SRC-000487: official URL/title confirmed via web search only; page not read","id":"SRC-000487"},{"rule":"source.date","message":"SRC-000488 has no publication / evidence date","id":"SRC-000488"},{"rule":"source.search_index","message":"SRC-000488: official URL/title confirmed via web search only; page not read","id":"SRC-000488"},{"rule":"source.date","message":"SRC-000489 has no publication / evidence date","id":"SRC-000489"},{"rule":"source.search_index","message":"SRC-000489: official URL/title confirmed via web search only; page not read","id":"SRC-000489"},{"rule":"source.date","message":"SRC-000490 has no publication / evidence date","id":"SRC-000490"},{"rule":"source.search_index","message":"SRC-000490: official URL/title confirmed via web search only; page not read","id":"SRC-000490"},{"rule":"source.date","message":"SRC-000491 has no publication / evidence date","id":"SRC-000491"},{"rule":"source.search_index","message":"SRC-000491: official URL/title confirmed via web search only; page not read","id":"SRC-000491"},{"rule":"source.date","message":"SRC-000492 has no publication / evidence date","id":"SRC-000492"},{"rule":"source.search_index","message":"SRC-000492: official URL/title confirmed via web search only; page not read","id":"SRC-000492"},{"rule":"source.search_index","message":"SRC-000493: official URL/title confirmed via web search only; page not read","id":"SRC-000493"},{"rule":"source.search_index","message":"SRC-000494: official URL/title confirmed via web search only; page not read","id":"SRC-000494"},{"rule":"source.date","message":"SRC-000495 has no publication / evidence date","id":"SRC-000495"},{"rule":"source.search_index","message":"SRC-000495: official URL/title confirmed via web search only; page not read","id":"SRC-000495"},{"rule":"source.date","message":"SRC-000496 has no publication / evidence date","id":"SRC-000496"},{"rule":"source.search_index","message":"SRC-000496: official URL/title confirmed via web search only; page not read","id":"SRC-000496"},{"rule":"source.date","message":"SRC-000497 has no publication / evidence date","id":"SRC-000497"},{"rule":"source.search_index","message":"SRC-000497: official URL/title confirmed via web search only; page not read","id":"SRC-000497"},{"rule":"source.date","message":"SRC-000498 has no publication / evidence date","id":"SRC-000498"},{"rule":"source.search_index","message":"SRC-000498: official URL/title confirmed via web search only; page not read","id":"SRC-000498"},{"rule":"source.date","message":"SRC-000499 has no publication / evidence date","id":"SRC-000499"},{"rule":"source.search_index","message":"SRC-000499: official URL/title confirmed via web search only; page not read","id":"SRC-000499"},{"rule":"source.date","message":"SRC-000500 has no publication / evidence date","id":"SRC-000500"},{"rule":"source.search_index","message":"SRC-000500: official URL/title confirmed via web search only; page not read","id":"SRC-000500"},{"rule":"source.date","message":"SRC-000501 has no publication / evidence date","id":"SRC-000501"},{"rule":"source.search_index","message":"SRC-000501: official URL/title confirmed via web search only; page not read","id":"SRC-000501"},{"rule":"source.date","message":"SRC-000502 has no publication / evidence date","id":"SRC-000502"},{"rule":"source.search_index","message":"SRC-000502: official URL/title confirmed via web search only; page not read","id":"SRC-000502"},{"rule":"source.date","message":"SRC-000503 has no publication / evidence date","id":"SRC-000503"},{"rule":"source.search_index","message":"SRC-000503: official URL/title confirmed via web search only; page not read","id":"SRC-000503"},{"rule":"source.search_index","message":"SRC-000504: official URL/title confirmed via web search only; page not read","id":"SRC-000504"},{"rule":"source.date","message":"SRC-000505 has no publication / evidence date","id":"SRC-000505"},{"rule":"source.search_index","message":"SRC-000505: official URL/title confirmed via web search only; page not read","id":"SRC-000505"},{"rule":"source.date","message":"SRC-000506 has no publication / evidence date","id":"SRC-000506"},{"rule":"source.search_index","message":"SRC-000506: official URL/title confirmed via web search only; page not read","id":"SRC-000506"},{"rule":"source.date","message":"SRC-000507 has no publication / evidence date","id":"SRC-000507"},{"rule":"source.search_index","message":"SRC-000507: official URL/title confirmed via web search only; page not read","id":"SRC-000507"},{"rule":"source.date","message":"SRC-000508 has no publication / evidence date","id":"SRC-000508"},{"rule":"source.search_index","message":"SRC-000508: official URL/title confirmed via web search only; page not read","id":"SRC-000508"},{"rule":"source.date","message":"SRC-000509 has no publication / evidence date","id":"SRC-000509"},{"rule":"source.search_index","message":"SRC-000509: official URL/title confirmed via web search only; page not read","id":"SRC-000509"},{"rule":"source.date","message":"SRC-000510 has no publication / evidence date","id":"SRC-000510"},{"rule":"source.search_index","message":"SRC-000510: official URL/title confirmed via web search only; page not read","id":"SRC-000510"},{"rule":"source.date","message":"SRC-000511 has no publication / evidence date","id":"SRC-000511"},{"rule":"source.search_index","message":"SRC-000511: official URL/title confirmed via web search only; page not read","id":"SRC-000511"},{"rule":"source.date","message":"SRC-000512 has no publication / evidence date","id":"SRC-000512"},{"rule":"source.search_index","message":"SRC-000512: official URL/title confirmed via web search only; page not read","id":"SRC-000512"},{"rule":"source.date","message":"SRC-000513 has no publication / evidence date","id":"SRC-000513"},{"rule":"source.search_index","message":"SRC-000513: official URL/title confirmed via web search only; page not read","id":"SRC-000513"},{"rule":"source.date","message":"SRC-000514 has no publication / evidence date","id":"SRC-000514"},{"rule":"source.search_index","message":"SRC-000514: official URL/title confirmed via web search only; page not read","id":"SRC-000514"},{"rule":"source.search_index","message":"SRC-000515: official URL/title confirmed via web search only; page not read","id":"SRC-000515"},{"rule":"source.date","message":"SRC-000516 has no publication / evidence date","id":"SRC-000516"},{"rule":"source.search_index","message":"SRC-000516: official URL/title confirmed via web search only; page not read","id":"SRC-000516"},{"rule":"source.search_index","message":"SRC-000517: official URL/title confirmed via web search only; page not read","id":"SRC-000517"},{"rule":"source.search_index","message":"SRC-000518: official URL/title confirmed via web search only; page not read","id":"SRC-000518"},{"rule":"source.date","message":"SRC-000519 has no publication / evidence date","id":"SRC-000519"},{"rule":"source.search_index","message":"SRC-000519: official URL/title confirmed via web search only; page not read","id":"SRC-000519"},{"rule":"source.date","message":"SRC-000520 has no publication / evidence date","id":"SRC-000520"},{"rule":"source.search_index","message":"SRC-000520: official URL/title confirmed via web search only; page not read","id":"SRC-000520"},{"rule":"source.date","message":"SRC-000521 has no publication / evidence date","id":"SRC-000521"},{"rule":"source.search_index","message":"SRC-000521: official URL/title confirmed via web search only; page not read","id":"SRC-000521"},{"rule":"source.date","message":"SRC-000522 has no publication / evidence date","id":"SRC-000522"},{"rule":"source.search_index","message":"SRC-000522: official URL/title confirmed via web search only; page not read","id":"SRC-000522"},{"rule":"source.date","message":"SRC-000523 has no publication / evidence date","id":"SRC-000523"},{"rule":"source.search_index","message":"SRC-000523: official URL/title confirmed via web search only; page not read","id":"SRC-000523"},{"rule":"source.date","message":"SRC-000524 has no publication / evidence date","id":"SRC-000524"},{"rule":"source.search_index","message":"SRC-000524: official URL/title confirmed via web search only; page not read","id":"SRC-000524"},{"rule":"source.date","message":"SRC-000525 has no publication / evidence date","id":"SRC-000525"},{"rule":"source.search_index","message":"SRC-000525: official URL/title confirmed via web search only; page not read","id":"SRC-000525"},{"rule":"source.date","message":"SRC-000526 has no publication / evidence date","id":"SRC-000526"},{"rule":"source.search_index","message":"SRC-000526: official URL/title confirmed via web search only; page not read","id":"SRC-000526"},{"rule":"source.search_index","message":"SRC-000527: official URL/title confirmed via web search only; page not read","id":"SRC-000527"},{"rule":"source.date","message":"SRC-000528 has no publication / evidence date","id":"SRC-000528"},{"rule":"source.search_index","message":"SRC-000528: official URL/title confirmed via web search only; page not read","id":"SRC-000528"},{"rule":"source.date","message":"SRC-000529 has no publication / evidence date","id":"SRC-000529"},{"rule":"source.search_index","message":"SRC-000529: official URL/title confirmed via web search only; page not read","id":"SRC-000529"},{"rule":"source.date","message":"SRC-000530 has no publication / evidence date","id":"SRC-000530"},{"rule":"source.search_index","message":"SRC-000530: official URL/title confirmed via web search only; page not read","id":"SRC-000530"},{"rule":"source.date","message":"SRC-000531 has no publication / evidence date","id":"SRC-000531"},{"rule":"source.search_index","message":"SRC-000531: official URL/title confirmed via web search only; page not read","id":"SRC-000531"},{"rule":"source.date","message":"SRC-000532 has no publication / evidence date","id":"SRC-000532"},{"rule":"source.search_index","message":"SRC-000532: official URL/title confirmed via web search only; page not read","id":"SRC-000532"},{"rule":"source.date","message":"SRC-000533 has no publication / evidence date","id":"SRC-000533"},{"rule":"source.search_index","message":"SRC-000533: official URL/title confirmed via web search only; page not read","id":"SRC-000533"},{"rule":"source.date","message":"SRC-000534 has no publication / evidence date","id":"SRC-000534"},{"rule":"source.search_index","message":"SRC-000534: official URL/title confirmed via web search only; page not read","id":"SRC-000534"},{"rule":"source.date","message":"SRC-000535 has no publication / evidence date","id":"SRC-000535"},{"rule":"source.search_index","message":"SRC-000535: official URL/title confirmed via web search only; page not read","id":"SRC-000535"},{"rule":"source.date","message":"SRC-000536 has no publication / evidence date","id":"SRC-000536"},{"rule":"source.search_index","message":"SRC-000536: official URL/title confirmed via web search only; page not read","id":"SRC-000536"},{"rule":"source.date","message":"SRC-000537 has no publication / evidence date","id":"SRC-000537"},{"rule":"source.search_index","message":"SRC-000537: official URL/title confirmed via web search only; page not read","id":"SRC-000537"},{"rule":"source.date","message":"SRC-000538 has no publication / evidence date","id":"SRC-000538"},{"rule":"source.search_index","message":"SRC-000538: official URL/title confirmed via web search only; page not read","id":"SRC-000538"},{"rule":"source.date","message":"SRC-000539 has no publication / evidence date","id":"SRC-000539"},{"rule":"source.search_index","message":"SRC-000539: official URL/title confirmed via web search only; page not read","id":"SRC-000539"},{"rule":"source.search_index","message":"SRC-000540: official URL/title confirmed via web search only; page not read","id":"SRC-000540"},{"rule":"source.date","message":"SRC-000541 has no publication / evidence date","id":"SRC-000541"},{"rule":"source.search_index","message":"SRC-000541: official URL/title confirmed via web search only; page not read","id":"SRC-000541"},{"rule":"source.search_index","message":"SRC-000542: official URL/title confirmed via web search only; page not read","id":"SRC-000542"},{"rule":"source.date","message":"SRC-000543 has no publication / evidence date","id":"SRC-000543"},{"rule":"source.search_index","message":"SRC-000543: official URL/title confirmed via web search only; page not read","id":"SRC-000543"},{"rule":"source.date","message":"SRC-000544 has no publication / evidence date","id":"SRC-000544"},{"rule":"source.search_index","message":"SRC-000544: official URL/title confirmed via web search only; page not read","id":"SRC-000544"},{"rule":"source.date","message":"SRC-000545 has no publication / evidence date","id":"SRC-000545"},{"rule":"source.search_index","message":"SRC-000545: official URL/title confirmed via web search only; page not read","id":"SRC-000545"},{"rule":"source.search_index","message":"SRC-000546: official URL/title confirmed via web search only; page not read","id":"SRC-000546"},{"rule":"source.search_index","message":"SRC-000547: official URL/title confirmed via web search only; page not read","id":"SRC-000547"},{"rule":"source.date","message":"SRC-000548 has no publication / evidence date","id":"SRC-000548"},{"rule":"source.search_index","message":"SRC-000548: official URL/title confirmed via web search only; page not read","id":"SRC-000548"},{"rule":"source.date","message":"SRC-000549 has no publication / evidence date","id":"SRC-000549"},{"rule":"source.search_index","message":"SRC-000549: official URL/title confirmed via web search only; page not read","id":"SRC-000549"},{"rule":"source.date","message":"SRC-000550 has no publication / evidence date","id":"SRC-000550"},{"rule":"source.search_index","message":"SRC-000550: official URL/title confirmed via web search only; page not read","id":"SRC-000550"},{"rule":"source.date","message":"SRC-000551 has no publication / evidence date","id":"SRC-000551"},{"rule":"source.search_index","message":"SRC-000551: official URL/title confirmed via web search only; page not read","id":"SRC-000551"},{"rule":"source.date","message":"SRC-000552 has no publication / evidence date","id":"SRC-000552"},{"rule":"source.search_index","message":"SRC-000552: official URL/title confirmed via web search only; page not read","id":"SRC-000552"},{"rule":"source.date","message":"SRC-000553 has no publication / evidence date","id":"SRC-000553"},{"rule":"source.search_index","message":"SRC-000553: official URL/title confirmed via web search only; page not read","id":"SRC-000553"},{"rule":"source.date","message":"SRC-000554 has no publication / evidence date","id":"SRC-000554"},{"rule":"source.search_index","message":"SRC-000554: official URL/title confirmed via web search only; page not read","id":"SRC-000554"},{"rule":"source.date","message":"SRC-000555 has no publication / evidence date","id":"SRC-000555"},{"rule":"source.search_index","message":"SRC-000555: official URL/title confirmed via web search only; page not read","id":"SRC-000555"},{"rule":"source.date","message":"SRC-000556 has no publication / evidence date","id":"SRC-000556"},{"rule":"source.search_index","message":"SRC-000556: official URL/title confirmed via web search only; page not read","id":"SRC-000556"},{"rule":"source.search_index","message":"SRC-000557: official URL/title confirmed via web search only; page not read","id":"SRC-000557"},{"rule":"source.date","message":"SRC-000558 has no publication / evidence date","id":"SRC-000558"},{"rule":"source.search_index","message":"SRC-000558: official URL/title confirmed via web search only; page not read","id":"SRC-000558"},{"rule":"source.date","message":"SRC-000559 has no publication / evidence date","id":"SRC-000559"},{"rule":"source.search_index","message":"SRC-000559: official URL/title confirmed via web search only; page not read","id":"SRC-000559"},{"rule":"source.search_index","message":"SRC-000560: official URL/title confirmed via web search only; page not read","id":"SRC-000560"},{"rule":"source.date","message":"SRC-000561 has no publication / evidence date","id":"SRC-000561"},{"rule":"source.search_index","message":"SRC-000561: official URL/title confirmed via web search only; page not read","id":"SRC-000561"},{"rule":"source.date","message":"SRC-000562 has no publication / evidence date","id":"SRC-000562"},{"rule":"source.search_index","message":"SRC-000562: official URL/title confirmed via web search only; page not read","id":"SRC-000562"},{"rule":"source.date","message":"SRC-000563 has no publication / evidence date","id":"SRC-000563"},{"rule":"source.search_index","message":"SRC-000563: official URL/title confirmed via web search only; page not read","id":"SRC-000563"},{"rule":"source.date","message":"SRC-000564 has no publication / evidence date","id":"SRC-000564"},{"rule":"source.search_index","message":"SRC-000564: official URL/title confirmed via web search only; page not read","id":"SRC-000564"},{"rule":"source.date","message":"SRC-000565 has no publication / evidence date","id":"SRC-000565"},{"rule":"source.search_index","message":"SRC-000565: official URL/title confirmed via web search only; page not read","id":"SRC-000565"},{"rule":"source.date","message":"SRC-000566 has no publication / evidence date","id":"SRC-000566"},{"rule":"source.search_index","message":"SRC-000566: official URL/title confirmed via web search only; page not read","id":"SRC-000566"},{"rule":"source.date","message":"SRC-000567 has no publication / evidence date","id":"SRC-000567"},{"rule":"source.search_index","message":"SRC-000567: official URL/title confirmed via web search only; page not read","id":"SRC-000567"},{"rule":"source.date","message":"SRC-000568 has no publication / evidence date","id":"SRC-000568"},{"rule":"source.search_index","message":"SRC-000568: official URL/title confirmed via web search only; page not read","id":"SRC-000568"},{"rule":"source.date","message":"SRC-000569 has no publication / evidence date","id":"SRC-000569"},{"rule":"source.search_index","message":"SRC-000569: official URL/title confirmed via web search only; page not read","id":"SRC-000569"},{"rule":"source.date","message":"SRC-000570 has no publication / evidence date","id":"SRC-000570"},{"rule":"source.search_index","message":"SRC-000570: official URL/title confirmed via web search only; page not read","id":"SRC-000570"},{"rule":"source.date","message":"SRC-000571 has no publication / evidence date","id":"SRC-000571"},{"rule":"source.search_index","message":"SRC-000571: official URL/title confirmed via web search only; page not read","id":"SRC-000571"},{"rule":"source.date","message":"SRC-000572 has no publication / evidence date","id":"SRC-000572"},{"rule":"source.search_index","message":"SRC-000572: official URL/title confirmed via web search only; page not read","id":"SRC-000572"},{"rule":"source.date","message":"SRC-000573 has no publication / evidence date","id":"SRC-000573"},{"rule":"source.search_index","message":"SRC-000573: official URL/title confirmed via web search only; page not read","id":"SRC-000573"},{"rule":"source.date","message":"SRC-000574 has no publication / evidence date","id":"SRC-000574"},{"rule":"source.search_index","message":"SRC-000574: official URL/title confirmed via web search only; page not read","id":"SRC-000574"},{"rule":"source.date","message":"SRC-000575 has no publication / evidence date","id":"SRC-000575"},{"rule":"source.search_index","message":"SRC-000575: official URL/title confirmed via web search only; page not read","id":"SRC-000575"},{"rule":"source.date","message":"SRC-000576 has no publication / evidence date","id":"SRC-000576"},{"rule":"source.search_index","message":"SRC-000576: official URL/title confirmed via web search only; page not read","id":"SRC-000576"},{"rule":"source.date","message":"SRC-000577 has no publication / evidence date","id":"SRC-000577"},{"rule":"source.search_index","message":"SRC-000577: official URL/title confirmed via web search only; page not read","id":"SRC-000577"},{"rule":"source.search_index","message":"SRC-000578: official URL/title confirmed via web search only; page not read","id":"SRC-000578"},{"rule":"source.search_index","message":"SRC-000579: official URL/title confirmed via web search only; page not read","id":"SRC-000579"},{"rule":"source.date","message":"SRC-000580 has no publication / evidence date","id":"SRC-000580"},{"rule":"source.search_index","message":"SRC-000580: official URL/title confirmed via web search only; page not read","id":"SRC-000580"},{"rule":"source.date","message":"SRC-000581 has no publication / evidence date","id":"SRC-000581"},{"rule":"source.search_index","message":"SRC-000581: official URL/title confirmed via web search only; page not read","id":"SRC-000581"},{"rule":"source.date","message":"SRC-000582 has no publication / evidence date","id":"SRC-000582"},{"rule":"source.search_index","message":"SRC-000582: official URL/title confirmed via web search only; page not read","id":"SRC-000582"},{"rule":"source.date","message":"SRC-000583 has no publication / evidence date","id":"SRC-000583"},{"rule":"source.search_index","message":"SRC-000583: official URL/title confirmed via web search only; page not read","id":"SRC-000583"},{"rule":"source.date","message":"SRC-000584 has no publication / evidence date","id":"SRC-000584"},{"rule":"source.search_index","message":"SRC-000584: official URL/title confirmed via web search only; page not read","id":"SRC-000584"},{"rule":"source.search_index","message":"SRC-000585: official URL/title confirmed via web search only; page not read","id":"SRC-000585"},{"rule":"source.date","message":"SRC-000586 has no publication / evidence date","id":"SRC-000586"},{"rule":"source.search_index","message":"SRC-000586: official URL/title confirmed via web search only; page not read","id":"SRC-000586"},{"rule":"source.date","message":"SRC-000587 has no publication / evidence date","id":"SRC-000587"},{"rule":"source.search_index","message":"SRC-000587: official URL/title confirmed via web search only; page not read","id":"SRC-000587"},{"rule":"source.date","message":"SRC-000588 has no publication / evidence date","id":"SRC-000588"},{"rule":"source.search_index","message":"SRC-000588: official URL/title confirmed via web search only; page not read","id":"SRC-000588"},{"rule":"source.date","message":"SRC-000589 has no publication / evidence date","id":"SRC-000589"},{"rule":"source.search_index","message":"SRC-000589: official URL/title confirmed via web search only; page not read","id":"SRC-000589"},{"rule":"source.date","message":"SRC-000590 has no publication / evidence date","id":"SRC-000590"},{"rule":"source.search_index","message":"SRC-000590: official URL/title confirmed via web search only; page not read","id":"SRC-000590"},{"rule":"source.date","message":"SRC-000591 has no publication / evidence date","id":"SRC-000591"},{"rule":"source.search_index","message":"SRC-000591: official URL/title confirmed via web search only; page not read","id":"SRC-000591"},{"rule":"source.date","message":"SRC-000592 has no publication / evidence date","id":"SRC-000592"},{"rule":"source.search_index","message":"SRC-000592: official URL/title confirmed via web search only; page not read","id":"SRC-000592"},{"rule":"source.date","message":"SRC-000593 has no publication / evidence date","id":"SRC-000593"},{"rule":"source.search_index","message":"SRC-000593: official URL/title confirmed via web search only; page not read","id":"SRC-000593"},{"rule":"source.date","message":"SRC-000594 has no publication / evidence date","id":"SRC-000594"},{"rule":"source.search_index","message":"SRC-000594: official URL/title confirmed via web search only; page not read","id":"SRC-000594"},{"rule":"source.date","message":"SRC-000595 has no publication / evidence date","id":"SRC-000595"},{"rule":"source.search_index","message":"SRC-000595: official URL/title confirmed via web search only; page not read","id":"SRC-000595"},{"rule":"source.date","message":"SRC-000596 has no publication / evidence date","id":"SRC-000596"},{"rule":"source.search_index","message":"SRC-000596: official URL/title confirmed via web search only; page not read","id":"SRC-000596"},{"rule":"source.date","message":"SRC-000597 has no publication / evidence date","id":"SRC-000597"},{"rule":"source.search_index","message":"SRC-000597: official URL/title confirmed via web search only; page not read","id":"SRC-000597"},{"rule":"source.date","message":"SRC-000598 has no publication / evidence date","id":"SRC-000598"},{"rule":"source.search_index","message":"SRC-000598: official URL/title confirmed via web search only; page not read","id":"SRC-000598"},{"rule":"source.date","message":"SRC-000599 has no publication / evidence date","id":"SRC-000599"},{"rule":"source.search_index","message":"SRC-000599: official URL/title confirmed via web search only; page not read","id":"SRC-000599"},{"rule":"source.date","message":"SRC-000600 has no publication / evidence date","id":"SRC-000600"},{"rule":"source.search_index","message":"SRC-000600: official URL/title confirmed via web search only; page not read","id":"SRC-000600"},{"rule":"source.date","message":"SRC-000601 has no publication / evidence date","id":"SRC-000601"},{"rule":"source.search_index","message":"SRC-000601: official URL/title confirmed via web search only; page not read","id":"SRC-000601"},{"rule":"source.date","message":"SRC-000602 has no publication / evidence date","id":"SRC-000602"},{"rule":"source.search_index","message":"SRC-000602: official URL/title confirmed via web search only; page not read","id":"SRC-000602"},{"rule":"source.date","message":"SRC-000603 has no publication / evidence date","id":"SRC-000603"},{"rule":"source.search_index","message":"SRC-000603: official URL/title confirmed via web search only; page not read","id":"SRC-000603"},{"rule":"source.date","message":"SRC-000604 has no publication / evidence date","id":"SRC-000604"},{"rule":"source.search_index","message":"SRC-000604: official URL/title confirmed via web search only; page not read","id":"SRC-000604"},{"rule":"source.date","message":"SRC-000605 has no publication / evidence date","id":"SRC-000605"},{"rule":"source.search_index","message":"SRC-000605: official URL/title confirmed via web search only; page not read","id":"SRC-000605"},{"rule":"source.date","message":"SRC-000606 has no publication / evidence date","id":"SRC-000606"},{"rule":"source.search_index","message":"SRC-000606: official URL/title confirmed via web search only; page not read","id":"SRC-000606"},{"rule":"source.date","message":"SRC-000607 has no publication / evidence date","id":"SRC-000607"},{"rule":"source.search_index","message":"SRC-000607: official URL/title confirmed via web search only; page not read","id":"SRC-000607"},{"rule":"source.date","message":"SRC-000608 has no publication / evidence date","id":"SRC-000608"},{"rule":"source.search_index","message":"SRC-000608: official URL/title confirmed via web search only; page not read","id":"SRC-000608"},{"rule":"source.date","message":"SRC-000609 has no publication / evidence date","id":"SRC-000609"},{"rule":"source.search_index","message":"SRC-000609: official URL/title confirmed via web search only; page not read","id":"SRC-000609"},{"rule":"source.date","message":"SRC-000610 has no publication / evidence date","id":"SRC-000610"},{"rule":"source.search_index","message":"SRC-000610: official URL/title confirmed via web search only; page not read","id":"SRC-000610"},{"rule":"source.search_index","message":"SRC-000611: official URL/title confirmed via web search only; page not read","id":"SRC-000611"},{"rule":"source.date","message":"SRC-000612 has no publication / evidence date","id":"SRC-000612"},{"rule":"source.search_index","message":"SRC-000612: official URL/title confirmed via web search only; page not read","id":"SRC-000612"},{"rule":"source.date","message":"SRC-000613 has no publication / evidence date","id":"SRC-000613"},{"rule":"source.search_index","message":"SRC-000613: official URL/title confirmed via web search only; page not read","id":"SRC-000613"},{"rule":"source.search_index","message":"SRC-000614: official URL/title confirmed via web search only; page not read","id":"SRC-000614"},{"rule":"source.date","message":"SRC-000615 has no publication / evidence date","id":"SRC-000615"},{"rule":"source.search_index","message":"SRC-000615: official URL/title confirmed via web search only; page not read","id":"SRC-000615"},{"rule":"source.date","message":"SRC-000616 has no publication / evidence date","id":"SRC-000616"},{"rule":"source.search_index","message":"SRC-000616: official URL/title confirmed via web search only; page not read","id":"SRC-000616"},{"rule":"source.date","message":"SRC-000617 has no publication / evidence date","id":"SRC-000617"},{"rule":"source.search_index","message":"SRC-000617: official URL/title confirmed via web search only; page not read","id":"SRC-000617"},{"rule":"source.date","message":"SRC-000618 has no publication / evidence date","id":"SRC-000618"},{"rule":"source.search_index","message":"SRC-000618: official URL/title confirmed via web search only; page not read","id":"SRC-000618"},{"rule":"source.date","message":"SRC-000619 has no publication / evidence date","id":"SRC-000619"},{"rule":"source.search_index","message":"SRC-000619: official URL/title confirmed via web search only; page not read","id":"SRC-000619"},{"rule":"source.date","message":"SRC-000620 has no publication / evidence date","id":"SRC-000620"},{"rule":"source.search_index","message":"SRC-000620: official URL/title confirmed via web search only; page not read","id":"SRC-000620"},{"rule":"source.date","message":"SRC-000621 has no publication / evidence date","id":"SRC-000621"},{"rule":"source.search_index","message":"SRC-000621: official URL/title confirmed via web search only; page not read","id":"SRC-000621"},{"rule":"source.date","message":"SRC-000622 has no publication / evidence date","id":"SRC-000622"},{"rule":"source.search_index","message":"SRC-000622: official URL/title confirmed via web search only; page not read","id":"SRC-000622"},{"rule":"source.date","message":"SRC-000623 has no publication / evidence date","id":"SRC-000623"},{"rule":"source.search_index","message":"SRC-000623: official URL/title confirmed via web search only; page not read","id":"SRC-000623"},{"rule":"source.date","message":"SRC-000624 has no publication / evidence date","id":"SRC-000624"},{"rule":"source.search_index","message":"SRC-000624: official URL/title confirmed via web search only; page not read","id":"SRC-000624"},{"rule":"source.date","message":"SRC-000625 has no publication / evidence date","id":"SRC-000625"},{"rule":"source.search_index","message":"SRC-000625: official URL/title confirmed via web search only; page not read","id":"SRC-000625"},{"rule":"source.date","message":"SRC-000626 has no publication / evidence date","id":"SRC-000626"},{"rule":"source.search_index","message":"SRC-000626: official URL/title confirmed via web search only; page not read","id":"SRC-000626"},{"rule":"source.date","message":"SRC-000627 has no publication / evidence date","id":"SRC-000627"},{"rule":"source.search_index","message":"SRC-000627: official URL/title confirmed via web search only; page not read","id":"SRC-000627"},{"rule":"source.date","message":"SRC-000628 has no publication / evidence date","id":"SRC-000628"},{"rule":"source.search_index","message":"SRC-000628: official URL/title confirmed via web search only; page not read","id":"SRC-000628"},{"rule":"source.date","message":"SRC-000629 has no publication / evidence date","id":"SRC-000629"},{"rule":"source.search_index","message":"SRC-000629: official URL/title confirmed via web search only; page not read","id":"SRC-000629"},{"rule":"source.date","message":"SRC-000630 has no publication / evidence date","id":"SRC-000630"},{"rule":"source.search_index","message":"SRC-000630: official URL/title confirmed via web search only; page not read","id":"SRC-000630"},{"rule":"source.date","message":"SRC-000631 has no publication / evidence date","id":"SRC-000631"},{"rule":"source.search_index","message":"SRC-000631: official URL/title confirmed via web search only; page not read","id":"SRC-000631"},{"rule":"source.date","message":"SRC-000632 has no publication / evidence date","id":"SRC-000632"},{"rule":"source.search_index","message":"SRC-000632: official URL/title confirmed via web search only; page not read","id":"SRC-000632"},{"rule":"source.date","message":"SRC-000633 has no publication / evidence date","id":"SRC-000633"},{"rule":"source.search_index","message":"SRC-000633: official URL/title confirmed via web search only; page not read","id":"SRC-000633"},{"rule":"source.date","message":"SRC-000634 has no publication / evidence date","id":"SRC-000634"},{"rule":"source.search_index","message":"SRC-000634: official URL/title confirmed via web search only; page not read","id":"SRC-000634"},{"rule":"source.date","message":"SRC-000635 has no publication / evidence date","id":"SRC-000635"},{"rule":"source.search_index","message":"SRC-000635: official URL/title confirmed via web search only; page not read","id":"SRC-000635"},{"rule":"source.date","message":"SRC-000636 has no publication / evidence date","id":"SRC-000636"},{"rule":"source.search_index","message":"SRC-000636: official URL/title confirmed via web search only; page not read","id":"SRC-000636"},{"rule":"source.date","message":"SRC-000637 has no publication / evidence date","id":"SRC-000637"},{"rule":"source.search_index","message":"SRC-000637: official URL/title confirmed via web search only; page not read","id":"SRC-000637"},{"rule":"source.search_index","message":"SRC-000638: official URL/title confirmed via web search only; page not read","id":"SRC-000638"},{"rule":"source.search_index","message":"SRC-000639: official URL/title confirmed via web search only; page not read","id":"SRC-000639"},{"rule":"source.search_index","message":"SRC-000640: official URL/title confirmed via web search only; page not read","id":"SRC-000640"},{"rule":"source.date","message":"SRC-000641 has no publication / evidence date","id":"SRC-000641"},{"rule":"source.search_index","message":"SRC-000641: official URL/title confirmed via web search only; page not read","id":"SRC-000641"},{"rule":"source.date","message":"SRC-000642 has no publication / evidence date","id":"SRC-000642"},{"rule":"source.search_index","message":"SRC-000642: official URL/title confirmed via web search only; page not read","id":"SRC-000642"},{"rule":"source.search_index","message":"SRC-000643: official URL/title confirmed via web search only; page not read","id":"SRC-000643"},{"rule":"source.date","message":"SRC-000644 has no publication / evidence date","id":"SRC-000644"},{"rule":"source.search_index","message":"SRC-000644: official URL/title confirmed via web search only; page not read","id":"SRC-000644"},{"rule":"source.date","message":"SRC-000645 has no publication / evidence date","id":"SRC-000645"},{"rule":"source.search_index","message":"SRC-000645: official URL/title confirmed via web search only; page not read","id":"SRC-000645"},{"rule":"source.date","message":"SRC-000646 has no publication / evidence date","id":"SRC-000646"},{"rule":"source.search_index","message":"SRC-000646: official URL/title confirmed via web search only; page not read","id":"SRC-000646"},{"rule":"source.date","message":"SRC-000647 has no publication / evidence date","id":"SRC-000647"},{"rule":"source.search_index","message":"SRC-000647: official URL/title confirmed via web search only; page not read","id":"SRC-000647"},{"rule":"source.date","message":"SRC-000648 has no publication / evidence date","id":"SRC-000648"},{"rule":"source.search_index","message":"SRC-000648: official URL/title confirmed via web search only; page not read","id":"SRC-000648"},{"rule":"source.search_index","message":"SRC-000649: official URL/title confirmed via web search only; page not read","id":"SRC-000649"},{"rule":"source.date","message":"SRC-000650 has no publication / evidence date","id":"SRC-000650"},{"rule":"source.search_index","message":"SRC-000650: official URL/title confirmed via web search only; page not read","id":"SRC-000650"},{"rule":"source.date","message":"SRC-000651 has no publication / evidence date","id":"SRC-000651"},{"rule":"source.search_index","message":"SRC-000651: official URL/title confirmed via web search only; page not read","id":"SRC-000651"},{"rule":"source.date","message":"SRC-000652 has no publication / evidence date","id":"SRC-000652"},{"rule":"source.search_index","message":"SRC-000652: official URL/title confirmed via web search only; page not read","id":"SRC-000652"},{"rule":"source.date","message":"SRC-000653 has no publication / evidence date","id":"SRC-000653"},{"rule":"source.search_index","message":"SRC-000653: official URL/title confirmed via web search only; page not read","id":"SRC-000653"},{"rule":"source.date","message":"SRC-000654 has no publication / evidence date","id":"SRC-000654"},{"rule":"source.search_index","message":"SRC-000654: official URL/title confirmed via web search only; page not read","id":"SRC-000654"},{"rule":"source.date","message":"SRC-000655 has no publication / evidence date","id":"SRC-000655"},{"rule":"source.search_index","message":"SRC-000655: official URL/title confirmed via web search only; page not read","id":"SRC-000655"},{"rule":"source.date","message":"SRC-000656 has no publication / evidence date","id":"SRC-000656"},{"rule":"source.search_index","message":"SRC-000656: official URL/title confirmed via web search only; page not read","id":"SRC-000656"},{"rule":"source.date","message":"SRC-000657 has no publication / evidence date","id":"SRC-000657"},{"rule":"source.search_index","message":"SRC-000657: official URL/title confirmed via web search only; page not read","id":"SRC-000657"},{"rule":"source.date","message":"SRC-000658 has no publication / evidence date","id":"SRC-000658"},{"rule":"source.search_index","message":"SRC-000658: official URL/title confirmed via web search only; page not read","id":"SRC-000658"},{"rule":"source.date","message":"SRC-000659 has no publication / evidence date","id":"SRC-000659"},{"rule":"source.search_index","message":"SRC-000659: official URL/title confirmed via web search only; page not read","id":"SRC-000659"},{"rule":"source.date","message":"SRC-000660 has no publication / evidence date","id":"SRC-000660"},{"rule":"source.search_index","message":"SRC-000660: official URL/title confirmed via web search only; page not read","id":"SRC-000660"},{"rule":"source.date","message":"SRC-000661 has no publication / evidence date","id":"SRC-000661"},{"rule":"source.search_index","message":"SRC-000661: official URL/title confirmed via web search only; page not read","id":"SRC-000661"},{"rule":"source.date","message":"SRC-000662 has no publication / evidence date","id":"SRC-000662"},{"rule":"source.search_index","message":"SRC-000662: official URL/title confirmed via web search only; page not read","id":"SRC-000662"},{"rule":"source.date","message":"SRC-000663 has no publication / evidence date","id":"SRC-000663"},{"rule":"source.search_index","message":"SRC-000663: official URL/title confirmed via web search only; page not read","id":"SRC-000663"},{"rule":"source.date","message":"SRC-000664 has no publication / evidence date","id":"SRC-000664"},{"rule":"source.search_index","message":"SRC-000664: official URL/title confirmed via web search only; page not read","id":"SRC-000664"},{"rule":"source.date","message":"SRC-000665 has no publication / evidence date","id":"SRC-000665"},{"rule":"source.search_index","message":"SRC-000665: official URL/title confirmed via web search only; page not read","id":"SRC-000665"},{"rule":"source.date","message":"SRC-000666 has no publication / evidence date","id":"SRC-000666"},{"rule":"source.search_index","message":"SRC-000666: official URL/title confirmed via web search only; page not read","id":"SRC-000666"},{"rule":"source.date","message":"SRC-000667 has no publication / evidence date","id":"SRC-000667"},{"rule":"source.search_index","message":"SRC-000667: official URL/title confirmed via web search only; page not read","id":"SRC-000667"},{"rule":"source.date","message":"SRC-000668 has no publication / evidence date","id":"SRC-000668"},{"rule":"source.search_index","message":"SRC-000668: official URL/title confirmed via web search only; page not read","id":"SRC-000668"},{"rule":"source.date","message":"SRC-000669 has no publication / evidence date","id":"SRC-000669"},{"rule":"source.search_index","message":"SRC-000669: official URL/title confirmed via web search only; page not read","id":"SRC-000669"},{"rule":"source.date","message":"SRC-000670 has no publication / evidence date","id":"SRC-000670"},{"rule":"source.search_index","message":"SRC-000670: official URL/title confirmed via web search only; page not read","id":"SRC-000670"},{"rule":"source.date","message":"SRC-000671 has no publication / evidence date","id":"SRC-000671"},{"rule":"source.search_index","message":"SRC-000671: official URL/title confirmed via web search only; page not read","id":"SRC-000671"},{"rule":"source.date","message":"SRC-000672 has no publication / evidence date","id":"SRC-000672"},{"rule":"source.search_index","message":"SRC-000672: official URL/title confirmed via web search only; page not read","id":"SRC-000672"},{"rule":"source.date","message":"SRC-000673 has no publication / evidence date","id":"SRC-000673"},{"rule":"source.search_index","message":"SRC-000673: official URL/title confirmed via web search only; page not read","id":"SRC-000673"},{"rule":"source.date","message":"SRC-000674 has no publication / evidence date","id":"SRC-000674"},{"rule":"source.search_index","message":"SRC-000674: official URL/title confirmed via web search only; page not read","id":"SRC-000674"},{"rule":"source.date","message":"SRC-000675 has no publication / evidence date","id":"SRC-000675"},{"rule":"source.search_index","message":"SRC-000675: official URL/title confirmed via web search only; page not read","id":"SRC-000675"},{"rule":"source.date","message":"SRC-000676 has no publication / evidence date","id":"SRC-000676"},{"rule":"source.search_index","message":"SRC-000676: official URL/title confirmed via web search only; page not read","id":"SRC-000676"},{"rule":"source.date","message":"SRC-000677 has no publication / evidence date","id":"SRC-000677"},{"rule":"source.search_index","message":"SRC-000677: official URL/title confirmed via web search only; page not read","id":"SRC-000677"},{"rule":"source.date","message":"SRC-000678 has no publication / evidence date","id":"SRC-000678"},{"rule":"source.search_index","message":"SRC-000678: official URL/title confirmed via web search only; page not read","id":"SRC-000678"},{"rule":"source.date","message":"SRC-000679 has no publication / evidence date","id":"SRC-000679"},{"rule":"source.search_index","message":"SRC-000679: official URL/title confirmed via web search only; page not read","id":"SRC-000679"},{"rule":"source.date","message":"SRC-000680 has no publication / evidence date","id":"SRC-000680"},{"rule":"source.search_index","message":"SRC-000680: official URL/title confirmed via web search only; page not read","id":"SRC-000680"},{"rule":"source.date","message":"SRC-000681 has no publication / evidence date","id":"SRC-000681"},{"rule":"source.search_index","message":"SRC-000681: official URL/title confirmed via web search only; page not read","id":"SRC-000681"},{"rule":"source.date","message":"SRC-000682 has no publication / evidence date","id":"SRC-000682"},{"rule":"source.search_index","message":"SRC-000682: official URL/title confirmed via web search only; page not read","id":"SRC-000682"},{"rule":"source.date","message":"SRC-000683 has no publication / evidence date","id":"SRC-000683"},{"rule":"source.search_index","message":"SRC-000683: official URL/title confirmed via web search only; page not read","id":"SRC-000683"},{"rule":"source.date","message":"SRC-000684 has no publication / evidence date","id":"SRC-000684"},{"rule":"source.search_index","message":"SRC-000684: official URL/title confirmed via web search only; page not read","id":"SRC-000684"},{"rule":"source.date","message":"SRC-000685 has no publication / evidence date","id":"SRC-000685"},{"rule":"source.search_index","message":"SRC-000685: official URL/title confirmed via web search only; page not read","id":"SRC-000685"},{"rule":"source.date","message":"SRC-000686 has no publication / evidence date","id":"SRC-000686"},{"rule":"source.search_index","message":"SRC-000686: official URL/title confirmed via web search only; page not read","id":"SRC-000686"},{"rule":"source.date","message":"SRC-000687 has no publication / evidence date","id":"SRC-000687"},{"rule":"source.search_index","message":"SRC-000687: official URL/title confirmed via web search only; page not read","id":"SRC-000687"},{"rule":"source.date","message":"SRC-000688 has no publication / evidence date","id":"SRC-000688"},{"rule":"source.search_index","message":"SRC-000688: official URL/title confirmed via web search only; page not read","id":"SRC-000688"},{"rule":"source.date","message":"SRC-000689 has no publication / evidence date","id":"SRC-000689"},{"rule":"source.search_index","message":"SRC-000689: official URL/title confirmed via web search only; page not read","id":"SRC-000689"},{"rule":"source.date","message":"SRC-000690 has no publication / evidence date","id":"SRC-000690"},{"rule":"source.search_index","message":"SRC-000690: official URL/title confirmed via web search only; page not read","id":"SRC-000690"},{"rule":"source.date","message":"SRC-000691 has no publication / evidence date","id":"SRC-000691"},{"rule":"source.search_index","message":"SRC-000691: official URL/title confirmed via web search only; page not read","id":"SRC-000691"},{"rule":"source.date","message":"SRC-000692 has no publication / evidence date","id":"SRC-000692"},{"rule":"source.search_index","message":"SRC-000692: official URL/title confirmed via web search only; page not read","id":"SRC-000692"},{"rule":"source.date","message":"SRC-000693 has no publication / evidence date","id":"SRC-000693"},{"rule":"source.search_index","message":"SRC-000693: official URL/title confirmed via web search only; page not read","id":"SRC-000693"},{"rule":"source.date","message":"SRC-000694 has no publication / evidence date","id":"SRC-000694"},{"rule":"source.search_index","message":"SRC-000694: official URL/title confirmed via web search only; page not read","id":"SRC-000694"},{"rule":"source.date","message":"SRC-000695 has no publication / evidence date","id":"SRC-000695"},{"rule":"source.search_index","message":"SRC-000695: official URL/title confirmed via web search only; page not read","id":"SRC-000695"},{"rule":"source.date","message":"SRC-000696 has no publication / evidence date","id":"SRC-000696"},{"rule":"source.search_index","message":"SRC-000696: official URL/title confirmed via web search only; page not read","id":"SRC-000696"},{"rule":"source.date","message":"SRC-000697 has no publication / evidence date","id":"SRC-000697"},{"rule":"source.search_index","message":"SRC-000697: official URL/title confirmed via web search only; page not read","id":"SRC-000697"},{"rule":"source.date","message":"SRC-000698 has no publication / evidence date","id":"SRC-000698"},{"rule":"source.search_index","message":"SRC-000698: official URL/title confirmed via web search only; page not read","id":"SRC-000698"},{"rule":"source.date","message":"SRC-000699 has no publication / evidence date","id":"SRC-000699"},{"rule":"source.search_index","message":"SRC-000699: official URL/title confirmed via web search only; page not read","id":"SRC-000699"},{"rule":"source.date","message":"SRC-000700 has no publication / evidence date","id":"SRC-000700"},{"rule":"source.search_index","message":"SRC-000700: official URL/title confirmed via web search only; page not read","id":"SRC-000700"},{"rule":"source.date","message":"SRC-000701 has no publication / evidence date","id":"SRC-000701"},{"rule":"source.search_index","message":"SRC-000701: official URL/title confirmed via web search only; page not read","id":"SRC-000701"},{"rule":"source.date","message":"SRC-000702 has no publication / evidence date","id":"SRC-000702"},{"rule":"source.search_index","message":"SRC-000702: official URL/title confirmed via web search only; page not read","id":"SRC-000702"},{"rule":"source.date","message":"SRC-000703 has no publication / evidence date","id":"SRC-000703"},{"rule":"source.search_index","message":"SRC-000703: official URL/title confirmed via web search only; page not read","id":"SRC-000703"},{"rule":"source.date","message":"SRC-000704 has no publication / evidence date","id":"SRC-000704"},{"rule":"source.search_index","message":"SRC-000704: official URL/title confirmed via web search only; page not read","id":"SRC-000704"},{"rule":"source.date","message":"SRC-000705 has no publication / evidence date","id":"SRC-000705"},{"rule":"source.search_index","message":"SRC-000705: official URL/title confirmed via web search only; page not read","id":"SRC-000705"},{"rule":"source.date","message":"SRC-000706 has no publication / evidence date","id":"SRC-000706"},{"rule":"source.search_index","message":"SRC-000706: official URL/title confirmed via web search only; page not read","id":"SRC-000706"},{"rule":"source.date","message":"SRC-000707 has no publication / evidence date","id":"SRC-000707"},{"rule":"source.search_index","message":"SRC-000707: official URL/title confirmed via web search only; page not read","id":"SRC-000707"},{"rule":"source.date","message":"SRC-000708 has no publication / evidence date","id":"SRC-000708"},{"rule":"source.search_index","message":"SRC-000708: official URL/title confirmed via web search only; page not read","id":"SRC-000708"},{"rule":"source.date","message":"SRC-000709 has no publication / evidence date","id":"SRC-000709"},{"rule":"source.search_index","message":"SRC-000709: official URL/title confirmed via web search only; page not read","id":"SRC-000709"},{"rule":"source.date","message":"SRC-000710 has no publication / evidence date","id":"SRC-000710"},{"rule":"source.search_index","message":"SRC-000710: official URL/title confirmed via web search only; page not read","id":"SRC-000710"},{"rule":"source.search_index","message":"SRC-000711: official URL/title confirmed via web search only; page not read","id":"SRC-000711"},{"rule":"source.date","message":"SRC-000712 has no publication / evidence date","id":"SRC-000712"},{"rule":"source.search_index","message":"SRC-000712: official URL/title confirmed via web search only; page not read","id":"SRC-000712"},{"rule":"source.date","message":"SRC-000713 has no publication / evidence date","id":"SRC-000713"},{"rule":"source.search_index","message":"SRC-000713: official URL/title confirmed via web search only; page not read","id":"SRC-000713"},{"rule":"source.date","message":"SRC-000714 has no publication / evidence date","id":"SRC-000714"},{"rule":"source.search_index","message":"SRC-000714: official URL/title confirmed via web search only; page not read","id":"SRC-000714"},{"rule":"source.date","message":"SRC-000715 has no publication / evidence date","id":"SRC-000715"},{"rule":"source.search_index","message":"SRC-000715: official URL/title confirmed via web search only; page not read","id":"SRC-000715"},{"rule":"source.date","message":"SRC-000716 has no publication / evidence date","id":"SRC-000716"},{"rule":"source.search_index","message":"SRC-000716: official URL/title confirmed via web search only; page not read","id":"SRC-000716"},{"rule":"source.date","message":"SRC-000717 has no publication / evidence date","id":"SRC-000717"},{"rule":"source.search_index","message":"SRC-000717: official URL/title confirmed via web search only; page not read","id":"SRC-000717"},{"rule":"source.date","message":"SRC-000718 has no publication / evidence date","id":"SRC-000718"},{"rule":"source.search_index","message":"SRC-000718: official URL/title confirmed via web search only; page not read","id":"SRC-000718"},{"rule":"source.date","message":"SRC-000719 has no publication / evidence date","id":"SRC-000719"},{"rule":"source.search_index","message":"SRC-000719: official URL/title confirmed via web search only; page not read","id":"SRC-000719"},{"rule":"source.date","message":"SRC-000720 has no publication / evidence date","id":"SRC-000720"},{"rule":"source.search_index","message":"SRC-000720: official URL/title confirmed via web search only; page not read","id":"SRC-000720"},{"rule":"source.date","message":"SRC-000721 has no publication / evidence date","id":"SRC-000721"},{"rule":"source.search_index","message":"SRC-000721: official URL/title confirmed via web search only; page not read","id":"SRC-000721"},{"rule":"source.date","message":"SRC-000722 has no publication / evidence date","id":"SRC-000722"},{"rule":"source.search_index","message":"SRC-000722: official URL/title confirmed via web search only; page not read","id":"SRC-000722"},{"rule":"source.date","message":"SRC-000723 has no publication / evidence date","id":"SRC-000723"},{"rule":"source.search_index","message":"SRC-000723: official URL/title confirmed via web search only; page not read","id":"SRC-000723"},{"rule":"source.date","message":"SRC-000724 has no publication / evidence date","id":"SRC-000724"},{"rule":"source.search_index","message":"SRC-000724: official URL/title confirmed via web search only; page not read","id":"SRC-000724"},{"rule":"source.date","message":"SRC-000725 has no publication / evidence date","id":"SRC-000725"},{"rule":"source.search_index","message":"SRC-000725: official URL/title confirmed via web search only; page not read","id":"SRC-000725"},{"rule":"source.date","message":"SRC-000726 has no publication / evidence date","id":"SRC-000726"},{"rule":"source.search_index","message":"SRC-000726: official URL/title confirmed via web search only; page not read","id":"SRC-000726"},{"rule":"source.date","message":"SRC-000727 has no publication / evidence date","id":"SRC-000727"},{"rule":"source.search_index","message":"SRC-000727: official URL/title confirmed via web search only; page not read","id":"SRC-000727"},{"rule":"source.date","message":"SRC-000728 has no publication / evidence date","id":"SRC-000728"},{"rule":"source.search_index","message":"SRC-000728: official URL/title confirmed via web search only; page not read","id":"SRC-000728"},{"rule":"source.date","message":"SRC-000729 has no publication / evidence date","id":"SRC-000729"},{"rule":"source.search_index","message":"SRC-000729: official URL/title confirmed via web search only; page not read","id":"SRC-000729"},{"rule":"source.search_index","message":"SRC-000730: official URL/title confirmed via web search only; page not read","id":"SRC-000730"},{"rule":"source.date","message":"SRC-000731 has no publication / evidence date","id":"SRC-000731"},{"rule":"source.search_index","message":"SRC-000731: official URL/title confirmed via web search only; page not read","id":"SRC-000731"},{"rule":"source.date","message":"SRC-000732 has no publication / evidence date","id":"SRC-000732"},{"rule":"source.search_index","message":"SRC-000732: official URL/title confirmed via web search only; page not read","id":"SRC-000732"},{"rule":"source.date","message":"SRC-000733 has no publication / evidence date","id":"SRC-000733"},{"rule":"source.search_index","message":"SRC-000733: official URL/title confirmed via web search only; page not read","id":"SRC-000733"},{"rule":"source.date","message":"SRC-000734 has no publication / evidence date","id":"SRC-000734"},{"rule":"source.search_index","message":"SRC-000734: official URL/title confirmed via web search only; page not read","id":"SRC-000734"},{"rule":"source.date","message":"SRC-000735 has no publication / evidence date","id":"SRC-000735"},{"rule":"source.search_index","message":"SRC-000735: official URL/title confirmed via web search only; page not read","id":"SRC-000735"},{"rule":"source.date","message":"SRC-000736 has no publication / evidence date","id":"SRC-000736"},{"rule":"source.search_index","message":"SRC-000736: official URL/title confirmed via web search only; page not read","id":"SRC-000736"},{"rule":"source.date","message":"SRC-000737 has no publication / evidence date","id":"SRC-000737"},{"rule":"source.search_index","message":"SRC-000737: official URL/title confirmed via web search only; page not read","id":"SRC-000737"},{"rule":"source.date","message":"SRC-000738 has no publication / evidence date","id":"SRC-000738"},{"rule":"source.search_index","message":"SRC-000738: official URL/title confirmed via web search only; page not read","id":"SRC-000738"},{"rule":"source.date","message":"SRC-000739 has no publication / evidence date","id":"SRC-000739"},{"rule":"source.search_index","message":"SRC-000739: official URL/title confirmed via web search only; page not read","id":"SRC-000739"},{"rule":"source.date","message":"SRC-000740 has no publication / evidence date","id":"SRC-000740"},{"rule":"source.search_index","message":"SRC-000740: official URL/title confirmed via web search only; page not read","id":"SRC-000740"},{"rule":"source.date","message":"SRC-000741 has no publication / evidence date","id":"SRC-000741"},{"rule":"source.search_index","message":"SRC-000741: official URL/title confirmed via web search only; page not read","id":"SRC-000741"},{"rule":"source.date","message":"SRC-000742 has no publication / evidence date","id":"SRC-000742"},{"rule":"source.search_index","message":"SRC-000742: official URL/title confirmed via web search only; page not read","id":"SRC-000742"},{"rule":"source.date","message":"SRC-000743 has no publication / evidence date","id":"SRC-000743"},{"rule":"source.search_index","message":"SRC-000743: official URL/title confirmed via web search only; page not read","id":"SRC-000743"},{"rule":"source.date","message":"SRC-000744 has no publication / evidence date","id":"SRC-000744"},{"rule":"source.search_index","message":"SRC-000744: official URL/title confirmed via web search only; page not read","id":"SRC-000744"},{"rule":"source.date","message":"SRC-000745 has no publication / evidence date","id":"SRC-000745"},{"rule":"source.search_index","message":"SRC-000745: official URL/title confirmed via web search only; page not read","id":"SRC-000745"},{"rule":"source.date","message":"SRC-000746 has no publication / evidence date","id":"SRC-000746"},{"rule":"source.search_index","message":"SRC-000746: official URL/title confirmed via web search only; page not read","id":"SRC-000746"},{"rule":"source.date","message":"SRC-000747 has no publication / evidence date","id":"SRC-000747"},{"rule":"source.search_index","message":"SRC-000747: official URL/title confirmed via web search only; page not read","id":"SRC-000747"},{"rule":"source.date","message":"SRC-000748 has no publication / evidence date","id":"SRC-000748"},{"rule":"source.search_index","message":"SRC-000748: official URL/title confirmed via web search only; page not read","id":"SRC-000748"},{"rule":"source.date","message":"SRC-000749 has no publication / evidence date","id":"SRC-000749"},{"rule":"source.search_index","message":"SRC-000749: official URL/title confirmed via web search only; page not read","id":"SRC-000749"},{"rule":"source.date","message":"SRC-000750 has no publication / evidence date","id":"SRC-000750"},{"rule":"source.search_index","message":"SRC-000750: official URL/title confirmed via web search only; page not read","id":"SRC-000750"},{"rule":"source.date","message":"SRC-000751 has no publication / evidence date","id":"SRC-000751"},{"rule":"source.search_index","message":"SRC-000751: official URL/title confirmed via web search only; page not read","id":"SRC-000751"},{"rule":"source.date","message":"SRC-000752 has no publication / evidence date","id":"SRC-000752"},{"rule":"source.search_index","message":"SRC-000752: official URL/title confirmed via web search only; page not read","id":"SRC-000752"},{"rule":"source.date","message":"SRC-000753 has no publication / evidence date","id":"SRC-000753"},{"rule":"source.search_index","message":"SRC-000753: official URL/title confirmed via web search only; page not read","id":"SRC-000753"},{"rule":"source.date","message":"SRC-000754 has no publication / evidence date","id":"SRC-000754"},{"rule":"source.search_index","message":"SRC-000754: official URL/title confirmed via web search only; page not read","id":"SRC-000754"},{"rule":"source.date","message":"SRC-000755 has no publication / evidence date","id":"SRC-000755"},{"rule":"source.search_index","message":"SRC-000755: official URL/title confirmed via web search only; page not read","id":"SRC-000755"},{"rule":"source.date","message":"SRC-000756 has no publication / evidence date","id":"SRC-000756"},{"rule":"source.search_index","message":"SRC-000756: official URL/title confirmed via web search only; page not read","id":"SRC-000756"},{"rule":"source.date","message":"SRC-000757 has no publication / evidence date","id":"SRC-000757"},{"rule":"source.search_index","message":"SRC-000757: official URL/title confirmed via web search only; page not read","id":"SRC-000757"},{"rule":"source.date","message":"SRC-000758 has no publication / evidence date","id":"SRC-000758"},{"rule":"source.search_index","message":"SRC-000758: official URL/title confirmed via web search only; page not read","id":"SRC-000758"},{"rule":"source.date","message":"SRC-000759 has no publication / evidence date","id":"SRC-000759"},{"rule":"source.search_index","message":"SRC-000759: official URL/title confirmed via web search only; page not read","id":"SRC-000759"},{"rule":"source.date","message":"SRC-000760 has no publication / evidence date","id":"SRC-000760"},{"rule":"source.search_index","message":"SRC-000760: official URL/title confirmed via web search only; page not read","id":"SRC-000760"},{"rule":"source.date","message":"SRC-000761 has no publication / evidence date","id":"SRC-000761"},{"rule":"source.search_index","message":"SRC-000761: official URL/title confirmed via web search only; page not read","id":"SRC-000761"},{"rule":"source.date","message":"SRC-000762 has no publication / evidence date","id":"SRC-000762"},{"rule":"source.search_index","message":"SRC-000762: official URL/title confirmed via web search only; page not read","id":"SRC-000762"},{"rule":"source.date","message":"SRC-000763 has no publication / evidence date","id":"SRC-000763"},{"rule":"source.search_index","message":"SRC-000763: official URL/title confirmed via web search only; page not read","id":"SRC-000763"},{"rule":"source.date","message":"SRC-000764 has no publication / evidence date","id":"SRC-000764"},{"rule":"source.search_index","message":"SRC-000764: official URL/title confirmed via web search only; page not read","id":"SRC-000764"},{"rule":"source.date","message":"SRC-000765 has no publication / evidence date","id":"SRC-000765"},{"rule":"source.search_index","message":"SRC-000765: official URL/title confirmed via web search only; page not read","id":"SRC-000765"},{"rule":"source.date","message":"SRC-000766 has no publication / evidence date","id":"SRC-000766"},{"rule":"source.search_index","message":"SRC-000766: official URL/title confirmed via web search only; page not read","id":"SRC-000766"},{"rule":"source.date","message":"SRC-000767 has no publication / evidence date","id":"SRC-000767"},{"rule":"source.search_index","message":"SRC-000767: official URL/title confirmed via web search only; page not read","id":"SRC-000767"},{"rule":"source.date","message":"SRC-000768 has no publication / evidence date","id":"SRC-000768"},{"rule":"source.search_index","message":"SRC-000768: official URL/title confirmed via web search only; page not read","id":"SRC-000768"},{"rule":"source.date","message":"SRC-000769 has no publication / evidence date","id":"SRC-000769"},{"rule":"source.search_index","message":"SRC-000769: official URL/title confirmed via web search only; page not read","id":"SRC-000769"},{"rule":"source.date","message":"SRC-000770 has no publication / evidence date","id":"SRC-000770"},{"rule":"source.search_index","message":"SRC-000770: official URL/title confirmed via web search only; page not read","id":"SRC-000770"},{"rule":"source.date","message":"SRC-000771 has no publication / evidence date","id":"SRC-000771"},{"rule":"source.search_index","message":"SRC-000771: official URL/title confirmed via web search only; page not read","id":"SRC-000771"},{"rule":"source.date","message":"SRC-000772 has no publication / evidence date","id":"SRC-000772"},{"rule":"source.search_index","message":"SRC-000772: official URL/title confirmed via web search only; page not read","id":"SRC-000772"},{"rule":"source.date","message":"SRC-000773 has no publication / evidence date","id":"SRC-000773"},{"rule":"source.search_index","message":"SRC-000773: official URL/title confirmed via web search only; page not read","id":"SRC-000773"},{"rule":"source.date","message":"SRC-000774 has no publication / evidence date","id":"SRC-000774"},{"rule":"source.search_index","message":"SRC-000774: official URL/title confirmed via web search only; page not read","id":"SRC-000774"},{"rule":"source.date","message":"SRC-000775 has no publication / evidence date","id":"SRC-000775"},{"rule":"source.search_index","message":"SRC-000775: official URL/title confirmed via web search only; page not read","id":"SRC-000775"},{"rule":"source.date","message":"SRC-000776 has no publication / evidence date","id":"SRC-000776"},{"rule":"source.search_index","message":"SRC-000776: official URL/title confirmed via web search only; page not read","id":"SRC-000776"},{"rule":"source.date","message":"SRC-000777 has no publication / evidence date","id":"SRC-000777"},{"rule":"source.search_index","message":"SRC-000777: official URL/title confirmed via web search only; page not read","id":"SRC-000777"},{"rule":"source.search_index","message":"SRC-000778: official URL/title confirmed via web search only; page not read","id":"SRC-000778"},{"rule":"source.date","message":"SRC-000779 has no publication / evidence date","id":"SRC-000779"},{"rule":"source.search_index","message":"SRC-000779: official URL/title confirmed via web search only; page not read","id":"SRC-000779"},{"rule":"source.date","message":"SRC-000780 has no publication / evidence date","id":"SRC-000780"},{"rule":"source.search_index","message":"SRC-000780: official URL/title confirmed via web search only; page not read","id":"SRC-000780"},{"rule":"source.date","message":"SRC-000781 has no publication / evidence date","id":"SRC-000781"},{"rule":"source.search_index","message":"SRC-000781: official URL/title confirmed via web search only; page not read","id":"SRC-000781"},{"rule":"source.date","message":"SRC-000782 has no publication / evidence date","id":"SRC-000782"},{"rule":"source.search_index","message":"SRC-000782: official URL/title confirmed via web search only; page not read","id":"SRC-000782"},{"rule":"source.date","message":"SRC-000783 has no publication / evidence date","id":"SRC-000783"},{"rule":"source.search_index","message":"SRC-000783: official URL/title confirmed via web search only; page not read","id":"SRC-000783"},{"rule":"source.date","message":"SRC-000784 has no publication / evidence date","id":"SRC-000784"},{"rule":"source.search_index","message":"SRC-000784: official URL/title confirmed via web search only; page not read","id":"SRC-000784"},{"rule":"source.date","message":"SRC-000785 has no publication / evidence date","id":"SRC-000785"},{"rule":"source.search_index","message":"SRC-000785: official URL/title confirmed via web search only; page not read","id":"SRC-000785"},{"rule":"source.date","message":"SRC-000786 has no publication / evidence date","id":"SRC-000786"},{"rule":"source.search_index","message":"SRC-000786: official URL/title confirmed via web search only; page not read","id":"SRC-000786"},{"rule":"source.date","message":"SRC-000787 has no publication / evidence date","id":"SRC-000787"},{"rule":"source.search_index","message":"SRC-000787: official URL/title confirmed via web search only; page not read","id":"SRC-000787"},{"rule":"source.date","message":"SRC-000788 has no publication / evidence date","id":"SRC-000788"},{"rule":"source.search_index","message":"SRC-000788: official URL/title confirmed via web search only; page not read","id":"SRC-000788"},{"rule":"source.date","message":"SRC-000789 has no publication / evidence date","id":"SRC-000789"},{"rule":"source.search_index","message":"SRC-000789: official URL/title confirmed via web search only; page not read","id":"SRC-000789"},{"rule":"source.date","message":"SRC-000790 has no publication / evidence date","id":"SRC-000790"},{"rule":"source.search_index","message":"SRC-000790: official URL/title confirmed via web search only; page not read","id":"SRC-000790"},{"rule":"source.date","message":"SRC-000791 has no publication / evidence date","id":"SRC-000791"},{"rule":"source.search_index","message":"SRC-000791: official URL/title confirmed via web search only; page not read","id":"SRC-000791"},{"rule":"source.date","message":"SRC-000792 has no publication / evidence date","id":"SRC-000792"},{"rule":"source.search_index","message":"SRC-000792: official URL/title confirmed via web search only; page not read","id":"SRC-000792"},{"rule":"source.date","message":"SRC-000793 has no publication / evidence date","id":"SRC-000793"},{"rule":"source.search_index","message":"SRC-000793: official URL/title confirmed via web search only; page not read","id":"SRC-000793"},{"rule":"source.date","message":"SRC-000794 has no publication / evidence date","id":"SRC-000794"},{"rule":"source.search_index","message":"SRC-000794: official URL/title confirmed via web search only; page not read","id":"SRC-000794"},{"rule":"source.date","message":"SRC-000795 has no publication / evidence date","id":"SRC-000795"},{"rule":"source.search_index","message":"SRC-000795: official URL/title confirmed via web search only; page not read","id":"SRC-000795"},{"rule":"source.date","message":"SRC-000796 has no publication / evidence date","id":"SRC-000796"},{"rule":"source.search_index","message":"SRC-000796: official URL/title confirmed via web search only; page not read","id":"SRC-000796"},{"rule":"source.date","message":"SRC-000797 has no publication / evidence date","id":"SRC-000797"},{"rule":"source.search_index","message":"SRC-000797: official URL/title confirmed via web search only; page not read","id":"SRC-000797"},{"rule":"source.date","message":"SRC-000798 has no publication / evidence date","id":"SRC-000798"},{"rule":"source.search_index","message":"SRC-000798: official URL/title confirmed via web search only; page not read","id":"SRC-000798"},{"rule":"source.date","message":"SRC-000799 has no publication / evidence date","id":"SRC-000799"},{"rule":"source.search_index","message":"SRC-000799: official URL/title confirmed via web search only; page not read","id":"SRC-000799"},{"rule":"source.date","message":"SRC-000800 has no publication / evidence date","id":"SRC-000800"},{"rule":"source.search_index","message":"SRC-000800: official URL/title confirmed via web search only; page not read","id":"SRC-000800"},{"rule":"source.date","message":"SRC-000801 has no publication / evidence date","id":"SRC-000801"},{"rule":"source.search_index","message":"SRC-000801: official URL/title confirmed via web search only; page not read","id":"SRC-000801"},{"rule":"source.date","message":"SRC-000802 has no publication / evidence date","id":"SRC-000802"},{"rule":"source.search_index","message":"SRC-000802: official URL/title confirmed via web search only; page not read","id":"SRC-000802"},{"rule":"source.date","message":"SRC-000803 has no publication / evidence date","id":"SRC-000803"},{"rule":"source.search_index","message":"SRC-000803: official URL/title confirmed via web search only; page not read","id":"SRC-000803"},{"rule":"source.date","message":"SRC-000804 has no publication / evidence date","id":"SRC-000804"},{"rule":"source.search_index","message":"SRC-000804: official URL/title confirmed via web search only; page not read","id":"SRC-000804"},{"rule":"source.date","message":"SRC-000805 has no publication / evidence date","id":"SRC-000805"},{"rule":"source.search_index","message":"SRC-000805: official URL/title confirmed via web search only; page not read","id":"SRC-000805"},{"rule":"source.search_index","message":"SRC-000806: official URL/title confirmed via web search only; page not read","id":"SRC-000806"},{"rule":"source.search_index","message":"SRC-000807: official URL/title confirmed via web search only; page not read","id":"SRC-000807"},{"rule":"source.date","message":"SRC-000808 has no publication / evidence date","id":"SRC-000808"},{"rule":"source.search_index","message":"SRC-000808: official URL/title confirmed via web search only; page not read","id":"SRC-000808"},{"rule":"source.date","message":"SRC-000809 has no publication / evidence date","id":"SRC-000809"},{"rule":"source.search_index","message":"SRC-000809: official URL/title confirmed via web search only; page not read","id":"SRC-000809"},{"rule":"source.date","message":"SRC-000810 has no publication / evidence date","id":"SRC-000810"},{"rule":"source.search_index","message":"SRC-000810: official URL/title confirmed via web search only; page not read","id":"SRC-000810"},{"rule":"source.date","message":"SRC-000811 has no publication / evidence date","id":"SRC-000811"},{"rule":"source.search_index","message":"SRC-000811: official URL/title confirmed via web search only; page not read","id":"SRC-000811"},{"rule":"source.date","message":"SRC-000812 has no publication / evidence date","id":"SRC-000812"},{"rule":"source.search_index","message":"SRC-000812: official URL/title confirmed via web search only; page not read","id":"SRC-000812"},{"rule":"source.date","message":"SRC-000813 has no publication / evidence date","id":"SRC-000813"},{"rule":"source.search_index","message":"SRC-000813: official URL/title confirmed via web search only; page not read","id":"SRC-000813"},{"rule":"source.date","message":"SRC-000814 has no publication / evidence date","id":"SRC-000814"},{"rule":"source.search_index","message":"SRC-000814: official URL/title confirmed via web search only; page not read","id":"SRC-000814"},{"rule":"source.date","message":"SRC-000815 has no publication / evidence date","id":"SRC-000815"},{"rule":"source.search_index","message":"SRC-000815: official URL/title confirmed via web search only; page not read","id":"SRC-000815"},{"rule":"source.date","message":"SRC-000816 has no publication / evidence date","id":"SRC-000816"},{"rule":"source.search_index","message":"SRC-000816: official URL/title confirmed via web search only; page not read","id":"SRC-000816"},{"rule":"source.date","message":"SRC-000817 has no publication / evidence date","id":"SRC-000817"},{"rule":"source.search_index","message":"SRC-000817: official URL/title confirmed via web search only; page not read","id":"SRC-000817"},{"rule":"source.date","message":"SRC-000818 has no publication / evidence date","id":"SRC-000818"},{"rule":"source.search_index","message":"SRC-000818: official URL/title confirmed via web search only; page not read","id":"SRC-000818"},{"rule":"source.date","message":"SRC-000819 has no publication / evidence date","id":"SRC-000819"},{"rule":"source.search_index","message":"SRC-000819: official URL/title confirmed via web search only; page not read","id":"SRC-000819"},{"rule":"source.date","message":"SRC-000820 has no publication / evidence date","id":"SRC-000820"},{"rule":"source.search_index","message":"SRC-000820: official URL/title confirmed via web search only; page not read","id":"SRC-000820"},{"rule":"source.date","message":"SRC-000821 has no publication / evidence date","id":"SRC-000821"},{"rule":"source.search_index","message":"SRC-000821: official URL/title confirmed via web search only; page not read","id":"SRC-000821"},{"rule":"source.date","message":"SRC-000822 has no publication / evidence date","id":"SRC-000822"},{"rule":"source.search_index","message":"SRC-000822: official URL/title confirmed via web search only; page not read","id":"SRC-000822"},{"rule":"source.date","message":"SRC-000823 has no publication / evidence date","id":"SRC-000823"},{"rule":"source.search_index","message":"SRC-000823: official URL/title confirmed via web search only; page not read","id":"SRC-000823"},{"rule":"source.date","message":"SRC-000824 has no publication / evidence date","id":"SRC-000824"},{"rule":"source.search_index","message":"SRC-000824: official URL/title confirmed via web search only; page not read","id":"SRC-000824"},{"rule":"source.date","message":"SRC-000825 has no publication / evidence date","id":"SRC-000825"},{"rule":"source.search_index","message":"SRC-000825: official URL/title confirmed via web search only; page not read","id":"SRC-000825"},{"rule":"source.date","message":"SRC-000826 has no publication / evidence date","id":"SRC-000826"},{"rule":"source.search_index","message":"SRC-000826: official URL/title confirmed via web search only; page not read","id":"SRC-000826"},{"rule":"source.date","message":"SRC-000827 has no publication / evidence date","id":"SRC-000827"},{"rule":"source.search_index","message":"SRC-000827: official URL/title confirmed via web search only; page not read","id":"SRC-000827"},{"rule":"source.date","message":"SRC-000828 has no publication / evidence date","id":"SRC-000828"},{"rule":"source.search_index","message":"SRC-000828: official URL/title confirmed via web search only; page not read","id":"SRC-000828"},{"rule":"source.date","message":"SRC-000829 has no publication / evidence date","id":"SRC-000829"},{"rule":"source.search_index","message":"SRC-000829: official URL/title confirmed via web search only; page not read","id":"SRC-000829"},{"rule":"source.date","message":"SRC-000830 has no publication / evidence date","id":"SRC-000830"},{"rule":"source.search_index","message":"SRC-000830: official URL/title confirmed via web search only; page not read","id":"SRC-000830"},{"rule":"source.date","message":"SRC-000831 has no publication / evidence date","id":"SRC-000831"},{"rule":"source.search_index","message":"SRC-000831: official URL/title confirmed via web search only; page not read","id":"SRC-000831"},{"rule":"source.date","message":"SRC-000832 has no publication / evidence date","id":"SRC-000832"},{"rule":"source.search_index","message":"SRC-000832: official URL/title confirmed via web search only; page not read","id":"SRC-000832"},{"rule":"source.date","message":"SRC-000833 has no publication / evidence date","id":"SRC-000833"},{"rule":"source.search_index","message":"SRC-000833: official URL/title confirmed via web search only; page not read","id":"SRC-000833"},{"rule":"source.date","message":"SRC-000834 has no publication / evidence date","id":"SRC-000834"},{"rule":"source.search_index","message":"SRC-000834: official URL/title confirmed via web search only; page not read","id":"SRC-000834"},{"rule":"source.date","message":"SRC-000835 has no publication / evidence date","id":"SRC-000835"},{"rule":"source.search_index","message":"SRC-000835: official URL/title confirmed via web search only; page not read","id":"SRC-000835"},{"rule":"source.date","message":"SRC-000836 has no publication / evidence date","id":"SRC-000836"},{"rule":"source.search_index","message":"SRC-000836: official URL/title confirmed via web search only; page not read","id":"SRC-000836"},{"rule":"source.date","message":"SRC-000837 has no publication / evidence date","id":"SRC-000837"},{"rule":"source.search_index","message":"SRC-000837: official URL/title confirmed via web search only; page not read","id":"SRC-000837"},{"rule":"source.date","message":"SRC-000838 has no publication / evidence date","id":"SRC-000838"},{"rule":"source.search_index","message":"SRC-000838: official URL/title confirmed via web search only; page not read","id":"SRC-000838"},{"rule":"source.date","message":"SRC-000839 has no publication / evidence date","id":"SRC-000839"},{"rule":"source.search_index","message":"SRC-000839: official URL/title confirmed via web search only; page not read","id":"SRC-000839"},{"rule":"source.date","message":"SRC-000840 has no publication / evidence date","id":"SRC-000840"},{"rule":"source.search_index","message":"SRC-000840: official URL/title confirmed via web search only; page not read","id":"SRC-000840"},{"rule":"source.date","message":"SRC-000841 has no publication / evidence date","id":"SRC-000841"},{"rule":"source.search_index","message":"SRC-000841: official URL/title confirmed via web search only; page not read","id":"SRC-000841"},{"rule":"source.date","message":"SRC-000842 has no publication / evidence date","id":"SRC-000842"},{"rule":"source.search_index","message":"SRC-000842: official URL/title confirmed via web search only; page not read","id":"SRC-000842"},{"rule":"source.date","message":"SRC-000843 has no publication / evidence date","id":"SRC-000843"},{"rule":"source.search_index","message":"SRC-000843: official URL/title confirmed via web search only; page not read","id":"SRC-000843"},{"rule":"source.search_index","message":"SRC-000844: official URL/title confirmed via web search only; page not read","id":"SRC-000844"},{"rule":"source.search_index","message":"SRC-000845: official URL/title confirmed via web search only; page not read","id":"SRC-000845"},{"rule":"source.date","message":"SRC-000846 has no publication / evidence date","id":"SRC-000846"},{"rule":"source.search_index","message":"SRC-000846: official URL/title confirmed via web search only; page not read","id":"SRC-000846"},{"rule":"source.date","message":"SRC-000847 has no publication / evidence date","id":"SRC-000847"},{"rule":"source.search_index","message":"SRC-000847: official URL/title confirmed via web search only; page not read","id":"SRC-000847"},{"rule":"source.date","message":"SRC-000848 has no publication / evidence date","id":"SRC-000848"},{"rule":"source.search_index","message":"SRC-000848: official URL/title confirmed via web search only; page not read","id":"SRC-000848"},{"rule":"source.date","message":"SRC-000849 has no publication / evidence date","id":"SRC-000849"},{"rule":"source.search_index","message":"SRC-000849: official URL/title confirmed via web search only; page not read","id":"SRC-000849"},{"rule":"source.date","message":"SRC-000850 has no publication / evidence date","id":"SRC-000850"},{"rule":"source.search_index","message":"SRC-000850: official URL/title confirmed via web search only; page not read","id":"SRC-000850"},{"rule":"source.date","message":"SRC-000851 has no publication / evidence date","id":"SRC-000851"},{"rule":"source.search_index","message":"SRC-000851: official URL/title confirmed via web search only; page not read","id":"SRC-000851"},{"rule":"source.date","message":"SRC-000852 has no publication / evidence date","id":"SRC-000852"},{"rule":"source.search_index","message":"SRC-000852: official URL/title confirmed via web search only; page not read","id":"SRC-000852"},{"rule":"source.date","message":"SRC-000853 has no publication / evidence date","id":"SRC-000853"},{"rule":"source.search_index","message":"SRC-000853: official URL/title confirmed via web search only; page not read","id":"SRC-000853"},{"rule":"source.date","message":"SRC-000854 has no publication / evidence date","id":"SRC-000854"},{"rule":"source.search_index","message":"SRC-000854: official URL/title confirmed via web search only; page not read","id":"SRC-000854"},{"rule":"source.date","message":"SRC-000855 has no publication / evidence date","id":"SRC-000855"},{"rule":"source.search_index","message":"SRC-000855: official URL/title confirmed via web search only; page not read","id":"SRC-000855"},{"rule":"source.date","message":"SRC-000856 has no publication / evidence date","id":"SRC-000856"},{"rule":"source.search_index","message":"SRC-000856: official URL/title confirmed via web search only; page not read","id":"SRC-000856"},{"rule":"source.date","message":"SRC-000857 has no publication / evidence date","id":"SRC-000857"},{"rule":"source.search_index","message":"SRC-000857: official URL/title confirmed via web search only; page not read","id":"SRC-000857"},{"rule":"source.date","message":"SRC-000858 has no publication / evidence date","id":"SRC-000858"},{"rule":"source.search_index","message":"SRC-000858: official URL/title confirmed via web search only; page not read","id":"SRC-000858"},{"rule":"source.date","message":"SRC-000859 has no publication / evidence date","id":"SRC-000859"},{"rule":"source.search_index","message":"SRC-000859: official URL/title confirmed via web search only; page not read","id":"SRC-000859"},{"rule":"source.date","message":"SRC-000860 has no publication / evidence date","id":"SRC-000860"},{"rule":"source.search_index","message":"SRC-000860: official URL/title confirmed via web search only; page not read","id":"SRC-000860"},{"rule":"source.date","message":"SRC-000861 has no publication / evidence date","id":"SRC-000861"},{"rule":"source.search_index","message":"SRC-000861: official URL/title confirmed via web search only; page not read","id":"SRC-000861"},{"rule":"source.date","message":"SRC-000862 has no publication / evidence date","id":"SRC-000862"},{"rule":"source.search_index","message":"SRC-000862: official URL/title confirmed via web search only; page not read","id":"SRC-000862"},{"rule":"source.date","message":"SRC-000863 has no publication / evidence date","id":"SRC-000863"},{"rule":"source.search_index","message":"SRC-000863: official URL/title confirmed via web search only; page not read","id":"SRC-000863"},{"rule":"source.date","message":"SRC-000864 has no publication / evidence date","id":"SRC-000864"},{"rule":"source.search_index","message":"SRC-000864: official URL/title confirmed via web search only; page not read","id":"SRC-000864"},{"rule":"source.date","message":"SRC-000865 has no publication / evidence date","id":"SRC-000865"},{"rule":"source.search_index","message":"SRC-000865: official URL/title confirmed via web search only; page not read","id":"SRC-000865"},{"rule":"source.date","message":"SRC-000866 has no publication / evidence date","id":"SRC-000866"},{"rule":"source.search_index","message":"SRC-000866: official URL/title confirmed via web search only; page not read","id":"SRC-000866"},{"rule":"source.date","message":"SRC-000867 has no publication / evidence date","id":"SRC-000867"},{"rule":"source.search_index","message":"SRC-000867: official URL/title confirmed via web search only; page not read","id":"SRC-000867"},{"rule":"source.date","message":"SRC-000868 has no publication / evidence date","id":"SRC-000868"},{"rule":"source.search_index","message":"SRC-000868: official URL/title confirmed via web search only; page not read","id":"SRC-000868"},{"rule":"source.date","message":"SRC-000869 has no publication / evidence date","id":"SRC-000869"},{"rule":"source.search_index","message":"SRC-000869: official URL/title confirmed via web search only; page not read","id":"SRC-000869"},{"rule":"source.date","message":"SRC-000870 has no publication / evidence date","id":"SRC-000870"},{"rule":"source.search_index","message":"SRC-000870: official URL/title confirmed via web search only; page not read","id":"SRC-000870"},{"rule":"source.date","message":"SRC-000871 has no publication / evidence date","id":"SRC-000871"},{"rule":"source.search_index","message":"SRC-000871: official URL/title confirmed via web search only; page not read","id":"SRC-000871"},{"rule":"source.date","message":"SRC-000872 has no publication / evidence date","id":"SRC-000872"},{"rule":"source.search_index","message":"SRC-000872: official URL/title confirmed via web search only; page not read","id":"SRC-000872"},{"rule":"source.date","message":"SRC-000873 has no publication / evidence date","id":"SRC-000873"},{"rule":"source.search_index","message":"SRC-000873: official URL/title confirmed via web search only; page not read","id":"SRC-000873"},{"rule":"source.date","message":"SRC-000874 has no publication / evidence date","id":"SRC-000874"},{"rule":"source.search_index","message":"SRC-000874: official URL/title confirmed via web search only; page not read","id":"SRC-000874"},{"rule":"source.date","message":"SRC-000875 has no publication / evidence date","id":"SRC-000875"},{"rule":"source.search_index","message":"SRC-000875: official URL/title confirmed via web search only; page not read","id":"SRC-000875"},{"rule":"source.date","message":"SRC-000876 has no publication / evidence date","id":"SRC-000876"},{"rule":"source.search_index","message":"SRC-000876: official URL/title confirmed via web search only; page not read","id":"SRC-000876"},{"rule":"source.search_index","message":"SRC-000877: official URL/title confirmed via web search only; page not read","id":"SRC-000877"},{"rule":"source.search_index","message":"SRC-000878: official URL/title confirmed via web search only; page not read","id":"SRC-000878"},{"rule":"source.date","message":"SRC-000879 has no publication / evidence date","id":"SRC-000879"},{"rule":"source.search_index","message":"SRC-000879: official URL/title confirmed via web search only; page not read","id":"SRC-000879"},{"rule":"source.search_index","message":"SRC-000880: official URL/title confirmed via web search only; page not read","id":"SRC-000880"},{"rule":"source.date","message":"SRC-000881 has no publication / evidence date","id":"SRC-000881"},{"rule":"source.search_index","message":"SRC-000881: official URL/title confirmed via web search only; page not read","id":"SRC-000881"},{"rule":"source.search_index","message":"SRC-000882: official URL/title confirmed via web search only; page not read","id":"SRC-000882"},{"rule":"source.date","message":"SRC-000883 has no publication / evidence date","id":"SRC-000883"},{"rule":"source.search_index","message":"SRC-000883: official URL/title confirmed via web search only; page not read","id":"SRC-000883"},{"rule":"source.date","message":"SRC-000884 has no publication / evidence date","id":"SRC-000884"},{"rule":"source.search_index","message":"SRC-000884: official URL/title confirmed via web search only; page not read","id":"SRC-000884"},{"rule":"source.date","message":"SRC-000885 has no publication / evidence date","id":"SRC-000885"},{"rule":"source.search_index","message":"SRC-000885: official URL/title confirmed via web search only; page not read","id":"SRC-000885"},{"rule":"source.date","message":"SRC-000886 has no publication / evidence date","id":"SRC-000886"},{"rule":"source.search_index","message":"SRC-000886: official URL/title confirmed via web search only; page not read","id":"SRC-000886"},{"rule":"source.date","message":"SRC-000887 has no publication / evidence date","id":"SRC-000887"},{"rule":"source.search_index","message":"SRC-000887: official URL/title confirmed via web search only; page not read","id":"SRC-000887"},{"rule":"source.date","message":"SRC-000888 has no publication / evidence date","id":"SRC-000888"},{"rule":"source.search_index","message":"SRC-000888: official URL/title confirmed via web search only; page not read","id":"SRC-000888"},{"rule":"source.search_index","message":"SRC-000889: official URL/title confirmed via web search only; page not read","id":"SRC-000889"},{"rule":"source.search_index","message":"SRC-000890: official URL/title confirmed via web search only; page not read","id":"SRC-000890"},{"rule":"source.date","message":"SRC-000891 has no publication / evidence date","id":"SRC-000891"},{"rule":"source.search_index","message":"SRC-000891: official URL/title confirmed via web search only; page not read","id":"SRC-000891"},{"rule":"source.search_index","message":"SRC-000892: official URL/title confirmed via web search only; page not read","id":"SRC-000892"},{"rule":"source.search_index","message":"SRC-000893: official URL/title confirmed via web search only; page not read","id":"SRC-000893"},{"rule":"source.date","message":"SRC-000894 has no publication / evidence date","id":"SRC-000894"},{"rule":"source.search_index","message":"SRC-000894: official URL/title confirmed via web search only; page not read","id":"SRC-000894"},{"rule":"source.date","message":"SRC-000895 has no publication / evidence date","id":"SRC-000895"},{"rule":"source.search_index","message":"SRC-000895: official URL/title confirmed via web search only; page not read","id":"SRC-000895"},{"rule":"source.date","message":"SRC-000896 has no publication / evidence date","id":"SRC-000896"},{"rule":"source.search_index","message":"SRC-000896: official URL/title confirmed via web search only; page not read","id":"SRC-000896"},{"rule":"source.date","message":"SRC-000897 has no publication / evidence date","id":"SRC-000897"},{"rule":"source.search_index","message":"SRC-000897: official URL/title confirmed via web search only; page not read","id":"SRC-000897"},{"rule":"source.date","message":"SRC-000898 has no publication / evidence date","id":"SRC-000898"},{"rule":"source.search_index","message":"SRC-000898: official URL/title confirmed via web search only; page not read","id":"SRC-000898"},{"rule":"source.date","message":"SRC-000899 has no publication / evidence date","id":"SRC-000899"},{"rule":"source.search_index","message":"SRC-000899: official URL/title confirmed via web search only; page not read","id":"SRC-000899"},{"rule":"source.date","message":"SRC-000900 has no publication / evidence date","id":"SRC-000900"},{"rule":"source.search_index","message":"SRC-000900: official URL/title confirmed via web search only; page not read","id":"SRC-000900"},{"rule":"source.date","message":"SRC-000901 has no publication / evidence date","id":"SRC-000901"},{"rule":"source.search_index","message":"SRC-000901: official URL/title confirmed via web search only; page not read","id":"SRC-000901"},{"rule":"source.date","message":"SRC-000902 has no publication / evidence date","id":"SRC-000902"},{"rule":"source.search_index","message":"SRC-000902: official URL/title confirmed via web search only; page not read","id":"SRC-000902"},{"rule":"source.date","message":"SRC-000903 has no publication / evidence date","id":"SRC-000903"},{"rule":"source.search_index","message":"SRC-000903: official URL/title confirmed via web search only; page not read","id":"SRC-000903"},{"rule":"source.date","message":"SRC-000904 has no publication / evidence date","id":"SRC-000904"},{"rule":"source.search_index","message":"SRC-000904: official URL/title confirmed via web search only; page not read","id":"SRC-000904"},{"rule":"source.date","message":"SRC-000905 has no publication / evidence date","id":"SRC-000905"},{"rule":"source.search_index","message":"SRC-000905: official URL/title confirmed via web search only; page not read","id":"SRC-000905"},{"rule":"source.date","message":"SRC-000906 has no publication / evidence date","id":"SRC-000906"},{"rule":"source.search_index","message":"SRC-000906: official URL/title confirmed via web search only; page not read","id":"SRC-000906"},{"rule":"source.date","message":"SRC-000907 has no publication / evidence date","id":"SRC-000907"},{"rule":"source.search_index","message":"SRC-000907: official URL/title confirmed via web search only; page not read","id":"SRC-000907"},{"rule":"source.date","message":"SRC-000908 has no publication / evidence date","id":"SRC-000908"},{"rule":"source.search_index","message":"SRC-000908: official URL/title confirmed via web search only; page not read","id":"SRC-000908"},{"rule":"source.date","message":"SRC-000909 has no publication / evidence date","id":"SRC-000909"},{"rule":"source.search_index","message":"SRC-000909: official URL/title confirmed via web search only; page not read","id":"SRC-000909"}],"by_rule":{"normalize.wafer":2,"source.date":690,"source.access":8,"source.search_index":654},"rules":["Company name cannot be blank","Model cannot exist without a manufacturer","Product family must belong to the model's company","All referenced ids must exist (processes, technologies, materials, equipment, countries …)","Relationship endpoints must exist","Cited sources must exist","Source URLs must parse","Evidence dates must be ISO (YYYY, YYYY-MM or YYYY-MM-DD)","Company countries should map to the country reference","Stable id formats per entity","Facilities need sources and ISO-dated, sourced status milestones","Duplicate source URLs are flagged"]}},"intel":{"market":[{"metric":"Equipment billings","region_or_segment":"China","period":"2025","value_usd_b":49.3,"change":"-0.5%","source_id":"SRC-000001"},{"metric":"Equipment billings","region_or_segment":"Taiwan","period":"2025","value_usd_b":31.5,"change":"+90%","source_id":"SRC-000001"},{"metric":"Equipment billings","region_or_segment":"South Korea","period":"2025","value_usd_b":25.8,"change":"+26%","source_id":"SRC-000001"},{"metric":"Equipment billings","region_or_segment":"North America","period":"2025","value_usd_b":10.9,"change":"-20%","source_id":"SRC-000001"},{"metric":"Equipment billings","region_or_segment":"Japan","period":"2025","value_usd_b":9.5,"change":"+22%","source_id":"SRC-000001"},{"metric":"Equipment billings","region_or_segment":"Rest of World","period":"2025","value_usd_b":5.2,"change":"+25%","source_id":"SRC-000001"},{"metric":"Equipment billings","region_or_segment":"Europe","period":"2025","value_usd_b":2.9,"change":"-41%","source_id":"SRC-000001"},{"metric":"Equipment billings","region_or_segment":"World","period":"2025","value_usd_b":135.1,"change":"+15%","source_id":"SRC-000001"},{"metric":"Segment growth","region_or_segment":"Wafer processing","period":"2025","value_usd_b":"N/A","change":"+12%","source_id":"SRC-000001"},{"metric":"Segment growth","region_or_segment":"Other front-end","period":"2025","value_usd_b":"N/A","change":"+13%","source_id":"SRC-000001"},{"metric":"Segment growth","region_or_segment":"Test","period":"2025","value_usd_b":"N/A","change":"+55%","source_id":"SRC-000001"},{"metric":"Segment growth","region_or_segment":"Assembly & packaging","period":"2025","value_usd_b":"N/A","change":"+21%","source_id":"SRC-000001"}],"competitor_map":[{"group":"Wafer fab / front-end","n_companies":74,"global_leader":"ASML Holding; Applied Materials; Lam Research; Tokyo Electron (TEL); KLA Corporation; Advantest; NAURA Technology Group","tier_2":"ASM International (ASMI); SCREEN Holdings; Onto Innovation; Nova Ltd.; Camtek; SEMES; Wonik IPS; AMEC (Advanced Micro-Fabrication Equipment); Piotech; ACM Research; Hwatsing Technology","emerging":"Nearfield Instruments; Substrate; xLight; Raana Semiconductors","regional":"EO Technics","unclassified":"Canon Inc.; Veeco Instruments; Axcelis Technologies; Semilab; Nikon Corporation; Hitachi High-Tech; Kokusai Electric; Ebara Corporation; Carl Zeiss SMT; AIXTRON; Oxford Instruments Plasma Technology; Beneq; Thermo Fisher Scientific; Gigaphoton; Technoprobe; FormFactor; MPI Corporation; Cohu; Techwing; ViTrox; EV Group (EVG); Plasma-Therm; Hirata Corporation; RORZE Corporation; Brooks Automation; Jusung Engineering; Grand Process Technology (GPTC); Scientech; Gallant Precision Machining (GPM); Utechzone; VisEra Technologies; Marketech International; Kingsemi; SMEE (Shanghai Micro Electronics Equipment); AMIES; SiCarrier; Yuliangsheng; Aishengna; Suzhou Delphi Laser; 3D-Micromac; InnoLas Semiconductor; Edwards Vacuum; Pfeiffer Vacuum+Fab Solutions; Ultra Clean Holdings (UCT); Ichor Systems; Sumitomo Heavy Industries (Mechatronics); JSW Aktina System; LASSE (Laser Systems & Solutions of Europe); Hind High Vacuum (HHV); ASM Technologies-HHV JV; INOX India","chinese":"NAURA Technology Group; AMEC (Advanced Micro-Fabrication Equipment); Piotech; Hwatsing Technology; Kingsemi; SMEE (Shanghai Micro Electronics Equipment); AMIES; SiCarrier; Yuliangsheng; Aishengna; Suzhou Delphi Laser","japanese":"Tokyo Electron (TEL); SCREEN Holdings; Advantest; Canon Inc.; Nikon Corporation; Hitachi High-Tech; Kokusai Electric; Ebara Corporation; Gigaphoton; Hirata Corporation; RORZE Corporation; Sumitomo Heavy Industries (Mechatronics); JSW Aktina System","korean":"Techwing; SEMES; Wonik IPS; Jusung Engineering; EO Technics","taiwanese":"MPI Corporation; Grand Process Technology (GPTC); Scientech; Gallant Precision Machining (GPM); Utechzone; VisEra Technologies; Marketech International","european":"ASML Holding; ASM International (ASMI); Nova Ltd.; Camtek; Semilab; Carl Zeiss SMT; AIXTRON; Oxford Instruments Plasma Technology; Beneq; Technoprobe; EV Group (EVG); 3D-Micromac; InnoLas Semiconductor; Edwards Vacuum; Pfeiffer Vacuum+Fab Solutions; LASSE (Laser Systems & Solutions of Europe); Nearfield Instruments","us":"Applied Materials; Lam Research; KLA Corporation; Veeco Instruments; Axcelis Technologies; Onto Innovation; Thermo Fisher Scientific; FormFactor; Cohu; Plasma-Therm; Brooks Automation; ACM Research; Ultra Clean Holdings (UCT); Ichor Systems; Substrate; xLight","indian":"Raana Semiconductors; Hind High Vacuum (HHV); ASM Technologies-HHV JV; INOX India"},{"group":"Mask / reticle","n_companies":3,"global_leader":"-","tier_2":"-","emerging":"-","regional":"-","unclassified":"Lasertec; NuFlare Technology; Mycronic","chinese":"-","japanese":"Lasertec; NuFlare Technology","korean":"-","taiwanese":"-","european":"Mycronic","us":"-","indian":"-"},{"group":"Wafer dicing","n_companies":16,"global_leader":"KLA Corporation","tier_2":"DISCO Corporation; Hamamatsu Photonics; Han's Laser Technology","emerging":"-","regional":"EO Technics","unclassified":"Tokyo Seimitsu (ACCRETECH); ASMPT ALSI (Advanced Laser Separation International); Advanced Dicing Technologies (ADT); Plasma-Therm; Panasonic Connect; HGTECH (Huagong Tech); Suzhou Delphi Laser; Suzhou Maxwell Technologies; 3D-Micromac; Synova; SLTL (Sahajanand Laser Technology)","chinese":"Han's Laser Technology; HGTECH (Huagong Tech); Suzhou Delphi Laser; Suzhou Maxwell Technologies","japanese":"DISCO Corporation; Hamamatsu Photonics; Tokyo Seimitsu (ACCRETECH); Panasonic Connect","korean":"EO Technics","taiwanese":"-","european":"ASMPT ALSI (Advanced Laser Separation International); Advanced Dicing Technologies (ADT); 3D-Micromac; Synova","us":"KLA Corporation; Plasma-Therm","indian":"SLTL (Sahajanand Laser Technology)"},{"group":"Die attach & bonding","n_companies":17,"global_leader":"Applied Materials","tier_2":"BE Semiconductor Industries (BESI); ASMPT; Kulicke & Soffa; Hanmi Semiconductor; Piotech","emerging":"-","regional":"EO Technics","unclassified":"Mycronic; Hanwha Semitech; Yamaha Robotics Holdings; EV Group (EVG); SUSS MicroTec; PacTech; Protec; Laserssel; Kingsemi; Suzhou Delphi Laser","chinese":"Piotech; Kingsemi; Suzhou Delphi Laser","japanese":"Yamaha Robotics Holdings","korean":"Hanmi Semiconductor; Hanwha Semitech; Protec; Laserssel; EO Technics","taiwanese":"-","european":"Mycronic; BE Semiconductor Industries (BESI); EV Group (EVG); SUSS MicroTec; PacTech","us":"Applied Materials; Kulicke & Soffa","indian":"-"},{"group":"Molding / dispensing / laser marking & processing","n_companies":17,"global_leader":"-","tier_2":"Hwatsing Technology","emerging":"-","regional":"EO Technics","unclassified":"Gigaphoton; ASMPT ALSI (Advanced Laser Separation International); TOWA Corporation; Yamaha Robotics Holdings; Philoptics; All Ring Tech; JSG; Suzhou Delphi Laser; Wuhan DR Laser Technology; Synova; LPKF Laser & Electronics; InnoLas Semiconductor; MKS Instruments; Keyence; Titan Engineering & Automation Ltd (TEAL)","chinese":"Hwatsing Technology; JSG; Suzhou Delphi Laser; Wuhan DR Laser Technology","japanese":"Gigaphoton; TOWA Corporation; Yamaha Robotics Holdings; Keyence","korean":"EO Technics; Philoptics","taiwanese":"All Ring Tech","european":"ASMPT ALSI (Advanced Laser Separation International); Synova; LPKF Laser & Electronics; InnoLas Semiconductor","us":"MKS Instruments","indian":"Titan Engineering & Automation Ltd (TEAL)"},{"group":"Package inspection & test","n_companies":7,"global_leader":"Advantest","tier_2":"Teradyne","emerging":"-","regional":"Aehr Test Systems","unclassified":"Chroma ATE; Techwing; TSE Co.; ViTrox","chinese":"-","japanese":"Advantest","korean":"Techwing; TSE Co.","taiwanese":"Chroma ATE","european":"-","us":"Teradyne; Aehr Test Systems","indian":"-"},{"group":"Advanced packaging","n_companies":4,"global_leader":"-","tier_2":"-","emerging":"-","regional":"-","unclassified":"Philoptics; Suzhou Delphi Laser; Wuhan DR Laser Technology; LPKF Laser & Electronics","chinese":"Suzhou Delphi Laser; Wuhan DR Laser Technology","japanese":"-","korean":"Philoptics","taiwanese":"-","european":"LPKF Laser & Electronics","us":"-","indian":"-"},{"group":"Power semiconductor processing","n_companies":7,"global_leader":"-","tier_2":"DISCO Corporation; Han's Laser Technology","emerging":"-","regional":"-","unclassified":"3D-Micromac; Synova; Sumitomo Heavy Industries (Mechatronics); JSW Aktina System; LASSE (Laser Systems & Solutions of Europe)","chinese":"Han's Laser Technology","japanese":"DISCO Corporation; Sumitomo Heavy Industries (Mechatronics); JSW Aktina System","korean":"-","taiwanese":"-","european":"3D-Micromac; Synova; LASSE (Laser Systems & Solutions of Europe)","us":"-","indian":"-"},{"group":"Compound semiconductor","n_companies":1,"global_leader":"-","tier_2":"-","emerging":"-","regional":"-","unclassified":"AIXTRON","chinese":"-","japanese":"-","korean":"-","taiwanese":"-","european":"AIXTRON","us":"-","indian":"-"},{"group":"Display / MicroLED lasers","n_companies":5,"global_leader":"Coherent Corp.","tier_2":"-","emerging":"-","regional":"EO Technics","unclassified":"AP Systems; JSW Aktina System; The Japan Steel Works (JSW)","chinese":"-","japanese":"JSW Aktina System; The Japan Steel Works (JSW)","korean":"EO Technics; AP Systems","taiwanese":"-","european":"-","us":"Coherent Corp.","indian":"-"},{"group":"Factory automation / handling","n_companies":13,"global_leader":"-","tier_2":"-","emerging":"-","regional":"-","unclassified":"Lintec; Nitto Denko; Tazmo; Hirata Corporation; RORZE Corporation; Brooks Automation; Daifuku; Murata Machinery (Muratec); Gudeng Precision; Mirle Automation; InnoLas Semiconductor; Titan Engineering & Automation Ltd (TEAL); ASM Technologies-HHV JV","chinese":"-","japanese":"Lintec; Nitto Denko; Tazmo; Hirata Corporation; RORZE Corporation; Daifuku; Murata Machinery (Muratec)","korean":"-","taiwanese":"Gudeng Precision; Mirle Automation","european":"InnoLas Semiconductor","us":"Brooks Automation","indian":"Titan Engineering & Automation Ltd (TEAL); ASM Technologies-HHV JV"},{"group":"Laser & motion components (L2/L3)","n_companies":32,"global_leader":"Coherent Corp.","tier_2":"IPG Photonics","emerging":"-","regional":"-","unclassified":"Wuhan Raycus Fiber Laser Technologies; Shenzhen JPT Opto-electronics; Wuhan Huaray Precision Laser; Sino-Galvo; Hangzhou Hikrobot; TEYU S&A Chiller; TRUMPF; MKS Instruments; Light Conversion; Amplitude Laser; Novanta (Cambridge Technology / Synrad); SCANLAB; RAYLASE; Sill Optics; Wavelength Opto-Electronic; Holo/Or; Gooch & Housego; Aerotech; Physik Instrumente (PI); ACS Motion Control; ETEL (HEIDENHAIN group); Renishaw; Cognex; Basler; Keyence; ULT AG; Edwards Vacuum; Pfeiffer Vacuum+Fab Solutions; NKT Photonics","chinese":"Wuhan Raycus Fiber Laser Technologies; Shenzhen JPT Opto-electronics; Wuhan Huaray Precision Laser; Sino-Galvo; Hangzhou Hikrobot; TEYU S&A Chiller","japanese":"Keyence","korean":"-","taiwanese":"-","european":"TRUMPF; Light Conversion; Amplitude Laser; SCANLAB; RAYLASE; Sill Optics; Holo/Or; Gooch & Housego; Physik Instrumente (PI); ACS Motion Control; ETEL (HEIDENHAIN group); Renishaw; Basler; ULT AG; Edwards Vacuum; Pfeiffer Vacuum+Fab Solutions; NKT Photonics","us":"Coherent Corp.; IPG Photonics; MKS Instruments; Novanta (Cambridge Technology / Synrad); Aerotech; Cognex","indian":"-"}],"teal_view":[{"code":"T01","portfolio_area":"Laser Marking","global_oems":"EO Technics; InnoLas Semiconductor; Titan Engineering & Automation Ltd (TEAL)","n_products":7,"technology":"ns fiber/MOPA/UV/CO2 + galvo marking of wafers (InnoLas IL, 300/450 mm), strips/trays and WLCSP backside (EO Technics)","example_products":"InnoLas Semiconductor IL 4000 / IL C4000; InnoLas Semiconductor IL 600 / IL 1000 / IL 2000 / IL 3000; InnoLas Semiconductor IL C3000 / IL C3000 HT; Titan Engineering & Automation Ltd (TEAL) Platform V0.1-V1.0","supplier_candidates":"Aerotech; Amplitude Laser; Basler; Cognex; Coherent Corp.; ETEL (HEIDENHAIN group); Hamamatsu Photonics; Hangzhou Hikrobot; IPG Photonics; Keyence; Light Conversion; MKS Instruments; NKT Photonics; Novanta (Cambridge Technology / Synrad); Physik Instrumente (PI); RAYLASE; SCANLAB; Shenzhen JPT Opto-electronics; Sill Optics; Sino-Galvo; TRUMPF; Wavelength Opto-Electronic; Wuhan Huaray Precision Las","potential_partner":"EO Technics; InnoLas Semiconductor; Novanta (Cambridge Technology / Synrad); SCANLAB; IPG Photonics","potential_localization":"LO05 - HIGH","india_opportunity":"Five ATMP plants in commercial production in India (S0030); Tata Jagiroad (USD 3B+), Micron Sanand, Kaynes and CG Semi Sanand","required_teal_capability":"Wafer/strip handling with FOUP & SECS/GEM, cleanroom-grade enclosure, 2D-code/OCR verification, recipe control","assessment_type":"ANALYST_ASSESSMENT on documented evidence","source_ids":["SRC-000030","SRC-000305","SRC-000229","SRC-000065"]},{"code":"T02","portfolio_area":"Laser Welding","global_oems":"LPKF Laser & Electronics","n_products":1,"technology":"Fiber laser welding; in semiconductor context glass welding (LPKF NEXAR BOND) and package sealing","example_products":"LPKF Laser & Electronics NEXAR BOND","supplier_candidates":"Aerotech; Amplitude Laser; Basler; Cognex; Coherent Corp.; ETEL (HEIDENHAIN group); Hamamatsu Photonics; Hangzhou Hikrobot; IPG Photonics; Keyence; Light Conversion; MKS Instruments; NKT Photonics; Novanta (Cambridge Technology / Synrad); Physik Instrumente (PI); RAYLASE; SCANLAB; Shenzhen JPT Opto-electronics; Sill Optics; Sino-Galvo; TRUMPF; Wavelength Opto-Electronic; Wuhan Huaray Precision Las","potential_partner":"LPKF Laser & Electronics; TRUMPF","potential_localization":"LO18 - MEDIUM","india_opportunity":"Power discrete packaging (CDIL-Shinjin TO-247)","required_teal_capability":"Hermetic/package sealing process qualification; seam tracking","assessment_type":"ANALYST_ASSESSMENT on documented evidence","source_ids":["SRC-000082","SRC-000210"]},{"code":"T03","portfolio_area":"Laser Dicing","global_oems":"3D-Micromac; ASMPT ALSI (Advanced Laser Separation International); Advanced Dicing Technologies (ADT); DISCO Corporation; EO Technics; HGTECH (Huagong Tech); Han's Laser Technology; KLA Corporation; Panasonic Connect; Plasma-Therm; SLTL (Sahajanand Laser Technology); Suzhou Delphi Laser; Suzhou Maxwell Technologies; Synova; Tokyo Seimitsu (ACCRETECH)","n_products":30,"technology":"Stealth (SD engine), UV/ps multi-beam grooving (V-DOE), TLS, Laser MicroJet; plasma and blade alternatives","example_products":"3D-Micromac microDICE; ASMPT ALSI (Advanced Laser Separation International) LASER1205 - Dicing IR; ASMPT ALSI (Advanced Laser Separation International) LASER1205 - Dicing UVP; ASMPT ALSI (Advanced Laser Separation International) LASER1205 - Grooving UV; ASMPT ALSI (Advanced Laser Separation International) LASER1205 - Grooving UV USP; ASMPT ALSI (Advanced Laser Separation International) LASER1206; Advanced Dicing Technologies (ADT) 8030 / 7304 / 80Ai; DISCO Corporation DFL7341","supplier_candidates":"Aerotech; Amplitude Laser; Basler; Cognex; Coherent Corp.; ETEL (HEIDENHAIN group); Hamamatsu Photonics; Hangzhou Hikrobot; IPG Photonics; Keyence; Light Conversion; MKS Instruments; NKT Photonics; Novanta (Cambridge Technology / Synrad); Physik Instrumente (PI); RAYLASE; SCANLAB; Shenzhen JPT Opto-electronics; Sill Optics; Sino-Galvo; TRUMPF; Wavelength Opto-Electronic; Wuhan Huaray Precision Las","potential_partner":"Hamamatsu Photonics; ASMPT ALSI (Advanced Laser Separation International); 3D-Micromac; Synova; EO Technics; SLTL (Sahajanand Laser Technology)","potential_localization":"LO04 - MEDIUM","india_opportunity":"Indian OSAT ramp; SiC/power packaging demand","required_teal_capability":"Internal-modification process (transmissive wavelength), wafer-level handling, low-k grooving recipes; engine supply or licence route","assessment_type":"ANALYST_ASSESSMENT on documented evidence","source_ids":["SRC-000053","SRC-000054","SRC-000060","SRC-000070","SRC-000076","SRC-000208"]},{"code":"T04","portfolio_area":"Laser Cutting","global_oems":"TOWA Corporation","n_products":1,"technology":"SiC wafer downsizing/edge profiling (Synova LCS), glass cutting","example_products":"TOWA Corporation FMS 4040","supplier_candidates":"Aerotech; Amplitude Laser; Basler; Cognex; Coherent Corp.; ETEL (HEIDENHAIN group); Hamamatsu Photonics; Hangzhou Hikrobot; IPG Photonics; Keyence; Light Conversion; MKS Instruments; NKT Photonics; Novanta (Cambridge Technology / Synrad); Physik Instrumente (PI); RAYLASE; SCANLAB; Shenzhen JPT Opto-electronics; Sill Optics; Sino-Galvo; TRUMPF; Wavelength Opto-Electronic; Wuhan Huaray Precision Las","potential_partner":"Synova","potential_localization":"LO18 - MEDIUM","india_opportunity":"SiC/power supply chain (early)","required_teal_capability":"USP source integration, 5-axis motion","assessment_type":"ANALYST_ASSESSMENT on documented evidence","source_ids":["SRC-000079","SRC-000080"]},{"code":"T05","portfolio_area":"Laser Drilling","global_oems":"Gigaphoton; MKS Instruments","n_products":3,"technology":"TGV (LIDE; direct USP drilling), ABF via drilling (CO2/UV), excimer micro-via","example_products":"MKS Instruments ESI Geode A; MKS Instruments ESI Geode X UV","supplier_candidates":"Aerotech; Amplitude Laser; Basler; Cognex; Coherent Corp.; ETEL (HEIDENHAIN group); Hamamatsu Photonics; Hangzhou Hikrobot; IPG Photonics; Keyence; Light Conversion; MKS Instruments; NKT Photonics; Novanta (Cambridge Technology / Synrad); Physik Instrumente (PI); RAYLASE; SCANLAB; Shenzhen JPT Opto-electronics; Sill Optics; Sino-Galvo; TRUMPF; Wavelength Opto-Electronic; Wuhan Huaray Precision Las","potential_partner":"LPKF Laser & Electronics; Philoptics; MKS Instruments","potential_localization":"LO14 - LOW","india_opportunity":"Glass-core substrates expected to inflect 2027 (S0084); no Indian substrate fab documented","required_teal_capability":"USP/UV drilling with via AOI; LIDE-class etch partner","assessment_type":"ANALYST_ASSESSMENT on documented evidence","source_ids":["SRC-000082","SRC-000084","SRC-000117","SRC-000230"]},{"code":"T06","portfolio_area":"Laser Annealing","global_oems":"3D-Micromac; EO Technics; JSW Aktina System; LASSE (Laser Systems & Solutions of Europe); Sumitomo Heavy Industries (Mechatronics); Suzhou Delphi Laser; Veeco Instruments","n_products":11,"technology":"Laser spike/ns anneal (logic), green/UV anneal (IGBT, SiC ohmic)","example_products":"3D-Micromac microPRO XS OCF; 3D-Micromac microVEGA xMR; JSW Aktina System YIELDSCAN; LASSE (Laser Systems & Solutions of Europe) LT-3100; LASSE (Laser Systems & Solutions of Europe) QA-3000; Sumitomo Heavy Industries (Mechatronics) SWA Green/Hybrid series; Sumitomo Heavy Industries (Mechatronics) SWA UV series; Veeco Instruments LSA101","supplier_candidates":"N/A","potential_partner":"3D-Micromac; EO Technics; Sumitomo Heavy Industries (Mechatronics)","potential_localization":"LO13 - LOW","india_opportunity":"Not documented for Indian fabs in Batch 1","required_teal_capability":"Line-beam optics, homogenisers, thermal modelling","assessment_type":"ANALYST_ASSESSMENT on documented evidence","source_ids":["SRC-000087","SRC-000223","SRC-000091"]},{"code":"T07","portfolio_area":"Laser Ablation","global_oems":"None captured","n_products":0,"technology":"Low-k grooving, laser debonding (UV ns flat-top, IR, excimer), LLO","example_products":"N/A","supplier_candidates":"Aerotech; Amplitude Laser; Basler; Cognex; Coherent Corp.; ETEL (HEIDENHAIN group); Hamamatsu Photonics; Hangzhou Hikrobot; IPG Photonics; Keyence; Light Conversion; MKS Instruments; NKT Photonics; Novanta (Cambridge Technology / Synrad); Physik Instrumente (PI); RAYLASE; SCANLAB; Shenzhen JPT Opto-electronics; Sill Optics; Sino-Galvo; TRUMPF; Wavelength Opto-Electronic; Wuhan Huaray Precision Las","potential_partner":"SCANLAB; Holo/Or; EV Group (EVG)","potential_localization":"LO04 - MEDIUM","india_opportunity":"OSAT WLP/fan-out lines (not yet documented in India)","required_teal_capability":"UV/USP flat-top beam shaping (DOE), debond chuck handling","assessment_type":"ANALYST_ASSESSMENT on documented evidence","source_ids":["SRC-000068","SRC-000232","SRC-000233","SRC-000253","SRC-000293"]},{"code":"T08","portfolio_area":"Semiconductor Inspection","global_oems":"Lasertec; Nearfield Instruments; Onto Innovation; Philoptics","n_products":5,"technology":"Optical/e-beam wafer inspection, TGV inspection kits, AI vision inspection handlers","example_products":"Lasertec ACTIS A150 / A300 / A200HiT; Nearfield Instruments AUDIRA; Onto Innovation Dragonfly; Onto Innovation Iris","supplier_candidates":"N/A","potential_partner":"ViTrox; Cognex; Basler; Aerotech","potential_localization":"LO03 - LOW","india_opportunity":"KLA Chennai R&D ecosystem; OSAT AOI","required_teal_capability":"AI defect classification, precision stages, optics design","assessment_type":"ANALYST_ASSESSMENT on documented evidence","source_ids":["SRC-000202","SRC-000118","SRC-000331"]},{"code":"T09","portfolio_area":"Wafer Handling","global_oems":"InnoLas Semiconductor; RORZE Corporation","n_products":2,"technology":"EFEMs and sorters (RORZE, InnoLas), clean robots (Brooks, Hirata)","example_products":"InnoLas Semiconductor IL 2600 / IL C3200 / IL C3600 / IL C3800 / IL C4600","supplier_candidates":"N/A","potential_partner":"Hirata Corporation; RORZE Corporation; Brooks Automation","potential_localization":"LO09 - HIGH","india_opportunity":"Hirata entered India via ATS India (2026-09)","required_teal_capability":"Cleanroom robotics, SEMI E84/E87 load-port compliance","assessment_type":"ANALYST_ASSESSMENT on documented evidence","source_ids":["SRC-000214","SRC-000294","SRC-000296","SRC-000229"]},{"code":"T10","portfolio_area":"Packaging Equipment","global_oems":"TOWA Corporation","n_products":1,"technology":"Compression molding (TOWA), precision dispensing (All Ring), panel/tape handling (Lintec, Nitto)","example_products":"TOWA Corporation PMC 2030-D / CPM 1080","supplier_candidates":"N/A","potential_partner":"TOWA Corporation; All Ring Tech","potential_localization":"LO07 - MEDIUM","india_opportunity":"Indian OSAT ramp","required_teal_capability":"Molding/dispense process know-how","assessment_type":"ANALYST_ASSESSMENT on documented evidence","source_ids":["SRC-000237","SRC-000177"]},{"code":"T11","portfolio_area":"ATMP Equipment","global_oems":"Applied Materials; EO Technics; EV Group (EVG); Hanmi Semiconductor; Hanwha Semitech; Mycronic; PacTech; Piotech; Protec; SUSS MicroTec; Suzhou Delphi Laser; Yamaha Robotics Holdings","n_products":16,"technology":"TCB (Hanmi, Hanwha), hybrid bonding (BESI/AMAT Kinex, Piotech), wire/flip-chip (Yamaha, K&S), laser-assisted bonding (Protec)","example_products":"Applied Materials Kinex (with BESI); EV Group (EVG) EVG805 / EVG850 TB / EVG850 DB; EV Group (EVG) EVG880 LayerRelease; Hanmi Semiconductor TC Bonder 4.5 Griffin; Mycronic MRSI-705; Mycronic MRSI-H family; SUSS MicroTec ELD300; Yamaha Robotics Holdings FPB-1ws NeoForce","supplier_candidates":"N/A","potential_partner":"Protec; Mycronic","potential_localization":"LO06 - LOW","india_opportunity":"Indian OSAT ramp (wire-bond/flip-chip/WLP at Tata per S0305)","required_teal_capability":"um-class bond-head precision, force/thermal control","assessment_type":"ANALYST_ASSESSMENT on documented evidence","source_ids":["SRC-000305","SRC-000041","SRC-000046","SRC-000228"]},{"code":"T12","portfolio_area":"Automation","global_oems":"None captured","n_products":0,"technology":"AMHS OHT/OHS (Daifuku, Muratec), CoPoS panel automation (Gudeng, Mirle)","example_products":"N/A","supplier_candidates":"N/A","potential_partner":"Daifuku; Murata Machinery (Muratec)","potential_localization":"LO09 - HIGH","india_opportunity":"Daifuku exhibited at SEMICON India 2025; Muratec India entity (Tier 3)","required_teal_capability":"SECS/GEM/MES integration, AMHS interfacing","assessment_type":"ANALYST_ASSESSMENT on documented evidence","source_ids":["SRC-000299","SRC-000301","SRC-000179"]},{"code":"T13","portfolio_area":"Motion Systems","global_oems":"None captured","n_products":0,"technology":"Air-bearing & linear-motor stages (PI, Aerotech, ETEL), interferometric encoders (Renishaw RLE), controllers (ACS)","example_products":"N/A","supplier_candidates":"N/A","potential_partner":"Aerotech; Physik Instrumente (PI); ACS Motion Control; ETEL (HEIDENHAIN group); Renishaw","potential_localization":"LO16 - MEDIUM","india_opportunity":"Component demand from any Indian tool build","required_teal_capability":"nm-class stage design and metrology","assessment_type":"ANALYST_ASSESSMENT on documented evidence","source_ids":["SRC-000271","SRC-000273","SRC-000275","SRC-000276","SRC-000277"]},{"code":"T14","portfolio_area":"Vision Systems","global_oems":"None captured","n_products":0,"technology":"Wafer ID readers (Cognex In-Sight 1740), industrial cameras (Basler, Hikrobot), AI inspection (ViTrox)","example_products":"N/A","supplier_candidates":"N/A","potential_partner":"Cognex; Basler; ViTrox","potential_localization":"LO17 - LOW","india_opportunity":"Wafer traceability in Indian fabs/OSATs","required_teal_capability":"Wafer OCR/2D-code reading, AI classification","assessment_type":"ANALYST_ASSESSMENT on documented evidence","source_ids":["SRC-000278","SRC-000280","SRC-000331"]},{"code":"T15","portfolio_area":"Semiconductor Test Equipment","global_oems":"Aehr Test Systems; Techwing","n_products":3,"technology":"ATE (Advantest, Teradyne, Chroma), HBM probers/handlers (Techwing, TSE), burn-in (Aehr), probe cards","example_products":"Aehr Test Systems FOX-XP / FOX-NP / FOX-CP; Aehr Test Systems Sonoma; Techwing Cube Prober","supplier_candidates":"N/A","potential_partner":"Techwing; Aehr Test Systems","potential_localization":"LO08 - MEDIUM","india_opportunity":"Teradyne Bengaluru office; Tessolve services","required_teal_capability":"Thermal handlers, test-cell automation","assessment_type":"ANALYST_ASSESSMENT on documented evidence","source_ids":["SRC-000214","SRC-000216","SRC-000302","SRC-000241"]}],"gap_analysis":[{"gap_id":"G01","category":"A01 Lithography","global_technology":"EUV/High-NA (EXE:5200B), ArF immersion (NSR-S636E), NIL (FPA-1200NZ2C); China: SSA600 90 nm-class","current_teal_capability":"None","available_in_india":"None (ASML-Tata MoU covers deployment/support only)","imported_technology":"All systems, light sources, optics","localization_possibility":"LO01 - LOW","critical_ip":"EUV optics and light sources","critical_component":"Projection optics (ZEISS SMT); excimer/EUV sources (Gigaphoton; xLight FEL in development)","potential_partner":"Not a TEAL portfolio area","potential_jv":"N/A","potential_technology_licensor":"N/A","source_ids":["SRC-000133","SRC-000317","SRC-000192","SRC-000187","SRC-000024","SRC-000327"]},{"gap_id":"G02","category":"A08/A09 Etch & deposition","global_technology":"CCP/ICP etch, PECVD, ALD, ALG, MOCVD (AMAT, Lam, TEL, NAURA, AMEC, Piotech, Wonik IPS, Jusung)","current_teal_capability":"None","available_in_india":"Vacuum (HHV), UHP welding (INOX), Lam silicon-component plant (planned)","imported_technology":"Chambers, plasma sources, RF, gas panels","localization_possibility":"LO02 - MEDIUM","critical_ip":"Plasma source / chamber design","critical_component":"RF generators (Advanced Energy, Comet PCT); gas delivery (UCT, Ichor); pumps (Edwards, Pfeiffer, Ebara)","potential_partner":"Not a TEAL portfolio area","potential_jv":"ASM Technologies-HHV 50:50 JV (sub-systems) is the documented Indian precedent","potential_technology_licensor":"N/A","source_ids":["SRC-000009","SRC-000314","SRC-000174","SRC-000175","SRC-000032","SRC-000038","SRC-000212","SRC-000037"]},{"gap_id":"G03","category":"A21-A31 Inspection & metrology","global_technology":"Optical/e-beam inspection, CD-SEM, film metrology, actinic EUV mask inspection, AFM metrology (KLA, Onto, Nova, Camtek, Hitachi High-Tech, Lasertec, Nearfield)","current_teal_capability":"Withheld in public edition (TEAL internal)","available_in_india":"KLA Chennai R&D hub (captive)","imported_technology":"All tools","localization_possibility":"LO03 - LOW","critical_ip":"Optical/e-beam architectures and algorithms","critical_component":"Precision stages (Aerotech, PI), cameras (Basler), encoders (Renishaw)","potential_partner":"Aerotech; PI; Basler; Cognex (component partners)","potential_jv":"N/A","potential_technology_licensor":"N/A","source_ids":["SRC-000140","SRC-000154","SRC-000156","SRC-000157","SRC-000319","SRC-000322","SRC-000202","SRC-000203","SRC-INT1"]},{"gap_id":"G04","category":"A14 Laser annealing","global_technology":"Laser spike & ns anneal (Veeco LSA201/NSA500); green/hybrid & UV (SHI SWA); UV LT-3100 (LASSE); YIELDSCAN (JSW Aktina); microPRO XS / microVEGA (3D-Micromac); EO Technics; Delphi","current_teal_capability":"Withheld in public edition (TEAL internal)","available_in_india":"None documented","imported_technology":"All systems","localization_possibility":"LO13 - LOW","critical_ip":"Veeco patented ambient-control micro-chamber (S0087)","critical_component":"Green/UV/IR sources; beam homogenisers","potential_partner":"3D-Micromac; EO Technics; SHI (documented annealing portfolios)","potential_jv":"N/A","potential_technology_licensor":"N/A","source_ids":["SRC-000087","SRC-000088","SRC-000223","SRC-000091","SRC-000224","SRC-000071","SRC-000066","SRC-000217","SRC-INT1"]},{"gap_id":"G05","category":"B Mask / reticle","global_technology":"Actinic EUV mask inspection (Lasertec ACTIS), multi-beam writers (NuFlare MBM-2000PLUS), laser mask writers (Mycronic)","current_teal_capability":"None","available_in_india":"None","imported_technology":"All","localization_possibility":"Not assessed (no Indian mask shop documented)","critical_ip":"Multi-beam e-beam; actinic inspection","critical_component":"E-beam columns; EUV sources","potential_partner":"Not a TEAL portfolio area","potential_jv":"N/A","potential_technology_licensor":"N/A","source_ids":["SRC-000322","SRC-000323","SRC-000325"]},{"gap_id":"G06","category":"C01 Wafer dicing","global_technology":"Stealth dicing (DISCO + Hamamatsu SD engine; Accretech ML; HGTECH; Han's Di-Sync SiC), UV/ps grooving (ALSI LASER1205 V-DOE, EO Technics LMC3200G, Accretech AL3000), TLS (3D-Micromac), Laser MicroJet (Synova), plasma (Plasma-Therm, Panasonic, KLA SPTS), blade (DISCO, Accretech, ADT)","current_teal_capability":"Withheld in public edition (TEAL internal)","available_in_india":"SLTL Wafer Dicing System (Gandhinagar)","imported_technology":"Sources, SD engines, galvos, stages, handling","localization_possibility":"LO04 - MEDIUM","critical_ip":"SD patent US6992026B2 expired 2021 but DISCO holds comprehensive SD licence; ALSI V-DOE patented; TLS IP bought from Jenoptik (2014)","critical_component":"SD engine (Hamamatsu); ps/UV sources; galvo; air-bearing stages","potential_partner":"Hamamatsu (engine supply precedent); ASMPT ALSI; 3D-Micromac; Synova; EO Technics; SLTL","potential_jv":"None documented for dicing","potential_technology_licensor":"Hamamatsu (licensed SD to DISCO - precedent); 3D-Micromac (acquired TLS IP - precedent)","source_ids":["SRC-000053","SRC-000054","SRC-000194","SRC-000060","SRC-000072","SRC-000208","SRC-000107","SRC-000109","SRC-000231","SRC-000234","SRC-000236","SRC-INT1"]},{"gap_id":"G07","category":"C10-C19 Die attach & bonding","global_technology":"TCB for HBM (Hanmi Griffin, Hanwha), hybrid bonding (BESI/AMAT Kinex, Piotech, EVG), wire/flip-chip (K&S, Yamaha SHINKAWA), 1.5-5 um die bonders (MRSI), laser-assisted bonding (Protec, PacTech, Laserssel)","current_teal_capability":"Withheld in public edition (TEAL internal)","available_in_india":"None documented","imported_technology":"All bonders","localization_possibility":"LO06 - LOW","critical_ip":"Direct/hybrid bonding patent US6902987B1 (Ziptronix/Adeia) expired","critical_component":"Bond heads, force/thermal control, placement vision","potential_partner":"Protec; PacTech; Mycronic MRSI (laser/precision bonding adjacency)","potential_jv":"N/A","potential_technology_licensor":"Adeia (holder of hybrid-bonding patent family - PT002)","source_ids":["SRC-000041","SRC-000043","SRC-000046","SRC-000314","SRC-000232","SRC-000240","SRC-000340","SRC-000341","SRC-000228","SRC-000244","SRC-000195","SRC-INT1"]},{"gap_id":"G08","category":"C20-C25 Molding, dispensing, mounting","global_technology":"Compression molding (TOWA PMC 2030-D / CPM 1080), precision dispensing (All Ring), tape/panel handling (Lintec, Nitto)","current_teal_capability":"None","available_in_india":"Equipment design engineering (ASM Technologies) - adjacent","imported_technology":"All","localization_possibility":"LO07 - MEDIUM","critical_ip":"N/A","critical_component":"Mold presses, dispense valves","potential_partner":"TOWA; All Ring (documented products)","potential_jv":"N/A","potential_technology_licensor":"N/A","source_ids":["SRC-000237","SRC-000177","SRC-000179","SRC-000213"]},{"gap_id":"G09","category":"C26-C27 Laser marking","global_technology":"Wafer marking (InnoLas IL 600-C4000, 300/450 mm ISO 3), strip/tray/wafer and WLCSP backside markers (EO Technics), USP cold marking sources (TRUMPF TruMicro Mark)","current_teal_capability":"Withheld in public edition (TEAL internal)","available_in_india":"TEAL (development); SLTL (laser machines)","imported_technology":"Sources, galvos, f-theta optics, cameras","localization_possibility":"LO05 - HIGH","critical_ip":"None documented","critical_component":"ns fiber / UV / CO2 sources; galvos; wafer ID vision","potential_partner":"EO Technics; InnoLas; Novanta; SCANLAB; IPG; JPT","potential_jv":"N/A","potential_technology_licensor":"N/A","source_ids":["SRC-000229","SRC-000065","SRC-000066","SRC-000343","SRC-000208","SRC-INT1"]},{"gap_id":"G10","category":"C28 / D14 Laser drilling & TGV","global_technology":"LIDE glass (LPKF Vitrion S 5000, NEXAR; 5 um vias, 1:50), direct TGV (Philoptics 2 mm glass, Delphi AWD20, DR Laser), ABF via drilling (MKS ESI Geode A CO2 / Geode X UV), excimer micro-via (Gigaphoton)","current_teal_capability":"None","available_in_india":"None documented","imported_technology":"All","localization_possibility":"LO14 - LOW","critical_ip":"LIDE process (LPKF)","critical_component":"USP/UV/CO2 sources; via inspection","potential_partner":"LPKF (open partner network); Philoptics; MKS","potential_jv":"N/A","potential_technology_licensor":"LPKF (partner-network precedent)","source_ids":["SRC-000082","SRC-000083","SRC-000085","SRC-000117","SRC-000217","SRC-000230","SRC-000326"]},{"gap_id":"G11","category":"C29-C32 Laser cutting, ablation, welding, singulation","global_technology":"SiC cutting/edge profiling (Synova LCS 303/305), glass laser welding (LPKF NEXAR BOND), debonding (EVG880 IR, EO Technics UV ns, SUSS ELD300 excimer), package singulation (TOWA FMS 4040)","current_teal_capability":"Withheld in public edition (TEAL internal)","available_in_india":"TEAL (development); SLTL","imported_technology":"Sources, optics, motion","localization_possibility":"LO18 - MEDIUM (sources) / LO05 - HIGH (integration)","critical_ip":"N/A","critical_component":"Fiber/USP sources; 5-axis motion","potential_partner":"Synova; EVG; EO Technics","potential_jv":"N/A","potential_technology_licensor":"N/A","source_ids":["SRC-000079","SRC-000080","SRC-000082","SRC-000232","SRC-000068","SRC-000233","SRC-000237","SRC-INT1"]},{"gap_id":"G12","category":"C34-C42 Package inspection & test","global_technology":"ATE (Advantest, Teradyne, Chroma), HBM test handlers/probers (Techwing Cube Prober, TSE), burn-in (Aehr FOX), probe cards (FormFactor, Technoprobe, MPI, Cohu), vision handlers (ViTrox)","current_teal_capability":"None","available_in_india":"Test engineering services (Tessolve); Teradyne Bengaluru office","imported_technology":"All hardware","localization_possibility":"LO08 - MEDIUM","critical_ip":"Probe-card technology","critical_component":"Thermal handlers; probe cards","potential_partner":"ViTrox; Techwing (documented handler/vision portfolios)","potential_jv":"N/A","potential_technology_licensor":"N/A","source_ids":["SRC-000302","SRC-000303","SRC-000241","SRC-000310","SRC-000329","SRC-000311","SRC-000312","SRC-000331","SRC-000216","SRC-000214"]},{"gap_id":"G13","category":"D Advanced packaging (HBM, panel, glass)","global_technology":"HBM TCB/hybrid bonding; panel-level litho (Onto Firefly); CoPoS pilot-line dual-track (Taiwan vendors vs AMAT/TEL/SCREEN/KLA/Camtek); glass cores (2027 inflection per LPKF)","current_teal_capability":"None","available_in_india":"None documented at equipment level","imported_technology":"All","localization_possibility":"LO06 / LO14 - LOW","critical_ip":"Hybrid bonding (expired Ziptronix family); LIDE","critical_component":"Bond heads; panel handling","potential_partner":"Not prioritised in Batch 1","potential_jv":"N/A","potential_technology_licensor":"N/A","source_ids":["SRC-000179","SRC-000081","SRC-000084","SRC-000041"]},{"gap_id":"G14","category":"E / J ATMP handling & factory automation","global_technology":"EFEM/sorters (RORZE), robots (Brooks, Hirata), AMHS OHT/OHS (Daifuku, Muratec), CoPoS panel handling (Gudeng, Mirle, Lintec, Nitto, Tazmo)","current_teal_capability":"Withheld in public edition (TEAL internal)","available_in_india":"ASM Technologies (robotics/motion engineering); ASM-HHV JV wafer handling (Tier 4); ATS India (Hirata distribution)","imported_technology":"Clean robots, EFEMs, AMHS","localization_possibility":"LO09 - HIGH","critical_ip":"Wafer-robot patents under litigation (Kawasaki v. RORZE, 2025)","critical_component":"Clean robots; load ports (SEMI E84/E87 compliance - analyst note)","potential_partner":"Hirata (India distribution precedent); RORZE; Brooks","potential_jv":"ASM Technologies-HHV JV (precedent)","potential_technology_licensor":"N/A","source_ids":["SRC-000294","SRC-000296","SRC-000214","SRC-000298","SRC-000300","SRC-000213","SRC-000207","SRC-000295","SRC-000200","SRC-INT1"]},{"gap_id":"G15","category":"F Power semiconductors (SiC/GaN)","global_technology":"KABRA laser slicing (DISCO SiC/GaN), SiC stealth dicing (Han's Di-Sync), TLS (3D-Micromac), SiC ohmic anneal (SHI SWA UV, LASSE LT-3100), SiC cutting (Synova)","current_teal_capability":"None","available_in_india":"Demand side: CDIL-Shinjin TO-247 packaging (Mohali)","imported_technology":"All","localization_possibility":"LO13 / LO04 - LOW-MEDIUM","critical_ip":"KABRA process (DISCO)","critical_component":"Green/UV/IR sources","potential_partner":"3D-Micromac; Synova; SHI","potential_jv":"N/A","potential_technology_licensor":"N/A","source_ids":["SRC-000220","SRC-000222","SRC-000109","SRC-000070","SRC-000223","SRC-000091","SRC-000080","SRC-000210"]},{"gap_id":"G16","category":"G Compound semiconductors","global_technology":"MOCVD for GaN/SiC (AIXTRON G5+ C, G10-GaN/SiC; AMEC)","current_teal_capability":"None","available_in_india":"None documented","imported_technology":"All","localization_possibility":"Not assessed","critical_ip":"N/A","critical_component":"Reactors; precursors","potential_partner":"Not a TEAL portfolio area","potential_jv":"N/A","potential_technology_licensor":"N/A","source_ids":["SRC-000328","SRC-000344","SRC-000009"]},{"gap_id":"G17","category":"I Display / MicroLED lasers","global_technology":"Excimer ELA/LLO (Coherent LineBeam, UVblade; AP Systems; JSW Aktina), SLA with DPSS (AP Systems + Coherent PYTHON), LIFT & repair (Coherent UVtransfer)","current_teal_capability":"None","available_in_india":"None documented","imported_technology":"All","localization_possibility":"Not assessed","critical_ip":"N/A","critical_component":"308 nm excimer; DPSS","potential_partner":"Coherent (systems + sources)","potential_jv":"N/A","potential_technology_licensor":"N/A","source_ids":["SRC-000093","SRC-000096","SRC-000095","SRC-000226","SRC-000227","SRC-000224"]},{"gap_id":"G18","category":"Laser sources (L2 component)","global_technology":"Fiber/MOPA (IPG, Raycus, JPT), USP (TRUMPF TruMicro, Light Conversion PHAROS, Amplitude Satsuma X, MKS IceFyre), UV (Huaray), excimer (Coherent, Gigaphoton)","current_teal_capability":"Withheld in public edition (TEAL internal)","available_in_india":"TEAL (development; detail withheld)","imported_technology":"All commercial sources in Indian tools (per documented BOMs)","localization_possibility":"LO18 - MEDIUM","critical_ip":"Gain fibre, pump diodes, seed lasers","critical_component":"Pump diodes; AOMs (Gooch & Housego - Tier 3)","potential_partner":"TRUMPF; Novanta; IPG (internal detail withheld)","potential_jv":"N/A","potential_technology_licensor":"N/A","source_ids":["SRC-000269","SRC-000260","SRC-000259","SRC-000264","SRC-000262","SRC-000265","SRC-000266","SRC-000267","SRC-INT1"]}],"partner_fit":[{"pf_id":"PF01","company_id":"CMP-000077","candidate":"EO Technics","country":"South Korea","partner_type":"Technology / OEM","teal_areas":"Laser Marking; Laser Dicing; Laser Drilling; Laser Annealing; Laser Ablation","technology_fit":"Marking, grooving/dicing, drilling, annealing, debonding, LLO documented","product_fit":"LMC3200G/D; strip/tray/wafer markers; WLCSP backside marker","geographic_fit":"South Korea (Anyang)","manufacturing_fit":"In-house fiber lasers (Tier 4)","india_presence":"Not documented in Batch 1","publicly_documented_partnerships":"None captured","source_ids":["SRC-000065","SRC-000066","SRC-000069"],"note":"Factual fit only - not a recommendation (Part 30)"},{"pf_id":"PF02","company_id":"CMP-000147","candidate":"TRUMPF","country":"Germany","partner_type":"Component / technology","teal_areas":"Laser Marking; Laser Welding; Laser Cutting","technology_fit":"USP (TruMicro 2000/9000/Mark) and ns sources","product_fit":"TruMicro series","geographic_fit":"Germany","manufacturing_fit":"Not captured","india_presence":"Not documented in Batch 1","publicly_documented_partnerships":"Lasers distributed by SHI (Japan)","source_ids":["SRC-000260","SRC-000342","SRC-000343","SRC-000223"],"note":"Factual fit only - not a recommendation (Part 30)"},{"pf_id":"PF03","company_id":"CMP-000151","candidate":"Novanta (Cambridge Technology / Synrad)","country":"United States","partner_type":"Component / subsystem","teal_areas":"Laser Marking; Motion Systems","technology_fit":"Galvanometers, scan controllers, CO2 sources (Synrad)","product_fit":"62xxK/83xxK; ScanMaster","geographic_fit":"United States","manufacturing_fit":"Not captured","india_presence":"Not documented in Batch 1","publicly_documented_partnerships":"None captured","source_ids":["SRC-000254","SRC-000255","SRC-INT1"],"note":"Factual fit only - not a recommendation (Part 30)"},{"pf_id":"PF04","company_id":"CMP-000152","candidate":"SCANLAB","country":"Germany","partner_type":"Component","teal_areas":"Laser Marking; Laser Dicing; Laser Ablation","technology_fit":"Scan heads for micromachining; DOEs","product_fit":"Scan systems; DOEs","geographic_fit":"Germany","manufacturing_fit":"Not captured","india_presence":"Not documented","publicly_documented_partnerships":"None captured","source_ids":["SRC-000251","SRC-000252","SRC-000253"],"note":"Factual fit only - not a recommendation (Part 30)"},{"pf_id":"PF05","company_id":"CMP-000011","candidate":"Hamamatsu Photonics","country":"Japan","partner_type":"Licensing / component","teal_areas":"Laser Dicing","technology_fit":"Stealth Dicing engine (laser + optics module)","product_fit":"SD engine","geographic_fit":"Japan","manufacturing_fit":"Not captured","india_presence":"Not documented","publicly_documented_partnerships":"Comprehensive SD licence to DISCO","source_ids":["SRC-000053","SRC-000054","SRC-000055"],"note":"Factual fit only - not a recommendation (Part 30)"},{"pf_id":"PF06","company_id":"CMP-000045","candidate":"ASMPT ALSI (Advanced Laser Separation International)","country":"Netherlands","partner_type":"Technology / OEM","teal_areas":"Laser Dicing; Laser Ablation","technology_fit":"Multi-beam UV/ps grooving and dicing, V-DOE","product_fit":"LASER1205/1206","geographic_fit":"Netherlands (Beuningen)","manufacturing_fit":"Not captured","india_presence":"Parent ASMPT has India training MoUs (Kaynes)","publicly_documented_partnerships":"Parent: ASMPT-Kaynes-Perceptives MoUs","source_ids":["SRC-000057","SRC-000060","SRC-000201"],"note":"Factual fit only - not a recommendation (Part 30)"},{"pf_id":"PF07","company_id":"CMP-000141","candidate":"3D-Micromac","country":"Germany","partner_type":"Technology / licensing","teal_areas":"Laser Dicing; Laser Annealing","technology_fit":"TLS dicing; laser annealing","product_fit":"microDICE; microPRO XS; microVEGA xMR","geographic_fit":"Germany (Chemnitz)","manufacturing_fit":"Not captured","india_presence":"Not documented","publicly_documented_partnerships":"Acquired TLS IP from Jenoptik (2014)","source_ids":["SRC-000070","SRC-000071","SRC-000072"],"note":"Factual fit only - not a recommendation (Part 30)"},{"pf_id":"PF08","company_id":"CMP-000142","candidate":"Synova","country":"Switzerland","partner_type":"Technology / OEM","teal_areas":"Laser Dicing; Laser Cutting","technology_fit":"Water-jet-guided laser dicing and SiC cutting","product_fit":"LDS 300 M; LDGS 300 A; LCS 303/305","geographic_fit":"Switzerland","manufacturing_fit":"Not captured","india_presence":"Not documented","publicly_documented_partnerships":"None captured","source_ids":["SRC-000076","SRC-000078","SRC-000079","SRC-000080"],"note":"Factual fit only - not a recommendation (Part 30)"},{"pf_id":"PF09","company_id":"CMP-000144","candidate":"InnoLas Semiconductor","country":"Germany","partner_type":"OEM / technology","teal_areas":"Laser Marking; Wafer Handling","technology_fit":"Wafer laser marking and sorting","product_fit":"IL 600-C4000; sorters","geographic_fit":"Germany (Krailling)","manufacturing_fit":"Not captured","india_presence":"Not documented","publicly_documented_partnerships":"None captured","source_ids":["SRC-000229"],"note":"Factual fit only - not a recommendation (Part 30)"},{"pf_id":"PF10","company_id":"CMP-000143","candidate":"LPKF Laser & Electronics","country":"Germany","partner_type":"Technology / JDA","teal_areas":"Laser Drilling; Laser Welding","technology_fit":"LIDE glass processing, TGV, glass welding","product_fit":"Vitrion S 5000; NEXAR; NEXAR BOND","geographic_fit":"Germany","manufacturing_fit":"Vitrion foundry service","india_presence":"Not documented","publicly_documented_partnerships":"Onto PACE programme; glass partner network","source_ids":["SRC-000081","SRC-000082","SRC-000083","SRC-000085"],"note":"Factual fit only - not a recommendation (Part 30)"},{"pf_id":"PF11","company_id":"CMP-000145","candidate":"Coherent Corp.","country":"United States","partner_type":"Component / OEM","teal_areas":"Laser Annealing; Laser Ablation","technology_fit":"Excimer & DPSS sources; LLO/ELA/LIFT systems","product_fit":"UVblade; LineBeam; UVtransfer; PYTHON","geographic_fit":"United States","manufacturing_fit":"Vertically integrated sources (S0093/S0096)","india_presence":"Not documented","publicly_documented_partnerships":"Supplies PYTHON to AP Systems","source_ids":["SRC-000093","SRC-000096","SRC-000095","SRC-000226"],"note":"Factual fit only - not a recommendation (Part 30)"},{"pf_id":"PF12","company_id":"CMP-000146","candidate":"IPG Photonics","country":"United States","partner_type":"Component","teal_areas":"Laser Marking; Laser Welding","technology_fit":"ns pulsed fiber lasers; UV marking modules","product_fit":"Nanosecond fiber lasers; UV marking module","geographic_fit":"United States","manufacturing_fit":"Not captured","india_presence":"Not documented","publicly_documented_partnerships":"Distributed by SHI (Japan)","source_ids":["SRC-000269","SRC-000270","SRC-000223","SRC-INT1"],"note":"Factual fit only - not a recommendation (Part 30)"},{"pf_id":"PF13","company_id":"CMP-000195","candidate":"SLTL (Sahajanand Laser Technology)","country":"India","partner_type":"Indian manufacturing / OEM","teal_areas":"Laser Marking; Laser Dicing; Laser Cutting","technology_fit":"Laser machines incl. wafer dicing","product_fit":"Wafer Dicing System; solar cell cutting","geographic_fit":"India (Gandhinagar)","manufacturing_fit":"In-house manufacturing + R&D centre","india_presence":"HQ India","publicly_documented_partnerships":"None captured","source_ids":["SRC-000208"],"note":"Factual fit only - not a recommendation (Part 30)"},{"pf_id":"PF14","company_id":"CMP-000192","candidate":"ASM Technologies","country":"India","partner_type":"Indian manufacturing / engineering","teal_areas":"Wafer Handling; Automation; Motion Systems","technology_fit":"Semiconductor equipment design, vacuum, robotics, motion control","product_fit":"Engineering services; JV tools/sub-systems","geographic_fit":"India (Bengaluru)","manufacturing_fit":"JV manufacturing with HHV","india_presence":"HQ India","publicly_documented_partnerships":"ASM Technologies-HHV JV (2022)","source_ids":["SRC-000213","SRC-000037"],"note":"Factual fit only - not a recommendation (Part 30)"},{"pf_id":"PF15","company_id":"CMP-000193","candidate":"Hind High Vacuum (HHV)","country":"India","partner_type":"Indian manufacturing / subsystem","teal_areas":"Motion Systems","technology_fit":"Vacuum and thin-film systems","product_fit":"Vacuum systems","geographic_fit":"India (Bengaluru, 3 plants)","manufacturing_fit":"Three plants (S0038)","india_presence":"HQ India","publicly_documented_partnerships":"ASM Technologies-HHV JV (2022)","source_ids":["SRC-000038","SRC-000037"],"note":"Factual fit only - not a recommendation (Part 30)"},{"pf_id":"PF16","company_id":"CMP-000062","candidate":"Hirata Corporation","country":"Japan","partner_type":"OEM / subsystem","teal_areas":"Wafer Handling","technology_fit":"Wafer-handling robots, EFEMs, PLP load ports","product_fit":"Robots; EFEMs; load ports","geographic_fit":"Japan","manufacturing_fit":"Not captured","india_presence":"Via ATS India (exclusive distributor)","publicly_documented_partnerships":"Hirata-ATS India exclusive distribution (2026)","source_ids":["SRC-000214"],"note":"Factual fit only - not a recommendation (Part 30)"},{"pf_id":"PF17","company_id":"CMP-000158","candidate":"Aerotech","country":"United States","partner_type":"Subsystem","teal_areas":"Motion Systems; Laser Dicing","technology_fit":"Precision stages for dicing, inspection & metrology","product_fit":"Stages","geographic_fit":"United States","manufacturing_fit":"Not captured","india_presence":"Not documented","publicly_documented_partnerships":"None captured","source_ids":["SRC-000271","SRC-000272"],"note":"Factual fit only - not a recommendation (Part 30)"},{"pf_id":"PF18","company_id":"CMP-000159","candidate":"Physik Instrumente (PI)","country":"Germany","partner_type":"Subsystem","teal_areas":"Motion Systems","technology_fit":"Air-bearing / linear-motor stages; controllers via ACS","product_fit":"A-110 PIglide LC","geographic_fit":"Germany (group incl. ACS, Israel)","manufacturing_fit":"Not captured","india_presence":"Not documented","publicly_documented_partnerships":"ACS Motion Control within PI Group","source_ids":["SRC-000273","SRC-000274"],"note":"Factual fit only - not a recommendation (Part 30)"},{"pf_id":"PF19","company_id":"CMP-000119","candidate":"Suzhou Delphi Laser","country":"China","partner_type":"Technology (Chinese)","teal_areas":"Laser Dicing; Laser Drilling; Laser Annealing; Laser Ablation","technology_fit":"Dicing (Si/SiC/GaAs/LT/LN/glass), grooving, TGV, annealing, debonding","product_fit":"AWD20 TGV and others","geographic_fit":"China (Suzhou)","manufacturing_fit":"Not captured","india_presence":"Not documented","publicly_documented_partnerships":"None captured","source_ids":["SRC-000217"],"note":"Factual fit only - not a recommendation (Part 30)"},{"pf_id":"PF20","company_id":"CMP-000148","candidate":"MKS Instruments","country":"United States","partner_type":"Component / OEM","teal_areas":"Laser Drilling; Laser Dicing","technology_fit":"ps UV/green sources; CO2/UV via drilling","product_fit":"IceFyre; ESI Geode A / Geode X","geographic_fit":"United States","manufacturing_fit":"Not captured","india_presence":"Not documented","publicly_documented_partnerships":"None captured","source_ids":["SRC-000262","SRC-000263","SRC-000230","SRC-000247"],"note":"Factual fit only - not a recommendation (Part 30)"}],"localization":[{"id":"LO01","eq":"EUV/DUV lithography (Tata Dholera)","oem":"ASML Holding; Nikon Corporation; Canon Inc.","crit":"Light source, projection optics, wafer stage","sub":"Optics; light source","cur":"Carl Zeiss SMT; Gigaphoton","ind":"None documented","pot":"LOW","why":"Optics/source-critical class; no documented Indian capability","teal":"N/A","src":"S0024;S0327;S0348","source_ids":["SRC-000024","SRC-000327","SRC-000348"]},{"id":"LO02","eq":"Etch & deposition tools","oem":"Lam Research; Applied Materials; Tokyo Electron (TEL); NAURA Technology Group; AMEC (Advanced Micro-Fabrication Equipment)","crit":"Plasma source, RF power, gas delivery, chamber parts","sub":"RF generators; gas panels; vacuum","cur":"Advanced Energy; Comet PCT; Ultra Clean Holdings (UCT); Ichor Systems; Edwards Vacuum; Pfeiffer Vacuum+Fab Solutions; Ebara Corporation","ind":"Hind High Vacuum (HHV) (vacuum); INOX India (UHP welding); Lam India silicon-component plant (planned)","pot":"MEDIUM","why":"Documented Indian capability in adjacent classes (vacuum, UHP) + OEM localisation commitments; plasma/RF core imported","teal":"N/A","src":"S0032;S0038;S0212;S0290;S0291","source_ids":["SRC-000032","SRC-000038","SRC-000212","SRC-000290","SRC-000291"]},{"id":"LO03","eq":"Inspection & metrology","oem":"KLA Corporation; Onto Innovation; Nova Ltd.; Camtek; Hitachi High-Tech","crit":"Optics, e-beam, algorithms","sub":"Optical/e-beam columns; stages","cur":"Aerotech; Physik Instrumente (PI); Basler","ind":"KLA Chennai R&D (OEM captive, software/R&D only)","pot":"LOW","why":"No documented Indian supplier; OEM R&D centre is captive","teal":"Semiconductor Inspection","src":"S0202;S0203","source_ids":["SRC-000202","SRC-000203"]},{"id":"LO04","eq":"Laser dicing / grooving (OSATs)","oem":"DISCO Corporation; Tokyo Seimitsu (ACCRETECH); ASMPT ALSI (Advanced Laser Separation International); EO Technics; 3D-Micromac; Synova; Han's Laser Technology; HGTECH (Huagong Tech); Suzhou Delphi Laser","crit":"Transmissive/UV/USP laser source, SD engine, beam delivery, process recipes","sub":"Laser source; galvo/optics; motion stage; vision","cur":"Hamamatsu Photonics; Coherent Corp.; TRUMPF; MKS Instruments; Light Conversion; Amplitude Laser; IPG Photonics; SCANLAB; Novanta (Cambridge Technology / Synrad); Aerotech; Physik Instrumente (PI)","ind":"SLTL (Sahajanand Laser Technology) (Wafer Dicing System); Titan Engineering & Automation Ltd (TEAL) (internal detail withheld)","pot":"MEDIUM","why":"Indian machine-level capability documented (SLTL) but critical sources/SD engine imported","teal":"Laser Dicing","src":"S0208;S0053;S0054;SINT1","source_ids":["SRC-000208","SRC-000053","SRC-000054","SRC-INT1"]},{"id":"LO05","eq":"Laser marking (wafer / package)","oem":"EO Technics; InnoLas Semiconductor; Han's Laser Technology","crit":"ns fiber/UV source, galvo, vision, handling","sub":"Laser source; galvo; camera","cur":"IPG Photonics; Shenzhen JPT Opto-electronics; Wuhan Raycus Fiber Laser Technologies; SCANLAB; Novanta (Cambridge Technology / Synrad); RAYLASE; Cognex; Basler","ind":"Titan Engineering & Automation Ltd (TEAL) (internal detail withheld); SLTL (Sahajanand Laser Technology) (laser machines)","pot":"HIGH","why":"Same-class Indian capability documented; class is integration/automation around bought-in source","teal":"Laser Marking","src":"S0065;S0229;S0208;SINT1","source_ids":["SRC-000065","SRC-000229","SRC-000208","SRC-INT1"]},{"id":"LO06","eq":"Die attach / wire / TC / hybrid bonding","oem":"Kulicke & Soffa; ASMPT; BE Semiconductor Industries (BESI); Hanmi Semiconductor; Hanwha Semitech; Yamaha Robotics Holdings","crit":"Bond head, force/thermal control, placement vision","sub":"Bond head; motion; vision","cur":"Not captured","ind":"None documented (ASMPT-Kaynes MoU is training only)","pot":"LOW","why":"No documented Indian capability; training MoU does not qualify","teal":"ATMP Equipment","src":"S0201;S0041;S0046","source_ids":["SRC-000201","SRC-000041","SRC-000046"]},{"id":"LO07","eq":"Molding & singulation","oem":"TOWA Corporation; Yamaha Robotics Holdings","crit":"Press/mold tooling, dispense","sub":"Mold presses; saw","cur":"Not captured","ind":"ASM Technologies (equipment design engineering - adjacent)","pot":"MEDIUM","why":"Mechanical class; only adjacent Indian capability documented","teal":"Packaging Equipment","src":"S0237;S0213","source_ids":["SRC-000237","SRC-000213"]},{"id":"LO08","eq":"Test: ATE, handlers, burn-in, probe cards","oem":"Advantest; Teradyne; Chroma ATE; Techwing; FormFactor; Technoprobe; Aehr Test Systems","crit":"Pin electronics, thermal handling, probe technology","sub":"Handlers; probe cards","cur":"Not captured","ind":"Tessolve (test engineering services); Teradyne Bengaluru office","pot":"MEDIUM","why":"Adjacent Indian capability (services) documented; hardware imported","teal":"Semiconductor Test Equipment","src":"S0216;S0214;S0302","source_ids":["SRC-000216","SRC-000214","SRC-000302"]},{"id":"LO09","eq":"Wafer handling / EFEM / AMHS","oem":"RORZE Corporation; Brooks Automation; Hirata Corporation; Daifuku; Murata Machinery (Muratec)","crit":"Clean robots, EFEM, OHT","sub":"Robots; load ports; AMHS","cur":"Not captured","ind":"ASM Technologies (robotics & motion engineering); ASM Technologies-HHV JV (wafer handling, Tier 4); Titan Engineering & Automation Ltd (TEAL) (automation); ATS India (distribution)","pot":"HIGH","why":"Same-class Indian capability documented (Tier 2 SEMI directory); mechanical/automation class","teal":"Wafer Handling;Automation","src":"S0213;S0214;S0207;S0200","source_ids":["SRC-000213","SRC-000214","SRC-000207","SRC-000200"]},{"id":"LO10","eq":"Vacuum pumps & systems","oem":"Edwards Vacuum; Pfeiffer Vacuum+Fab Solutions; Ebara Corporation","crit":"Dry pump rotors, abatement","sub":"Pumps; abatement","cur":"Not captured","ind":"Hind High Vacuum (HHV) (vacuum systems, 3 plants)","pot":"MEDIUM","why":"Same-class Indian capability documented; process-pump IP critical","teal":"N/A","src":"S0038;S0286;S0288","source_ids":["SRC-000038","SRC-000286","SRC-000288"]},{"id":"LO11","eq":"UHP gas / chemical delivery & fab facility","oem":"Ultra Clean Holdings (UCT); Ichor Systems; Marketech International; United Integrated Services (UIS)","crit":"UHP welding, gas panels","sub":"Gas panels; hook-up","cur":"Not captured","ind":"INOX India (orbital welding - first Tata order); Linde India (gases, Tier 4)","pot":"HIGH","why":"Same-class Indian capability documented with a first fab order","teal":"N/A","src":"S0212;S0205","source_ids":["SRC-000212","SRC-000205"]},{"id":"LO12","eq":"Crystal growth (CZ pullers)","oem":"N/A","crit":"Hot zone, magnetic field, process control","sub":"Puller","cur":"Not captured","ind":"Raana Semiconductors (orders INR 12 crore); ASM Technologies-HHV JV (prototype, Tier 4)","pot":"MEDIUM","why":"Same-class Indian startup capability documented; early commercial stage","teal":"N/A","src":"S0211;S0207","source_ids":["SRC-000211","SRC-000207"]},{"id":"LO13","eq":"Laser annealing (power / logic)","oem":"Sumitomo Heavy Industries (Mechatronics); LASSE (Laser Systems & Solutions of Europe); JSW Aktina System; 3D-Micromac; Veeco Instruments; EO Technics","crit":"Green/UV/IR source, beam homogenizer","sub":"Laser source; optics","cur":"Coherent Corp.; TRUMPF","ind":"None documented","pot":"LOW","why":"Optics/source-critical class; no documented Indian capability","teal":"Laser Annealing","src":"S0223;S0091;S0224;S0087","source_ids":["SRC-000223","SRC-000091","SRC-000224","SRC-000087"]},{"id":"LO14","eq":"TGV / glass substrate laser processing","oem":"LPKF Laser & Electronics; Philoptics; Suzhou Delphi Laser; Wuhan DR Laser Technology","crit":"USP/UV source, LIDE etch, inspection","sub":"Laser source; etch; inspection","cur":"Not captured","ind":"None documented","pot":"LOW","why":"No documented Indian capability","teal":"Laser Drilling","src":"S0082;S0117;S0217","source_ids":["SRC-000082","SRC-000117","SRC-000217"]},{"id":"LO15","eq":"Plasma dicing","oem":"Plasma-Therm; Panasonic Connect; KLA Corporation","crit":"ICP plasma, masking","sub":"Plasma source","cur":"Not captured","ind":"None documented","pot":"LOW","why":"Plasma-critical class; no documented Indian capability","teal":"Laser Dicing","src":"S0231;S0234","source_ids":["SRC-000231","SRC-000234"]},{"id":"LO16","eq":"Motion stages & encoders","oem":"Aerotech; Physik Instrumente (PI); ETEL (HEIDENHAIN group); Renishaw","crit":"Air bearings, linear motors, interferometric encoders","sub":"Stages; encoders","cur":"Not captured","ind":"ASM Technologies (motion control engineering); Titan Engineering & Automation Ltd (TEAL) (internal detail withheld)","pot":"MEDIUM","why":"Adjacent Indian capability documented; precision encoders imported","teal":"Motion Systems","src":"S0213;S0277;SINT1","source_ids":["SRC-000213","SRC-000277","SRC-INT1"]},{"id":"LO17","eq":"Machine vision (cameras / ID readers)","oem":"Cognex; Basler; Hangzhou Hikrobot","crit":"Image sensors, optics, algorithms","sub":"Cameras; readers","cur":"Not captured","ind":"Titan Engineering & Automation Ltd (TEAL) (internal detail withheld)","pot":"LOW","why":"No documented Indian camera/reader manufacturer","teal":"Vision Systems","src":"S0278;S0280;SINT1","source_ids":["SRC-000278","SRC-000280","SRC-INT1"]},{"id":"LO18","eq":"Industrial laser sources (fiber / MOPA / USP)","oem":"IPG Photonics; TRUMPF; Wuhan Raycus Fiber Laser Technologies; Shenzhen JPT Opto-electronics; Light Conversion","crit":"Gain fibre, pump diodes, seed, AOM","sub":"Pump diodes; AOM; optics","cur":"Gooch & Housego","ind":"Titan Engineering & Automation Ltd (TEAL) (internal detail withheld)","pot":"MEDIUM","why":"Same-class Indian development documented (internal); not yet commercial","teal":"Laser Marking;Laser Welding","src":"SINT1;S0269","source_ids":["SRC-INT1","SRC-000269"]}],"qc_log":[{"check":"1 Remove duplicates","result":"PASS","detail":"0 normalised-name collisions","note":"Name-variant pairs are logged in Company_Relationships (Part 19)"},{"check":"2 Validate company names","result":"PASS","detail":"187 names checked","note":"Non-empty, trimmed"},{"check":"3 Validate product names","result":"PASS","detail":"158 products","note":"Family name present for every product"},{"check":"4 Validate model numbers","result":"INFO","detail":"109 with exact model; 49 N/A (source names no model)","note":"Models copied verbatim from source"},{"check":"5 Validate URLs","result":"PASS","detail":"351 URLs well-formed; 8 DATA_NOT_ACCESSIBLE","note":"Format check; inaccessible pages recorded, never bypassed"},{"check":"6 Validate country","result":"PASS","detail":"5 N/A countries","note":"Canonical names (rules.norm_country)"},{"check":"7 Validate parent companies","result":"INFO","detail":"14 parents recorded; entries marked [KNOW]/Tier 4 need verification","note":"See Company_Relationships"},{"check":"8 Cross-check critical specifications","result":"INFO","detail":"54 spec rows; cross-checked against 2nd source where available (e.g. Synova LDS 300 M T1+T3)","note":"Tier-3 spec values labelled in notes"},{"check":"9 Identify stale information","result":"FLAGGED","detail":"16 records rest on sources >2 years old","note":"e.g. SUSS ELD300 (2014), microDICE adoption (2016), KABRA launch (2018)"},{"check":"10 Identify conflicting information","result":"FLAGGED","detail":"9 conflicts logged","note":"TOWA FY3/26 figures: Unit ambiguity (oku-yen) [S0237]; Plasma-Therm Singulator speed: 'up to 3,000 mm/s' implausible as etch rate [S0231]; SMEE SSA/800: Never deployed (S0187) vs scaled (S0189) [S0187;S0189]; Skyverse ownership: SiCarrier subsidiary claim (S0188) [S0188]; HGTECH profile: Misattributed to Synova in Tier-4 list [S0110]; ASML in grooving list: Error in Tier-4 list [S0112]; Huaray official domain: Two domains observed [S0265]; Tata Assam investment: USD 3B+ (official) vs USD 2.83B (Tier 4) [S0305;S0338]; Hwatsing 2025 revenue: Tier-3 AI flash only [S0316]"},{"check":"11 Flag unsupported claims","result":"PASS","detail":"0 records without any source","note":"Tier-4-only records set to UNVERIFIED"},{"check":"12 Source for every important claim","result":"PASS","detail":"450 records carry source_ids","note":""},{"check":"13 No assumption-filled data","result":"PASS","detail":"Missing values = N/A; candidate categories kept in a separate UNVERIFIED column","note":""},{"check":"14 N/A where unavailable","result":"PASS","detail":"Applied uniformly","note":""},{"check":"15 NOT DISCLOSED where appropriate","result":"PASS","detail":"Local manufacturing/sourcing % = NOT DISCLOSED","note":""},{"check":"16 Estimated vs reported separated","result":"PASS","detail":"value_type: {'REPORTED': 85, 'GUIDANCE': 2, 'DERIVED': 2, 'ESTIMATE': 1, 'UNIT_CONFLICT': 3}","note":"Price estimates labelled ESTIMATE"},{"check":"17 Original source preserved","result":"PASS","detail":"Original currency/value kept beside USD; source excerpt stored","note":""},{"check":"18 Verification date recorded","result":"PASS","detail":"last_verified_date = 2026-09-29 on every company/product","note":""}],"completeness":[{"dimension":"Company","pct":36.4,"definition":"Share of 10 core Part-3 fields populated across all companies"},{"dimension":"Product","pct":91.1,"definition":"Share of model/technology/application/process-step populated"},{"dimension":"Specification","pct":9,"definition":"Share of wafer size/throughput/accuracy populated (equipment products)"},{"dimension":"Customer","pct":35.5,"definition":"Named Part-9 customers with >=1 CONFIRMED/PROBABLE relationship"},{"dimension":"Financial","pct":21,"definition":"VERIFIED companies with a reported/derived revenue figure"},{"dimension":"Geography","pct":60.6,"definition":"Brief-listed countries with >=1 company captured"},{"dimension":"Source","pct":87.8,"definition":"Records backed by >=1 accessible Tier-1/2 source"}],"coverage":{"countries_listed":33,"countries_with_companies":20,"missing_countries":["Canada","Mexico","Belgium","Spain","Ireland","Czech Republic","Poland","Vietnam","Thailand","Philippines","Australia","New Zealand","Middle East (UAE/Saudi Arabia/other)"],"companies_discovered":187,"companies_verified":143,"companies_partially_verified":28,"companies_unverified":16,"products_discovered":158,"products_verified":140,"sources":351,"sources_tier":{"1":192,"2":97,"3":30,"4":30,"BRIEF":1,"INT":1},"sources_not_accessible":8,"categories_covered":["A","B","C","D","E","F","G","I","J"],"missing_categories":["H"],"taxonomy_nodes_without_records":118,"customer_relationships":61,"customer_rel_by_status":{"CONFIRMED":25,"PROBABLE":27,"UNVERIFIED":9},"supplier_relationships_documented":12,"supplier_rows_total":66,"india_relevant_companies":23,"stale_records":16,"completeness":{"Company":36.4,"Product":91.1,"Specification":9,"Customer":35.5,"Financial":21,"Geography":60.6,"Source":87.8},"partnerships":44,"patents":3,"financial_rows":93,"laser_products":84,"startups":5},"exhibitions":[{"ex_id":"EX01","exhibition":"SEMICON West","region":"United States","editions_captured":"2026 (exhibitor portal)","extraction_status":"SEED ONLY","notes":"1 exhibitor mapped","source_ids":["SRC-000297"]},{"ex_id":"EX02","exhibition":"SEMICON Taiwan","region":"Taiwan","editions_captured":"2026 (eBooth)","extraction_status":"SEED ONLY","notes":"User holds an enriched 1,288-listing exhibitor mapping - ingest in Batch 2","source_ids":["SRC-000066"]},{"ex_id":"EX03","exhibition":"SEMICON Japan","region":"Japan","editions_captured":"N/A","extraction_status":"NOT RUN","notes":"Batch 2","source_ids":[]},{"ex_id":"EX04","exhibition":"SEMICON Korea","region":"South Korea","editions_captured":"N/A","extraction_status":"NOT RUN","notes":"Batch 2","source_ids":[]},{"ex_id":"EX05","exhibition":"SEMICON Southeast Asia","region":"Southeast Asia","editions_captured":"2026 (exhibitor listing)","extraction_status":"SEED ONLY","notes":"1 exhibitor mapped","source_ids":["SRC-000332"]},{"ex_id":"EX06","exhibition":"SEMICON India","region":"India","editions_captured":"2025 (eBooth); 2026 held 17-19 Sep 2026, Yashobhoomi, New Delhi","extraction_status":"SEED ONLY","notes":"Added - India relevance","source_ids":["SRC-000299","SRC-000031"]},{"ex_id":"EX07","exhibition":"Productronica","region":"Germany","editions_captured":"2025 (exhibitor portal)","extraction_status":"SEED ONLY","notes":"1 exhibitor mapped","source_ids":["SRC-000236"]},{"ex_id":"EX08","exhibition":"electronica","region":"Germany","editions_captured":"N/A","extraction_status":"NOT RUN","notes":"Batch 2","source_ids":[]},{"ex_id":"EX09","exhibition":"SPIE Photonics West","region":"United States","editions_captured":"N/A","extraction_status":"NOT RUN","notes":"Batch 2","source_ids":[]},{"ex_id":"EX10","exhibition":"Laser World of Photonics","region":"Germany / India / China","editions_captured":"N/A","extraction_status":"NOT RUN","notes":"Batch 2","source_ids":[]},{"ex_id":"EX11","exhibition":"NEPCON","region":"China / Japan","editions_captured":"N/A","extraction_status":"NOT RUN","notes":"Batch 2","source_ids":[]},{"ex_id":"EX12","exhibition":"IMAPS","region":"United States","editions_captured":"N/A","extraction_status":"NOT RUN","notes":"Batch 2","source_ids":[]},{"ex_id":"EX13","exhibition":"ELEXCON","region":"China","editions_captured":"N/A","extraction_status":"NOT RUN","notes":"Batch 2","source_ids":[]},{"ex_id":"EX14","exhibition":"CIOE","region":"China","editions_captured":"N/A","extraction_status":"NOT RUN","notes":"Batch 2","source_ids":[]}],"exhibitors":[{"ex_id":"EX02","exhibition":"SEMICON Taiwan","year":"2026","company_id":"CMP-000077","company":"EO Technics","classification":"OEM","evidence":"eBooth lists wafer laser annealing, grooving/dicing, drilling, WLCSP backside marker","source_ids":["SRC-000066"]},{"ex_id":"EX01","exhibition":"SEMICON West","year":"2026","company_id":"CMP-000064","company":"Brooks Automation","classification":"OEM","evidence":"Exhibitor listing; company makes wafer-handling robotics (S0296)","source_ids":["SRC-000297","SRC-000296"]},{"ex_id":"EX06","exhibition":"SEMICON India","year":"2025","company_id":"CMP-000065","company":"Daifuku","classification":"OEM","evidence":"eBooth; company makes cleanroom AMHS (S0298)","source_ids":["SRC-000299","SRC-000298"]},{"ex_id":"EX07","exhibition":"Productronica","year":"2025","company_id":"CMP-000053","company":"Advanced Dicing Technologies (ADT)","classification":"OEM","evidence":"Exhibitor listing; company makes dicing saws (S0236)","source_ids":["SRC-000236"]},{"ex_id":"EX05","exhibition":"SEMICON Southeast Asia","year":"2026","company_id":"CMP-000042","company":"Pentamaster","classification":"Other (category unconfirmed)","evidence":"Exhibitor listing; equipment category not confirmed","source_ids":["SRC-000332"]}],"patents":[{"id":"PT001","holder":"Hamamatsu Photonics","patent_number":"US6992026B2","technology":"Laser processing method and apparatus (Stealth Dicing family)","filing_date":"2003-03-12 (priority 2000-09-13)","grant_date":"2006-01-31","country":"US","equipment_id":"EQP-C01.03","status":"EXPIRED (adjusted expiry 2021-12-27)","notes":"Litigation history recorded on Google Patents","source_ids":["SRC-000194"],"confidence":"HIGH"},{"id":"PT002","holder":"Ziptronix -> Adeia","patent_number":"US6902987B1","technology":"Method for low temperature bonding and bonded structure (direct/hybrid bonding)","filing_date":"2000-02-16","grant_date":"2005-06-07","country":"US","equipment_id":null,"status":"EXPIRED","notes":"Litigation history recorded on Google Patents","source_ids":["SRC-000195"],"confidence":"HIGH"},{"id":"PT003","holder":"Kawasaki Heavy Industries (plaintiff) / RORZE (defendant)","patent_number":"N/A (not captured)","technology":"Wafer-transfer robot patent dispute (N.D. Cal., 2025)","filing_date":"N/A","grant_date":"N/A","country":"US","equipment_id":"EQP-A38","status":"LITIGATION","notes":"Court opinion; patent numbers to be captured in Batch 2","source_ids":["SRC-000295"],"confidence":"HIGH"}],"legacy_process_steps":[{"process_step_id":"PS01","sequence":1,"name":"Wafer Fabrication","canonical_in_brief":"Y","description":"Front-end umbrella: substrate preparation, epitaxy and the full wafer-processing loop","products":2,"customer_relationships":1},{"process_step_id":"PSX3","sequence":1.5,"name":"Mask / Reticle Making","canonical_in_brief":"N","description":"AUXILIARY: photomask writing, inspection, repair, pellicle (feeds lithography)","products":2,"customer_relationships":0},{"process_step_id":"PS02","sequence":2,"name":"Lithography","canonical_in_brief":"Y","description":"Pattern transfer: exposure (EUV/DUV/i-line), e-beam, NIL, maskless","products":11,"customer_relationships":7},{"process_step_id":"PS03","sequence":3,"name":"Coating","canonical_in_brief":"Y","description":"Resist coat / bake / develop on track systems","products":0,"customer_relationships":0},{"process_step_id":"PS04","sequence":4,"name":"Etching","canonical_in_brief":"Y","description":"Dry (plasma/RIE/ICP/DRIE) and wet removal of material","products":1,"customer_relationships":4},{"process_step_id":"PS05","sequence":5,"name":"Deposition","canonical_in_brief":"Y","description":"CVD/ALD/PVD/epitaxy thin-film growth","products":6,"customer_relationships":2},{"process_step_id":"PS06","sequence":6,"name":"Implantation","canonical_in_brief":"Y","description":"Ion implantation and doping","products":0,"customer_relationships":0},{"process_step_id":"PSX1","sequence":6.5,"name":"Thermal Processing","canonical_in_brief":"N","description":"AUXILIARY: diffusion, oxidation, RTP, furnace, laser/flash annealing","products":12,"customer_relationships":1},{"process_step_id":"PS07","sequence":7,"name":"Cleaning","canonical_in_brief":"Y","description":"Wet/dry/plasma cleaning and scrubbing","products":0,"customer_relationships":7},{"process_step_id":"PS08","sequence":8,"name":"Metrology","canonical_in_brief":"Y","description":"Dimensional, film, overlay and surface measurement","products":3,"customer_relationships":1},{"process_step_id":"PS09","sequence":9,"name":"Inspection","canonical_in_brief":"Y","description":"Defect, particle, optical and e-beam inspection","products":1,"customer_relationships":6},{"process_step_id":"PS10","sequence":10,"name":"CMP","canonical_in_brief":"Y","description":"Chemical-mechanical planarization","products":0,"customer_relationships":0},{"process_step_id":"PS11","sequence":11,"name":"Metallization","canonical_in_brief":"Y","description":"Interconnect metal deposition and electroplating","products":0,"customer_relationships":0},{"process_step_id":"PS12","sequence":12,"name":"Wafer Test","canonical_in_brief":"Y","description":"Electrical wafer sort / probing","products":1,"customer_relationships":3},{"process_step_id":"PSX2","sequence":12.5,"name":"Wafer Thinning & Grinding","canonical_in_brief":"N","description":"AUXILIARY: back-grind, thinning, polishing, mount/demount","products":0,"customer_relationships":0},{"process_step_id":"PS13","sequence":13,"name":"Dicing","canonical_in_brief":"Y","description":"Wafer singulation: blade, laser ablation, stealth, plasma, DBG","products":30,"customer_relationships":1},{"process_step_id":"PS14","sequence":14,"name":"Packaging","canonical_in_brief":"Y","description":"Molding, encapsulation, marking, package singulation","products":9,"customer_relationships":1},{"process_step_id":"PSX5","sequence":14.5,"name":"Advanced Packaging Substrates & Interposers","canonical_in_brief":"N","description":"AUXILIARY: TSV/TGV/RDL/interposer/panel processing","products":8,"customer_relationships":5},{"process_step_id":"PS15","sequence":15,"name":"Assembly","canonical_in_brief":"Y","description":"Die attach, flip-chip, wire/TC/hybrid bonding","products":17,"customer_relationships":9},{"process_step_id":"PS16","sequence":16,"name":"Final Test","canonical_in_brief":"Y","description":"Final test, burn-in, handlers, package inspection","products":2,"customer_relationships":1},{"process_step_id":"PSX4","sequence":90,"name":"Factory Automation & Infrastructure","canonical_in_brief":"N","description":"AUXILIARY (cross-process): AMHS, robots, EFEM, vacuum, gas/chemical delivery, abatement, MES","products":5,"customer_relationships":10},{"process_step_id":"PSX6","sequence":91,"name":"Display / MicroLED Panel Processing","canonical_in_brief":"N","description":"AUXILIARY (adjacent industry): ELA, LLO, mass transfer, laser repair","products":7,"customer_relationships":1}],"legacy_laser_types":[["L01","Laser Marking"],["L02","Laser Dicing"],["L03","Stealth Dicing"],["L04","Laser Ablation"],["L05","Laser Drilling"],["L06","Laser Grooving"],["L07","Laser Cutting"],["L08","Laser Welding"],["L09","Laser Annealing"],["L10","Laser Lift-Off"],["L11","Laser Debonding"],["L12","Laser Repair"],["L13","Laser Trimming"],["L14","Laser Micromachining"],["L15","UV Processing"],["L16","Green Laser Processing"],["L17","IR Laser Processing"],["L18","Ultrafast Laser Processing"],["L19","Picosecond"],["L20","Femtosecond"],["L21","CO2 Laser"],["L22","Fiber Laser"],["L23","DPSS"],["L24","Excimer"],["L25","Diode Laser"]],"teal_areas":[["T01","Laser Marking"],["T02","Laser Welding"],["T03","Laser Dicing"],["T04","Laser Cutting"],["T05","Laser Drilling"],["T06","Laser Annealing"],["T07","Laser Ablation"],["T08","Semiconductor Inspection"],["T09","Wafer Handling"],["T10","Packaging Equipment"],["T11","ATMP Equipment"],["T12","Automation"],["T13","Motion Systems"],["T14","Vision Systems"],["T15","Semiconductor Test Equipment"]],"legacy_country_matrix":[{"country":"United States","iso2":"US","region":"North America","currency":"USD","listed_in_brief":"Y","batch1_search_status":"TARGETED","companies":26,"verified":26,"customers":8,"notes":"OEM majors, subsystems, laser/optics, motion, test"},{"country":"Canada","iso2":"CA","region":"North America","currency":"CAD","listed_in_brief":"Y","batch1_search_status":"NOT_SEARCHED","companies":0,"verified":0,"customers":0,"notes":"Batch 2"},{"country":"Mexico","iso2":"MX","region":"North America","currency":"MXN","listed_in_brief":"Y","batch1_search_status":"NOT_SEARCHED","companies":0,"verified":0,"customers":0,"notes":"Batch 2 (OSAT/EMS near-shoring)"},{"country":"Germany","iso2":"DE","region":"Europe","currency":"EUR","listed_in_brief":"Y","batch1_search_status":"TARGETED","companies":15,"verified":14,"customers":2,"notes":"Laser (TRUMPF, 3D-Micromac, LPKF, InnoLas), optics, galvo, motion, MOCVD, vacuum"},{"country":"Netherlands","iso2":"NL","region":"Europe","currency":"EUR","listed_in_brief":"Y","batch1_search_status":"TARGETED","companies":5,"verified":4,"customers":2,"notes":"ASML, ASMI, BESI, ASMPT ALSI"},{"country":"Switzerland","iso2":"CH","region":"Europe","currency":"CHF","listed_in_brief":"Y","batch1_search_status":"INCIDENTAL","companies":3,"verified":3,"customers":1,"notes":"Synova, Comet PCT, ETEL (HEIDENHAIN)"},{"country":"United Kingdom","iso2":"GB","region":"Europe","currency":"GBP","listed_in_brief":"Y","batch1_search_status":"INCIDENTAL","companies":4,"verified":3,"customers":0,"notes":"Edwards, Renishaw, Oxford Instruments, Gooch & Housego"},{"country":"France","iso2":"FR","region":"Europe","currency":"EUR","listed_in_brief":"Y","batch1_search_status":"INCIDENTAL","companies":2,"verified":2,"customers":0,"notes":"Amplitude"},{"country":"Italy","iso2":"IT","region":"Europe","currency":"EUR","listed_in_brief":"Y","batch1_search_status":"INCIDENTAL","companies":1,"verified":1,"customers":0,"notes":"Technoprobe"},{"country":"Belgium","iso2":"BE","region":"Europe","currency":"EUR","listed_in_brief":"Y","batch1_search_status":"NOT_SEARCHED","companies":0,"verified":0,"customers":0,"notes":"Batch 2 (imec ecosystem)"},{"country":"Austria","iso2":"AT","region":"Europe","currency":"EUR","listed_in_brief":"Y","batch1_search_status":"INCIDENTAL","companies":1,"verified":1,"customers":0,"notes":"EV Group"},{"country":"Finland","iso2":"FI","region":"Europe","currency":"EUR","listed_in_brief":"Y","batch1_search_status":"INCIDENTAL","companies":1,"verified":1,"customers":0,"notes":"Beneq"},{"country":"Sweden","iso2":"SE","region":"Europe","currency":"SEK","listed_in_brief":"Y","batch1_search_status":"INCIDENTAL","companies":1,"verified":1,"customers":0,"notes":"Mycronic"},{"country":"Denmark","iso2":"DK","region":"Europe","currency":"DKK","listed_in_brief":"Y","batch1_search_status":"INCIDENTAL","companies":1,"verified":1,"customers":0,"notes":"NKT Photonics (Hamamatsu group)"},{"country":"Spain","iso2":"ES","region":"Europe","currency":"EUR","listed_in_brief":"Y","batch1_search_status":"NOT_SEARCHED","companies":0,"verified":0,"customers":0,"notes":"Batch 2"},{"country":"Ireland","iso2":"IE","region":"Europe","currency":"EUR","listed_in_brief":"Y","batch1_search_status":"NOT_SEARCHED","companies":0,"verified":0,"customers":0,"notes":"Batch 2"},{"country":"Czech Republic","iso2":"CZ","region":"Europe","currency":"CZK","listed_in_brief":"Y","batch1_search_status":"NOT_SEARCHED","companies":0,"verified":0,"customers":0,"notes":"Batch 2 (Thermo Fisher Brno site not verified)"},{"country":"Poland","iso2":"PL","region":"Europe","currency":"PLN","listed_in_brief":"Y","batch1_search_status":"NOT_SEARCHED","companies":0,"verified":0,"customers":0,"notes":"Batch 2"},{"country":"Israel","iso2":"IL","region":"Europe/Middle East (per brief)","currency":"ILS","listed_in_brief":"Y","batch1_search_status":"INCIDENTAL","companies":5,"verified":5,"customers":0,"notes":"Nova, Camtek, ADT, ACS Motion Control, Holo/Or"},{"country":"Hungary","iso2":"HU","region":"Europe (other)","currency":"HUF","listed_in_brief":"N","batch1_search_status":"INCIDENTAL","companies":1,"verified":0,"customers":0,"notes":"Semilab"},{"country":"Lithuania","iso2":"LT","region":"Europe (other)","currency":"EUR","listed_in_brief":"N","batch1_search_status":"INCIDENTAL","companies":1,"verified":1,"customers":0,"notes":"Light Conversion"},{"country":"Japan","iso2":"JP","region":"Asia","currency":"JPY","listed_in_brief":"Y","batch1_search_status":"TARGETED","companies":28,"verified":27,"customers":3,"notes":"Front-end majors, dicing/grinding, laser annealing, back-end, AMHS"},{"country":"South Korea","iso2":"KR","region":"Asia","currency":"KRW","listed_in_brief":"Y","batch1_search_status":"TARGETED","companies":19,"verified":11,"customers":3,"notes":"HBM TC bonders, laser (EO Technics, Philoptics, AP Systems), test handlers"},{"country":"Taiwan","iso2":"TW","region":"Asia","currency":"TWD","listed_in_brief":"Y","batch1_search_status":"TARGETED","companies":16,"verified":15,"customers":4,"notes":"CoWoS/CoPoS local vendors, test (Chroma, MPI), facility (UIS, Marketech)"},{"country":"China","iso2":"CN","region":"Asia","currency":"CNY","listed_in_brief":"Y","batch1_search_status":"TARGETED","companies":36,"verified":17,"customers":3,"notes":"Naura, AMEC, Piotech, Hwatsing, ACM, SMEE/AMIES/SiCarrier, laser (Han's, HGTECH, Delphi, DR Laser), laser sources"},{"country":"Singapore","iso2":"SG","region":"Asia","currency":"SGD","listed_in_brief":"Y","batch1_search_status":"INCIDENTAL","companies":1,"verified":1,"customers":0,"notes":"Wavelength Opto-Electronic"},{"country":"India","iso2":"IN","region":"Asia","currency":"INR","listed_in_brief":"Y","batch1_search_status":"TARGETED","companies":12,"verified":7,"customers":5,"notes":"ISM projects, OEM India presence, Indian equipment/automation/laser firms"},{"country":"Malaysia","iso2":"MY","region":"Asia","currency":"MYR","listed_in_brief":"Y","batch1_search_status":"INCIDENTAL","companies":2,"verified":1,"customers":0,"notes":"ViTrox, Pentamaster"},{"country":"Vietnam","iso2":"VN","region":"Asia","currency":"VND","listed_in_brief":"Y","batch1_search_status":"NOT_SEARCHED","companies":0,"verified":0,"customers":0,"notes":"Batch 2"},{"country":"Thailand","iso2":"TH","region":"Asia","currency":"THB","listed_in_brief":"Y","batch1_search_status":"NOT_SEARCHED","companies":0,"verified":0,"customers":0,"notes":"Batch 2"},{"country":"Philippines","iso2":"PH","region":"Asia","currency":"PHP","listed_in_brief":"Y","batch1_search_status":"NOT_SEARCHED","companies":0,"verified":0,"customers":0,"notes":"Batch 2"},{"country":"Hong Kong","iso2":"HK","region":"Asia","currency":"HKD","listed_in_brief":"Y","batch1_search_status":"INCIDENTAL","companies":1,"verified":1,"customers":0,"notes":"ASMPT (HKEX listing)"},{"country":"Australia","iso2":"AU","region":"Other","currency":"AUD","listed_in_brief":"Y","batch1_search_status":"NOT_SEARCHED","companies":0,"verified":0,"customers":0,"notes":"Batch 2"},{"country":"New Zealand","iso2":"NZ","region":"Other","currency":"NZD","listed_in_brief":"Y","batch1_search_status":"NOT_SEARCHED","companies":0,"verified":0,"customers":0,"notes":"Batch 2"},{"country":"Middle East (UAE/Saudi Arabia/other)","iso2":"ME","region":"Other","currency":"various","listed_in_brief":"Y","batch1_search_status":"NOT_SEARCHED","companies":0,"verified":0,"customers":0,"notes":"Batch 2"}],"programs":[{"id":"PG01","name":"India Semiconductor Mission (ISM) — approved manufacturing units","country":"India","jurisdiction":"India (central)","type":"INCENTIVE","announced":null,"status":"IN_FORCE","facts":[{"label":"Approved units (Aug 2025)","value":"10 units, about ₹1.60 lakh crore cumulative, 6 states","source_ids":["SRC-000958"]},{"label":"Approved units (May 2026)","value":"12 units after two further approvals","source_ids":["SRC-000959"]}],"source_ids":["SRC-000958","SRC-000959"],"facility_ids":["FAC-000001","FAC-000002","FAC-000003","FAC-000004","FAC-000005","FAC-000006","FAC-000007","FAC-000008","FAC-000009","FAC-000010","FAC-000011","FAC-000012"],"facility_basis":"Facility record names this programme in its scheme / incentive field","batch":"Batch 11"},{"id":"PG02","name":"Semicon 2.0","country":"India","jurisdiction":"India (central)","type":"INCENTIVE","announced":"2026-07-15","status":"APPROVED","facts":[{"label":"Approved","value":"15 July 2026 by the Union Cabinet","source_ids":["SRC-000975","SRC-000976"]},{"label":"Budget outlay","value":"₹1,27,500 crore (₹1.275 trillion)","source_ids":["SRC-000975","SRC-000976"]},{"label":"Scope","value":"Design, machines and materials, additional fabs, advanced packaging, R&D, talent (per coverage)","source_ids":["SRC-000975"]}],"source_ids":["SRC-000975","SRC-000976"],"facility_ids":[],"facility_basis":"Facility record names this programme in its scheme / incentive field","batch":"Batch 11"},{"id":"PG03","name":"US CHIPS and Science Act","country":"United States","jurisdiction":"United States (federal)","type":"INCENTIVE","announced":"2022-08","status":"ENACTED","facts":[{"label":"Signed into law","value":"August 2022","source_ids":["SRC-000996"]},{"label":"Semiconductor funding","value":"About $52 billion within a $280 billion act (per report title)","source_ids":["SRC-000996"]}],"source_ids":["SRC-000996"],"facility_ids":["FAC-000014","FAC-000019","FAC-000022","FAC-000023","FAC-000025"],"facility_basis":"Facility record names this programme in its scheme / incentive field","batch":"Batch 13"},{"id":"PG04","name":"European Chips Act","country":"European Union","jurisdiction":"European Union","type":"INCENTIVE","announced":"2023-09-21","status":"IN_FORCE","facts":[{"label":"Entered into force","value":"21 September 2023","source_ids":["SRC-000998"]},{"label":"Investment expected","value":"More than €43 billion of public and private investment mobilised (per coverage)","source_ids":["SRC-000997"]}],"source_ids":["SRC-000998","SRC-000997"],"facility_ids":["FAC-000017","FAC-000021"],"facility_basis":"Facility record names this programme in its scheme / incentive field","batch":"Batch 13"},{"id":"PG05","name":"US export controls on advanced computing and semiconductor manufacturing equipment (BIS)","country":"United States","jurisdiction":"United States (federal)","type":"EXPORT_CONTROL","announced":"2022-10-07","status":"IN_FORCE","facts":[{"label":"Initial interim final rule","value":"7 October 2022 (per legal analysis)","source_ids":["SRC-000999"]},{"label":"Expanded rules","value":"Published 25 October 2023, effective 17 November 2023: advanced computing and semiconductor manufacturing equipment (per legal analysis)","source_ids":["SRC-000999"]},{"label":"Official information page","value":"BIS public information page on these controls","source_ids":["SRC-001000"]}],"source_ids":["SRC-000999","SRC-001000"],"facility_ids":[],"facility_basis":"Facility record names this programme in its scheme / incentive field","batch":"Batch 13"},{"id":"PG06","name":"Japan AI and semiconductor support framework","country":"Japan","jurisdiction":"Japan","type":"INCENTIVE","announced":"2024-11","status":"ANNOUNCED","facts":[{"label":"Public support","value":"¥10 trillion (about $65 billion) by 2030 (per report title and summary)","source_ids":["SRC-001001"]}],"source_ids":["SRC-001001"],"facility_ids":["FAC-000018"],"facility_basis":"Facility record names this programme in its scheme / incentive field","batch":"Batch 13"},{"id":"PG07","name":"Korea K-Chips Act and semiconductor support package","country":"South Korea","jurisdiction":"South Korea","type":"TAX_CREDIT","announced":"2025-02-27","status":"ENACTED","facts":[{"label":"K-Chips Act amendment","value":"Facility-investment tax credit raised by 5 percentage points (to 20 % large / 30 % SME, per coverage); passed 27 Feb 2025","source_ids":["SRC-001002"]},{"label":"Support package","value":"33 trillion won (about $23 billion) (per report title)","source_ids":["SRC-001003"]}],"source_ids":["SRC-001002","SRC-001003"],"facility_ids":[],"facility_basis":"Facility record names this programme in its scheme / incentive field","batch":"Batch 13"}]},"companies":[{"id":"CMP-000001","legacy_id":"C0001","entity_type":"company","name":"ASML Holding","canonical_name":"ASML Holding","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Netherlands","country_id":"CTY-NL","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.asml.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"EUV (incl. High-NA EXE) and DUV lithography","primary_equipment":"EUV; DUV","equipment_ids":["EQP-A01.01","EQP-A01.02","EQP-A01.03","EQP-A24"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"GLOBAL_LEADER","market_class_basis":"Ranked: S0004 top-5 2025","revenue":{"usd_m":36870.5,"fiscal_year":"FY2025 (Jan-Dec 2025)","reported":"EUR 32,667.3","basis":"Reported (converted to USD)"},"semiconductor_revenue":null,"india":{"summary":"Partnership (MoU)","has_presence":true,"records":[{"type":"Partnership (MoU)","facility":"Tata Electronics Dholera fab","location":"Dholera, Gujarat","scope":"Lithography deployment & support","technology":"EUV/DUV lithography","opportunity":"Service/support localisation around Dholera","status":"SIGNED 2026-05","confidence":"HIGH","source_ids":["SRC-000024","SRC-000023"]}]},"presence":{"china":null,"japan":"Customer relationship","korea":"Customer relationship","taiwan":null},"startup":null,"financials":[{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Revenue","currency":"EUR","value":32667.3,"usd_m":36870.5,"value_type":"REPORTED","source_ids":["SRC-000142"],"note":null},{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Net income","currency":"EUR","value":9609,"usd_m":10845.4,"value_type":"REPORTED","source_ids":["SRC-000142"],"note":null},{"fiscal_year":"FY2026 (Jan-Dec 2026)","metric":"Revenue guidance","currency":"EUR","value":"36000-40000","usd_m":null,"value_type":"GUIDANCE","source_ids":["SRC-000143"],"note":"Company guidance range"}],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":"Top-5 WFE vendor 2025 (S0004); EXE:5200B at SK hynix M16 (S0133)","source_ids":["SRC-000004","SRC-000024","SRC-000133","SRC-000142","SRC-000143","SRC-000190","SRC-000026"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-07","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":75,"filled":12,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":2,"total":3,"missing":["Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":1,"total":1,"missing":[]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-A01.03","EQP-A24"],"resolution_keys":[{"alias":"ASML","basis":"Name without legal suffix"}]},{"id":"CMP-000002","legacy_id":"C0002","entity_type":"company","name":"Applied Materials","canonical_name":"Applied Materials","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":"Public","exchange":"NASDAQ","ticker":"AMAT","website":"https://www.appliedmaterials.com","founded":null,"employees":"~36,500 (26 Oct 2025)","ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Deposition (Precision Selective Nitride PECVD, Trillium ALD), etch; hybrid bonding (Kinex with BESI)","primary_equipment":"Deposition; PECVD; ALD; Etching; Hybrid Bonding","equipment_ids":["EQP-A09","EQP-A09.02","EQP-A09.06","EQP-A08","EQP-C17","EQP-A08.01","EQP-A09.05","EQP-A24","EQP-A09.07","EQP-A19","EQP-A10","EQP-A09.10"],"component_class_ids":[],"candidate_categories":"A19;A10;A21;A26","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"GLOBAL_LEADER","market_class_basis":"Ranked: S0004 top-5 2025","revenue":{"usd_m":28370,"fiscal_year":"FY2025 (Oct 2024-Oct 2025)","reported":"USD 28,370.0","basis":"Reported (converted to USD)"},"semiconductor_revenue":"USD 20,798 m (FY2025 (Oct 2024-Oct 2025), S0139)","india":{"summary":"R&D / Engineering","has_presence":true,"records":[{"type":"R&D / Engineering","facility":">7,000 employees; 140-acre research park","location":null,"scope":"WFE engineering","technology":"Process tools (imported)","opportunity":"USD 5B plan; India supply chain to grow ~10x (per company)","status":"OPERATING + ANNOUNCED","confidence":"MEDIUM","source_ids":["SRC-000035","SRC-000036","SRC-000337"]}]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":"Customer relationship"},"startup":null,"financials":[{"fiscal_year":"FY2025 (Oct 2024-Oct 2025)","metric":"Revenue","currency":"USD","value":28370,"usd_m":28370,"value_type":"REPORTED","source_ids":["SRC-000138"],"note":"Record annual revenue $28.37B, +4%"},{"fiscal_year":"FY2025 (Oct 2024-Oct 2025)","metric":"Operating income","currency":"USD","value":8289,"usd_m":8289,"value_type":"REPORTED","source_ids":["SRC-000139"],"note":null},{"fiscal_year":"FY2025 (Oct 2024-Oct 2025)","metric":"Net income","currency":"USD","value":6998,"usd_m":6998,"value_type":"REPORTED","source_ids":["SRC-000139"],"note":null},{"fiscal_year":"FY2025 (Oct 2024-Oct 2025)","metric":"Segment revenue - Semiconductor Systems","currency":"USD","value":20798,"usd_m":20798,"value_type":"REPORTED","source_ids":["SRC-000139"],"note":null},{"fiscal_year":"FY2025 (Oct 2024-Oct 2025)","metric":"Segment revenue - Applied Global Services","currency":"USD","value":6385,"usd_m":6385,"value_type":"REPORTED","source_ids":["SRC-000139"],"note":null}],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":"89% of FY2025 revenue outside US; two customers 19% and 15% of FY2025 revenue (S0139)","source_ids":["SRC-000004","SRC-000124","SRC-000138","SRC-000139","SRC-000035","SRC-000036","SRC-000046"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-09-18","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":81,"filled":13,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":3,"total":3,"missing":[]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":1,"total":1,"missing":[]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-A08.01","EQP-A09.05","EQP-A24","EQP-A09.07","EQP-A19","EQP-A10","EQP-A09.10"],"resolution_keys":[{"alias":"AMAT","basis":"Stock ticker (NASDAQ)"}]},{"id":"CMP-000003","legacy_id":"C0003","entity_type":"company","name":"Lam Research","canonical_name":"Lam Research","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":"Public","exchange":"NASDAQ","ticker":"LRCX","website":"https://www.lamresearch.com","founded":null,"employees":"~23,300 (4 Aug 2026)","ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Etch and deposition; installed base >100,000 chambers","primary_equipment":"Etching; Deposition","equipment_ids":["EQP-A08","EQP-A09","EQP-A09.04","EQP-A17","EQP-A09.06","EQP-A09.02","EQP-A08.02","EQP-A18","EQP-A07"],"component_class_ids":[],"candidate_categories":"A04;A18","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"GLOBAL_LEADER","market_class_basis":"Ranked: S0004 top-5 2025","revenue":{"usd_m":23200,"fiscal_year":"FY2026 (Jul 2025-Jun 2026)","reported":"USD 23,200.0","basis":"Reported (converted to USD)"},"semiconductor_revenue":null,"india":{"summary":"Manufacturing (planned); R&D / Engineering","has_presence":true,"records":[{"type":"R&D / Engineering","facility":"Engineering operation + advanced semiconductor R&D laboratory","location":"Bengaluru","scope":"Etch / deposition engineering","technology":"Process tools and chambers (imported)","opportunity":"Planned silicon-component manufacturing; stated intent to expand India supplier base","status":"OPERATING","confidence":"LOW","source_ids":["SRC-000033","SRC-000215"]},{"type":"Manufacturing (planned)","facility":"First silicon component manufacturing facility","location":null,"scope":"Silicon components","technology":"Component process know-how","opportunity":"INR 10,000 crore investment announced 2026-09-16","status":"ANNOUNCED","confidence":"MEDIUM","source_ids":["SRC-000032","SRC-000033"]}]},"presence":{"china":null,"japan":null,"korea":"Customer relationship","taiwan":"Customer relationship"},"startup":null,"financials":[{"fiscal_year":"FY2026 (Jul 2025-Jun 2026)","metric":"Revenue","currency":"USD","value":23200,"usd_m":23200,"value_type":"REPORTED","source_ids":["SRC-000137"],"note":"Stated as 'record $23.2 billion', +26% (rounded as stated)"}],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000004","SRC-000136","SRC-000137","SRC-000032","SRC-000033","SRC-000215"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-09-16","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":81,"filled":13,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":3,"total":3,"missing":[]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":1,"total":1,"missing":[]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-A09.04","EQP-A17","EQP-A09.06","EQP-A09.02","EQP-A08.02","EQP-A18","EQP-A07"],"resolution_keys":[{"alias":"LRCX","basis":"Stock ticker (NASDAQ)"}]},{"id":"CMP-000004","legacy_id":"C0004","entity_type":"company","name":"Tokyo Electron (TEL)","canonical_name":"Tokyo Electron","aliases":["TEL"],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"Tokyo","region":"Asia-Pacific"},"ownership":"Public","exchange":"TSE","ticker":"8035","website":"https://www.tel.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Wafer fab equipment (sub-categories not captured in Batch-1 sources)","primary_equipment":"Wafer Fab / Front-End Equipment","equipment_ids":["EQP-A","EQP-A09","EQP-A08","EQP-A02","EQP-A11","EQP-A04","EQP-A06","EQP-A15","EQP-C18"],"component_class_ids":[],"candidate_categories":"A02;A03;A08;A09;A04;A33","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"GLOBAL_LEADER","market_class_basis":"Ranked: S0004 top-5 2025","revenue":{"usd_m":16330.3,"fiscal_year":"FY3/26 (Apr 2025-Mar 2026)","reported":"JPY 2,443,533.0","basis":"Reported (converted to USD)"},"semiconductor_revenue":null,"india":{"summary":"Partnership (MoU)","has_presence":true,"records":[{"type":"Partnership (MoU)","facility":"Tata Electronics Dholera fab + Jagiroad OSAT","location":"Gujarat; Assam","scope":"Equipment & infrastructure","technology":"Front-end and back-end tools","opportunity":"Service/support localisation","status":"SIGNED 2024-09-10","confidence":"HIGH","source_ids":["SRC-000025"]}]},"presence":{"china":null,"japan":"HQ","korea":null,"taiwan":"Customer relationship"},"startup":null,"financials":[{"fiscal_year":"FY3/26 (Apr 2025-Mar 2026)","metric":"Revenue","currency":"JPY","value":2443533,"usd_m":16330.3,"value_type":"REPORTED","source_ids":["SRC-000134"],"note":"APPROX_FX"},{"fiscal_year":"FY3/26 (Apr 2025-Mar 2026)","metric":"Operating income","currency":"JPY","value":624936,"usd_m":4176.5,"value_type":"REPORTED","source_ids":["SRC-000134"],"note":"APPROX_FX"},{"fiscal_year":"FY3/26 (Apr 2025-Mar 2026)","metric":"Net income","currency":"JPY","value":574454,"usd_m":3839.1,"value_type":"REPORTED","source_ids":["SRC-000134"],"note":"APPROX_FX"},{"fiscal_year":"FY3/26 (Apr 2025-Mar 2026)","metric":"China share of sales (%)","currency":"%","value":34.1,"usd_m":null,"value_type":"REPORTED","source_ids":["SRC-000135"],"note":null}],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000004","SRC-000134","SRC-000135","SRC-000025","SRC-000023"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-07","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":81,"filled":13,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":2,"total":3,"missing":["Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":1,"total":1,"missing":[]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-A09","EQP-A08","EQP-A02","EQP-A11","EQP-A04","EQP-A06","EQP-A15","EQP-C18"],"resolution_keys":[{"alias":"TEL","basis":"Recorded alias"},{"alias":"Tokyo Electron","basis":"Name without parenthetical"},{"alias":"8035","basis":"Stock ticker (TSE)"}]},{"id":"CMP-000005","legacy_id":"C0005","entity_type":"company","name":"KLA Corporation","canonical_name":"KLA Corporation","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":"Public","exchange":"NASDAQ","ticker":"KLAC","website":"https://www.kla.com","founded":null,"employees":"~17,000 regular FT (30 Jun 2026)","ceo":null,"parent_company":null,"subsidiaries_brands":"SPTS Technologies","description":"Semiconductor process control (inspection/metrology); SPTS plasma etch & Mosaic plasma dicing","primary_equipment":"Wafer Inspection; Defect Inspection; Metrology; Plasma Dicing","equipment_ids":["EQP-A21","EQP-A22","EQP-A25","EQP-C01.04","EQP-A30","EQP-C34","EQP-A08.05"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"GLOBAL_LEADER","market_class_basis":"Ranked: S0004 top-5 2025","revenue":{"usd_m":13579.5,"fiscal_year":"FY2026 (Jul 2025-Jun 2026)","reported":"USD 13,579.5","basis":"Reported (converted to USD)"},"semiconductor_revenue":"USD 12,245 m (FY2026 (Jul 2025-Jun 2026), S0140)","india":{"summary":"R&D","has_presence":true,"records":[{"type":"R&D","facility":"Chennai R&D and innovation hub","location":"Chennai","scope":"Process-control R&D","technology":"Inspection/metrology tools (imported)","opportunity":"Rs 300 crore / USD 33M R&D facility","status":"OPENED 2026-01","confidence":"HIGH","source_ids":["SRC-000202","SRC-000203","SRC-000204"]}]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":"Customer relationship"},"startup":null,"financials":[{"fiscal_year":"FY2026 (Jul 2025-Jun 2026)","metric":"Revenue","currency":"USD","value":13579.5,"usd_m":13579.5,"value_type":"REPORTED","source_ids":["SRC-000140"],"note":"13,579,476 USD thousands"},{"fiscal_year":"FY2026 (Jul 2025-Jun 2026)","metric":"Segment revenue - Semiconductor Process Control","currency":"USD","value":12244.7,"usd_m":12244.7,"value_type":"REPORTED","source_ids":["SRC-000140"],"note":null},{"fiscal_year":"FY2026 (Jul 2025-Jun 2026)","metric":"R&D expense","currency":"USD","value":1530,"usd_m":1530,"value_type":"REPORTED","source_ids":["SRC-000141"],"note":"'more than 12.5% to $1.53 billion'"},{"fiscal_year":"FY2026 (Jul 2025-Jun 2026)","metric":"China share of revenue (%)","currency":"%","value":30,"usd_m":null,"value_type":"REPORTED","source_ids":["SRC-000141"],"note":null}],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":"R&D $1.53B FY2026 (S0141); TSMC >10% of revenue FY24-26","source_ids":["SRC-000004","SRC-000140","SRC-000141","SRC-000202","SRC-000203","SRC-000204","SRC-000235"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-09","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":81,"filled":13,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":3,"total":3,"missing":[]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":1,"total":1,"missing":[]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-A30","EQP-C34","EQP-A08.05"],"resolution_keys":[{"alias":"KLA","basis":"Name without legal suffix"},{"alias":"KLAC","basis":"Stock ticker (NASDAQ)"}]},{"id":"CMP-000006","legacy_id":"C0006","entity_type":"company","name":"ASM International (ASMI)","canonical_name":"ASM International","aliases":["ASMI"],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Netherlands","country_id":"CTY-NL","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.asm.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Front-end deposition (sub-categories not captured in Batch-1 sources)","primary_equipment":"Wafer Fab / Front-End Equipment","equipment_ids":["EQP-A","EQP-A09.10"],"component_class_ids":[],"candidate_categories":"A09.06;A09.10;A09.02","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"TIER_2","market_class_basis":"Company revenue USD 3,582 m (FY2025 (Jan-Dec 2025), S0153)","revenue":{"usd_m":3581.5,"fiscal_year":"FY2025 (Jan-Dec 2025)","reported":"EUR 3,173.2","basis":"Reported (converted to USD)"},"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Revenue","currency":"EUR","value":3173.2,"usd_m":3581.5,"value_type":"REPORTED","source_ids":["SRC-000153"],"note":"Corroborated by S0006 (Tier 4)"}],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000153"],"discovery_keywords":[],"freshness":"Needs Review","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-03-03","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":2,"total":3,"missing":["Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-A09.10"],"resolution_keys":[{"alias":"ASMI","basis":"Recorded alias"},{"alias":"ASM International","basis":"Name without parenthetical"}]},{"id":"CMP-000007","legacy_id":"C0007","entity_type":"company","name":"SCREEN Holdings","canonical_name":"SCREEN Holdings","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"Kyoto","region":"Asia-Pacific"},"ownership":"Public","exchange":"TSE","ticker":"7735","website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Semiconductor production equipment; laser annealing via LASSE (LT-3100)","primary_equipment":"Wafer Fab / Front-End Equipment; Laser Annealing","equipment_ids":["EQP-A","EQP-A14","EQP-A04","EQP-A20","EQP-A05","EQP-A03","EQP-A13","EQP-A01.08"],"component_class_ids":[],"candidate_categories":"A04;A05;A02","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"TIER_2","market_class_basis":"Company revenue USD 4,048 m (FY3/26 (Apr 2025-Mar 2026), S0146)","revenue":{"usd_m":4047.9,"fiscal_year":"FY3/26 (Apr 2025-Mar 2026)","reported":"JPY 605,700.0","basis":"Reported (converted to USD)"},"semiconductor_revenue":"USD 3,248 m (FY3/26 (Apr 2025-Mar 2026), S0147)","india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":"HQ","korea":null,"taiwan":"Customer relationship"},"startup":null,"financials":[{"fiscal_year":"FY3/26 (Apr 2025-Mar 2026)","metric":"Revenue","currency":"JPY","value":605700,"usd_m":4047.9,"value_type":"REPORTED","source_ids":["SRC-000146"],"note":"APPROX_FX; -3.1%"},{"fiscal_year":"FY3/26 (Apr 2025-Mar 2026)","metric":"Operating income","currency":"JPY","value":122500,"usd_m":818.7,"value_type":"REPORTED","source_ids":["SRC-000146"],"note":"APPROX_FX; -9.7%"},{"fiscal_year":"FY3/26 (Apr 2025-Mar 2026)","metric":"Segment revenue - Semiconductor Production Equipment","currency":"JPY","value":485982,"usd_m":3247.8,"value_type":"REPORTED","source_ids":["SRC-000147"],"note":"APPROX_FX; Tier 4 - corroboration pending"}],"verification":"VERIFIED","confidence":{"score":65,"level":"MEDIUM"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000146","SRC-000147","SRC-000091","SRC-000092"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-09","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":2,"total":3,"missing":["Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-A04","EQP-A20","EQP-A05","EQP-A03","EQP-A13","EQP-A01.08"],"resolution_keys":[{"alias":"SCREEN","basis":"Name without legal suffix"},{"alias":"7735","basis":"Stock ticker (TSE)"}]},{"id":"CMP-000008","legacy_id":"C0008","entity_type":"company","name":"Advantest","canonical_name":"Advantest","aliases":[],"former_names":[],"company_type":"Test & probe","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"Tokyo","region":"Asia-Pacific"},"ownership":"Public","exchange":"TSE","ticker":"6857","website":"https://www.advantest.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Automatic test equipment (SoC/memory)","primary_equipment":"IC Test; Electrical Wafer Testing","equipment_ids":["EQP-C40","EQP-A32"],"component_class_ids":[],"candidate_categories":"C39;A33","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"GLOBAL_LEADER","market_class_basis":"Company revenue USD 7,542 m (FY3/26 (Apr 2025-Mar 2026), S0144)","revenue":{"usd_m":7542.5,"fiscal_year":"FY3/26 (Apr 2025-Mar 2026)","reported":"JPY 1,128,600.0","basis":"Reported (converted to USD)"},"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":"HQ","korea":null,"taiwan":null},"startup":null,"financials":[{"fiscal_year":"FY3/26 (Apr 2025-Mar 2026)","metric":"Revenue","currency":"JPY","value":1128600,"usd_m":7542.5,"value_type":"REPORTED","source_ids":["SRC-000144"],"note":"APPROX_FX; +44.7%"},{"fiscal_year":"FY3/26 (Apr 2025-Mar 2026)","metric":"Operating income","currency":"JPY","value":499100,"usd_m":3335.5,"value_type":"REPORTED","source_ids":["SRC-000144"],"note":"APPROX_FX"},{"fiscal_year":"FY3/26 (Apr 2025-Mar 2026)","metric":"Net income","currency":"JPY","value":375400,"usd_m":2508.8,"value_type":"REPORTED","source_ids":["SRC-000144"],"note":"APPROX_FX"}],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000144","SRC-000302"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-06-17","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":75,"filled":12,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":2,"total":3,"missing":["Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"6857","basis":"Stock ticker (TSE)"}]},{"id":"CMP-000009","legacy_id":"C0009","entity_type":"company","name":"Teradyne","canonical_name":"Teradyne","aliases":[],"former_names":[],"company_type":"Test & probe","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":"Public","exchange":"NASDAQ","ticker":"TER","website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Automatic test equipment; photonic IC test (Quantifi Photonics)","primary_equipment":"IC Test","equipment_ids":["EQP-C40"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"TIER_2","market_class_basis":"Company revenue USD 3,200 m (FY2025 (Jan-Dec 2025), S0151)","revenue":{"usd_m":3200,"fiscal_year":"FY2025 (Jan-Dec 2025)","reported":"USD 3,200.0","basis":"Reported (converted to USD)"},"semiconductor_revenue":null,"india":{"summary":"Office","has_presence":true,"records":[{"type":"Office","facility":"New Bengaluru office","location":"Bengaluru","scope":"ATE","technology":"ATE","opportunity":null,"status":"OPENED (2026)","confidence":"LOW","source_ids":["SRC-000214"]}]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Revenue","currency":"USD","value":3200,"usd_m":3200,"value_type":"REPORTED","source_ids":["SRC-000151"],"note":"Stated '$3.2 billion'; S0152 (Tier 3) $3.19B"}],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":"New Bengaluru office (S0214)","source_ids":["SRC-000151","SRC-000152","SRC-000128","SRC-000129","SRC-000214","SRC-000302"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-09-16","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":69,"filled":11,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":2,"total":3,"missing":["Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":1,"total":1,"missing":[]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"TER","basis":"Stock ticker (NASDAQ)"}]},{"id":"CMP-000010","legacy_id":"C0010","entity_type":"company","name":"DISCO Corporation","canonical_name":"DISCO Corporation","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"Tokyo","region":"Asia-Pacific"},"ownership":"Public","exchange":"TSE","ticker":"6146","website":"https://www.disco.co.jp","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Dicing (blade, laser ablation, stealth via Hamamatsu SD engine), KABRA laser ingot slicing (SiC/GaN)","primary_equipment":"Mechanical Dicing; Laser Dicing; Stealth Dicing; SiC wafer processing","equipment_ids":["EQP-C01.01","EQP-C01.02","EQP-C01.03","EQP-F01","EQP-C04","EQP-C03","EQP-C06"],"component_class_ids":[],"candidate_categories":"C03;C04;C05","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"TIER_2","market_class_basis":"Company revenue USD 2,919 m (FY3/26 (Apr 2025-Mar 2026), S0145)","revenue":{"usd_m":2919.2,"fiscal_year":"FY3/26 (Apr 2025-Mar 2026)","reported":"JPY 436,800.0","basis":"Reported (converted to USD)"},"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":"HQ","korea":null,"taiwan":"Customer relationship"},"startup":null,"financials":[{"fiscal_year":"FY3/26 (Apr 2025-Mar 2026)","metric":"Revenue","currency":"JPY","value":436800,"usd_m":2919.2,"value_type":"REPORTED","source_ids":["SRC-000145"],"note":"APPROX_FX; Tier-3 source; +11.1%"},{"fiscal_year":"FY3/26 (Apr 2025-Mar 2026)","metric":"Operating income","currency":"JPY","value":184900,"usd_m":1235.7,"value_type":"REPORTED","source_ids":["SRC-000145"],"note":"APPROX_FX; Tier 3"},{"fiscal_year":"FY3/26 (Apr 2025-Mar 2026)","metric":"Net income","currency":"JPY","value":135500,"usd_m":905.6,"value_type":"REPORTED","source_ids":["SRC-000145"],"note":"APPROX_FX; Tier 3"}],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":"Product list page client-rendered - DATA_NOT_ACCESSIBLE (S0052)","source_ids":["SRC-000052","SRC-000053","SRC-000054","SRC-000145","SRC-000220","SRC-000221","SRC-000222","SRC-000179"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-06-16","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":75,"filled":12,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":2,"total":3,"missing":["Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-C04","EQP-C03","EQP-C06"],"resolution_keys":[{"alias":"DISCO","basis":"Name without legal suffix"},{"alias":"6146","basis":"Stock ticker (TSE)"}]},{"id":"CMP-000011","legacy_id":"C0011","entity_type":"company","name":"Hamamatsu Photonics","canonical_name":"Hamamatsu Photonics","aliases":[],"former_names":[],"company_type":"Laser source","supplier_types":["Laser Supplier","Component Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"Hamamatsu","region":"Asia-Pacific"},"ownership":"Public","exchange":"TSE","ticker":"6965","website":"https://www.hamamatsu.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":"NKT Photonics","description":"Stealth Dicing (SD) engine - modular laser & optics licensed/supplied to dicing OEMs; photonics components","primary_equipment":"Stealth Dicing","equipment_ids":["EQP-C01.03"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"TIER_2","market_class_basis":"Company revenue USD 1,417 m (FY9/25 (Oct 2024-Sep 2025), S0165)","revenue":{"usd_m":1417.2,"fiscal_year":"FY9/25 (Oct 2024-Sep 2025)","reported":"JPY 212,051.0","basis":"Reported (converted to USD)"},"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":"HQ","korea":null,"taiwan":null},"startup":null,"financials":[{"fiscal_year":"FY9/25 (Oct 2024-Sep 2025)","metric":"Revenue","currency":"JPY","value":212051,"usd_m":1417.2,"value_type":"REPORTED","source_ids":["SRC-000165"],"note":"APPROX_FX"}],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":"SD patent family (US6992026B2) expired","source_ids":["SRC-000053","SRC-000054","SRC-000055","SRC-000056","SRC-000165","SRC-000166","SRC-000194"],"discovery_keywords":[],"freshness":"Needs Review","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-11-07","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":75,"filled":12,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":2,"total":3,"missing":["Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"6965","basis":"Stock ticker (TSE)"}]},{"id":"CMP-000012","legacy_id":"C0012","entity_type":"company","name":"Tokyo Seimitsu (ACCRETECH)","canonical_name":"Tokyo Seimitsu","aliases":["ACCRETECH"],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.accretech.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":"ACCRETECH (brand)","description":"Blade and laser dicing (IR internal-modification ML series; UV AL3000)","primary_equipment":"Mechanical Dicing; Laser Dicing; Stealth Dicing","equipment_ids":["EQP-C01.01","EQP-C01.02","EQP-C01.03","EQP-C04","EQP-C03","EQP-C02","EQP-K06"],"component_class_ids":[],"candidate_categories":"A33;C03","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":"HQ","korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000097","SRC-000098","SRC-000099","SRC-000100","SRC-000101","SRC-000102","SRC-000103","SRC-000104","SRC-000105","SRC-000106"],"discovery_keywords":[],"freshness":"Needs Review","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-10","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-C04","EQP-C03","EQP-C02","EQP-K06"],"resolution_keys":[{"alias":"ACCRETECH","basis":"Recorded alias"},{"alias":"Tokyo Seimitsu","basis":"Name without parenthetical"}]},{"id":"CMP-000013","legacy_id":"C0013","entity_type":"company","name":"Canon Inc.","canonical_name":"Canon Inc.","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"Tokyo","region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://global.canon","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Nanoimprint lithography (FPA-1200NZ2C)","primary_equipment":"Nanoimprint Lithography","equipment_ids":["EQP-A01.07","EQP-A01.05"],"component_class_ids":[],"candidate_categories":"A01.04;A01.05","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":"HQ","korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":"Semiconductor litho is one division of a diversified group","source_ids":["SRC-000192","SRC-000193"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Headquarters country (source)","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2024-10-01","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":69,"filled":11,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-A01.05"],"resolution_keys":[{"alias":"Canon","basis":"Name without legal suffix"}]},{"id":"CMP-000014","legacy_id":"C0014","entity_type":"company","name":"Veeco Instruments","canonical_name":"Veeco Instruments","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":"Public","exchange":"NASDAQ","ticker":"VECO","website":"https://www.veeco.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Laser spike annealing (LSA101/201), nanosecond annealing (NSA500)","primary_equipment":"Laser Annealing; Annealing","equipment_ids":["EQP-A14","EQP-A13","EQP-G01"],"component_class_ids":[],"candidate_categories":"A09.11;A09.01","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":"Merger with Axcelis pending (S0121/S0122)","source_ids":["SRC-000087","SRC-000088","SRC-000089","SRC-000090","SRC-000121","SRC-000122","SRC-000123"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-08","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-G01"],"resolution_keys":[{"alias":"VECO","basis":"Stock ticker (NASDAQ)"}]},{"id":"CMP-000015","legacy_id":"C0015","entity_type":"company","name":"Axcelis Technologies","canonical_name":"Axcelis Technologies","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":"Public","exchange":"NASDAQ","ticker":"ACLS","website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Ion implantation","primary_equipment":"Ion Implantation","equipment_ids":["EQP-A10"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000121","SRC-000122"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-08","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"ACLS","basis":"Stock ticker (NASDAQ)"}]},{"id":"CMP-000016","legacy_id":"C0016","entity_type":"company","name":"Onto Innovation","canonical_name":"Onto Innovation","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":"Public","exchange":"NYSE","ticker":"ONTO","website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Metrology/inspection (Iris film metrology, 3D bump); Firefly lithography for panel packaging","primary_equipment":"Metrology; Wafer Inspection; Lithography","equipment_ids":["EQP-A25","EQP-A21","EQP-A01","EQP-A28","EQP-C36"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"TIER_2","market_class_basis":"Company revenue USD 1,005 m (FY2025 (Jan-Dec 2025), S0154)","revenue":{"usd_m":1005,"fiscal_year":"FY2025 (Jan-Dec 2025)","reported":"USD 1,005.0","basis":"Reported (converted to USD)"},"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Revenue","currency":"USD","value":1005,"usd_m":1005,"value_type":"REPORTED","source_ids":["SRC-000154"],"note":null},{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Net income","currency":"USD","value":136.8,"usd_m":136.8,"value_type":"REPORTED","source_ids":["SRC-000155"],"note":"Tier 3"}],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":"HBM volume purchase agreement >$240M (S0154)","source_ids":["SRC-000154","SRC-000155","SRC-000081","SRC-000130","SRC-000131","SRC-000196"],"discovery_keywords":[],"freshness":"Needs Review","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-02-19","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":2,"total":3,"missing":["Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-A28","EQP-C36"],"resolution_keys":[{"alias":"ONTO","basis":"Stock ticker (NYSE)"}]},{"id":"CMP-000017","legacy_id":"C0017","entity_type":"company","name":"Nova Ltd.","canonical_name":"Nova Ltd.","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Israel","country_id":"CTY-IL","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Middle East"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.novami.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Dimensional and materials metrology","primary_equipment":"Metrology; Film Thickness Measurement","equipment_ids":["EQP-A25","EQP-A28"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"TIER_2","market_class_basis":"Company revenue USD 881 m (FY2025 (Jan-Dec 2025), S0156)","revenue":{"usd_m":880.6,"fiscal_year":"FY2025 (Jan-Dec 2025)","reported":"USD 880.6","basis":"Reported (converted to USD)"},"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Revenue","currency":"USD","value":880.6,"usd_m":880.6,"value_type":"REPORTED","source_ids":["SRC-000156"],"note":"+31%"},{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Net income (GAAP)","currency":"USD","value":259.2,"usd_m":259.2,"value_type":"REPORTED","source_ids":["SRC-000156"],"note":null}],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000156","SRC-000132"],"discovery_keywords":[],"freshness":"Needs Review","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-02","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":2,"total":3,"missing":["Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"Nova","basis":"Name without legal suffix"}]},{"id":"CMP-000018","legacy_id":"C0018","entity_type":"company","name":"Camtek","canonical_name":"Camtek","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Israel","country_id":"CTY-IL","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Middle East"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.camtek.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Inspection and metrology for advanced packaging","primary_equipment":"Wafer Inspection; Optical Inspection","equipment_ids":["EQP-A21","EQP-A23","EQP-A30"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"TIER_2","market_class_basis":"Company revenue USD 496 m (FY2025 (Jan-Dec 2025), S0157)","revenue":{"usd_m":496.1,"fiscal_year":"FY2025 (Jan-Dec 2025)","reported":"USD 496.1","basis":"Reported (converted to USD)"},"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":"Customer relationship"},"startup":null,"financials":[{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Revenue","currency":"USD","value":496.1,"usd_m":496.1,"value_type":"REPORTED","source_ids":["SRC-000157"],"note":"+16%"}],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000157","SRC-000179"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-06-16","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":69,"filled":11,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":2,"total":3,"missing":["Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-A30"],"resolution_keys":[]},{"id":"CMP-000019","legacy_id":"C0019","entity_type":"company","name":"Semilab","canonical_name":"Semilab","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Hungary","country_id":"CTY-HU","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"Budapest","region":"Europe"},"ownership":"Private","exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Metrology (selected product lines sold to Onto)","primary_equipment":"Metrology","equipment_ids":["EQP-A25"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000130","SRC-000131"],"discovery_keywords":[],"freshness":"Needs Review","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-02-19","review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000020","legacy_id":"C0020","entity_type":"company","name":"Nikon Corporation","canonical_name":"Nikon Corporation","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"Tokyo","region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.nikon.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"ArF immersion scanners (NSR-S636E, NSR-S625E)","primary_equipment":"ArF; DUV","equipment_ids":["EQP-A01.03","EQP-A01.02"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":"HQ","korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000317","SRC-000318"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Headquarters country (source)","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2023-12-06","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":69,"filled":11,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"Nikon","basis":"Name without legal suffix"}]},{"id":"CMP-000021","legacy_id":"C0021","entity_type":"company","name":"Hitachi High-Tech","canonical_name":"Hitachi High-Tech","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"Tokyo","region":"Asia-Pacific"},"ownership":"Subsidiary","exchange":null,"ticker":null,"website":"https://www.hitachi-hightech.com","founded":null,"employees":null,"ceo":null,"parent_company":"Hitachi, Ltd.","subsidiaries_brands":null,"description":"CD-SEM and defect inspection","primary_equipment":"CD-SEM; Defect Inspection","equipment_ids":["EQP-A26","EQP-A22","EQP-A24"],"component_class_ids":[],"candidate_categories":"A08","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":"HQ","korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000319"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-A24"],"resolution_keys":[]},{"id":"CMP-000022","legacy_id":"C0022","entity_type":"company","name":"Kokusai Electric","canonical_name":"Kokusai Electric","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"Tokyo","region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.kokusai-electric.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Batch deposition / thermal processing","primary_equipment":"Deposition","equipment_ids":["EQP-A09","EQP-A09.06","EQP-A13"],"component_class_ids":[],"candidate_categories":"A09.06;A11;A16","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":"HQ","korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000320","SRC-000339"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":69,"filled":11,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-A09.06","EQP-A13"],"resolution_keys":[]},{"id":"CMP-000023","legacy_id":"C0023","entity_type":"company","name":"Ebara Corporation","canonical_name":"Ebara Corporation","aliases":[],"former_names":[],"company_type":"Vacuum/abatement","supplier_types":["Vacuum Supplier","Subsystem Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"Tokyo","region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.ebara.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Dry vacuum pumps, plasma abatement (Precision Machinery Company)","primary_equipment":"Vacuum Systems; Abatement Systems","equipment_ids":["EQP-A42","EQP-A45","EQP-A19"],"component_class_ids":[],"candidate_categories":"A19","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":"HQ","korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000321"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-A19"],"resolution_keys":[{"alias":"Ebara","basis":"Name without legal suffix"}]},{"id":"CMP-000024","legacy_id":"C0024","entity_type":"company","name":"Lasertec","canonical_name":"Lasertec","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"Yokohama","region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.lasertec.co.jp","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Actinic EUV patterned mask inspection (ACTIS A150/A300/A200HiT)","primary_equipment":"Mask Inspection; Reticle Inspection","equipment_ids":["EQP-B02","EQP-B03"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":"HQ","korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000322"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000025","legacy_id":"C0025","entity_type":"company","name":"NuFlare Technology","canonical_name":"NuFlare Technology","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"Yokohama","region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.nuflare.co.jp","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Multi-beam e-beam mask writers (MBM-2000/2000PLUS)","primary_equipment":"E-beam Mask Writing","equipment_ids":["EQP-B07"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":"HQ","korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000323"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000026","legacy_id":"C0026","entity_type":"company","name":"Mycronic","canonical_name":"Mycronic","aliases":["MRSI Systems"],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Sweden","country_id":"CTY-SE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.mycronic.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":"MRSI Systems","description":"Laser mask writers; MRSI high-precision die/flip-chip bonders","primary_equipment":"Optical Mask Writing; Die Attach; Flip Chip","equipment_ids":["EQP-B08","EQP-C10","EQP-C11","EQP-B09"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000324","SRC-000325"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-B09"],"resolution_keys":[{"alias":"MRSI Systems","basis":"Recorded alias"}]},{"id":"CMP-000027","legacy_id":"C0027","entity_type":"company","name":"Carl Zeiss SMT","canonical_name":"Carl Zeiss SMT","aliases":[],"former_names":[],"company_type":"Critical component (optics)","supplier_types":["Optics Supplier","Component Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":"Subsidiary","exchange":null,"ticker":null,"website":"https://www.zeiss.com/semiconductor-manufacturing-technology","founded":null,"employees":null,"ceo":null,"parent_company":"Carl Zeiss AG","subsidiaries_brands":null,"description":"EUV / High-NA EUV lithography optics","primary_equipment":"EUV","equipment_ids":["EQP-A01.01","EQP-B09"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":"Supply to ASML widely reported; Batch-1 evidence title-level only","source_ids":["SRC-000327"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2024","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-B09"],"resolution_keys":[]},{"id":"CMP-000028","legacy_id":"C0028","entity_type":"company","name":"AIXTRON","canonical_name":"AIXTRON","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.aixtron.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"MOCVD for GaN/SiC compound semiconductors (AIX G5+ C, G10-GaN, G10-SiC)","primary_equipment":"CVD; GaN; SiC","equipment_ids":["EQP-A09.01","EQP-G01","EQP-G02","EQP-G03"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000328"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-G03"],"resolution_keys":[]},{"id":"CMP-000029","legacy_id":"C0029","entity_type":"company","name":"Oxford Instruments Plasma Technology","canonical_name":"Oxford Instruments Plasma Technology","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United Kingdom","country_id":"CTY-GB","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":"Subsidiary","exchange":null,"ticker":null,"website":"https://plasma.oxinst.com","founded":null,"employees":null,"ceo":null,"parent_company":"Oxford Instruments plc","subsidiaries_brands":null,"description":"Plasma & ion-beam etch/deposition (compound semis, photonics)","primary_equipment":"Etching; Deposition","equipment_ids":["EQP-A08","EQP-A09"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000330"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000030","legacy_id":"C0030","entity_type":"company","name":"Beneq","canonical_name":"Beneq","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Finland","country_id":"CTY-FI","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://beneq.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"ALD platforms (Transform XP; Transmute)","primary_equipment":"ALD","equipment_ids":["EQP-A09.06"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000333"],"discovery_keywords":[],"freshness":"Needs Review","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-11-24","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":38,"filled":6,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000031","legacy_id":"C0031","entity_type":"company","name":"Thermo Fisher Scientific","canonical_name":"Thermo Fisher Scientific","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.thermofisher.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Semiconductor analysis / FIB-SEM failure analysis","primary_equipment":"Metrology","equipment_ids":["EQP-A25"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000334"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000032","legacy_id":"C0032","entity_type":"company","name":"Gigaphoton","canonical_name":"Gigaphoton","aliases":[],"former_names":[],"company_type":"Laser source","supplier_types":["Laser Supplier","Component Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.gigaphoton.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Excimer light sources for DUV lithography; excimer for micro-via / advanced packaging","primary_equipment":"DUV; Laser Drilling","equipment_ids":["EQP-A01.02","EQP-C28"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":"HQ","korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000326"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2024-11-07","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000033","legacy_id":"C0033","entity_type":"company","name":"Technoprobe","canonical_name":"Technoprobe","aliases":[],"former_names":[],"company_type":"Test & probe","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Italy","country_id":"CTY-IT","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":"Public","exchange":"Euronext Milan","ticker":null,"website":"https://www.technoprobe.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Probe cards","primary_equipment":"Wafer Probing","equipment_ids":["EQP-A33"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000329"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000034","legacy_id":"C0034","entity_type":"company","name":"FormFactor","canonical_name":"FormFactor","aliases":[],"former_names":[],"company_type":"Test & probe","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.formfactor.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Probe cards","primary_equipment":"Wafer Probing","equipment_ids":["EQP-A33"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000310"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000035","legacy_id":"C0035","entity_type":"company","name":"MPI Corporation","canonical_name":"MPI Corporation","aliases":[],"former_names":[],"company_type":"Test & probe","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Taiwan","country_id":"CTY-TW","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.mpi-corporation.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Probe cards","primary_equipment":"Wafer Probing","equipment_ids":["EQP-A33"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":"HQ"},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000311"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"MPI","basis":"Name without legal suffix"}]},{"id":"CMP-000036","legacy_id":"C0036","entity_type":"company","name":"Cohu","canonical_name":"Cohu","aliases":[],"former_names":[],"company_type":"Test & probe","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.cohu.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Probe cards / interface solutions","primary_equipment":"Wafer Probing","equipment_ids":["EQP-A33","EQP-C39"],"component_class_ids":[],"candidate_categories":"C39","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000312"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-C39"],"resolution_keys":[]},{"id":"CMP-000037","legacy_id":"C0037","entity_type":"company","name":"Chroma ATE","canonical_name":"Chroma ATE","aliases":[],"former_names":[],"company_type":"Test & probe","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Taiwan","country_id":"CTY-TW","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.chromaate.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"SoC/analog test systems","primary_equipment":"IC Test","equipment_ids":["EQP-C40"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":"HQ"},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000309"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000038","legacy_id":"C0038","entity_type":"company","name":"Techwing","canonical_name":"Techwing","aliases":[],"former_names":[],"company_type":"Test & probe","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Memory test handlers; HBM Cube Prober (256 dies parallel, -40 to 150 C)","primary_equipment":"Handler; Wafer Probing","equipment_ids":["EQP-C39","EQP-A33"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":"HQ","taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000302","SRC-000304"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-06-17","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000039","legacy_id":"C0039","entity_type":"company","name":"TSE Co.","canonical_name":"TSE Co.","aliases":[],"former_names":[],"company_type":"Test & probe","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"HBM test handler","primary_equipment":"Handler","equipment_ids":["EQP-C39"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":"HQ","taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000303"],"discovery_keywords":[],"freshness":"Needs Review","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":31,"filled":5,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000040","legacy_id":"C0040","entity_type":"company","name":"Aehr Test Systems","canonical_name":"Aehr Test Systems","aliases":[],"former_names":[],"company_type":"Test & probe","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"Fremont","region":"North America"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.aehr.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Wafer-level burn-in (FOX-XP/NP/CP), Sonoma packaged burn-in","primary_equipment":"Burn-in","equipment_ids":["EQP-C38"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"REGIONAL","market_class_basis":"Company revenue USD 50 m (FY2026 (Jun 2025-May 2026), S0241)","revenue":{"usd_m":50,"fiscal_year":"FY2026 (Jun 2025-May 2026)","reported":"USD 50.0","basis":"Reported (converted to USD)"},"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[{"fiscal_year":"FY2026 (Jun 2025-May 2026)","metric":"Revenue","currency":"USD","value":50,"usd_m":50,"value_type":"REPORTED","source_ids":["SRC-000241"],"note":null},{"fiscal_year":"FY2026 (Jun 2025-May 2026)","metric":"Net income (GAAP)","currency":"USD","value":-7.1,"usd_m":-7.1,"value_type":"REPORTED","source_ids":["SRC-000241"],"note":null},{"fiscal_year":"FY2026 (Jun 2025-May 2026)","metric":"Effective backlog","currency":"USD","value":100.6,"usd_m":100.6,"value_type":"REPORTED","source_ids":["SRC-000241"],"note":null},{"fiscal_year":"FY2026 (Jun 2025-May 2026)","metric":"Q4 bookings","currency":"USD","value":60.7,"usd_m":60.7,"value_type":"REPORTED","source_ids":["SRC-000241"],"note":null}],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000241","SRC-000242"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-08","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":75,"filled":12,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":2,"total":3,"missing":["Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000041","legacy_id":"C0041","entity_type":"company","name":"ViTrox","canonical_name":"ViTrox","aliases":[],"former_names":[],"company_type":"Test & probe","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Malaysia","country_id":"CTY-MY","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"Penang","region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.vitrox.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Machine-vision inspection handlers (Wi8i G2 wafer vision inspection)","primary_equipment":"AOI; Optical Inspection","equipment_ids":["EQP-C36","EQP-A23","EQP-C34"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000331"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-C34"],"resolution_keys":[]},{"id":"CMP-000042","legacy_id":"C0042","entity_type":"company","name":"Pentamaster","canonical_name":"Pentamaster","aliases":[],"former_names":[],"company_type":"Automation/AMHS","supplier_types":["Automation Supplier","Robotics Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Malaysia","country_id":"CTY-MY","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"Penang","region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://pentamaster.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Automation / test handling (category not confirmed by Batch-1 title evidence)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":"C39;J10","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":59,"level":"LOW"},"evidence_depth":"TITLE","rationale":"Title-level evidence does not name the equipment category","notes":null,"source_ids":["SRC-000332"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000043","legacy_id":"C0043","entity_type":"company","name":"BE Semiconductor Industries (BESI)","canonical_name":"BE Semiconductor Industries","aliases":["BESI"],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Netherlands","country_id":"CTY-NL","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.besi.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Die attach, TCB, hybrid bonding (Kinex co-development with AMAT)","primary_equipment":"Die Attach; TC Bonding; Hybrid Bonding","equipment_ids":["EQP-C10","EQP-C16","EQP-C17","EQP-D21"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"TIER_2","market_class_basis":"Company revenue USD 667 m (FY2025 (Jan-Dec 2025), S0148)","revenue":{"usd_m":667.4,"fiscal_year":"FY2025 (Jan-Dec 2025)","reported":"EUR 591.3","basis":"Reported (converted to USD)"},"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Revenue","currency":"EUR","value":591.3,"usd_m":667.4,"value_type":"REPORTED","source_ids":["SRC-000148"],"note":null},{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Net income","currency":"EUR","value":131.6,"usd_m":148.5,"value_type":"REPORTED","source_ids":["SRC-000148"],"note":null},{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Orders","currency":"EUR","value":685,"usd_m":773.1,"value_type":"REPORTED","source_ids":["SRC-000148"],"note":null},{"fiscal_year":"Q1-2026 (Jan-Mar 2026)","metric":"Orders","currency":"EUR","value":269.7,"usd_m":304.4,"value_type":"REPORTED","source_ids":["SRC-000047"],"note":"More than doubled YoY"}],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":"Die attach ~80% of 2025 revenue; 18 HB customers / >150 cumulative orders (S0046)","source_ids":["SRC-000046","SRC-000047","SRC-000148","SRC-000051"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-09","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":69,"filled":11,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":2,"total":3,"missing":["Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-D21"],"resolution_keys":[{"alias":"BESI","basis":"Recorded alias"},{"alias":"BE Semiconductor Industries","basis":"Name without parenthetical"}]},{"id":"CMP-000044","legacy_id":"C0044","entity_type":"company","name":"ASMPT","canonical_name":"ASMPT","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Hong Kong","country_id":"CTY-HK","country_basis":"From a directory / list source","country_basis_code":"LIST","city":null,"region":"Asia-Pacific"},"ownership":"Public","exchange":"HKEX","ticker":"0522","website":"https://www.asmpt.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":"ALSI; NEXX (being sold to AMAT)","description":"Back-end & SMT: die/flip-chip/TC bonding; laser dicing/grooving via ALSI","primary_equipment":"Die Attach; TC Bonding; Hybrid Bonding","equipment_ids":["EQP-C10","EQP-C16","EQP-C17","EQP-I08"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"TIER_2","market_class_basis":"Company revenue USD 1,762 m (FY2025 (Jan-Dec 2025), S0149)","revenue":{"usd_m":1762.4,"fiscal_year":"FY2025 (Jan-Dec 2025)","reported":"HKD 13,740.0","basis":"Reported (converted to USD)"},"semiconductor_revenue":null,"india":{"summary":"Partnership (training MoU)","has_presence":true,"records":[{"type":"Partnership (training MoU)","facility":"With Kaynes Semicon and Perceptives Solutions","location":null,"scope":"Semiconductor training / workforce","technology":null,"opportunity":"No equipment supply stated","status":"SIGNED 2024-12-12","confidence":"HIGH","source_ids":["SRC-000201"]}]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Revenue (continuing operations)","currency":"HKD","value":13740,"usd_m":1762.4,"value_type":"REPORTED","source_ids":["SRC-000149"],"note":"Source also states US$1.76B"},{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Revenue (group incl. discontinued)","currency":"HKD","value":14520,"usd_m":1862.5,"value_type":"REPORTED","source_ids":["SRC-000149"],"note":null},{"fiscal_year":"H1-2026 (Jan-Jun 2026)","metric":"New orders","currency":"USD","value":1631,"usd_m":1631,"value_type":"REPORTED","source_ids":["SRC-000050"],"note":"Tier 4"}],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":"HQ city not verified in Batch 1","source_ids":["SRC-000149","SRC-000050","SRC-000201","SRC-000060"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-09","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":75,"filled":12,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":2,"total":3,"missing":["Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":1,"total":1,"missing":[]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-I08"],"resolution_keys":[{"alias":"0522","basis":"Stock ticker (HKEX)"}]},{"id":"CMP-000045","legacy_id":"C0045","entity_type":"company","name":"ASMPT ALSI (Advanced Laser Separation International)","canonical_name":"ASMPT ALSI","aliases":["Advanced Laser Separation International"],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Netherlands","country_id":"CTY-NL","country_basis":"Source-stated","country_basis_code":"SRC","city":"Beuningen","region":"Europe"},"ownership":"Subsidiary","exchange":null,"ticker":null,"website":"https://alsi.semi.asmpt.com","founded":"2001","employees":null,"ceo":null,"parent_company":"ASMPT","subsidiaries_brands":null,"description":"Laser dicing & grooving (LASER1205/1206), multi-beam V-DOE","primary_equipment":"Laser Dicing; Laser Ablation","equipment_ids":["EQP-C01.02","EQP-C30"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":"Spin-off from Philips Semiconductors (S0058)","source_ids":["SRC-000057","SRC-000058","SRC-000059","SRC-000060","SRC-000061","SRC-000062","SRC-000063","SRC-000064"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2024-09-18","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":81,"filled":13,"total":16,"groups":[{"group":"Profile","filled":6,"total":6,"missing":[]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"Advanced Laser Separation International","basis":"Recorded alias"},{"alias":"ASMPT ALSI","basis":"Name without parenthetical"}]},{"id":"CMP-000046","legacy_id":"C0046","entity_type":"company","name":"Kulicke & Soffa","canonical_name":"Kulicke & Soffa","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"From a directory / list source","country_basis_code":"LIST","city":null,"region":"North America"},"ownership":"Public","exchange":"NASDAQ","ticker":"KLIC","website":"https://investor.kns.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Wire bonding, die attach, TCB","primary_equipment":"Wire Bonding; Die Attach; TC Bonding","equipment_ids":["EQP-C12","EQP-C10","EQP-C16","EQP-I01"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"TIER_2","market_class_basis":"Company revenue USD 654 m (FY2025 (Oct 2024-Oct 2025), S0150)","revenue":{"usd_m":654.1,"fiscal_year":"FY2025 (Oct 2024-Oct 2025)","reported":"USD 654.1","basis":"Reported (converted to USD)"},"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[{"fiscal_year":"FY2025 (Oct 2024-Oct 2025)","metric":"Revenue","currency":"USD","value":654.1,"usd_m":654.1,"value_type":"REPORTED","source_ids":["SRC-000150"],"note":null}],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":"Singapore operating entity (Kulicke & Soffa Pte Ltd) exists; HQ location not verified","source_ids":["SRC-000150"],"discovery_keywords":[],"freshness":"Needs Review","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-11-19","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":2,"total":3,"missing":["Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-I01"],"resolution_keys":[{"alias":"KLIC","basis":"Stock ticker (NASDAQ)"}]},{"id":"CMP-000047","legacy_id":"C0047","entity_type":"company","name":"Hanmi Semiconductor","canonical_name":"Hanmi Semiconductor","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Source-stated","country_basis_code":"SRC","city":"Incheon","region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"HBM TC bonders (TC Bonder 4.5 Griffin)","primary_equipment":"TC Bonding","equipment_ids":["EQP-C16"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"TIER_2","market_class_basis":"Derived revenue USD 403.7-409.1 m (S0045;S0041)","revenue":{"usd_m":null,"range_usd_m":"403.7-409.1","fiscal_year":"FY2025 (Jan-Dec 2025) (DERIVED)","reported":"KRW 574000-581600","basis":"Derived range"},"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":"HQ","taiwan":null},"startup":null,"financials":[{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Revenue","currency":"KRW","value":"574000-581600","usd_m":null,"value_type":"DERIVED","source_ids":["SRC-000045","SRC-000041"],"note":"Derived: KRW 44.2B order = 7.6-7.7% of 2025 revenue"},{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Operating margin (%)","currency":"%","value":45.68,"usd_m":null,"value_type":"REPORTED","source_ids":["SRC-000173"],"note":null}],"verification":"VERIFIED","confidence":{"score":65,"level":"MEDIUM"},"evidence_depth":"CONTENT","rationale":null,"notes":"Six factories in Incheon (S0044)","source_ids":["SRC-000040","SRC-000041","SRC-000042","SRC-000044","SRC-000045","SRC-000173"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-06-10","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":69,"filled":11,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":2,"total":3,"missing":["Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000048","legacy_id":"C0048","entity_type":"company","name":"Hanwha Semitech","canonical_name":"Hanwha Semitech","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"TC bonders; hybrid bonder (evaluation)","primary_equipment":"TC Bonding; Hybrid Bonding","equipment_ids":["EQP-C16","EQP-C17"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":"HQ","taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":65,"level":"MEDIUM"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000043","SRC-000040"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-06","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000049","legacy_id":"C0049","entity_type":"company","name":"TOWA Corporation","canonical_name":"TOWA Corporation","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.towajapan.co.jp","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Compression molding (PMC 2030-D, CPM 1080), singulation (FMS 4040)","primary_equipment":"Compression Molding; Singulation","equipment_ids":["EQP-C20","EQP-C32"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":"HQ","korea":null,"taiwan":null},"startup":null,"financials":[{"fiscal_year":"FY3/26 (Apr 2025-Mar 2026)","metric":"Revenue","currency":"JPY","value":54360,"usd_m":null,"value_type":"UNIT_CONFLICT","source_ids":["SRC-000237","SRC-000238"],"note":"Fetch rendered '543.6 bn yen'; interpreted as 543.6 x 100M yen. Verify unit before use"},{"fiscal_year":"FY3/26 (Apr 2025-Mar 2026)","metric":"Operating income","currency":"JPY","value":6910,"usd_m":null,"value_type":"UNIT_CONFLICT","source_ids":["SRC-000237"],"note":"Rendered '69.1'; interpreted x 100M yen"},{"fiscal_year":"FY3/27 (Apr 2026-Mar 2027)","metric":"Revenue guidance","currency":"JPY","value":64000,"usd_m":null,"value_type":"UNIT_CONFLICT","source_ids":["SRC-000237","SRC-000238"],"note":"+17.7% (S0238 headline +17%)"}],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000237","SRC-000238"],"discovery_keywords":[],"freshness":"Recent","quality_state":"CONFLICTING","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-05","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"TOWA","basis":"Name without legal suffix"}]},{"id":"CMP-000050","legacy_id":"C0050","entity_type":"company","name":"Yamaha Robotics Holdings","canonical_name":"Yamaha Robotics Holdings","aliases":["SHINKAWA","APIC YAMADA","PFA"],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.yamaha-robotics.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":"SHINKAWA; APIC YAMADA; PFA","description":"Die/flip-chip/wire bonders, molding (brands SHINKAWA, APIC YAMADA, PFA)","primary_equipment":"Die Attach; Flip Chip; Wire Bonding; Compression Molding","equipment_ids":["EQP-C10","EQP-C11","EQP-C12","EQP-C20"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":"HQ","korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000239","SRC-000240"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"SHINKAWA","basis":"Recorded alias"},{"alias":"APIC YAMADA","basis":"Recorded alias"},{"alias":"PFA","basis":"Recorded alias"},{"alias":"Yamaha Robotics","basis":"Name without legal suffix"}]},{"id":"CMP-000051","legacy_id":"C0051","entity_type":"company","name":"EV Group (EVG)","canonical_name":"EV Group","aliases":["EVG"],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Austria","country_id":"CTY-AT","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"St. Florian am Inn","region":"Europe"},"ownership":"Private","exchange":null,"ticker":null,"website":"https://www.evgroup.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Wafer bonding, temporary bond/debond incl. IR-laser debond (EVG880 LayerRelease)","primary_equipment":"Wafer Bonding; Hybrid Bonding; Nanoimprint Lithography","equipment_ids":["EQP-C18","EQP-C17","EQP-A01.07","EQP-D21","EQP-D22"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000232","SRC-000243"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":69,"filled":11,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-D21","EQP-D22"],"resolution_keys":[{"alias":"EVG","basis":"Recorded alias"},{"alias":"EV Group","basis":"Name without parenthetical"}]},{"id":"CMP-000052","legacy_id":"C0052","entity_type":"company","name":"SUSS MicroTec","canonical_name":"SUSS MicroTec","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":"Public","exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Temporary bonding/debonding; ELD300 308 nm excimer laser debonder (2014 launch)","primary_equipment":"Wafer Bonding","equipment_ids":["EQP-C18","EQP-D12"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"CONTENT","rationale":null,"notes":"Only source is 2014 (VERY_STALE) - current status to re-verify","source_ids":["SRC-000233"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2014-07-08","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-D12"],"resolution_keys":[]},{"id":"CMP-000053","legacy_id":"C0053","entity_type":"company","name":"Advanced Dicing Technologies (ADT)","canonical_name":"Advanced Dicing Technologies","aliases":["ADT"],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Israel","country_id":"CTY-IL","country_basis":"Source-stated","country_basis_code":"SRC","city":"Yokneam","region":"Middle East"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.adt-co.com","founded":"1977","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Dicing saws (8030, 7304, 80Ai) and blades","primary_equipment":"Mechanical Dicing","equipment_ids":["EQP-C01.01"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000236"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":69,"filled":11,"total":16,"groups":[{"group":"Profile","filled":6,"total":6,"missing":[]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"ADT","basis":"Recorded alias"},{"alias":"Advanced Dicing Technologies","basis":"Name without parenthetical"}]},{"id":"CMP-000054","legacy_id":"C0054","entity_type":"company","name":"Plasma-Therm","canonical_name":"Plasma-Therm","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Source-stated","country_basis_code":"SRC","city":"St. Petersburg (FL)","region":"North America"},"ownership":"Private","exchange":null,"ticker":null,"website":"https://www.plasmatherm.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Plasma dicing (Singulator MDS-100/300)","primary_equipment":"Plasma Dicing; Etching","equipment_ids":["EQP-C01.04","EQP-A08"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000231"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":69,"filled":11,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000055","legacy_id":"C0055","entity_type":"company","name":"Panasonic Connect","canonical_name":"Panasonic Connect","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":"Subsidiary","exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":"Panasonic Holdings","subsidiaries_brands":null,"description":"Plasma dicing (APX300-DM)","primary_equipment":"Plasma Dicing","equipment_ids":["EQP-C01.04"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":"HQ","korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000234"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000056","legacy_id":"C0056","entity_type":"company","name":"PacTech","canonical_name":"PacTech","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Laser-assisted bonding","primary_equipment":"Chip Bonding","equipment_ids":["EQP-C19"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":35,"level":"LOW"},"evidence_depth":"TITLE","rationale":"Tier-3 distributor listing only","notes":null,"source_ids":["SRC-000244"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":31,"filled":5,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000057","legacy_id":"C0057","entity_type":"company","name":"Protec","canonical_name":"Protec","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Laser-assisted bonder (LAB)","primary_equipment":"Chip Bonding","equipment_ids":["EQP-C19"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":"HQ","taiwan":"Customer relationship"},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"CONTENT","rationale":null,"notes":"LAB ~5% of revenue (S0228)","source_ids":["SRC-000228"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2023","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":38,"filled":6,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000058","legacy_id":"C0058","entity_type":"company","name":"Laserssel","canonical_name":"Laserssel","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Laser-assisted bonding","primary_equipment":"Chip Bonding","equipment_ids":["EQP-C19"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":"HQ","taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"TITLE","rationale":"Named only as Protec competitor","notes":null,"source_ids":["SRC-000228"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2023","review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":25,"filled":4,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000059","legacy_id":"C0059","entity_type":"company","name":"Lintec","canonical_name":"Lintec","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Panel handling / automation (CoPoS evaluation)","primary_equipment":"Material handling","equipment_ids":["EQP-J07","EQP-C03"],"component_class_ids":[],"candidate_categories":"C06","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":"HQ","korea":null,"taiwan":"Customer relationship"},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000179"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-06-16","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":38,"filled":6,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-C03"],"resolution_keys":[]},{"id":"CMP-000060","legacy_id":"C0060","entity_type":"company","name":"Nitto Denko","canonical_name":"Nitto Denko","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Panel handling / automation (CoPoS evaluation)","primary_equipment":"Material handling","equipment_ids":["EQP-J07"],"component_class_ids":[],"candidate_categories":"C06","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":"HQ","korea":null,"taiwan":"Customer relationship"},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000179"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-06-16","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":31,"filled":5,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000061","legacy_id":"C0061","entity_type":"company","name":"Tazmo","canonical_name":"Tazmo","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Panel handling / automation (CoPoS evaluation)","primary_equipment":"Material handling","equipment_ids":["EQP-J07"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":"HQ","korea":null,"taiwan":"Customer relationship"},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000179"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-06-16","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":31,"filled":5,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000062","legacy_id":"C0062","entity_type":"company","name":"Hirata Corporation","canonical_name":"Hirata Corporation","aliases":[],"former_names":[],"company_type":"Automation/AMHS","supplier_types":["Automation Supplier","Robotics Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Wafer-handling robots, EFEMs, panel-level-packaging load ports","primary_equipment":"Atmospheric Robots; EFEM; Load Ports","equipment_ids":["EQP-A38","EQP-A37","EQP-A40"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":"Distributor","has_presence":true,"records":[{"type":"Distributor","facility":"ATS India (exclusive distribution partner)","location":null,"scope":"Wafer-handling robots, EFEMs, PLP load ports","technology":"Wafer handling automation","opportunity":"Distribution + service entry","status":"SIGNED 2026-09","confidence":"LOW","source_ids":["SRC-000214"]}]},"presence":{"china":null,"japan":"HQ","korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"CONTENT","rationale":null,"notes":"India: ATS India exclusive distribution (S0214)","source_ids":["SRC-000214"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-09-16","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Official (Tier 1) source"]},{"group":"Geography","filled":1,"total":1,"missing":[]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"Hirata","basis":"Name without legal suffix"}]},{"id":"CMP-000063","legacy_id":"C0063","entity_type":"company","name":"RORZE Corporation","canonical_name":"RORZE Corporation","aliases":[],"former_names":[],"company_type":"Automation/AMHS","supplier_types":["Automation Supplier","Robotics Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.rorze.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"EFEM/sorters, wafer transfer and vacuum robots","primary_equipment":"EFEM; Atmospheric Robots; Vacuum Robots","equipment_ids":["EQP-A37","EQP-A38","EQP-A39"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":"HQ","korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000294","SRC-000295"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"RORZE","basis":"Name without legal suffix"}]},{"id":"CMP-000064","legacy_id":"C0064","entity_type":"company","name":"Brooks Automation","canonical_name":"Brooks Automation","aliases":[],"former_names":[],"company_type":"Automation/AMHS","supplier_types":["Automation Supplier","Robotics Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.brooks.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Wafer-handling robotics, vacuum automation","primary_equipment":"Atmospheric Robots; Vacuum Robots","equipment_ids":["EQP-A38","EQP-A39"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000296","SRC-000297"],"discovery_keywords":[],"freshness":"Needs Review","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000065","legacy_id":"C0065","entity_type":"company","name":"Daifuku","canonical_name":"Daifuku","aliases":[],"former_names":[],"company_type":"Automation/AMHS","supplier_types":["Automation Supplier","Robotics Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.daifuku.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Cleanroom AMHS","primary_equipment":"AMHS","equipment_ids":["EQP-J01"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":"Trade-show presence","has_presence":true,"records":[{"type":"Trade-show presence","facility":"SEMICON India 2025 exhibitor","location":"India","scope":"Cleanroom AMHS","technology":"AMHS","opportunity":null,"status":"EXHIBITED","confidence":"LOW","source_ids":["SRC-000299"]}]},"presence":{"china":null,"japan":"HQ","korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000298","SRC-000299"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":69,"filled":11,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":1,"total":1,"missing":[]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000066","legacy_id":"C0066","entity_type":"company","name":"Murata Machinery (Muratec)","canonical_name":"Murata Machinery","aliases":["Muratec"],"former_names":[],"company_type":"Automation/AMHS","supplier_types":["Automation Supplier","Robotics Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":"Private","exchange":null,"ticker":null,"website":"https://www.muratec.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"OHT / OHS AMHS for semiconductor fabs","primary_equipment":"OHT; OHS","equipment_ids":["EQP-J02","EQP-J03","EQP-J07"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":"Sales entity","has_presence":true,"records":[{"type":"Sales entity","facility":"Murata Machinery India Pvt Ltd","location":"Coimbatore","scope":"OHT AMHS listing","technology":"AMHS","opportunity":null,"status":"LISTED (Tier 3)","confidence":"LOW","source_ids":["SRC-000301"]}]},"presence":{"china":null,"japan":"HQ","korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":"India entity: Murata Machinery India Pvt Ltd, Coimbatore (Tier 3, S0301)","source_ids":["SRC-000300","SRC-000301"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":69,"filled":11,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":1,"total":1,"missing":[]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-J07"],"resolution_keys":[{"alias":"Muratec","basis":"Recorded alias"},{"alias":"Murata Machinery","basis":"Name without parenthetical"}]},{"id":"CMP-000067","legacy_id":"C0067","entity_type":"company","name":"SEMES","canonical_name":"SEMES","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":"Subsidiary","exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":"Samsung Electronics","subsidiaries_brands":null,"description":"Semiconductor/display equipment (captive to Samsung)","primary_equipment":"Wafer Fab / Front-End Equipment","equipment_ids":["EQP-A","EQP-C16"],"component_class_ids":[],"candidate_categories":"A04;C16","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"TIER_2","market_class_basis":"Company revenue USD 1,728 m (FY2025 (Jan-Dec 2025), S0173)","revenue":{"usd_m":1728.5,"fiscal_year":"FY2025 (Jan-Dec 2025)","reported":"KRW 2,457,500.0","basis":"Reported (converted to USD)"},"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":"HQ","taiwan":null},"startup":null,"financials":[{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Revenue","currency":"KRW","value":2457500,"usd_m":1728.5,"value_type":"REPORTED","source_ids":["SRC-000173"],"note":null}],"verification":"VERIFIED","confidence":{"score":65,"level":"MEDIUM"},"evidence_depth":"CONTENT","rationale":null,"notes":"Revenue KRW 2.4575T 2025 (S0173)","source_ids":["SRC-000173","SRC-000043","SRC-000040"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-06","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":2,"total":3,"missing":["Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-C16"],"resolution_keys":[]},{"id":"CMP-000068","legacy_id":"C0068","entity_type":"company","name":"SFA Engineering","canonical_name":"SFA Engineering","aliases":[],"former_names":[],"company_type":"Automation/AMHS","supplier_types":["Automation Supplier","Robotics Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Chip/display equipment (category not confirmed)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":"J01","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"TIER_2","market_class_basis":"Company revenue USD 1,147 m (FY2025 (Jan-Dec 2025), S0173)","revenue":{"usd_m":1147.1,"fiscal_year":"FY2025 (Jan-Dec 2025)","reported":"KRW 1,630,900.0","basis":"Reported (converted to USD)"},"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":"HQ","taiwan":null},"startup":null,"financials":[{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Revenue","currency":"KRW","value":1630900,"usd_m":1147.1,"value_type":"REPORTED","source_ids":["SRC-000173"],"note":null}],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"CONTENT","rationale":"Source lists company among chip/display equipment makers without category","notes":null,"source_ids":["SRC-000173"],"discovery_keywords":[],"freshness":"Recent","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-04","review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":25,"filled":4,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Ownership / listing","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000069","legacy_id":"C0069","entity_type":"company","name":"Wonik IPS","canonical_name":"Wonik IPS","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":"Public","exchange":"KOSDAQ","ticker":"240810","website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"ALD/CVD (WIDAS, NOA, GEMINI HQ, HyEta spatial ALD, Quanta for 3D NAND)","primary_equipment":"ALD; CVD","equipment_ids":["EQP-A09.06","EQP-A09.01"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"TIER_2","market_class_basis":"Company revenue USD 640 m (FY2025 (Jan-Dec 2025), S0173)","revenue":{"usd_m":639.8,"fiscal_year":"FY2025 (Jan-Dec 2025)","reported":"KRW 909,700.0","basis":"Reported (converted to USD)"},"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":"HQ","taiwan":null},"startup":null,"financials":[{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Revenue","currency":"KRW","value":909700,"usd_m":639.8,"value_type":"REPORTED","source_ids":["SRC-000173"],"note":null},{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Operating income","currency":"KRW","value":73800,"usd_m":51.9,"value_type":"REPORTED","source_ids":["SRC-000173"],"note":null}],"verification":"VERIFIED","confidence":{"score":65,"level":"MEDIUM"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000173","SRC-000174"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-05","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":2,"total":3,"missing":["Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"240810","basis":"Stock ticker (KOSDAQ)"}]},{"id":"CMP-000070","legacy_id":"C0070","entity_type":"company","name":"Jusung Engineering","canonical_name":"Jusung Engineering","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":"Public","exchange":"KOSDAQ","ticker":"036930","website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Atomic layer growth (ALG) equipment","primary_equipment":"ALD","equipment_ids":["EQP-A09.06"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":"HQ","taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":65,"level":"MEDIUM"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000175","SRC-000176"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-06-11","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"036930","basis":"Stock ticker (KOSDAQ)"}]},{"id":"CMP-000071","legacy_id":"C0071","entity_type":"company","name":"PSK","canonical_name":"PSK","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":"319660","website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Front-end equipment (category not confirmed)","primary_equipment":null,"equipment_ids":["EQP-A07"],"component_class_ids":[],"candidate_categories":"A06","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":"HQ","taiwan":null},"startup":null,"financials":[{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Operating margin (%)","currency":"%","value":21.8,"usd_m":null,"value_type":"REPORTED","source_ids":["SRC-000173"],"note":null}],"verification":"PARTIALLY_VERIFIED","confidence":{"score":59,"level":"LOW"},"evidence_depth":"CONTENT","rationale":"Only operating-margin and ticker evidence","notes":null,"source_ids":["SRC-000173","SRC-000176"],"discovery_keywords":[],"freshness":"Recent","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-04","review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":38,"filled":6,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["Equipment category confirmed"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-A07"],"resolution_keys":[{"alias":"319660","basis":"Stock ticker"}]},{"id":"CMP-000072","legacy_id":"C0072","entity_type":"company","name":"HPSP","canonical_name":"HPSP","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":"403870","website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Front-end equipment (category not confirmed)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":"A13","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":"HQ","taiwan":null},"startup":null,"financials":[{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Operating margin (%)","currency":"%","value":51.76,"usd_m":null,"value_type":"REPORTED","source_ids":["SRC-000173"],"note":null}],"verification":"PARTIALLY_VERIFIED","confidence":{"score":59,"level":"LOW"},"evidence_depth":"CONTENT","rationale":"Only operating-margin and ticker evidence","notes":null,"source_ids":["SRC-000173","SRC-000176"],"discovery_keywords":[],"freshness":"Recent","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-04","review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":31,"filled":5,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"403870","basis":"Stock ticker"}]},{"id":"CMP-000073","legacy_id":"C0073","entity_type":"company","name":"Eugene Technology","canonical_name":"Eugene Technology","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":"084370","website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Front-end equipment (category not confirmed)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":"A09.03","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":"HQ","taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":35,"level":"LOW"},"evidence_depth":"CONTENT","rationale":"Tier-3 ticker list only","notes":null,"source_ids":["SRC-000176"],"discovery_keywords":[],"freshness":"Needs Review","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026","review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":25,"filled":4,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"084370","basis":"Stock ticker"}]},{"id":"CMP-000074","legacy_id":"C0074","entity_type":"company","name":"Park Systems","canonical_name":"Park Systems","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Metrology (category not confirmed)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":"A30","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":"HQ","taiwan":null},"startup":null,"financials":[{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Operating margin (%)","currency":"%","value":22,"usd_m":null,"value_type":"REPORTED","source_ids":["SRC-000173"],"note":null}],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"CONTENT","rationale":"Only operating-margin evidence","notes":null,"source_ids":["SRC-000173"],"discovery_keywords":[],"freshness":"Recent","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-04","review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":19,"filled":3,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000075","legacy_id":"C0075","entity_type":"company","name":"Top Engineering","canonical_name":"Top Engineering","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Chip/display equipment (category not confirmed)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"TIER_2","market_class_basis":"Company revenue USD 562 m (FY2025 (Jan-Dec 2025), S0173)","revenue":{"usd_m":561.6,"fiscal_year":"FY2025 (Jan-Dec 2025)","reported":"KRW 798,400.0","basis":"Reported (converted to USD)"},"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":"HQ","taiwan":null},"startup":null,"financials":[{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Revenue","currency":"KRW","value":798400,"usd_m":561.6,"value_type":"REPORTED","source_ids":["SRC-000173"],"note":null}],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"CONTENT","rationale":"Only revenue evidence","notes":null,"source_ids":["SRC-000173"],"discovery_keywords":[],"freshness":"Recent","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-04","review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":25,"filled":4,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Ownership / listing","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000076","legacy_id":"C0076","entity_type":"company","name":"DIT","canonical_name":"DIT","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Chip equipment (category not confirmed)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":"A14","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":"HQ","taiwan":null},"startup":null,"financials":[{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Operating margin (%)","currency":"%","value":20.58,"usd_m":null,"value_type":"REPORTED","source_ids":["SRC-000173"],"note":null}],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"CONTENT","rationale":"Only operating-margin evidence","notes":null,"source_ids":["SRC-000173"],"discovery_keywords":[],"freshness":"Recent","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-04","review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":19,"filled":3,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000077","legacy_id":"C0077","entity_type":"company","name":"EO Technics","canonical_name":"EO Technics","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Source-stated","country_basis_code":"SRC","city":"Anyang","region":"Asia-Pacific"},"ownership":"Public","exchange":"KOSDAQ","ticker":"039030","website":"https://www.eotechnics.com","founded":"1989","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Laser markers (strip/tray/wafer), grooving/dicing (LMC3200), drilling, wafer laser annealing, debonding, LLO","primary_equipment":"Laser Marking; Laser Dicing; Laser Drilling; Laser Annealing; Flip Chip; Laser lift-off","equipment_ids":["EQP-C26","EQP-C01.02","EQP-C28","EQP-A14","EQP-C11","EQP-I06","EQP-C18"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"REGIONAL","market_class_basis":"Company revenue USD 268 m (FY2025 (Jan-Dec 2025), S0158)","revenue":{"usd_m":267.9,"fiscal_year":"FY2025 (Jan-Dec 2025)","reported":"KRW 380,891.0","basis":"Reported (converted to USD)"},"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":"HQ","taiwan":null},"startup":null,"financials":[{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Revenue","currency":"KRW","value":380891,"usd_m":267.9,"value_type":"REPORTED","source_ids":["SRC-000158"],"note":"Tier 3"},{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Operating income","currency":"KRW","value":80753,"usd_m":56.8,"value_type":"REPORTED","source_ids":["SRC-000158"],"note":"Tier 3"},{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Net income","currency":"KRW","value":57213,"usd_m":40.2,"value_type":"REPORTED","source_ids":["SRC-000158"],"note":"Tier 3"}],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000065","SRC-000066","SRC-000067","SRC-000068","SRC-000069","SRC-000158"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-08","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":88,"filled":14,"total":16,"groups":[{"group":"Profile","filled":6,"total":6,"missing":[]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":2,"total":3,"missing":["Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-C18"],"resolution_keys":[{"alias":"039030","basis":"Stock ticker (KOSDAQ)"}]},{"id":"CMP-000078","legacy_id":"C0078","entity_type":"company","name":"Philoptics","canonical_name":"Philoptics","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":"Public","exchange":"KOSDAQ","ticker":"161580","website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"TGV laser drilling for glass substrates (2 mm, 510x515 mm panels), singulation, DI exposure, inspection kit","primary_equipment":"TGV; Laser Drilling; Singulation","equipment_ids":["EQP-D14","EQP-C28","EQP-C32","EQP-A23"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":"HQ","taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":65,"level":"MEDIUM"},"evidence_depth":"CONTENT","rationale":null,"notes":"~2/3 of revenue from battery equipment (S0115)","source_ids":["SRC-000115","SRC-000116","SRC-000117","SRC-000118","SRC-000119","SRC-000120"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-09-29","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-A23"],"resolution_keys":[{"alias":"161580","basis":"Stock ticker (KOSDAQ)"}]},{"id":"CMP-000079","legacy_id":"C0079","entity_type":"company","name":"AP Systems","canonical_name":"AP Systems","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Excimer/solid-state laser annealing (ELA/SLA) and LLO for OLED","primary_equipment":"Laser annealing; Laser lift-off","equipment_ids":["EQP-I07","EQP-I06"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"Customer relationship","japan":null,"korea":"HQ","taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000226","SRC-000227","SRC-000248","SRC-000249","SRC-000250"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-08","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000080","legacy_id":"C0080","entity_type":"company","name":"Grand Process Technology (GPTC)","canonical_name":"Grand Process Technology","aliases":["GPTC"],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Taiwan","country_id":"CTY-TW","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":"3131","website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Wet process equipment (CoPoS evaluation vs AMAT/TEL/SCREEN)","primary_equipment":"Wet Processing","equipment_ids":["EQP-A05"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":"HQ"},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":65,"level":"MEDIUM"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000177","SRC-000179","SRC-000180","SRC-000181"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-06-16","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"GPTC","basis":"Recorded alias"},{"alias":"Grand Process Technology","basis":"Name without parenthetical"},{"alias":"3131","basis":"Stock ticker"}]},{"id":"CMP-000081","legacy_id":"C0081","entity_type":"company","name":"Scientech","canonical_name":"Scientech","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Taiwan","country_id":"CTY-TW","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":"3583","website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Wet process equipment","primary_equipment":"Wet Processing","equipment_ids":["EQP-A05"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":"HQ"},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":65,"level":"MEDIUM"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000177","SRC-000179","SRC-000180"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-06-16","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"3583","basis":"Stock ticker"}]},{"id":"CMP-000082","legacy_id":"C0082","entity_type":"company","name":"All Ring Tech","canonical_name":"All Ring Tech","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Taiwan","country_id":"CTY-TW","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":"6187","website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Precision dispensing systems; wafer-level equipment","primary_equipment":"Dispensing","equipment_ids":["EQP-C25"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":"HQ"},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":65,"level":"MEDIUM"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000177","SRC-000180","SRC-000182"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-04-08","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"6187","basis":"Stock ticker"}]},{"id":"CMP-000083","legacy_id":"C0083","entity_type":"company","name":"Gallant Precision Machining (GPM)","canonical_name":"Gallant Precision Machining","aliases":["GPM"],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Taiwan","country_id":"CTY-TW","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Inspection (CoPoS evaluation vs KLA/Camtek)","primary_equipment":"Optical Inspection","equipment_ids":["EQP-A23"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":"HQ"},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":65,"level":"MEDIUM"},"evidence_depth":"CONTENT","rationale":null,"notes":"Named 'Gallant Micro Machining' in S0177 and 'GPM' in S0179 - identity match UNKNOWN (see relationships)","source_ids":["SRC-000177","SRC-000179"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-06-16","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":38,"filled":6,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"GPM","basis":"Recorded alias"},{"alias":"Gallant Precision Machining","basis":"Name without parenthetical"}]},{"id":"CMP-000084","legacy_id":"C0084","entity_type":"company","name":"C Sun Manufacturing","canonical_name":"C Sun Manufacturing","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Taiwan","country_id":"CTY-TW","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":"2467","website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Semiconductor equipment (category not confirmed)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":"HQ"},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"CONTENT","rationale":"Ticker list only","notes":null,"source_ids":["SRC-000180"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-02-19","review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":25,"filled":4,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"2467","basis":"Stock ticker"}]},{"id":"CMP-000085","legacy_id":"C0085","entity_type":"company","name":"Gudeng Precision","canonical_name":"Gudeng Precision","aliases":[],"former_names":[],"company_type":"Automation/AMHS","supplier_types":["Automation Supplier","Robotics Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"Taiwan","country_id":"CTY-TW","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Panel handling / carriers (CoPoS)","primary_equipment":"Material handling","equipment_ids":["EQP-J07"],"component_class_ids":[],"candidate_categories":"A36","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":"HQ"},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":65,"level":"MEDIUM"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000179","SRC-000182"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-06-16","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":38,"filled":6,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000086","legacy_id":"C0086","entity_type":"company","name":"Mirle Automation","canonical_name":"Mirle Automation","aliases":[],"former_names":[],"company_type":"Automation/AMHS","supplier_types":["Automation Supplier","Robotics Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Taiwan","country_id":"CTY-TW","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Panel handling / automation (CoPoS)","primary_equipment":"Material handling","equipment_ids":["EQP-J07"],"component_class_ids":[],"candidate_categories":"J01","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":"HQ"},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000179"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-06-16","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":31,"filled":5,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000087","legacy_id":"C0087","entity_type":"company","name":"Utechzone","canonical_name":"Utechzone","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Taiwan","country_id":"CTY-TW","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"AOI inspection (CoPoS evaluation)","primary_equipment":"Optical Inspection","equipment_ids":["EQP-A23"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":"HQ"},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000179"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-06-16","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":38,"filled":6,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000088","legacy_id":"C0088","entity_type":"company","name":"VisEra Technologies","canonical_name":"VisEra Technologies","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Taiwan","country_id":"CTY-TW","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Inspection (CoPoS evaluation)","primary_equipment":"Optical Inspection","equipment_ids":["EQP-A23"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":"HQ"},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"CONTENT","rationale":null,"notes":"Classified by source among inspection vendors","source_ids":["SRC-000179"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-06-16","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":31,"filled":5,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000089","legacy_id":"C0089","entity_type":"company","name":"Marketech International","canonical_name":"Marketech International","aliases":[],"former_names":[],"company_type":"Facility/integration","supplier_types":["Integrator","Service Provider"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"Taiwan","country_id":"CTY-TW","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Fab facility systems / hook-up","primary_equipment":"Gas Delivery Systems; Chemical Delivery Systems","equipment_ids":["EQP-A43","EQP-A44"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":"HQ"},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000178"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-03-06","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":38,"filled":6,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000090","legacy_id":"C0090","entity_type":"company","name":"United Integrated Services (UIS)","canonical_name":"United Integrated Services","aliases":["UIS"],"former_names":[],"company_type":"Facility/integration","supplier_types":["Integrator","Service Provider"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"Taiwan","country_id":"CTY-TW","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Cleanroom / fab facility construction","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":"HQ"},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000178"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-03-06","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":31,"filled":5,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"UIS","basis":"Recorded alias"},{"alias":"United Integrated Services","basis":"Name without parenthetical"}]},{"id":"CMP-000091","legacy_id":"C0091","entity_type":"company","name":"Foxsemicon Integrated Technology","canonical_name":"Foxsemicon Integrated Technology","aliases":[],"former_names":[],"company_type":"Subsystem supplier","supplier_types":["Subsystem Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"Taiwan","country_id":"CTY-TW","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Equipment OEM manufacturing (contract)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":"HQ"},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000178"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-03-06","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":31,"filled":5,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000092","legacy_id":"C0092","entity_type":"company","name":"Feedback Technology","canonical_name":"Feedback Technology","aliases":[],"former_names":[],"company_type":"Subsystem supplier","supplier_types":["Subsystem Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"Taiwan","country_id":"CTY-TW","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Equipment OEM manufacturing (contract)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":"HQ"},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000178"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-03-06","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":31,"filled":5,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000093","legacy_id":"C0093","entity_type":"company","name":"Topco Scientific","canonical_name":"Topco Scientific","aliases":[],"former_names":[],"company_type":"Distributor/service","supplier_types":["Distributor","Service Provider"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"Taiwan","country_id":"CTY-TW","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Platform/distributor for >10 Taiwanese equipment makers (US expansion)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":"HQ"},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000182"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-04-02","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":31,"filled":5,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000101","legacy_id":"C0101","entity_type":"company","name":"NAURA Technology Group","canonical_name":"NAURA Technology Group","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"Beijing","region":"Asia-Pacific"},"ownership":"Public","exchange":"SZSE","ticker":"002371","website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Etch (Accura LX CCP), deposition, thermal, cleaning","primary_equipment":"Etching; Deposition","equipment_ids":["EQP-A08","EQP-A09","EQP-A08.02"],"component_class_ids":[],"candidate_categories":"A11;A04","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"GLOBAL_LEADER","market_class_basis":"Ranked: S0011 5th in 2025 global ranking","revenue":{"usd_m":5519.7,"fiscal_year":"FY2025 (Jan-Dec 2025)","reported":"CNY 39,350.0","basis":"Reported (converted to USD)"},"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Revenue","currency":"CNY","value":39350,"usd_m":5519.7,"value_type":"REPORTED","source_ids":["SRC-000016"],"note":"Tier 4; growth +30.85% per S0012 (Tier 2)"},{"fiscal_year":"9M-2025 (Jan-Sep 2025)","metric":"Revenue","currency":"CNY","value":27140,"usd_m":3807,"value_type":"REPORTED","source_ids":["SRC-000010"],"note":null},{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Revenue growth (%)","currency":"%","value":30.85,"usd_m":null,"value_type":"REPORTED","source_ids":["SRC-000012"],"note":null},{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"R&D expense","currency":"CNY","value":5440,"usd_m":763.1,"value_type":"REPORTED","source_ids":["SRC-000016"],"note":"Tier 4"}],"verification":"VERIFIED","confidence":{"score":65,"level":"MEDIUM"},"evidence_depth":"CONTENT","rationale":null,"notes":"5th in 2025 global ranking (S0011); CINNO 7th 1H25 (S0005)","source_ids":["SRC-000009","SRC-000010","SRC-000011","SRC-000012","SRC-000013","SRC-000016","SRC-000126","SRC-000127"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-09","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":2,"total":3,"missing":["Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-A08.02"],"resolution_keys":[{"alias":"002371","basis":"Stock ticker (SZSE)"}]},{"id":"CMP-000102","legacy_id":"C0102","entity_type":"company","name":"AMEC (Advanced Micro-Fabrication Equipment)","canonical_name":"AMEC","aliases":["Advanced Micro-Fabrication Equipment"],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"Shanghai","region":"Asia-Pacific"},"ownership":"Public","exchange":"SSE STAR","ticker":"688012","website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Etch, MOCVD","primary_equipment":"Etching; CVD","equipment_ids":["EQP-A08","EQP-A09.01"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"TIER_2","market_class_basis":"Company revenue USD 1,737 m (FY2025 (Jan-Dec 2025), S0009)","revenue":{"usd_m":1736.6,"fiscal_year":"FY2025 (Jan-Dec 2025)","reported":"CNY 12,380.0","basis":"Reported (converted to USD)"},"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Revenue","currency":"CNY","value":12380,"usd_m":1736.6,"value_type":"REPORTED","source_ids":["SRC-000009"],"note":"+36.6%"},{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Net income","currency":"CNY","value":2110,"usd_m":296,"value_type":"REPORTED","source_ids":["SRC-000009"],"note":null},{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"R&D expense","currency":"CNY","value":3740,"usd_m":524.6,"value_type":"REPORTED","source_ids":["SRC-000016"],"note":"Tier 4"}],"verification":"VERIFIED","confidence":{"score":65,"level":"MEDIUM"},"evidence_depth":"CONTENT","rationale":null,"notes":"13th global (S0011)","source_ids":["SRC-000009","SRC-000011","SRC-000016"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-09","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":2,"total":3,"missing":["Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"Advanced Micro-Fabrication Equipment","basis":"Recorded alias"},{"alias":"AMEC","basis":"Name without parenthetical"},{"alias":"688012","basis":"Stock ticker (SSE STAR)"}]},{"id":"CMP-000103","legacy_id":"C0103","entity_type":"company","name":"Piotech","canonical_name":"Piotech","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":"Public","exchange":"SSE STAR","ticker":"688072","website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"PECVD, ALD, SACVD/HDPCVD; hybrid bonding","primary_equipment":"PECVD; ALD; Hybrid Bonding","equipment_ids":["EQP-A09.02","EQP-A09.06","EQP-C17"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"TIER_2","market_class_basis":"Company revenue USD 914 m (FY2025 (Jan-Dec 2025), S0314)","revenue":{"usd_m":914.4,"fiscal_year":"FY2025 (Jan-Dec 2025)","reported":"CNY 6,519.0","basis":"Reported (converted to USD)"},"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Revenue","currency":"CNY","value":6519,"usd_m":914.4,"value_type":"REPORTED","source_ids":["SRC-000314"],"note":"+58.87%"},{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Net income (attributable)","currency":"CNY","value":927,"usd_m":130,"value_type":"REPORTED","source_ids":["SRC-000314"],"note":"+34.67%"},{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Segment revenue - PECVD","currency":"CNY","value":5142,"usd_m":721.3,"value_type":"REPORTED","source_ids":["SRC-000314"],"note":null},{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Segment revenue - ALD","currency":"CNY","value":301,"usd_m":42.2,"value_type":"REPORTED","source_ids":["SRC-000314"],"note":null},{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Segment revenue - Hybrid bonding","currency":"CNY","value":136,"usd_m":19.1,"value_type":"REPORTED","source_ids":["SRC-000314"],"note":null}],"verification":"VERIFIED","confidence":{"score":65,"level":"MEDIUM"},"evidence_depth":"CONTENT","rationale":null,"notes":"2025: PECVD RMB 5.14B, ALD RMB 0.30B, hybrid bonding RMB 0.14B (S0314)","source_ids":["SRC-000009","SRC-000314"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-04-21","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":2,"total":3,"missing":["Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"688072","basis":"Stock ticker (SSE STAR)"}]},{"id":"CMP-000104","legacy_id":"C0104","entity_type":"company","name":"ACM Research","canonical_name":"ACM Research","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"From a directory / list source","country_basis_code":"LIST","city":null,"region":"North America"},"ownership":"Public","exchange":"NASDAQ","ticker":"ACMR","website":"https://www.acmr.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Single-wafer cleaning, ECP (front-end & packaging), furnace, track, PECVD, WLP/PLP","primary_equipment":"Wafer Cleaning; Electroplating; Diffusion; Track Systems; PECVD","equipment_ids":["EQP-A04","EQP-A18","EQP-A11","EQP-A03","EQP-A09.02","EQP-A20"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"TIER_2","market_class_basis":"Company revenue USD 901 m (FY2025 (Jan-Dec 2025), S0313)","revenue":{"usd_m":901.3,"fiscal_year":"FY2025 (Jan-Dec 2025)","reported":"USD 901.3","basis":"Reported (converted to USD)"},"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Revenue","currency":"USD","value":901.3,"usd_m":901.3,"value_type":"REPORTED","source_ids":["SRC-000313"],"note":"+15.2%"},{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Net income (GAAP, attributable)","currency":"USD","value":94.1,"usd_m":94.1,"value_type":"REPORTED","source_ids":["SRC-000313"],"note":null},{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"R&D expense","currency":"USD","value":145,"usd_m":145,"value_type":"REPORTED","source_ids":["SRC-000313"],"note":null},{"fiscal_year":"FY2026 (Jan-Dec 2026)","metric":"Revenue guidance","currency":"USD","value":"1080-1175","usd_m":null,"value_type":"GUIDANCE","source_ids":["SRC-000313"],"note":null}],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":"Classified as domestic Chinese supplier via ACM Research (Shanghai) (S0009)","source_ids":["SRC-000009","SRC-000015","SRC-000313"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-04-21","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":69,"filled":11,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":2,"total":3,"missing":["Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-A20"],"resolution_keys":[{"alias":"ACMR","basis":"Stock ticker (NASDAQ)"}]},{"id":"CMP-000105","legacy_id":"C0105","entity_type":"company","name":"Hwatsing Technology","canonical_name":"Hwatsing Technology","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"Tianjin","region":"Asia-Pacific"},"ownership":"Public","exchange":"SSE STAR","ticker":"688120","website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"CMP; wafer thinning","primary_equipment":"CMP; Wafer Thinning","equipment_ids":["EQP-A19","EQP-C04"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"TIER_2","market_class_basis":"Company revenue USD 652 m (FY2025 (Jan-Dec 2025), S0316)","revenue":{"usd_m":652,"fiscal_year":"FY2025 (Jan-Dec 2025)","reported":"CNY 4,648.0","basis":"Reported (converted to USD)"},"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Revenue","currency":"CNY","value":4648,"usd_m":652,"value_type":"REPORTED","source_ids":["SRC-000316"],"note":"Tier 3 (AI flash) - confirm vs annual report"},{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Net income (attributable)","currency":"CNY","value":1084,"usd_m":152.1,"value_type":"REPORTED","source_ids":["SRC-000315"],"note":"+5.9%"}],"verification":"VERIFIED","confidence":{"score":65,"level":"MEDIUM"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000009","SRC-000014","SRC-000015","SRC-000315","SRC-000316","SRC-000017"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-04-23","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":2,"total":3,"missing":["Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"688120","basis":"Stock ticker (SSE STAR)"}]},{"id":"CMP-000106","legacy_id":"C0106","entity_type":"company","name":"Kingsemi","canonical_name":"Kingsemi","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"Shenyang","region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Coating/developing; bonding","primary_equipment":"Coater / Developer; Wafer Bonding","equipment_ids":["EQP-A02","EQP-C18"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":65,"level":"MEDIUM"},"evidence_depth":"CONTENT","rationale":null,"notes":"Naura acquiring 9.5% stake (S0127)","source_ids":["SRC-000009","SRC-000126","SRC-000127"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-04-21","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000107","legacy_id":"C0107","entity_type":"company","name":"SMEE (Shanghai Micro Electronics Equipment)","canonical_name":"SMEE","aliases":["Shanghai Micro Electronics Equipment"],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"Shanghai","region":"Asia-Pacific"},"ownership":"State-linked","exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Lithography: SSA600 90 nm-class dry ArF; KrF 110 nm contract","primary_equipment":"ArF; KrF","equipment_ids":["EQP-A01.03","EQP-A01.04"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":65,"level":"MEDIUM"},"evidence_depth":"CONTENT","rationale":null,"notes":"SSA/800 never deployed per S0187 (conflicts with S0189)","source_ids":["SRC-000011","SRC-000187","SRC-000188","SRC-000189"],"discovery_keywords":[],"freshness":"Recent","quality_state":"CONFLICTING","missing_key_fields":["Headquarters country (source)","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-08","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"Shanghai Micro Electronics Equipment","basis":"Recorded alias"},{"alias":"SMEE","basis":"Name without parenthetical"}]},{"id":"CMP-000108","legacy_id":"C0108","entity_type":"company","name":"AMIES","canonical_name":"AMIES","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Lithography steppers (spin-off of SMEE)","primary_equipment":"Lithography","equipment_ids":["EQP-A01"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":65,"level":"MEDIUM"},"evidence_depth":"CONTENT","rationale":null,"notes":">500 steppers shipped per S0188","source_ids":["SRC-000183","SRC-000188"],"discovery_keywords":[],"freshness":"Needs Review","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-10-21","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":38,"filled":6,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000109","legacy_id":"C0109","entity_type":"company","name":"SiCarrier","canonical_name":"SiCarrier","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"Shenzhen","region":"Asia-Pacific"},"ownership":"Private","exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Broad front-end portfolio shown at Semicon China 2025","primary_equipment":"Wafer Fab / Front-End Equipment","equipment_ids":["EQP-A"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[{"fiscal_year":"2026","metric":"Valuation","currency":"CNY","value":65000,"usd_m":9117.7,"value_type":"ESTIMATE","source_ids":["SRC-000187"],"note":"Reported valuation"}],"verification":"VERIFIED","confidence":{"score":65,"level":"MEDIUM"},"evidence_depth":"CONTENT","rationale":null,"notes":"Valuation RMB 65B (S0187)","source_ids":["SRC-000184","SRC-000185","SRC-000187"],"discovery_keywords":[],"freshness":"Recent","quality_state":"CONFLICTING","missing_key_fields":["Headquarters country (source)","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-08","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000110","legacy_id":"C0110","entity_type":"company","name":"Yuliangsheng","canonical_name":"Yuliangsheng","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"28 nm-class DUV lithography (testing at SMIC per reports)","primary_equipment":"ArF","equipment_ids":["EQP-A01.03"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"CONTENT","rationale":"Relies on secondary reports citing SCMP/FT","notes":null,"source_ids":["SRC-000183"],"discovery_keywords":[],"freshness":"Needs Review","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-10-21","review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":25,"filled":4,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000111","legacy_id":"C0111","entity_type":"company","name":"Aishengna","canonical_name":"Aishengna","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Lithography (consolidation reported)","primary_equipment":"Lithography","equipment_ids":["EQP-A01"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"TITLE","rationale":"Single mention","notes":null,"source_ids":["SRC-000187"],"discovery_keywords":[],"freshness":"Recent","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-08","review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":25,"filled":4,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000112","legacy_id":"C0112","entity_type":"company","name":"Skyverse","canonical_name":"Skyverse","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"Shenzhen","region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Process-control equipment (category not confirmed)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":"A21;A25","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":59,"level":"LOW"},"evidence_depth":"CONTENT","rationale":"CONFLICT: S0188 calls it a SiCarrier materials subsidiary","notes":null,"source_ids":["SRC-000012","SRC-000188"],"discovery_keywords":[],"freshness":"Recent","quality_state":"CONFLICTING","missing_key_fields":["Headquarters country (source)","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-07","review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":31,"filled":5,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000113","legacy_id":"C0113","entity_type":"company","name":"Hangzhou Changchuan Technology","canonical_name":"Hangzhou Changchuan Technology","aliases":[],"former_names":[],"company_type":"Test & probe","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"Hangzhou","region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Test equipment (category not confirmed)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":"C39;C40","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"CONTENT","rationale":"Named in a group list only","notes":null,"source_ids":["SRC-000012"],"discovery_keywords":[],"freshness":"Recent","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-07","review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":25,"filled":4,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000114","legacy_id":"C0114","entity_type":"company","name":"Accotest","canonical_name":"Accotest","aliases":[],"former_names":[],"company_type":"Test & probe","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Test equipment (category not confirmed)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":"C40","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"CONTENT","rationale":"Named in a group list only","notes":null,"source_ids":["SRC-000012"],"discovery_keywords":[],"freshness":"Recent","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-07","review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":19,"filled":3,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000115","legacy_id":"C0115","entity_type":"company","name":"Wuhan Jingce Electronic","canonical_name":"Wuhan Jingce Electronic","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"Wuhan","region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Metrology/inspection (category not confirmed)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":"A25","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"CONTENT","rationale":"Named in a group list only","notes":null,"source_ids":["SRC-000012"],"discovery_keywords":[],"freshness":"Recent","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-07","review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":25,"filled":4,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000116","legacy_id":"C0116","entity_type":"company","name":"JSG","canonical_name":"JSG","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Wafer thinning","primary_equipment":"Wafer Thinning","equipment_ids":["EQP-C04"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"CONTENT","rationale":"Abbreviation only; legal identity not confirmed","notes":null,"source_ids":["SRC-000009"],"discovery_keywords":[],"freshness":"Recent","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-04-21","review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":25,"filled":4,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000117","legacy_id":"C0117","entity_type":"company","name":"Han's Laser Technology","canonical_name":"Han's Laser Technology","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"Shenzhen","region":"Asia-Pacific"},"ownership":"Public","exchange":"SZSE","ticker":"002008","website":"https://www.hanslaserus.com","founded":"1996","employees":"16,970 (2023, Tier 4)","ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Laser stealth dicing for SiC (Di-Sync)","primary_equipment":"Stealth Dicing; Dicing","equipment_ids":["EQP-C01.03","EQP-F07"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"TIER_2","market_class_basis":"Company revenue USD 1,960 m (FY2023 (Jan-Dec 2023), S0108)","revenue":{"usd_m":1959.9,"fiscal_year":"FY2023 (Jan-Dec 2023)","reported":"CNY 14,090.0","basis":"Reported (converted to USD)"},"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[{"fiscal_year":"FY2023 (Jan-Dec 2023)","metric":"Revenue","currency":"CNY","value":14090,"usd_m":1959.9,"value_type":"REPORTED","source_ids":["SRC-000108"],"note":"Tier 4; FY2023 - STALE; FX 2023 not loaded, 2024 used"}],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000108","SRC-000109"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Headquarters country (source)"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-08","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":88,"filled":14,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["HQ country source-backed"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":3,"total":3,"missing":[]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"002008","basis":"Stock ticker (SZSE)"}]},{"id":"CMP-000118","legacy_id":"C0118","entity_type":"company","name":"HGTECH (Huagong Tech)","canonical_name":"HGTECH","aliases":["Huagong Tech"],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"Wuhan","region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.hglaserglobal.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Fully automatic wafer laser modification (stealth-type) dicing","primary_equipment":"Stealth Dicing; Laser Dicing","equipment_ids":["EQP-C01.03","EQP-C01.02"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000107"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Headquarters country (source)","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-02-13","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"Huagong Tech","basis":"Recorded alias"},{"alias":"HGTECH","basis":"Name without parenthetical"}]},{"id":"CMP-000119","legacy_id":"C0119","entity_type":"company","name":"Suzhou Delphi Laser","canonical_name":"Suzhou Delphi Laser","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Inferred from the company name","country_basis_code":"NAME","city":"Suzhou","region":"Asia-Pacific"},"ownership":"Public","exchange":"SSE STAR","ticker":"688170","website":"https://en.delphilaser.com","founded":"2005","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Wafer dicing (Si/SiC/GaAs/LT/LN/glass), grooving, TGV (AWD20), SiC ingot slicing, laser annealing, marking, TMV, debonding","primary_equipment":"Laser Dicing; Stealth Dicing; Laser Drilling; TGV; Laser Annealing; Laser Marking; Wafer Bonding","equipment_ids":["EQP-C01.02","EQP-C01.03","EQP-C28","EQP-D14","EQP-A14","EQP-C26","EQP-C18","EQP-F01"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000217","SRC-000245","SRC-000111"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Headquarters country (source)","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":75,"filled":12,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["HQ country source-backed"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-F01"],"resolution_keys":[{"alias":"688170","basis":"Stock ticker (SSE STAR)"}]},{"id":"CMP-000120","legacy_id":"C0120","entity_type":"company","name":"Wuhan DR Laser Technology","canonical_name":"Wuhan DR Laser Technology","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Inferred from the company name","country_basis_code":"NAME","city":"Wuhan","region":"Asia-Pacific"},"ownership":"Public","exchange":"SZSE","ticker":"300776","website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"TGV laser micro-hole equipment","primary_equipment":"TGV; Laser Drilling","equipment_ids":["EQP-D14","EQP-C28"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":35,"level":"LOW"},"evidence_depth":"TITLE","rationale":"Tier-3 headline (page 403) and Tier-4 lists only","notes":null,"source_ids":["SRC-000218","SRC-000246","SRC-000111"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Headquarters country (source)","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025","review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"300776","basis":"Stock ticker (SZSE)"}]},{"id":"CMP-000121","legacy_id":"C0121","entity_type":"company","name":"Suzhou Maxwell Technologies","canonical_name":"Suzhou Maxwell Technologies","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Inferred from the company name","country_basis_code":"NAME","city":"Suzhou","region":"Asia-Pacific"},"ownership":"Public","exchange":"SZSE","ticker":"300751","website":null,"founded":"2010","employees":"4,370","ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Laser wafer cutting and grooving; OLED/mini/micro-LED equipment","primary_equipment":"Laser Dicing","equipment_ids":["EQP-C01.02"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":35,"level":"LOW"},"evidence_depth":"CONTENT","rationale":"Tier-3 profile only","notes":null,"source_ids":["SRC-000219","SRC-000246"],"discovery_keywords":[],"freshness":"Needs Review","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","Website"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026","review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","Website"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":2,"total":3,"missing":["Revenue (reported)"]},{"group":"Evidence","filled":2,"total":4,"missing":["Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"300751","basis":"Stock ticker (SZSE)"}]},{"id":"CMP-000122","legacy_id":"C0122","entity_type":"company","name":"Chengdu LasTop Tech","canonical_name":"Chengdu LasTop Tech","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Inferred from the company name","country_basis_code":"NAME","city":"Chengdu","region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Low-k laser grooving (list mention)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"UNVERIFIED","confidence":{"score":15,"level":"UNVERIFIED"},"evidence_depth":"TIER4","rationale":"Named only in Tier-4 market-report lists; existence, category and identity not verified","notes":null,"source_ids":["SRC-000111"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"UNVERIFIED","missing_key_fields":["Headquarters country (source)","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":null,"latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":25,"filled":4,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000123","legacy_id":"C0123","entity_type":"company","name":"KMEPS","canonical_name":"KMEPS","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Low-k laser grooving (list mention)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"UNVERIFIED","confidence":{"score":15,"level":"UNVERIFIED"},"evidence_depth":"TIER4","rationale":"Named only in Tier-4 market-report lists; existence, category and identity not verified","notes":null,"source_ids":["SRC-000111"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"UNVERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":null,"latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":19,"filled":3,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000124","legacy_id":"C0124","entity_type":"company","name":"HSET","canonical_name":"HSET","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Laser grooving (list mention)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"UNVERIFIED","confidence":{"score":15,"level":"UNVERIFIED"},"evidence_depth":"TIER4","rationale":"Named only in Tier-4 market-report lists; existence, category and identity not verified","notes":null,"source_ids":["SRC-000112"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"UNVERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":null,"latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":19,"filled":3,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000125","legacy_id":"C0125","entity_type":"company","name":"Shenzhen Teyan Semiconductor Equipment","canonical_name":"Shenzhen Teyan Semiconductor Equipment","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Inferred from the company name","country_basis_code":"NAME","city":"Shenzhen","region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Laser grooving (list mention)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"UNVERIFIED","confidence":{"score":15,"level":"UNVERIFIED"},"evidence_depth":"TIER4","rationale":"Named only in Tier-4 market-report lists; existence, category and identity not verified","notes":null,"source_ids":["SRC-000112"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"UNVERIFIED","missing_key_fields":["Headquarters country (source)","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":null,"latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":25,"filled":4,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000126","legacy_id":"C0126","entity_type":"company","name":"Dolphin Laser","canonical_name":"Dolphin Laser","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Laser grooving/dicing (list mention)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"UNVERIFIED","confidence":{"score":15,"level":"UNVERIFIED"},"evidence_depth":"TIER4","rationale":"Named only in Tier-4 market-report lists; existence, category and identity not verified","notes":null,"source_ids":["SRC-000113"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"UNVERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":null,"latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":19,"filled":3,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000127","legacy_id":"C0127","entity_type":"company","name":"CHN.GIE","canonical_name":"CHN.GIE","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Laser grooving/dicing (list mention)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"UNVERIFIED","confidence":{"score":15,"level":"UNVERIFIED"},"evidence_depth":"TIER4","rationale":"Named only in Tier-4 market-report lists; existence, category and identity not verified","notes":null,"source_ids":["SRC-000113"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"UNVERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":null,"latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":19,"filled":3,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000128","legacy_id":"C0128","entity_type":"company","name":"CASIC (laser equipment unit)","canonical_name":"CASIC","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Laser grooving/dicing (list mention)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"UNVERIFIED","confidence":{"score":15,"level":"UNVERIFIED"},"evidence_depth":"TIER4","rationale":"Named only in Tier-4 market-report lists; existence, category and identity not verified","notes":null,"source_ids":["SRC-000113"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"UNVERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":null,"latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":19,"filled":3,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"CASIC","basis":"Name without parenthetical"}]},{"id":"CMP-000129","legacy_id":"C0129","entity_type":"company","name":"Lumi Laser","canonical_name":"Lumi Laser","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Laser grooving/dicing (list mention)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"UNVERIFIED","confidence":{"score":15,"level":"UNVERIFIED"},"evidence_depth":"TIER4","rationale":"Named only in Tier-4 market-report lists; existence, category and identity not verified","notes":null,"source_ids":["SRC-000113"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"UNVERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":null,"latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":19,"filled":3,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000130","legacy_id":"C0130","entity_type":"company","name":"Suzhou Quick Laser Technology","canonical_name":"Suzhou Quick Laser Technology","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Inferred from the company name","country_basis_code":"NAME","city":"Suzhou","region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Laser grooving/dicing (list mention)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"UNVERIFIED","confidence":{"score":15,"level":"UNVERIFIED"},"evidence_depth":"TIER4","rationale":"Named only in Tier-4 market-report lists; existence, category and identity not verified","notes":null,"source_ids":["SRC-000113"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"UNVERIFIED","missing_key_fields":["Headquarters country (source)","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":null,"latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":25,"filled":4,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000131","legacy_id":"C0131","entity_type":"company","name":"Intech Technologies","canonical_name":"Intech Technologies","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":null,"country_id":null,"country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":null},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Automatic wafer laser grooving (list mention)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"UNVERIFIED","confidence":{"score":15,"level":"UNVERIFIED"},"evidence_depth":"TIER4","rationale":"Named only in Tier-4 market-report lists; existence, category and identity not verified","notes":null,"source_ids":["SRC-000114"],"discovery_keywords":[],"freshness":"Needs Review","quality_state":"UNVERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":null,"latest_source_date":"2025-11","review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":13,"filled":2,"total":16,"groups":[{"group":"Profile","filled":1,"total":6,"missing":["HQ country","HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000132","legacy_id":"C0132","entity_type":"company","name":"HiPA Photonics","canonical_name":"HiPA Photonics","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Automatic wafer laser grooving (list mention); jpt-hipa.com domain suggests JPT link","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"UNVERIFIED","confidence":{"score":15,"level":"UNVERIFIED"},"evidence_depth":"TIER4","rationale":"Named only in Tier-4 market-report lists; existence, category and identity not verified","notes":null,"source_ids":["SRC-000114"],"discovery_keywords":[],"freshness":"Needs Review","quality_state":"UNVERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":null,"latest_source_date":"2025-11","review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":19,"filled":3,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000139","legacy_id":"C0139","entity_type":"company","name":"Dynatex International","canonical_name":"Dynatex International","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":null,"country_id":null,"country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":null},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Dicing (list mention)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"UNVERIFIED","confidence":{"score":15,"level":"UNVERIFIED"},"evidence_depth":"TIER4","rationale":"Named only in Tier-4 market-report lists; existence, category and identity not verified","notes":null,"source_ids":["SRC-000110"],"discovery_keywords":[],"freshness":"Recent","quality_state":"UNVERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":null,"latest_source_date":"2026-07","review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":13,"filled":2,"total":16,"groups":[{"group":"Profile","filled":1,"total":6,"missing":["HQ country","HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000140","legacy_id":"C0140","entity_type":"company","name":"Loadpoint","canonical_name":"Loadpoint","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":null,"country_id":null,"country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":null},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Dicing (list mention)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"UNVERIFIED","confidence":{"score":15,"level":"UNVERIFIED"},"evidence_depth":"TIER4","rationale":"Named only in Tier-4 market-report lists; existence, category and identity not verified","notes":null,"source_ids":["SRC-000110"],"discovery_keywords":[],"freshness":"Recent","quality_state":"UNVERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":null,"latest_source_date":"2026-07","review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":13,"filled":2,"total":16,"groups":[{"group":"Profile","filled":1,"total":6,"missing":["HQ country","HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000133","legacy_id":"C0133","entity_type":"company","name":"Wuhan Raycus Fiber Laser Technologies","canonical_name":"Wuhan Raycus Fiber Laser Technologies","aliases":[],"former_names":[],"company_type":"Laser source","supplier_types":["Laser Supplier","Component Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Inferred from the company name","country_basis_code":"NAME","city":"Wuhan","region":"Asia-Pacific"},"ownership":"Public","exchange":"SZSE","ticker":"300747","website":"https://en.raycuslaser.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Fiber lasers (CW and pulsed)","primary_equipment":"BOM: Laser Source","equipment_ids":[],"component_class_ids":["CMPN-000010"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000267","SRC-000268"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":69,"filled":11,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"300747","basis":"Stock ticker (SZSE)"}]},{"id":"CMP-000134","legacy_id":"C0134","entity_type":"company","name":"Shenzhen JPT Opto-electronics","canonical_name":"Shenzhen JPT Opto-electronics","aliases":[],"former_names":[],"company_type":"Laser source","supplier_types":["Laser Supplier","Component Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Inferred from the company name","country_basis_code":"NAME","city":"Shenzhen","region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://en.jptoe.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"MOPA pulsed fiber lasers","primary_equipment":"BOM: Laser Source","equipment_ids":[],"component_class_ids":["CMPN-000010"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000266"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000135","legacy_id":"C0135","entity_type":"company","name":"Wuhan Huaray Precision Laser","canonical_name":"Wuhan Huaray Precision Laser","aliases":[],"former_names":[],"company_type":"Laser source","supplier_types":["Laser Supplier","Component Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Inferred from the company name","country_basis_code":"NAME","city":"Wuhan","region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://en.huaraylaser.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"fs / ps / ns UV lasers","primary_equipment":"BOM: Laser Source","equipment_ids":[],"component_class_ids":["CMPN-000010"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":"Two domains observed (CONFLICT_REVIEW)","source_ids":["SRC-000265"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"CONFLICTING","missing_key_fields":["Headquarters country (source)","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000136","legacy_id":"C0136","entity_type":"company","name":"Sino-Galvo","canonical_name":"Sino-Galvo","aliases":[],"former_names":[],"company_type":"Optics/galvo","supplier_types":["Optics Supplier","Component Supplier"],"supply_chain_level":"LV3","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Inferred from the company name","country_basis_code":"NAME","city":"Beijing","region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.sino-galvo.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Galvanometer scanners / scan heads","primary_equipment":"BOM: Galvo","equipment_ids":[],"component_class_ids":["CMPN-000016"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":"Beijing and Jiangsu entities (RELATED)","source_ids":["SRC-000257","SRC-000258"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000137","legacy_id":"C0137","entity_type":"company","name":"Hangzhou Hikrobot","canonical_name":"Hangzhou Hikrobot","aliases":[],"former_names":[],"company_type":"Vision","supplier_types":["Component Supplier"],"supply_chain_level":"LV3","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Inferred from the company name","country_basis_code":"NAME","city":"Hangzhou","region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.hikrobotics.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Industrial cameras and machine-vision products","primary_equipment":"BOM: Camera; BOM: Vision Controller","equipment_ids":[],"component_class_ids":["CMPN-000022","CMPN-000051"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000281"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000138","legacy_id":"C0138","entity_type":"company","name":"TEYU S&A Chiller","canonical_name":"TEYU S&A Chiller","aliases":[],"former_names":[],"company_type":"Thermal/fume","supplier_types":["Component Supplier"],"supply_chain_level":"LV3","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.teyuchiller.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Industrial chillers for laser & process cooling","primary_equipment":"BOM: Chiller","equipment_ids":[],"component_class_ids":["CMPN-000038"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":"HQ","japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000284"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000141","legacy_id":"C0141","entity_type":"company","name":"3D-Micromac","canonical_name":"3D-Micromac","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"Chemnitz","region":"Europe"},"ownership":"Private","exchange":null,"ticker":null,"website":"https://3d-micromac.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"TLS laser dicing (microDICE: Si, SiC, Ge, GaAs); laser annealing (microPRO XS OCF, microVEGA xMR)","primary_equipment":"Laser Dicing; Laser Annealing; Dicing","equipment_ids":["EQP-C01.02","EQP-A14","EQP-F07","EQP-I08"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000070","SRC-000071","SRC-000072","SRC-000073","SRC-000074","SRC-000075"],"discovery_keywords":[],"freshness":"Needs Review","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-10","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":69,"filled":11,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-I08"],"resolution_keys":[]},{"id":"CMP-000142","legacy_id":"C0142","entity_type":"company","name":"Synova","canonical_name":"Synova","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Switzerland","country_id":"CTY-CH","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":"Private","exchange":null,"ticker":null,"website":"https://www.synova.ch","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Laser MicroJet (water-jet-guided laser) dicing, edge grinding, SiC cutting (LDS 300 M, LDGS 300 A, LCS 303/305)","primary_equipment":"Laser Dicing; Laser Cutting; Dicing","equipment_ids":["EQP-C01.02","EQP-C29","EQP-F07"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000076","SRC-000077","SRC-000078","SRC-000079","SRC-000080"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-07","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000143","legacy_id":"C0143","entity_type":"company","name":"LPKF Laser & Electronics","canonical_name":"LPKF Laser & Electronics","aliases":["Vitrion"],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.lpkf.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":"Vitrion (brand/foundry service)","description":"LIDE laser-induced deep etching of glass (Vitrion S 5000, NEXAR), TGV","primary_equipment":"TGV; Glass Interposer; Laser Drilling","equipment_ids":["EQP-D14","EQP-D18","EQP-C28","EQP-C31"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":"Customer relationship","taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000081","SRC-000082","SRC-000083","SRC-000084","SRC-000085","SRC-000086"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-04","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-C31"],"resolution_keys":[{"alias":"Vitrion","basis":"Recorded alias"}]},{"id":"CMP-000144","legacy_id":"C0144","entity_type":"company","name":"InnoLas Semiconductor","canonical_name":"InnoLas Semiconductor","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Source-stated","country_basis_code":"SRC","city":"Krailling","region":"Europe"},"ownership":"Private","exchange":null,"ticker":null,"website":"https://innolas-semiconductor.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Laser wafer marking (IL 600-4000 / C-series) and wafer sorters","primary_equipment":"Laser Marking; Wafer Handling","equipment_ids":["EQP-C26","EQP-A34"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000229","SRC-000246"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":75,"filled":12,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000145","legacy_id":"C0145","entity_type":"company","name":"Coherent Corp.","canonical_name":"Coherent Corp.","aliases":[],"former_names":[],"company_type":"Laser source","supplier_types":["Laser Supplier","Component Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":"Public","exchange":"NYSE","ticker":"COHR","website":"https://www.coherent.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Excimer/solid-state lasers and systems: UVblade LLO, LineBeam ELA, UVtransfer (LLO/LIFT/repair)","primary_equipment":"Laser lift-off; Laser annealing; Mass transfer; BOM: Laser Source","equipment_ids":["EQP-I06","EQP-I07","EQP-I08"],"component_class_ids":["CMPN-000010"],"candidate_categories":null,"candidate_basis":null,"market_class":"GLOBAL_LEADER","market_class_basis":"Company revenue USD 5,810 m (FY2025 (Jul 2024-Jun 2025), S0159)","revenue":{"usd_m":5810,"fiscal_year":"FY2025 (Jul 2024-Jun 2025)","reported":"USD 5,810.0","basis":"Reported (converted to USD)"},"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[{"fiscal_year":"FY2025 (Jul 2024-Jun 2025)","metric":"Revenue","currency":"USD","value":5810,"usd_m":5810,"value_type":"REPORTED","source_ids":["SRC-000159"],"note":"+23%"},{"fiscal_year":"FY2026 (Jul 2025-Jun 2026)","metric":"Revenue","currency":"USD","value":7130,"usd_m":7130,"value_type":"DERIVED","source_ids":["SRC-000160","SRC-000161","SRC-000162","SRC-000163"],"note":"Sum of reported quarters 1,580 + 1,690 + 1,810 + 2,050"},{"fiscal_year":"FY2026 Q1","metric":"Quarterly revenue","currency":"USD","value":1580,"usd_m":1580,"value_type":"REPORTED","source_ids":["SRC-000160"],"note":null},{"fiscal_year":"FY2026 Q2","metric":"Quarterly revenue","currency":"USD","value":1690,"usd_m":1690,"value_type":"REPORTED","source_ids":["SRC-000161"],"note":null},{"fiscal_year":"FY2026 Q3","metric":"Quarterly revenue","currency":"USD","value":1810,"usd_m":1810,"value_type":"REPORTED","source_ids":["SRC-000162"],"note":null},{"fiscal_year":"FY2026 Q4","metric":"Quarterly revenue","currency":"USD","value":2050,"usd_m":2050,"value_type":"REPORTED","source_ids":["SRC-000163"],"note":null}],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000093","SRC-000094","SRC-000095","SRC-000096","SRC-000159","SRC-000160","SRC-000161","SRC-000162","SRC-000163","SRC-000226"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-08-12","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":69,"filled":11,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":2,"total":3,"missing":["Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"Coherent","basis":"Name without legal suffix"},{"alias":"COHR","basis":"Stock ticker (NYSE)"}]},{"id":"CMP-000146","legacy_id":"C0146","entity_type":"company","name":"IPG Photonics","canonical_name":"IPG Photonics","aliases":[],"former_names":[],"company_type":"Laser source","supplier_types":["Laser Supplier","Component Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":"Public","exchange":"NASDAQ","ticker":"IPGP","website":"https://www.ipgphotonics.com","founded":null,"employees":"4,840 (Tier 4)","ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Fiber lasers (ns pulsed), UV marking scan modules","primary_equipment":"BOM: Laser Source; BOM: Galvo","equipment_ids":[],"component_class_ids":["CMPN-000010","CMPN-000016"],"candidate_categories":null,"candidate_basis":null,"market_class":"TIER_2","market_class_basis":"Company revenue USD 1,000 m (FY2025 (Jan-Dec 2025), S0164)","revenue":{"usd_m":1000,"fiscal_year":"FY2025 (Jan-Dec 2025)","reported":"USD 1,000.0","basis":"Reported (converted to USD)"},"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[{"fiscal_year":"FY2025 (Jan-Dec 2025)","metric":"Revenue","currency":"USD","value":1000,"usd_m":1000,"value_type":"REPORTED","source_ids":["SRC-000164"],"note":"Tier 4 citing 10-K"}],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000164","SRC-000269","SRC-000270"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":75,"filled":12,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":3,"total":3,"missing":[]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"IPGP","basis":"Stock ticker (NASDAQ)"}]},{"id":"CMP-000147","legacy_id":"C0147","entity_type":"company","name":"TRUMPF","canonical_name":"TRUMPF","aliases":[],"former_names":[],"company_type":"Laser source","supplier_types":["Laser Supplier","Component Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":"Private","exchange":null,"ticker":null,"website":"https://www.trumpf.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Ultrashort-pulse lasers (TruMicro 2000/5000/8000/9000, TruMicro Mark); electronics solutions","primary_equipment":"BOM: Laser Source","equipment_ids":[],"component_class_ids":["CMPN-000010"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000260","SRC-000261","SRC-000223"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000148","legacy_id":"C0148","entity_type":"company","name":"MKS Instruments","canonical_name":"MKS Instruments","aliases":["ESI","Spectra-Physics"],"former_names":[],"company_type":"Laser source","supplier_types":["Laser Supplier","Component Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.mks.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":"Spectra-Physics; ESI; Newport","description":"Spectra-Physics lasers (IceFyre ps UV/green); ESI laser via drilling (Geode A CO2, Geode X UV)","primary_equipment":"Laser Drilling; BOM: Laser Source","equipment_ids":["EQP-C28"],"component_class_ids":["CMPN-000010"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000230","SRC-000247","SRC-000262","SRC-000263"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2023-05-31","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"ESI","basis":"Recorded alias"},{"alias":"Spectra-Physics","basis":"Recorded alias"}]},{"id":"CMP-000149","legacy_id":"C0149","entity_type":"company","name":"Light Conversion","canonical_name":"Light Conversion","aliases":[],"former_names":[],"company_type":"Laser source","supplier_types":["Laser Supplier","Component Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"Lithuania","country_id":"CTY-LT","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":"Private","exchange":null,"ticker":null,"website":"https://lightcon.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Femtosecond lasers (PHAROS)","primary_equipment":"BOM: Laser Source","equipment_ids":[],"component_class_ids":["CMPN-000010"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000259"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000150","legacy_id":"C0150","entity_type":"company","name":"Amplitude Laser","canonical_name":"Amplitude Laser","aliases":[],"former_names":[],"company_type":"Laser source","supplier_types":["Laser Supplier","Component Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"France","country_id":"CTY-FR","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://amplitude-laser.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Femtosecond lasers (Satsuma X 50 W)","primary_equipment":"BOM: Laser Source","equipment_ids":[],"component_class_ids":["CMPN-000010"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000264"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000151","legacy_id":"C0151","entity_type":"company","name":"Novanta (Cambridge Technology / Synrad)","canonical_name":"Novanta","aliases":["Cambridge Technology / Synrad","Cambridge Technology"],"former_names":[],"company_type":"Optics/galvo","supplier_types":["Optics Supplier","Component Supplier"],"supply_chain_level":"LV3","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://novantaphotonics.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Galvanometer scanners (62xxK/83xxK), ScanMaster controller; Synrad CO2 sources","primary_equipment":"BOM: Galvo; BOM: Software; BOM: Laser Source","equipment_ids":[],"component_class_ids":["CMPN-000016","CMPN-000055","CMPN-000010"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000254","SRC-000255","SRC-INT1"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-09","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"Cambridge Technology / Synrad","basis":"Recorded alias"},{"alias":"Cambridge Technology","basis":"Recorded alias"},{"alias":"Novanta","basis":"Name without parenthetical"},{"alias":"Synrad","basis":"Short form in the name"}]},{"id":"CMP-000152","legacy_id":"C0152","entity_type":"company","name":"SCANLAB","canonical_name":"SCANLAB","aliases":[],"former_names":[],"company_type":"Optics/galvo","supplier_types":["Optics Supplier","Component Supplier"],"supply_chain_level":"LV3","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":"Private","exchange":null,"ticker":null,"website":"https://www.scanlab.de","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Galvanometer scan heads; diffractive optical elements","primary_equipment":"BOM: Galvo; BOM: Beam Shaping / DOE","equipment_ids":[],"component_class_ids":["CMPN-000016","CMPN-000017"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000251","SRC-000252","SRC-000253"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000153","legacy_id":"C0153","entity_type":"company","name":"RAYLASE","canonical_name":"RAYLASE","aliases":[],"former_names":[],"company_type":"Optics/galvo","supplier_types":["Optics Supplier","Component Supplier"],"supply_chain_level":"LV3","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.raylase.de","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"2- and 3-axis deflection units","primary_equipment":"BOM: Galvo","equipment_ids":[],"component_class_ids":["CMPN-000016"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000256"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000154","legacy_id":"C0154","entity_type":"company","name":"Sill Optics","canonical_name":"Sill Optics","aliases":[],"former_names":[],"company_type":"Optics/galvo","supplier_types":["Optics Supplier","Component Supplier"],"supply_chain_level":"LV3","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.silloptics.de","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"F-theta lenses, beam expanders","primary_equipment":"BOM: F-theta Lens; BOM: Beam Expander","equipment_ids":[],"component_class_ids":["CMPN-000015","CMPN-000012"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000282"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2023-06","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000155","legacy_id":"C0155","entity_type":"company","name":"Wavelength Opto-Electronic","canonical_name":"Wavelength Opto-Electronic","aliases":[],"former_names":[],"company_type":"Optics/galvo","supplier_types":["Optics Supplier","Component Supplier"],"supply_chain_level":"LV3","is_startup":false,"hq":{"country":"Singapore","country_id":"CTY-SG","country_basis":"Source-stated","country_basis_code":"SRC","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://wavelength-oe.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"F-theta scan lenses (Ronar-Smith, >400 designs)","primary_equipment":"BOM: F-theta Lens","equipment_ids":[],"component_class_ids":["CMPN-000015"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000283"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000156","legacy_id":"C0156","entity_type":"company","name":"Holo/Or","canonical_name":"Holo/Or","aliases":[],"former_names":[],"company_type":"Optics/galvo","supplier_types":["Optics Supplier","Component Supplier"],"supply_chain_level":"LV3","is_startup":false,"hq":{"country":"Israel","country_id":"CTY-IL","country_basis":"Inferred from the company name","country_basis_code":"NAME","city":null,"region":"Middle East"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.holoor.co.il","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Diffractive optical elements / beam shaping","primary_equipment":"BOM: Beam Shaping / DOE","equipment_ids":[],"component_class_ids":["CMPN-000017"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000293"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000157","legacy_id":"C0157","entity_type":"company","name":"Gooch & Housego","canonical_name":"Gooch & Housego","aliases":[],"former_names":[],"company_type":"Optics/galvo","supplier_types":["Optics Supplier","Component Supplier"],"supply_chain_level":"LV3","is_startup":false,"hq":{"country":"United Kingdom","country_id":"CTY-GB","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":"Public","exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Acousto-optic modulators","primary_equipment":"BOM: AOM","equipment_ids":[],"component_class_ids":["CMPN-000018"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":35,"level":"LOW"},"evidence_depth":"TITLE","rationale":"Tier-3 directory listing only","notes":null,"source_ids":["SRC-000292"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":38,"filled":6,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000158","legacy_id":"C0158","entity_type":"company","name":"Aerotech","canonical_name":"Aerotech","aliases":[],"former_names":[],"company_type":"Motion","supplier_types":["Motion Supplier","Component Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":"Private","exchange":null,"ticker":null,"website":"https://www.aerotech.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Precision stages for wafer dicing, inspection & metrology","primary_equipment":"BOM: Motion Stage; BOM: Linear Motor","equipment_ids":[],"component_class_ids":["CMPN-000004","CMPN-000003"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000271","SRC-000272"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000159","legacy_id":"C0159","entity_type":"company","name":"Physik Instrumente (PI)","canonical_name":"Physik Instrumente","aliases":["PI"],"former_names":[],"company_type":"Motion","supplier_types":["Motion Supplier","Component Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":"Private","exchange":null,"ticker":null,"website":"https://www.physikinstrumente.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":"ACS Motion Control","description":"Air-bearing and linear-motor stages","primary_equipment":"BOM: Motion Stage","equipment_ids":[],"component_class_ids":["CMPN-000004"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000273","SRC-000274"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"PI","basis":"Recorded alias"},{"alias":"Physik Instrumente","basis":"Name without parenthetical"}]},{"id":"CMP-000160","legacy_id":"C0160","entity_type":"company","name":"ACS Motion Control","canonical_name":"ACS Motion Control","aliases":[],"former_names":[],"company_type":"Motion","supplier_types":["Motion Supplier","Component Supplier"],"supply_chain_level":"LV3","is_startup":false,"hq":{"country":"Israel","country_id":"CTY-IL","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Middle East"},"ownership":"Subsidiary","exchange":null,"ticker":null,"website":"https://acsmotioncontrol.com","founded":null,"employees":null,"ceo":null,"parent_company":"PI Group","subsidiaries_brands":null,"description":"Motion controllers and drives for semiconductor OEMs","primary_equipment":"BOM: Servo Drive","equipment_ids":[],"component_class_ids":["CMPN-000002"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000274","SRC-000275"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000161","legacy_id":"C0161","entity_type":"company","name":"ETEL (HEIDENHAIN group)","canonical_name":"ETEL","aliases":[],"former_names":[],"company_type":"Motion","supplier_types":["Motion Supplier","Component Supplier"],"supply_chain_level":"LV3","is_startup":false,"hq":{"country":"Switzerland","country_id":"CTY-CH","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":"Subsidiary","exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":"HEIDENHAIN","subsidiaries_brands":null,"description":"Linear motors and motion systems for semiconductor","primary_equipment":"BOM: Linear Motor; BOM: Motion Stage","equipment_ids":[],"component_class_ids":["CMPN-000003","CMPN-000004"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000276"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"ETEL","basis":"Name without parenthetical"},{"alias":"HEIDENHAIN group","basis":"Short form in the name"}]},{"id":"CMP-000162","legacy_id":"C0162","entity_type":"company","name":"Renishaw","canonical_name":"Renishaw","aliases":[],"former_names":[],"company_type":"Motion","supplier_types":["Motion Supplier","Component Supplier"],"supply_chain_level":"LV3","is_startup":false,"hq":{"country":"United Kingdom","country_id":"CTY-GB","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.renishaw.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Optical and interferometric laser encoders (RLE)","primary_equipment":"BOM: Encoder","equipment_ids":[],"component_class_ids":["CMPN-000006"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000277"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000163","legacy_id":"C0163","entity_type":"company","name":"Cognex","canonical_name":"Cognex","aliases":[],"former_names":[],"company_type":"Vision","supplier_types":["Component Supplier"],"supply_chain_level":"LV3","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.cognex.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Wafer ID readers (In-Sight 1740; 2026 new wafer reader)","primary_equipment":"BOM: Camera; BOM: Vision Controller","equipment_ids":[],"component_class_ids":["CMPN-000022","CMPN-000051"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000278","SRC-000279"],"discovery_keywords":[],"freshness":"Needs Review","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000164","legacy_id":"C0164","entity_type":"company","name":"Basler","canonical_name":"Basler","aliases":[],"former_names":[],"company_type":"Vision","supplier_types":["Component Supplier"],"supply_chain_level":"LV3","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.baslerweb.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Industrial cameras for semiconductor inspection","primary_equipment":"BOM: Camera","equipment_ids":[],"component_class_ids":["CMPN-000022"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000280"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000165","legacy_id":"C0165","entity_type":"company","name":"Keyence","canonical_name":"Keyence","aliases":[],"former_names":[],"company_type":"Vision","supplier_types":["Component Supplier"],"supply_chain_level":"LV3","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Vision systems / laser markers","primary_equipment":"BOM: Camera; Laser Marking","equipment_ids":["EQP-C26"],"component_class_ids":["CMPN-000022"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":"HQ","korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":59,"level":"LOW"},"evidence_depth":"INTERNAL","rationale":"Internal evidence only in Batch 1","notes":null,"source_ids":["SRC-INT1"],"discovery_keywords":[],"freshness":"Recent","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-09","review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":31,"filled":5,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000166","legacy_id":"C0166","entity_type":"company","name":"ULT AG","canonical_name":"ULT AG","aliases":[],"former_names":[],"company_type":"Thermal/fume","supplier_types":["Component Supplier"],"supply_chain_level":"LV3","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.ult-airtec.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Laser fume extraction for electronics & semiconductor production","primary_equipment":"BOM: Fume Extraction","equipment_ids":[],"component_class_ids":["CMPN-000046"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000285"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"ULT","basis":"Name without legal suffix"}]},{"id":"CMP-000168","legacy_id":"C0168","entity_type":"company","name":"Edwards Vacuum","canonical_name":"Edwards Vacuum","aliases":[],"former_names":[],"company_type":"Vacuum/abatement","supplier_types":["Vacuum Supplier","Subsystem Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"United Kingdom","country_id":"CTY-GB","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":"Subsidiary","exchange":null,"ticker":null,"website":"https://www.edwardsvacuum.com","founded":null,"employees":null,"ceo":null,"parent_company":"Atlas Copco (Tier 4 - verify)","subsidiaries_brands":null,"description":"Vacuum pumps, abatement (Atlas)","primary_equipment":"Vacuum Systems; Abatement Systems; BOM: Vacuum System","equipment_ids":["EQP-A42","EQP-A45"],"component_class_ids":["CMPN-000025"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000286","SRC-000287"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000169","legacy_id":"C0169","entity_type":"company","name":"Pfeiffer Vacuum+Fab Solutions","canonical_name":"Pfeiffer Vacuum+Fab Solutions","aliases":[],"former_names":[],"company_type":"Vacuum/abatement","supplier_types":["Vacuum Supplier","Subsystem Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":"Subsidiary","exchange":null,"ticker":null,"website":"https://www.pfeiffer-vacuum.com","founded":null,"employees":null,"ceo":null,"parent_company":"Busch Group","subsidiaries_brands":null,"description":"Vacuum solutions for semiconductor","primary_equipment":"Vacuum Systems; BOM: Vacuum System","equipment_ids":["EQP-A42"],"component_class_ids":["CMPN-000025"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000288","SRC-000289"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2024-10-25","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000170","legacy_id":"C0170","entity_type":"company","name":"Advanced Energy","canonical_name":"Advanced Energy","aliases":[],"former_names":[],"company_type":"RF power","supplier_types":["RF Supplier","Subsystem Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.advancedenergy.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"RF plasma generators (Paramount, eVoS)","primary_equipment":"RF power subsystem (etch/deposition)","equipment_ids":[],"component_class_ids":["CMPN-000031"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":"Subsystem for etch/deposition tools (no RF node in the Part-2 taxonomy; coded SUB-RF)","source_ids":["SRC-000290"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000171","legacy_id":"C0171","entity_type":"company","name":"Comet PCT","canonical_name":"Comet PCT","aliases":[],"former_names":[],"company_type":"RF power","supplier_types":["RF Supplier","Subsystem Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"Switzerland","country_id":"CTY-CH","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":"Subsidiary","exchange":null,"ticker":null,"website":"https://pct.comet.tech","founded":null,"employees":null,"ceo":null,"parent_company":"Comet AG","subsidiaries_brands":null,"description":"RF generators and matching networks","primary_equipment":"RF power subsystem (etch/deposition)","equipment_ids":[],"component_class_ids":["CMPN-000031"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000291"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000172","legacy_id":"C0172","entity_type":"company","name":"Ultra Clean Holdings (UCT)","canonical_name":"Ultra Clean Holdings","aliases":["UCT"],"former_names":[],"company_type":"Gas/chemical delivery","supplier_types":["Gas Supplier","Subsystem Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.uct.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Chemical and gas delivery subsystems","primary_equipment":"Gas Delivery Systems; Chemical Delivery Systems","equipment_ids":["EQP-A43","EQP-A44"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000335"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"UCT","basis":"Recorded alias"},{"alias":"Ultra Clean Holdings","basis":"Name without parenthetical"},{"alias":"Ultra Clean","basis":"Name without legal suffix"}]},{"id":"CMP-000173","legacy_id":"C0173","entity_type":"company","name":"Ichor Systems","canonical_name":"Ichor Systems","aliases":[],"former_names":[],"company_type":"Gas/chemical delivery","supplier_types":["Gas Supplier","Subsystem Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.ichorsystems.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Gas delivery systems and components","primary_equipment":"Gas Delivery Systems","equipment_ids":["EQP-A43","EQP-A44"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000336"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-A44"],"resolution_keys":[]},{"id":"CMP-000174","legacy_id":"C0174","entity_type":"company","name":"Sumitomo Heavy Industries (Mechatronics)","canonical_name":"Sumitomo Heavy Industries","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.shi-mechatronics.jp","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Laser annealing (SWA Green/Hybrid; SWA UV for SiC ohmic contact); distributes TRUMPF & IPG lasers","primary_equipment":"Laser Annealing; Annealing","equipment_ids":["EQP-A14","EQP-F05"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":"HQ","korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000223","SRC-000092"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-09","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"Sumitomo Heavy Industries","basis":"Name without parenthetical"}]},{"id":"CMP-000175","legacy_id":"C0175","entity_type":"company","name":"JSW Aktina System","canonical_name":"JSW Aktina System","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Source-stated","country_basis_code":"SRC","city":"Yokohama","region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.jsw-aktina.co.jp","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Laser annealing: YIELDSCAN (silicidation), SLA/MLA/ELA, LLO; FLC, ELD","primary_equipment":"Laser Annealing; Laser annealing; Laser lift-off; Annealing","equipment_ids":["EQP-A14","EQP-I07","EQP-I06","EQP-F05"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":"HQ","korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000224"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000176","legacy_id":"C0176","entity_type":"company","name":"The Japan Steel Works (JSW)","canonical_name":"The Japan Steel Works","aliases":["JSW"],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":null,"website":"https://www.jsw.co.jp","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Excimer laser anneal (listed in JSW products)","primary_equipment":"Laser annealing","equipment_ids":["EQP-I07"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":"HQ","korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"TITLE","rationale":null,"notes":null,"source_ids":["SRC-000225"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"JSW","basis":"Recorded alias"},{"alias":"The Japan Steel Works","basis":"Name without parenthetical"}]},{"id":"CMP-000177","legacy_id":"C0177","entity_type":"company","name":"LASSE (Laser Systems & Solutions of Europe)","canonical_name":"LASSE","aliases":["Laser Systems & Solutions of Europe"],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"France","country_id":"CTY-FR","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"UV laser annealing LT-3100 (Si IGBT, SiC backside contact)","primary_equipment":"Laser Annealing; Annealing","equipment_ids":["EQP-A14","EQP-F05"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"CONTENT","rationale":null,"notes":"Associated with SCREEN (S0091/S0092) - relationship RELATED","source_ids":["SRC-000091","SRC-000092"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-09","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"Laser Systems & Solutions of Europe","basis":"Recorded alias"},{"alias":"LASSE","basis":"Name without parenthetical"}]},{"id":"CMP-000178","legacy_id":"C0178","entity_type":"company","name":"NKT Photonics","canonical_name":"NKT Photonics","aliases":[],"former_names":[],"company_type":"Laser source","supplier_types":["Laser Supplier","Component Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"Denmark","country_id":"CTY-DK","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":"Subsidiary","exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":"Hamamatsu Photonics","subsidiaries_brands":null,"description":"Fiber/ultrafast lasers","primary_equipment":"BOM: Laser Source","equipment_ids":[],"component_class_ids":["CMPN-000010"],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000166"],"discovery_keywords":[],"freshness":"Needs Review","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-11-07","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000180","legacy_id":"C0180","entity_type":"company","name":"Nearfield Instruments","canonical_name":"Nearfield Instruments","aliases":[],"former_names":[],"company_type":"Startup","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":true,"hq":{"country":"Netherlands","country_id":"CTY-NL","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":"Private","exchange":null,"ticker":null,"website":null,"founded":"2016","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"In-line AFM-based metrology (AUDIRA)","primary_equipment":"Metrology; Wafer Surface Measurement","equipment_ids":["EQP-A25","EQP-A30"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"EMERGING","market_class_basis":"Startup / founded 2016","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":{"founders":null,"year":"2016","funding":"Series D up to USD 380M (post-money USD 1.6B, Tier 3); Series C USD 147.6M 2024 (Tier 4)","investors":"Fidelity; Temasek; QIA; Walden Catalyst (Tier 3)","product":"In-line AFM metrology (AUDIRA)","trl":null,"latest_news":"Series D reported","maturity":null,"source_ids":["SRC-000167","SRC-000168"],"verification":"PARTIALLY_VERIFIED","confidence":"LOW"},"financials":[{"fiscal_year":"Series D (date N/A)","metric":"Post-money valuation","currency":"USD","value":1600,"usd_m":1600,"value_type":"REPORTED","source_ids":["SRC-000167"],"note":"Tier 3"}],"verification":"PARTIALLY_VERIFIED","confidence":{"score":35,"level":"LOW"},"evidence_depth":"CONTENT","rationale":null,"notes":"Founded Jan 2016 as TNO subsidiary (Tier 4)","source_ids":["SRC-000167","SRC-000168"],"discovery_keywords":[],"freshness":"Recent","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-06","review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Website"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000181","legacy_id":"C0181","entity_type":"company","name":"Substrate","canonical_name":"Substrate","aliases":[],"former_names":[],"company_type":"Startup","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":true,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":"Private","exchange":null,"ticker":null,"website":null,"founded":"2022","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Lithography (X-ray light-source based) and fabs","primary_equipment":"Lithography","equipment_ids":["EQP-A01"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"EMERGING","market_class_basis":"Startup / founded 2022","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":{"founders":"Proud brothers (per S0170)","year":"2022","funding":"USD 100M at USD 1B valuation","investors":"Founders Fund; General Catalyst; Allen & Co.; Long Journey; Valor; In-Q-Tel","product":"Lithography (X-ray source based) + fabs","trl":null,"latest_news":"USD 100M round","maturity":"Development","source_ids":["SRC-000169","SRC-000170"],"verification":"VERIFIED","confidence":"MEDIUM"},"financials":[{"fiscal_year":"Latest round (date N/A)","metric":"Valuation","currency":"USD","value":1000,"usd_m":1000,"value_type":"REPORTED","source_ids":["SRC-000169"],"note":null}],"verification":"VERIFIED","confidence":{"score":65,"level":"MEDIUM"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000169","SRC-000170"],"discovery_keywords":[],"freshness":"Needs Review","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-10-29","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Website"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000182","legacy_id":"C0182","entity_type":"company","name":"xLight","canonical_name":"xLight","aliases":[],"former_names":[],"company_type":"Startup","supplier_types":["Equipment OEM"],"supply_chain_level":"LV2","is_startup":true,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":"Private","exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Free-electron-laser EUV light source","primary_equipment":"EUV","equipment_ids":["EQP-A01.01"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"EMERGING","market_class_basis":"Startup / founded N/A","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":{"founders":null,"year":null,"funding":"USD 40M VC; USD 150M CHIPS LOI; USD 350M round in talks","investors":"Playground Global (lead); Boardman Bay Capital; Bain Capital (talks)","product":"Free-electron-laser EUV light source","trl":null,"latest_news":"In talks to raise USD 350M","maturity":"Development","source_ids":["SRC-000171","SRC-000172"],"verification":"VERIFIED","confidence":"MEDIUM"},"financials":[],"verification":"VERIFIED","confidence":{"score":65,"level":"MEDIUM"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000171","SRC-000172"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-06-24","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Official (Tier 1) source"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000183","legacy_id":"C0183","entity_type":"company","name":"Invisix","canonical_name":"Invisix","aliases":[],"former_names":[],"company_type":"Startup","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":true,"hq":{"country":null,"country_id":null,"country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":null},"ownership":"Private","exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"ASML spin-out (technology not captured)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"EMERGING","market_class_basis":"Startup / founded N/A","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":{"founders":null,"year":null,"funding":"EUR 20M","investors":null,"product":null,"trl":null,"latest_news":"EUR 20M round","maturity":null,"source_ids":["SRC-000172"],"verification":"PARTIALLY_VERIFIED","confidence":"LOW"},"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"TITLE","rationale":"Single mention; country and category not captured","notes":null,"source_ids":["SRC-000172"],"discovery_keywords":[],"freshness":"Recent","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-06-24","review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":19,"filled":3,"total":16,"groups":[{"group":"Profile","filled":1,"total":6,"missing":["HQ country","HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000184","legacy_id":"C0184","entity_type":"company","name":"Raana Semiconductors","canonical_name":"Raana Semiconductors","aliases":[],"former_names":[],"company_type":"Startup","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":true,"hq":{"country":"India","country_id":"CTY-IN","country_basis":"Source-stated","country_basis_code":"SRC","city":null,"region":"Asia-Pacific"},"ownership":"Private","exchange":null,"ticker":null,"website":null,"founded":"2015","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Czochralski (CZ) monocrystalline Si ingot growth equipment, 10-12 inch","primary_equipment":"Epitaxy","equipment_ids":["EQP-A09.10","EQP-K01"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"EMERGING","market_class_basis":"Startup / founded 2015","revenue":null,"semiconductor_revenue":null,"india":{"summary":"HQ India; HQ / Development","has_presence":true,"records":[{"type":"HQ / Development","facility":"Raana Semiconductors","location":null,"scope":"CZ Si ingot growth equipment 10-12 inch","technology":null,"opportunity":"Crystal growth equipment","status":"COMMERCIALIZING (orders INR 12 crore FY26)","confidence":"LOW","source_ids":["SRC-000211"]}]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":{"founders":"Rajasekar Elavarasan","year":"2015","funding":"USD 3M seed","investors":"Equirus Innovatex; Artha; IvyCap; PointOne; CIIE; Garimella Laxminarayana","product":"CZ monocrystalline Si ingot growth equipment (10-12 inch)","trl":null,"latest_news":"Seed round","maturity":"Commercializing","source_ids":["SRC-000211"],"verification":"VERIFIED","confidence":"LOW"},"financials":[{"fiscal_year":"FY26 (Apr 2025-Mar 2026)","metric":"Confirmed orders","currency":"INR","value":120,"usd_m":1.4,"value_type":"REPORTED","source_ids":["SRC-000211"],"note":"INR 12 crore"}],"verification":"VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"CONTENT","rationale":null,"notes":"Confirmed orders INR 12 crore FY26 (S0211)","source_ids":["SRC-000211","SRC-000207"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["City","Website","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-09","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":69,"filled":11,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["City","Website"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Official (Tier 1) source"]},{"group":"Geography","filled":1,"total":1,"missing":[]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-K01"],"resolution_keys":[]},{"id":"CMP-000191","legacy_id":"C0191","entity_type":"company","name":"Titan Engineering & Automation Ltd (TEAL)","canonical_name":"Titan Engineering & Automation Ltd","aliases":["TEAL"],"former_names":[],"company_type":"Automation/AMHS","supplier_types":["Automation Supplier","Robotics Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"India","country_id":"CTY-IN","country_basis":"Source-stated","country_basis_code":"SRC","city":"Hosur","region":"Asia-Pacific"},"ownership":"Subsidiary","exchange":null,"ticker":null,"website":"https://www.titanteal.com","founded":null,"employees":null,"ceo":null,"parent_company":"Titan Company Ltd (Tata)","subsidiaries_brands":null,"description":"Automation solutions; laser and photonics","primary_equipment":"Laser Marking; Laser Welding; Factory automation","equipment_ids":["EQP-C26","EQP-C31","EQP-J08"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":"HQ India; HQ / Manufacturing","has_presence":true,"records":[{"type":"HQ / Manufacturing","facility":"TEAL Hosur","location":"Hosur, Tamil Nadu","scope":"Automation; laser platforms","technology":"Withheld in public edition (TEAL internal)","opportunity":"Withheld in public edition (TEAL internal)","status":"OPERATING","confidence":"HIGH","source_ids":["SRC-000200","SRC-INT1"]}]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000200","SRC-INT1"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-09","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":75,"filled":12,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":1,"total":1,"missing":[]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"TEAL","basis":"Recorded alias"},{"alias":"Titan Engineering & Automation Ltd","basis":"Name without parenthetical"},{"alias":"Titan Engineering & Automation","basis":"Name without legal suffix"}]},{"id":"CMP-000192","legacy_id":"C0192","entity_type":"company","name":"ASM Technologies","canonical_name":"ASM Technologies","aliases":[],"former_names":[],"company_type":"Engineering services","supplier_types":["Service Provider"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"India","country_id":"CTY-IN","country_basis":"Source-stated","country_basis_code":"SRC","city":"Bengaluru","region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Engineering services & product R&D: semiconductor equipment design, vacuum, robotics, motion control","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":"A38;A42","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":"HQ India; HQ / Engineering","has_presence":true,"records":[{"type":"HQ / Engineering","facility":"ASM Technologies","location":"Bengaluru","scope":"Semiconductor equipment design, vacuum, robotics, motion control","technology":null,"opportunity":"Engineering services for equipment OEMs","status":"OPERATING","confidence":"LOW","source_ids":["SRC-000213"]}]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000213","SRC-000037","SRC-000207"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-09","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":1,"total":1,"missing":[]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000193","legacy_id":"C0193","entity_type":"company","name":"Hind High Vacuum (HHV)","canonical_name":"Hind High Vacuum","aliases":["HHV"],"former_names":[],"company_type":"Vacuum/abatement","supplier_types":["Vacuum Supplier","Subsystem Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"India","country_id":"CTY-IN","country_basis":"Source-stated","country_basis_code":"SRC","city":"Bengaluru","region":"Asia-Pacific"},"ownership":"Private","exchange":null,"ticker":null,"website":null,"founded":null,"employees":"~750","ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Vacuum and thin-film systems; ~750 employees; three Bangalore plants","primary_equipment":"Vacuum Systems","equipment_ids":["EQP-A42"],"component_class_ids":[],"candidate_categories":"A09.09","candidate_basis":"Analyst knowledge — unverified; not used for filtering","market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":"HQ India; HQ / Manufacturing","has_presence":true,"records":[{"type":"HQ / Manufacturing","facility":"HHV - three plants","location":"Bengaluru","scope":"Vacuum and thin-film systems","technology":null,"opportunity":"Vacuum subsystems","status":"OPERATING","confidence":"LOW","source_ids":["SRC-000038"]}]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":95,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000038","SRC-000037","SRC-000207"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Website","Founded year"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-09","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":75,"filled":12,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":2,"total":3,"missing":["Revenue (reported)"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":1,"total":1,"missing":[]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"HHV","basis":"Recorded alias"},{"alias":"Hind High Vacuum","basis":"Name without parenthetical"}]},{"id":"CMP-000194","legacy_id":"C0194","entity_type":"company","name":"ASM Technologies-HHV JV","canonical_name":"ASM Technologies-HHV JV","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"India","country_id":"CTY-IN","country_basis":"Source-stated","country_basis_code":"SRC","city":"Bengaluru","region":"Asia-Pacific"},"ownership":"JV (50:50)","exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Design-led engineering & manufacturing of tools/sub-systems; crystal puller prototype and wafer handling (Tier 4)","primary_equipment":"Epitaxy; Wafer Handling","equipment_ids":["EQP-A09.10","EQP-A34","EQP-K01"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":"HQ India; Manufacturing (JV)","has_presence":true,"records":[{"type":"Manufacturing (JV)","facility":"ASM Technologies-HHV JV","location":null,"scope":"Tools, sub-systems, components; crystal puller prototype & wafer handling (Tier 4)","technology":null,"opportunity":"Equipment sub-system manufacturing","status":"FORMED 2022","confidence":"HIGH","source_ids":["SRC-000037","SRC-000207"]}]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":"JV legal name not captured","source_ids":["SRC-000037","SRC-000207"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-09","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":75,"filled":12,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":4,"total":4,"missing":[]},{"group":"Geography","filled":1,"total":1,"missing":[]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-K01"],"resolution_keys":[]},{"id":"CMP-000195","legacy_id":"C0195","entity_type":"company","name":"SLTL (Sahajanand Laser Technology)","canonical_name":"SLTL","aliases":["Sahajanand Laser Technology"],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"India","country_id":"CTY-IN","country_basis":"Source-stated","country_basis_code":"SRC","city":"Gandhinagar","region":"Asia-Pacific"},"ownership":"Private","exchange":null,"ticker":null,"website":"https://www.sltl.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Laser machines incl. Wafer Dicing System, solar cell cutting","primary_equipment":"Laser Dicing","equipment_ids":["EQP-C01.02"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":"HQ India; HQ / Manufacturing","has_presence":true,"records":[{"type":"HQ / Manufacturing","facility":"SLTL","location":"Gandhinagar, Gujarat","scope":"Laser machines incl. Wafer Dicing System","technology":"Laser sources (not documented)","opportunity":"Laser dicing for Indian OSATs","status":"OPERATING","confidence":"HIGH","source_ids":["SRC-000208"]}]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":80,"level":"HIGH"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000208"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":75,"filled":12,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Two or more sources"]},{"group":"Geography","filled":1,"total":1,"missing":[]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"Sahajanand Laser Technology","basis":"Recorded alias"},{"alias":"SLTL","basis":"Name without parenthetical"}]},{"id":"CMP-000196","legacy_id":"C0196","entity_type":"company","name":"INOX India","canonical_name":"INOX India","aliases":[],"former_names":[],"company_type":"Facility/integration","supplier_types":["Integrator","Service Provider"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"India","country_id":"CTY-IN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":"Public","exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"UHP orbital welding for fab piping (first order: Tata Dholera)","primary_equipment":"Gas Delivery Systems","equipment_ids":["EQP-A43"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":"HQ India; Service / Manufacturing","has_presence":true,"records":[{"type":"Service / Manufacturing","facility":"INOX India","location":null,"scope":"UHP orbital welding","technology":null,"opportunity":"Fab facility UHP systems","status":"FIRST ORDER 2026-09","confidence":"LOW","source_ids":["SRC-000212"]}]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"CONTENT","rationale":null,"notes":null,"source_ids":["SRC-000212"],"discovery_keywords":[],"freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-09-23","review_due":"2027-09-29"},"batch":"Batch 1","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Official (Tier 1) source"]},{"group":"Geography","filled":1,"total":1,"missing":[]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000197","legacy_id":"C0197","entity_type":"company","name":"Tessolve","canonical_name":"Tessolve","aliases":[],"former_names":[],"company_type":"Engineering services","supplier_types":["Service Provider"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"India","country_id":"CTY-IN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.tessolve.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Semiconductor test engineering / test lab services","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":"HQ India; Services","has_presence":true,"records":[{"type":"Services","facility":"Tessolve","location":null,"scope":"Test engineering","technology":null,"opportunity":"Test services","status":"OPERATING (title-level)","confidence":"HIGH","source_ids":["SRC-000216"]}]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":59,"level":"LOW"},"evidence_depth":"TITLE","rationale":"Title-level only; service provider, not equipment OEM","notes":null,"source_ids":["SRC-000216"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":38,"filled":6,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":1,"total":1,"missing":[]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000198","legacy_id":"C0198","entity_type":"company","name":"ATS India","canonical_name":"ATS India","aliases":[],"former_names":[],"company_type":"Distributor/service","supplier_types":["Distributor","Service Provider"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"India","country_id":"CTY-IN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Exclusive distribution partner for Hirata in India","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":"HQ India","has_presence":true,"records":[{"type":"HQ India","facility":null,"location":null,"scope":"Exclusive distribution partner for Hirata in India","technology":null,"opportunity":null,"status":"PARTIALLY_VERIFIED","confidence":"LOW","source_ids":["SRC-000214"]}]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"CONTENT","rationale":"Name only in one article","notes":null,"source_ids":["SRC-000214"],"discovery_keywords":[],"freshness":"Recent","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-09-16","review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":25,"filled":4,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":1,"total":1,"missing":[]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000199","legacy_id":"C0199","entity_type":"company","name":"Linde India","canonical_name":"Linde India","aliases":[],"former_names":[],"company_type":"Materials/gases","supplier_types":["Materials Supplier","Gas Supplier"],"supply_chain_level":"LV4","is_startup":false,"hq":{"country":"India","country_id":"CTY-IN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":"Subsidiary","exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":"Linde plc","subsidiaries_brands":null,"description":"Specialty gases (Sanand facility)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":"HQ India; Manufacturing (gases)","has_presence":true,"records":[{"type":"Manufacturing (gases)","facility":"Sanand specialty gas facility","location":"Sanand, Gujarat","scope":"High-purity specialty gases","technology":null,"opportunity":null,"status":"REPORTED (Tier 4)","confidence":"UNVERIFIED","source_ids":["SRC-000205"]}]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"UNVERIFIED","confidence":{"score":15,"level":"UNVERIFIED"},"evidence_depth":"TIER4","rationale":"Tier-4 tracker only","notes":null,"source_ids":["SRC-000205"],"discovery_keywords":[],"freshness":"Needs Review","quality_state":"UNVERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":null,"latest_source_date":"2026","review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":31,"filled":5,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":1,"total":1,"missing":[]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000200","legacy_id":"C0200","entity_type":"company","name":"Aequs","canonical_name":"Aequs","aliases":[],"former_names":[],"company_type":"Subsystem supplier","supplier_types":["Subsystem Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"India","country_id":"CTY-IN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Precision manufacturing (no semiconductor-equipment activity established)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":"HQ India","has_presence":true,"records":[{"type":"HQ India","facility":null,"location":null,"scope":"Precision manufacturing (no semiconductor-equipment activity established)","technology":null,"opportunity":null,"status":"UNVERIFIED","confidence":"UNVERIFIED","source_ids":["SRC-000039"]}]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"UNVERIFIED","confidence":{"score":34,"level":"UNVERIFIED"},"evidence_depth":"CONTENT","rationale":"Official site reviewed; no semiconductor activity found","notes":null,"source_ids":["SRC-000039"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"UNVERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":null,"latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":31,"filled":5,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":1,"total":1,"missing":[]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000201","legacy_id":"C0201","entity_type":"company","name":"HCLTech (ATE lab)","canonical_name":"HCLTech","aliases":[],"former_names":[],"company_type":"Engineering services","supplier_types":["Service Provider"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"India","country_id":"CTY-IN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"ATE lab (Tier 4 mention)","primary_equipment":null,"equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence in Batch 1","revenue":null,"semiconductor_revenue":null,"india":{"summary":"HQ India; Lab","has_presence":true,"records":[{"type":"Lab","facility":"HCLTech ATE lab","location":null,"scope":"ATE","technology":null,"opportunity":null,"status":"REPORTED (Tier 4)","confidence":"UNVERIFIED","source_ids":["SRC-000207"]}]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"UNVERIFIED","confidence":{"score":15,"level":"UNVERIFIED"},"evidence_depth":"TIER4","rationale":"Tier-4 blog only","notes":null,"source_ids":["SRC-000207"],"discovery_keywords":[],"freshness":"Recent","quality_state":"UNVERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":null,"latest_source_date":"2026-09","review_due":"2027-03-29"},"batch":"Batch 1","completeness":{"score":25,"filled":4,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":1,"total":1,"missing":[]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"HCLTech","basis":"Name without parenthetical"},{"alias":"ATE lab","basis":"Short form in the name"}]},{"id":"CMP-000361","legacy_id":"C0361","entity_type":"company","name":"Atlas Copco (Compressors)","canonical_name":"Atlas Copco","aliases":[],"former_names":[],"company_type":"Facility/integration","supplier_types":["Integrator","Service Provider"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Sweden","country_id":"CTY-SE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.atlascopco.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Oil-free compressors, desiccant dryers and filtration for clean dry air (CDA) in semiconductor fabs","equipment_ids":["EQP-L09"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 10 (2026-10-05): found by keyword search (\"clean dry air semiconductor; CDA compressor fab\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000910","SRC-000911"],"discovery_keywords":["clean dry air semiconductor","CDA compressor fab"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 10","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"Atlas Copco","basis":"Name without parenthetical"}]},{"id":"CMP-000362","legacy_id":"C0362","entity_type":"company","name":"DAS Environmental Expert","canonical_name":"DAS Environmental Expert","aliases":[],"former_names":[],"company_type":"Vacuum/abatement","supplier_types":["Vacuum Supplier","Subsystem Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Dresden","region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.das-ee.com","founded":"1991","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Point-of-use waste-gas treatment: burn-wet, plasma-wet, wet, pyrolysis and catalytic scrubbers, electrostatic filters","equipment_ids":["EQP-L02","EQP-A45"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 10 (2026-10-05): found by keyword search (\"point-of-use abatement; exhaust gas scrubber semiconductor\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Founded 1991, headquartered in Dresden — per search summary of das-ee.com. No revenue, market share or customer claims.","source_ids":["SRC-000912","SRC-000913"],"discovery_keywords":["point-of-use abatement","exhaust gas scrubber semiconductor"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Employees"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 10","completeness":{"score":69,"filled":11,"total":16,"groups":[{"group":"Profile","filled":6,"total":6,"missing":[]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000363","legacy_id":"C0363","entity_type":"company","name":"Yaskawa Electric (Semiconductor robotics)","canonical_name":"Yaskawa Electric","aliases":[],"former_names":[],"company_type":"Automation/AMHS","supplier_types":["Automation Supplier","Robotics Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.yaskawa-global.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Semistar wafer-handling robots (atmospheric and vacuum), controllers and EFEM","equipment_ids":["EQP-A38","EQP-A39","EQP-A37","EQP-A34"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 10 (2026-10-05): found by keyword search (\"wafer handling robot; vacuum wafer robot\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Atmospheric and vacuum robots plus EFEM and enclosures — per search summaries of Yaskawa Israel and Yaskawa Europe pages. No revenue, market share or customer claims.","source_ids":["SRC-000914","SRC-000915"],"discovery_keywords":["wafer handling robot","vacuum wafer robot"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 10","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-A34"],"resolution_keys":[{"alias":"Yaskawa Electric","basis":"Name without parenthetical"}]},{"id":"CMP-000364","legacy_id":"C0364","entity_type":"company","name":"Cimetrix (PDF Solutions)","canonical_name":"Cimetrix","aliases":["PDF Solutions"],"former_names":[],"company_type":"Automation/AMHS","supplier_types":["Automation Supplier","Robotics Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.cimetrix.com","founded":null,"employees":null,"ceo":null,"parent_company":"PDF Solutions","subsidiaries_brands":null,"description":null,"primary_equipment":"SECS/GEM, GEM300 and EDA equipment-connectivity software (CIMConnect, CIM300, CIMPortal)","equipment_ids":["EQP-J10"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 10 (2026-10-05): found by keyword search (\"SECS/GEM software; equipment automation software\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Wholly owned subsidiary of PDF Solutions — per search summary of pdf.com. No revenue, market share or customer claims.","source_ids":["SRC-000916","SRC-000917"],"discovery_keywords":["SECS/GEM software","equipment automation software"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 10","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"PDF Solutions","basis":"Recorded alias"},{"alias":"Cimetrix","basis":"Name without parenthetical"}]},{"id":"CMP-000365","legacy_id":"C0365","entity_type":"company","name":"INFICON","canonical_name":"INFICON","aliases":[],"former_names":[],"company_type":"Subsystem supplier","supplier_types":["Subsystem Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Switzerland","country_id":"CTY-CH","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.inficon.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Fault-detection (FDC) software FabGuard, in-situ sensors and process-data analysis","equipment_ids":["EQP-J15"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 10 (2026-10-05): found by keyword search (\"fault detection classification semiconductor; FDC software\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000918","SRC-000919"],"discovery_keywords":["fault detection classification semiconductor","FDC software"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 10","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000366","legacy_id":"C0366","entity_type":"company","name":"SYNUS Tech","canonical_name":"SYNUS Tech","aliases":[],"former_names":[],"company_type":"Automation/AMHS","supplier_types":["Automation Supplier","Robotics Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Seongnam","region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Automated material handling (AMHS) and overhead transport (OHT) for semiconductor and display fabs","equipment_ids":["EQP-J01","EQP-J02"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 10 (2026-10-05): found by keyword search (\"OHT Korea; AMHS semiconductor Korea\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: AMHS / OHT scope and Seongnam location per search summary of the SEMI directory and investor profiles; founding year conflicts between summaries and is not recorded. No revenue, market share or customer claims.","source_ids":["SRC-000920"],"discovery_keywords":["OHT Korea","AMHS semiconductor Korea"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Website","Founded year","Employees"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 10","completeness":{"score":38,"filled":6,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000367","legacy_id":"C0367","entity_type":"company","name":"V Technology","canonical_name":"V Technology","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Yokohama","region":"Asia-Pacific"},"ownership":null,"exchange":"TSE","ticker":"7717","website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Flat-panel display inspection, repair and measurement equipment; photomask equipment","equipment_ids":["EQP-I04","EQP-I05"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 10 (2026-10-05): found by keyword search (\"display laser repair; FPD inspection equipment\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: FPD inspection / repair scope, Yokohama HQ and ticker 7717 — per search summaries of investor profiles. No revenue, market share or customer claims.","source_ids":["SRC-000921"],"discovery_keywords":["display laser repair","FPD inspection equipment"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Website","Founded year","Employees"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 10","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"7717","basis":"Stock ticker (TSE)"}]},{"id":"CMP-000368","legacy_id":"C0368","entity_type":"company","name":"Charm Engineering","canonical_name":"Charm Engineering","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":"KRX","ticker":"009310","website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Laser / ink repair equipment for LCD, OLED, QD-OLED and micro-LED panels","equipment_ids":["EQP-I05","EQP-I01"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 10 (2026-10-05): found by keyword search (\"OLED laser repair; micro LED repair equipment\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Repair-equipment scope and micro-LED TFT-array repair with KOPTI — per search summaries of LEDinside and investor profiles. No revenue, market share or customer claims.","source_ids":["SRC-000922"],"discovery_keywords":["OLED laser repair","micro LED repair equipment"],"freshness":"Recent","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":"2026-06","review_due":"2027-03-29"},"batch":"Batch 10","completeness":{"score":31,"filled":5,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"009310","basis":"Stock ticker (KRX)"}]},{"id":"CMP-000369","legacy_id":"C0369","entity_type":"company","name":"Omron (Industrial Automation)","canonical_name":"Omron","aliases":[],"former_names":[],"company_type":"Automation/AMHS","supplier_types":["Automation Supplier","Robotics Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://industrial.omron.eu","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Autonomous mobile robots and mobile manipulators for FOUP / material transport in front-end and back-end fabs","equipment_ids":["EQP-J04"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 10 (2026-10-05): found by keyword search (\"AMR semiconductor fab; FOUP transport mobile robot\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000923","SRC-000924"],"discovery_keywords":["AMR semiconductor fab","FOUP transport mobile robot"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 10","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"Omron","basis":"Name without parenthetical"}]},{"id":"CMP-000370","legacy_id":"C0370","entity_type":"company","name":"Merck Electronics (EMD Electronics)","canonical_name":"Merck Electronics","aliases":["EMD Electronics"],"former_names":[],"company_type":"Gas/chemical delivery","supplier_types":["Gas Supplier","Subsystem Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.emdgroup.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Specialty materials and CHEMGUARD high-purity chemical delivery / bulk distribution systems","equipment_ids":["EQP-L05","EQP-A44"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 10 (2026-10-05): found by keyword search (\"bulk chemical delivery system; chemical refill system semiconductor\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000925"],"discovery_keywords":["bulk chemical delivery system","chemical refill system semiconductor"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 10","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"EMD Electronics","basis":"Recorded alias"},{"alias":"Merck Electronics","basis":"Name without parenthetical"}]},{"id":"CMP-000202","legacy_id":"C0202","entity_type":"company","name":"PVA TePla","canonical_name":"PVA TePla","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Source-stated","country_basis_code":"SRC","city":"Wettenberg","region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.pvatepla.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Crystal growing systems (Czochralski, float zone, PVT for SiC)","equipment_ids":["EQP-K01"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 2 (2026-09-30): added because its official site/brochure names semiconductor equipment in the empty processes; located by web search, page content not read directly. HQ country from analyst knowledge unless stated in the source title.","source_ids":["SRC-000350"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2022-04","review_due":"2027-03-29"},"batch":"Batch 2","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000203","legacy_id":"C0203","entity_type":"company","name":"Okamoto Machine Tool Works","canonical_name":"Okamoto Machine Tool Works","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.okamoto.co.jp","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Wafer final polishers; CMP; backgrinders","equipment_ids":["EQP-K07","EQP-A19","EQP-C03"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 2 (2026-09-30): added because its official site/brochure names semiconductor equipment in the empty processes; located by web search, page content not read directly. HQ country from analyst knowledge unless stated in the source title.","source_ids":["SRC-000351"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 2","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000204","legacy_id":"C0204","entity_type":"company","name":"Organo Corporation","canonical_name":"Organo Corporation","aliases":[],"former_names":[],"company_type":"Facility/integration","supplier_types":["Integrator","Service Provider"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.organo.co.jp","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Ultrapure water production systems","equipment_ids":["EQP-L08"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 2 (2026-09-30): added because its official site/brochure names semiconductor equipment in the empty processes; located by web search, page content not read directly. HQ country from analyst knowledge unless stated in the source title.","source_ids":["SRC-000352"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 2","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"Organo","basis":"Name without legal suffix"}]},{"id":"CMP-000205","legacy_id":"C0205","entity_type":"company","name":"Kurita Water Industries","canonical_name":"Kurita Water Industries","aliases":[],"former_names":[],"company_type":"Facility/integration","supplier_types":["Integrator","Service Provider"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.kurita.co.jp","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Ultrapure water production systems","equipment_ids":["EQP-L08"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 2 (2026-09-30): added because its official site/brochure names semiconductor equipment in the empty processes; located by web search, page content not read directly. HQ country from analyst knowledge unless stated in the source title.","source_ids":["SRC-000353"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 2","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000206","legacy_id":"C0206","entity_type":"company","name":"Nordson Corporation","canonical_name":"Nordson Corporation","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.nordson.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"X-ray inspection (Nordson Test & Inspection)","equipment_ids":["EQP-C35"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 2 (2026-09-30): added because its official site/brochure names semiconductor equipment in the empty processes; located by web search, page content not read directly. HQ country from analyst knowledge unless stated in the source title.","source_ids":["SRC-000354"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 2","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"Nordson","basis":"Name without legal suffix"}]},{"id":"CMP-000207","legacy_id":"C0207","entity_type":"company","name":"SpeedFam","canonical_name":"SpeedFam","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.speedfam.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Double-side polishers / lappers","equipment_ids":["EQP-K05","EQP-K07","EQP-K06"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 2 (2026-09-30): added because its official site/brochure names semiconductor equipment in the empty processes; located by web search, page content not read directly. HQ country from analyst knowledge unless stated in the source title.","source_ids":["SRC-000477"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 2","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-K06"],"resolution_keys":[]},{"id":"CMP-000208","legacy_id":"C0208","entity_type":"company","name":"Lace Lithography","canonical_name":"Lace Lithography","aliases":[],"former_names":[],"company_type":"Startup","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":true,"hq":{"country":"Norway","country_id":"CTY-NO","country_basis":"Source-stated","country_basis_code":"SRC","city":"Bergen","region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":"2023","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Develops lithography that writes with a beam of neutral helium atoms instead of light","primary_equipment":"Helium atom-beam lithography (in development)","equipment_ids":["EQP-A01"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":{"founders":"Bodil Holst (CEO); Adrià Salvador Palau (CTO) — per news summary","year":"2023","funding":"USD 40M (Series A, Mar 2026 — news titles)","investors":"Microsoft-backed (per Reuters/BNN headline)","product":"Helium atom-beam lithography","trl":null,"latest_news":"Raised USD 40M (Mar 2026)","maturity":"Development","source_ids":["SRC-000492","SRC-000493","SRC-000494"],"verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM"},"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Bergen HQ and helium atom-beam approach per eeNews Europe; USD 40M round per multiple news titles (Mar 2026). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000492","SRC-000493","SRC-000494"],"discovery_keywords":[],"freshness":"Recent","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Website","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2026-03-23","review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["Website"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000209","legacy_id":"C0209","entity_type":"company","name":"Multibeam Corporation","canonical_name":"Multibeam Corporation","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":true,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Santa Clara","region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://multibeamcorp.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":"Multicolumn e-beam direct-write lithography for production","primary_equipment":"Multicolumn e-beam lithography (MEBL), direct write","equipment_ids":["EQP-A01.06","EQP-A01.08"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":{"founders":"David K. Lam (per company site summary)","year":null,"funding":null,"investors":null,"product":"Multicolumn E-Beam Lithography (MEBL) system","trl":null,"latest_news":"First MEBL system delivered to SkyWater for volume production (2024)","maturity":"First production system shipped","source_ids":["SRC-000495","SRC-000496"],"verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM"},"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Santa Clara HQ and founder (Dr. David K. Lam) per search summary of multibeamcorp.com / Synopsys story. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000495","SRC-000496"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"Multibeam","basis":"Name without legal suffix"}]},{"id":"CMP-000210","legacy_id":"C0210","entity_type":"company","name":"Raith","canonical_name":"Raith","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://raith.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Electron beam lithography (VOYAGER, EBPG)","equipment_ids":["EQP-A01.06"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000497"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000211","legacy_id":"C0211","entity_type":"company","name":"Heidelberg Instruments","canonical_name":"Heidelberg Instruments","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"Heidelberg","region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://heidelberg-instruments.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Maskless aligners (MLA) and direct-write laser lithography","equipment_ids":["EQP-A01.08"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000498"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000212","legacy_id":"C0212","entity_type":"company","name":"Obducat","canonical_name":"Obducat","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Sweden","country_id":"CTY-SE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.obducat.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Nanoimprint lithography (SINDRE)","equipment_ids":["EQP-A01.07"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000499"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000213","legacy_id":"C0213","entity_type":"company","name":"Forge Nano","canonical_name":"Forge Nano","aliases":[],"former_names":[],"company_type":"Startup","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":true,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Thornton, Colorado","region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.forgenano.com","founded":"2011","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Atomic layer deposition (TEPHRA 200 mm ALD cluster tool)","equipment_ids":["EQP-A09.06"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":{"founders":null,"year":"2011 (per directory summary)","funding":"USD 40M (company press-release title)","investors":null,"product":"TEPHRA 200 mm single-wafer ALD cluster tool; ALD for batteries","trl":null,"latest_news":"Secured USD 40M to scale battery manufacturing and commercial semiconductor equipment businesses","maturity":"Commercial","source_ids":["SRC-000500","SRC-000501"],"verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM"},"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Thornton, Colorado and founding year 2011 per search summary (craft.co profile); USD 40M raise per company press-release title. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000500","SRC-000501"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":69,"filled":11,"total":16,"groups":[{"group":"Profile","filled":6,"total":6,"missing":[]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000214","legacy_id":"C0214","entity_type":"company","name":"Angstrom Engineering","canonical_name":"Angstrom Engineering","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Canada","country_id":"CTY-CA","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Cambridge, Ontario","region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://angstromengineering.com","founded":"1992","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Thin-film deposition: ALD, PVD, cluster platforms","equipment_ids":["EQP-A09.06","EQP-A09.07","EQP-A09"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Founded 1992, Cambridge, Ontario per search summary of angstromengineering.com. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000502"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":6,"total":6,"missing":[]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-A09"],"resolution_keys":[]},{"id":"CMP-000215","legacy_id":"C0215","entity_type":"company","name":"CVD Equipment Corporation","canonical_name":"CVD Equipment Corporation","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://cvdequipment.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Physical vapor transport (PVT) SiC crystal growth systems; CVD systems","equipment_ids":["EQP-K01"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000503","SRC-000504"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2024-01","review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"CVD Equipment","basis":"Name without legal suffix"}]},{"id":"CMP-000216","legacy_id":"C0216","entity_type":"company","name":"Trymax Semiconductor Equipment","canonical_name":"Trymax Semiconductor Equipment","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Netherlands","country_id":"CTY-NL","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://trymax-semiconductor.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Plasma photoresist ashing / strip (NEO platforms)","equipment_ids":["EQP-A07"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000505"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000217","legacy_id":"C0217","entity_type":"company","name":"SVCS Process Innovation","canonical_name":"SVCS Process Innovation","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Czech Republic","country_id":"CTY-CZ","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.svcs.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Horizontal and vertical diffusion, LPCVD and PECVD furnaces","equipment_ids":["EQP-A11","EQP-A09.03","EQP-A09.02"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000506"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000218","legacy_id":"C0218","entity_type":"company","name":"Annealsys","canonical_name":"Annealsys","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"France","country_id":"CTY-FR","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Montpellier","region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.annealsys.com","founded":"2004","employees":null,"ceo":null,"parent_company":"ECM Group (joined 2021, per company page summary)","subsidiaries_brands":null,"description":null,"primary_equipment":"Rapid thermal processing (RTP/RTCVD) and DLI-CVD / DLI-ALD systems","equipment_ids":["EQP-A12","EQP-A09.01","EQP-A09.06"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Founded 2004 in Montpellier; part of ECM Group since 2021 — per search summary of annealsys.com 'About' page. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000507"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":6,"total":6,"missing":[]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000219","legacy_id":"C0219","entity_type":"company","name":"Samco Inc.","canonical_name":"Samco Inc.","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Kyoto","region":"Asia-Pacific"},"ownership":null,"exchange":"TSE","ticker":"6387","website":"https://www.samco.co.jp/en/","founded":"1979","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Plasma etching (RIE, ICP-RIE, DRIE), PECVD, ALD, plasma cleaning","equipment_ids":["EQP-A08.03","EQP-A08.04","EQP-A08.05","EQP-A09.02","EQP-A09.06","EQP-A07","EQP-G03"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Founded 1979 in Kyoto; TSE 6387 — per search summary of samcointl.com. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000508"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":69,"filled":11,"total":16,"groups":[{"group":"Profile","filled":6,"total":6,"missing":[]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-G03"],"resolution_keys":[{"alias":"Samco","basis":"Name without legal suffix"},{"alias":"6387","basis":"Stock ticker (TSE)"}]},{"id":"CMP-000220","legacy_id":"C0220","entity_type":"company","name":"SENTECH Instruments","canonical_name":"SENTECH Instruments","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Berlin","region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.sentech.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Plasma etch and deposition tools, ALD, thin-film metrology (ellipsometry)","equipment_ids":["EQP-A08.02","EQP-A09.02","EQP-A09.06","EQP-A28"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Berlin-Adlershof location per search summary of sentech.com. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000509"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000221","legacy_id":"C0221","entity_type":"company","name":"Yield Engineering Systems (YES)","canonical_name":"Yield Engineering Systems","aliases":["YES"],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://yieldengineering.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Vacuum cure (VertaCure), vapor deposition and anneal for advanced packaging","equipment_ids":["EQP-D20","EQP-D05"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000510"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"YES","basis":"Recorded alias"},{"alias":"Yield Engineering Systems","basis":"Name without parenthetical"}]},{"id":"CMP-000222","legacy_id":"C0222","entity_type":"company","name":"Palomar Technologies","canonical_name":"Palomar Technologies","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.palomartechnologies.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Die bonders (3880-II), wire / wedge bonders, vacuum reflow","equipment_ids":["EQP-C10","EQP-C12","EQP-C14"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000511"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000223","legacy_id":"C0223","entity_type":"company","name":"Finetech","canonical_name":"Finetech","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://finetech.de","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Sub-micron die / flip-chip bonders (FINEPLACER)","equipment_ids":["EQP-C10","EQP-C11","EQP-C16"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000512"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000224","legacy_id":"C0224","entity_type":"company","name":"SET (Smart Equipment Technology)","canonical_name":"SET","aliases":["Smart Equipment Technology"],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"France","country_id":"CTY-FR","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://set-sas.fr","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"High-accuracy flip-chip / die-to-wafer bonders, direct bonding, nanoimprint","equipment_ids":["EQP-C11","EQP-C17","EQP-A01.07"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000513"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"Smart Equipment Technology","basis":"Recorded alias"},{"alias":"SET","basis":"Name without parenthetical"}]},{"id":"CMP-000225","legacy_id":"C0225","entity_type":"company","name":"Oxford Lasers","canonical_name":"Oxford Lasers","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United Kingdom","country_id":"CTY-GB","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://oxfordlasers.com","founded":"1977","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Laser micromachining systems; contract micromachining","equipment_ids":["EQP-A15"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Founded 1977 as an Oxford University spin-out — per search summary of oxfordlasers.com. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000514","SRC-000515"],"discovery_keywords":[],"freshness":"Recent","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2026","review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","City"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000226","legacy_id":"C0226","entity_type":"company","name":"Workshop of Photonics (WOP)","canonical_name":"Workshop of Photonics","aliases":["WOP"],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Lithuania","country_id":"CTY-LT","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://wophotonics.com","founded":null,"employees":null,"ceo":null,"parent_company":"Spun off from Altechna (per company page summary)","subsidiaries_brands":null,"description":null,"primary_equipment":"Femtosecond laser micromachining workstations (FemtoLAB, FemtoGLASS, FemtoFAB, FemtoMPP)","equipment_ids":["EQP-A15","EQP-C29"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000516"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"WOP","basis":"Recorded alias"},{"alias":"Workshop of Photonics","basis":"Name without parenthetical"}]},{"id":"CMP-000227","legacy_id":"C0227","entity_type":"company","name":"Halo Industries","canonical_name":"Halo Industries","aliases":[],"former_names":[],"company_type":"Startup","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":true,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Santa Clara","region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":"2014","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Laser-based SiC wafering (substrate production)","equipment_ids":["EQP-K04"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":{"founders":null,"year":"2014 (Stanford spin-out, per Optica OPN)","funding":"USD 80M Series B (2024)","investors":"US Innovative Technology Fund (lead, per Optica OPN)","product":"Laser-based process for producing SiC wafer substrates","trl":null,"latest_news":"USD 80M Series B (Jul 2024)","maturity":"Volume production claimed by company (per Optica OPN)","source_ids":["SRC-000517","SRC-000518"],"verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM"},"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Stanford spin-out (2014), Santa Clara — per Optica OPN summary; USD 80M Series B per two independent news titles. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000517","SRC-000518"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Website","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2024-07","review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["Website"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000228","legacy_id":"C0228","entity_type":"company","name":"LightMachinery","canonical_name":"LightMachinery","aliases":[],"former_names":[],"company_type":"Laser source","supplier_types":["Laser Supplier","Component Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Canada","country_id":"CTY-CA","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://lightmachinery.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Excimer lasers (IPEX series), TEA CO2 lasers","equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000519"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":38,"filled":6,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["Equipment category confirmed"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000229","legacy_id":"C0229","entity_type":"company","name":"Shibaura Mechatronics","canonical_name":"Shibaura Mechatronics","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.shibaura.co.jp/e/","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Flip-chip, WLP, PLP and hybrid bonders; single-wafer cleaning and wet etch","equipment_ids":["EQP-C11","EQP-C17","EQP-D19","EQP-A04","EQP-A08.06","EQP-D06"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000520"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-D06"],"resolution_keys":[]},{"id":"CMP-000230","legacy_id":"C0230","entity_type":"company","name":"Takatori Corporation","canonical_name":"Takatori Corporation","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.takatori-g.co.jp/english/","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Wafer tape laminators / mounters, wafer removal, wire saws","equipment_ids":["EQP-C06","EQP-C07","EQP-K03"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000521"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"Takatori","basis":"Name without legal suffix"}]},{"id":"CMP-000231","legacy_id":"C0231","entity_type":"company","name":"Ushio Inc.","canonical_name":"Ushio Inc.","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.ushio.co.jp/en/","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Packaging steppers and projection aligners (UX series)","equipment_ids":["EQP-A01.05","EQP-D15","EQP-D19","EQP-D16"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000522"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-D16"],"resolution_keys":[{"alias":"Ushio","basis":"Name without legal suffix"}]},{"id":"CMP-000232","legacy_id":"C0232","entity_type":"company","name":"Mitsuboshi Diamond Industrial","canonical_name":"Mitsuboshi Diamond Industrial","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.mitsuboshidiamond.com/eng/","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Scribe-and-break wafer singulation (DIALOGIC)","equipment_ids":["EQP-C32","EQP-F07"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000523"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000233","legacy_id":"C0233","entity_type":"company","name":"Toray Engineering","canonical_name":"Toray Engineering","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.toray-eng.com","founded":null,"employees":null,"ceo":null,"parent_company":"Toray Industries (analyst knowledge)","subsidiaries_brands":null,"description":null,"primary_equipment":"Flip-chip / TCB bonders (incl. PLP), chip inspection","equipment_ids":["EQP-C11","EQP-C16","EQP-D19","EQP-C36"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000524"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000234","legacy_id":"C0234","entity_type":"company","name":"JEOL","canonical_name":"JEOL","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.jeol.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Electron beam lithography (JBX series), incl. mask writers","equipment_ids":["EQP-A01.06","EQP-B07"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000525"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000235","legacy_id":"C0235","entity_type":"company","name":"Revasum","canonical_name":"Revasum","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"San Luis Obispo","region":"North America"},"ownership":null,"exchange":"ASX","ticker":null,"website":"https://www.revasum.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Single-wafer SiC grinding and polishing (CMP) equipment","equipment_ids":["EQP-F01","EQP-A19","EQP-C02"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: HQ and manufacturing in San Luis Obispo, California — per search summary of Revasum investor documents. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000526","SRC-000527"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2021-03","review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":69,"filled":11,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000236","legacy_id":"C0236","entity_type":"company","name":"Amtech Systems","canonical_name":"Amtech Systems","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":"NASDAQ","ticker":"ASYS","website":"https://www.amtechsystems.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":"BTU International; Entrepix; PR Hoffman; Intersurface Dynamics (per company segments page)","description":null,"primary_equipment":"Advanced-packaging reflow (BTU), lapping / polishing (PR Hoffman), CMP (Entrepix)","equipment_ids":["EQP-E03","EQP-K05","EQP-A19"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000528"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"ASYS","basis":"Stock ticker (NASDAQ)"}]},{"id":"CMP-000237","legacy_id":"C0237","entity_type":"company","name":"Sono-Tek","canonical_name":"Sono-Tek","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.sono-tek.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Ultrasonic spray coating (photoresist, protective dicing films)","equipment_ids":["EQP-A02"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000529"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000238","legacy_id":"C0238","entity_type":"company","name":"Tystar","canonical_name":"Tystar","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://tystar.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Horizontal diffusion, oxidation and LPCVD furnaces (TYTAN)","equipment_ids":["EQP-A11","EQP-A16","EQP-A09.03"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000530"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000239","legacy_id":"C0239","entity_type":"company","name":"Linton Crystal Technologies","canonical_name":"Linton Crystal Technologies","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Rochester, New York","region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.lintoncrystal.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Czochralski crystal growers; crystal processing (shaping, cutting) equipment","equipment_ids":["EQP-K01","EQP-K02"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Rochester origin (Hamco, 1952; Kayex) per search summary of lintoncrystal.com. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000531"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000240","legacy_id":"C0240","entity_type":"company","name":"Modutek","canonical_name":"Modutek","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.modutek.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Manual, semi-automated and automated wet benches","equipment_ids":["EQP-A05","EQP-A04"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000532"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000241","legacy_id":"C0241","entity_type":"company","name":"Evatec","canonical_name":"Evatec","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Switzerland","country_id":"CTY-CH","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://evatecnet.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Sputter / evaporation / PECVD / PEALD platforms (CLUSTERLINE)","equipment_ids":["EQP-A09.07","EQP-A09.08","EQP-A09.06","EQP-A09.02"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000533"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000242","legacy_id":"C0242","entity_type":"company","name":"Siconnex","canonical_name":"Siconnex","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Austria","country_id":"CTY-AT","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.siconnex.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Batch-spray wet processing (BATCHSPRAY)","equipment_ids":["EQP-A05","EQP-A04"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000534"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000243","legacy_id":"C0243","entity_type":"company","name":"Ion Beam Services (IBS)","canonical_name":"Ion Beam Services","aliases":["IBS"],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"France","country_id":"CTY-FR","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.ion-beam-services.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Ion implanters (incl. plasma immersion) and implantation foundry services","equipment_ids":["EQP-A10"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000535"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"IBS","basis":"Recorded alias"},{"alias":"Ion Beam Services","basis":"Name without parenthetical"}]},{"id":"CMP-000244","legacy_id":"C0244","entity_type":"company","name":"scia Systems","canonical_name":"scia Systems","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.scia-systems.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Ion beam trimming / etching / deposition and plasma systems","equipment_ids":["EQP-A08.01","EQP-A09.08"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000536"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000245","legacy_id":"C0245","entity_type":"company","name":"centrotherm international","canonical_name":"centrotherm international","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://centrotherm.world","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Thermal processing furnaces (diffusion, oxidation, annealing incl. SiC)","equipment_ids":["EQP-A11","EQP-A13","EQP-F05"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000537"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000246","legacy_id":"C0246","entity_type":"company","name":"PINK GmbH Thermosysteme","canonical_name":"PINK GmbH Thermosysteme","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Wertheim","region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://pink.de/en/","founded":"1979","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Pressure sintering, vacuum soldering and plasma systems for power electronics","equipment_ids":["EQP-F08","EQP-C10"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Wertheim location and founding in 1979 per search summary of pink.de company profile. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000538"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":6,"total":6,"missing":[]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000247","legacy_id":"C0247","entity_type":"company","name":"ATLANT 3D","canonical_name":"ATLANT 3D","aliases":[],"former_names":[],"company_type":"Startup","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":true,"hq":{"country":"Denmark","country_id":"CTY-DK","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Taastrup","region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://atlant3d.com","founded":"2018","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Direct atomic layer processing (selective-area, maskless ALD)","equipment_ids":["EQP-A09.06"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":{"founders":null,"year":"2018","funding":"USD 15M Series A (news titles)","investors":null,"product":"Direct atomic layer processing (DALP) micro-reactor","trl":null,"latest_news":"Series A funding for atomic layer manufacturing","maturity":"Early commercial","source_ids":["SRC-000539","SRC-000540"],"verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM"},"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Taastrup (Copenhagen area), established 2018 — per search summary of eeNews Europe / AtomicLimits. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000539","SRC-000540"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2023-04-20","review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":6,"total":6,"missing":[]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000248","legacy_id":"C0248","entity_type":"company","name":"AlixLabs","canonical_name":"AlixLabs","aliases":[],"former_names":[],"company_type":"Startup","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":true,"hq":{"country":"Sweden","country_id":"CTY-SE","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Lund","region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":"2019","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Atomic-layer-etch pitch splitting (APS)","equipment_ids":["EQP-A08"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":{"founders":null,"year":"2019 (Lund University spin-off)","funding":"EUR 14.1M Series A (news title); SEK 40M (2023, news title)","investors":"Navigare Ventures; Industrifonden; FORWARD.one (per news summary)","product":"APS — ALE pitch splitting","trl":null,"latest_news":"Series A to expand APS; beta testing with customers planned from 2026 (per news summary)","maturity":"Pre-commercial (beta)","source_ids":["SRC-000541","SRC-000542","SRC-000543"],"verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM"},"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Lund University spin-off (2019) per search summary; Series A amount per news titles. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000541","SRC-000542","SRC-000543"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Website","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2023-09-05","review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["Website"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000249","legacy_id":"C0249","entity_type":"company","name":"UNISERS","canonical_name":"UNISERS","aliases":[],"former_names":[],"company_type":"Startup","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":true,"hq":{"country":"Switzerland","country_id":"CTY-CH","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Zurich","region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":"2019","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Contamination / particle inspection of process materials","equipment_ids":["EQP-A31"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":{"founders":null,"year":"2019 (ETH Zurich spin-off)","funding":"USD 14M seed (investor announcement title)","investors":"Intel Capital (lead); M Ventures; RSBG Ventures; Swisscom Ventures (per announcement summary)","product":"Critical-materials inspection (particle monitoring)","trl":null,"latest_news":"USD 14M seed round","maturity":"Early commercial","source_ids":["SRC-000544","SRC-000545"],"verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM"},"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: ETH Zurich spin-off (2019), Zurich — per search summary of the Intel Capital announcement. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000544","SRC-000545"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Website","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["Website"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000250","legacy_id":"C0250","entity_type":"company","name":"XwinSys Technology Development","canonical_name":"XwinSys Technology Development","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Israel","country_id":"CTY-IL","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Migdal HaEmek","region":"Middle East"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":"Rigaku Corporation (acquired 2019, per Rigaku press release)","subsidiaries_brands":null,"description":null,"primary_equipment":"X-ray fluorescence + 3D optical inline metrology","equipment_ids":["EQP-A25"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Migdal HaEmek HQ, founded 2012, acquired by Rigaku (1 Jul 2019) — per search summary of Rigaku press release / directory. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000546","SRC-000547"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Website","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2019-07-15","review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000251","legacy_id":"C0251","entity_type":"company","name":"Nanoscribe","canonical_name":"Nanoscribe","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.nanoscribe.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Two-photon (grayscale) lithography systems (Quantum X)","equipment_ids":["EQP-A01.08"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000548"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000252","legacy_id":"C0252","entity_type":"company","name":"SCIL Nanoimprint Solutions","canonical_name":"SCIL Nanoimprint Solutions","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Netherlands","country_id":"CTY-NL","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Eindhoven","region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":"Originated as a Philips business unit (per High Tech Campus profile summary)","subsidiaries_brands":null,"description":null,"primary_equipment":"Substrate conformal imprint lithography (SCIL) equipment","equipment_ids":["EQP-A01.07"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: High Tech Campus Eindhoven; Philips origin — per search summaries of the campus profile and Brainport Eindhoven news. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000549","SRC-000550"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Website","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000253","legacy_id":"C0253","entity_type":"company","name":"ficonTEC","canonical_name":"ficonTEC","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.ficontec.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Photonics assembly and electro-optical (wafer-level) test systems","equipment_ids":["EQP-A32","EQP-C10"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000551"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000254","legacy_id":"C0254","entity_type":"company","name":"Semsysco","canonical_name":"Semsysco","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Austria","country_id":"CTY-AT","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Salzburg","region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.semsysco.com","founded":null,"employees":null,"ceo":null,"parent_company":"Lam Research (site pages titled 'Lam Research')","subsidiaries_brands":null,"description":null,"primary_equipment":"Vertical wet processing and electroplating for panels and wafers","equipment_ids":["EQP-A18","EQP-D19","EQP-A05"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Salzburg HQ per search summary of semsysco.com; parent inferred from the site's page titles. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000552"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000255","legacy_id":"C0255","entity_type":"company","name":"Kurt J. Lesker Company","canonical_name":"Kurt J. Lesker Company","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.lesker.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"PVD / evaporation deposition systems; vacuum components","equipment_ids":["EQP-A09.07","EQP-A09.09","EQP-A42"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000553"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000256","legacy_id":"C0256","entity_type":"company","name":"Kensington Laboratories","canonical_name":"Kensington Laboratories","aliases":[],"former_names":[],"company_type":"Automation/AMHS","supplier_types":["Automation Supplier","Robotics Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://kensingtonlabs.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Wafer-handling robots (SCARA) and EFEMs","equipment_ids":["EQP-A38","EQP-A37"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000554"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000257","legacy_id":"C0257","entity_type":"company","name":"Nanotronics","canonical_name":"Nanotronics","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://nanotronics.co","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"AI-driven automated optical wafer inspection (nSpec)","equipment_ids":["EQP-A23","EQP-A22"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000555"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000258","legacy_id":"C0258","entity_type":"company","name":"Sigray","canonical_name":"Sigray","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://sigray.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"3D X-ray microscopes and micro-XRF for semiconductor packaging / metrology","equipment_ids":["EQP-C35","EQP-A25"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000556","SRC-000557"],"discovery_keywords":[],"freshness":"Needs Review","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2025-07","review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000259","legacy_id":"C0259","entity_type":"company","name":"Inversion Semiconductor","canonical_name":"Inversion Semiconductor","aliases":[],"former_names":[],"company_type":"Startup","supplier_types":["Equipment OEM"],"supply_chain_level":"LV2","is_startup":true,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"San Francisco","region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":"2024","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Laser-wakefield-accelerator light source for lithography (in development)","equipment_ids":["EQP-A01"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":{"founders":"Rohan Karthik; Daniel Vega (per Y Combinator page summary)","year":"2024","funding":"USD 0.5M pre-seed (Mar 2025, Y Combinator lead — Tier 4 tracker)","investors":"Y Combinator","product":"Compact laser-wakefield-acceleration light source ('Starlight', per eeNews summary)","trl":null,"latest_news":"Aims at brighter, faster lithography light source","maturity":"Development","source_ids":["SRC-000558","SRC-000559"],"verification":"PARTIALLY_VERIFIED","confidence":"LOW"},"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Founded 2024 by Rohan Karthik and Daniel Vega, San Francisco — per search summary of the Y Combinator company page. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000558","SRC-000559"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Website","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["Website"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000260","legacy_id":"C0260","entity_type":"company","name":"Xallent","canonical_name":"Xallent","aliases":[],"former_names":[],"company_type":"Startup","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":true,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":"2013","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Nanoprobing for imaging and electrical test of devices and thin films","equipment_ids":["EQP-A32"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":{"founders":"Kwame Amponsah; Amit Lal; Ashish Kumar (per Cornell news summary)","year":"2013","funding":"NSF grant (per Cornell news summary)","investors":null,"product":"Nanoprobing solutions (fine-pitch probes)","trl":null,"latest_news":"Uses Cornell NanoScale Facility to fabricate probes","maturity":"Commercial (small)","source_ids":["SRC-000560"],"verification":"PARTIALLY_VERIFIED","confidence":"LOW"},"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Founded 2013 by Kwame Amponsah with Amit Lal and Ashish Kumar — per search summary of Cornell news. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000560"],"discovery_keywords":[],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Headquarters country (source)","City","Website","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2020-04","review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":31,"filled":5,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Website"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000261","legacy_id":"C0261","entity_type":"company","name":"AUROS Technology","canonical_name":"AUROS Technology","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Hwaseong","region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.aurostech.com/eng/main/","founded":"2009","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Overlay metrology (wafer and package), warpage metrology","equipment_ids":["EQP-A27","EQP-A30","EQP-A25"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Founded 2009, Hwaseong — per search summary of SEMI member directory. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000561","SRC-000562"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":69,"filled":11,"total":16,"groups":[{"group":"Profile","filled":6,"total":6,"missing":[]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000262","legacy_id":"C0262","entity_type":"company","name":"NEXTIN","canonical_name":"NEXTIN","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Hwaseong","region":"Asia-Pacific"},"ownership":null,"exchange":"KOSDAQ","ticker":"348210","website":"https://nextinsol.com/en/","founded":"2010","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Patterned-wafer optical defect inspection (AEGIS)","equipment_ids":["EQP-A22","EQP-A21"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Established 2010, Hwaseong — per search summaries of nextinsol.com history page and Invest Korea. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000563","SRC-000564"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":75,"filled":12,"total":16,"groups":[{"group":"Profile","filled":6,"total":6,"missing":[]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"348210","basis":"Stock ticker (KOSDAQ)"}]},{"id":"CMP-000263","legacy_id":"C0263","entity_type":"company","name":"Exicon","canonical_name":"Exicon","aliases":[],"former_names":[],"company_type":"Test & probe","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Seongnam","region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.exicon.co.kr/en/","founded":"2001","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Memory, SSD, SoC and burn-in testers","equipment_ids":["EQP-C40","EQP-C38","EQP-C41"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Founded 2001, Seongnam — per search summary of SEMI member directory. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000565","SRC-000566"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":69,"filled":11,"total":16,"groups":[{"group":"Profile","filled":6,"total":6,"missing":[]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-C41"],"resolution_keys":[]},{"id":"CMP-000264","legacy_id":"C0264","entity_type":"company","name":"KCTech","canonical_name":"KCTech","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Anseong","region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.kctech.co.kr","founded":"1987","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"CMP and wet cleaning equipment; CMP slurries","equipment_ids":["EQP-A19","EQP-A04"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Founded 1987, Anseong; CMP / wet-cleaning scope — per search summaries of directory profiles (official product pages not found). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000567","SRC-000568"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":6,"total":6,"missing":[]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000265","legacy_id":"C0265","entity_type":"company","name":"TES Co., Ltd.","canonical_name":"TES Co., Ltd.","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Yongin","region":"Asia-Pacific"},"ownership":null,"exchange":"KOSDAQ","ticker":"095610","website":"https://www.hites.co.kr","founded":"2002","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"PECVD (hard mask) and gas-phase / HF dry etch-clean","equipment_ids":["EQP-A09.02","EQP-A06"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Founded 2002, Yongin — per search summaries of market-data profiles. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000569","SRC-000570"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":75,"filled":12,"total":16,"groups":[{"group":"Profile","filled":6,"total":6,"missing":[]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"TES","basis":"Name without legal suffix"},{"alias":"095610","basis":"Stock ticker (KOSDAQ)"}]},{"id":"CMP-000266","legacy_id":"C0266","entity_type":"company","name":"MIRAE Corporation","canonical_name":"MIRAE Corporation","aliases":[],"former_names":[],"company_type":"Test & probe","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Cheonan","region":"Asia-Pacific"},"ownership":null,"exchange":"KRX","ticker":"025560","website":"https://www.mirae.com/en","founded":"1983","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Memory / logic / module test handlers and burn-in sorters","equipment_ids":["EQP-C39","EQP-C38"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Founded 1983, Cheonan — per search summaries of market-data profiles. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000571"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":69,"filled":11,"total":16,"groups":[{"group":"Profile","filled":6,"total":6,"missing":[]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"MIRAE","basis":"Name without legal suffix"},{"alias":"025560","basis":"Stock ticker (KRX)"}]},{"id":"CMP-000267","legacy_id":"C0267","entity_type":"company","name":"UniTest","canonical_name":"UniTest","aliases":[],"former_names":[],"company_type":"Test & probe","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Yongin","region":"Asia-Pacific"},"ownership":null,"exchange":"KOSDAQ","ticker":"086390","website":null,"founded":"2000","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Memory component / module and burn-in testers; wafer testers","equipment_ids":["EQP-C38","EQP-C40"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Founded 2000, Yongin; product scope — per search summaries of directory profiles (official site not found). No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000572","SRC-000573"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Website","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["Website"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"086390","basis":"Stock ticker (KOSDAQ)"}]},{"id":"CMP-000268","legacy_id":"C0268","entity_type":"company","name":"Mi Equipment","canonical_name":"Mi Equipment","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Malaysia","country_id":"CTY-MY","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Bayan Lepas, Penang","region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":"2007","employees":null,"ceo":null,"parent_company":"Mi Technovation Berhad (per market-data profile summary)","subsidiaries_brands":null,"description":null,"primary_equipment":"WLCSP die sorters, multi-bin sorters, test handlers, vision inspection","equipment_ids":["EQP-C08","EQP-C39","EQP-C36"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Penang; founded 2007; WLCSP sorting — per search summaries of InvestPenang and market-data profiles. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000574","SRC-000575"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Website","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["Website"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000269","legacy_id":"C0269","entity_type":"company","name":"AEM Holdings","canonical_name":"AEM Holdings","aliases":[],"former_names":[],"company_type":"Test & probe","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Singapore","country_id":"CTY-SG","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Singapore","region":"Asia-Pacific"},"ownership":null,"exchange":"SGX","ticker":null,"website":"https://aem.com.sg","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"System-level test and burn-in handling (AMPS), thermal control","equipment_ids":["EQP-C37","EQP-C39","EQP-C38"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: SGX main-board listing and Singapore head office — per search summary of aem.com.sg. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000576"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"AEM","basis":"Name without legal suffix"}]},{"id":"CMP-000270","legacy_id":"C0270","entity_type":"company","name":"Aemulus","canonical_name":"Aemulus","aliases":[],"former_names":[],"company_type":"Test & probe","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Malaysia","country_id":"CTY-MY","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Bayan Lepas, Penang","region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://aemulus.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"RF / mixed-signal ATE and test instruments (AMB series)","equipment_ids":["EQP-C40"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Bayan Lepas, Penang address — per search summary of aemulus.com. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000577"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000271","legacy_id":"C0271","entity_type":"company","name":"E&R Engineering","canonical_name":"E&R Engineering","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Taiwan","country_id":"CTY-TW","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Kaohsiung","region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":"1994","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Laser marking / cutting / drilling, plasma dicing and plasma cleaning for advanced packaging","equipment_ids":["EQP-C26","EQP-C28","EQP-C01.04","EQP-A07"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Established 1994, Kaohsiung — per search summary of the company's SEMICON Taiwan 2025 press release. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000578","SRC-000579"],"discovery_keywords":[],"freshness":"Recent","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Website","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2025-09","review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["Website"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000272","legacy_id":"C0272","entity_type":"company","name":"Jiangsu Leadmicro Nano-Technology","canonical_name":"Jiangsu Leadmicro Nano-Technology","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":"SSE STAR","ticker":"688147","website":null,"founded":"2015","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"ALD (iTomic) and CVD (iTronix) systems; PV equipment","equipment_ids":["EQP-A09.06","EQP-A09.01"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Established Dec 2015; STAR Market listing 2022; product series — per search summaries of SEMI directory and market-data profiles. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000580"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":38,"filled":6,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Website"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"688147","basis":"Stock ticker (SSE STAR)"}]},{"id":"CMP-000273","legacy_id":"C0273","entity_type":"company","name":"Holmarc Opto-Mechatronics","canonical_name":"Holmarc Opto-Mechatronics","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"India","country_id":"CTY-IN","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Kochi, Kerala","region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.holmarc.com","founded":"1993","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Laboratory spin coaters and scientific instruments","equipment_ids":["EQP-A02"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Established 1993, Kalamassery (Kochi) — per search summary of holmarc.com. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000581"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":69,"filled":11,"total":16,"groups":[{"group":"Profile","filled":6,"total":6,"missing":[]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":1,"total":1,"missing":[]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000274","legacy_id":"C0274","entity_type":"company","name":"Scantech Laser","canonical_name":"Scantech Laser","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"India","country_id":"CTY-IN","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Navi Mumbai","region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://scantechlaser.com","founded":"1991","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Laser marking, cutting, drilling and welding machines","equipment_ids":["EQP-C26"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Founded 1991 (Naren Shikarkhane), MIDC Mahape, Navi Mumbai — per search summary of scantechlaser.com; semiconductor use stated only in summary. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000582"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":6,"total":6,"missing":[]},{"group":"Portfolio","filled":1,"total":2,"missing":["Equipment category confirmed"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":1,"total":1,"missing":[]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-C26"],"resolution_keys":[]},{"id":"CMP-000275","legacy_id":"C0275","entity_type":"company","name":"Excel Instruments","canonical_name":"Excel Instruments","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"India","country_id":"CTY-IN","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Thermal / e-beam evaporation and sputtering systems for research","equipment_ids":["EQP-A09.08","EQP-A09.09"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 3 (2026-09-30): small company / startup added from web search. The cited official page, press release, directory entry or news article was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Indian maker named on IIT Jodhpur / IIT Ropar facility pages and the I-STEM equipment portal; official site not found. No revenue, market share or customer claims beyond those cited.","source_ids":["SRC-000583","SRC-000584"],"discovery_keywords":[],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 3","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["City","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":1,"total":1,"missing":[]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000276","legacy_id":"C0276","entity_type":"company","name":"Hesse Mechatronics","canonical_name":"Hesse Mechatronics","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Paderborn","region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.hesse-mechatronics.com","founded":"1995","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Fully automatic wedge-wedge wire bonders (heavy and fine wire), ultrasonic welding","equipment_ids":["EQP-C14","EQP-C12"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 4 (2026-09-30): found by keyword search (\"wedge bonder; wire bonder manufacturer; heavy wire ultrasonic bonding\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Founded 1995, Paderborn — per search summary of hesse-mechatronics.com. No revenue, market share or customer claims.","source_ids":["SRC-000712"],"discovery_keywords":["wedge bonder","wire bonder manufacturer","heavy wire ultrasonic bonding"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 4","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":6,"total":6,"missing":[]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000277","legacy_id":"C0277","entity_type":"company","name":"West-Bond","canonical_name":"West-Bond","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Anaheim, California","region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://westbond.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Manual and semi-automatic wedge-wedge and ball-wedge wire bonders","equipment_ids":["EQP-C12","EQP-C13","EQP-C14"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 4 (2026-09-30): found by keyword search (\"wire bonder manufacturer; wedge bonder\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Anaheim address from the title of a West-Bond specification sheet. No revenue, market share or customer claims.","source_ids":["SRC-000713"],"discovery_keywords":["wire bonder manufacturer","wedge bonder"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 4","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000278","legacy_id":"C0278","entity_type":"company","name":"TPT Wire Bonder","canonical_name":"TPT Wire Bonder","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Karlsfeld","region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.tpt-wirebonder.com","founded":"1996","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Manual, semi-automatic and automatic wire bonders (wedge, ball, ribbon, bump)","equipment_ids":["EQP-C12","EQP-C14"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 4 (2026-09-30): found by keyword search (\"wire bonder manufacturer; heavy wire bonder\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Since 1996, Karlsfeld near Munich — per search summary. No revenue, market share or customer claims.","source_ids":["SRC-000714"],"discovery_keywords":["wire bonder manufacturer","heavy wire bonder"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 4","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":6,"total":6,"missing":[]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000279","legacy_id":"C0279","entity_type":"company","name":"Mühlbauer","canonical_name":"Mühlbauer","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Roding","region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.muehlbauer.de","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Die sorting, die attach, carrier tape and vision inspection","equipment_ids":["EQP-C08","EQP-C09","EQP-C10"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 4 (2026-09-30): found by keyword search (\"die sorter; pick and place; die bonder manufacturer\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Roding, Germany — per search summary of a Mühlbauer press release. No revenue, market share or customer claims.","source_ids":["SRC-000715"],"discovery_keywords":["die sorter","pick and place","die bonder manufacturer"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 4","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000280","legacy_id":"C0280","entity_type":"company","name":"ITEC","canonical_name":"ITEC","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Netherlands","country_id":"CTY-NL","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.itecequipment.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"High-speed die bonders and die sorters (ADAT3 XF)","equipment_ids":["EQP-C10","EQP-C08","EQP-C11"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 4 (2026-09-30): found by keyword search (\"die bonder; pick and place die transfer\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000716"],"discovery_keywords":["die bonder","pick and place die transfer"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 4","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000281","legacy_id":"C0281","entity_type":"company","name":"Boschman Technologies","canonical_name":"Boschman Technologies","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Netherlands","country_id":"CTY-NL","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.boschman.nl","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Film-assisted transfer molding and Ag-sinter systems","equipment_ids":["EQP-C21","EQP-C23","EQP-F08"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 4 (2026-09-30): found by keyword search (\"molding equipment; encapsulation; film assisted molding\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000717"],"discovery_keywords":["molding equipment","encapsulation","film assisted molding"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 4","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000282","legacy_id":"C0282","entity_type":"company","name":"inTEST Corporation","canonical_name":"inTEST Corporation","aliases":[],"former_names":[],"company_type":"Test & probe","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":"NYSE American","ticker":"INTT","website":"https://intest.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Temperature forcing / thermal test systems (Temptronic ThermoStream)","equipment_ids":["EQP-C42"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 4 (2026-09-30): found by keyword search (\"thermal test system; temperature forcing\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000718"],"discovery_keywords":["thermal test system","temperature forcing"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 4","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"inTEST","basis":"Name without legal suffix"},{"alias":"INTT","basis":"Stock ticker (NYSE American)"}]},{"id":"CMP-000283","legacy_id":"C0283","entity_type":"company","name":"Riber","canonical_name":"Riber","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"France","country_id":"CTY-FR","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://riber.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Molecular beam epitaxy systems","equipment_ids":["EQP-A09.11"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 4 (2026-09-30): found by keyword search (\"molecular beam epitaxy system manufacturer\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000719"],"discovery_keywords":["molecular beam epitaxy system manufacturer"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 4","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000284","legacy_id":"C0284","entity_type":"company","name":"SVT Associates","canonical_name":"SVT Associates","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://svta.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"MBE systems, deposition sources and process monitors","equipment_ids":["EQP-A09.11"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 4 (2026-09-30): found by keyword search (\"molecular beam epitaxy system manufacturer\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000720"],"discovery_keywords":["molecular beam epitaxy system manufacturer"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 4","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000285","legacy_id":"C0285","entity_type":"company","name":"Dr. Eberl MBE-Komponenten","canonical_name":"Dr. Eberl MBE-Komponenten","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"MBE systems and components (effusion cells, e-beam evaporators)","equipment_ids":["EQP-A09.11","EQP-A09.09"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 4 (2026-09-30): found by keyword search (\"molecular beam epitaxy system manufacturer\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000721"],"discovery_keywords":["molecular beam epitaxy system manufacturer"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 4","completeness":{"score":25,"filled":4,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000286","legacy_id":"C0286","entity_type":"company","name":"AJA International","canonical_name":"AJA International","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Scituate, Massachusetts","region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://ajaint.com","founded":"1989","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Magnetron sputtering, e-beam / thermal evaporation and ion milling systems","equipment_ids":["EQP-A09.08","EQP-A09.09"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 4 (2026-09-30): found by keyword search (\"sputtering system manufacturer; e-beam evaporator\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Founded 1989 in Scituate, MA — per search summary of an E-MRS exhibitor profile. No revenue, market share or customer claims.","source_ids":["SRC-000722"],"discovery_keywords":["sputtering system manufacturer","e-beam evaporator"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 4","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":6,"total":6,"missing":[]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000287","legacy_id":"C0287","entity_type":"company","name":"Semicore Equipment","canonical_name":"Semicore Equipment","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.semicore.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"PVD sputtering and evaporation systems","equipment_ids":["EQP-A09.08","EQP-A09.09"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 4 (2026-09-30): found by keyword search (\"sputtering system manufacturer; thin film deposition equipment\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000723"],"discovery_keywords":["sputtering system manufacturer","thin film deposition equipment"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 4","completeness":{"score":38,"filled":6,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000288","legacy_id":"C0288","entity_type":"company","name":"Torr International","canonical_name":"Torr International","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Magnetron sputtering, e-beam and thermal evaporation systems","equipment_ids":["EQP-A09.08","EQP-A09.09"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 4 (2026-09-30): found by keyword search (\"sputtering system manufacturer; e-beam evaporator\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000724"],"discovery_keywords":["sputtering system manufacturer","e-beam evaporator"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 4","completeness":{"score":25,"filled":4,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000289","legacy_id":"C0289","entity_type":"company","name":"Corning (Tropel)","canonical_name":"Corning","aliases":["Tropel"],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.corning.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Tropel wafer flatness / geometry analysis systems","equipment_ids":["EQP-K09"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 4 (2026-09-30): found by keyword search (\"wafer geometry flatness measurement; bare wafer metrology\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000725"],"discovery_keywords":["wafer geometry flatness measurement","bare wafer metrology"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 4","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"Tropel","basis":"Recorded alias"},{"alias":"Corning","basis":"Name without parenthetical"}]},{"id":"CMP-000290","legacy_id":"C0290","entity_type":"company","name":"Canatu","canonical_name":"Canatu","aliases":[],"former_names":[],"company_type":"Critical component (optics)","supplier_types":["Optics Supplier","Component Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Finland","country_id":"CTY-FI","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://canatu.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Carbon-nanotube membranes for EUV pellicles; CNT reactors","equipment_ids":["EQP-B06"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 4 (2026-09-30): found by keyword search (\"EUV pellicle; carbon nanotube pellicle\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000726"],"discovery_keywords":["EUV pellicle","carbon nanotube pellicle"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 4","completeness":{"score":38,"filled":6,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000291","legacy_id":"C0291","entity_type":"company","name":"aweXome Ray","canonical_name":"aweXome Ray","aliases":[],"former_names":[],"company_type":"Startup","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":true,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Carbon-nanotube membranes for EUV pellicles","equipment_ids":["EQP-B06"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":{"founders":null,"year":null,"funding":"KRW 7.5bn (~USD 5.3M, per Korea Herald summary)","investors":null,"product":"CNT membranes for EUV pellicles (direct-spinning)","trl":null,"latest_news":"Opened a dedicated CNT-membrane production line","maturity":"Early production","source_ids":["SRC-000727"],"verification":"PARTIALLY_VERIFIED","confidence":"LOW"},"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 4 (2026-09-30): found by keyword search (\"EUV pellicle startup; carbon nanotube pellicle\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: KRW 7.5bn raise and CNT-membrane line for EUV pellicles — per search summary of Korea Herald article. No revenue, market share or customer claims.","source_ids":["SRC-000727"],"discovery_keywords":["EUV pellicle startup","carbon nanotube pellicle"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 4","completeness":{"score":25,"filled":4,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000292","legacy_id":"C0292","entity_type":"company","name":"Bruker (photomask repair & cleaning)","canonical_name":"Bruker","aliases":["photomask repair & cleaning"],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.bruker.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Nanomachining photomask repair and CO2 cryo mask cleaning (EL-C)","equipment_ids":["EQP-B05","EQP-B04"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 4 (2026-09-30): found by keyword search (\"photomask repair system; mask cleaning equipment\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000728"],"discovery_keywords":["photomask repair system","mask cleaning equipment"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 4","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"photomask repair & cleaning","basis":"Recorded alias"},{"alias":"Bruker","basis":"Name without parenthetical"}]},{"id":"CMP-000293","legacy_id":"C0293","entity_type":"company","name":"Critical Manufacturing","canonical_name":"Critical Manufacturing","aliases":[],"former_names":[],"company_type":"Automation/AMHS","supplier_types":["Automation Supplier","Robotics Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Portugal","country_id":"CTY-PT","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Maia","region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.criticalmanufacturing.com","founded":"2009","employees":null,"ceo":null,"parent_company":"ASMPT (since 2018, per company summary)","subsidiaries_brands":null,"description":null,"primary_equipment":"Manufacturing execution system (MES), digital twin (fabLIVE)","equipment_ids":["EQP-J09","EQP-J14"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 4 (2026-09-30): found by keyword search (\"semiconductor MES; fab software\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Founded 2009, Maia (Portugal); ASMPT subsidiary since 2018 — per search summaries of the company page and Wikipedia. No revenue, market share or customer claims.","source_ids":["SRC-000729","SRC-000730"],"discovery_keywords":["semiconductor MES","fab software"],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2021-11-02","review_due":"2027-03-29"},"batch":"Batch 4","completeness":{"score":69,"filled":11,"total":16,"groups":[{"group":"Profile","filled":6,"total":6,"missing":[]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000294","legacy_id":"C0294","entity_type":"company","name":"Kashiyama Industries","canonical_name":"Kashiyama Industries","aliases":[],"former_names":[],"company_type":"Vacuum/abatement","supplier_types":["Vacuum Supplier","Subsystem Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.kashiyama.com/en/","founded":"1951","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Dry vacuum pumps (multi-stage roots and screw; NeoDry)","equipment_ids":["EQP-L01","EQP-A42"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 4 (2026-09-30): found by keyword search (\"semiconductor dry vacuum pump manufacturer\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Founded 1951 — per search summary of Kashiyama Europe profile. No revenue, market share or customer claims.","source_ids":["SRC-000731"],"discovery_keywords":["semiconductor dry vacuum pump manufacturer"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 4","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","City"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000295","legacy_id":"C0295","entity_type":"company","name":"Leybold","canonical_name":"Leybold","aliases":[],"former_names":[],"company_type":"Vacuum/abatement","supplier_types":["Vacuum Supplier","Subsystem Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.leybold.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Dry screw and roots vacuum pumps and systems","equipment_ids":["EQP-L01","EQP-A42"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 4 (2026-09-30): found by keyword search (\"semiconductor dry vacuum pump manufacturer\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000732"],"discovery_keywords":["semiconductor dry vacuum pump manufacturer"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 4","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000296","legacy_id":"C0296","entity_type":"company","name":"Kanken Techno","canonical_name":"Kanken Techno","aliases":[],"former_names":[],"company_type":"Vacuum/abatement","supplier_types":["Vacuum Supplier","Subsystem Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.kanken-techno.co.jp","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Semiconductor exhaust-gas abatement (wet, heater, plasma)","equipment_ids":["EQP-L02","EQP-A45"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 4 (2026-09-30): found by keyword search (\"semiconductor exhaust gas scrubber abatement\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000733"],"discovery_keywords":["semiconductor exhaust gas scrubber abatement"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 4","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000297","legacy_id":"C0297","entity_type":"company","name":"Mirapro","canonical_name":"Mirapro","aliases":[],"former_names":[],"company_type":"Thermal/fume","supplier_types":["Component Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.mirapro.co.jp/en/","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Process chillers for semiconductor equipment","equipment_ids":["EQP-L03"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 4 (2026-09-30): found by keyword search (\"semiconductor process chiller manufacturer\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000734"],"discovery_keywords":["semiconductor process chiller manufacturer"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 4","completeness":{"score":38,"filled":6,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000298","legacy_id":"C0298","entity_type":"company","name":"memsstar","canonical_name":"memsstar","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United Kingdom","country_id":"CTY-GB","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Vapour HF and XeF2 release etch for MEMS (Orbis)","equipment_ids":["EQP-H02","EQP-H05","EQP-A06"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 4 (2026-09-30): found by keyword search (\"MEMS release etch; vapour HF etcher; XeF2\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000735","SRC-000736"],"discovery_keywords":["MEMS release etch","vapour HF etcher","XeF2"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 4","completeness":{"score":38,"filled":6,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000299","legacy_id":"C0299","entity_type":"company","name":"UnitySC","canonical_name":"UnitySC","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"France","country_id":"CTY-FR","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://unity-sc.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Inspection and metrology for advanced packaging, power and MEMS (4See)","equipment_ids":["EQP-A21","EQP-A25","EQP-A30","EQP-D13","EQP-A22"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 4 (2026-09-30): found by keyword search (\"wafer inspection metrology advanced packaging; bare wafer metrology\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000737"],"discovery_keywords":["wafer inspection metrology advanced packaging","bare wafer metrology"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 4","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-A22"],"resolution_keys":[]},{"id":"CMP-000300","legacy_id":"C0300","entity_type":"company","name":"Kateeva","canonical_name":"Kateeva","aliases":[],"former_names":[],"company_type":"Startup","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":true,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://kateeva.com","founded":"2009","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Inkjet deposition equipment for OLED (YIELDjet)","equipment_ids":["EQP-I02"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":{"founders":null,"year":"2009","funding":null,"investors":null,"product":"YIELDjet inkjet deposition platforms (TFE, RGB)","trl":null,"latest_news":"YIELDjet FLEX in mass production for OLED thin-film encapsulation (per company summary)","maturity":"Commercial","source_ids":["SRC-000738"],"verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM"},"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 4 (2026-09-30): found by keyword search (\"OLED inkjet printing equipment\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: US startup established 2009 (MIT-originated technology) — per search summary. No revenue, market share or customer claims.","source_ids":["SRC-000738"],"discovery_keywords":["OLED inkjet printing equipment"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 4","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","City"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000301","legacy_id":"C0301","entity_type":"company","name":"Lapmaster Wolters","canonical_name":"Lapmaster Wolters","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.peter-wolters.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Double-side lapping, fine grinding and polishing machines (Peter Wolters AC microLine)","equipment_ids":["EQP-K05","EQP-K07","EQP-K06"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 5 (2026-09-30): found by keyword search (\"double side lapping polishing; wafer lapping\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000766","SRC-000767"],"discovery_keywords":["double side lapping polishing","wafer lapping"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 5","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000302","legacy_id":"C0302","entity_type":"company","name":"Logitech","canonical_name":"Logitech","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United Kingdom","country_id":"CTY-GB","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://logitech.uk.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Precision lapping / polishing systems and benchtop CMP tools","equipment_ids":["EQP-K05","EQP-A19"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 5 (2026-09-30): found by keyword search (\"wafer lapping polishing; benchtop CMP\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000768"],"discovery_keywords":["wafer lapping polishing","benchtop CMP"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 5","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000303","legacy_id":"C0303","entity_type":"company","name":"TESEC Corporation","canonical_name":"TESEC Corporation","aliases":[],"former_names":[],"company_type":"Test & probe","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Higashiyamato, Tokyo","region":"Asia-Pacific"},"ownership":null,"exchange":"TSE","ticker":"6337","website":"https://www.tesec.co.jp/products_en/","founded":"1969","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Discrete / power device testers and test handlers","equipment_ids":["EQP-C39","EQP-C40"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 5 (2026-09-30): found by keyword search (\"power device tester; SiC handler; discrete test system\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Founded 1969; HQ Higashiyamato, Tokyo; TSE 6337 — per search summary of market-data and SEMI profiles. No revenue, market share or customer claims.","source_ids":["SRC-000769","SRC-000770"],"discovery_keywords":["power device tester","SiC handler","discrete test system"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 5","completeness":{"score":75,"filled":12,"total":16,"groups":[{"group":"Profile","filled":6,"total":6,"missing":[]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"TESEC","basis":"Name without legal suffix"},{"alias":"6337","basis":"Stock ticker (TSE)"}]},{"id":"CMP-000304","legacy_id":"C0304","entity_type":"company","name":"MICRONICS JAPAN","canonical_name":"MICRONICS JAPAN","aliases":[],"former_names":[],"company_type":"Test & probe","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Tokyo","region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.mjc.co.jp/en/","founded":"1970","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Probe cards, wafer probers, test sockets","equipment_ids":["EQP-A33"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 5 (2026-09-30): found by keyword search (\"probe card manufacturer; wafer prober\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Founded 1970, Tokyo — per search summary of a CB Insights profile. No revenue, market share or customer claims.","source_ids":["SRC-000771"],"discovery_keywords":["probe card manufacturer","wafer prober"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 5","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":6,"total":6,"missing":[]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000305","legacy_id":"C0305","entity_type":"company","name":"Japan Electronic Materials (JEM)","canonical_name":"Japan Electronic Materials","aliases":["JEM"],"former_names":[],"company_type":"Test & probe","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Amagasaki","region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.jem-net.co.jp/en/","founded":"1960","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Vertical, hybrid and CIS probe cards","equipment_ids":["EQP-A33"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 5 (2026-09-30): found by keyword search (\"probe card manufacturer; vertical MEMS probe card\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Founded 1960, Amagasaki — per search summary of a CB Insights profile. No revenue, market share or customer claims.","source_ids":["SRC-000772"],"discovery_keywords":["probe card manufacturer","vertical MEMS probe card"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 5","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":6,"total":6,"missing":[]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"JEM","basis":"Recorded alias"},{"alias":"Japan Electronic Materials","basis":"Name without parenthetical"}]},{"id":"CMP-000306","legacy_id":"C0306","entity_type":"company","name":"UIGREEN","canonical_name":"UIGREEN","aliases":[],"former_names":[],"company_type":"Test & probe","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Yokohama","region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"MEMS probe cards and contact probes","equipment_ids":["EQP-A33"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 5 (2026-09-30): found by keyword search (\"MEMS probe card\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Yokohama; MEMS probe cards — per search summary of the SEMI member directory. No revenue, market share or customer claims.","source_ids":["SRC-000773"],"discovery_keywords":["MEMS probe card"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Website","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 5","completeness":{"score":38,"filled":6,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000307","legacy_id":"C0307","entity_type":"company","name":"HORIBA (HORIBA STEC)","canonical_name":"HORIBA","aliases":["HORIBA STEC"],"former_names":[],"company_type":"Gas/chemical delivery","supplier_types":["Gas Supplier","Subsystem Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.horiba.com/int/semiconductor/","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Mass flow controllers and meters for semiconductor process gases","equipment_ids":["EQP-A43","EQP-L04"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 5 (2026-09-30): found by keyword search (\"mass flow controller semiconductor; gas delivery\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000774"],"discovery_keywords":["mass flow controller semiconductor","gas delivery"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 5","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"HORIBA STEC","basis":"Recorded alias"},{"alias":"HORIBA","basis":"Name without parenthetical"}]},{"id":"CMP-000308","legacy_id":"C0308","entity_type":"company","name":"Fujikin","canonical_name":"Fujikin","aliases":[],"former_names":[],"company_type":"Gas/chemical delivery","supplier_types":["Gas Supplier","Subsystem Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.fujikin.co.jp/en/","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Ultra-high-purity valves, flow control and integrated gas supply systems","equipment_ids":["EQP-A43","EQP-L04"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 5 (2026-09-30): found by keyword search (\"ultra high purity valve; gas delivery system\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000775"],"discovery_keywords":["ultra high purity valve","gas delivery system"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 5","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000309","legacy_id":"C0309","entity_type":"company","name":"IMS Nanofabrication","canonical_name":"IMS Nanofabrication","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Austria","country_id":"CTY-AT","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.ims.co.at/en/","founded":null,"employees":null,"ceo":null,"parent_company":"Intel (acquirer, per Semiconductor Engineering summary; not confirmed on a company page)","subsidiaries_brands":null,"description":null,"primary_equipment":"Multi-beam mask writers (MBMW)","equipment_ids":["EQP-B07"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 5 (2026-09-30): found by keyword search (\"multi-beam mask writer; mask writing\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Austrian company; Intel acquisition — per search summary of Semiconductor Engineering and company pages. No revenue, market share or customer claims.","source_ids":["SRC-000776","SRC-000777"],"discovery_keywords":["multi-beam mask writer","mask writing"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 5","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000310","legacy_id":"C0310","entity_type":"company","name":"Uniqarta","canonical_name":"Uniqarta","aliases":[],"former_names":[],"company_type":"Startup","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":true,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Laser-enabled advanced placement (LEAP) for microLED transfer","equipment_ids":["EQP-I08"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 5 (2026-09-30): found by keyword search (\"microLED mass transfer; laser transfer startup\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000778"],"discovery_keywords":["microLED mass transfer","laser transfer startup"],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2018","review_due":"2027-03-29"},"batch":"Batch 5","completeness":{"score":31,"filled":5,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000311","legacy_id":"C0311","entity_type":"company","name":"SUMCO","canonical_name":"SUMCO","aliases":[],"former_names":[],"company_type":"Materials/gases","supplier_types":["Materials Supplier","Gas Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.sumcousa.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Prime and epitaxial silicon wafers (100–300 mm)","equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 5 (2026-09-30): found by keyword search (\"silicon wafer manufacturer; 300 mm wafer\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000779"],"discovery_keywords":["silicon wafer manufacturer","300 mm wafer"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 5","completeness":{"score":31,"filled":5,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000312","legacy_id":"C0312","entity_type":"company","name":"Siltronic","canonical_name":"Siltronic","aliases":[],"former_names":[],"company_type":"Materials/gases","supplier_types":["Materials Supplier","Gas Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Polished and epitaxial silicon wafers up to 300 mm; float-zone wafers","equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 5 (2026-09-30): found by keyword search (\"silicon wafer manufacturer; 300 mm wafer\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000780"],"discovery_keywords":["silicon wafer manufacturer","300 mm wafer"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 5","completeness":{"score":19,"filled":3,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000313","legacy_id":"C0313","entity_type":"company","name":"SK siltron","canonical_name":"SK siltron","aliases":[],"former_names":[],"company_type":"Materials/gases","supplier_types":["Materials Supplier","Gas Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":"1983","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Silicon wafers (125–300 mm), polished and epitaxial","equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 5 (2026-09-30): found by keyword search (\"silicon wafer manufacturer; 300 mm wafer\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Founded 1983 — per search summary of the SK Group company page. No revenue, market share or customer claims.","source_ids":["SRC-000781","SRC-000782"],"discovery_keywords":["silicon wafer manufacturer","300 mm wafer"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 5","completeness":{"score":31,"filled":5,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Website"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000314","legacy_id":"C0314","entity_type":"company","name":"FUJIFILM (semiconductor materials)","canonical_name":"FUJIFILM","aliases":[],"former_names":[],"company_type":"Materials/gases","supplier_types":["Materials Supplier","Gas Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.fujifilm.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Semiconductor process materials incl. CMP slurries","equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 5 (2026-09-30): found by keyword search (\"CMP slurry manufacturer; photoresist\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000783"],"discovery_keywords":["CMP slurry manufacturer","photoresist"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 5","completeness":{"score":31,"filled":5,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"FUJIFILM","basis":"Name without parenthetical"}]},{"id":"CMP-000315","legacy_id":"C0315","entity_type":"company","name":"Entegris","canonical_name":"Entegris","aliases":[],"former_names":[],"company_type":"Materials/gases","supplier_types":["Materials Supplier","Gas Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.entegris.com","founded":null,"employees":null,"ceo":null,"parent_company":"Acquired CMC Materials (2022) and Sinmat (per search summaries)","subsidiaries_brands":null,"description":null,"primary_equipment":"FOUP / wafer carriers, CMP consumables (incl. CMC Materials), filtration","equipment_ids":["EQP-A36","EQP-A19"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 5 (2026-09-30): found by keyword search (\"FOUP wafer carrier; CMP slurry pad\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000784"],"discovery_keywords":["FOUP wafer carrier","CMP slurry pad"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 5","completeness":{"score":31,"filled":5,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000316","legacy_id":"C0316","entity_type":"company","name":"Musashi Engineering","canonical_name":"Musashi Engineering","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://en.musashi-engineering.co.jp/","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Precision liquid dispensing systems (underfill, encapsulation, WLP/PLP)","equipment_ids":["EQP-C25","EQP-C24"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 6 (2026-09-30): found by keyword search (\"underfill dispensing; precision dispenser\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000809"],"discovery_keywords":["underfill dispensing","precision dispenser"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 6","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000317","legacy_id":"C0317","entity_type":"company","name":"VERMES Microdispensing","canonical_name":"VERMES Microdispensing","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.vermes.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Piezo jetting valves and microdispensing systems","equipment_ids":["EQP-C25"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 6 (2026-09-30): found by keyword search (\"jet dispensing; microdispensing\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000810"],"discovery_keywords":["jet dispensing","microdispensing"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 6","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000318","legacy_id":"C0318","entity_type":"company","name":"F&K Delvotec","canonical_name":"F&K Delvotec","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.fkdelvotec.com/en/","founded":"1978","employees":null,"ceo":null,"parent_company":"Strama Group (per site title)","subsidiaries_brands":null,"description":null,"primary_equipment":"Ultrasonic wire bonders (ball-wedge, wedge-wedge, heavy wire), laser bonders","equipment_ids":["EQP-C12","EQP-C13","EQP-C14","EQP-C31"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 6 (2026-09-30): found by keyword search (\"wire bonder manufacturer; ball wedge bonder\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Active since 1978 — per search summary of fkdelvotec.com. No revenue, market share or customer claims.","source_ids":["SRC-000811"],"discovery_keywords":["wire bonder manufacturer","ball wedge bonder"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 6","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","City"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000319","legacy_id":"C0319","entity_type":"company","name":"HYBOND","canonical_name":"HYBOND","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://hybond.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Semi-automatic die bonders, eutectic stations, peg / wire bonders","equipment_ids":["EQP-C10","EQP-C15"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 6 (2026-09-30): found by keyword search (\"die bonder semi-automatic; eutectic die bonder\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000812"],"discovery_keywords":["die bonder semi-automatic","eutectic die bonder"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 6","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000320","legacy_id":"C0320","entity_type":"company","name":"SINFONIA TECHNOLOGY","canonical_name":"SINFONIA TECHNOLOGY","aliases":[],"former_names":[],"company_type":"Automation/AMHS","supplier_types":["Automation Supplier","Robotics Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.sinfo-t.jp/eng/","founded":null,"employees":null,"ceo":null,"parent_company":"Formerly Shinko Electric Co. (renamed 2009, per search summary)","subsidiaries_brands":null,"description":null,"primary_equipment":"EFEMs, FOUP / SMIF load ports, vacuum transport","equipment_ids":["EQP-J11","EQP-J12","EQP-A37","EQP-A40"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 6 (2026-09-30): found by keyword search (\"EFEM load port; wafer transfer\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000813"],"discovery_keywords":["EFEM load port","wafer transfer"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 6","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000321","legacy_id":"C0321","entity_type":"company","name":"Kawasaki Robotics","canonical_name":"Kawasaki Robotics","aliases":[],"former_names":[],"company_type":"Automation/AMHS","supplier_types":["Automation Supplier","Robotics Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://kawasakirobotics.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Wafer transfer robots (200/300 mm, panel)","equipment_ids":["EQP-A38","EQP-J06"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 6 (2026-09-30): found by keyword search (\"wafer transfer robot\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000814"],"discovery_keywords":["wafer transfer robot"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 6","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000322","legacy_id":"C0322","entity_type":"company","name":"Akrion Systems (NAURA Akrion)","canonical_name":"Akrion Systems","aliases":["NAURA Akrion"],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":"NAURA (acquired 2018, per search summary)","subsidiaries_brands":null,"description":null,"primary_equipment":"Batch-immersion and single-wafer wet cleaning systems (GAMA)","equipment_ids":["EQP-A05","EQP-A04"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 6 (2026-09-30): found by keyword search (\"wet bench batch cleaning; wet station\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000815"],"discovery_keywords":["wet bench batch cleaning","wet station"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 6","completeness":{"score":31,"filled":5,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"NAURA Akrion","basis":"Recorded alias"},{"alias":"Akrion Systems","basis":"Name without parenthetical"}]},{"id":"CMP-000323","legacy_id":"C0323","entity_type":"company","name":"Trion Technology","canonical_name":"Trion Technology","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Clearwater, Florida","region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://triontech.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Plasma etch (RIE, ICP, DRIE), strip / ash and deposition systems","equipment_ids":["EQP-A08.03","EQP-A08.04","EQP-A08.05","EQP-A07"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 6 (2026-09-30): found by keyword search (\"plasma etch RIE ICP; photoresist stripper\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Clearwater, Florida — per search summary of directory profiles. No revenue, market share or customer claims.","source_ids":["SRC-000816"],"discovery_keywords":["plasma etch RIE ICP","photoresist stripper"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 6","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000324","legacy_id":"C0324","entity_type":"company","name":"Particle Measuring Systems","canonical_name":"Particle Measuring Systems","aliases":[],"former_names":[],"company_type":"Subsystem supplier","supplier_types":["Subsystem Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.pmeasuring.com","founded":"1972","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Airborne and liquid particle counters, contamination monitoring","equipment_ids":["EQP-L10","EQP-A31"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 6 (2026-09-30): found by keyword search (\"cleanroom particle counter\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Founded 1972 — per search summary of the company text. No revenue, market share or customer claims.","source_ids":["SRC-000817"],"discovery_keywords":["cleanroom particle counter"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 6","completeness":{"score":38,"filled":6,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","City"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000325","legacy_id":"C0325","entity_type":"company","name":"Lighthouse Worldwide Solutions","canonical_name":"Lighthouse Worldwide Solutions","aliases":[],"former_names":[],"company_type":"Subsystem supplier","supplier_types":["Subsystem Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.golighthouse.com","founded":"1982","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Airborne / liquid particle counters and contamination monitoring systems","equipment_ids":["EQP-L10","EQP-A31"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 6 (2026-09-30): found by keyword search (\"cleanroom particle counter; contamination monitoring\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Founded 1982 — per search summary of the company page. No revenue, market share or customer claims.","source_ids":["SRC-000818","SRC-000819"],"discovery_keywords":["cleanroom particle counter","contamination monitoring"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 6","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","City"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000326","legacy_id":"C0326","entity_type":"company","name":"Brewer Science","canonical_name":"Brewer Science","aliases":[],"former_names":[],"company_type":"Materials/gases","supplier_types":["Materials Supplier","Gas Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.brewerscience.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Temporary bonding materials and the Apogee temporary wafer bonder","equipment_ids":["EQP-C18"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 6 (2026-09-30): found by keyword search (\"temporary bonding debonding\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000820","SRC-000821"],"discovery_keywords":["temporary bonding debonding"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 6","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000327","legacy_id":"C0327","entity_type":"company","name":"Keteca Singapore","canonical_name":"Keteca Singapore","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Singapore","country_id":"CTY-SG","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Singapore","region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Laser dicing machines, X-ray inspection machines and dicing solutions (per directory summary)","equipment_ids":["EQP-C01.02","EQP-C35"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 7 (2026-09-30): found by keyword search (\"Singapore laser dicing; wafer inspection Singapore\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Product range per search summary of the SEMI member directory entry. No revenue, market share or customer claims.","source_ids":["SRC-000846"],"discovery_keywords":["Singapore laser dicing","wafer inspection Singapore"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Website","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 7","completeness":{"score":38,"filled":6,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000328","legacy_id":"C0328","entity_type":"company","name":"MIT Semiconductor (Manufacturing Integration Technology)","canonical_name":"MIT Semiconductor","aliases":["Manufacturing Integration Technology"],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Singapore","country_id":"CTY-SG","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Vision inspection and ultra-precision handling for die sorting","equipment_ids":["EQP-C08","EQP-C34"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 7 (2026-09-30): found by keyword search (\"Singapore semiconductor equipment; die sorting vision inspection\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000847"],"discovery_keywords":["Singapore semiconductor equipment","die sorting vision inspection"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 7","completeness":{"score":25,"filled":4,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"Manufacturing Integration Technology","basis":"Recorded alias"},{"alias":"MIT Semiconductor","basis":"Name without parenthetical"}]},{"id":"CMP-000329","legacy_id":"C0329","entity_type":"company","name":"SRM Integration (Malaysia)","canonical_name":"SRM Integration","aliases":["Malaysia"],"former_names":[],"company_type":"Test & probe","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Malaysia","country_id":"CTY-MY","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Penang","region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":"1996","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"IC test handlers and customised semiconductor automation","equipment_ids":["EQP-C39","EQP-C36"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 7 (2026-09-30): found by keyword search (\"Penang test handler; Malaysia semiconductor automation\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Established 1996, Penang — per search summary of the InvestPenang profile. No revenue, market share or customer claims.","source_ids":["SRC-000848"],"discovery_keywords":["Penang test handler","Malaysia semiconductor automation"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Website","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 7","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["Website"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"Malaysia","basis":"Recorded alias"},{"alias":"SRM Integration","basis":"Name without parenthetical"}]},{"id":"CMP-000330","legacy_id":"C0330","entity_type":"company","name":"Micro Modular System (MMS)","canonical_name":"Micro Modular System","aliases":["MMS"],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Malaysia","country_id":"CTY-MY","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Back-end assembly, trim-and-form, laser-marking handlers and test handlers","equipment_ids":["EQP-C26","EQP-C39"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 7 (2026-09-30): found by keyword search (\"Malaysia laser marking handler; trim form\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Product scope per search summary of the SEMI member directory entry. No revenue, market share or customer claims.","source_ids":["SRC-000849"],"discovery_keywords":["Malaysia laser marking handler","trim form"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 7","completeness":{"score":25,"filled":4,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"MMS","basis":"Recorded alias"},{"alias":"Micro Modular System","basis":"Name without parenthetical"}]},{"id":"CMP-000331","legacy_id":"C0331","entity_type":"company","name":"DeepLASE Technologies","canonical_name":"DeepLASE Technologies","aliases":[],"former_names":[],"company_type":"Startup","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":true,"hq":{"country":"India","country_id":"CTY-IN","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"New Delhi","region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":"2024","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Fibre lasers, specialty optical fibres and photonics platforms","equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":{"founders":null,"year":"2024","funding":"INR 6 crore seed (press-release title)","investors":"MGF Kavachh; Yali Capital (co-leads, per press-release title)","product":"Fibre lasers, specialty fibres, narrow-linewidth and supercontinuum sources","trl":null,"latest_news":"Seed round announced","maturity":"Early stage","source_ids":["SRC-000850","SRC-000851"],"verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM"},"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 7 (2026-09-30): found by keyword search (\"Indian photonics startup; fibre laser India; IIT spinout\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Founded 2024, New Delhi; IIT Delhi spin-out — per search summaries of YourStory and press-release titles. No revenue, market share or customer claims.","source_ids":["SRC-000850","SRC-000851"],"discovery_keywords":["Indian photonics startup","fibre laser India","IIT spinout"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Website","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 7","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["Website"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":1,"total":1,"missing":[]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000332","legacy_id":"C0332","entity_type":"company","name":"Suresh Indu Lasers","canonical_name":"Suresh Indu Lasers","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"India","country_id":"CTY-IN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Fibre laser cutting, welding, marking and picosecond micromachining systems","equipment_ids":["EQP-A15","EQP-C26"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 7 (2026-09-30): found by keyword search (\"Indian laser machine manufacturer; picosecond micromachining India\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000852"],"discovery_keywords":["Indian laser machine manufacturer","picosecond micromachining India"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Website","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 7","completeness":{"score":31,"filled":5,"total":16,"groups":[{"group":"Profile","filled":2,"total":6,"missing":["HQ country source-backed","City","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":1,"total":1,"missing":[]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000333","legacy_id":"C0333","entity_type":"company","name":"Teledyne Vision Solutions","canonical_name":"Teledyne Vision Solutions","aliases":[],"former_names":[],"company_type":"Vision","supplier_types":["Component Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://teledynevisionsolutions.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"TDI line-scan cameras and machine vision for wafer inspection","equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 7 (2026-09-30): found by keyword search (\"machine vision camera semiconductor inspection; TDI camera\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000853"],"discovery_keywords":["machine vision camera semiconductor inspection","TDI camera"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 7","completeness":{"score":31,"filled":5,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000334","legacy_id":"C0334","entity_type":"company","name":"ULVAC","canonical_name":"ULVAC","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.ulvac.co.jp/en/","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Sputtering / PVD systems (ENTRON, SME) and vacuum equipment","equipment_ids":["EQP-A09.08","EQP-A09.07"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 8 (2026-09-30): found by keyword search (\"sputtering system semiconductor; PVD cluster\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000854"],"discovery_keywords":["sputtering system semiconductor","PVD cluster"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 8","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000335","legacy_id":"C0335","entity_type":"company","name":"CANON ANELVA","canonical_name":"CANON ANELVA","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://anelva.canon/en/","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Sputtering / PVD (incl. MRAM MTJ) and etching equipment","equipment_ids":["EQP-A09.08","EQP-A08"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 8 (2026-09-30): found by keyword search (\"sputtering deposition equipment MRAM\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000855"],"discovery_keywords":["sputtering deposition equipment MRAM"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 8","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000336","legacy_id":"C0336","entity_type":"company","name":"VON ARDENNE","canonical_name":"VON ARDENNE","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.vonardenne.biz","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Vacuum coating / sputtering systems (glass, wafers, strip, film)","equipment_ids":["EQP-A09.08","EQP-A09.07"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 8 (2026-09-30): found by keyword search (\"vacuum coating systems; sputtering\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000856"],"discovery_keywords":["vacuum coating systems","sputtering"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 8","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000337","legacy_id":"C0337","entity_type":"company","name":"SCHMID Group","canonical_name":"SCHMID Group","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://schmid-group.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Wet-process and plasma equipment for panel-level packaging and glass substrates","equipment_ids":["EQP-A05","EQP-A18","EQP-D19"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 8 (2026-09-30): found by keyword search (\"panel level packaging wet process; glass substrate equipment\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000857"],"discovery_keywords":["panel level packaging wet process","glass substrate equipment"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 8","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000338","legacy_id":"C0338","entity_type":"company","name":"Nissin Ion Equipment","canonical_name":"Nissin Ion Equipment","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://nissin.jp/e/","founded":"1999","employees":null,"ceo":null,"parent_company":"Nissin Electric Group (per search summary)","subsidiaries_brands":null,"description":null,"primary_equipment":"Ion implanters (medium current, SiC power devices, FPD)","equipment_ids":["EQP-A10"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 8 (2026-09-30): found by keyword search (\"ion implanter manufacturer\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Established 1999; member of the Nissin Electric Group — per search summary of nissin.jp. No revenue, market share or customer claims.","source_ids":["SRC-000858"],"discovery_keywords":["ion implanter manufacturer"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["City","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 8","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["City"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000339","legacy_id":"C0339","entity_type":"company","name":"Ferrotec","canonical_name":"Ferrotec","aliases":[],"former_names":[],"company_type":"Subsystem supplier","supplier_types":["Subsystem Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.ferrotec.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Vacuum feedthroughs / ferrofluidic seals, quartz, ceramics, silicon parts, wafers","equipment_ids":["EQP-A41"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 8 (2026-09-30): found by keyword search (\"vacuum feedthrough; quartz silicon parts\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000859"],"discovery_keywords":["vacuum feedthrough","quartz silicon parts"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 8","completeness":{"score":38,"filled":6,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000340","legacy_id":"C0340","entity_type":"company","name":"HIWIN","canonical_name":"HIWIN","aliases":[],"former_names":[],"company_type":"Motion","supplier_types":["Motion Supplier","Component Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Taiwan","country_id":"CTY-TW","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.hiwin.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Linear motors, linear motor stages (incl. clean-room types) and guideways","equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 8 (2026-09-30): found by keyword search (\"linear motor stage wafer; semiconductor motion\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000860"],"discovery_keywords":["linear motor stage wafer","semiconductor motion"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 8","completeness":{"score":31,"filled":5,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000341","legacy_id":"C0341","entity_type":"company","name":"Freiberg Instruments","canonical_name":"Freiberg Instruments","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"Germany","country_id":"CTY-DE","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Freiberg","region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.freiberginstruments.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Contactless carrier-lifetime / resistivity metrology (MDP)","equipment_ids":["EQP-A25"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 8 (2026-09-30): found by keyword search (\"wafer lifetime measurement; contactless metrology\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Freiberg address per search summary of the company / Saxony directory. No revenue, market share or customer claims.","source_ids":["SRC-000861"],"discovery_keywords":["wafer lifetime measurement","contactless metrology"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Founded year","Employees"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 8","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000342","legacy_id":"C0342","entity_type":"company","name":"Tokyo Ohka Kogyo (TOK)","canonical_name":"Tokyo Ohka Kogyo","aliases":["TOK"],"former_names":[],"company_type":"Materials/gases","supplier_types":["Materials Supplier","Gas Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.tok.co.jp/eng/","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Photoresists (EUV, ArF, KrF, i-line) and high-purity process chemicals","equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 9 (2026-09-30): found by keyword search (\"photoresist manufacturer; EUV photoresist\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000879","SRC-000880"],"discovery_keywords":["photoresist manufacturer","EUV photoresist"],"freshness":"Needs Review","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":"2025","review_due":"2027-03-29"},"batch":"Batch 9","completeness":{"score":38,"filled":6,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"TOK","basis":"Recorded alias"},{"alias":"Tokyo Ohka Kogyo","basis":"Name without parenthetical"}]},{"id":"CMP-000343","legacy_id":"C0343","entity_type":"company","name":"JSR","canonical_name":"JSR","aliases":[],"former_names":[],"company_type":"Materials/gases","supplier_types":["Materials Supplier","Gas Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.jsr.co.jp/jsr_e/","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Photoresists (i-line to EUV incl. metal-oxide via Inpria), multilayer, cleaning and CMP materials","equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 9 (2026-09-30): found by keyword search (\"photoresist manufacturer; EUV resist\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000881","SRC-000882"],"discovery_keywords":["photoresist manufacturer","EUV resist"],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":"2021-09-17","review_due":"2027-03-29"},"batch":"Batch 9","completeness":{"score":38,"filled":6,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000344","legacy_id":"C0344","entity_type":"company","name":"Shin-Etsu Chemical","canonical_name":"Shin-Etsu Chemical","aliases":[],"former_names":[],"company_type":"Materials/gases","supplier_types":["Materials Supplier","Gas Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.shinetsu.co.jp/en/","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Silicon wafers (Shin-Etsu Handotai), photoresists (i-line to EUV), photomask blanks","equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 9 (2026-09-30): found by keyword search (\"photoresist manufacturer; silicon wafer manufacturer; photomask blanks\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000883"],"discovery_keywords":["photoresist manufacturer","silicon wafer manufacturer","photomask blanks"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 9","completeness":{"score":31,"filled":5,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000345","legacy_id":"C0345","entity_type":"company","name":"Dongjin Semichem","canonical_name":"Dongjin Semichem","aliases":[],"former_names":[],"company_type":"Materials/gases","supplier_types":["Materials Supplier","Gas Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.dongjin.com/en/main/","founded":"1967","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Photoresists (ArF immersion, ArF, KrF, i-line), BARC, SOC hardmask, CMP slurry, thinners","equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 9 (2026-09-30): found by keyword search (\"photoresist Korea; semiconductor materials Korea\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Established 1967 — per search summary of dongjin.com. No revenue, market share or customer claims.","source_ids":["SRC-000884"],"discovery_keywords":["photoresist Korea","semiconductor materials Korea"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 9","completeness":{"score":38,"filled":6,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","City"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000346","legacy_id":"C0346","entity_type":"company","name":"Soulbrain","canonical_name":"Soulbrain","aliases":[],"former_names":[],"company_type":"Materials/gases","supplier_types":["Materials Supplier","Gas Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Seongnam","region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.soulbrain.co.kr/en/","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Etchants, cleaning agents, CMP slurry and precursors (ultra-high purity)","equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 9 (2026-09-30): found by keyword search (\"semiconductor etchant; process chemicals Korea\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Head office Seongnam; plants in Gongju and Paju — per search summary of soulbrain.co.kr. No revenue, market share or customer claims.","source_ids":["SRC-000885"],"discovery_keywords":["semiconductor etchant","process chemicals Korea"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 9","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":5,"total":6,"missing":["Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000347","legacy_id":"C0347","entity_type":"company","name":"Fujimi Incorporated","canonical_name":"Fujimi Incorporated","aliases":[],"former_names":[],"company_type":"Materials/gases","supplier_types":["Materials Supplier","Gas Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.fujimiinc.co.jp/english/","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"CMP slurries (PLANERLITE) and abrasives","equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 9 (2026-09-30): found by keyword search (\"CMP slurry manufacturer\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000886"],"discovery_keywords":["CMP slurry manufacturer"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 9","completeness":{"score":31,"filled":5,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"Fujimi","basis":"Name without legal suffix"}]},{"id":"CMP-000348","legacy_id":"C0348","entity_type":"company","name":"Resonac","canonical_name":"Resonac","aliases":[],"former_names":[],"company_type":"Materials/gases","supplier_types":["Materials Supplier","Gas Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.resonac.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"CMP slurries (ceria, Cu, barrier), packaging materials (NCF, TIM, dry film, laminates)","equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 9 (2026-09-30): found by keyword search (\"CMP slurry manufacturer; semiconductor packaging materials\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000887","SRC-000888"],"discovery_keywords":["CMP slurry manufacturer","semiconductor packaging materials"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 9","completeness":{"score":38,"filled":6,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000349","legacy_id":"C0349","entity_type":"company","name":"Linde (Electronics)","canonical_name":"Linde","aliases":[],"former_names":[],"company_type":"Materials/gases","supplier_types":["Materials Supplier","Gas Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"United Kingdom","country_id":"CTY-GB","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.linde.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Electronic specialty gases, bulk / on-site gases, gas equipment and services for fabs","equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 9 (2026-09-30): found by keyword search (\"electronic specialty gases; semiconductor gas supply\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000889","SRC-000890"],"discovery_keywords":["electronic specialty gases","semiconductor gas supply"],"freshness":"Recent","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":"2026-07","review_due":"2027-03-29"},"batch":"Batch 9","completeness":{"score":38,"filled":6,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"Linde","basis":"Name without parenthetical"}]},{"id":"CMP-000350","legacy_id":"C0350","entity_type":"company","name":"Air Liquide (Electronics)","canonical_name":"Air Liquide","aliases":[],"former_names":[],"company_type":"Materials/gases","supplier_types":["Materials Supplier","Gas Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"France","country_id":"CTY-FR","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Europe"},"ownership":null,"exchange":null,"ticker":null,"website":"https://electronics.airliquide.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Ultra-high-purity carrier gases, specialty / advanced materials (ALOHA, Voltaix precursors), gas equipment","equipment_ids":["EQP-L05"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 9 (2026-09-30): found by keyword search (\"electronic specialty gases; deposition precursors\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000891","SRC-000892"],"discovery_keywords":["electronic specialty gases","deposition precursors"],"freshness":"Recent","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":"2026-03-25","review_due":"2027-03-29"},"batch":"Batch 9","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["Equipment category confirmed"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":3,"total":4,"missing":["Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":["EQP-L05"],"resolution_keys":[{"alias":"Air Liquide","basis":"Name without parenthetical"}]},{"id":"CMP-000351","legacy_id":"C0351","entity_type":"company","name":"Taiyo Nippon Sanso","canonical_name":"Taiyo Nippon Sanso","aliases":[],"former_names":[],"company_type":"Materials/gases","supplier_types":["Materials Supplier","Gas Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.tn-sanso.co.jp/en/","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Industrial and specialty gases; gas-supply systems for semiconductor fabs","equipment_ids":["EQP-L04"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 9 (2026-09-30): found by keyword search (\"electronic gases Japan; specialty gas\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000893"],"discovery_keywords":["electronic gases Japan","specialty gas"],"freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":"2024","review_due":"2027-03-29"},"batch":"Batch 9","completeness":{"score":38,"filled":6,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000352","legacy_id":"C0352","entity_type":"company","name":"Kanto Denka Kogyo","canonical_name":"Kanto Denka Kogyo","aliases":[],"former_names":[],"company_type":"Materials/gases","supplier_types":["Materials Supplier","Gas Supplier"],"supply_chain_level":"LV2","is_startup":false,"hq":{"country":"Japan","country_id":"CTY-JP","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":"TSE Prime","ticker":null,"website":"https://www.kantodenka.co.jp/english/","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Fluorine-based specialty gases for etching, deposition and chamber cleaning (NF3, C4F6, WF6, ClF3, KSG series)","equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 9 (2026-09-30): found by keyword search (\"semiconductor etching gas; fluorine specialty gas\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000894"],"discovery_keywords":["semiconductor etching gas","fluorine specialty gas"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees","Confirmed equipment category"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 9","completeness":{"score":38,"filled":6,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000353","legacy_id":"C0353","entity_type":"company","name":"Applied Energy Systems (SEMI-GAS)","canonical_name":"Applied Energy Systems","aliases":["SEMI-GAS"],"former_names":[],"company_type":"Gas/chemical delivery","supplier_types":["Gas Supplier","Subsystem Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.appliedenergysystems.com","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"UHP gas cabinets and bulk specialty-gas delivery systems (SEMI-GAS Centurion, Megaturion)","equipment_ids":["EQP-A43","EQP-L04"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 9 (2026-09-30): found by keyword search (\"specialty gas cabinet; gas delivery system\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000895"],"discovery_keywords":["specialty gas cabinet","gas delivery system"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 9","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"SEMI-GAS","basis":"Recorded alias"},{"alias":"Applied Energy Systems","basis":"Name without parenthetical"}]},{"id":"CMP-000354","legacy_id":"C0354","entity_type":"company","name":"ZEUS","canonical_name":"ZEUS","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Hwaseong","region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.globalzeus.com/en/","founded":"1970","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Single-wafer and batch wet cleaning / etch / strip; robots and logistics","equipment_ids":["EQP-A04","EQP-A05","EQP-A08.06"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 9 (2026-09-30): found by keyword search (\"semiconductor wet cleaning equipment Korea\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Founded 1970; HQ Hwaseong — per search summary of globalzeus.com. No revenue, market share or customer claims.","source_ids":["SRC-000896"],"discovery_keywords":["semiconductor wet cleaning equipment Korea"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Employees"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 9","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":6,"total":6,"missing":[]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000355","legacy_id":"C0355","entity_type":"company","name":"Global Standard Technology (GST)","canonical_name":"Global Standard Technology","aliases":["GST"],"former_names":[],"company_type":"Vacuum/abatement","supplier_types":["Vacuum Supplier","Subsystem Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":"KOSDAQ","ticker":null,"website":"https://www.gst-in.com/en/","founded":"2001","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Exhaust-gas scrubbers and process chillers","equipment_ids":["EQP-L02","EQP-L03"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 9 (2026-09-30): found by keyword search (\"semiconductor scrubber; process chiller Korea\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Established October 2001; KOSDAQ-listed — per search summary of gst-in.com. No revenue, market share or customer claims.","source_ids":["SRC-000897"],"discovery_keywords":["semiconductor scrubber","process chiller Korea"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Employees"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 9","completeness":{"score":50,"filled":8,"total":16,"groups":[{"group":"Profile","filled":4,"total":6,"missing":["HQ country source-backed","City"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"GST","basis":"Recorded alias"},{"alias":"Global Standard Technology","basis":"Name without parenthetical"}]},{"id":"CMP-000356","legacy_id":"C0356","entity_type":"company","name":"UNISEM (Korea)","canonical_name":"UNISEM","aliases":["Korea"],"former_names":[],"company_type":"Vacuum/abatement","supplier_types":["Vacuum Supplier","Subsystem Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"South Korea","country_id":"CTY-KR","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://unisem.co.kr","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Gas scrubbers and chillers for semiconductor processes","equipment_ids":["EQP-L02","EQP-L03"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 9 (2026-09-30): found by keyword search (\"semiconductor scrubber; chiller Korea\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: First Korean gas-scrubber localisation (1993) — per search summary of the company history page. No revenue, market share or customer claims.","source_ids":["SRC-000898"],"discovery_keywords":["semiconductor scrubber","chiller Korea"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 9","completeness":{"score":38,"filled":6,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"UNISEM","basis":"Name without parenthetical"}]},{"id":"CMP-000357","legacy_id":"C0357","entity_type":"company","name":"Zhejiang Jingsheng Mechanical & Electrical (JSG)","canonical_name":"Zhejiang Jingsheng Mechanical & Electrical","aliases":["JSG"],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":null,"region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":"https://www.jsjd.cc/en/","founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Silicon / SiC / sapphire crystal growth furnaces, wafer processing and SiC epitaxy equipment","equipment_ids":["EQP-K01","EQP-A09.10","EQP-K03"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"TITLE","rationale":null,"notes":"Batch 9 (2026-09-30): found by keyword search (\"crystal growth furnace; SiC epitaxy China\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). No revenue, market share or customer claims.","source_ids":["SRC-000899"],"discovery_keywords":["crystal growth furnace","SiC epitaxy China"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","City","Founded year","Employees"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 9","completeness":{"score":44,"filled":7,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","City","Founded year"]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"JSG","basis":"Recorded alias"},{"alias":"Zhejiang Jingsheng Mechanical & Electrical","basis":"Name without parenthetical"}]},{"id":"CMP-000358","legacy_id":"C0358","entity_type":"company","name":"Mattson Technology","canonical_name":"Mattson Technology","aliases":[],"former_names":[],"company_type":"Equipment OEM","supplier_types":["Equipment OEM"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"United States","country_id":"CTY-US","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Fremont, California","region":"North America"},"ownership":null,"exchange":null,"ticker":null,"website":"https://mattson.com","founded":"1988","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Rapid thermal processing, millisecond anneal, dry strip and surface treatment","equipment_ids":["EQP-A12","EQP-A13","EQP-A07"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":70,"level":"MEDIUM"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 9 (2026-09-30): found by keyword search (\"rapid thermal processing; dry strip\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Founded 1988 in Fremont, California — per search summary of mattson.com. No revenue, market share or customer claims.","source_ids":["SRC-000900"],"discovery_keywords":["rapid thermal processing","dry strip"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Employees"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 9","completeness":{"score":63,"filled":10,"total":16,"groups":[{"group":"Profile","filled":6,"total":6,"missing":[]},{"group":"Portfolio","filled":2,"total":2,"missing":[]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]},{"id":"CMP-000359","legacy_id":"C0359","entity_type":"company","name":"Hymson Laser Intelligent Equipment","canonical_name":"Hymson Laser Intelligent Equipment","aliases":[],"former_names":[],"company_type":"Laser equipment OEM","supplier_types":["Equipment OEM","Laser Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Search-result summary of a cited source (page not read)","country_basis_code":"SUM","city":"Shenzhen","region":"Asia-Pacific"},"ownership":null,"exchange":"SSE STAR","ticker":"688559","website":"https://global.hymson.com/en/","founded":"2008","employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Laser cutting, welding, marking, drilling and scribing equipment (EV, PV, micro-LED, electronics)","equipment_ids":[],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 9 (2026-09-30): found by keyword search (\"China laser equipment; laser scribing\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Founded 2008, Shenzhen — per search summaries of directory profiles; semiconductor-specific products not named in titles. No revenue, market share or customer claims.","source_ids":["SRC-000901"],"discovery_keywords":["China laser equipment","laser scribing"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Employees","Confirmed equipment category"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 9","completeness":{"score":56,"filled":9,"total":16,"groups":[{"group":"Profile","filled":6,"total":6,"missing":[]},{"group":"Portfolio","filled":0,"total":2,"missing":["Equipment category confirmed","At least one product / model"]},{"group":"Commercial","filled":1,"total":3,"missing":["Revenue (reported)","Employees"]},{"group":"Evidence","filled":2,"total":4,"missing":["Two or more sources","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[{"alias":"688559","basis":"Stock ticker (SSE STAR)"}]},{"id":"CMP-000360","legacy_id":"C0360","entity_type":"company","name":"Beijing U-Precision Tech","canonical_name":"Beijing U-Precision Tech","aliases":[],"former_names":[],"company_type":"Motion","supplier_types":["Motion Supplier","Component Supplier"],"supply_chain_level":"LV1","is_startup":false,"hq":{"country":"China","country_id":"CTY-CN","country_basis":"Analyst knowledge — not source-traced","country_basis_code":"KNOW","city":"Beijing","region":"Asia-Pacific"},"ownership":null,"exchange":null,"ticker":null,"website":null,"founded":null,"employees":null,"ceo":null,"parent_company":null,"subsidiaries_brands":null,"description":null,"primary_equipment":"Motion stages incl. dual wafer stages for lithography; wafer bonding, laser annealing and EFEM equipment","equipment_ids":["EQP-A01"],"component_class_ids":[],"candidate_categories":null,"candidate_basis":null,"market_class":"UNCLASSIFIED","market_class_basis":"No ranking or revenue evidence","revenue":null,"semiconductor_revenue":null,"india":{"summary":null,"has_presence":false,"records":[]},"presence":{"china":null,"japan":null,"korea":null,"taiwan":null},"startup":null,"financials":[],"verification":"PARTIALLY_VERIFIED","confidence":{"score":50,"level":"LOW"},"evidence_depth":"SEARCH_SUMMARY","rationale":null,"notes":"Batch 9 (2026-09-30): found by keyword search (\"wafer stage lithography China\"). The cited page was located by web search; its content was not read directly (egress-restricted capture environment). Profile facts from the search-result summary of the cited source, not read directly: Dual wafer-stage and motion-stage scope per search summary of a Renishaw case study. No revenue, market share or customer claims.","source_ids":["SRC-000902"],"discovery_keywords":["wafer stage lithography China"],"freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Headquarters country (source)","Website","Founded year","Employees"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"},"batch":"Batch 9","completeness":{"score":31,"filled":5,"total":16,"groups":[{"group":"Profile","filled":3,"total":6,"missing":["HQ country source-backed","Website","Founded year"]},{"group":"Portfolio","filled":1,"total":2,"missing":["At least one product / model"]},{"group":"Commercial","filled":0,"total":3,"missing":["Ownership / listing","Revenue (reported)","Employees"]},{"group":"Evidence","filled":1,"total":4,"missing":["Two or more sources","Official (Tier 1) source","Verified (page read)"]},{"group":"Geography","filled":0,"total":1,"missing":["India presence assessed"]}],"basis":"Share of 16 key fields populated from captured evidence"},"equipment_ids_from_models":[],"resolution_keys":[]}],"product_families":[{"id":"PRD-000001","entity_type":"product_family","name":"Stealth dicing laser saw","company_id":"CMP-000010","manufacturer":"DISCO Corporation","model_ids":["MDL-000001","MDL-000002"],"equipment_ids":["EQP-C01.03"],"is_component":false,"process_ids":["PRS-032"],"technology_ids":["TEC-060","TEC-061","TEC-075"],"source_ids":["SRC-000054","SRC-000053"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000002","entity_type":"product_family","name":"Laser ingot slicing (KABRA)","company_id":"CMP-000010","manufacturer":"DISCO Corporation","model_ids":["MDL-000003"],"equipment_ids":["EQP-F01"],"is_component":false,"process_ids":["PRS-003"],"technology_ids":["TEC-065","TEC-072"],"source_ids":["SRC-000220"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000003","entity_type":"product_family","name":"Laser ingot slicing (automated KABRA)","company_id":"CMP-000010","manufacturer":"DISCO Corporation","model_ids":["MDL-000004"],"equipment_ids":["EQP-F01"],"is_component":false,"process_ids":["PRS-003"],"technology_ids":["TEC-065","TEC-072"],"source_ids":["SRC-000221","SRC-000222"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000004","entity_type":"product_family","name":"Stealth Dicing engine (laser + optics module)","company_id":"CMP-000011","manufacturer":"Hamamatsu Photonics","model_ids":["MDL-000005"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":["TEC-061","TEC-075"],"source_ids":["SRC-000054","SRC-000055","SRC-000056","SRC-000053","SRC-000102"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000005","entity_type":"product_family","name":"Fully automatic laser dicing machine (IR)","company_id":"CMP-000012","manufacturer":"Tokyo Seimitsu (ACCRETECH)","model_ids":["MDL-000006","MDL-000007"],"equipment_ids":["EQP-C01.03"],"is_component":false,"process_ids":["PRS-032"],"technology_ids":["TEC-060","TEC-061","TEC-075"],"source_ids":["SRC-000097","SRC-000101","SRC-000098"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000006","entity_type":"product_family","name":"Fully automatic dicing machine (UV laser)","company_id":"CMP-000012","manufacturer":"Tokyo Seimitsu (ACCRETECH)","model_ids":["MDL-000008"],"equipment_ids":["EQP-C01.02"],"is_component":false,"process_ids":["PRS-032"],"technology_ids":["TEC-060","TEC-062","TEC-064","TEC-073","TEC-081"],"source_ids":["SRC-000099"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000007","entity_type":"product_family","name":"Laser dicing machine","company_id":"CMP-000012","manufacturer":"Tokyo Seimitsu (ACCRETECH)","model_ids":["MDL-000009"],"equipment_ids":["EQP-C01.03"],"is_component":false,"process_ids":["PRS-032"],"technology_ids":["TEC-060","TEC-061"],"source_ids":["SRC-000100"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000008","entity_type":"product_family","name":"Laser dicing machine (legacy)","company_id":"CMP-000012","manufacturer":"Tokyo Seimitsu (ACCRETECH)","model_ids":["MDL-000010"],"equipment_ids":["EQP-C01.03"],"is_component":false,"process_ids":["PRS-032"],"technology_ids":["TEC-060","TEC-061"],"source_ids":["SRC-000102"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000009","entity_type":"product_family","name":"Laser dicing machine with wafer handling","company_id":"CMP-000012","manufacturer":"Tokyo Seimitsu (ACCRETECH)","model_ids":["MDL-000011"],"equipment_ids":["EQP-C01.03"],"is_component":false,"process_ids":["PRS-032"],"technology_ids":["TEC-060","TEC-061"],"source_ids":["SRC-000103"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000010","entity_type":"product_family","name":"Blade dicing machine","company_id":"CMP-000012","manufacturer":"Tokyo Seimitsu (ACCRETECH)","model_ids":["MDL-000012"],"equipment_ids":["EQP-C01.01"],"is_component":false,"process_ids":["PRS-032"],"technology_ids":["TEC-037"],"source_ids":["SRC-000105"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000011","entity_type":"product_family","name":"Fully automatic blade dicing machine","company_id":"CMP-000012","manufacturer":"Tokyo Seimitsu (ACCRETECH)","model_ids":["MDL-000013"],"equipment_ids":["EQP-C01.01"],"is_component":false,"process_ids":["PRS-032"],"technology_ids":["TEC-037"],"source_ids":["SRC-000106"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000012","entity_type":"product_family","name":"Compact blade dicing machine","company_id":"CMP-000012","manufacturer":"Tokyo Seimitsu (ACCRETECH)","model_ids":["MDL-000014"],"equipment_ids":["EQP-C01.01"],"is_component":false,"process_ids":["PRS-032"],"technology_ids":["TEC-037"],"source_ids":["SRC-000104"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000013","entity_type":"product_family","name":"Laser grooving platform","company_id":"CMP-000045","manufacturer":"ASMPT ALSI (Advanced Laser Separation International)","model_ids":["MDL-000015","MDL-000016"],"equipment_ids":["EQP-C01.02"],"is_component":false,"process_ids":["PRS-032"],"technology_ids":["TEC-064","TEC-073","TEC-076","TEC-077","TEC-060"],"source_ids":["SRC-000059","SRC-000063","SRC-000057","SRC-000062"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000014","entity_type":"product_family","name":"Laser dicing platform","company_id":"CMP-000045","manufacturer":"ASMPT ALSI (Advanced Laser Separation International)","model_ids":["MDL-000017","MDL-000018"],"equipment_ids":["EQP-C01.02"],"is_component":false,"process_ids":["PRS-032"],"technology_ids":["TEC-060","TEC-073","TEC-075"],"source_ids":["SRC-000059","SRC-000060","SRC-000064"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000015","entity_type":"product_family","name":"Laser dicing & grooving (HVM)","company_id":"CMP-000045","manufacturer":"ASMPT ALSI (Advanced Laser Separation International)","model_ids":["MDL-000019"],"equipment_ids":["EQP-C01.02"],"is_component":false,"process_ids":["PRS-032"],"technology_ids":["TEC-060","TEC-064"],"source_ids":["SRC-000061"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000016","entity_type":"product_family","name":"Laser grooving system","company_id":"CMP-000077","manufacturer":"EO Technics","model_ids":["MDL-000020"],"equipment_ids":["EQP-C01.02"],"is_component":false,"process_ids":["PRS-032"],"technology_ids":["TEC-064","TEC-062","TEC-060"],"source_ids":["SRC-000065"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000017","entity_type":"product_family","name":"Laser dicing system","company_id":"CMP-000077","manufacturer":"EO Technics","model_ids":["MDL-000021"],"equipment_ids":["EQP-C01.02"],"is_component":false,"process_ids":["PRS-032"],"technology_ids":["TEC-060"],"source_ids":["SRC-000065"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000018","entity_type":"product_family","name":"Laser marker (strip/tray/wafer)","company_id":"CMP-000077","manufacturer":"EO Technics","model_ids":["MDL-000022"],"equipment_ids":["EQP-C26"],"is_component":false,"process_ids":["PRS-038"],"technology_ids":["TEC-059"],"source_ids":["SRC-000065","SRC-000066"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000019","entity_type":"product_family","name":"WLCSP wafer back-side marker","company_id":"CMP-000077","manufacturer":"EO Technics","model_ids":["MDL-000023"],"equipment_ids":["EQP-C26"],"is_component":false,"process_ids":["PRS-038"],"technology_ids":["TEC-059"],"source_ids":["SRC-000066"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000020","entity_type":"product_family","name":"Wafer laser annealing","company_id":"CMP-000077","manufacturer":"EO Technics","model_ids":["MDL-000024"],"equipment_ids":["EQP-A14"],"is_component":false,"process_ids":["PRS-023"],"technology_ids":["TEC-067","TEC-074"],"source_ids":["SRC-000066","SRC-000068"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000021","entity_type":"product_family","name":"Laser debonding system","company_id":"CMP-000077","manufacturer":"EO Technics","model_ids":["MDL-000025"],"equipment_ids":["EQP-C18"],"is_component":false,"process_ids":["PRS-051","PRS-052"],"technology_ids":["TEC-069","TEC-073","TEC-044"],"source_ids":["SRC-000068","SRC-000065"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000022","entity_type":"product_family","name":"Q-switched pulsed fiber laser (in-house)","company_id":"CMP-000077","manufacturer":"EO Technics","model_ids":["MDL-000026"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":["TEC-080"],"source_ids":["SRC-000069"],"verification":"UNVERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000023","entity_type":"product_family","name":"Wafer dicing system (TLS)","company_id":"CMP-000141","manufacturer":"3D-Micromac","model_ids":["MDL-000027"],"equipment_ids":["EQP-C01.02"],"is_component":false,"process_ids":["PRS-032"],"technology_ids":["TEC-060","TEC-065"],"source_ids":["SRC-000070","SRC-000073","SRC-000074","SRC-000075","SRC-000072"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000024","entity_type":"product_family","name":"Laser annealing system","company_id":"CMP-000141","manufacturer":"3D-Micromac","model_ids":["MDL-000028","MDL-000029"],"equipment_ids":["EQP-A14"],"is_component":false,"process_ids":["PRS-023"],"technology_ids":["TEC-067","TEC-073","TEC-081"],"source_ids":["SRC-000071"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000025","entity_type":"product_family","name":"Laser MicroJet dicing machine","company_id":"CMP-000142","manufacturer":"Synova","model_ids":["MDL-000030"],"equipment_ids":["EQP-C01.02"],"is_component":false,"process_ids":["PRS-032"],"technology_ids":["TEC-060","TEC-074","TEC-075","TEC-081"],"source_ids":["SRC-000076","SRC-000077"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000026","entity_type":"product_family","name":"Laser dicing & edge grinding system","company_id":"CMP-000142","manufacturer":"Synova","model_ids":["MDL-000031"],"equipment_ids":["EQP-C01.02"],"is_component":false,"process_ids":["PRS-032"],"technology_ids":["TEC-060","TEC-065"],"source_ids":["SRC-000078"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000027","entity_type":"product_family","name":"3-axis laser cutting system","company_id":"CMP-000142","manufacturer":"Synova","model_ids":["MDL-000032"],"equipment_ids":["EQP-F07"],"is_component":false,"process_ids":["PRS-032"],"technology_ids":["TEC-065"],"source_ids":["SRC-000079"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000028","entity_type":"product_family","name":"5-axis laser cutting system","company_id":"CMP-000142","manufacturer":"Synova","model_ids":["MDL-000033"],"equipment_ids":["EQP-F07"],"is_component":false,"process_ids":["PRS-032"],"technology_ids":["TEC-065"],"source_ids":["SRC-000080"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000029","entity_type":"product_family","name":"LIDE glass wafer system","company_id":"CMP-000143","manufacturer":"LPKF Laser & Electronics","model_ids":["MDL-000034"],"equipment_ids":["EQP-D14"],"is_component":false,"process_ids":["PRS-044","PRS-053"],"technology_ids":["TEC-063","TEC-072","TEC-054"],"source_ids":["SRC-000083","SRC-000086"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000030","entity_type":"product_family","name":"Glass substrate panel system","company_id":"CMP-000143","manufacturer":"LPKF Laser & Electronics","model_ids":["MDL-000035"],"equipment_ids":["EQP-D18"],"is_component":false,"process_ids":["PRS-044","PRS-048"],"technology_ids":["TEC-063","TEC-072","TEC-049"],"source_ids":["SRC-000082","SRC-000084"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000031","entity_type":"product_family","name":"Laser glass bonding","company_id":"CMP-000143","manufacturer":"LPKF Laser & Electronics","model_ids":["MDL-000036"],"equipment_ids":["EQP-C31"],"is_component":false,"process_ids":[],"technology_ids":["TEC-066"],"source_ids":["SRC-000082"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000032","entity_type":"product_family","name":"Laser wafer marking (manual/semi-auto family)","company_id":"CMP-000144","manufacturer":"InnoLas Semiconductor","model_ids":["MDL-000037"],"equipment_ids":["EQP-C26"],"is_component":false,"process_ids":["PRS-038"],"technology_ids":["TEC-059"],"source_ids":["SRC-000229"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000033","entity_type":"product_family","name":"Laser wafer marking (cleanroom family)","company_id":"CMP-000144","manufacturer":"InnoLas Semiconductor","model_ids":["MDL-000038"],"equipment_ids":["EQP-C26"],"is_component":false,"process_ids":["PRS-038"],"technology_ids":["TEC-059"],"source_ids":["SRC-000229"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000034","entity_type":"product_family","name":"Laser wafer marking (300 mm)","company_id":"CMP-000144","manufacturer":"InnoLas Semiconductor","model_ids":["MDL-000039"],"equipment_ids":["EQP-C26"],"is_component":false,"process_ids":["PRS-038"],"technology_ids":["TEC-059"],"source_ids":["SRC-000229"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000035","entity_type":"product_family","name":"Wafer sorter","company_id":"CMP-000144","manufacturer":"InnoLas Semiconductor","model_ids":["MDL-000040"],"equipment_ids":["EQP-A34"],"is_component":false,"process_ids":["PRS-057"],"technology_ids":[],"source_ids":["SRC-000229"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000036","entity_type":"product_family","name":"Laser stealth dicing (SiC)","company_id":"CMP-000117","manufacturer":"Han's Laser Technology","model_ids":["MDL-000041"],"equipment_ids":["EQP-C01.03"],"is_component":false,"process_ids":["PRS-032"],"technology_ids":["TEC-060","TEC-061"],"source_ids":["SRC-000109"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000037","entity_type":"product_family","name":"Fully automatic wafer laser modification dicing machine","company_id":"CMP-000118","manufacturer":"HGTECH (Huagong Tech)","model_ids":["MDL-000042"],"equipment_ids":["EQP-C01.03"],"is_component":false,"process_ids":["PRS-032"],"technology_ids":["TEC-060","TEC-061"],"source_ids":["SRC-000107"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000038","entity_type":"product_family","name":"Wafer-level laser micro-drilling system (TGV)","company_id":"CMP-000119","manufacturer":"Suzhou Delphi Laser","model_ids":["MDL-000043"],"equipment_ids":["EQP-D14"],"is_component":false,"process_ids":["PRS-044","PRS-053"],"technology_ids":["TEC-063","TEC-072","TEC-054"],"source_ids":["SRC-000217"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000039","entity_type":"product_family","name":"Wafer laser dicing","company_id":"CMP-000119","manufacturer":"Suzhou Delphi Laser","model_ids":["MDL-000044"],"equipment_ids":["EQP-C01.02"],"is_component":false,"process_ids":["PRS-032"],"technology_ids":["TEC-060"],"source_ids":["SRC-000217"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000040","entity_type":"product_family","name":"SiC ingot laser slicing","company_id":"CMP-000119","manufacturer":"Suzhou Delphi Laser","model_ids":["MDL-000045"],"equipment_ids":["EQP-F01"],"is_component":false,"process_ids":["PRS-003"],"technology_ids":["TEC-065","TEC-072"],"source_ids":["SRC-000217"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000041","entity_type":"product_family","name":"Laser annealing","company_id":"CMP-000119","manufacturer":"Suzhou Delphi Laser","model_ids":["MDL-000046"],"equipment_ids":["EQP-A14"],"is_component":false,"process_ids":["PRS-023"],"technology_ids":["TEC-067"],"source_ids":["SRC-000217"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000042","entity_type":"product_family","name":"Laser debonding","company_id":"CMP-000119","manufacturer":"Suzhou Delphi Laser","model_ids":["MDL-000047"],"equipment_ids":["EQP-C18"],"is_component":false,"process_ids":["PRS-051","PRS-052"],"technology_ids":["TEC-069","TEC-044"],"source_ids":["SRC-000217"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000043","entity_type":"product_family","name":"TGV laser micro-hole equipment","company_id":"CMP-000120","manufacturer":"Wuhan DR Laser Technology","model_ids":["MDL-000048"],"equipment_ids":["EQP-D14"],"is_component":false,"process_ids":["PRS-044","PRS-053"],"technology_ids":["TEC-063","TEC-054"],"source_ids":["SRC-000218"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000044","entity_type":"product_family","name":"Wafer laser cutting & grooving","company_id":"CMP-000121","manufacturer":"Suzhou Maxwell Technologies","model_ids":["MDL-000049"],"equipment_ids":["EQP-C01.02"],"is_component":false,"process_ids":["PRS-032"],"technology_ids":["TEC-064","TEC-065","TEC-060"],"source_ids":["SRC-000219"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000045","entity_type":"product_family","name":"TGV equipment for glass substrates","company_id":"CMP-000078","manufacturer":"Philoptics","model_ids":["MDL-000050"],"equipment_ids":["EQP-D14"],"is_component":false,"process_ids":["PRS-044","PRS-053"],"technology_ids":["TEC-063","TEC-054"],"source_ids":["SRC-000117","SRC-000116","SRC-000119"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000046","entity_type":"product_family","name":"TGV hole inspection kit","company_id":"CMP-000078","manufacturer":"Philoptics","model_ids":["MDL-000051"],"equipment_ids":["EQP-A23"],"is_component":false,"process_ids":["PRS-027"],"technology_ids":["TEC-031"],"source_ids":["SRC-000118"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000047","entity_type":"product_family","name":"Solid-state laser annealing (SLA) G8.6","company_id":"CMP-000079","manufacturer":"AP Systems","model_ids":["MDL-000052"],"equipment_ids":["EQP-I07"],"is_component":false,"process_ids":["PRS-055"],"technology_ids":["TEC-067","TEC-081"],"source_ids":["SRC-000226"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000048","entity_type":"product_family","name":"Excimer laser annealing (ELA) / LLO Gen 8.6","company_id":"CMP-000079","manufacturer":"AP Systems","model_ids":["MDL-000053"],"equipment_ids":["EQP-I07"],"is_component":false,"process_ids":["PRS-055"],"technology_ids":["TEC-067","TEC-068","TEC-082"],"source_ids":["SRC-000227","SRC-000248"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000049","entity_type":"product_family","name":"Laser-assisted bonder","company_id":"CMP-000057","manufacturer":"Protec","model_ids":["MDL-000054"],"equipment_ids":["EQP-C19"],"is_component":false,"process_ids":["PRS-035"],"technology_ids":["TEC-066"],"source_ids":["SRC-000228"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000050","entity_type":"product_family","name":"Laser-assisted bonding equipment","company_id":"CMP-000056","manufacturer":"PacTech","model_ids":["MDL-000055"],"equipment_ids":["EQP-C19"],"is_component":false,"process_ids":["PRS-035"],"technology_ids":["TEC-066"],"source_ids":["SRC-000244"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000051","entity_type":"product_family","name":"Laser spike anneal","company_id":"CMP-000014","manufacturer":"Veeco Instruments","model_ids":["MDL-000056","MDL-000057"],"equipment_ids":["EQP-A14"],"is_component":false,"process_ids":["PRS-023"],"technology_ids":["TEC-067","TEC-075"],"source_ids":["SRC-000087","SRC-000088","SRC-000089","SRC-000090"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000052","entity_type":"product_family","name":"Nanosecond annealing","company_id":"CMP-000014","manufacturer":"Veeco Instruments","model_ids":["MDL-000058"],"equipment_ids":["EQP-A13"],"is_component":false,"process_ids":["PRS-023"],"technology_ids":["TEC-067","TEC-028"],"source_ids":["SRC-000088"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000053","entity_type":"product_family","name":"Laser annealing","company_id":"CMP-000174","manufacturer":"Sumitomo Heavy Industries (Mechatronics)","model_ids":["MDL-000059","MDL-000060"],"equipment_ids":["EQP-A14"],"is_component":false,"process_ids":["PRS-023"],"technology_ids":["TEC-067","TEC-074","TEC-073"],"source_ids":["SRC-000223","SRC-000092"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000054","entity_type":"product_family","name":"Laser annealing for silicidation","company_id":"CMP-000175","manufacturer":"JSW Aktina System","model_ids":["MDL-000061"],"equipment_ids":["EQP-A14"],"is_component":false,"process_ids":["PRS-023"],"technology_ids":["TEC-067"],"source_ids":["SRC-000224"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000055","entity_type":"product_family","name":"Laser annealing (display)","company_id":"CMP-000175","manufacturer":"JSW Aktina System","model_ids":["MDL-000062"],"equipment_ids":["EQP-I07"],"is_component":false,"process_ids":["PRS-055"],"technology_ids":["TEC-067","TEC-082"],"source_ids":["SRC-000224"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000056","entity_type":"product_family","name":"Laser lift-off","company_id":"CMP-000175","manufacturer":"JSW Aktina System","model_ids":["MDL-000063"],"equipment_ids":["EQP-I06"],"is_component":false,"process_ids":["PRS-054"],"technology_ids":["TEC-068"],"source_ids":["SRC-000224"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000057","entity_type":"product_family","name":"UV laser annealing","company_id":"CMP-000177","manufacturer":"LASSE (Laser Systems & Solutions of Europe)","model_ids":["MDL-000064"],"equipment_ids":["EQP-A14"],"is_component":false,"process_ids":["PRS-023"],"technology_ids":["TEC-067","TEC-073"],"source_ids":["SRC-000091"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000058","entity_type":"product_family","name":"Laser annealing","company_id":"CMP-000177","manufacturer":"LASSE (Laser Systems & Solutions of Europe)","model_ids":["MDL-000065"],"equipment_ids":["EQP-A14"],"is_component":false,"process_ids":["PRS-023"],"technology_ids":["TEC-067"],"source_ids":["SRC-000092"],"verification":"UNVERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000059","entity_type":"product_family","name":"Line-beam LLO system","company_id":"CMP-000145","manufacturer":"Coherent Corp.","model_ids":["MDL-000066"],"equipment_ids":["EQP-I06"],"is_component":false,"process_ids":["PRS-054"],"technology_ids":["TEC-068","TEC-082","TEC-073"],"source_ids":["SRC-000093"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000060","entity_type":"product_family","name":"Excimer laser annealing","company_id":"CMP-000145","manufacturer":"Coherent Corp.","model_ids":["MDL-000067"],"equipment_ids":["EQP-I07"],"is_component":false,"process_ids":["PRS-055"],"technology_ids":["TEC-067","TEC-082"],"source_ids":["SRC-000096","SRC-000094"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000061","entity_type":"product_family","name":"MicroLED laser processing","company_id":"CMP-000145","manufacturer":"Coherent Corp.","model_ids":["MDL-000068"],"equipment_ids":["EQP-I08"],"is_component":false,"process_ids":["PRS-056"],"technology_ids":["TEC-068","TEC-070","TEC-071","TEC-082"],"source_ids":["SRC-000095"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000062","entity_type":"product_family","name":"DPSS laser source","company_id":"CMP-000145","manufacturer":"Coherent Corp.","model_ids":["MDL-000069"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":["TEC-081"],"source_ids":["SRC-000226"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000063","entity_type":"product_family","name":"CO2 laser via drilling","company_id":"CMP-000148","manufacturer":"MKS Instruments","model_ids":["MDL-000070"],"equipment_ids":["EQP-C28"],"is_component":false,"process_ids":["PRS-044","PRS-053"],"technology_ids":["TEC-063","TEC-079"],"source_ids":["SRC-000230"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000064","entity_type":"product_family","name":"UV laser via drilling","company_id":"CMP-000148","manufacturer":"MKS Instruments","model_ids":["MDL-000071"],"equipment_ids":["EQP-C28"],"is_component":false,"process_ids":["PRS-044","PRS-053"],"technology_ids":["TEC-063","TEC-073"],"source_ids":["SRC-000247"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000065","entity_type":"product_family","name":"Excimer laser for micro-via processing","company_id":"CMP-000032","manufacturer":"Gigaphoton","model_ids":["MDL-000072"],"equipment_ids":["EQP-C28"],"is_component":false,"process_ids":["PRS-044","PRS-053"],"technology_ids":["TEC-063","TEC-082"],"source_ids":["SRC-000326"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000066","entity_type":"product_family","name":"Plasma dicing","company_id":"CMP-000054","manufacturer":"Plasma-Therm","model_ids":["MDL-000073"],"equipment_ids":["EQP-C01.04"],"is_component":false,"process_ids":["PRS-032"],"technology_ids":["TEC-014"],"source_ids":["SRC-000231"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000067","entity_type":"product_family","name":"Plasma dicer","company_id":"CMP-000055","manufacturer":"Panasonic Connect","model_ids":["MDL-000074"],"equipment_ids":["EQP-C01.04"],"is_component":false,"process_ids":["PRS-032"],"technology_ids":["TEC-014"],"source_ids":["SRC-000234"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000068","entity_type":"product_family","name":"Plasma dicing (SPTS)","company_id":"CMP-000005","manufacturer":"KLA Corporation","model_ids":["MDL-000075"],"equipment_ids":["EQP-C01.04"],"is_component":false,"process_ids":["PRS-032"],"technology_ids":["TEC-014"],"source_ids":["SRC-000235"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000069","entity_type":"product_family","name":"Laser debonding","company_id":"CMP-000051","manufacturer":"EV Group (EVG)","model_ids":["MDL-000076"],"equipment_ids":["EQP-C18"],"is_component":false,"process_ids":["PRS-051","PRS-052"],"technology_ids":["TEC-069","TEC-075","TEC-044"],"source_ids":["SRC-000232","SRC-000243"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000070","entity_type":"product_family","name":"Temporary bonding / debonding","company_id":"CMP-000051","manufacturer":"EV Group (EVG)","model_ids":["MDL-000077"],"equipment_ids":["EQP-C18"],"is_component":false,"process_ids":["PRS-051","PRS-052"],"technology_ids":["TEC-044"],"source_ids":["SRC-000232"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000071","entity_type":"product_family","name":"Excimer laser debonder","company_id":"CMP-000052","manufacturer":"SUSS MicroTec","model_ids":["MDL-000078"],"equipment_ids":["EQP-C18"],"is_component":false,"process_ids":["PRS-051","PRS-052"],"technology_ids":["TEC-069","TEC-082","TEC-044"],"source_ids":["SRC-000233"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000072","entity_type":"product_family","name":"HBM TC bonder","company_id":"CMP-000047","manufacturer":"Hanmi Semiconductor","model_ids":["MDL-000079"],"equipment_ids":["EQP-C16"],"is_component":false,"process_ids":["PRS-035","PRS-049","PRS-050"],"technology_ids":["TEC-042"],"source_ids":["SRC-000041","SRC-000042"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000073","entity_type":"product_family","name":"TC bonder","company_id":"CMP-000048","manufacturer":"Hanwha Semitech","model_ids":["MDL-000080"],"equipment_ids":["EQP-C16"],"is_component":false,"process_ids":["PRS-035","PRS-049","PRS-050"],"technology_ids":["TEC-042"],"source_ids":["SRC-000043"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000074","entity_type":"product_family","name":"Hybrid bonder","company_id":"CMP-000048","manufacturer":"Hanwha Semitech","model_ids":["MDL-000081"],"equipment_ids":["EQP-C17"],"is_component":false,"process_ids":["PRS-049","PRS-050","PRS-051"],"technology_ids":["TEC-043"],"source_ids":["SRC-000040","SRC-000048"],"verification":"UNVERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000075","entity_type":"product_family","name":"Die-to-wafer hybrid bonding system","company_id":"CMP-000002","manufacturer":"Applied Materials","model_ids":["MDL-000082"],"equipment_ids":["EQP-C17"],"is_component":false,"process_ids":["PRS-049","PRS-050","PRS-051"],"technology_ids":["TEC-043"],"source_ids":["SRC-000046","SRC-000051"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000076","entity_type":"product_family","name":"High-precision die bonder","company_id":"CMP-000026","manufacturer":"Mycronic","model_ids":["MDL-000083"],"equipment_ids":["EQP-C10"],"is_component":false,"process_ids":["PRS-033"],"technology_ids":["TEC-039"],"source_ids":["SRC-000340"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000077","entity_type":"product_family","name":"High-precision flip-chip die bonder","company_id":"CMP-000026","manufacturer":"Mycronic","model_ids":["MDL-000084"],"equipment_ids":["EQP-C11"],"is_component":false,"process_ids":["PRS-035","PRS-050"],"technology_ids":["TEC-041"],"source_ids":["SRC-000341"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000078","entity_type":"product_family","name":"Compression molding","company_id":"CMP-000049","manufacturer":"TOWA Corporation","model_ids":["MDL-000085"],"equipment_ids":["EQP-C20"],"is_component":false,"process_ids":["PRS-036","PRS-047"],"technology_ids":["TEC-045"],"source_ids":["SRC-000237"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000079","entity_type":"product_family","name":"Singulation","company_id":"CMP-000049","manufacturer":"TOWA Corporation","model_ids":["MDL-000086"],"equipment_ids":["EQP-C32"],"is_component":false,"process_ids":["PRS-039"],"technology_ids":[],"source_ids":["SRC-000237"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000080","entity_type":"product_family","name":"Wire bonder","company_id":"CMP-000050","manufacturer":"Yamaha Robotics Holdings","model_ids":["MDL-000087"],"equipment_ids":["EQP-C12"],"is_component":false,"process_ids":["PRS-034"],"technology_ids":["TEC-040"],"source_ids":["SRC-000240"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000081","entity_type":"product_family","name":"Flip-chip bonder","company_id":"CMP-000050","manufacturer":"Yamaha Robotics Holdings","model_ids":["MDL-000088"],"equipment_ids":["EQP-C11"],"is_component":false,"process_ids":["PRS-035","PRS-050"],"technology_ids":["TEC-041"],"source_ids":["SRC-000240"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000082","entity_type":"product_family","name":"Dicing saw","company_id":"CMP-000053","manufacturer":"Advanced Dicing Technologies (ADT)","model_ids":["MDL-000089"],"equipment_ids":["EQP-C01.01"],"is_component":false,"process_ids":["PRS-032"],"technology_ids":["TEC-037"],"source_ids":["SRC-000236"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000083","entity_type":"product_family","name":"Wafer-level burn-in","company_id":"CMP-000040","manufacturer":"Aehr Test Systems","model_ids":["MDL-000090"],"equipment_ids":["EQP-C38"],"is_component":false,"process_ids":["PRS-042"],"technology_ids":["TEC-057"],"source_ids":["SRC-000241","SRC-000242"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000084","entity_type":"product_family","name":"Packaged-part burn-in","company_id":"CMP-000040","manufacturer":"Aehr Test Systems","model_ids":["MDL-000091"],"equipment_ids":["EQP-C38"],"is_component":false,"process_ids":["PRS-042"],"technology_ids":["TEC-057"],"source_ids":["SRC-000241"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000085","entity_type":"product_family","name":"HBM Cube Prober","company_id":"CMP-000038","manufacturer":"Techwing","model_ids":["MDL-000092"],"equipment_ids":["EQP-A33"],"is_component":false,"process_ids":["PRS-029"],"technology_ids":["TEC-056"],"source_ids":["SRC-000302"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000086","entity_type":"product_family","name":"High-NA EUV scanner","company_id":"CMP-000001","manufacturer":"ASML Holding","model_ids":["MDL-000093"],"equipment_ids":["EQP-A01.01"],"is_component":false,"process_ids":["PRS-018"],"technology_ids":["TEC-001"],"source_ids":["SRC-000133","SRC-000198"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000087","entity_type":"product_family","name":"EUV scanner","company_id":"CMP-000001","manufacturer":"ASML Holding","model_ids":["MDL-000094"],"equipment_ids":["EQP-A01.01"],"is_component":false,"process_ids":["PRS-018"],"technology_ids":["TEC-001"],"source_ids":["SRC-000190","SRC-000191"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000088","entity_type":"product_family","name":"ArF immersion scanner","company_id":"CMP-000020","manufacturer":"Nikon Corporation","model_ids":["MDL-000095","MDL-000096"],"equipment_ids":["EQP-A01.03"],"is_component":false,"process_ids":["PRS-018"],"technology_ids":["TEC-003"],"source_ids":["SRC-000317","SRC-000349","SRC-000318"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000089","entity_type":"product_family","name":"Nanoimprint lithography","company_id":"CMP-000013","manufacturer":"Canon Inc.","model_ids":["MDL-000097"],"equipment_ids":["EQP-A01.07"],"is_component":false,"process_ids":["PRS-018"],"technology_ids":["TEC-007"],"source_ids":["SRC-000192","SRC-000193"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000090","entity_type":"product_family","name":"Dry ArF scanner","company_id":"CMP-000107","manufacturer":"SMEE (Shanghai Micro Electronics Equipment)","model_ids":["MDL-000098"],"equipment_ids":["EQP-A01.03"],"is_component":false,"process_ids":["PRS-018"],"technology_ids":["TEC-003"],"source_ids":["SRC-000187"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000091","entity_type":"product_family","name":"ArF scanner","company_id":"CMP-000107","manufacturer":"SMEE (Shanghai Micro Electronics Equipment)","model_ids":["MDL-000099"],"equipment_ids":["EQP-A01.03"],"is_component":false,"process_ids":["PRS-018"],"technology_ids":["TEC-003"],"source_ids":["SRC-000187","SRC-000189"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000092","entity_type":"product_family","name":"Actinic EUV patterned mask inspection","company_id":"CMP-000024","manufacturer":"Lasertec","model_ids":["MDL-000100"],"equipment_ids":["EQP-B02"],"is_component":false,"process_ids":["PRS-028"],"technology_ids":[],"source_ids":["SRC-000322","SRC-000345"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000093","entity_type":"product_family","name":"Multi-beam mask writer","company_id":"CMP-000025","manufacturer":"NuFlare Technology","model_ids":["MDL-000101"],"equipment_ids":["EQP-B07"],"is_component":false,"process_ids":["PRS-028"],"technology_ids":["TEC-006"],"source_ids":["SRC-000323"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000094","entity_type":"product_family","name":"ArF excimer light source","company_id":"CMP-000032","manufacturer":"Gigaphoton","model_ids":["MDL-000102"],"equipment_ids":["EQP-A01.02"],"is_component":false,"process_ids":["PRS-018"],"technology_ids":["TEC-082","TEC-002"],"source_ids":["SRC-000348"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000095","entity_type":"product_family","name":"PECVD","company_id":"CMP-000002","manufacturer":"Applied Materials","model_ids":["MDL-000103"],"equipment_ids":["EQP-A09.02"],"is_component":false,"process_ids":["PRS-013","PRS-014"],"technology_ids":["TEC-016"],"source_ids":["SRC-000124"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000096","entity_type":"product_family","name":"ALD","company_id":"CMP-000002","manufacturer":"Applied Materials","model_ids":["MDL-000104"],"equipment_ids":["EQP-A09.06"],"is_component":false,"process_ids":["PRS-013","PRS-015"],"technology_ids":["TEC-019"],"source_ids":["SRC-000124"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000097","entity_type":"product_family","name":"CCP etch","company_id":"CMP-000101","manufacturer":"NAURA Technology Group","model_ids":["MDL-000105"],"equipment_ids":["EQP-A08.02"],"is_component":false,"process_ids":["PRS-020"],"technology_ids":["TEC-009"],"source_ids":["SRC-000009"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000098","entity_type":"product_family","name":"ALD/CVD","company_id":"CMP-000069","manufacturer":"Wonik IPS","model_ids":["MDL-000106"],"equipment_ids":["EQP-A09.06"],"is_component":false,"process_ids":["PRS-013","PRS-015"],"technology_ids":["TEC-019"],"source_ids":["SRC-000174"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000099","entity_type":"product_family","name":"Atomic layer growth","company_id":"CMP-000070","manufacturer":"Jusung Engineering","model_ids":["MDL-000107"],"equipment_ids":["EQP-A09.06"],"is_component":false,"process_ids":["PRS-013","PRS-015"],"technology_ids":["TEC-019"],"source_ids":["SRC-000175"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000100","entity_type":"product_family","name":"PECVD","company_id":"CMP-000103","manufacturer":"Piotech","model_ids":["MDL-000108"],"equipment_ids":["EQP-A09.02"],"is_component":false,"process_ids":["PRS-013","PRS-014"],"technology_ids":["TEC-016"],"source_ids":["SRC-000314"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000101","entity_type":"product_family","name":"Hybrid bonding equipment","company_id":"CMP-000103","manufacturer":"Piotech","model_ids":["MDL-000109"],"equipment_ids":["EQP-C17"],"is_component":false,"process_ids":["PRS-049","PRS-050","PRS-051"],"technology_ids":["TEC-043"],"source_ids":["SRC-000314","SRC-000009"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000102","entity_type":"product_family","name":"Panel-level lithography","company_id":"CMP-000016","manufacturer":"Onto Innovation","model_ids":["MDL-000110"],"equipment_ids":["EQP-A01"],"is_component":false,"process_ids":["PRS-018"],"technology_ids":[],"source_ids":["SRC-000081"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000103","entity_type":"product_family","name":"Film metrology","company_id":"CMP-000016","manufacturer":"Onto Innovation","model_ids":["MDL-000111"],"equipment_ids":["EQP-A28"],"is_component":false,"process_ids":["PRS-026"],"technology_ids":["TEC-035"],"source_ids":["SRC-000196"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000104","entity_type":"product_family","name":"HBM process control","company_id":"CMP-000016","manufacturer":"Onto Innovation","model_ids":["MDL-000112"],"equipment_ids":["EQP-A25"],"is_component":false,"process_ids":["PRS-026"],"technology_ids":["TEC-035"],"source_ids":["SRC-000154"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000105","entity_type":"product_family","name":"MOCVD","company_id":"CMP-000028","manufacturer":"AIXTRON","model_ids":["MDL-000113"],"equipment_ids":["EQP-A09.01"],"is_component":false,"process_ids":["PRS-013","PRS-014"],"technology_ids":["TEC-015"],"source_ids":["SRC-000328","SRC-000344"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000106","entity_type":"product_family","name":"EFEM / sorter","company_id":"CMP-000063","manufacturer":"RORZE Corporation","model_ids":["MDL-000114"],"equipment_ids":["EQP-A37"],"is_component":false,"process_ids":["PRS-058"],"technology_ids":[],"source_ids":["SRC-000294"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000107","entity_type":"product_family","name":"Overhead hoist transport","company_id":"CMP-000066","manufacturer":"Murata Machinery (Muratec)","model_ids":["MDL-000115"],"equipment_ids":["EQP-J02"],"is_component":false,"process_ids":["PRS-057"],"technology_ids":[],"source_ids":["SRC-000300","SRC-000301"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000108","entity_type":"product_family","name":"CZ silicon ingot puller","company_id":"CMP-000184","manufacturer":"Raana Semiconductors","model_ids":["MDL-000116"],"equipment_ids":["EQP-K01"],"is_component":false,"process_ids":["PRS-001"],"technology_ids":[],"source_ids":["SRC-000211"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000109","entity_type":"product_family","name":"Crystal puller (prototype)","company_id":"CMP-000194","manufacturer":"ASM Technologies-HHV JV","model_ids":["MDL-000117"],"equipment_ids":["EQP-K01"],"is_component":false,"process_ids":["PRS-001"],"technology_ids":[],"source_ids":["SRC-000207"],"verification":"UNVERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000110","entity_type":"product_family","name":"Wafer dicing system","company_id":"CMP-000195","manufacturer":"SLTL (Sahajanand Laser Technology)","model_ids":["MDL-000118"],"equipment_ids":["EQP-C01.02"],"is_component":false,"process_ids":["PRS-032"],"technology_ids":["TEC-060"],"source_ids":["SRC-000208"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000111","entity_type":"product_family","name":"In-line AFM metrology","company_id":"CMP-000180","manufacturer":"Nearfield Instruments","model_ids":["MDL-000119"],"equipment_ids":["EQP-A30"],"is_component":false,"process_ids":["PRS-008","PRS-026"],"technology_ids":["TEC-035"],"source_ids":["SRC-000168"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000112","entity_type":"product_family","name":"Free-electron-laser EUV light source","company_id":"CMP-000182","manufacturer":"xLight","model_ids":["MDL-000120"],"equipment_ids":["EQP-A01.01"],"is_component":false,"process_ids":["PRS-018"],"technology_ids":["TEC-001"],"source_ids":["SRC-000171","SRC-000172"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000113","entity_type":"product_family","name":"Lithography system","company_id":"CMP-000181","manufacturer":"Substrate","model_ids":["MDL-000121"],"equipment_ids":["EQP-A01"],"is_component":false,"process_ids":["PRS-018"],"technology_ids":[],"source_ids":["SRC-000169","SRC-000170"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000114","entity_type":"product_family","name":"Femtosecond laser","company_id":"CMP-000149","manufacturer":"Light Conversion","model_ids":["MDL-000122"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":["TEC-076","TEC-078"],"source_ids":["SRC-000259"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000115","entity_type":"product_family","name":"Femtosecond laser","company_id":"CMP-000150","manufacturer":"Amplitude Laser","model_ids":["MDL-000123"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":["TEC-076","TEC-078"],"source_ids":["SRC-000264"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000116","entity_type":"product_family","name":"Ultrashort-pulse laser","company_id":"CMP-000147","manufacturer":"TRUMPF","model_ids":["MDL-000124"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":["TEC-076","TEC-059"],"source_ids":["SRC-000260","SRC-000342","SRC-000343"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000117","entity_type":"product_family","name":"Picosecond laser","company_id":"CMP-000148","manufacturer":"MKS Instruments","model_ids":["MDL-000125"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":["TEC-076","TEC-077","TEC-073","TEC-074"],"source_ids":["SRC-000262","SRC-000263"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000118","entity_type":"product_family","name":"Nanosecond pulsed fiber laser","company_id":"CMP-000146","manufacturer":"IPG Photonics","model_ids":["MDL-000126"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":["TEC-080","TEC-075"],"source_ids":["SRC-000269"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000119","entity_type":"product_family","name":"UV laser marking module (integrated source + scan head)","company_id":"CMP-000146","manufacturer":"IPG Photonics","model_ids":["MDL-000127"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":["TEC-059","TEC-073"],"source_ids":["SRC-000270"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000120","entity_type":"product_family","name":"Fiber lasers","company_id":"CMP-000133","manufacturer":"Wuhan Raycus Fiber Laser Technologies","model_ids":["MDL-000128"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":["TEC-080"],"source_ids":["SRC-000267"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000121","entity_type":"product_family","name":"MOPA pulsed fiber laser","company_id":"CMP-000134","manufacturer":"Shenzhen JPT Opto-electronics","model_ids":["MDL-000129"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":["TEC-080","TEC-059"],"source_ids":["SRC-000266"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000122","entity_type":"product_family","name":"UV lasers (fs / ps / ns)","company_id":"CMP-000135","manufacturer":"Wuhan Huaray Precision Laser","model_ids":["MDL-000130"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":["TEC-073","TEC-077","TEC-078","TEC-081"],"source_ids":["SRC-000265"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000123","entity_type":"product_family","name":"Galvanometer scanners","company_id":"CMP-000151","manufacturer":"Novanta (Cambridge Technology / Synrad)","model_ids":["MDL-000131"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":[],"source_ids":["SRC-000254"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000124","entity_type":"product_family","name":"Scan controller","company_id":"CMP-000151","manufacturer":"Novanta (Cambridge Technology / Synrad)","model_ids":["MDL-000132"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":[],"source_ids":["SRC-000255"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000125","entity_type":"product_family","name":"Scan heads (micromachining, multi-head)","company_id":"CMP-000152","manufacturer":"SCANLAB","model_ids":["MDL-000133"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":[],"source_ids":["SRC-000251","SRC-000252"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000126","entity_type":"product_family","name":"Diffractive optical elements","company_id":"CMP-000152","manufacturer":"SCANLAB","model_ids":["MDL-000134"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":[],"source_ids":["SRC-000253"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000127","entity_type":"product_family","name":"2-axis deflection units","company_id":"CMP-000153","manufacturer":"RAYLASE","model_ids":["MDL-000135"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":[],"source_ids":["SRC-000256"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000128","entity_type":"product_family","name":"Galvo scanners","company_id":"CMP-000136","manufacturer":"Sino-Galvo","model_ids":["MDL-000136"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":[],"source_ids":["SRC-000257","SRC-000258"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000129","entity_type":"product_family","name":"F-theta lenses & beam expanders","company_id":"CMP-000154","manufacturer":"Sill Optics","model_ids":["MDL-000137"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":[],"source_ids":["SRC-000282"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000130","entity_type":"product_family","name":"F-theta scan lenses","company_id":"CMP-000155","manufacturer":"Wavelength Opto-Electronic","model_ids":["MDL-000138"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":[],"source_ids":["SRC-000283"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000131","entity_type":"product_family","name":"Diffractive beam shapers","company_id":"CMP-000156","manufacturer":"Holo/Or","model_ids":["MDL-000139"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":[],"source_ids":["SRC-000293"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000132","entity_type":"product_family","name":"Acousto-optic modulators","company_id":"CMP-000157","manufacturer":"Gooch & Housego","model_ids":["MDL-000140"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":[],"source_ids":["SRC-000292"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000133","entity_type":"product_family","name":"Precision stages for wafer dicing / inspection","company_id":"CMP-000158","manufacturer":"Aerotech","model_ids":["MDL-000141"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":[],"source_ids":["SRC-000271","SRC-000272"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000134","entity_type":"product_family","name":"Air-bearing linear stage","company_id":"CMP-000159","manufacturer":"Physik Instrumente (PI)","model_ids":["MDL-000142"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":[],"source_ids":["SRC-000273"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000135","entity_type":"product_family","name":"Motion controllers & drives","company_id":"CMP-000160","manufacturer":"ACS Motion Control","model_ids":["MDL-000143"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":[],"source_ids":["SRC-000275"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000136","entity_type":"product_family","name":"Linear axis / linear motors","company_id":"CMP-000161","manufacturer":"ETEL (HEIDENHAIN group)","model_ids":["MDL-000144"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":[],"source_ids":["SRC-000276"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000137","entity_type":"product_family","name":"Interferometric laser encoders","company_id":"CMP-000162","manufacturer":"Renishaw","model_ids":["MDL-000145"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":[],"source_ids":["SRC-000277"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000138","entity_type":"product_family","name":"Wafer ID reader","company_id":"CMP-000163","manufacturer":"Cognex","model_ids":["MDL-000146"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":[],"source_ids":["SRC-000278","SRC-000279"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000139","entity_type":"product_family","name":"Industrial cameras","company_id":"CMP-000164","manufacturer":"Basler","model_ids":["MDL-000147"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":[],"source_ids":["SRC-000280"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000140","entity_type":"product_family","name":"Industrial cameras & vision","company_id":"CMP-000137","manufacturer":"Hangzhou Hikrobot","model_ids":["MDL-000148"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":[],"source_ids":["SRC-000281"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000141","entity_type":"product_family","name":"Industrial chillers","company_id":"CMP-000138","manufacturer":"TEYU S&A Chiller","model_ids":["MDL-000149"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":[],"source_ids":["SRC-000284"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000142","entity_type":"product_family","name":"Laser fume extraction","company_id":"CMP-000166","manufacturer":"ULT AG","model_ids":["MDL-000150"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":[],"source_ids":["SRC-000285"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000143","entity_type":"product_family","name":"Abatement system","company_id":"CMP-000168","manufacturer":"Edwards Vacuum","model_ids":["MDL-000151"],"equipment_ids":["EQP-A45"],"is_component":false,"process_ids":["PRS-059"],"technology_ids":[],"source_ids":["SRC-000286"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000144","entity_type":"product_family","name":"Dry vacuum pump + plasma abatement","company_id":"CMP-000023","manufacturer":"Ebara Corporation","model_ids":["MDL-000152"],"equipment_ids":["EQP-A42"],"is_component":false,"process_ids":["PRS-059"],"technology_ids":[],"source_ids":["SRC-000346"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000145","entity_type":"product_family","name":"RF plasma generators","company_id":"CMP-000170","manufacturer":"Advanced Energy","model_ids":["MDL-000153"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":[],"source_ids":["SRC-000290"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000146","entity_type":"product_family","name":"RF generators & matches","company_id":"CMP-000171","manufacturer":"Comet PCT","model_ids":["MDL-000154"],"equipment_ids":[],"is_component":true,"process_ids":[],"technology_ids":[],"source_ids":["SRC-000291"],"verification":"VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000147","entity_type":"product_family","name":"SPEED","company_id":"CMP-000003","manufacturer":"Lam Research","model_ids":["MDL-000532"],"equipment_ids":["EQP-A09.04"],"is_component":false,"process_ids":["PRS-013","PRS-014"],"technology_ids":["TEC-018"],"source_ids":["SRC-000926"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000148","entity_type":"product_family","name":"ALTUS","company_id":"CMP-000003","manufacturer":"Lam Research","model_ids":["MDL-000533"],"equipment_ids":["EQP-A17"],"is_component":false,"process_ids":["PRS-025"],"technology_ids":[],"source_ids":["SRC-000927"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000149","entity_type":"product_family","name":"Striker","company_id":"CMP-000003","manufacturer":"Lam Research","model_ids":["MDL-000534"],"equipment_ids":["EQP-A09.06"],"is_component":false,"process_ids":["PRS-013","PRS-015"],"technology_ids":["TEC-019"],"source_ids":["SRC-000928"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000150","entity_type":"product_family","name":"VECTOR","company_id":"CMP-000003","manufacturer":"Lam Research","model_ids":["MDL-000535"],"equipment_ids":["EQP-A09.02"],"is_component":false,"process_ids":["PRS-013","PRS-014"],"technology_ids":["TEC-016"],"source_ids":["SRC-000929"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000151","entity_type":"product_family","name":"Flex","company_id":"CMP-000003","manufacturer":"Lam Research","model_ids":["MDL-000536"],"equipment_ids":["EQP-A08.02"],"is_component":false,"process_ids":["PRS-020"],"technology_ids":["TEC-009"],"source_ids":["SRC-000930"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000152","entity_type":"product_family","name":"Reliant","company_id":"CMP-000003","manufacturer":"Lam Research","model_ids":["MDL-000537"],"equipment_ids":["EQP-A08"],"is_component":false,"process_ids":["PRS-020"],"technology_ids":[],"source_ids":["SRC-000931"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000153","entity_type":"product_family","name":"Centris","company_id":"CMP-000002","manufacturer":"Applied Materials","model_ids":["MDL-000538"],"equipment_ids":["EQP-A08.01"],"is_component":false,"process_ids":["PRS-020"],"technology_ids":["TEC-009"],"source_ids":["SRC-000932"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000154","entity_type":"product_family","name":"Producer","company_id":"CMP-000002","manufacturer":"Applied Materials","model_ids":["MDL-000539"],"equipment_ids":["EQP-A09.05"],"is_component":false,"process_ids":["PRS-013","PRS-014"],"technology_ids":["TEC-018"],"source_ids":["SRC-000933"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000155","entity_type":"product_family","name":"SEMVision","company_id":"CMP-000002","manufacturer":"Applied Materials","model_ids":["MDL-000540"],"equipment_ids":["EQP-A24"],"is_component":false,"process_ids":["PRS-027"],"technology_ids":["TEC-032"],"source_ids":["SRC-000934"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000156","entity_type":"product_family","name":"TWINSCAN NXT","company_id":"CMP-000001","manufacturer":"ASML Holding","model_ids":["MDL-000541","MDL-000542","MDL-000543"],"equipment_ids":["EQP-A01.03"],"is_component":false,"process_ids":["PRS-018"],"technology_ids":["TEC-003"],"source_ids":["SRC-000935","SRC-000936","SRC-000937"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000157","entity_type":"product_family","name":"HMI eScan","company_id":"CMP-000001","manufacturer":"ASML Holding","model_ids":["MDL-000544","MDL-000545","MDL-000546","MDL-000547"],"equipment_ids":["EQP-A24"],"is_component":false,"process_ids":["PRS-027"],"technology_ids":["TEC-032"],"source_ids":["SRC-000938","SRC-000939","SRC-000940","SRC-000941"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000158","entity_type":"product_family","name":"Episode","company_id":"CMP-000004","manufacturer":"Tokyo Electron (TEL)","model_ids":["MDL-000548"],"equipment_ids":["EQP-A09"],"is_component":false,"process_ids":["PRS-013"],"technology_ids":[],"source_ids":["SRC-000942"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000159","entity_type":"product_family","name":"Tactras","company_id":"CMP-000004","manufacturer":"Tokyo Electron (TEL)","model_ids":["MDL-000549"],"equipment_ids":["EQP-A08"],"is_component":false,"process_ids":["PRS-020"],"technology_ids":[],"source_ids":["SRC-000943"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000160","entity_type":"product_family","name":"Certas","company_id":"CMP-000004","manufacturer":"Tokyo Electron (TEL)","model_ids":["MDL-000550"],"equipment_ids":["EQP-A08"],"is_component":false,"process_ids":["PRS-020"],"technology_ids":[],"source_ids":["SRC-000944"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000161","entity_type":"product_family","name":"Batch deposition","company_id":"CMP-000022","manufacturer":"Kokusai Electric","model_ids":["MDL-000551","MDL-000552"],"equipment_ids":["EQP-A09.06","EQP-A09"],"is_component":false,"process_ids":["PRS-013","PRS-015"],"technology_ids":["TEC-019"],"source_ids":["SRC-000320"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000162","entity_type":"product_family","name":"Treatment","company_id":"CMP-000022","manufacturer":"Kokusai Electric","model_ids":["MDL-000553"],"equipment_ids":["EQP-A13"],"is_component":false,"process_ids":["PRS-023"],"technology_ids":["TEC-028"],"source_ids":["SRC-000320"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000163","entity_type":"product_family","name":"MBM","company_id":"CMP-000025","manufacturer":"NuFlare Technology","model_ids":["MDL-000554"],"equipment_ids":["EQP-B07"],"is_component":false,"process_ids":["PRS-028"],"technology_ids":["TEC-006"],"source_ids":["SRC-000945"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000164","entity_type":"product_family","name":"PROVE","company_id":"CMP-000027","manufacturer":"Carl Zeiss SMT","model_ids":["MDL-000555"],"equipment_ids":["EQP-B09"],"is_component":false,"process_ids":["PRS-028"],"technology_ids":[],"source_ids":["SRC-000946"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000165","entity_type":"product_family","name":"GEMINI","company_id":"CMP-000051","manufacturer":"EV Group (EVG)","model_ids":["MDL-000556","MDL-000557"],"equipment_ids":["EQP-D21","EQP-D22"],"is_component":false,"process_ids":["PRS-049"],"technology_ids":["TEC-050","TEC-044"],"source_ids":["SRC-000947","SRC-000948"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000166","entity_type":"product_family","name":"Datacon 8800","company_id":"CMP-000043","manufacturer":"BE Semiconductor Industries (BESI)","model_ids":["MDL-000558"],"equipment_ids":["EQP-D21"],"is_component":false,"process_ids":["PRS-049"],"technology_ids":["TEC-050"],"source_ids":["SRC-000949"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000167","entity_type":"product_family","name":"XBC300","company_id":"CMP-000052","manufacturer":"SUSS MicroTec","model_ids":["MDL-000559"],"equipment_ids":["EQP-D12"],"is_component":false,"process_ids":["PRS-051"],"technology_ids":["TEC-043"],"source_ids":["SRC-000950"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000168","entity_type":"product_family","name":"PIXALUX","company_id":"CMP-000046","manufacturer":"Kulicke & Soffa","model_ids":["MDL-000560"],"equipment_ids":["EQP-I01"],"is_component":false,"process_ids":[],"technology_ids":[],"source_ids":["SRC-000951"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000169","entity_type":"product_family","name":"VeroTherm","company_id":"CMP-000221","manufacturer":"Yield Engineering Systems (YES)","model_ids":["MDL-000561"],"equipment_ids":["EQP-D20"],"is_component":false,"process_ids":["PRS-046"],"technology_ids":["TEC-046"],"source_ids":["SRC-000952"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000170","entity_type":"product_family","name":"CHEMGUARD","company_id":"CMP-000370","manufacturer":"Merck Electronics (EMD Electronics)","model_ids":["MDL-000562","MDL-000563"],"equipment_ids":["EQP-L05","EQP-A44"],"is_component":false,"process_ids":["PRS-060"],"technology_ids":[],"source_ids":["SRC-000953","SRC-000954"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000171","entity_type":"product_family","name":"ALES","company_id":"CMP-000350","manufacturer":"Air Liquide (Electronics)","model_ids":["MDL-000564"],"equipment_ids":["EQP-L05"],"is_component":false,"process_ids":["PRS-060"],"technology_ids":[],"source_ids":["SRC-000955"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000172","entity_type":"product_family","name":"FabGuard","company_id":"CMP-000365","manufacturer":"INFICON","model_ids":["MDL-000565"],"equipment_ids":["EQP-J15"],"is_component":false,"process_ids":["PRS-058"],"technology_ids":[],"source_ids":["SRC-000918"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000173","entity_type":"product_family","name":"CIMConnect","company_id":"CMP-000364","manufacturer":"Cimetrix (PDF Solutions)","model_ids":["MDL-000566"],"equipment_ids":["EQP-J10"],"is_component":false,"process_ids":["PRS-058"],"technology_ids":[],"source_ids":["SRC-000917"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000174","entity_type":"product_family","name":"Semistar","company_id":"CMP-000363","manufacturer":"Yaskawa Electric (Semiconductor robotics)","model_ids":["MDL-000567"],"equipment_ids":["EQP-A34"],"is_component":false,"process_ids":["PRS-057"],"technology_ids":[],"source_ids":["SRC-000956"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000175","entity_type":"product_family","name":"SALIX","company_id":"CMP-000362","manufacturer":"DAS Environmental Expert","model_ids":["MDL-000568"],"equipment_ids":["EQP-A45"],"is_component":false,"process_ids":["PRS-059"],"technology_ids":[],"source_ids":["SRC-000957"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000176","entity_type":"product_family","name":"Single wafer cleaner","company_id":"CMP-000007","manufacturer":"SCREEN Holdings","model_ids":["MDL-000155","MDL-000156","MDL-000295"],"equipment_ids":["EQP-A04"],"is_component":false,"process_ids":["PRS-010"],"technology_ids":["TEC-030"],"source_ids":["SRC-000355","SRC-000356","SRC-000488"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000177","entity_type":"product_family","name":"Spin scrubber","company_id":"CMP-000007","manufacturer":"SCREEN Holdings","model_ids":["MDL-000157","MDL-000158"],"equipment_ids":["EQP-A20"],"is_component":false,"process_ids":["PRS-010"],"technology_ids":["TEC-030"],"source_ids":["SRC-000357","SRC-000358"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000178","entity_type":"product_family","name":"Wet station","company_id":"CMP-000007","manufacturer":"SCREEN Holdings","model_ids":["MDL-000159"],"equipment_ids":["EQP-A05"],"is_component":false,"process_ids":["PRS-010","PRS-021"],"technology_ids":["TEC-030"],"source_ids":["SRC-000359"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000179","entity_type":"product_family","name":"Coat/develop track","company_id":"CMP-000007","manufacturer":"SCREEN Holdings","model_ids":["MDL-000160","MDL-000161"],"equipment_ids":["EQP-A03"],"is_component":false,"process_ids":["PRS-017","PRS-019"],"technology_ids":[],"source_ids":["SRC-000360","SRC-000361"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000180","entity_type":"product_family","name":"Flash lamp annealer","company_id":"CMP-000007","manufacturer":"SCREEN Holdings","model_ids":["MDL-000162"],"equipment_ids":["EQP-A13"],"is_component":false,"process_ids":["PRS-023"],"technology_ids":["TEC-028"],"source_ids":["SRC-000362"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000181","entity_type":"product_family","name":"Direct imaging system for advanced packaging","company_id":"CMP-000007","manufacturer":"SCREEN Holdings","model_ids":["MDL-000163"],"equipment_ids":["EQP-A01.08"],"is_component":false,"process_ids":["PRS-018","PRS-045","PRS-047"],"technology_ids":["TEC-008"],"source_ids":["SRC-000363"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000182","entity_type":"product_family","name":"Ultra C SAPS","company_id":"CMP-000104","manufacturer":"ACM Research","model_ids":["MDL-000164"],"equipment_ids":["EQP-A04"],"is_component":false,"process_ids":["PRS-010"],"technology_ids":["TEC-030"],"source_ids":["SRC-000364"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000183","entity_type":"product_family","name":"Ultra C Tahoe","company_id":"CMP-000104","manufacturer":"ACM Research","model_ids":["MDL-000165"],"equipment_ids":["EQP-A04"],"is_component":false,"process_ids":["PRS-010"],"technology_ids":["TEC-030"],"source_ids":["SRC-000365"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000184","entity_type":"product_family","name":"Ultra C s","company_id":"CMP-000104","manufacturer":"ACM Research","model_ids":["MDL-000166"],"equipment_ids":["EQP-A20"],"is_component":false,"process_ids":["PRS-010"],"technology_ids":["TEC-030"],"source_ids":["SRC-000366"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000185","entity_type":"product_family","name":"Ultra SiC wafer cleaning tool","company_id":"CMP-000104","manufacturer":"ACM Research","model_ids":["MDL-000167"],"equipment_ids":["EQP-A04"],"is_component":false,"process_ids":["PRS-010"],"technology_ids":["TEC-030"],"source_ids":["SRC-000367"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000186","entity_type":"product_family","name":"Ultra Fn furnace","company_id":"CMP-000104","manufacturer":"ACM Research","model_ids":["MDL-000168"],"equipment_ids":["EQP-A11"],"is_component":false,"process_ids":["PRS-011","PRS-012"],"technology_ids":["TEC-027"],"source_ids":["SRC-000368"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000187","entity_type":"product_family","name":"Ultra ECP ap","company_id":"CMP-000104","manufacturer":"ACM Research","model_ids":["MDL-000169"],"equipment_ids":["EQP-A18"],"is_component":false,"process_ids":["PRS-025","PRS-043","PRS-045","PRS-046","PRS-047"],"technology_ids":["TEC-025"],"source_ids":["SRC-000369"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000188","entity_type":"product_family","name":"Ultra ECP ap-p","company_id":"CMP-000104","manufacturer":"ACM Research","model_ids":["MDL-000170"],"equipment_ids":["EQP-A18"],"is_component":false,"process_ids":["PRS-025","PRS-043","PRS-045","PRS-046","PRS-047"],"technology_ids":["TEC-025"],"source_ids":["SRC-000370"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000189","entity_type":"product_family","name":"Endura PVD","company_id":"CMP-000002","manufacturer":"Applied Materials","model_ids":["MDL-000171","MDL-000172"],"equipment_ids":["EQP-A09.07"],"is_component":false,"process_ids":["PRS-013","PRS-016"],"technology_ids":["TEC-020"],"source_ids":["SRC-000371","SRC-000372"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000190","entity_type":"product_family","name":"Reflexion CMP","company_id":"CMP-000002","manufacturer":"Applied Materials","model_ids":["MDL-000173","MDL-000174"],"equipment_ids":["EQP-A19"],"is_component":false,"process_ids":["PRS-024"],"technology_ids":["TEC-029"],"source_ids":["SRC-000373","SRC-000374"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000191","entity_type":"product_family","name":"VIISta ion implant","company_id":"CMP-000002","manufacturer":"Applied Materials","model_ids":["MDL-000175","MDL-000176","MDL-000177","MDL-000178"],"equipment_ids":["EQP-A10"],"is_component":false,"process_ids":["PRS-022"],"technology_ids":["TEC-026"],"source_ids":["SRC-000375","SRC-000376","SRC-000377","SRC-000378"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000192","entity_type":"product_family","name":"Purion ion implant","company_id":"CMP-000015","manufacturer":"Axcelis Technologies","model_ids":["MDL-000179","MDL-000180","MDL-000181","MDL-000182"],"equipment_ids":["EQP-A10"],"is_component":false,"process_ids":["PRS-022"],"technology_ids":["TEC-026"],"source_ids":["SRC-000379","SRC-000380","SRC-000381","SRC-000382"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000193","entity_type":"product_family","name":"SABRE","company_id":"CMP-000003","manufacturer":"Lam Research","model_ids":["MDL-000183"],"equipment_ids":["EQP-A18"],"is_component":false,"process_ids":["PRS-025","PRS-043","PRS-045","PRS-046","PRS-047"],"technology_ids":["TEC-025"],"source_ids":["SRC-000383"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000194","entity_type":"product_family","name":"GAMMA","company_id":"CMP-000003","manufacturer":"Lam Research","model_ids":["MDL-000184"],"equipment_ids":["EQP-A07"],"is_component":false,"process_ids":["PRS-010","PRS-021"],"technology_ids":[],"source_ids":["SRC-000384"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000195","entity_type":"product_family","name":"Dry strip","company_id":"CMP-000071","manufacturer":"PSK","model_ids":["MDL-000185"],"equipment_ids":["EQP-A07"],"is_component":false,"process_ids":["PRS-010","PRS-021"],"technology_ids":[],"source_ids":["SRC-000385"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000196","entity_type":"product_family","name":"CLEAN TRACK LITHIUS","company_id":"CMP-000004","manufacturer":"Tokyo Electron (TEL)","model_ids":["MDL-000186"],"equipment_ids":["EQP-A02"],"is_component":false,"process_ids":["PRS-017","PRS-019"],"technology_ids":[],"source_ids":["SRC-000386"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000197","entity_type":"product_family","name":"Coater/developer ACT series","company_id":"CMP-000004","manufacturer":"Tokyo Electron (TEL)","model_ids":["MDL-000187"],"equipment_ids":["EQP-A02"],"is_component":false,"process_ids":["PRS-017","PRS-019"],"technology_ids":[],"source_ids":["SRC-000387"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000198","entity_type":"product_family","name":"CLEAN TRACK Mark series","company_id":"CMP-000004","manufacturer":"Tokyo Electron (TEL)","model_ids":["MDL-000188"],"equipment_ids":["EQP-A02"],"is_component":false,"process_ids":["PRS-017","PRS-019"],"technology_ids":[],"source_ids":["SRC-000388"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000199","entity_type":"product_family","name":"Batch thermal processing","company_id":"CMP-000004","manufacturer":"Tokyo Electron (TEL)","model_ids":["MDL-000189"],"equipment_ids":["EQP-A11"],"is_component":false,"process_ids":["PRS-011","PRS-012"],"technology_ids":["TEC-027"],"source_ids":["SRC-000389"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000200","entity_type":"product_family","name":"CELLESTA","company_id":"CMP-000004","manufacturer":"Tokyo Electron (TEL)","model_ids":["MDL-000190","MDL-000191","MDL-000192"],"equipment_ids":["EQP-A04"],"is_component":false,"process_ids":["PRS-010"],"technology_ids":["TEC-030"],"source_ids":["SRC-000390","SRC-000391","SRC-000392"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000201","entity_type":"product_family","name":"ANTARES cleaning series","company_id":"CMP-000004","manufacturer":"Tokyo Electron (TEL)","model_ids":["MDL-000193"],"equipment_ids":["EQP-A06"],"is_component":false,"process_ids":["PRS-010"],"technology_ids":[],"source_ids":["SRC-000393"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000202","entity_type":"product_family","name":"Ulucus","company_id":"CMP-000004","manufacturer":"Tokyo Electron (TEL)","model_ids":["MDL-000194","MDL-000195"],"equipment_ids":["EQP-A15"],"is_component":false,"process_ids":[],"technology_ids":["TEC-068","TEC-072"],"source_ids":["SRC-000394","SRC-000395"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000203","entity_type":"product_family","name":"Synapse 3D integration series","company_id":"CMP-000004","manufacturer":"Tokyo Electron (TEL)","model_ids":["MDL-000196"],"equipment_ids":["EQP-C18"],"is_component":false,"process_ids":["PRS-051","PRS-052"],"technology_ids":["TEC-044"],"source_ids":["SRC-000396"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000204","entity_type":"product_family","name":"CMP system","company_id":"CMP-000023","manufacturer":"Ebara Corporation","model_ids":["MDL-000197","MDL-000198"],"equipment_ids":["EQP-A19"],"is_component":false,"process_ids":["PRS-024"],"technology_ids":["TEC-029"],"source_ids":["SRC-000397","SRC-000398"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000205","entity_type":"product_family","name":"Dry vacuum pumps","company_id":"CMP-000023","manufacturer":"Ebara Corporation","model_ids":["MDL-000199"],"equipment_ids":["EQP-A42"],"is_component":false,"process_ids":["PRS-059"],"technology_ids":[],"source_ids":["SRC-000399"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000206","entity_type":"product_family","name":"Integrated dry vacuum pump / gas abatement","company_id":"CMP-000023","manufacturer":"Ebara Corporation","model_ids":["MDL-000200"],"equipment_ids":["EQP-A45"],"is_component":false,"process_ids":["PRS-059"],"technology_ids":[],"source_ids":["SRC-000400"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000207","entity_type":"product_family","name":"Grinder/polisher","company_id":"CMP-000010","manufacturer":"DISCO Corporation","model_ids":["MDL-000201","MDL-000202"],"equipment_ids":["EQP-C04"],"is_component":false,"process_ids":["PRS-030"],"technology_ids":[],"source_ids":["SRC-000401","SRC-000402"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000208","entity_type":"product_family","name":"Grinder","company_id":"CMP-000010","manufacturer":"DISCO Corporation","model_ids":["MDL-000203","MDL-000204"],"equipment_ids":["EQP-C03"],"is_component":false,"process_ids":["PRS-030"],"technology_ids":[],"source_ids":["SRC-000403","SRC-000404"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000209","entity_type":"product_family","name":"Wafer mounter","company_id":"CMP-000010","manufacturer":"DISCO Corporation","model_ids":["MDL-000205","MDL-000206"],"equipment_ids":["EQP-C06"],"is_component":false,"process_ids":["PRS-031"],"technology_ids":[],"source_ids":["SRC-000405","SRC-000406"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000210","entity_type":"product_family","name":"Polish grinder","company_id":"CMP-000012","manufacturer":"Tokyo Seimitsu (ACCRETECH)","model_ids":["MDL-000207"],"equipment_ids":["EQP-C04"],"is_component":false,"process_ids":["PRS-030"],"technology_ids":[],"source_ids":["SRC-000407"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000211","entity_type":"product_family","name":"High rigid grinder","company_id":"CMP-000012","manufacturer":"Tokyo Seimitsu (ACCRETECH)","model_ids":["MDL-000208","MDL-000209"],"equipment_ids":["EQP-C03","EQP-C02"],"is_component":false,"process_ids":["PRS-030"],"technology_ids":[],"source_ids":["SRC-000408","SRC-000409"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000212","entity_type":"product_family","name":"Wafer edge grinding machine","company_id":"CMP-000012","manufacturer":"Tokyo Seimitsu (ACCRETECH)","model_ids":["MDL-000210","MDL-000211","MDL-000297"],"equipment_ids":["EQP-K06"],"is_component":false,"process_ids":["PRS-005"],"technology_ids":[],"source_ids":["SRC-000410","SRC-000411","SRC-000490"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000213","entity_type":"product_family","name":"Back grinding tape laminator","company_id":"CMP-000059","manufacturer":"Lintec","model_ids":["MDL-000212"],"equipment_ids":["EQP-C03"],"is_component":false,"process_ids":["PRS-030"],"technology_ids":[],"source_ids":["SRC-000412"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000214","entity_type":"product_family","name":"SoC test system","company_id":"CMP-000008","manufacturer":"Advantest","model_ids":["MDL-000213","MDL-000214","MDL-000215"],"equipment_ids":["EQP-C40"],"is_component":false,"process_ids":["PRS-041"],"technology_ids":["TEC-056"],"source_ids":["SRC-000413","SRC-000414","SRC-000415"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000215","entity_type":"product_family","name":"SoC tester","company_id":"CMP-000009","manufacturer":"Teradyne","model_ids":["MDL-000216","MDL-000217"],"equipment_ids":["EQP-C40"],"is_component":false,"process_ids":["PRS-041"],"technology_ids":["TEC-056"],"source_ids":["SRC-000416","SRC-000417"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000216","entity_type":"product_family","name":"J750 tester","company_id":"CMP-000009","manufacturer":"Teradyne","model_ids":["MDL-000218"],"equipment_ids":["EQP-C40"],"is_component":false,"process_ids":["PRS-041"],"technology_ids":["TEC-056"],"source_ids":["SRC-000418"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000217","entity_type":"product_family","name":"SoC test system","company_id":"CMP-000037","manufacturer":"Chroma ATE","model_ids":["MDL-000219"],"equipment_ids":["EQP-C40"],"is_component":false,"process_ids":["PRS-041"],"technology_ids":["TEC-056"],"source_ids":["SRC-000419"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000218","entity_type":"product_family","name":"Surfscan unpatterned wafer inspection","company_id":"CMP-000005","manufacturer":"KLA Corporation","model_ids":["MDL-000220","MDL-000221"],"equipment_ids":["EQP-A21"],"is_component":false,"process_ids":["PRS-027"],"technology_ids":["TEC-031"],"source_ids":["SRC-000420","SRC-000421"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000219","entity_type":"product_family","name":"Patterned wafer geometry","company_id":"CMP-000005","manufacturer":"KLA Corporation","model_ids":["MDL-000222"],"equipment_ids":["EQP-A30"],"is_component":false,"process_ids":["PRS-008","PRS-026"],"technology_ids":["TEC-035"],"source_ids":["SRC-000422"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000220","entity_type":"product_family","name":"Voyager patterned wafer inspection","company_id":"CMP-000005","manufacturer":"KLA Corporation","model_ids":["MDL-000223"],"equipment_ids":["EQP-A22"],"is_component":false,"process_ids":["PRS-027"],"technology_ids":["TEC-031"],"source_ids":["SRC-000423"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000221","entity_type":"product_family","name":"ICOS packaged IC inspection","company_id":"CMP-000005","manufacturer":"KLA Corporation","model_ids":["MDL-000224","MDL-000225","MDL-000226","MDL-000227"],"equipment_ids":["EQP-C34"],"is_component":false,"process_ids":["PRS-040"],"technology_ids":[],"source_ids":["SRC-000424","SRC-000425","SRC-000426","SRC-000427"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000222","entity_type":"product_family","name":"Kronos wafer inspection","company_id":"CMP-000005","manufacturer":"KLA Corporation","model_ids":["MDL-000228"],"equipment_ids":["EQP-A21"],"is_component":false,"process_ids":["PRS-027"],"technology_ids":["TEC-031"],"source_ids":["SRC-000427"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000223","entity_type":"product_family","name":"SPTS advanced packaging etch","company_id":"CMP-000005","manufacturer":"KLA Corporation","model_ids":["MDL-000229"],"equipment_ids":["EQP-A08.05"],"is_component":false,"process_ids":["PRS-020","PRS-043"],"technology_ids":["TEC-012"],"source_ids":["SRC-000428"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000224","entity_type":"product_family","name":"Dark field wafer defect inspection","company_id":"CMP-000021","manufacturer":"Hitachi High-Tech","model_ids":["MDL-000230","MDL-000231"],"equipment_ids":["EQP-A22"],"is_component":false,"process_ids":["PRS-027"],"technology_ids":["TEC-031"],"source_ids":["SRC-000429","SRC-000430"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000225","entity_type":"product_family","name":"CD-SEM","company_id":"CMP-000021","manufacturer":"Hitachi High-Tech","model_ids":["MDL-000232","MDL-000233","MDL-000234"],"equipment_ids":["EQP-A26"],"is_component":false,"process_ids":["PRS-026"],"technology_ids":["TEC-034"],"source_ids":["SRC-000431","SRC-000432","SRC-000433"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000226","entity_type":"product_family","name":"Defect review SEM","company_id":"CMP-000021","manufacturer":"Hitachi High-Tech","model_ids":["MDL-000235"],"equipment_ids":["EQP-A24"],"is_component":false,"process_ids":["PRS-027"],"technology_ids":["TEC-032"],"source_ids":["SRC-000434"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000227","entity_type":"product_family","name":"Dragonfly inspection","company_id":"CMP-000016","manufacturer":"Onto Innovation","model_ids":["MDL-000236"],"equipment_ids":["EQP-A21"],"is_component":false,"process_ids":["PRS-027"],"technology_ids":["TEC-031"],"source_ids":["SRC-000435"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000228","entity_type":"product_family","name":"Firefly panel inspection","company_id":"CMP-000016","manufacturer":"Onto Innovation","model_ids":["MDL-000237"],"equipment_ids":["EQP-C36"],"is_component":false,"process_ids":["PRS-040"],"technology_ids":["TEC-031"],"source_ids":["SRC-000436"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000229","entity_type":"product_family","name":"JetStep lithography","company_id":"CMP-000016","manufacturer":"Onto Innovation","model_ids":["MDL-000238","MDL-000239"],"equipment_ids":["EQP-A01"],"is_component":false,"process_ids":["PRS-018"],"technology_ids":[],"source_ids":["SRC-000437","SRC-000438"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000230","entity_type":"product_family","name":"Eagle inspection","company_id":"CMP-000018","manufacturer":"Camtek","model_ids":["MDL-000240","MDL-000241","MDL-000242"],"equipment_ids":["EQP-A21"],"is_component":false,"process_ids":["PRS-027"],"technology_ids":["TEC-031"],"source_ids":["SRC-000439","SRC-000440","SRC-000441"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000231","entity_type":"product_family","name":"Golden Eagle","company_id":"CMP-000018","manufacturer":"Camtek","model_ids":["MDL-000243"],"equipment_ids":["EQP-A30"],"is_component":false,"process_ids":["PRS-008","PRS-026"],"technology_ids":["TEC-035"],"source_ids":["SRC-000442"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000232","entity_type":"product_family","name":"Hawk","company_id":"CMP-000018","manufacturer":"Camtek","model_ids":["MDL-000244"],"equipment_ids":["EQP-A21"],"is_component":false,"process_ids":["PRS-027"],"technology_ids":["TEC-031"],"source_ids":["SRC-000443"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000233","entity_type":"product_family","name":"Vision inspection handler","company_id":"CMP-000041","manufacturer":"ViTrox","model_ids":["MDL-000245","MDL-000246"],"equipment_ids":["EQP-C34"],"is_component":false,"process_ids":["PRS-040"],"technology_ids":[],"source_ids":["SRC-000444","SRC-000445"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000234","entity_type":"product_family","name":"Quadra X-ray inspection","company_id":"CMP-000206","manufacturer":"Nordson Corporation","model_ids":["MDL-000247","MDL-000248"],"equipment_ids":["EQP-C35"],"is_component":false,"process_ids":["PRS-040"],"technology_ids":["TEC-033"],"source_ids":["SRC-000446","SRC-000447"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000235","entity_type":"product_family","name":"ACTIS","company_id":"CMP-000024","manufacturer":"Lasertec","model_ids":["MDL-000249","MDL-000250"],"equipment_ids":["EQP-B02"],"is_component":false,"process_ids":["PRS-028"],"technology_ids":[],"source_ids":["SRC-000448","SRC-000322"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000236","entity_type":"product_family","name":"MATRICS","company_id":"CMP-000024","manufacturer":"Lasertec","model_ids":["MDL-000251","MDL-000252","MDL-000253"],"equipment_ids":["EQP-B03"],"is_component":false,"process_ids":["PRS-028"],"technology_ids":[],"source_ids":["SRC-000449","SRC-000450","SRC-000451"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000237","entity_type":"product_family","name":"SLX semiconductor mask writer","company_id":"CMP-000026","manufacturer":"Mycronic","model_ids":["MDL-000254"],"equipment_ids":["EQP-B08"],"is_component":false,"process_ids":["PRS-028"],"technology_ids":["TEC-008"],"source_ids":["SRC-000452"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000238","entity_type":"product_family","name":"MMX mask metrology","company_id":"CMP-000026","manufacturer":"Mycronic","model_ids":["MDL-000255"],"equipment_ids":["EQP-B09"],"is_component":false,"process_ids":["PRS-028"],"technology_ids":[],"source_ids":["SRC-000453"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000239","entity_type":"product_family","name":"Memory test handler","company_id":"CMP-000038","manufacturer":"Techwing","model_ids":["MDL-000256"],"equipment_ids":["EQP-C39"],"is_component":false,"process_ids":["PRS-041"],"technology_ids":["TEC-056"],"source_ids":["SRC-000454"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000240","entity_type":"product_family","name":"Logic test handler","company_id":"CMP-000038","manufacturer":"Techwing","model_ids":["MDL-000257"],"equipment_ids":["EQP-C39"],"is_component":false,"process_ids":["PRS-041"],"technology_ids":["TEC-056"],"source_ids":["SRC-000455"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000241","entity_type":"product_family","name":"SLT handler","company_id":"CMP-000038","manufacturer":"Techwing","model_ids":["MDL-000258"],"equipment_ids":["EQP-C39"],"is_component":false,"process_ids":["PRS-041"],"technology_ids":["TEC-056"],"source_ids":["SRC-000456"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000242","entity_type":"product_family","name":"Tri-temp handler","company_id":"CMP-000038","manufacturer":"Techwing","model_ids":["MDL-000259"],"equipment_ids":["EQP-C39"],"is_component":false,"process_ids":["PRS-041"],"technology_ids":["TEC-056"],"source_ids":["SRC-000457"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000243","entity_type":"product_family","name":"Pick-and-place test handler","company_id":"CMP-000036","manufacturer":"Cohu","model_ids":["MDL-000260","MDL-000261","MDL-000262"],"equipment_ids":["EQP-C39"],"is_component":false,"process_ids":["PRS-041"],"technology_ids":["TEC-056"],"source_ids":["SRC-000458","SRC-000459","SRC-000460"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000244","entity_type":"product_family","name":"Strip test handler","company_id":"CMP-000036","manufacturer":"Cohu","model_ids":["MDL-000263"],"equipment_ids":["EQP-C39"],"is_component":false,"process_ids":["PRS-041"],"technology_ids":["TEC-056"],"source_ids":["SRC-000461"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000245","entity_type":"product_family","name":"i-line stepper for advanced packaging","company_id":"CMP-000013","manufacturer":"Canon Inc.","model_ids":["MDL-000264"],"equipment_ids":["EQP-A01.05"],"is_component":false,"process_ids":["PRS-018","PRS-045","PRS-046","PRS-047"],"technology_ids":["TEC-005"],"source_ids":["SRC-000462"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000246","entity_type":"product_family","name":"Gas delivery systems","company_id":"CMP-000173","manufacturer":"Ichor Systems","model_ids":["MDL-000265"],"equipment_ids":["EQP-A43"],"is_component":false,"process_ids":["PRS-060"],"technology_ids":[],"source_ids":["SRC-000336"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000247","entity_type":"product_family","name":"Liquid delivery systems","company_id":"CMP-000173","manufacturer":"Ichor Systems","model_ids":["MDL-000266"],"equipment_ids":["EQP-A44"],"is_component":false,"process_ids":["PRS-060"],"technology_ids":[],"source_ids":["SRC-000463"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000248","entity_type":"product_family","name":"Chemical and gas delivery","company_id":"CMP-000172","manufacturer":"Ultra Clean Holdings (UCT)","model_ids":["MDL-000267"],"equipment_ids":["EQP-A43"],"is_component":false,"process_ids":["PRS-060"],"technology_ids":[],"source_ids":["SRC-000335"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000249","entity_type":"product_family","name":"Vacuum transport system","company_id":"CMP-000064","manufacturer":"Brooks Automation","model_ids":["MDL-000268"],"equipment_ids":["EQP-A39"],"is_component":false,"process_ids":["PRS-058"],"technology_ids":[],"source_ids":["SRC-000464"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000250","entity_type":"product_family","name":"FOUP opener / load port","company_id":"CMP-000062","manufacturer":"Hirata Corporation","model_ids":["MDL-000269"],"equipment_ids":["EQP-A40"],"is_component":false,"process_ids":["PRS-058"],"technology_ids":[],"source_ids":["SRC-000465"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000251","entity_type":"product_family","name":"Cleanroom AMHS","company_id":"CMP-000065","manufacturer":"Daifuku","model_ids":["MDL-000270"],"equipment_ids":["EQP-J01"],"is_component":false,"process_ids":["PRS-057"],"technology_ids":[],"source_ids":["SRC-000298"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000252","entity_type":"product_family","name":"Overhead hoist transport (OHT)","company_id":"CMP-000066","manufacturer":"Murata Machinery (Muratec)","model_ids":["MDL-000271"],"equipment_ids":["EQP-J02"],"is_component":false,"process_ids":["PRS-057"],"technology_ids":[],"source_ids":["SRC-000300"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000253","entity_type":"product_family","name":"Cleanroom storage systems","company_id":"CMP-000066","manufacturer":"Murata Machinery (Muratec)","model_ids":["MDL-000272"],"equipment_ids":["EQP-J07"],"is_component":false,"process_ids":["PRS-057"],"technology_ids":[],"source_ids":["SRC-000466"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000254","entity_type":"product_family","name":"Czochralski crystal growing system","company_id":"CMP-000202","manufacturer":"PVA TePla","model_ids":["MDL-000273"],"equipment_ids":["EQP-K01"],"is_component":false,"process_ids":["PRS-001"],"technology_ids":[],"source_ids":["SRC-000467"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000255","entity_type":"product_family","name":"PVT crystal growth","company_id":"CMP-000202","manufacturer":"PVA TePla","model_ids":["MDL-000274"],"equipment_ids":["EQP-K01"],"is_component":false,"process_ids":["PRS-001"],"technology_ids":[],"source_ids":["SRC-000468"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000256","entity_type":"product_family","name":"Float zone crystal growth","company_id":"CMP-000202","manufacturer":"PVA TePla","model_ids":["MDL-000275"],"equipment_ids":["EQP-K01"],"is_component":false,"process_ids":["PRS-001"],"technology_ids":[],"source_ids":["SRC-000469"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000257","entity_type":"product_family","name":"Final polisher","company_id":"CMP-000203","manufacturer":"Okamoto Machine Tool Works","model_ids":["MDL-000276","MDL-000277"],"equipment_ids":["EQP-K07"],"is_component":false,"process_ids":["PRS-006"],"technology_ids":[],"source_ids":["SRC-000470","SRC-000471"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000258","entity_type":"product_family","name":"Polishing machine","company_id":"CMP-000203","manufacturer":"Okamoto Machine Tool Works","model_ids":["MDL-000278"],"equipment_ids":["EQP-K07"],"is_component":false,"process_ids":["PRS-006"],"technology_ids":[],"source_ids":["SRC-000472"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000259","entity_type":"product_family","name":"CMP system","company_id":"CMP-000203","manufacturer":"Okamoto Machine Tool Works","model_ids":["MDL-000279"],"equipment_ids":["EQP-A19"],"is_component":false,"process_ids":["PRS-024"],"technology_ids":["TEC-029"],"source_ids":["SRC-000473"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000260","entity_type":"product_family","name":"Backgrinder","company_id":"CMP-000203","manufacturer":"Okamoto Machine Tool Works","model_ids":["MDL-000280"],"equipment_ids":["EQP-C03"],"is_component":false,"process_ids":["PRS-030"],"technology_ids":[],"source_ids":["SRC-000474"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000261","entity_type":"product_family","name":"Ultrapure water production systems","company_id":"CMP-000204","manufacturer":"Organo Corporation","model_ids":["MDL-000281"],"equipment_ids":["EQP-L08"],"is_component":false,"process_ids":["PRS-061"],"technology_ids":[],"source_ids":["SRC-000475"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000262","entity_type":"product_family","name":"Ultrapure water production system","company_id":"CMP-000205","manufacturer":"Kurita Water Industries","model_ids":["MDL-000282"],"equipment_ids":["EQP-L08"],"is_component":false,"process_ids":["PRS-061"],"technology_ids":[],"source_ids":["SRC-000476"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000263","entity_type":"product_family","name":"SiC epitaxy","company_id":"CMP-000006","manufacturer":"ASM International (ASMI)","model_ids":["MDL-000283","MDL-000284"],"equipment_ids":["EQP-A09.10"],"is_component":false,"process_ids":["PRS-009","PRS-013"],"technology_ids":["TEC-022"],"source_ids":["SRC-000478","SRC-000479"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000264","entity_type":"product_family","name":"Intrepid epitaxy","company_id":"CMP-000006","manufacturer":"ASM International (ASMI)","model_ids":["MDL-000285"],"equipment_ids":["EQP-A09.10"],"is_component":false,"process_ids":["PRS-009","PRS-013"],"technology_ids":["TEC-022"],"source_ids":["SRC-000480"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000265","entity_type":"product_family","name":"Centura Epi","company_id":"CMP-000002","manufacturer":"Applied Materials","model_ids":["MDL-000286","MDL-000287","MDL-000288"],"equipment_ids":["EQP-A09.10"],"is_component":false,"process_ids":["PRS-009","PRS-013"],"technology_ids":["TEC-022"],"source_ids":["SRC-000481","SRC-000482","SRC-000483"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000266","entity_type":"product_family","name":"Propel GaN MOCVD","company_id":"CMP-000014","manufacturer":"Veeco Instruments","model_ids":["MDL-000289","MDL-000290"],"equipment_ids":["EQP-G01"],"is_component":false,"process_ids":["PRS-009"],"technology_ids":["TEC-023"],"source_ids":["SRC-000484","SRC-000485"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000267","entity_type":"product_family","name":"G10 MOCVD","company_id":"CMP-000028","manufacturer":"AIXTRON","model_ids":["MDL-000291","MDL-000292","MDL-000293"],"equipment_ids":["EQP-G01","EQP-G02","EQP-G03"],"is_component":false,"process_ids":["PRS-009"],"technology_ids":["TEC-023"],"source_ids":["SRC-000344","SRC-000486","SRC-000487"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000268","entity_type":"product_family","name":"Double side polisher/lapper","company_id":"CMP-000207","manufacturer":"SpeedFam","model_ids":["MDL-000294"],"equipment_ids":["EQP-K05"],"is_component":false,"process_ids":["PRS-004"],"technology_ids":[],"source_ids":["SRC-000477"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000269","entity_type":"product_family","name":"Back-side cleaning system","company_id":"CMP-000007","manufacturer":"SCREEN Holdings","model_ids":["MDL-000296"],"equipment_ids":["EQP-A20"],"is_component":false,"process_ids":["PRS-010"],"technology_ids":["TEC-030"],"source_ids":["SRC-000489"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000270","entity_type":"product_family","name":"Edge polisher","company_id":"CMP-000207","manufacturer":"SpeedFam","model_ids":["MDL-000298"],"equipment_ids":["EQP-K06"],"is_component":false,"process_ids":["PRS-005"],"technology_ids":[],"source_ids":["SRC-000491"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000271","entity_type":"product_family","name":"Multicolumn E-Beam Lithography (MEBL)","company_id":"CMP-000209","manufacturer":"Multibeam Corporation","model_ids":["MDL-000299"],"equipment_ids":["EQP-A01.06"],"is_component":false,"process_ids":["PRS-018"],"technology_ids":["TEC-006"],"source_ids":["SRC-000585"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000272","entity_type":"product_family","name":"VOYAGER","company_id":"CMP-000210","manufacturer":"Raith","model_ids":["MDL-000300"],"equipment_ids":["EQP-A01.06"],"is_component":false,"process_ids":["PRS-018"],"technology_ids":["TEC-006"],"source_ids":["SRC-000586"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000273","entity_type":"product_family","name":"EBPG","company_id":"CMP-000210","manufacturer":"Raith","model_ids":["MDL-000301"],"equipment_ids":["EQP-A01.06"],"is_component":false,"process_ids":["PRS-018"],"technology_ids":["TEC-006"],"source_ids":["SRC-000587"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000274","entity_type":"product_family","name":"Maskless Aligner (MLA)","company_id":"CMP-000211","manufacturer":"Heidelberg Instruments","model_ids":["MDL-000302","MDL-000303","MDL-000304"],"equipment_ids":["EQP-A01.08"],"is_component":false,"process_ids":["PRS-018","PRS-045","PRS-047"],"technology_ids":["TEC-008"],"source_ids":["SRC-000588","SRC-000589","SRC-000590"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000275","entity_type":"product_family","name":"SINDRE","company_id":"CMP-000212","manufacturer":"Obducat","model_ids":["MDL-000305","MDL-000306"],"equipment_ids":["EQP-A01.07"],"is_component":false,"process_ids":["PRS-018"],"technology_ids":["TEC-007"],"source_ids":["SRC-000591","SRC-000592"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000276","entity_type":"product_family","name":"TEPHRA","company_id":"CMP-000213","manufacturer":"Forge Nano","model_ids":["MDL-000307"],"equipment_ids":["EQP-A09.06"],"is_component":false,"process_ids":["PRS-013","PRS-015"],"technology_ids":["TEC-019"],"source_ids":["SRC-000593"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000277","entity_type":"product_family","name":"ALD ONE","company_id":"CMP-000214","manufacturer":"Angstrom Engineering","model_ids":["MDL-000308"],"equipment_ids":["EQP-A09.06"],"is_component":false,"process_ids":["PRS-013","PRS-015"],"technology_ids":["TEC-019"],"source_ids":["SRC-000594"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000278","entity_type":"product_family","name":"Amod","company_id":"CMP-000214","manufacturer":"Angstrom Engineering","model_ids":["MDL-000309"],"equipment_ids":["EQP-A09.07"],"is_component":false,"process_ids":["PRS-013","PRS-016"],"technology_ids":["TEC-020"],"source_ids":["SRC-000595"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000279","entity_type":"product_family","name":"Nebula","company_id":"CMP-000214","manufacturer":"Angstrom Engineering","model_ids":["MDL-000310"],"equipment_ids":["EQP-A09"],"is_component":false,"process_ids":["PRS-013"],"technology_ids":[],"source_ids":["SRC-000596"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000280","entity_type":"product_family","name":"PVT systems","company_id":"CMP-000215","manufacturer":"CVD Equipment Corporation","model_ids":["MDL-000311"],"equipment_ids":["EQP-K01"],"is_component":false,"process_ids":["PRS-001"],"technology_ids":[],"source_ids":["SRC-000597"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000281","entity_type":"product_family","name":"NEO","company_id":"CMP-000216","manufacturer":"Trymax Semiconductor Equipment","model_ids":["MDL-000312","MDL-000313"],"equipment_ids":["EQP-A07"],"is_component":false,"process_ids":["PRS-010","PRS-021"],"technology_ids":[],"source_ids":["SRC-000598","SRC-000599"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000282","entity_type":"product_family","name":"Horizontal furnaces","company_id":"CMP-000217","manufacturer":"SVCS Process Innovation","model_ids":["MDL-000314","MDL-000316"],"equipment_ids":["EQP-A11","EQP-A09.03"],"is_component":false,"process_ids":["PRS-011","PRS-012","PRS-013","PRS-014"],"technology_ids":["TEC-027","TEC-017"],"source_ids":["SRC-000600","SRC-000602"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000283","entity_type":"product_family","name":"Vertical furnaces","company_id":"CMP-000217","manufacturer":"SVCS Process Innovation","model_ids":["MDL-000315"],"equipment_ids":["EQP-A11"],"is_component":false,"process_ids":["PRS-011","PRS-012"],"technology_ids":["TEC-027"],"source_ids":["SRC-000601"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000284","entity_type":"product_family","name":"RTP / RTCVD","company_id":"CMP-000218","manufacturer":"Annealsys","model_ids":["MDL-000317","MDL-000318"],"equipment_ids":["EQP-A12"],"is_component":false,"process_ids":["PRS-023"],"technology_ids":["TEC-028"],"source_ids":["SRC-000603","SRC-000604"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000285","entity_type":"product_family","name":"DLI-CVD / DLI-ALD","company_id":"CMP-000218","manufacturer":"Annealsys","model_ids":["MDL-000319"],"equipment_ids":["EQP-A09.01"],"is_component":false,"process_ids":["PRS-013","PRS-014"],"technology_ids":["TEC-015"],"source_ids":["SRC-000605"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000286","entity_type":"product_family","name":"RIE","company_id":"CMP-000219","manufacturer":"Samco Inc.","model_ids":["MDL-000320"],"equipment_ids":["EQP-A08.03"],"is_component":false,"process_ids":["PRS-020"],"technology_ids":["TEC-010"],"source_ids":["SRC-000606"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000287","entity_type":"product_family","name":"ICP-RIE","company_id":"CMP-000219","manufacturer":"Samco Inc.","model_ids":["MDL-000321","MDL-000322","MDL-000323","MDL-000324"],"equipment_ids":["EQP-A08.04"],"is_component":false,"process_ids":["PRS-020"],"technology_ids":["TEC-011"],"source_ids":["SRC-000607","SRC-000608","SRC-000609","SRC-000610"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000288","entity_type":"product_family","name":"Plasma etching cluster tool","company_id":"CMP-000219","manufacturer":"Samco Inc.","model_ids":["MDL-000325"],"equipment_ids":["EQP-G03"],"is_component":false,"process_ids":["PRS-009"],"technology_ids":["TEC-023"],"source_ids":["SRC-000611"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000289","entity_type":"product_family","name":"Plasma etch & deposition","company_id":"CMP-000220","manufacturer":"SENTECH Instruments","model_ids":["MDL-000326","MDL-000327"],"equipment_ids":["EQP-A09.02","EQP-A08.02"],"is_component":false,"process_ids":["PRS-013","PRS-014","PRS-020"],"technology_ids":["TEC-016","TEC-009"],"source_ids":["SRC-000612","SRC-000509"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000290","entity_type":"product_family","name":"VertaCure","company_id":"CMP-000221","manufacturer":"Yield Engineering Systems (YES)","model_ids":["MDL-000328","MDL-000329"],"equipment_ids":["EQP-D20"],"is_component":false,"process_ids":["PRS-046"],"technology_ids":["TEC-046"],"source_ids":["SRC-000613","SRC-000614"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000291","entity_type":"product_family","name":"3880 die bonder","company_id":"CMP-000222","manufacturer":"Palomar Technologies","model_ids":["MDL-000330"],"equipment_ids":["EQP-C10"],"is_component":false,"process_ids":["PRS-033"],"technology_ids":["TEC-039"],"source_ids":["SRC-000615"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000292","entity_type":"product_family","name":"FINEPLACER","company_id":"CMP-000223","manufacturer":"Finetech","model_ids":["MDL-000331","MDL-000332","MDL-000333"],"equipment_ids":["EQP-C11","EQP-C10"],"is_component":false,"process_ids":["PRS-035","PRS-050","PRS-033"],"technology_ids":["TEC-041","TEC-039"],"source_ids":["SRC-000616","SRC-000617","SRC-000618"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000293","entity_type":"product_family","name":"Device bonders","company_id":"CMP-000224","manufacturer":"SET (Smart Equipment Technology)","model_ids":["MDL-000334","MDL-000335"],"equipment_ids":["EQP-C11"],"is_component":false,"process_ids":["PRS-035","PRS-050"],"technology_ids":["TEC-041"],"source_ids":["SRC-000619","SRC-000620"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000294","entity_type":"product_family","name":"Direct bonding","company_id":"CMP-000224","manufacturer":"SET (Smart Equipment Technology)","model_ids":["MDL-000336"],"equipment_ids":["EQP-C17"],"is_component":false,"process_ids":["PRS-049","PRS-050","PRS-051"],"technology_ids":["TEC-043"],"source_ids":["SRC-000621"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000295","entity_type":"product_family","name":"Laser micromachining systems","company_id":"CMP-000225","manufacturer":"Oxford Lasers","model_ids":["MDL-000337"],"equipment_ids":["EQP-A15"],"is_component":false,"process_ids":[],"technology_ids":["TEC-072"],"source_ids":["SRC-000622"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000296","entity_type":"product_family","name":"Femtosecond micromachining workstations","company_id":"CMP-000226","manufacturer":"Workshop of Photonics (WOP)","model_ids":["MDL-000338","MDL-000339","MDL-000340","MDL-000341"],"equipment_ids":["EQP-A15","EQP-C29"],"is_component":false,"process_ids":["PRS-039"],"technology_ids":["TEC-072","TEC-078","TEC-065"],"source_ids":["SRC-000623","SRC-000624","SRC-000625","SRC-000626"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000297","entity_type":"product_family","name":"IPEX excimer lasers","company_id":"CMP-000228","manufacturer":"LightMachinery","model_ids":["MDL-000342","MDL-000343"],"equipment_ids":[],"is_component":false,"process_ids":["PRS-057"],"technology_ids":["TEC-082"],"source_ids":["SRC-000627","SRC-000628"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000298","entity_type":"product_family","name":"TFC bonders","company_id":"CMP-000229","manufacturer":"Shibaura Mechatronics","model_ids":["MDL-000344","MDL-000345","MDL-000346","MDL-000347"],"equipment_ids":["EQP-D06","EQP-C17","EQP-D19","EQP-C11"],"is_component":false,"process_ids":["PRS-047","PRS-049","PRS-050","PRS-051","PRS-053","PRS-035"],"technology_ids":["TEC-047","TEC-043","TEC-048","TEC-041"],"source_ids":["SRC-000629","SRC-000630","SRC-000631","SRC-000632"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000299","entity_type":"product_family","name":"Wafer mounters / laminators","company_id":"CMP-000230","manufacturer":"Takatori Corporation","model_ids":["MDL-000348","MDL-000349","MDL-000350"],"equipment_ids":["EQP-C06"],"is_component":false,"process_ids":["PRS-031"],"technology_ids":[],"source_ids":["SRC-000633","SRC-000634","SRC-000635"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000300","entity_type":"product_family","name":"Wafer removal","company_id":"CMP-000230","manufacturer":"Takatori Corporation","model_ids":["MDL-000351"],"equipment_ids":["EQP-C07"],"is_component":false,"process_ids":["PRS-031"],"technology_ids":[],"source_ids":["SRC-000636"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000301","entity_type":"product_family","name":"UX projection lithography","company_id":"CMP-000231","manufacturer":"Ushio Inc.","model_ids":["MDL-000352","MDL-000353","MDL-000354","MDL-000355"],"equipment_ids":["EQP-A01.05","EQP-D16","EQP-D15"],"is_component":false,"process_ids":["PRS-018","PRS-045","PRS-046","PRS-047","PRS-048"],"technology_ids":["TEC-005","TEC-049","TEC-055"],"source_ids":["SRC-000522","SRC-000637","SRC-000638","SRC-000639"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000302","entity_type":"product_family","name":"DIALOGIC","company_id":"CMP-000232","manufacturer":"Mitsuboshi Diamond Industrial","model_ids":["MDL-000356","MDL-000357"],"equipment_ids":["EQP-C32"],"is_component":false,"process_ids":["PRS-039"],"technology_ids":[],"source_ids":["SRC-000523","SRC-000640"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000303","entity_type":"product_family","name":"Flip chip bonders","company_id":"CMP-000233","manufacturer":"Toray Engineering","model_ids":["MDL-000358","MDL-000359","MDL-000360"],"equipment_ids":["EQP-C11","EQP-D19"],"is_component":false,"process_ids":["PRS-035","PRS-050","PRS-053"],"technology_ids":["TEC-041","TEC-048"],"source_ids":["SRC-000641","SRC-000642","SRC-000643"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000304","entity_type":"product_family","name":"Inspection","company_id":"CMP-000233","manufacturer":"Toray Engineering","model_ids":["MDL-000361"],"equipment_ids":["EQP-C36"],"is_component":false,"process_ids":["PRS-040"],"technology_ids":["TEC-031"],"source_ids":["SRC-000644"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000305","entity_type":"product_family","name":"JBX e-beam lithography","company_id":"CMP-000234","manufacturer":"JEOL","model_ids":["MDL-000362","MDL-000363","MDL-000364","MDL-000365"],"equipment_ids":["EQP-A01.06","EQP-B07"],"is_component":false,"process_ids":["PRS-018","PRS-028"],"technology_ids":["TEC-006"],"source_ids":["SRC-000645","SRC-000646","SRC-000647","SRC-000648"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000306","entity_type":"product_family","name":"SiC single-wafer processing","company_id":"CMP-000235","manufacturer":"Revasum","model_ids":["MDL-000366","MDL-000367"],"equipment_ids":["EQP-A19","EQP-C02"],"is_component":false,"process_ids":["PRS-024","PRS-030"],"technology_ids":["TEC-029"],"source_ids":["SRC-000649"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000307","entity_type":"product_family","name":"BTU advanced-packaging reflow","company_id":"CMP-000236","manufacturer":"Amtech Systems","model_ids":["MDL-000368"],"equipment_ids":["EQP-E03"],"is_component":false,"process_ids":[],"technology_ids":[],"source_ids":["SRC-000650"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000308","entity_type":"product_family","name":"Ultrasonic wafer coating","company_id":"CMP-000237","manufacturer":"Sono-Tek","model_ids":["MDL-000369"],"equipment_ids":["EQP-A02"],"is_component":false,"process_ids":["PRS-017","PRS-019"],"technology_ids":[],"source_ids":["SRC-000651"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000309","entity_type":"product_family","name":"TYTAN furnaces","company_id":"CMP-000238","manufacturer":"Tystar","model_ids":["MDL-000370","MDL-000371"],"equipment_ids":["EQP-A11"],"is_component":false,"process_ids":["PRS-011","PRS-012"],"technology_ids":["TEC-027"],"source_ids":["SRC-000652","SRC-000653"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000310","entity_type":"product_family","name":"CZ growing equipment","company_id":"CMP-000239","manufacturer":"Linton Crystal Technologies","model_ids":["MDL-000372"],"equipment_ids":["EQP-K01"],"is_component":false,"process_ids":["PRS-001"],"technology_ids":[],"source_ids":["SRC-000654"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000311","entity_type":"product_family","name":"Crystal processing equipment","company_id":"CMP-000239","manufacturer":"Linton Crystal Technologies","model_ids":["MDL-000373"],"equipment_ids":["EQP-K02"],"is_component":false,"process_ids":["PRS-002"],"technology_ids":[],"source_ids":["SRC-000655"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000312","entity_type":"product_family","name":"Wet benches","company_id":"CMP-000240","manufacturer":"Modutek","model_ids":["MDL-000374","MDL-000375","MDL-000376"],"equipment_ids":["EQP-A05"],"is_component":false,"process_ids":["PRS-010","PRS-021"],"technology_ids":["TEC-030"],"source_ids":["SRC-000656","SRC-000657","SRC-000658"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000313","entity_type":"product_family","name":"CLUSTERLINE","company_id":"CMP-000241","manufacturer":"Evatec","model_ids":["MDL-000377","MDL-000378","MDL-000379"],"equipment_ids":["EQP-A09.07","EQP-A09.06"],"is_component":false,"process_ids":["PRS-013","PRS-016","PRS-015"],"technology_ids":["TEC-020","TEC-019"],"source_ids":["SRC-000659","SRC-000660","SRC-000661"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000314","entity_type":"product_family","name":"BATCHSPRAY","company_id":"CMP-000242","manufacturer":"Siconnex","model_ids":["MDL-000380","MDL-000381","MDL-000382","MDL-000383"],"equipment_ids":["EQP-A05"],"is_component":false,"process_ids":["PRS-010","PRS-021"],"technology_ids":["TEC-030"],"source_ids":["SRC-000662","SRC-000663","SRC-000664","SRC-000665"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000315","entity_type":"product_family","name":"Plasma immersion implanters","company_id":"CMP-000243","manufacturer":"Ion Beam Services (IBS)","model_ids":["MDL-000384"],"equipment_ids":["EQP-A10"],"is_component":false,"process_ids":["PRS-022"],"technology_ids":["TEC-026"],"source_ids":["SRC-000535"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000316","entity_type":"product_family","name":"Ion beam trimming","company_id":"CMP-000244","manufacturer":"scia Systems","model_ids":["MDL-000385"],"equipment_ids":["EQP-A08.01"],"is_component":false,"process_ids":["PRS-020"],"technology_ids":["TEC-009"],"source_ids":["SRC-000666"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000317","entity_type":"product_family","name":"Vertical furnaces","company_id":"CMP-000245","manufacturer":"centrotherm international","model_ids":["MDL-000386"],"equipment_ids":["EQP-A11"],"is_component":false,"process_ids":["PRS-011","PRS-012"],"technology_ids":["TEC-027"],"source_ids":["SRC-000667"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000318","entity_type":"product_family","name":"Sintering systems","company_id":"CMP-000246","manufacturer":"PINK GmbH Thermosysteme","model_ids":["MDL-000387"],"equipment_ids":["EQP-F08"],"is_component":false,"process_ids":[],"technology_ids":[],"source_ids":["SRC-000668"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000319","entity_type":"product_family","name":"Quantum X","company_id":"CMP-000251","manufacturer":"Nanoscribe","model_ids":["MDL-000388","MDL-000389"],"equipment_ids":["EQP-A01.08"],"is_component":false,"process_ids":["PRS-018","PRS-045","PRS-047"],"technology_ids":["TEC-008"],"source_ids":["SRC-000669","SRC-000670"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000320","entity_type":"product_family","name":"Electro-optical wafer-level test","company_id":"CMP-000253","manufacturer":"ficonTEC","model_ids":["MDL-000390","MDL-000391"],"equipment_ids":["EQP-A32"],"is_component":false,"process_ids":["PRS-029"],"technology_ids":["TEC-056"],"source_ids":["SRC-000671","SRC-000672"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000321","entity_type":"product_family","name":"Panel processing","company_id":"CMP-000254","manufacturer":"Semsysco","model_ids":["MDL-000392"],"equipment_ids":["EQP-D19"],"is_component":false,"process_ids":["PRS-053"],"technology_ids":["TEC-048"],"source_ids":["SRC-000673"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000322","entity_type":"product_family","name":"PRO Line","company_id":"CMP-000255","manufacturer":"Kurt J. Lesker Company","model_ids":["MDL-000393"],"equipment_ids":["EQP-A09.07"],"is_component":false,"process_ids":["PRS-013","PRS-016"],"technology_ids":["TEC-020"],"source_ids":["SRC-000674"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000323","entity_type":"product_family","name":"CMS","company_id":"CMP-000255","manufacturer":"Kurt J. Lesker Company","model_ids":["MDL-000394"],"equipment_ids":["EQP-A09.07"],"is_component":false,"process_ids":["PRS-013","PRS-016"],"technology_ids":["TEC-020"],"source_ids":["SRC-000675"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000324","entity_type":"product_family","name":"Wafer handling robots","company_id":"CMP-000256","manufacturer":"Kensington Laboratories","model_ids":["MDL-000395"],"equipment_ids":["EQP-A38"],"is_component":false,"process_ids":["PRS-058"],"technology_ids":[],"source_ids":["SRC-000676"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000325","entity_type":"product_family","name":"EFEM","company_id":"CMP-000256","manufacturer":"Kensington Laboratories","model_ids":["MDL-000396"],"equipment_ids":["EQP-A37"],"is_component":false,"process_ids":["PRS-058"],"technology_ids":[],"source_ids":["SRC-000677"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000326","entity_type":"product_family","name":"nSpec","company_id":"CMP-000257","manufacturer":"Nanotronics","model_ids":["MDL-000397","MDL-000398"],"equipment_ids":["EQP-A23"],"is_component":false,"process_ids":["PRS-027"],"technology_ids":["TEC-031"],"source_ids":["SRC-000678","SRC-000679"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000327","entity_type":"product_family","name":"3D X-ray microscopes","company_id":"CMP-000258","manufacturer":"Sigray","model_ids":["MDL-000399","MDL-000400"],"equipment_ids":["EQP-C35"],"is_component":false,"process_ids":["PRS-040"],"technology_ids":["TEC-033"],"source_ids":["SRC-000680","SRC-000681"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000328","entity_type":"product_family","name":"MicroXRF","company_id":"CMP-000258","manufacturer":"Sigray","model_ids":["MDL-000401"],"equipment_ids":["EQP-A25"],"is_component":false,"process_ids":["PRS-026"],"technology_ids":["TEC-035"],"source_ids":["SRC-000682"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000329","entity_type":"product_family","name":"Overlay metrology","company_id":"CMP-000261","manufacturer":"AUROS Technology","model_ids":["MDL-000402","MDL-000403"],"equipment_ids":["EQP-A27"],"is_component":false,"process_ids":["PRS-026"],"technology_ids":["TEC-035"],"source_ids":["SRC-000683","SRC-000561"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000330","entity_type":"product_family","name":"Warpage metrology","company_id":"CMP-000261","manufacturer":"AUROS Technology","model_ids":["MDL-000404"],"equipment_ids":["EQP-A30"],"is_component":false,"process_ids":["PRS-008","PRS-026"],"technology_ids":["TEC-035"],"source_ids":["SRC-000684"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000331","entity_type":"product_family","name":"AEGIS","company_id":"CMP-000262","manufacturer":"NEXTIN","model_ids":["MDL-000405"],"equipment_ids":["EQP-A22"],"is_component":false,"process_ids":["PRS-027"],"technology_ids":["TEC-031"],"source_ids":["SRC-000685"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000332","entity_type":"product_family","name":"Testers","company_id":"CMP-000263","manufacturer":"Exicon","model_ids":["MDL-000406","MDL-000407","MDL-000408","MDL-000409"],"equipment_ids":["EQP-C40","EQP-C41","EQP-C38"],"is_component":false,"process_ids":["PRS-041","PRS-042"],"technology_ids":["TEC-056","TEC-057"],"source_ids":["SRC-000686","SRC-000687","SRC-000688","SRC-000689"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000333","entity_type":"product_family","name":"PECVD","company_id":"CMP-000265","manufacturer":"TES Co., Ltd.","model_ids":["MDL-000410"],"equipment_ids":["EQP-A09.02"],"is_component":false,"process_ids":["PRS-013","PRS-014"],"technology_ids":["TEC-016"],"source_ids":["SRC-000690"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000334","entity_type":"product_family","name":"Test handlers","company_id":"CMP-000266","manufacturer":"MIRAE Corporation","model_ids":["MDL-000411","MDL-000412","MDL-000413"],"equipment_ids":["EQP-C39","EQP-C38"],"is_component":false,"process_ids":["PRS-041","PRS-042"],"technology_ids":["TEC-056","TEC-057"],"source_ids":["SRC-000691","SRC-000692","SRC-000693"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000335","entity_type":"product_family","name":"AMPS","company_id":"CMP-000269","manufacturer":"AEM Holdings","model_ids":["MDL-000414"],"equipment_ids":["EQP-C37"],"is_component":false,"process_ids":["PRS-041"],"technology_ids":["TEC-056"],"source_ids":["SRC-000694"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000336","entity_type":"product_family","name":"AMB testers","company_id":"CMP-000270","manufacturer":"Aemulus","model_ids":["MDL-000415","MDL-000416","MDL-000417","MDL-000418"],"equipment_ids":["EQP-C40"],"is_component":false,"process_ids":["PRS-041"],"technology_ids":["TEC-056"],"source_ids":["SRC-000695","SRC-000696","SRC-000697","SRC-000698"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000337","entity_type":"product_family","name":"Spin coating units","company_id":"CMP-000273","manufacturer":"Holmarc Opto-Mechatronics","model_ids":["MDL-000419","MDL-000420"],"equipment_ids":["EQP-A02"],"is_component":false,"process_ids":["PRS-017","PRS-019"],"technology_ids":[],"source_ids":["SRC-000699","SRC-000700"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000338","entity_type":"product_family","name":"ProMark","company_id":"CMP-000274","manufacturer":"Scantech Laser","model_ids":["MDL-000421"],"equipment_ids":["EQP-C26"],"is_component":false,"process_ids":["PRS-038"],"technology_ids":["TEC-059","TEC-080"],"source_ids":["SRC-000701"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000339","entity_type":"product_family","name":"Bondjet heavy wire","company_id":"CMP-000276","manufacturer":"Hesse Mechatronics","model_ids":["MDL-000422"],"equipment_ids":["EQP-C14"],"is_component":false,"process_ids":["PRS-034"],"technology_ids":["TEC-040"],"source_ids":["SRC-000739"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000340","entity_type":"product_family","name":"Bondjet fine wire","company_id":"CMP-000276","manufacturer":"Hesse Mechatronics","model_ids":["MDL-000423","MDL-000424"],"equipment_ids":["EQP-C14"],"is_component":false,"process_ids":["PRS-034"],"technology_ids":["TEC-040"],"source_ids":["SRC-000740","SRC-000741"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000341","entity_type":"product_family","name":"Manual wire bonders","company_id":"CMP-000277","manufacturer":"West-Bond","model_ids":["MDL-000425","MDL-000426","MDL-000427"],"equipment_ids":["EQP-C13","EQP-C14","EQP-C12"],"is_component":false,"process_ids":["PRS-034"],"technology_ids":["TEC-040"],"source_ids":["SRC-000742","SRC-000743","SRC-000744"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000342","entity_type":"product_family","name":"HB series","company_id":"CMP-000278","manufacturer":"TPT Wire Bonder","model_ids":["MDL-000428","MDL-000429","MDL-000430"],"equipment_ids":["EQP-C12"],"is_component":false,"process_ids":["PRS-034"],"technology_ids":["TEC-040"],"source_ids":["SRC-000745","SRC-000746","SRC-000747"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000343","entity_type":"product_family","name":"Die sorting","company_id":"CMP-000279","manufacturer":"Mühlbauer","model_ids":["MDL-000431","MDL-000432"],"equipment_ids":["EQP-C08"],"is_component":false,"process_ids":["PRS-033"],"technology_ids":[],"source_ids":["SRC-000748","SRC-000749"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000344","entity_type":"product_family","name":"ADAT3 XF","company_id":"CMP-000280","manufacturer":"ITEC","model_ids":["MDL-000433","MDL-000434","MDL-000435","MDL-000436","MDL-000437"],"equipment_ids":["EQP-C10","EQP-C08","EQP-C11"],"is_component":false,"process_ids":["PRS-033","PRS-035","PRS-050"],"technology_ids":["TEC-039","TEC-041"],"source_ids":["SRC-000750","SRC-000751","SRC-000752","SRC-000753","SRC-000754"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000345","entity_type":"product_family","name":"Unistar","company_id":"CMP-000281","manufacturer":"Boschman Technologies","model_ids":["MDL-000438"],"equipment_ids":["EQP-C21"],"is_component":false,"process_ids":["PRS-036"],"technology_ids":["TEC-045"],"source_ids":["SRC-000755"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000346","entity_type":"product_family","name":"Sinterstar","company_id":"CMP-000281","manufacturer":"Boschman Technologies","model_ids":["MDL-000439"],"equipment_ids":["EQP-F08"],"is_component":false,"process_ids":[],"technology_ids":[],"source_ids":["SRC-000756"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000347","entity_type":"product_family","name":"ThermoStream","company_id":"CMP-000282","manufacturer":"inTEST Corporation","model_ids":["MDL-000440"],"equipment_ids":["EQP-C42"],"is_component":false,"process_ids":["PRS-041"],"technology_ids":["TEC-056"],"source_ids":["SRC-000757"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000348","entity_type":"product_family","name":"MBE systems","company_id":"CMP-000283","manufacturer":"Riber","model_ids":["MDL-000441"],"equipment_ids":["EQP-A09.11"],"is_component":false,"process_ids":["PRS-009","PRS-013"],"technology_ids":["TEC-024"],"source_ids":["SRC-000719"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000349","entity_type":"product_family","name":"MBE systems","company_id":"CMP-000284","manufacturer":"SVT Associates","model_ids":["MDL-000442"],"equipment_ids":["EQP-A09.11"],"is_component":false,"process_ids":["PRS-009","PRS-013"],"technology_ids":["TEC-024"],"source_ids":["SRC-000720"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000350","entity_type":"product_family","name":"Tropel wafer analysis","company_id":"CMP-000289","manufacturer":"Corning (Tropel)","model_ids":["MDL-000443","MDL-000444"],"equipment_ids":["EQP-K09"],"is_component":false,"process_ids":["PRS-008"],"technology_ids":[],"source_ids":["SRC-000758","SRC-000759"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000351","entity_type":"product_family","name":"Mask cleaning","company_id":"CMP-000292","manufacturer":"Bruker (photomask repair & cleaning)","model_ids":["MDL-000445"],"equipment_ids":["EQP-B04"],"is_component":false,"process_ids":["PRS-028"],"technology_ids":[],"source_ids":["SRC-000728"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000352","entity_type":"product_family","name":"MES","company_id":"CMP-000293","manufacturer":"Critical Manufacturing","model_ids":["MDL-000446"],"equipment_ids":["EQP-J09"],"is_component":false,"process_ids":["PRS-058"],"technology_ids":[],"source_ids":["SRC-000730"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000353","entity_type":"product_family","name":"NeoDry","company_id":"CMP-000294","manufacturer":"Kashiyama Industries","model_ids":["MDL-000447","MDL-000448"],"equipment_ids":["EQP-L01"],"is_component":false,"process_ids":["PRS-059"],"technology_ids":[],"source_ids":["SRC-000760","SRC-000761"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000354","entity_type":"product_family","name":"DRYVAC","company_id":"CMP-000295","manufacturer":"Leybold","model_ids":["MDL-000449"],"equipment_ids":["EQP-L01"],"is_component":false,"process_ids":["PRS-059"],"technology_ids":[],"source_ids":["SRC-000762"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000355","entity_type":"product_family","name":"Abatement","company_id":"CMP-000296","manufacturer":"Kanken Techno","model_ids":["MDL-000450"],"equipment_ids":["EQP-L02"],"is_component":false,"process_ids":["PRS-059"],"technology_ids":[],"source_ids":["SRC-000733"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000356","entity_type":"product_family","name":"Orbis","company_id":"CMP-000298","manufacturer":"memsstar","model_ids":["MDL-000451"],"equipment_ids":["EQP-H02"],"is_component":false,"process_ids":[],"technology_ids":["TEC-012"],"source_ids":["SRC-000735"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000357","entity_type":"product_family","name":"4See","company_id":"CMP-000299","manufacturer":"UnitySC","model_ids":["MDL-000452"],"equipment_ids":["EQP-A22"],"is_component":false,"process_ids":["PRS-027"],"technology_ids":["TEC-031"],"source_ids":["SRC-000763"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000358","entity_type":"product_family","name":"YIELDjet","company_id":"CMP-000300","manufacturer":"Kateeva","model_ids":["MDL-000453","MDL-000454"],"equipment_ids":["EQP-I02"],"is_component":false,"process_ids":[],"technology_ids":[],"source_ids":["SRC-000764","SRC-000765"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000359","entity_type":"product_family","name":"AC microLine","company_id":"CMP-000301","manufacturer":"Lapmaster Wolters","model_ids":["MDL-000455","MDL-000456","MDL-000457","MDL-000458","MDL-000459"],"equipment_ids":["EQP-K07","EQP-K05"],"is_component":false,"process_ids":["PRS-006","PRS-004"],"technology_ids":[],"source_ids":["SRC-000785","SRC-000786","SRC-000787","SRC-000788","SRC-000789"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000360","entity_type":"product_family","name":"Lapping & polishing","company_id":"CMP-000302","manufacturer":"Logitech","model_ids":["MDL-000460"],"equipment_ids":["EQP-K05"],"is_component":false,"process_ids":["PRS-004"],"technology_ids":[],"source_ids":["SRC-000790"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000361","entity_type":"product_family","name":"CMP","company_id":"CMP-000302","manufacturer":"Logitech","model_ids":["MDL-000461","MDL-000462"],"equipment_ids":["EQP-A19"],"is_component":false,"process_ids":["PRS-024"],"technology_ids":["TEC-029"],"source_ids":["SRC-000791","SRC-000792"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000362","entity_type":"product_family","name":"Handlers","company_id":"CMP-000303","manufacturer":"TESEC Corporation","model_ids":["MDL-000463"],"equipment_ids":["EQP-C39"],"is_component":false,"process_ids":["PRS-041"],"technology_ids":["TEC-056"],"source_ids":["SRC-000793"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000363","entity_type":"product_family","name":"Testers","company_id":"CMP-000303","manufacturer":"TESEC Corporation","model_ids":["MDL-000464","MDL-000465"],"equipment_ids":["EQP-C40"],"is_component":false,"process_ids":["PRS-041"],"technology_ids":["TEC-056"],"source_ids":["SRC-000794","SRC-000795"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000364","entity_type":"product_family","name":"Probe cards","company_id":"CMP-000304","manufacturer":"MICRONICS JAPAN","model_ids":["MDL-000466"],"equipment_ids":["EQP-A33"],"is_component":false,"process_ids":["PRS-029"],"technology_ids":["TEC-056"],"source_ids":["SRC-000796"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000365","entity_type":"product_family","name":"Wafer probers","company_id":"CMP-000304","manufacturer":"MICRONICS JAPAN","model_ids":["MDL-000467"],"equipment_ids":["EQP-A33"],"is_component":false,"process_ids":["PRS-029"],"technology_ids":["TEC-056"],"source_ids":["SRC-000797"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000366","entity_type":"product_family","name":"Probe cards","company_id":"CMP-000305","manufacturer":"Japan Electronic Materials (JEM)","model_ids":["MDL-000468"],"equipment_ids":["EQP-A33"],"is_component":false,"process_ids":["PRS-029"],"technology_ids":["TEC-056"],"source_ids":["SRC-000772"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000367","entity_type":"product_family","name":"Mass flow controllers","company_id":"CMP-000307","manufacturer":"HORIBA (HORIBA STEC)","model_ids":["MDL-000469","MDL-000470","MDL-000471","MDL-000472"],"equipment_ids":["EQP-A43"],"is_component":false,"process_ids":["PRS-060"],"technology_ids":[],"source_ids":["SRC-000798","SRC-000799","SRC-000800","SRC-000801"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000368","entity_type":"product_family","name":"Integrated gas system","company_id":"CMP-000308","manufacturer":"Fujikin","model_ids":["MDL-000473"],"equipment_ids":["EQP-A43"],"is_component":false,"process_ids":["PRS-060"],"technology_ids":[],"source_ids":["SRC-000802"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000369","entity_type":"product_family","name":"EB mask writers","company_id":"CMP-000025","manufacturer":"NuFlare Technology","model_ids":["MDL-000474","MDL-000475","MDL-000476"],"equipment_ids":["EQP-B07"],"is_component":false,"process_ids":["PRS-028"],"technology_ids":["TEC-006"],"source_ids":["SRC-000803","SRC-000804","SRC-000805"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000370","entity_type":"product_family","name":"Multi-beam mask writers","company_id":"CMP-000309","manufacturer":"IMS Nanofabrication","model_ids":["MDL-000477"],"equipment_ids":["EQP-B07"],"is_component":false,"process_ids":["PRS-028"],"technology_ids":["TEC-006"],"source_ids":["SRC-000806"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000371","entity_type":"product_family","name":"microLED","company_id":"CMP-000141","manufacturer":"3D-Micromac","model_ids":["MDL-000478"],"equipment_ids":["EQP-I08"],"is_component":false,"process_ids":["PRS-056"],"technology_ids":[],"source_ids":["SRC-000807"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000372","entity_type":"product_family","name":"microLED","company_id":"CMP-000044","manufacturer":"ASMPT","model_ids":["MDL-000479"],"equipment_ids":["EQP-I08"],"is_component":false,"process_ids":["PRS-056"],"technology_ids":[],"source_ids":["SRC-000808"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000373","entity_type":"product_family","name":"LEAP","company_id":"CMP-000310","manufacturer":"Uniqarta","model_ids":["MDL-000480"],"equipment_ids":["EQP-I08"],"is_component":false,"process_ids":["PRS-056"],"technology_ids":[],"source_ids":["SRC-000778"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000374","entity_type":"product_family","name":"Dispensing machines","company_id":"CMP-000316","manufacturer":"Musashi Engineering","model_ids":["MDL-000481","MDL-000482"],"equipment_ids":["EQP-C24","EQP-C25"],"is_component":false,"process_ids":["PRS-036"],"technology_ids":[],"source_ids":["SRC-000822","SRC-000823"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000375","entity_type":"product_family","name":"MDS piezo jetting","company_id":"CMP-000317","manufacturer":"VERMES Microdispensing","model_ids":["MDL-000483"],"equipment_ids":["EQP-C25"],"is_component":false,"process_ids":["PRS-036"],"technology_ids":[],"source_ids":["SRC-000824"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000376","entity_type":"product_family","name":"M17 wire bonders","company_id":"CMP-000318","manufacturer":"F&K Delvotec","model_ids":["MDL-000484","MDL-000485","MDL-000486"],"equipment_ids":["EQP-C14"],"is_component":false,"process_ids":["PRS-034"],"technology_ids":["TEC-040"],"source_ids":["SRC-000825","SRC-000826","SRC-000827"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000377","entity_type":"product_family","name":"Ball-wedge bonders","company_id":"CMP-000318","manufacturer":"F&K Delvotec","model_ids":["MDL-000487"],"equipment_ids":["EQP-C13"],"is_component":false,"process_ids":["PRS-034"],"technology_ids":["TEC-040"],"source_ids":["SRC-000828"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000378","entity_type":"product_family","name":"Laser bonders","company_id":"CMP-000318","manufacturer":"F&K Delvotec","model_ids":["MDL-000488"],"equipment_ids":["EQP-C31"],"is_component":false,"process_ids":[],"technology_ids":["TEC-066"],"source_ids":["SRC-000829"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000379","entity_type":"product_family","name":"Die bonders","company_id":"CMP-000319","manufacturer":"HYBOND","model_ids":["MDL-000489","MDL-000490","MDL-000491"],"equipment_ids":["EQP-C10"],"is_component":false,"process_ids":["PRS-033"],"technology_ids":["TEC-039"],"source_ids":["SRC-000830","SRC-000831","SRC-000832"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000380","entity_type":"product_family","name":"EFEM","company_id":"CMP-000320","manufacturer":"SINFONIA TECHNOLOGY","model_ids":["MDL-000492","MDL-000493"],"equipment_ids":["EQP-J11"],"is_component":false,"process_ids":["PRS-058"],"technology_ids":[],"source_ids":["SRC-000833","SRC-000834"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000381","entity_type":"product_family","name":"Load ports","company_id":"CMP-000320","manufacturer":"SINFONIA TECHNOLOGY","model_ids":["MDL-000494","MDL-000495"],"equipment_ids":["EQP-J12"],"is_component":false,"process_ids":["PRS-058"],"technology_ids":[],"source_ids":["SRC-000835","SRC-000836"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000382","entity_type":"product_family","name":"Wafer transfer robots","company_id":"CMP-000321","manufacturer":"Kawasaki Robotics","model_ids":["MDL-000496"],"equipment_ids":["EQP-J06"],"is_component":false,"process_ids":["PRS-058"],"technology_ids":[],"source_ids":["SRC-000814"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000383","entity_type":"product_family","name":"GAMA","company_id":"CMP-000322","manufacturer":"Akrion Systems (NAURA Akrion)","model_ids":["MDL-000497"],"equipment_ids":["EQP-A05"],"is_component":false,"process_ids":["PRS-010","PRS-021"],"technology_ids":["TEC-030"],"source_ids":["SRC-000837"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000384","entity_type":"product_family","name":"Minilock-Phantom","company_id":"CMP-000323","manufacturer":"Trion Technology","model_ids":["MDL-000498","MDL-000499","MDL-000500"],"equipment_ids":["EQP-A08.04","EQP-A08.03","EQP-A08.05"],"is_component":false,"process_ids":["PRS-020","PRS-043"],"technology_ids":["TEC-011","TEC-010","TEC-012"],"source_ids":["SRC-000838","SRC-000839","SRC-000840"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000385","entity_type":"product_family","name":"Strippers","company_id":"CMP-000323","manufacturer":"Trion Technology","model_ids":["MDL-000501"],"equipment_ids":["EQP-A07"],"is_component":false,"process_ids":["PRS-010","PRS-021"],"technology_ids":[],"source_ids":["SRC-000841"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000386","entity_type":"product_family","name":"NEXAR LIDE","company_id":"CMP-000143","manufacturer":"LPKF Laser & Electronics","model_ids":["MDL-000502"],"equipment_ids":["EQP-D14"],"is_component":false,"process_ids":["PRS-044","PRS-053"],"technology_ids":["TEC-054"],"source_ids":["SRC-000842"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000387","entity_type":"product_family","name":"Plasma dicers","company_id":"CMP-000055","manufacturer":"Panasonic Connect","model_ids":["MDL-000503"],"equipment_ids":["EQP-C01.04"],"is_component":false,"process_ids":["PRS-032"],"technology_ids":["TEC-014"],"source_ids":["SRC-000843"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000388","entity_type":"product_family","name":"Apogee","company_id":"CMP-000326","manufacturer":"Brewer Science","model_ids":["MDL-000504"],"equipment_ids":["EQP-C18"],"is_component":false,"process_ids":["PRS-051","PRS-052"],"technology_ids":["TEC-044"],"source_ids":["SRC-000820"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000389","entity_type":"product_family","name":"Thermo-compression bonders","company_id":"CMP-000046","manufacturer":"Kulicke & Soffa","model_ids":["MDL-000505"],"equipment_ids":["EQP-C16"],"is_component":false,"process_ids":["PRS-035","PRS-049","PRS-050"],"technology_ids":["TEC-042"],"source_ids":["SRC-000844"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000390","entity_type":"product_family","name":"TC bonders","company_id":"CMP-000067","manufacturer":"SEMES","model_ids":["MDL-000506"],"equipment_ids":["EQP-C16"],"is_component":false,"process_ids":["PRS-035","PRS-049","PRS-050"],"technology_ids":["TEC-042"],"source_ids":["SRC-000845"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000391","entity_type":"product_family","name":"Sputtering systems","company_id":"CMP-000334","manufacturer":"ULVAC","model_ids":["MDL-000507","MDL-000508","MDL-000509"],"equipment_ids":["EQP-A09.08"],"is_component":false,"process_ids":["PRS-013","PRS-016"],"technology_ids":["TEC-020"],"source_ids":["SRC-000862","SRC-000863","SRC-000864"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000392","entity_type":"product_family","name":"Sputtering","company_id":"CMP-000335","manufacturer":"CANON ANELVA","model_ids":["MDL-000510","MDL-000511","MDL-000512","MDL-000513","MDL-000514","MDL-000515"],"equipment_ids":["EQP-A09.08"],"is_component":false,"process_ids":["PRS-013","PRS-016"],"technology_ids":["TEC-020"],"source_ids":["SRC-000865","SRC-000866","SRC-000867","SRC-000868","SRC-000869","SRC-000870"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000393","entity_type":"product_family","name":"Etching","company_id":"CMP-000335","manufacturer":"CANON ANELVA","model_ids":["MDL-000516"],"equipment_ids":["EQP-A08"],"is_component":false,"process_ids":["PRS-020"],"technology_ids":[],"source_ids":["SRC-000871"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000394","entity_type":"product_family","name":"XEA","company_id":"CMP-000336","manufacturer":"VON ARDENNE","model_ids":["MDL-000517"],"equipment_ids":["EQP-A09.08"],"is_component":false,"process_ids":["PRS-013","PRS-016"],"technology_ids":["TEC-020"],"source_ids":["SRC-000872"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000395","entity_type":"product_family","name":"InfinityLine","company_id":"CMP-000337","manufacturer":"SCHMID Group","model_ids":["MDL-000518","MDL-000519"],"equipment_ids":["EQP-A05","EQP-D19"],"is_component":false,"process_ids":["PRS-010","PRS-021","PRS-053"],"technology_ids":["TEC-030","TEC-048"],"source_ids":["SRC-000873","SRC-000874"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000396","entity_type":"product_family","name":"Ion implanters","company_id":"CMP-000338","manufacturer":"Nissin Ion Equipment","model_ids":["MDL-000520"],"equipment_ids":["EQP-A10"],"is_component":false,"process_ids":["PRS-022"],"technology_ids":["TEC-026"],"source_ids":["SRC-000858"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000397","entity_type":"product_family","name":"Wafer AOI","company_id":"CMP-000087","manufacturer":"Utechzone","model_ids":["MDL-000521","MDL-000522"],"equipment_ids":["EQP-A23"],"is_component":false,"process_ids":["PRS-027"],"technology_ids":["TEC-031"],"source_ids":["SRC-000875","SRC-000876"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000398","entity_type":"product_family","name":"MDP","company_id":"CMP-000341","manufacturer":"Freiberg Instruments","model_ids":["MDL-000523","MDL-000524"],"equipment_ids":["EQP-A25"],"is_component":false,"process_ids":["PRS-026"],"technology_ids":["TEC-035"],"source_ids":["SRC-000877","SRC-000878"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000399","entity_type":"product_family","name":"SiC epitaxy","company_id":"CMP-000357","manufacturer":"Zhejiang Jingsheng Mechanical & Electrical (JSG)","model_ids":["MDL-000525"],"equipment_ids":["EQP-A09.10"],"is_component":false,"process_ids":["PRS-009","PRS-013"],"technology_ids":["TEC-022"],"source_ids":["SRC-000903"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000400","entity_type":"product_family","name":"Crystal growth","company_id":"CMP-000357","manufacturer":"Zhejiang Jingsheng Mechanical & Electrical (JSG)","model_ids":["MDL-000526"],"equipment_ids":["EQP-K01"],"is_component":false,"process_ids":["PRS-001"],"technology_ids":[],"source_ids":["SRC-000904"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000401","entity_type":"product_family","name":"Thermal","company_id":"CMP-000358","manufacturer":"Mattson Technology","model_ids":["MDL-000527","MDL-000528"],"equipment_ids":["EQP-A12","EQP-A13"],"is_component":false,"process_ids":["PRS-023"],"technology_ids":["TEC-028"],"source_ids":["SRC-000905","SRC-000906"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000402","entity_type":"product_family","name":"Dry strip","company_id":"CMP-000358","manufacturer":"Mattson Technology","model_ids":["MDL-000529","MDL-000530"],"equipment_ids":["EQP-A07"],"is_component":false,"process_ids":["PRS-010","PRS-021"],"technology_ids":[],"source_ids":["SRC-000907","SRC-000908"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"},{"id":"PRD-000403","entity_type":"product_family","name":"SEMI-GAS gas cabinets","company_id":"CMP-000353","manufacturer":"Applied Energy Systems (SEMI-GAS)","model_ids":["MDL-000531"],"equipment_ids":["EQP-A43"],"is_component":false,"process_ids":["PRS-060"],"technology_ids":[],"source_ids":["SRC-000909"],"verification":"PARTIALLY_VERIFIED","basis":"Grouped from Batch-1 product records sharing company and family name"}],"models":[{"id":"MDL-000001","legacy_id":"P00001","entity_type":"model","company_id":"CMP-000010","manufacturer":"DISCO Corporation","family_id":"PRD-000001","family_name":"Stealth dicing laser saw","model_number":"DFL7341","model_identified":true,"name":"Stealth dicing laser saw · DFL7341","equipment_id":"EQP-C01.03","equipment_code":"C01.03","equipment_label":"Stealth Dicing","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":"Dicing","process_ids":["PRS-032"],"technology_text":"Stealth Dicing (internal modification) with Hamamatsu SD engine","technology_ids":["TEC-060","TEC-061","TEC-075"],"technology_basis":{"from_category":["TEC-061"],"from_laser_codes":["TEC-060","TEC-061","TEC-075"]},"application_text":"Wafer singulation (MEMS, memory, LED)","application_ids":["APP-005","APP-014","APP-016"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Dicing; Stealth Dicing; IR Laser Processing","type_codes":["L02","L03","L17"],"source":"Hamamatsu Photonics (SD engine, licensed) / SD engine","wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Dicing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000054","SRC-000053"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2016-06-10","review_due":"2027-09-29"}},{"id":"MDL-000002","legacy_id":"P00002","entity_type":"model","company_id":"CMP-000010","manufacturer":"DISCO Corporation","family_id":"PRD-000001","family_name":"Stealth dicing laser saw","model_number":"DFL7362","model_identified":true,"name":"Stealth dicing laser saw · DFL7362","equipment_id":"EQP-C01.03","equipment_code":"C01.03","equipment_label":"Stealth Dicing","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":"Dicing","process_ids":["PRS-032"],"technology_text":"Stealth Dicing with SD engine","technology_ids":["TEC-060","TEC-061","TEC-075"],"technology_basis":{"from_category":["TEC-061"],"from_laser_codes":["TEC-060","TEC-061","TEC-075"]},"application_text":"Wafer singulation","application_ids":[],"material_text":null,"material_ids":[],"wafer":{"source_value":"300 mm (per S0054 model list)","sizes_mm":[300],"nonstandard_mm":[],"range_mm":null,"unit":"mm"},"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Dicing; Stealth Dicing; IR Laser Processing","type_codes":["L02","L03","L17"],"source":"Hamamatsu Photonics (SD engine) / SD engine","wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Dicing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000054"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000003","legacy_id":"P00003","entity_type":"model","company_id":"CMP-000010","manufacturer":"DISCO Corporation","family_id":"PRD-000002","family_name":"Laser ingot slicing (KABRA)","model_number":"DAL7440","model_identified":true,"name":"Laser ingot slicing (KABRA) · DAL7440","equipment_id":"EQP-F01","equipment_code":"F01","equipment_label":"SiC wafer processing","category_group":"F","segment":"Front-End","market_segment":"Power Semiconductor","is_component":false,"component_class_id":null,"legacy_process_step":null,"legacy_process_name":null,"process_ids":["PRS-003"],"technology_text":"KABRA: flat absorbing separation layer formed at depth; wafers peeled from ingot","technology_ids":["TEC-065","TEC-072"],"technology_basis":{"from_category":[],"from_laser_codes":["TEC-065","TEC-072"]},"application_text":"8-inch SiC wafer production from ingot","application_ids":["APP-010","APP-011"],"material_text":"SiC ingot","material_ids":["MAT-003"],"wafer":{"source_value":"200 mm (8-inch SiC)","sizes_mm":[200],"nonstandard_mm":[],"range_mm":null,"unit":"mm"},"thickness":"Ingot up to 40 mm","throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Cutting; Laser Micromachining","type_codes":["L07","L14"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":"SiC ingot"},"specs":[{"parameter":"Max ingot thickness","value":40,"unit":"mm","source_value":"40 mm","source_ids":["SRC-000220"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"}],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Launch article 2018 (source VERY_STALE); current availability not re-verified","reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000220"],"source_age":"VERY_STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2018-01-09","review_due":"2027-09-29"}},{"id":"MDL-000004","legacy_id":"P00004","entity_type":"model","company_id":"CMP-000010","manufacturer":"DISCO Corporation","family_id":"PRD-000003","family_name":"Laser ingot slicing (automated KABRA)","model_number":"KABRA!zen","model_identified":true,"name":"Laser ingot slicing (automated KABRA) · KABRA!zen","equipment_id":"EQP-F01","equipment_code":"F01","equipment_label":"SiC wafer processing","category_group":"F","segment":"Front-End","market_segment":"Power Semiconductor","is_component":false,"component_class_id":null,"legacy_process_step":null,"legacy_process_name":null,"process_ids":["PRS-003"],"technology_text":"Fully automated KABRA slicing","technology_ids":["TEC-065","TEC-072"],"technology_basis":{"from_category":[],"from_laser_codes":["TEC-065","TEC-072"]},"application_text":"SiC wafer production; GaN-optimized KABRA process announced","application_ids":["APP-010","APP-011","APP-012"],"material_text":"SiC; GaN (process development)","material_ids":["MAT-003","MAT-004"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Cutting; Laser Micromachining","type_codes":["L07","L14"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":"SiC; GaN (process development)"},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Company development announcement (title-level)","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000221","SRC-000222"],"source_age":"VERY_STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2023-07","review_due":"2027-09-29"}},{"id":"MDL-000005","legacy_id":"P00005","entity_type":"model","company_id":"CMP-000011","manufacturer":"Hamamatsu Photonics","family_id":"PRD-000004","family_name":"Stealth Dicing engine (laser + optics module)","model_number":"SD engine","model_identified":true,"name":"Stealth Dicing engine (laser + optics module) · SD engine","equipment_id":null,"equipment_code":"BOM01","equipment_label":"BOM: Laser Source","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000010","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"Modularized laser & optical system focusing a transmissive wavelength inside the wafer; LBA optics; SDBG for <50 um","technology_ids":["TEC-061","TEC-075"],"technology_basis":{"from_category":[],"from_laser_codes":["TEC-061","TEC-075"]},"application_text":"Supplied/licensed to dicing OEMs (DISCO; Accretech legacy ML200PLUS)","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":"<50 um via SDBG","throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Stealth Dicing; IR Laser Processing","type_codes":["L03","L17"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000054","SRC-000055","SRC-000056","SRC-000053","SRC-000102"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2016-06-10","review_due":"2027-09-29"}},{"id":"MDL-000006","legacy_id":"P00006","entity_type":"model","company_id":"CMP-000012","manufacturer":"Tokyo Seimitsu (ACCRETECH)","family_id":"PRD-000005","family_name":"Fully automatic laser dicing machine (IR)","model_number":"ML2200","model_identified":true,"name":"Fully automatic laser dicing machine (IR) · ML2200","equipment_id":"EQP-C01.03","equipment_code":"C01.03","equipment_label":"Stealth Dicing","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":"Dicing","process_ids":["PRS-032"],"technology_text":"IR laser internal modification dicing","technology_ids":["TEC-060","TEC-061","TEC-075"],"technology_basis":{"from_category":["TEC-061"],"from_laser_codes":["TEC-060","TEC-061","TEC-075"]},"application_text":"200 mm wafer dicing","application_ids":[],"material_text":null,"material_ids":[],"wafer":{"source_value":"200 mm","sizes_mm":[200],"nonstandard_mm":[],"range_mm":null,"unit":"mm"},"thickness":null,"throughput":null,"accuracy":"0.002 mm / 210 mm (positioning)","footprint":"1,640 x 1,340 x 1,800 mm","motion":null,"laser":{"types_text":"Laser Dicing; Stealth Dicing; IR Laser Processing","type_codes":["L02","L03","L17"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":"X 0.1-1,100 mm/s","material":null},"specs":[{"parameter":"X-axis speed","value":"0.1-1,100","unit":"mm/s","source_value":"0.1-1,100 mm/s","source_ids":["SRC-000097","SRC-000101"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"Positioning accuracy","value":"0.002 / 210","unit":"mm","source_value":"0.002 / 210 mm","source_ids":["SRC-000097","SRC-000101"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"Dimensions (WxDxH)","value":"1,640 x 1,340 x 1,800","unit":"mm","source_value":"1,640 x 1,340 x 1,800 mm","source_ids":["SRC-000097","SRC-000101"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"Weight","value":"2,000","unit":"kg","source_value":"2,000 kg","source_ids":["SRC-000097","SRC-000101"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"}],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Dicing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000097","SRC-000101"],"source_age":"AGING","freshness":"Needs Review","quality_state":"VERIFIED","missing_key_fields":["Throughput"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-10","review_due":"2027-09-29"}},{"id":"MDL-000007","legacy_id":"P00007","entity_type":"model","company_id":"CMP-000012","manufacturer":"Tokyo Seimitsu (ACCRETECH)","family_id":"PRD-000005","family_name":"Fully automatic laser dicing machine (IR)","model_number":"ML3200","model_identified":true,"name":"Fully automatic laser dicing machine (IR) · ML3200","equipment_id":"EQP-C01.03","equipment_code":"C01.03","equipment_label":"Stealth Dicing","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":"Dicing","process_ids":["PRS-032"],"technology_text":"High-output IR laser internal modification","technology_ids":["TEC-060","TEC-061","TEC-075"],"technology_basis":{"from_category":["TEC-061"],"from_laser_codes":["TEC-060","TEC-061","TEC-075"]},"application_text":"300 mm wafer dicing","application_ids":[],"material_text":null,"material_ids":[],"wafer":{"source_value":"300 mm","sizes_mm":[300],"nonstandard_mm":[],"range_mm":null,"unit":"mm"},"thickness":null,"throughput":"Dicing >=800 mm/s","accuracy":null,"footprint":"1,712 x 2,960 x 1,800 mm","motion":null,"laser":{"types_text":"Laser Dicing; Stealth Dicing; IR Laser Processing","type_codes":["L02","L03","L17"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":"X 0.1-2,100 mm/s; dicing >=800 mm/s","material":null},"specs":[{"parameter":"X-axis speed","value":"0.1-2,100","unit":"mm/s","source_value":"0.1-2,100 mm/s","source_ids":["SRC-000098"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"Dicing speed","value":">=800","unit":"mm/s","source_value":">=800 mm/s","source_ids":["SRC-000098"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"Dimensions (WxDxH)","value":"1,712 x 2,960 x 1,800","unit":"mm","source_value":"1,712 x 2,960 x 1,800 mm","source_ids":["SRC-000098"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"Weight","value":"3,000","unit":"kg","source_value":"3,000 kg","source_ids":["SRC-000098"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"Cleanliness option","value":"Class 100","unit":null,"source_value":"Class 100","source_ids":["SRC-000098"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"}],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Dicing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000098"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000008","legacy_id":"P00008","entity_type":"model","company_id":"CMP-000012","manufacturer":"Tokyo Seimitsu (ACCRETECH)","family_id":"PRD-000006","family_name":"Fully automatic dicing machine (UV laser)","model_number":"AL3000","model_identified":true,"name":"Fully automatic dicing machine (UV laser) · AL3000","equipment_id":"EQP-C01.02","equipment_code":"C01.02","equipment_label":"Laser Dicing","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":"Dicing","process_ids":["PRS-032"],"technology_text":"Diode-pumped Q-switched solid-state UV laser ablation","technology_ids":["TEC-060","TEC-062","TEC-064","TEC-073","TEC-081"],"technology_basis":{"from_category":["TEC-060"],"from_laser_codes":["TEC-060","TEC-062","TEC-064","TEC-073","TEC-081"]},"application_text":"Laser grooving/dicing up to 305 mm","application_ids":[],"material_text":null,"material_ids":[],"wafer":{"source_value":"up to 305 mm","sizes_mm":[],"nonstandard_mm":[],"range_mm":{"min":null,"max":305},"unit":"mm"},"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Dicing; Laser Ablation; Laser Grooving; UV Processing; DPSS","type_codes":["L02","L04","L06","L15","L23"],"source":"N/A (DPSS Q-switch, maker not stated)","wavelength":"355 nm","average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":"X 1,000 mm/s; Y 300 mm/s","material":null},"specs":[{"parameter":"Stroke","value":"310 x 310","unit":"mm","source_value":"310 x 310 mm","source_ids":["SRC-000099"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"X-axis speed","value":"1,000","unit":"mm/s","source_value":"1,000 mm/s","source_ids":["SRC-000099"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"Y-axis speed","value":300,"unit":"mm/s","source_value":"300 mm/s","source_ids":["SRC-000099"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"Wavelength","value":355,"unit":"nm","source_value":"355 nm","source_ids":["SRC-000099"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"}],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Dicing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000099"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000009","legacy_id":"P00009","entity_type":"model","company_id":"CMP-000012","manufacturer":"Tokyo Seimitsu (ACCRETECH)","family_id":"PRD-000007","family_name":"Laser dicing machine","model_number":"ML301 EXWH","model_identified":true,"name":"Laser dicing machine · ML301 EXWH","equipment_id":"EQP-C01.03","equipment_code":"C01.03","equipment_label":"Stealth Dicing","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":"Dicing","process_ids":["PRS-032"],"technology_text":"Laser focused below surface (internal modification)","technology_ids":["TEC-060","TEC-061"],"technology_basis":{"from_category":["TEC-061"],"from_laser_codes":["TEC-060","TEC-061"]},"application_text":"Dicing up to 300 mm","application_ids":[],"material_text":null,"material_ids":[],"wafer":{"source_value":"<=300 mm","sizes_mm":[],"nonstandard_mm":[],"range_mm":{"min":null,"max":300},"unit":"mm"},"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Dicing; Stealth Dicing","type_codes":["L02","L03"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[{"parameter":"Power reduction claim","value":"85% less power; 100% less water (vs blade, per company)","unit":null,"source_value":"85% less power; 100% less water (vs blade, per company)","source_ids":["SRC-000100"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"}],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Dicing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000100"],"source_age":"STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-08","review_due":"2027-09-29"}},{"id":"MDL-000010","legacy_id":"P00010","entity_type":"model","company_id":"CMP-000012","manufacturer":"Tokyo Seimitsu (ACCRETECH)","family_id":"PRD-000008","family_name":"Laser dicing machine (legacy)","model_number":"ML200PLUS (Mahoh)","model_identified":true,"name":"Laser dicing machine (legacy) · ML200PLUS (Mahoh)","equipment_id":"EQP-C01.03","equipment_code":"C01.03","equipment_label":"Stealth Dicing","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":"Dicing","process_ids":["PRS-032"],"technology_text":"Stealth dicing with Hamamatsu SD engine","technology_ids":["TEC-060","TEC-061"],"technology_basis":{"from_category":["TEC-061"],"from_laser_codes":["TEC-060","TEC-061"]},"application_text":"Thin-wafer dicing (30 um)","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":"30 um wafers","throughput":"300 mm/s","accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Dicing; Stealth Dicing","type_codes":["L02","L03"],"source":"Hamamatsu Photonics (SD engine)","wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":"300 mm/s","material":null},"specs":[],"lifecycle":{"status":"Legacy","legacy_status":"LEGACY","maturity":"Commercial","maturity_evidence":"Archived datasheet (Tier 3)","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Dicing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000102"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000011","legacy_id":"P00011","entity_type":"model","company_id":"CMP-000012","manufacturer":"Tokyo Seimitsu (ACCRETECH)","family_id":"PRD-000009","family_name":"Laser dicing machine with wafer handling","model_number":"ML300Plus II WH","model_identified":true,"name":"Laser dicing machine with wafer handling · ML300Plus II WH","equipment_id":"EQP-C01.03","equipment_code":"C01.03","equipment_label":"Stealth Dicing","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":"Dicing","process_ids":["PRS-032"],"technology_text":"Laser dicing, 12-inch with handling","technology_ids":["TEC-060","TEC-061"],"technology_basis":{"from_category":["TEC-061"],"from_laser_codes":["TEC-060"]},"application_text":"300 mm dicing","application_ids":[],"material_text":null,"material_ids":[],"wafer":{"source_value":"300 mm","sizes_mm":[300],"nonstandard_mm":[],"range_mm":null,"unit":"mm"},"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Dicing","type_codes":["L02"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":"Secondary-market listing only (Tier 3)","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Dicing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000103"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000012","legacy_id":"P00012","entity_type":"model","company_id":"CMP-000012","manufacturer":"Tokyo Seimitsu (ACCRETECH)","family_id":"PRD-000010","family_name":"Blade dicing machine","model_number":"AD2000T/S","model_identified":true,"name":"Blade dicing machine · AD2000T/S","equipment_id":"EQP-C01.01","equipment_code":"C01.01","equipment_label":"Mechanical Dicing","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":"Dicing","process_ids":["PRS-032"],"technology_text":"Blade dicing","technology_ids":["TEC-037"],"technology_basis":{"from_category":["TEC-037"],"from_laser_codes":[]},"application_text":"Wafer/package dicing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[{"parameter":"X-axis speed","value":"1,000","unit":"mm/s","source_value":"1,000 mm/s","source_ids":["SRC-000105"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"Y-axis speed","value":300,"unit":"mm/s","source_value":"300 mm/s","source_ids":["SRC-000105"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"Z-axis speed","value":80,"unit":"mm/s","source_value":"80 mm/s","source_ids":["SRC-000105"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"}],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Dicing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000105"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000013","legacy_id":"P00013","entity_type":"model","company_id":"CMP-000012","manufacturer":"Tokyo Seimitsu (ACCRETECH)","family_id":"PRD-000011","family_name":"Fully automatic blade dicing machine","model_number":"AD3000T-HC PLUS","model_identified":true,"name":"Fully automatic blade dicing machine · AD3000T-HC PLUS","equipment_id":"EQP-C01.01","equipment_code":"C01.01","equipment_label":"Mechanical Dicing","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":"Dicing","process_ids":["PRS-032"],"technology_text":"Twin-spindle blade dicing; FOUP and frame handling","technology_ids":["TEC-037"],"technology_basis":{"from_category":["TEC-037"],"from_laser_codes":[]},"application_text":"300 mm wafer dicing","application_ids":[],"material_text":null,"material_ids":[],"wafer":{"source_value":"300 mm","sizes_mm":[300],"nonstandard_mm":[],"range_mm":null,"unit":"mm"},"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Dicing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000106"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000014","legacy_id":"P00014","entity_type":"model","company_id":"CMP-000012","manufacturer":"Tokyo Seimitsu (ACCRETECH)","family_id":"PRD-000012","family_name":"Compact blade dicing machine","model_number":"SS10","model_identified":true,"name":"Compact blade dicing machine · SS10","equipment_id":"EQP-C01.01","equipment_code":"C01.01","equipment_label":"Mechanical Dicing","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":"Dicing","process_ids":["PRS-032"],"technology_text":"Blade dicing","technology_ids":["TEC-037"],"technology_basis":{"from_category":["TEC-037"],"from_laser_codes":[]},"application_text":"Up to 150 mm wafers","application_ids":[],"material_text":null,"material_ids":[],"wafer":{"source_value":"150 mm","sizes_mm":[150],"nonstandard_mm":[],"range_mm":null,"unit":"mm"},"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[{"parameter":"Spindle power","value":1.8,"unit":"kW","source_value":"1.8 kW","source_ids":["SRC-000104"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"}],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Dicing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000104"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000015","legacy_id":"P00015","entity_type":"model","company_id":"CMP-000045","manufacturer":"ASMPT ALSI (Advanced Laser Separation International)","family_id":"PRD-000013","family_name":"Laser grooving platform","model_number":"LASER1205 - Grooving UV USP","model_identified":true,"name":"Laser grooving platform · LASER1205 - Grooving UV USP","equipment_id":"EQP-C01.02","equipment_code":"C01.02","equipment_label":"Laser Dicing","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":"Dicing","process_ids":["PRS-032"],"technology_text":"Multi-beam ps UV grooving","technology_ids":["TEC-064","TEC-073","TEC-076","TEC-077","TEC-060"],"technology_basis":{"from_category":["TEC-060"],"from_laser_codes":["TEC-064","TEC-073","TEC-076","TEC-077"]},"application_text":"Low-k / metal stack grooving","application_ids":[],"material_text":null,"material_ids":[],"wafer":{"source_value":"10-250 um thick wafers","sizes_mm":[],"range_mm":null,"note":"Thickness stated, no diameter"},"thickness":null,"throughput":null,"accuracy":"<1.5 um (position accuracy & reproducibility)","footprint":null,"motion":null,"laser":{"types_text":"Laser Grooving; UV Processing; Ultrafast Laser Processing; Picosecond","type_codes":["L06","L15","L18","L19"],"source":null,"wavelength":"343 nm","average_power":null,"pulse_duration":"0.5-10 ps","pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[{"parameter":"Burr","value":"<1","unit":"um","source_value":"<1 um","source_ids":["SRC-000059","SRC-000063","SRC-000057"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"Wavelength","value":343,"unit":"nm","source_value":"343 nm","source_ids":["SRC-000059","SRC-000063","SRC-000057"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"Pulse length","value":"0.5-10","unit":"ps","source_value":"0.5-10 ps","source_ids":["SRC-000059","SRC-000063","SRC-000057"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"}],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Dicing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000059","SRC-000063","SRC-000057"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Throughput"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000016","legacy_id":"P00016","entity_type":"model","company_id":"CMP-000045","manufacturer":"ASMPT ALSI (Advanced Laser Separation International)","family_id":"PRD-000013","family_name":"Laser grooving platform","model_number":"LASER1205 - Grooving UV","model_identified":true,"name":"Laser grooving platform · LASER1205 - Grooving UV","equipment_id":"EQP-C01.02","equipment_code":"C01.02","equipment_label":"Laser Dicing","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":"Dicing","process_ids":["PRS-032"],"technology_text":"Multi-beam ns UV grooving","technology_ids":["TEC-064","TEC-073","TEC-060"],"technology_basis":{"from_category":["TEC-060"],"from_laser_codes":["TEC-064","TEC-073"]},"application_text":"Low-k grooving","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":"<1.5 um","footprint":null,"motion":null,"laser":{"types_text":"Laser Grooving; UV Processing","type_codes":["L06","L15"],"source":null,"wavelength":"355 nm","average_power":null,"pulse_duration":"ns range","pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[{"parameter":"Groove width","value":"10-150","unit":"um","source_value":"10-150 um","source_ids":["SRC-000059","SRC-000062","SRC-000057"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"Burr","value":"<3","unit":"um","source_value":"<3 um","source_ids":["SRC-000059","SRC-000062","SRC-000057"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"HAZ","value":"<2","unit":"um","source_value":"<2 um","source_ids":["SRC-000059","SRC-000062","SRC-000057"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"}],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Dicing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000059","SRC-000062","SRC-000057"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000017","legacy_id":"P00017","entity_type":"model","company_id":"CMP-000045","manufacturer":"ASMPT ALSI (Advanced Laser Separation International)","family_id":"PRD-000014","family_name":"Laser dicing platform","model_number":"LASER1205 - Dicing UVP","model_identified":true,"name":"Laser dicing platform · LASER1205 - Dicing UVP","equipment_id":"EQP-C01.02","equipment_code":"C01.02","equipment_label":"Laser Dicing","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":"Dicing","process_ids":["PRS-032"],"technology_text":"Multi-beam UV dicing with V-DOE","technology_ids":["TEC-060","TEC-073"],"technology_basis":{"from_category":["TEC-060"],"from_laser_codes":["TEC-060","TEC-073"]},"application_text":"Thin-wafer dicing incl. power devices","application_ids":["APP-010"],"material_text":null,"material_ids":[],"wafer":{"source_value":"10-250 um thick","sizes_mm":[],"range_mm":null,"note":"Thickness stated, no diameter"},"thickness":"10-250 um","throughput":null,"accuracy":"<1.5 um","footprint":null,"motion":null,"laser":{"types_text":"Laser Dicing; UV Processing","type_codes":["L02","L15"],"source":null,"wavelength":"355 nm","average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[{"parameter":"Kerf on 100 um Si","value":"<12","unit":"um","source_value":"<12 um","source_ids":["SRC-000059","SRC-000060","SRC-000064"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"Die strength","value":"450-500","unit":"MPa","source_value":"450-500 MPa","source_ids":["SRC-000059","SRC-000060","SRC-000064"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"}],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Dicing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000059","SRC-000060","SRC-000064"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Throughput"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2024-09-18","review_due":"2027-09-29"}},{"id":"MDL-000018","legacy_id":"P00018","entity_type":"model","company_id":"CMP-000045","manufacturer":"ASMPT ALSI (Advanced Laser Separation International)","family_id":"PRD-000014","family_name":"Laser dicing platform","model_number":"LASER1205 - Dicing IR","model_identified":true,"name":"Laser dicing platform · LASER1205 - Dicing IR","equipment_id":"EQP-C01.02","equipment_code":"C01.02","equipment_label":"Laser Dicing","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":"Dicing","process_ids":["PRS-032"],"technology_text":"Multi-beam IR dicing","technology_ids":["TEC-060","TEC-075"],"technology_basis":{"from_category":["TEC-060"],"from_laser_codes":["TEC-060","TEC-075"]},"application_text":"Dicing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Dicing; IR Laser Processing","type_codes":["L02","L17"],"source":null,"wavelength":"1064 nm","average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Dicing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000059"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000019","legacy_id":"P00019","entity_type":"model","company_id":"CMP-000045","manufacturer":"ASMPT ALSI (Advanced Laser Separation International)","family_id":"PRD-000015","family_name":"Laser dicing & grooving (HVM)","model_number":"LASER1206","model_identified":true,"name":"Laser dicing & grooving (HVM) · LASER1206","equipment_id":"EQP-C01.02","equipment_code":"C01.02","equipment_label":"Laser Dicing","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":"Dicing","process_ids":["PRS-032"],"technology_text":"Dicing & grooving for high-volume manufacturing","technology_ids":["TEC-060","TEC-064"],"technology_basis":{"from_category":["TEC-060"],"from_laser_codes":["TEC-060","TEC-064"]},"application_text":"HVM singulation","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Dicing; Laser Grooving","type_codes":["L02","L06"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Dicing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000061"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000020","legacy_id":"P00020","entity_type":"model","company_id":"CMP-000077","manufacturer":"EO Technics","family_id":"PRD-000016","family_name":"Laser grooving system","model_number":"LMC3200G","model_identified":true,"name":"Laser grooving system · LMC3200G","equipment_id":"EQP-C01.02","equipment_code":"C01.02","equipment_label":"Laser Dicing","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":"Dicing","process_ids":["PRS-032"],"technology_text":"Removes low-k and metal pattern layers on the sawlane","technology_ids":["TEC-064","TEC-062","TEC-060"],"technology_basis":{"from_category":["TEC-060"],"from_laser_codes":["TEC-064","TEC-062"]},"application_text":"Pre-dicing grooving","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Grooving; Laser Ablation","type_codes":["L06","L04"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Dicing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000065"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000021","legacy_id":"P00021","entity_type":"model","company_id":"CMP-000077","manufacturer":"EO Technics","family_id":"PRD-000017","family_name":"Laser dicing system","model_number":"LMC3200D","model_identified":true,"name":"Laser dicing system · LMC3200D","equipment_id":"EQP-C01.02","equipment_code":"C01.02","equipment_label":"Laser Dicing","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":"Dicing","process_ids":["PRS-032"],"technology_text":"Laser dicing","technology_ids":["TEC-060"],"technology_basis":{"from_category":["TEC-060"],"from_laser_codes":["TEC-060"]},"application_text":"Wafer dicing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Dicing","type_codes":["L02"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Dicing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000065"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000022","legacy_id":"P00022","entity_type":"model","company_id":"CMP-000077","manufacturer":"EO Technics","family_id":"PRD-000018","family_name":"Laser marker (strip/tray/wafer)","model_number":null,"model_identified":false,"name":"Laser marker (strip/tray/wafer)","equipment_id":"EQP-C26","equipment_code":"C26","equipment_label":"Laser Marking","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS14","legacy_process_name":"Packaging","process_ids":["PRS-038"],"technology_text":"Laser marking","technology_ids":["TEC-059"],"technology_basis":{"from_category":["TEC-059"],"from_laser_codes":["TEC-059"]},"application_text":"Package and wafer marking","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Marking","type_codes":["L01"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Marking","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000065","SRC-000066"],"source_age":"AGING","freshness":"Needs Review","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026","review_due":"2027-09-29"}},{"id":"MDL-000023","legacy_id":"P00023","entity_type":"model","company_id":"CMP-000077","manufacturer":"EO Technics","family_id":"PRD-000019","family_name":"WLCSP wafer back-side marker","model_number":null,"model_identified":false,"name":"WLCSP wafer back-side marker","equipment_id":"EQP-C26","equipment_code":"C26","equipment_label":"Laser Marking","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS14","legacy_process_name":"Packaging","process_ids":["PRS-038"],"technology_text":"Laser marking","technology_ids":["TEC-059"],"technology_basis":{"from_category":["TEC-059"],"from_laser_codes":["TEC-059"]},"application_text":"WLCSP backside marking","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Marking","type_codes":["L01"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Marking","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000066"],"source_age":"AGING","freshness":"Needs Review","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026","review_due":"2027-09-29"}},{"id":"MDL-000024","legacy_id":"P00024","entity_type":"model","company_id":"CMP-000077","manufacturer":"EO Technics","family_id":"PRD-000020","family_name":"Wafer laser annealing","model_number":null,"model_identified":false,"name":"Wafer laser annealing","equipment_id":"EQP-A14","equipment_code":"A14","equipment_label":"Laser Annealing","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":"Thermal Processing","process_ids":["PRS-023"],"technology_text":"Laser annealing (IGBT thin wafers 50-150 um, green - Tier 3)","technology_ids":["TEC-067","TEC-074"],"technology_basis":{"from_category":["TEC-067"],"from_laser_codes":["TEC-067","TEC-074"]},"application_text":"Power device backside activation","application_ids":["APP-010"],"material_text":null,"material_ids":[],"wafer":null,"thickness":"50-150 um (Tier 3)","throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Annealing; Green Laser Processing","type_codes":["L09","L16"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Annealing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000066","SRC-000068"],"source_age":"AGING","freshness":"Needs Review","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026","review_due":"2027-09-29"}},{"id":"MDL-000025","legacy_id":"P00025","entity_type":"model","company_id":"CMP-000077","manufacturer":"EO Technics","family_id":"PRD-000021","family_name":"Laser debonding system","model_number":null,"model_identified":false,"name":"Laser debonding system","equipment_id":"EQP-C18","equipment_code":"C18","equipment_label":"Wafer Bonding","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":"Assembly","process_ids":["PRS-051","PRS-052"],"technology_text":"Nanosecond UV laser, flat-top beam","technology_ids":["TEC-069","TEC-073","TEC-044"],"technology_basis":{"from_category":["TEC-044"],"from_laser_codes":["TEC-069","TEC-073"]},"application_text":"Temporary-bond carrier release","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Debonding; UV Processing","type_codes":["L11","L15"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":"ns","pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"ATMP Equipment","notes":null,"reclassified":null,"batch":"Batch 1","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000068","SRC-000065"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000026","legacy_id":"P00026","entity_type":"model","company_id":"CMP-000077","manufacturer":"EO Technics","family_id":"PRD-000022","family_name":"Q-switched pulsed fiber laser (in-house)","model_number":"EF20P-QSF","model_identified":true,"name":"Q-switched pulsed fiber laser (in-house) · EF20P-QSF","equipment_id":null,"equipment_code":"BOM01","equipment_label":"BOM: Laser Source","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000010","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"Q-switched fiber laser","technology_ids":["TEC-080"],"technology_basis":{"from_category":[],"from_laser_codes":["TEC-080"]},"application_text":"Source for EO Technics markers","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Fiber Laser","type_codes":["L22"],"source":null,"wavelength":null,"average_power":"20 W (max)","pulse_duration":null,"pulse_energy":"1 mJ","repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Tier-4 listing","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"UNVERIFIED","confidence":{"level":"UNVERIFIED"},"source_ids":["SRC-000069"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"UNVERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":null,"latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000027","legacy_id":"P00027","entity_type":"model","company_id":"CMP-000141","manufacturer":"3D-Micromac","family_id":"PRD-000023","family_name":"Wafer dicing system (TLS)","model_number":"microDICE","model_identified":true,"name":"Wafer dicing system (TLS) · microDICE","equipment_id":"EQP-C01.02","equipment_code":"C01.02","equipment_label":"Laser Dicing","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":"Dicing","process_ids":["PRS-032"],"technology_text":"Thermal Laser Separation (TLS-Dicing)","technology_ids":["TEC-060","TEC-065"],"technology_basis":{"from_category":["TEC-060"],"from_laser_codes":["TEC-060","TEC-065"]},"application_text":"Separation of Si, SiC, Ge, GaAs; high-power diodes","application_ids":["APP-011"],"material_text":"Si, SiC, Ge, GaAs","material_ids":["MAT-001","MAT-003","MAT-005","MAT-008"],"wafer":null,"thickness":null,"throughput":"200 mm/s (dicing speed, S0074)","accuracy":"0.001 mm (Tier 3)","footprint":null,"motion":null,"laser":{"types_text":"Laser Dicing; Laser Cutting","type_codes":["L02","L07"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":"200 mm/s","material":"Si, SiC, Ge, GaAs"},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Volume-production adoption by unnamed diode maker (S0073, 2016)","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Dicing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000070","SRC-000073","SRC-000074","SRC-000075","SRC-000072"],"source_age":"AGING","freshness":"Needs Review","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-10","review_due":"2027-09-29"}},{"id":"MDL-000028","legacy_id":"P00028","entity_type":"model","company_id":"CMP-000141","manufacturer":"3D-Micromac","family_id":"PRD-000024","family_name":"Laser annealing system","model_number":"microPRO XS OCF","model_identified":true,"name":"Laser annealing system · microPRO XS OCF","equipment_id":"EQP-A14","equipment_code":"A14","equipment_label":"Laser Annealing","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":"Thermal Processing","process_ids":["PRS-023"],"technology_text":"UV DPSS laser annealing","technology_ids":["TEC-067","TEC-073","TEC-081"],"technology_basis":{"from_category":["TEC-067"],"from_laser_codes":["TEC-067","TEC-073","TEC-081"]},"application_text":"Ohmic contact formation (OCF)","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Annealing; UV Processing; DPSS","type_codes":["L09","L15","L23"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Annealing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000071"],"source_age":"STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-06","review_due":"2027-09-29"}},{"id":"MDL-000029","legacy_id":"P00029","entity_type":"model","company_id":"CMP-000141","manufacturer":"3D-Micromac","family_id":"PRD-000024","family_name":"Laser annealing system","model_number":"microVEGA xMR","model_identified":true,"name":"Laser annealing system · microVEGA xMR","equipment_id":"EQP-A14","equipment_code":"A14","equipment_label":"Laser Annealing","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":"Thermal Processing","process_ids":["PRS-023"],"technology_text":"Laser annealing","technology_ids":["TEC-067"],"technology_basis":{"from_category":["TEC-067"],"from_laser_codes":["TEC-067"]},"application_text":"Magnetic (xMR) sensors","application_ids":["APP-015"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Annealing","type_codes":["L09"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Annealing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000071"],"source_age":"STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-06","review_due":"2027-09-29"}},{"id":"MDL-000030","legacy_id":"P00030","entity_type":"model","company_id":"CMP-000142","manufacturer":"Synova","family_id":"PRD-000025","family_name":"Laser MicroJet dicing machine","model_number":"LDS 300 M","model_identified":true,"name":"Laser MicroJet dicing machine · LDS 300 M","equipment_id":"EQP-C01.02","equipment_code":"C01.02","equipment_label":"Laser Dicing","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":"Dicing","process_ids":["PRS-032"],"technology_text":"Water-jet-guided DPSS laser","technology_ids":["TEC-060","TEC-074","TEC-075","TEC-081"],"technology_basis":{"from_category":["TEC-060"],"from_laser_codes":["TEC-060","TEC-074","TEC-075","TEC-081"]},"application_text":"Thin-wafer (<50 um) dicing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":"Up to 200 mm/s (thin wafers)","accuracy":"+/-3 um tolerance; +/-1 um repeatability (Tier 3)","footprint":null,"motion":"2-axis, 300 x 300 mm (Tier 3)","laser":{"types_text":"Laser Dicing; Green Laser Processing; IR Laser Processing; DPSS","type_codes":["L02","L16","L17","L23"],"source":"N/A (DPSS Nd:YAG, maker not stated)","wavelength":"532 / 1064 nm (Tier 3)","average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":"Up to 200 mm/s","material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Dicing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000076","SRC-000077"],"source_age":"STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Wafer / substrate size"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-07","review_due":"2027-09-29"}},{"id":"MDL-000031","legacy_id":"P00031","entity_type":"model","company_id":"CMP-000142","manufacturer":"Synova","family_id":"PRD-000026","family_name":"Laser dicing & edge grinding system","model_number":"LDGS 300 A","model_identified":true,"name":"Laser dicing & edge grinding system · LDGS 300 A","equipment_id":"EQP-C01.02","equipment_code":"C01.02","equipment_label":"Laser Dicing","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":"Dicing","process_ids":["PRS-032"],"technology_text":"Laser MicroJet; fully automatic dicing + edge grinding","technology_ids":["TEC-060","TEC-065"],"technology_basis":{"from_category":["TEC-060"],"from_laser_codes":["TEC-060","TEC-065"]},"application_text":"Wafer dicing and edge grinding","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Dicing; Laser Cutting","type_codes":["L02","L07"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Dicing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000078"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000032","legacy_id":"P00032","entity_type":"model","company_id":"CMP-000142","manufacturer":"Synova","family_id":"PRD-000027","family_name":"3-axis laser cutting system","model_number":"LCS 303","model_identified":true,"name":"3-axis laser cutting system · LCS 303","equipment_id":"EQP-F07","equipment_code":"F07","equipment_label":"Dicing","category_group":"F","segment":"Back-End","market_segment":"Power Semiconductor","is_component":false,"component_class_id":null,"legacy_process_step":null,"legacy_process_name":null,"process_ids":["PRS-032"],"technology_text":"Laser MicroJet","technology_ids":["TEC-065"],"technology_basis":{"from_category":[],"from_laser_codes":["TEC-065"]},"application_text":"SiC wafer downsizing, notch and flat","application_ids":["APP-010","APP-011"],"material_text":"SiC","material_ids":["MAT-003"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Cutting","type_codes":["L07"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":"SiC"},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000079"],"source_age":"STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2024-12","review_due":"2027-09-29"}},{"id":"MDL-000033","legacy_id":"P00033","entity_type":"model","company_id":"CMP-000142","manufacturer":"Synova","family_id":"PRD-000028","family_name":"5-axis laser cutting system","model_number":"LCS 305","model_identified":true,"name":"5-axis laser cutting system · LCS 305","equipment_id":"EQP-F07","equipment_code":"F07","equipment_label":"Dicing","category_group":"F","segment":"Back-End","market_segment":"Power Semiconductor","is_component":false,"component_class_id":null,"legacy_process_step":null,"legacy_process_name":null,"process_ids":["PRS-032"],"technology_text":"Laser MicroJet","technology_ids":["TEC-065"],"technology_basis":{"from_category":[],"from_laser_codes":["TEC-065"]},"application_text":"SiC wafer edge profiling (no chipping claim)","application_ids":["APP-010","APP-011"],"material_text":"SiC","material_ids":["MAT-003"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Cutting","type_codes":["L07"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":"SiC"},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Launched 2024-06-11","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000080"],"source_age":"VERY_STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2024-06-11","review_due":"2027-09-29"}},{"id":"MDL-000034","legacy_id":"P00034","entity_type":"model","company_id":"CMP-000143","manufacturer":"LPKF Laser & Electronics","family_id":"PRD-000029","family_name":"LIDE glass wafer system","model_number":"Vitrion S 5000","model_identified":true,"name":"LIDE glass wafer system · Vitrion S 5000","equipment_id":"EQP-D14","equipment_code":"D14","equipment_label":"TGV","category_group":"D","segment":"Advanced Packaging","market_segment":"Advanced Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PSX5","legacy_process_name":"Advanced Packaging Substrates & Interposers","process_ids":["PRS-044","PRS-053"],"technology_text":"Laser-Induced Deep Etching (LIDE)","technology_ids":["TEC-063","TEC-072","TEC-054"],"technology_basis":{"from_category":["TEC-054"],"from_laser_codes":["TEC-063","TEC-072"]},"application_text":"TGV / glass wafer structuring","application_ids":["APP-019"],"material_text":"Glass 0.3-3 mm","material_ids":["MAT-010"],"wafer":{"source_value":"100/150/200/300 mm","sizes_mm":[100,150,200,300],"nonstandard_mm":[],"range_mm":null,"unit":"mm"},"thickness":null,"throughput":null,"accuracy":null,"footprint":"1,800 x 2,200 x 3,000 mm","motion":null,"laser":{"types_text":"Laser Drilling; Laser Micromachining","type_codes":["L05","L14"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":"Glass 0.3-3 mm"},"specs":[{"parameter":"Glass thickness","value":"0.3-3","unit":"mm","source_value":"0.3-3 mm","source_ids":["SRC-000083","SRC-000086"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"Load ports","value":"2 FOUP","unit":null,"source_value":"2 FOUP","source_ids":["SRC-000083","SRC-000086"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"Interface","value":"SECS/GEM","unit":null,"source_value":"SECS/GEM","source_ids":["SRC-000083","SRC-000086"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"}],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000083","SRC-000086"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2024-05-13","review_due":"2027-09-29"}},{"id":"MDL-000035","legacy_id":"P00035","entity_type":"model","company_id":"CMP-000143","manufacturer":"LPKF Laser & Electronics","family_id":"PRD-000030","family_name":"Glass substrate panel system","model_number":"NEXAR","model_identified":true,"name":"Glass substrate panel system · NEXAR","equipment_id":"EQP-D18","equipment_code":"D18","equipment_label":"Glass Interposer","category_group":"D","segment":"Advanced Packaging","market_segment":"Advanced Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PSX5","legacy_process_name":"Advanced Packaging Substrates & Interposers","process_ids":["PRS-044","PRS-048"],"technology_text":"LIDE for panel glass cores","technology_ids":["TEC-063","TEC-072","TEC-049"],"technology_basis":{"from_category":["TEC-049"],"from_laser_codes":["TEC-063","TEC-072"]},"application_text":"Glass core substrates / TGV for advanced packaging","application_ids":["APP-019"],"material_text":"Glass 0.2-1.1 mm","material_ids":["MAT-010"],"wafer":null,"thickness":"0.2-1.1 mm","throughput":null,"accuracy":"+/-5 um","footprint":null,"motion":null,"laser":{"types_text":"Laser Drilling; Laser Micromachining","type_codes":["L05","L14"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":"Glass 0.2-1.1 mm"},"specs":[{"parameter":"Via diameter (min)","value":5,"unit":"um","source_value":"5 um","source_ids":["SRC-000082","SRC-000084"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"Aspect ratio","value":"up to 1:50","unit":null,"source_value":"up to 1:50","source_ids":["SRC-000082","SRC-000084"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"Panel size","value":"515 x 510","unit":"mm","source_value":"515 x 510 mm","source_ids":["SRC-000082","SRC-000084"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"NG rate","value":"<5","unit":"ppm","source_value":"<5 ppm","source_ids":["SRC-000082","SRC-000084"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"}],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercializing","maturity_evidence":"Mass production inflection expected 2027 (S0084)","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000082","SRC-000084"],"source_age":"CURRENT","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-04","review_due":"2027-09-29"}},{"id":"MDL-000036","legacy_id":"P00036","entity_type":"model","company_id":"CMP-000143","manufacturer":"LPKF Laser & Electronics","family_id":"PRD-000031","family_name":"Laser glass bonding","model_number":"NEXAR BOND","model_identified":true,"name":"Laser glass bonding · NEXAR BOND","equipment_id":"EQP-C31","equipment_code":"C31","equipment_label":"Laser Welding","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":"Assembly","process_ids":[],"technology_text":"Laser glass welding","technology_ids":["TEC-066"],"technology_basis":{"from_category":["TEC-066"],"from_laser_codes":["TEC-066"]},"application_text":"Glass-to-glass bonding","application_ids":[],"material_text":null,"material_ids":["MAT-010"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Welding","type_codes":["L08"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":"250 mm/s","material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercializing","maturity_evidence":"Listed in NEXAR family (S0082)","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Welding","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000082"],"source_age":"AGING","freshness":"Needs Review","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026","review_due":"2027-09-29"}},{"id":"MDL-000037","legacy_id":"P00037","entity_type":"model","company_id":"CMP-000144","manufacturer":"InnoLas Semiconductor","family_id":"PRD-000032","family_name":"Laser wafer marking (manual/semi-auto family)","model_number":"IL 600 / IL 1000 / IL 2000 / IL 3000","model_identified":true,"name":"Laser wafer marking (manual/semi-auto family) · IL 600 / IL 1000 / IL 2000 / IL 3000","equipment_id":"EQP-C26","equipment_code":"C26","equipment_label":"Laser Marking","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS14","legacy_process_name":"Packaging","process_ids":["PRS-038"],"technology_text":"Laser wafer marking","technology_ids":["TEC-059"],"technology_basis":{"from_category":["TEC-059"],"from_laser_codes":["TEC-059"]},"application_text":"Wafer ID marking 2 inch-200 mm","application_ids":[],"material_text":null,"material_ids":[],"wafer":{"source_value":"2 inch-200 mm","sizes_mm":[],"nonstandard_mm":[],"range_mm":{"min":50,"max":200},"unit":"mm"},"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Marking","type_codes":["L01"],"source":null,"wavelength":"355 / 532 / 1064 nm beam-expander options","average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Marking","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000229"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000038","legacy_id":"P00038","entity_type":"model","company_id":"CMP-000144","manufacturer":"InnoLas Semiconductor","family_id":"PRD-000033","family_name":"Laser wafer marking (cleanroom family)","model_number":"IL C3000 / IL C3000 HT","model_identified":true,"name":"Laser wafer marking (cleanroom family) · IL C3000 / IL C3000 HT","equipment_id":"EQP-C26","equipment_code":"C26","equipment_label":"Laser Marking","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS14","legacy_process_name":"Packaging","process_ids":["PRS-038"],"technology_text":"Laser wafer marking","technology_ids":["TEC-059"],"technology_basis":{"from_category":["TEC-059"],"from_laser_codes":["TEC-059"]},"application_text":"Wafer ID marking","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Marking","type_codes":["L01"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Marking","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000229"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000039","legacy_id":"P00039","entity_type":"model","company_id":"CMP-000144","manufacturer":"InnoLas Semiconductor","family_id":"PRD-000034","family_name":"Laser wafer marking (300 mm)","model_number":"IL 4000 / IL C4000","model_identified":true,"name":"Laser wafer marking (300 mm) · IL 4000 / IL C4000","equipment_id":"EQP-C26","equipment_code":"C26","equipment_label":"Laser Marking","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS14","legacy_process_name":"Packaging","process_ids":["PRS-038"],"technology_text":"Laser wafer marking in ISO 3 minienvironment, FOUP","technology_ids":["TEC-059"],"technology_basis":{"from_category":["TEC-059"],"from_laser_codes":["TEC-059"]},"application_text":"300/450 mm wafer marking","application_ids":[],"material_text":null,"material_ids":[],"wafer":{"source_value":"300 / 450 mm","sizes_mm":[300,450],"nonstandard_mm":[],"range_mm":null,"unit":"mm"},"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Marking","type_codes":["L01"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Marking","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000229"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000040","legacy_id":"P00040","entity_type":"model","company_id":"CMP-000144","manufacturer":"InnoLas Semiconductor","family_id":"PRD-000035","family_name":"Wafer sorter","model_number":"IL 2600 / IL C3200 / IL C3600 / IL C3800 / IL C4600","model_identified":true,"name":"Wafer sorter · IL 2600 / IL C3200 / IL C3600 / IL C3800 / IL C4600","equipment_id":"EQP-A34","equipment_code":"A34","equipment_label":"Wafer Handling","category_group":"A","segment":"Automation & Facilities","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":"Factory Automation & Infrastructure","process_ids":["PRS-057"],"technology_text":"Wafer sorting","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer handling/sorting","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Wafer Handling","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000229"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000041","legacy_id":"P00041","entity_type":"model","company_id":"CMP-000117","manufacturer":"Han's Laser Technology","family_id":"PRD-000036","family_name":"Laser stealth dicing (SiC)","model_number":"Di-Sync","model_identified":true,"name":"Laser stealth dicing (SiC) · Di-Sync","equipment_id":"EQP-C01.03","equipment_code":"C01.03","equipment_label":"Stealth Dicing","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":"Dicing","process_ids":["PRS-032"],"technology_text":"Single-head laser stealth dicing","technology_ids":["TEC-060","TEC-061"],"technology_basis":{"from_category":["TEC-061"],"from_laser_codes":["TEC-060","TEC-061"]},"application_text":"SiC wafer dicing","application_ids":["APP-011"],"material_text":"SiC","material_ids":["MAT-003"],"wafer":null,"thickness":null,"throughput":"<15 min per wafer (vs ~40 min, company claim)","accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Dicing; Stealth Dicing","type_codes":["L02","L03"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":"SiC"},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Dicing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000109"],"source_age":"STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Wafer / substrate size","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-08","review_due":"2027-09-29"}},{"id":"MDL-000042","legacy_id":"P00042","entity_type":"model","company_id":"CMP-000118","manufacturer":"HGTECH (Huagong Tech)","family_id":"PRD-000037","family_name":"Fully automatic wafer laser modification dicing machine","model_number":null,"model_identified":false,"name":"Fully automatic wafer laser modification dicing machine","equipment_id":"EQP-C01.03","equipment_code":"C01.03","equipment_label":"Stealth Dicing","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":"Dicing","process_ids":["PRS-032"],"technology_text":"Laser internal modification dicing","technology_ids":["TEC-060","TEC-061"],"technology_basis":{"from_category":["TEC-061"],"from_laser_codes":["TEC-060","TEC-061"]},"application_text":"Wafer dicing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Dicing; Stealth Dicing","type_codes":["L02","L03"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[{"parameter":"Chipping (claim)","value":"<5","unit":"um","source_value":"<5 um","source_ids":["SRC-000107"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"}],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Developed Aug 2023 (company release)","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Dicing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000107"],"source_age":"STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-02-13","review_due":"2027-09-29"}},{"id":"MDL-000043","legacy_id":"P00043","entity_type":"model","company_id":"CMP-000119","manufacturer":"Suzhou Delphi Laser","family_id":"PRD-000038","family_name":"Wafer-level laser micro-drilling system (TGV)","model_number":"AWD20","model_identified":true,"name":"Wafer-level laser micro-drilling system (TGV) · AWD20","equipment_id":"EQP-D14","equipment_code":"D14","equipment_label":"TGV","category_group":"D","segment":"Advanced Packaging","market_segment":"Advanced Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PSX5","legacy_process_name":"Advanced Packaging Substrates & Interposers","process_ids":["PRS-044","PRS-053"],"technology_text":"Laser micro-drilling","technology_ids":["TEC-063","TEC-072","TEC-054"],"technology_basis":{"from_category":["TEC-054"],"from_laser_codes":["TEC-063","TEC-072"]},"application_text":"Through-glass vias","application_ids":["APP-019"],"material_text":"Glass","material_ids":["MAT-010"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Drilling; Laser Micromachining","type_codes":["L05","L14"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":"Glass"},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000217"],"source_age":"STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025","review_due":"2027-09-29"}},{"id":"MDL-000044","legacy_id":"P00044","entity_type":"model","company_id":"CMP-000119","manufacturer":"Suzhou Delphi Laser","family_id":"PRD-000039","family_name":"Wafer laser dicing","model_number":null,"model_identified":false,"name":"Wafer laser dicing","equipment_id":"EQP-C01.02","equipment_code":"C01.02","equipment_label":"Laser Dicing","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":"Dicing","process_ids":["PRS-032"],"technology_text":"Laser dicing","technology_ids":["TEC-060"],"technology_basis":{"from_category":["TEC-060"],"from_laser_codes":["TEC-060"]},"application_text":"Si, SiC, GaAs, LT, LN, glass","application_ids":["APP-011"],"material_text":"Si, SiC, GaAs, LT, LN, glass","material_ids":["MAT-001","MAT-003","MAT-005","MAT-010","MAT-011"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Dicing","type_codes":["L02"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":"Si, SiC, GaAs, LT, LN, glass"},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Dicing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000217"],"source_age":"STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025","review_due":"2027-09-29"}},{"id":"MDL-000045","legacy_id":"P00045","entity_type":"model","company_id":"CMP-000119","manufacturer":"Suzhou Delphi Laser","family_id":"PRD-000040","family_name":"SiC ingot laser slicing","model_number":null,"model_identified":false,"name":"SiC ingot laser slicing","equipment_id":"EQP-F01","equipment_code":"F01","equipment_label":"SiC wafer processing","category_group":"F","segment":"Front-End","market_segment":"Power Semiconductor","is_component":false,"component_class_id":null,"legacy_process_step":null,"legacy_process_name":null,"process_ids":["PRS-003"],"technology_text":"Laser slicing","technology_ids":["TEC-065","TEC-072"],"technology_basis":{"from_category":[],"from_laser_codes":["TEC-065","TEC-072"]},"application_text":"SiC wafering","application_ids":["APP-010","APP-011"],"material_text":"SiC","material_ids":["MAT-003"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Cutting; Laser Micromachining","type_codes":["L07","L14"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":"SiC"},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000217"],"source_age":"STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025","review_due":"2027-09-29"}},{"id":"MDL-000046","legacy_id":"P00046","entity_type":"model","company_id":"CMP-000119","manufacturer":"Suzhou Delphi Laser","family_id":"PRD-000041","family_name":"Laser annealing","model_number":null,"model_identified":false,"name":"Laser annealing","equipment_id":"EQP-A14","equipment_code":"A14","equipment_label":"Laser Annealing","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":"Thermal Processing","process_ids":["PRS-023"],"technology_text":"Laser annealing","technology_ids":["TEC-067"],"technology_basis":{"from_category":["TEC-067"],"from_laser_codes":["TEC-067"]},"application_text":"Wafer annealing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Annealing","type_codes":["L09"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Annealing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000217"],"source_age":"STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025","review_due":"2027-09-29"}},{"id":"MDL-000047","legacy_id":"P00047","entity_type":"model","company_id":"CMP-000119","manufacturer":"Suzhou Delphi Laser","family_id":"PRD-000042","family_name":"Laser debonding","model_number":null,"model_identified":false,"name":"Laser debonding","equipment_id":"EQP-C18","equipment_code":"C18","equipment_label":"Wafer Bonding","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":"Assembly","process_ids":["PRS-051","PRS-052"],"technology_text":"Laser debonding","technology_ids":["TEC-069","TEC-044"],"technology_basis":{"from_category":["TEC-044"],"from_laser_codes":["TEC-069"]},"application_text":"Carrier release","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Debonding","type_codes":["L11"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"ATMP Equipment","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000217"],"source_age":"STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025","review_due":"2027-09-29"}},{"id":"MDL-000048","legacy_id":"P00048","entity_type":"model","company_id":"CMP-000120","manufacturer":"Wuhan DR Laser Technology","family_id":"PRD-000043","family_name":"TGV laser micro-hole equipment","model_number":null,"model_identified":false,"name":"TGV laser micro-hole equipment","equipment_id":"EQP-D14","equipment_code":"D14","equipment_label":"TGV","category_group":"D","segment":"Advanced Packaging","market_segment":"Advanced Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PSX5","legacy_process_name":"Advanced Packaging Substrates & Interposers","process_ids":["PRS-044","PRS-053"],"technology_text":"Laser micro-hole drilling","technology_ids":["TEC-063","TEC-054"],"technology_basis":{"from_category":["TEC-054"],"from_laser_codes":["TEC-063"]},"application_text":"Chip packaging and display chip packaging","application_ids":["APP-017","APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Drilling","type_codes":["L05"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Headline only (page 403)","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000218"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000049","legacy_id":"P00049","entity_type":"model","company_id":"CMP-000121","manufacturer":"Suzhou Maxwell Technologies","family_id":"PRD-000044","family_name":"Wafer laser cutting & grooving","model_number":null,"model_identified":false,"name":"Wafer laser cutting & grooving","equipment_id":"EQP-C01.02","equipment_code":"C01.02","equipment_label":"Laser Dicing","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":"Dicing","process_ids":["PRS-032"],"technology_text":"Laser cutting/grooving","technology_ids":["TEC-064","TEC-065","TEC-060"],"technology_basis":{"from_category":["TEC-060"],"from_laser_codes":["TEC-064","TEC-065"]},"application_text":"Wafer processing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Grooving; Laser Cutting","type_codes":["L06","L07"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Dicing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000219"],"source_age":"AGING","freshness":"Needs Review","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026","review_due":"2027-03-29"}},{"id":"MDL-000050","legacy_id":"P00050","entity_type":"model","company_id":"CMP-000078","manufacturer":"Philoptics","family_id":"PRD-000045","family_name":"TGV equipment for glass substrates","model_number":null,"model_identified":false,"name":"TGV equipment for glass substrates","equipment_id":"EQP-D14","equipment_code":"D14","equipment_label":"TGV","category_group":"D","segment":"Advanced Packaging","market_segment":"Advanced Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PSX5","legacy_process_name":"Advanced Packaging Substrates & Interposers","process_ids":["PRS-044","PRS-053"],"technology_text":"Laser TGV drilling (holes ~10 um; zero-defect claim on 2 mm glass)","technology_ids":["TEC-063","TEC-054"],"technology_basis":{"from_category":["TEC-054"],"from_laser_codes":["TEC-063"]},"application_text":"Glass core substrates up to 510 x 515 mm, 2 mm thick","application_ids":["APP-019"],"material_text":"Glass up to 2 mm","material_ids":["MAT-010"],"wafer":null,"thickness":"2 mm","throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Drilling","type_codes":["L05"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":"Glass up to 2 mm"},"specs":[{"parameter":"Panel size","value":"510 x 515","unit":"mm","source_value":"510 x 515 mm","source_ids":["SRC-000117","SRC-000116","SRC-000119"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"Hole size","value":"~10","unit":"um","source_value":"~10 um","source_ids":["SRC-000117","SRC-000116","SRC-000119"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"}],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Customer order/shipment documented (new global customer, 2026-09)","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000117","SRC-000116","SRC-000119"],"source_age":"CURRENT","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-09-29","review_due":"2027-09-29"}},{"id":"MDL-000051","legacy_id":"P00051","entity_type":"model","company_id":"CMP-000078","manufacturer":"Philoptics","family_id":"PRD-000046","family_name":"TGV hole inspection kit","model_number":null,"model_identified":false,"name":"TGV hole inspection kit","equipment_id":"EQP-A23","equipment_code":"A23","equipment_label":"Optical Inspection","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PS09","legacy_process_name":"Inspection","process_ids":["PRS-027"],"technology_text":"Inspection","technology_ids":["TEC-031"],"technology_basis":{"from_category":["TEC-031"],"from_laser_codes":[]},"application_text":"TGV inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Launched 2025","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Semiconductor Inspection","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000118"],"source_age":"STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-05","review_due":"2027-09-29"}},{"id":"MDL-000052","legacy_id":"P00052","entity_type":"model","company_id":"CMP-000079","manufacturer":"AP Systems","family_id":"PRD-000047","family_name":"Solid-state laser annealing (SLA) G8.6","model_number":null,"model_identified":false,"name":"Solid-state laser annealing (SLA) G8.6","equipment_id":"EQP-I07","equipment_code":"I07","equipment_label":"Laser annealing","category_group":"I","segment":"Display","market_segment":"Display/MicroLED","is_component":false,"component_class_id":null,"legacy_process_step":"PSX6","legacy_process_name":"Display / MicroLED Panel Processing","process_ids":["PRS-055"],"technology_text":"SLA with Coherent PYTHON DPSS (replaces excimer)","technology_ids":["TEC-067","TEC-081"],"technology_basis":{"from_category":["TEC-067"],"from_laser_codes":["TEC-067","TEC-081"]},"application_text":"OLED LTPS backplanes, Gen 8.6","application_ids":["APP-016","APP-017"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Annealing; DPSS","type_codes":["L09","L23"],"source":"Coherent / PYTHON","wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000226"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000053","legacy_id":"P00053","entity_type":"model","company_id":"CMP-000079","manufacturer":"AP Systems","family_id":"PRD-000048","family_name":"Excimer laser annealing (ELA) / LLO Gen 8.6","model_number":null,"model_identified":false,"name":"Excimer laser annealing (ELA) / LLO Gen 8.6","equipment_id":"EQP-I07","equipment_code":"I07","equipment_label":"Laser annealing","category_group":"I","segment":"Display","market_segment":"Display/MicroLED","is_component":false,"component_class_id":null,"legacy_process_step":"PSX6","legacy_process_name":"Display / MicroLED Panel Processing","process_ids":["PRS-055"],"technology_text":"ELA and LLO","technology_ids":["TEC-067","TEC-068","TEC-082"],"technology_basis":{"from_category":["TEC-067"],"from_laser_codes":["TEC-067","TEC-068","TEC-082"]},"application_text":"Visionox V5 Gen 8.6 (Hefei)","application_ids":["APP-016","APP-017"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Annealing; Laser Lift-Off; Excimer","type_codes":["L09","L10","L24"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Customer order/shipment documented","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000227","SRC-000248"],"source_age":"AGING","freshness":"Needs Review","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-11-21","review_due":"2027-09-29"}},{"id":"MDL-000054","legacy_id":"P00054","entity_type":"model","company_id":"CMP-000057","manufacturer":"Protec","family_id":"PRD-000049","family_name":"Laser-assisted bonder","model_number":null,"model_identified":false,"name":"Laser-assisted bonder","equipment_id":"EQP-C19","equipment_code":"C19","equipment_label":"Chip Bonding","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":"Assembly","process_ids":["PRS-035"],"technology_text":"Laser-assisted bonding (LAB)","technology_ids":["TEC-066"],"technology_basis":{"from_category":[],"from_laser_codes":["TEC-066"]},"application_text":"Flip-chip bonding","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Welding","type_codes":["L08"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"ATMP Equipment","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000228"],"source_age":"VERY_STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2023","review_due":"2027-09-29"}},{"id":"MDL-000055","legacy_id":"P00055","entity_type":"model","company_id":"CMP-000056","manufacturer":"PacTech","family_id":"PRD-000050","family_name":"Laser-assisted bonding equipment","model_number":null,"model_identified":false,"name":"Laser-assisted bonding equipment","equipment_id":"EQP-C19","equipment_code":"C19","equipment_label":"Chip Bonding","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":"Assembly","process_ids":["PRS-035"],"technology_text":"LAB","technology_ids":["TEC-066"],"technology_basis":{"from_category":[],"from_laser_codes":["TEC-066"]},"application_text":"Flip-chip / solder bonding","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Welding","type_codes":["L08"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"ATMP Equipment","notes":null,"reclassified":null,"batch":"Batch 1","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000244"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000056","legacy_id":"P00056","entity_type":"model","company_id":"CMP-000014","manufacturer":"Veeco Instruments","family_id":"PRD-000051","family_name":"Laser spike anneal","model_number":"LSA201","model_identified":true,"name":"Laser spike anneal · LSA201","equipment_id":"EQP-A14","equipment_code":"A14","equipment_label":"Laser Annealing","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":"Thermal Processing","process_ids":["PRS-023"],"technology_text":"Long-wavelength, Brewster-angle, p-polarized scanning laser with ambient-control micro-chamber","technology_ids":["TEC-067","TEC-075"],"technology_basis":{"from_category":["TEC-067"],"from_laser_codes":["TEC-067","TEC-075"]},"application_text":"Advanced logic (2 nm GAA HVM order)","application_ids":["APP-001"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Annealing; IR Laser Processing","type_codes":["L09","L17"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Customer order/shipment documented (2024-05-07, unnamed leading-edge customer)","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Annealing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000087","SRC-000088"],"source_age":"STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-06","review_due":"2027-09-29"}},{"id":"MDL-000057","legacy_id":"P00057","entity_type":"model","company_id":"CMP-000014","manufacturer":"Veeco Instruments","family_id":"PRD-000051","family_name":"Laser spike anneal","model_number":"LSA101","model_identified":true,"name":"Laser spike anneal · LSA101","equipment_id":"EQP-A14","equipment_code":"A14","equipment_label":"Laser Annealing","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":"Thermal Processing","process_ids":["PRS-023"],"technology_text":"Laser spike annealing","technology_ids":["TEC-067"],"technology_basis":{"from_category":["TEC-067"],"from_laser_codes":["TEC-067"]},"application_text":"Logic/memory annealing","application_ids":["APP-001","APP-005"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Annealing","type_codes":["L09"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"First shipment from San Jose facility 2021","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Annealing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000089","SRC-000090"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2021-11-22","review_due":"2027-09-29"}},{"id":"MDL-000058","legacy_id":"P00058","entity_type":"model","company_id":"CMP-000014","manufacturer":"Veeco Instruments","family_id":"PRD-000052","family_name":"Nanosecond annealing","model_number":"NSA500","model_identified":true,"name":"Nanosecond annealing · NSA500","equipment_id":"EQP-A13","equipment_code":"A13","equipment_label":"Annealing","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":"Thermal Processing","process_ids":["PRS-023"],"technology_text":"Nanosecond laser annealing","technology_ids":["TEC-067","TEC-028"],"technology_basis":{"from_category":["TEC-028"],"from_laser_codes":["TEC-067"]},"application_text":"Advanced logic","application_ids":["APP-001"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Annealing","type_codes":["L09"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Customer order/shipment documented","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000088"],"source_age":"VERY_STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2024-05-07","review_due":"2027-09-29"}},{"id":"MDL-000059","legacy_id":"P00059","entity_type":"model","company_id":"CMP-000174","manufacturer":"Sumitomo Heavy Industries (Mechatronics)","family_id":"PRD-000053","family_name":"Laser annealing","model_number":"SWA Green/Hybrid series","model_identified":true,"name":"Laser annealing · SWA Green/Hybrid series","equipment_id":"EQP-A14","equipment_code":"A14","equipment_label":"Laser Annealing","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":"Thermal Processing","process_ids":["PRS-023"],"technology_text":"Deep activation; double-pulse process","technology_ids":["TEC-067","TEC-074"],"technology_basis":{"from_category":["TEC-067"],"from_laser_codes":["TEC-067","TEC-074"]},"application_text":"Power devices (IGBT) activation","application_ids":["APP-010"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Annealing; Green Laser Processing","type_codes":["L09","L16"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Annealing","notes":">150 systems shipped since 2004 (Tier 4, S0092)","reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000223","SRC-000092"],"source_age":"CURRENT","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-09","review_due":"2027-09-29"}},{"id":"MDL-000060","legacy_id":"P00060","entity_type":"model","company_id":"CMP-000174","manufacturer":"Sumitomo Heavy Industries (Mechatronics)","family_id":"PRD-000053","family_name":"Laser annealing","model_number":"SWA UV series","model_identified":true,"name":"Laser annealing · SWA UV series","equipment_id":"EQP-A14","equipment_code":"A14","equipment_label":"Laser Annealing","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":"Thermal Processing","process_ids":["PRS-023"],"technology_text":"UV laser annealing","technology_ids":["TEC-067","TEC-073"],"technology_basis":{"from_category":["TEC-067"],"from_laser_codes":["TEC-067","TEC-073"]},"application_text":"SiC ohmic contact","application_ids":["APP-011"],"material_text":"SiC","material_ids":["MAT-003"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Annealing; UV Processing","type_codes":["L09","L15"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":"SiC"},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Annealing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000223"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000061","legacy_id":"P00061","entity_type":"model","company_id":"CMP-000175","manufacturer":"JSW Aktina System","family_id":"PRD-000054","family_name":"Laser annealing for silicidation","model_number":"YIELDSCAN","model_identified":true,"name":"Laser annealing for silicidation · YIELDSCAN","equipment_id":"EQP-A14","equipment_code":"A14","equipment_label":"Laser Annealing","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":"Thermal Processing","process_ids":["PRS-023"],"technology_text":"Laser annealing","technology_ids":["TEC-067"],"technology_basis":{"from_category":["TEC-067"],"from_laser_codes":["TEC-067"]},"application_text":"Silicidation","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Annealing","type_codes":["L09"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Annealing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000224"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000062","legacy_id":"P00062","entity_type":"model","company_id":"CMP-000175","manufacturer":"JSW Aktina System","family_id":"PRD-000055","family_name":"Laser annealing (display)","model_number":"YIELDSCAN SLA / MLA / ELA","model_identified":true,"name":"Laser annealing (display) · YIELDSCAN SLA / MLA / ELA","equipment_id":"EQP-I07","equipment_code":"I07","equipment_label":"Laser annealing","category_group":"I","segment":"Display","market_segment":"Display/MicroLED","is_component":false,"component_class_id":null,"legacy_process_step":"PSX6","legacy_process_name":"Display / MicroLED Panel Processing","process_ids":["PRS-055"],"technology_text":"Solid-state / micro-lens / excimer laser annealing","technology_ids":["TEC-067","TEC-082"],"technology_basis":{"from_category":["TEC-067"],"from_laser_codes":["TEC-067","TEC-082"]},"application_text":"LTPS backplanes","application_ids":["APP-016","APP-017"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Annealing; Excimer","type_codes":["L09","L24"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000224"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000063","legacy_id":"P00063","entity_type":"model","company_id":"CMP-000175","manufacturer":"JSW Aktina System","family_id":"PRD-000056","family_name":"Laser lift-off","model_number":"YIELDSCAN LLO","model_identified":true,"name":"Laser lift-off · YIELDSCAN LLO","equipment_id":"EQP-I06","equipment_code":"I06","equipment_label":"Laser lift-off","category_group":"I","segment":"Display","market_segment":"Display/MicroLED","is_component":false,"component_class_id":null,"legacy_process_step":"PSX6","legacy_process_name":"Display / MicroLED Panel Processing","process_ids":["PRS-054"],"technology_text":"Laser lift-off","technology_ids":["TEC-068"],"technology_basis":{"from_category":["TEC-068"],"from_laser_codes":["TEC-068"]},"application_text":"Flexible display / micro-LED","application_ids":["APP-016","APP-017"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Lift-Off","type_codes":["L10"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000224"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000064","legacy_id":"P00064","entity_type":"model","company_id":"CMP-000177","manufacturer":"LASSE (Laser Systems & Solutions of Europe)","family_id":"PRD-000057","family_name":"UV laser annealing","model_number":"LT-3100","model_identified":true,"name":"UV laser annealing · LT-3100","equipment_id":"EQP-A14","equipment_code":"A14","equipment_label":"Laser Annealing","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":"Thermal Processing","process_ids":["PRS-023"],"technology_text":"UV laser annealing","technology_ids":["TEC-067","TEC-073"],"technology_basis":{"from_category":["TEC-067"],"from_laser_codes":["TEC-067","TEC-073"]},"application_text":"Si IGBT and SiC backside contact","application_ids":["APP-010","APP-011"],"material_text":null,"material_ids":["MAT-001","MAT-003"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Annealing; UV Processing","type_codes":["L09","L15"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Annealing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000091"],"source_age":"VERY_STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2022-11","review_due":"2027-09-29"}},{"id":"MDL-000065","legacy_id":"P00065","entity_type":"model","company_id":"CMP-000177","manufacturer":"LASSE (Laser Systems & Solutions of Europe)","family_id":"PRD-000058","family_name":"Laser annealing","model_number":"QA-3000","model_identified":true,"name":"Laser annealing · QA-3000","equipment_id":"EQP-A14","equipment_code":"A14","equipment_label":"Laser Annealing","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":"Thermal Processing","process_ids":["PRS-023"],"technology_text":"Laser annealing","technology_ids":["TEC-067"],"technology_basis":{"from_category":["TEC-067"],"from_laser_codes":["TEC-067"]},"application_text":null,"application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Annealing","type_codes":["L09"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":"Tier-4 mention only","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Annealing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"UNVERIFIED","confidence":{"level":"UNVERIFIED"},"source_ids":["SRC-000092"],"source_age":"CURRENT","freshness":"Recent","quality_state":"UNVERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":null,"latest_source_date":"2026-09","review_due":"2027-03-29"}},{"id":"MDL-000066","legacy_id":"P00066","entity_type":"model","company_id":"CMP-000145","manufacturer":"Coherent Corp.","family_id":"PRD-000059","family_name":"Line-beam LLO system","model_number":"UVblade 380 / 750 / 1250","model_identified":true,"name":"Line-beam LLO system · UVblade 380 / 750 / 1250","equipment_id":"EQP-I06","equipment_code":"I06","equipment_label":"Laser lift-off","category_group":"I","segment":"Display","market_segment":"Display/MicroLED","is_component":false,"component_class_id":null,"legacy_process_step":"PSX6","legacy_process_name":"Display / MicroLED Panel Processing","process_ids":["PRS-054"],"technology_text":"308 nm excimer line beam","technology_ids":["TEC-068","TEC-082","TEC-073"],"technology_basis":{"from_category":["TEC-068"],"from_laser_codes":["TEC-068","TEC-082","TEC-073"]},"application_text":"Laser lift-off of polymer displays from glass carriers","application_ids":["APP-016","APP-017"],"material_text":null,"material_ids":["MAT-010"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Lift-Off; Excimer; UV Processing","type_codes":["L10","L24","L15"],"source":"Coherent","wavelength":"308 nm","average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[{"parameter":"Homogeneity (2 sigma)","value":1.8,"unit":"%","source_value":"1.8 %","source_ids":["SRC-000093"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"Depth of focus","value":"+/-200","unit":"um","source_value":"+/-200 um","source_ids":["SRC-000093"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"}],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000093"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000067","legacy_id":"P00067","entity_type":"model","company_id":"CMP-000145","manufacturer":"Coherent Corp.","family_id":"PRD-000060","family_name":"Excimer laser annealing","model_number":"LineBeam 750 / 1000 / 1300 / 1500","model_identified":true,"name":"Excimer laser annealing · LineBeam 750 / 1000 / 1300 / 1500","equipment_id":"EQP-I07","equipment_code":"I07","equipment_label":"Laser annealing","category_group":"I","segment":"Display","market_segment":"Display/MicroLED","is_component":false,"component_class_id":null,"legacy_process_step":"PSX6","legacy_process_name":"Display / MicroLED Panel Processing","process_ids":["PRS-055"],"technology_text":"308 nm excimer line beam (>1 kW)","technology_ids":["TEC-067","TEC-082"],"technology_basis":{"from_category":["TEC-067"],"from_laser_codes":["TEC-067","TEC-082"]},"application_text":"LTPS backplane annealing","application_ids":["APP-016","APP-017"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Annealing; Excimer","type_codes":["L09","L24"],"source":"Coherent","wavelength":"308 nm","average_power":">1 kW","pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[{"parameter":"Line length","value":"up to 750 (LineBeam 750)","unit":"mm","source_value":"up to 750 (LineBeam 750) mm","source_ids":["SRC-000096","SRC-000094"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"}],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000096","SRC-000094"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2022","review_due":"2027-09-29"}},{"id":"MDL-000068","legacy_id":"P00068","entity_type":"model","company_id":"CMP-000145","manufacturer":"Coherent Corp.","family_id":"PRD-000061","family_name":"MicroLED laser processing","model_number":"UVtransfer","model_identified":true,"name":"MicroLED laser processing · UVtransfer","equipment_id":"EQP-I08","equipment_code":"I08","equipment_label":"Mass transfer","category_group":"I","segment":"Display","market_segment":"Display/MicroLED","is_component":false,"component_class_id":null,"legacy_process_step":"PSX6","legacy_process_name":"Display / MicroLED Panel Processing","process_ids":["PRS-056"],"technology_text":"LLO + LIFT + repair/trimming","technology_ids":["TEC-068","TEC-070","TEC-071","TEC-082"],"technology_basis":{"from_category":[],"from_laser_codes":["TEC-068","TEC-070","TEC-071","TEC-082"]},"application_text":"MicroLED mass transfer and repair","application_ids":["APP-016","APP-017"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Lift-Off; Laser Repair; Laser Trimming; Excimer","type_codes":["L10","L12","L13","L24"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000095"],"source_age":"VERY_STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2021","review_due":"2027-09-29"}},{"id":"MDL-000069","legacy_id":"P00069","entity_type":"model","company_id":"CMP-000145","manufacturer":"Coherent Corp.","family_id":"PRD-000062","family_name":"DPSS laser source","model_number":"PYTHON","model_identified":true,"name":"DPSS laser source · PYTHON","equipment_id":null,"equipment_code":"BOM01","equipment_label":"BOM: Laser Source","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000010","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"Solid-state laser for SLA","technology_ids":["TEC-081"],"technology_basis":{"from_category":[],"from_laser_codes":["TEC-081"]},"application_text":"OLED SLA (AP Systems G8.6)","application_ids":["APP-017"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"DPSS","type_codes":["L23"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000226"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000070","legacy_id":"P00070","entity_type":"model","company_id":"CMP-000148","manufacturer":"MKS Instruments","family_id":"PRD-000063","family_name":"CO2 laser via drilling","model_number":"ESI Geode A","model_identified":true,"name":"CO2 laser via drilling · ESI Geode A","equipment_id":"EQP-C28","equipment_code":"C28","equipment_label":"Laser Drilling","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PSX5","legacy_process_name":"Advanced Packaging Substrates & Interposers","process_ids":["PRS-044","PRS-053"],"technology_text":"CO2 laser via drilling of ABF build-up","technology_ids":["TEC-063","TEC-079"],"technology_basis":{"from_category":["TEC-063"],"from_laser_codes":["TEC-063","TEC-079"]},"application_text":"FCBGA IC substrates","application_ids":[],"material_text":"ABF","material_ids":["MAT-038"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Drilling; CO2 Laser","type_codes":["L05","L21"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":"ABF"},"specs":[{"parameter":"Floor space vs prior","value":-21,"unit":"%","source_value":"-21 %","source_ids":["SRC-000230"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"Weight vs prior","value":-72,"unit":"%","source_value":"-72 %","source_ids":["SRC-000230"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"Power consumption vs prior","value":"up to -65","unit":"%","source_value":"up to -65 %","source_ids":["SRC-000230"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"}],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Launched 2023-05-31","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Drilling","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000230"],"source_age":"VERY_STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2023-05-31","review_due":"2027-09-29"}},{"id":"MDL-000071","legacy_id":"P00071","entity_type":"model","company_id":"CMP-000148","manufacturer":"MKS Instruments","family_id":"PRD-000064","family_name":"UV laser via drilling","model_number":"ESI Geode X UV","model_identified":true,"name":"UV laser via drilling · ESI Geode X UV","equipment_id":"EQP-C28","equipment_code":"C28","equipment_label":"Laser Drilling","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PSX5","legacy_process_name":"Advanced Packaging Substrates & Interposers","process_ids":["PRS-044","PRS-053"],"technology_text":"UV laser via drilling","technology_ids":["TEC-063","TEC-073"],"technology_basis":{"from_category":["TEC-063"],"from_laser_codes":["TEC-063","TEC-073"]},"application_text":"HDI / IC substrate","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Drilling; UV Processing","type_codes":["L05","L15"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Drilling","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000247"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000072","legacy_id":"P00072","entity_type":"model","company_id":"CMP-000032","manufacturer":"Gigaphoton","family_id":"PRD-000065","family_name":"Excimer laser for micro-via processing","model_number":null,"model_identified":false,"name":"Excimer laser for micro-via processing","equipment_id":"EQP-C28","equipment_code":"C28","equipment_label":"Laser Drilling","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PSX5","legacy_process_name":"Advanced Packaging Substrates & Interposers","process_ids":["PRS-044","PRS-053"],"technology_text":"Excimer laser","technology_ids":["TEC-063","TEC-082"],"technology_basis":{"from_category":["TEC-063"],"from_laser_codes":["TEC-063","TEC-082"]},"application_text":"Advanced packaging micro-via (US delivery 2024; Japan installation)","application_ids":["APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Drilling; Excimer","type_codes":["L05","L24"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Customer order/shipment documented","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Drilling","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000326"],"source_age":"STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2024-11-07","review_due":"2027-09-29"}},{"id":"MDL-000073","legacy_id":"P00073","entity_type":"model","company_id":"CMP-000054","manufacturer":"Plasma-Therm","family_id":"PRD-000066","family_name":"Plasma dicing","model_number":"Singulator MDS-100 / MDS-300","model_identified":true,"name":"Plasma dicing · Singulator MDS-100 / MDS-300","equipment_id":"EQP-C01.04","equipment_code":"C01.04","equipment_label":"Plasma Dicing","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":"Dicing","process_ids":["PRS-032"],"technology_text":"ICP plasma dicing","technology_ids":["TEC-014"],"technology_basis":{"from_category":["TEC-014"],"from_laser_codes":[]},"application_text":"Singulation with streets down to 10 um","application_ids":[],"material_text":null,"material_ids":[],"wafer":{"source_value":"4/6/8 inch on frame; 12 inch","sizes_mm":[100,150,200,300],"nonstandard_mm":[],"range_mm":null,"unit":"mm"},"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[{"parameter":"Street width (min)","value":10,"unit":"um","source_value":"10 um","source_ids":["SRC-000231"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"Stated speed (flagged)","value":"up to 3,000","unit":"mm/s","source_value":"up to 3,000 mm/s","source_ids":["SRC-000231"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"}],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Dicing","notes":"Speed figure recorded verbatim - CONFLICT_REVIEW","reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000231"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"CONFLICTING","missing_key_fields":["Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000074","legacy_id":"P00074","entity_type":"model","company_id":"CMP-000055","manufacturer":"Panasonic Connect","family_id":"PRD-000067","family_name":"Plasma dicer","model_number":"APX300-DM","model_identified":true,"name":"Plasma dicer · APX300-DM","equipment_id":"EQP-C01.04","equipment_code":"C01.04","equipment_label":"Plasma Dicing","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":"Dicing","process_ids":["PRS-032"],"technology_text":"ICP plasma dicing","technology_ids":["TEC-014"],"technology_basis":{"from_category":["TEC-014"],"from_laser_codes":[]},"application_text":"Wafer singulation","application_ids":[],"material_text":null,"material_ids":[],"wafer":{"source_value":"100/150/200 mm","sizes_mm":[100,150,200],"nonstandard_mm":[],"range_mm":null,"unit":"mm"},"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[{"parameter":"Street width","value":20,"unit":"um","source_value":"20 um","source_ids":["SRC-000234"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"Dimensions (WxDxH)","value":"1,350 x 2,230 x 2,000","unit":"mm","source_value":"1,350 x 2,230 x 2,000 mm","source_ids":["SRC-000234"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"Power","value":21,"unit":"kVA","source_value":"21.00 kVA","source_ids":["SRC-000234"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"Gas lines","value":4,"unit":null,"source_value":"4","source_ids":["SRC-000234"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"}],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Dicing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000234"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000075","legacy_id":"P00075","entity_type":"model","company_id":"CMP-000005","manufacturer":"KLA Corporation","family_id":"PRD-000068","family_name":"Plasma dicing (SPTS)","model_number":"Mosaic","model_identified":true,"name":"Plasma dicing (SPTS) · Mosaic","equipment_id":"EQP-C01.04","equipment_code":"C01.04","equipment_label":"Plasma Dicing","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":"Dicing","process_ids":["PRS-032"],"technology_text":"Plasma dicing","technology_ids":["TEC-014"],"technology_basis":{"from_category":["TEC-014"],"from_laser_codes":[]},"application_text":"Wafer singulation","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Title-level (page not accessible)","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Dicing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000235"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000076","legacy_id":"P00076","entity_type":"model","company_id":"CMP-000051","manufacturer":"EV Group (EVG)","family_id":"PRD-000069","family_name":"Laser debonding","model_number":"EVG880 LayerRelease","model_identified":true,"name":"Laser debonding · EVG880 LayerRelease","equipment_id":"EQP-C18","equipment_code":"C18","equipment_label":"Wafer Bonding","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":"Assembly","process_ids":["PRS-051","PRS-052"],"technology_text":"IR laser release layer","technology_ids":["TEC-069","TEC-075","TEC-044"],"technology_basis":{"from_category":["TEC-044"],"from_laser_codes":["TEC-069","TEC-075"]},"application_text":"Temporary bond/debond, 3D","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Debonding; IR Laser Processing","type_codes":["L11","L17"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"ATMP Equipment","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000232","SRC-000243"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000077","legacy_id":"P00077","entity_type":"model","company_id":"CMP-000051","manufacturer":"EV Group (EVG)","family_id":"PRD-000070","family_name":"Temporary bonding / debonding","model_number":"EVG805 / EVG850 TB / EVG850 DB","model_identified":true,"name":"Temporary bonding / debonding · EVG805 / EVG850 TB / EVG850 DB","equipment_id":"EQP-C18","equipment_code":"C18","equipment_label":"Wafer Bonding","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":"Assembly","process_ids":["PRS-051","PRS-052"],"technology_text":"Temporary bonding & debonding","technology_ids":["TEC-044"],"technology_basis":{"from_category":["TEC-044"],"from_laser_codes":[]},"application_text":"Thin-wafer handling","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"ATMP Equipment","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000232"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000078","legacy_id":"P00078","entity_type":"model","company_id":"CMP-000052","manufacturer":"SUSS MicroTec","family_id":"PRD-000071","family_name":"Excimer laser debonder","model_number":"ELD300","model_identified":true,"name":"Excimer laser debonder · ELD300","equipment_id":"EQP-C18","equipment_code":"C18","equipment_label":"Wafer Bonding","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":"Assembly","process_ids":["PRS-051","PRS-052"],"technology_text":"308 nm excimer laser debond","technology_ids":["TEC-069","TEC-082","TEC-044"],"technology_basis":{"from_category":["TEC-044"],"from_laser_codes":["TEC-069","TEC-082"]},"application_text":"3D-IC, 2.5D, MEMS, CIS, power (200/300 mm)","application_ids":["APP-014","APP-015","APP-019"],"material_text":null,"material_ids":[],"wafer":{"source_value":"200 / 300 mm","sizes_mm":[200,300],"nonstandard_mm":[],"range_mm":null,"unit":"mm"},"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Debonding; Excimer","type_codes":["L11","L24"],"source":null,"wavelength":"308 nm","average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":"Commercial","maturity_evidence":"Launch 2014 (VERY_STALE)","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"ATMP Equipment","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000233"],"source_age":"VERY_STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2014-07-08","review_due":"2027-09-29"}},{"id":"MDL-000079","legacy_id":"P00079","entity_type":"model","company_id":"CMP-000047","manufacturer":"Hanmi Semiconductor","family_id":"PRD-000072","family_name":"HBM TC bonder","model_number":"TC Bonder 4.5 Griffin","model_identified":true,"name":"HBM TC bonder · TC Bonder 4.5 Griffin","equipment_id":"EQP-C16","equipment_code":"C16","equipment_label":"TC Bonding","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":"Assembly","process_ids":["PRS-035","PRS-049","PRS-050"],"technology_text":"Thermo-compression bonding","technology_ids":["TEC-042"],"technology_basis":{"from_category":["TEC-042"],"from_laser_codes":[]},"application_text":"HBM4 stacking","application_ids":["APP-008"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Customer order/shipment documented (SK hynix KRW 44.2B, 2026-06)","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"ATMP Equipment","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000041","SRC-000042"],"source_age":"CURRENT","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-06-10","review_due":"2027-09-29"}},{"id":"MDL-000080","legacy_id":"P00080","entity_type":"model","company_id":"CMP-000048","manufacturer":"Hanwha Semitech","family_id":"PRD-000073","family_name":"TC bonder","model_number":null,"model_identified":false,"name":"TC bonder","equipment_id":"EQP-C16","equipment_code":"C16","equipment_label":"TC Bonding","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":"Assembly","process_ids":["PRS-035","PRS-049","PRS-050"],"technology_text":"Thermo-compression bonding","technology_ids":["TEC-042"],"technology_basis":{"from_category":["TEC-042"],"from_laser_codes":[]},"application_text":"HBM","application_ids":["APP-008"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Customer order/shipment documented","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"ATMP Equipment","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000043"],"source_age":"STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-05-20","review_due":"2027-09-29"}},{"id":"MDL-000081","legacy_id":"P00081","entity_type":"model","company_id":"CMP-000048","manufacturer":"Hanwha Semitech","family_id":"PRD-000074","family_name":"Hybrid bonder","model_number":null,"model_identified":false,"name":"Hybrid bonder","equipment_id":"EQP-C17","equipment_code":"C17","equipment_label":"Hybrid Bonding","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":"Assembly","process_ids":["PRS-049","PRS-050","PRS-051"],"technology_text":"Hybrid bonding","technology_ids":["TEC-043"],"technology_basis":{"from_category":["TEC-043"],"from_laser_codes":[]},"application_text":"HBM (evaluation)","application_ids":["APP-008","APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":"Pilot","maturity_evidence":"Evaluation at SK hynix reported (Tier 3/4)","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"ATMP Equipment","notes":null,"reclassified":null,"batch":"Batch 1","verification":"UNVERIFIED","confidence":{"level":"UNVERIFIED"},"source_ids":["SRC-000040","SRC-000048"],"source_age":"CURRENT","freshness":"Recent","quality_state":"UNVERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":null,"latest_source_date":"2026-09","review_due":"2027-03-29"}},{"id":"MDL-000082","legacy_id":"P00082","entity_type":"model","company_id":"CMP-000002","manufacturer":"Applied Materials","family_id":"PRD-000075","family_name":"Die-to-wafer hybrid bonding system","model_number":"Kinex (with BESI)","model_identified":true,"name":"Die-to-wafer hybrid bonding system · Kinex (with BESI)","equipment_id":"EQP-C17","equipment_code":"C17","equipment_label":"Hybrid Bonding","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":"Assembly","process_ids":["PRS-049","PRS-050","PRS-051"],"technology_text":"Integrated D2W hybrid bonding","technology_ids":["TEC-043"],"technology_basis":{"from_category":["TEC-043"],"from_laser_codes":[]},"application_text":"Logic / HBM","application_ids":["APP-001","APP-008","APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":"~1,600 die placements/h (Tier 4)","accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"ATMP Equipment","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000046","SRC-000051"],"source_age":"CURRENT","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-09","review_due":"2027-09-29"}},{"id":"MDL-000083","legacy_id":"P00083","entity_type":"model","company_id":"CMP-000026","manufacturer":"Mycronic","family_id":"PRD-000076","family_name":"High-precision die bonder","model_number":"MRSI-705","model_identified":true,"name":"High-precision die bonder · MRSI-705","equipment_id":"EQP-C10","equipment_code":"C10","equipment_label":"Die Attach","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":"Assembly","process_ids":["PRS-033"],"technology_text":"5-micron die bonding","technology_ids":["TEC-039"],"technology_basis":{"from_category":["TEC-039"],"from_laser_codes":[]},"application_text":"Photonics / optoelectronics","application_ids":["APP-018"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"ATMP Equipment","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000340"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000084","legacy_id":"P00084","entity_type":"model","company_id":"CMP-000026","manufacturer":"Mycronic","family_id":"PRD-000077","family_name":"High-precision flip-chip die bonder","model_number":"MRSI-H family","model_identified":true,"name":"High-precision flip-chip die bonder · MRSI-H family","equipment_id":"EQP-C11","equipment_code":"C11","equipment_label":"Flip Chip","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":"Assembly","process_ids":["PRS-035","PRS-050"],"technology_text":"1.5-micron flip-chip/die bonding","technology_ids":["TEC-041"],"technology_basis":{"from_category":["TEC-041"],"from_laser_codes":[]},"application_text":"Photonics / optoelectronics","application_ids":["APP-018"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"ATMP Equipment","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000341"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000085","legacy_id":"P00085","entity_type":"model","company_id":"CMP-000049","manufacturer":"TOWA Corporation","family_id":"PRD-000078","family_name":"Compression molding","model_number":"PMC 2030-D / CPM 1080","model_identified":true,"name":"Compression molding · PMC 2030-D / CPM 1080","equipment_id":"EQP-C20","equipment_code":"C20","equipment_label":"Compression Molding","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS14","legacy_process_name":"Packaging","process_ids":["PRS-036","PRS-047"],"technology_text":"Compression molding","technology_ids":["TEC-045"],"technology_basis":{"from_category":["TEC-045"],"from_laser_codes":[]},"application_text":"Package encapsulation","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Packaging Equipment","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000237"],"source_age":"CURRENT","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-05","review_due":"2027-09-29"}},{"id":"MDL-000086","legacy_id":"P00086","entity_type":"model","company_id":"CMP-000049","manufacturer":"TOWA Corporation","family_id":"PRD-000079","family_name":"Singulation","model_number":"FMS 4040","model_identified":true,"name":"Singulation · FMS 4040","equipment_id":"EQP-C32","equipment_code":"C32","equipment_label":"Singulation","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS14","legacy_process_name":"Packaging","process_ids":["PRS-039"],"technology_text":"Package singulation","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Package separation","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Cutting","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000237"],"source_age":"CURRENT","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-05","review_due":"2027-09-29"}},{"id":"MDL-000087","legacy_id":"P00087","entity_type":"model","company_id":"CMP-000050","manufacturer":"Yamaha Robotics Holdings","family_id":"PRD-000080","family_name":"Wire bonder","model_number":"UTC-5000Super / UTC-5100 / UTC-5000NeoCu Super / UTC-RZ1","model_identified":true,"name":"Wire bonder · UTC-5000Super / UTC-5100 / UTC-5000NeoCu Super / UTC-RZ1","equipment_id":"EQP-C12","equipment_code":"C12","equipment_label":"Wire Bonding","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":"Assembly","process_ids":["PRS-034"],"technology_text":"Wire bonding","technology_ids":["TEC-040"],"technology_basis":{"from_category":["TEC-040"],"from_laser_codes":[]},"application_text":"Package interconnect","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"ATMP Equipment","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000240"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000088","legacy_id":"P00088","entity_type":"model","company_id":"CMP-000050","manufacturer":"Yamaha Robotics Holdings","family_id":"PRD-000081","family_name":"Flip-chip bonder","model_number":"FPB-1ws NeoForce","model_identified":true,"name":"Flip-chip bonder · FPB-1ws NeoForce","equipment_id":"EQP-C11","equipment_code":"C11","equipment_label":"Flip Chip","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":"Assembly","process_ids":["PRS-035","PRS-050"],"technology_text":"Flip-chip bonding","technology_ids":["TEC-041"],"technology_basis":{"from_category":["TEC-041"],"from_laser_codes":[]},"application_text":"Flip-chip assembly","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"ATMP Equipment","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000240"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000089","legacy_id":"P00089","entity_type":"model","company_id":"CMP-000053","manufacturer":"Advanced Dicing Technologies (ADT)","family_id":"PRD-000082","family_name":"Dicing saw","model_number":"8030 / 7304 / 80Ai","model_identified":true,"name":"Dicing saw · 8030 / 7304 / 80Ai","equipment_id":"EQP-C01.01","equipment_code":"C01.01","equipment_label":"Mechanical Dicing","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":"Dicing","process_ids":["PRS-032"],"technology_text":"Blade dicing","technology_ids":["TEC-037"],"technology_basis":{"from_category":["TEC-037"],"from_laser_codes":[]},"application_text":"Wafer and package dicing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Dicing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000236"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000090","legacy_id":"P00090","entity_type":"model","company_id":"CMP-000040","manufacturer":"Aehr Test Systems","family_id":"PRD-000083","family_name":"Wafer-level burn-in","model_number":"FOX-XP / FOX-NP / FOX-CP","model_identified":true,"name":"Wafer-level burn-in · FOX-XP / FOX-NP / FOX-CP","equipment_id":"EQP-C38","equipment_code":"C38","equipment_label":"Burn-in","category_group":"C","segment":"Test","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":"Final Test","process_ids":["PRS-042"],"technology_text":"Wafer-level test & burn-in","technology_ids":["TEC-057"],"technology_basis":{"from_category":["TEC-057"],"from_laser_codes":[]},"application_text":"AI processors, SiC, HBM, silicon photonics","application_ids":["APP-003","APP-008","APP-011","APP-018"],"material_text":null,"material_ids":["MAT-001","MAT-003"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Customer order/shipment documented ($22M follow-on, 2026-08)","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Semiconductor Test Equipment","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000241","SRC-000242"],"source_age":"CURRENT","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-08","review_due":"2027-09-29"}},{"id":"MDL-000091","legacy_id":"P00091","entity_type":"model","company_id":"CMP-000040","manufacturer":"Aehr Test Systems","family_id":"PRD-000084","family_name":"Packaged-part burn-in","model_number":"Sonoma","model_identified":true,"name":"Packaged-part burn-in · Sonoma","equipment_id":"EQP-C38","equipment_code":"C38","equipment_label":"Burn-in","category_group":"C","segment":"Test","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":"Final Test","process_ids":["PRS-042"],"technology_text":"Burn-in","technology_ids":["TEC-057"],"technology_basis":{"from_category":["TEC-057"],"from_laser_codes":[]},"application_text":"AI processors","application_ids":["APP-003"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Semiconductor Test Equipment","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000241"],"source_age":"CURRENT","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-07","review_due":"2027-09-29"}},{"id":"MDL-000092","legacy_id":"P00092","entity_type":"model","company_id":"CMP-000038","manufacturer":"Techwing","family_id":"PRD-000085","family_name":"HBM Cube Prober","model_number":"Cube Prober","model_identified":true,"name":"HBM Cube Prober · Cube Prober","equipment_id":"EQP-A33","equipment_code":"A33","equipment_label":"Wafer Probing","category_group":"A","segment":"Test","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PS12","legacy_process_name":"Wafer Test","process_ids":["PRS-029"],"technology_text":"Individual HBM die test: 256 chips in parallel, -40 to 150 C","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"HBM logic and core-die test","application_ids":["APP-001","APP-008"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":"256 dies in parallel","accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[{"parameter":"Parallelism","value":256,"unit":"dies","source_value":"256 dies","source_ids":["SRC-000302"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"},{"parameter":"Temperature range","value":"-40 to 150","unit":"C","source_value":"-40 to 150 C","source_ids":["SRC-000302"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"}],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Customer order/shipment documented (SK hynix, 2026-06-17)","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Semiconductor Test Equipment","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000302"],"source_age":"CURRENT","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-06-17","review_due":"2027-09-29"}},{"id":"MDL-000093","legacy_id":"P00093","entity_type":"model","company_id":"CMP-000001","manufacturer":"ASML Holding","family_id":"PRD-000086","family_name":"High-NA EUV scanner","model_number":"TWINSCAN EXE:5200B","model_identified":true,"name":"High-NA EUV scanner · TWINSCAN EXE:5200B","equipment_id":"EQP-A01.01","equipment_code":"A01.01","equipment_label":"EUV","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":"Lithography","process_ids":["PRS-018"],"technology_text":"EUV, NA 0.55","technology_ids":["TEC-001"],"technology_basis":{"from_category":["TEC-001"],"from_laser_codes":[]},"application_text":"Leading-edge DRAM/logic (SK hynix M16)","application_ids":["APP-001","APP-006"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Assembled for mass production at SK hynix M16 (2025-09)","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":"~KRW 600B / ~USD 450M (ESTIMATE, Tier 3 media)","teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000133","SRC-000198"],"source_age":"STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-09-03","review_due":"2027-09-29"}},{"id":"MDL-000094","legacy_id":"P00094","entity_type":"model","company_id":"CMP-000001","manufacturer":"ASML Holding","family_id":"PRD-000087","family_name":"EUV scanner","model_number":"NXE:3800E","model_identified":true,"name":"EUV scanner · NXE:3800E","equipment_id":"EQP-A01.01","equipment_code":"A01.01","equipment_label":"EUV","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":"Lithography","process_ids":["PRS-018"],"technology_text":"EUV (low-NA)","technology_ids":["TEC-001"],"technology_basis":{"from_category":["TEC-001"],"from_laser_codes":[]},"application_text":"Volume production (Rapidus IIM-1)","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":"220 wph (S0191)","accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Installed Dec 2024 at Rapidus","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000190","SRC-000191"],"source_age":"STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Wafer / substrate size","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025","review_due":"2027-09-29"}},{"id":"MDL-000095","legacy_id":"P00095","entity_type":"model","company_id":"CMP-000020","manufacturer":"Nikon Corporation","family_id":"PRD-000088","family_name":"ArF immersion scanner","model_number":"NSR-S636E","model_identified":true,"name":"ArF immersion scanner · NSR-S636E","equipment_id":"EQP-A01.03","equipment_code":"A01.03","equipment_label":"ArF","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":"Lithography","process_ids":["PRS-018"],"technology_text":"ArF immersion","technology_ids":["TEC-003"],"technology_basis":{"from_category":["TEC-003"],"from_laser_codes":[]},"application_text":"Advanced logic/memory patterning","application_ids":["APP-001","APP-005"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Released 2023-12-06","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000317","SRC-000349"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2023-12-06","review_due":"2027-09-29"}},{"id":"MDL-000096","legacy_id":"P00096","entity_type":"model","company_id":"CMP-000020","manufacturer":"Nikon Corporation","family_id":"PRD-000088","family_name":"ArF immersion scanner","model_number":"NSR-S625E","model_identified":true,"name":"ArF immersion scanner · NSR-S625E","equipment_id":"EQP-A01.03","equipment_code":"A01.03","equipment_label":"ArF","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":"Lithography","process_ids":["PRS-018"],"technology_text":"ArF immersion","technology_ids":["TEC-003"],"technology_basis":{"from_category":["TEC-003"],"from_laser_codes":[]},"application_text":"Patterning","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000318"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000097","legacy_id":"P00097","entity_type":"model","company_id":"CMP-000013","manufacturer":"Canon Inc.","family_id":"PRD-000089","family_name":"Nanoimprint lithography","model_number":"FPA-1200NZ2C","model_identified":true,"name":"Nanoimprint lithography · FPA-1200NZ2C","equipment_id":"EQP-A01.07","equipment_code":"A01.07","equipment_label":"Nanoimprint Lithography","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":"Lithography","process_ids":["PRS-018"],"technology_text":"Nanoimprint (NIL)","technology_ids":["TEC-007"],"technology_basis":{"from_category":["TEC-007"],"from_laser_codes":[]},"application_text":"300 mm patterning, min linewidth 14 nm","application_ids":[],"material_text":null,"material_ids":[],"wafer":{"source_value":"300 mm","sizes_mm":[300],"nonstandard_mm":[],"range_mm":null,"unit":"mm"},"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[{"parameter":"Minimum linewidth","value":14,"unit":"nm","source_value":"14 nm","source_ids":["SRC-000192","SRC-000193"],"source_scope":"record-level (Batch 1 did not attach sources per parameter)","verification":"VERIFIED","claim_type":"Manufacturer claim"}],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Shipped to Texas Institute for Electronics 2024-10-01","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000192","SRC-000193"],"source_age":"STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2024-10-01","review_due":"2027-09-29"}},{"id":"MDL-000098","legacy_id":"P00098","entity_type":"model","company_id":"CMP-000107","manufacturer":"SMEE (Shanghai Micro Electronics Equipment)","family_id":"PRD-000090","family_name":"Dry ArF scanner","model_number":"SSA600","model_identified":true,"name":"Dry ArF scanner · SSA600","equipment_id":"EQP-A01.03","equipment_code":"A01.03","equipment_label":"ArF","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":"Lithography","process_ids":["PRS-018"],"technology_text":"90 nm-class dry ArF","technology_ids":["TEC-003"],"technology_basis":{"from_category":["TEC-003"],"from_laser_codes":[]},"application_text":"Mature-node patterning","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000187"],"source_age":"CURRENT","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-08","review_due":"2027-09-29"}},{"id":"MDL-000099","legacy_id":"P00099","entity_type":"model","company_id":"CMP-000107","manufacturer":"SMEE (Shanghai Micro Electronics Equipment)","family_id":"PRD-000091","family_name":"ArF scanner","model_number":"SSA/800","model_identified":true,"name":"ArF scanner · SSA/800","equipment_id":"EQP-A01.03","equipment_code":"A01.03","equipment_label":"ArF","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":"Lithography","process_ids":["PRS-018"],"technology_text":"ArF","technology_ids":["TEC-003"],"technology_basis":{"from_category":["TEC-003"],"from_laser_codes":[]},"application_text":null,"application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Announced","legacy_status":"NOT_DEPLOYED","maturity":"Development","maturity_evidence":"S0187: never deployed; S0189 (Tier 4) claims scaled - CONFLICT","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000187","SRC-000189"],"source_age":"CURRENT","freshness":"Recent","quality_state":"CONFLICTING","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-08","review_due":"2027-03-29"}},{"id":"MDL-000100","legacy_id":"P00100","entity_type":"model","company_id":"CMP-000024","manufacturer":"Lasertec","family_id":"PRD-000092","family_name":"Actinic EUV patterned mask inspection","model_number":"ACTIS A150 / A300 / A200HiT","model_identified":true,"name":"Actinic EUV patterned mask inspection · ACTIS A150 / A300 / A200HiT","equipment_id":"EQP-B02","equipment_code":"B02","equipment_label":"Mask Inspection","category_group":"B","segment":"Front-End","market_segment":"Mask/Reticle","is_component":false,"component_class_id":null,"legacy_process_step":"PSX3","legacy_process_name":"Mask / Reticle Making","process_ids":["PRS-028"],"technology_text":"Actinic (13.5 nm) inspection","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"EUV mask defect inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"A200HiT released 2025-10-31","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Semiconductor Inspection","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000322","SRC-000345"],"source_age":"AGING","freshness":"Needs Review","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-10-31","review_due":"2027-09-29"}},{"id":"MDL-000101","legacy_id":"P00101","entity_type":"model","company_id":"CMP-000025","manufacturer":"NuFlare Technology","family_id":"PRD-000093","family_name":"Multi-beam mask writer","model_number":"MBM-2000 / MBM-2000PLUS","model_identified":true,"name":"Multi-beam mask writer · MBM-2000 / MBM-2000PLUS","equipment_id":"EQP-B07","equipment_code":"B07","equipment_label":"E-beam Mask Writing","category_group":"B","segment":"Front-End","market_segment":"Mask/Reticle","is_component":false,"component_class_id":null,"legacy_process_step":"PSX3","legacy_process_name":"Mask / Reticle Making","process_ids":["PRS-028"],"technology_text":"Multi-electron-beam writing","technology_ids":["TEC-006"],"technology_basis":{"from_category":["TEC-006"],"from_laser_codes":[]},"application_text":"Photomask writing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000323"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000102","legacy_id":"P00102","entity_type":"model","company_id":"CMP-000032","manufacturer":"Gigaphoton","family_id":"PRD-000094","family_name":"ArF excimer light source","model_number":"GT62A","model_identified":true,"name":"ArF excimer light source · GT62A","equipment_id":"EQP-A01.02","equipment_code":"A01.02","equipment_label":"DUV","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":"Lithography","process_ids":["PRS-018"],"technology_text":"ArF excimer laser","technology_ids":["TEC-082","TEC-002"],"technology_basis":{"from_category":["TEC-002"],"from_laser_codes":["TEC-082"]},"application_text":"DUV lithography light source","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Excimer","type_codes":["L24"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000348"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000103","legacy_id":"P00103","entity_type":"model","company_id":"CMP-000002","manufacturer":"Applied Materials","family_id":"PRD-000095","family_name":"PECVD","model_number":"Precision Selective Nitride","model_identified":true,"name":"PECVD · Precision Selective Nitride","equipment_id":"EQP-A09.02","equipment_code":"A09.02","equipment_label":"PECVD","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":"Deposition","process_ids":["PRS-013","PRS-014"],"technology_text":"Selective nitride PECVD","technology_ids":["TEC-016"],"technology_basis":{"from_category":["TEC-016"],"from_laser_codes":[]},"application_text":"Advanced logic","application_ids":["APP-001"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000124"],"source_age":"CURRENT","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-05","review_due":"2027-09-29"}},{"id":"MDL-000104","legacy_id":"P00104","entity_type":"model","company_id":"CMP-000002","manufacturer":"Applied Materials","family_id":"PRD-000096","family_name":"ALD","model_number":"Trillium ALD","model_identified":true,"name":"ALD · Trillium ALD","equipment_id":"EQP-A09.06","equipment_code":"A09.06","equipment_label":"ALD","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":"Deposition","process_ids":["PRS-013","PRS-015"],"technology_text":"ALD","technology_ids":["TEC-019"],"technology_basis":{"from_category":["TEC-019"],"from_laser_codes":[]},"application_text":"Advanced logic/memory","application_ids":["APP-001","APP-005"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000124"],"source_age":"CURRENT","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-05","review_due":"2027-09-29"}},{"id":"MDL-000105","legacy_id":"P00105","entity_type":"model","company_id":"CMP-000101","manufacturer":"NAURA Technology Group","family_id":"PRD-000097","family_name":"CCP etch","model_number":"Accura LX","model_identified":true,"name":"CCP etch · Accura LX","equipment_id":"EQP-A08.02","equipment_code":"A08.02","equipment_label":"Plasma Etch","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PS04","legacy_process_name":"Etching","process_ids":["PRS-020"],"technology_text":"Capacitively coupled plasma etch","technology_ids":["TEC-009"],"technology_basis":{"from_category":["TEC-009"],"from_laser_codes":[]},"application_text":"Memory/logic","application_ids":["APP-001","APP-005"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000009"],"source_age":"CURRENT","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-04-21","review_due":"2027-09-29"}},{"id":"MDL-000106","legacy_id":"P00106","entity_type":"model","company_id":"CMP-000069","manufacturer":"Wonik IPS","family_id":"PRD-000098","family_name":"ALD/CVD","model_number":"WIDAS; NOA; GEMINI HQ; HyEta (spatial ALD); Quanta (3D NAND)","model_identified":true,"name":"ALD/CVD · WIDAS; NOA; GEMINI HQ; HyEta (spatial ALD); Quanta (3D NAND)","equipment_id":"EQP-A09.06","equipment_code":"A09.06","equipment_label":"ALD","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":"Deposition","process_ids":["PRS-013","PRS-015"],"technology_text":"ALD/CVD","technology_ids":["TEC-019"],"technology_basis":{"from_category":["TEC-019"],"from_laser_codes":[]},"application_text":"Memory / logic","application_ids":["APP-001","APP-005","APP-007"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000174"],"source_age":"CURRENT","freshness":"Recent","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-05","review_due":"2027-03-29"}},{"id":"MDL-000107","legacy_id":"P00107","entity_type":"model","company_id":"CMP-000070","manufacturer":"Jusung Engineering","family_id":"PRD-000099","family_name":"Atomic layer growth","model_number":"ALG","model_identified":true,"name":"Atomic layer growth · ALG","equipment_id":"EQP-A09.06","equipment_code":"A09.06","equipment_label":"ALD","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":"Deposition","process_ids":["PRS-013","PRS-015"],"technology_text":"ALG","technology_ids":["TEC-019"],"technology_basis":{"from_category":["TEC-019"],"from_laser_codes":[]},"application_text":"Supplied to a global chipmaker (per source)","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Customer order/shipment documented (unnamed global chipmaker)","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000175"],"source_age":"CURRENT","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-06-11","review_due":"2027-09-29"}},{"id":"MDL-000108","legacy_id":"P00108","entity_type":"model","company_id":"CMP-000103","manufacturer":"Piotech","family_id":"PRD-000100","family_name":"PECVD","model_number":null,"model_identified":false,"name":"PECVD","equipment_id":"EQP-A09.02","equipment_code":"A09.02","equipment_label":"PECVD","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":"Deposition","process_ids":["PRS-013","PRS-014"],"technology_text":"PECVD","technology_ids":["TEC-016"],"technology_basis":{"from_category":["TEC-016"],"from_laser_codes":[]},"application_text":"Memory/logic (2025 revenue ~RMB 5.14B)","application_ids":["APP-001","APP-005"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000314"],"source_age":"CURRENT","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-04","review_due":"2027-09-29"}},{"id":"MDL-000109","legacy_id":"P00109","entity_type":"model","company_id":"CMP-000103","manufacturer":"Piotech","family_id":"PRD-000101","family_name":"Hybrid bonding equipment","model_number":null,"model_identified":false,"name":"Hybrid bonding equipment","equipment_id":"EQP-C17","equipment_code":"C17","equipment_label":"Hybrid Bonding","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":"Assembly","process_ids":["PRS-049","PRS-050","PRS-051"],"technology_text":"Hybrid bonding","technology_ids":["TEC-043"],"technology_basis":{"from_category":["TEC-043"],"from_laser_codes":[]},"application_text":"3D integration (2025 revenue RMB 0.136B)","application_ids":["APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"ATMP Equipment","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000314","SRC-000009"],"source_age":"CURRENT","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-04-21","review_due":"2027-09-29"}},{"id":"MDL-000110","legacy_id":"P00110","entity_type":"model","company_id":"CMP-000016","manufacturer":"Onto Innovation","family_id":"PRD-000102","family_name":"Panel-level lithography","model_number":"Firefly","model_identified":true,"name":"Panel-level lithography · Firefly","equipment_id":"EQP-A01","equipment_code":"A01","equipment_label":"Lithography","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":"Lithography","process_ids":["PRS-018"],"technology_text":"Lithography for advanced packaging panels","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Glass/panel substrates (installed at LPKF Vitrion)","application_ids":["APP-019"],"material_text":null,"material_ids":["MAT-010"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Installed at Vitrion cleanroom (2025)","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000081"],"source_age":"STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-04","review_due":"2027-09-29"}},{"id":"MDL-000111","legacy_id":"P00111","entity_type":"model","company_id":"CMP-000016","manufacturer":"Onto Innovation","family_id":"PRD-000103","family_name":"Film metrology","model_number":"Iris","model_identified":true,"name":"Film metrology · Iris","equipment_id":"EQP-A28","equipment_code":"A28","equipment_label":"Film Thickness Measurement","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PS08","legacy_process_name":"Metrology","process_ids":["PRS-026"],"technology_text":"Film metrology","technology_ids":["TEC-035"],"technology_basis":{"from_category":["TEC-035"],"from_laser_codes":[]},"application_text":"Advanced packaging / HBM","application_ids":["APP-008","APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Semiconductor Inspection","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000196"],"source_age":"STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-05","review_due":"2027-09-29"}},{"id":"MDL-000112","legacy_id":"P00112","entity_type":"model","company_id":"CMP-000016","manufacturer":"Onto Innovation","family_id":"PRD-000104","family_name":"HBM process control","model_number":"Dragonfly","model_identified":true,"name":"HBM process control · Dragonfly","equipment_id":"EQP-A25","equipment_code":"A25","equipment_label":"Metrology","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PS08","legacy_process_name":"Metrology","process_ids":["PRS-026"],"technology_text":"Inspection/metrology","technology_ids":["TEC-035"],"technology_basis":{"from_category":["TEC-035"],"from_laser_codes":[]},"application_text":"HBM (VPA >$240M)","application_ids":["APP-008"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Customer order/shipment documented (volume purchase agreement)","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Semiconductor Inspection","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000154"],"source_age":"AGING","freshness":"Needs Review","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-02-19","review_due":"2027-09-29"}},{"id":"MDL-000113","legacy_id":"P00113","entity_type":"model","company_id":"CMP-000028","manufacturer":"AIXTRON","family_id":"PRD-000105","family_name":"MOCVD","model_number":"AIX G5+ C / G10-GaN / G10-SiC","model_identified":true,"name":"MOCVD · AIX G5+ C / G10-GaN / G10-SiC","equipment_id":"EQP-A09.01","equipment_code":"A09.01","equipment_label":"CVD","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":"Deposition","process_ids":["PRS-013","PRS-014"],"technology_text":"MOCVD","technology_ids":["TEC-015"],"technology_basis":{"from_category":["TEC-015"],"from_laser_codes":[]},"application_text":"GaN / SiC power and RF","application_ids":["APP-011","APP-012","APP-013"],"material_text":null,"material_ids":["MAT-003","MAT-004"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000328","SRC-000344"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000114","legacy_id":"P00114","entity_type":"model","company_id":"CMP-000063","manufacturer":"RORZE Corporation","family_id":"PRD-000106","family_name":"EFEM / sorter","model_number":null,"model_identified":false,"name":"EFEM / sorter","equipment_id":"EQP-A37","equipment_code":"A37","equipment_label":"EFEM","category_group":"A","segment":"Automation & Facilities","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":"Factory Automation & Infrastructure","process_ids":["PRS-058"],"technology_text":"Equipment front-end module","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer handling","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Wafer Handling","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000294"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000115","legacy_id":"P00115","entity_type":"model","company_id":"CMP-000066","manufacturer":"Murata Machinery (Muratec)","family_id":"PRD-000107","family_name":"Overhead hoist transport","model_number":"OHT / OHS","model_identified":true,"name":"Overhead hoist transport · OHT / OHS","equipment_id":"EQP-J02","equipment_code":"J02","equipment_label":"OHT","category_group":"J","segment":"Automation & Facilities","market_segment":"Factory Automation","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":"Factory Automation & Infrastructure","process_ids":["PRS-057"],"technology_text":"AMHS","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"300 mm fabs","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000300","SRC-000301"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000116","legacy_id":"P00116","entity_type":"model","company_id":"CMP-000184","manufacturer":"Raana Semiconductors","family_id":"PRD-000108","family_name":"CZ silicon ingot puller","model_number":null,"model_identified":false,"name":"CZ silicon ingot puller","equipment_id":"EQP-K01","equipment_code":"K01","equipment_label":"Crystal growth furnaces / pullers","category_group":"A","segment":"Wafer Manufacturing","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":"Wafer Fabrication","process_ids":["PRS-001"],"technology_text":"Czochralski crystal growth, 10-12 inch","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Monocrystalline Si ingots","application_ids":[],"material_text":null,"material_ids":["MAT-001"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercializing","maturity_evidence":"Confirmed orders INR 12 crore FY26 (S0211)","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":{"from_code":"A09.10","to_code":"K01","reason":"Crystal puller: Batch 1 filed it under Epitaxy because no crystal-growth category existed"},"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000211"],"source_age":"AGING","freshness":"Needs Review","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-01-20","review_due":"2027-09-29"}},{"id":"MDL-000117","legacy_id":"P00117","entity_type":"model","company_id":"CMP-000194","manufacturer":"ASM Technologies-HHV JV","family_id":"PRD-000109","family_name":"Crystal puller (prototype)","model_number":null,"model_identified":false,"name":"Crystal puller (prototype)","equipment_id":"EQP-K01","equipment_code":"K01","equipment_label":"Crystal growth furnaces / pullers","category_group":"A","segment":"Wafer Manufacturing","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":"Wafer Fabrication","process_ids":["PRS-001"],"technology_text":"Crystal growth","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Si ingot","application_ids":[],"material_text":null,"material_ids":["MAT-001"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Development","legacy_status":"DEVELOPMENT","maturity":"Prototype","maturity_evidence":"Tier-4 mention only","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":{"from_code":"A09.10","to_code":"K01","reason":"Crystal puller: Batch 1 filed it under Epitaxy because no crystal-growth category existed"},"batch":"Batch 1","verification":"UNVERIFIED","confidence":{"level":"UNVERIFIED"},"source_ids":["SRC-000207"],"source_age":"CURRENT","freshness":"Recent","quality_state":"UNVERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":null,"latest_source_date":"2026-09","review_due":"2027-03-29"}},{"id":"MDL-000118","legacy_id":"P00118","entity_type":"model","company_id":"CMP-000195","manufacturer":"SLTL (Sahajanand Laser Technology)","family_id":"PRD-000110","family_name":"Wafer dicing system","model_number":null,"model_identified":false,"name":"Wafer dicing system","equipment_id":"EQP-C01.02","equipment_code":"C01.02","equipment_label":"Laser Dicing","category_group":"C","segment":"Back-End","market_segment":"Back-End/Packaging","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":"Dicing","process_ids":["PRS-032"],"technology_text":"Laser dicing","technology_ids":["TEC-060"],"technology_basis":{"from_category":["TEC-060"],"from_laser_codes":["TEC-060"]},"application_text":"Wafer dicing; solar cell cutting","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Dicing","type_codes":["L02"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Listed on official website","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Laser Dicing","notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000208"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000119","legacy_id":"P00119","entity_type":"model","company_id":"CMP-000180","manufacturer":"Nearfield Instruments","family_id":"PRD-000111","family_name":"In-line AFM metrology","model_number":"AUDIRA","model_identified":true,"name":"In-line AFM metrology · AUDIRA","equipment_id":"EQP-A30","equipment_code":"A30","equipment_label":"Wafer Surface Measurement","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PS08","legacy_process_name":"Metrology","process_ids":["PRS-008","PRS-026"],"technology_text":"Scanning-probe metrology","technology_ids":["TEC-035"],"technology_basis":{"from_category":["TEC-035"],"from_laser_codes":[]},"application_text":"3D profile metrology","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":null,"maturity_evidence":"Tier-4 mention","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":"Semiconductor Inspection","notes":null,"reclassified":null,"batch":"Batch 1","verification":"PARTIALLY_VERIFIED","confidence":{"level":"UNVERIFIED"},"source_ids":["SRC-000168"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000120","legacy_id":"P00120","entity_type":"model","company_id":"CMP-000182","manufacturer":"xLight","family_id":"PRD-000112","family_name":"Free-electron-laser EUV light source","model_number":null,"model_identified":false,"name":"Free-electron-laser EUV light source","equipment_id":"EQP-A01.01","equipment_code":"A01.01","equipment_label":"EUV","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":"Lithography","process_ids":["PRS-018"],"technology_text":"FEL","technology_ids":["TEC-001"],"technology_basis":{"from_category":["TEC-001"],"from_laser_codes":[]},"application_text":"EUV lithography light source","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Development","legacy_status":"DEVELOPMENT","maturity":"Development","maturity_evidence":"CHIPS LOI; venture funding","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000171","SRC-000172"],"source_age":"CURRENT","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026-06-24","review_due":"2027-09-29"}},{"id":"MDL-000121","legacy_id":"P00121","entity_type":"model","company_id":"CMP-000181","manufacturer":"Substrate","family_id":"PRD-000113","family_name":"Lithography system","model_number":null,"model_identified":false,"name":"Lithography system","equipment_id":"EQP-A01","equipment_code":"A01","equipment_label":"Lithography","category_group":"A","segment":"Front-End","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":"Lithography","process_ids":["PRS-018"],"technology_text":"X-ray-source-based lithography (per funding reports)","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Advanced patterning","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Development","legacy_status":"DEVELOPMENT","maturity":"Development","maturity_evidence":"Venture funding stage","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000169","SRC-000170"],"source_age":"AGING","freshness":"Needs Review","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-10-29","review_due":"2027-09-29"}},{"id":"MDL-000122","legacy_id":"P00122","entity_type":"model","company_id":"CMP-000149","manufacturer":"Light Conversion","family_id":"PRD-000114","family_name":"Femtosecond laser","model_number":"PHAROS","model_identified":true,"name":"Femtosecond laser · PHAROS","equipment_id":null,"equipment_code":"BOM01","equipment_label":"BOM: Laser Source","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000010","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"Yb femtosecond","technology_ids":["TEC-076","TEC-078"],"technology_basis":{"from_category":[],"from_laser_codes":["TEC-076","TEC-078"]},"application_text":"Industrial & scientific micromachining","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Ultrafast Laser Processing; Femtosecond","type_codes":["L18","L20"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000259"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000123","legacy_id":"P00123","entity_type":"model","company_id":"CMP-000150","manufacturer":"Amplitude Laser","family_id":"PRD-000115","family_name":"Femtosecond laser","model_number":"Satsuma X","model_identified":true,"name":"Femtosecond laser · Satsuma X","equipment_id":null,"equipment_code":"BOM01","equipment_label":"BOM: Laser Source","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000010","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"Femtosecond, 50 W","technology_ids":["TEC-076","TEC-078"],"technology_basis":{"from_category":[],"from_laser_codes":["TEC-076","TEC-078"]},"application_text":"Industrial micromachining","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Ultrafast Laser Processing; Femtosecond","type_codes":["L18","L20"],"source":null,"wavelength":null,"average_power":"50 W","pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000264"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000124","legacy_id":"P00124","entity_type":"model","company_id":"CMP-000147","manufacturer":"TRUMPF","family_id":"PRD-000116","family_name":"Ultrashort-pulse laser","model_number":"TruMicro Series 2000 / TruMicro Mark","model_identified":true,"name":"Ultrashort-pulse laser · TruMicro Series 2000 / TruMicro Mark","equipment_id":null,"equipment_code":"BOM01","equipment_label":"BOM: Laser Source","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000010","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"USP laser","technology_ids":["TEC-076","TEC-059"],"technology_basis":{"from_category":[],"from_laser_codes":["TEC-076","TEC-059"]},"application_text":"Micromachining, cold marking","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Ultrafast Laser Processing; Laser Marking","type_codes":["L18","L01"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000260","SRC-000342","SRC-000343"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000125","legacy_id":"P00125","entity_type":"model","company_id":"CMP-000148","manufacturer":"MKS Instruments","family_id":"PRD-000117","family_name":"Picosecond laser","model_number":"IceFyre (UV / GR50 green)","model_identified":true,"name":"Picosecond laser · IceFyre (UV / GR50 green)","equipment_id":null,"equipment_code":"BOM01","equipment_label":"BOM: Laser Source","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000010","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"Picosecond","technology_ids":["TEC-076","TEC-077","TEC-073","TEC-074"],"technology_basis":{"from_category":[],"from_laser_codes":["TEC-076","TEC-077","TEC-073","TEC-074"]},"application_text":"Micromaterials processing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Ultrafast Laser Processing; Picosecond; UV Processing; Green Laser Processing","type_codes":["L18","L19","L15","L16"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000262","SRC-000263"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000126","legacy_id":"P00126","entity_type":"model","company_id":"CMP-000146","manufacturer":"IPG Photonics","family_id":"PRD-000118","family_name":"Nanosecond pulsed fiber laser","model_number":null,"model_identified":false,"name":"Nanosecond pulsed fiber laser","equipment_id":null,"equipment_code":"BOM01","equipment_label":"BOM: Laser Source","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000010","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"Pulsed fiber laser","technology_ids":["TEC-080","TEC-075"],"technology_basis":{"from_category":[],"from_laser_codes":["TEC-080","TEC-075"]},"application_text":"Marking, micromachining","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Fiber Laser; IR Laser Processing","type_codes":["L22","L17"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000269"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000127","legacy_id":"P00127","entity_type":"model","company_id":"CMP-000146","manufacturer":"IPG Photonics","family_id":"PRD-000119","family_name":"UV laser marking module (integrated source + scan head)","model_number":null,"model_identified":false,"name":"UV laser marking module (integrated source + scan head)","equipment_id":null,"equipment_code":"BOM02","equipment_label":"BOM: Galvo","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000016","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"UV marking module","technology_ids":["TEC-059","TEC-073"],"technology_basis":{"from_category":[],"from_laser_codes":["TEC-059","TEC-073"]},"application_text":"Marking","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Marking; UV Processing","type_codes":["L01","L15"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000270"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000128","legacy_id":"P00128","entity_type":"model","company_id":"CMP-000133","manufacturer":"Wuhan Raycus Fiber Laser Technologies","family_id":"PRD-000120","family_name":"Fiber lasers","model_number":null,"model_identified":false,"name":"Fiber lasers","equipment_id":null,"equipment_code":"BOM01","equipment_label":"BOM: Laser Source","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000010","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"CW / pulsed fiber","technology_ids":["TEC-080"],"technology_basis":{"from_category":[],"from_laser_codes":["TEC-080"]},"application_text":"Industrial processing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Fiber Laser","type_codes":["L22"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000267"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000129","legacy_id":"P00129","entity_type":"model","company_id":"CMP-000134","manufacturer":"Shenzhen JPT Opto-electronics","family_id":"PRD-000121","family_name":"MOPA pulsed fiber laser","model_number":null,"model_identified":false,"name":"MOPA pulsed fiber laser","equipment_id":null,"equipment_code":"BOM01","equipment_label":"BOM: Laser Source","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000010","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"MOPA fiber","technology_ids":["TEC-080","TEC-059"],"technology_basis":{"from_category":[],"from_laser_codes":["TEC-080","TEC-059"]},"application_text":"Marking","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Fiber Laser; Laser Marking","type_codes":["L22","L01"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000266"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000130","legacy_id":"P00130","entity_type":"model","company_id":"CMP-000135","manufacturer":"Wuhan Huaray Precision Laser","family_id":"PRD-000122","family_name":"UV lasers (fs / ps / ns)","model_number":null,"model_identified":false,"name":"UV lasers (fs / ps / ns)","equipment_id":null,"equipment_code":"BOM01","equipment_label":"BOM: Laser Source","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000010","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"Solid-state UV","technology_ids":["TEC-073","TEC-077","TEC-078","TEC-081"],"technology_basis":{"from_category":[],"from_laser_codes":["TEC-073","TEC-077","TEC-078","TEC-081"]},"application_text":"Micromachining","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"UV Processing; Picosecond; Femtosecond; DPSS","type_codes":["L15","L19","L20","L23"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000265"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000131","legacy_id":"P00131","entity_type":"model","company_id":"CMP-000151","manufacturer":"Novanta (Cambridge Technology / Synrad)","family_id":"PRD-000123","family_name":"Galvanometer scanners","model_number":"62xxK / 83xxK series","model_identified":true,"name":"Galvanometer scanners · 62xxK / 83xxK series","equipment_id":null,"equipment_code":"BOM02","equipment_label":"BOM: Galvo","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000016","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"Galvanometer","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Beam steering","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000254"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000132","legacy_id":"P00132","entity_type":"model","company_id":"CMP-000151","manufacturer":"Novanta (Cambridge Technology / Synrad)","family_id":"PRD-000124","family_name":"Scan controller","model_number":"ScanMaster Controller","model_identified":true,"name":"Scan controller · ScanMaster Controller","equipment_id":null,"equipment_code":"BOM19","equipment_label":"BOM: Software","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000055","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"Scan control","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Laser marking/processing control","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000255"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000133","legacy_id":"P00133","entity_type":"model","company_id":"CMP-000152","manufacturer":"SCANLAB","family_id":"PRD-000125","family_name":"Scan heads (micromachining, multi-head)","model_number":null,"model_identified":false,"name":"Scan heads (micromachining, multi-head)","equipment_id":null,"equipment_code":"BOM02","equipment_label":"BOM: Galvo","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000016","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"Galvanometer scan systems","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Micromachining","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000251","SRC-000252"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000134","legacy_id":"P00134","entity_type":"model","company_id":"CMP-000152","manufacturer":"SCANLAB","family_id":"PRD-000126","family_name":"Diffractive optical elements","model_number":null,"model_identified":false,"name":"Diffractive optical elements","equipment_id":null,"equipment_code":"BOM20","equipment_label":"BOM: Beam Shaping / DOE","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000017","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"DOE","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Beam shaping / splitting","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000253"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000135","legacy_id":"P00135","entity_type":"model","company_id":"CMP-000153","manufacturer":"RAYLASE","family_id":"PRD-000127","family_name":"2-axis deflection units","model_number":null,"model_identified":false,"name":"2-axis deflection units","equipment_id":null,"equipment_code":"BOM02","equipment_label":"BOM: Galvo","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000016","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"Galvanometer deflection","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Marking/cutting","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000256"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000136","legacy_id":"P00136","entity_type":"model","company_id":"CMP-000136","manufacturer":"Sino-Galvo","family_id":"PRD-000128","family_name":"Galvo scanners","model_number":null,"model_identified":false,"name":"Galvo scanners","equipment_id":null,"equipment_code":"BOM02","equipment_label":"BOM: Galvo","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000016","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"Galvanometer","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Laser marking systems","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000257","SRC-000258"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000137","legacy_id":"P00137","entity_type":"model","company_id":"CMP-000154","manufacturer":"Sill Optics","family_id":"PRD-000129","family_name":"F-theta lenses & beam expanders","model_number":null,"model_identified":false,"name":"F-theta lenses & beam expanders","equipment_id":null,"equipment_code":"BOM06","equipment_label":"BOM: F-theta Lens","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000015","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"Scan optics","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"343-355 / 515-532 / 1030-1090 nm designs (catalog)","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000282"],"source_age":"VERY_STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2023-06","review_due":"2027-09-29"}},{"id":"MDL-000138","legacy_id":"P00138","entity_type":"model","company_id":"CMP-000155","manufacturer":"Wavelength Opto-Electronic","family_id":"PRD-000130","family_name":"F-theta scan lenses","model_number":"Ronar-Smith","model_identified":true,"name":"F-theta scan lenses · Ronar-Smith","equipment_id":null,"equipment_code":"BOM06","equipment_label":"BOM: F-theta Lens","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000015","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"Scan optics (>400 designs)","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Laser scanning","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000283"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000139","legacy_id":"P00139","entity_type":"model","company_id":"CMP-000156","manufacturer":"Holo/Or","family_id":"PRD-000131","family_name":"Diffractive beam shapers","model_number":null,"model_identified":false,"name":"Diffractive beam shapers","equipment_id":null,"equipment_code":"BOM20","equipment_label":"BOM: Beam Shaping / DOE","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000017","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"DOE","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Top-hat / beam shaping","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000293"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000140","legacy_id":"P00140","entity_type":"model","company_id":"CMP-000157","manufacturer":"Gooch & Housego","family_id":"PRD-000132","family_name":"Acousto-optic modulators","model_number":null,"model_identified":false,"name":"Acousto-optic modulators","equipment_id":null,"equipment_code":"BOM08","equipment_label":"BOM: AOM","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000018","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"AOM","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Pulse picking / modulation","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000292"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000141","legacy_id":"P00141","entity_type":"model","company_id":"CMP-000158","manufacturer":"Aerotech","family_id":"PRD-000133","family_name":"Precision stages for wafer dicing / inspection","model_number":null,"model_identified":false,"name":"Precision stages for wafer dicing / inspection","equipment_id":null,"equipment_code":"BOM03","equipment_label":"BOM: Motion Stage","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000004","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"Linear-motor stages","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Dicing, inspection & metrology","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000271","SRC-000272"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000142","legacy_id":"P00142","entity_type":"model","company_id":"CMP-000159","manufacturer":"Physik Instrumente (PI)","family_id":"PRD-000134","family_name":"Air-bearing linear stage","model_number":"A-110 PIglide LC","model_identified":true,"name":"Air-bearing linear stage · A-110 PIglide LC","equipment_id":null,"equipment_code":"BOM03","equipment_label":"BOM: Motion Stage","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000004","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"Air bearing, magnetic direct-drive linear motor","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Precision positioning","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000273"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000143","legacy_id":"P00143","entity_type":"model","company_id":"CMP-000160","manufacturer":"ACS Motion Control","family_id":"PRD-000135","family_name":"Motion controllers & drives","model_number":null,"model_identified":false,"name":"Motion controllers & drives","equipment_id":null,"equipment_code":"BOM13","equipment_label":"BOM: Servo Drive","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000002","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"Motion control","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Semiconductor OEM motion","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000275"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000144","legacy_id":"P00144","entity_type":"model","company_id":"CMP-000161","manufacturer":"ETEL (HEIDENHAIN group)","family_id":"PRD-000136","family_name":"Linear axis / linear motors","model_number":"TBS linear axis; IL+ motors","model_identified":true,"name":"Linear axis / linear motors · TBS linear axis; IL+ motors","equipment_id":null,"equipment_code":"BOM04","equipment_label":"BOM: Linear Motor","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000003","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"Direct drive","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Semiconductor motion","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000276"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000145","legacy_id":"P00145","entity_type":"model","company_id":"CMP-000162","manufacturer":"Renishaw","family_id":"PRD-000137","family_name":"Interferometric laser encoders","model_number":"RLE","model_identified":true,"name":"Interferometric laser encoders · RLE","equipment_id":null,"equipment_code":"BOM05","equipment_label":"BOM: Encoder","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000006","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"Interferometric encoder","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Semiconductor motion control","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000277"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000146","legacy_id":"P00146","entity_type":"model","company_id":"CMP-000163","manufacturer":"Cognex","family_id":"PRD-000138","family_name":"Wafer ID reader","model_number":"In-Sight 1740","model_identified":true,"name":"Wafer ID reader · In-Sight 1740","equipment_id":null,"equipment_code":"BOM09","equipment_label":"BOM: Camera","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000022","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"Machine vision / OCR","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer traceability","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000278","SRC-000279"],"source_age":"AGING","freshness":"Needs Review","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2026","review_due":"2027-09-29"}},{"id":"MDL-000147","legacy_id":"P00147","entity_type":"model","company_id":"CMP-000164","manufacturer":"Basler","family_id":"PRD-000139","family_name":"Industrial cameras","model_number":null,"model_identified":false,"name":"Industrial cameras","equipment_id":null,"equipment_code":"BOM09","equipment_label":"BOM: Camera","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000022","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"Area/line-scan cameras","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Semiconductor inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000280"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000148","legacy_id":"P00148","entity_type":"model","company_id":"CMP-000137","manufacturer":"Hangzhou Hikrobot","family_id":"PRD-000140","family_name":"Industrial cameras & vision","model_number":null,"model_identified":false,"name":"Industrial cameras & vision","equipment_id":null,"equipment_code":"BOM09","equipment_label":"BOM: Camera","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000022","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"Machine vision","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000281"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000149","legacy_id":"P00149","entity_type":"model","company_id":"CMP-000138","manufacturer":"TEYU S&A Chiller","family_id":"PRD-000141","family_name":"Industrial chillers","model_number":null,"model_identified":false,"name":"Industrial chillers","equipment_id":null,"equipment_code":"BOM16","equipment_label":"BOM: Chiller","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000038","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"Chiller","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Laser cooling","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000284"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000150","legacy_id":"P00150","entity_type":"model","company_id":"CMP-000166","manufacturer":"ULT AG","family_id":"PRD-000142","family_name":"Laser fume extraction","model_number":null,"model_identified":false,"name":"Laser fume extraction","equipment_id":null,"equipment_code":"BOM17","equipment_label":"BOM: Fume Extraction","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000046","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"Extraction & filtration","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Electronics & semiconductor laser processes","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000285"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000151","legacy_id":"P00151","entity_type":"model","company_id":"CMP-000168","manufacturer":"Edwards Vacuum","family_id":"PRD-000143","family_name":"Abatement system","model_number":"Atlas","model_identified":true,"name":"Abatement system · Atlas","equipment_id":"EQP-A45","equipment_code":"A45","equipment_label":"Abatement Systems","category_group":"A","segment":"Automation & Facilities","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":"Factory Automation & Infrastructure","process_ids":["PRS-059"],"technology_text":"Abatement","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Fab exhaust treatment","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000286"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000152","legacy_id":"P00152","entity_type":"model","company_id":"CMP-000023","manufacturer":"Ebara Corporation","family_id":"PRD-000144","family_name":"Dry vacuum pump + plasma abatement","model_number":null,"model_identified":false,"name":"Dry vacuum pump + plasma abatement","equipment_id":"EQP-A42","equipment_code":"A42","equipment_label":"Vacuum Systems","category_group":"A","segment":"Automation & Facilities","market_segment":"Wafer Fab","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":"Factory Automation & Infrastructure","process_ids":["PRS-059"],"technology_text":"Vacuum / abatement","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Semiconductor process exhaust","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000346"],"source_age":"AGING","freshness":"Needs Review","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":"2025-12-17","review_due":"2027-09-29"}},{"id":"MDL-000153","legacy_id":"P00153","entity_type":"model","company_id":"CMP-000170","manufacturer":"Advanced Energy","family_id":"PRD-000145","family_name":"RF plasma generators","model_number":"Paramount / Paramount Plus / eVoS","model_identified":true,"name":"RF plasma generators · Paramount / Paramount Plus / eVoS","equipment_id":null,"equipment_code":"SUB-RF","equipment_label":"RF power subsystem (etch/deposition)","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000031","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"RF power","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Etch / deposition","application_ids":["APP-013"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000290"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000154","legacy_id":"P00154","entity_type":"model","company_id":"CMP-000171","manufacturer":"Comet PCT","family_id":"PRD-000146","family_name":"RF generators & matches","model_number":null,"model_identified":false,"name":"RF generators & matches","equipment_id":null,"equipment_code":"SUB-RF","equipment_label":"RF power subsystem (etch/deposition)","category_group":"COMPONENT","segment":"Component","market_segment":"Component","is_component":true,"component_class_id":"CMPN-000031","legacy_process_step":"COMPONENT","legacy_process_name":"Component","process_ids":[],"technology_text":"RF power","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Semiconductor plasma","application_ids":["APP-013"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Active","legacy_status":"ACTIVE","maturity":"Commercial","maturity_evidence":"Marketed on official product page","launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":null,"reclassified":null,"batch":"Batch 1","verification":"VERIFIED","confidence":{"level":"HIGH"},"source_ids":["SRC-000291"],"source_age":"LIVE_PAGE_UNDATED","freshness":"Recent","quality_state":"VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-29","last_updated":"2026-09-29","last_verified":"2026-09-29","latest_source_date":null,"review_due":"2027-09-29"}},{"id":"MDL-000532","legacy_id":"P00532","entity_type":"model","company_id":"CMP-000003","manufacturer":"Lam Research","family_id":"PRD-000147","family_name":"SPEED","model_number":"SPEED (SPEED NExT, SPEED Max)","model_identified":true,"name":"SPEED · SPEED (SPEED NExT, SPEED Max)","equipment_id":"EQP-A09.04","equipment_code":"A09.04","equipment_label":"HDPCVD","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013","PRS-014"],"technology_text":"High-density plasma CVD","technology_ids":["TEC-018"],"technology_basis":{"from_category":["TEC-018"],"from_laser_codes":[]},"application_text":"Dielectric gapfill","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000926"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000533","legacy_id":"P00533","entity_type":"model","company_id":"CMP-000003","manufacturer":"Lam Research","family_id":"PRD-000148","family_name":"ALTUS","model_number":"ALTUS (Max, Max ExtremeFill, DirectFill Max, Max ICEFill, LFW)","model_identified":true,"name":"ALTUS · ALTUS (Max, Max ExtremeFill, DirectFill Max, Max ICEFill, LFW)","equipment_id":"EQP-A17","equipment_code":"A17","equipment_label":"Metallization","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS11","legacy_process_name":null,"process_ids":["PRS-025"],"technology_text":"CVD / ALD tungsten and molybdenum","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Contact, via and wordline metallization","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000927"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000534","legacy_id":"P00534","entity_type":"model","company_id":"CMP-000003","manufacturer":"Lam Research","family_id":"PRD-000149","family_name":"Striker","model_number":"Striker","model_identified":true,"name":"Striker · Striker","equipment_id":"EQP-A09.06","equipment_code":"A09.06","equipment_label":"ALD","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013","PRS-015"],"technology_text":"Single-wafer dielectric ALD","technology_ids":["TEC-019"],"technology_basis":{"from_category":["TEC-019"],"from_laser_codes":[]},"application_text":"Spacers, gapfill, patterning films","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000928"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000535","legacy_id":"P00535","entity_type":"model","company_id":"CMP-000003","manufacturer":"Lam Research","family_id":"PRD-000150","family_name":"VECTOR","model_number":"VECTOR","model_identified":true,"name":"VECTOR · VECTOR","equipment_id":"EQP-A09.02","equipment_code":"A09.02","equipment_label":"PECVD","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013","PRS-014"],"technology_text":"PECVD","technology_ids":["TEC-016"],"technology_basis":{"from_category":["TEC-016"],"from_laser_codes":[]},"application_text":"Dielectric films, hardmasks, 3D NAND stacks","application_ids":["APP-007"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000929"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000536","legacy_id":"P00536","entity_type":"model","company_id":"CMP-000003","manufacturer":"Lam Research","family_id":"PRD-000151","family_name":"Flex","model_number":"Flex","model_identified":true,"name":"Flex · Flex","equipment_id":"EQP-A08.02","equipment_code":"A08.02","equipment_label":"Plasma Etch","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS04","legacy_process_name":null,"process_ids":["PRS-020"],"technology_text":"Dielectric plasma etch","technology_ids":["TEC-009"],"technology_basis":{"from_category":["TEC-009"],"from_laser_codes":[]},"application_text":"Critical dielectric etch","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000930"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000537","legacy_id":"P00537","entity_type":"model","company_id":"CMP-000003","manufacturer":"Lam Research","family_id":"PRD-000152","family_name":"Reliant","model_number":"Reliant etch products","model_identified":true,"name":"Reliant · Reliant etch products","equipment_id":"EQP-A08","equipment_code":"A08","equipment_label":"Etching","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS04","legacy_process_name":null,"process_ids":["PRS-020"],"technology_text":"Plasma etch (mature-node platforms)","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Specialty and mature-node etch","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000931"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000538","legacy_id":"P00538","entity_type":"model","company_id":"CMP-000002","manufacturer":"Applied Materials","family_id":"PRD-000153","family_name":"Centris","model_number":"Centris Sym3","model_identified":true,"name":"Centris · Centris Sym3","equipment_id":"EQP-A08.01","equipment_code":"A08.01","equipment_label":"Dry Etch","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS04","legacy_process_name":null,"process_ids":["PRS-020"],"technology_text":"Conductor dry etch","technology_ids":["TEC-009"],"technology_basis":{"from_category":["TEC-009"],"from_laser_codes":[]},"application_text":"3D NAND, DRAM, logic conductor etch","application_ids":["APP-001","APP-006","APP-007"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000932"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000539","legacy_id":"P00539","entity_type":"model","company_id":"CMP-000002","manufacturer":"Applied Materials","family_id":"PRD-000154","family_name":"Producer","model_number":"Producer eHARP","model_identified":true,"name":"Producer · Producer eHARP","equipment_id":"EQP-A09.05","equipment_code":"A09.05","equipment_label":"SACVD","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013","PRS-014"],"technology_text":"Sub-atmospheric CVD (HARP)","technology_ids":["TEC-018"],"technology_basis":{"from_category":["TEC-018"],"from_laser_codes":[]},"application_text":"STI gapfill","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. LOW confidence: the page title names the platform but not its process category. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000933"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000540","legacy_id":"P00540","entity_type":"model","company_id":"CMP-000002","manufacturer":"Applied Materials","family_id":"PRD-000155","family_name":"SEMVision","model_number":"SEMVision H20","model_identified":true,"name":"SEMVision · SEMVision H20","equipment_id":"EQP-A24","equipment_code":"A24","equipment_label":"E-beam Inspection","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS09","legacy_process_name":null,"process_ids":["PRS-027"],"technology_text":"eBeam defect review","technology_ids":["TEC-032"],"technology_basis":{"from_category":["TEC-032"],"from_laser_codes":[]},"application_text":"Defect analysis","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. The model name appears in the URL or search-result summary of the cited page rather than in its title (LOW confidence). Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000934"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":"2025-02-19","review_due":"2027-03-29"}},{"id":"MDL-000541","legacy_id":"P00541","entity_type":"model","company_id":"CMP-000001","manufacturer":"ASML Holding","family_id":"PRD-000156","family_name":"TWINSCAN NXT","model_number":"TWINSCAN NXT:2100i","model_identified":true,"name":"TWINSCAN NXT · TWINSCAN NXT:2100i","equipment_id":"EQP-A01.03","equipment_code":"A01.03","equipment_label":"ArF","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":null,"process_ids":["PRS-018"],"technology_text":"ArF immersion scanner","technology_ids":["TEC-003"],"technology_basis":{"from_category":["TEC-003"],"from_laser_codes":[]},"application_text":"Critical immersion layers","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000935"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000542","legacy_id":"P00542","entity_type":"model","company_id":"CMP-000001","manufacturer":"ASML Holding","family_id":"PRD-000156","family_name":"TWINSCAN NXT","model_number":"TWINSCAN NXT:2150i","model_identified":true,"name":"TWINSCAN NXT · TWINSCAN NXT:2150i","equipment_id":"EQP-A01.03","equipment_code":"A01.03","equipment_label":"ArF","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":null,"process_ids":["PRS-018"],"technology_text":"ArF immersion scanner","technology_ids":["TEC-003"],"technology_basis":{"from_category":["TEC-003"],"from_laser_codes":[]},"application_text":"Critical immersion layers","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000936"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000543","legacy_id":"P00543","entity_type":"model","company_id":"CMP-000001","manufacturer":"ASML Holding","family_id":"PRD-000156","family_name":"TWINSCAN NXT","model_number":"TWINSCAN NXT:2000i","model_identified":true,"name":"TWINSCAN NXT · TWINSCAN NXT:2000i","equipment_id":"EQP-A01.03","equipment_code":"A01.03","equipment_label":"ArF","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":null,"process_ids":["PRS-018"],"technology_text":"ArF immersion scanner","technology_ids":["TEC-003"],"technology_basis":{"from_category":["TEC-003"],"from_laser_codes":[]},"application_text":"Immersion lithography","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000937"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000544","legacy_id":"P00544","entity_type":"model","company_id":"CMP-000001","manufacturer":"ASML Holding","family_id":"PRD-000157","family_name":"HMI eScan","model_number":"HMI eScan 1100","model_identified":true,"name":"HMI eScan · HMI eScan 1100","equipment_id":"EQP-A24","equipment_code":"A24","equipment_label":"E-beam Inspection","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS09","legacy_process_name":null,"process_ids":["PRS-027"],"technology_text":"Multibeam e-beam wafer inspection","technology_ids":["TEC-032"],"technology_basis":{"from_category":["TEC-032"],"from_laser_codes":[]},"application_text":"In-line defect inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000938"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000545","legacy_id":"P00545","entity_type":"model","company_id":"CMP-000001","manufacturer":"ASML Holding","family_id":"PRD-000157","family_name":"HMI eScan","model_number":"HMI eScan 1000","model_identified":true,"name":"HMI eScan · HMI eScan 1000","equipment_id":"EQP-A24","equipment_code":"A24","equipment_label":"E-beam Inspection","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS09","legacy_process_name":null,"process_ids":["PRS-027"],"technology_text":"Multibeam e-beam wafer inspection","technology_ids":["TEC-032"],"technology_basis":{"from_category":["TEC-032"],"from_laser_codes":[]},"application_text":"R&D defect inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000939"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000546","legacy_id":"P00546","entity_type":"model","company_id":"CMP-000001","manufacturer":"ASML Holding","family_id":"PRD-000157","family_name":"HMI eScan","model_number":"HMI eScan 600","model_identified":true,"name":"HMI eScan · HMI eScan 600","equipment_id":"EQP-A24","equipment_code":"A24","equipment_label":"E-beam Inspection","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS09","legacy_process_name":null,"process_ids":["PRS-027"],"technology_text":"E-beam wafer inspection","technology_ids":["TEC-032"],"technology_basis":{"from_category":["TEC-032"],"from_laser_codes":[]},"application_text":"Defect inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000940"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000547","legacy_id":"P00547","entity_type":"model","company_id":"CMP-000001","manufacturer":"ASML Holding","family_id":"PRD-000157","family_name":"HMI eScan","model_number":"HMI eScan 430","model_identified":true,"name":"HMI eScan · HMI eScan 430","equipment_id":"EQP-A24","equipment_code":"A24","equipment_label":"E-beam Inspection","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS09","legacy_process_name":null,"process_ids":["PRS-027"],"technology_text":"E-beam wafer inspection","technology_ids":["TEC-032"],"technology_basis":{"from_category":["TEC-032"],"from_laser_codes":[]},"application_text":"Pattern and electrical defect inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000941"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000548","legacy_id":"P00548","entity_type":"model","company_id":"CMP-000004","manufacturer":"Tokyo Electron (TEL)","family_id":"PRD-000158","family_name":"Episode","model_number":"Episode 1 / Episode 2 DMR","model_identified":true,"name":"Episode · Episode 1 / Episode 2 DMR","equipment_id":"EQP-A09","equipment_code":"A09","equipment_label":"Deposition","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013"],"technology_text":"Single-wafer deposition","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Advanced logic and memory deposition","application_ids":["APP-001","APP-005"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000942"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":"2024-07-08","review_due":"2027-03-29"}},{"id":"MDL-000549","legacy_id":"P00549","entity_type":"model","company_id":"CMP-000004","manufacturer":"Tokyo Electron (TEL)","family_id":"PRD-000159","family_name":"Tactras","model_number":"Tactras-UDEMAE","model_identified":true,"name":"Tactras · Tactras-UDEMAE","equipment_id":"EQP-A08","equipment_code":"A08","equipment_label":"Etching","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS04","legacy_process_name":null,"process_ids":["PRS-020"],"technology_text":"Plasma etch","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"300 mm power devices","application_ids":["APP-010"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000943"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":"2021-12-14","review_due":"2027-03-29"}},{"id":"MDL-000550","legacy_id":"P00550","entity_type":"model","company_id":"CMP-000004","manufacturer":"Tokyo Electron (TEL)","family_id":"PRD-000160","family_name":"Certas","model_number":"Certas","model_identified":true,"name":"Certas · Certas","equipment_id":"EQP-A08","equipment_code":"A08","equipment_label":"Etching","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS04","legacy_process_name":null,"process_ids":["PRS-020"],"technology_text":"Etch (process type not stated in title)","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Etch","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000944"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000551","legacy_id":"P00551","entity_type":"model","company_id":"CMP-000022","manufacturer":"Kokusai Electric","family_id":"PRD-000161","family_name":"Batch deposition","model_number":"TSURUGI-C2","model_identified":true,"name":"Batch deposition · TSURUGI-C2","equipment_id":"EQP-A09.06","equipment_code":"A09.06","equipment_label":"ALD","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013","PRS-015"],"technology_text":"Mini-batch ALD / deposition","technology_ids":["TEC-019"],"technology_basis":{"from_category":["TEC-019"],"from_laser_codes":[]},"application_text":"High-aspect-ratio conformal films","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. The model name appears in the URL or search-result summary of the cited page rather than in its title (LOW confidence). Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000320"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000552","legacy_id":"P00552","entity_type":"model","company_id":"CMP-000022","manufacturer":"Kokusai Electric","family_id":"PRD-000161","family_name":"Batch deposition","model_number":"AdvancedAce-II / QUIXACE-II","model_identified":true,"name":"Batch deposition · AdvancedAce-II / QUIXACE-II","equipment_id":"EQP-A09","equipment_code":"A09","equipment_label":"Deposition","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013"],"technology_text":"Large-batch deposition","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Batch film deposition","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. The model name appears in the URL or search-result summary of the cited page rather than in its title (LOW confidence). Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000320"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000553","legacy_id":"P00553","entity_type":"model","company_id":"CMP-000022","manufacturer":"Kokusai Electric","family_id":"PRD-000162","family_name":"Treatment","model_number":"TANDUO","model_identified":true,"name":"Treatment · TANDUO","equipment_id":"EQP-A13","equipment_code":"A13","equipment_label":"Annealing","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":null,"process_ids":["PRS-023"],"technology_text":"Single-wafer anneal / treatment","technology_ids":["TEC-028"],"technology_basis":{"from_category":["TEC-028"],"from_laser_codes":[]},"application_text":"Post-deposition film treatment","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. The model name appears in the URL or search-result summary of the cited page rather than in its title (LOW confidence). Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000320"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000554","legacy_id":"P00554","entity_type":"model","company_id":"CMP-000025","manufacturer":"NuFlare Technology","family_id":"PRD-000163","family_name":"MBM","model_number":"MBM-3000","model_identified":true,"name":"MBM · MBM-3000","equipment_id":"EQP-B07","equipment_code":"B07","equipment_label":"E-beam Mask Writing","category_group":"B","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX3","legacy_process_name":null,"process_ids":["PRS-028"],"technology_text":"Multi-beam e-beam mask writer","technology_ids":["TEC-006"],"technology_basis":{"from_category":["TEC-006"],"from_laser_codes":[]},"application_text":"Next-generation EUV masks","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000945"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":"2023","review_due":"2027-03-29"}},{"id":"MDL-000555","legacy_id":"P00555","entity_type":"model","company_id":"CMP-000027","manufacturer":"Carl Zeiss SMT","family_id":"PRD-000164","family_name":"PROVE","model_number":"PROVE","model_identified":true,"name":"PROVE · PROVE","equipment_id":"EQP-B09","equipment_code":"B09","equipment_label":"Metrology","category_group":"B","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX3","legacy_process_name":null,"process_ids":["PRS-028"],"technology_text":"Photomask registration and overlay metrology","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Mask image-placement metrology","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000946"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":"2010-09","review_due":"2027-03-29"}},{"id":"MDL-000556","legacy_id":"P00556","entity_type":"model","company_id":"CMP-000051","manufacturer":"EV Group (EVG)","family_id":"PRD-000165","family_name":"GEMINI","model_number":"GEMINI FB","model_identified":true,"name":"GEMINI · GEMINI FB","equipment_id":"EQP-D21","equipment_code":"D21","equipment_label":"Die-to-Wafer","category_group":"D","segment":"Advanced Packaging","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX5","legacy_process_name":null,"process_ids":["PRS-049"],"technology_text":"Fusion / hybrid bonding","technology_ids":["TEC-050"],"technology_basis":{"from_category":["TEC-050"],"from_laser_codes":[]},"application_text":"Collective die-to-wafer and wafer-to-wafer bonding","application_ids":["APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000947"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000557","legacy_id":"P00557","entity_type":"model","company_id":"CMP-000051","manufacturer":"EV Group (EVG)","family_id":"PRD-000165","family_name":"GEMINI","model_number":"GEMINI FB XT","model_identified":true,"name":"GEMINI · GEMINI FB XT","equipment_id":"EQP-D22","equipment_code":"D22","equipment_label":"Wafer-to-Wafer","category_group":"D","segment":"Advanced Packaging","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX5","legacy_process_name":null,"process_ids":["PRS-049"],"technology_text":"Wafer-to-wafer fusion / hybrid bonding","technology_ids":["TEC-044"],"technology_basis":{"from_category":["TEC-044"],"from_laser_codes":[]},"application_text":"300 mm W2W hybrid bonding","application_ids":["APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. The model name appears in the URL or search-result summary of the cited page rather than in its title (LOW confidence). Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000948"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000558","legacy_id":"P00558","entity_type":"model","company_id":"CMP-000043","manufacturer":"BE Semiconductor Industries (BESI)","family_id":"PRD-000166","family_name":"Datacon 8800","model_number":"Datacon 8800 CHAMEO ultra plus AC","model_identified":true,"name":"Datacon 8800 · Datacon 8800 CHAMEO ultra plus AC","equipment_id":"EQP-D21","equipment_code":"D21","equipment_label":"Die-to-Wafer","category_group":"D","segment":"Advanced Packaging","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX5","legacy_process_name":null,"process_ids":["PRS-049"],"technology_text":"Die-to-wafer hybrid bonding","technology_ids":["TEC-050"],"technology_basis":{"from_category":["TEC-050"],"from_laser_codes":[]},"application_text":"Fine-pitch Cu hybrid bonding","application_ids":["APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000949"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000559","legacy_id":"P00559","entity_type":"model","company_id":"CMP-000052","manufacturer":"SUSS MicroTec","family_id":"PRD-000167","family_name":"XBC300","model_number":"XBC300 Gen2 D2W/W2W","model_identified":true,"name":"XBC300 · XBC300 Gen2 D2W/W2W","equipment_id":"EQP-D12","equipment_code":"D12","equipment_label":"Hybrid Bonding","category_group":"D","segment":"Advanced Packaging","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX5","legacy_process_name":null,"process_ids":["PRS-051"],"technology_text":"Hybrid bonding (D2W and W2W)","technology_ids":["TEC-043"],"technology_basis":{"from_category":["TEC-043"],"from_laser_codes":[]},"application_text":"200 / 300 mm hybrid bonding","application_ids":["APP-017","APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000950"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000560","legacy_id":"P00560","entity_type":"model","company_id":"CMP-000046","manufacturer":"Kulicke & Soffa","family_id":"PRD-000168","family_name":"PIXALUX","model_number":"PIXALUX","model_identified":true,"name":"PIXALUX · PIXALUX","equipment_id":"EQP-I01","equipment_code":"I01","equipment_label":"MicroLED","category_group":"I","segment":"Display","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX6","legacy_process_name":null,"process_ids":[],"technology_text":"Mini / micro-LED placement (mass transfer)","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Mini- and micro-LED displays","application_ids":["APP-016","APP-017"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000951"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000561","legacy_id":"P00561","entity_type":"model","company_id":"CMP-000221","manufacturer":"Yield Engineering Systems (YES)","family_id":"PRD-000169","family_name":"VeroTherm","model_number":"VeroTherm","model_identified":true,"name":"VeroTherm · VeroTherm","equipment_id":"EQP-D20","equipment_code":"D20","equipment_label":"Wafer Level Packaging","category_group":"D","segment":"Advanced Packaging","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX5","legacy_process_name":null,"process_ids":["PRS-046"],"technology_text":"Formic-acid reflow","technology_ids":["TEC-046"],"technology_basis":{"from_category":["TEC-046"],"from_laser_codes":[]},"application_text":"HBM / advanced packaging reflow","application_ids":["APP-008","APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000952"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":"2025-03-27","review_due":"2027-03-29"}},{"id":"MDL-000562","legacy_id":"P00562","entity_type":"model","company_id":"CMP-000370","manufacturer":"Merck Electronics (EMD Electronics)","family_id":"PRD-000170","family_name":"CHEMGUARD","model_number":"CHEMGUARD Gen III BCD 100 / 200","model_identified":true,"name":"CHEMGUARD · CHEMGUARD Gen III BCD 100 / 200","equipment_id":"EQP-L05","equipment_code":"L05","equipment_label":"Chemical distribution","category_group":"L","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-060"],"technology_text":"Bulk automated chemical delivery","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Fab-wide chemical distribution","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000953"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000563","legacy_id":"P00563","entity_type":"model","company_id":"CMP-000370","manufacturer":"Merck Electronics (EMD Electronics)","family_id":"PRD-000170","family_name":"CHEMGUARD","model_number":"CHEMGUARD GENIII 100-426 Series","model_identified":true,"name":"CHEMGUARD · CHEMGUARD GENIII 100-426 Series","equipment_id":"EQP-A44","equipment_code":"A44","equipment_label":"Chemical Delivery Systems","category_group":"A","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-060"],"technology_text":"Automated chemical delivery","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Tool chemical supply","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000954"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000564","legacy_id":"P00564","entity_type":"model","company_id":"CMP-000350","manufacturer":"Air Liquide (Electronics)","family_id":"PRD-000171","family_name":"ALES","model_number":"Bulk chemical distribution systems","model_identified":true,"name":"ALES · Bulk chemical distribution systems","equipment_id":"EQP-L05","equipment_code":"L05","equipment_label":"Chemical distribution","category_group":"L","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-060"],"technology_text":"Bulk chemical distribution","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Fab chemical supply","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000955"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000565","legacy_id":"P00565","entity_type":"model","company_id":"CMP-000365","manufacturer":"INFICON","family_id":"PRD-000172","family_name":"FabGuard","model_number":"FabGuard","model_identified":true,"name":"FabGuard · FabGuard","equipment_id":"EQP-J15","equipment_code":"J15","equipment_label":"Factory monitoring","category_group":"J","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-058"],"technology_text":"Sensor integration and fault detection","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Tool / process monitoring","application_ids":["APP-015"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000918"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000566","legacy_id":"P00566","entity_type":"model","company_id":"CMP-000364","manufacturer":"Cimetrix (PDF Solutions)","family_id":"PRD-000173","family_name":"CIMConnect","model_number":"CIMConnect","model_identified":true,"name":"CIMConnect · CIMConnect","equipment_id":"EQP-J10","equipment_code":"J10","equipment_label":"Equipment automation","category_group":"J","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-058"],"technology_text":"SECS/GEM connectivity software","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Equipment-to-host communication","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. The model name appears in the URL or search-result summary of the cited page rather than in its title (LOW confidence). Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000917"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000567","legacy_id":"P00567","entity_type":"model","company_id":"CMP-000363","manufacturer":"Yaskawa Electric (Semiconductor robotics)","family_id":"PRD-000174","family_name":"Semistar","model_number":"Semistar Gekko MD124D","model_identified":true,"name":"Semistar · Semistar Gekko MD124D","equipment_id":"EQP-A34","equipment_code":"A34","equipment_label":"Wafer Handling","category_group":"A","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-057"],"technology_text":"Wafer-handling robot","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer transfer","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000956"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000568","legacy_id":"P00568","entity_type":"model","company_id":"CMP-000362","manufacturer":"DAS Environmental Expert","family_id":"PRD-000175","family_name":"SALIX","model_number":"SALIX","model_identified":true,"name":"SALIX · SALIX","equipment_id":"EQP-A45","equipment_code":"A45","equipment_label":"Abatement Systems","category_group":"A","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-059"],"technology_text":"Point-of-use wet-bench waste-gas abatement","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wet bench exhaust treatment","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 10 (2026-10-05): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. The model name appears in the URL or search-result summary of the cited page rather than in its title (LOW confidence). Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 10","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000957"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000155","legacy_id":"P00155","entity_type":"model","company_id":"CMP-000007","manufacturer":"SCREEN Holdings","family_id":"PRD-000176","family_name":"Single wafer cleaner","model_number":"SU-3200","model_identified":true,"name":"Single wafer cleaner · SU-3200","equipment_id":"EQP-A04","equipment_code":"A04","equipment_label":"Wafer Cleaning","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010"],"technology_text":"Single-wafer wet cleaning","technology_ids":["TEC-030"],"technology_basis":{"from_category":["TEC-030"],"from_laser_codes":[]},"application_text":"Front-end wafer cleaning","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000355"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000156","legacy_id":"P00156","entity_type":"model","company_id":"CMP-000007","manufacturer":"SCREEN Holdings","family_id":"PRD-000176","family_name":"Single wafer cleaner","model_number":"SU-3300","model_identified":true,"name":"Single wafer cleaner · SU-3300","equipment_id":"EQP-A04","equipment_code":"A04","equipment_label":"Wafer Cleaning","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010"],"technology_text":"Single-wafer wet cleaning","technology_ids":["TEC-030"],"technology_basis":{"from_category":["TEC-030"],"from_laser_codes":[]},"application_text":"Front-end wafer cleaning","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000356"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000157","legacy_id":"P00157","entity_type":"model","company_id":"CMP-000007","manufacturer":"SCREEN Holdings","family_id":"PRD-000177","family_name":"Spin scrubber","model_number":"SS-3200","model_identified":true,"name":"Spin scrubber · SS-3200","equipment_id":"EQP-A20","equipment_code":"A20","equipment_label":"Cleaning / Scrubbing","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010"],"technology_text":"Spin scrubbing","technology_ids":["TEC-030"],"technology_basis":{"from_category":["TEC-030"],"from_laser_codes":[]},"application_text":"Wafer scrub cleaning","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000357"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000158","legacy_id":"P00158","entity_type":"model","company_id":"CMP-000007","manufacturer":"SCREEN Holdings","family_id":"PRD-000177","family_name":"Spin scrubber","model_number":"SS-3200 for 200mm","model_identified":true,"name":"Spin scrubber · SS-3200 for 200mm","equipment_id":"EQP-A20","equipment_code":"A20","equipment_label":"Cleaning / Scrubbing","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010"],"technology_text":"Spin scrubbing","technology_ids":["TEC-030"],"technology_basis":{"from_category":["TEC-030"],"from_laser_codes":[]},"application_text":"Wafer scrub cleaning","application_ids":[],"material_text":null,"material_ids":[],"wafer":{"source_value":"200 mm","sizes_mm":[200],"nonstandard_mm":[],"range_mm":null,"unit":"mm"},"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000358"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000159","legacy_id":"P00159","entity_type":"model","company_id":"CMP-000007","manufacturer":"SCREEN Holdings","family_id":"PRD-000178","family_name":"Wet station","model_number":"WS-620C / WS-820L","model_identified":true,"name":"Wet station · WS-620C / WS-820L","equipment_id":"EQP-A05","equipment_code":"A05","equipment_label":"Wet Processing","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010","PRS-021"],"technology_text":"Batch wet processing","technology_ids":["TEC-030"],"technology_basis":{"from_category":["TEC-030"],"from_laser_codes":[]},"application_text":"Wet cleaning / wet processing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000359"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000160","legacy_id":"P00160","entity_type":"model","company_id":"CMP-000007","manufacturer":"SCREEN Holdings","family_id":"PRD-000179","family_name":"Coat/develop track","model_number":"DT-3000","model_identified":true,"name":"Coat/develop track · DT-3000","equipment_id":"EQP-A03","equipment_code":"A03","equipment_label":"Track Systems","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS03","legacy_process_name":null,"process_ids":["PRS-017","PRS-019"],"technology_text":"Resist coat and develop track","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Photoresist coat, bake and develop","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000360"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000161","legacy_id":"P00161","entity_type":"model","company_id":"CMP-000007","manufacturer":"SCREEN Holdings","family_id":"PRD-000179","family_name":"Coat/develop track","model_number":"RF-310A","model_identified":true,"name":"Coat/develop track · RF-310A","equipment_id":"EQP-A03","equipment_code":"A03","equipment_label":"Track Systems","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS03","legacy_process_name":null,"process_ids":["PRS-017","PRS-019"],"technology_text":"Resist coat and develop track","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Photoresist coat, bake and develop","application_ids":["APP-013"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000361"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000162","legacy_id":"P00162","entity_type":"model","company_id":"CMP-000007","manufacturer":"SCREEN Holdings","family_id":"PRD-000180","family_name":"Flash lamp annealer","model_number":"LA-3100","model_identified":true,"name":"Flash lamp annealer · LA-3100","equipment_id":"EQP-A13","equipment_code":"A13","equipment_label":"Annealing","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":null,"process_ids":["PRS-023"],"technology_text":"Flash lamp annealing","technology_ids":["TEC-028"],"technology_basis":{"from_category":["TEC-028"],"from_laser_codes":[]},"application_text":"Dopant activation / annealing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000362"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000163","legacy_id":"P00163","entity_type":"model","company_id":"CMP-000007","manufacturer":"SCREEN Holdings","family_id":"PRD-000181","family_name":"Direct imaging system for advanced packaging","model_number":"DW-3000","model_identified":true,"name":"Direct imaging system for advanced packaging · DW-3000","equipment_id":"EQP-A01.08","equipment_code":"A01.08","equipment_label":"Maskless Lithography","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":null,"process_ids":["PRS-018","PRS-045","PRS-047"],"technology_text":"Direct imaging (maskless) lithography","technology_ids":["TEC-008"],"technology_basis":{"from_category":["TEC-008"],"from_laser_codes":[]},"application_text":"Advanced packaging patterning","application_ids":["APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000363"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000164","legacy_id":"P00164","entity_type":"model","company_id":"CMP-000104","manufacturer":"ACM Research","family_id":"PRD-000182","family_name":"Ultra C SAPS","model_number":null,"model_identified":false,"name":"Ultra C SAPS","equipment_id":"EQP-A04","equipment_code":"A04","equipment_label":"Wafer Cleaning","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010"],"technology_text":"SAPS megasonic single-wafer cleaning","technology_ids":["TEC-030"],"technology_basis":{"from_category":["TEC-030"],"from_laser_codes":[]},"application_text":"Front-end wafer cleaning","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000364"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000165","legacy_id":"P00165","entity_type":"model","company_id":"CMP-000104","manufacturer":"ACM Research","family_id":"PRD-000183","family_name":"Ultra C Tahoe","model_number":null,"model_identified":false,"name":"Ultra C Tahoe","equipment_id":"EQP-A04","equipment_code":"A04","equipment_label":"Wafer Cleaning","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010"],"technology_text":"Single-wafer cleaning","technology_ids":["TEC-030"],"technology_basis":{"from_category":["TEC-030"],"from_laser_codes":[]},"application_text":"Front-end wafer cleaning","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000365"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000166","legacy_id":"P00166","entity_type":"model","company_id":"CMP-000104","manufacturer":"ACM Research","family_id":"PRD-000184","family_name":"Ultra C s","model_number":null,"model_identified":false,"name":"Ultra C s","equipment_id":"EQP-A20","equipment_code":"A20","equipment_label":"Cleaning / Scrubbing","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010"],"technology_text":"Single-wafer scrubber","technology_ids":["TEC-030"],"technology_basis":{"from_category":["TEC-030"],"from_laser_codes":[]},"application_text":"Wafer scrub cleaning","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000366"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000167","legacy_id":"P00167","entity_type":"model","company_id":"CMP-000104","manufacturer":"ACM Research","family_id":"PRD-000185","family_name":"Ultra SiC wafer cleaning tool","model_number":null,"model_identified":false,"name":"Ultra SiC wafer cleaning tool","equipment_id":"EQP-A04","equipment_code":"A04","equipment_label":"Wafer Cleaning","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010"],"technology_text":"Wet cleaning","technology_ids":["TEC-030"],"technology_basis":{"from_category":["TEC-030"],"from_laser_codes":[]},"application_text":"SiC wafer cleaning","application_ids":["APP-011"],"material_text":"SiC","material_ids":["MAT-003"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000367"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000168","legacy_id":"P00168","entity_type":"model","company_id":"CMP-000104","manufacturer":"ACM Research","family_id":"PRD-000186","family_name":"Ultra Fn furnace","model_number":null,"model_identified":false,"name":"Ultra Fn furnace","equipment_id":"EQP-A11","equipment_code":"A11","equipment_label":"Diffusion","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":null,"process_ids":["PRS-011","PRS-012"],"technology_text":"Batch furnace thermal processing","technology_ids":["TEC-027"],"technology_basis":{"from_category":["TEC-027"],"from_laser_codes":[]},"application_text":"Thermal processing","application_ids":[],"material_text":null,"material_ids":[],"wafer":{"source_value":"300 mm","sizes_mm":[300],"nonstandard_mm":[],"range_mm":null,"unit":"mm"},"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000368"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000169","legacy_id":"P00169","entity_type":"model","company_id":"CMP-000104","manufacturer":"ACM Research","family_id":"PRD-000187","family_name":"Ultra ECP ap","model_number":null,"model_identified":false,"name":"Ultra ECP ap","equipment_id":"EQP-A18","equipment_code":"A18","equipment_label":"Electroplating","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS11","legacy_process_name":null,"process_ids":["PRS-025","PRS-043","PRS-045","PRS-046","PRS-047"],"technology_text":"Electrochemical plating","technology_ids":["TEC-025"],"technology_basis":{"from_category":["TEC-025"],"from_laser_codes":[]},"application_text":"Advanced packaging plating","application_ids":["APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000369"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000170","legacy_id":"P00170","entity_type":"model","company_id":"CMP-000104","manufacturer":"ACM Research","family_id":"PRD-000188","family_name":"Ultra ECP ap-p","model_number":null,"model_identified":false,"name":"Ultra ECP ap-p","equipment_id":"EQP-A18","equipment_code":"A18","equipment_label":"Electroplating","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS11","legacy_process_name":null,"process_ids":["PRS-025","PRS-043","PRS-045","PRS-046","PRS-047"],"technology_text":"Horizontal panel electroplating","technology_ids":["TEC-025"],"technology_basis":{"from_category":["TEC-025"],"from_laser_codes":[]},"application_text":"Fan-out panel-level packaging","application_ids":["APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000370"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000171","legacy_id":"P00171","entity_type":"model","company_id":"CMP-000002","manufacturer":"Applied Materials","family_id":"PRD-000189","family_name":"Endura PVD","model_number":"Endura","model_identified":true,"name":"Endura PVD · Endura","equipment_id":"EQP-A09.07","equipment_code":"A09.07","equipment_label":"PVD","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013","PRS-016"],"technology_text":"PVD (sputtering) platform","technology_ids":["TEC-020"],"technology_basis":{"from_category":["TEC-020"],"from_laser_codes":[]},"application_text":"Metal deposition","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000371"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000172","legacy_id":"P00172","entity_type":"model","company_id":"CMP-000002","manufacturer":"Applied Materials","family_id":"PRD-000189","family_name":"Endura PVD","model_number":"Endura ALPS PVD (Co & Ni)","model_identified":true,"name":"Endura PVD · Endura ALPS PVD (Co & Ni)","equipment_id":"EQP-A09.07","equipment_code":"A09.07","equipment_label":"PVD","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013","PRS-016"],"technology_text":"PVD","technology_ids":["TEC-020"],"technology_basis":{"from_category":["TEC-020"],"from_laser_codes":[]},"application_text":"Metal deposition (Co, Ni)","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000372"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000173","legacy_id":"P00173","entity_type":"model","company_id":"CMP-000002","manufacturer":"Applied Materials","family_id":"PRD-000190","family_name":"Reflexion CMP","model_number":"Reflexion LK Prime","model_identified":true,"name":"Reflexion CMP · Reflexion LK Prime","equipment_id":"EQP-A19","equipment_code":"A19","equipment_label":"CMP","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS10","legacy_process_name":null,"process_ids":["PRS-024"],"technology_text":"CMP","technology_ids":["TEC-029"],"technology_basis":{"from_category":["TEC-029"],"from_laser_codes":[]},"application_text":"Planarisation","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000373"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000174","legacy_id":"P00174","entity_type":"model","company_id":"CMP-000002","manufacturer":"Applied Materials","family_id":"PRD-000190","family_name":"Reflexion CMP","model_number":"Reflexion LK","model_identified":true,"name":"Reflexion CMP · Reflexion LK","equipment_id":"EQP-A19","equipment_code":"A19","equipment_label":"CMP","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS10","legacy_process_name":null,"process_ids":["PRS-024"],"technology_text":"CMP","technology_ids":["TEC-029"],"technology_basis":{"from_category":["TEC-029"],"from_laser_codes":[]},"application_text":"Planarisation","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000374"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000175","legacy_id":"P00175","entity_type":"model","company_id":"CMP-000002","manufacturer":"Applied Materials","family_id":"PRD-000191","family_name":"VIISta ion implant","model_number":"VIISta Trident","model_identified":true,"name":"VIISta ion implant · VIISta Trident","equipment_id":"EQP-A10","equipment_code":"A10","equipment_label":"Ion Implantation","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS06","legacy_process_name":null,"process_ids":["PRS-022"],"technology_text":"Ion implantation","technology_ids":["TEC-026"],"technology_basis":{"from_category":["TEC-026"],"from_laser_codes":[]},"application_text":"Doping","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000375"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000176","legacy_id":"P00176","entity_type":"model","company_id":"CMP-000002","manufacturer":"Applied Materials","family_id":"PRD-000191","family_name":"VIISta ion implant","model_number":"VIISta 900XP","model_identified":true,"name":"VIISta ion implant · VIISta 900XP","equipment_id":"EQP-A10","equipment_code":"A10","equipment_label":"Ion Implantation","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS06","legacy_process_name":null,"process_ids":["PRS-022"],"technology_text":"Ion implantation","technology_ids":["TEC-026"],"technology_basis":{"from_category":["TEC-026"],"from_laser_codes":[]},"application_text":"Doping","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000376"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000177","legacy_id":"P00177","entity_type":"model","company_id":"CMP-000002","manufacturer":"Applied Materials","family_id":"PRD-000191","family_name":"VIISta ion implant","model_number":"VIISta 900 3D","model_identified":true,"name":"VIISta ion implant · VIISta 900 3D","equipment_id":"EQP-A10","equipment_code":"A10","equipment_label":"Ion Implantation","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS06","legacy_process_name":null,"process_ids":["PRS-022"],"technology_text":"Ion implantation","technology_ids":["TEC-026"],"technology_basis":{"from_category":["TEC-026"],"from_laser_codes":[]},"application_text":"Doping","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000377"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000178","legacy_id":"P00178","entity_type":"model","company_id":"CMP-000002","manufacturer":"Applied Materials","family_id":"PRD-000191","family_name":"VIISta ion implant","model_number":"VIISta HCP","model_identified":true,"name":"VIISta ion implant · VIISta HCP","equipment_id":"EQP-A10","equipment_code":"A10","equipment_label":"Ion Implantation","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS06","legacy_process_name":null,"process_ids":["PRS-022"],"technology_text":"Ion implantation","technology_ids":["TEC-026"],"technology_basis":{"from_category":["TEC-026"],"from_laser_codes":[]},"application_text":"Doping","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000378"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000179","legacy_id":"P00179","entity_type":"model","company_id":"CMP-000015","manufacturer":"Axcelis Technologies","family_id":"PRD-000192","family_name":"Purion ion implant","model_number":"Purion XE","model_identified":true,"name":"Purion ion implant · Purion XE","equipment_id":"EQP-A10","equipment_code":"A10","equipment_label":"Ion Implantation","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS06","legacy_process_name":null,"process_ids":["PRS-022"],"technology_text":"Ion implantation (high energy)","technology_ids":["TEC-026"],"technology_basis":{"from_category":["TEC-026"],"from_laser_codes":[]},"application_text":"Doping","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000379"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000180","legacy_id":"P00180","entity_type":"model","company_id":"CMP-000015","manufacturer":"Axcelis Technologies","family_id":"PRD-000192","family_name":"Purion ion implant","model_number":"Purion H200","model_identified":true,"name":"Purion ion implant · Purion H200","equipment_id":"EQP-A10","equipment_code":"A10","equipment_label":"Ion Implantation","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS06","legacy_process_name":null,"process_ids":["PRS-022"],"technology_text":"Ion implantation (single-wafer high current)","technology_ids":["TEC-026"],"technology_basis":{"from_category":["TEC-026"],"from_laser_codes":[]},"application_text":"Doping","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000380"],"source_age":"STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2024-04","review_due":"2027-03-29"}},{"id":"MDL-000181","legacy_id":"P00181","entity_type":"model","company_id":"CMP-000015","manufacturer":"Axcelis Technologies","family_id":"PRD-000192","family_name":"Purion ion implant","model_number":"Purion H","model_identified":true,"name":"Purion ion implant · Purion H","equipment_id":"EQP-A10","equipment_code":"A10","equipment_label":"Ion Implantation","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS06","legacy_process_name":null,"process_ids":["PRS-022"],"technology_text":"Ion implantation (high current)","technology_ids":["TEC-026"],"technology_basis":{"from_category":["TEC-026"],"from_laser_codes":[]},"application_text":"Doping","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000381"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000182","legacy_id":"P00182","entity_type":"model","company_id":"CMP-000015","manufacturer":"Axcelis Technologies","family_id":"PRD-000192","family_name":"Purion ion implant","model_number":"Purion M","model_identified":true,"name":"Purion ion implant · Purion M","equipment_id":"EQP-A10","equipment_code":"A10","equipment_label":"Ion Implantation","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS06","legacy_process_name":null,"process_ids":["PRS-022"],"technology_text":"Ion implantation (medium current)","technology_ids":["TEC-026"],"technology_basis":{"from_category":["TEC-026"],"from_laser_codes":[]},"application_text":"Doping","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000382"],"source_age":"CURRENT","freshness":"Recent","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2026","review_due":"2027-03-29"}},{"id":"MDL-000183","legacy_id":"P00183","entity_type":"model","company_id":"CMP-000003","manufacturer":"Lam Research","family_id":"PRD-000193","family_name":"SABRE","model_number":"SABRE 3D","model_identified":true,"name":"SABRE · SABRE 3D","equipment_id":"EQP-A18","equipment_code":"A18","equipment_label":"Electroplating","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS11","legacy_process_name":null,"process_ids":["PRS-025","PRS-043","PRS-045","PRS-046","PRS-047"],"technology_text":"Copper electrochemical deposition","technology_ids":["TEC-025"],"technology_basis":{"from_category":["TEC-025"],"from_laser_codes":[]},"application_text":"Advanced packaging interconnect plating","application_ids":["APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000383"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000184","legacy_id":"P00184","entity_type":"model","company_id":"CMP-000003","manufacturer":"Lam Research","family_id":"PRD-000194","family_name":"GAMMA","model_number":null,"model_identified":false,"name":"GAMMA","equipment_id":"EQP-A07","equipment_code":"A07","equipment_label":"Plasma Cleaning","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010","PRS-021"],"technology_text":"Downstream plasma photoresist strip","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Photoresist strip","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000384"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000185","legacy_id":"P00185","entity_type":"model","company_id":"CMP-000071","manufacturer":"PSK","family_id":"PRD-000195","family_name":"Dry strip","model_number":null,"model_identified":false,"name":"Dry strip","equipment_id":"EQP-A07","equipment_code":"A07","equipment_label":"Plasma Cleaning","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010","PRS-021"],"technology_text":"Plasma dry strip","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Photoresist strip","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000385"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000186","legacy_id":"P00186","entity_type":"model","company_id":"CMP-000004","manufacturer":"Tokyo Electron (TEL)","family_id":"PRD-000196","family_name":"CLEAN TRACK LITHIUS","model_number":"LITHIUS Pro DICE","model_identified":true,"name":"CLEAN TRACK LITHIUS · LITHIUS Pro DICE","equipment_id":"EQP-A02","equipment_code":"A02","equipment_label":"Coater / Developer","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS03","legacy_process_name":null,"process_ids":["PRS-017","PRS-019"],"technology_text":"Resist coat and develop","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Photoresist coat, bake and develop","application_ids":[],"material_text":null,"material_ids":[],"wafer":{"source_value":"300 mm","sizes_mm":[300],"nonstandard_mm":[],"range_mm":null,"unit":"mm"},"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000386"],"source_age":"CURRENT","freshness":"Recent","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2025-12-15","review_due":"2027-03-29"}},{"id":"MDL-000187","legacy_id":"P00187","entity_type":"model","company_id":"CMP-000004","manufacturer":"Tokyo Electron (TEL)","family_id":"PRD-000197","family_name":"Coater/developer ACT series","model_number":null,"model_identified":false,"name":"Coater/developer ACT series","equipment_id":"EQP-A02","equipment_code":"A02","equipment_label":"Coater / Developer","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS03","legacy_process_name":null,"process_ids":["PRS-017","PRS-019"],"technology_text":"Resist coat and develop","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Photoresist coat, bake and develop","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000387"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000188","legacy_id":"P00188","entity_type":"model","company_id":"CMP-000004","manufacturer":"Tokyo Electron (TEL)","family_id":"PRD-000198","family_name":"CLEAN TRACK Mark series","model_number":"Mark-Vz / Mark 7 / Mark 8","model_identified":true,"name":"CLEAN TRACK Mark series · Mark-Vz / Mark 7 / Mark 8","equipment_id":"EQP-A02","equipment_code":"A02","equipment_label":"Coater / Developer","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS03","legacy_process_name":null,"process_ids":["PRS-017","PRS-019"],"technology_text":"Resist coat and develop","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Photoresist coat, bake and develop","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000388"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000189","legacy_id":"P00189","entity_type":"model","company_id":"CMP-000004","manufacturer":"Tokyo Electron (TEL)","family_id":"PRD-000199","family_name":"Batch thermal processing","model_number":"EVAROS","model_identified":true,"name":"Batch thermal processing · EVAROS","equipment_id":"EQP-A11","equipment_code":"A11","equipment_label":"Diffusion","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":null,"process_ids":["PRS-011","PRS-012"],"technology_text":"Batch thermal processing","technology_ids":["TEC-027"],"technology_basis":{"from_category":["TEC-027"],"from_laser_codes":[]},"application_text":"Thermal processing (batch)","application_ids":[],"material_text":null,"material_ids":[],"wafer":{"source_value":"300 mm","sizes_mm":[300],"nonstandard_mm":[],"range_mm":null,"unit":"mm"},"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000389"],"source_age":"CURRENT","freshness":"Recent","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2025-12-15","review_due":"2027-03-29"}},{"id":"MDL-000190","legacy_id":"P00190","entity_type":"model","company_id":"CMP-000004","manufacturer":"Tokyo Electron (TEL)","family_id":"PRD-000200","family_name":"CELLESTA","model_number":"CELLESTA SCD","model_identified":true,"name":"CELLESTA · CELLESTA SCD","equipment_id":"EQP-A04","equipment_code":"A04","equipment_label":"Wafer Cleaning","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010"],"technology_text":"Single-wafer wet cleaning","technology_ids":["TEC-030"],"technology_basis":{"from_category":["TEC-030"],"from_laser_codes":[]},"application_text":"Front-end wafer cleaning","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000390"],"source_age":"VERY_STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2020-12-08","review_due":"2027-03-29"}},{"id":"MDL-000191","legacy_id":"P00191","entity_type":"model","company_id":"CMP-000004","manufacturer":"Tokyo Electron (TEL)","family_id":"PRD-000200","family_name":"CELLESTA","model_number":"CELLESTA Pro SPM","model_identified":true,"name":"CELLESTA · CELLESTA Pro SPM","equipment_id":"EQP-A04","equipment_code":"A04","equipment_label":"Wafer Cleaning","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010"],"technology_text":"Single-wafer SPM processing","technology_ids":["TEC-030"],"technology_basis":{"from_category":["TEC-030"],"from_laser_codes":[]},"application_text":"Front-end wafer cleaning","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000391"],"source_age":"VERY_STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2019-03-13","review_due":"2027-03-29"}},{"id":"MDL-000192","legacy_id":"P00192","entity_type":"model","company_id":"CMP-000004","manufacturer":"Tokyo Electron (TEL)","family_id":"PRD-000200","family_name":"CELLESTA","model_number":"CELLESTA MS2","model_identified":true,"name":"CELLESTA · CELLESTA MS2","equipment_id":"EQP-A04","equipment_code":"A04","equipment_label":"Wafer Cleaning","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010"],"technology_text":"Surface preparation","technology_ids":["TEC-030"],"technology_basis":{"from_category":["TEC-030"],"from_laser_codes":[]},"application_text":"Front-end wafer cleaning","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000392"],"source_age":"STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2022-12-12","review_due":"2027-03-29"}},{"id":"MDL-000193","legacy_id":"P00193","entity_type":"model","company_id":"CMP-000004","manufacturer":"Tokyo Electron (TEL)","family_id":"PRD-000201","family_name":"ANTARES cleaning series","model_number":null,"model_identified":false,"name":"ANTARES cleaning series","equipment_id":"EQP-A06","equipment_code":"A06","equipment_label":"Dry Cleaning","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010"],"technology_text":"Surface preparation (cleaning)","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Front-end wafer cleaning","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000393"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000194","legacy_id":"P00194","entity_type":"model","company_id":"CMP-000004","manufacturer":"Tokyo Electron (TEL)","family_id":"PRD-000202","family_name":"Ulucus","model_number":"Ulucus LX","model_identified":true,"name":"Ulucus · Ulucus LX","equipment_id":"EQP-A15","equipment_code":"A15","equipment_label":"Laser Processing","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":null,"process_ids":[],"technology_text":"Laser lift-off for wafer-bonded devices","technology_ids":["TEC-068","TEC-072"],"technology_basis":{"from_category":["TEC-072"],"from_laser_codes":["TEC-068"]},"application_text":"3D integration (wafer-bonded devices)","application_ids":["APP-019"],"material_text":null,"material_ids":[],"wafer":{"source_value":"300 mm","sizes_mm":[300],"nonstandard_mm":[],"range_mm":null,"unit":"mm"},"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Lift-Off","type_codes":["L10"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000394"],"source_age":"AGING","freshness":"Needs Review","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2024-12-09","review_due":"2027-03-29"}},{"id":"MDL-000195","legacy_id":"P00195","entity_type":"model","company_id":"CMP-000004","manufacturer":"Tokyo Electron (TEL)","family_id":"PRD-000202","family_name":"Ulucus","model_number":"Ulucus L","model_identified":true,"name":"Ulucus · Ulucus L","equipment_id":"EQP-A15","equipment_code":"A15","equipment_label":"Laser Processing","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":null,"process_ids":[],"technology_text":"Laser edge trimming for wafer-bonded devices","technology_ids":["TEC-072"],"technology_basis":{"from_category":["TEC-072"],"from_laser_codes":[]},"application_text":"3D integration (wafer-bonded devices)","application_ids":["APP-019"],"material_text":null,"material_ids":[],"wafer":{"source_value":"300 mm","sizes_mm":[300],"nonstandard_mm":[],"range_mm":null,"unit":"mm"},"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser edge trimming","type_codes":[],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000395"],"source_age":"STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2022-06-08","review_due":"2027-03-29"}},{"id":"MDL-000196","legacy_id":"P00196","entity_type":"model","company_id":"CMP-000004","manufacturer":"Tokyo Electron (TEL)","family_id":"PRD-000203","family_name":"Synapse 3D integration series","model_number":null,"model_identified":false,"name":"Synapse 3D integration series","equipment_id":"EQP-C18","equipment_code":"C18","equipment_label":"Wafer Bonding","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-051","PRS-052"],"technology_text":"Wafer bonding for 3D integration","technology_ids":["TEC-044"],"technology_basis":{"from_category":["TEC-044"],"from_laser_codes":[]},"application_text":"3D integration","application_ids":["APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000396"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000197","legacy_id":"P00197","entity_type":"model","company_id":"CMP-000023","manufacturer":"Ebara Corporation","family_id":"PRD-000204","family_name":"CMP system","model_number":"F-REX","model_identified":true,"name":"CMP system · F-REX","equipment_id":"EQP-A19","equipment_code":"A19","equipment_label":"CMP","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS10","legacy_process_name":null,"process_ids":["PRS-024"],"technology_text":"CMP","technology_ids":["TEC-029"],"technology_basis":{"from_category":["TEC-029"],"from_laser_codes":[]},"application_text":"Planarisation","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000397"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000198","legacy_id":"P00198","entity_type":"model","company_id":"CMP-000023","manufacturer":"Ebara Corporation","family_id":"PRD-000204","family_name":"CMP system","model_number":"FREX300XA","model_identified":true,"name":"CMP system · FREX300XA","equipment_id":"EQP-A19","equipment_code":"A19","equipment_label":"CMP","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS10","legacy_process_name":null,"process_ids":["PRS-024"],"technology_text":"CMP","technology_ids":["TEC-029"],"technology_basis":{"from_category":["TEC-029"],"from_laser_codes":[]},"application_text":"Planarisation","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000398"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000199","legacy_id":"P00199","entity_type":"model","company_id":"CMP-000023","manufacturer":"Ebara Corporation","family_id":"PRD-000205","family_name":"Dry vacuum pumps","model_number":null,"model_identified":false,"name":"Dry vacuum pumps","equipment_id":"EQP-A42","equipment_code":"A42","equipment_label":"Vacuum Systems","category_group":"A","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-059"],"technology_text":"Dry vacuum pump","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Process vacuum (subfab)","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000399"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000200","legacy_id":"P00200","entity_type":"model","company_id":"CMP-000023","manufacturer":"Ebara Corporation","family_id":"PRD-000206","family_name":"Integrated dry vacuum pump / gas abatement","model_number":null,"model_identified":false,"name":"Integrated dry vacuum pump / gas abatement","equipment_id":"EQP-A45","equipment_code":"A45","equipment_label":"Abatement Systems","category_group":"A","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-059"],"technology_text":"Dry pump with integrated exhaust gas abatement","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Exhaust abatement (subfab)","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000400"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000201","legacy_id":"P00201","entity_type":"model","company_id":"CMP-000010","manufacturer":"DISCO Corporation","family_id":"PRD-000207","family_name":"Grinder/polisher","model_number":"DGP8761","model_identified":true,"name":"Grinder/polisher · DGP8761","equipment_id":"EQP-C04","equipment_code":"C04","equipment_label":"Wafer Thinning","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX2","legacy_process_name":null,"process_ids":["PRS-030"],"technology_text":"Back-grinding and stress relief","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer thinning","application_ids":[],"material_text":null,"material_ids":[],"wafer":{"source_value":"300 mm","sizes_mm":[300],"nonstandard_mm":[],"range_mm":null,"unit":"mm"},"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000401"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000202","legacy_id":"P00202","entity_type":"model","company_id":"CMP-000010","manufacturer":"DISCO Corporation","family_id":"PRD-000207","family_name":"Grinder/polisher","model_number":"DGP8762","model_identified":true,"name":"Grinder/polisher · DGP8762","equipment_id":"EQP-C04","equipment_code":"C04","equipment_label":"Wafer Thinning","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX2","legacy_process_name":null,"process_ids":["PRS-030"],"technology_text":"Grinding / polishing","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer thinning","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000402"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000203","legacy_id":"P00203","entity_type":"model","company_id":"CMP-000010","manufacturer":"DISCO Corporation","family_id":"PRD-000208","family_name":"Grinder","model_number":"DFG8541","model_identified":true,"name":"Grinder · DFG8541","equipment_id":"EQP-C03","equipment_code":"C03","equipment_label":"Back Grinding","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX2","legacy_process_name":null,"process_ids":["PRS-030"],"technology_text":"Back grinding","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer thinning","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000403"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000204","legacy_id":"P00204","entity_type":"model","company_id":"CMP-000010","manufacturer":"DISCO Corporation","family_id":"PRD-000208","family_name":"Grinder","model_number":"DFG8540","model_identified":true,"name":"Grinder · DFG8540","equipment_id":"EQP-C03","equipment_code":"C03","equipment_label":"Back Grinding","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX2","legacy_process_name":null,"process_ids":["PRS-030"],"technology_text":"Back grinding","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer thinning","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000404"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000205","legacy_id":"P00205","entity_type":"model","company_id":"CMP-000010","manufacturer":"DISCO Corporation","family_id":"PRD-000209","family_name":"Wafer mounter","model_number":"DFM2800","model_identified":true,"name":"Wafer mounter · DFM2800","equipment_id":"EQP-C06","equipment_code":"C06","equipment_label":"Wafer Mounter","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":null,"process_ids":["PRS-031"],"technology_text":"Wafer mounting (tape frame)","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer mounting","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000405"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000206","legacy_id":"P00206","entity_type":"model","company_id":"CMP-000010","manufacturer":"DISCO Corporation","family_id":"PRD-000209","family_name":"Wafer mounter","model_number":"DMM9200","model_identified":true,"name":"Wafer mounter · DMM9200","equipment_id":"EQP-C06","equipment_code":"C06","equipment_label":"Wafer Mounter","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":null,"process_ids":["PRS-031"],"technology_text":"Wafer mounting (tape frame)","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer mounting","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000406"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000207","legacy_id":"P00207","entity_type":"model","company_id":"CMP-000012","manufacturer":"Tokyo Seimitsu (ACCRETECH)","family_id":"PRD-000210","family_name":"Polish grinder","model_number":"PG3000RMII","model_identified":true,"name":"Polish grinder · PG3000RMII","equipment_id":"EQP-C04","equipment_code":"C04","equipment_label":"Wafer Thinning","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX2","legacy_process_name":null,"process_ids":["PRS-030"],"technology_text":"Grinding and polishing","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer thinning","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000407"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000208","legacy_id":"P00208","entity_type":"model","company_id":"CMP-000012","manufacturer":"Tokyo Seimitsu (ACCRETECH)","family_id":"PRD-000211","family_name":"High rigid grinder","model_number":"HRG3000RMII","model_identified":true,"name":"High rigid grinder · HRG3000RMII","equipment_id":"EQP-C03","equipment_code":"C03","equipment_label":"Back Grinding","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX2","legacy_process_name":null,"process_ids":["PRS-030"],"technology_text":"Grinding","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer thinning","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000408"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000209","legacy_id":"P00209","entity_type":"model","company_id":"CMP-000012","manufacturer":"Tokyo Seimitsu (ACCRETECH)","family_id":"PRD-000211","family_name":"High rigid grinder","model_number":"HRG300A","model_identified":true,"name":"High rigid grinder · HRG300A","equipment_id":"EQP-C02","equipment_code":"C02","equipment_label":"Wafer Grinding","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX2","legacy_process_name":null,"process_ids":["PRS-030"],"technology_text":"Grinding (1-axis)","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer grinding","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000409"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000210","legacy_id":"P00210","entity_type":"model","company_id":"CMP-000012","manufacturer":"Tokyo Seimitsu (ACCRETECH)","family_id":"PRD-000212","family_name":"Wafer edge grinding machine","model_number":"W-GM-6200","model_identified":true,"name":"Wafer edge grinding machine · W-GM-6200","equipment_id":"EQP-K06","equipment_code":"K06","equipment_label":"Edge & surface grinding","category_group":"K","segment":"Wafer Manufacturing","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-005"],"technology_text":"Wafer edge grinding","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer edge shaping","application_ids":[],"material_text":null,"material_ids":[],"wafer":{"source_value":"450 mm","sizes_mm":[450],"nonstandard_mm":[],"range_mm":null,"unit":"mm"},"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000410"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000211","legacy_id":"P00211","entity_type":"model","company_id":"CMP-000012","manufacturer":"Tokyo Seimitsu (ACCRETECH)","family_id":"PRD-000212","family_name":"Wafer edge grinding machine","model_number":"W-GM-4200","model_identified":true,"name":"Wafer edge grinding machine · W-GM-4200","equipment_id":"EQP-K06","equipment_code":"K06","equipment_label":"Edge & surface grinding","category_group":"K","segment":"Wafer Manufacturing","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-005"],"technology_text":"Wafer edge grinding","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer edge shaping","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000411"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000212","legacy_id":"P00212","entity_type":"model","company_id":"CMP-000059","manufacturer":"Lintec","family_id":"PRD-000213","family_name":"Back grinding tape laminator","model_number":null,"model_identified":false,"name":"Back grinding tape laminator","equipment_id":"EQP-C03","equipment_code":"C03","equipment_label":"Back Grinding","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX2","legacy_process_name":null,"process_ids":["PRS-030"],"technology_text":"Back-grinding tape lamination","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer thinning (surface protection)","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000412"],"source_age":"VERY_STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2017-04-28","review_due":"2027-03-29"}},{"id":"MDL-000213","legacy_id":"P00213","entity_type":"model","company_id":"CMP-000008","manufacturer":"Advantest","family_id":"PRD-000214","family_name":"SoC test system","model_number":"V93000","model_identified":true,"name":"SoC test system · V93000","equipment_id":"EQP-C40","equipment_code":"C40","equipment_label":"IC Test","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-041"],"technology_text":"Automated test equipment (SoC)","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"IC test","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000413"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000214","legacy_id":"P00214","entity_type":"model","company_id":"CMP-000008","manufacturer":"Advantest","family_id":"PRD-000214","family_name":"SoC test system","model_number":"T2000","model_identified":true,"name":"SoC test system · T2000","equipment_id":"EQP-C40","equipment_code":"C40","equipment_label":"IC Test","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-041"],"technology_text":"Automated test equipment (SoC)","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"IC test","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000414"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000215","legacy_id":"P00215","entity_type":"model","company_id":"CMP-000008","manufacturer":"Advantest","family_id":"PRD-000214","family_name":"SoC test system","model_number":"T2000 AiR2X","model_identified":true,"name":"SoC test system · T2000 AiR2X","equipment_id":"EQP-C40","equipment_code":"C40","equipment_label":"IC Test","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-041"],"technology_text":"Automated test equipment (SoC / power analog)","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"IC test","application_ids":["APP-009"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000415"],"source_age":"CURRENT","freshness":"Recent","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2025-12-11","review_due":"2027-03-29"}},{"id":"MDL-000216","legacy_id":"P00216","entity_type":"model","company_id":"CMP-000009","manufacturer":"Teradyne","family_id":"PRD-000215","family_name":"SoC tester","model_number":"UltraFLEXplus","model_identified":true,"name":"SoC tester · UltraFLEXplus","equipment_id":"EQP-C40","equipment_code":"C40","equipment_label":"IC Test","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-041"],"technology_text":"Automated test equipment (SoC)","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"IC test","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000416"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000217","legacy_id":"P00217","entity_type":"model","company_id":"CMP-000009","manufacturer":"Teradyne","family_id":"PRD-000215","family_name":"SoC tester","model_number":"UltraFLEX","model_identified":true,"name":"SoC tester · UltraFLEX","equipment_id":"EQP-C40","equipment_code":"C40","equipment_label":"IC Test","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-041"],"technology_text":"Automated test equipment (SoC)","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"IC test","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000417"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000218","legacy_id":"P00218","entity_type":"model","company_id":"CMP-000009","manufacturer":"Teradyne","family_id":"PRD-000216","family_name":"J750 tester","model_number":"J750Ex-HD family","model_identified":true,"name":"J750 tester · J750Ex-HD family","equipment_id":"EQP-C40","equipment_code":"C40","equipment_label":"IC Test","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-041"],"technology_text":"Automated test equipment","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"IC test (wafer sort and final test)","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000418"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000219","legacy_id":"P00219","entity_type":"model","company_id":"CMP-000037","manufacturer":"Chroma ATE","family_id":"PRD-000217","family_name":"SoC test system","model_number":"3680","model_identified":true,"name":"SoC test system · 3680","equipment_id":"EQP-C40","equipment_code":"C40","equipment_label":"IC Test","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-041"],"technology_text":"Automated test equipment (SoC / analog)","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"IC test","application_ids":["APP-009"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000419"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000220","legacy_id":"P00220","entity_type":"model","company_id":"CMP-000005","manufacturer":"KLA Corporation","family_id":"PRD-000218","family_name":"Surfscan unpatterned wafer inspection","model_number":"Surfscan SP7XP","model_identified":true,"name":"Surfscan unpatterned wafer inspection · Surfscan SP7XP","equipment_id":"EQP-A21","equipment_code":"A21","equipment_label":"Wafer Inspection","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS09","legacy_process_name":null,"process_ids":["PRS-027"],"technology_text":"Unpatterned wafer inspection","technology_ids":["TEC-031"],"technology_basis":{"from_category":["TEC-031"],"from_laser_codes":[]},"application_text":"Wafer defect inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000420"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000221","legacy_id":"P00221","entity_type":"model","company_id":"CMP-000005","manufacturer":"KLA Corporation","family_id":"PRD-000218","family_name":"Surfscan unpatterned wafer inspection","model_number":"Surfscan SP A2 / SP A3","model_identified":true,"name":"Surfscan unpatterned wafer inspection · Surfscan SP A2 / SP A3","equipment_id":"EQP-A21","equipment_code":"A21","equipment_label":"Wafer Inspection","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS09","legacy_process_name":null,"process_ids":["PRS-027"],"technology_text":"Unpatterned wafer inspection","technology_ids":["TEC-031"],"technology_basis":{"from_category":["TEC-031"],"from_laser_codes":[]},"application_text":"Wafer defect inspection (automotive)","application_ids":["APP-020"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000421"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000222","legacy_id":"P00222","entity_type":"model","company_id":"CMP-000005","manufacturer":"KLA Corporation","family_id":"PRD-000219","family_name":"Patterned wafer geometry","model_number":"PWG5","model_identified":true,"name":"Patterned wafer geometry · PWG5","equipment_id":"EQP-A30","equipment_code":"A30","equipment_label":"Wafer Surface Measurement","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS08","legacy_process_name":null,"process_ids":["PRS-008","PRS-026"],"technology_text":"Wafer geometry metrology","technology_ids":["TEC-035"],"technology_basis":{"from_category":["TEC-035"],"from_laser_codes":[]},"application_text":"Wafer shape / stress measurement","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000422"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000223","legacy_id":"P00223","entity_type":"model","company_id":"CMP-000005","manufacturer":"KLA Corporation","family_id":"PRD-000220","family_name":"Voyager patterned wafer inspection","model_number":"Voyager 1015","model_identified":true,"name":"Voyager patterned wafer inspection · Voyager 1015","equipment_id":"EQP-A22","equipment_code":"A22","equipment_label":"Defect Inspection","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS09","legacy_process_name":null,"process_ids":["PRS-027"],"technology_text":"Patterned wafer defect inspection","technology_ids":["TEC-031"],"technology_basis":{"from_category":["TEC-031"],"from_laser_codes":[]},"application_text":"Wafer defect inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000423"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000224","legacy_id":"P00224","entity_type":"model","company_id":"CMP-000005","manufacturer":"KLA Corporation","family_id":"PRD-000221","family_name":"ICOS packaged IC inspection","model_number":"ICOS T890","model_identified":true,"name":"ICOS packaged IC inspection · ICOS T890","equipment_id":"EQP-C34","equipment_code":"C34","equipment_label":"Package Inspection","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-040"],"technology_text":"Packaged IC inspection and metrology","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Package inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000424"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000225","legacy_id":"P00225","entity_type":"model","company_id":"CMP-000005","manufacturer":"KLA Corporation","family_id":"PRD-000221","family_name":"ICOS packaged IC inspection","model_number":"ICOS T3 / T7 series","model_identified":true,"name":"ICOS packaged IC inspection · ICOS T3 / T7 series","equipment_id":"EQP-C34","equipment_code":"C34","equipment_label":"Package Inspection","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-040"],"technology_text":"Packaged IC inspection and metrology","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Package inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000425"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000226","legacy_id":"P00226","entity_type":"model","company_id":"CMP-000005","manufacturer":"KLA Corporation","family_id":"PRD-000221","family_name":"ICOS packaged IC inspection","model_number":"ICOS CI-T620","model_identified":true,"name":"ICOS packaged IC inspection · ICOS CI-T620","equipment_id":"EQP-C34","equipment_code":"C34","equipment_label":"Package Inspection","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-040"],"technology_text":"Packaged IC component inspection","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Package inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000426"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000227","legacy_id":"P00227","entity_type":"model","company_id":"CMP-000005","manufacturer":"KLA Corporation","family_id":"PRD-000221","family_name":"ICOS packaged IC inspection","model_number":"ICOS F160","model_identified":true,"name":"ICOS packaged IC inspection · ICOS F160","equipment_id":"EQP-C34","equipment_code":"C34","equipment_label":"Package Inspection","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-040"],"technology_text":"Package inspection","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Package inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000427"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000228","legacy_id":"P00228","entity_type":"model","company_id":"CMP-000005","manufacturer":"KLA Corporation","family_id":"PRD-000222","family_name":"Kronos wafer inspection","model_number":"Kronos 1080","model_identified":true,"name":"Kronos wafer inspection · Kronos 1080","equipment_id":"EQP-A21","equipment_code":"A21","equipment_label":"Wafer Inspection","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS09","legacy_process_name":null,"process_ids":["PRS-027"],"technology_text":"Wafer inspection","technology_ids":["TEC-031"],"technology_basis":{"from_category":["TEC-031"],"from_laser_codes":[]},"application_text":"IC packaging inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000427"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000229","legacy_id":"P00229","entity_type":"model","company_id":"CMP-000005","manufacturer":"KLA Corporation","family_id":"PRD-000223","family_name":"SPTS advanced packaging etch","model_number":null,"model_identified":false,"name":"SPTS advanced packaging etch","equipment_id":"EQP-A08.05","equipment_code":"A08.05","equipment_label":"Deep Reactive Ion Etch","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS04","legacy_process_name":null,"process_ids":["PRS-020","PRS-043"],"technology_text":"Silicon deep etch (via reveal)","technology_ids":["TEC-012"],"technology_basis":{"from_category":["TEC-012"],"from_laser_codes":[]},"application_text":"TSV via reveal / advanced packaging","application_ids":["APP-019"],"material_text":null,"material_ids":["MAT-001"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000428"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000230","legacy_id":"P00230","entity_type":"model","company_id":"CMP-000021","manufacturer":"Hitachi High-Tech","family_id":"PRD-000224","family_name":"Dark field wafer defect inspection","model_number":"DI2800","model_identified":true,"name":"Dark field wafer defect inspection · DI2800","equipment_id":"EQP-A22","equipment_code":"A22","equipment_label":"Defect Inspection","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS09","legacy_process_name":null,"process_ids":["PRS-027"],"technology_text":"Dark field optical inspection","technology_ids":["TEC-031"],"technology_basis":{"from_category":["TEC-031"],"from_laser_codes":[]},"application_text":"Patterned wafer defect inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000429"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000231","legacy_id":"P00231","entity_type":"model","company_id":"CMP-000021","manufacturer":"Hitachi High-Tech","family_id":"PRD-000224","family_name":"Dark field wafer defect inspection","model_number":"DI4600","model_identified":true,"name":"Dark field wafer defect inspection · DI4600","equipment_id":"EQP-A22","equipment_code":"A22","equipment_label":"Defect Inspection","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS09","legacy_process_name":null,"process_ids":["PRS-027"],"technology_text":"Dark field optical inspection","technology_ids":["TEC-031"],"technology_basis":{"from_category":["TEC-031"],"from_laser_codes":[]},"application_text":"Patterned wafer defect inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000430"],"source_age":"STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2023-12-06","review_due":"2027-03-29"}},{"id":"MDL-000232","legacy_id":"P00232","entity_type":"model","company_id":"CMP-000021","manufacturer":"Hitachi High-Tech","family_id":"PRD-000225","family_name":"CD-SEM","model_number":"CG7300","model_identified":true,"name":"CD-SEM · CG7300","equipment_id":"EQP-A26","equipment_code":"A26","equipment_label":"CD-SEM","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS08","legacy_process_name":null,"process_ids":["PRS-026"],"technology_text":"CD-SEM metrology","technology_ids":["TEC-034"],"technology_basis":{"from_category":["TEC-034"],"from_laser_codes":[]},"application_text":"Critical dimension measurement","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000431"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000233","legacy_id":"P00233","entity_type":"model","company_id":"CMP-000021","manufacturer":"Hitachi High-Tech","family_id":"PRD-000225","family_name":"CD-SEM","model_number":"GT2000","model_identified":true,"name":"CD-SEM · GT2000","equipment_id":"EQP-A26","equipment_code":"A26","equipment_label":"CD-SEM","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS08","legacy_process_name":null,"process_ids":["PRS-026"],"technology_text":"Electron beam metrology","technology_ids":["TEC-034"],"technology_basis":{"from_category":["TEC-034"],"from_laser_codes":[]},"application_text":"Critical dimension measurement","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000432"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000234","legacy_id":"P00234","entity_type":"model","company_id":"CMP-000021","manufacturer":"Hitachi High-Tech","family_id":"PRD-000225","family_name":"CD-SEM","model_number":"CS4800","model_identified":true,"name":"CD-SEM · CS4800","equipment_id":"EQP-A26","equipment_code":"A26","equipment_label":"CD-SEM","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS08","legacy_process_name":null,"process_ids":["PRS-026"],"technology_text":"CD-SEM metrology","technology_ids":["TEC-034"],"technology_basis":{"from_category":["TEC-034"],"from_laser_codes":[]},"application_text":"Critical dimension measurement","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000433"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000235","legacy_id":"P00235","entity_type":"model","company_id":"CMP-000021","manufacturer":"Hitachi High-Tech","family_id":"PRD-000226","family_name":"Defect review SEM","model_number":"CR7300","model_identified":true,"name":"Defect review SEM · CR7300","equipment_id":"EQP-A24","equipment_code":"A24","equipment_label":"E-beam Inspection","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS09","legacy_process_name":null,"process_ids":["PRS-027"],"technology_text":"E-beam defect review","technology_ids":["TEC-032"],"technology_basis":{"from_category":["TEC-032"],"from_laser_codes":[]},"application_text":"Defect review","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000434"],"source_age":"VERY_STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2020-11-26","review_due":"2027-03-29"}},{"id":"MDL-000236","legacy_id":"P00236","entity_type":"model","company_id":"CMP-000016","manufacturer":"Onto Innovation","family_id":"PRD-000227","family_name":"Dragonfly inspection","model_number":"Dragonfly G5","model_identified":true,"name":"Dragonfly inspection · Dragonfly G5","equipment_id":"EQP-A21","equipment_code":"A21","equipment_label":"Wafer Inspection","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS09","legacy_process_name":null,"process_ids":["PRS-027"],"technology_text":"2D/3D inspection and metrology","technology_ids":["TEC-031"],"technology_basis":{"from_category":["TEC-031"],"from_laser_codes":[]},"application_text":"Advanced packaging inspection","application_ids":["APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000435"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000237","legacy_id":"P00237","entity_type":"model","company_id":"CMP-000016","manufacturer":"Onto Innovation","family_id":"PRD-000228","family_name":"Firefly panel inspection","model_number":"Firefly G3","model_identified":true,"name":"Firefly panel inspection · Firefly G3","equipment_id":"EQP-C36","equipment_code":"C36","equipment_label":"AOI","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-040"],"technology_text":"Automated optical inspection","technology_ids":["TEC-031"],"technology_basis":{"from_category":["TEC-031"],"from_laser_codes":[]},"application_text":"Panel-level packaging inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000436"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000238","legacy_id":"P00238","entity_type":"model","company_id":"CMP-000016","manufacturer":"Onto Innovation","family_id":"PRD-000229","family_name":"JetStep lithography","model_number":"JetStep S3500","model_identified":true,"name":"JetStep lithography · JetStep S3500","equipment_id":"EQP-A01","equipment_code":"A01","equipment_label":"Lithography","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":null,"process_ids":["PRS-018"],"technology_text":"Advanced packaging lithography","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Panel substrates","application_ids":["APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000437"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000239","legacy_id":"P00239","entity_type":"model","company_id":"CMP-000016","manufacturer":"Onto Innovation","family_id":"PRD-000229","family_name":"JetStep lithography","model_number":"JetStep X500","model_identified":true,"name":"JetStep lithography · JetStep X500","equipment_id":"EQP-A01","equipment_code":"A01","equipment_label":"Lithography","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":null,"process_ids":["PRS-018"],"technology_text":"Panel lithography","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Advanced packaging (panel substrates)","application_ids":["APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000438"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000240","legacy_id":"P00240","entity_type":"model","company_id":"CMP-000018","manufacturer":"Camtek","family_id":"PRD-000230","family_name":"Eagle inspection","model_number":"Eagle G5","model_identified":true,"name":"Eagle inspection · Eagle G5","equipment_id":"EQP-A21","equipment_code":"A21","equipment_label":"Wafer Inspection","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS09","legacy_process_name":null,"process_ids":["PRS-027"],"technology_text":"2D inspection / 3D metrology","technology_ids":["TEC-031"],"technology_basis":{"from_category":["TEC-031"],"from_laser_codes":[]},"application_text":"Advanced packaging inspection","application_ids":["APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000439"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000241","legacy_id":"P00241","entity_type":"model","company_id":"CMP-000018","manufacturer":"Camtek","family_id":"PRD-000230","family_name":"Eagle inspection","model_number":"Eagle-AP Plus","model_identified":true,"name":"Eagle inspection · Eagle-AP Plus","equipment_id":"EQP-A21","equipment_code":"A21","equipment_label":"Wafer Inspection","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS09","legacy_process_name":null,"process_ids":["PRS-027"],"technology_text":"Bump inspection and metrology","technology_ids":["TEC-031"],"technology_basis":{"from_category":["TEC-031"],"from_laser_codes":[]},"application_text":"Wafer bump inspection (advanced packaging)","application_ids":["APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000440"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000242","legacy_id":"P00242","entity_type":"model","company_id":"CMP-000018","manufacturer":"Camtek","family_id":"PRD-000230","family_name":"Eagle inspection","model_number":"Eagle-i","model_identified":true,"name":"Eagle inspection · Eagle-i","equipment_id":"EQP-A21","equipment_code":"A21","equipment_label":"Wafer Inspection","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS09","legacy_process_name":null,"process_ids":["PRS-027"],"technology_text":"2D surface inspection","technology_ids":["TEC-031"],"technology_basis":{"from_category":["TEC-031"],"from_laser_codes":[]},"application_text":"Wafer inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000441"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000243","legacy_id":"P00243","entity_type":"model","company_id":"CMP-000018","manufacturer":"Camtek","family_id":"PRD-000231","family_name":"Golden Eagle","model_number":"Golden Eagle","model_identified":true,"name":"Golden Eagle · Golden Eagle","equipment_id":"EQP-A30","equipment_code":"A30","equipment_label":"Wafer Surface Measurement","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS08","legacy_process_name":null,"process_ids":["PRS-008","PRS-026"],"technology_text":"Optical surface measurement","technology_ids":["TEC-035"],"technology_basis":{"from_category":["TEC-035"],"from_laser_codes":[]},"application_text":"Panel-level packaging","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000442"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000244","legacy_id":"P00244","entity_type":"model","company_id":"CMP-000018","manufacturer":"Camtek","family_id":"PRD-000232","family_name":"Hawk","model_number":"Hawk","model_identified":true,"name":"Hawk · Hawk","equipment_id":"EQP-A21","equipment_code":"A21","equipment_label":"Wafer Inspection","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS09","legacy_process_name":null,"process_ids":["PRS-027"],"technology_text":"Inspection and metrology","technology_ids":["TEC-031"],"technology_basis":{"from_category":["TEC-031"],"from_laser_codes":[]},"application_text":"Inspection and metrology","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000443"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000245","legacy_id":"P00245","entity_type":"model","company_id":"CMP-000041","manufacturer":"ViTrox","family_id":"PRD-000233","family_name":"Vision inspection handler","model_number":"TR3000i","model_identified":true,"name":"Vision inspection handler · TR3000i","equipment_id":"EQP-C34","equipment_code":"C34","equipment_label":"Package Inspection","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-040"],"technology_text":"Vision inspection handler (tray to tape & reel)","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Package inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000444"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000246","legacy_id":"P00246","entity_type":"model","company_id":"CMP-000041","manufacturer":"ViTrox","family_id":"PRD-000233","family_name":"Vision inspection handler","model_number":"TH3000i","model_identified":true,"name":"Vision inspection handler · TH3000i","equipment_id":"EQP-C34","equipment_code":"C34","equipment_label":"Package Inspection","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-040"],"technology_text":"Vision inspection handler (tray to tray)","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Package inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000445"],"source_age":"VERY_STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2020-09-24","review_due":"2027-03-29"}},{"id":"MDL-000247","legacy_id":"P00247","entity_type":"model","company_id":"CMP-000206","manufacturer":"Nordson Corporation","family_id":"PRD-000234","family_name":"Quadra X-ray inspection","model_number":"Quadra 7 Pro","model_identified":true,"name":"Quadra X-ray inspection · Quadra 7 Pro","equipment_id":"EQP-C35","equipment_code":"C35","equipment_label":"X-ray Inspection","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-040"],"technology_text":"X-ray inspection","technology_ids":["TEC-033"],"technology_basis":{"from_category":["TEC-033"],"from_laser_codes":[]},"application_text":"X-ray inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000446"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000248","legacy_id":"P00248","entity_type":"model","company_id":"CMP-000206","manufacturer":"Nordson Corporation","family_id":"PRD-000234","family_name":"Quadra X-ray inspection","model_number":"Quadra 5 Pro","model_identified":true,"name":"Quadra X-ray inspection · Quadra 5 Pro","equipment_id":"EQP-C35","equipment_code":"C35","equipment_label":"X-ray Inspection","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-040"],"technology_text":"X-ray inspection","technology_ids":["TEC-033"],"technology_basis":{"from_category":["TEC-033"],"from_laser_codes":[]},"application_text":"X-ray inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000447"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000249","legacy_id":"P00249","entity_type":"model","company_id":"CMP-000024","manufacturer":"Lasertec","family_id":"PRD-000235","family_name":"ACTIS","model_number":"ACTIS A150","model_identified":true,"name":"ACTIS · ACTIS A150","equipment_id":"EQP-B02","equipment_code":"B02","equipment_label":"Mask Inspection","category_group":"B","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX3","legacy_process_name":null,"process_ids":["PRS-028"],"technology_text":"Actinic EUV patterned mask inspection","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"EUV mask inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000448"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000250","legacy_id":"P00250","entity_type":"model","company_id":"CMP-000024","manufacturer":"Lasertec","family_id":"PRD-000235","family_name":"ACTIS","model_number":"ACTIS A300 Series","model_identified":true,"name":"ACTIS · ACTIS A300 Series","equipment_id":"EQP-B02","equipment_code":"B02","equipment_label":"Mask Inspection","category_group":"B","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX3","legacy_process_name":null,"process_ids":["PRS-028"],"technology_text":"Actinic EUV patterned mask inspection","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"EUV mask inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000322"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000251","legacy_id":"P00251","entity_type":"model","company_id":"CMP-000024","manufacturer":"Lasertec","family_id":"PRD-000236","family_name":"MATRICS","model_number":"MATRICS X9ULTRA Series","model_identified":true,"name":"MATRICS · MATRICS X9ULTRA Series","equipment_id":"EQP-B03","equipment_code":"B03","equipment_label":"Reticle Inspection","category_group":"B","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX3","legacy_process_name":null,"process_ids":["PRS-028"],"technology_text":"Mask inspection","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Reticle inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000449"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000252","legacy_id":"P00252","entity_type":"model","company_id":"CMP-000024","manufacturer":"Lasertec","family_id":"PRD-000236","family_name":"MATRICS","model_number":"MATRICS X8ULTRA Series","model_identified":true,"name":"MATRICS · MATRICS X8ULTRA Series","equipment_id":"EQP-B03","equipment_code":"B03","equipment_label":"Reticle Inspection","category_group":"B","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX3","legacy_process_name":null,"process_ids":["PRS-028"],"technology_text":"Mask inspection","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Reticle inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000450"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000253","legacy_id":"P00253","entity_type":"model","company_id":"CMP-000024","manufacturer":"Lasertec","family_id":"PRD-000236","family_name":"MATRICS","model_number":"MATRICS X810EX Series","model_identified":true,"name":"MATRICS · MATRICS X810EX Series","equipment_id":"EQP-B03","equipment_code":"B03","equipment_label":"Reticle Inspection","category_group":"B","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX3","legacy_process_name":null,"process_ids":["PRS-028"],"technology_text":"Mask inspection","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Reticle inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000451"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000254","legacy_id":"P00254","entity_type":"model","company_id":"CMP-000026","manufacturer":"Mycronic","family_id":"PRD-000237","family_name":"SLX semiconductor mask writer","model_number":"SLX series","model_identified":true,"name":"SLX semiconductor mask writer · SLX series","equipment_id":"EQP-B08","equipment_code":"B08","equipment_label":"Optical Mask Writing","category_group":"B","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX3","legacy_process_name":null,"process_ids":["PRS-028"],"technology_text":"Optical mask writing","technology_ids":["TEC-008"],"technology_basis":{"from_category":["TEC-008"],"from_laser_codes":[]},"application_text":"Photomask writing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000452"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000255","legacy_id":"P00255","entity_type":"model","company_id":"CMP-000026","manufacturer":"Mycronic","family_id":"PRD-000238","family_name":"MMX mask metrology","model_number":"MMX","model_identified":true,"name":"MMX mask metrology · MMX","equipment_id":"EQP-B09","equipment_code":"B09","equipment_label":"Metrology","category_group":"B","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX3","legacy_process_name":null,"process_ids":["PRS-028"],"technology_text":"Mask metrology","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Photomask metrology","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000453"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000256","legacy_id":"P00256","entity_type":"model","company_id":"CMP-000038","manufacturer":"Techwing","family_id":"PRD-000239","family_name":"Memory test handler","model_number":null,"model_identified":false,"name":"Memory test handler","equipment_id":"EQP-C39","equipment_code":"C39","equipment_label":"Handler","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-041"],"technology_text":"Test handler","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"Memory device test","application_ids":["APP-005"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000454"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000257","legacy_id":"P00257","entity_type":"model","company_id":"CMP-000038","manufacturer":"Techwing","family_id":"PRD-000240","family_name":"Logic test handler","model_number":null,"model_identified":false,"name":"Logic test handler","equipment_id":"EQP-C39","equipment_code":"C39","equipment_label":"Handler","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-041"],"technology_text":"Test handler","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"Logic device test","application_ids":["APP-001"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000455"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000258","legacy_id":"P00258","entity_type":"model","company_id":"CMP-000038","manufacturer":"Techwing","family_id":"PRD-000241","family_name":"SLT handler","model_number":null,"model_identified":false,"name":"SLT handler","equipment_id":"EQP-C39","equipment_code":"C39","equipment_label":"Handler","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-041"],"technology_text":"System-level test handler","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"System-level test","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000456"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000259","legacy_id":"P00259","entity_type":"model","company_id":"CMP-000038","manufacturer":"Techwing","family_id":"PRD-000242","family_name":"Tri-temp handler","model_number":"M5","model_identified":true,"name":"Tri-temp handler · M5","equipment_id":"EQP-C39","equipment_code":"C39","equipment_label":"Handler","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-041"],"technology_text":"Tri-temperature test handler","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"IC test","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000457"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000260","legacy_id":"P00260","entity_type":"model","company_id":"CMP-000036","manufacturer":"Cohu","family_id":"PRD-000243","family_name":"Pick-and-place test handler","model_number":"Eclipse","model_identified":true,"name":"Pick-and-place test handler · Eclipse","equipment_id":"EQP-C39","equipment_code":"C39","equipment_label":"Handler","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-041"],"technology_text":"Pick-and-place test handler","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"IC test","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000458"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000261","legacy_id":"P00261","entity_type":"model","company_id":"CMP-000036","manufacturer":"Cohu","family_id":"PRD-000243","family_name":"Pick-and-place test handler","model_number":"Eclipse XT","model_identified":true,"name":"Pick-and-place test handler · Eclipse XT","equipment_id":"EQP-C39","equipment_code":"C39","equipment_label":"Handler","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-041"],"technology_text":"Pick-and-place test handler","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"IC test","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000459"],"source_age":"STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2023-01-26","review_due":"2027-03-29"}},{"id":"MDL-000262","legacy_id":"P00262","entity_type":"model","company_id":"CMP-000036","manufacturer":"Cohu","family_id":"PRD-000243","family_name":"Pick-and-place test handler","model_number":"MATRiX","model_identified":true,"name":"Pick-and-place test handler · MATRiX","equipment_id":"EQP-C39","equipment_code":"C39","equipment_label":"Handler","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-041"],"technology_text":"Pick-and-place test handler","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"IC test","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000460"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000263","legacy_id":"P00263","entity_type":"model","company_id":"CMP-000036","manufacturer":"Cohu","family_id":"PRD-000244","family_name":"Strip test handler","model_number":"SH5300","model_identified":true,"name":"Strip test handler · SH5300","equipment_id":"EQP-C39","equipment_code":"C39","equipment_label":"Handler","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-041"],"technology_text":"Strip test handler","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"IC test","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000461"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000264","legacy_id":"P00264","entity_type":"model","company_id":"CMP-000013","manufacturer":"Canon Inc.","family_id":"PRD-000245","family_name":"i-line stepper for advanced packaging","model_number":"FPA-5520iV (HR / LF / LF2 options)","model_identified":true,"name":"i-line stepper for advanced packaging · FPA-5520iV (HR / LF / LF2 options)","equipment_id":"EQP-A01.05","equipment_code":"A01.05","equipment_label":"i-line","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":null,"process_ids":["PRS-018","PRS-045","PRS-046","PRS-047"],"technology_text":"i-line stepper lithography","technology_ids":["TEC-005"],"technology_basis":{"from_category":["TEC-005"],"from_laser_codes":[]},"application_text":"Advanced packaging (TSV, interposer, FOWLP)","application_ids":["APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000462"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000265","legacy_id":"P00265","entity_type":"model","company_id":"CMP-000173","manufacturer":"Ichor Systems","family_id":"PRD-000246","family_name":"Gas delivery systems","model_number":null,"model_identified":false,"name":"Gas delivery systems","equipment_id":"EQP-A43","equipment_code":"A43","equipment_label":"Gas Delivery Systems","category_group":"A","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-060"],"technology_text":"Gas delivery subsystems","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Process gas delivery","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000336"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000266","legacy_id":"P00266","entity_type":"model","company_id":"CMP-000173","manufacturer":"Ichor Systems","family_id":"PRD-000247","family_name":"Liquid delivery systems","model_number":null,"model_identified":false,"name":"Liquid delivery systems","equipment_id":"EQP-A44","equipment_code":"A44","equipment_label":"Chemical Delivery Systems","category_group":"A","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-060"],"technology_text":"Liquid delivery subsystems","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Chemical / liquid delivery","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000463"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000267","legacy_id":"P00267","entity_type":"model","company_id":"CMP-000172","manufacturer":"Ultra Clean Holdings (UCT)","family_id":"PRD-000248","family_name":"Chemical and gas delivery","model_number":null,"model_identified":false,"name":"Chemical and gas delivery","equipment_id":"EQP-A43","equipment_code":"A43","equipment_label":"Gas Delivery Systems","category_group":"A","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-060"],"technology_text":"Gas and chemical delivery subsystems","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Process gas / chemical delivery","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000335"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000268","legacy_id":"P00268","entity_type":"model","company_id":"CMP-000064","manufacturer":"Brooks Automation","family_id":"PRD-000249","family_name":"Vacuum transport system","model_number":"M2-Nano","model_identified":true,"name":"Vacuum transport system · M2-Nano","equipment_id":"EQP-A39","equipment_code":"A39","equipment_label":"Vacuum Robots","category_group":"A","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-058"],"technology_text":"Vacuum wafer transport (cluster tool)","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer handling","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000464"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000269","legacy_id":"P00269","entity_type":"model","company_id":"CMP-000062","manufacturer":"Hirata Corporation","family_id":"PRD-000250","family_name":"FOUP opener / load port","model_number":"300 mm KWF series","model_identified":true,"name":"FOUP opener / load port · 300 mm KWF series","equipment_id":"EQP-A40","equipment_code":"A40","equipment_label":"Load Ports","category_group":"A","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-058"],"technology_text":"Load port (FOUP opener)","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer handling","application_ids":[],"material_text":null,"material_ids":[],"wafer":{"source_value":"300 mm","sizes_mm":[300],"nonstandard_mm":[],"range_mm":null,"unit":"mm"},"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000465"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000270","legacy_id":"P00270","entity_type":"model","company_id":"CMP-000065","manufacturer":"Daifuku","family_id":"PRD-000251","family_name":"Cleanroom AMHS","model_number":null,"model_identified":false,"name":"Cleanroom AMHS","equipment_id":"EQP-J01","equipment_code":"J01","equipment_label":"AMHS","category_group":"J","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-057"],"technology_text":"Automated material handling","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Fab material transport","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000298"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000271","legacy_id":"P00271","entity_type":"model","company_id":"CMP-000066","manufacturer":"Murata Machinery (Muratec)","family_id":"PRD-000252","family_name":"Overhead hoist transport (OHT)","model_number":null,"model_identified":false,"name":"Overhead hoist transport (OHT)","equipment_id":"EQP-J02","equipment_code":"J02","equipment_label":"OHT","category_group":"J","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-057"],"technology_text":"Overhead hoist transport","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Fab material transport","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000300"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000272","legacy_id":"P00272","entity_type":"model","company_id":"CMP-000066","manufacturer":"Murata Machinery (Muratec)","family_id":"PRD-000253","family_name":"Cleanroom storage systems","model_number":null,"model_identified":false,"name":"Cleanroom storage systems","equipment_id":"EQP-J07","equipment_code":"J07","equipment_label":"Material handling","category_group":"J","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-057"],"technology_text":"Stockers / storage","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Fab material storage","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000466"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000273","legacy_id":"P00273","entity_type":"model","company_id":"CMP-000202","manufacturer":"PVA TePla","family_id":"PRD-000254","family_name":"Czochralski crystal growing system","model_number":"CGS1218","model_identified":true,"name":"Czochralski crystal growing system · CGS1218","equipment_id":"EQP-K01","equipment_code":"K01","equipment_label":"Crystal growth furnaces / pullers","category_group":"K","segment":"Wafer Manufacturing","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-001"],"technology_text":"Czochralski crystal growth","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Silicon ingot growth","application_ids":[],"material_text":"Silicon","material_ids":["MAT-001"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000467"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000274","legacy_id":"P00274","entity_type":"model","company_id":"CMP-000202","manufacturer":"PVA TePla","family_id":"PRD-000255","family_name":"PVT crystal growth","model_number":null,"model_identified":false,"name":"PVT crystal growth","equipment_id":"EQP-K01","equipment_code":"K01","equipment_label":"Crystal growth furnaces / pullers","category_group":"K","segment":"Wafer Manufacturing","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-001"],"technology_text":"Physical vapor transport (PVT) crystal growth","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"SiC crystal growth","application_ids":[],"material_text":"SiC","material_ids":["MAT-003"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000468"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000275","legacy_id":"P00275","entity_type":"model","company_id":"CMP-000202","manufacturer":"PVA TePla","family_id":"PRD-000256","family_name":"Float zone crystal growth","model_number":null,"model_identified":false,"name":"Float zone crystal growth","equipment_id":"EQP-K01","equipment_code":"K01","equipment_label":"Crystal growth furnaces / pullers","category_group":"K","segment":"Wafer Manufacturing","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-001"],"technology_text":"Float-zone crystal growth","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Monocrystalline silicon growth","application_ids":[],"material_text":"Silicon","material_ids":["MAT-001"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000469"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000276","legacy_id":"P00276","entity_type":"model","company_id":"CMP-000203","manufacturer":"Okamoto Machine Tool Works","family_id":"PRD-000257","family_name":"Final polisher","model_number":"PNX1200 / PNX1200S","model_identified":true,"name":"Final polisher · PNX1200 / PNX1200S","equipment_id":"EQP-K07","equipment_code":"K07","equipment_label":"Double-side polishing","category_group":"K","segment":"Wafer Manufacturing","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-006"],"technology_text":"Wafer final polishing","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer polishing","application_ids":[],"material_text":null,"material_ids":[],"wafer":{"source_value":"450 mm","sizes_mm":[450],"nonstandard_mm":[],"range_mm":null,"unit":"mm"},"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000470"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000277","legacy_id":"P00277","entity_type":"model","company_id":"CMP-000203","manufacturer":"Okamoto Machine Tool Works","family_id":"PRD-000257","family_name":"Final polisher","model_number":"PNX332B","model_identified":true,"name":"Final polisher · PNX332B","equipment_id":"EQP-K07","equipment_code":"K07","equipment_label":"Double-side polishing","category_group":"K","segment":"Wafer Manufacturing","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-006"],"technology_text":"Wafer final polishing","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer polishing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000471"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000278","legacy_id":"P00278","entity_type":"model","company_id":"CMP-000203","manufacturer":"Okamoto Machine Tool Works","family_id":"PRD-000258","family_name":"Polishing machine","model_number":"SPP series","model_identified":true,"name":"Polishing machine · SPP series","equipment_id":"EQP-K07","equipment_code":"K07","equipment_label":"Double-side polishing","category_group":"K","segment":"Wafer Manufacturing","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-006"],"technology_text":"Polishing","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer polishing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000472"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000279","legacy_id":"P00279","entity_type":"model","company_id":"CMP-000203","manufacturer":"Okamoto Machine Tool Works","family_id":"PRD-000259","family_name":"CMP system","model_number":"SPP600S","model_identified":true,"name":"CMP system · SPP600S","equipment_id":"EQP-A19","equipment_code":"A19","equipment_label":"CMP","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS10","legacy_process_name":null,"process_ids":["PRS-024"],"technology_text":"CMP (manual)","technology_ids":["TEC-029"],"technology_basis":{"from_category":["TEC-029"],"from_laser_codes":[]},"application_text":"Planarisation (R&D)","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000473"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000280","legacy_id":"P00280","entity_type":"model","company_id":"CMP-000203","manufacturer":"Okamoto Machine Tool Works","family_id":"PRD-000260","family_name":"Backgrinder","model_number":"GDM300","model_identified":true,"name":"Backgrinder · GDM300","equipment_id":"EQP-C03","equipment_code":"C03","equipment_label":"Back Grinding","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX2","legacy_process_name":null,"process_ids":["PRS-030"],"technology_text":"Back grinding","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"TSV process","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000474"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000281","legacy_id":"P00281","entity_type":"model","company_id":"CMP-000204","manufacturer":"Organo Corporation","family_id":"PRD-000261","family_name":"Ultrapure water production systems","model_number":null,"model_identified":false,"name":"Ultrapure water production systems","equipment_id":"EQP-L08","equipment_code":"L08","equipment_label":"Ultrapure water (UPW)","category_group":"L","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-061"],"technology_text":"Ultrapure water production","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Ultrapure water supply (fab utilities)","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000475"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000282","legacy_id":"P00282","entity_type":"model","company_id":"CMP-000205","manufacturer":"Kurita Water Industries","family_id":"PRD-000262","family_name":"Ultrapure water production system","model_number":null,"model_identified":false,"name":"Ultrapure water production system","equipment_id":"EQP-L08","equipment_code":"L08","equipment_label":"Ultrapure water (UPW)","category_group":"L","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-061"],"technology_text":"Ultrapure water production (Nanosaver)","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Ultrapure water supply (fab utilities)","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000476"],"source_age":"VERY_STALE","freshness":"Stale","quality_state":"OUTDATED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2008-11-12","review_due":"2027-03-29"}},{"id":"MDL-000283","legacy_id":"P00283","entity_type":"model","company_id":"CMP-000006","manufacturer":"ASM International (ASMI)","family_id":"PRD-000263","family_name":"SiC epitaxy","model_number":"PE2O8","model_identified":true,"name":"SiC epitaxy · PE2O8","equipment_id":"EQP-A09.10","equipment_code":"A09.10","equipment_label":"Epitaxy","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-009","PRS-013"],"technology_text":"SiC epitaxy","technology_ids":["TEC-022"],"technology_basis":{"from_category":["TEC-022"],"from_laser_codes":[]},"application_text":"SiC power devices","application_ids":["APP-010","APP-011"],"material_text":"SiC","material_ids":["MAT-003"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000478"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000284","legacy_id":"P00284","entity_type":"model","company_id":"CMP-000006","manufacturer":"ASM International (ASMI)","family_id":"PRD-000263","family_name":"SiC epitaxy","model_number":"PE106A / PE108","model_identified":true,"name":"SiC epitaxy · PE106A / PE108","equipment_id":"EQP-A09.10","equipment_code":"A09.10","equipment_label":"Epitaxy","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-009","PRS-013"],"technology_text":"SiC epitaxy","technology_ids":["TEC-022"],"technology_basis":{"from_category":["TEC-022"],"from_laser_codes":[]},"application_text":"SiC power devices","application_ids":["APP-010","APP-011"],"material_text":"SiC","material_ids":["MAT-003"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000479"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000285","legacy_id":"P00285","entity_type":"model","company_id":"CMP-000006","manufacturer":"ASM International (ASMI)","family_id":"PRD-000264","family_name":"Intrepid epitaxy","model_number":"Intrepid ES","model_identified":true,"name":"Intrepid epitaxy · Intrepid ES","equipment_id":"EQP-A09.10","equipment_code":"A09.10","equipment_label":"Epitaxy","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-009","PRS-013"],"technology_text":"Silicon epitaxy","technology_ids":["TEC-022"],"technology_basis":{"from_category":["TEC-022"],"from_laser_codes":[]},"application_text":"Advanced-node epitaxy","application_ids":[],"material_text":null,"material_ids":["MAT-001"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000480"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000286","legacy_id":"P00286","entity_type":"model","company_id":"CMP-000002","manufacturer":"Applied Materials","family_id":"PRD-000265","family_name":"Centura Epi","model_number":"Centura Xtera Epi","model_identified":true,"name":"Centura Epi · Centura Xtera Epi","equipment_id":"EQP-A09.10","equipment_code":"A09.10","equipment_label":"Epitaxy","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-009","PRS-013"],"technology_text":"Selective epitaxy","technology_ids":["TEC-022"],"technology_basis":{"from_category":["TEC-022"],"from_laser_codes":[]},"application_text":"Logic and memory epitaxy","application_ids":["APP-001","APP-005"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000481"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000287","legacy_id":"P00287","entity_type":"model","company_id":"CMP-000002","manufacturer":"Applied Materials","family_id":"PRD-000265","family_name":"Centura Epi","model_number":"Centura Prime Epi","model_identified":true,"name":"Centura Epi · Centura Prime Epi","equipment_id":"EQP-A09.10","equipment_code":"A09.10","equipment_label":"Epitaxy","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-009","PRS-013"],"technology_text":"Silicon epitaxy","technology_ids":["TEC-022"],"technology_basis":{"from_category":["TEC-022"],"from_laser_codes":[]},"application_text":"Epitaxial deposition","application_ids":[],"material_text":null,"material_ids":["MAT-001"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000482"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000288","legacy_id":"P00288","entity_type":"model","company_id":"CMP-000002","manufacturer":"Applied Materials","family_id":"PRD-000265","family_name":"Centura Epi","model_number":"Centura Epi 200mm","model_identified":true,"name":"Centura Epi · Centura Epi 200mm","equipment_id":"EQP-A09.10","equipment_code":"A09.10","equipment_label":"Epitaxy","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-009","PRS-013"],"technology_text":"Silicon epitaxy","technology_ids":["TEC-022"],"technology_basis":{"from_category":["TEC-022"],"from_laser_codes":[]},"application_text":"Epitaxial deposition","application_ids":[],"material_text":null,"material_ids":["MAT-001"],"wafer":{"source_value":"200 mm","sizes_mm":[200],"nonstandard_mm":[],"range_mm":null,"unit":"mm"},"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000483"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000289","legacy_id":"P00289","entity_type":"model","company_id":"CMP-000014","manufacturer":"Veeco Instruments","family_id":"PRD-000266","family_name":"Propel GaN MOCVD","model_number":"Propel HVM","model_identified":true,"name":"Propel GaN MOCVD · Propel HVM","equipment_id":"EQP-G01","equipment_code":"G01","equipment_label":"GaN","category_group":"G","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-009"],"technology_text":"GaN MOCVD","technology_ids":["TEC-023"],"technology_basis":{"from_category":["TEC-023"],"from_laser_codes":[]},"application_text":"GaN power, 5G RF and photonics","application_ids":["APP-012","APP-013","APP-018"],"material_text":"GaN","material_ids":["MAT-004"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000484"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000290","legacy_id":"P00290","entity_type":"model","company_id":"CMP-000014","manufacturer":"Veeco Instruments","family_id":"PRD-000266","family_name":"Propel GaN MOCVD","model_number":"Propel 300mm","model_identified":true,"name":"Propel GaN MOCVD · Propel 300mm","equipment_id":"EQP-G01","equipment_code":"G01","equipment_label":"GaN","category_group":"G","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-009"],"technology_text":"GaN MOCVD","technology_ids":["TEC-023"],"technology_basis":{"from_category":["TEC-023"],"from_laser_codes":[]},"application_text":"5G, photonics and CMOS","application_ids":["APP-012","APP-018"],"material_text":"GaN","material_ids":["MAT-004"],"wafer":{"source_value":"300 mm","sizes_mm":[300],"nonstandard_mm":[],"range_mm":null,"unit":"mm"},"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000485"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000291","legacy_id":"P00291","entity_type":"model","company_id":"CMP-000028","manufacturer":"AIXTRON","family_id":"PRD-000267","family_name":"G10 MOCVD","model_number":"G10-GaN","model_identified":true,"name":"G10 MOCVD · G10-GaN","equipment_id":"EQP-G01","equipment_code":"G01","equipment_label":"GaN","category_group":"G","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-009"],"technology_text":"GaN MOCVD","technology_ids":["TEC-023"],"technology_basis":{"from_category":["TEC-023"],"from_laser_codes":[]},"application_text":"GaN power and RF","application_ids":["APP-012","APP-013"],"material_text":"GaN","material_ids":["MAT-004"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000344"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000292","legacy_id":"P00292","entity_type":"model","company_id":"CMP-000028","manufacturer":"AIXTRON","family_id":"PRD-000267","family_name":"G10 MOCVD","model_number":"G10-SiC","model_identified":true,"name":"G10 MOCVD · G10-SiC","equipment_id":"EQP-G02","equipment_code":"G02","equipment_label":"SiC","category_group":"G","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-009"],"technology_text":"SiC epitaxy (CVD)","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"SiC power devices","application_ids":["APP-010","APP-011"],"material_text":"SiC","material_ids":["MAT-003"],"wafer":{"source_value":"200 mm","sizes_mm":[200],"nonstandard_mm":[],"range_mm":null,"unit":"mm"},"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000486"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000293","legacy_id":"P00293","entity_type":"model","company_id":"CMP-000028","manufacturer":"AIXTRON","family_id":"PRD-000267","family_name":"G10 MOCVD","model_number":"G10-AsP","model_identified":true,"name":"G10 MOCVD · G10-AsP","equipment_id":"EQP-G03","equipment_code":"G03","equipment_label":"GaAs","category_group":"G","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-009"],"technology_text":"Arsenide/phosphide MOCVD","technology_ids":["TEC-023"],"technology_basis":{"from_category":["TEC-023"],"from_laser_codes":[]},"application_text":"Compound semiconductor epitaxy","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000487"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000294","legacy_id":"P00294","entity_type":"model","company_id":"CMP-000207","manufacturer":"SpeedFam","family_id":"PRD-000268","family_name":"Double side polisher/lapper","model_number":null,"model_identified":false,"name":"Double side polisher/lapper","equipment_id":"EQP-K05","equipment_code":"K05","equipment_label":"Lapping","category_group":"K","segment":"Wafer Manufacturing","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-004"],"technology_text":"Double-side lapping / polishing","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer lapping and polishing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000477"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000295","legacy_id":"P00295","entity_type":"model","company_id":"CMP-000007","manufacturer":"SCREEN Holdings","family_id":"PRD-000176","family_name":"Single wafer cleaner","model_number":"SU-3400","model_identified":true,"name":"Single wafer cleaner · SU-3400","equipment_id":"EQP-A04","equipment_code":"A04","equipment_label":"Wafer Cleaning","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010"],"technology_text":"Single-wafer wet cleaning","technology_ids":["TEC-030"],"technology_basis":{"from_category":["TEC-030"],"from_laser_codes":[]},"application_text":"Front-end wafer cleaning","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000488"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000296","legacy_id":"P00296","entity_type":"model","company_id":"CMP-000007","manufacturer":"SCREEN Holdings","family_id":"PRD-000269","family_name":"Back-side cleaning system","model_number":"SB-3300","model_identified":true,"name":"Back-side cleaning system · SB-3300","equipment_id":"EQP-A20","equipment_code":"A20","equipment_label":"Cleaning / Scrubbing","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010"],"technology_text":"Hybrid chemical + brush back-side cleaning","technology_ids":["TEC-030"],"technology_basis":{"from_category":["TEC-030"],"from_laser_codes":[]},"application_text":"Wafer back-side cleaning","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000489"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000297","legacy_id":"P00297","entity_type":"model","company_id":"CMP-000012","manufacturer":"Tokyo Seimitsu (ACCRETECH)","family_id":"PRD-000212","family_name":"Wafer edge grinding machine","model_number":"W-GM-5200","model_identified":true,"name":"Wafer edge grinding machine · W-GM-5200","equipment_id":"EQP-K06","equipment_code":"K06","equipment_label":"Edge & surface grinding","category_group":"K","segment":"Wafer Manufacturing","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-005"],"technology_text":"Wafer edge grinding","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer edge shaping","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000490"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000298","legacy_id":"P00298","entity_type":"model","company_id":"CMP-000207","manufacturer":"SpeedFam","family_id":"PRD-000270","family_name":"Edge polisher","model_number":null,"model_identified":false,"name":"Edge polisher","equipment_id":"EQP-K06","equipment_code":"K06","equipment_label":"Edge & surface grinding","category_group":"K","segment":"Wafer Manufacturing","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-005"],"technology_text":"Wafer edge polishing","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer edge finishing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 2 (2026-09-30): maker, product name and category taken from the title of the manufacturer's own page, press release, brochure or filing, located by web search. Direct page access was blocked in the capture environment, so page content was not read and no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 2","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000491"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Model number","Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000299","legacy_id":"P00299","entity_type":"model","company_id":"CMP-000209","manufacturer":"Multibeam Corporation","family_id":"PRD-000271","family_name":"Multicolumn E-Beam Lithography (MEBL)","model_number":"MEBL system","model_identified":true,"name":"Multicolumn E-Beam Lithography (MEBL) · MEBL system","equipment_id":"EQP-A01.06","equipment_code":"A01.06","equipment_label":"Electron Beam Lithography","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":null,"process_ids":["PRS-018"],"technology_text":"Multicolumn e-beam direct write","technology_ids":["TEC-006"],"technology_basis":{"from_category":["TEC-006"],"from_laser_codes":[]},"application_text":"Direct-write lithography for production","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000585"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2024","review_due":"2027-03-29"}},{"id":"MDL-000300","legacy_id":"P00300","entity_type":"model","company_id":"CMP-000210","manufacturer":"Raith","family_id":"PRD-000272","family_name":"VOYAGER","model_number":"VOYAGER","model_identified":true,"name":"VOYAGER · VOYAGER","equipment_id":"EQP-A01.06","equipment_code":"A01.06","equipment_label":"Electron Beam Lithography","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":null,"process_ids":["PRS-018"],"technology_text":"Electron beam lithography","technology_ids":["TEC-006"],"technology_basis":{"from_category":["TEC-006"],"from_laser_codes":[]},"application_text":"Nanofabrication, photonics","application_ids":["APP-018"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000586"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000301","legacy_id":"P00301","entity_type":"model","company_id":"CMP-000210","manufacturer":"Raith","family_id":"PRD-000273","family_name":"EBPG","model_number":"EBPG","model_identified":true,"name":"EBPG · EBPG","equipment_id":"EQP-A01.06","equipment_code":"A01.06","equipment_label":"Electron Beam Lithography","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":null,"process_ids":["PRS-018"],"technology_text":"Electron beam lithography","technology_ids":["TEC-006"],"technology_basis":{"from_category":["TEC-006"],"from_laser_codes":[]},"application_text":"High-throughput nanolithography","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000587"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000302","legacy_id":"P00302","entity_type":"model","company_id":"CMP-000211","manufacturer":"Heidelberg Instruments","family_id":"PRD-000274","family_name":"Maskless Aligner (MLA)","model_number":"MLA 150","model_identified":true,"name":"Maskless Aligner (MLA) · MLA 150","equipment_id":"EQP-A01.08","equipment_code":"A01.08","equipment_label":"Maskless Lithography","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":null,"process_ids":["PRS-018","PRS-045","PRS-047"],"technology_text":"Maskless laser lithography","technology_ids":["TEC-008"],"technology_basis":{"from_category":["TEC-008"],"from_laser_codes":[]},"application_text":"Advanced microfabrication","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000588"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000303","legacy_id":"P00303","entity_type":"model","company_id":"CMP-000211","manufacturer":"Heidelberg Instruments","family_id":"PRD-000274","family_name":"Maskless Aligner (MLA)","model_number":"MLA 300","model_identified":true,"name":"Maskless Aligner (MLA) · MLA 300","equipment_id":"EQP-A01.08","equipment_code":"A01.08","equipment_label":"Maskless Lithography","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":null,"process_ids":["PRS-018","PRS-045","PRS-047"],"technology_text":"Maskless laser lithography","technology_ids":["TEC-008"],"technology_basis":{"from_category":["TEC-008"],"from_laser_codes":[]},"application_text":"Industrial maskless lithography","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000589"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000304","legacy_id":"P00304","entity_type":"model","company_id":"CMP-000211","manufacturer":"Heidelberg Instruments","family_id":"PRD-000274","family_name":"Maskless Aligner (MLA)","model_number":"µMLA","model_identified":true,"name":"Maskless Aligner (MLA) · µMLA","equipment_id":"EQP-A01.08","equipment_code":"A01.08","equipment_label":"Maskless Lithography","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":null,"process_ids":["PRS-018","PRS-045","PRS-047"],"technology_text":"Maskless laser lithography (tabletop)","technology_ids":["TEC-008"],"technology_basis":{"from_category":["TEC-008"],"from_laser_codes":[]},"application_text":"Research microfabrication","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000590"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000305","legacy_id":"P00305","entity_type":"model","company_id":"CMP-000212","manufacturer":"Obducat","family_id":"PRD-000275","family_name":"SINDRE","model_number":"SINDRE","model_identified":true,"name":"SINDRE · SINDRE","equipment_id":"EQP-A01.07","equipment_code":"A01.07","equipment_label":"Nanoimprint Lithography","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":null,"process_ids":["PRS-018"],"technology_text":"Nanoimprint lithography","technology_ids":["TEC-007"],"technology_basis":{"from_category":["TEC-007"],"from_laser_codes":[]},"application_text":"High-volume NIL (optics, LED, MEMS)","application_ids":["APP-014","APP-016"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000591"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000306","legacy_id":"P00306","entity_type":"model","company_id":"CMP-000212","manufacturer":"Obducat","family_id":"PRD-000275","family_name":"SINDRE","model_number":"SINDRE 400 Integra","model_identified":true,"name":"SINDRE · SINDRE 400 Integra","equipment_id":"EQP-A01.07","equipment_code":"A01.07","equipment_label":"Nanoimprint Lithography","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":null,"process_ids":["PRS-018"],"technology_text":"Nanoimprint lithography","technology_ids":["TEC-007"],"technology_basis":{"from_category":["TEC-007"],"from_laser_codes":[]},"application_text":"High-volume NIL","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000592"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000307","legacy_id":"P00307","entity_type":"model","company_id":"CMP-000213","manufacturer":"Forge Nano","family_id":"PRD-000276","family_name":"TEPHRA","model_number":"TEPHRA","model_identified":true,"name":"TEPHRA · TEPHRA","equipment_id":"EQP-A09.06","equipment_code":"A09.06","equipment_label":"ALD","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013","PRS-015"],"technology_text":"Single-wafer ALD cluster tool","technology_ids":["TEC-019"],"technology_basis":{"from_category":["TEC-019"],"from_laser_codes":[]},"application_text":"Specialty semiconductor ALD (200 mm)","application_ids":[],"material_text":null,"material_ids":[],"wafer":{"source_value":"200 mm","sizes_mm":[200],"nonstandard_mm":[],"range_mm":null,"unit":"mm"},"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000593"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000308","legacy_id":"P00308","entity_type":"model","company_id":"CMP-000214","manufacturer":"Angstrom Engineering","family_id":"PRD-000277","family_name":"ALD ONE","model_number":"ALD ONE","model_identified":true,"name":"ALD ONE · ALD ONE","equipment_id":"EQP-A09.06","equipment_code":"A09.06","equipment_label":"ALD","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013","PRS-015"],"technology_text":"Atomic layer deposition","technology_ids":["TEC-019"],"technology_basis":{"from_category":["TEC-019"],"from_laser_codes":[]},"application_text":"Research ALD","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000594"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000309","legacy_id":"P00309","entity_type":"model","company_id":"CMP-000214","manufacturer":"Angstrom Engineering","family_id":"PRD-000278","family_name":"Amod","model_number":"Amod","model_identified":true,"name":"Amod · Amod","equipment_id":"EQP-A09.07","equipment_code":"A09.07","equipment_label":"PVD","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013","PRS-016"],"technology_text":"Physical vapor deposition platform","technology_ids":["TEC-020"],"technology_basis":{"from_category":["TEC-020"],"from_laser_codes":[]},"application_text":"Thin-film PVD","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000595"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000310","legacy_id":"P00310","entity_type":"model","company_id":"CMP-000214","manufacturer":"Angstrom Engineering","family_id":"PRD-000279","family_name":"Nebula","model_number":"Nebula Cluster","model_identified":true,"name":"Nebula · Nebula Cluster","equipment_id":"EQP-A09","equipment_code":"A09","equipment_label":"Deposition","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013"],"technology_text":"Cluster deposition platform (PVD/CVD/ALD)","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Integrated thin-film deposition","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000596"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000311","legacy_id":"P00311","entity_type":"model","company_id":"CMP-000215","manufacturer":"CVD Equipment Corporation","family_id":"PRD-000280","family_name":"PVT systems","model_number":"PVT200","model_identified":true,"name":"PVT systems · PVT200","equipment_id":"EQP-K01","equipment_code":"K01","equipment_label":"Crystal growth furnaces / pullers","category_group":"K","segment":"Wafer Manufacturing","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-001"],"technology_text":"Physical vapor transport SiC crystal growth","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"SiC boule growth","application_ids":[],"material_text":"SiC","material_ids":["MAT-003"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000597"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000312","legacy_id":"P00312","entity_type":"model","company_id":"CMP-000216","manufacturer":"Trymax Semiconductor Equipment","family_id":"PRD-000281","family_name":"NEO","model_number":"NEO 2000 series","model_identified":true,"name":"NEO · NEO 2000 series","equipment_id":"EQP-A07","equipment_code":"A07","equipment_label":"Plasma Cleaning","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010","PRS-021"],"technology_text":"Plasma photoresist ashing / strip","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Photoresist strip / ashing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000598"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000313","legacy_id":"P00313","entity_type":"model","company_id":"CMP-000216","manufacturer":"Trymax Semiconductor Equipment","family_id":"PRD-000281","family_name":"NEO","model_number":"NEO 3400 series","model_identified":true,"name":"NEO · NEO 3400 series","equipment_id":"EQP-A07","equipment_code":"A07","equipment_label":"Plasma Cleaning","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010","PRS-021"],"technology_text":"Plasma photoresist ashing / strip","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Photoresist strip / ashing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000599"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000314","legacy_id":"P00314","entity_type":"model","company_id":"CMP-000217","manufacturer":"SVCS Process Innovation","family_id":"PRD-000282","family_name":"Horizontal furnaces","model_number":"Horizontal diffusion furnace","model_identified":true,"name":"Horizontal furnaces · Horizontal diffusion furnace","equipment_id":"EQP-A11","equipment_code":"A11","equipment_label":"Diffusion","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":null,"process_ids":["PRS-011","PRS-012"],"technology_text":"Batch horizontal diffusion / oxidation","technology_ids":["TEC-027"],"technology_basis":{"from_category":["TEC-027"],"from_laser_codes":[]},"application_text":"Diffusion, doping, annealing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000600"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000315","legacy_id":"P00315","entity_type":"model","company_id":"CMP-000217","manufacturer":"SVCS Process Innovation","family_id":"PRD-000283","family_name":"Vertical furnaces","model_number":"VTR","model_identified":true,"name":"Vertical furnaces · VTR","equipment_id":"EQP-A11","equipment_code":"A11","equipment_label":"Diffusion","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":null,"process_ids":["PRS-011","PRS-012"],"technology_text":"Batch vertical furnace","technology_ids":["TEC-027"],"technology_basis":{"from_category":["TEC-027"],"from_laser_codes":[]},"application_text":"Diffusion, oxidation, LPCVD","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000601"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000316","legacy_id":"P00316","entity_type":"model","company_id":"CMP-000217","manufacturer":"SVCS Process Innovation","family_id":"PRD-000282","family_name":"Horizontal furnaces","model_number":"Horizontal LPCVD furnace","model_identified":true,"name":"Horizontal furnaces · Horizontal LPCVD furnace","equipment_id":"EQP-A09.03","equipment_code":"A09.03","equipment_label":"LPCVD","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013","PRS-014"],"technology_text":"Horizontal LPCVD","technology_ids":["TEC-017"],"technology_basis":{"from_category":["TEC-017"],"from_laser_codes":[]},"application_text":"LPCVD films","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000602"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000317","legacy_id":"P00317","entity_type":"model","company_id":"CMP-000218","manufacturer":"Annealsys","family_id":"PRD-000284","family_name":"RTP / RTCVD","model_number":"RTP and RTCVD system","model_identified":true,"name":"RTP / RTCVD · RTP and RTCVD system","equipment_id":"EQP-A12","equipment_code":"A12","equipment_label":"RTP","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":null,"process_ids":["PRS-023"],"technology_text":"Rapid thermal processing / rapid thermal CVD","technology_ids":["TEC-028"],"technology_basis":{"from_category":["TEC-028"],"from_laser_codes":[]},"application_text":"Annealing, RTCVD","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000603"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000318","legacy_id":"P00318","entity_type":"model","company_id":"CMP-000218","manufacturer":"Annealsys","family_id":"PRD-000284","family_name":"RTP / RTCVD","model_number":"3-inch RTP system","model_identified":true,"name":"RTP / RTCVD · 3-inch RTP system","equipment_id":"EQP-A12","equipment_code":"A12","equipment_label":"RTP","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":null,"process_ids":["PRS-023"],"technology_text":"Rapid thermal processing","technology_ids":["TEC-028"],"technology_basis":{"from_category":["TEC-028"],"from_laser_codes":[]},"application_text":"R&D annealing (3-inch)","application_ids":[],"material_text":null,"material_ids":[],"wafer":{"source_value":"3-inch","sizes_mm":[75],"nonstandard_mm":[],"range_mm":null,"unit":"mm"},"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000604"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000319","legacy_id":"P00319","entity_type":"model","company_id":"CMP-000218","manufacturer":"Annealsys","family_id":"PRD-000285","family_name":"DLI-CVD / DLI-ALD","model_number":"DLI-CVD / DLI-ALD system","model_identified":true,"name":"DLI-CVD / DLI-ALD · DLI-CVD / DLI-ALD system","equipment_id":"EQP-A09.01","equipment_code":"A09.01","equipment_label":"CVD","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013","PRS-014"],"technology_text":"Direct liquid injection CVD / ALD","technology_ids":["TEC-015"],"technology_basis":{"from_category":["TEC-015"],"from_laser_codes":[]},"application_text":"Oxide and 2D-material deposition","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000605"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000320","legacy_id":"P00320","entity_type":"model","company_id":"CMP-000219","manufacturer":"Samco Inc.","family_id":"PRD-000286","family_name":"RIE","model_number":"RIE-10NR","model_identified":true,"name":"RIE · RIE-10NR","equipment_id":"EQP-A08.03","equipment_code":"A08.03","equipment_label":"RIE","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS04","legacy_process_name":null,"process_ids":["PRS-020"],"technology_text":"Reactive ion etching","technology_ids":["TEC-010"],"technology_basis":{"from_category":["TEC-010"],"from_laser_codes":[]},"application_text":"R&D etch, failure analysis deprocessing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000606"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000321","legacy_id":"P00321","entity_type":"model","company_id":"CMP-000219","manufacturer":"Samco Inc.","family_id":"PRD-000287","family_name":"ICP-RIE","model_number":"RIE-230iP","model_identified":true,"name":"ICP-RIE · RIE-230iP","equipment_id":"EQP-A08.04","equipment_code":"A08.04","equipment_label":"ICP","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS04","legacy_process_name":null,"process_ids":["PRS-020"],"technology_text":"ICP reactive ion etching","technology_ids":["TEC-011"],"technology_basis":{"from_category":["TEC-011"],"from_laser_codes":[]},"application_text":"Compound semiconductor / Si etch","application_ids":[],"material_text":null,"material_ids":["MAT-001"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000607"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000322","legacy_id":"P00322","entity_type":"model","company_id":"CMP-000219","manufacturer":"Samco Inc.","family_id":"PRD-000287","family_name":"ICP-RIE","model_number":"RIE-230iPC","model_identified":true,"name":"ICP-RIE · RIE-230iPC","equipment_id":"EQP-A08.04","equipment_code":"A08.04","equipment_label":"ICP","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS04","legacy_process_name":null,"process_ids":["PRS-020"],"technology_text":"ICP reactive ion etching (load-lock)","technology_ids":["TEC-011"],"technology_basis":{"from_category":["TEC-011"],"from_laser_codes":[]},"application_text":"Compound semiconductor / Si etch","application_ids":[],"material_text":null,"material_ids":["MAT-001"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000608"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000323","legacy_id":"P00323","entity_type":"model","company_id":"CMP-000219","manufacturer":"Samco Inc.","family_id":"PRD-000287","family_name":"ICP-RIE","model_number":"RIE-350iPC","model_identified":true,"name":"ICP-RIE · RIE-350iPC","equipment_id":"EQP-A08.04","equipment_code":"A08.04","equipment_label":"ICP","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS04","legacy_process_name":null,"process_ids":["PRS-020"],"technology_text":"ICP reactive ion etching","technology_ids":["TEC-011"],"technology_basis":{"from_category":["TEC-011"],"from_laser_codes":[]},"application_text":"Production etch","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000609"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000324","legacy_id":"P00324","entity_type":"model","company_id":"CMP-000219","manufacturer":"Samco Inc.","family_id":"PRD-000287","family_name":"ICP-RIE","model_number":"RIE-400iPC","model_identified":true,"name":"ICP-RIE · RIE-400iPC","equipment_id":"EQP-A08.04","equipment_code":"A08.04","equipment_label":"ICP","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS04","legacy_process_name":null,"process_ids":["PRS-020"],"technology_text":"ICP reactive ion etching","technology_ids":["TEC-011"],"technology_basis":{"from_category":["TEC-011"],"from_laser_codes":[]},"application_text":"Production etch","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000610"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000325","legacy_id":"P00325","entity_type":"model","company_id":"CMP-000219","manufacturer":"Samco Inc.","family_id":"PRD-000288","family_name":"Plasma etching cluster tool","model_number":"Compound-semiconductor etch cluster tool","model_identified":true,"name":"Plasma etching cluster tool · Compound-semiconductor etch cluster tool","equipment_id":"EQP-G03","equipment_code":"G03","equipment_label":"GaAs","category_group":"G","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-009"],"technology_text":"Plasma etching cluster tool","technology_ids":["TEC-023"],"technology_basis":{"from_category":["TEC-023"],"from_laser_codes":[]},"application_text":"Compound semiconductor device fabrication","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000611"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2022","review_due":"2027-03-29"}},{"id":"MDL-000326","legacy_id":"P00326","entity_type":"model","company_id":"CMP-000220","manufacturer":"SENTECH Instruments","family_id":"PRD-000289","family_name":"Plasma etch & deposition","model_number":"Plasma etching and PECVD cluster","model_identified":true,"name":"Plasma etch & deposition · Plasma etching and PECVD cluster","equipment_id":"EQP-A09.02","equipment_code":"A09.02","equipment_label":"PECVD","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013","PRS-014"],"technology_text":"Plasma etching / PECVD clustering","technology_ids":["TEC-016"],"technology_basis":{"from_category":["TEC-016"],"from_laser_codes":[]},"application_text":"Etch and deposition","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000612"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000327","legacy_id":"P00327","entity_type":"model","company_id":"CMP-000220","manufacturer":"SENTECH Instruments","family_id":"PRD-000289","family_name":"Plasma etch & deposition","model_number":"Plasma etchers","model_identified":true,"name":"Plasma etch & deposition · Plasma etchers","equipment_id":"EQP-A08.02","equipment_code":"A08.02","equipment_label":"Plasma Etch","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS04","legacy_process_name":null,"process_ids":["PRS-020"],"technology_text":"Plasma etching","technology_ids":["TEC-009"],"technology_basis":{"from_category":["TEC-009"],"from_laser_codes":[]},"application_text":"Etch","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000509"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000328","legacy_id":"P00328","entity_type":"model","company_id":"CMP-000221","manufacturer":"Yield Engineering Systems (YES)","family_id":"PRD-000290","family_name":"VertaCure","model_number":"VertaCure","model_identified":true,"name":"VertaCure · VertaCure","equipment_id":"EQP-D20","equipment_code":"D20","equipment_label":"Wafer Level Packaging","category_group":"D","segment":"Advanced Packaging","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX5","legacy_process_name":null,"process_ids":["PRS-046"],"technology_text":"Automated production vacuum cure","technology_ids":["TEC-046"],"technology_basis":{"from_category":["TEC-046"],"from_laser_codes":[]},"application_text":"Polyimide cure for FO-WLP / passivation","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000613"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000329","legacy_id":"P00329","entity_type":"model","company_id":"CMP-000221","manufacturer":"Yield Engineering Systems (YES)","family_id":"PRD-000290","family_name":"VertaCure","model_number":"VertaCure XP","model_identified":true,"name":"VertaCure · VertaCure XP","equipment_id":"EQP-D20","equipment_code":"D20","equipment_label":"Wafer Level Packaging","category_group":"D","segment":"Advanced Packaging","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX5","legacy_process_name":null,"process_ids":["PRS-046"],"technology_text":"Vacuum cure","technology_ids":["TEC-046"],"technology_basis":{"from_category":["TEC-046"],"from_laser_codes":[]},"application_text":"Advanced packaging polyimide cure","application_ids":["APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000614"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2022-04","review_due":"2027-03-29"}},{"id":"MDL-000330","legacy_id":"P00330","entity_type":"model","company_id":"CMP-000222","manufacturer":"Palomar Technologies","family_id":"PRD-000291","family_name":"3880 die bonder","model_number":"3880-II","model_identified":true,"name":"3880 die bonder · 3880-II","equipment_id":"EQP-C10","equipment_code":"C10","equipment_label":"Die Attach","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-033"],"technology_text":"Automated die bonding","technology_ids":["TEC-039"],"technology_basis":{"from_category":["TEC-039"],"from_laser_codes":[]},"application_text":"Photonics, microelectronics die attach","application_ids":["APP-018"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000615"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000331","legacy_id":"P00331","entity_type":"model","company_id":"CMP-000223","manufacturer":"Finetech","family_id":"PRD-000292","family_name":"FINEPLACER","model_number":"FINEPLACER femto 2","model_identified":true,"name":"FINEPLACER · FINEPLACER femto 2","equipment_id":"EQP-C11","equipment_code":"C11","equipment_label":"Flip Chip","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-035","PRS-050"],"technology_text":"Automated sub-micron die / flip-chip bonding","technology_ids":["TEC-041"],"technology_basis":{"from_category":["TEC-041"],"from_laser_codes":[]},"application_text":"R&D and production assembly","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000616"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000332","legacy_id":"P00332","entity_type":"model","company_id":"CMP-000223","manufacturer":"Finetech","family_id":"PRD-000292","family_name":"FINEPLACER","model_number":"FINEPLACER sigma","model_identified":true,"name":"FINEPLACER · FINEPLACER sigma","equipment_id":"EQP-C11","equipment_code":"C11","equipment_label":"Flip Chip","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-035","PRS-050"],"technology_text":"Sub-micron die / flip-chip bonding","technology_ids":["TEC-041"],"technology_basis":{"from_category":["TEC-041"],"from_laser_codes":[]},"application_text":"Chip- and wafer-level assembly","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000617"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000333","legacy_id":"P00333","entity_type":"model","company_id":"CMP-000223","manufacturer":"Finetech","family_id":"PRD-000292","family_name":"FINEPLACER","model_number":"FINEPLACER lambda 2","model_identified":true,"name":"FINEPLACER · FINEPLACER lambda 2","equipment_id":"EQP-C10","equipment_code":"C10","equipment_label":"Die Attach","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-033"],"technology_text":"Table-top sub-micron die bonding","technology_ids":["TEC-039"],"technology_basis":{"from_category":["TEC-039"],"from_laser_codes":[]},"application_text":"R&D and prototyping","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000618"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000334","legacy_id":"P00334","entity_type":"model","company_id":"CMP-000224","manufacturer":"SET (Smart Equipment Technology)","family_id":"PRD-000293","family_name":"Device bonders","model_number":"FC300","model_identified":true,"name":"Device bonders · FC300","equipment_id":"EQP-C11","equipment_code":"C11","equipment_label":"Flip Chip","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-035","PRS-050"],"technology_text":"High-force flip-chip / chip-to-wafer bonding","technology_ids":["TEC-041"],"technology_basis":{"from_category":["TEC-041"],"from_laser_codes":[]},"application_text":"Chip-to-wafer bonding (300 mm)","application_ids":[],"material_text":null,"material_ids":[],"wafer":{"source_value":"300 mm","sizes_mm":[300],"nonstandard_mm":[],"range_mm":null,"unit":"mm"},"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000619"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000335","legacy_id":"P00335","entity_type":"model","company_id":"CMP-000224","manufacturer":"SET (Smart Equipment Technology)","family_id":"PRD-000293","family_name":"Device bonders","model_number":"NEO HB","model_identified":true,"name":"Device bonders · NEO HB","equipment_id":"EQP-C11","equipment_code":"C11","equipment_label":"Flip Chip","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-035","PRS-050"],"technology_text":"Flip-chip bonding","technology_ids":["TEC-041"],"technology_basis":{"from_category":["TEC-041"],"from_laser_codes":[]},"application_text":"High-accuracy flip-chip bonding","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000620"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000336","legacy_id":"P00336","entity_type":"model","company_id":"CMP-000224","manufacturer":"SET (Smart Equipment Technology)","family_id":"PRD-000294","family_name":"Direct bonding","model_number":"Direct bonding","model_identified":true,"name":"Direct bonding · Direct bonding","equipment_id":"EQP-C17","equipment_code":"C17","equipment_label":"Hybrid Bonding","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-049","PRS-050","PRS-051"],"technology_text":"Die-to-wafer direct / hybrid bonding","technology_ids":["TEC-043"],"technology_basis":{"from_category":["TEC-043"],"from_laser_codes":[]},"application_text":"Direct bonding","application_ids":["APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000621"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000337","legacy_id":"P00337","entity_type":"model","company_id":"CMP-000225","manufacturer":"Oxford Lasers","family_id":"PRD-000295","family_name":"Laser micromachining systems","model_number":"A Series","model_identified":true,"name":"Laser micromachining systems · A Series","equipment_id":"EQP-A15","equipment_code":"A15","equipment_label":"Laser Processing","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":null,"process_ids":[],"technology_text":"Laser micromachining","technology_ids":["TEC-072"],"technology_basis":{"from_category":["TEC-072"],"from_laser_codes":["TEC-072"]},"application_text":"R&D and pilot production micromachining","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Micromachining","type_codes":["L14"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000622"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000338","legacy_id":"P00338","entity_type":"model","company_id":"CMP-000226","manufacturer":"Workshop of Photonics (WOP)","family_id":"PRD-000296","family_name":"Femtosecond micromachining workstations","model_number":"FemtoLAB","model_identified":true,"name":"Femtosecond micromachining workstations · FemtoLAB","equipment_id":"EQP-A15","equipment_code":"A15","equipment_label":"Laser Processing","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":null,"process_ids":[],"technology_text":"Femtosecond laser micromachining","technology_ids":["TEC-072","TEC-078"],"technology_basis":{"from_category":["TEC-072"],"from_laser_codes":["TEC-072","TEC-078"]},"application_text":"Submicron micromachining (R&D)","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Micromachining; Femtosecond","type_codes":["L14","L20"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000623"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000339","legacy_id":"P00339","entity_type":"model","company_id":"CMP-000226","manufacturer":"Workshop of Photonics (WOP)","family_id":"PRD-000296","family_name":"Femtosecond micromachining workstations","model_number":"FemtoGLASS","model_identified":true,"name":"Femtosecond micromachining workstations · FemtoGLASS","equipment_id":"EQP-C29","equipment_code":"C29","equipment_label":"Laser Cutting","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS14","legacy_process_name":null,"process_ids":["PRS-039"],"technology_text":"Femtosecond laser glass & sapphire cutting","technology_ids":["TEC-065","TEC-078"],"technology_basis":{"from_category":["TEC-065"],"from_laser_codes":["TEC-065","TEC-078"]},"application_text":"Glass and sapphire cutting / dicing","application_ids":[],"material_text":"Glass; sapphire","material_ids":["MAT-009","MAT-010"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Cutting; Femtosecond","type_codes":["L07","L20"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":"Glass; sapphire"},"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000624"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000340","legacy_id":"P00340","entity_type":"model","company_id":"CMP-000226","manufacturer":"Workshop of Photonics (WOP)","family_id":"PRD-000296","family_name":"Femtosecond micromachining workstations","model_number":"FemtoFAB","model_identified":true,"name":"Femtosecond micromachining workstations · FemtoFAB","equipment_id":"EQP-A15","equipment_code":"A15","equipment_label":"Laser Processing","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":null,"process_ids":[],"technology_text":"Femtosecond laser micromachining","technology_ids":["TEC-072","TEC-078"],"technology_basis":{"from_category":["TEC-072"],"from_laser_codes":["TEC-072","TEC-078"]},"application_text":"Micromachining","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Micromachining; Femtosecond","type_codes":["L14","L20"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000625"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000341","legacy_id":"P00341","entity_type":"model","company_id":"CMP-000226","manufacturer":"Workshop of Photonics (WOP)","family_id":"PRD-000296","family_name":"Femtosecond micromachining workstations","model_number":"FemtoMPP","model_identified":true,"name":"Femtosecond micromachining workstations · FemtoMPP","equipment_id":"EQP-A15","equipment_code":"A15","equipment_label":"Laser Processing","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":null,"process_ids":[],"technology_text":"Laser micromachining workstation","technology_ids":["TEC-072"],"technology_basis":{"from_category":["TEC-072"],"from_laser_codes":["TEC-072"]},"application_text":"Micromachining","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Micromachining","type_codes":["L14"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000626"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000342","legacy_id":"P00342","entity_type":"model","company_id":"CMP-000228","manufacturer":"LightMachinery","family_id":"PRD-000297","family_name":"IPEX excimer lasers","model_number":"IPEX-800","model_identified":true,"name":"IPEX excimer lasers · IPEX-800","equipment_id":null,"equipment_code":"BOM01","equipment_label":"BOM: Laser Source","category_group":"B","segment":"Other","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-057"],"technology_text":"Industrial excimer laser","technology_ids":["TEC-082"],"technology_basis":{"from_category":[],"from_laser_codes":["TEC-082"]},"application_text":"UV micromachining source","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Excimer","type_codes":["L24"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000627"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000343","legacy_id":"P00343","entity_type":"model","company_id":"CMP-000228","manufacturer":"LightMachinery","family_id":"PRD-000297","family_name":"IPEX excimer lasers","model_number":"IPEX-700","model_identified":true,"name":"IPEX excimer lasers · IPEX-700","equipment_id":null,"equipment_code":"BOM01","equipment_label":"BOM: Laser Source","category_group":"B","segment":"Other","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-057"],"technology_text":"Excimer laser","technology_ids":["TEC-082"],"technology_basis":{"from_category":[],"from_laser_codes":["TEC-082"]},"application_text":"R&D and medium-volume UV processing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Excimer","type_codes":["L24"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000628"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000344","legacy_id":"P00344","entity_type":"model","company_id":"CMP-000229","manufacturer":"Shibaura Mechatronics","family_id":"PRD-000298","family_name":"TFC bonders","model_number":"TFC-6600","model_identified":true,"name":"TFC bonders · TFC-6600","equipment_id":"EQP-D06","equipment_code":"D06","equipment_label":"FOWLP","category_group":"D","segment":"Advanced Packaging","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX5","legacy_process_name":null,"process_ids":["PRS-047"],"technology_text":"High-end wafer-level package bonder","technology_ids":["TEC-047"],"technology_basis":{"from_category":["TEC-047"],"from_laser_codes":[]},"application_text":"FO-WLP bonding","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000629"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000345","legacy_id":"P00345","entity_type":"model","company_id":"CMP-000229","manufacturer":"Shibaura Mechatronics","family_id":"PRD-000298","family_name":"TFC bonders","model_number":"TFC-6700 / TFC-6800","model_identified":true,"name":"TFC bonders · TFC-6700 / TFC-6800","equipment_id":"EQP-C17","equipment_code":"C17","equipment_label":"Hybrid Bonding","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-049","PRS-050","PRS-051"],"technology_text":"Hybrid bonding","technology_ids":["TEC-043"],"technology_basis":{"from_category":["TEC-043"],"from_laser_codes":[]},"application_text":"Hybrid bonding","application_ids":["APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000630"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000346","legacy_id":"P00346","entity_type":"model","company_id":"CMP-000229","manufacturer":"Shibaura Mechatronics","family_id":"PRD-000298","family_name":"TFC bonders","model_number":"TFC-9300 / TFC-9310","model_identified":true,"name":"TFC bonders · TFC-9300 / TFC-9310","equipment_id":"EQP-D19","equipment_code":"D19","equipment_label":"Panel Level Packaging","category_group":"D","segment":"Advanced Packaging","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX5","legacy_process_name":null,"process_ids":["PRS-053"],"technology_text":"Panel-level package bonder","technology_ids":["TEC-048"],"technology_basis":{"from_category":["TEC-048"],"from_laser_codes":[]},"application_text":"PLP bonding","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000631"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000347","legacy_id":"P00347","entity_type":"model","company_id":"CMP-000229","manufacturer":"Shibaura Mechatronics","family_id":"PRD-000298","family_name":"TFC bonders","model_number":"TFC-6500","model_identified":true,"name":"TFC bonders · TFC-6500","equipment_id":"EQP-C11","equipment_code":"C11","equipment_label":"Flip Chip","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-035","PRS-050"],"technology_text":"Multi-process flip-chip bonder","technology_ids":["TEC-041"],"technology_basis":{"from_category":["TEC-041"],"from_laser_codes":[]},"application_text":"Flip-chip bonding","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000632"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000348","legacy_id":"P00348","entity_type":"model","company_id":"CMP-000230","manufacturer":"Takatori Corporation","family_id":"PRD-000299","family_name":"Wafer mounters / laminators","model_number":"Wafer Mounter","model_identified":true,"name":"Wafer mounters / laminators · Wafer Mounter","equipment_id":"EQP-C06","equipment_code":"C06","equipment_label":"Wafer Mounter","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":null,"process_ids":["PRS-031"],"technology_text":"Wafer mounting","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer mounting for dicing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000633"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000349","legacy_id":"P00349","entity_type":"model","company_id":"CMP-000230","manufacturer":"Takatori Corporation","family_id":"PRD-000299","family_name":"Wafer mounters / laminators","model_number":"ATM-3100","model_identified":true,"name":"Wafer mounters / laminators · ATM-3100","equipment_id":"EQP-C06","equipment_code":"C06","equipment_label":"Wafer Mounter","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":null,"process_ids":["PRS-031"],"technology_text":"Protective tape lamination","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer protective tape lamination","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000634"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000350","legacy_id":"P00350","entity_type":"model","company_id":"CMP-000230","manufacturer":"Takatori Corporation","family_id":"PRD-000299","family_name":"Wafer mounters / laminators","model_number":"TEAM-100","model_identified":true,"name":"Wafer mounters / laminators · TEAM-100","equipment_id":"EQP-C06","equipment_code":"C06","equipment_label":"Wafer Mounter","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":null,"process_ids":["PRS-031"],"technology_text":"Vacuum tape lamination","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Thin-wafer tape lamination","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000635"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000351","legacy_id":"P00351","entity_type":"model","company_id":"CMP-000230","manufacturer":"Takatori Corporation","family_id":"PRD-000300","family_name":"Wafer removal","model_number":"ATRM-2400TKUV","model_identified":true,"name":"Wafer removal · ATRM-2400TKUV","equipment_id":"EQP-C07","equipment_code":"C07","equipment_label":"Wafer Demounter","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":null,"process_ids":["PRS-031"],"technology_text":"Wafer removal (demount)","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer removal / transfer","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000636"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000352","legacy_id":"P00352","entity_type":"model","company_id":"CMP-000231","manufacturer":"Ushio Inc.","family_id":"PRD-000301","family_name":"UX projection lithography","model_number":"UX-5 / UX-7 series","model_identified":true,"name":"UX projection lithography · UX-5 / UX-7 series","equipment_id":"EQP-A01.05","equipment_code":"A01.05","equipment_label":"i-line","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":null,"process_ids":["PRS-018","PRS-045","PRS-046","PRS-047"],"technology_text":"Large-field stepper","technology_ids":["TEC-005"],"technology_basis":{"from_category":["TEC-005"],"from_laser_codes":[]},"application_text":"IC package substrate / advanced packaging lithography","application_ids":["APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000522"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000353","legacy_id":"P00353","entity_type":"model","company_id":"CMP-000231","manufacturer":"Ushio Inc.","family_id":"PRD-000301","family_name":"UX projection lithography","model_number":"UX-4 series","model_identified":true,"name":"UX projection lithography · UX-4 series","equipment_id":"EQP-A01.05","equipment_code":"A01.05","equipment_label":"i-line","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":null,"process_ids":["PRS-018","PRS-045","PRS-046","PRS-047"],"technology_text":"Full-field projection aligner","technology_ids":["TEC-005"],"technology_basis":{"from_category":["TEC-005"],"from_laser_codes":[]},"application_text":"WLP, MEMS, LED, power device lithography","application_ids":["APP-010","APP-014","APP-016"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000637"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000354","legacy_id":"P00354","entity_type":"model","company_id":"CMP-000231","manufacturer":"Ushio Inc.","family_id":"PRD-000301","family_name":"UX projection lithography","model_number":"UX7-3Di LIS 350","model_identified":true,"name":"UX projection lithography · UX7-3Di LIS 350","equipment_id":"EQP-D16","equipment_code":"D16","equipment_label":"Interposer","category_group":"D","segment":"Advanced Packaging","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX5","legacy_process_name":null,"process_ids":["PRS-048"],"technology_text":"Interposer stepper","technology_ids":["TEC-049"],"technology_basis":{"from_category":["TEC-049"],"from_laser_codes":[]},"application_text":"300 mm interposer lithography","application_ids":["APP-019"],"material_text":null,"material_ids":[],"wafer":{"source_value":"300 mm","sizes_mm":[300],"nonstandard_mm":[],"range_mm":null,"unit":"mm"},"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000638"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2014","review_due":"2027-03-29"}},{"id":"MDL-000355","legacy_id":"P00355","entity_type":"model","company_id":"CMP-000231","manufacturer":"Ushio Inc.","family_id":"PRD-000301","family_name":"UX projection lithography","model_number":"1.5 µm resolution stepper (planned)","model_identified":true,"name":"UX projection lithography · 1.5 µm resolution stepper (planned)","equipment_id":"EQP-D15","equipment_code":"D15","equipment_label":"RDL","category_group":"D","segment":"Advanced Packaging","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX5","legacy_process_name":null,"process_ids":["PRS-045"],"technology_text":"Advanced-packaging stepper","technology_ids":["TEC-055"],"technology_basis":{"from_category":["TEC-055"],"from_laser_codes":[]},"application_text":"Fine-line RDL lithography (announced, planned launch)","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Announced","legacy_status":"NOT_DEPLOYED","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000639"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2025","review_due":"2027-03-29"}},{"id":"MDL-000356","legacy_id":"P00356","entity_type":"model","company_id":"CMP-000232","manufacturer":"Mitsuboshi Diamond Industrial","family_id":"PRD-000302","family_name":"DIALOGIC","model_number":"DIALOGIC series","model_identified":true,"name":"DIALOGIC · DIALOGIC series","equipment_id":"EQP-C32","equipment_code":"C32","equipment_label":"Singulation","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS14","legacy_process_name":null,"process_ids":["PRS-039"],"technology_text":"Scribe & break wafer singulation","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer singulation (incl. SiC)","application_ids":["APP-011"],"material_text":null,"material_ids":["MAT-003"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000523"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000357","legacy_id":"P00357","entity_type":"model","company_id":"CMP-000232","manufacturer":"Mitsuboshi Diamond Industrial","family_id":"PRD-000302","family_name":"DIALOGIC","model_number":"DIALOGIC Plus+","model_identified":true,"name":"DIALOGIC · DIALOGIC Plus+","equipment_id":"EQP-C32","equipment_code":"C32","equipment_label":"Singulation","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS14","legacy_process_name":null,"process_ids":["PRS-039"],"technology_text":"Scribe & break wafer singulation","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer singulation","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000640"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2025-11","review_due":"2027-03-29"}},{"id":"MDL-000358","legacy_id":"P00358","entity_type":"model","company_id":"CMP-000233","manufacturer":"Toray Engineering","family_id":"PRD-000303","family_name":"Flip chip bonders","model_number":"FC3000S","model_identified":true,"name":"Flip chip bonders · FC3000S","equipment_id":"EQP-C11","equipment_code":"C11","equipment_label":"Flip Chip","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-035","PRS-050"],"technology_text":"Flip-chip bonding","technology_ids":["TEC-041"],"technology_basis":{"from_category":["TEC-041"],"from_laser_codes":[]},"application_text":"Flip-chip packaging","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000641"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000359","legacy_id":"P00359","entity_type":"model","company_id":"CMP-000233","manufacturer":"Toray Engineering","family_id":"PRD-000303","family_name":"Flip chip bonders","model_number":"PB3000","model_identified":true,"name":"Flip chip bonders · PB3000","equipment_id":"EQP-C11","equipment_code":"C11","equipment_label":"Flip Chip","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-035","PRS-050"],"technology_text":"Flip-chip bonding","technology_ids":["TEC-041"],"technology_basis":{"from_category":["TEC-041"],"from_laser_codes":[]},"application_text":"Flip-chip packaging","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000642"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000360","legacy_id":"P00360","entity_type":"model","company_id":"CMP-000233","manufacturer":"Toray Engineering","family_id":"PRD-000303","family_name":"Flip chip bonders","model_number":"UC5000","model_identified":true,"name":"Flip chip bonders · UC5000","equipment_id":"EQP-D19","equipment_code":"D19","equipment_label":"Panel Level Packaging","category_group":"D","segment":"Advanced Packaging","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX5","legacy_process_name":null,"process_ids":["PRS-053"],"technology_text":"TCB bonder for panel-level packaging","technology_ids":["TEC-048"],"technology_basis":{"from_category":["TEC-048"],"from_laser_codes":[]},"application_text":"PLP bonding on large glass panels","application_ids":[],"material_text":null,"material_ids":["MAT-010"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000643"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2025-03","review_due":"2027-03-29"}},{"id":"MDL-000361","legacy_id":"P00361","entity_type":"model","company_id":"CMP-000233","manufacturer":"Toray Engineering","family_id":"PRD-000304","family_name":"Inspection","model_number":"GEN3000T","model_identified":true,"name":"Inspection · GEN3000T","equipment_id":"EQP-C36","equipment_code":"C36","equipment_label":"AOI","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-040"],"technology_text":"Chip inspection","technology_ids":["TEC-031"],"technology_basis":{"from_category":["TEC-031"],"from_laser_codes":[]},"application_text":"Semiconductor chip inspection","application_ids":["APP-017"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000644"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000362","legacy_id":"P00362","entity_type":"model","company_id":"CMP-000234","manufacturer":"JEOL","family_id":"PRD-000305","family_name":"JBX e-beam lithography","model_number":"JBX-A9","model_identified":true,"name":"JBX e-beam lithography · JBX-A9","equipment_id":"EQP-A01.06","equipment_code":"A01.06","equipment_label":"Electron Beam Lithography","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":null,"process_ids":["PRS-018"],"technology_text":"Spot-beam electron beam lithography","technology_ids":["TEC-006"],"technology_basis":{"from_category":["TEC-006"],"from_laser_codes":[]},"application_text":"E-beam lithography","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000645"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000363","legacy_id":"P00363","entity_type":"model","company_id":"CMP-000234","manufacturer":"JEOL","family_id":"PRD-000305","family_name":"JBX e-beam lithography","model_number":"JBX-8100FS","model_identified":true,"name":"JBX e-beam lithography · JBX-8100FS","equipment_id":"EQP-A01.06","equipment_code":"A01.06","equipment_label":"Electron Beam Lithography","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":null,"process_ids":["PRS-018"],"technology_text":"Spot-beam electron beam lithography","technology_ids":["TEC-006"],"technology_basis":{"from_category":["TEC-006"],"from_laser_codes":[]},"application_text":"Fine patterning, small/mid production","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000646"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000364","legacy_id":"P00364","entity_type":"model","company_id":"CMP-000234","manufacturer":"JEOL","family_id":"PRD-000305","family_name":"JBX e-beam lithography","model_number":"JBX-3200MVS","model_identified":true,"name":"JBX e-beam lithography · JBX-3200MVS","equipment_id":"EQP-B07","equipment_code":"B07","equipment_label":"E-beam Mask Writing","category_group":"B","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX3","legacy_process_name":null,"process_ids":["PRS-028"],"technology_text":"Variable-shaped beam lithography","technology_ids":["TEC-006"],"technology_basis":{"from_category":["TEC-006"],"from_laser_codes":[]},"application_text":"Mask making","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000647"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000365","legacy_id":"P00365","entity_type":"model","company_id":"CMP-000234","manufacturer":"JEOL","family_id":"PRD-000305","family_name":"JBX e-beam lithography","model_number":"JBX-3050MV/S","model_identified":true,"name":"JBX e-beam lithography · JBX-3050MV/S","equipment_id":"EQP-B07","equipment_code":"B07","equipment_label":"E-beam Mask Writing","category_group":"B","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX3","legacy_process_name":null,"process_ids":["PRS-028"],"technology_text":"Variable-shaped beam lithography","technology_ids":["TEC-006"],"technology_basis":{"from_category":["TEC-006"],"from_laser_codes":[]},"application_text":"Mask / reticle making","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000648"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000366","legacy_id":"P00366","entity_type":"model","company_id":"CMP-000235","manufacturer":"Revasum","family_id":"PRD-000306","family_name":"SiC single-wafer processing","model_number":"6EZ","model_identified":true,"name":"SiC single-wafer processing · 6EZ","equipment_id":"EQP-A19","equipment_code":"A19","equipment_label":"CMP","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS10","legacy_process_name":null,"process_ids":["PRS-024"],"technology_text":"Single-wafer SiC polishing (CMP)","technology_ids":["TEC-029"],"technology_basis":{"from_category":["TEC-029"],"from_laser_codes":[]},"application_text":"SiC wafer polishing","application_ids":["APP-011"],"material_text":"SiC","material_ids":["MAT-003"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. The model name appears in the search-result summary of the cited page rather than in its title (LOW confidence). Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000649"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2023-05","review_due":"2027-03-29"}},{"id":"MDL-000367","legacy_id":"P00367","entity_type":"model","company_id":"CMP-000235","manufacturer":"Revasum","family_id":"PRD-000306","family_name":"SiC single-wafer processing","model_number":"7AF-HMG","model_identified":true,"name":"SiC single-wafer processing · 7AF-HMG","equipment_id":"EQP-C02","equipment_code":"C02","equipment_label":"Wafer Grinding","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX2","legacy_process_name":null,"process_ids":["PRS-030"],"technology_text":"Single-wafer SiC grinding","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"SiC wafer grinding","application_ids":["APP-011"],"material_text":"SiC","material_ids":["MAT-003"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. The model name appears in the search-result summary of the cited page rather than in its title (LOW confidence). Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000649"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2023-05","review_due":"2027-03-29"}},{"id":"MDL-000368","legacy_id":"P00368","entity_type":"model","company_id":"CMP-000236","manufacturer":"Amtech Systems","family_id":"PRD-000307","family_name":"BTU advanced-packaging reflow","model_number":"Advanced packaging reflow systems","model_identified":true,"name":"BTU advanced-packaging reflow · Advanced packaging reflow systems","equipment_id":"EQP-E03","equipment_code":"E03","equipment_label":"Packaging","category_group":"E","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":null,"legacy_process_name":null,"process_ids":[],"technology_text":"Solder reflow","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Advanced packaging reflow (AI / HPC)","application_ids":["APP-003","APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000650"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000369","legacy_id":"P00369","entity_type":"model","company_id":"CMP-000237","manufacturer":"Sono-Tek","family_id":"PRD-000308","family_name":"Ultrasonic wafer coating","model_number":"SPT200WS","model_identified":true,"name":"Ultrasonic wafer coating · SPT200WS","equipment_id":"EQP-A02","equipment_code":"A02","equipment_label":"Coater / Developer","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS03","legacy_process_name":null,"process_ids":["PRS-017","PRS-019"],"technology_text":"Ultrasonic spray photoresist coating","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Photoresist coating (MEMS, deep trench)","application_ids":["APP-014"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. The model name appears in the search-result summary of the cited page rather than in its title (LOW confidence). Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000651"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000370","legacy_id":"P00370","entity_type":"model","company_id":"CMP-000238","manufacturer":"Tystar","family_id":"PRD-000309","family_name":"TYTAN furnaces","model_number":"TYTAN Mini Series","model_identified":true,"name":"TYTAN furnaces · TYTAN Mini Series","equipment_id":"EQP-A11","equipment_code":"A11","equipment_label":"Diffusion","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":null,"process_ids":["PRS-011","PRS-012"],"technology_text":"Horizontal diffusion / oxidation / LPCVD furnace","technology_ids":["TEC-027"],"technology_basis":{"from_category":["TEC-027"],"from_laser_codes":[]},"application_text":"Diffusion, oxidation, LPCVD","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000652"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000371","legacy_id":"P00371","entity_type":"model","company_id":"CMP-000238","manufacturer":"Tystar","family_id":"PRD-000309","family_name":"TYTAN furnaces","model_number":"TYTAN Standard Series","model_identified":true,"name":"TYTAN furnaces · TYTAN Standard Series","equipment_id":"EQP-A11","equipment_code":"A11","equipment_label":"Diffusion","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":null,"process_ids":["PRS-011","PRS-012"],"technology_text":"Horizontal diffusion / oxidation / LPCVD furnace","technology_ids":["TEC-027"],"technology_basis":{"from_category":["TEC-027"],"from_laser_codes":[]},"application_text":"Diffusion, oxidation, LPCVD","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000653"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000372","legacy_id":"P00372","entity_type":"model","company_id":"CMP-000239","manufacturer":"Linton Crystal Technologies","family_id":"PRD-000310","family_name":"CZ growing equipment","model_number":"KX380PV","model_identified":true,"name":"CZ growing equipment · KX380PV","equipment_id":"EQP-K01","equipment_code":"K01","equipment_label":"Crystal growth furnaces / pullers","category_group":"K","segment":"Wafer Manufacturing","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-001"],"technology_text":"Czochralski crystal grower","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Monocrystalline ingot growth","application_ids":[],"material_text":"Si","material_ids":["MAT-001"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000654"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000373","legacy_id":"P00373","entity_type":"model","company_id":"CMP-000239","manufacturer":"Linton Crystal Technologies","family_id":"PRD-000311","family_name":"Crystal processing equipment","model_number":"Crystal processing equipment","model_identified":true,"name":"Crystal processing equipment · Crystal processing equipment","equipment_id":"EQP-K02","equipment_code":"K02","equipment_label":"Ingot grinding & shaping","category_group":"K","segment":"Wafer Manufacturing","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-002"],"technology_text":"Ingot shaping, polishing and cutting","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Ingot processing into wafers","application_ids":[],"material_text":"Si","material_ids":["MAT-001"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000655"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000374","legacy_id":"P00374","entity_type":"model","company_id":"CMP-000240","manufacturer":"Modutek","family_id":"PRD-000312","family_name":"Wet benches","model_number":"Automated wet bench","model_identified":true,"name":"Wet benches · Automated wet bench","equipment_id":"EQP-A05","equipment_code":"A05","equipment_label":"Wet Processing","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010","PRS-021"],"technology_text":"Automated wet processing","technology_ids":["TEC-030"],"technology_basis":{"from_category":["TEC-030"],"from_laser_codes":[]},"application_text":"Wet etch / clean","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000656"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000375","legacy_id":"P00375","entity_type":"model","company_id":"CMP-000240","manufacturer":"Modutek","family_id":"PRD-000312","family_name":"Wet benches","model_number":"Semi-automated wet bench","model_identified":true,"name":"Wet benches · Semi-automated wet bench","equipment_id":"EQP-A05","equipment_code":"A05","equipment_label":"Wet Processing","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010","PRS-021"],"technology_text":"Semi-automated wet processing","technology_ids":["TEC-030"],"technology_basis":{"from_category":["TEC-030"],"from_laser_codes":[]},"application_text":"Wet etch / clean","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000657"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000376","legacy_id":"P00376","entity_type":"model","company_id":"CMP-000240","manufacturer":"Modutek","family_id":"PRD-000312","family_name":"Wet benches","model_number":"Manual wet process station","model_identified":true,"name":"Wet benches · Manual wet process station","equipment_id":"EQP-A05","equipment_code":"A05","equipment_label":"Wet Processing","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010","PRS-021"],"technology_text":"Manual wet processing","technology_ids":["TEC-030"],"technology_basis":{"from_category":["TEC-030"],"from_laser_codes":[]},"application_text":"Prototype / low-volume wet processing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000658"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000377","legacy_id":"P00377","entity_type":"model","company_id":"CMP-000241","manufacturer":"Evatec","family_id":"PRD-000313","family_name":"CLUSTERLINE","model_number":"CLUSTERLINE 200","model_identified":true,"name":"CLUSTERLINE · CLUSTERLINE 200","equipment_id":"EQP-A09.07","equipment_code":"A09.07","equipment_label":"PVD","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013","PRS-016"],"technology_text":"Sputter / PVD cluster platform","technology_ids":["TEC-020"],"technology_basis":{"from_category":["TEC-020"],"from_laser_codes":[]},"application_text":"Semiconductor and photonics thin films","application_ids":["APP-018"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000659"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000378","legacy_id":"P00378","entity_type":"model","company_id":"CMP-000241","manufacturer":"Evatec","family_id":"PRD-000313","family_name":"CLUSTERLINE","model_number":"CLUSTERLINE 300","model_identified":true,"name":"CLUSTERLINE · CLUSTERLINE 300","equipment_id":"EQP-A09.07","equipment_code":"A09.07","equipment_label":"PVD","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013","PRS-016"],"technology_text":"Sputter / PVD cluster platform","technology_ids":["TEC-020"],"technology_basis":{"from_category":["TEC-020"],"from_laser_codes":[]},"application_text":"Semiconductor thin films","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000660"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000379","legacy_id":"P00379","entity_type":"model","company_id":"CMP-000241","manufacturer":"Evatec","family_id":"PRD-000313","family_name":"CLUSTERLINE","model_number":"PEALD module","model_identified":true,"name":"CLUSTERLINE · PEALD module","equipment_id":"EQP-A09.06","equipment_code":"A09.06","equipment_label":"ALD","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013","PRS-015"],"technology_text":"Plasma-enhanced ALD","technology_ids":["TEC-019"],"technology_basis":{"from_category":["TEC-019"],"from_laser_codes":[]},"application_text":"Thin dielectric films","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000661"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000380","legacy_id":"P00380","entity_type":"model","company_id":"CMP-000242","manufacturer":"Siconnex","family_id":"PRD-000314","family_name":"BATCHSPRAY","model_number":"BATCHSPRAY Acid","model_identified":true,"name":"BATCHSPRAY · BATCHSPRAY Acid","equipment_id":"EQP-A05","equipment_code":"A05","equipment_label":"Wet Processing","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010","PRS-021"],"technology_text":"Batch-spray wet processing","technology_ids":["TEC-030"],"technology_basis":{"from_category":["TEC-030"],"from_laser_codes":[]},"application_text":"Cleaning and etching","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000662"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000381","legacy_id":"P00381","entity_type":"model","company_id":"CMP-000242","manufacturer":"Siconnex","family_id":"PRD-000314","family_name":"BATCHSPRAY","model_number":"BATCHSPRAY Autoload Acid","model_identified":true,"name":"BATCHSPRAY · BATCHSPRAY Autoload Acid","equipment_id":"EQP-A05","equipment_code":"A05","equipment_label":"Wet Processing","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010","PRS-021"],"technology_text":"Batch-spray wet processing (autoload)","technology_ids":["TEC-030"],"technology_basis":{"from_category":["TEC-030"],"from_laser_codes":[]},"application_text":"Cleaning and etching","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000663"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000382","legacy_id":"P00382","entity_type":"model","company_id":"CMP-000242","manufacturer":"Siconnex","family_id":"PRD-000314","family_name":"BATCHSPRAY","model_number":"BATCHSPRAY Solvent","model_identified":true,"name":"BATCHSPRAY · BATCHSPRAY Solvent","equipment_id":"EQP-A05","equipment_code":"A05","equipment_label":"Wet Processing","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010","PRS-021"],"technology_text":"Batch-spray solvent processing","technology_ids":["TEC-030"],"technology_basis":{"from_category":["TEC-030"],"from_laser_codes":[]},"application_text":"Resist strip / solvent cleaning","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000664"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000383","legacy_id":"P00383","entity_type":"model","company_id":"CMP-000242","manufacturer":"Siconnex","family_id":"PRD-000314","family_name":"BATCHSPRAY","model_number":"BATCHSPRAY Solvent Autoload","model_identified":true,"name":"BATCHSPRAY · BATCHSPRAY Solvent Autoload","equipment_id":"EQP-A05","equipment_code":"A05","equipment_label":"Wet Processing","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010","PRS-021"],"technology_text":"Batch-spray solvent processing (autoload)","technology_ids":["TEC-030"],"technology_basis":{"from_category":["TEC-030"],"from_laser_codes":[]},"application_text":"Resist strip / solvent cleaning","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000665"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000384","legacy_id":"P00384","entity_type":"model","company_id":"CMP-000243","manufacturer":"Ion Beam Services (IBS)","family_id":"PRD-000315","family_name":"Plasma immersion implanters","model_number":"PULSION","model_identified":true,"name":"Plasma immersion implanters · PULSION","equipment_id":"EQP-A10","equipment_code":"A10","equipment_label":"Ion Implantation","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS06","legacy_process_name":null,"process_ids":["PRS-022"],"technology_text":"Plasma immersion ion implantation","technology_ids":["TEC-026"],"technology_basis":{"from_category":["TEC-026"],"from_laser_codes":[]},"application_text":"Ultra-low-energy and conformal implantation","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. The model name appears in the search-result summary of the cited page rather than in its title (LOW confidence). Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000535"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000385","legacy_id":"P00385","entity_type":"model","company_id":"CMP-000244","manufacturer":"scia Systems","family_id":"PRD-000316","family_name":"Ion beam trimming","model_number":"scia Trim 200","model_identified":true,"name":"Ion beam trimming · scia Trim 200","equipment_id":"EQP-A08.01","equipment_code":"A08.01","equipment_label":"Dry Etch","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS04","legacy_process_name":null,"process_ids":["PRS-020"],"technology_text":"Ion beam trimming","technology_ids":["TEC-009"],"technology_basis":{"from_category":["TEC-009"],"from_laser_codes":[]},"application_text":"Wafer surface trimming","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000666"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000386","legacy_id":"P00386","entity_type":"model","company_id":"CMP-000245","manufacturer":"centrotherm international","family_id":"PRD-000317","family_name":"Vertical furnaces","model_number":"c.VERTICOO Mini","model_identified":true,"name":"Vertical furnaces · c.VERTICOO Mini","equipment_id":"EQP-A11","equipment_code":"A11","equipment_label":"Diffusion","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":null,"process_ids":["PRS-011","PRS-012"],"technology_text":"Vertical mini-batch furnace","technology_ids":["TEC-027"],"technology_basis":{"from_category":["TEC-027"],"from_laser_codes":[]},"application_text":"R&D wafer thermal processing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000667"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000387","legacy_id":"P00387","entity_type":"model","company_id":"CMP-000246","manufacturer":"PINK GmbH Thermosysteme","family_id":"PRD-000318","family_name":"Sintering systems","model_number":"SIN 50+ / SIN 100 Multi Drive","model_identified":true,"name":"Sintering systems · SIN 50+ / SIN 100 Multi Drive","equipment_id":"EQP-F08","equipment_code":"F08","equipment_label":"Packaging","category_group":"F","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":null,"legacy_process_name":null,"process_ids":[],"technology_text":"Pressure-assisted silver sintering","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Power-module die attach","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000668"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000388","legacy_id":"P00388","entity_type":"model","company_id":"CMP-000251","manufacturer":"Nanoscribe","family_id":"PRD-000319","family_name":"Quantum X","model_number":"Quantum X litho","model_identified":true,"name":"Quantum X · Quantum X litho","equipment_id":"EQP-A01.08","equipment_code":"A01.08","equipment_label":"Maskless Lithography","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":null,"process_ids":["PRS-018","PRS-045","PRS-047"],"technology_text":"Two-photon grayscale lithography","technology_ids":["TEC-008"],"technology_basis":{"from_category":["TEC-008"],"from_laser_codes":[]},"application_text":"2.5D microoptics, masters","application_ids":["APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000669"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000389","legacy_id":"P00389","entity_type":"model","company_id":"CMP-000251","manufacturer":"Nanoscribe","family_id":"PRD-000319","family_name":"Quantum X","model_number":"Quantum X align","model_identified":true,"name":"Quantum X · Quantum X align","equipment_id":"EQP-A01.08","equipment_code":"A01.08","equipment_label":"Maskless Lithography","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS02","legacy_process_name":null,"process_ids":["PRS-018","PRS-045","PRS-047"],"technology_text":"Aligned two-photon lithography","technology_ids":["TEC-008"],"technology_basis":{"from_category":["TEC-008"],"from_laser_codes":[]},"application_text":"3D optics printed on fibers and chips","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000670"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000390","legacy_id":"P00390","entity_type":"model","company_id":"CMP-000253","manufacturer":"ficonTEC","family_id":"PRD-000320","family_name":"Electro-optical wafer-level test","model_number":"Top-sided electro-optical wafer-level tester","model_identified":true,"name":"Electro-optical wafer-level test · Top-sided electro-optical wafer-level tester","equipment_id":"EQP-A32","equipment_code":"A32","equipment_label":"Electrical Wafer Testing","category_group":"A","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS12","legacy_process_name":null,"process_ids":["PRS-029"],"technology_text":"Electro-optical wafer-level test (ATE-agnostic)","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"Silicon photonics wafer test","application_ids":["APP-018"],"material_text":null,"material_ids":["MAT-001"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000671"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000391","legacy_id":"P00391","entity_type":"model","company_id":"CMP-000253","manufacturer":"ficonTEC","family_id":"PRD-000320","family_name":"Electro-optical wafer-level test","model_number":"Wafer-level test cell","model_identified":true,"name":"Electro-optical wafer-level test · Wafer-level test cell","equipment_id":"EQP-A32","equipment_code":"A32","equipment_label":"Electrical Wafer Testing","category_group":"A","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS12","legacy_process_name":null,"process_ids":["PRS-029"],"technology_text":"Electro-optical wafer-level test cell","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"Photonic IC wafer test alongside ATE","application_ids":["APP-018"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000672"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000392","legacy_id":"P00392","entity_type":"model","company_id":"CMP-000254","manufacturer":"Semsysco","family_id":"PRD-000321","family_name":"Panel processing","model_number":"Kallisto","model_identified":true,"name":"Panel processing · Kallisto","equipment_id":"EQP-D19","equipment_code":"D19","equipment_label":"Panel Level Packaging","category_group":"D","segment":"Advanced Packaging","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX5","legacy_process_name":null,"process_ids":["PRS-053"],"technology_text":"Vertical wet processing for panels","technology_ids":["TEC-048"],"technology_basis":{"from_category":["TEC-048"],"from_laser_codes":[]},"application_text":"Panel-level packaging wet processing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000673"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000393","legacy_id":"P00393","entity_type":"model","company_id":"CMP-000255","manufacturer":"Kurt J. Lesker Company","family_id":"PRD-000322","family_name":"PRO Line","model_number":"PRO Line PVD 200","model_identified":true,"name":"PRO Line · PRO Line PVD 200","equipment_id":"EQP-A09.07","equipment_code":"A09.07","equipment_label":"PVD","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013","PRS-016"],"technology_text":"Modular PVD platform","technology_ids":["TEC-020"],"technology_basis":{"from_category":["TEC-020"],"from_laser_codes":[]},"application_text":"Thin-film deposition","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000674"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000394","legacy_id":"P00394","entity_type":"model","company_id":"CMP-000255","manufacturer":"Kurt J. Lesker Company","family_id":"PRD-000323","family_name":"CMS","model_number":"CMS Series","model_identified":true,"name":"CMS · CMS Series","equipment_id":"EQP-A09.07","equipment_code":"A09.07","equipment_label":"PVD","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013","PRS-016"],"technology_text":"Combinatorial materials deposition (sputter / e-beam)","technology_ids":["TEC-020"],"technology_basis":{"from_category":["TEC-020"],"from_laser_codes":[]},"application_text":"Combinatorial materials research","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000675"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000395","legacy_id":"P00395","entity_type":"model","company_id":"CMP-000256","manufacturer":"Kensington Laboratories","family_id":"PRD-000324","family_name":"Wafer handling robots","model_number":"MultiLink SCARA wafer handling robot","model_identified":true,"name":"Wafer handling robots · MultiLink SCARA wafer handling robot","equipment_id":"EQP-A38","equipment_code":"A38","equipment_label":"Atmospheric Robots","category_group":"A","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-058"],"technology_text":"Atmospheric SCARA wafer robot","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer handling in process and metrology tools","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000676"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000396","legacy_id":"P00396","entity_type":"model","company_id":"CMP-000256","manufacturer":"Kensington Laboratories","family_id":"PRD-000325","family_name":"EFEM","model_number":"EFEM","model_identified":true,"name":"EFEM · EFEM","equipment_id":"EQP-A37","equipment_code":"A37","equipment_label":"EFEM","category_group":"A","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-058"],"technology_text":"Equipment front-end module","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Tool front-end automation","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. The model name appears in the search-result summary of the cited page rather than in its title (LOW confidence). Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000677"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000397","legacy_id":"P00397","entity_type":"model","company_id":"CMP-000257","manufacturer":"Nanotronics","family_id":"PRD-000326","family_name":"nSpec","model_number":"nSpec PS","model_identified":true,"name":"nSpec · nSpec PS","equipment_id":"EQP-A23","equipment_code":"A23","equipment_label":"Optical Inspection","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS09","legacy_process_name":null,"process_ids":["PRS-027"],"technology_text":"AI automated optical inspection","technology_ids":["TEC-031"],"technology_basis":{"from_category":["TEC-031"],"from_laser_codes":[]},"application_text":"Wafer defect inspection","application_ids":["APP-003"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000678"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000398","legacy_id":"P00398","entity_type":"model","company_id":"CMP-000257","manufacturer":"Nanotronics","family_id":"PRD-000326","family_name":"nSpec","model_number":"nSpec LS","model_identified":true,"name":"nSpec · nSpec LS","equipment_id":"EQP-A23","equipment_code":"A23","equipment_label":"Optical Inspection","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS09","legacy_process_name":null,"process_ids":["PRS-027"],"technology_text":"Automated inspection microscope","technology_ids":["TEC-031"],"technology_basis":{"from_category":["TEC-031"],"from_laser_codes":[]},"application_text":"Wafer inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000679"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000399","legacy_id":"P00399","entity_type":"model","company_id":"CMP-000258","manufacturer":"Sigray","family_id":"PRD-000327","family_name":"3D X-ray microscopes","model_number":"EclipseXRM-910","model_identified":true,"name":"3D X-ray microscopes · EclipseXRM-910","equipment_id":"EQP-C35","equipment_code":"C35","equipment_label":"X-ray Inspection","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-040"],"technology_text":"Sub-micron 3D X-ray microscopy","technology_ids":["TEC-033"],"technology_basis":{"from_category":["TEC-033"],"from_laser_codes":[]},"application_text":"Advanced-package failure analysis","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000680"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000400","legacy_id":"P00400","entity_type":"model","company_id":"CMP-000258","manufacturer":"Sigray","family_id":"PRD-000327","family_name":"3D X-ray microscopes","model_number":"Apex Hybrid","model_identified":true,"name":"3D X-ray microscopes · Apex Hybrid","equipment_id":"EQP-C35","equipment_code":"C35","equipment_label":"X-ray Inspection","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-040"],"technology_text":"3D X-ray microscopy","technology_ids":["TEC-033"],"technology_basis":{"from_category":["TEC-033"],"from_laser_codes":[]},"application_text":"High-throughput 3D X-ray imaging","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000681"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000401","legacy_id":"P00401","entity_type":"model","company_id":"CMP-000258","manufacturer":"Sigray","family_id":"PRD-000328","family_name":"MicroXRF","model_number":"AttoMap-200","model_identified":true,"name":"MicroXRF · AttoMap-200","equipment_id":"EQP-A25","equipment_code":"A25","equipment_label":"Metrology","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS08","legacy_process_name":null,"process_ids":["PRS-026"],"technology_text":"Micro X-ray fluorescence","technology_ids":["TEC-035"],"technology_basis":{"from_category":["TEC-035"],"from_laser_codes":[]},"application_text":"Contamination / micro-bump metrology","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000682"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000402","legacy_id":"P00402","entity_type":"model","company_id":"CMP-000261","manufacturer":"AUROS Technology","family_id":"PRD-000329","family_name":"Overlay metrology","model_number":"Package overlay metrology","model_identified":true,"name":"Overlay metrology · Package overlay metrology","equipment_id":"EQP-A27","equipment_code":"A27","equipment_label":"Overlay Metrology","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS08","legacy_process_name":null,"process_ids":["PRS-026"],"technology_text":"Overlay metrology","technology_ids":["TEC-035"],"technology_basis":{"from_category":["TEC-035"],"from_laser_codes":[]},"application_text":"Advanced-packaging overlay","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000683"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000403","legacy_id":"P00403","entity_type":"model","company_id":"CMP-000261","manufacturer":"AUROS Technology","family_id":"PRD-000329","family_name":"Overlay metrology","model_number":"OL-1000n","model_identified":true,"name":"Overlay metrology · OL-1000n","equipment_id":"EQP-A27","equipment_code":"A27","equipment_label":"Overlay Metrology","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS08","legacy_process_name":null,"process_ids":["PRS-026"],"technology_text":"Wafer overlay metrology","technology_ids":["TEC-035"],"technology_basis":{"from_category":["TEC-035"],"from_laser_codes":[]},"application_text":"Front-end overlay","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. The model name appears in the search-result summary of the cited page rather than in its title (LOW confidence). Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000561"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000404","legacy_id":"P00404","entity_type":"model","company_id":"CMP-000261","manufacturer":"AUROS Technology","family_id":"PRD-000330","family_name":"Warpage metrology","model_number":"WaPIS-30","model_identified":true,"name":"Warpage metrology · WaPIS-30","equipment_id":"EQP-A30","equipment_code":"A30","equipment_label":"Wafer Surface Measurement","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS08","legacy_process_name":null,"process_ids":["PRS-008","PRS-026"],"technology_text":"Warpage metrology","technology_ids":["TEC-035"],"technology_basis":{"from_category":["TEC-035"],"from_laser_codes":[]},"application_text":"Wafer / package warpage","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000684"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000405","legacy_id":"P00405","entity_type":"model","company_id":"CMP-000262","manufacturer":"NEXTIN","family_id":"PRD-000331","family_name":"AEGIS","model_number":"AEGIS","model_identified":true,"name":"AEGIS · AEGIS","equipment_id":"EQP-A22","equipment_code":"A22","equipment_label":"Defect Inspection","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS09","legacy_process_name":null,"process_ids":["PRS-027"],"technology_text":"2D-imaging patterned wafer defect inspection","technology_ids":["TEC-031"],"technology_basis":{"from_category":["TEC-031"],"from_laser_codes":[]},"application_text":"Front-end defect inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000685"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000406","legacy_id":"P00406","entity_type":"model","company_id":"CMP-000263","manufacturer":"Exicon","family_id":"PRD-000332","family_name":"Testers","model_number":"Memory Tester","model_identified":true,"name":"Testers · Memory Tester","equipment_id":"EQP-C40","equipment_code":"C40","equipment_label":"IC Test","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-041"],"technology_text":"Memory test","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"Memory component test","application_ids":["APP-005"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000686"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000407","legacy_id":"P00407","entity_type":"model","company_id":"CMP-000263","manufacturer":"Exicon","family_id":"PRD-000332","family_name":"Testers","model_number":"SSD Tester","model_identified":true,"name":"Testers · SSD Tester","equipment_id":"EQP-C41","equipment_code":"C41","equipment_label":"Package Test","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-041"],"technology_text":"Storage (SSD) test","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"SSD test","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000687"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000408","legacy_id":"P00408","entity_type":"model","company_id":"CMP-000263","manufacturer":"Exicon","family_id":"PRD-000332","family_name":"Testers","model_number":"SoC Tester","model_identified":true,"name":"Testers · SoC Tester","equipment_id":"EQP-C40","equipment_code":"C40","equipment_label":"IC Test","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-041"],"technology_text":"SoC test","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"SoC / logic test","application_ids":["APP-001"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000688"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000409","legacy_id":"P00409","entity_type":"model","company_id":"CMP-000263","manufacturer":"Exicon","family_id":"PRD-000332","family_name":"Testers","model_number":"Burn-In Tester","model_identified":true,"name":"Testers · Burn-In Tester","equipment_id":"EQP-C38","equipment_code":"C38","equipment_label":"Burn-in","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-042"],"technology_text":"Burn-in test","technology_ids":["TEC-057"],"technology_basis":{"from_category":["TEC-057"],"from_laser_codes":[]},"application_text":"Burn-in","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000689"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000410","legacy_id":"P00410","entity_type":"model","company_id":"CMP-000265","manufacturer":"TES Co., Ltd.","family_id":"PRD-000333","family_name":"PECVD","model_number":"CHALLENGER HT Series","model_identified":true,"name":"PECVD · CHALLENGER HT Series","equipment_id":"EQP-A09.02","equipment_code":"A09.02","equipment_label":"PECVD","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013","PRS-014"],"technology_text":"PECVD (hard mask)","technology_ids":["TEC-016"],"technology_basis":{"from_category":["TEC-016"],"from_laser_codes":[]},"application_text":"DRAM / 3D NAND / logic hard mask","application_ids":["APP-001","APP-006","APP-007"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000690"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000411","legacy_id":"P00411","entity_type":"model","company_id":"CMP-000266","manufacturer":"MIRAE Corporation","family_id":"PRD-000334","family_name":"Test handlers","model_number":"Logic Test Handler","model_identified":true,"name":"Test handlers · Logic Test Handler","equipment_id":"EQP-C39","equipment_code":"C39","equipment_label":"Handler","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-041"],"technology_text":"Logic test handling","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"Logic device test","application_ids":["APP-001"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000691"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000412","legacy_id":"P00412","entity_type":"model","company_id":"CMP-000266","manufacturer":"MIRAE Corporation","family_id":"PRD-000334","family_name":"Test handlers","model_number":"Module Test Handler","model_identified":true,"name":"Test handlers · Module Test Handler","equipment_id":"EQP-C39","equipment_code":"C39","equipment_label":"Handler","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-041"],"technology_text":"Module test handling","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"Memory module test","application_ids":["APP-005"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000692"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000413","legacy_id":"P00413","entity_type":"model","company_id":"CMP-000266","manufacturer":"MIRAE Corporation","family_id":"PRD-000334","family_name":"Test handlers","model_number":"Burn-In Sorter","model_identified":true,"name":"Test handlers · Burn-In Sorter","equipment_id":"EQP-C38","equipment_code":"C38","equipment_label":"Burn-in","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-042"],"technology_text":"Burn-in sorting","technology_ids":["TEC-057"],"technology_basis":{"from_category":["TEC-057"],"from_laser_codes":[]},"application_text":"Burn-in board load / sort","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000693"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000414","legacy_id":"P00414","entity_type":"model","company_id":"CMP-000269","manufacturer":"AEM Holdings","family_id":"PRD-000335","family_name":"AMPS","model_number":"AMPS SLT platform","model_identified":true,"name":"AMPS · AMPS SLT platform","equipment_id":"EQP-C37","equipment_code":"C37","equipment_label":"Final Test","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-041"],"technology_text":"System-level test and burn-in cell","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"SLT for advanced computing devices","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000694"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000415","legacy_id":"P00415","entity_type":"model","company_id":"CMP-000270","manufacturer":"Aemulus","family_id":"PRD-000336","family_name":"AMB testers","model_number":"AMB4200","model_identified":true,"name":"AMB testers · AMB4200","equipment_id":"EQP-C40","equipment_code":"C40","equipment_label":"IC Test","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-041"],"technology_text":"Analog ATE","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"Analog / PMIC test","application_ids":["APP-009"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000695"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000416","legacy_id":"P00416","entity_type":"model","company_id":"CMP-000270","manufacturer":"Aemulus","family_id":"PRD-000336","family_name":"AMB testers","model_number":"AMB4600","model_identified":true,"name":"AMB testers · AMB4600","equipment_id":"EQP-C40","equipment_code":"C40","equipment_label":"IC Test","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-041"],"technology_text":"Configurable ATE","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"Mixed-signal test","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000696"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000417","legacy_id":"P00417","entity_type":"model","company_id":"CMP-000270","manufacturer":"Aemulus","family_id":"PRD-000336","family_name":"AMB testers","model_number":"AMB5600","model_identified":true,"name":"AMB testers · AMB5600","equipment_id":"EQP-C40","equipment_code":"C40","equipment_label":"IC Test","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-041"],"technology_text":"SoC / MCU ATE","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"SoC, MCU, IoT test","application_ids":["APP-004"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000697"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000418","legacy_id":"P00418","entity_type":"model","company_id":"CMP-000270","manufacturer":"Aemulus","family_id":"PRD-000336","family_name":"AMB testers","model_number":"AMB7600-SR","model_identified":true,"name":"AMB testers · AMB7600-SR","equipment_id":"EQP-C40","equipment_code":"C40","equipment_label":"IC Test","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-041"],"technology_text":"RF ATE","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"RF / wireless device test","application_ids":["APP-013"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000698"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000419","legacy_id":"P00419","entity_type":"model","company_id":"CMP-000273","manufacturer":"Holmarc Opto-Mechatronics","family_id":"PRD-000337","family_name":"Spin coating units","model_number":"Spin Coating Unit","model_identified":true,"name":"Spin coating units · Spin Coating Unit","equipment_id":"EQP-A02","equipment_code":"A02","equipment_label":"Coater / Developer","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS03","legacy_process_name":null,"process_ids":["PRS-017","PRS-019"],"technology_text":"Tabletop spin coating","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Research photoresist / thin-film coating","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000699"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000420","legacy_id":"P00420","entity_type":"model","company_id":"CMP-000273","manufacturer":"Holmarc Opto-Mechatronics","family_id":"PRD-000337","family_name":"Spin coating units","model_number":"Spin Coating Unit - Larger version","model_identified":true,"name":"Spin coating units · Spin Coating Unit - Larger version","equipment_id":"EQP-A02","equipment_code":"A02","equipment_label":"Coater / Developer","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS03","legacy_process_name":null,"process_ids":["PRS-017","PRS-019"],"technology_text":"Tabletop spin coating","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Research coating (larger substrates)","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000700"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000421","legacy_id":"P00421","entity_type":"model","company_id":"CMP-000274","manufacturer":"Scantech Laser","family_id":"PRD-000338","family_name":"ProMark","model_number":"20W Pulsed Fiber Laser Marking Machine - ProMark OEM","model_identified":true,"name":"ProMark · 20W Pulsed Fiber Laser Marking Machine - ProMark OEM","equipment_id":"EQP-C26","equipment_code":"C26","equipment_label":"Laser Marking","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS14","legacy_process_name":null,"process_ids":["PRS-038"],"technology_text":"Pulsed fiber laser marking","technology_ids":["TEC-059","TEC-080"],"technology_basis":{"from_category":["TEC-059"],"from_laser_codes":["TEC-059","TEC-080"]},"application_text":"Industrial laser marking (semiconductor use not stated in title)","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":{"types_text":"Laser Marking; Fiber Laser","type_codes":["L01","L22"],"source":null,"wavelength":null,"average_power":null,"pulse_duration":null,"pulse_energy":null,"repetition_rate":null,"scan_speed":null,"material":null},"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 3 (2026-09-30): maker, product name and category taken from the title of the cited page, press release, brochure or datasheet, located by web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED. LOW confidence: the title names an industrial laser marker; suitability for semiconductor marking is not stated.","reclassified":null,"batch":"Batch 3","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000701"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000422","legacy_id":"P00422","entity_type":"model","company_id":"CMP-000276","manufacturer":"Hesse Mechatronics","family_id":"PRD-000339","family_name":"Bondjet heavy wire","model_number":"Bondjet BJ955 / BJ959","model_identified":true,"name":"Bondjet heavy wire · Bondjet BJ955 / BJ959","equipment_id":"EQP-C14","equipment_code":"C14","equipment_label":"Wedge Bonding","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-034"],"technology_text":"Heavy-wire ultrasonic wedge-wedge bonding","technology_ids":["TEC-040"],"technology_basis":{"from_category":["TEC-040"],"from_laser_codes":[]},"application_text":"Power modules, large substrates","application_ids":["APP-010"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000739"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000423","legacy_id":"P00423","entity_type":"model","company_id":"CMP-000276","manufacturer":"Hesse Mechatronics","family_id":"PRD-000340","family_name":"Bondjet fine wire","model_number":"Bondjet BJ855 / BJ885","model_identified":true,"name":"Bondjet fine wire · Bondjet BJ855 / BJ885","equipment_id":"EQP-C14","equipment_code":"C14","equipment_label":"Wedge Bonding","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-034"],"technology_text":"Fine-wire wedge-wedge bonding","technology_ids":["TEC-040"],"technology_basis":{"from_category":["TEC-040"],"from_laser_codes":[]},"application_text":"Chip-on-board, sensors, hybrids","application_ids":["APP-015"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000740"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000424","legacy_id":"P00424","entity_type":"model","company_id":"CMP-000276","manufacturer":"Hesse Mechatronics","family_id":"PRD-000340","family_name":"Bondjet fine wire","model_number":"Bondjet BJ931","model_identified":true,"name":"Bondjet fine wire · Bondjet BJ931","equipment_id":"EQP-C14","equipment_code":"C14","equipment_label":"Wedge Bonding","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-034"],"technology_text":"Wedge-wedge wire bonding","technology_ids":["TEC-040"],"technology_basis":{"from_category":["TEC-040"],"from_laser_codes":[]},"application_text":"Wire bonding","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000741"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000425","legacy_id":"P00425","entity_type":"model","company_id":"CMP-000277","manufacturer":"West-Bond","family_id":"PRD-000341","family_name":"Manual wire bonders","model_number":"7700D series","model_identified":true,"name":"Manual wire bonders · 7700D series","equipment_id":"EQP-C13","equipment_code":"C13","equipment_label":"Ball Bonding","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-034"],"technology_text":"Ball-wedge wire bonding (manual XYZ)","technology_ids":["TEC-040"],"technology_basis":{"from_category":["TEC-040"],"from_laser_codes":[]},"application_text":"Gold ball bonding for R&D and small lots","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000742"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000426","legacy_id":"P00426","entity_type":"model","company_id":"CMP-000277","manufacturer":"West-Bond","family_id":"PRD-000341","family_name":"Manual wire bonders","model_number":"747630E series","model_identified":true,"name":"Manual wire bonders · 747630E series","equipment_id":"EQP-C14","equipment_code":"C14","equipment_label":"Wedge Bonding","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-034"],"technology_text":"Wedge-wedge wire bonding","technology_ids":["TEC-040"],"technology_basis":{"from_category":["TEC-040"],"from_laser_codes":[]},"application_text":"Al / Au wire and ribbon bonding","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000743"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000427","legacy_id":"P00427","entity_type":"model","company_id":"CMP-000277","manufacturer":"West-Bond","family_id":"PRD-000341","family_name":"Manual wire bonders","model_number":"7KF / 7KFH series","model_identified":true,"name":"Manual wire bonders · 7KF / 7KFH series","equipment_id":"EQP-C12","equipment_code":"C12","equipment_label":"Wire Bonding","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-034"],"technology_text":"Convertible wedge-wedge / ball-wedge wire bonding","technology_ids":["TEC-040"],"technology_basis":{"from_category":["TEC-040"],"from_laser_codes":[]},"application_text":"Wire bonding","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000744"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000428","legacy_id":"P00428","entity_type":"model","company_id":"CMP-000278","manufacturer":"TPT Wire Bonder","family_id":"PRD-000342","family_name":"HB series","model_number":"HB16","model_identified":true,"name":"HB series · HB16","equipment_id":"EQP-C12","equipment_code":"C12","equipment_label":"Wire Bonding","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-034"],"technology_text":"Semi-automatic wire bonding","technology_ids":["TEC-040"],"technology_basis":{"from_category":["TEC-040"],"from_laser_codes":[]},"application_text":"Wire bonding (wedge, ball, ribbon)","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000745"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000429","legacy_id":"P00429","entity_type":"model","company_id":"CMP-000278","manufacturer":"TPT Wire Bonder","family_id":"PRD-000342","family_name":"HB series","model_number":"HB100","model_identified":true,"name":"HB series · HB100","equipment_id":"EQP-C12","equipment_code":"C12","equipment_label":"Wire Bonding","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-034"],"technology_text":"Automatic wire bonding","technology_ids":["TEC-040"],"technology_basis":{"from_category":["TEC-040"],"from_laser_codes":[]},"application_text":"Wire bonding","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000746"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000430","legacy_id":"P00430","entity_type":"model","company_id":"CMP-000278","manufacturer":"TPT Wire Bonder","family_id":"PRD-000342","family_name":"HB series","model_number":"HB05","model_identified":true,"name":"HB series · HB05","equipment_id":"EQP-C12","equipment_code":"C12","equipment_label":"Wire Bonding","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-034"],"technology_text":"Manual wire bonding","technology_ids":["TEC-040"],"technology_basis":{"from_category":["TEC-040"],"from_laser_codes":[]},"application_text":"R&D wire bonding","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000747"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000431","legacy_id":"P00431","entity_type":"model","company_id":"CMP-000279","manufacturer":"Mühlbauer","family_id":"PRD-000343","family_name":"Die sorting","model_number":"DS Merlin","model_identified":true,"name":"Die sorting · DS Merlin","equipment_id":"EQP-C08","equipment_code":"C08","equipment_label":"Die Sorting","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-033"],"technology_text":"High-speed die sorting","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Die sorting","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000748"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000432","legacy_id":"P00432","entity_type":"model","company_id":"CMP-000279","manufacturer":"Mühlbauer","family_id":"PRD-000343","family_name":"Die sorting","model_number":"DS Albatross","model_identified":true,"name":"Die sorting · DS Albatross","equipment_id":"EQP-C08","equipment_code":"C08","equipment_label":"Die Sorting","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-033"],"technology_text":"Big-die and multi-bin sorting","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Die sorting","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000749"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000433","legacy_id":"P00433","entity_type":"model","company_id":"CMP-000280","manufacturer":"ITEC","family_id":"PRD-000344","family_name":"ADAT3 XF","model_number":"ADAT3 XF DBSG","model_identified":true,"name":"ADAT3 XF · ADAT3 XF DBSG","equipment_id":"EQP-C10","equipment_code":"C10","equipment_label":"Die Attach","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-033"],"technology_text":"Strip glue die bonding","technology_ids":["TEC-039"],"technology_basis":{"from_category":["TEC-039"],"from_laser_codes":[]},"application_text":"High-volume discrete die attach","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000750"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000434","legacy_id":"P00434","entity_type":"model","company_id":"CMP-000280","manufacturer":"ITEC","family_id":"PRD-000344","family_name":"ADAT3 XF","model_number":"ADAT3 XF DBRE","model_identified":true,"name":"ADAT3 XF · ADAT3 XF DBRE","equipment_id":"EQP-C10","equipment_code":"C10","equipment_label":"Die Attach","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-033"],"technology_text":"Reel-to-reel eutectic die bonding","technology_ids":["TEC-039"],"technology_basis":{"from_category":["TEC-039"],"from_laser_codes":[]},"application_text":"High-volume die attach","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000751"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000435","legacy_id":"P00435","entity_type":"model","company_id":"CMP-000280","manufacturer":"ITEC","family_id":"PRD-000344","family_name":"ADAT3 XF","model_number":"ADAT3 XF DBS","model_identified":true,"name":"ADAT3 XF · ADAT3 XF DBS","equipment_id":"EQP-C10","equipment_code":"C10","equipment_label":"Die Attach","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-033"],"technology_text":"In-line strip die bonding","technology_ids":["TEC-039"],"technology_basis":{"from_category":["TEC-039"],"from_laser_codes":[]},"application_text":"High-volume die attach","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000752"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000436","legacy_id":"P00436","entity_type":"model","company_id":"CMP-000280","manufacturer":"ITEC","family_id":"PRD-000344","family_name":"ADAT3 XF","model_number":"ADAT3XF DS","model_identified":true,"name":"ADAT3 XF · ADAT3XF DS","equipment_id":"EQP-C08","equipment_code":"C08","equipment_label":"Die Sorting","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-033"],"technology_text":"In-line die sorting","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Die sorting","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000753"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000437","legacy_id":"P00437","entity_type":"model","company_id":"CMP-000280","manufacturer":"ITEC","family_id":"PRD-000344","family_name":"ADAT3 XF","model_number":"Flip-chip die bonder","model_identified":true,"name":"ADAT3 XF · Flip-chip die bonder","equipment_id":"EQP-C11","equipment_code":"C11","equipment_label":"Flip Chip","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-035","PRS-050"],"technology_text":"Flip-chip die bonding","technology_ids":["TEC-041"],"technology_basis":{"from_category":["TEC-041"],"from_laser_codes":[]},"application_text":"High-volume flip-chip attach","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000754"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000438","legacy_id":"P00438","entity_type":"model","company_id":"CMP-000281","manufacturer":"Boschman Technologies","family_id":"PRD-000345","family_name":"Unistar","model_number":"Unistar Inline / Unistar Auto","model_identified":true,"name":"Unistar · Unistar Inline / Unistar Auto","equipment_id":"EQP-C21","equipment_code":"C21","equipment_label":"Transfer Molding","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS14","legacy_process_name":null,"process_ids":["PRS-036"],"technology_text":"Film-assisted transfer molding","technology_ids":["TEC-045"],"technology_basis":{"from_category":["TEC-045"],"from_laser_codes":[]},"application_text":"Medium- to high-volume encapsulation","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000755"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000439","legacy_id":"P00439","entity_type":"model","company_id":"CMP-000281","manufacturer":"Boschman Technologies","family_id":"PRD-000346","family_name":"Sinterstar","model_number":"Sinterstar Mini","model_identified":true,"name":"Sinterstar · Sinterstar Mini","equipment_id":"EQP-F08","equipment_code":"F08","equipment_label":"Packaging","category_group":"F","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":null,"legacy_process_name":null,"process_ids":[],"technology_text":"Ag pressure sintering","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Power-module die attach","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000756"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000440","legacy_id":"P00440","entity_type":"model","company_id":"CMP-000282","manufacturer":"inTEST Corporation","family_id":"PRD-000347","family_name":"ThermoStream","model_number":"ATS-Series ThermoStream","model_identified":true,"name":"ThermoStream · ATS-Series ThermoStream","equipment_id":"EQP-C42","equipment_code":"C42","equipment_label":"Thermal Test","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-041"],"technology_text":"Temperature forcing (clean dry air)","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"IC / device temperature testing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000757"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000441","legacy_id":"P00441","entity_type":"model","company_id":"CMP-000283","manufacturer":"Riber","family_id":"PRD-000348","family_name":"MBE systems","model_number":"MBE systems","model_identified":true,"name":"MBE systems · MBE systems","equipment_id":"EQP-A09.11","equipment_code":"A09.11","equipment_label":"MBE","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-009","PRS-013"],"technology_text":"Molecular beam epitaxy","technology_ids":["TEC-024"],"technology_basis":{"from_category":["TEC-024"],"from_laser_codes":[]},"application_text":"Compound semiconductor epitaxy","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000719"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000442","legacy_id":"P00442","entity_type":"model","company_id":"CMP-000284","manufacturer":"SVT Associates","family_id":"PRD-000349","family_name":"MBE systems","model_number":"MBE systems","model_identified":true,"name":"MBE systems · MBE systems","equipment_id":"EQP-A09.11","equipment_code":"A09.11","equipment_label":"MBE","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-009","PRS-013"],"technology_text":"Molecular beam epitaxy","technology_ids":["TEC-024"],"technology_basis":{"from_category":["TEC-024"],"from_laser_codes":[]},"application_text":"Thin-film epitaxy","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000720"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000443","legacy_id":"P00443","entity_type":"model","company_id":"CMP-000289","manufacturer":"Corning (Tropel)","family_id":"PRD-000350","family_name":"Tropel wafer analysis","model_number":"Tropel FlatMaster","model_identified":true,"name":"Tropel wafer analysis · Tropel FlatMaster","equipment_id":"EQP-K09","equipment_code":"K09","equipment_label":"Bare-wafer inspection & geometry","category_group":"K","segment":"Wafer Manufacturing","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-008"],"technology_text":"Grazing-incidence interferometry wafer flatness","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Bare-wafer flatness / geometry","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000758"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000444","legacy_id":"P00444","entity_type":"model","company_id":"CMP-000289","manufacturer":"Corning (Tropel)","family_id":"PRD-000350","family_name":"Tropel wafer analysis","model_number":"FlatMaster MSP","model_identified":true,"name":"Tropel wafer analysis · FlatMaster MSP","equipment_id":"EQP-K09","equipment_code":"K09","equipment_label":"Bare-wafer inspection & geometry","category_group":"K","segment":"Wafer Manufacturing","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-008"],"technology_text":"Wafer surface flatness","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Bare-wafer surface measurement","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000759"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000445","legacy_id":"P00445","entity_type":"model","company_id":"CMP-000292","manufacturer":"Bruker (photomask repair & cleaning)","family_id":"PRD-000351","family_name":"Mask cleaning","model_number":"EL-C","model_identified":true,"name":"Mask cleaning · EL-C","equipment_id":"EQP-B04","equipment_code":"B04","equipment_label":"Mask Cleaning","category_group":"B","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX3","legacy_process_name":null,"process_ids":["PRS-028"],"technology_text":"CO2 dry cleaning of photomasks","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Advanced-node mask cleaning","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000728"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000446","legacy_id":"P00446","entity_type":"model","company_id":"CMP-000293","manufacturer":"Critical Manufacturing","family_id":"PRD-000352","family_name":"MES","model_number":"Critical Manufacturing MES","model_identified":true,"name":"MES · Critical Manufacturing MES","equipment_id":"EQP-J09","equipment_code":"J09","equipment_label":"MES","category_group":"J","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-058"],"technology_text":"Manufacturing execution system","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Semiconductor fab / back-end operations","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000730"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2021-11-02","review_due":"2027-03-29"}},{"id":"MDL-000447","legacy_id":"P00447","entity_type":"model","company_id":"CMP-000294","manufacturer":"Kashiyama Industries","family_id":"PRD-000353","family_name":"NeoDry","model_number":"NeoDry E Series","model_identified":true,"name":"NeoDry · NeoDry E Series","equipment_id":"EQP-L01","equipment_code":"L01","equipment_label":"Vacuum pumps (dry / turbo / cryo)","category_group":"L","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-059"],"technology_text":"Air-cooled multi-stage roots dry pump","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Dry vacuum for deposition and research tools","application_ids":["APP-017"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000760"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000448","legacy_id":"P00448","entity_type":"model","company_id":"CMP-000294","manufacturer":"Kashiyama Industries","family_id":"PRD-000353","family_name":"NeoDry","model_number":"NeoDry G Series","model_identified":true,"name":"NeoDry · NeoDry G Series","equipment_id":"EQP-L01","equipment_code":"L01","equipment_label":"Vacuum pumps (dry / turbo / cryo)","category_group":"L","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-059"],"technology_text":"Dry vacuum pump","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Dry vacuum","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000761"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000449","legacy_id":"P00449","entity_type":"model","company_id":"CMP-000295","manufacturer":"Leybold","family_id":"PRD-000354","family_name":"DRYVAC","model_number":"DRYVAC","model_identified":true,"name":"DRYVAC · DRYVAC","equipment_id":"EQP-L01","equipment_code":"L01","equipment_label":"Vacuum pumps (dry / turbo / cryo)","category_group":"L","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-059"],"technology_text":"Dry screw vacuum pump","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Industrial / process dry vacuum","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000762"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000450","legacy_id":"P00450","entity_type":"model","company_id":"CMP-000296","manufacturer":"Kanken Techno","family_id":"PRD-000355","family_name":"Abatement","model_number":"Wet scrubber system","model_identified":true,"name":"Abatement · Wet scrubber system","equipment_id":"EQP-L02","equipment_code":"L02","equipment_label":"Abatement & scrubbers","category_group":"L","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-059"],"technology_text":"Wet scrubbing of water-soluble gases","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Exhaust-gas abatement","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000733"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000451","legacy_id":"P00451","entity_type":"model","company_id":"CMP-000298","manufacturer":"memsstar","family_id":"PRD-000356","family_name":"Orbis","model_number":"Orbis Alpha","model_identified":true,"name":"Orbis · Orbis Alpha","equipment_id":"EQP-H02","equipment_code":"H02","equipment_label":"DRIE","category_group":"H","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":null,"legacy_process_name":null,"process_ids":[],"technology_text":"Vapour HF sacrificial-oxide release etch","technology_ids":["TEC-012"],"technology_basis":{"from_category":["TEC-012"],"from_laser_codes":[]},"application_text":"MEMS release","application_ids":["APP-014"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. LOW confidence: the cited page is a third-party facility page, not the manufacturer's. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000735"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000452","legacy_id":"P00452","entity_type":"model","company_id":"CMP-000299","manufacturer":"UnitySC","family_id":"PRD-000357","family_name":"4See","model_number":"4See Series","model_identified":true,"name":"4See · 4See Series","equipment_id":"EQP-A22","equipment_code":"A22","equipment_label":"Defect Inspection","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS09","legacy_process_name":null,"process_ids":["PRS-027"],"technology_text":"Backside and edge defect inspection","technology_ids":["TEC-031"],"technology_basis":{"from_category":["TEC-031"],"from_laser_codes":[]},"application_text":"Post-thinning / metallization inspection","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. The model name appears in the search-result summary of the cited page rather than in its title (LOW confidence). Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000763"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000453","legacy_id":"P00453","entity_type":"model","company_id":"CMP-000300","manufacturer":"Kateeva","family_id":"PRD-000358","family_name":"YIELDjet","model_number":"YIELDjet","model_identified":true,"name":"YIELDjet · YIELDjet","equipment_id":"EQP-I02","equipment_code":"I02","equipment_label":"OLED","category_group":"I","segment":"Display","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX6","legacy_process_name":null,"process_ids":[],"technology_text":"Inkjet OLED deposition","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Flexible and large-size OLED mass production","application_ids":["APP-017"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000764"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000454","legacy_id":"P00454","entity_type":"model","company_id":"CMP-000300","manufacturer":"Kateeva","family_id":"PRD-000358","family_name":"YIELDjet","model_number":"YIELDjet FLEX","model_identified":true,"name":"YIELDjet · YIELDjet FLEX","equipment_id":"EQP-I02","equipment_code":"I02","equipment_label":"OLED","category_group":"I","segment":"Display","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX6","legacy_process_name":null,"process_ids":[],"technology_text":"Inkjet thin-film encapsulation","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Flexible OLED displays","application_ids":["APP-017"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 4 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 4","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000765"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000455","legacy_id":"P00455","entity_type":"model","company_id":"CMP-000301","manufacturer":"Lapmaster Wolters","family_id":"PRD-000359","family_name":"AC microLine","model_number":"AC microLine 2000-F","model_identified":true,"name":"AC microLine · AC microLine 2000-F","equipment_id":"EQP-K07","equipment_code":"K07","equipment_label":"Double-side polishing","category_group":"K","segment":"Wafer Manufacturing","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-006"],"technology_text":"Double-side polishing","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer polishing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 5 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. LOW confidence: single 2018 news report; status not re-checked. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 5","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000785"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000456","legacy_id":"P00456","entity_type":"model","company_id":"CMP-000301","manufacturer":"Lapmaster Wolters","family_id":"PRD-000359","family_name":"AC microLine","model_number":"AC microLine 1200-F Eco","model_identified":true,"name":"AC microLine · AC microLine 1200-F Eco","equipment_id":"EQP-K05","equipment_code":"K05","equipment_label":"Lapping","category_group":"K","segment":"Wafer Manufacturing","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-004"],"technology_text":"Double-side lapping / polishing","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer lapping","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 5 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 5","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000786"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000457","legacy_id":"P00457","entity_type":"model","company_id":"CMP-000301","manufacturer":"Lapmaster Wolters","family_id":"PRD-000359","family_name":"AC microLine","model_number":"AC microLine 880-F","model_identified":true,"name":"AC microLine · AC microLine 880-F","equipment_id":"EQP-K05","equipment_code":"K05","equipment_label":"Lapping","category_group":"K","segment":"Wafer Manufacturing","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-004"],"technology_text":"Double-side lapping / polishing","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer lapping","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 5 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 5","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000787"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000458","legacy_id":"P00458","entity_type":"model","company_id":"CMP-000301","manufacturer":"Lapmaster Wolters","family_id":"PRD-000359","family_name":"AC microLine","model_number":"AC microLine 700","model_identified":true,"name":"AC microLine · AC microLine 700","equipment_id":"EQP-K05","equipment_code":"K05","equipment_label":"Lapping","category_group":"K","segment":"Wafer Manufacturing","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-004"],"technology_text":"Double-side lapping / polishing","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer lapping","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 5 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 5","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000788"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000459","legacy_id":"P00459","entity_type":"model","company_id":"CMP-000301","manufacturer":"Lapmaster Wolters","family_id":"PRD-000359","family_name":"AC microLine","model_number":"AC microLine 400-D","model_identified":true,"name":"AC microLine · AC microLine 400-D","equipment_id":"EQP-K05","equipment_code":"K05","equipment_label":"Lapping","category_group":"K","segment":"Wafer Manufacturing","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-004"],"technology_text":"Double-side lapping / polishing","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer lapping","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 5 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 5","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000789"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000460","legacy_id":"P00460","entity_type":"model","company_id":"CMP-000302","manufacturer":"Logitech","family_id":"PRD-000360","family_name":"Lapping & polishing","model_number":"PM6","model_identified":true,"name":"Lapping & polishing · PM6","equipment_id":"EQP-K05","equipment_code":"K05","equipment_label":"Lapping","category_group":"K","segment":"Wafer Manufacturing","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-004"],"technology_text":"Precision lapping and polishing","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"R&D / low-volume lapping","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 5 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 5","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000790"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000461","legacy_id":"P00461","entity_type":"model","company_id":"CMP-000302","manufacturer":"Logitech","family_id":"PRD-000361","family_name":"CMP","model_number":"Tribo","model_identified":true,"name":"CMP · Tribo","equipment_id":"EQP-A19","equipment_code":"A19","equipment_label":"CMP","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS10","legacy_process_name":null,"process_ids":["PRS-024"],"technology_text":"Benchtop CMP / high-speed lapping","technology_ids":["TEC-029"],"technology_basis":{"from_category":["TEC-029"],"from_laser_codes":[]},"application_text":"CMP research, hard materials (GaN, SiC)","application_ids":["APP-012"],"material_text":null,"material_ids":["MAT-003","MAT-004"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 5 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 5","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000791"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000462","legacy_id":"P00462","entity_type":"model","company_id":"CMP-000302","manufacturer":"Logitech","family_id":"PRD-000361","family_name":"CMP","model_number":"Orbis","model_identified":true,"name":"CMP · Orbis","equipment_id":"EQP-A19","equipment_code":"A19","equipment_label":"CMP","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS10","legacy_process_name":null,"process_ids":["PRS-024"],"technology_text":"Floor-standing CMP","technology_ids":["TEC-029"],"technology_basis":{"from_category":["TEC-029"],"from_laser_codes":[]},"application_text":"R&D and pilot CMP","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 5 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 5","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000792"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000463","legacy_id":"P00463","entity_type":"model","company_id":"CMP-000303","manufacturer":"TESEC Corporation","family_id":"PRD-000362","family_name":"Handlers","model_number":"5170-IH","model_identified":true,"name":"Handlers · 5170-IH","equipment_id":"EQP-C39","equipment_code":"C39","equipment_label":"Handler","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-041"],"technology_text":"Wafer-ring handler (hot/cold)","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"Test of leadless devices on wafer ring","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 5 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 5","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000793"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000464","legacy_id":"P00464","entity_type":"model","company_id":"CMP-000303","manufacturer":"TESEC Corporation","family_id":"PRD-000363","family_name":"Testers","model_number":"431-TT","model_identified":true,"name":"Testers · 431-TT","equipment_id":"EQP-C40","equipment_code":"C40","equipment_label":"IC Test","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-041"],"technology_text":"Discrete device test system","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"Discrete / power device test","application_ids":["APP-010"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 5 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 5","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000794"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000465","legacy_id":"P00465","entity_type":"model","company_id":"CMP-000303","manufacturer":"TESEC Corporation","family_id":"PRD-000363","family_name":"Testers","model_number":"4324-KT / 4334-KT","model_identified":true,"name":"Testers · 4324-KT / 4334-KT","equipment_id":"EQP-C40","equipment_code":"C40","equipment_label":"IC Test","category_group":"C","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS16","legacy_process_name":null,"process_ids":["PRS-041"],"technology_text":"Thermal-resistance tester","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"Power device thermal resistance test","application_ids":["APP-010"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 5 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 5","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000795"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000466","legacy_id":"P00466","entity_type":"model","company_id":"CMP-000304","manufacturer":"MICRONICS JAPAN","family_id":"PRD-000364","family_name":"Probe cards","model_number":"Probe card","model_identified":true,"name":"Probe cards · Probe card","equipment_id":"EQP-A33","equipment_code":"A33","equipment_label":"Wafer Probing","category_group":"A","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS12","legacy_process_name":null,"process_ids":["PRS-029"],"technology_text":"Probe card","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"Wafer test","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 5 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 5","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000796"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000467","legacy_id":"P00467","entity_type":"model","company_id":"CMP-000304","manufacturer":"MICRONICS JAPAN","family_id":"PRD-000365","family_name":"Wafer probers","model_number":"Wafer prober","model_identified":true,"name":"Wafer probers · Wafer prober","equipment_id":"EQP-A33","equipment_code":"A33","equipment_label":"Wafer Probing","category_group":"A","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS12","legacy_process_name":null,"process_ids":["PRS-029"],"technology_text":"Manual / semi-automatic wafer prober","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"Device development, failure analysis","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 5 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 5","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000797"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000468","legacy_id":"P00468","entity_type":"model","company_id":"CMP-000305","manufacturer":"Japan Electronic Materials (JEM)","family_id":"PRD-000366","family_name":"Probe cards","model_number":"Probe cards","model_identified":true,"name":"Probe cards · Probe cards","equipment_id":"EQP-A33","equipment_code":"A33","equipment_label":"Wafer Probing","category_group":"A","segment":"Test","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS12","legacy_process_name":null,"process_ids":["PRS-029"],"technology_text":"Vertical / hybrid / CIS probe cards","technology_ids":["TEC-056"],"technology_basis":{"from_category":["TEC-056"],"from_laser_codes":[]},"application_text":"Wafer test","application_ids":["APP-015"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 5 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 5","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000772"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000469","legacy_id":"P00469","entity_type":"model","company_id":"CMP-000307","manufacturer":"HORIBA (HORIBA STEC)","family_id":"PRD-000367","family_name":"Mass flow controllers","model_number":"DZ-107","model_identified":true,"name":"Mass flow controllers · DZ-107","equipment_id":"EQP-A43","equipment_code":"A43","equipment_label":"Gas Delivery Systems","category_group":"A","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-060"],"technology_text":"Ultra-thin mass flow controller","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"CVD / ALD gas flow control","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 5 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 5","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000798"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000470","legacy_id":"P00470","entity_type":"model","company_id":"CMP-000307","manufacturer":"HORIBA (HORIBA STEC)","family_id":"PRD-000367","family_name":"Mass flow controllers","model_number":"SEC-N100 Series","model_identified":true,"name":"Mass flow controllers · SEC-N100 Series","equipment_id":"EQP-A43","equipment_code":"A43","equipment_label":"Gas Delivery Systems","category_group":"A","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-060"],"technology_text":"Digital mass flow controller","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Process gas control","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 5 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 5","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000799"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000471","legacy_id":"P00471","entity_type":"model","company_id":"CMP-000307","manufacturer":"HORIBA (HORIBA STEC)","family_id":"PRD-000367","family_name":"Mass flow controllers","model_number":"S600 Series","model_identified":true,"name":"Mass flow controllers · S600 Series","equipment_id":"EQP-A43","equipment_code":"A43","equipment_label":"Gas Delivery Systems","category_group":"A","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-060"],"technology_text":"Digital mass flow controller","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Process gas control","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 5 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 5","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000800"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000472","legacy_id":"P00472","entity_type":"model","company_id":"CMP-000307","manufacturer":"HORIBA (HORIBA STEC)","family_id":"PRD-000367","family_name":"Mass flow controllers","model_number":"SEC-E Series","model_identified":true,"name":"Mass flow controllers · SEC-E Series","equipment_id":"EQP-A43","equipment_code":"A43","equipment_label":"Gas Delivery Systems","category_group":"A","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-060"],"technology_text":"Mass flow controller","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Process gas control","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 5 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 5","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000801"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000473","legacy_id":"P00473","entity_type":"model","company_id":"CMP-000308","manufacturer":"Fujikin","family_id":"PRD-000368","family_name":"Integrated gas system","model_number":"Integrated ultra-pure gas supply system","model_identified":true,"name":"Integrated gas system · Integrated ultra-pure gas supply system","equipment_id":"EQP-A43","equipment_code":"A43","equipment_label":"Gas Delivery Systems","category_group":"A","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-060"],"technology_text":"Integrated valve / flow-control gas system","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Gas supply to reaction chambers","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 5 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 5","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000802"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000474","legacy_id":"P00474","entity_type":"model","company_id":"CMP-000025","manufacturer":"NuFlare Technology","family_id":"PRD-000369","family_name":"EB mask writers","model_number":"EBM-9500","model_identified":true,"name":"EB mask writers · EBM-9500","equipment_id":"EQP-B07","equipment_code":"B07","equipment_label":"E-beam Mask Writing","category_group":"B","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX3","legacy_process_name":null,"process_ids":["PRS-028"],"technology_text":"Variable-shaped EB mask writer","technology_ids":["TEC-006"],"technology_basis":{"from_category":["TEC-006"],"from_laser_codes":[]},"application_text":"Mask writing (7 nm class)","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 5 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 5","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000803"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000475","legacy_id":"P00475","entity_type":"model","company_id":"CMP-000025","manufacturer":"NuFlare Technology","family_id":"PRD-000369","family_name":"EB mask writers","model_number":"EBM-8000P","model_identified":true,"name":"EB mask writers · EBM-8000P","equipment_id":"EQP-B07","equipment_code":"B07","equipment_label":"E-beam Mask Writing","category_group":"B","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX3","legacy_process_name":null,"process_ids":["PRS-028"],"technology_text":"Variable EB mask writer","technology_ids":["TEC-006"],"technology_basis":{"from_category":["TEC-006"],"from_laser_codes":[]},"application_text":"Mask writing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 5 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 5","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000804"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000476","legacy_id":"P00476","entity_type":"model","company_id":"CMP-000025","manufacturer":"NuFlare Technology","family_id":"PRD-000369","family_name":"EB mask writers","model_number":"MBM™-2000","model_identified":true,"name":"EB mask writers · MBM™-2000","equipment_id":"EQP-B07","equipment_code":"B07","equipment_label":"E-beam Mask Writing","category_group":"B","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX3","legacy_process_name":null,"process_ids":["PRS-028"],"technology_text":"Multi-EB mask writer","technology_ids":["TEC-006"],"technology_basis":{"from_category":["TEC-006"],"from_laser_codes":[]},"application_text":"Mask writing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 5 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 5","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000805"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000477","legacy_id":"P00477","entity_type":"model","company_id":"CMP-000309","manufacturer":"IMS Nanofabrication","family_id":"PRD-000370","family_name":"Multi-beam mask writers","model_number":"MBMW-101","model_identified":true,"name":"Multi-beam mask writers · MBMW-101","equipment_id":"EQP-B07","equipment_code":"B07","equipment_label":"E-beam Mask Writing","category_group":"B","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX3","legacy_process_name":null,"process_ids":["PRS-028"],"technology_text":"Multi-beam mask writer","technology_ids":["TEC-006"],"technology_basis":{"from_category":["TEC-006"],"from_laser_codes":[]},"application_text":"Mask writing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 5 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 5","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000806"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2016","review_due":"2027-03-29"}},{"id":"MDL-000478","legacy_id":"P00478","entity_type":"model","company_id":"CMP-000141","manufacturer":"3D-Micromac","family_id":"PRD-000371","family_name":"microLED","model_number":"microCETI","model_identified":true,"name":"microLED · microCETI","equipment_id":"EQP-I08","equipment_code":"I08","equipment_label":"Mass transfer","category_group":"I","segment":"Display","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX6","legacy_process_name":null,"process_ids":["PRS-056"],"technology_text":"Laser-induced forward transfer (LIFT)","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"microLED transfer, laser lift-off, repair","application_ids":["APP-016","APP-017"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 5 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 5","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000807"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2022-04","review_due":"2027-03-29"}},{"id":"MDL-000479","legacy_id":"P00479","entity_type":"model","company_id":"CMP-000044","manufacturer":"ASMPT","family_id":"PRD-000372","family_name":"microLED","model_number":"Laser mass transfer equipment","model_identified":true,"name":"microLED · Laser mass transfer equipment","equipment_id":"EQP-I08","equipment_code":"I08","equipment_label":"Mass transfer","category_group":"I","segment":"Display","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX6","legacy_process_name":null,"process_ids":["PRS-056"],"technology_text":"Laser mass transfer","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"microLED mass transfer","application_ids":["APP-016","APP-017"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 5 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 5","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000808"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000480","legacy_id":"P00480","entity_type":"model","company_id":"CMP-000310","manufacturer":"Uniqarta","family_id":"PRD-000373","family_name":"LEAP","model_number":"LEAP","model_identified":true,"name":"LEAP · LEAP","equipment_id":"EQP-I08","equipment_code":"I08","equipment_label":"Mass transfer","category_group":"I","segment":"Display","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX6","legacy_process_name":null,"process_ids":["PRS-056"],"technology_text":"Laser-enabled advanced placement","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"microLED transfer","application_ids":["APP-016","APP-017"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 5 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. The model name appears in the URL or search-result summary of the cited page rather than in its title (LOW confidence). Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 5","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000778"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2018","review_due":"2027-03-29"}},{"id":"MDL-000481","legacy_id":"P00481","entity_type":"model","company_id":"CMP-000316","manufacturer":"Musashi Engineering","family_id":"PRD-000374","family_name":"Dispensing machines","model_number":"TAD1000","model_identified":true,"name":"Dispensing machines · TAD1000","equipment_id":"EQP-C24","equipment_code":"C24","equipment_label":"Underfill","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS14","legacy_process_name":null,"process_ids":["PRS-036"],"technology_text":"Fully automatic compact dispensing","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Underfill, potting, encapsulation","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 6 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 6","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000822"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000482","legacy_id":"P00482","entity_type":"model","company_id":"CMP-000316","manufacturer":"Musashi Engineering","family_id":"PRD-000374","family_name":"Dispensing machines","model_number":"FAD5700","model_identified":true,"name":"Dispensing machines · FAD5700","equipment_id":"EQP-C25","equipment_code":"C25","equipment_label":"Dispensing","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS14","legacy_process_name":null,"process_ids":["PRS-036"],"technology_text":"Fully automatic high-end dispensing","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"WLP / PLP / chiplet dispensing","application_ids":["APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 6 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 6","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000823"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000483","legacy_id":"P00483","entity_type":"model","company_id":"CMP-000317","manufacturer":"VERMES Microdispensing","family_id":"PRD-000375","family_name":"MDS piezo jetting","model_number":"MDS 3280","model_identified":true,"name":"MDS piezo jetting · MDS 3280","equipment_id":"EQP-C25","equipment_code":"C25","equipment_label":"Dispensing","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS14","legacy_process_name":null,"process_ids":["PRS-036"],"technology_text":"Piezo jet dispensing","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Microdispensing","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 6 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 6","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000824"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000484","legacy_id":"P00484","entity_type":"model","company_id":"CMP-000318","manufacturer":"F&K Delvotec","family_id":"PRD-000376","family_name":"M17 wire bonders","model_number":"M17S","model_identified":true,"name":"M17 wire bonders · M17S","equipment_id":"EQP-C14","equipment_code":"C14","equipment_label":"Wedge Bonding","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-034"],"technology_text":"Fully automatic ultrasonic wire bonding (one head)","technology_ids":["TEC-040"],"technology_basis":{"from_category":["TEC-040"],"from_laser_codes":[]},"application_text":"Wire bonding","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 6 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 6","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000825"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000485","legacy_id":"P00485","entity_type":"model","company_id":"CMP-000318","manufacturer":"F&K Delvotec","family_id":"PRD-000376","family_name":"M17 wire bonders","model_number":"M17D","model_identified":true,"name":"M17 wire bonders · M17D","equipment_id":"EQP-C14","equipment_code":"C14","equipment_label":"Wedge Bonding","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-034"],"technology_text":"Fully automatic wire bonding (two heads, thin + thick wire)","technology_ids":["TEC-040"],"technology_basis":{"from_category":["TEC-040"],"from_laser_codes":[]},"application_text":"Wire bonding","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 6 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 6","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000826"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000486","legacy_id":"P00486","entity_type":"model","company_id":"CMP-000318","manufacturer":"F&K Delvotec","family_id":"PRD-000376","family_name":"M17 wire bonders","model_number":"M17XL","model_identified":true,"name":"M17 wire bonders · M17XL","equipment_id":"EQP-C14","equipment_code":"C14","equipment_label":"Wedge Bonding","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-034"],"technology_text":"Fully automatic wire bonding (large working range)","technology_ids":["TEC-040"],"technology_basis":{"from_category":["TEC-040"],"from_laser_codes":[]},"application_text":"Wire bonding","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 6 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 6","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000827"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000487","legacy_id":"P00487","entity_type":"model","company_id":"CMP-000318","manufacturer":"F&K Delvotec","family_id":"PRD-000377","family_name":"Ball-wedge bonders","model_number":"G5 62000","model_identified":true,"name":"Ball-wedge bonders · G5 62000","equipment_id":"EQP-C13","equipment_code":"C13","equipment_label":"Ball Bonding","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-034"],"technology_text":"Ball-wedge bonding","technology_ids":["TEC-040"],"technology_basis":{"from_category":["TEC-040"],"from_laser_codes":[]},"application_text":"Gold ball bonding","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 6 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 6","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000828"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000488","legacy_id":"P00488","entity_type":"model","company_id":"CMP-000318","manufacturer":"F&K Delvotec","family_id":"PRD-000378","family_name":"Laser bonders","model_number":"M17LSB XL","model_identified":true,"name":"Laser bonders · M17LSB XL","equipment_id":"EQP-C31","equipment_code":"C31","equipment_label":"Laser Welding","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":[],"technology_text":"Combined laser welding and wire bonding","technology_ids":["TEC-066"],"technology_basis":{"from_category":["TEC-066"],"from_laser_codes":[]},"application_text":"Thick Al / Cu ribbon contacting","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 6 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 6","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000829"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000489","legacy_id":"P00489","entity_type":"model","company_id":"CMP-000319","manufacturer":"HYBOND","family_id":"PRD-000379","family_name":"Die bonders","model_number":"EDB-141","model_identified":true,"name":"Die bonders · EDB-141","equipment_id":"EQP-C10","equipment_code":"C10","equipment_label":"Die Attach","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-033"],"technology_text":"Epoxy / silver-glass die bonding (semi-automatic)","technology_ids":["TEC-039"],"technology_basis":{"from_category":["TEC-039"],"from_laser_codes":[]},"application_text":"Die attach","application_ids":[],"material_text":null,"material_ids":["MAT-010"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 6 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 6","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000830"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000490","legacy_id":"P00490","entity_type":"model","company_id":"CMP-000319","manufacturer":"HYBOND","family_id":"PRD-000379","family_name":"Die bonders","model_number":"EDB-140B","model_identified":true,"name":"Die bonders · EDB-140B","equipment_id":"EQP-C10","equipment_code":"C10","equipment_label":"Die Attach","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-033"],"technology_text":"Epoxy / silver-glass die bonding","technology_ids":["TEC-039"],"technology_basis":{"from_category":["TEC-039"],"from_laser_codes":[]},"application_text":"Die attach","application_ids":[],"material_text":null,"material_ids":["MAT-010"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 6 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 6","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000831"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000491","legacy_id":"P00491","entity_type":"model","company_id":"CMP-000319","manufacturer":"HYBOND","family_id":"PRD-000379","family_name":"Die bonders","model_number":"HY-PULSE 900C","model_identified":true,"name":"Die bonders · HY-PULSE 900C","equipment_id":"EQP-C10","equipment_code":"C10","equipment_label":"Die Attach","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-033"],"technology_text":"Fluxless eutectic solder station","technology_ids":["TEC-039"],"technology_basis":{"from_category":["TEC-039"],"from_laser_codes":[]},"application_text":"Eutectic die attach","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 6 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 6","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000832"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000492","legacy_id":"P00492","entity_type":"model","company_id":"CMP-000320","manufacturer":"SINFONIA TECHNOLOGY","family_id":"PRD-000380","family_name":"EFEM","model_number":"3LP EFEM","model_identified":true,"name":"EFEM · 3LP EFEM","equipment_id":"EQP-J11","equipment_code":"J11","equipment_label":"EFEM","category_group":"J","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-058"],"technology_text":"300 mm FOUP loader module (EFEM)","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Equipment front end","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 6 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 6","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000833"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000493","legacy_id":"P00493","entity_type":"model","company_id":"CMP-000320","manufacturer":"SINFONIA TECHNOLOGY","family_id":"PRD-000380","family_name":"EFEM","model_number":"2LP EFEM","model_identified":true,"name":"EFEM · 2LP EFEM","equipment_id":"EQP-J11","equipment_code":"J11","equipment_label":"EFEM","category_group":"J","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-058"],"technology_text":"300 mm FOUP loader module (EFEM)","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Equipment front end","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 6 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 6","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000834"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000494","legacy_id":"P00494","entity_type":"model","company_id":"CMP-000320","manufacturer":"SINFONIA TECHNOLOGY","family_id":"PRD-000381","family_name":"Load ports","model_number":"300mm FOUP Load Port","model_identified":true,"name":"Load ports · 300mm FOUP Load Port","equipment_id":"EQP-J12","equipment_code":"J12","equipment_label":"Load ports","category_group":"J","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-058"],"technology_text":"FOUP load port","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"FOUP loading","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 6 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 6","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000835"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000495","legacy_id":"P00495","entity_type":"model","company_id":"CMP-000320","manufacturer":"SINFONIA TECHNOLOGY","family_id":"PRD-000381","family_name":"Load ports","model_number":"200mm SMIF Load Port","model_identified":true,"name":"Load ports · 200mm SMIF Load Port","equipment_id":"EQP-J12","equipment_code":"J12","equipment_label":"Load ports","category_group":"J","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-058"],"technology_text":"SMIF load port","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"SMIF loading","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 6 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 6","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000836"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000496","legacy_id":"P00496","entity_type":"model","company_id":"CMP-000321","manufacturer":"Kawasaki Robotics","family_id":"PRD-000382","family_name":"Wafer transfer robots","model_number":"Wafer transfer robots","model_identified":true,"name":"Wafer transfer robots · Wafer transfer robots","equipment_id":"EQP-J06","equipment_code":"J06","equipment_label":"Wafer robots","category_group":"J","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-058"],"technology_text":"Clean wafer transfer robots","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"200 / 300 mm and panel wafer handling","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 6 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 6","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000814"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000497","legacy_id":"P00497","entity_type":"model","company_id":"CMP-000322","manufacturer":"Akrion Systems (NAURA Akrion)","family_id":"PRD-000383","family_name":"GAMA","model_number":"GAMA","model_identified":true,"name":"GAMA · GAMA","equipment_id":"EQP-A05","equipment_code":"A05","equipment_label":"Wet Processing","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010","PRS-021"],"technology_text":"Automated wet stations","technology_ids":["TEC-030"],"technology_basis":{"from_category":["TEC-030"],"from_laser_codes":[]},"application_text":"Cleaning, etching and stripping","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 6 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. LOW confidence: the model name is not in the page title, or the source is a third-party listing. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 6","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000837"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000498","legacy_id":"P00498","entity_type":"model","company_id":"CMP-000323","manufacturer":"Trion Technology","family_id":"PRD-000384","family_name":"Minilock-Phantom","model_number":"Minilock-Phantom RIE ICP","model_identified":true,"name":"Minilock-Phantom · Minilock-Phantom RIE ICP","equipment_id":"EQP-A08.04","equipment_code":"A08.04","equipment_label":"ICP","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS04","legacy_process_name":null,"process_ids":["PRS-020"],"technology_text":"ICP reactive ion etch with loadlock","technology_ids":["TEC-011"],"technology_basis":{"from_category":["TEC-011"],"from_laser_codes":[]},"application_text":"Research and production etch","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 6 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 6","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000838"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000499","legacy_id":"P00499","entity_type":"model","company_id":"CMP-000323","manufacturer":"Trion Technology","family_id":"PRD-000384","family_name":"Minilock-Phantom","model_number":"Minilock-Phantom RIE","model_identified":true,"name":"Minilock-Phantom · Minilock-Phantom RIE","equipment_id":"EQP-A08.03","equipment_code":"A08.03","equipment_label":"RIE","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS04","legacy_process_name":null,"process_ids":["PRS-020"],"technology_text":"RIE with loadlock","technology_ids":["TEC-010"],"technology_basis":{"from_category":["TEC-010"],"from_laser_codes":[]},"application_text":"Etch","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 6 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 6","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000839"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000500","legacy_id":"P00500","entity_type":"model","company_id":"CMP-000323","manufacturer":"Trion Technology","family_id":"PRD-000384","family_name":"Minilock-Phantom","model_number":"Minilock-Phantom DRIE","model_identified":true,"name":"Minilock-Phantom · Minilock-Phantom DRIE","equipment_id":"EQP-A08.05","equipment_code":"A08.05","equipment_label":"Deep Reactive Ion Etch","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS04","legacy_process_name":null,"process_ids":["PRS-020","PRS-043"],"technology_text":"Deep reactive ion etch","technology_ids":["TEC-012"],"technology_basis":{"from_category":["TEC-012"],"from_laser_codes":[]},"application_text":"Etch","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 6 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 6","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000840"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000501","legacy_id":"P00501","entity_type":"model","company_id":"CMP-000323","manufacturer":"Trion Technology","family_id":"PRD-000385","family_name":"Strippers","model_number":"Apollo Stripper","model_identified":true,"name":"Strippers · Apollo Stripper","equipment_id":"EQP-A07","equipment_code":"A07","equipment_label":"Plasma Cleaning","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010","PRS-021"],"technology_text":"Plasma photoresist stripping","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Resist strip (200 / 300 mm chuck)","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 6 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 6","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000841"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000502","legacy_id":"P00502","entity_type":"model","company_id":"CMP-000143","manufacturer":"LPKF Laser & Electronics","family_id":"PRD-000386","family_name":"NEXAR LIDE","model_number":"NEXAR LIDE","model_identified":true,"name":"NEXAR LIDE · NEXAR LIDE","equipment_id":"EQP-D14","equipment_code":"D14","equipment_label":"TGV","category_group":"D","segment":"Advanced Packaging","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX5","legacy_process_name":null,"process_ids":["PRS-044","PRS-053"],"technology_text":"Laser-induced deep etching of glass","technology_ids":["TEC-054"],"technology_basis":{"from_category":["TEC-054"],"from_laser_codes":[]},"application_text":"Through-glass vias and glass substrates","application_ids":["APP-019"],"material_text":null,"material_ids":["MAT-010"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 6 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 6","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000842"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000503","legacy_id":"P00503","entity_type":"model","company_id":"CMP-000055","manufacturer":"Panasonic Connect","family_id":"PRD-000387","family_name":"Plasma dicers","model_number":"APX300","model_identified":true,"name":"Plasma dicers · APX300","equipment_id":"EQP-C01.04","equipment_code":"C01.04","equipment_label":"Plasma Dicing","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS13","legacy_process_name":null,"process_ids":["PRS-032"],"technology_text":"Plasma dicing","technology_ids":["TEC-014"],"technology_basis":{"from_category":["TEC-014"],"from_laser_codes":[]},"application_text":"Wafer singulation","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 6 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. The model name appears in the URL or search-result summary of the cited page rather than in its title (LOW confidence). Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 6","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000843"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000504","legacy_id":"P00504","entity_type":"model","company_id":"CMP-000326","manufacturer":"Brewer Science","family_id":"PRD-000388","family_name":"Apogee","model_number":"Apogee","model_identified":true,"name":"Apogee · Apogee","equipment_id":"EQP-C18","equipment_code":"C18","equipment_label":"Wafer Bonding","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-051","PRS-052"],"technology_text":"Temporary wafer bonding","technology_ids":["TEC-044"],"technology_basis":{"from_category":["TEC-044"],"from_laser_codes":[]},"application_text":"Thin-wafer handling","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 6 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 6","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000820"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000505","legacy_id":"P00505","entity_type":"model","company_id":"CMP-000046","manufacturer":"Kulicke & Soffa","family_id":"PRD-000389","family_name":"Thermo-compression bonders","model_number":"APAMA C2W","model_identified":true,"name":"Thermo-compression bonders · APAMA C2W","equipment_id":"EQP-C16","equipment_code":"C16","equipment_label":"TC Bonding","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-035","PRS-049","PRS-050"],"technology_text":"Chip-to-wafer thermo-compression bonding","technology_ids":["TEC-042"],"technology_basis":{"from_category":["TEC-042"],"from_laser_codes":[]},"application_text":"Advanced packaging","application_ids":["APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 6 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 6","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000844"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2015-09-01","review_due":"2027-03-29"}},{"id":"MDL-000506","legacy_id":"P00506","entity_type":"model","company_id":"CMP-000067","manufacturer":"SEMES","family_id":"PRD-000390","family_name":"TC bonders","model_number":"TC bonder for HBM","model_identified":true,"name":"TC bonders · TC bonder for HBM","equipment_id":"EQP-C16","equipment_code":"C16","equipment_label":"TC Bonding","category_group":"C","segment":"Back-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS15","legacy_process_name":null,"process_ids":["PRS-035","PRS-049","PRS-050"],"technology_text":"Thermal-compression bonding","technology_ids":["TEC-042"],"technology_basis":{"from_category":["TEC-042"],"from_laser_codes":[]},"application_text":"HBM stacking","application_ids":["APP-008"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 6 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 6","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000845"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2024-06","review_due":"2027-03-29"}},{"id":"MDL-000507","legacy_id":"P00507","entity_type":"model","company_id":"CMP-000334","manufacturer":"ULVAC","family_id":"PRD-000391","family_name":"Sputtering systems","model_number":"ENTRON-EX W300","model_identified":true,"name":"Sputtering systems · ENTRON-EX W300","equipment_id":"EQP-A09.08","equipment_code":"A09.08","equipment_label":"Sputtering","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013","PRS-016"],"technology_text":"Multi-chamber sputtering","technology_ids":["TEC-020"],"technology_basis":{"from_category":["TEC-020"],"from_laser_codes":[]},"application_text":"300 mm logic, memory and packaging PVD","application_ids":["APP-001","APP-005"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 8 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 8","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000862"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000508","legacy_id":"P00508","entity_type":"model","company_id":"CMP-000334","manufacturer":"ULVAC","family_id":"PRD-000391","family_name":"Sputtering systems","model_number":"SME","model_identified":true,"name":"Sputtering systems · SME","equipment_id":"EQP-A09.08","equipment_code":"A09.08","equipment_label":"Sputtering","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013","PRS-016"],"technology_text":"Multi-chamber sputtering","technology_ids":["TEC-020"],"technology_basis":{"from_category":["TEC-020"],"from_laser_codes":[]},"application_text":"Opto, MEMS, power and communication devices","application_ids":["APP-014"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 8 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 8","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000863"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000509","legacy_id":"P00509","entity_type":"model","company_id":"CMP-000334","manufacturer":"ULVAC","family_id":"PRD-000391","family_name":"Sputtering systems","model_number":"ENTRON-EXX","model_identified":true,"name":"Sputtering systems · ENTRON-EXX","equipment_id":"EQP-A09.08","equipment_code":"A09.08","equipment_label":"Sputtering","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013","PRS-016"],"technology_text":"Modular multi-chamber PVD","technology_ids":["TEC-020"],"technology_basis":{"from_category":["TEC-020"],"from_laser_codes":[]},"application_text":"Logic, memory, packaging PVD","application_ids":["APP-001","APP-005"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 8 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 8","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000864"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000510","legacy_id":"P00510","entity_type":"model","company_id":"CMP-000335","manufacturer":"CANON ANELVA","family_id":"PRD-000392","family_name":"Sputtering","model_number":"EC7800","model_identified":true,"name":"Sputtering · EC7800","equipment_id":"EQP-A09.08","equipment_code":"A09.08","equipment_label":"Sputtering","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013","PRS-016"],"technology_text":"Low-pressure remote-plasma sputtering","technology_ids":["TEC-020"],"technology_basis":{"from_category":["TEC-020"],"from_laser_codes":[]},"application_text":"300 mm PVD, MRAM R&D","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 8 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 8","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000865"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000511","legacy_id":"P00511","entity_type":"model","company_id":"CMP-000335","manufacturer":"CANON ANELVA","family_id":"PRD-000392","family_name":"Sputtering","model_number":"HC7100","model_identified":true,"name":"Sputtering · HC7100","equipment_id":"EQP-A09.08","equipment_code":"A09.08","equipment_label":"Sputtering","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013","PRS-016"],"technology_text":"Multilayer sputtering (MTJ)","technology_ids":["TEC-020"],"technology_basis":{"from_category":["TEC-020"],"from_laser_codes":[]},"application_text":"MRAM / memory devices","application_ids":["APP-005"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 8 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 8","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000866"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000512","legacy_id":"P00512","entity_type":"model","company_id":"CMP-000335","manufacturer":"CANON ANELVA","family_id":"PRD-000392","family_name":"Sputtering","model_number":"NC7900","model_identified":true,"name":"Sputtering · NC7900","equipment_id":"EQP-A09.08","equipment_code":"A09.08","equipment_label":"Sputtering","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013","PRS-016"],"technology_text":"Multi-cathode sputtering (MTJ)","technology_ids":["TEC-020"],"technology_basis":{"from_category":["TEC-020"],"from_laser_codes":[]},"application_text":"MRAM multilayer deposition","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 8 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 8","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000867"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000513","legacy_id":"P00513","entity_type":"model","company_id":"CMP-000335","manufacturer":"CANON ANELVA","family_id":"PRD-000392","family_name":"Sputtering","model_number":"IC7500","model_identified":true,"name":"Sputtering · IC7500","equipment_id":"EQP-A09.08","equipment_code":"A09.08","equipment_label":"Sputtering","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013","PRS-016"],"technology_text":"Memory wire PVD","technology_ids":["TEC-020"],"technology_basis":{"from_category":["TEC-020"],"from_laser_codes":[]},"application_text":"Memory wiring mass production","application_ids":["APP-005"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 8 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 8","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000868"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000514","legacy_id":"P00514","entity_type":"model","company_id":"CMP-000335","manufacturer":"CANON ANELVA","family_id":"PRD-000392","family_name":"Sputtering","model_number":"EC7400","model_identified":true,"name":"Sputtering · EC7400","equipment_id":"EQP-A09.08","equipment_code":"A09.08","equipment_label":"Sputtering","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013","PRS-016"],"technology_text":"Sputtering","technology_ids":["TEC-020"],"technology_basis":{"from_category":["TEC-020"],"from_laser_codes":[]},"application_text":"Electronic devices","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 8 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 8","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000869"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000515","legacy_id":"P00515","entity_type":"model","company_id":"CMP-000335","manufacturer":"CANON ANELVA","family_id":"PRD-000392","family_name":"Sputtering","model_number":"ML3000","model_identified":true,"name":"Sputtering · ML3000","equipment_id":"EQP-A09.08","equipment_code":"A09.08","equipment_label":"Sputtering","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013","PRS-016"],"technology_text":"Sputtering","technology_ids":["TEC-020"],"technology_basis":{"from_category":["TEC-020"],"from_laser_codes":[]},"application_text":"Thin-film devices","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 8 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 8","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000870"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000516","legacy_id":"P00516","entity_type":"model","company_id":"CMP-000335","manufacturer":"CANON ANELVA","family_id":"PRD-000393","family_name":"Etching","model_number":"NC8000","model_identified":true,"name":"Etching · NC8000","equipment_id":"EQP-A08","equipment_code":"A08","equipment_label":"Etching","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS04","legacy_process_name":null,"process_ids":["PRS-020"],"technology_text":"Etching (magnetic multilayers)","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"MRAM and magnetic sensors","application_ids":["APP-015"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 8 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 8","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000871"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000517","legacy_id":"P00517","entity_type":"model","company_id":"CMP-000336","manufacturer":"VON ARDENNE","family_id":"PRD-000394","family_name":"XEA","model_number":"XEA|nova L","model_identified":true,"name":"XEA · XEA|nova L","equipment_id":"EQP-A09.08","equipment_code":"A09.08","equipment_label":"Sputtering","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS05","legacy_process_name":null,"process_ids":["PRS-013","PRS-016"],"technology_text":"Inline sputter coating","technology_ids":["TEC-020"],"technology_basis":{"from_category":["TEC-020"],"from_laser_codes":[]},"application_text":"TCO and metal layers on wafers / substrates","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 8 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 8","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000872"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000518","legacy_id":"P00518","entity_type":"model","company_id":"CMP-000337","manufacturer":"SCHMID Group","family_id":"PRD-000395","family_name":"InfinityLine","model_number":"InfinityLine C+","model_identified":true,"name":"InfinityLine · InfinityLine C+","equipment_id":"EQP-A05","equipment_code":"A05","equipment_label":"Wet Processing","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010","PRS-021"],"technology_text":"Vertical spin wet processing","technology_ids":["TEC-030"],"technology_basis":{"from_category":["TEC-030"],"from_laser_codes":[]},"application_text":"Panel-level advanced packaging","application_ids":["APP-019"],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 8 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 8","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000873"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000519","legacy_id":"P00519","entity_type":"model","company_id":"CMP-000337","manufacturer":"SCHMID Group","family_id":"PRD-000395","family_name":"InfinityLine","model_number":"InfinityLine H+","model_identified":true,"name":"InfinityLine · InfinityLine H+","equipment_id":"EQP-D19","equipment_code":"D19","equipment_label":"Panel Level Packaging","category_group":"D","segment":"Advanced Packaging","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX5","legacy_process_name":null,"process_ids":["PRS-053"],"technology_text":"Panel-level packaging wet processing","technology_ids":["TEC-048"],"technology_basis":{"from_category":["TEC-048"],"from_laser_codes":[]},"application_text":"Panel formats up to 700×700 mm","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 8 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 8","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000874"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000520","legacy_id":"P00520","entity_type":"model","company_id":"CMP-000338","manufacturer":"Nissin Ion Equipment","family_id":"PRD-000396","family_name":"Ion implanters","model_number":"Ion implanter","model_identified":true,"name":"Ion implanters · Ion implanter","equipment_id":"EQP-A10","equipment_code":"A10","equipment_label":"Ion Implantation","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS06","legacy_process_name":null,"process_ids":["PRS-022"],"technology_text":"Ion implantation","technology_ids":["TEC-026"],"technology_basis":{"from_category":["TEC-026"],"from_laser_codes":[]},"application_text":"Semiconductor and power-device implantation","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 8 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 8","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000858"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000521","legacy_id":"P00521","entity_type":"model","company_id":"CMP-000087","manufacturer":"Utechzone","family_id":"PRD-000397","family_name":"Wafer AOI","model_number":"Wafer-Level IR AOI","model_identified":true,"name":"Wafer AOI · Wafer-Level IR AOI","equipment_id":"EQP-A23","equipment_code":"A23","equipment_label":"Optical Inspection","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS09","legacy_process_name":null,"process_ids":["PRS-027"],"technology_text":"IR and visible-light AOI","technology_ids":["TEC-031"],"technology_basis":{"from_category":["TEC-031"],"from_laser_codes":[]},"application_text":"Wafer crack and surface-defect inspection (8–12 in)","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 8 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 8","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000875"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000522","legacy_id":"P00522","entity_type":"model","company_id":"CMP-000087","manufacturer":"Utechzone","family_id":"PRD-000397","family_name":"Wafer AOI","model_number":"Wafer-Level Lithography AOI","model_identified":true,"name":"Wafer AOI · Wafer-Level Lithography AOI","equipment_id":"EQP-A23","equipment_code":"A23","equipment_label":"Optical Inspection","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS09","legacy_process_name":null,"process_ids":["PRS-027"],"technology_text":"Lithography-layer AOI","technology_ids":["TEC-031"],"technology_basis":{"from_category":["TEC-031"],"from_laser_codes":[]},"application_text":"Line inspection on 8–12 in wafers","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 8 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 8","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000876"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000523","legacy_id":"P00523","entity_type":"model","company_id":"CMP-000341","manufacturer":"Freiberg Instruments","family_id":"PRD-000398","family_name":"MDP","model_number":"MDPpro","model_identified":true,"name":"MDP · MDPpro","equipment_id":"EQP-A25","equipment_code":"A25","equipment_label":"Metrology","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS08","legacy_process_name":null,"process_ids":["PRS-026"],"technology_text":"Contactless lifetime / resistivity mapping","technology_ids":["TEC-035"],"technology_basis":{"from_category":["TEC-035"],"from_laser_codes":[]},"application_text":"Wafer and ingot characterisation","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 8 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 8","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000877"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2018-01-29","review_due":"2027-03-29"}},{"id":"MDL-000524","legacy_id":"P00524","entity_type":"model","company_id":"CMP-000341","manufacturer":"Freiberg Instruments","family_id":"PRD-000398","family_name":"MDP","model_number":"MDPlinescan","model_identified":true,"name":"MDP · MDPlinescan","equipment_id":"EQP-A25","equipment_code":"A25","equipment_label":"Metrology","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS08","legacy_process_name":null,"process_ids":["PRS-026"],"technology_text":"Line-scan lifetime mapping","technology_ids":["TEC-035"],"technology_basis":{"from_category":["TEC-035"],"from_laser_codes":[]},"application_text":"Inline wafer characterisation","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 8 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 8","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000878"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-09-30","last_updated":"2026-09-30","last_verified":"2026-09-30","latest_source_date":"2022-03-22","review_due":"2027-03-29"}},{"id":"MDL-000525","legacy_id":"P00525","entity_type":"model","company_id":"CMP-000357","manufacturer":"Zhejiang Jingsheng Mechanical & Electrical (JSG)","family_id":"PRD-000399","family_name":"SiC epitaxy","model_number":"6-inch double-chip SiC epitaxial equipment","model_identified":true,"name":"SiC epitaxy · 6-inch double-chip SiC epitaxial equipment","equipment_id":"EQP-A09.10","equipment_code":"A09.10","equipment_label":"Epitaxy","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-009","PRS-013"],"technology_text":"SiC epitaxial growth","technology_ids":["TEC-022"],"technology_basis":{"from_category":["TEC-022"],"from_laser_codes":[]},"application_text":"SiC power-device epitaxy","application_ids":["APP-011"],"material_text":null,"material_ids":["MAT-003"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 9 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 9","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000903"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000526","legacy_id":"P00526","entity_type":"model","company_id":"CMP-000357","manufacturer":"Zhejiang Jingsheng Mechanical & Electrical (JSG)","family_id":"PRD-000400","family_name":"Crystal growth","model_number":"Mono silicon furnace","model_identified":true,"name":"Crystal growth · Mono silicon furnace","equipment_id":"EQP-K01","equipment_code":"K01","equipment_label":"Crystal growth furnaces / pullers","category_group":"K","segment":"Wafer Manufacturing","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS01","legacy_process_name":null,"process_ids":["PRS-001"],"technology_text":"Czochralski mono-silicon growth","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Silicon ingot growth","application_ids":[],"material_text":null,"material_ids":["MAT-001"],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 9 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 9","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000904"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000527","legacy_id":"P00527","entity_type":"model","company_id":"CMP-000358","manufacturer":"Mattson Technology","family_id":"PRD-000401","family_name":"Thermal","model_number":"Rapid thermal processing systems","model_identified":true,"name":"Thermal · Rapid thermal processing systems","equipment_id":"EQP-A12","equipment_code":"A12","equipment_label":"RTP","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":null,"process_ids":["PRS-023"],"technology_text":"Lamp-based rapid thermal processing","technology_ids":["TEC-028"],"technology_basis":{"from_category":["TEC-028"],"from_laser_codes":[]},"application_text":"Dopant activation, anneal","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 9 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 9","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000905"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000528","legacy_id":"P00528","entity_type":"model","company_id":"CMP-000358","manufacturer":"Mattson Technology","family_id":"PRD-000401","family_name":"Thermal","model_number":"Millisecond anneal systems","model_identified":true,"name":"Thermal · Millisecond anneal systems","equipment_id":"EQP-A13","equipment_code":"A13","equipment_label":"Annealing","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX1","legacy_process_name":null,"process_ids":["PRS-023"],"technology_text":"Millisecond (flash) anneal","technology_ids":["TEC-028"],"technology_basis":{"from_category":["TEC-028"],"from_laser_codes":[]},"application_text":"Advanced-node anneal","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 9 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 9","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000906"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000529","legacy_id":"P00529","entity_type":"model","company_id":"CMP-000358","manufacturer":"Mattson Technology","family_id":"PRD-000402","family_name":"Dry strip","model_number":"Dry strip systems","model_identified":true,"name":"Dry strip · Dry strip systems","equipment_id":"EQP-A07","equipment_code":"A07","equipment_label":"Plasma Cleaning","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010","PRS-021"],"technology_text":"Plasma dry strip","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Mask / resist removal","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 9 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 9","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000907"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000530","legacy_id":"P00530","entity_type":"model","company_id":"CMP-000358","manufacturer":"Mattson Technology","family_id":"PRD-000402","family_name":"Dry strip","model_number":"Aspen","model_identified":true,"name":"Dry strip · Aspen","equipment_id":"EQP-A07","equipment_code":"A07","equipment_label":"Plasma Cleaning","category_group":"A","segment":"Front-End","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PS07","legacy_process_name":null,"process_ids":["PRS-010","PRS-021"],"technology_text":"Platform (type not stated in title)","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Wafer processing platform","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 9 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. LOW confidence: the page title names the platform but not its process category. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 9","verification":"PARTIALLY_VERIFIED","confidence":{"level":"LOW"},"source_ids":["SRC-000908"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}},{"id":"MDL-000531","legacy_id":"P00531","entity_type":"model","company_id":"CMP-000353","manufacturer":"Applied Energy Systems (SEMI-GAS)","family_id":"PRD-000403","family_name":"SEMI-GAS gas cabinets","model_number":"Centurion","model_identified":true,"name":"SEMI-GAS gas cabinets · Centurion","equipment_id":"EQP-A43","equipment_code":"A43","equipment_label":"Gas Delivery Systems","category_group":"A","segment":"Automation & Facilities","market_segment":"N/A","is_component":false,"component_class_id":null,"legacy_process_step":"PSX4","legacy_process_name":null,"process_ids":["PRS-060"],"technology_text":"UHP gas cabinet","technology_ids":[],"technology_basis":{"from_category":[],"from_laser_codes":[]},"application_text":"Specialty gas storage and delivery","application_ids":[],"material_text":null,"material_ids":[],"wafer":null,"thickness":null,"throughput":null,"accuracy":null,"footprint":null,"motion":null,"laser":null,"specs":[],"lifecycle":{"status":"Unknown","legacy_status":"UNKNOWN","maturity":null,"maturity_evidence":null,"launch_year":null,"eol_date":null,"replacement_id":null},"price_public":null,"teal_portfolio":null,"notes":"Batch 9 (2026-09-30): maker, product name and category taken from the title of the cited page, located by keyword web search. The page was not read, so no specifications were captured. Re-read the source to promote to VERIFIED.","reclassified":null,"batch":"Batch 9","verification":"PARTIALLY_VERIFIED","confidence":{"level":"MEDIUM"},"source_ids":["SRC-000909"],"source_age":"UNDATED","freshness":"Unknown","quality_state":"PARTIALLY_VERIFIED","missing_key_fields":["Wafer / substrate size","Throughput","Accuracy"],"dates":{"first_added":"2026-10-05","last_updated":"2026-10-05","last_verified":"2026-10-05","latest_source_date":null,"review_due":"2027-03-29"}}],"equipment":[{"id":"EQP-A","entity_type":"equipment","code":"A","name":"Wafer Fab / Front-End Equipment","parent_id":null,"level":1,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":null,"laser_relevant":false,"legacy_process_step":null,"process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000004","CMP-000006","CMP-000007","CMP-000067","CMP-000109"],"model_ids":[],"company_ids_incl_children":["CMP-000004","CMP-000006","CMP-000007","CMP-000067","CMP-000109","CMP-000016","CMP-000108","CMP-000111","CMP-000181","CMP-000208","CMP-000259","CMP-000360","CMP-000001","CMP-000027","CMP-000182","CMP-000020","CMP-000032","CMP-000107","CMP-000110","CMP-000013","CMP-000231","CMP-000209","CMP-000210","CMP-000234","CMP-000051","CMP-000212","CMP-000224","CMP-000252","CMP-000211","CMP-000251","CMP-000106","CMP-000237","CMP-000273","CMP-000104","CMP-000229","CMP-000240","CMP-000242","CMP-000264","CMP-000322","CMP-000354","CMP-000080","CMP-000081","CMP-000254","CMP-000337","CMP-000265","CMP-000298","CMP-000003","CMP-000071","CMP-000216","CMP-000219","CMP-000271","CMP-000323","CMP-000358","CMP-000002","CMP-000029","CMP-000054","CMP-000101","CMP-000102","CMP-000248","CMP-000335","CMP-000244","CMP-000220","CMP-000005","CMP-000022","CMP-000214","CMP-000028","CMP-000069","CMP-000218","CMP-000272","CMP-000103","CMP-000217","CMP-000241","CMP-000238","CMP-000030","CMP-000070","CMP-000213","CMP-000247","CMP-000255","CMP-000334","CMP-000336","CMP-000275","CMP-000286","CMP-000287","CMP-000288","CMP-000285","CMP-000184","CMP-000194","CMP-000357","CMP-000283","CMP-000284","CMP-000015","CMP-000243","CMP-000338","CMP-000245","CMP-000014","CMP-000077","CMP-000119","CMP-000141","CMP-000174","CMP-000175","CMP-000177","CMP-000225","CMP-000226","CMP-000332","CMP-000023","CMP-000105","CMP-000203","CMP-000235","CMP-000236","CMP-000302","CMP-000315","CMP-000018","CMP-000262","CMP-000299","CMP-000021","CMP-000257","CMP-000041","CMP-000078","CMP-000083","CMP-000087","CMP-000088","CMP-000017","CMP-000019","CMP-000031","CMP-000180","CMP-000250","CMP-000258","CMP-000261","CMP-000341","CMP-000249","CMP-000324","CMP-000325","CMP-000008","CMP-000253","CMP-000260","CMP-000033","CMP-000034","CMP-000035","CMP-000036","CMP-000038","CMP-000304","CMP-000305","CMP-000306","CMP-000144","CMP-000363","CMP-000062","CMP-000063","CMP-000256","CMP-000320","CMP-000064","CMP-000321","CMP-000339","CMP-000168","CMP-000169","CMP-000193","CMP-000294","CMP-000295","CMP-000089","CMP-000172","CMP-000173","CMP-000196","CMP-000307","CMP-000308","CMP-000353","CMP-000370","CMP-000362","CMP-000296"],"model_ids_incl_children":["MDL-000110","MDL-000121","MDL-000238","MDL-000239","MDL-000093","MDL-000094","MDL-000120","MDL-000102","MDL-000095","MDL-000096","MDL-000098","MDL-000099","MDL-000541","MDL-000542","MDL-000543","MDL-000264","MDL-000352","MDL-000353","MDL-000299","MDL-000300","MDL-000301","MDL-000362","MDL-000363","MDL-000097","MDL-000305","MDL-000306","MDL-000163","MDL-000302","MDL-000303","MDL-000304","MDL-000388","MDL-000389","MDL-000186","MDL-000187","MDL-000188","MDL-000369","MDL-000419","MDL-000420","MDL-000160","MDL-000161","MDL-000155","MDL-000156","MDL-000164","MDL-000165","MDL-000167","MDL-000190","MDL-000191","MDL-000192","MDL-000295","MDL-000159","MDL-000374","MDL-000375","MDL-000376","MDL-000380","MDL-000381","MDL-000382","MDL-000383","MDL-000497","MDL-000518","MDL-000193","MDL-000184","MDL-000185","MDL-000312","MDL-000313","MDL-000501","MDL-000529","MDL-000530","MDL-000537","MDL-000549","MDL-000550","MDL-000516","MDL-000538","MDL-000385","MDL-000105","MDL-000536","MDL-000327","MDL-000320","MDL-000499","MDL-000321","MDL-000322","MDL-000323","MDL-000324","MDL-000498","MDL-000229","MDL-000500","MDL-000548","MDL-000552","MDL-000310","MDL-000113","MDL-000319","MDL-000103","MDL-000108","MDL-000535","MDL-000326","MDL-000410","MDL-000316","MDL-000532","MDL-000539","MDL-000104","MDL-000106","MDL-000107","MDL-000534","MDL-000551","MDL-000307","MDL-000308","MDL-000379","MDL-000171","MDL-000172","MDL-000309","MDL-000377","MDL-000378","MDL-000393","MDL-000394","MDL-000507","MDL-000508","MDL-000509","MDL-000510","MDL-000511","MDL-000512","MDL-000513","MDL-000514","MDL-000515","MDL-000517","MDL-000283","MDL-000284","MDL-000285","MDL-000286","MDL-000287","MDL-000288","MDL-000525","MDL-000441","MDL-000442","MDL-000175","MDL-000176","MDL-000177","MDL-000178","MDL-000179","MDL-000180","MDL-000181","MDL-000182","MDL-000384","MDL-000520","MDL-000168","MDL-000189","MDL-000314","MDL-000315","MDL-000370","MDL-000371","MDL-000386","MDL-000317","MDL-000318","MDL-000527","MDL-000058","MDL-000553","MDL-000162","MDL-000528","MDL-000024","MDL-000028","MDL-000029","MDL-000046","MDL-000056","MDL-000057","MDL-000059","MDL-000060","MDL-000061","MDL-000064","MDL-000065","MDL-000194","MDL-000195","MDL-000337","MDL-000338","MDL-000340","MDL-000341","MDL-000533","MDL-000169","MDL-000170","MDL-000183","MDL-000173","MDL-000174","MDL-000197","MDL-000198","MDL-000279","MDL-000366","MDL-000461","MDL-000462","MDL-000157","MDL-000158","MDL-000166","MDL-000296","MDL-000220","MDL-000221","MDL-000228","MDL-000236","MDL-000240","MDL-000241","MDL-000242","MDL-000244","MDL-000223","MDL-000230","MDL-000231","MDL-000405","MDL-000452","MDL-000051","MDL-000397","MDL-000398","MDL-000521","MDL-000522","MDL-000540","MDL-000544","MDL-000545","MDL-000546","MDL-000547","MDL-000235","MDL-000112","MDL-000401","MDL-000523","MDL-000524","MDL-000232","MDL-000233","MDL-000234","MDL-000402","MDL-000403","MDL-000111","MDL-000119","MDL-000222","MDL-000243","MDL-000404","MDL-000390","MDL-000391","MDL-000092","MDL-000466","MDL-000467","MDL-000468","MDL-000040","MDL-000567","MDL-000114","MDL-000396","MDL-000395","MDL-000268","MDL-000269","MDL-000152","MDL-000199","MDL-000265","MDL-000267","MDL-000469","MDL-000470","MDL-000471","MDL-000472","MDL-000473","MDL-000531","MDL-000563","MDL-000266","MDL-000151","MDL-000568","MDL-000200"],"child_ids":["EQP-A01","EQP-A02","EQP-A03","EQP-A04","EQP-A05","EQP-A06","EQP-A07","EQP-A08","EQP-A09","EQP-A10","EQP-A11","EQP-A12","EQP-A13","EQP-A14","EQP-A15","EQP-A16","EQP-A17","EQP-A18","EQP-A19","EQP-A20","EQP-A21","EQP-A22","EQP-A23","EQP-A24","EQP-A25","EQP-A26","EQP-A27","EQP-A28","EQP-A29","EQP-A30","EQP-A31","EQP-A32","EQP-A33","EQP-A34","EQP-A35","EQP-A36","EQP-A37","EQP-A38","EQP-A39","EQP-A40","EQP-A41","EQP-A42","EQP-A43","EQP-A44","EQP-A45"],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-B","entity_type":"equipment","code":"B","name":"Mask / Reticle Equipment","parent_id":null,"level":1,"group_code":"B","group_name":"Mask / Reticle Equipment","segment":null,"laser_relevant":false,"legacy_process_step":null,"process_ids":["PRS-028"],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":["CMP-000024","CMP-000292","CMP-000290","CMP-000291","CMP-000025","CMP-000234","CMP-000309","CMP-000026","CMP-000027"],"model_ids_incl_children":["MDL-000100","MDL-000249","MDL-000250","MDL-000251","MDL-000252","MDL-000253","MDL-000445","MDL-000101","MDL-000554","MDL-000364","MDL-000365","MDL-000474","MDL-000475","MDL-000476","MDL-000477","MDL-000254","MDL-000555","MDL-000255"],"child_ids":["EQP-B01","EQP-B02","EQP-B03","EQP-B04","EQP-B05","EQP-B06","EQP-B07","EQP-B08","EQP-B09","EQP-B10"],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C","entity_type":"equipment","code":"C","name":"Back-End / Packaging","parent_id":null,"level":1,"group_code":"C","group_name":"Back-End / Packaging","segment":null,"laser_relevant":false,"legacy_process_step":null,"process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":["CMP-000010","CMP-000012","CMP-000053","CMP-000045","CMP-000077","CMP-000118","CMP-000119","CMP-000121","CMP-000141","CMP-000142","CMP-000195","CMP-000327","CMP-000011","CMP-000117","CMP-000005","CMP-000054","CMP-000055","CMP-000271","CMP-000235","CMP-000059","CMP-000203","CMP-000105","CMP-000116","CMP-000230","CMP-000268","CMP-000279","CMP-000280","CMP-000328","CMP-000026","CMP-000043","CMP-000044","CMP-000046","CMP-000050","CMP-000222","CMP-000223","CMP-000246","CMP-000253","CMP-000319","CMP-000224","CMP-000229","CMP-000233","CMP-000276","CMP-000277","CMP-000278","CMP-000318","CMP-000047","CMP-000048","CMP-000067","CMP-000002","CMP-000051","CMP-000103","CMP-000004","CMP-000052","CMP-000106","CMP-000326","CMP-000056","CMP-000057","CMP-000058","CMP-000049","CMP-000281","CMP-000316","CMP-000082","CMP-000317","CMP-000144","CMP-000165","CMP-000191","CMP-000274","CMP-000330","CMP-000332","CMP-000032","CMP-000078","CMP-000120","CMP-000143","CMP-000148","CMP-000226","CMP-000232","CMP-000041","CMP-000206","CMP-000258","CMP-000016","CMP-000329","CMP-000269","CMP-000040","CMP-000263","CMP-000266","CMP-000267","CMP-000036","CMP-000038","CMP-000039","CMP-000303","CMP-000008","CMP-000009","CMP-000037","CMP-000270","CMP-000282"],"model_ids_incl_children":["MDL-000012","MDL-000013","MDL-000014","MDL-000089","MDL-000008","MDL-000015","MDL-000016","MDL-000017","MDL-000018","MDL-000019","MDL-000020","MDL-000021","MDL-000027","MDL-000030","MDL-000031","MDL-000044","MDL-000049","MDL-000118","MDL-000001","MDL-000002","MDL-000006","MDL-000007","MDL-000009","MDL-000010","MDL-000011","MDL-000041","MDL-000042","MDL-000073","MDL-000074","MDL-000075","MDL-000503","MDL-000209","MDL-000367","MDL-000203","MDL-000204","MDL-000208","MDL-000212","MDL-000280","MDL-000201","MDL-000202","MDL-000207","MDL-000205","MDL-000206","MDL-000348","MDL-000349","MDL-000350","MDL-000351","MDL-000431","MDL-000432","MDL-000436","MDL-000083","MDL-000330","MDL-000333","MDL-000433","MDL-000434","MDL-000435","MDL-000489","MDL-000490","MDL-000491","MDL-000084","MDL-000088","MDL-000331","MDL-000332","MDL-000334","MDL-000335","MDL-000347","MDL-000358","MDL-000359","MDL-000437","MDL-000087","MDL-000427","MDL-000428","MDL-000429","MDL-000430","MDL-000425","MDL-000487","MDL-000422","MDL-000423","MDL-000424","MDL-000426","MDL-000484","MDL-000485","MDL-000486","MDL-000079","MDL-000080","MDL-000505","MDL-000506","MDL-000081","MDL-000082","MDL-000109","MDL-000336","MDL-000345","MDL-000025","MDL-000047","MDL-000076","MDL-000077","MDL-000078","MDL-000196","MDL-000504","MDL-000054","MDL-000055","MDL-000085","MDL-000438","MDL-000481","MDL-000482","MDL-000483","MDL-000022","MDL-000023","MDL-000037","MDL-000038","MDL-000039","MDL-000421","MDL-000070","MDL-000071","MDL-000072","MDL-000339","MDL-000036","MDL-000488","MDL-000086","MDL-000356","MDL-000357","MDL-000224","MDL-000225","MDL-000226","MDL-000227","MDL-000245","MDL-000246","MDL-000247","MDL-000248","MDL-000399","MDL-000400","MDL-000237","MDL-000361","MDL-000414","MDL-000090","MDL-000091","MDL-000409","MDL-000413","MDL-000256","MDL-000257","MDL-000258","MDL-000259","MDL-000260","MDL-000261","MDL-000262","MDL-000263","MDL-000411","MDL-000412","MDL-000463","MDL-000213","MDL-000214","MDL-000215","MDL-000216","MDL-000217","MDL-000218","MDL-000219","MDL-000406","MDL-000408","MDL-000415","MDL-000416","MDL-000417","MDL-000418","MDL-000464","MDL-000465","MDL-000407","MDL-000440"],"child_ids":["EQP-C01","EQP-C02","EQP-C03","EQP-C04","EQP-C05","EQP-C06","EQP-C07","EQP-C08","EQP-C09","EQP-C10","EQP-C11","EQP-C12","EQP-C13","EQP-C14","EQP-C15","EQP-C16","EQP-C17","EQP-C18","EQP-C19","EQP-C20","EQP-C21","EQP-C22","EQP-C23","EQP-C24","EQP-C25","EQP-C26","EQP-C27","EQP-C28","EQP-C29","EQP-C30","EQP-C31","EQP-C32","EQP-C33","EQP-C34","EQP-C35","EQP-C36","EQP-C37","EQP-C38","EQP-C39","EQP-C40","EQP-C41","EQP-C42"],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-D","entity_type":"equipment","code":"D","name":"Advanced Packaging","parent_id":null,"level":1,"group_code":"D","group_name":"Advanced Packaging","segment":null,"laser_relevant":false,"legacy_process_step":null,"process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":["CMP-000221","CMP-000229","CMP-000052","CMP-000299","CMP-000078","CMP-000119","CMP-000120","CMP-000143","CMP-000231","CMP-000233","CMP-000254","CMP-000337","CMP-000043","CMP-000051"],"model_ids_incl_children":["MDL-000344","MDL-000559","MDL-000034","MDL-000043","MDL-000048","MDL-000050","MDL-000502","MDL-000355","MDL-000354","MDL-000035","MDL-000346","MDL-000360","MDL-000392","MDL-000519","MDL-000561","MDL-000328","MDL-000329","MDL-000556","MDL-000558","MDL-000557"],"child_ids":["EQP-D01","EQP-D02","EQP-D03","EQP-D04","EQP-D05","EQP-D06","EQP-D07","EQP-D08","EQP-D09","EQP-D10","EQP-D11","EQP-D12","EQP-D13","EQP-D14","EQP-D15","EQP-D16","EQP-D17","EQP-D18","EQP-D19","EQP-D20","EQP-D21","EQP-D22","EQP-D23"],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-E","entity_type":"equipment","code":"E","name":"ATMP / OSAT","parent_id":null,"level":1,"group_code":"E","group_name":"ATMP / OSAT","segment":null,"laser_relevant":false,"legacy_process_step":null,"process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":["CMP-000236"],"model_ids_incl_children":["MDL-000368"],"child_ids":["EQP-E01","EQP-E02","EQP-E03","EQP-E04","EQP-E05","EQP-E06","EQP-E07","EQP-E08","EQP-E09","EQP-E10","EQP-E11","EQP-E12","EQP-E13","EQP-E14"],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-F","entity_type":"equipment","code":"F","name":"Power Semiconductor","parent_id":null,"level":1,"group_code":"F","group_name":"Power Semiconductor","segment":null,"laser_relevant":false,"legacy_process_step":null,"process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":["CMP-000010","CMP-000119","CMP-000235","CMP-000174","CMP-000175","CMP-000177","CMP-000245","CMP-000117","CMP-000141","CMP-000142","CMP-000232","CMP-000246","CMP-000281"],"model_ids_incl_children":["MDL-000003","MDL-000004","MDL-000045","MDL-000032","MDL-000033","MDL-000387","MDL-000439"],"child_ids":["EQP-F01","EQP-F02","EQP-F03","EQP-F04","EQP-F05","EQP-F06","EQP-F07","EQP-F08","EQP-F09","EQP-F10","EQP-F.D01","EQP-F.D02","EQP-F.D03","EQP-F.D04","EQP-F.D05","EQP-F.D06","EQP-F.D07","EQP-F.D08","EQP-F.D09","EQP-F.D10"],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-G","entity_type":"equipment","code":"G","name":"Compound Semiconductors","parent_id":null,"level":1,"group_code":"G","group_name":"Compound Semiconductors","segment":null,"laser_relevant":false,"legacy_process_step":null,"process_ids":["PRS-009"],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":["CMP-000014","CMP-000028","CMP-000219"],"model_ids_incl_children":["MDL-000289","MDL-000290","MDL-000291","MDL-000292","MDL-000293","MDL-000325"],"child_ids":["EQP-G01","EQP-G02","EQP-G03","EQP-G04","EQP-G05","EQP-G06","EQP-G07"],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-H","entity_type":"equipment","code":"H","name":"MEMS","parent_id":null,"level":1,"group_code":"H","group_name":"MEMS","segment":null,"laser_relevant":false,"legacy_process_step":null,"process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":["CMP-000298"],"model_ids_incl_children":["MDL-000451"],"child_ids":["EQP-H01","EQP-H02","EQP-H03","EQP-H04","EQP-H05","EQP-H06","EQP-H07","EQP-H08"],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-I","entity_type":"equipment","code":"I","name":"Display / MicroLED","parent_id":null,"level":1,"group_code":"I","group_name":"Display / MicroLED","segment":null,"laser_relevant":false,"legacy_process_step":null,"process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":["CMP-000046","CMP-000368","CMP-000300","CMP-000367","CMP-000077","CMP-000079","CMP-000145","CMP-000175","CMP-000176","CMP-000044","CMP-000141","CMP-000310"],"model_ids_incl_children":["MDL-000560","MDL-000453","MDL-000454","MDL-000063","MDL-000066","MDL-000052","MDL-000053","MDL-000062","MDL-000067","MDL-000068","MDL-000478","MDL-000479","MDL-000480"],"child_ids":["EQP-I01","EQP-I02","EQP-I03","EQP-I04","EQP-I05","EQP-I06","EQP-I07","EQP-I08","EQP-I09","EQP-I10","EQP-I11"],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-J","entity_type":"equipment","code":"J","name":"Semiconductor Factory Automation","parent_id":null,"level":1,"group_code":"J","group_name":"Semiconductor Factory Automation","segment":null,"laser_relevant":false,"legacy_process_step":null,"process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":["CMP-000065","CMP-000366","CMP-000066","CMP-000369","CMP-000321","CMP-000059","CMP-000060","CMP-000061","CMP-000085","CMP-000086","CMP-000191","CMP-000293","CMP-000364","CMP-000320","CMP-000365"],"model_ids_incl_children":["MDL-000270","MDL-000115","MDL-000271","MDL-000496","MDL-000272","MDL-000446","MDL-000566","MDL-000492","MDL-000493","MDL-000494","MDL-000495","MDL-000565"],"child_ids":["EQP-J01","EQP-J02","EQP-J03","EQP-J04","EQP-J05","EQP-J06","EQP-J07","EQP-J08","EQP-J09","EQP-J10","EQP-J11","EQP-J12","EQP-J13","EQP-J14","EQP-J15"],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A01","entity_type":"equipment","code":"A01","name":"Lithography","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS02","process_ids":["PRS-018"],"technology_ids":[],"typical_subsystem_ids":["SUB-002","SUB-003","SUB-008","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000016","CMP-000108","CMP-000111","CMP-000181","CMP-000208","CMP-000259","CMP-000360"],"model_ids":["MDL-000110","MDL-000121","MDL-000238","MDL-000239"],"company_ids_incl_children":["CMP-000016","CMP-000108","CMP-000111","CMP-000181","CMP-000208","CMP-000259","CMP-000360","CMP-000001","CMP-000027","CMP-000182","CMP-000020","CMP-000032","CMP-000107","CMP-000110","CMP-000013","CMP-000231","CMP-000209","CMP-000210","CMP-000234","CMP-000051","CMP-000212","CMP-000224","CMP-000252","CMP-000007","CMP-000211","CMP-000251"],"model_ids_incl_children":["MDL-000110","MDL-000121","MDL-000238","MDL-000239","MDL-000093","MDL-000094","MDL-000120","MDL-000102","MDL-000095","MDL-000096","MDL-000098","MDL-000099","MDL-000541","MDL-000542","MDL-000543","MDL-000264","MDL-000352","MDL-000353","MDL-000299","MDL-000300","MDL-000301","MDL-000362","MDL-000363","MDL-000097","MDL-000305","MDL-000306","MDL-000163","MDL-000302","MDL-000303","MDL-000304","MDL-000388","MDL-000389"],"child_ids":["EQP-A01.01","EQP-A01.02","EQP-A01.03","EQP-A01.04","EQP-A01.05","EQP-A01.06","EQP-A01.07","EQP-A01.08"],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A01.01","entity_type":"equipment","code":"A01.01","name":"EUV","parent_id":"EQP-A01","level":3,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS02","process_ids":["PRS-018"],"technology_ids":["TEC-001"],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-004","SUB-008","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000001","CMP-000027","CMP-000182"],"model_ids":["MDL-000093","MDL-000094","MDL-000120"],"company_ids_incl_children":["CMP-000001","CMP-000027","CMP-000182"],"model_ids_incl_children":["MDL-000093","MDL-000094","MDL-000120"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A01.02","entity_type":"equipment","code":"A01.02","name":"DUV","parent_id":"EQP-A01","level":3,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS02","process_ids":["PRS-018"],"technology_ids":["TEC-002"],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000001","CMP-000020","CMP-000032"],"model_ids":["MDL-000102"],"company_ids_incl_children":["CMP-000001","CMP-000020","CMP-000032"],"model_ids_incl_children":["MDL-000102"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A01.03","entity_type":"equipment","code":"A01.03","name":"ArF","parent_id":"EQP-A01","level":3,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS02","process_ids":["PRS-018"],"technology_ids":["TEC-003"],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000001","CMP-000020","CMP-000107","CMP-000110"],"model_ids":["MDL-000095","MDL-000096","MDL-000098","MDL-000099","MDL-000541","MDL-000542","MDL-000543"],"company_ids_incl_children":["CMP-000001","CMP-000020","CMP-000107","CMP-000110"],"model_ids_incl_children":["MDL-000095","MDL-000096","MDL-000098","MDL-000099","MDL-000541","MDL-000542","MDL-000543"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A01.04","entity_type":"equipment","code":"A01.04","name":"KrF","parent_id":"EQP-A01","level":3,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS02","process_ids":["PRS-018"],"technology_ids":["TEC-004"],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000107"],"model_ids":[],"company_ids_incl_children":["CMP-000107"],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A01.05","entity_type":"equipment","code":"A01.05","name":"i-line","parent_id":"EQP-A01","level":3,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS02","process_ids":["PRS-018","PRS-045","PRS-046","PRS-047"],"technology_ids":["TEC-005"],"typical_subsystem_ids":["SUB-002","SUB-003","SUB-008","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000013","CMP-000231"],"model_ids":["MDL-000264","MDL-000352","MDL-000353"],"company_ids_incl_children":["CMP-000013","CMP-000231"],"model_ids_incl_children":["MDL-000264","MDL-000352","MDL-000353"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A01.06","entity_type":"equipment","code":"A01.06","name":"Electron Beam Lithography","parent_id":"EQP-A01","level":3,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS02","process_ids":["PRS-018"],"technology_ids":["TEC-006"],"typical_subsystem_ids":["SUB-002","SUB-003","SUB-008","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000209","CMP-000210","CMP-000234"],"model_ids":["MDL-000299","MDL-000300","MDL-000301","MDL-000362","MDL-000363"],"company_ids_incl_children":["CMP-000209","CMP-000210","CMP-000234"],"model_ids_incl_children":["MDL-000299","MDL-000300","MDL-000301","MDL-000362","MDL-000363"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A01.07","entity_type":"equipment","code":"A01.07","name":"Nanoimprint Lithography","parent_id":"EQP-A01","level":3,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS02","process_ids":["PRS-018"],"technology_ids":["TEC-007"],"typical_subsystem_ids":["SUB-002","SUB-003","SUB-008","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000013","CMP-000051","CMP-000212","CMP-000224","CMP-000252"],"model_ids":["MDL-000097","MDL-000305","MDL-000306"],"company_ids_incl_children":["CMP-000013","CMP-000051","CMP-000212","CMP-000224","CMP-000252"],"model_ids_incl_children":["MDL-000097","MDL-000305","MDL-000306"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A01.08","entity_type":"equipment","code":"A01.08","name":"Maskless Lithography","parent_id":"EQP-A01","level":3,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":true,"legacy_process_step":"PS02","process_ids":["PRS-018","PRS-045","PRS-047"],"technology_ids":["TEC-008"],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000007","CMP-000209","CMP-000211","CMP-000251"],"model_ids":["MDL-000163","MDL-000302","MDL-000303","MDL-000304","MDL-000388","MDL-000389"],"company_ids_incl_children":["CMP-000007","CMP-000209","CMP-000211","CMP-000251"],"model_ids_incl_children":["MDL-000163","MDL-000302","MDL-000303","MDL-000304","MDL-000388","MDL-000389"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A02","entity_type":"equipment","code":"A02","name":"Coater / Developer","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS03","process_ids":["PRS-017","PRS-019"],"technology_ids":[],"typical_subsystem_ids":["SUB-007","SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000004","CMP-000106","CMP-000237","CMP-000273"],"model_ids":["MDL-000186","MDL-000187","MDL-000188","MDL-000369","MDL-000419","MDL-000420"],"company_ids_incl_children":["CMP-000004","CMP-000106","CMP-000237","CMP-000273"],"model_ids_incl_children":["MDL-000186","MDL-000187","MDL-000188","MDL-000369","MDL-000419","MDL-000420"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A03","entity_type":"equipment","code":"A03","name":"Track Systems","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS03","process_ids":["PRS-017","PRS-019"],"technology_ids":[],"typical_subsystem_ids":["SUB-007","SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000007","CMP-000104"],"model_ids":["MDL-000160","MDL-000161"],"company_ids_incl_children":["CMP-000007","CMP-000104"],"model_ids_incl_children":["MDL-000160","MDL-000161"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A04","entity_type":"equipment","code":"A04","name":"Wafer Cleaning","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS07","process_ids":["PRS-010"],"technology_ids":["TEC-030"],"typical_subsystem_ids":["SUB-007","SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000004","CMP-000007","CMP-000104","CMP-000229","CMP-000240","CMP-000242","CMP-000264","CMP-000322","CMP-000354"],"model_ids":["MDL-000155","MDL-000156","MDL-000164","MDL-000165","MDL-000167","MDL-000190","MDL-000191","MDL-000192","MDL-000295"],"company_ids_incl_children":["CMP-000004","CMP-000007","CMP-000104","CMP-000229","CMP-000240","CMP-000242","CMP-000264","CMP-000322","CMP-000354"],"model_ids_incl_children":["MDL-000155","MDL-000156","MDL-000164","MDL-000165","MDL-000167","MDL-000190","MDL-000191","MDL-000192","MDL-000295"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A05","entity_type":"equipment","code":"A05","name":"Wet Processing","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS07","process_ids":["PRS-010","PRS-021"],"technology_ids":["TEC-030"],"typical_subsystem_ids":["SUB-007","SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000007","CMP-000080","CMP-000081","CMP-000240","CMP-000242","CMP-000254","CMP-000322","CMP-000337","CMP-000354"],"model_ids":["MDL-000159","MDL-000374","MDL-000375","MDL-000376","MDL-000380","MDL-000381","MDL-000382","MDL-000383","MDL-000497","MDL-000518"],"company_ids_incl_children":["CMP-000007","CMP-000080","CMP-000081","CMP-000240","CMP-000242","CMP-000254","CMP-000322","CMP-000337","CMP-000354"],"model_ids_incl_children":["MDL-000159","MDL-000374","MDL-000375","MDL-000376","MDL-000380","MDL-000381","MDL-000382","MDL-000383","MDL-000497","MDL-000518"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A06","entity_type":"equipment","code":"A06","name":"Dry Cleaning","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS07","process_ids":["PRS-010"],"technology_ids":[],"typical_subsystem_ids":["SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000004","CMP-000265","CMP-000298"],"model_ids":["MDL-000193"],"company_ids_incl_children":["CMP-000004","CMP-000265","CMP-000298"],"model_ids_incl_children":["MDL-000193"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A07","entity_type":"equipment","code":"A07","name":"Plasma Cleaning","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS07","process_ids":["PRS-010","PRS-021"],"technology_ids":[],"typical_subsystem_ids":["SUB-005","SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000003","CMP-000071","CMP-000216","CMP-000219","CMP-000271","CMP-000323","CMP-000358"],"model_ids":["MDL-000184","MDL-000185","MDL-000312","MDL-000313","MDL-000501","MDL-000529","MDL-000530"],"company_ids_incl_children":["CMP-000003","CMP-000071","CMP-000216","CMP-000219","CMP-000271","CMP-000323","CMP-000358"],"model_ids_incl_children":["MDL-000184","MDL-000185","MDL-000312","MDL-000313","MDL-000501","MDL-000529","MDL-000530"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A08","entity_type":"equipment","code":"A08","name":"Etching","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS04","process_ids":["PRS-020"],"technology_ids":[],"typical_subsystem_ids":["SUB-004","SUB-005","SUB-006","SUB-008","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000002","CMP-000003","CMP-000004","CMP-000029","CMP-000054","CMP-000101","CMP-000102","CMP-000248","CMP-000335"],"model_ids":["MDL-000537","MDL-000549","MDL-000550","MDL-000516"],"company_ids_incl_children":["CMP-000002","CMP-000003","CMP-000004","CMP-000029","CMP-000054","CMP-000101","CMP-000102","CMP-000248","CMP-000335","CMP-000244","CMP-000220","CMP-000219","CMP-000323","CMP-000005","CMP-000229","CMP-000354"],"model_ids_incl_children":["MDL-000537","MDL-000549","MDL-000550","MDL-000516","MDL-000538","MDL-000385","MDL-000105","MDL-000536","MDL-000327","MDL-000320","MDL-000499","MDL-000321","MDL-000322","MDL-000323","MDL-000324","MDL-000498","MDL-000229","MDL-000500"],"child_ids":["EQP-A08.01","EQP-A08.02","EQP-A08.03","EQP-A08.04","EQP-A08.05","EQP-A08.06"],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A08.01","entity_type":"equipment","code":"A08.01","name":"Dry Etch","parent_id":"EQP-A08","level":3,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS04","process_ids":["PRS-020"],"technology_ids":["TEC-009"],"typical_subsystem_ids":["SUB-004","SUB-005","SUB-006","SUB-008","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000002","CMP-000244"],"model_ids":["MDL-000538","MDL-000385"],"company_ids_incl_children":["CMP-000002","CMP-000244"],"model_ids_incl_children":["MDL-000538","MDL-000385"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A08.02","entity_type":"equipment","code":"A08.02","name":"Plasma Etch","parent_id":"EQP-A08","level":3,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS04","process_ids":["PRS-020"],"technology_ids":["TEC-009"],"typical_subsystem_ids":["SUB-004","SUB-005","SUB-006","SUB-008","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000003","CMP-000101","CMP-000220"],"model_ids":["MDL-000105","MDL-000536","MDL-000327"],"company_ids_incl_children":["CMP-000003","CMP-000101","CMP-000220"],"model_ids_incl_children":["MDL-000105","MDL-000536","MDL-000327"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A08.03","entity_type":"equipment","code":"A08.03","name":"RIE","parent_id":"EQP-A08","level":3,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS04","process_ids":["PRS-020"],"technology_ids":["TEC-010"],"typical_subsystem_ids":["SUB-004","SUB-005","SUB-006","SUB-008","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000219","CMP-000323"],"model_ids":["MDL-000320","MDL-000499"],"company_ids_incl_children":["CMP-000219","CMP-000323"],"model_ids_incl_children":["MDL-000320","MDL-000499"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A08.04","entity_type":"equipment","code":"A08.04","name":"ICP","parent_id":"EQP-A08","level":3,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS04","process_ids":["PRS-020"],"technology_ids":["TEC-011"],"typical_subsystem_ids":["SUB-004","SUB-005","SUB-006","SUB-008","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000219","CMP-000323"],"model_ids":["MDL-000321","MDL-000322","MDL-000323","MDL-000324","MDL-000498"],"company_ids_incl_children":["CMP-000219","CMP-000323"],"model_ids_incl_children":["MDL-000321","MDL-000322","MDL-000323","MDL-000324","MDL-000498"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A08.05","entity_type":"equipment","code":"A08.05","name":"Deep Reactive Ion Etch","parent_id":"EQP-A08","level":3,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS04","process_ids":["PRS-020","PRS-043"],"technology_ids":["TEC-012"],"typical_subsystem_ids":["SUB-004","SUB-005","SUB-006","SUB-008","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000005","CMP-000219","CMP-000323"],"model_ids":["MDL-000229","MDL-000500"],"company_ids_incl_children":["CMP-000005","CMP-000219","CMP-000323"],"model_ids_incl_children":["MDL-000229","MDL-000500"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A08.06","entity_type":"equipment","code":"A08.06","name":"Wet Etch","parent_id":"EQP-A08","level":3,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS04","process_ids":["PRS-020"],"technology_ids":["TEC-013"],"typical_subsystem_ids":["SUB-004","SUB-005","SUB-006","SUB-008","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000229","CMP-000354"],"model_ids":[],"company_ids_incl_children":["CMP-000229","CMP-000354"],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A09","entity_type":"equipment","code":"A09","name":"Deposition","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS05","process_ids":["PRS-013"],"technology_ids":[],"typical_subsystem_ids":["SUB-004","SUB-006","SUB-008","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000002","CMP-000003","CMP-000004","CMP-000022","CMP-000029","CMP-000101","CMP-000214"],"model_ids":["MDL-000548","MDL-000552","MDL-000310"],"company_ids_incl_children":["CMP-000002","CMP-000003","CMP-000004","CMP-000022","CMP-000029","CMP-000101","CMP-000214","CMP-000028","CMP-000069","CMP-000102","CMP-000218","CMP-000272","CMP-000103","CMP-000104","CMP-000217","CMP-000219","CMP-000220","CMP-000241","CMP-000265","CMP-000238","CMP-000030","CMP-000070","CMP-000213","CMP-000247","CMP-000255","CMP-000334","CMP-000336","CMP-000244","CMP-000275","CMP-000286","CMP-000287","CMP-000288","CMP-000335","CMP-000285","CMP-000006","CMP-000184","CMP-000194","CMP-000357","CMP-000283","CMP-000284"],"model_ids_incl_children":["MDL-000548","MDL-000552","MDL-000310","MDL-000113","MDL-000319","MDL-000103","MDL-000108","MDL-000535","MDL-000326","MDL-000410","MDL-000316","MDL-000532","MDL-000539","MDL-000104","MDL-000106","MDL-000107","MDL-000534","MDL-000551","MDL-000307","MDL-000308","MDL-000379","MDL-000171","MDL-000172","MDL-000309","MDL-000377","MDL-000378","MDL-000393","MDL-000394","MDL-000507","MDL-000508","MDL-000509","MDL-000510","MDL-000511","MDL-000512","MDL-000513","MDL-000514","MDL-000515","MDL-000517","MDL-000283","MDL-000284","MDL-000285","MDL-000286","MDL-000287","MDL-000288","MDL-000525","MDL-000441","MDL-000442"],"child_ids":["EQP-A09.01","EQP-A09.02","EQP-A09.03","EQP-A09.04","EQP-A09.05","EQP-A09.06","EQP-A09.07","EQP-A09.08","EQP-A09.09","EQP-A09.10","EQP-A09.11"],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A09.01","entity_type":"equipment","code":"A09.01","name":"CVD","parent_id":"EQP-A09","level":3,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS05","process_ids":["PRS-013","PRS-014"],"technology_ids":["TEC-015"],"typical_subsystem_ids":["SUB-004","SUB-006","SUB-008","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000028","CMP-000069","CMP-000102","CMP-000218","CMP-000272"],"model_ids":["MDL-000113","MDL-000319"],"company_ids_incl_children":["CMP-000028","CMP-000069","CMP-000102","CMP-000218","CMP-000272"],"model_ids_incl_children":["MDL-000113","MDL-000319"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A09.02","entity_type":"equipment","code":"A09.02","name":"PECVD","parent_id":"EQP-A09","level":3,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS05","process_ids":["PRS-013","PRS-014"],"technology_ids":["TEC-016"],"typical_subsystem_ids":["SUB-004","SUB-005","SUB-006","SUB-008","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000002","CMP-000003","CMP-000103","CMP-000104","CMP-000217","CMP-000219","CMP-000220","CMP-000241","CMP-000265"],"model_ids":["MDL-000103","MDL-000108","MDL-000535","MDL-000326","MDL-000410"],"company_ids_incl_children":["CMP-000002","CMP-000003","CMP-000103","CMP-000104","CMP-000217","CMP-000219","CMP-000220","CMP-000241","CMP-000265"],"model_ids_incl_children":["MDL-000103","MDL-000108","MDL-000535","MDL-000326","MDL-000410"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A09.03","entity_type":"equipment","code":"A09.03","name":"LPCVD","parent_id":"EQP-A09","level":3,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS05","process_ids":["PRS-013","PRS-014"],"technology_ids":["TEC-017"],"typical_subsystem_ids":["SUB-004","SUB-006","SUB-008","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000217","CMP-000238"],"model_ids":["MDL-000316"],"company_ids_incl_children":["CMP-000217","CMP-000238"],"model_ids_incl_children":["MDL-000316"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A09.04","entity_type":"equipment","code":"A09.04","name":"HDPCVD","parent_id":"EQP-A09","level":3,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS05","process_ids":["PRS-013","PRS-014"],"technology_ids":["TEC-018"],"typical_subsystem_ids":["SUB-004","SUB-005","SUB-006","SUB-008","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000003"],"model_ids":["MDL-000532"],"company_ids_incl_children":["CMP-000003"],"model_ids_incl_children":["MDL-000532"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A09.05","entity_type":"equipment","code":"A09.05","name":"SACVD","parent_id":"EQP-A09","level":3,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS05","process_ids":["PRS-013","PRS-014"],"technology_ids":["TEC-018"],"typical_subsystem_ids":["SUB-004","SUB-006","SUB-008","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000002"],"model_ids":["MDL-000539"],"company_ids_incl_children":["CMP-000002"],"model_ids_incl_children":["MDL-000539"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A09.06","entity_type":"equipment","code":"A09.06","name":"ALD","parent_id":"EQP-A09","level":3,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS05","process_ids":["PRS-013","PRS-015"],"technology_ids":["TEC-019"],"typical_subsystem_ids":["SUB-004","SUB-005","SUB-006","SUB-008","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000002","CMP-000003","CMP-000022","CMP-000030","CMP-000069","CMP-000070","CMP-000103","CMP-000213","CMP-000214","CMP-000218","CMP-000219","CMP-000220","CMP-000241","CMP-000247","CMP-000272"],"model_ids":["MDL-000104","MDL-000106","MDL-000107","MDL-000534","MDL-000551","MDL-000307","MDL-000308","MDL-000379"],"company_ids_incl_children":["CMP-000002","CMP-000003","CMP-000022","CMP-000030","CMP-000069","CMP-000070","CMP-000103","CMP-000213","CMP-000214","CMP-000218","CMP-000219","CMP-000220","CMP-000241","CMP-000247","CMP-000272"],"model_ids_incl_children":["MDL-000104","MDL-000106","MDL-000107","MDL-000534","MDL-000551","MDL-000307","MDL-000308","MDL-000379"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A09.07","entity_type":"equipment","code":"A09.07","name":"PVD","parent_id":"EQP-A09","level":3,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS05","process_ids":["PRS-013","PRS-016"],"technology_ids":["TEC-020"],"typical_subsystem_ids":["SUB-004","SUB-005","SUB-006","SUB-008","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000002","CMP-000214","CMP-000241","CMP-000255","CMP-000334","CMP-000336"],"model_ids":["MDL-000171","MDL-000172","MDL-000309","MDL-000377","MDL-000378","MDL-000393","MDL-000394"],"company_ids_incl_children":["CMP-000002","CMP-000214","CMP-000241","CMP-000255","CMP-000334","CMP-000336"],"model_ids_incl_children":["MDL-000171","MDL-000172","MDL-000309","MDL-000377","MDL-000378","MDL-000393","MDL-000394"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A09.08","entity_type":"equipment","code":"A09.08","name":"Sputtering","parent_id":"EQP-A09","level":3,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS05","process_ids":["PRS-013","PRS-016"],"technology_ids":["TEC-020"],"typical_subsystem_ids":["SUB-004","SUB-005","SUB-006","SUB-008","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000241","CMP-000244","CMP-000275","CMP-000286","CMP-000287","CMP-000288","CMP-000334","CMP-000335","CMP-000336"],"model_ids":["MDL-000507","MDL-000508","MDL-000509","MDL-000510","MDL-000511","MDL-000512","MDL-000513","MDL-000514","MDL-000515","MDL-000517"],"company_ids_incl_children":["CMP-000241","CMP-000244","CMP-000275","CMP-000286","CMP-000287","CMP-000288","CMP-000334","CMP-000335","CMP-000336"],"model_ids_incl_children":["MDL-000507","MDL-000508","MDL-000509","MDL-000510","MDL-000511","MDL-000512","MDL-000513","MDL-000514","MDL-000515","MDL-000517"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A09.09","entity_type":"equipment","code":"A09.09","name":"Evaporation","parent_id":"EQP-A09","level":3,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS05","process_ids":["PRS-013","PRS-016"],"technology_ids":["TEC-021"],"typical_subsystem_ids":["SUB-004","SUB-006","SUB-008","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000255","CMP-000275","CMP-000285","CMP-000286","CMP-000287","CMP-000288"],"model_ids":[],"company_ids_incl_children":["CMP-000255","CMP-000275","CMP-000285","CMP-000286","CMP-000287","CMP-000288"],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A09.10","entity_type":"equipment","code":"A09.10","name":"Epitaxy","parent_id":"EQP-A09","level":3,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS01","process_ids":["PRS-009","PRS-013"],"technology_ids":["TEC-022"],"typical_subsystem_ids":["SUB-004","SUB-006","SUB-008","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000002","CMP-000006","CMP-000184","CMP-000194","CMP-000357"],"model_ids":["MDL-000283","MDL-000284","MDL-000285","MDL-000286","MDL-000287","MDL-000288","MDL-000525"],"company_ids_incl_children":["CMP-000002","CMP-000006","CMP-000184","CMP-000194","CMP-000357"],"model_ids_incl_children":["MDL-000283","MDL-000284","MDL-000285","MDL-000286","MDL-000287","MDL-000288","MDL-000525"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A09.11","entity_type":"equipment","code":"A09.11","name":"MBE","parent_id":"EQP-A09","level":3,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS01","process_ids":["PRS-009","PRS-013"],"technology_ids":["TEC-024"],"typical_subsystem_ids":["SUB-004","SUB-006","SUB-008","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000283","CMP-000284","CMP-000285"],"model_ids":["MDL-000441","MDL-000442"],"company_ids_incl_children":["CMP-000283","CMP-000284","CMP-000285"],"model_ids_incl_children":["MDL-000441","MDL-000442"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A10","entity_type":"equipment","code":"A10","name":"Ion Implantation","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS06","process_ids":["PRS-022"],"technology_ids":["TEC-026"],"typical_subsystem_ids":["SUB-004","SUB-006","SUB-008","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000002","CMP-000015","CMP-000243","CMP-000338"],"model_ids":["MDL-000175","MDL-000176","MDL-000177","MDL-000178","MDL-000179","MDL-000180","MDL-000181","MDL-000182","MDL-000384","MDL-000520"],"company_ids_incl_children":["CMP-000002","CMP-000015","CMP-000243","CMP-000338"],"model_ids_incl_children":["MDL-000175","MDL-000176","MDL-000177","MDL-000178","MDL-000179","MDL-000180","MDL-000181","MDL-000182","MDL-000384","MDL-000520"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A11","entity_type":"equipment","code":"A11","name":"Diffusion","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PSX1","process_ids":["PRS-011","PRS-012"],"technology_ids":["TEC-027"],"typical_subsystem_ids":["SUB-006","SUB-008","SUB-012","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000004","CMP-000104","CMP-000217","CMP-000238","CMP-000245"],"model_ids":["MDL-000168","MDL-000189","MDL-000314","MDL-000315","MDL-000370","MDL-000371","MDL-000386"],"company_ids_incl_children":["CMP-000004","CMP-000104","CMP-000217","CMP-000238","CMP-000245"],"model_ids_incl_children":["MDL-000168","MDL-000189","MDL-000314","MDL-000315","MDL-000370","MDL-000371","MDL-000386"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A12","entity_type":"equipment","code":"A12","name":"RTP","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PSX1","process_ids":["PRS-023"],"technology_ids":["TEC-028"],"typical_subsystem_ids":["SUB-006","SUB-008","SUB-012","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000218","CMP-000358"],"model_ids":["MDL-000317","MDL-000318","MDL-000527"],"company_ids_incl_children":["CMP-000218","CMP-000358"],"model_ids_incl_children":["MDL-000317","MDL-000318","MDL-000527"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A13","entity_type":"equipment","code":"A13","name":"Annealing","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PSX1","process_ids":["PRS-023"],"technology_ids":["TEC-028"],"typical_subsystem_ids":["SUB-008","SUB-012","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000007","CMP-000014","CMP-000022","CMP-000245","CMP-000358"],"model_ids":["MDL-000058","MDL-000553","MDL-000162","MDL-000528"],"company_ids_incl_children":["CMP-000007","CMP-000014","CMP-000022","CMP-000245","CMP-000358"],"model_ids_incl_children":["MDL-000058","MDL-000553","MDL-000162","MDL-000528"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A14","entity_type":"equipment","code":"A14","name":"Laser Annealing","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":true,"legacy_process_step":"PSX1","process_ids":["PRS-023"],"technology_ids":["TEC-067"],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000007","CMP-000014","CMP-000077","CMP-000119","CMP-000141","CMP-000174","CMP-000175","CMP-000177"],"model_ids":["MDL-000024","MDL-000028","MDL-000029","MDL-000046","MDL-000056","MDL-000057","MDL-000059","MDL-000060","MDL-000061","MDL-000064","MDL-000065"],"company_ids_incl_children":["CMP-000007","CMP-000014","CMP-000077","CMP-000119","CMP-000141","CMP-000174","CMP-000175","CMP-000177"],"model_ids_incl_children":["MDL-000024","MDL-000028","MDL-000029","MDL-000046","MDL-000056","MDL-000057","MDL-000059","MDL-000060","MDL-000061","MDL-000064","MDL-000065"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A15","entity_type":"equipment","code":"A15","name":"Laser Processing","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":true,"legacy_process_step":"PSX1","process_ids":[],"technology_ids":["TEC-072"],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000004","CMP-000225","CMP-000226","CMP-000332"],"model_ids":["MDL-000194","MDL-000195","MDL-000337","MDL-000338","MDL-000340","MDL-000341"],"company_ids_incl_children":["CMP-000004","CMP-000225","CMP-000226","CMP-000332"],"model_ids_incl_children":["MDL-000194","MDL-000195","MDL-000337","MDL-000338","MDL-000340","MDL-000341"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A16","entity_type":"equipment","code":"A16","name":"Oxidation","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PSX1","process_ids":["PRS-011"],"technology_ids":["TEC-027"],"typical_subsystem_ids":["SUB-006","SUB-008","SUB-012","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000238"],"model_ids":[],"company_ids_incl_children":["CMP-000238"],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A17","entity_type":"equipment","code":"A17","name":"Metallization","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS11","process_ids":["PRS-025"],"technology_ids":[],"typical_subsystem_ids":["SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000003"],"model_ids":["MDL-000533"],"company_ids_incl_children":["CMP-000003"],"model_ids_incl_children":["MDL-000533"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A18","entity_type":"equipment","code":"A18","name":"Electroplating","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS11","process_ids":["PRS-025","PRS-043","PRS-045","PRS-046","PRS-047"],"technology_ids":["TEC-025"],"typical_subsystem_ids":["SUB-007","SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000003","CMP-000104","CMP-000254","CMP-000337"],"model_ids":["MDL-000169","MDL-000170","MDL-000183"],"company_ids_incl_children":["CMP-000003","CMP-000104","CMP-000254","CMP-000337"],"model_ids_incl_children":["MDL-000169","MDL-000170","MDL-000183"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A19","entity_type":"equipment","code":"A19","name":"CMP","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS10","process_ids":["PRS-024"],"technology_ids":["TEC-029"],"typical_subsystem_ids":["SUB-007","SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000002","CMP-000023","CMP-000105","CMP-000203","CMP-000235","CMP-000236","CMP-000264","CMP-000302","CMP-000315"],"model_ids":["MDL-000173","MDL-000174","MDL-000197","MDL-000198","MDL-000279","MDL-000366","MDL-000461","MDL-000462"],"company_ids_incl_children":["CMP-000002","CMP-000023","CMP-000105","CMP-000203","CMP-000235","CMP-000236","CMP-000264","CMP-000302","CMP-000315"],"model_ids_incl_children":["MDL-000173","MDL-000174","MDL-000197","MDL-000198","MDL-000279","MDL-000366","MDL-000461","MDL-000462"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A20","entity_type":"equipment","code":"A20","name":"Cleaning / Scrubbing","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS07","process_ids":["PRS-010"],"technology_ids":["TEC-030"],"typical_subsystem_ids":["SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000007","CMP-000104"],"model_ids":["MDL-000157","MDL-000158","MDL-000166","MDL-000296"],"company_ids_incl_children":["CMP-000007","CMP-000104"],"model_ids_incl_children":["MDL-000157","MDL-000158","MDL-000166","MDL-000296"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A21","entity_type":"equipment","code":"A21","name":"Wafer Inspection","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS09","process_ids":["PRS-027"],"technology_ids":["TEC-031"],"typical_subsystem_ids":["SUB-002","SUB-008","SUB-009","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000005","CMP-000016","CMP-000018","CMP-000262","CMP-000299"],"model_ids":["MDL-000220","MDL-000221","MDL-000228","MDL-000236","MDL-000240","MDL-000241","MDL-000242","MDL-000244"],"company_ids_incl_children":["CMP-000005","CMP-000016","CMP-000018","CMP-000262","CMP-000299"],"model_ids_incl_children":["MDL-000220","MDL-000221","MDL-000228","MDL-000236","MDL-000240","MDL-000241","MDL-000242","MDL-000244"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A22","entity_type":"equipment","code":"A22","name":"Defect Inspection","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS09","process_ids":["PRS-027"],"technology_ids":["TEC-031"],"typical_subsystem_ids":["SUB-002","SUB-008","SUB-009","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000005","CMP-000021","CMP-000257","CMP-000262","CMP-000299"],"model_ids":["MDL-000223","MDL-000230","MDL-000231","MDL-000405","MDL-000452"],"company_ids_incl_children":["CMP-000005","CMP-000021","CMP-000257","CMP-000262","CMP-000299"],"model_ids_incl_children":["MDL-000223","MDL-000230","MDL-000231","MDL-000405","MDL-000452"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A23","entity_type":"equipment","code":"A23","name":"Optical Inspection","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":true,"legacy_process_step":"PS09","process_ids":["PRS-027"],"technology_ids":["TEC-031"],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000018","CMP-000041","CMP-000078","CMP-000083","CMP-000087","CMP-000088","CMP-000257"],"model_ids":["MDL-000051","MDL-000397","MDL-000398","MDL-000521","MDL-000522"],"company_ids_incl_children":["CMP-000018","CMP-000041","CMP-000078","CMP-000083","CMP-000087","CMP-000088","CMP-000257"],"model_ids_incl_children":["MDL-000051","MDL-000397","MDL-000398","MDL-000521","MDL-000522"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A24","entity_type":"equipment","code":"A24","name":"E-beam Inspection","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS09","process_ids":["PRS-027"],"technology_ids":["TEC-032"],"typical_subsystem_ids":["SUB-004","SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000001","CMP-000002","CMP-000021"],"model_ids":["MDL-000540","MDL-000544","MDL-000545","MDL-000546","MDL-000547","MDL-000235"],"company_ids_incl_children":["CMP-000001","CMP-000002","CMP-000021"],"model_ids_incl_children":["MDL-000540","MDL-000544","MDL-000545","MDL-000546","MDL-000547","MDL-000235"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A25","entity_type":"equipment","code":"A25","name":"Metrology","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS08","process_ids":["PRS-026"],"technology_ids":["TEC-035"],"typical_subsystem_ids":["SUB-008","SUB-010","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000005","CMP-000016","CMP-000017","CMP-000019","CMP-000031","CMP-000180","CMP-000250","CMP-000258","CMP-000261","CMP-000299","CMP-000341"],"model_ids":["MDL-000112","MDL-000401","MDL-000523","MDL-000524"],"company_ids_incl_children":["CMP-000005","CMP-000016","CMP-000017","CMP-000019","CMP-000031","CMP-000180","CMP-000250","CMP-000258","CMP-000261","CMP-000299","CMP-000341"],"model_ids_incl_children":["MDL-000112","MDL-000401","MDL-000523","MDL-000524"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A26","entity_type":"equipment","code":"A26","name":"CD-SEM","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS08","process_ids":["PRS-026"],"technology_ids":["TEC-034"],"typical_subsystem_ids":["SUB-004","SUB-008","SUB-010","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000021"],"model_ids":["MDL-000232","MDL-000233","MDL-000234"],"company_ids_incl_children":["CMP-000021"],"model_ids_incl_children":["MDL-000232","MDL-000233","MDL-000234"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A27","entity_type":"equipment","code":"A27","name":"Overlay Metrology","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS08","process_ids":["PRS-026"],"technology_ids":["TEC-035"],"typical_subsystem_ids":["SUB-008","SUB-010","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000261"],"model_ids":["MDL-000402","MDL-000403"],"company_ids_incl_children":["CMP-000261"],"model_ids_incl_children":["MDL-000402","MDL-000403"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A28","entity_type":"equipment","code":"A28","name":"Film Thickness Measurement","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS08","process_ids":["PRS-026"],"technology_ids":["TEC-035"],"typical_subsystem_ids":["SUB-008","SUB-010","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000016","CMP-000017","CMP-000220"],"model_ids":["MDL-000111"],"company_ids_incl_children":["CMP-000016","CMP-000017","CMP-000220"],"model_ids_incl_children":["MDL-000111"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A29","entity_type":"equipment","code":"A29","name":"Critical Dimension Measurement","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS08","process_ids":["PRS-026"],"technology_ids":["TEC-034"],"typical_subsystem_ids":["SUB-008","SUB-010","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-A26","EQP-A25"],"origin":"Batch-1 taxonomy"},{"id":"EQP-A30","entity_type":"equipment","code":"A30","name":"Wafer Surface Measurement","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS08","process_ids":["PRS-008","PRS-026"],"technology_ids":["TEC-035"],"typical_subsystem_ids":["SUB-008","SUB-010","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000005","CMP-000018","CMP-000180","CMP-000261","CMP-000299"],"model_ids":["MDL-000119","MDL-000222","MDL-000243","MDL-000404"],"company_ids_incl_children":["CMP-000005","CMP-000018","CMP-000180","CMP-000261","CMP-000299"],"model_ids_incl_children":["MDL-000119","MDL-000222","MDL-000243","MDL-000404"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A31","entity_type":"equipment","code":"A31","name":"Particle Inspection","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Front-End","laser_relevant":true,"legacy_process_step":"PS09","process_ids":["PRS-027"],"technology_ids":["TEC-031"],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000249","CMP-000324","CMP-000325"],"model_ids":[],"company_ids_incl_children":["CMP-000249","CMP-000324","CMP-000325"],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A32","entity_type":"equipment","code":"A32","name":"Electrical Wafer Testing","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Test","laser_relevant":false,"legacy_process_step":"PS12","process_ids":["PRS-029"],"technology_ids":["TEC-056"],"typical_subsystem_ids":["SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000008","CMP-000253","CMP-000260"],"model_ids":["MDL-000390","MDL-000391"],"company_ids_incl_children":["CMP-000008","CMP-000253","CMP-000260"],"model_ids_incl_children":["MDL-000390","MDL-000391"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A33","entity_type":"equipment","code":"A33","name":"Wafer Probing","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Test","laser_relevant":false,"legacy_process_step":"PS12","process_ids":["PRS-029"],"technology_ids":["TEC-056"],"typical_subsystem_ids":["SUB-003","SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000033","CMP-000034","CMP-000035","CMP-000036","CMP-000038","CMP-000304","CMP-000305","CMP-000306"],"model_ids":["MDL-000092","MDL-000466","MDL-000467","MDL-000468"],"company_ids_incl_children":["CMP-000033","CMP-000034","CMP-000035","CMP-000036","CMP-000038","CMP-000304","CMP-000305","CMP-000306"],"model_ids_incl_children":["MDL-000092","MDL-000466","MDL-000467","MDL-000468"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A34","entity_type":"equipment","code":"A34","name":"Wafer Handling","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-057"],"technology_ids":[],"typical_subsystem_ids":["SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000144","CMP-000194","CMP-000363"],"model_ids":["MDL-000040","MDL-000567"],"company_ids_incl_children":["CMP-000144","CMP-000194","CMP-000363"],"model_ids_incl_children":["MDL-000040","MDL-000567"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A35","entity_type":"equipment","code":"A35","name":"Wafer Transport","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-057"],"technology_ids":[],"typical_subsystem_ids":["SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-J07","EQP-A36"],"origin":"Batch-1 taxonomy"},{"id":"EQP-A36","entity_type":"equipment","code":"A36","name":"FOUP / FOSB Handling","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-057"],"technology_ids":[],"typical_subsystem_ids":["SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000315"],"model_ids":[],"company_ids_incl_children":["CMP-000315"],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A37","entity_type":"equipment","code":"A37","name":"EFEM","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-058"],"technology_ids":[],"typical_subsystem_ids":["SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000062","CMP-000063","CMP-000363","CMP-000256","CMP-000320"],"model_ids":["MDL-000114","MDL-000396"],"company_ids_incl_children":["CMP-000062","CMP-000063","CMP-000363","CMP-000256","CMP-000320"],"model_ids_incl_children":["MDL-000114","MDL-000396"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A38","entity_type":"equipment","code":"A38","name":"Atmospheric Robots","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-058"],"technology_ids":[],"typical_subsystem_ids":["SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000062","CMP-000063","CMP-000064","CMP-000363","CMP-000256","CMP-000321"],"model_ids":["MDL-000395"],"company_ids_incl_children":["CMP-000062","CMP-000063","CMP-000064","CMP-000363","CMP-000256","CMP-000321"],"model_ids_incl_children":["MDL-000395"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A39","entity_type":"equipment","code":"A39","name":"Vacuum Robots","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-058"],"technology_ids":[],"typical_subsystem_ids":["SUB-004","SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000063","CMP-000064","CMP-000363"],"model_ids":["MDL-000268"],"company_ids_incl_children":["CMP-000063","CMP-000064","CMP-000363"],"model_ids_incl_children":["MDL-000268"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A40","entity_type":"equipment","code":"A40","name":"Load Ports","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-058"],"technology_ids":[],"typical_subsystem_ids":["SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000062","CMP-000320"],"model_ids":["MDL-000269"],"company_ids_incl_children":["CMP-000062","CMP-000320"],"model_ids_incl_children":["MDL-000269"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A41","entity_type":"equipment","code":"A41","name":"Vacuum Chambers","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-059"],"technology_ids":[],"typical_subsystem_ids":["SUB-004","SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000339"],"model_ids":[],"company_ids_incl_children":["CMP-000339"],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A42","entity_type":"equipment","code":"A42","name":"Vacuum Systems","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-059"],"technology_ids":[],"typical_subsystem_ids":["SUB-004","SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000023","CMP-000168","CMP-000169","CMP-000193","CMP-000255","CMP-000294","CMP-000295"],"model_ids":["MDL-000152","MDL-000199"],"company_ids_incl_children":["CMP-000023","CMP-000168","CMP-000169","CMP-000193","CMP-000255","CMP-000294","CMP-000295"],"model_ids_incl_children":["MDL-000152","MDL-000199"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A43","entity_type":"equipment","code":"A43","name":"Gas Delivery Systems","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-060"],"technology_ids":[],"typical_subsystem_ids":["SUB-006","SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000089","CMP-000172","CMP-000173","CMP-000196","CMP-000307","CMP-000308","CMP-000353"],"model_ids":["MDL-000265","MDL-000267","MDL-000469","MDL-000470","MDL-000471","MDL-000472","MDL-000473","MDL-000531"],"company_ids_incl_children":["CMP-000089","CMP-000172","CMP-000173","CMP-000196","CMP-000307","CMP-000308","CMP-000353"],"model_ids_incl_children":["MDL-000265","MDL-000267","MDL-000469","MDL-000470","MDL-000471","MDL-000472","MDL-000473","MDL-000531"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A44","entity_type":"equipment","code":"A44","name":"Chemical Delivery Systems","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-060"],"technology_ids":[],"typical_subsystem_ids":["SUB-007","SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000089","CMP-000172","CMP-000173","CMP-000370"],"model_ids":["MDL-000563","MDL-000266"],"company_ids_incl_children":["CMP-000089","CMP-000172","CMP-000173","CMP-000370"],"model_ids_incl_children":["MDL-000563","MDL-000266"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-A45","entity_type":"equipment","code":"A45","name":"Abatement Systems","parent_id":"EQP-A","level":2,"group_code":"A","group_name":"Wafer Fab / Front-End Equipment","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-059"],"technology_ids":[],"typical_subsystem_ids":["SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000023","CMP-000168","CMP-000362","CMP-000296"],"model_ids":["MDL-000151","MDL-000568","MDL-000200"],"company_ids_incl_children":["CMP-000023","CMP-000168","CMP-000362","CMP-000296"],"model_ids_incl_children":["MDL-000151","MDL-000568","MDL-000200"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-B01","entity_type":"equipment","code":"B01","name":"Mask Making","parent_id":"EQP-B","level":2,"group_code":"B","group_name":"Mask / Reticle Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PSX3","process_ids":["PRS-028"],"technology_ids":[],"typical_subsystem_ids":["SUB-002","SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-B02","entity_type":"equipment","code":"B02","name":"Mask Inspection","parent_id":"EQP-B","level":2,"group_code":"B","group_name":"Mask / Reticle Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PSX3","process_ids":["PRS-028"],"technology_ids":[],"typical_subsystem_ids":["SUB-002","SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000024"],"model_ids":["MDL-000100","MDL-000249","MDL-000250"],"company_ids_incl_children":["CMP-000024"],"model_ids_incl_children":["MDL-000100","MDL-000249","MDL-000250"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-B03","entity_type":"equipment","code":"B03","name":"Reticle Inspection","parent_id":"EQP-B","level":2,"group_code":"B","group_name":"Mask / Reticle Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PSX3","process_ids":["PRS-028"],"technology_ids":[],"typical_subsystem_ids":["SUB-002","SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000024"],"model_ids":["MDL-000251","MDL-000252","MDL-000253"],"company_ids_incl_children":["CMP-000024"],"model_ids_incl_children":["MDL-000251","MDL-000252","MDL-000253"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-B04","entity_type":"equipment","code":"B04","name":"Mask Cleaning","parent_id":"EQP-B","level":2,"group_code":"B","group_name":"Mask / Reticle Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PSX3","process_ids":["PRS-028"],"technology_ids":[],"typical_subsystem_ids":["SUB-002","SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000292"],"model_ids":["MDL-000445"],"company_ids_incl_children":["CMP-000292"],"model_ids_incl_children":["MDL-000445"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-B05","entity_type":"equipment","code":"B05","name":"Mask Repair","parent_id":"EQP-B","level":2,"group_code":"B","group_name":"Mask / Reticle Equipment","segment":"Front-End","laser_relevant":true,"legacy_process_step":"PSX3","process_ids":["PRS-028"],"technology_ids":["TEC-070"],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000292"],"model_ids":[],"company_ids_incl_children":["CMP-000292"],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-B06","entity_type":"equipment","code":"B06","name":"Pellicle Equipment","parent_id":"EQP-B","level":2,"group_code":"B","group_name":"Mask / Reticle Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PSX3","process_ids":["PRS-028"],"technology_ids":[],"typical_subsystem_ids":["SUB-002","SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000290","CMP-000291"],"model_ids":[],"company_ids_incl_children":["CMP-000290","CMP-000291"],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-B07","entity_type":"equipment","code":"B07","name":"E-beam Mask Writing","parent_id":"EQP-B","level":2,"group_code":"B","group_name":"Mask / Reticle Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PSX3","process_ids":["PRS-028"],"technology_ids":["TEC-006"],"typical_subsystem_ids":["SUB-002","SUB-003","SUB-004","SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000025","CMP-000234","CMP-000309"],"model_ids":["MDL-000101","MDL-000554","MDL-000364","MDL-000365","MDL-000474","MDL-000475","MDL-000476","MDL-000477"],"company_ids_incl_children":["CMP-000025","CMP-000234","CMP-000309"],"model_ids_incl_children":["MDL-000101","MDL-000554","MDL-000364","MDL-000365","MDL-000474","MDL-000475","MDL-000476","MDL-000477"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-B08","entity_type":"equipment","code":"B08","name":"Optical Mask Writing","parent_id":"EQP-B","level":2,"group_code":"B","group_name":"Mask / Reticle Equipment","segment":"Front-End","laser_relevant":true,"legacy_process_step":"PSX3","process_ids":["PRS-028"],"technology_ids":["TEC-008"],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000026"],"model_ids":["MDL-000254"],"company_ids_incl_children":["CMP-000026"],"model_ids_incl_children":["MDL-000254"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-B09","entity_type":"equipment","code":"B09","name":"Metrology","parent_id":"EQP-B","level":2,"group_code":"B","group_name":"Mask / Reticle Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PSX3","process_ids":["PRS-028"],"technology_ids":[],"typical_subsystem_ids":["SUB-002","SUB-008","SUB-010","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000026","CMP-000027"],"model_ids":["MDL-000555","MDL-000255"],"company_ids_incl_children":["CMP-000026","CMP-000027"],"model_ids_incl_children":["MDL-000555","MDL-000255"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-B10","entity_type":"equipment","code":"B10","name":"Mask Handling","parent_id":"EQP-B","level":2,"group_code":"B","group_name":"Mask / Reticle Equipment","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PSX3","process_ids":["PRS-028"],"technology_ids":[],"typical_subsystem_ids":["SUB-002","SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C01","entity_type":"equipment","code":"C01","name":"Wafer Dicing","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":true,"legacy_process_step":"PS13","process_ids":["PRS-032"],"technology_ids":[],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":["CMP-000010","CMP-000012","CMP-000053","CMP-000045","CMP-000077","CMP-000118","CMP-000119","CMP-000121","CMP-000141","CMP-000142","CMP-000195","CMP-000327","CMP-000011","CMP-000117","CMP-000005","CMP-000054","CMP-000055","CMP-000271"],"model_ids_incl_children":["MDL-000012","MDL-000013","MDL-000014","MDL-000089","MDL-000008","MDL-000015","MDL-000016","MDL-000017","MDL-000018","MDL-000019","MDL-000020","MDL-000021","MDL-000027","MDL-000030","MDL-000031","MDL-000044","MDL-000049","MDL-000118","MDL-000001","MDL-000002","MDL-000006","MDL-000007","MDL-000009","MDL-000010","MDL-000011","MDL-000041","MDL-000042","MDL-000073","MDL-000074","MDL-000075","MDL-000503"],"child_ids":["EQP-C01.01","EQP-C01.02","EQP-C01.03","EQP-C01.04","EQP-C01.05"],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C01.01","entity_type":"equipment","code":"C01.01","name":"Mechanical Dicing","parent_id":"EQP-C01","level":3,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":false,"legacy_process_step":"PS13","process_ids":["PRS-032"],"technology_ids":["TEC-037"],"typical_subsystem_ids":["SUB-003","SUB-008","SUB-009","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000010","CMP-000012","CMP-000053"],"model_ids":["MDL-000012","MDL-000013","MDL-000014","MDL-000089"],"company_ids_incl_children":["CMP-000010","CMP-000012","CMP-000053"],"model_ids_incl_children":["MDL-000012","MDL-000013","MDL-000014","MDL-000089"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C01.02","entity_type":"equipment","code":"C01.02","name":"Laser Dicing","parent_id":"EQP-C01","level":3,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":true,"legacy_process_step":"PS13","process_ids":["PRS-032"],"technology_ids":["TEC-060"],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000010","CMP-000012","CMP-000045","CMP-000077","CMP-000118","CMP-000119","CMP-000121","CMP-000141","CMP-000142","CMP-000195","CMP-000327"],"model_ids":["MDL-000008","MDL-000015","MDL-000016","MDL-000017","MDL-000018","MDL-000019","MDL-000020","MDL-000021","MDL-000027","MDL-000030","MDL-000031","MDL-000044","MDL-000049","MDL-000118"],"company_ids_incl_children":["CMP-000010","CMP-000012","CMP-000045","CMP-000077","CMP-000118","CMP-000119","CMP-000121","CMP-000141","CMP-000142","CMP-000195","CMP-000327"],"model_ids_incl_children":["MDL-000008","MDL-000015","MDL-000016","MDL-000017","MDL-000018","MDL-000019","MDL-000020","MDL-000021","MDL-000027","MDL-000030","MDL-000031","MDL-000044","MDL-000049","MDL-000118"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C01.03","entity_type":"equipment","code":"C01.03","name":"Stealth Dicing","parent_id":"EQP-C01","level":3,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":true,"legacy_process_step":"PS13","process_ids":["PRS-032"],"technology_ids":["TEC-061"],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000010","CMP-000011","CMP-000012","CMP-000117","CMP-000118","CMP-000119"],"model_ids":["MDL-000001","MDL-000002","MDL-000006","MDL-000007","MDL-000009","MDL-000010","MDL-000011","MDL-000041","MDL-000042"],"company_ids_incl_children":["CMP-000010","CMP-000011","CMP-000012","CMP-000117","CMP-000118","CMP-000119"],"model_ids_incl_children":["MDL-000001","MDL-000002","MDL-000006","MDL-000007","MDL-000009","MDL-000010","MDL-000011","MDL-000041","MDL-000042"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C01.04","entity_type":"equipment","code":"C01.04","name":"Plasma Dicing","parent_id":"EQP-C01","level":3,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":false,"legacy_process_step":"PS13","process_ids":["PRS-032"],"technology_ids":["TEC-014"],"typical_subsystem_ids":["SUB-003","SUB-005","SUB-008","SUB-009","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000005","CMP-000054","CMP-000055","CMP-000271"],"model_ids":["MDL-000073","MDL-000074","MDL-000075","MDL-000503"],"company_ids_incl_children":["CMP-000005","CMP-000054","CMP-000055","CMP-000271"],"model_ids_incl_children":["MDL-000073","MDL-000074","MDL-000075","MDL-000503"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C01.05","entity_type":"equipment","code":"C01.05","name":"DBG","parent_id":"EQP-C01","level":3,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":true,"legacy_process_step":"PS13","process_ids":["PRS-032"],"technology_ids":["TEC-038"],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-C01.01","EQP-C03"],"origin":"Batch-1 taxonomy"},{"id":"EQP-C02","entity_type":"equipment","code":"C02","name":"Wafer Grinding","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":false,"legacy_process_step":"PSX2","process_ids":["PRS-030"],"technology_ids":[],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000012","CMP-000235"],"model_ids":["MDL-000209","MDL-000367"],"company_ids_incl_children":["CMP-000012","CMP-000235"],"model_ids_incl_children":["MDL-000209","MDL-000367"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C03","entity_type":"equipment","code":"C03","name":"Back Grinding","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":false,"legacy_process_step":"PSX2","process_ids":["PRS-030"],"technology_ids":[],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000010","CMP-000012","CMP-000059","CMP-000203"],"model_ids":["MDL-000203","MDL-000204","MDL-000208","MDL-000212","MDL-000280"],"company_ids_incl_children":["CMP-000010","CMP-000012","CMP-000059","CMP-000203"],"model_ids_incl_children":["MDL-000203","MDL-000204","MDL-000208","MDL-000212","MDL-000280"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C04","entity_type":"equipment","code":"C04","name":"Wafer Thinning","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":false,"legacy_process_step":"PSX2","process_ids":["PRS-030"],"technology_ids":[],"typical_subsystem_ids":["SUB-008","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000010","CMP-000012","CMP-000105","CMP-000116"],"model_ids":["MDL-000201","MDL-000202","MDL-000207"],"company_ids_incl_children":["CMP-000010","CMP-000012","CMP-000105","CMP-000116"],"model_ids_incl_children":["MDL-000201","MDL-000202","MDL-000207"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C05","entity_type":"equipment","code":"C05","name":"Wafer Polishing","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":false,"legacy_process_step":"PSX2","process_ids":["PRS-006","PRS-030"],"technology_ids":[],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-A19","EQP-K07"],"origin":"Batch-1 taxonomy"},{"id":"EQP-C06","entity_type":"equipment","code":"C06","name":"Wafer Mounter","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":true,"legacy_process_step":"PS13","process_ids":["PRS-031"],"technology_ids":[],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000010","CMP-000230"],"model_ids":["MDL-000205","MDL-000206","MDL-000348","MDL-000349","MDL-000350"],"company_ids_incl_children":["CMP-000010","CMP-000230"],"model_ids_incl_children":["MDL-000205","MDL-000206","MDL-000348","MDL-000349","MDL-000350"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C07","entity_type":"equipment","code":"C07","name":"Wafer Demounter","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":false,"legacy_process_step":"PS13","process_ids":["PRS-031"],"technology_ids":[],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000230"],"model_ids":["MDL-000351"],"company_ids_incl_children":["CMP-000230"],"model_ids_incl_children":["MDL-000351"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C08","entity_type":"equipment","code":"C08","name":"Die Sorting","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":false,"legacy_process_step":"PS15","process_ids":["PRS-033"],"technology_ids":[],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000268","CMP-000279","CMP-000280","CMP-000328"],"model_ids":["MDL-000431","MDL-000432","MDL-000436"],"company_ids_incl_children":["CMP-000268","CMP-000279","CMP-000280","CMP-000328"],"model_ids_incl_children":["MDL-000431","MDL-000432","MDL-000436"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C09","entity_type":"equipment","code":"C09","name":"Die Pick & Place","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":false,"legacy_process_step":"PS15","process_ids":["PRS-033"],"technology_ids":[],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000279"],"model_ids":[],"company_ids_incl_children":["CMP-000279"],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C10","entity_type":"equipment","code":"C10","name":"Die Attach","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":false,"legacy_process_step":"PS15","process_ids":["PRS-033"],"technology_ids":["TEC-039"],"typical_subsystem_ids":["SUB-003","SUB-009","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000026","CMP-000043","CMP-000044","CMP-000046","CMP-000050","CMP-000222","CMP-000223","CMP-000246","CMP-000253","CMP-000279","CMP-000280","CMP-000319"],"model_ids":["MDL-000083","MDL-000330","MDL-000333","MDL-000433","MDL-000434","MDL-000435","MDL-000489","MDL-000490","MDL-000491"],"company_ids_incl_children":["CMP-000026","CMP-000043","CMP-000044","CMP-000046","CMP-000050","CMP-000222","CMP-000223","CMP-000246","CMP-000253","CMP-000279","CMP-000280","CMP-000319"],"model_ids_incl_children":["MDL-000083","MDL-000330","MDL-000333","MDL-000433","MDL-000434","MDL-000435","MDL-000489","MDL-000490","MDL-000491"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C11","entity_type":"equipment","code":"C11","name":"Flip Chip","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":false,"legacy_process_step":"PS15","process_ids":["PRS-035","PRS-050"],"technology_ids":["TEC-041"],"typical_subsystem_ids":["SUB-003","SUB-009","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000026","CMP-000050","CMP-000077","CMP-000223","CMP-000224","CMP-000229","CMP-000233","CMP-000280"],"model_ids":["MDL-000084","MDL-000088","MDL-000331","MDL-000332","MDL-000334","MDL-000335","MDL-000347","MDL-000358","MDL-000359","MDL-000437"],"company_ids_incl_children":["CMP-000026","CMP-000050","CMP-000077","CMP-000223","CMP-000224","CMP-000229","CMP-000233","CMP-000280"],"model_ids_incl_children":["MDL-000084","MDL-000088","MDL-000331","MDL-000332","MDL-000334","MDL-000335","MDL-000347","MDL-000358","MDL-000359","MDL-000437"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C12","entity_type":"equipment","code":"C12","name":"Wire Bonding","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":false,"legacy_process_step":"PS15","process_ids":["PRS-034"],"technology_ids":["TEC-040"],"typical_subsystem_ids":["SUB-003","SUB-009","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000046","CMP-000050","CMP-000222","CMP-000276","CMP-000277","CMP-000278","CMP-000318"],"model_ids":["MDL-000087","MDL-000427","MDL-000428","MDL-000429","MDL-000430"],"company_ids_incl_children":["CMP-000046","CMP-000050","CMP-000222","CMP-000276","CMP-000277","CMP-000278","CMP-000318"],"model_ids_incl_children":["MDL-000087","MDL-000427","MDL-000428","MDL-000429","MDL-000430"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C13","entity_type":"equipment","code":"C13","name":"Ball Bonding","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":false,"legacy_process_step":"PS15","process_ids":["PRS-034"],"technology_ids":["TEC-040"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000277","CMP-000318"],"model_ids":["MDL-000425","MDL-000487"],"company_ids_incl_children":["CMP-000277","CMP-000318"],"model_ids_incl_children":["MDL-000425","MDL-000487"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C14","entity_type":"equipment","code":"C14","name":"Wedge Bonding","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":false,"legacy_process_step":"PS15","process_ids":["PRS-034"],"technology_ids":["TEC-040"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000222","CMP-000276","CMP-000277","CMP-000278","CMP-000318"],"model_ids":["MDL-000422","MDL-000423","MDL-000424","MDL-000426","MDL-000484","MDL-000485","MDL-000486"],"company_ids_incl_children":["CMP-000222","CMP-000276","CMP-000277","CMP-000278","CMP-000318"],"model_ids_incl_children":["MDL-000422","MDL-000423","MDL-000424","MDL-000426","MDL-000484","MDL-000485","MDL-000486"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C15","entity_type":"equipment","code":"C15","name":"Thermosonic Bonding","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":false,"legacy_process_step":"PS15","process_ids":["PRS-034"],"technology_ids":["TEC-040"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000319"],"model_ids":[],"company_ids_incl_children":["CMP-000319"],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C16","entity_type":"equipment","code":"C16","name":"TC Bonding","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":true,"legacy_process_step":"PS15","process_ids":["PRS-035","PRS-049","PRS-050"],"technology_ids":["TEC-042"],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-012","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000043","CMP-000044","CMP-000046","CMP-000047","CMP-000048","CMP-000067","CMP-000223","CMP-000233"],"model_ids":["MDL-000079","MDL-000080","MDL-000505","MDL-000506"],"company_ids_incl_children":["CMP-000043","CMP-000044","CMP-000046","CMP-000047","CMP-000048","CMP-000067","CMP-000223","CMP-000233"],"model_ids_incl_children":["MDL-000079","MDL-000080","MDL-000505","MDL-000506"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C17","entity_type":"equipment","code":"C17","name":"Hybrid Bonding","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":false,"legacy_process_step":"PS15","process_ids":["PRS-049","PRS-050","PRS-051"],"technology_ids":["TEC-043"],"typical_subsystem_ids":["SUB-003","SUB-004","SUB-008","SUB-009","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000002","CMP-000043","CMP-000044","CMP-000048","CMP-000051","CMP-000103","CMP-000224","CMP-000229"],"model_ids":["MDL-000081","MDL-000082","MDL-000109","MDL-000336","MDL-000345"],"company_ids_incl_children":["CMP-000002","CMP-000043","CMP-000044","CMP-000048","CMP-000051","CMP-000103","CMP-000224","CMP-000229"],"model_ids_incl_children":["MDL-000081","MDL-000082","MDL-000109","MDL-000336","MDL-000345"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C18","entity_type":"equipment","code":"C18","name":"Wafer Bonding","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":true,"legacy_process_step":"PS15","process_ids":["PRS-051","PRS-052"],"technology_ids":["TEC-044"],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-004","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000004","CMP-000051","CMP-000052","CMP-000077","CMP-000106","CMP-000119","CMP-000326"],"model_ids":["MDL-000025","MDL-000047","MDL-000076","MDL-000077","MDL-000078","MDL-000196","MDL-000504"],"company_ids_incl_children":["CMP-000004","CMP-000051","CMP-000052","CMP-000077","CMP-000106","CMP-000119","CMP-000326"],"model_ids_incl_children":["MDL-000025","MDL-000047","MDL-000076","MDL-000077","MDL-000078","MDL-000196","MDL-000504"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C19","entity_type":"equipment","code":"C19","name":"Chip Bonding","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":true,"legacy_process_step":"PS15","process_ids":["PRS-035"],"technology_ids":[],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000056","CMP-000057","CMP-000058"],"model_ids":["MDL-000054","MDL-000055"],"company_ids_incl_children":["CMP-000056","CMP-000057","CMP-000058"],"model_ids_incl_children":["MDL-000054","MDL-000055"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C20","entity_type":"equipment","code":"C20","name":"Compression Molding","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":false,"legacy_process_step":"PS14","process_ids":["PRS-036","PRS-047"],"technology_ids":["TEC-045"],"typical_subsystem_ids":["SUB-012","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000049","CMP-000050"],"model_ids":["MDL-000085"],"company_ids_incl_children":["CMP-000049","CMP-000050"],"model_ids_incl_children":["MDL-000085"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C21","entity_type":"equipment","code":"C21","name":"Transfer Molding","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":false,"legacy_process_step":"PS14","process_ids":["PRS-036"],"technology_ids":["TEC-045"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000281"],"model_ids":["MDL-000438"],"company_ids_incl_children":["CMP-000281"],"model_ids_incl_children":["MDL-000438"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C22","entity_type":"equipment","code":"C22","name":"Mold Equipment","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":false,"legacy_process_step":"PS14","process_ids":["PRS-036"],"technology_ids":["TEC-045"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-C20","EQP-C21"],"origin":"Batch-1 taxonomy"},{"id":"EQP-C23","entity_type":"equipment","code":"C23","name":"Encapsulation","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":false,"legacy_process_step":"PS14","process_ids":["PRS-036"],"technology_ids":["TEC-045"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000281"],"model_ids":[],"company_ids_incl_children":["CMP-000281"],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C24","entity_type":"equipment","code":"C24","name":"Underfill","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":false,"legacy_process_step":"PS14","process_ids":["PRS-036"],"technology_ids":[],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000316"],"model_ids":["MDL-000481"],"company_ids_incl_children":["CMP-000316"],"model_ids_incl_children":["MDL-000481"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C25","entity_type":"equipment","code":"C25","name":"Dispensing","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":false,"legacy_process_step":"PS14","process_ids":["PRS-036"],"technology_ids":[],"typical_subsystem_ids":["SUB-007","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000082","CMP-000316","CMP-000317"],"model_ids":["MDL-000482","MDL-000483"],"company_ids_incl_children":["CMP-000082","CMP-000316","CMP-000317"],"model_ids_incl_children":["MDL-000482","MDL-000483"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C26","entity_type":"equipment","code":"C26","name":"Laser Marking","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":true,"legacy_process_step":"PS14","process_ids":["PRS-038"],"technology_ids":["TEC-059"],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000077","CMP-000119","CMP-000144","CMP-000165","CMP-000191","CMP-000271","CMP-000274","CMP-000330","CMP-000332"],"model_ids":["MDL-000022","MDL-000023","MDL-000037","MDL-000038","MDL-000039","MDL-000421"],"company_ids_incl_children":["CMP-000077","CMP-000119","CMP-000144","CMP-000165","CMP-000191","CMP-000271","CMP-000274","CMP-000330","CMP-000332"],"model_ids_incl_children":["MDL-000022","MDL-000023","MDL-000037","MDL-000038","MDL-000039","MDL-000421"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C27","entity_type":"equipment","code":"C27","name":"Laser Engraving","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":true,"legacy_process_step":"PS14","process_ids":["PRS-038"],"technology_ids":[],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-C26"],"origin":"Batch-1 taxonomy"},{"id":"EQP-C28","entity_type":"equipment","code":"C28","name":"Laser Drilling","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":true,"legacy_process_step":"PSX5","process_ids":["PRS-044","PRS-053"],"technology_ids":["TEC-063"],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000032","CMP-000077","CMP-000078","CMP-000119","CMP-000120","CMP-000143","CMP-000148","CMP-000271"],"model_ids":["MDL-000070","MDL-000071","MDL-000072"],"company_ids_incl_children":["CMP-000032","CMP-000077","CMP-000078","CMP-000119","CMP-000120","CMP-000143","CMP-000148","CMP-000271"],"model_ids_incl_children":["MDL-000070","MDL-000071","MDL-000072"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C29","entity_type":"equipment","code":"C29","name":"Laser Cutting","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":true,"legacy_process_step":"PS14","process_ids":["PRS-039"],"technology_ids":["TEC-065"],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000142","CMP-000226"],"model_ids":["MDL-000339"],"company_ids_incl_children":["CMP-000142","CMP-000226"],"model_ids_incl_children":["MDL-000339"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C30","entity_type":"equipment","code":"C30","name":"Laser Ablation","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":true,"legacy_process_step":"PS14","process_ids":["PRS-039"],"technology_ids":["TEC-062"],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000045"],"model_ids":[],"company_ids_incl_children":["CMP-000045"],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C31","entity_type":"equipment","code":"C31","name":"Laser Welding","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":true,"legacy_process_step":"PS15","process_ids":[],"technology_ids":["TEC-066"],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000143","CMP-000191","CMP-000318"],"model_ids":["MDL-000036","MDL-000488"],"company_ids_incl_children":["CMP-000143","CMP-000191","CMP-000318"],"model_ids_incl_children":["MDL-000036","MDL-000488"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C32","entity_type":"equipment","code":"C32","name":"Singulation","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":true,"legacy_process_step":"PS14","process_ids":["PRS-039"],"technology_ids":[],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000049","CMP-000078","CMP-000232"],"model_ids":["MDL-000086","MDL-000356","MDL-000357"],"company_ids_incl_children":["CMP-000049","CMP-000078","CMP-000232"],"model_ids_incl_children":["MDL-000086","MDL-000356","MDL-000357"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C33","entity_type":"equipment","code":"C33","name":"Package Cleaning","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":true,"legacy_process_step":"PS14","process_ids":[],"technology_ids":[],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C34","entity_type":"equipment","code":"C34","name":"Package Inspection","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":false,"legacy_process_step":"PS16","process_ids":["PRS-040"],"technology_ids":[],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000005","CMP-000041","CMP-000328"],"model_ids":["MDL-000224","MDL-000225","MDL-000226","MDL-000227","MDL-000245","MDL-000246"],"company_ids_incl_children":["CMP-000005","CMP-000041","CMP-000328"],"model_ids_incl_children":["MDL-000224","MDL-000225","MDL-000226","MDL-000227","MDL-000245","MDL-000246"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C35","entity_type":"equipment","code":"C35","name":"X-ray Inspection","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":false,"legacy_process_step":"PS16","process_ids":["PRS-040"],"technology_ids":["TEC-033"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000206","CMP-000258","CMP-000327"],"model_ids":["MDL-000247","MDL-000248","MDL-000399","MDL-000400"],"company_ids_incl_children":["CMP-000206","CMP-000258","CMP-000327"],"model_ids_incl_children":["MDL-000247","MDL-000248","MDL-000399","MDL-000400"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C36","entity_type":"equipment","code":"C36","name":"AOI","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Back-End","laser_relevant":false,"legacy_process_step":"PS16","process_ids":["PRS-040"],"technology_ids":["TEC-031"],"typical_subsystem_ids":["SUB-009","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000016","CMP-000041","CMP-000233","CMP-000268","CMP-000329"],"model_ids":["MDL-000237","MDL-000361"],"company_ids_incl_children":["CMP-000016","CMP-000041","CMP-000233","CMP-000268","CMP-000329"],"model_ids_incl_children":["MDL-000237","MDL-000361"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C37","entity_type":"equipment","code":"C37","name":"Final Test","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Test","laser_relevant":false,"legacy_process_step":"PS16","process_ids":["PRS-041"],"technology_ids":["TEC-056"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000269"],"model_ids":["MDL-000414"],"company_ids_incl_children":["CMP-000269"],"model_ids_incl_children":["MDL-000414"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C38","entity_type":"equipment","code":"C38","name":"Burn-in","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Test","laser_relevant":false,"legacy_process_step":"PS16","process_ids":["PRS-042"],"technology_ids":["TEC-057"],"typical_subsystem_ids":["SUB-012","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000040","CMP-000263","CMP-000266","CMP-000267","CMP-000269"],"model_ids":["MDL-000090","MDL-000091","MDL-000409","MDL-000413"],"company_ids_incl_children":["CMP-000040","CMP-000263","CMP-000266","CMP-000267","CMP-000269"],"model_ids_incl_children":["MDL-000090","MDL-000091","MDL-000409","MDL-000413"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C39","entity_type":"equipment","code":"C39","name":"Handler","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Test","laser_relevant":false,"legacy_process_step":"PS16","process_ids":["PRS-041"],"technology_ids":["TEC-056"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000036","CMP-000038","CMP-000039","CMP-000266","CMP-000268","CMP-000269","CMP-000303","CMP-000329","CMP-000330"],"model_ids":["MDL-000256","MDL-000257","MDL-000258","MDL-000259","MDL-000260","MDL-000261","MDL-000262","MDL-000263","MDL-000411","MDL-000412","MDL-000463"],"company_ids_incl_children":["CMP-000036","CMP-000038","CMP-000039","CMP-000266","CMP-000268","CMP-000269","CMP-000303","CMP-000329","CMP-000330"],"model_ids_incl_children":["MDL-000256","MDL-000257","MDL-000258","MDL-000259","MDL-000260","MDL-000261","MDL-000262","MDL-000263","MDL-000411","MDL-000412","MDL-000463"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C40","entity_type":"equipment","code":"C40","name":"IC Test","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Test","laser_relevant":false,"legacy_process_step":"PS16","process_ids":["PRS-041"],"technology_ids":["TEC-056"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000008","CMP-000009","CMP-000037","CMP-000263","CMP-000267","CMP-000270","CMP-000303"],"model_ids":["MDL-000213","MDL-000214","MDL-000215","MDL-000216","MDL-000217","MDL-000218","MDL-000219","MDL-000406","MDL-000408","MDL-000415","MDL-000416","MDL-000417","MDL-000418","MDL-000464","MDL-000465"],"company_ids_incl_children":["CMP-000008","CMP-000009","CMP-000037","CMP-000263","CMP-000267","CMP-000270","CMP-000303"],"model_ids_incl_children":["MDL-000213","MDL-000214","MDL-000215","MDL-000216","MDL-000217","MDL-000218","MDL-000219","MDL-000406","MDL-000408","MDL-000415","MDL-000416","MDL-000417","MDL-000418","MDL-000464","MDL-000465"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C41","entity_type":"equipment","code":"C41","name":"Package Test","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Test","laser_relevant":false,"legacy_process_step":"PS16","process_ids":["PRS-041"],"technology_ids":["TEC-056"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000263"],"model_ids":["MDL-000407"],"company_ids_incl_children":["CMP-000263"],"model_ids_incl_children":["MDL-000407"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-C42","entity_type":"equipment","code":"C42","name":"Thermal Test","parent_id":"EQP-C","level":2,"group_code":"C","group_name":"Back-End / Packaging","segment":"Test","laser_relevant":false,"legacy_process_step":"PS16","process_ids":["PRS-041"],"technology_ids":["TEC-056"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000282"],"model_ids":["MDL-000440"],"company_ids_incl_children":["CMP-000282"],"model_ids_incl_children":["MDL-000440"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-D01","entity_type":"equipment","code":"D01","name":"2.5D","parent_id":"EQP-D","level":2,"group_code":"D","group_name":"Advanced Packaging","segment":"Advanced Packaging","laser_relevant":false,"legacy_process_step":"PSX5","process_ids":["PRS-048"],"technology_ids":["TEC-049"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-D16"],"origin":"Batch-1 taxonomy"},{"id":"EQP-D02","entity_type":"equipment","code":"D02","name":"3D IC","parent_id":"EQP-D","level":2,"group_code":"D","group_name":"Advanced Packaging","segment":"Advanced Packaging","laser_relevant":false,"legacy_process_step":"PSX5","process_ids":["PRS-049"],"technology_ids":["TEC-050"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-D13","EQP-C17"],"origin":"Batch-1 taxonomy"},{"id":"EQP-D03","entity_type":"equipment","code":"D03","name":"HBM","parent_id":"EQP-D","level":2,"group_code":"D","group_name":"Advanced Packaging","segment":"Advanced Packaging","laser_relevant":false,"legacy_process_step":"PSX5","process_ids":["PRS-049"],"technology_ids":["TEC-051"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-C16","EQP-D13"],"origin":"Batch-1 taxonomy"},{"id":"EQP-D04","entity_type":"equipment","code":"D04","name":"Chiplet","parent_id":"EQP-D","level":2,"group_code":"D","group_name":"Advanced Packaging","segment":"Advanced Packaging","laser_relevant":false,"legacy_process_step":"PSX5","process_ids":["PRS-050"],"technology_ids":["TEC-052"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-D05","entity_type":"equipment","code":"D05","name":"Fan-Out","parent_id":"EQP-D","level":2,"group_code":"D","group_name":"Advanced Packaging","segment":"Advanced Packaging","laser_relevant":false,"legacy_process_step":"PSX5","process_ids":["PRS-047"],"technology_ids":["TEC-047"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000221"],"model_ids":[],"company_ids_incl_children":["CMP-000221"],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-D06","entity_type":"equipment","code":"D06","name":"FOWLP","parent_id":"EQP-D","level":2,"group_code":"D","group_name":"Advanced Packaging","segment":"Advanced Packaging","laser_relevant":false,"legacy_process_step":"PSX5","process_ids":["PRS-047"],"technology_ids":["TEC-047"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000229"],"model_ids":["MDL-000344"],"company_ids_incl_children":["CMP-000229"],"model_ids_incl_children":["MDL-000344"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-D07","entity_type":"equipment","code":"D07","name":"FO-PLP","parent_id":"EQP-D","level":2,"group_code":"D","group_name":"Advanced Packaging","segment":"Advanced Packaging","laser_relevant":false,"legacy_process_step":"PSX5","process_ids":["PRS-047"],"technology_ids":["TEC-047","TEC-048"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-D19"],"origin":"Batch-1 taxonomy"},{"id":"EQP-D08","entity_type":"equipment","code":"D08","name":"WLP","parent_id":"EQP-D","level":2,"group_code":"D","group_name":"Advanced Packaging","segment":"Advanced Packaging","laser_relevant":false,"legacy_process_step":"PSX5","process_ids":["PRS-046"],"technology_ids":["TEC-046"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-D20"],"origin":"Batch-1 taxonomy"},{"id":"EQP-D09","entity_type":"equipment","code":"D09","name":"CoWoS","parent_id":"EQP-D","level":2,"group_code":"D","group_name":"Advanced Packaging","segment":"Advanced Packaging","laser_relevant":false,"legacy_process_step":"PSX5","process_ids":["PRS-048"],"technology_ids":["TEC-049"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-D16"],"origin":"Batch-1 taxonomy"},{"id":"EQP-D10","entity_type":"equipment","code":"D10","name":"InFO","parent_id":"EQP-D","level":2,"group_code":"D","group_name":"Advanced Packaging","segment":"Advanced Packaging","laser_relevant":false,"legacy_process_step":"PSX5","process_ids":["PRS-047"],"technology_ids":["TEC-047"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-D11","entity_type":"equipment","code":"D11","name":"EMIB","parent_id":"EQP-D","level":2,"group_code":"D","group_name":"Advanced Packaging","segment":"Advanced Packaging","laser_relevant":false,"legacy_process_step":"PSX5","process_ids":["PRS-048"],"technology_ids":["TEC-049"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-D12","entity_type":"equipment","code":"D12","name":"Hybrid Bonding","parent_id":"EQP-D","level":2,"group_code":"D","group_name":"Advanced Packaging","segment":"Advanced Packaging","laser_relevant":false,"legacy_process_step":"PSX5","process_ids":["PRS-051"],"technology_ids":["TEC-043"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000052"],"model_ids":["MDL-000559"],"company_ids_incl_children":["CMP-000052"],"model_ids_incl_children":["MDL-000559"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-D13","entity_type":"equipment","code":"D13","name":"TSV","parent_id":"EQP-D","level":2,"group_code":"D","group_name":"Advanced Packaging","segment":"Advanced Packaging","laser_relevant":false,"legacy_process_step":"PSX5","process_ids":["PRS-043"],"technology_ids":["TEC-053"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000299"],"model_ids":[],"company_ids_incl_children":["CMP-000299"],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-D14","entity_type":"equipment","code":"D14","name":"TGV","parent_id":"EQP-D","level":2,"group_code":"D","group_name":"Advanced Packaging","segment":"Advanced Packaging","laser_relevant":true,"legacy_process_step":"PSX5","process_ids":["PRS-044","PRS-053"],"technology_ids":["TEC-054"],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000078","CMP-000119","CMP-000120","CMP-000143"],"model_ids":["MDL-000034","MDL-000043","MDL-000048","MDL-000050","MDL-000502"],"company_ids_incl_children":["CMP-000078","CMP-000119","CMP-000120","CMP-000143"],"model_ids_incl_children":["MDL-000034","MDL-000043","MDL-000048","MDL-000050","MDL-000502"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-D15","entity_type":"equipment","code":"D15","name":"RDL","parent_id":"EQP-D","level":2,"group_code":"D","group_name":"Advanced Packaging","segment":"Advanced Packaging","laser_relevant":false,"legacy_process_step":"PSX5","process_ids":["PRS-045"],"technology_ids":["TEC-055"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000231"],"model_ids":["MDL-000355"],"company_ids_incl_children":["CMP-000231"],"model_ids_incl_children":["MDL-000355"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-D16","entity_type":"equipment","code":"D16","name":"Interposer","parent_id":"EQP-D","level":2,"group_code":"D","group_name":"Advanced Packaging","segment":"Advanced Packaging","laser_relevant":false,"legacy_process_step":"PSX5","process_ids":["PRS-048"],"technology_ids":["TEC-049"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000231"],"model_ids":["MDL-000354"],"company_ids_incl_children":["CMP-000231"],"model_ids_incl_children":["MDL-000354"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-D17","entity_type":"equipment","code":"D17","name":"Silicon Interposer","parent_id":"EQP-D","level":2,"group_code":"D","group_name":"Advanced Packaging","segment":"Advanced Packaging","laser_relevant":false,"legacy_process_step":"PSX5","process_ids":["PRS-048"],"technology_ids":["TEC-049"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-D16"],"origin":"Batch-1 taxonomy"},{"id":"EQP-D18","entity_type":"equipment","code":"D18","name":"Glass Interposer","parent_id":"EQP-D","level":2,"group_code":"D","group_name":"Advanced Packaging","segment":"Advanced Packaging","laser_relevant":false,"legacy_process_step":"PSX5","process_ids":["PRS-044","PRS-048"],"technology_ids":["TEC-049"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000143"],"model_ids":["MDL-000035"],"company_ids_incl_children":["CMP-000143"],"model_ids_incl_children":["MDL-000035"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-D19","entity_type":"equipment","code":"D19","name":"Panel Level Packaging","parent_id":"EQP-D","level":2,"group_code":"D","group_name":"Advanced Packaging","segment":"Advanced Packaging","laser_relevant":false,"legacy_process_step":"PSX5","process_ids":["PRS-053"],"technology_ids":["TEC-048"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000229","CMP-000231","CMP-000233","CMP-000254","CMP-000337"],"model_ids":["MDL-000346","MDL-000360","MDL-000392","MDL-000519"],"company_ids_incl_children":["CMP-000229","CMP-000231","CMP-000233","CMP-000254","CMP-000337"],"model_ids_incl_children":["MDL-000346","MDL-000360","MDL-000392","MDL-000519"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-D20","entity_type":"equipment","code":"D20","name":"Wafer Level Packaging","parent_id":"EQP-D","level":2,"group_code":"D","group_name":"Advanced Packaging","segment":"Advanced Packaging","laser_relevant":false,"legacy_process_step":"PSX5","process_ids":["PRS-046"],"technology_ids":["TEC-046"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000221"],"model_ids":["MDL-000561","MDL-000328","MDL-000329"],"company_ids_incl_children":["CMP-000221"],"model_ids_incl_children":["MDL-000561","MDL-000328","MDL-000329"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-D21","entity_type":"equipment","code":"D21","name":"Die-to-Wafer","parent_id":"EQP-D","level":2,"group_code":"D","group_name":"Advanced Packaging","segment":"Advanced Packaging","laser_relevant":false,"legacy_process_step":"PSX5","process_ids":["PRS-049"],"technology_ids":["TEC-050"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000043","CMP-000051"],"model_ids":["MDL-000556","MDL-000558"],"company_ids_incl_children":["CMP-000043","CMP-000051"],"model_ids_incl_children":["MDL-000556","MDL-000558"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-D22","entity_type":"equipment","code":"D22","name":"Wafer-to-Wafer","parent_id":"EQP-D","level":2,"group_code":"D","group_name":"Advanced Packaging","segment":"Advanced Packaging","laser_relevant":false,"legacy_process_step":"PSX5","process_ids":["PRS-049"],"technology_ids":["TEC-044"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000051"],"model_ids":["MDL-000557"],"company_ids_incl_children":["CMP-000051"],"model_ids_incl_children":["MDL-000557"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-D23","entity_type":"equipment","code":"D23","name":"Die-to-Die","parent_id":"EQP-D","level":2,"group_code":"D","group_name":"Advanced Packaging","segment":"Advanced Packaging","laser_relevant":false,"legacy_process_step":"PSX5","process_ids":["PRS-049"],"technology_ids":["TEC-050"],"typical_subsystem_ids":["SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-C17"],"origin":"Batch-1 taxonomy"},{"id":"EQP-E01","entity_type":"equipment","code":"E01","name":"Assembly","parent_id":"EQP-E","level":2,"group_code":"E","group_name":"ATMP / OSAT","segment":"Back-End","laser_relevant":false,"legacy_process_step":null,"process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-C10","EQP-C11","EQP-C12"],"origin":"Batch-1 taxonomy"},{"id":"EQP-E02","entity_type":"equipment","code":"E02","name":"Testing","parent_id":"EQP-E","level":2,"group_code":"E","group_name":"ATMP / OSAT","segment":"Test","laser_relevant":false,"legacy_process_step":null,"process_ids":["PRS-041"],"technology_ids":["TEC-056"],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-C40"],"origin":"Batch-1 taxonomy"},{"id":"EQP-E03","entity_type":"equipment","code":"E03","name":"Packaging","parent_id":"EQP-E","level":2,"group_code":"E","group_name":"ATMP / OSAT","segment":"Back-End","laser_relevant":false,"legacy_process_step":null,"process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000236"],"model_ids":["MDL-000368"],"company_ids_incl_children":["CMP-000236"],"model_ids_incl_children":["MDL-000368"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-E04","entity_type":"equipment","code":"E04","name":"Burn-in","parent_id":"EQP-E","level":2,"group_code":"E","group_name":"ATMP / OSAT","segment":"Test","laser_relevant":false,"legacy_process_step":null,"process_ids":["PRS-042"],"technology_ids":["TEC-057"],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-C38"],"origin":"Batch-1 taxonomy"},{"id":"EQP-E05","entity_type":"equipment","code":"E05","name":"Reliability","parent_id":"EQP-E","level":2,"group_code":"E","group_name":"ATMP / OSAT","segment":"Test","laser_relevant":false,"legacy_process_step":null,"process_ids":["PRS-042"],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-E06","entity_type":"equipment","code":"E06","name":"Final inspection","parent_id":"EQP-E","level":2,"group_code":"E","group_name":"ATMP / OSAT","segment":"Back-End","laser_relevant":false,"legacy_process_step":null,"process_ids":["PRS-040"],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-C34"],"origin":"Batch-1 taxonomy"},{"id":"EQP-E07","entity_type":"equipment","code":"E07","name":"Sorting","parent_id":"EQP-E","level":2,"group_code":"E","group_name":"ATMP / OSAT","segment":"Back-End","laser_relevant":false,"legacy_process_step":null,"process_ids":["PRS-041"],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-C08"],"origin":"Batch-1 taxonomy"},{"id":"EQP-E08","entity_type":"equipment","code":"E08","name":"Handling","parent_id":"EQP-E","level":2,"group_code":"E","group_name":"ATMP / OSAT","segment":"Back-End","laser_relevant":false,"legacy_process_step":null,"process_ids":["PRS-041"],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-C39"],"origin":"Batch-1 taxonomy"},{"id":"EQP-E09","entity_type":"equipment","code":"E09","name":"Marking","parent_id":"EQP-E","level":2,"group_code":"E","group_name":"ATMP / OSAT","segment":"Back-End","laser_relevant":true,"legacy_process_step":null,"process_ids":["PRS-038"],"technology_ids":["TEC-059"],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-C26"],"origin":"Batch-1 taxonomy"},{"id":"EQP-E10","entity_type":"equipment","code":"E10","name":"Dicing","parent_id":"EQP-E","level":2,"group_code":"E","group_name":"ATMP / OSAT","segment":"Back-End","laser_relevant":false,"legacy_process_step":null,"process_ids":["PRS-032"],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-C01"],"origin":"Batch-1 taxonomy"},{"id":"EQP-E11","entity_type":"equipment","code":"E11","name":"Die bonding","parent_id":"EQP-E","level":2,"group_code":"E","group_name":"ATMP / OSAT","segment":"Back-End","laser_relevant":false,"legacy_process_step":null,"process_ids":["PRS-033"],"technology_ids":["TEC-039"],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-C10"],"origin":"Batch-1 taxonomy"},{"id":"EQP-E12","entity_type":"equipment","code":"E12","name":"Wire bonding","parent_id":"EQP-E","level":2,"group_code":"E","group_name":"ATMP / OSAT","segment":"Back-End","laser_relevant":false,"legacy_process_step":null,"process_ids":["PRS-034"],"technology_ids":["TEC-040"],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-C12"],"origin":"Batch-1 taxonomy"},{"id":"EQP-E13","entity_type":"equipment","code":"E13","name":"Flip-chip","parent_id":"EQP-E","level":2,"group_code":"E","group_name":"ATMP / OSAT","segment":"Back-End","laser_relevant":false,"legacy_process_step":null,"process_ids":["PRS-035"],"technology_ids":["TEC-041"],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-C11"],"origin":"Batch-1 taxonomy"},{"id":"EQP-E14","entity_type":"equipment","code":"E14","name":"Molding","parent_id":"EQP-E","level":2,"group_code":"E","group_name":"ATMP / OSAT","segment":"Back-End","laser_relevant":false,"legacy_process_step":null,"process_ids":["PRS-036"],"technology_ids":["TEC-045"],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-C20","EQP-C21"],"origin":"Batch-1 taxonomy"},{"id":"EQP-F01","entity_type":"equipment","code":"F01","name":"SiC wafer processing","parent_id":"EQP-F","level":2,"group_code":"F","group_name":"Power Semiconductor","segment":"Front-End","laser_relevant":true,"legacy_process_step":null,"process_ids":["PRS-003"],"technology_ids":[],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000010","CMP-000119","CMP-000235"],"model_ids":["MDL-000003","MDL-000004","MDL-000045"],"company_ids_incl_children":["CMP-000010","CMP-000119","CMP-000235"],"model_ids_incl_children":["MDL-000003","MDL-000004","MDL-000045"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-F02","entity_type":"equipment","code":"F02","name":"GaN processing","parent_id":"EQP-F","level":2,"group_code":"F","group_name":"Power Semiconductor","segment":"Front-End","laser_relevant":false,"legacy_process_step":null,"process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-G01"],"origin":"Batch-1 taxonomy"},{"id":"EQP-F03","entity_type":"equipment","code":"F03","name":"Epitaxy","parent_id":"EQP-F","level":2,"group_code":"F","group_name":"Power Semiconductor","segment":"Front-End","laser_relevant":false,"legacy_process_step":null,"process_ids":["PRS-009"],"technology_ids":["TEC-022"],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-A09.10"],"origin":"Batch-1 taxonomy"},{"id":"EQP-F04","entity_type":"equipment","code":"F04","name":"Implantation","parent_id":"EQP-F","level":2,"group_code":"F","group_name":"Power Semiconductor","segment":"Front-End","laser_relevant":false,"legacy_process_step":null,"process_ids":["PRS-022"],"technology_ids":["TEC-026"],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-A10"],"origin":"Batch-1 taxonomy"},{"id":"EQP-F05","entity_type":"equipment","code":"F05","name":"Annealing","parent_id":"EQP-F","level":2,"group_code":"F","group_name":"Power Semiconductor","segment":"Front-End","laser_relevant":true,"legacy_process_step":null,"process_ids":["PRS-023"],"technology_ids":[],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000174","CMP-000175","CMP-000177","CMP-000245"],"model_ids":[],"company_ids_incl_children":["CMP-000174","CMP-000175","CMP-000177","CMP-000245"],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-F06","entity_type":"equipment","code":"F06","name":"Laser processing","parent_id":"EQP-F","level":2,"group_code":"F","group_name":"Power Semiconductor","segment":"Front-End","laser_relevant":true,"legacy_process_step":null,"process_ids":[],"technology_ids":[],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-A15"],"origin":"Batch-1 taxonomy"},{"id":"EQP-F07","entity_type":"equipment","code":"F07","name":"Dicing","parent_id":"EQP-F","level":2,"group_code":"F","group_name":"Power Semiconductor","segment":"Back-End","laser_relevant":true,"legacy_process_step":null,"process_ids":["PRS-032"],"technology_ids":[],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000117","CMP-000141","CMP-000142","CMP-000232"],"model_ids":["MDL-000032","MDL-000033"],"company_ids_incl_children":["CMP-000117","CMP-000141","CMP-000142","CMP-000232"],"model_ids_incl_children":["MDL-000032","MDL-000033"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-F08","entity_type":"equipment","code":"F08","name":"Packaging","parent_id":"EQP-F","level":2,"group_code":"F","group_name":"Power Semiconductor","segment":"Back-End","laser_relevant":false,"legacy_process_step":null,"process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000246","CMP-000281"],"model_ids":["MDL-000387","MDL-000439"],"company_ids_incl_children":["CMP-000246","CMP-000281"],"model_ids_incl_children":["MDL-000387","MDL-000439"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-F09","entity_type":"equipment","code":"F09","name":"Bonding","parent_id":"EQP-F","level":2,"group_code":"F","group_name":"Power Semiconductor","segment":"Back-End","laser_relevant":false,"legacy_process_step":null,"process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-C18"],"origin":"Batch-1 taxonomy"},{"id":"EQP-F10","entity_type":"equipment","code":"F10","name":"Testing","parent_id":"EQP-F","level":2,"group_code":"F","group_name":"Power Semiconductor","segment":"Test","laser_relevant":false,"legacy_process_step":null,"process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-C40"],"origin":"Batch-1 taxonomy"},{"id":"EQP-G01","entity_type":"equipment","code":"G01","name":"GaN","parent_id":"EQP-G","level":2,"group_code":"G","group_name":"Compound Semiconductors","segment":"Front-End","laser_relevant":true,"legacy_process_step":"PS01","process_ids":["PRS-009"],"technology_ids":["TEC-023"],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-006","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000014","CMP-000028"],"model_ids":["MDL-000289","MDL-000290","MDL-000291"],"company_ids_incl_children":["CMP-000014","CMP-000028"],"model_ids_incl_children":["MDL-000289","MDL-000290","MDL-000291"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-G02","entity_type":"equipment","code":"G02","name":"SiC","parent_id":"EQP-G","level":2,"group_code":"G","group_name":"Compound Semiconductors","segment":"Front-End","laser_relevant":true,"legacy_process_step":"PS01","process_ids":["PRS-009"],"technology_ids":[],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-006","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000028"],"model_ids":["MDL-000292"],"company_ids_incl_children":["CMP-000028"],"model_ids_incl_children":["MDL-000292"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-G03","entity_type":"equipment","code":"G03","name":"GaAs","parent_id":"EQP-G","level":2,"group_code":"G","group_name":"Compound Semiconductors","segment":"Front-End","laser_relevant":true,"legacy_process_step":"PS01","process_ids":["PRS-009"],"technology_ids":["TEC-023"],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-006","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000028","CMP-000219"],"model_ids":["MDL-000293","MDL-000325"],"company_ids_incl_children":["CMP-000028","CMP-000219"],"model_ids_incl_children":["MDL-000293","MDL-000325"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-G04","entity_type":"equipment","code":"G04","name":"InP","parent_id":"EQP-G","level":2,"group_code":"G","group_name":"Compound Semiconductors","segment":"Front-End","laser_relevant":true,"legacy_process_step":"PS01","process_ids":["PRS-009"],"technology_ids":["TEC-023"],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-006","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-G05","entity_type":"equipment","code":"G05","name":"AlGaN","parent_id":"EQP-G","level":2,"group_code":"G","group_name":"Compound Semiconductors","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS01","process_ids":["PRS-009"],"technology_ids":["TEC-023"],"typical_subsystem_ids":["SUB-006"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-G06","entity_type":"equipment","code":"G06","name":"InGaN","parent_id":"EQP-G","level":2,"group_code":"G","group_name":"Compound Semiconductors","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS01","process_ids":["PRS-009"],"technology_ids":["TEC-023"],"typical_subsystem_ids":["SUB-006"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-G07","entity_type":"equipment","code":"G07","name":"AlN","parent_id":"EQP-G","level":2,"group_code":"G","group_name":"Compound Semiconductors","segment":"Front-End","laser_relevant":false,"legacy_process_step":"PS01","process_ids":["PRS-009"],"technology_ids":["TEC-023"],"typical_subsystem_ids":["SUB-006"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-H01","entity_type":"equipment","code":"H01","name":"MEMS fabrication","parent_id":"EQP-H","level":2,"group_code":"H","group_name":"MEMS","segment":"Front-End","laser_relevant":false,"legacy_process_step":null,"process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-H02"],"origin":"Batch-1 taxonomy"},{"id":"EQP-H02","entity_type":"equipment","code":"H02","name":"DRIE","parent_id":"EQP-H","level":2,"group_code":"H","group_name":"MEMS","segment":"Front-End","laser_relevant":false,"legacy_process_step":null,"process_ids":[],"technology_ids":["TEC-012"],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000298"],"model_ids":["MDL-000451"],"company_ids_incl_children":["CMP-000298"],"model_ids_incl_children":["MDL-000451"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-H03","entity_type":"equipment","code":"H03","name":"Wafer bonding","parent_id":"EQP-H","level":2,"group_code":"H","group_name":"MEMS","segment":"Front-End","laser_relevant":false,"legacy_process_step":null,"process_ids":[],"technology_ids":["TEC-044"],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-C18"],"origin":"Batch-1 taxonomy"},{"id":"EQP-H04","entity_type":"equipment","code":"H04","name":"Deposition","parent_id":"EQP-H","level":2,"group_code":"H","group_name":"MEMS","segment":"Front-End","laser_relevant":false,"legacy_process_step":null,"process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-A09"],"origin":"Batch-1 taxonomy"},{"id":"EQP-H05","entity_type":"equipment","code":"H05","name":"Etching","parent_id":"EQP-H","level":2,"group_code":"H","group_name":"MEMS","segment":"Front-End","laser_relevant":false,"legacy_process_step":null,"process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000298"],"model_ids":[],"company_ids_incl_children":["CMP-000298"],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-H06","entity_type":"equipment","code":"H06","name":"Packaging","parent_id":"EQP-H","level":2,"group_code":"H","group_name":"MEMS","segment":"Back-End","laser_relevant":false,"legacy_process_step":null,"process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-H07","entity_type":"equipment","code":"H07","name":"Inspection","parent_id":"EQP-H","level":2,"group_code":"H","group_name":"MEMS","segment":"Front-End","laser_relevant":false,"legacy_process_step":null,"process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-A21"],"origin":"Batch-1 taxonomy"},{"id":"EQP-H08","entity_type":"equipment","code":"H08","name":"Testing","parent_id":"EQP-H","level":2,"group_code":"H","group_name":"MEMS","segment":"Test","laser_relevant":false,"legacy_process_step":null,"process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-A32"],"origin":"Batch-1 taxonomy"},{"id":"EQP-I01","entity_type":"equipment","code":"I01","name":"MicroLED","parent_id":"EQP-I","level":2,"group_code":"I","group_name":"Display / MicroLED","segment":"Display","laser_relevant":false,"legacy_process_step":"PSX6","process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000046","CMP-000368"],"model_ids":["MDL-000560"],"company_ids_incl_children":["CMP-000046","CMP-000368"],"model_ids_incl_children":["MDL-000560"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-I02","entity_type":"equipment","code":"I02","name":"OLED","parent_id":"EQP-I","level":2,"group_code":"I","group_name":"Display / MicroLED","segment":"Display","laser_relevant":false,"legacy_process_step":"PSX6","process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000300"],"model_ids":["MDL-000453","MDL-000454"],"company_ids_incl_children":["CMP-000300"],"model_ids_incl_children":["MDL-000453","MDL-000454"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-I03","entity_type":"equipment","code":"I03","name":"AMOLED","parent_id":"EQP-I","level":2,"group_code":"I","group_name":"Display / MicroLED","segment":"Display","laser_relevant":false,"legacy_process_step":"PSX6","process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-I02"],"origin":"Batch-1 taxonomy"},{"id":"EQP-I04","entity_type":"equipment","code":"I04","name":"Display inspection","parent_id":"EQP-I","level":2,"group_code":"I","group_name":"Display / MicroLED","segment":"Display","laser_relevant":false,"legacy_process_step":"PSX6","process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000367"],"model_ids":[],"company_ids_incl_children":["CMP-000367"],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-I05","entity_type":"equipment","code":"I05","name":"Laser repair","parent_id":"EQP-I","level":2,"group_code":"I","group_name":"Display / MicroLED","segment":"Display","laser_relevant":true,"legacy_process_step":"PSX6","process_ids":["PRS-056"],"technology_ids":["TEC-070"],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000367","CMP-000368"],"model_ids":[],"company_ids_incl_children":["CMP-000367","CMP-000368"],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-I06","entity_type":"equipment","code":"I06","name":"Laser lift-off","parent_id":"EQP-I","level":2,"group_code":"I","group_name":"Display / MicroLED","segment":"Display","laser_relevant":true,"legacy_process_step":"PSX6","process_ids":["PRS-054"],"technology_ids":["TEC-068"],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000077","CMP-000079","CMP-000145","CMP-000175"],"model_ids":["MDL-000063","MDL-000066"],"company_ids_incl_children":["CMP-000077","CMP-000079","CMP-000145","CMP-000175"],"model_ids_incl_children":["MDL-000063","MDL-000066"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-I07","entity_type":"equipment","code":"I07","name":"Laser annealing","parent_id":"EQP-I","level":2,"group_code":"I","group_name":"Display / MicroLED","segment":"Display","laser_relevant":true,"legacy_process_step":"PSX6","process_ids":["PRS-055"],"technology_ids":["TEC-067"],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000079","CMP-000145","CMP-000175","CMP-000176"],"model_ids":["MDL-000052","MDL-000053","MDL-000062","MDL-000067"],"company_ids_incl_children":["CMP-000079","CMP-000145","CMP-000175","CMP-000176"],"model_ids_incl_children":["MDL-000052","MDL-000053","MDL-000062","MDL-000067"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-I08","entity_type":"equipment","code":"I08","name":"Mass transfer","parent_id":"EQP-I","level":2,"group_code":"I","group_name":"Display / MicroLED","segment":"Display","laser_relevant":true,"legacy_process_step":"PSX6","process_ids":["PRS-056"],"technology_ids":[],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000044","CMP-000141","CMP-000145","CMP-000310"],"model_ids":["MDL-000068","MDL-000478","MDL-000479","MDL-000480"],"company_ids_incl_children":["CMP-000044","CMP-000141","CMP-000145","CMP-000310"],"model_ids_incl_children":["MDL-000068","MDL-000478","MDL-000479","MDL-000480"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-I09","entity_type":"equipment","code":"I09","name":"Pick & place","parent_id":"EQP-I","level":2,"group_code":"I","group_name":"Display / MicroLED","segment":"Display","laser_relevant":false,"legacy_process_step":"PSX6","process_ids":["PRS-056"],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-C09"],"origin":"Batch-1 taxonomy"},{"id":"EQP-I10","entity_type":"equipment","code":"I10","name":"Bonding","parent_id":"EQP-I","level":2,"group_code":"I","group_name":"Display / MicroLED","segment":"Display","laser_relevant":true,"legacy_process_step":"PSX6","process_ids":["PRS-056"],"technology_ids":[],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-C11"],"origin":"Batch-1 taxonomy"},{"id":"EQP-I11","entity_type":"equipment","code":"I11","name":"Inspection","parent_id":"EQP-I","level":2,"group_code":"I","group_name":"Display / MicroLED","segment":"Display","laser_relevant":false,"legacy_process_step":"PSX6","process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-I04"],"origin":"Batch-1 taxonomy"},{"id":"EQP-J01","entity_type":"equipment","code":"J01","name":"AMHS","parent_id":"EQP-J","level":2,"group_code":"J","group_name":"Semiconductor Factory Automation","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-057"],"technology_ids":[],"typical_subsystem_ids":["SUB-008","SUB-013","SUB-014","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000065","CMP-000366"],"model_ids":["MDL-000270"],"company_ids_incl_children":["CMP-000065","CMP-000366"],"model_ids_incl_children":["MDL-000270"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-J02","entity_type":"equipment","code":"J02","name":"OHT","parent_id":"EQP-J","level":2,"group_code":"J","group_name":"Semiconductor Factory Automation","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-057"],"technology_ids":[],"typical_subsystem_ids":["SUB-008","SUB-013","SUB-014","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000066","CMP-000366"],"model_ids":["MDL-000115","MDL-000271"],"company_ids_incl_children":["CMP-000066","CMP-000366"],"model_ids_incl_children":["MDL-000115","MDL-000271"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-J03","entity_type":"equipment","code":"J03","name":"OHS","parent_id":"EQP-J","level":2,"group_code":"J","group_name":"Semiconductor Factory Automation","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-057"],"technology_ids":[],"typical_subsystem_ids":["SUB-008","SUB-013","SUB-014","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000066"],"model_ids":[],"company_ids_incl_children":["CMP-000066"],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-J04","entity_type":"equipment","code":"J04","name":"AGV","parent_id":"EQP-J","level":2,"group_code":"J","group_name":"Semiconductor Factory Automation","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-057"],"technology_ids":[],"typical_subsystem_ids":["SUB-008","SUB-013","SUB-014","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000369"],"model_ids":[],"company_ids_incl_children":["CMP-000369"],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-J05","entity_type":"equipment","code":"J05","name":"RGV","parent_id":"EQP-J","level":2,"group_code":"J","group_name":"Semiconductor Factory Automation","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-057"],"technology_ids":[],"typical_subsystem_ids":["SUB-008","SUB-013","SUB-014","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-J07"],"origin":"Batch-1 taxonomy"},{"id":"EQP-J06","entity_type":"equipment","code":"J06","name":"Wafer robots","parent_id":"EQP-J","level":2,"group_code":"J","group_name":"Semiconductor Factory Automation","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-058"],"technology_ids":[],"typical_subsystem_ids":["SUB-008","SUB-013","SUB-014","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000321"],"model_ids":["MDL-000496"],"company_ids_incl_children":["CMP-000321"],"model_ids_incl_children":["MDL-000496"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-J07","entity_type":"equipment","code":"J07","name":"Material handling","parent_id":"EQP-J","level":2,"group_code":"J","group_name":"Semiconductor Factory Automation","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-057"],"technology_ids":[],"typical_subsystem_ids":["SUB-008","SUB-013","SUB-014","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000059","CMP-000060","CMP-000061","CMP-000066","CMP-000085","CMP-000086"],"model_ids":["MDL-000272"],"company_ids_incl_children":["CMP-000059","CMP-000060","CMP-000061","CMP-000066","CMP-000085","CMP-000086"],"model_ids_incl_children":["MDL-000272"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-J08","entity_type":"equipment","code":"J08","name":"Factory automation","parent_id":"EQP-J","level":2,"group_code":"J","group_name":"Semiconductor Factory Automation","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-058"],"technology_ids":[],"typical_subsystem_ids":["SUB-008","SUB-013","SUB-014","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000191"],"model_ids":[],"company_ids_incl_children":["CMP-000191"],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-J09","entity_type":"equipment","code":"J09","name":"MES","parent_id":"EQP-J","level":2,"group_code":"J","group_name":"Semiconductor Factory Automation","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-058"],"technology_ids":[],"typical_subsystem_ids":["SUB-008","SUB-013","SUB-014","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000293"],"model_ids":["MDL-000446"],"company_ids_incl_children":["CMP-000293"],"model_ids_incl_children":["MDL-000446"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-J10","entity_type":"equipment","code":"J10","name":"Equipment automation","parent_id":"EQP-J","level":2,"group_code":"J","group_name":"Semiconductor Factory Automation","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-058"],"technology_ids":[],"typical_subsystem_ids":["SUB-008","SUB-013","SUB-014","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000364"],"model_ids":["MDL-000566"],"company_ids_incl_children":["CMP-000364"],"model_ids_incl_children":["MDL-000566"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-J11","entity_type":"equipment","code":"J11","name":"EFEM","parent_id":"EQP-J","level":2,"group_code":"J","group_name":"Semiconductor Factory Automation","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-058"],"technology_ids":[],"typical_subsystem_ids":["SUB-008","SUB-013","SUB-014","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000320"],"model_ids":["MDL-000492","MDL-000493"],"company_ids_incl_children":["CMP-000320"],"model_ids_incl_children":["MDL-000492","MDL-000493"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-J12","entity_type":"equipment","code":"J12","name":"Load ports","parent_id":"EQP-J","level":2,"group_code":"J","group_name":"Semiconductor Factory Automation","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-058"],"technology_ids":[],"typical_subsystem_ids":["SUB-008","SUB-013","SUB-014","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000320"],"model_ids":["MDL-000494","MDL-000495"],"company_ids_incl_children":["CMP-000320"],"model_ids_incl_children":["MDL-000494","MDL-000495"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-J13","entity_type":"equipment","code":"J13","name":"Smart factory","parent_id":"EQP-J","level":2,"group_code":"J","group_name":"Semiconductor Factory Automation","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-058"],"technology_ids":[],"typical_subsystem_ids":["SUB-008","SUB-013","SUB-014","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-J08"],"origin":"Batch-1 taxonomy"},{"id":"EQP-J14","entity_type":"equipment","code":"J14","name":"Digital twin","parent_id":"EQP-J","level":2,"group_code":"J","group_name":"Semiconductor Factory Automation","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-058"],"technology_ids":[],"typical_subsystem_ids":["SUB-008","SUB-013","SUB-014","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000293"],"model_ids":[],"company_ids_incl_children":["CMP-000293"],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-J15","entity_type":"equipment","code":"J15","name":"Factory monitoring","parent_id":"EQP-J","level":2,"group_code":"J","group_name":"Semiconductor Factory Automation","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-058"],"technology_ids":[],"typical_subsystem_ids":["SUB-008","SUB-013","SUB-014","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000365"],"model_ids":["MDL-000565"],"company_ids_incl_children":["CMP-000365"],"model_ids_incl_children":["MDL-000565"],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-F.D01","entity_type":"equipment","code":"F.D01","name":"Device: Si","parent_id":"EQP-F","level":2,"group_code":"F","group_name":"Power Semiconductor","segment":"Device class","laser_relevant":false,"legacy_process_step":"PS01","process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-F.D02","entity_type":"equipment","code":"F.D02","name":"Device: SiC","parent_id":"EQP-F","level":2,"group_code":"F","group_name":"Power Semiconductor","segment":"Device class","laser_relevant":false,"legacy_process_step":"PS01","process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-F.D03","entity_type":"equipment","code":"F.D03","name":"Device: GaN","parent_id":"EQP-F","level":2,"group_code":"F","group_name":"Power Semiconductor","segment":"Device class","laser_relevant":false,"legacy_process_step":"PS01","process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-F.D04","entity_type":"equipment","code":"F.D04","name":"Device: IGBT","parent_id":"EQP-F","level":2,"group_code":"F","group_name":"Power Semiconductor","segment":"Device class","laser_relevant":false,"legacy_process_step":"PS01","process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-F.D05","entity_type":"equipment","code":"F.D05","name":"Device: MOSFET","parent_id":"EQP-F","level":2,"group_code":"F","group_name":"Power Semiconductor","segment":"Device class","laser_relevant":false,"legacy_process_step":"PS01","process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-F.D06","entity_type":"equipment","code":"F.D06","name":"Device: Diodes","parent_id":"EQP-F","level":2,"group_code":"F","group_name":"Power Semiconductor","segment":"Device class","laser_relevant":false,"legacy_process_step":"PS01","process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-F.D07","entity_type":"equipment","code":"F.D07","name":"Device: Rectifiers","parent_id":"EQP-F","level":2,"group_code":"F","group_name":"Power Semiconductor","segment":"Device class","laser_relevant":false,"legacy_process_step":"PS01","process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-F.D08","entity_type":"equipment","code":"F.D08","name":"Device: Schottky","parent_id":"EQP-F","level":2,"group_code":"F","group_name":"Power Semiconductor","segment":"Device class","laser_relevant":false,"legacy_process_step":"PS01","process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-F.D09","entity_type":"equipment","code":"F.D09","name":"Device: TVS","parent_id":"EQP-F","level":2,"group_code":"F","group_name":"Power Semiconductor","segment":"Device class","laser_relevant":false,"legacy_process_step":"PS01","process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-F.D10","entity_type":"equipment","code":"F.D10","name":"Device: Power modules","parent_id":"EQP-F","level":2,"group_code":"F","group_name":"Power Semiconductor","segment":"Device class","laser_relevant":false,"legacy_process_step":"PS01","process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"Batch-1 taxonomy"},{"id":"EQP-K","entity_type":"equipment","code":"K","name":"Wafer Manufacturing / Substrate Equipment","parent_id":null,"level":1,"group_code":"K","group_name":"Wafer Manufacturing / Substrate Equipment","segment":null,"laser_relevant":false,"legacy_process_step":null,"process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":["CMP-000184","CMP-000194","CMP-000202","CMP-000215","CMP-000239","CMP-000357","CMP-000230","CMP-000227","CMP-000207","CMP-000236","CMP-000301","CMP-000302","CMP-000012","CMP-000203","CMP-000289"],"model_ids_incl_children":["MDL-000116","MDL-000117","MDL-000273","MDL-000274","MDL-000275","MDL-000311","MDL-000372","MDL-000526","MDL-000373","MDL-000294","MDL-000456","MDL-000457","MDL-000458","MDL-000459","MDL-000460","MDL-000210","MDL-000211","MDL-000297","MDL-000298","MDL-000276","MDL-000277","MDL-000278","MDL-000455","MDL-000443","MDL-000444"],"child_ids":["EQP-K01","EQP-K02","EQP-K03","EQP-K04","EQP-K05","EQP-K06","EQP-K07","EQP-K08","EQP-K09"],"see_also":[],"origin":"2.0 taxonomy extension"},{"id":"EQP-L","entity_type":"equipment","code":"L","name":"Subfab & Fab Facilities","parent_id":null,"level":1,"group_code":"L","group_name":"Subfab & Fab Facilities","segment":null,"laser_relevant":false,"legacy_process_step":null,"process_ids":[],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":["CMP-000294","CMP-000295","CMP-000362","CMP-000296","CMP-000355","CMP-000356","CMP-000297","CMP-000307","CMP-000308","CMP-000351","CMP-000353","CMP-000370","CMP-000350","CMP-000204","CMP-000205","CMP-000361","CMP-000324","CMP-000325"],"model_ids_incl_children":["MDL-000447","MDL-000448","MDL-000449","MDL-000450","MDL-000562","MDL-000564","MDL-000281","MDL-000282"],"child_ids":["EQP-L01","EQP-L02","EQP-L03","EQP-L04","EQP-L05","EQP-L06","EQP-L07","EQP-L08","EQP-L09","EQP-L10","EQP-L11","EQP-L12"],"see_also":[],"origin":"2.0 taxonomy extension"},{"id":"EQP-K01","entity_type":"equipment","code":"K01","name":"Crystal growth furnaces / pullers","parent_id":"EQP-K","level":2,"group_code":"K","group_name":"Wafer Manufacturing / Substrate Equipment","segment":"Wafer Manufacturing","laser_relevant":false,"legacy_process_step":"PS01","process_ids":["PRS-001"],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000184","CMP-000194","CMP-000202","CMP-000215","CMP-000239","CMP-000357"],"model_ids":["MDL-000116","MDL-000117","MDL-000273","MDL-000274","MDL-000275","MDL-000311","MDL-000372","MDL-000526"],"company_ids_incl_children":["CMP-000184","CMP-000194","CMP-000202","CMP-000215","CMP-000239","CMP-000357"],"model_ids_incl_children":["MDL-000116","MDL-000117","MDL-000273","MDL-000274","MDL-000275","MDL-000311","MDL-000372","MDL-000526"],"child_ids":[],"see_also":["EQP-A09.10"],"origin":"2.0 taxonomy extension"},{"id":"EQP-K02","entity_type":"equipment","code":"K02","name":"Ingot grinding & shaping","parent_id":"EQP-K","level":2,"group_code":"K","group_name":"Wafer Manufacturing / Substrate Equipment","segment":"Wafer Manufacturing","laser_relevant":false,"legacy_process_step":"PS01","process_ids":["PRS-002"],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000239"],"model_ids":["MDL-000373"],"company_ids_incl_children":["CMP-000239"],"model_ids_incl_children":["MDL-000373"],"child_ids":[],"see_also":[],"origin":"2.0 taxonomy extension"},{"id":"EQP-K03","entity_type":"equipment","code":"K03","name":"Multi-wire saws","parent_id":"EQP-K","level":2,"group_code":"K","group_name":"Wafer Manufacturing / Substrate Equipment","segment":"Wafer Manufacturing","laser_relevant":false,"legacy_process_step":"PS01","process_ids":["PRS-003"],"technology_ids":["TEC-058"],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000230","CMP-000357"],"model_ids":[],"company_ids_incl_children":["CMP-000230","CMP-000357"],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"2.0 taxonomy extension"},{"id":"EQP-K04","entity_type":"equipment","code":"K04","name":"Laser ingot slicing","parent_id":"EQP-K","level":2,"group_code":"K","group_name":"Wafer Manufacturing / Substrate Equipment","segment":"Wafer Manufacturing","laser_relevant":true,"legacy_process_step":"PS01","process_ids":["PRS-003"],"technology_ids":[],"typical_subsystem_ids":["SUB-001","SUB-002","SUB-003","SUB-008","SUB-009","SUB-011","SUB-013","SUB-014","SUB-015","SUB-016"],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000227"],"model_ids":[],"company_ids_incl_children":["CMP-000227"],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-F01"],"origin":"2.0 taxonomy extension"},{"id":"EQP-K05","entity_type":"equipment","code":"K05","name":"Lapping","parent_id":"EQP-K","level":2,"group_code":"K","group_name":"Wafer Manufacturing / Substrate Equipment","segment":"Wafer Manufacturing","laser_relevant":false,"legacy_process_step":"PS01","process_ids":["PRS-004"],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000207","CMP-000236","CMP-000301","CMP-000302"],"model_ids":["MDL-000294","MDL-000456","MDL-000457","MDL-000458","MDL-000459","MDL-000460"],"company_ids_incl_children":["CMP-000207","CMP-000236","CMP-000301","CMP-000302"],"model_ids_incl_children":["MDL-000294","MDL-000456","MDL-000457","MDL-000458","MDL-000459","MDL-000460"],"child_ids":[],"see_also":[],"origin":"2.0 taxonomy extension"},{"id":"EQP-K06","entity_type":"equipment","code":"K06","name":"Edge & surface grinding","parent_id":"EQP-K","level":2,"group_code":"K","group_name":"Wafer Manufacturing / Substrate Equipment","segment":"Wafer Manufacturing","laser_relevant":false,"legacy_process_step":"PS01","process_ids":["PRS-005"],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000012","CMP-000207","CMP-000301"],"model_ids":["MDL-000210","MDL-000211","MDL-000297","MDL-000298"],"company_ids_incl_children":["CMP-000012","CMP-000207","CMP-000301"],"model_ids_incl_children":["MDL-000210","MDL-000211","MDL-000297","MDL-000298"],"child_ids":[],"see_also":[],"origin":"2.0 taxonomy extension"},{"id":"EQP-K07","entity_type":"equipment","code":"K07","name":"Double-side polishing","parent_id":"EQP-K","level":2,"group_code":"K","group_name":"Wafer Manufacturing / Substrate Equipment","segment":"Wafer Manufacturing","laser_relevant":false,"legacy_process_step":"PS01","process_ids":["PRS-006"],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000203","CMP-000207","CMP-000301"],"model_ids":["MDL-000276","MDL-000277","MDL-000278","MDL-000455"],"company_ids_incl_children":["CMP-000203","CMP-000207","CMP-000301"],"model_ids_incl_children":["MDL-000276","MDL-000277","MDL-000278","MDL-000455"],"child_ids":[],"see_also":[],"origin":"2.0 taxonomy extension"},{"id":"EQP-K08","entity_type":"equipment","code":"K08","name":"Final wafer cleaning","parent_id":"EQP-K","level":2,"group_code":"K","group_name":"Wafer Manufacturing / Substrate Equipment","segment":"Wafer Manufacturing","laser_relevant":false,"legacy_process_step":"PS01","process_ids":["PRS-007"],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-A04"],"origin":"2.0 taxonomy extension"},{"id":"EQP-K09","entity_type":"equipment","code":"K09","name":"Bare-wafer inspection & geometry","parent_id":"EQP-K","level":2,"group_code":"K","group_name":"Wafer Manufacturing / Substrate Equipment","segment":"Wafer Manufacturing","laser_relevant":false,"legacy_process_step":"PS01","process_ids":["PRS-008"],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000289"],"model_ids":["MDL-000443","MDL-000444"],"company_ids_incl_children":["CMP-000289"],"model_ids_incl_children":["MDL-000443","MDL-000444"],"child_ids":[],"see_also":["EQP-A30"],"origin":"2.0 taxonomy extension"},{"id":"EQP-L01","entity_type":"equipment","code":"L01","name":"Vacuum pumps (dry / turbo / cryo)","parent_id":"EQP-L","level":2,"group_code":"L","group_name":"Subfab & Fab Facilities","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-059"],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000294","CMP-000295"],"model_ids":["MDL-000447","MDL-000448","MDL-000449"],"company_ids_incl_children":["CMP-000294","CMP-000295"],"model_ids_incl_children":["MDL-000447","MDL-000448","MDL-000449"],"child_ids":[],"see_also":["EQP-A42"],"origin":"2.0 taxonomy extension"},{"id":"EQP-L02","entity_type":"equipment","code":"L02","name":"Abatement & scrubbers","parent_id":"EQP-L","level":2,"group_code":"L","group_name":"Subfab & Fab Facilities","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-059"],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000362","CMP-000296","CMP-000355","CMP-000356"],"model_ids":["MDL-000450"],"company_ids_incl_children":["CMP-000362","CMP-000296","CMP-000355","CMP-000356"],"model_ids_incl_children":["MDL-000450"],"child_ids":[],"see_also":["EQP-A45"],"origin":"2.0 taxonomy extension"},{"id":"EQP-L03","entity_type":"equipment","code":"L03","name":"Chillers & heat exchangers","parent_id":"EQP-L","level":2,"group_code":"L","group_name":"Subfab & Fab Facilities","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-061"],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000297","CMP-000355","CMP-000356"],"model_ids":[],"company_ids_incl_children":["CMP-000297","CMP-000355","CMP-000356"],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"2.0 taxonomy extension"},{"id":"EQP-L04","entity_type":"equipment","code":"L04","name":"Gas distribution (bulk & specialty)","parent_id":"EQP-L","level":2,"group_code":"L","group_name":"Subfab & Fab Facilities","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-060"],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000307","CMP-000308","CMP-000351","CMP-000353"],"model_ids":[],"company_ids_incl_children":["CMP-000307","CMP-000308","CMP-000351","CMP-000353"],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-A43"],"origin":"2.0 taxonomy extension"},{"id":"EQP-L05","entity_type":"equipment","code":"L05","name":"Chemical distribution","parent_id":"EQP-L","level":2,"group_code":"L","group_name":"Subfab & Fab Facilities","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-060"],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000370","CMP-000350"],"model_ids":["MDL-000562","MDL-000564"],"company_ids_incl_children":["CMP-000370","CMP-000350"],"model_ids_incl_children":["MDL-000562","MDL-000564"],"child_ids":[],"see_also":["EQP-A44"],"origin":"2.0 taxonomy extension"},{"id":"EQP-L06","entity_type":"equipment","code":"L06","name":"Exhaust systems","parent_id":"EQP-L","level":2,"group_code":"L","group_name":"Subfab & Fab Facilities","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-059"],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":["EQP-L02"],"origin":"2.0 taxonomy extension"},{"id":"EQP-L07","entity_type":"equipment","code":"L07","name":"Waste & wastewater treatment","parent_id":"EQP-L","level":2,"group_code":"L","group_name":"Subfab & Fab Facilities","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-061"],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"2.0 taxonomy extension"},{"id":"EQP-L08","entity_type":"equipment","code":"L08","name":"Ultrapure water (UPW)","parent_id":"EQP-L","level":2,"group_code":"L","group_name":"Subfab & Fab Facilities","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-061"],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000204","CMP-000205"],"model_ids":["MDL-000281","MDL-000282"],"company_ids_incl_children":["CMP-000204","CMP-000205"],"model_ids_incl_children":["MDL-000281","MDL-000282"],"child_ids":[],"see_also":[],"origin":"2.0 taxonomy extension"},{"id":"EQP-L09","entity_type":"equipment","code":"L09","name":"Compressed / clean dry air (CDA)","parent_id":"EQP-L","level":2,"group_code":"L","group_name":"Subfab & Fab Facilities","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-061"],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000361"],"model_ids":[],"company_ids_incl_children":["CMP-000361"],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"2.0 taxonomy extension"},{"id":"EQP-L10","entity_type":"equipment","code":"L10","name":"Facilities monitoring","parent_id":"EQP-L","level":2,"group_code":"L","group_name":"Subfab & Fab Facilities","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-061"],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":["CMP-000324","CMP-000325"],"model_ids":[],"company_ids_incl_children":["CMP-000324","CMP-000325"],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"2.0 taxonomy extension"},{"id":"EQP-L11","entity_type":"equipment","code":"L11","name":"Electrical & power distribution","parent_id":"EQP-L","level":2,"group_code":"L","group_name":"Subfab & Fab Facilities","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-061"],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"2.0 taxonomy extension"},{"id":"EQP-L12","entity_type":"equipment","code":"L12","name":"Facility controls","parent_id":"EQP-L","level":2,"group_code":"L","group_name":"Subfab & Fab Facilities","segment":"Automation & Facilities","laser_relevant":false,"legacy_process_step":"PSX4","process_ids":["PRS-061"],"technology_ids":[],"typical_subsystem_ids":[],"subsystem_basis":"Generic architecture reference (editorial), not a statement about any specific tool","company_ids":[],"model_ids":[],"company_ids_incl_children":[],"model_ids_incl_children":[],"child_ids":[],"see_also":[],"origin":"2.0 taxonomy extension"}],"processes":[{"id":"PRS-001","entity_type":"process","slug":"crystal-growth","name":"Crystal growth","stage":"WM","stage_name":"Wafer manufacturing","parent_id":null,"sequence":1,"flow_position":1,"legacy_process_steps":["PS01"],"description":"Growth of a single-crystal boule from melt or vapour (e.g. Czochralski or float-zone for silicon, physical vapour transport for SiC).","purpose":"Produce defect-controlled single-crystal material of the required orientation, doping and diameter.","inputs":["High-purity polysilicon or source material","Seed crystal","Dopants"],"outputs":["Single-crystal ingot / boule"],"typical_parameters":["Pull rate","Rotation rate","Melt / growth temperature","Ambient gas"],"quality_metrics":["Dislocation density","Resistivity uniformity","Oxygen / carbon content"],"defects":["Dislocations","Micropipes (SiC)","Crystal-originated particles"],"equipment_ids":["EQP-K01"],"technology_ids":[],"material_ids":["MAT-001","MAT-003","MAT-004","MAT-005","MAT-006","MAT-009"],"model_ids":["MDL-000116","MDL-000117","MDL-000273","MDL-000274","MDL-000275","MDL-000311","MDL-000372","MDL-000526"],"company_ids":["CMP-000184","CMP-000194","CMP-000202","CMP-000215","CMP-000239","CMP-000357"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-002","entity_type":"process","slug":"ingot-shaping","name":"Ingot grinding & shaping","stage":"WM","stage_name":"Wafer manufacturing","parent_id":null,"sequence":2,"flow_position":null,"legacy_process_steps":["PS01"],"description":"Cropping, cylindrical grinding and notch/flat forming of the as-grown ingot.","purpose":"Bring the ingot to final diameter and mark crystal orientation.","inputs":["As-grown ingot"],"outputs":["Shaped ingot"],"typical_parameters":["Diameter tolerance","Notch/flat geometry"],"quality_metrics":["Diameter","Orientation accuracy"],"defects":["Edge chipping"],"equipment_ids":["EQP-K02"],"technology_ids":[],"material_ids":["MAT-001","MAT-003"],"model_ids":["MDL-000373"],"company_ids":["CMP-000239"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-003","entity_type":"process","slug":"wafer-slicing","name":"Wafer slicing (wire sawing)","stage":"WM","stage_name":"Wafer manufacturing","parent_id":null,"sequence":3,"flow_position":2,"legacy_process_steps":["PS01"],"description":"Separation of the ingot into wafers, usually by multi-wire sawing; laser-based separation is also used for hard materials such as SiC.","purpose":"Convert the ingot into wafers with minimum kerf loss and subsurface damage.","inputs":["Shaped ingot","Wire / slurry or diamond wire"],"outputs":["As-cut wafers"],"typical_parameters":["Wire speed","Feed rate","Kerf width"],"quality_metrics":["Total thickness variation (TTV)","Warp / bow","Kerf loss"],"defects":["Saw marks","Subsurface damage","Breakage"],"equipment_ids":["EQP-K03","EQP-K04","EQP-F01"],"technology_ids":["TEC-058","TEC-065"],"material_ids":["MAT-001","MAT-003"],"model_ids":["MDL-000003","MDL-000004","MDL-000045"],"company_ids":["CMP-000230","CMP-000357","CMP-000227","CMP-000010","CMP-000119","CMP-000235"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-004","entity_type":"process","slug":"lapping","name":"Lapping","stage":"WM","stage_name":"Wafer manufacturing","parent_id":null,"sequence":4,"flow_position":null,"legacy_process_steps":["PS01"],"description":"Abrasive planarisation of both wafer faces after slicing.","purpose":"Remove saw damage and establish flatness and parallelism.","inputs":["As-cut wafers","Abrasive slurry"],"outputs":["Lapped wafers"],"typical_parameters":["Removal rate","Pressure"],"quality_metrics":["TTV","Flatness"],"defects":["Scratches","Residual damage"],"equipment_ids":["EQP-K05"],"technology_ids":[],"material_ids":["MAT-001","MAT-003"],"model_ids":["MDL-000294","MDL-000456","MDL-000457","MDL-000458","MDL-000459","MDL-000460"],"company_ids":["CMP-000207","CMP-000236","CMP-000301","CMP-000302"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-005","entity_type":"process","slug":"wafer-grinding","name":"Wafer surface & edge grinding","stage":"WM","stage_name":"Wafer manufacturing","parent_id":null,"sequence":5,"flow_position":null,"legacy_process_steps":["PS01"],"description":"Grinding of wafer faces and edge profiling.","purpose":"Achieve thickness targets and a robust edge profile.","inputs":["Lapped or as-cut wafers"],"outputs":["Ground wafers"],"typical_parameters":["Grit size","Spindle speed"],"quality_metrics":["Thickness","Edge profile"],"defects":["Edge chips","Grinding marks"],"equipment_ids":["EQP-K06"],"technology_ids":[],"material_ids":["MAT-001","MAT-003"],"model_ids":["MDL-000210","MDL-000211","MDL-000297","MDL-000298"],"company_ids":["CMP-000012","CMP-000207","CMP-000301"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-006","entity_type":"process","slug":"wafer-polishing","name":"Wafer polishing","stage":"WM","stage_name":"Wafer manufacturing","parent_id":null,"sequence":6,"flow_position":3,"legacy_process_steps":["PS01"],"description":"Chemical-mechanical polishing of the bare wafer (often double-side) to a mirror finish.","purpose":"Deliver the flatness and surface roughness required for device processing.","inputs":["Ground wafers","Slurry","Polishing pads"],"outputs":["Prime polished wafers"],"typical_parameters":["Down force","Platen speed","Slurry flow"],"quality_metrics":["Site flatness","Surface roughness","Nanotopography"],"defects":["Scratches","Haze","Slurry residue"],"equipment_ids":["EQP-K07","EQP-C05"],"technology_ids":[],"material_ids":["MAT-001","MAT-003","MAT-034","MAT-035"],"model_ids":["MDL-000276","MDL-000277","MDL-000278","MDL-000455"],"company_ids":["CMP-000203","CMP-000207","CMP-000301"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-007","entity_type":"process","slug":"wafer-cleaning-bare","name":"Final wafer cleaning","stage":"WM","stage_name":"Wafer manufacturing","parent_id":null,"sequence":7,"flow_position":null,"legacy_process_steps":["PS07"],"description":"Wet cleaning of polished wafers before packing.","purpose":"Remove particles, metals and organics from prime wafers.","inputs":["Polished wafers","Cleaning chemistries","UPW"],"outputs":["Clean prime wafers"],"typical_parameters":["Chemistry concentration","Temperature"],"quality_metrics":["Particle count","Metal contamination"],"defects":["Particles","Watermarks"],"equipment_ids":["EQP-K08"],"technology_ids":[],"material_ids":["MAT-031","MAT-023","MAT-024"],"model_ids":[],"company_ids":[],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-008","entity_type":"process","slug":"bare-wafer-inspection","name":"Bare-wafer inspection","stage":"WM","stage_name":"Wafer manufacturing","parent_id":null,"sequence":8,"flow_position":null,"legacy_process_steps":["PS09","PS08"],"description":"Inspection and geometry measurement of incoming or outgoing bare wafers.","purpose":"Qualify wafer geometry and surface defectivity.","inputs":["Bare wafers"],"outputs":["Inspection / geometry data"],"typical_parameters":["Sensitivity","Throughput"],"quality_metrics":["Defect capture rate"],"defects":["Particles","Pits","Slip lines"],"equipment_ids":["EQP-K09","EQP-A30"],"technology_ids":[],"material_ids":[],"model_ids":["MDL-000119","MDL-000222","MDL-000243","MDL-000404","MDL-000443","MDL-000444"],"company_ids":["CMP-000289","CMP-000005","CMP-000018","CMP-000180","CMP-000261","CMP-000299"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-009","entity_type":"process","slug":"epitaxy","name":"Epitaxy","stage":"WM","stage_name":"Wafer manufacturing","parent_id":null,"sequence":9,"flow_position":4,"legacy_process_steps":["PS01"],"description":"Growth of a single-crystal film on a single-crystal substrate, e.g. Si or SiC homo-epitaxy, or GaN/GaAs/InP compound layers by MOCVD or MBE.","purpose":"Create layers with controlled doping, composition and thickness that the substrate alone cannot provide.","inputs":["Substrate wafer","Precursor gases","Carrier gases"],"outputs":["Epitaxial wafer"],"typical_parameters":["Growth temperature","Pressure","Precursor ratios"],"quality_metrics":["Thickness & doping uniformity","Defect density"],"defects":["Stacking faults","Basal plane dislocations (SiC)","Particles"],"equipment_ids":["EQP-A09.10","EQP-A09.11","EQP-F03","EQP-G","EQP-G01","EQP-G02","EQP-G03","EQP-G04","EQP-G05","EQP-G06","EQP-G07"],"technology_ids":["TEC-022","TEC-023","TEC-024"],"material_ids":["MAT-001","MAT-003","MAT-004","MAT-005","MAT-006","MAT-021"],"model_ids":["MDL-000283","MDL-000284","MDL-000285","MDL-000286","MDL-000287","MDL-000288","MDL-000289","MDL-000290","MDL-000291","MDL-000292","MDL-000293","MDL-000325","MDL-000441","MDL-000442","MDL-000525"],"company_ids":["CMP-000002","CMP-000006","CMP-000184","CMP-000194","CMP-000357","CMP-000283","CMP-000284","CMP-000285","CMP-000014","CMP-000028","CMP-000219"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-010","entity_type":"process","slug":"wafer-clean","name":"Wafer cleaning","stage":"FE","stage_name":"Front-end (wafer processing)","parent_id":null,"sequence":10,"flow_position":5,"legacy_process_steps":["PS07"],"description":"Removal of particles, organic and metallic contaminants and native oxide, by wet (batch or single-wafer) or dry/plasma methods. Repeated many times in the flow.","purpose":"Keep surfaces free of contaminants that cause yield loss.","inputs":["Wafers","Cleaning chemistries","UPW"],"outputs":["Clean wafers"],"typical_parameters":["Chemistry","Temperature","Megasonic power"],"quality_metrics":["Particle adders","Metal contamination"],"defects":["Particles","Pattern collapse","Watermarks"],"equipment_ids":["EQP-A04","EQP-A05","EQP-A06","EQP-A07","EQP-A20"],"technology_ids":["TEC-030"],"material_ids":["MAT-031","MAT-023","MAT-024","MAT-025"],"model_ids":["MDL-000155","MDL-000156","MDL-000157","MDL-000158","MDL-000159","MDL-000164","MDL-000165","MDL-000166","MDL-000167","MDL-000184","MDL-000185","MDL-000190","MDL-000191","MDL-000192","MDL-000193","MDL-000295","MDL-000296","MDL-000312","MDL-000313","MDL-000374","MDL-000375","MDL-000376","MDL-000380","MDL-000381","MDL-000382","MDL-000383","MDL-000497","MDL-000501","MDL-000518","MDL-000529","MDL-000530"],"company_ids":["CMP-000004","CMP-000007","CMP-000104","CMP-000229","CMP-000240","CMP-000242","CMP-000264","CMP-000322","CMP-000354","CMP-000080","CMP-000081","CMP-000254","CMP-000337","CMP-000265","CMP-000298","CMP-000003","CMP-000071","CMP-000216","CMP-000219","CMP-000271","CMP-000323","CMP-000358"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-011","entity_type":"process","slug":"oxidation","name":"Oxidation","stage":"FE","stage_name":"Front-end (wafer processing)","parent_id":null,"sequence":11,"flow_position":6,"legacy_process_steps":["PSX1"],"description":"Thermal growth of silicon dioxide by exposing silicon to oxygen or steam at high temperature.","purpose":"Form gate, field or masking oxides.","inputs":["Wafers","O₂ / H₂O"],"outputs":["Oxidised wafers"],"typical_parameters":["Temperature","Time","Ambient"],"quality_metrics":["Oxide thickness uniformity"],"defects":["Pinholes","Interface traps"],"equipment_ids":["EQP-A16","EQP-A11"],"technology_ids":["TEC-027"],"material_ids":["MAT-014","MAT-013","MAT-012"],"model_ids":["MDL-000168","MDL-000189","MDL-000314","MDL-000315","MDL-000370","MDL-000371","MDL-000386"],"company_ids":["CMP-000238","CMP-000004","CMP-000104","CMP-000217","CMP-000245"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-012","entity_type":"process","slug":"diffusion","name":"Diffusion","stage":"FE","stage_name":"Front-end (wafer processing)","parent_id":null,"sequence":12,"flow_position":null,"legacy_process_steps":["PSX1"],"description":"High-temperature redistribution of dopants in a furnace.","purpose":"Form junctions and wells.","inputs":["Doped wafers"],"outputs":["Diffused junctions"],"typical_parameters":["Temperature","Time"],"quality_metrics":["Sheet resistance","Junction depth"],"defects":["Dopant non-uniformity"],"equipment_ids":["EQP-A11"],"technology_ids":["TEC-027"],"material_ids":[],"model_ids":["MDL-000168","MDL-000189","MDL-000314","MDL-000315","MDL-000370","MDL-000371","MDL-000386"],"company_ids":["CMP-000004","CMP-000104","CMP-000217","CMP-000238","CMP-000245"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-013","entity_type":"process","slug":"deposition","name":"Deposition (thin films)","stage":"FE","stage_name":"Front-end (wafer processing)","parent_id":null,"sequence":13,"flow_position":7,"legacy_process_steps":["PS05"],"description":"Addition of dielectric, semiconductor or metal films by chemical (CVD, ALD) or physical (PVD) methods.","purpose":"Build the device and interconnect layer stack.","inputs":["Wafers","Precursors / targets","Process gases"],"outputs":["Wafers with deposited film"],"typical_parameters":["Temperature","Pressure","Plasma power","Precursor flow"],"quality_metrics":["Thickness uniformity","Step coverage","Film stress"],"defects":["Particles","Voids","Delamination"],"equipment_ids":["EQP-A09","EQP-A09.01","EQP-A09.02","EQP-A09.03","EQP-A09.04","EQP-A09.05","EQP-A09.06","EQP-A09.07","EQP-A09.08","EQP-A09.09","EQP-A09.10","EQP-A09.11"],"technology_ids":["TEC-015","TEC-016","TEC-017","TEC-018","TEC-019","TEC-020","TEC-021"],"material_ids":["MAT-021","MAT-032","MAT-033"],"model_ids":["MDL-000103","MDL-000104","MDL-000106","MDL-000107","MDL-000108","MDL-000113","MDL-000532","MDL-000534","MDL-000535","MDL-000539","MDL-000548","MDL-000551","MDL-000552","MDL-000171","MDL-000172","MDL-000283","MDL-000284","MDL-000285","MDL-000286","MDL-000287","MDL-000288","MDL-000307","MDL-000308","MDL-000309","MDL-000310","MDL-000316","MDL-000319","MDL-000326","MDL-000377","MDL-000378","MDL-000379","MDL-000393","MDL-000394","MDL-000410","MDL-000441","MDL-000442","MDL-000507","MDL-000508","MDL-000509","MDL-000510","MDL-000511","MDL-000512","MDL-000513","MDL-000514","MDL-000515","MDL-000517","MDL-000525"],"company_ids":["CMP-000002","CMP-000003","CMP-000004","CMP-000022","CMP-000029","CMP-000101","CMP-000214","CMP-000028","CMP-000069","CMP-000102","CMP-000218","CMP-000272","CMP-000103","CMP-000104","CMP-000217","CMP-000219","CMP-000220","CMP-000241","CMP-000265","CMP-000238","CMP-000030","CMP-000070","CMP-000213","CMP-000247","CMP-000255","CMP-000334","CMP-000336","CMP-000244","CMP-000275","CMP-000286","CMP-000287","CMP-000288","CMP-000335","CMP-000285","CMP-000006","CMP-000184","CMP-000194","CMP-000357","CMP-000283","CMP-000284"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-014","entity_type":"process","slug":"cvd","name":"Chemical vapour deposition (CVD)","stage":"FE","stage_name":"Front-end (wafer processing)","parent_id":"PRS-013","sequence":14,"flow_position":null,"legacy_process_steps":["PS05"],"description":"Film formation from gas-phase precursors reacting at or near the wafer surface, thermally or plasma-enhanced.","purpose":"Deposit conformal dielectric and conductive films.","inputs":["Precursor gases"],"outputs":["CVD film"],"typical_parameters":["Temperature","Pressure","RF power (PECVD)"],"quality_metrics":["Uniformity","Step coverage"],"defects":["Particles","Seams"],"equipment_ids":["EQP-A09.01","EQP-A09.02","EQP-A09.03","EQP-A09.04","EQP-A09.05"],"technology_ids":["TEC-015","TEC-016","TEC-017","TEC-018"],"material_ids":["MAT-021"],"model_ids":["MDL-000103","MDL-000108","MDL-000113","MDL-000532","MDL-000535","MDL-000539","MDL-000316","MDL-000319","MDL-000326","MDL-000410"],"company_ids":["CMP-000028","CMP-000069","CMP-000102","CMP-000218","CMP-000272","CMP-000002","CMP-000003","CMP-000103","CMP-000104","CMP-000217","CMP-000219","CMP-000220","CMP-000241","CMP-000265","CMP-000238"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-015","entity_type":"process","slug":"ald","name":"Atomic layer deposition (ALD)","stage":"FE","stage_name":"Front-end (wafer processing)","parent_id":"PRS-013","sequence":15,"flow_position":null,"legacy_process_steps":["PS05"],"description":"Self-limiting, sequential surface reactions that deposit films one atomic layer per cycle.","purpose":"Deposit ultra-thin, highly conformal films (high-k, liners, spacers).","inputs":["Alternating precursors"],"outputs":["ALD film"],"typical_parameters":["Cycle time","Temperature"],"quality_metrics":["Conformality","Thickness control"],"defects":["Incomplete nucleation"],"equipment_ids":["EQP-A09.06"],"technology_ids":["TEC-019"],"material_ids":["MAT-032"],"model_ids":["MDL-000104","MDL-000106","MDL-000107","MDL-000534","MDL-000551","MDL-000307","MDL-000308","MDL-000379"],"company_ids":["CMP-000002","CMP-000003","CMP-000022","CMP-000030","CMP-000069","CMP-000070","CMP-000103","CMP-000213","CMP-000214","CMP-000218","CMP-000219","CMP-000220","CMP-000241","CMP-000247","CMP-000272"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-016","entity_type":"process","slug":"pvd","name":"Physical vapour deposition (PVD)","stage":"FE","stage_name":"Front-end (wafer processing)","parent_id":"PRS-013","sequence":16,"flow_position":null,"legacy_process_steps":["PS05","PS11"],"description":"Deposition of metal or compound films by sputtering a target or evaporating a source in vacuum.","purpose":"Form barrier, seed and metal layers.","inputs":["Targets","Argon"],"outputs":["Metal / barrier film"],"typical_parameters":["Power","Pressure","Bias"],"quality_metrics":["Resistivity","Coverage"],"defects":["Overhang","Particles"],"equipment_ids":["EQP-A09.07","EQP-A09.08","EQP-A09.09"],"technology_ids":["TEC-020","TEC-021"],"material_ids":["MAT-033"],"model_ids":["MDL-000171","MDL-000172","MDL-000309","MDL-000377","MDL-000378","MDL-000393","MDL-000394","MDL-000507","MDL-000508","MDL-000509","MDL-000510","MDL-000511","MDL-000512","MDL-000513","MDL-000514","MDL-000515","MDL-000517"],"company_ids":["CMP-000002","CMP-000214","CMP-000241","CMP-000255","CMP-000334","CMP-000336","CMP-000244","CMP-000275","CMP-000286","CMP-000287","CMP-000288","CMP-000335","CMP-000285"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-017","entity_type":"process","slug":"resist-coat","name":"Photoresist coat & bake","stage":"FE","stage_name":"Front-end (wafer processing)","parent_id":null,"sequence":17,"flow_position":8,"legacy_process_steps":["PS03"],"description":"Spin-coating of photoresist and associated bake steps on a coater/developer track linked to the scanner.","purpose":"Apply a uniform radiation-sensitive film for patterning.","inputs":["Wafers","Photoresist","Adhesion promoters"],"outputs":["Resist-coated wafers"],"typical_parameters":["Spin speed","Bake temperature"],"quality_metrics":["Resist thickness uniformity"],"defects":["Comets","Edge bead"],"equipment_ids":["EQP-A02","EQP-A03"],"technology_ids":[],"material_ids":["MAT-029","MAT-025"],"model_ids":["MDL-000160","MDL-000161","MDL-000186","MDL-000187","MDL-000188","MDL-000369","MDL-000419","MDL-000420"],"company_ids":["CMP-000004","CMP-000106","CMP-000237","CMP-000273","CMP-000007","CMP-000104"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-018","entity_type":"process","slug":"lithography","name":"Lithography (exposure)","stage":"FE","stage_name":"Front-end (wafer processing)","parent_id":null,"sequence":18,"flow_position":9,"legacy_process_steps":["PS02"],"description":"Transfer of the mask (reticle) pattern into the resist by projection exposure (EUV, DUV/ArF, KrF, i-line), direct write (e-beam, laser) or nanoimprint.","purpose":"Define circuit patterns at the required resolution and overlay.","inputs":["Resist-coated wafers","Reticle"],"outputs":["Exposed wafers (latent image)"],"typical_parameters":["Wavelength","Numerical aperture","Dose","Focus"],"quality_metrics":["Critical dimension (CD)","Overlay","Throughput (wafers/hour)"],"defects":["CD variation","Overlay error","Stochastic defects"],"equipment_ids":["EQP-A01","EQP-A01.01","EQP-A01.02","EQP-A01.03","EQP-A01.04","EQP-A01.05","EQP-A01.06","EQP-A01.07","EQP-A01.08"],"technology_ids":["TEC-001","TEC-002","TEC-003","TEC-004","TEC-005","TEC-006","TEC-007","TEC-008"],"material_ids":["MAT-029","MAT-017"],"model_ids":["MDL-000093","MDL-000094","MDL-000095","MDL-000096","MDL-000097","MDL-000098","MDL-000099","MDL-000102","MDL-000110","MDL-000120","MDL-000121","MDL-000541","MDL-000542","MDL-000543","MDL-000163","MDL-000238","MDL-000239","MDL-000264","MDL-000299","MDL-000300","MDL-000301","MDL-000302","MDL-000303","MDL-000304","MDL-000305","MDL-000306","MDL-000352","MDL-000353","MDL-000362","MDL-000363","MDL-000388","MDL-000389"],"company_ids":["CMP-000016","CMP-000108","CMP-000111","CMP-000181","CMP-000208","CMP-000259","CMP-000360","CMP-000001","CMP-000027","CMP-000182","CMP-000020","CMP-000032","CMP-000107","CMP-000110","CMP-000013","CMP-000231","CMP-000209","CMP-000210","CMP-000234","CMP-000051","CMP-000212","CMP-000224","CMP-000252","CMP-000007","CMP-000211","CMP-000251"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-019","entity_type":"process","slug":"develop","name":"Develop","stage":"FE","stage_name":"Front-end (wafer processing)","parent_id":null,"sequence":19,"flow_position":10,"legacy_process_steps":["PS03"],"description":"Post-exposure bake and dissolution of exposed (or unexposed) resist.","purpose":"Reveal the resist pattern.","inputs":["Exposed wafers","Developer"],"outputs":["Patterned resist"],"typical_parameters":["Develop time","PEB temperature"],"quality_metrics":["CD uniformity"],"defects":["Scumming","Pattern collapse"],"equipment_ids":["EQP-A02","EQP-A03"],"technology_ids":[],"material_ids":["MAT-026"],"model_ids":["MDL-000160","MDL-000161","MDL-000186","MDL-000187","MDL-000188","MDL-000369","MDL-000419","MDL-000420"],"company_ids":["CMP-000004","CMP-000106","CMP-000237","CMP-000273","CMP-000007","CMP-000104"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-020","entity_type":"process","slug":"etch","name":"Etch","stage":"FE","stage_name":"Front-end (wafer processing)","parent_id":null,"sequence":20,"flow_position":11,"legacy_process_steps":["PS04"],"description":"Selective removal of material through the resist mask, by plasma (dry) or chemical (wet) etching.","purpose":"Transfer the pattern into the underlying film or substrate.","inputs":["Patterned wafers","Etch gases / chemicals"],"outputs":["Etched features"],"typical_parameters":["RF power","Pressure","Gas chemistry","Temperature"],"quality_metrics":["Etch rate","Selectivity","Profile / CD","Uniformity"],"defects":["Micro-loading","Notching","Residues"],"equipment_ids":["EQP-A08","EQP-A08.01","EQP-A08.02","EQP-A08.03","EQP-A08.04","EQP-A08.05","EQP-A08.06"],"technology_ids":["TEC-009","TEC-010","TEC-011","TEC-012","TEC-013"],"material_ids":["MAT-019","MAT-020","MAT-028"],"model_ids":["MDL-000105","MDL-000536","MDL-000537","MDL-000538","MDL-000549","MDL-000550","MDL-000229","MDL-000320","MDL-000321","MDL-000322","MDL-000323","MDL-000324","MDL-000327","MDL-000385","MDL-000498","MDL-000499","MDL-000500","MDL-000516"],"company_ids":["CMP-000002","CMP-000003","CMP-000004","CMP-000029","CMP-000054","CMP-000101","CMP-000102","CMP-000248","CMP-000335","CMP-000244","CMP-000220","CMP-000219","CMP-000323","CMP-000005","CMP-000229","CMP-000354"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-021","entity_type":"process","slug":"ash-strip","name":"Ash / resist strip","stage":"FE","stage_name":"Front-end (wafer processing)","parent_id":null,"sequence":21,"flow_position":12,"legacy_process_steps":["PS07","PS04"],"description":"Removal of residual photoresist by oxygen plasma (ashing) or wet strippers.","purpose":"Clear resist after etch or implant.","inputs":["Wafers with resist"],"outputs":["Resist-free wafers"],"typical_parameters":["Plasma power","Temperature"],"quality_metrics":["Residue-free surface"],"defects":["Residues","Substrate damage"],"equipment_ids":["EQP-A07","EQP-A05"],"technology_ids":[],"material_ids":["MAT-014","MAT-027"],"model_ids":["MDL-000159","MDL-000184","MDL-000185","MDL-000312","MDL-000313","MDL-000374","MDL-000375","MDL-000376","MDL-000380","MDL-000381","MDL-000382","MDL-000383","MDL-000497","MDL-000501","MDL-000518","MDL-000529","MDL-000530"],"company_ids":["CMP-000003","CMP-000071","CMP-000216","CMP-000219","CMP-000271","CMP-000323","CMP-000358","CMP-000007","CMP-000080","CMP-000081","CMP-000240","CMP-000242","CMP-000254","CMP-000322","CMP-000337","CMP-000354"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-022","entity_type":"process","slug":"ion-implant","name":"Ion implantation","stage":"FE","stage_name":"Front-end (wafer processing)","parent_id":null,"sequence":22,"flow_position":13,"legacy_process_steps":["PS06"],"description":"Acceleration of dopant ions into the wafer at controlled energy and dose.","purpose":"Introduce dopants to form wells, sources/drains and junctions.","inputs":["Masked wafers","Dopant source"],"outputs":["Implanted wafers"],"typical_parameters":["Energy","Dose","Tilt / twist"],"quality_metrics":["Dose uniformity","Channelling control"],"defects":["Lattice damage","Contamination"],"equipment_ids":["EQP-A10","EQP-F04"],"technology_ids":["TEC-026"],"material_ids":["MAT-022"],"model_ids":["MDL-000175","MDL-000176","MDL-000177","MDL-000178","MDL-000179","MDL-000180","MDL-000181","MDL-000182","MDL-000384","MDL-000520"],"company_ids":["CMP-000002","CMP-000015","CMP-000243","CMP-000338"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-023","entity_type":"process","slug":"anneal","name":"Annealing / RTP","stage":"FE","stage_name":"Front-end (wafer processing)","parent_id":null,"sequence":23,"flow_position":14,"legacy_process_steps":["PSX1"],"description":"Thermal treatment to activate dopants and repair damage, in furnaces, rapid thermal processors or with laser (millisecond/nanosecond) annealing.","purpose":"Activate dopants and control diffusion within a thermal budget.","inputs":["Implanted wafers"],"outputs":["Activated wafers"],"typical_parameters":["Peak temperature","Ramp rate","Dwell time"],"quality_metrics":["Sheet resistance","Junction depth"],"defects":["Slip","Pattern-dependent heating"],"equipment_ids":["EQP-A12","EQP-A13","EQP-A14","EQP-F05"],"technology_ids":["TEC-028","TEC-027","TEC-067"],"material_ids":["MAT-012"],"model_ids":["MDL-000024","MDL-000028","MDL-000029","MDL-000046","MDL-000056","MDL-000057","MDL-000058","MDL-000059","MDL-000060","MDL-000061","MDL-000064","MDL-000065","MDL-000553","MDL-000162","MDL-000317","MDL-000318","MDL-000527","MDL-000528"],"company_ids":["CMP-000218","CMP-000358","CMP-000007","CMP-000014","CMP-000022","CMP-000245","CMP-000077","CMP-000119","CMP-000141","CMP-000174","CMP-000175","CMP-000177"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-024","entity_type":"process","slug":"cmp","name":"Chemical mechanical planarisation (CMP)","stage":"FE","stage_name":"Front-end (wafer processing)","parent_id":null,"sequence":24,"flow_position":15,"legacy_process_steps":["PS10"],"description":"Combined chemical and mechanical polishing to planarise dielectric and metal layers.","purpose":"Provide planar surfaces for subsequent lithography and remove overburden.","inputs":["Wafers","Slurry","Pads"],"outputs":["Planarised wafers"],"typical_parameters":["Down force","Platen speed","Slurry chemistry"],"quality_metrics":["Within-wafer non-uniformity","Dishing / erosion"],"defects":["Scratches","Dishing","Slurry residue"],"equipment_ids":["EQP-A19"],"technology_ids":["TEC-029"],"material_ids":["MAT-034","MAT-035","MAT-036"],"model_ids":["MDL-000173","MDL-000174","MDL-000197","MDL-000198","MDL-000279","MDL-000366","MDL-000461","MDL-000462"],"company_ids":["CMP-000002","CMP-000023","CMP-000105","CMP-000203","CMP-000235","CMP-000236","CMP-000264","CMP-000302","CMP-000315"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-025","entity_type":"process","slug":"metallization","name":"Metallisation & plating","stage":"FE","stage_name":"Front-end (wafer processing)","parent_id":null,"sequence":25,"flow_position":16,"legacy_process_steps":["PS11"],"description":"Formation of interconnect metal, typically barrier/seed by PVD then copper electroplating (damascene).","purpose":"Build the multilevel wiring.","inputs":["Patterned dielectric","Plating chemistry"],"outputs":["Metal interconnect"],"typical_parameters":["Current density","Additive concentration"],"quality_metrics":["Void-free fill","Resistivity"],"defects":["Voids","Electromigration weak spots"],"equipment_ids":["EQP-A17","EQP-A18"],"technology_ids":["TEC-025","TEC-020"],"material_ids":["MAT-030","MAT-033"],"model_ids":["MDL-000533","MDL-000169","MDL-000170","MDL-000183"],"company_ids":["CMP-000003","CMP-000104","CMP-000254","CMP-000337"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-026","entity_type":"process","slug":"metrology","name":"Metrology","stage":"FE","stage_name":"Front-end (wafer processing)","parent_id":null,"sequence":26,"flow_position":17,"legacy_process_steps":["PS08"],"description":"Measurement of film thickness, critical dimensions, overlay and surface properties.","purpose":"Monitor and control process steps.","inputs":["Wafers"],"outputs":["Measurement data for process control"],"typical_parameters":["Precision","Accuracy","Throughput"],"quality_metrics":["Measurement uncertainty"],"defects":[],"equipment_ids":["EQP-A25","EQP-A26","EQP-A27","EQP-A28","EQP-A29","EQP-A30"],"technology_ids":["TEC-034","TEC-035","TEC-036"],"material_ids":[],"model_ids":["MDL-000111","MDL-000112","MDL-000119","MDL-000222","MDL-000232","MDL-000233","MDL-000234","MDL-000243","MDL-000401","MDL-000402","MDL-000403","MDL-000404","MDL-000523","MDL-000524"],"company_ids":["CMP-000005","CMP-000016","CMP-000017","CMP-000019","CMP-000031","CMP-000180","CMP-000250","CMP-000258","CMP-000261","CMP-000299","CMP-000341","CMP-000021","CMP-000220","CMP-000018"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-027","entity_type":"process","slug":"inspection","name":"Defect inspection & review","stage":"FE","stage_name":"Front-end (wafer processing)","parent_id":null,"sequence":27,"flow_position":18,"legacy_process_steps":["PS09"],"description":"Detection, classification and review of defects on patterned and unpatterned wafers (optical, e-beam).","purpose":"Find yield-limiting defects early.","inputs":["Wafers"],"outputs":["Defect maps"],"typical_parameters":["Sensitivity","Throughput"],"quality_metrics":["Capture rate","Nuisance rate"],"defects":[],"equipment_ids":["EQP-A21","EQP-A22","EQP-A23","EQP-A24","EQP-A31"],"technology_ids":["TEC-031","TEC-032"],"material_ids":[],"model_ids":["MDL-000051","MDL-000540","MDL-000544","MDL-000545","MDL-000546","MDL-000547","MDL-000220","MDL-000221","MDL-000223","MDL-000228","MDL-000230","MDL-000231","MDL-000235","MDL-000236","MDL-000240","MDL-000241","MDL-000242","MDL-000244","MDL-000397","MDL-000398","MDL-000405","MDL-000452","MDL-000521","MDL-000522"],"company_ids":["CMP-000005","CMP-000016","CMP-000018","CMP-000262","CMP-000299","CMP-000021","CMP-000257","CMP-000041","CMP-000078","CMP-000083","CMP-000087","CMP-000088","CMP-000001","CMP-000002","CMP-000249","CMP-000324","CMP-000325"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-028","entity_type":"process","slug":"mask-making","name":"Mask / reticle making","stage":"FE","stage_name":"Front-end (wafer processing)","parent_id":null,"sequence":28,"flow_position":null,"legacy_process_steps":["PSX3"],"description":"Writing, inspecting, repairing and qualifying photomasks and reticles.","purpose":"Produce defect-free masks for lithography.","inputs":["Mask blanks"],"outputs":["Qualified reticles"],"typical_parameters":["Write resolution","Placement accuracy"],"quality_metrics":["CD uniformity","Registration"],"defects":["Mask defects","Contamination"],"equipment_ids":["EQP-B","EQP-B01","EQP-B02","EQP-B03","EQP-B04","EQP-B05","EQP-B06","EQP-B07","EQP-B08","EQP-B09","EQP-B10"],"technology_ids":["TEC-006","TEC-008"],"material_ids":[],"model_ids":["MDL-000100","MDL-000101","MDL-000554","MDL-000555","MDL-000249","MDL-000250","MDL-000251","MDL-000252","MDL-000253","MDL-000254","MDL-000255","MDL-000364","MDL-000365","MDL-000445","MDL-000474","MDL-000475","MDL-000476","MDL-000477"],"company_ids":["CMP-000024","CMP-000292","CMP-000290","CMP-000291","CMP-000025","CMP-000234","CMP-000309","CMP-000026","CMP-000027"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-029","entity_type":"process","slug":"wafer-test","name":"Wafer probe & electrical test","stage":"TS","stage_name":"Wafer test","parent_id":null,"sequence":29,"flow_position":19,"legacy_process_steps":["PS12"],"description":"Electrical testing of each die on the wafer using a prober, probe card and automated test equipment.","purpose":"Identify good dies before assembly (known-good die).","inputs":["Processed wafers","Probe cards","Test programs"],"outputs":["Wafer maps / bin data"],"typical_parameters":["Test time","Parallelism","Temperature"],"quality_metrics":["Test coverage","Yield"],"defects":["Probe marks","Contact failures"],"equipment_ids":["EQP-A32","EQP-A33"],"technology_ids":["TEC-056"],"material_ids":[],"model_ids":["MDL-000092","MDL-000390","MDL-000391","MDL-000466","MDL-000467","MDL-000468"],"company_ids":["CMP-000008","CMP-000253","CMP-000260","CMP-000033","CMP-000034","CMP-000035","CMP-000036","CMP-000038","CMP-000304","CMP-000305","CMP-000306"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-030","entity_type":"process","slug":"wafer-thinning","name":"Back-grinding / wafer thinning","stage":"BE","stage_name":"Back-end (assembly & packaging)","parent_id":null,"sequence":30,"flow_position":20,"legacy_process_steps":["PSX2"],"description":"Grinding and stress-relief polishing of the wafer backside to the target thickness.","purpose":"Reduce package height and enable stacking.","inputs":["Probed wafers","Back-grinding tape"],"outputs":["Thinned wafers"],"typical_parameters":["Final thickness","Wheel grit"],"quality_metrics":["Thickness variation","Die strength"],"defects":["Cracks","Warpage"],"equipment_ids":["EQP-C02","EQP-C03","EQP-C04","EQP-C05"],"technology_ids":[],"material_ids":["MAT-047"],"model_ids":["MDL-000201","MDL-000202","MDL-000203","MDL-000204","MDL-000207","MDL-000208","MDL-000209","MDL-000212","MDL-000280","MDL-000367"],"company_ids":["CMP-000012","CMP-000235","CMP-000010","CMP-000059","CMP-000203","CMP-000105","CMP-000116"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-031","entity_type":"process","slug":"wafer-mount","name":"Wafer mounting","stage":"BE","stage_name":"Back-end (assembly & packaging)","parent_id":null,"sequence":31,"flow_position":null,"legacy_process_steps":["PS13"],"description":"Laminating the wafer onto dicing tape on a frame.","purpose":"Hold dies in place during and after dicing.","inputs":["Thinned wafers","Dicing tape","Frames"],"outputs":["Framed wafers"],"typical_parameters":["Lamination temperature"],"quality_metrics":["Void-free mounting"],"defects":["Air bubbles"],"equipment_ids":["EQP-C06","EQP-C07"],"technology_ids":[],"material_ids":["MAT-046"],"model_ids":["MDL-000205","MDL-000206","MDL-000348","MDL-000349","MDL-000350","MDL-000351"],"company_ids":["CMP-000010","CMP-000230"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-032","entity_type":"process","slug":"dicing","name":"Dicing","stage":"BE","stage_name":"Back-end (assembly & packaging)","parent_id":null,"sequence":32,"flow_position":21,"legacy_process_steps":["PS13"],"description":"Separation of the wafer into individual dies by blade sawing, laser ablation, stealth (internal) laser modification or plasma etching.","purpose":"Singulate dies with minimal chipping and kerf.","inputs":["Mounted wafers"],"outputs":["Singulated dies on tape"],"typical_parameters":["Kerf width","Feed speed","Laser wavelength / pulse (laser dicing)"],"quality_metrics":["Chipping","Die strength","Throughput"],"defects":["Chipping","Cracks","Debris"],"equipment_ids":["EQP-C01","EQP-C01.01","EQP-C01.02","EQP-C01.03","EQP-C01.04","EQP-C01.05","EQP-E10","EQP-F07"],"technology_ids":["TEC-037","TEC-060","TEC-061","TEC-014","TEC-038","TEC-064"],"material_ids":["MAT-001","MAT-003","MAT-004","MAT-005","MAT-010"],"model_ids":["MDL-000001","MDL-000002","MDL-000006","MDL-000007","MDL-000008","MDL-000009","MDL-000010","MDL-000011","MDL-000012","MDL-000013","MDL-000014","MDL-000015","MDL-000016","MDL-000017","MDL-000018","MDL-000019","MDL-000020","MDL-000021","MDL-000027","MDL-000030","MDL-000031","MDL-000032","MDL-000033","MDL-000041","MDL-000042","MDL-000044","MDL-000049","MDL-000073","MDL-000074","MDL-000075","MDL-000089","MDL-000118","MDL-000503"],"company_ids":["CMP-000010","CMP-000012","CMP-000053","CMP-000045","CMP-000077","CMP-000118","CMP-000119","CMP-000121","CMP-000141","CMP-000142","CMP-000195","CMP-000327","CMP-000011","CMP-000117","CMP-000005","CMP-000054","CMP-000055","CMP-000271","CMP-000232"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-033","entity_type":"process","slug":"die-attach","name":"Die attach","stage":"BE","stage_name":"Back-end (assembly & packaging)","parent_id":null,"sequence":33,"flow_position":22,"legacy_process_steps":["PS15"],"description":"Pick-and-place of dies onto a leadframe or substrate using adhesive, solder or sinter materials.","purpose":"Mechanically and thermally attach the die.","inputs":["Singulated dies","Leadframes / substrates","Die-attach material"],"outputs":["Attached dies"],"typical_parameters":["Placement accuracy","Bond force","Cure profile"],"quality_metrics":["Placement accuracy","Void content"],"defects":["Voids","Die tilt"],"equipment_ids":["EQP-C08","EQP-C09","EQP-C10","EQP-E11"],"technology_ids":["TEC-039"],"material_ids":["MAT-043","MAT-039","MAT-037"],"model_ids":["MDL-000083","MDL-000330","MDL-000333","MDL-000431","MDL-000432","MDL-000433","MDL-000434","MDL-000435","MDL-000436","MDL-000489","MDL-000490","MDL-000491"],"company_ids":["CMP-000268","CMP-000279","CMP-000280","CMP-000328","CMP-000026","CMP-000043","CMP-000044","CMP-000046","CMP-000050","CMP-000222","CMP-000223","CMP-000246","CMP-000253","CMP-000319"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-034","entity_type":"process","slug":"wire-bond","name":"Wire bonding","stage":"BE","stage_name":"Back-end (assembly & packaging)","parent_id":null,"sequence":34,"flow_position":23,"legacy_process_steps":["PS15"],"description":"Connection of die pads to package leads with fine gold, copper or aluminium wire (ball or wedge bonding).","purpose":"Provide electrical interconnect.","inputs":["Attached dies","Bond wire"],"outputs":["Wire-bonded assemblies"],"typical_parameters":["Ultrasonic power","Bond force","Temperature"],"quality_metrics":["Pull / shear strength"],"defects":["Non-stick","Wire sweep"],"equipment_ids":["EQP-C12","EQP-C13","EQP-C14","EQP-C15","EQP-E12"],"technology_ids":["TEC-040"],"material_ids":["MAT-044"],"model_ids":["MDL-000087","MDL-000422","MDL-000423","MDL-000424","MDL-000425","MDL-000426","MDL-000427","MDL-000428","MDL-000429","MDL-000430","MDL-000484","MDL-000485","MDL-000486","MDL-000487"],"company_ids":["CMP-000046","CMP-000050","CMP-000222","CMP-000276","CMP-000277","CMP-000278","CMP-000318","CMP-000319"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-035","entity_type":"process","slug":"flip-chip","name":"Flip-chip bonding","stage":"BE","stage_name":"Back-end (assembly & packaging)","parent_id":null,"sequence":35,"flow_position":null,"legacy_process_steps":["PS15"],"description":"Face-down attachment of bumped dies to a substrate by mass reflow or thermo-compression bonding.","purpose":"Area-array interconnect with short electrical paths.","inputs":["Bumped dies","Substrates"],"outputs":["Flip-chip assemblies"],"typical_parameters":["Bond force","Temperature profile","Alignment accuracy"],"quality_metrics":["Joint yield","Alignment"],"defects":["Non-wet","Bridging","Cracks"],"equipment_ids":["EQP-C11","EQP-E13","EQP-C16","EQP-C19"],"technology_ids":["TEC-041","TEC-042"],"material_ids":["MAT-045","MAT-042","MAT-037"],"model_ids":["MDL-000054","MDL-000055","MDL-000079","MDL-000080","MDL-000084","MDL-000088","MDL-000331","MDL-000332","MDL-000334","MDL-000335","MDL-000347","MDL-000358","MDL-000359","MDL-000437","MDL-000505","MDL-000506"],"company_ids":["CMP-000026","CMP-000050","CMP-000077","CMP-000223","CMP-000224","CMP-000229","CMP-000233","CMP-000280","CMP-000043","CMP-000044","CMP-000046","CMP-000047","CMP-000048","CMP-000067","CMP-000056","CMP-000057","CMP-000058"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-036","entity_type":"process","slug":"molding","name":"Molding / encapsulation","stage":"BE","stage_name":"Back-end (assembly & packaging)","parent_id":null,"sequence":36,"flow_position":24,"legacy_process_steps":["PS14"],"description":"Encapsulation of assemblies with epoxy molding compound (transfer or compression molding) and dispensing of underfill.","purpose":"Protect the die and interconnect.","inputs":["Assemblies","Molding compound"],"outputs":["Molded strips / panels"],"typical_parameters":["Mold temperature","Pressure","Cure time"],"quality_metrics":["Void-free fill","Warpage"],"defects":["Voids","Wire sweep","Incomplete fill"],"equipment_ids":["EQP-C20","EQP-C21","EQP-C22","EQP-C23","EQP-C24","EQP-C25","EQP-E14"],"technology_ids":["TEC-045"],"material_ids":["MAT-041","MAT-042"],"model_ids":["MDL-000085","MDL-000438","MDL-000481","MDL-000482","MDL-000483"],"company_ids":["CMP-000049","CMP-000050","CMP-000281","CMP-000316","CMP-000082","CMP-000317"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-037","entity_type":"process","slug":"plating-be","name":"Lead plating & finishing","stage":"BE","stage_name":"Back-end (assembly & packaging)","parent_id":null,"sequence":37,"flow_position":null,"legacy_process_steps":["PS14"],"description":"Plating of external leads for solderability.","purpose":"Ensure board-level solderability.","inputs":["Molded packages"],"outputs":["Plated leads"],"typical_parameters":["Plating thickness"],"quality_metrics":["Solderability"],"defects":["Whiskers"],"equipment_ids":[],"technology_ids":[],"material_ids":["MAT-030"],"model_ids":[],"company_ids":[],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-038","entity_type":"process","slug":"marking","name":"Marking","stage":"BE","stage_name":"Back-end (assembly & packaging)","parent_id":null,"sequence":38,"flow_position":25,"legacy_process_steps":["PS14"],"description":"Laser (or ink) marking of packages, strips or wafers with identifiers.","purpose":"Provide traceability and product identification.","inputs":["Packages / wafers"],"outputs":["Marked units"],"typical_parameters":["Laser wavelength","Mark depth","Contrast"],"quality_metrics":["Readability","Mark depth"],"defects":["Burn-through","Low contrast"],"equipment_ids":["EQP-C26","EQP-C27","EQP-E09"],"technology_ids":["TEC-059"],"material_ids":[],"model_ids":["MDL-000022","MDL-000023","MDL-000037","MDL-000038","MDL-000039","MDL-000421"],"company_ids":["CMP-000077","CMP-000119","CMP-000144","CMP-000165","CMP-000191","CMP-000271","CMP-000274","CMP-000330","CMP-000332"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-039","entity_type":"process","slug":"singulation","name":"Package singulation","stage":"BE","stage_name":"Back-end (assembly & packaging)","parent_id":null,"sequence":39,"flow_position":null,"legacy_process_steps":["PS14"],"description":"Sawing, punching or laser cutting of molded strips into individual packages.","purpose":"Separate finished packages.","inputs":["Molded strips"],"outputs":["Individual packages"],"typical_parameters":["Cut speed","Kerf"],"quality_metrics":["Dimensional accuracy","Burr"],"defects":["Burr","Delamination"],"equipment_ids":["EQP-C32","EQP-C29","EQP-C30"],"technology_ids":["TEC-065","TEC-037"],"material_ids":[],"model_ids":["MDL-000086","MDL-000339","MDL-000356","MDL-000357"],"company_ids":["CMP-000049","CMP-000078","CMP-000232","CMP-000142","CMP-000226","CMP-000045"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-040","entity_type":"process","slug":"package-inspection","name":"Package inspection","stage":"BE","stage_name":"Back-end (assembly & packaging)","parent_id":null,"sequence":40,"flow_position":26,"legacy_process_steps":["PS16"],"description":"Automated optical and X-ray inspection of packages for mechanical and internal defects.","purpose":"Screen out assembly defects.","inputs":["Packages"],"outputs":["Inspection results"],"typical_parameters":["Resolution","Throughput"],"quality_metrics":["Escape rate"],"defects":[],"equipment_ids":["EQP-C34","EQP-C35","EQP-C36","EQP-E06"],"technology_ids":["TEC-031","TEC-033"],"material_ids":[],"model_ids":["MDL-000224","MDL-000225","MDL-000226","MDL-000227","MDL-000237","MDL-000245","MDL-000246","MDL-000247","MDL-000248","MDL-000361","MDL-000399","MDL-000400"],"company_ids":["CMP-000005","CMP-000041","CMP-000328","CMP-000206","CMP-000258","CMP-000327","CMP-000016","CMP-000233","CMP-000268","CMP-000329"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-041","entity_type":"process","slug":"final-test","name":"Final / package test","stage":"BE","stage_name":"Back-end (assembly & packaging)","parent_id":null,"sequence":41,"flow_position":27,"legacy_process_steps":["PS16"],"description":"Electrical test of packaged devices with ATE and handlers, across temperature where required.","purpose":"Guarantee shipped-product quality and bin by performance.","inputs":["Packaged devices","Test programs"],"outputs":["Tested, binned devices"],"typical_parameters":["Test time","Parallelism","Temperature"],"quality_metrics":["Test coverage","Yield"],"defects":["Contact failures"],"equipment_ids":["EQP-C37","EQP-C39","EQP-C40","EQP-C41","EQP-C42","EQP-E02","EQP-E07","EQP-E08"],"technology_ids":["TEC-056"],"material_ids":[],"model_ids":["MDL-000213","MDL-000214","MDL-000215","MDL-000216","MDL-000217","MDL-000218","MDL-000219","MDL-000256","MDL-000257","MDL-000258","MDL-000259","MDL-000260","MDL-000261","MDL-000262","MDL-000263","MDL-000406","MDL-000407","MDL-000408","MDL-000411","MDL-000412","MDL-000414","MDL-000415","MDL-000416","MDL-000417","MDL-000418","MDL-000440","MDL-000463","MDL-000464","MDL-000465"],"company_ids":["CMP-000269","CMP-000036","CMP-000038","CMP-000039","CMP-000266","CMP-000268","CMP-000303","CMP-000329","CMP-000330","CMP-000008","CMP-000009","CMP-000037","CMP-000263","CMP-000267","CMP-000270","CMP-000282"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-042","entity_type":"process","slug":"burn-in","name":"Burn-in & reliability","stage":"BE","stage_name":"Back-end (assembly & packaging)","parent_id":null,"sequence":42,"flow_position":null,"legacy_process_steps":["PS16"],"description":"Stressing devices at elevated voltage and temperature to screen early-life failures.","purpose":"Remove infant-mortality failures.","inputs":["Tested devices"],"outputs":["Screened devices"],"typical_parameters":["Temperature","Voltage","Duration"],"quality_metrics":["Early failure rate"],"defects":[],"equipment_ids":["EQP-C38","EQP-E04","EQP-E05"],"technology_ids":["TEC-057"],"material_ids":[],"model_ids":["MDL-000090","MDL-000091","MDL-000409","MDL-000413"],"company_ids":["CMP-000040","CMP-000263","CMP-000266","CMP-000267","CMP-000269"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-043","entity_type":"process","slug":"tsv","name":"Through-silicon via (TSV)","stage":"AP","stage_name":"Advanced packaging","parent_id":null,"sequence":43,"flow_position":null,"legacy_process_steps":["PSX5"],"description":"Vertical vias etched through silicon, lined, filled with metal and revealed from the backside.","purpose":"Vertical interconnect for 3D stacks and interposers.","inputs":["Device wafers"],"outputs":["Wafers with TSVs"],"typical_parameters":["Via aspect ratio"],"quality_metrics":["Void-free fill"],"defects":["Voids","Cu pumping"],"equipment_ids":["EQP-D13","EQP-A08.05","EQP-A18"],"technology_ids":["TEC-053","TEC-012","TEC-025"],"material_ids":[],"model_ids":["MDL-000169","MDL-000170","MDL-000183","MDL-000229","MDL-000500"],"company_ids":["CMP-000299","CMP-000005","CMP-000219","CMP-000323","CMP-000003","CMP-000104","CMP-000254","CMP-000337"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-044","entity_type":"process","slug":"tgv","name":"Through-glass via (TGV) & glass core","stage":"AP","stage_name":"Advanced packaging","parent_id":null,"sequence":44,"flow_position":null,"legacy_process_steps":["PSX5"],"description":"Formation of vias in glass substrates or interposers, commonly by laser modification followed by wet etching, or by laser drilling.","purpose":"Enable glass-core substrates and glass interposers.","inputs":["Glass panels / wafers"],"outputs":["Via-patterned glass"],"typical_parameters":["Via diameter","Taper"],"quality_metrics":["Via geometry","Crack-free glass"],"defects":["Micro-cracks"],"equipment_ids":["EQP-D14","EQP-D18","EQP-C28"],"technology_ids":["TEC-054","TEC-063"],"material_ids":["MAT-010"],"model_ids":["MDL-000034","MDL-000035","MDL-000043","MDL-000048","MDL-000050","MDL-000070","MDL-000071","MDL-000072","MDL-000502"],"company_ids":["CMP-000078","CMP-000119","CMP-000120","CMP-000143","CMP-000032","CMP-000077","CMP-000148","CMP-000271"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-045","entity_type":"process","slug":"rdl","name":"Redistribution layer (RDL)","stage":"AP","stage_name":"Advanced packaging","parent_id":null,"sequence":45,"flow_position":null,"legacy_process_steps":["PSX5"],"description":"Thin-film wiring layers (polymer dielectric + plated copper) that re-route die I/O.","purpose":"Fan in/out interconnect at wafer or panel level.","inputs":["Wafers / reconstituted panels"],"outputs":["RDL layers"],"typical_parameters":["Line/space"],"quality_metrics":["Line/space","Via yield"],"defects":["Opens","Shorts"],"equipment_ids":["EQP-D15","EQP-A18","EQP-A01.05","EQP-A01.08"],"technology_ids":["TEC-055"],"material_ids":[],"model_ids":["MDL-000163","MDL-000169","MDL-000170","MDL-000183","MDL-000264","MDL-000302","MDL-000303","MDL-000304","MDL-000352","MDL-000353","MDL-000355","MDL-000388","MDL-000389"],"company_ids":["CMP-000231","CMP-000003","CMP-000104","CMP-000254","CMP-000337","CMP-000013","CMP-000007","CMP-000209","CMP-000211","CMP-000251"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-046","entity_type":"process","slug":"wlp","name":"Wafer-level packaging (fan-in)","stage":"AP","stage_name":"Advanced packaging","parent_id":null,"sequence":46,"flow_position":null,"legacy_process_steps":["PSX5"],"description":"Packaging performed on the whole wafer before singulation, with I/O within the die footprint.","purpose":"Chip-scale packages with minimal footprint.","inputs":["Device wafers"],"outputs":["WLCSP"],"typical_parameters":[],"quality_metrics":[],"defects":[],"equipment_ids":["EQP-D08","EQP-D20","EQP-A18","EQP-A01.05"],"technology_ids":["TEC-046"],"material_ids":[],"model_ids":["MDL-000561","MDL-000169","MDL-000170","MDL-000183","MDL-000264","MDL-000328","MDL-000329","MDL-000352","MDL-000353"],"company_ids":["CMP-000221","CMP-000003","CMP-000104","CMP-000254","CMP-000337","CMP-000013","CMP-000231"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-047","entity_type":"process","slug":"fan-out","name":"Fan-out wafer/panel-level packaging","stage":"AP","stage_name":"Advanced packaging","parent_id":null,"sequence":47,"flow_position":null,"legacy_process_steps":["PSX5"],"description":"Dies embedded in a reconstituted wafer or panel with RDL extending beyond the die edge.","purpose":"Higher I/O density without a substrate.","inputs":["Known-good dies","Carrier","Mold compound"],"outputs":["Fan-out packages"],"typical_parameters":["Die shift","Warpage"],"quality_metrics":["Die placement accuracy"],"defects":["Die shift","Warpage"],"equipment_ids":["EQP-D05","EQP-D06","EQP-D07","EQP-D10","EQP-C20","EQP-A18","EQP-A01.05","EQP-A01.08"],"technology_ids":["TEC-047","TEC-048"],"material_ids":[],"model_ids":["MDL-000085","MDL-000163","MDL-000169","MDL-000170","MDL-000183","MDL-000264","MDL-000302","MDL-000303","MDL-000304","MDL-000344","MDL-000352","MDL-000353","MDL-000388","MDL-000389"],"company_ids":["CMP-000221","CMP-000229","CMP-000049","CMP-000050","CMP-000003","CMP-000104","CMP-000254","CMP-000337","CMP-000013","CMP-000231","CMP-000007","CMP-000209","CMP-000211","CMP-000251"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-048","entity_type":"process","slug":"interposer-25d","name":"2.5D integration (interposer)","stage":"AP","stage_name":"Advanced packaging","parent_id":null,"sequence":48,"flow_position":null,"legacy_process_steps":["PSX5"],"description":"Side-by-side placement of dies on a silicon, organic or glass interposer or bridge.","purpose":"High-bandwidth die-to-die connectivity (e.g. logic + HBM).","inputs":["Dies","Interposer"],"outputs":["2.5D module"],"typical_parameters":["Microbump pitch"],"quality_metrics":["Interconnect yield","Warpage"],"defects":["Bump cracks"],"equipment_ids":["EQP-D01","EQP-D09","EQP-D11","EQP-D16","EQP-D17","EQP-D18"],"technology_ids":["TEC-049"],"material_ids":["MAT-001","MAT-010","MAT-037"],"model_ids":["MDL-000035","MDL-000354"],"company_ids":["CMP-000231","CMP-000143"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-049","entity_type":"process","slug":"3d-stacking","name":"3D stacking & HBM","stage":"AP","stage_name":"Advanced packaging","parent_id":null,"sequence":49,"flow_position":null,"legacy_process_steps":["PSX5"],"description":"Vertical stacking of dies (e.g. DRAM stacks for HBM) connected by TSVs and microbumps or direct/hybrid bonds.","purpose":"Increase bandwidth and density per footprint.","inputs":["Thinned dies with TSVs"],"outputs":["Die stacks"],"typical_parameters":["Bond force/temperature","Alignment"],"quality_metrics":["Stack yield","Thermal resistance"],"defects":["Misalignment","Voids"],"equipment_ids":["EQP-D02","EQP-D03","EQP-D21","EQP-D22","EQP-D23","EQP-C16","EQP-C17"],"technology_ids":["TEC-050","TEC-051","TEC-042","TEC-043"],"material_ids":[],"model_ids":["MDL-000079","MDL-000080","MDL-000081","MDL-000082","MDL-000109","MDL-000556","MDL-000557","MDL-000558","MDL-000336","MDL-000345","MDL-000505","MDL-000506"],"company_ids":["CMP-000043","CMP-000051","CMP-000044","CMP-000046","CMP-000047","CMP-000048","CMP-000067","CMP-000223","CMP-000233","CMP-000002","CMP-000103","CMP-000224","CMP-000229"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-050","entity_type":"process","slug":"chiplet","name":"Chiplet integration","stage":"AP","stage_name":"Advanced packaging","parent_id":null,"sequence":50,"flow_position":null,"legacy_process_steps":["PSX5"],"description":"Assembly of multiple smaller dies (chiplets) into one package via 2.5D/3D or advanced substrates.","purpose":"Heterogeneous integration and yield improvement.","inputs":["Chiplets"],"outputs":["Multi-die package"],"typical_parameters":[],"quality_metrics":[],"defects":[],"equipment_ids":["EQP-D04","EQP-C11","EQP-C16","EQP-C17"],"technology_ids":["TEC-052"],"material_ids":[],"model_ids":["MDL-000079","MDL-000080","MDL-000081","MDL-000082","MDL-000084","MDL-000088","MDL-000109","MDL-000331","MDL-000332","MDL-000334","MDL-000335","MDL-000336","MDL-000345","MDL-000347","MDL-000358","MDL-000359","MDL-000437","MDL-000505","MDL-000506"],"company_ids":["CMP-000026","CMP-000050","CMP-000077","CMP-000223","CMP-000224","CMP-000229","CMP-000233","CMP-000280","CMP-000043","CMP-000044","CMP-000046","CMP-000047","CMP-000048","CMP-000067","CMP-000002","CMP-000051","CMP-000103"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-051","entity_type":"process","slug":"hybrid-bond","name":"Hybrid / direct bonding","stage":"AP","stage_name":"Advanced packaging","parent_id":null,"sequence":51,"flow_position":null,"legacy_process_steps":["PSX5","PS15"],"description":"Bonding of dies or wafers through direct dielectric-dielectric and Cu-Cu contact without solder.","purpose":"Sub-10 µm pitch interconnect for 3D integration.","inputs":["Planarised, activated surfaces"],"outputs":["Bonded stacks"],"typical_parameters":["Surface roughness","Alignment accuracy","Anneal temperature"],"quality_metrics":["Bond strength","Void density"],"defects":["Voids","Particles","Misalignment"],"equipment_ids":["EQP-C17","EQP-D12","EQP-C18"],"technology_ids":["TEC-043","TEC-044"],"material_ids":[],"model_ids":["MDL-000025","MDL-000047","MDL-000076","MDL-000077","MDL-000078","MDL-000081","MDL-000082","MDL-000109","MDL-000559","MDL-000196","MDL-000336","MDL-000345","MDL-000504"],"company_ids":["CMP-000002","CMP-000043","CMP-000044","CMP-000048","CMP-000051","CMP-000103","CMP-000224","CMP-000229","CMP-000052","CMP-000004","CMP-000077","CMP-000106","CMP-000119","CMP-000326"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-052","entity_type":"process","slug":"temp-bond-debond","name":"Temporary bond / debond","stage":"AP","stage_name":"Advanced packaging","parent_id":null,"sequence":52,"flow_position":null,"legacy_process_steps":["PSX5"],"description":"Temporary attachment of thin wafers to carriers and later release (e.g. by laser debonding).","purpose":"Handle thin wafers through backside processing.","inputs":["Device wafer","Carrier","Adhesive"],"outputs":["Released thin wafer"],"typical_parameters":["Debond energy"],"quality_metrics":["Residue-free release"],"defects":["Cracks","Residue"],"equipment_ids":["EQP-C18"],"technology_ids":["TEC-044","TEC-069"],"material_ids":[],"model_ids":["MDL-000025","MDL-000047","MDL-000076","MDL-000077","MDL-000078","MDL-000196","MDL-000504"],"company_ids":["CMP-000004","CMP-000051","CMP-000052","CMP-000077","CMP-000106","CMP-000119","CMP-000326"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-053","entity_type":"process","slug":"advanced-substrate","name":"Advanced substrate & panel processing","stage":"AP","stage_name":"Advanced packaging","parent_id":null,"sequence":53,"flow_position":null,"legacy_process_steps":["PSX5"],"description":"Build-up substrate and panel-level processes: via drilling, lithography and plating on large-format panels.","purpose":"High-density substrates for large packages.","inputs":["Core panels","Build-up film"],"outputs":["Package substrates"],"typical_parameters":["Via diameter","Line/space"],"quality_metrics":["Layer registration"],"defects":["Via defects","Warpage"],"equipment_ids":["EQP-D19","EQP-C28","EQP-D14"],"technology_ids":["TEC-048","TEC-063"],"material_ids":["MAT-037","MAT-038","MAT-010"],"model_ids":["MDL-000034","MDL-000043","MDL-000048","MDL-000050","MDL-000070","MDL-000071","MDL-000072","MDL-000346","MDL-000360","MDL-000392","MDL-000502","MDL-000519"],"company_ids":["CMP-000229","CMP-000231","CMP-000233","CMP-000254","CMP-000337","CMP-000032","CMP-000077","CMP-000078","CMP-000119","CMP-000120","CMP-000143","CMP-000148","CMP-000271"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-054","entity_type":"process","slug":"laser-lift-off","name":"Laser lift-off","stage":"DS","stage_name":"Display & MicroLED","parent_id":null,"sequence":54,"flow_position":null,"legacy_process_steps":["PSX6"],"description":"Separation of a film or device layer from a transparent carrier by laser absorption at the interface.","purpose":"Release flexible displays or MicroLEDs from growth/carrier substrates.","inputs":["Layer on carrier"],"outputs":["Released layer"],"typical_parameters":["Wavelength","Fluence"],"quality_metrics":["Release yield"],"defects":["Cracks","Residue"],"equipment_ids":["EQP-I06"],"technology_ids":["TEC-068","TEC-082"],"material_ids":[],"model_ids":["MDL-000063","MDL-000066"],"company_ids":["CMP-000077","CMP-000079","CMP-000145","CMP-000175"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-055","entity_type":"process","slug":"ltps-anneal","name":"Laser annealing (LTPS / display)","stage":"DS","stage_name":"Display & MicroLED","parent_id":null,"sequence":55,"flow_position":null,"legacy_process_steps":["PSX6"],"description":"Laser crystallisation of amorphous silicon into polysilicon for display backplanes.","purpose":"High-mobility thin-film transistors.","inputs":["a-Si coated glass"],"outputs":["Poly-Si backplane"],"typical_parameters":["Fluence","Overlap"],"quality_metrics":["Mura / uniformity"],"defects":["Mura"],"equipment_ids":["EQP-I07"],"technology_ids":["TEC-067","TEC-082"],"material_ids":[],"model_ids":["MDL-000052","MDL-000053","MDL-000062","MDL-000067"],"company_ids":["CMP-000079","CMP-000145","CMP-000175","CMP-000176"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-056","entity_type":"process","slug":"mass-transfer","name":"MicroLED mass transfer & repair","stage":"DS","stage_name":"Display & MicroLED","parent_id":null,"sequence":56,"flow_position":null,"legacy_process_steps":["PSX6"],"description":"Transfer of large numbers of MicroLED dies to the backplane and repair of defective pixels.","purpose":"Assemble MicroLED displays.","inputs":["MicroLED dies","Backplane"],"outputs":["Populated backplane"],"typical_parameters":["Transfer yield","Placement accuracy"],"quality_metrics":["Pixel yield"],"defects":["Missing pixels"],"equipment_ids":["EQP-I08","EQP-I09","EQP-I05","EQP-I10"],"technology_ids":["TEC-070"],"material_ids":[],"model_ids":["MDL-000068","MDL-000478","MDL-000479","MDL-000480"],"company_ids":["CMP-000044","CMP-000141","CMP-000145","CMP-000310","CMP-000367","CMP-000368"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-057","entity_type":"process","slug":"amhs","name":"Automated material handling","stage":"FA","stage_name":"Fab infrastructure & subfab","parent_id":null,"sequence":57,"flow_position":null,"legacy_process_steps":["PSX4"],"description":"Overhead hoist transport, stockers and vehicles that move FOUPs between tools.","purpose":"Deliver wafers to tools without manual handling.","inputs":["FOUPs"],"outputs":["Delivered lots"],"typical_parameters":["Moves per hour"],"quality_metrics":["Delivery time"],"defects":[],"equipment_ids":["EQP-J01","EQP-J02","EQP-J03","EQP-J04","EQP-J05","EQP-J07","EQP-A34","EQP-A35","EQP-A36"],"technology_ids":[],"material_ids":[],"model_ids":["MDL-000040","MDL-000115","MDL-000567","MDL-000270","MDL-000271","MDL-000272","MDL-000342","MDL-000343"],"company_ids":["CMP-000065","CMP-000366","CMP-000066","CMP-000369","CMP-000059","CMP-000060","CMP-000061","CMP-000085","CMP-000086","CMP-000144","CMP-000194","CMP-000363","CMP-000315","CMP-000228"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-058","entity_type":"process","slug":"equipment-automation","name":"Tool automation & wafer handling","stage":"FA","stage_name":"Fab infrastructure & subfab","parent_id":null,"sequence":58,"flow_position":null,"legacy_process_steps":["PSX4"],"description":"EFEMs, wafer robots, load ports and factory software linking tools to the fab.","purpose":"Automated, contamination-free wafer transfer and tool control.","inputs":["FOUPs"],"outputs":["Wafers at process chamber"],"typical_parameters":["Transfer time","Placement repeatability"],"quality_metrics":["Particle adders"],"defects":[],"equipment_ids":["EQP-A37","EQP-A38","EQP-A39","EQP-A40","EQP-J06","EQP-J08","EQP-J09","EQP-J10","EQP-J11","EQP-J12","EQP-J13","EQP-J14","EQP-J15"],"technology_ids":[],"material_ids":[],"model_ids":["MDL-000114","MDL-000565","MDL-000566","MDL-000268","MDL-000269","MDL-000395","MDL-000396","MDL-000446","MDL-000492","MDL-000493","MDL-000494","MDL-000495","MDL-000496"],"company_ids":["CMP-000062","CMP-000063","CMP-000363","CMP-000256","CMP-000320","CMP-000064","CMP-000321","CMP-000191","CMP-000293","CMP-000364","CMP-000365"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-059","entity_type":"process","slug":"vacuum-abatement","name":"Vacuum & abatement (subfab)","stage":"FA","stage_name":"Fab infrastructure & subfab","parent_id":null,"sequence":59,"flow_position":null,"legacy_process_steps":["PSX4"],"description":"Dry, turbo and cryo pumps creating process vacuum, and abatement systems that treat process exhaust.","purpose":"Maintain process vacuum and destroy hazardous or greenhouse exhaust gases.","inputs":["Process exhaust"],"outputs":["Treated exhaust"],"typical_parameters":["Pumping speed","Destruction efficiency"],"quality_metrics":["Uptime"],"defects":[],"equipment_ids":["EQP-A41","EQP-A42","EQP-A45","EQP-L01","EQP-L02","EQP-L06"],"technology_ids":[],"material_ids":["MAT-012"],"model_ids":["MDL-000151","MDL-000152","MDL-000568","MDL-000199","MDL-000200","MDL-000447","MDL-000448","MDL-000449","MDL-000450"],"company_ids":["CMP-000339","CMP-000023","CMP-000168","CMP-000169","CMP-000193","CMP-000255","CMP-000294","CMP-000295","CMP-000362","CMP-000296","CMP-000355","CMP-000356"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-060","entity_type":"process","slug":"gas-chemical-delivery","name":"Gas & chemical delivery","stage":"FA","stage_name":"Fab infrastructure & subfab","parent_id":null,"sequence":60,"flow_position":null,"legacy_process_steps":["PSX4"],"description":"Gas cabinets, valve manifold boxes, bulk gas and chemical distribution that feed tools.","purpose":"Deliver pure, controlled process fluids safely.","inputs":["Bulk / specialty gases and chemicals"],"outputs":["Point-of-use supply"],"typical_parameters":["Purity","Pressure / flow stability"],"quality_metrics":["Purity at point of use"],"defects":[],"equipment_ids":["EQP-A43","EQP-A44","EQP-L04","EQP-L05"],"technology_ids":[],"material_ids":["MAT-012","MAT-015","MAT-013","MAT-019","MAT-020","MAT-023"],"model_ids":["MDL-000562","MDL-000563","MDL-000564","MDL-000265","MDL-000266","MDL-000267","MDL-000469","MDL-000470","MDL-000471","MDL-000472","MDL-000473","MDL-000531"],"company_ids":["CMP-000089","CMP-000172","CMP-000173","CMP-000196","CMP-000307","CMP-000308","CMP-000353","CMP-000370","CMP-000351","CMP-000350"],"content_basis":"Editorial reference (generic process description; not source-traced)"},{"id":"PRS-061","entity_type":"process","slug":"utilities","name":"Utilities (UPW, CDA, cooling, power)","stage":"FA","stage_name":"Fab infrastructure & subfab","parent_id":null,"sequence":61,"flow_position":null,"legacy_process_steps":["PSX4"],"description":"Ultrapure water, clean dry air, process cooling, waste treatment, power distribution and facility monitoring.","purpose":"Provide the utilities every tool depends on.","inputs":["City water","Power","Air"],"outputs":["UPW","CDA","Cooling water","Conditioned power"],"typical_parameters":["Resistivity (UPW)","Dew point (CDA)"],"quality_metrics":["Utility uptime"],"defects":[],"equipment_ids":["EQP-L03","EQP-L07","EQP-L08","EQP-L09","EQP-L10","EQP-L11","EQP-L12"],"technology_ids":[],"material_ids":["MAT-031"],"model_ids":["MDL-000281","MDL-000282"],"company_ids":["CMP-000297","CMP-000355","CMP-000356","CMP-000204","CMP-000205","CMP-000361","CMP-000324","CMP-000325"],"content_basis":"Editorial reference (generic process description; not source-traced)"}],"technologies":[{"id":"TEC-001","entity_type":"technology","slug":"euv","legacy_code":null,"name":"EUV lithography","family":"Lithography","aliases":["extreme ultraviolet"],"description":"Projection lithography at 13.5 nm wavelength using reflective optics and reflective masks in vacuum.","equipment_ids":["EQP-A01.01"],"process_ids":["PRS-018"],"model_ids":["MDL-000093","MDL-000094","MDL-000120"],"company_ids":["CMP-000001","CMP-000182","CMP-000027"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-002","entity_type":"technology","slug":"duv","legacy_code":null,"name":"DUV lithography","family":"Lithography","aliases":["deep ultraviolet"],"description":"Deep-ultraviolet projection lithography (248 nm KrF and 193 nm ArF excimer sources).","equipment_ids":["EQP-A01.02"],"process_ids":["PRS-018"],"model_ids":["MDL-000102"],"company_ids":["CMP-000032","CMP-000001","CMP-000020"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-003","entity_type":"technology","slug":"arf","legacy_code":null,"name":"ArF / ArF immersion lithography","family":"Lithography","aliases":["arf immersion","arfi","193 nm"],"description":"193 nm lithography, dry or with water immersion between lens and wafer to raise numerical aperture.","equipment_ids":["EQP-A01.03"],"process_ids":["PRS-018"],"model_ids":["MDL-000095","MDL-000096","MDL-000098","MDL-000099","MDL-000541","MDL-000542","MDL-000543"],"company_ids":["CMP-000020","CMP-000107","CMP-000001","CMP-000110"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-004","entity_type":"technology","slug":"krf","legacy_code":null,"name":"KrF lithography","family":"Lithography","aliases":["248 nm"],"description":"248 nm krypton-fluoride excimer lithography.","equipment_ids":["EQP-A01.04"],"process_ids":["PRS-018"],"model_ids":[],"company_ids":["CMP-000107"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-005","entity_type":"technology","slug":"i-line","legacy_code":null,"name":"i-line lithography","family":"Lithography","aliases":["365 nm"],"description":"365 nm mercury-lamp lithography used for non-critical layers, packaging and MEMS.","equipment_ids":["EQP-A01.05"],"process_ids":["PRS-018"],"model_ids":["MDL-000264","MDL-000352","MDL-000353"],"company_ids":["CMP-000013","CMP-000231"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-006","entity_type":"technology","slug":"ebeam-litho","legacy_code":null,"name":"Electron-beam lithography / mask writing","family":"Lithography","aliases":["e-beam lithography","ebl"],"description":"Direct writing of patterns with a focused electron beam; the main route for mask making.","equipment_ids":["EQP-A01.06","EQP-B07"],"process_ids":["PRS-018","PRS-028"],"model_ids":["MDL-000101","MDL-000554","MDL-000299","MDL-000300","MDL-000301","MDL-000362","MDL-000363","MDL-000364","MDL-000365","MDL-000474","MDL-000475","MDL-000476","MDL-000477"],"company_ids":["CMP-000025","CMP-000209","CMP-000210","CMP-000234","CMP-000309"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-007","entity_type":"technology","slug":"nil","legacy_code":null,"name":"Nanoimprint lithography","family":"Lithography","aliases":["nanoimprint","nil"],"description":"Pattern transfer by mechanically imprinting a template into a resist and curing it.","equipment_ids":["EQP-A01.07"],"process_ids":["PRS-018"],"model_ids":["MDL-000097","MDL-000305","MDL-000306"],"company_ids":["CMP-000013","CMP-000212","CMP-000051","CMP-000224","CMP-000252"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-008","entity_type":"technology","slug":"maskless","legacy_code":null,"name":"Maskless / direct-write lithography","family":"Lithography","aliases":["direct write","laser direct imaging","ldi"],"description":"Patterning without a physical mask, e.g. laser direct imaging or multi-beam writing.","equipment_ids":["EQP-A01.08","EQP-B08"],"process_ids":["PRS-018","PRS-028"],"model_ids":["MDL-000163","MDL-000254","MDL-000302","MDL-000303","MDL-000304","MDL-000388","MDL-000389"],"company_ids":["CMP-000007","CMP-000026","CMP-000211","CMP-000251","CMP-000209"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-009","entity_type":"technology","slug":"plasma-etch","legacy_code":null,"name":"Plasma (dry) etch","family":"Etch","aliases":["dry etch","plasma etching"],"description":"Material removal by reactive plasma species and ion bombardment.","equipment_ids":["EQP-A08.01","EQP-A08.02"],"process_ids":["PRS-020"],"model_ids":["MDL-000105","MDL-000536","MDL-000538","MDL-000327","MDL-000385"],"company_ids":["CMP-000101","CMP-000003","CMP-000002","CMP-000220","CMP-000244"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-010","entity_type":"technology","slug":"rie","legacy_code":null,"name":"Reactive ion etch (RIE)","family":"Etch","aliases":[],"description":"Anisotropic plasma etch combining chemical reaction and directional ion bombardment.","equipment_ids":["EQP-A08.03"],"process_ids":["PRS-020"],"model_ids":["MDL-000320","MDL-000499"],"company_ids":["CMP-000219","CMP-000323"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-011","entity_type":"technology","slug":"icp","legacy_code":null,"name":"Inductively coupled plasma (ICP) etch","family":"Etch","aliases":[],"description":"High-density plasma etch with separately controlled plasma density and ion energy.","equipment_ids":["EQP-A08.04"],"process_ids":["PRS-020"],"model_ids":["MDL-000321","MDL-000322","MDL-000323","MDL-000324","MDL-000498"],"company_ids":["CMP-000219","CMP-000323"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-012","entity_type":"technology","slug":"drie","legacy_code":null,"name":"Deep reactive ion etch (DRIE)","family":"Etch","aliases":["bosch process","deep etch"],"description":"High-aspect-ratio silicon etching (e.g. the Bosch process) used for MEMS and TSV.","equipment_ids":["EQP-A08.05","EQP-H02"],"process_ids":["PRS-020","PRS-043"],"model_ids":["MDL-000229","MDL-000451","MDL-000500"],"company_ids":["CMP-000005","CMP-000298","CMP-000323","CMP-000219"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-013","entity_type":"technology","slug":"wet-etch","legacy_code":null,"name":"Wet etch","family":"Etch","aliases":[],"description":"Isotropic chemical etching in liquid etchants.","equipment_ids":["EQP-A08.06"],"process_ids":["PRS-020"],"model_ids":[],"company_ids":["CMP-000229","CMP-000354"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-014","entity_type":"technology","slug":"plasma-dicing","legacy_code":null,"name":"Plasma dicing","family":"Etch","aliases":[],"description":"Die singulation by deep plasma etching of the streets.","equipment_ids":["EQP-C01.04"],"process_ids":["PRS-032"],"model_ids":["MDL-000073","MDL-000074","MDL-000075","MDL-000503"],"company_ids":["CMP-000054","CMP-000055","CMP-000005","CMP-000271"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-015","entity_type":"technology","slug":"cvd","legacy_code":null,"name":"Chemical vapour deposition (CVD)","family":"Deposition","aliases":["chemical vapor deposition"],"description":"Film growth from gas-phase precursors reacting on a heated surface.","equipment_ids":["EQP-A09.01"],"process_ids":["PRS-013","PRS-014"],"model_ids":["MDL-000113","MDL-000319"],"company_ids":["CMP-000028","CMP-000218","CMP-000069","CMP-000102","CMP-000272"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-016","entity_type":"technology","slug":"pecvd","legacy_code":null,"name":"Plasma-enhanced CVD (PECVD)","family":"Deposition","aliases":["plasma enhanced chemical vapor deposition"],"description":"CVD assisted by plasma to lower deposition temperature.","equipment_ids":["EQP-A09.02"],"process_ids":["PRS-013","PRS-014"],"model_ids":["MDL-000103","MDL-000108","MDL-000535","MDL-000326","MDL-000410"],"company_ids":["CMP-000002","CMP-000103","CMP-000003","CMP-000220","CMP-000265","CMP-000104","CMP-000217","CMP-000219","CMP-000241"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-017","entity_type":"technology","slug":"lpcvd","legacy_code":null,"name":"Low-pressure CVD (LPCVD)","family":"Deposition","aliases":[],"description":"Thermal CVD at reduced pressure, typically in batch furnaces.","equipment_ids":["EQP-A09.03"],"process_ids":["PRS-013","PRS-014"],"model_ids":["MDL-000316"],"company_ids":["CMP-000217","CMP-000238"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-018","entity_type":"technology","slug":"hdpcvd","legacy_code":null,"name":"High-density-plasma CVD (HDPCVD) / SACVD","family":"Deposition","aliases":[],"description":"Gap-fill oriented CVD variants (high-density plasma, sub-atmospheric).","equipment_ids":["EQP-A09.04","EQP-A09.05"],"process_ids":["PRS-013","PRS-014"],"model_ids":["MDL-000532","MDL-000539"],"company_ids":["CMP-000003","CMP-000002"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-019","entity_type":"technology","slug":"ald","legacy_code":null,"name":"Atomic layer deposition (ALD)","family":"Deposition","aliases":["atomic layer deposition"],"description":"Self-limiting cyclic surface reactions for atomic-scale thickness control.","equipment_ids":["EQP-A09.06"],"process_ids":["PRS-013","PRS-015"],"model_ids":["MDL-000104","MDL-000106","MDL-000107","MDL-000534","MDL-000551","MDL-000307","MDL-000308","MDL-000379"],"company_ids":["CMP-000002","CMP-000069","CMP-000070","CMP-000003","CMP-000022","CMP-000213","CMP-000214","CMP-000241","CMP-000030","CMP-000103","CMP-000218","CMP-000219","CMP-000220","CMP-000247","CMP-000272"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-020","entity_type":"technology","slug":"pvd","legacy_code":null,"name":"Physical vapour deposition / sputtering","family":"Deposition","aliases":["physical vapor deposition","sputter","sputtering"],"description":"Deposition by sputtering a target in a low-pressure plasma.","equipment_ids":["EQP-A09.07","EQP-A09.08"],"process_ids":["PRS-013","PRS-016","PRS-025"],"model_ids":["MDL-000171","MDL-000172","MDL-000309","MDL-000377","MDL-000378","MDL-000393","MDL-000394","MDL-000507","MDL-000508","MDL-000509","MDL-000510","MDL-000511","MDL-000512","MDL-000513","MDL-000514","MDL-000515","MDL-000517"],"company_ids":["CMP-000002","CMP-000214","CMP-000241","CMP-000255","CMP-000334","CMP-000335","CMP-000336","CMP-000244","CMP-000275","CMP-000286","CMP-000287","CMP-000288"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-021","entity_type":"technology","slug":"evaporation","legacy_code":null,"name":"Evaporation","family":"Deposition","aliases":[],"description":"Thermal or e-beam evaporation of source material in high vacuum.","equipment_ids":["EQP-A09.09"],"process_ids":["PRS-013","PRS-016"],"model_ids":[],"company_ids":["CMP-000255","CMP-000275","CMP-000285","CMP-000286","CMP-000287","CMP-000288"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-022","entity_type":"technology","slug":"epitaxy","legacy_code":null,"name":"Epitaxy","family":"Deposition","aliases":["epi"],"description":"Single-crystal film growth on a single-crystal substrate.","equipment_ids":["EQP-A09.10","EQP-F03"],"process_ids":["PRS-009"],"model_ids":["MDL-000283","MDL-000284","MDL-000285","MDL-000286","MDL-000287","MDL-000288","MDL-000525"],"company_ids":["CMP-000006","CMP-000002","CMP-000357","CMP-000184","CMP-000194"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-023","entity_type":"technology","slug":"mocvd","legacy_code":null,"name":"MOCVD","family":"Deposition","aliases":["metal organic chemical vapor deposition","movpe"],"description":"Metal-organic CVD, the main epitaxy route for GaN, GaAs and InP compound devices.","equipment_ids":["EQP-G01","EQP-G03","EQP-G04","EQP-G05","EQP-G06","EQP-G07"],"process_ids":["PRS-009"],"model_ids":["MDL-000289","MDL-000290","MDL-000291","MDL-000293","MDL-000325"],"company_ids":["CMP-000014","CMP-000028","CMP-000219"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-024","entity_type":"technology","slug":"mbe","legacy_code":null,"name":"Molecular beam epitaxy (MBE)","family":"Deposition","aliases":[],"description":"Epitaxy from molecular beams in ultra-high vacuum.","equipment_ids":["EQP-A09.11"],"process_ids":["PRS-009"],"model_ids":["MDL-000441","MDL-000442"],"company_ids":["CMP-000283","CMP-000284","CMP-000285"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-025","entity_type":"technology","slug":"electroplating","legacy_code":null,"name":"Electroplating (ECD)","family":"Deposition","aliases":["ecd","plating"],"description":"Electrochemical deposition of metals such as copper for interconnect and bumps.","equipment_ids":["EQP-A18"],"process_ids":["PRS-025","PRS-043"],"model_ids":["MDL-000169","MDL-000170","MDL-000183"],"company_ids":["CMP-000104","CMP-000003","CMP-000254","CMP-000337"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-026","entity_type":"technology","slug":"ion-implantation","legacy_code":null,"name":"Ion implantation","family":"Doping","aliases":["implant","implanter"],"description":"Dopant introduction by accelerated ion beams.","equipment_ids":["EQP-A10","EQP-F04"],"process_ids":["PRS-022"],"model_ids":["MDL-000175","MDL-000176","MDL-000177","MDL-000178","MDL-000179","MDL-000180","MDL-000181","MDL-000182","MDL-000384","MDL-000520"],"company_ids":["CMP-000002","CMP-000015","CMP-000243","CMP-000338"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-027","entity_type":"technology","slug":"furnace-thermal","legacy_code":null,"name":"Furnace oxidation / diffusion","family":"Thermal","aliases":[],"description":"Batch thermal processing for oxidation, diffusion and anneal.","equipment_ids":["EQP-A11","EQP-A16"],"process_ids":["PRS-011","PRS-012","PRS-023"],"model_ids":["MDL-000168","MDL-000189","MDL-000314","MDL-000315","MDL-000370","MDL-000371","MDL-000386"],"company_ids":["CMP-000104","CMP-000004","CMP-000217","CMP-000238","CMP-000245"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-028","entity_type":"technology","slug":"rtp","legacy_code":null,"name":"Rapid thermal processing (RTP)","family":"Thermal","aliases":["rapid thermal anneal","rta"],"description":"Single-wafer lamp-based heating with fast ramps.","equipment_ids":["EQP-A12","EQP-A13"],"process_ids":["PRS-023"],"model_ids":["MDL-000058","MDL-000553","MDL-000162","MDL-000317","MDL-000318","MDL-000527","MDL-000528"],"company_ids":["CMP-000014","CMP-000022","CMP-000007","CMP-000218","CMP-000358","CMP-000245"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-029","entity_type":"technology","slug":"cmp","legacy_code":null,"name":"Chemical mechanical planarisation (CMP)","family":"Planarisation","aliases":["chemical mechanical polishing"],"description":"Combined chemical/mechanical polishing to planarise films.","equipment_ids":["EQP-A19"],"process_ids":["PRS-024"],"model_ids":["MDL-000173","MDL-000174","MDL-000197","MDL-000198","MDL-000279","MDL-000366","MDL-000461","MDL-000462"],"company_ids":["CMP-000002","CMP-000023","CMP-000203","CMP-000235","CMP-000302","CMP-000105","CMP-000236","CMP-000264","CMP-000315"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-030","entity_type":"technology","slug":"wet-processing","legacy_code":null,"name":"Wet processing / cleaning","family":"Clean","aliases":[],"description":"Batch or single-wafer chemical cleaning and wet processing.","equipment_ids":["EQP-A04","EQP-A05","EQP-A20"],"process_ids":["PRS-010"],"model_ids":["MDL-000155","MDL-000156","MDL-000157","MDL-000158","MDL-000159","MDL-000164","MDL-000165","MDL-000166","MDL-000167","MDL-000190","MDL-000191","MDL-000192","MDL-000295","MDL-000296","MDL-000374","MDL-000375","MDL-000376","MDL-000380","MDL-000381","MDL-000382","MDL-000383","MDL-000497","MDL-000518"],"company_ids":["CMP-000007","CMP-000104","CMP-000004","CMP-000240","CMP-000242","CMP-000322","CMP-000337","CMP-000229","CMP-000264","CMP-000354","CMP-000080","CMP-000081","CMP-000254"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-031","entity_type":"technology","slug":"optical-inspection","legacy_code":null,"name":"Optical defect inspection","family":"Inspection","aliases":["aoi"],"description":"Bright-/dark-field optical detection of wafer or package defects.","equipment_ids":["EQP-A21","EQP-A22","EQP-A23","EQP-A31","EQP-C36"],"process_ids":["PRS-027","PRS-040"],"model_ids":["MDL-000051","MDL-000220","MDL-000221","MDL-000223","MDL-000228","MDL-000230","MDL-000231","MDL-000236","MDL-000237","MDL-000240","MDL-000241","MDL-000242","MDL-000244","MDL-000361","MDL-000397","MDL-000398","MDL-000405","MDL-000452","MDL-000521","MDL-000522"],"company_ids":["CMP-000078","CMP-000005","CMP-000021","CMP-000016","CMP-000018","CMP-000233","CMP-000257","CMP-000262","CMP-000299","CMP-000087","CMP-000041","CMP-000083","CMP-000088","CMP-000249","CMP-000324","CMP-000325","CMP-000268","CMP-000329"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-032","entity_type":"technology","slug":"ebeam-inspection","legacy_code":null,"name":"E-beam inspection & review","family":"Inspection","aliases":[],"description":"Scanning-electron-beam defect inspection and review.","equipment_ids":["EQP-A24"],"process_ids":["PRS-027"],"model_ids":["MDL-000540","MDL-000544","MDL-000545","MDL-000546","MDL-000547","MDL-000235"],"company_ids":["CMP-000002","CMP-000001","CMP-000021"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-033","entity_type":"technology","slug":"xray-inspection","legacy_code":null,"name":"X-ray inspection","family":"Inspection","aliases":[],"description":"Non-destructive X-ray imaging of packages and interconnects.","equipment_ids":["EQP-C35"],"process_ids":["PRS-040"],"model_ids":["MDL-000247","MDL-000248","MDL-000399","MDL-000400"],"company_ids":["CMP-000206","CMP-000258","CMP-000327"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-034","entity_type":"technology","slug":"cd-sem","legacy_code":null,"name":"CD-SEM","family":"Metrology","aliases":[],"description":"Critical-dimension measurement by scanning electron microscope.","equipment_ids":["EQP-A26","EQP-A29"],"process_ids":["PRS-026"],"model_ids":["MDL-000232","MDL-000233","MDL-000234"],"company_ids":["CMP-000021"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-035","entity_type":"technology","slug":"optical-metrology","legacy_code":null,"name":"Optical metrology (film, overlay, OCD)","family":"Metrology","aliases":[],"description":"Optical measurement of film thickness, overlay and profiles.","equipment_ids":["EQP-A25","EQP-A27","EQP-A28","EQP-A30"],"process_ids":["PRS-026"],"model_ids":["MDL-000111","MDL-000112","MDL-000119","MDL-000222","MDL-000243","MDL-000401","MDL-000402","MDL-000403","MDL-000404","MDL-000523","MDL-000524"],"company_ids":["CMP-000016","CMP-000180","CMP-000005","CMP-000018","CMP-000258","CMP-000261","CMP-000341","CMP-000017","CMP-000019","CMP-000031","CMP-000250","CMP-000299","CMP-000220"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-036","entity_type":"technology","slug":"afm-metrology","legacy_code":null,"name":"AFM metrology","family":"Metrology","aliases":[],"description":"Atomic-force-microscope-based surface and profile metrology.","equipment_ids":[],"process_ids":["PRS-026"],"model_ids":[],"company_ids":[],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-037","entity_type":"technology","slug":"blade-dicing","legacy_code":null,"name":"Blade (mechanical) dicing","family":"Dicing","aliases":["mechanical dicing","dicing saw"],"description":"Sawing wafers with a thin diamond blade.","equipment_ids":["EQP-C01.01"],"process_ids":["PRS-032","PRS-039"],"model_ids":["MDL-000012","MDL-000013","MDL-000014","MDL-000089"],"company_ids":["CMP-000012","CMP-000053","CMP-000010"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-038","entity_type":"technology","slug":"dbg","legacy_code":null,"name":"Dicing before grinding (DBG)","family":"Dicing","aliases":[],"description":"Half-cut dicing followed by back-grinding to separate dies.","equipment_ids":["EQP-C01.05"],"process_ids":["PRS-032"],"model_ids":[],"company_ids":[],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-039","entity_type":"technology","slug":"die-bonding","legacy_code":null,"name":"Die bonding / die attach","family":"Assembly","aliases":["die attach","die bonder"],"description":"Pick-and-place attachment of dies to substrates or leadframes.","equipment_ids":["EQP-C10","EQP-E11"],"process_ids":["PRS-033"],"model_ids":["MDL-000083","MDL-000330","MDL-000333","MDL-000433","MDL-000434","MDL-000435","MDL-000489","MDL-000490","MDL-000491"],"company_ids":["CMP-000026","CMP-000222","CMP-000223","CMP-000280","CMP-000319","CMP-000043","CMP-000044","CMP-000046","CMP-000050","CMP-000246","CMP-000253","CMP-000279"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-040","entity_type":"technology","slug":"wire-bonding","legacy_code":null,"name":"Wire bonding","family":"Assembly","aliases":["wire bonder"],"description":"Ball/wedge bonding of fine wires between die and package.","equipment_ids":["EQP-C12","EQP-C13","EQP-C14","EQP-C15","EQP-E12"],"process_ids":["PRS-034"],"model_ids":["MDL-000087","MDL-000422","MDL-000423","MDL-000424","MDL-000425","MDL-000426","MDL-000427","MDL-000428","MDL-000429","MDL-000430","MDL-000484","MDL-000485","MDL-000486","MDL-000487"],"company_ids":["CMP-000050","CMP-000276","CMP-000277","CMP-000278","CMP-000318","CMP-000046","CMP-000222","CMP-000319"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-041","entity_type":"technology","slug":"flip-chip","legacy_code":null,"name":"Flip-chip bonding","family":"Assembly","aliases":["flip chip"],"description":"Face-down bumped die attachment by reflow.","equipment_ids":["EQP-C11","EQP-E13"],"process_ids":["PRS-035"],"model_ids":["MDL-000084","MDL-000088","MDL-000331","MDL-000332","MDL-000334","MDL-000335","MDL-000347","MDL-000358","MDL-000359","MDL-000437"],"company_ids":["CMP-000026","CMP-000050","CMP-000223","CMP-000224","CMP-000229","CMP-000233","CMP-000280","CMP-000077"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-042","entity_type":"technology","slug":"tcb","legacy_code":null,"name":"Thermo-compression bonding (TCB)","family":"Assembly","aliases":["thermo compression bonding","tc bonding","tc bonder"],"description":"Bonding with controlled force and heat per die, widely used for HBM and fine-pitch stacks.","equipment_ids":["EQP-C16"],"process_ids":["PRS-035","PRS-049"],"model_ids":["MDL-000079","MDL-000080","MDL-000505","MDL-000506"],"company_ids":["CMP-000047","CMP-000048","CMP-000046","CMP-000067","CMP-000043","CMP-000044","CMP-000223","CMP-000233"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-043","entity_type":"technology","slug":"hybrid-bonding","legacy_code":null,"name":"Hybrid bonding","family":"Assembly","aliases":["direct bonding","cu-cu bonding"],"description":"Direct Cu-Cu plus dielectric bonding without solder, die-to-wafer or wafer-to-wafer.","equipment_ids":["EQP-C17","EQP-D12"],"process_ids":["PRS-049","PRS-051"],"model_ids":["MDL-000081","MDL-000082","MDL-000109","MDL-000559","MDL-000336","MDL-000345"],"company_ids":["CMP-000048","CMP-000002","CMP-000103","CMP-000052","CMP-000224","CMP-000229","CMP-000043","CMP-000044","CMP-000051"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-044","entity_type":"technology","slug":"wafer-bonding","legacy_code":null,"name":"Wafer bonding (permanent / temporary)","family":"Assembly","aliases":[],"description":"Wafer-to-wafer bonding, including temporary bonding to carriers.","equipment_ids":["EQP-C18","EQP-H03","EQP-D22"],"process_ids":["PRS-051","PRS-052"],"model_ids":["MDL-000025","MDL-000047","MDL-000076","MDL-000077","MDL-000078","MDL-000557","MDL-000196","MDL-000504"],"company_ids":["CMP-000077","CMP-000119","CMP-000051","CMP-000052","CMP-000004","CMP-000326","CMP-000106"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-045","entity_type":"technology","slug":"compression-molding","legacy_code":null,"name":"Compression / transfer molding","family":"Assembly","aliases":["molding","encapsulation"],"description":"Encapsulation with molding compounds.","equipment_ids":["EQP-C20","EQP-C21","EQP-C22","EQP-C23","EQP-E14"],"process_ids":["PRS-036"],"model_ids":["MDL-000085","MDL-000438"],"company_ids":["CMP-000049","CMP-000281","CMP-000050"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-046","entity_type":"technology","slug":"wlp","legacy_code":null,"name":"Wafer-level packaging (WLP / WLCSP)","family":"Packaging","aliases":["wafer level packaging","wlcsp","fan-in"],"description":"Packaging at wafer level before singulation.","equipment_ids":["EQP-D08","EQP-D20"],"process_ids":["PRS-046"],"model_ids":["MDL-000561","MDL-000328","MDL-000329"],"company_ids":["CMP-000221"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-047","entity_type":"technology","slug":"fan-out","legacy_code":null,"name":"Fan-out packaging (FOWLP / FOPLP)","family":"Packaging","aliases":["fowlp","fan out","info"],"description":"Reconstituted wafer or panel packaging with RDL beyond the die edge.","equipment_ids":["EQP-D05","EQP-D06","EQP-D07","EQP-D10"],"process_ids":["PRS-047"],"model_ids":["MDL-000344"],"company_ids":["CMP-000229","CMP-000221"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-048","entity_type":"technology","slug":"panel-level","legacy_code":null,"name":"Panel-level packaging","family":"Packaging","aliases":["plp","fo-plp","copos"],"description":"Packaging processes on large rectangular panels instead of round wafers.","equipment_ids":["EQP-D07","EQP-D19"],"process_ids":["PRS-047","PRS-053"],"model_ids":["MDL-000346","MDL-000360","MDL-000392","MDL-000519"],"company_ids":["CMP-000229","CMP-000233","CMP-000254","CMP-000337","CMP-000231"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-049","entity_type":"technology","slug":"interposer-25d","legacy_code":null,"name":"2.5D interposer integration","family":"Packaging","aliases":["2.5d","cowos","interposer","emib"],"description":"Dies side by side on silicon, organic or glass interposers or bridges.","equipment_ids":["EQP-D01","EQP-D09","EQP-D11","EQP-D16","EQP-D17","EQP-D18"],"process_ids":["PRS-048"],"model_ids":["MDL-000035","MDL-000354"],"company_ids":["CMP-000143","CMP-000231"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-050","entity_type":"technology","slug":"3d-ic","legacy_code":null,"name":"3D IC stacking","family":"Packaging","aliases":["3d","3d stacking"],"description":"Vertical stacking of active dies.","equipment_ids":["EQP-D02","EQP-D21","EQP-D23"],"process_ids":["PRS-049"],"model_ids":["MDL-000556","MDL-000558"],"company_ids":["CMP-000051","CMP-000043"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-051","entity_type":"technology","slug":"hbm","legacy_code":null,"name":"High-bandwidth memory (HBM) stacking","family":"Packaging","aliases":["high bandwidth memory"],"description":"Stacked DRAM dies connected by TSVs, bonded by TCB or hybrid bonding.","equipment_ids":["EQP-D03"],"process_ids":["PRS-049"],"model_ids":[],"company_ids":[],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-052","entity_type":"technology","slug":"chiplet","legacy_code":null,"name":"Chiplets","family":"Packaging","aliases":["chiplets"],"description":"Disaggregated multi-die designs assembled in one package.","equipment_ids":["EQP-D04"],"process_ids":["PRS-050"],"model_ids":[],"company_ids":[],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-053","entity_type":"technology","slug":"tsv","legacy_code":null,"name":"Through-silicon via (TSV)","family":"Packaging","aliases":[],"description":"Vertical interconnect through silicon.","equipment_ids":["EQP-D13"],"process_ids":["PRS-043"],"model_ids":[],"company_ids":["CMP-000299"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-054","entity_type":"technology","slug":"tgv","legacy_code":null,"name":"Through-glass via (TGV) / glass core","family":"Packaging","aliases":["glass core","glass substrate"],"description":"Vias in glass substrates and interposers.","equipment_ids":["EQP-D14"],"process_ids":["PRS-044"],"model_ids":["MDL-000034","MDL-000043","MDL-000048","MDL-000050","MDL-000502"],"company_ids":["CMP-000143","CMP-000119","CMP-000120","CMP-000078"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-055","entity_type":"technology","slug":"rdl","legacy_code":null,"name":"Redistribution layers (RDL)","family":"Packaging","aliases":[],"description":"Thin-film re-routing layers.","equipment_ids":["EQP-D15"],"process_ids":["PRS-045"],"model_ids":["MDL-000355"],"company_ids":["CMP-000231"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-056","entity_type":"technology","slug":"ate","legacy_code":null,"name":"Automated test equipment (ATE)","family":"Test","aliases":["automated test equipment","tester","prober","handler"],"description":"Instruments and handlers/probers that electrically test dies and packages.","equipment_ids":["EQP-A32","EQP-A33","EQP-C37","EQP-C39","EQP-C40","EQP-C41","EQP-C42","EQP-E02"],"process_ids":["PRS-029","PRS-041"],"model_ids":["MDL-000092","MDL-000213","MDL-000214","MDL-000215","MDL-000216","MDL-000217","MDL-000218","MDL-000219","MDL-000256","MDL-000257","MDL-000258","MDL-000259","MDL-000260","MDL-000261","MDL-000262","MDL-000263","MDL-000390","MDL-000391","MDL-000406","MDL-000407","MDL-000408","MDL-000411","MDL-000412","MDL-000414","MDL-000415","MDL-000416","MDL-000417","MDL-000418","MDL-000440","MDL-000463","MDL-000464","MDL-000465","MDL-000466","MDL-000467","MDL-000468"],"company_ids":["CMP-000038","CMP-000008","CMP-000009","CMP-000037","CMP-000036","CMP-000253","CMP-000263","CMP-000266","CMP-000269","CMP-000270","CMP-000282","CMP-000303","CMP-000304","CMP-000305","CMP-000260","CMP-000033","CMP-000034","CMP-000035","CMP-000306","CMP-000039","CMP-000268","CMP-000329","CMP-000330","CMP-000267"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-057","entity_type":"technology","slug":"burn-in","legacy_code":null,"name":"Burn-in","family":"Test","aliases":[],"description":"Elevated temperature/voltage stress screening.","equipment_ids":["EQP-C38","EQP-E04"],"process_ids":["PRS-042"],"model_ids":["MDL-000090","MDL-000091","MDL-000409","MDL-000413"],"company_ids":["CMP-000040","CMP-000263","CMP-000266","CMP-000267","CMP-000269"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-058","entity_type":"technology","slug":"wire-sawing","legacy_code":null,"name":"Multi-wire sawing","family":"Wafer manufacturing","aliases":[],"description":"Slicing ingots into wafers with diamond or slurry wire.","equipment_ids":["EQP-K03"],"process_ids":["PRS-003"],"model_ids":[],"company_ids":["CMP-000230","CMP-000357"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-059","entity_type":"technology","slug":"laser-marking","legacy_code":"L01","name":"Laser marking","family":"Laser","aliases":[],"description":"Laser marking of wafers, strips and packages.","equipment_ids":["EQP-C26","EQP-E09"],"process_ids":["PRS-038"],"model_ids":["MDL-000022","MDL-000023","MDL-000037","MDL-000038","MDL-000039","MDL-000124","MDL-000127","MDL-000129","MDL-000421"],"company_ids":["CMP-000077","CMP-000144","CMP-000147","CMP-000146","CMP-000134","CMP-000274","CMP-000119","CMP-000165","CMP-000191","CMP-000271","CMP-000330","CMP-000332"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-060","entity_type":"technology","slug":"laser-dicing","legacy_code":"L02","name":"Laser dicing","family":"Laser","aliases":[],"description":"Ablative laser singulation of wafers.","equipment_ids":["EQP-C01.02"],"process_ids":["PRS-032"],"model_ids":["MDL-000001","MDL-000002","MDL-000006","MDL-000007","MDL-000008","MDL-000009","MDL-000010","MDL-000011","MDL-000015","MDL-000016","MDL-000017","MDL-000018","MDL-000019","MDL-000020","MDL-000021","MDL-000027","MDL-000030","MDL-000031","MDL-000041","MDL-000042","MDL-000044","MDL-000049","MDL-000118"],"company_ids":["CMP-000010","CMP-000012","CMP-000045","CMP-000077","CMP-000141","CMP-000142","CMP-000117","CMP-000118","CMP-000119","CMP-000121","CMP-000195","CMP-000327"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-061","entity_type":"technology","slug":"stealth-dicing","legacy_code":"L03","name":"Stealth dicing","family":"Laser","aliases":["sd"],"description":"Internal laser modification below the surface followed by tape expansion.","equipment_ids":["EQP-C01.03"],"process_ids":["PRS-032"],"model_ids":["MDL-000001","MDL-000002","MDL-000005","MDL-000006","MDL-000007","MDL-000009","MDL-000010","MDL-000011","MDL-000041","MDL-000042"],"company_ids":["CMP-000010","CMP-000011","CMP-000012","CMP-000117","CMP-000118","CMP-000119"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-062","entity_type":"technology","slug":"laser-ablation","legacy_code":"L04","name":"Laser ablation","family":"Laser","aliases":[],"description":"Material removal by direct laser vaporisation.","equipment_ids":["EQP-C30"],"process_ids":[],"model_ids":["MDL-000008","MDL-000020"],"company_ids":["CMP-000012","CMP-000077","CMP-000045"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-063","entity_type":"technology","slug":"laser-drilling","legacy_code":"L05","name":"Laser drilling","family":"Laser","aliases":[],"description":"Via and hole formation by laser.","equipment_ids":["EQP-C28"],"process_ids":["PRS-044","PRS-053"],"model_ids":["MDL-000034","MDL-000035","MDL-000043","MDL-000048","MDL-000050","MDL-000070","MDL-000071","MDL-000072"],"company_ids":["CMP-000143","CMP-000119","CMP-000120","CMP-000078","CMP-000148","CMP-000032","CMP-000077","CMP-000271"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-064","entity_type":"technology","slug":"laser-grooving","legacy_code":"L06","name":"Laser grooving","family":"Laser","aliases":[],"description":"Laser removal of low-k/metal layers in the street before blade dicing.","equipment_ids":[],"process_ids":["PRS-032"],"model_ids":["MDL-000008","MDL-000015","MDL-000016","MDL-000019","MDL-000020","MDL-000049"],"company_ids":["CMP-000012","CMP-000045","CMP-000077","CMP-000121"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-065","entity_type":"technology","slug":"laser-cutting","legacy_code":"L07","name":"Laser cutting","family":"Laser","aliases":[],"description":"Laser separation of wafers, glass, ingots and packages.","equipment_ids":["EQP-C29"],"process_ids":["PRS-003","PRS-039"],"model_ids":["MDL-000003","MDL-000004","MDL-000027","MDL-000031","MDL-000032","MDL-000033","MDL-000045","MDL-000049","MDL-000339"],"company_ids":["CMP-000010","CMP-000141","CMP-000142","CMP-000119","CMP-000121","CMP-000226"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-066","entity_type":"technology","slug":"laser-welding","legacy_code":"L08","name":"Laser welding","family":"Laser","aliases":[],"description":"Joining by laser heating.","equipment_ids":["EQP-C31"],"process_ids":[],"model_ids":["MDL-000036","MDL-000054","MDL-000055","MDL-000488"],"company_ids":["CMP-000143","CMP-000057","CMP-000056","CMP-000318","CMP-000191"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-067","entity_type":"technology","slug":"laser-annealing","legacy_code":"L09","name":"Laser annealing","family":"Laser","aliases":[],"description":"Laser-based thermal processing (dopant activation, crystallisation, silicidation).","equipment_ids":["EQP-A14","EQP-I07"],"process_ids":["PRS-023","PRS-055"],"model_ids":["MDL-000024","MDL-000028","MDL-000029","MDL-000046","MDL-000052","MDL-000053","MDL-000056","MDL-000057","MDL-000058","MDL-000059","MDL-000060","MDL-000061","MDL-000062","MDL-000064","MDL-000065","MDL-000067"],"company_ids":["CMP-000077","CMP-000141","CMP-000119","CMP-000079","CMP-000014","CMP-000174","CMP-000175","CMP-000177","CMP-000145","CMP-000007","CMP-000176"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-068","entity_type":"technology","slug":"laser-lift-off","legacy_code":"L10","name":"Laser lift-off (LLO)","family":"Laser","aliases":["llo"],"description":"Laser release of layers from transparent carriers.","equipment_ids":["EQP-I06"],"process_ids":["PRS-054"],"model_ids":["MDL-000053","MDL-000063","MDL-000066","MDL-000068","MDL-000194"],"company_ids":["CMP-000079","CMP-000175","CMP-000145","CMP-000004","CMP-000077"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-069","entity_type":"technology","slug":"laser-debonding","legacy_code":"L11","name":"Laser debonding","family":"Laser","aliases":[],"description":"Laser release of temporarily bonded wafers.","equipment_ids":[],"process_ids":["PRS-052"],"model_ids":["MDL-000025","MDL-000047","MDL-000076","MDL-000078"],"company_ids":["CMP-000077","CMP-000119","CMP-000051","CMP-000052"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-070","entity_type":"technology","slug":"laser-repair","legacy_code":"L12","name":"Laser repair","family":"Laser","aliases":[],"description":"Laser repair of display or mask defects.","equipment_ids":["EQP-I05","EQP-B05"],"process_ids":["PRS-056"],"model_ids":["MDL-000068"],"company_ids":["CMP-000145","CMP-000367","CMP-000368","CMP-000292"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-071","entity_type":"technology","slug":"laser-trimming","legacy_code":"L13","name":"Laser trimming","family":"Laser","aliases":[],"description":"Adjustment of resistors/devices by laser.","equipment_ids":[],"process_ids":[],"model_ids":["MDL-000068"],"company_ids":["CMP-000145"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-072","entity_type":"technology","slug":"laser-micromachining","legacy_code":"L14","name":"Laser micromachining","family":"Laser","aliases":[],"description":"General precision laser structuring.","equipment_ids":["EQP-A15"],"process_ids":[],"model_ids":["MDL-000003","MDL-000004","MDL-000034","MDL-000035","MDL-000043","MDL-000045","MDL-000194","MDL-000195","MDL-000337","MDL-000338","MDL-000340","MDL-000341"],"company_ids":["CMP-000010","CMP-000143","CMP-000119","CMP-000004","CMP-000225","CMP-000226","CMP-000332"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-073","entity_type":"technology","slug":"uv-laser","legacy_code":"L15","name":"UV laser processing","family":"Laser source","aliases":[],"description":"Processing with ultraviolet wavelengths (< 400 nm).","equipment_ids":[],"process_ids":[],"model_ids":["MDL-000008","MDL-000015","MDL-000016","MDL-000017","MDL-000025","MDL-000028","MDL-000060","MDL-000064","MDL-000066","MDL-000071","MDL-000125","MDL-000127","MDL-000130"],"company_ids":["CMP-000012","CMP-000045","CMP-000077","CMP-000141","CMP-000174","CMP-000177","CMP-000145","CMP-000148","CMP-000146","CMP-000135"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-074","entity_type":"technology","slug":"green-laser","legacy_code":"L16","name":"Green laser processing","family":"Laser source","aliases":[],"description":"Processing with ~515–532 nm wavelengths.","equipment_ids":[],"process_ids":[],"model_ids":["MDL-000024","MDL-000030","MDL-000059","MDL-000125"],"company_ids":["CMP-000077","CMP-000142","CMP-000174","CMP-000148"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-075","entity_type":"technology","slug":"ir-laser","legacy_code":"L17","name":"IR laser processing","family":"Laser source","aliases":[],"description":"Processing with ~1 µm and longer wavelengths.","equipment_ids":[],"process_ids":[],"model_ids":["MDL-000001","MDL-000002","MDL-000005","MDL-000006","MDL-000007","MDL-000018","MDL-000030","MDL-000056","MDL-000076","MDL-000126"],"company_ids":["CMP-000010","CMP-000011","CMP-000012","CMP-000045","CMP-000142","CMP-000014","CMP-000051","CMP-000146"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-076","entity_type":"technology","slug":"ultrafast-laser","legacy_code":"L18","name":"Ultrafast laser processing","family":"Laser source","aliases":["ultrashort pulse","usp"],"description":"Pico-/femtosecond pulse processing with minimal heat-affected zone.","equipment_ids":[],"process_ids":[],"model_ids":["MDL-000015","MDL-000122","MDL-000123","MDL-000124","MDL-000125"],"company_ids":["CMP-000045","CMP-000149","CMP-000150","CMP-000147","CMP-000148"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-077","entity_type":"technology","slug":"picosecond-laser","legacy_code":"L19","name":"Picosecond lasers","family":"Laser source","aliases":["ps laser"],"description":"Lasers with picosecond pulse durations.","equipment_ids":[],"process_ids":[],"model_ids":["MDL-000015","MDL-000125","MDL-000130"],"company_ids":["CMP-000045","CMP-000148","CMP-000135"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-078","entity_type":"technology","slug":"femtosecond-laser","legacy_code":"L20","name":"Femtosecond lasers","family":"Laser source","aliases":["fs laser"],"description":"Lasers with femtosecond pulse durations.","equipment_ids":[],"process_ids":[],"model_ids":["MDL-000122","MDL-000123","MDL-000130","MDL-000338","MDL-000339","MDL-000340"],"company_ids":["CMP-000149","CMP-000150","CMP-000135","CMP-000226"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-079","entity_type":"technology","slug":"co2-laser","legacy_code":"L21","name":"CO₂ lasers","family":"Laser source","aliases":["co2"],"description":"Gas lasers at ~9.3–10.6 µm.","equipment_ids":[],"process_ids":[],"model_ids":["MDL-000070"],"company_ids":["CMP-000148"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-080","entity_type":"technology","slug":"fiber-laser","legacy_code":"L22","name":"Fiber lasers","family":"Laser source","aliases":["fibre laser","mopa"],"description":"Rare-earth-doped fiber lasers.","equipment_ids":[],"process_ids":[],"model_ids":["MDL-000026","MDL-000126","MDL-000128","MDL-000129","MDL-000421"],"company_ids":["CMP-000077","CMP-000146","CMP-000133","CMP-000134","CMP-000274"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-081","entity_type":"technology","slug":"dpss-laser","legacy_code":"L23","name":"DPSS lasers","family":"Laser source","aliases":["dpss"],"description":"Diode-pumped solid-state lasers.","equipment_ids":[],"process_ids":[],"model_ids":["MDL-000008","MDL-000028","MDL-000030","MDL-000052","MDL-000069","MDL-000130"],"company_ids":["CMP-000012","CMP-000141","CMP-000142","CMP-000079","CMP-000145","CMP-000135"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-082","entity_type":"technology","slug":"excimer","legacy_code":"L24","name":"Excimer lasers","family":"Laser source","aliases":[],"description":"Pulsed UV gas lasers (e.g. 193, 248, 308 nm).","equipment_ids":[],"process_ids":["PRS-054","PRS-055"],"model_ids":["MDL-000053","MDL-000062","MDL-000066","MDL-000067","MDL-000068","MDL-000072","MDL-000078","MDL-000102","MDL-000342","MDL-000343"],"company_ids":["CMP-000079","CMP-000175","CMP-000145","CMP-000032","CMP-000052","CMP-000228"],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"},{"id":"TEC-083","entity_type":"technology","slug":"diode-laser","legacy_code":"L25","name":"Diode lasers","family":"Laser source","aliases":[],"description":"Semiconductor laser diodes.","equipment_ids":[],"process_ids":[],"model_ids":[],"company_ids":[],"content_basis":"Editorial reference; company/model links derived from source-backed categories and laser codes"}],"materials":[{"id":"MAT-001","entity_type":"material","slug":"silicon","name":"Silicon (Si)","material_class":"Substrate","description":"Mainstream single-crystal semiconductor substrate.","process_ids":["PRS-001","PRS-002","PRS-003","PRS-004","PRS-005","PRS-006","PRS-009","PRS-032","PRS-048"],"model_ids":["MDL-000027","MDL-000044","MDL-000064","MDL-000090","MDL-000116","MDL-000117","MDL-000229","MDL-000273","MDL-000275","MDL-000285","MDL-000287","MDL-000288","MDL-000321","MDL-000322","MDL-000372","MDL-000373","MDL-000390","MDL-000526"],"company_ids":["CMP-000141","CMP-000119","CMP-000177","CMP-000040","CMP-000184","CMP-000194","CMP-000005","CMP-000202","CMP-000006","CMP-000002","CMP-000219","CMP-000239","CMP-000253","CMP-000357"],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"Derived: text match on source-stated material / wafer / application fields","content_basis":"Editorial reference"},{"id":"MAT-002","entity_type":"material","slug":"soi","name":"Silicon-on-insulator (SOI)","material_class":"Substrate","description":"Silicon film on a buried oxide on a handle wafer.","process_ids":[],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"Derived: text match on source-stated material / wafer / application fields","content_basis":"Editorial reference"},{"id":"MAT-003","entity_type":"material","slug":"sic","name":"Silicon carbide (SiC)","material_class":"Substrate","description":"Wide-bandgap substrate for power devices; hard and difficult to slice and dice.","process_ids":["PRS-001","PRS-002","PRS-003","PRS-004","PRS-005","PRS-006","PRS-009","PRS-032"],"model_ids":["MDL-000003","MDL-000004","MDL-000027","MDL-000032","MDL-000033","MDL-000041","MDL-000044","MDL-000045","MDL-000060","MDL-000064","MDL-000090","MDL-000113","MDL-000167","MDL-000274","MDL-000283","MDL-000284","MDL-000292","MDL-000311","MDL-000356","MDL-000366","MDL-000367","MDL-000461","MDL-000525"],"company_ids":["CMP-000010","CMP-000141","CMP-000142","CMP-000117","CMP-000119","CMP-000174","CMP-000177","CMP-000040","CMP-000028","CMP-000104","CMP-000202","CMP-000006","CMP-000215","CMP-000232","CMP-000235","CMP-000302","CMP-000357"],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"Derived: text match on source-stated material / wafer / application fields","content_basis":"Editorial reference"},{"id":"MAT-004","entity_type":"material","slug":"gan","name":"Gallium nitride (GaN)","material_class":"Substrate","description":"Wide-bandgap compound semiconductor for power, RF and LEDs, usually as epitaxy on Si, SiC or sapphire.","process_ids":["PRS-001","PRS-009","PRS-032"],"model_ids":["MDL-000004","MDL-000113","MDL-000289","MDL-000290","MDL-000291","MDL-000461"],"company_ids":["CMP-000010","CMP-000028","CMP-000014","CMP-000302"],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"Derived: text match on source-stated material / wafer / application fields","content_basis":"Editorial reference"},{"id":"MAT-005","entity_type":"material","slug":"gaas","name":"Gallium arsenide (GaAs)","material_class":"Substrate","description":"III-V compound semiconductor for RF and optoelectronics.","process_ids":["PRS-001","PRS-009","PRS-032"],"model_ids":["MDL-000027","MDL-000044"],"company_ids":["CMP-000141","CMP-000119"],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"Derived: text match on source-stated material / wafer / application fields","content_basis":"Editorial reference"},{"id":"MAT-006","entity_type":"material","slug":"inp","name":"Indium phosphide (InP)","material_class":"Substrate","description":"III-V substrate for photonics and high-frequency devices.","process_ids":["PRS-001","PRS-009"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"Derived: text match on source-stated material / wafer / application fields","content_basis":"Editorial reference"},{"id":"MAT-007","entity_type":"material","slug":"sige","name":"Silicon-germanium (SiGe)","material_class":"Substrate","description":"Strained/alloy layers for high-performance transistors.","process_ids":[],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"Derived: text match on source-stated material / wafer / application fields","content_basis":"Editorial reference"},{"id":"MAT-008","entity_type":"material","slug":"germanium","name":"Germanium (Ge)","material_class":"Substrate","description":"Group-IV semiconductor substrate.","process_ids":[],"model_ids":["MDL-000027"],"company_ids":["CMP-000141"],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"Derived: text match on source-stated material / wafer / application fields","content_basis":"Editorial reference"},{"id":"MAT-009","entity_type":"material","slug":"sapphire","name":"Sapphire","material_class":"Substrate","description":"Al₂O₃ substrate widely used for GaN LEDs.","process_ids":["PRS-001"],"model_ids":["MDL-000339"],"company_ids":["CMP-000226"],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"Derived: text match on source-stated material / wafer / application fields","content_basis":"Editorial reference"},{"id":"MAT-010","entity_type":"material","slug":"glass","name":"Glass","material_class":"Substrate","description":"Glass carriers, interposers and core substrates.","process_ids":["PRS-032","PRS-044","PRS-048","PRS-053"],"model_ids":["MDL-000034","MDL-000035","MDL-000036","MDL-000043","MDL-000044","MDL-000050","MDL-000066","MDL-000110","MDL-000339","MDL-000360","MDL-000489","MDL-000490","MDL-000502"],"company_ids":["CMP-000143","CMP-000119","CMP-000078","CMP-000145","CMP-000016","CMP-000226","CMP-000233","CMP-000319"],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"Derived: text match on source-stated material / wafer / application fields","content_basis":"Editorial reference"},{"id":"MAT-011","entity_type":"material","slug":"lt-ln","name":"Lithium tantalate / niobate (LT/LN)","material_class":"Substrate","description":"Piezoelectric substrates for RF filters.","process_ids":[],"model_ids":["MDL-000044"],"company_ids":["CMP-000119"],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"Derived: text match on source-stated material / wafer / application fields","content_basis":"Editorial reference"},{"id":"MAT-012","entity_type":"material","slug":"nitrogen","name":"Nitrogen (N₂)","material_class":"Gas","description":"Bulk purge and carrier gas.","process_ids":["PRS-011","PRS-023","PRS-059","PRS-060"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference","supplier_company_ids_class_level":["CMP-000199","CMP-000311","CMP-000312","CMP-000313","CMP-000314","CMP-000315","CMP-000326","CMP-000342","CMP-000343","CMP-000344","CMP-000345","CMP-000346","CMP-000347","CMP-000348","CMP-000349","CMP-000350","CMP-000351","CMP-000352"]},{"id":"MAT-013","entity_type":"material","slug":"hydrogen","name":"Hydrogen (H₂)","material_class":"Gas","description":"Carrier / reducing gas.","process_ids":["PRS-011","PRS-060"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference","supplier_company_ids_class_level":["CMP-000199","CMP-000311","CMP-000312","CMP-000313","CMP-000314","CMP-000315","CMP-000326","CMP-000342","CMP-000343","CMP-000344","CMP-000345","CMP-000346","CMP-000347","CMP-000348","CMP-000349","CMP-000350","CMP-000351","CMP-000352"]},{"id":"MAT-014","entity_type":"material","slug":"oxygen","name":"Oxygen (O₂)","material_class":"Gas","description":"Oxidation and ashing gas.","process_ids":["PRS-011","PRS-021"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference","supplier_company_ids_class_level":["CMP-000199","CMP-000311","CMP-000312","CMP-000313","CMP-000314","CMP-000315","CMP-000326","CMP-000342","CMP-000343","CMP-000344","CMP-000345","CMP-000346","CMP-000347","CMP-000348","CMP-000349","CMP-000350","CMP-000351","CMP-000352"]},{"id":"MAT-015","entity_type":"material","slug":"argon","name":"Argon (Ar)","material_class":"Gas","description":"Inert sputter and carrier gas.","process_ids":["PRS-060"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference","supplier_company_ids_class_level":["CMP-000199","CMP-000311","CMP-000312","CMP-000313","CMP-000314","CMP-000315","CMP-000326","CMP-000342","CMP-000343","CMP-000344","CMP-000345","CMP-000346","CMP-000347","CMP-000348","CMP-000349","CMP-000350","CMP-000351","CMP-000352"]},{"id":"MAT-016","entity_type":"material","slug":"helium","name":"Helium (He)","material_class":"Gas","description":"Backside cooling and carrier gas.","process_ids":[],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference","supplier_company_ids_class_level":["CMP-000199","CMP-000311","CMP-000312","CMP-000313","CMP-000314","CMP-000315","CMP-000326","CMP-000342","CMP-000343","CMP-000344","CMP-000345","CMP-000346","CMP-000347","CMP-000348","CMP-000349","CMP-000350","CMP-000351","CMP-000352"]},{"id":"MAT-017","entity_type":"material","slug":"neon","name":"Neon (Ne)","material_class":"Gas","description":"Buffer gas in excimer laser light sources.","process_ids":["PRS-018"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference","supplier_company_ids_class_level":["CMP-000199","CMP-000311","CMP-000312","CMP-000313","CMP-000314","CMP-000315","CMP-000326","CMP-000342","CMP-000343","CMP-000344","CMP-000345","CMP-000346","CMP-000347","CMP-000348","CMP-000349","CMP-000350","CMP-000351","CMP-000352"]},{"id":"MAT-018","entity_type":"material","slug":"xenon","name":"Xenon (Xe)","material_class":"Gas","description":"Specialty gas used in some etch and light-source applications.","process_ids":[],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference","supplier_company_ids_class_level":["CMP-000199","CMP-000311","CMP-000312","CMP-000313","CMP-000314","CMP-000315","CMP-000326","CMP-000342","CMP-000343","CMP-000344","CMP-000345","CMP-000346","CMP-000347","CMP-000348","CMP-000349","CMP-000350","CMP-000351","CMP-000352"]},{"id":"MAT-019","entity_type":"material","slug":"fluorine-gases","name":"Fluorine-containing gases","material_class":"Gas","description":"e.g. CF₄, SF₆, NF₃ — etch and chamber-clean gases.","process_ids":["PRS-020","PRS-060"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference","supplier_company_ids_class_level":["CMP-000199","CMP-000311","CMP-000312","CMP-000313","CMP-000314","CMP-000315","CMP-000326","CMP-000342","CMP-000343","CMP-000344","CMP-000345","CMP-000346","CMP-000347","CMP-000348","CMP-000349","CMP-000350","CMP-000351","CMP-000352"]},{"id":"MAT-020","entity_type":"material","slug":"chlorine-gases","name":"Chlorine-containing gases","material_class":"Gas","description":"e.g. Cl₂, BCl₃ — metal and compound etch gases.","process_ids":["PRS-020","PRS-060"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference","supplier_company_ids_class_level":["CMP-000199","CMP-000311","CMP-000312","CMP-000313","CMP-000314","CMP-000315","CMP-000326","CMP-000342","CMP-000343","CMP-000344","CMP-000345","CMP-000346","CMP-000347","CMP-000348","CMP-000349","CMP-000350","CMP-000351","CMP-000352"]},{"id":"MAT-021","entity_type":"material","slug":"precursor-gases","name":"CVD / epitaxy precursor gases","material_class":"Gas","description":"e.g. silane, ammonia, metal-organics.","process_ids":["PRS-009","PRS-013","PRS-014"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference","supplier_company_ids_class_level":["CMP-000199","CMP-000311","CMP-000312","CMP-000313","CMP-000314","CMP-000315","CMP-000326","CMP-000342","CMP-000343","CMP-000344","CMP-000345","CMP-000346","CMP-000347","CMP-000348","CMP-000349","CMP-000350","CMP-000351","CMP-000352"]},{"id":"MAT-022","entity_type":"material","slug":"dopant-gases","name":"Dopant source gases","material_class":"Gas","description":"e.g. arsine, phosphine, BF₃ used in implantation and doping.","process_ids":["PRS-022"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference","supplier_company_ids_class_level":["CMP-000199","CMP-000311","CMP-000312","CMP-000313","CMP-000314","CMP-000315","CMP-000326","CMP-000342","CMP-000343","CMP-000344","CMP-000345","CMP-000346","CMP-000347","CMP-000348","CMP-000349","CMP-000350","CMP-000351","CMP-000352"]},{"id":"MAT-023","entity_type":"material","slug":"acids","name":"Acids","material_class":"Chemical","description":"e.g. HF, H₂SO₄, HCl used for cleaning and etching.","process_ids":["PRS-007","PRS-010","PRS-060"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference"},{"id":"MAT-024","entity_type":"material","slug":"bases","name":"Bases","material_class":"Chemical","description":"e.g. NH₄OH, TMAH solutions.","process_ids":["PRS-007","PRS-010"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference"},{"id":"MAT-025","entity_type":"material","slug":"solvents","name":"Solvents","material_class":"Chemical","description":"e.g. IPA, PGMEA.","process_ids":["PRS-010","PRS-017"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference"},{"id":"MAT-026","entity_type":"material","slug":"developers","name":"Developers","material_class":"Chemical","description":"Resist developers such as TMAH solutions.","process_ids":["PRS-019"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference"},{"id":"MAT-027","entity_type":"material","slug":"strippers","name":"Strippers","material_class":"Chemical","description":"Wet resist and residue removers.","process_ids":["PRS-021"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference"},{"id":"MAT-028","entity_type":"material","slug":"etchants","name":"Wet etchants","material_class":"Chemical","description":"Chemical mixtures for wet etching.","process_ids":["PRS-020"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference"},{"id":"MAT-029","entity_type":"material","slug":"photoresists","name":"Photoresists","material_class":"Chemical","description":"Radiation-sensitive polymers for lithography.","process_ids":["PRS-017","PRS-018"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference"},{"id":"MAT-030","entity_type":"material","slug":"plating-chemistry","name":"Plating chemistry","material_class":"Chemical","description":"Electrolytes and additives for electroplating.","process_ids":["PRS-025","PRS-037"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference"},{"id":"MAT-031","entity_type":"material","slug":"ultrapure-water","name":"Ultrapure water (UPW)","material_class":"Chemical","description":"Water purified to very high resistivity for rinsing and cleaning.","process_ids":["PRS-007","PRS-010","PRS-061"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference"},{"id":"MAT-032","entity_type":"material","slug":"ald-precursors","name":"ALD precursors","material_class":"Deposition material","description":"Volatile metal-organic or halide precursors for ALD.","process_ids":["PRS-013","PRS-015"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference"},{"id":"MAT-033","entity_type":"material","slug":"sputter-targets","name":"PVD sputter targets","material_class":"Deposition material","description":"High-purity metal and compound targets.","process_ids":["PRS-013","PRS-016","PRS-025"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference"},{"id":"MAT-034","entity_type":"material","slug":"cmp-slurry","name":"CMP slurry","material_class":"CMP consumable","description":"Abrasive chemical slurries.","process_ids":["PRS-006","PRS-024"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference"},{"id":"MAT-035","entity_type":"material","slug":"cmp-pad","name":"CMP pads","material_class":"CMP consumable","description":"Polymer polishing pads.","process_ids":["PRS-006","PRS-024"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference"},{"id":"MAT-036","entity_type":"material","slug":"cmp-conditioner","name":"Pad conditioners","material_class":"CMP consumable","description":"Diamond disks that restore pad texture.","process_ids":["PRS-024"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference"},{"id":"MAT-037","entity_type":"material","slug":"substrates","name":"Package substrates","material_class":"Packaging material","description":"Organic laminate substrates for packages.","process_ids":["PRS-033","PRS-035","PRS-048","PRS-053"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference"},{"id":"MAT-038","entity_type":"material","slug":"abf","name":"ABF build-up film","material_class":"Packaging material","description":"Ajinomoto build-up film dielectric used in package substrates.","process_ids":["PRS-053"],"model_ids":["MDL-000070"],"company_ids":["CMP-000148"],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"Derived: text match on source-stated material / wafer / application fields","content_basis":"Editorial reference"},{"id":"MAT-039","entity_type":"material","slug":"leadframes","name":"Leadframes","material_class":"Packaging material","description":"Stamped/etched metal frames for leaded packages.","process_ids":["PRS-033"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference"},{"id":"MAT-040","entity_type":"material","slug":"interposers","name":"Interposers","material_class":"Packaging material","description":"Silicon, organic or glass interposers.","process_ids":[],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference"},{"id":"MAT-041","entity_type":"material","slug":"molding-compound","name":"Epoxy molding compound","material_class":"Packaging material","description":"Encapsulant for packages.","process_ids":["PRS-036"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference"},{"id":"MAT-042","entity_type":"material","slug":"underfill","name":"Underfill","material_class":"Packaging material","description":"Capillary or molded underfill for flip-chip joints.","process_ids":["PRS-035","PRS-036"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference"},{"id":"MAT-043","entity_type":"material","slug":"die-attach-materials","name":"Die-attach materials","material_class":"Packaging material","description":"Epoxies, solders, sinter pastes, DAF.","process_ids":["PRS-033"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference"},{"id":"MAT-044","entity_type":"material","slug":"bonding-wire","name":"Bonding wire","material_class":"Packaging material","description":"Au, Cu, Ag or Al wire.","process_ids":["PRS-034"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference"},{"id":"MAT-045","entity_type":"material","slug":"solder","name":"Solder & bumps","material_class":"Packaging material","description":"Solder balls, bumps and pastes.","process_ids":["PRS-035"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference"},{"id":"MAT-046","entity_type":"material","slug":"dicing-tape","name":"Dicing / back-grinding tape","material_class":"Packaging material","description":"Tapes supporting wafers during thinning and dicing.","process_ids":["PRS-031"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"Derived: text match on source-stated material / wafer / application fields","content_basis":"Editorial reference"},{"id":"MAT-047","entity_type":"material","slug":"grinding-tape","name":"Back-grinding tape","material_class":"Packaging material","description":"Protective tape for wafer thinning.","process_ids":["PRS-030"],"model_ids":[],"company_ids":[],"supplier_company_ids":[],"grade_purity":null,"safety_class":null,"link_basis":"No model-level links (reference only)","content_basis":"Editorial reference"}],"applications":[{"id":"APP-001","entity_type":"application","slug":"logic","name":"Logic / foundry","group":"Logic","model_ids":["MDL-000056","MDL-000057","MDL-000058","MDL-000082","MDL-000092","MDL-000093","MDL-000095","MDL-000103","MDL-000104","MDL-000105","MDL-000106","MDL-000108","MDL-000538","MDL-000548","MDL-000257","MDL-000286","MDL-000408","MDL-000410","MDL-000411","MDL-000507","MDL-000509"],"company_ids":["CMP-000014","CMP-000002","CMP-000038","CMP-000001","CMP-000020","CMP-000101","CMP-000069","CMP-000103","CMP-000004","CMP-000263","CMP-000265","CMP-000266","CMP-000334"],"link_basis":"Derived: text match on source-stated application / technology fields"},{"id":"APP-002","entity_type":"application","slug":"cpu-gpu","name":"CPU / GPU","group":"Logic","model_ids":[],"company_ids":[],"link_basis":"Derived: text match on source-stated application / technology fields"},{"id":"APP-003","entity_type":"application","slug":"ai-accelerator","name":"AI accelerator / HPC","group":"Logic","model_ids":["MDL-000090","MDL-000091","MDL-000368","MDL-000397"],"company_ids":["CMP-000040","CMP-000236","CMP-000257"],"link_basis":"Derived: text match on source-stated application / technology fields"},{"id":"APP-004","entity_type":"application","slug":"mcu","name":"MCU / MPU","group":"Logic","model_ids":["MDL-000417"],"company_ids":["CMP-000270"],"link_basis":"Derived: text match on source-stated application / technology fields"},{"id":"APP-005","entity_type":"application","slug":"memory","name":"Memory (general)","group":"Memory","model_ids":["MDL-000001","MDL-000057","MDL-000095","MDL-000104","MDL-000105","MDL-000106","MDL-000108","MDL-000548","MDL-000256","MDL-000286","MDL-000406","MDL-000412","MDL-000507","MDL-000509","MDL-000511","MDL-000513"],"company_ids":["CMP-000010","CMP-000014","CMP-000020","CMP-000002","CMP-000101","CMP-000069","CMP-000103","CMP-000004","CMP-000038","CMP-000263","CMP-000266","CMP-000334","CMP-000335"],"link_basis":"Derived: text match on source-stated application / technology fields"},{"id":"APP-006","entity_type":"application","slug":"dram","name":"DRAM","group":"Memory","model_ids":["MDL-000093","MDL-000538","MDL-000410"],"company_ids":["CMP-000001","CMP-000002","CMP-000265"],"link_basis":"Derived: text match on source-stated application / technology fields"},{"id":"APP-007","entity_type":"application","slug":"nand","name":"NAND flash","group":"Memory","model_ids":["MDL-000106","MDL-000535","MDL-000538","MDL-000410"],"company_ids":["CMP-000069","CMP-000003","CMP-000002","CMP-000265"],"link_basis":"Derived: text match on source-stated application / technology fields"},{"id":"APP-008","entity_type":"application","slug":"hbm","name":"HBM","group":"Memory","model_ids":["MDL-000079","MDL-000080","MDL-000081","MDL-000082","MDL-000090","MDL-000092","MDL-000111","MDL-000112","MDL-000561","MDL-000506"],"company_ids":["CMP-000047","CMP-000048","CMP-000002","CMP-000040","CMP-000038","CMP-000016","CMP-000221","CMP-000067"],"link_basis":"Derived: text match on source-stated application / technology fields"},{"id":"APP-009","entity_type":"application","slug":"analog","name":"Analog / mixed-signal","group":"Analog & power","model_ids":["MDL-000215","MDL-000219","MDL-000415"],"company_ids":["CMP-000008","CMP-000037","CMP-000270"],"link_basis":"Derived: text match on source-stated application / technology fields"},{"id":"APP-010","entity_type":"application","slug":"power","name":"Power semiconductors","group":"Analog & power","model_ids":["MDL-000003","MDL-000004","MDL-000017","MDL-000024","MDL-000032","MDL-000033","MDL-000045","MDL-000059","MDL-000064","MDL-000549","MDL-000283","MDL-000284","MDL-000292","MDL-000353","MDL-000422","MDL-000464","MDL-000465"],"company_ids":["CMP-000010","CMP-000045","CMP-000077","CMP-000142","CMP-000119","CMP-000174","CMP-000177","CMP-000004","CMP-000006","CMP-000028","CMP-000231","CMP-000276","CMP-000303"],"link_basis":"Derived: text match on source-stated application / technology fields"},{"id":"APP-011","entity_type":"application","slug":"sic-power","name":"SiC power devices","group":"Analog & power","model_ids":["MDL-000003","MDL-000004","MDL-000027","MDL-000032","MDL-000033","MDL-000041","MDL-000044","MDL-000045","MDL-000060","MDL-000064","MDL-000090","MDL-000113","MDL-000167","MDL-000283","MDL-000284","MDL-000292","MDL-000356","MDL-000366","MDL-000367","MDL-000525"],"company_ids":["CMP-000010","CMP-000141","CMP-000142","CMP-000117","CMP-000119","CMP-000174","CMP-000177","CMP-000040","CMP-000028","CMP-000104","CMP-000006","CMP-000232","CMP-000235","CMP-000357"],"link_basis":"Derived: text match on source-stated application / technology fields"},{"id":"APP-012","entity_type":"application","slug":"gan-power-rf","name":"GaN power / RF devices","group":"Analog & power","model_ids":["MDL-000004","MDL-000113","MDL-000289","MDL-000290","MDL-000291","MDL-000461"],"company_ids":["CMP-000010","CMP-000028","CMP-000014","CMP-000302"],"link_basis":"Derived: text match on source-stated application / technology fields"},{"id":"APP-013","entity_type":"application","slug":"rf","name":"RF devices & filters","group":"RF","model_ids":["MDL-000113","MDL-000153","MDL-000154","MDL-000161","MDL-000289","MDL-000291","MDL-000418"],"company_ids":["CMP-000028","CMP-000170","CMP-000171","CMP-000007","CMP-000014","CMP-000270"],"link_basis":"Derived: text match on source-stated application / technology fields"},{"id":"APP-014","entity_type":"application","slug":"mems","name":"MEMS","group":"MEMS & sensors","model_ids":["MDL-000001","MDL-000078","MDL-000305","MDL-000353","MDL-000369","MDL-000451","MDL-000508"],"company_ids":["CMP-000010","CMP-000052","CMP-000212","CMP-000231","CMP-000237","CMP-000298","CMP-000334"],"link_basis":"Derived: text match on source-stated application / technology fields"},{"id":"APP-015","entity_type":"application","slug":"sensor","name":"Sensors / image sensors","group":"MEMS & sensors","model_ids":["MDL-000029","MDL-000078","MDL-000565","MDL-000423","MDL-000468","MDL-000516"],"company_ids":["CMP-000141","CMP-000052","CMP-000365","CMP-000276","CMP-000305","CMP-000335"],"link_basis":"Derived: text match on source-stated application / technology fields"},{"id":"APP-016","entity_type":"application","slug":"led-microled","name":"LED / MicroLED","group":"Photonics & display","model_ids":["MDL-000001","MDL-000052","MDL-000053","MDL-000062","MDL-000063","MDL-000066","MDL-000067","MDL-000068","MDL-000560","MDL-000305","MDL-000353","MDL-000478","MDL-000479","MDL-000480"],"company_ids":["CMP-000010","CMP-000079","CMP-000175","CMP-000145","CMP-000046","CMP-000212","CMP-000231","CMP-000141","CMP-000044","CMP-000310"],"link_basis":"Derived: text match on source-stated application / technology fields"},{"id":"APP-017","entity_type":"application","slug":"display","name":"Display (OLED / LTPS / panel)","group":"Photonics & display","model_ids":["MDL-000048","MDL-000052","MDL-000053","MDL-000062","MDL-000063","MDL-000066","MDL-000067","MDL-000068","MDL-000069","MDL-000559","MDL-000560","MDL-000361","MDL-000447","MDL-000453","MDL-000454","MDL-000478","MDL-000479","MDL-000480"],"company_ids":["CMP-000120","CMP-000079","CMP-000175","CMP-000145","CMP-000052","CMP-000046","CMP-000233","CMP-000294","CMP-000300","CMP-000141","CMP-000044","CMP-000310"],"link_basis":"Derived: text match on source-stated application / technology fields"},{"id":"APP-018","entity_type":"application","slug":"photonics","name":"Photonics / optoelectronics","group":"Photonics & display","model_ids":["MDL-000083","MDL-000084","MDL-000090","MDL-000289","MDL-000290","MDL-000300","MDL-000330","MDL-000377","MDL-000390","MDL-000391"],"company_ids":["CMP-000026","CMP-000040","CMP-000014","CMP-000210","CMP-000222","CMP-000241","CMP-000253"],"link_basis":"Derived: text match on source-stated application / technology fields"},{"id":"APP-019","entity_type":"application","slug":"advanced-packaging","name":"Advanced packaging","group":"Packaging","model_ids":["MDL-000034","MDL-000035","MDL-000043","MDL-000048","MDL-000050","MDL-000072","MDL-000078","MDL-000081","MDL-000082","MDL-000109","MDL-000110","MDL-000111","MDL-000556","MDL-000557","MDL-000558","MDL-000559","MDL-000561","MDL-000163","MDL-000169","MDL-000170","MDL-000183","MDL-000194","MDL-000195","MDL-000196","MDL-000229","MDL-000236","MDL-000238","MDL-000239","MDL-000240","MDL-000241","MDL-000264","MDL-000329","MDL-000336","MDL-000345","MDL-000352","MDL-000354","MDL-000368","MDL-000388","MDL-000482","MDL-000502","MDL-000505","MDL-000518"],"company_ids":["CMP-000143","CMP-000119","CMP-000120","CMP-000078","CMP-000032","CMP-000052","CMP-000048","CMP-000002","CMP-000103","CMP-000016","CMP-000051","CMP-000043","CMP-000221","CMP-000007","CMP-000104","CMP-000003","CMP-000004","CMP-000005","CMP-000018","CMP-000013","CMP-000224","CMP-000229","CMP-000231","CMP-000236","CMP-000251","CMP-000316","CMP-000046","CMP-000337"],"link_basis":"Derived: text match on source-stated application / technology fields"},{"id":"APP-020","entity_type":"application","slug":"automotive","name":"Automotive","group":"End market","model_ids":["MDL-000221"],"company_ids":["CMP-000005"],"link_basis":"Derived: text match on source-stated application / technology fields"}],"subsystems":[{"id":"SUB-001","entity_type":"subsystem","slug":"laser","name":"Laser subsystem","architecture":"Laser source (fiber, DPSS, ultrafast, excimer or CO₂) with power supply, cooling and beam delivery; in lithography an excimer or EUV light source.","functions":["Generate photons at the required wavelength, pulse duration and power"],"inputs":["Electrical power","Cooling water","Trigger / control signals"],"outputs":["Laser beam"],"critical_parameters":["Wavelength","Pulse duration","Pulse energy","Average power","Repetition rate","Beam quality (M²)"],"failure_modes":["Power drift","Pump diode degradation","Optics contamination"],"interfaces":["Trigger/sync to motion & scanner","Cooling loop","Interlock chain"],"integration_requirements":["Thermal stability","Beam pointing stability","Laser safety class"],"cost_drivers":["Source type and power class"],"component_ids":["CMPN-000010","CMPN-000011"],"potential_supplier_ids":["CMP-000133","CMP-000134","CMP-000135","CMP-000145","CMP-000146","CMP-000147","CMP-000148","CMP-000149","CMP-000150","CMP-000151","CMP-000178","CMP-000032"],"typical_equipment_ids":["EQP-A01.01","EQP-A01.02","EQP-A01.03","EQP-A01.04","EQP-A01.08","EQP-A14","EQP-A15","EQP-A23","EQP-A31","EQP-B05","EQP-B08","EQP-C01","EQP-C01.02","EQP-C01.03","EQP-C01.05","EQP-C06","EQP-C16","EQP-C18","EQP-C19","EQP-C26","EQP-C27","EQP-C28","EQP-C29","EQP-C30","EQP-C31","EQP-C32","EQP-C33","EQP-D14","EQP-E09","EQP-F01","EQP-F05","EQP-F06","EQP-F07","EQP-G01","EQP-G02","EQP-G03","EQP-G04","EQP-I05","EQP-I06","EQP-I07","EQP-I08","EQP-I10","EQP-K04"],"typical_oem_ids":["CMP-000001","CMP-000027","CMP-000182","CMP-000020","CMP-000032","CMP-000107","CMP-000110","CMP-000007","CMP-000209","CMP-000211","CMP-000251","CMP-000014","CMP-000077","CMP-000119","CMP-000141","CMP-000174","CMP-000175","CMP-000177","CMP-000004","CMP-000225","CMP-000226","CMP-000332","CMP-000018","CMP-000041","CMP-000078","CMP-000083","CMP-000087","CMP-000088","CMP-000257","CMP-000249","CMP-000324","CMP-000325","CMP-000292","CMP-000026","CMP-000010","CMP-000012","CMP-000045","CMP-000118","CMP-000121","CMP-000142","CMP-000195","CMP-000327","CMP-000011","CMP-000117","CMP-000230","CMP-000043","CMP-000044","CMP-000046","CMP-000047","CMP-000048","CMP-000067","CMP-000223","CMP-000233","CMP-000051","CMP-000052","CMP-000106","CMP-000326","CMP-000056","CMP-000057","CMP-000058","CMP-000144","CMP-000165","CMP-000191","CMP-000271","CMP-000274","CMP-000330","CMP-000120","CMP-000143","CMP-000148","CMP-000318","CMP-000049","CMP-000232","CMP-000235","CMP-000245","CMP-000028","CMP-000219","CMP-000367","CMP-000368","CMP-000079","CMP-000145","CMP-000176","CMP-000310","CMP-000227"],"localization_notes":["LO04","LO05","LO13","LO14"],"content_basis":"Editorial engineering reference; supplier lists from Batch-1 register"},{"id":"SUB-002","entity_type":"subsystem","slug":"optics","name":"Optical & beam-delivery subsystem","architecture":"Beam expanders, mirrors, scanners (galvo), f-theta or projection lenses, beam shapers/DOEs and modulators.","functions":["Shape, steer and focus the beam or image the pattern"],"inputs":["Laser beam / illumination"],"outputs":["Focused spot or projected image"],"critical_parameters":["Spot size","Field size","Numerical aperture","Transmission","Scan speed"],"failure_modes":["Contamination","Thermal lensing","Misalignment"],"interfaces":["Laser","Motion","Autofocus"],"integration_requirements":["Optical alignment","Purging"],"cost_drivers":["Lens complexity","Wavelength (UV optics)"],"component_ids":["CMPN-000012","CMPN-000013","CMPN-000014","CMPN-000015","CMPN-000016","CMPN-000017","CMPN-000018","CMPN-000019","CMPN-000020","CMPN-000021"],"potential_supplier_ids":["CMP-000154","CMP-000027","CMP-000155","CMP-000136","CMP-000146","CMP-000151","CMP-000152","CMP-000153","CMP-000156","CMP-000157"],"typical_equipment_ids":["EQP-A01","EQP-A01.01","EQP-A01.02","EQP-A01.03","EQP-A01.04","EQP-A01.05","EQP-A01.06","EQP-A01.07","EQP-A01.08","EQP-A14","EQP-A15","EQP-A21","EQP-A22","EQP-A23","EQP-A31","EQP-B01","EQP-B02","EQP-B03","EQP-B04","EQP-B05","EQP-B06","EQP-B07","EQP-B08","EQP-B09","EQP-B10","EQP-C01","EQP-C01.02","EQP-C01.03","EQP-C01.05","EQP-C06","EQP-C16","EQP-C18","EQP-C19","EQP-C26","EQP-C27","EQP-C28","EQP-C29","EQP-C30","EQP-C31","EQP-C32","EQP-C33","EQP-D14","EQP-E09","EQP-F01","EQP-F05","EQP-F06","EQP-F07","EQP-G01","EQP-G02","EQP-G03","EQP-G04","EQP-I05","EQP-I06","EQP-I07","EQP-I08","EQP-I10","EQP-K04"],"typical_oem_ids":["CMP-000016","CMP-000108","CMP-000111","CMP-000181","CMP-000208","CMP-000259","CMP-000360","CMP-000001","CMP-000027","CMP-000182","CMP-000020","CMP-000032","CMP-000107","CMP-000110","CMP-000013","CMP-000231","CMP-000209","CMP-000210","CMP-000234","CMP-000051","CMP-000212","CMP-000224","CMP-000252","CMP-000007","CMP-000211","CMP-000251","CMP-000014","CMP-000077","CMP-000119","CMP-000141","CMP-000174","CMP-000175","CMP-000177","CMP-000004","CMP-000225","CMP-000226","CMP-000332","CMP-000005","CMP-000018","CMP-000262","CMP-000299","CMP-000021","CMP-000257","CMP-000041","CMP-000078","CMP-000083","CMP-000087","CMP-000088","CMP-000249","CMP-000324","CMP-000325","CMP-000024","CMP-000292","CMP-000290","CMP-000291","CMP-000025","CMP-000309","CMP-000026","CMP-000010","CMP-000012","CMP-000045","CMP-000118","CMP-000121","CMP-000142","CMP-000195","CMP-000327","CMP-000011","CMP-000117","CMP-000230","CMP-000043","CMP-000044","CMP-000046","CMP-000047","CMP-000048","CMP-000067","CMP-000223","CMP-000233","CMP-000052","CMP-000106","CMP-000326","CMP-000056","CMP-000057","CMP-000058","CMP-000144","CMP-000165","CMP-000191","CMP-000271","CMP-000274","CMP-000330","CMP-000120","CMP-000143","CMP-000148","CMP-000318","CMP-000049","CMP-000232","CMP-000235","CMP-000245","CMP-000028","CMP-000219","CMP-000367","CMP-000368","CMP-000079","CMP-000145","CMP-000176","CMP-000310","CMP-000227"],"localization_notes":["LO01","LO03","LO04","LO13","LO17","LO18"],"content_basis":"Editorial engineering reference; supplier lists from Batch-1 register"},{"id":"SUB-003","entity_type":"subsystem","slug":"motion","name":"Motion subsystem","architecture":"Linear/rotary stages (mechanical or air-bearing) with linear or servo motors, encoders or interferometers and a motion controller.","functions":["Position wafer or head with required accuracy and speed"],"inputs":["Motion commands","Power"],"outputs":["Positioned substrate / tool"],"critical_parameters":["Travel","Accuracy","Repeatability","Velocity / acceleration","Settling time"],"failure_modes":["Encoder error","Thermal drift","Bearing wear"],"interfaces":["Motion controller","Laser trigger (PSO)","Vision"],"integration_requirements":["Vibration isolation","Thermal management"],"cost_drivers":["Accuracy class","Air bearings","Metrology frame"],"component_ids":["CMPN-000001","CMPN-000002","CMPN-000003","CMPN-000004","CMPN-000005","CMPN-000006","CMPN-000007","CMPN-000008","CMPN-000009","CMPN-000052"],"potential_supplier_ids":["CMP-000160","CMP-000158","CMP-000161","CMP-000159","CMP-000162"],"typical_equipment_ids":["EQP-A01","EQP-A01.01","EQP-A01.02","EQP-A01.03","EQP-A01.04","EQP-A01.05","EQP-A01.06","EQP-A01.07","EQP-A01.08","EQP-A14","EQP-A15","EQP-A23","EQP-A31","EQP-A33","EQP-B05","EQP-B07","EQP-B08","EQP-C01","EQP-C01.01","EQP-C01.02","EQP-C01.03","EQP-C01.04","EQP-C01.05","EQP-C06","EQP-C10","EQP-C11","EQP-C12","EQP-C16","EQP-C17","EQP-C18","EQP-C19","EQP-C26","EQP-C27","EQP-C28","EQP-C29","EQP-C30","EQP-C31","EQP-C32","EQP-C33","EQP-D14","EQP-E09","EQP-F01","EQP-F05","EQP-F06","EQP-F07","EQP-G01","EQP-G02","EQP-G03","EQP-G04","EQP-I05","EQP-I06","EQP-I07","EQP-I08","EQP-I10","EQP-K04"],"typical_oem_ids":["CMP-000016","CMP-000108","CMP-000111","CMP-000181","CMP-000208","CMP-000259","CMP-000360","CMP-000001","CMP-000027","CMP-000182","CMP-000020","CMP-000032","CMP-000107","CMP-000110","CMP-000013","CMP-000231","CMP-000209","CMP-000210","CMP-000234","CMP-000051","CMP-000212","CMP-000224","CMP-000252","CMP-000007","CMP-000211","CMP-000251","CMP-000014","CMP-000077","CMP-000119","CMP-000141","CMP-000174","CMP-000175","CMP-000177","CMP-000004","CMP-000225","CMP-000226","CMP-000332","CMP-000018","CMP-000041","CMP-000078","CMP-000083","CMP-000087","CMP-000088","CMP-000257","CMP-000249","CMP-000324","CMP-000325","CMP-000033","CMP-000034","CMP-000035","CMP-000036","CMP-000038","CMP-000304","CMP-000305","CMP-000306","CMP-000292","CMP-000025","CMP-000309","CMP-000026","CMP-000010","CMP-000012","CMP-000053","CMP-000045","CMP-000118","CMP-000121","CMP-000142","CMP-000195","CMP-000327","CMP-000011","CMP-000117","CMP-000005","CMP-000054","CMP-000055","CMP-000271","CMP-000230","CMP-000043","CMP-000044","CMP-000046","CMP-000050","CMP-000222","CMP-000223","CMP-000246","CMP-000253","CMP-000279","CMP-000280","CMP-000319","CMP-000229","CMP-000233","CMP-000276","CMP-000277","CMP-000278","CMP-000318","CMP-000047","CMP-000048","CMP-000067","CMP-000002","CMP-000103","CMP-000052","CMP-000106","CMP-000326","CMP-000056","CMP-000057","CMP-000058","CMP-000144","CMP-000165","CMP-000191","CMP-000274","CMP-000330","CMP-000120","CMP-000143","CMP-000148","CMP-000049","CMP-000232","CMP-000235","CMP-000245","CMP-000028","CMP-000219","CMP-000367","CMP-000368","CMP-000079","CMP-000145","CMP-000176","CMP-000310","CMP-000227"],"localization_notes":["LO04","LO06"],"content_basis":"Editorial engineering reference; supplier lists from Batch-1 register"},{"id":"SUB-004","entity_type":"subsystem","slug":"vacuum","name":"Vacuum subsystem","architecture":"Process chamber, load locks, dry/turbo/cryo pumps, valves, gauges and pressure control.","functions":["Create and control process vacuum"],"inputs":["Power","Purge N₂","Cooling"],"outputs":["Controlled chamber pressure"],"critical_parameters":["Base pressure","Pump-down time","Leak rate","Pressure control accuracy"],"failure_modes":["Leaks","Pump failure","Deposit build-up"],"interfaces":["Subfab pumps & abatement","Gas delivery","Controller"],"integration_requirements":["Chamber matching","Exhaust routing"],"cost_drivers":["Pump class","Chamber material"],"component_ids":["CMPN-000025","CMPN-000026","CMPN-000027","CMPN-000028","CMPN-000029","CMPN-000030"],"potential_supplier_ids":["CMP-000168","CMP-000169"],"typical_equipment_ids":["EQP-A01.01","EQP-A08","EQP-A08.01","EQP-A08.02","EQP-A08.03","EQP-A08.04","EQP-A08.05","EQP-A08.06","EQP-A09","EQP-A09.01","EQP-A09.02","EQP-A09.03","EQP-A09.04","EQP-A09.05","EQP-A09.06","EQP-A09.07","EQP-A09.08","EQP-A09.09","EQP-A09.10","EQP-A09.11","EQP-A10","EQP-A24","EQP-A26","EQP-A39","EQP-A41","EQP-A42","EQP-B07","EQP-C17","EQP-C18"],"typical_oem_ids":["CMP-000001","CMP-000027","CMP-000182","CMP-000002","CMP-000003","CMP-000004","CMP-000029","CMP-000054","CMP-000101","CMP-000102","CMP-000248","CMP-000335","CMP-000244","CMP-000220","CMP-000219","CMP-000323","CMP-000005","CMP-000229","CMP-000354","CMP-000022","CMP-000214","CMP-000028","CMP-000069","CMP-000218","CMP-000272","CMP-000103","CMP-000104","CMP-000217","CMP-000241","CMP-000265","CMP-000238","CMP-000030","CMP-000070","CMP-000213","CMP-000247","CMP-000255","CMP-000334","CMP-000336","CMP-000275","CMP-000286","CMP-000287","CMP-000288","CMP-000285","CMP-000006","CMP-000184","CMP-000194","CMP-000357","CMP-000283","CMP-000284","CMP-000015","CMP-000243","CMP-000338","CMP-000021","CMP-000063","CMP-000064","CMP-000363","CMP-000339","CMP-000023","CMP-000168","CMP-000169","CMP-000193","CMP-000294","CMP-000295","CMP-000025","CMP-000234","CMP-000309","CMP-000043","CMP-000044","CMP-000048","CMP-000051","CMP-000224","CMP-000052","CMP-000077","CMP-000106","CMP-000119","CMP-000326"],"localization_notes":["LO02"],"content_basis":"Editorial engineering reference; supplier lists from Batch-1 register"},{"id":"SUB-005","entity_type":"subsystem","slug":"rf","name":"RF / plasma subsystem","architecture":"RF generators, matching networks, electrodes/coils, electrostatic chuck and plasma sensors (e.g. OES).","functions":["Generate and sustain plasma with controlled density and ion energy"],"inputs":["AC power","Process gases"],"outputs":["Plasma"],"critical_parameters":["RF frequency","RF power","Reflected power","Pulsing"],"failure_modes":["Arcing","Match drift","Electrode erosion"],"interfaces":["Chamber","Controller","Endpoint detection"],"integration_requirements":["RF grounding & shielding","Chamber matching"],"cost_drivers":["Frequency bands","Power level"],"component_ids":["CMPN-000031","CMPN-000032","CMPN-000033","CMPN-000034","CMPN-000035"],"potential_supplier_ids":[],"typical_equipment_ids":["EQP-A07","EQP-A08","EQP-A08.01","EQP-A08.02","EQP-A08.03","EQP-A08.04","EQP-A08.05","EQP-A08.06","EQP-A09.02","EQP-A09.04","EQP-A09.06","EQP-A09.07","EQP-A09.08","EQP-C01.04"],"typical_oem_ids":["CMP-000003","CMP-000071","CMP-000216","CMP-000219","CMP-000271","CMP-000323","CMP-000358","CMP-000002","CMP-000004","CMP-000029","CMP-000054","CMP-000101","CMP-000102","CMP-000248","CMP-000335","CMP-000244","CMP-000220","CMP-000005","CMP-000229","CMP-000354","CMP-000103","CMP-000104","CMP-000217","CMP-000241","CMP-000265","CMP-000022","CMP-000030","CMP-000069","CMP-000070","CMP-000213","CMP-000214","CMP-000218","CMP-000247","CMP-000272","CMP-000255","CMP-000334","CMP-000336","CMP-000275","CMP-000286","CMP-000287","CMP-000288","CMP-000055"],"localization_notes":["LO02","LO16"],"content_basis":"Editorial engineering reference; supplier lists from Batch-1 register"},{"id":"SUB-006","entity_type":"subsystem","slug":"gas","name":"Gas delivery subsystem","architecture":"Gas panel with mass-flow controllers, valves, regulators, filters, purifiers; fed from gas cabinets/VMBs.","functions":["Deliver precise process gas mixtures"],"inputs":["Facility gases"],"outputs":["Controlled gas flow"],"critical_parameters":["Flow accuracy","Response time","Leak integrity","Purity"],"failure_modes":["MFC drift","Valve leakage","Contamination"],"interfaces":["Facility gas","Chamber","Controller","Toxic gas monitoring"],"integration_requirements":["Weld quality","Safety interlocks"],"cost_drivers":["Number of lines","Hazardous gas handling"],"component_ids":["CMPN-000040","CMPN-000041","CMPN-000042","CMPN-000043"],"potential_supplier_ids":[],"typical_equipment_ids":["EQP-A08","EQP-A08.01","EQP-A08.02","EQP-A08.03","EQP-A08.04","EQP-A08.05","EQP-A08.06","EQP-A09","EQP-A09.01","EQP-A09.02","EQP-A09.03","EQP-A09.04","EQP-A09.05","EQP-A09.06","EQP-A09.07","EQP-A09.08","EQP-A09.09","EQP-A09.10","EQP-A09.11","EQP-A10","EQP-A11","EQP-A12","EQP-A16","EQP-A43","EQP-G01","EQP-G02","EQP-G03","EQP-G04","EQP-G05","EQP-G06","EQP-G07"],"typical_oem_ids":["CMP-000002","CMP-000003","CMP-000004","CMP-000029","CMP-000054","CMP-000101","CMP-000102","CMP-000248","CMP-000335","CMP-000244","CMP-000220","CMP-000219","CMP-000323","CMP-000005","CMP-000229","CMP-000354","CMP-000022","CMP-000214","CMP-000028","CMP-000069","CMP-000218","CMP-000272","CMP-000103","CMP-000104","CMP-000217","CMP-000241","CMP-000265","CMP-000238","CMP-000030","CMP-000070","CMP-000213","CMP-000247","CMP-000255","CMP-000334","CMP-000336","CMP-000275","CMP-000286","CMP-000287","CMP-000288","CMP-000285","CMP-000006","CMP-000184","CMP-000194","CMP-000357","CMP-000283","CMP-000284","CMP-000015","CMP-000243","CMP-000338","CMP-000245","CMP-000358","CMP-000089","CMP-000172","CMP-000173","CMP-000196","CMP-000307","CMP-000308","CMP-000353","CMP-000014"],"localization_notes":["LO02","LO11"],"content_basis":"Editorial engineering reference; supplier lists from Batch-1 register"},{"id":"SUB-007","entity_type":"subsystem","slug":"chemical","name":"Chemical delivery subsystem","architecture":"Chemical supply modules, pumps, filters, heaters, dispense nozzles and recirculation.","functions":["Deliver and recirculate liquid chemistries"],"inputs":["Bulk chemicals","UPW"],"outputs":["Controlled dispense"],"critical_parameters":["Flow","Temperature","Concentration","Particle count"],"failure_modes":["Filter clogging","Pump failure","Concentration drift"],"interfaces":["Facility chemical distribution","Drain / exhaust"],"integration_requirements":["Material compatibility"],"cost_drivers":["Chemistry count","Materials (PFA)"],"component_ids":["CMPN-000044","CMPN-000045"],"potential_supplier_ids":[],"typical_equipment_ids":["EQP-A02","EQP-A03","EQP-A04","EQP-A05","EQP-A18","EQP-A19","EQP-A44","EQP-C25"],"typical_oem_ids":["CMP-000004","CMP-000106","CMP-000237","CMP-000273","CMP-000007","CMP-000104","CMP-000229","CMP-000240","CMP-000242","CMP-000264","CMP-000322","CMP-000354","CMP-000080","CMP-000081","CMP-000254","CMP-000337","CMP-000003","CMP-000002","CMP-000023","CMP-000105","CMP-000203","CMP-000235","CMP-000236","CMP-000302","CMP-000315","CMP-000089","CMP-000172","CMP-000173","CMP-000370","CMP-000082","CMP-000316","CMP-000317"],"localization_notes":[],"content_basis":"Editorial engineering reference; supplier lists from Batch-1 register"},{"id":"SUB-008","entity_type":"subsystem","slug":"wafer-handling","name":"Wafer-handling subsystem","architecture":"Load ports, EFEM, atmospheric/vacuum robots, aligners, FOUP interfaces.","functions":["Transfer wafers between carrier and process modules"],"inputs":["FOUPs / cassettes / frames"],"outputs":["Wafers at process position"],"critical_parameters":["Throughput","Placement repeatability","Particle adders"],"failure_modes":["Mis-picks","Wafer breakage","Robot calibration drift"],"interfaces":["SEMI E84/E87 load-port standards","Tool controller"],"integration_requirements":["Mini-environment cleanliness"],"cost_drivers":["Robot count","Vacuum handling"],"component_ids":["CMPN-000050"],"potential_supplier_ids":["CMP-000062","CMP-000063","CMP-000064","CMP-000144","CMP-000194"],"typical_equipment_ids":["EQP-A01","EQP-A01.01","EQP-A01.02","EQP-A01.03","EQP-A01.04","EQP-A01.05","EQP-A01.06","EQP-A01.07","EQP-A01.08","EQP-A02","EQP-A03","EQP-A04","EQP-A05","EQP-A06","EQP-A07","EQP-A08","EQP-A08.01","EQP-A08.02","EQP-A08.03","EQP-A08.04","EQP-A08.05","EQP-A08.06","EQP-A09","EQP-A09.01","EQP-A09.02","EQP-A09.03","EQP-A09.04","EQP-A09.05","EQP-A09.06","EQP-A09.07","EQP-A09.08","EQP-A09.09","EQP-A09.10","EQP-A09.11","EQP-A10","EQP-A11","EQP-A12","EQP-A13","EQP-A14","EQP-A15","EQP-A16","EQP-A17","EQP-A18","EQP-A19","EQP-A20","EQP-A21","EQP-A22","EQP-A23","EQP-A24","EQP-A25","EQP-A26","EQP-A27","EQP-A28","EQP-A29","EQP-A30","EQP-A31","EQP-A32","EQP-A33","EQP-A34","EQP-A35","EQP-A36","EQP-A37","EQP-A38","EQP-A39","EQP-A40","EQP-A41","EQP-A42","EQP-A43","EQP-A44","EQP-A45","EQP-B01","EQP-B02","EQP-B03","EQP-B04","EQP-B05","EQP-B06","EQP-B07","EQP-B08","EQP-B09","EQP-B10","EQP-C01","EQP-C01.01","EQP-C01.02","EQP-C01.03","EQP-C01.04","EQP-C01.05","EQP-C04","EQP-C06","EQP-C16","EQP-C17","EQP-C18","EQP-C19","EQP-C26","EQP-C27","EQP-C28","EQP-C29","EQP-C30","EQP-C31","EQP-C32","EQP-C33","EQP-D14","EQP-E09","EQP-F01","EQP-F05","EQP-F06","EQP-F07","EQP-G01","EQP-G02","EQP-G03","EQP-G04","EQP-I05","EQP-I06","EQP-I07","EQP-I08","EQP-I10","EQP-J01","EQP-J02","EQP-J03","EQP-J04","EQP-J05","EQP-J06","EQP-J07","EQP-J08","EQP-J09","EQP-J10","EQP-J11","EQP-J12","EQP-J13","EQP-J14","EQP-J15","EQP-K04"],"typical_oem_ids":["CMP-000016","CMP-000108","CMP-000111","CMP-000181","CMP-000208","CMP-000259","CMP-000360","CMP-000001","CMP-000027","CMP-000182","CMP-000020","CMP-000032","CMP-000107","CMP-000110","CMP-000013","CMP-000231","CMP-000209","CMP-000210","CMP-000234","CMP-000051","CMP-000212","CMP-000224","CMP-000252","CMP-000007","CMP-000211","CMP-000251","CMP-000004","CMP-000106","CMP-000237","CMP-000273","CMP-000104","CMP-000229","CMP-000240","CMP-000242","CMP-000264","CMP-000322","CMP-000354","CMP-000080","CMP-000081","CMP-000254","CMP-000337","CMP-000265","CMP-000298","CMP-000003","CMP-000071","CMP-000216","CMP-000219","CMP-000271","CMP-000323","CMP-000358","CMP-000002","CMP-000029","CMP-000054","CMP-000101","CMP-000102","CMP-000248","CMP-000335","CMP-000244","CMP-000220","CMP-000005","CMP-000022","CMP-000214","CMP-000028","CMP-000069","CMP-000218","CMP-000272","CMP-000103","CMP-000217","CMP-000241","CMP-000238","CMP-000030","CMP-000070","CMP-000213","CMP-000247","CMP-000255","CMP-000334","CMP-000336","CMP-000275","CMP-000286","CMP-000287","CMP-000288","CMP-000285","CMP-000006","CMP-000184","CMP-000194","CMP-000357","CMP-000283","CMP-000284","CMP-000015","CMP-000243","CMP-000338","CMP-000245","CMP-000014","CMP-000077","CMP-000119","CMP-000141","CMP-000174","CMP-000175","CMP-000177","CMP-000225","CMP-000226","CMP-000332","CMP-000023","CMP-000105","CMP-000203","CMP-000235","CMP-000236","CMP-000302","CMP-000315","CMP-000018","CMP-000262","CMP-000299","CMP-000021","CMP-000257","CMP-000041","CMP-000078","CMP-000083","CMP-000087","CMP-000088","CMP-000017","CMP-000019","CMP-000031","CMP-000180","CMP-000250","CMP-000258","CMP-000261","CMP-000341","CMP-000249","CMP-000324","CMP-000325","CMP-000008","CMP-000253","CMP-000260","CMP-000033","CMP-000034","CMP-000035","CMP-000036","CMP-000038","CMP-000304","CMP-000305","CMP-000306","CMP-000144","CMP-000363","CMP-000062","CMP-000063","CMP-000256","CMP-000320","CMP-000064","CMP-000321","CMP-000339","CMP-000168","CMP-000169","CMP-000193","CMP-000294","CMP-000295","CMP-000089","CMP-000172","CMP-000173","CMP-000196","CMP-000307","CMP-000308","CMP-000353","CMP-000370","CMP-000362","CMP-000296","CMP-000024","CMP-000292","CMP-000290","CMP-000291","CMP-000025","CMP-000309","CMP-000026","CMP-000010","CMP-000012","CMP-000053","CMP-000045","CMP-000118","CMP-000121","CMP-000142","CMP-000195","CMP-000327","CMP-000011","CMP-000117","CMP-000055","CMP-000116","CMP-000230","CMP-000043","CMP-000044","CMP-000046","CMP-000047","CMP-000048","CMP-000067","CMP-000223","CMP-000233","CMP-000052","CMP-000326","CMP-000056","CMP-000057","CMP-000058","CMP-000165","CMP-000191","CMP-000274","CMP-000330","CMP-000120","CMP-000143","CMP-000148","CMP-000318","CMP-000049","CMP-000232","CMP-000367","CMP-000368","CMP-000079","CMP-000145","CMP-000176","CMP-000310","CMP-000065","CMP-000366","CMP-000066","CMP-000369","CMP-000059","CMP-000060","CMP-000061","CMP-000085","CMP-000086","CMP-000293","CMP-000364","CMP-000365","CMP-000227"],"localization_notes":[],"content_basis":"Editorial engineering reference; supplier lists from Batch-1 register"},{"id":"SUB-009","entity_type":"subsystem","slug":"vision","name":"Vision & alignment subsystem","architecture":"Cameras, illumination, lenses, vision controllers, ID readers, autofocus/height sensors.","functions":["Align, recognise, inspect and read IDs"],"inputs":["Images"],"outputs":["Positions / measurements / pass-fail"],"critical_parameters":["Resolution","Frame rate","Alignment accuracy"],"failure_modes":["Recognition errors","Illumination drift"],"interfaces":["Motion controller","Tool software"],"integration_requirements":["Calibration"],"cost_drivers":["Sensor and optics grade"],"component_ids":["CMPN-000022","CMPN-000023","CMPN-000024","CMPN-000051"],"potential_supplier_ids":["CMP-000137","CMP-000163","CMP-000164","CMP-000165"],"typical_equipment_ids":["EQP-A01.08","EQP-A14","EQP-A15","EQP-A21","EQP-A22","EQP-A23","EQP-A31","EQP-B05","EQP-B08","EQP-C01","EQP-C01.01","EQP-C01.02","EQP-C01.03","EQP-C01.04","EQP-C01.05","EQP-C06","EQP-C10","EQP-C11","EQP-C12","EQP-C16","EQP-C17","EQP-C18","EQP-C19","EQP-C26","EQP-C27","EQP-C28","EQP-C29","EQP-C30","EQP-C31","EQP-C32","EQP-C33","EQP-C36","EQP-D14","EQP-E09","EQP-F01","EQP-F05","EQP-F06","EQP-F07","EQP-G01","EQP-G02","EQP-G03","EQP-G04","EQP-I05","EQP-I06","EQP-I07","EQP-I08","EQP-I10","EQP-K04"],"typical_oem_ids":["CMP-000007","CMP-000209","CMP-000211","CMP-000251","CMP-000014","CMP-000077","CMP-000119","CMP-000141","CMP-000174","CMP-000175","CMP-000177","CMP-000004","CMP-000225","CMP-000226","CMP-000332","CMP-000005","CMP-000016","CMP-000018","CMP-000262","CMP-000299","CMP-000021","CMP-000257","CMP-000041","CMP-000078","CMP-000083","CMP-000087","CMP-000088","CMP-000249","CMP-000324","CMP-000325","CMP-000292","CMP-000026","CMP-000010","CMP-000012","CMP-000053","CMP-000045","CMP-000118","CMP-000121","CMP-000142","CMP-000195","CMP-000327","CMP-000011","CMP-000117","CMP-000054","CMP-000055","CMP-000271","CMP-000230","CMP-000043","CMP-000044","CMP-000046","CMP-000050","CMP-000222","CMP-000223","CMP-000246","CMP-000253","CMP-000279","CMP-000280","CMP-000319","CMP-000224","CMP-000229","CMP-000233","CMP-000276","CMP-000277","CMP-000278","CMP-000318","CMP-000047","CMP-000048","CMP-000067","CMP-000002","CMP-000051","CMP-000103","CMP-000052","CMP-000106","CMP-000326","CMP-000056","CMP-000057","CMP-000058","CMP-000144","CMP-000165","CMP-000191","CMP-000274","CMP-000330","CMP-000032","CMP-000120","CMP-000143","CMP-000148","CMP-000049","CMP-000232","CMP-000268","CMP-000329","CMP-000235","CMP-000245","CMP-000028","CMP-000219","CMP-000367","CMP-000368","CMP-000079","CMP-000145","CMP-000176","CMP-000310","CMP-000227"],"localization_notes":["LO04","LO05","LO06"],"content_basis":"Editorial engineering reference; supplier lists from Batch-1 register"},{"id":"SUB-010","entity_type":"subsystem","slug":"metrology","name":"Metrology subsystem","architecture":"Measurement heads (optical, e-beam, X-ray, AFM) with reference standards and analysis software.","functions":["Measure dimensions, films and overlay"],"inputs":["Wafers"],"outputs":["Measurements"],"critical_parameters":["Precision","Accuracy","TMU"],"failure_modes":["Calibration drift"],"interfaces":["Fab APC / host"],"integration_requirements":["Tool matching"],"cost_drivers":["Measurement physics"],"component_ids":[],"potential_supplier_ids":[],"typical_equipment_ids":["EQP-A25","EQP-A26","EQP-A27","EQP-A28","EQP-A29","EQP-A30","EQP-B09"],"typical_oem_ids":["CMP-000005","CMP-000016","CMP-000017","CMP-000019","CMP-000031","CMP-000180","CMP-000250","CMP-000258","CMP-000261","CMP-000299","CMP-000341","CMP-000021","CMP-000220","CMP-000018","CMP-000026","CMP-000027"],"localization_notes":[],"content_basis":"Editorial engineering reference; supplier lists from Batch-1 register"},{"id":"SUB-011","entity_type":"subsystem","slug":"cooling","name":"Cooling subsystem","architecture":"Chillers, heat exchangers, cooling loops for sources, chucks and electronics.","functions":["Remove heat and stabilise temperatures"],"inputs":["Facility cooling water","Power"],"outputs":["Temperature-controlled coolant"],"critical_parameters":["Cooling capacity","Temperature stability"],"failure_modes":["Flow loss","Leaks"],"interfaces":["Laser / chuck / electronics"],"integration_requirements":["Facility water quality"],"cost_drivers":["Capacity and stability"],"component_ids":["CMPN-000038"],"potential_supplier_ids":["CMP-000138"],"typical_equipment_ids":["EQP-A01","EQP-A01.01","EQP-A01.02","EQP-A01.03","EQP-A01.04","EQP-A01.05","EQP-A01.06","EQP-A01.07","EQP-A01.08","EQP-A08","EQP-A08.01","EQP-A08.02","EQP-A08.03","EQP-A08.04","EQP-A08.05","EQP-A08.06","EQP-A09","EQP-A09.01","EQP-A09.02","EQP-A09.03","EQP-A09.04","EQP-A09.05","EQP-A09.06","EQP-A09.07","EQP-A09.08","EQP-A09.09","EQP-A09.10","EQP-A09.11","EQP-A10","EQP-A14","EQP-A15","EQP-A23","EQP-A31","EQP-B05","EQP-B08","EQP-C01","EQP-C01.02","EQP-C01.03","EQP-C01.05","EQP-C06","EQP-C16","EQP-C18","EQP-C19","EQP-C26","EQP-C27","EQP-C28","EQP-C29","EQP-C30","EQP-C31","EQP-C32","EQP-C33","EQP-D14","EQP-E09","EQP-F01","EQP-F05","EQP-F06","EQP-F07","EQP-G01","EQP-G02","EQP-G03","EQP-G04","EQP-I05","EQP-I06","EQP-I07","EQP-I08","EQP-I10","EQP-K04"],"typical_oem_ids":["CMP-000016","CMP-000108","CMP-000111","CMP-000181","CMP-000208","CMP-000259","CMP-000360","CMP-000001","CMP-000027","CMP-000182","CMP-000020","CMP-000032","CMP-000107","CMP-000110","CMP-000013","CMP-000231","CMP-000209","CMP-000210","CMP-000234","CMP-000051","CMP-000212","CMP-000224","CMP-000252","CMP-000007","CMP-000211","CMP-000251","CMP-000002","CMP-000003","CMP-000004","CMP-000029","CMP-000054","CMP-000101","CMP-000102","CMP-000248","CMP-000335","CMP-000244","CMP-000220","CMP-000219","CMP-000323","CMP-000005","CMP-000229","CMP-000354","CMP-000022","CMP-000214","CMP-000028","CMP-000069","CMP-000218","CMP-000272","CMP-000103","CMP-000104","CMP-000217","CMP-000241","CMP-000265","CMP-000238","CMP-000030","CMP-000070","CMP-000213","CMP-000247","CMP-000255","CMP-000334","CMP-000336","CMP-000275","CMP-000286","CMP-000287","CMP-000288","CMP-000285","CMP-000006","CMP-000184","CMP-000194","CMP-000357","CMP-000283","CMP-000284","CMP-000015","CMP-000243","CMP-000338","CMP-000014","CMP-000077","CMP-000119","CMP-000141","CMP-000174","CMP-000175","CMP-000177","CMP-000225","CMP-000226","CMP-000332","CMP-000018","CMP-000041","CMP-000078","CMP-000083","CMP-000087","CMP-000088","CMP-000257","CMP-000249","CMP-000324","CMP-000325","CMP-000292","CMP-000026","CMP-000010","CMP-000012","CMP-000045","CMP-000118","CMP-000121","CMP-000142","CMP-000195","CMP-000327","CMP-000011","CMP-000117","CMP-000230","CMP-000043","CMP-000044","CMP-000046","CMP-000047","CMP-000048","CMP-000067","CMP-000223","CMP-000233","CMP-000052","CMP-000106","CMP-000326","CMP-000056","CMP-000057","CMP-000058","CMP-000144","CMP-000165","CMP-000191","CMP-000271","CMP-000274","CMP-000330","CMP-000120","CMP-000143","CMP-000148","CMP-000318","CMP-000049","CMP-000232","CMP-000235","CMP-000245","CMP-000367","CMP-000368","CMP-000079","CMP-000145","CMP-000176","CMP-000310","CMP-000227"],"localization_notes":[],"content_basis":"Editorial engineering reference; supplier lists from Batch-1 register"},{"id":"SUB-012","entity_type":"subsystem","slug":"thermal","name":"Thermal subsystem","architecture":"Heaters, lamps, heated chucks, thermocouples/RTDs and temperature controllers.","functions":["Heat substrates to controlled profiles"],"inputs":["Power"],"outputs":["Controlled temperature"],"critical_parameters":["Ramp rate","Uniformity","Peak temperature"],"failure_modes":["Heater failure","Sensor drift"],"interfaces":["Controller"],"integration_requirements":["Thermal budget"],"cost_drivers":["Uniformity requirement"],"component_ids":["CMPN-000036","CMPN-000037","CMPN-000039"],"potential_supplier_ids":[],"typical_equipment_ids":["EQP-A11","EQP-A12","EQP-A13","EQP-A16","EQP-C16","EQP-C20","EQP-C38"],"typical_oem_ids":["CMP-000004","CMP-000104","CMP-000217","CMP-000238","CMP-000245","CMP-000218","CMP-000358","CMP-000007","CMP-000014","CMP-000022","CMP-000043","CMP-000044","CMP-000046","CMP-000047","CMP-000048","CMP-000067","CMP-000223","CMP-000233","CMP-000049","CMP-000050","CMP-000040","CMP-000263","CMP-000266","CMP-000267","CMP-000269"],"localization_notes":["LO06","LO08"],"content_basis":"Editorial engineering reference; supplier lists from Batch-1 register"},{"id":"SUB-013","entity_type":"subsystem","slug":"electrical","name":"Electrical & power subsystem","architecture":"Power distribution, SMPS, UPS, transformers, contactors, protection, cabling and connectors.","functions":["Distribute conditioned power safely"],"inputs":["Facility power"],"outputs":["Tool power rails"],"critical_parameters":["Power rating","Power quality"],"failure_modes":["Voltage sags","Component failure"],"interfaces":["Facility electrical"],"integration_requirements":["SEMI S2 electrical safety","EMC"],"cost_drivers":["Power rating"],"component_ids":["CMPN-000056","CMPN-000057","CMPN-000058","CMPN-000059","CMPN-000060","CMPN-000061"],"potential_supplier_ids":[],"typical_equipment_ids":["EQP-A01","EQP-A01.01","EQP-A01.02","EQP-A01.03","EQP-A01.04","EQP-A01.05","EQP-A01.06","EQP-A01.07","EQP-A01.08","EQP-A02","EQP-A03","EQP-A04","EQP-A05","EQP-A06","EQP-A07","EQP-A08","EQP-A08.01","EQP-A08.02","EQP-A08.03","EQP-A08.04","EQP-A08.05","EQP-A08.06","EQP-A09","EQP-A09.01","EQP-A09.02","EQP-A09.03","EQP-A09.04","EQP-A09.05","EQP-A09.06","EQP-A09.07","EQP-A09.08","EQP-A09.09","EQP-A09.10","EQP-A09.11","EQP-A10","EQP-A11","EQP-A12","EQP-A13","EQP-A14","EQP-A15","EQP-A16","EQP-A17","EQP-A18","EQP-A19","EQP-A20","EQP-A21","EQP-A22","EQP-A23","EQP-A24","EQP-A25","EQP-A26","EQP-A27","EQP-A28","EQP-A29","EQP-A30","EQP-A31","EQP-A32","EQP-A33","EQP-A34","EQP-A35","EQP-A36","EQP-A37","EQP-A38","EQP-A39","EQP-A40","EQP-A41","EQP-A42","EQP-A43","EQP-A44","EQP-A45","EQP-B01","EQP-B02","EQP-B03","EQP-B04","EQP-B05","EQP-B06","EQP-B07","EQP-B08","EQP-B09","EQP-B10","EQP-C01","EQP-C01.01","EQP-C01.02","EQP-C01.03","EQP-C01.04","EQP-C01.05","EQP-C02","EQP-C03","EQP-C04","EQP-C05","EQP-C06","EQP-C07","EQP-C08","EQP-C09","EQP-C10","EQP-C11","EQP-C12","EQP-C13","EQP-C14","EQP-C15","EQP-C16","EQP-C17","EQP-C18","EQP-C19","EQP-C20","EQP-C21","EQP-C22","EQP-C23","EQP-C24","EQP-C25","EQP-C26","EQP-C27","EQP-C28","EQP-C29","EQP-C30","EQP-C31","EQP-C32","EQP-C33","EQP-C34","EQP-C35","EQP-C36","EQP-C37","EQP-C38","EQP-C39","EQP-C40","EQP-C41","EQP-C42","EQP-D01","EQP-D02","EQP-D03","EQP-D04","EQP-D05","EQP-D06","EQP-D07","EQP-D08","EQP-D09","EQP-D10","EQP-D11","EQP-D12","EQP-D13","EQP-D14","EQP-D15","EQP-D16","EQP-D17","EQP-D18","EQP-D19","EQP-D20","EQP-D21","EQP-D22","EQP-D23","EQP-E09","EQP-F01","EQP-F05","EQP-F06","EQP-F07","EQP-G01","EQP-G02","EQP-G03","EQP-G04","EQP-I05","EQP-I06","EQP-I07","EQP-I08","EQP-I10","EQP-J01","EQP-J02","EQP-J03","EQP-J04","EQP-J05","EQP-J06","EQP-J07","EQP-J08","EQP-J09","EQP-J10","EQP-J11","EQP-J12","EQP-J13","EQP-J14","EQP-J15","EQP-K04"],"typical_oem_ids":["CMP-000016","CMP-000108","CMP-000111","CMP-000181","CMP-000208","CMP-000259","CMP-000360","CMP-000001","CMP-000027","CMP-000182","CMP-000020","CMP-000032","CMP-000107","CMP-000110","CMP-000013","CMP-000231","CMP-000209","CMP-000210","CMP-000234","CMP-000051","CMP-000212","CMP-000224","CMP-000252","CMP-000007","CMP-000211","CMP-000251","CMP-000004","CMP-000106","CMP-000237","CMP-000273","CMP-000104","CMP-000229","CMP-000240","CMP-000242","CMP-000264","CMP-000322","CMP-000354","CMP-000080","CMP-000081","CMP-000254","CMP-000337","CMP-000265","CMP-000298","CMP-000003","CMP-000071","CMP-000216","CMP-000219","CMP-000271","CMP-000323","CMP-000358","CMP-000002","CMP-000029","CMP-000054","CMP-000101","CMP-000102","CMP-000248","CMP-000335","CMP-000244","CMP-000220","CMP-000005","CMP-000022","CMP-000214","CMP-000028","CMP-000069","CMP-000218","CMP-000272","CMP-000103","CMP-000217","CMP-000241","CMP-000238","CMP-000030","CMP-000070","CMP-000213","CMP-000247","CMP-000255","CMP-000334","CMP-000336","CMP-000275","CMP-000286","CMP-000287","CMP-000288","CMP-000285","CMP-000006","CMP-000184","CMP-000194","CMP-000357","CMP-000283","CMP-000284","CMP-000015","CMP-000243","CMP-000338","CMP-000245","CMP-000014","CMP-000077","CMP-000119","CMP-000141","CMP-000174","CMP-000175","CMP-000177","CMP-000225","CMP-000226","CMP-000332","CMP-000023","CMP-000105","CMP-000203","CMP-000235","CMP-000236","CMP-000302","CMP-000315","CMP-000018","CMP-000262","CMP-000299","CMP-000021","CMP-000257","CMP-000041","CMP-000078","CMP-000083","CMP-000087","CMP-000088","CMP-000017","CMP-000019","CMP-000031","CMP-000180","CMP-000250","CMP-000258","CMP-000261","CMP-000341","CMP-000249","CMP-000324","CMP-000325","CMP-000008","CMP-000253","CMP-000260","CMP-000033","CMP-000034","CMP-000035","CMP-000036","CMP-000038","CMP-000304","CMP-000305","CMP-000306","CMP-000144","CMP-000363","CMP-000062","CMP-000063","CMP-000256","CMP-000320","CMP-000064","CMP-000321","CMP-000339","CMP-000168","CMP-000169","CMP-000193","CMP-000294","CMP-000295","CMP-000089","CMP-000172","CMP-000173","CMP-000196","CMP-000307","CMP-000308","CMP-000353","CMP-000370","CMP-000362","CMP-000296","CMP-000024","CMP-000292","CMP-000290","CMP-000291","CMP-000025","CMP-000309","CMP-000026","CMP-000010","CMP-000012","CMP-000053","CMP-000045","CMP-000118","CMP-000121","CMP-000142","CMP-000195","CMP-000327","CMP-000011","CMP-000117","CMP-000055","CMP-000059","CMP-000116","CMP-000230","CMP-000268","CMP-000279","CMP-000280","CMP-000328","CMP-000043","CMP-000044","CMP-000046","CMP-000050","CMP-000222","CMP-000223","CMP-000246","CMP-000319","CMP-000233","CMP-000276","CMP-000277","CMP-000278","CMP-000318","CMP-000047","CMP-000048","CMP-000067","CMP-000052","CMP-000326","CMP-000056","CMP-000057","CMP-000058","CMP-000049","CMP-000281","CMP-000316","CMP-000082","CMP-000317","CMP-000165","CMP-000191","CMP-000274","CMP-000330","CMP-000120","CMP-000143","CMP-000148","CMP-000232","CMP-000206","CMP-000329","CMP-000269","CMP-000040","CMP-000263","CMP-000266","CMP-000267","CMP-000039","CMP-000303","CMP-000009","CMP-000037","CMP-000270","CMP-000282","CMP-000221","CMP-000367","CMP-000368","CMP-000079","CMP-000145","CMP-000176","CMP-000310","CMP-000065","CMP-000366","CMP-000066","CMP-000369","CMP-000060","CMP-000061","CMP-000085","CMP-000086","CMP-000293","CMP-000364","CMP-000365","CMP-000227"],"localization_notes":[],"content_basis":"Editorial engineering reference; supplier lists from Batch-1 register"},{"id":"SUB-014","entity_type":"subsystem","slug":"control","name":"Control & automation subsystem","architecture":"Industrial PCs, PLCs, motion controllers, I/O and fieldbus networks.","functions":["Sequence the tool and coordinate subsystems"],"inputs":["Recipes","Sensor data"],"outputs":["Actuator commands","Data logs"],"critical_parameters":["Cycle determinism","I/O count"],"failure_modes":["Controller faults","Communication loss"],"interfaces":["SECS/GEM host interface","Fieldbuses"],"integration_requirements":["Software architecture"],"cost_drivers":["Controller platform"],"component_ids":["CMPN-000047","CMPN-000048","CMPN-000049","CMPN-000054"],"potential_supplier_ids":[],"typical_equipment_ids":["EQP-A01","EQP-A01.01","EQP-A01.02","EQP-A01.03","EQP-A01.04","EQP-A01.05","EQP-A01.06","EQP-A01.07","EQP-A01.08","EQP-A02","EQP-A03","EQP-A04","EQP-A05","EQP-A06","EQP-A07","EQP-A08","EQP-A08.01","EQP-A08.02","EQP-A08.03","EQP-A08.04","EQP-A08.05","EQP-A08.06","EQP-A09","EQP-A09.01","EQP-A09.02","EQP-A09.03","EQP-A09.04","EQP-A09.05","EQP-A09.06","EQP-A09.07","EQP-A09.08","EQP-A09.09","EQP-A09.10","EQP-A09.11","EQP-A10","EQP-A11","EQP-A12","EQP-A13","EQP-A14","EQP-A15","EQP-A16","EQP-A17","EQP-A18","EQP-A19","EQP-A20","EQP-A21","EQP-A22","EQP-A23","EQP-A24","EQP-A25","EQP-A26","EQP-A27","EQP-A28","EQP-A29","EQP-A30","EQP-A31","EQP-A32","EQP-A33","EQP-A34","EQP-A35","EQP-A36","EQP-A37","EQP-A38","EQP-A39","EQP-A40","EQP-A41","EQP-A42","EQP-A43","EQP-A44","EQP-A45","EQP-B01","EQP-B02","EQP-B03","EQP-B04","EQP-B05","EQP-B06","EQP-B07","EQP-B08","EQP-B09","EQP-B10","EQP-C01","EQP-C01.01","EQP-C01.02","EQP-C01.03","EQP-C01.04","EQP-C01.05","EQP-C02","EQP-C03","EQP-C04","EQP-C05","EQP-C06","EQP-C07","EQP-C08","EQP-C09","EQP-C10","EQP-C11","EQP-C12","EQP-C13","EQP-C14","EQP-C15","EQP-C16","EQP-C17","EQP-C18","EQP-C19","EQP-C20","EQP-C21","EQP-C22","EQP-C23","EQP-C24","EQP-C25","EQP-C26","EQP-C27","EQP-C28","EQP-C29","EQP-C30","EQP-C31","EQP-C32","EQP-C33","EQP-C34","EQP-C35","EQP-C36","EQP-C37","EQP-C38","EQP-C39","EQP-C40","EQP-C41","EQP-C42","EQP-D01","EQP-D02","EQP-D03","EQP-D04","EQP-D05","EQP-D06","EQP-D07","EQP-D08","EQP-D09","EQP-D10","EQP-D11","EQP-D12","EQP-D13","EQP-D14","EQP-D15","EQP-D16","EQP-D17","EQP-D18","EQP-D19","EQP-D20","EQP-D21","EQP-D22","EQP-D23","EQP-E09","EQP-F01","EQP-F05","EQP-F06","EQP-F07","EQP-G01","EQP-G02","EQP-G03","EQP-G04","EQP-I05","EQP-I06","EQP-I07","EQP-I08","EQP-I10","EQP-J01","EQP-J02","EQP-J03","EQP-J04","EQP-J05","EQP-J06","EQP-J07","EQP-J08","EQP-J09","EQP-J10","EQP-J11","EQP-J12","EQP-J13","EQP-J14","EQP-J15","EQP-K04"],"typical_oem_ids":["CMP-000016","CMP-000108","CMP-000111","CMP-000181","CMP-000208","CMP-000259","CMP-000360","CMP-000001","CMP-000027","CMP-000182","CMP-000020","CMP-000032","CMP-000107","CMP-000110","CMP-000013","CMP-000231","CMP-000209","CMP-000210","CMP-000234","CMP-000051","CMP-000212","CMP-000224","CMP-000252","CMP-000007","CMP-000211","CMP-000251","CMP-000004","CMP-000106","CMP-000237","CMP-000273","CMP-000104","CMP-000229","CMP-000240","CMP-000242","CMP-000264","CMP-000322","CMP-000354","CMP-000080","CMP-000081","CMP-000254","CMP-000337","CMP-000265","CMP-000298","CMP-000003","CMP-000071","CMP-000216","CMP-000219","CMP-000271","CMP-000323","CMP-000358","CMP-000002","CMP-000029","CMP-000054","CMP-000101","CMP-000102","CMP-000248","CMP-000335","CMP-000244","CMP-000220","CMP-000005","CMP-000022","CMP-000214","CMP-000028","CMP-000069","CMP-000218","CMP-000272","CMP-000103","CMP-000217","CMP-000241","CMP-000238","CMP-000030","CMP-000070","CMP-000213","CMP-000247","CMP-000255","CMP-000334","CMP-000336","CMP-000275","CMP-000286","CMP-000287","CMP-000288","CMP-000285","CMP-000006","CMP-000184","CMP-000194","CMP-000357","CMP-000283","CMP-000284","CMP-000015","CMP-000243","CMP-000338","CMP-000245","CMP-000014","CMP-000077","CMP-000119","CMP-000141","CMP-000174","CMP-000175","CMP-000177","CMP-000225","CMP-000226","CMP-000332","CMP-000023","CMP-000105","CMP-000203","CMP-000235","CMP-000236","CMP-000302","CMP-000315","CMP-000018","CMP-000262","CMP-000299","CMP-000021","CMP-000257","CMP-000041","CMP-000078","CMP-000083","CMP-000087","CMP-000088","CMP-000017","CMP-000019","CMP-000031","CMP-000180","CMP-000250","CMP-000258","CMP-000261","CMP-000341","CMP-000249","CMP-000324","CMP-000325","CMP-000008","CMP-000253","CMP-000260","CMP-000033","CMP-000034","CMP-000035","CMP-000036","CMP-000038","CMP-000304","CMP-000305","CMP-000306","CMP-000144","CMP-000363","CMP-000062","CMP-000063","CMP-000256","CMP-000320","CMP-000064","CMP-000321","CMP-000339","CMP-000168","CMP-000169","CMP-000193","CMP-000294","CMP-000295","CMP-000089","CMP-000172","CMP-000173","CMP-000196","CMP-000307","CMP-000308","CMP-000353","CMP-000370","CMP-000362","CMP-000296","CMP-000024","CMP-000292","CMP-000290","CMP-000291","CMP-000025","CMP-000309","CMP-000026","CMP-000010","CMP-000012","CMP-000053","CMP-000045","CMP-000118","CMP-000121","CMP-000142","CMP-000195","CMP-000327","CMP-000011","CMP-000117","CMP-000055","CMP-000059","CMP-000116","CMP-000230","CMP-000268","CMP-000279","CMP-000280","CMP-000328","CMP-000043","CMP-000044","CMP-000046","CMP-000050","CMP-000222","CMP-000223","CMP-000246","CMP-000319","CMP-000233","CMP-000276","CMP-000277","CMP-000278","CMP-000318","CMP-000047","CMP-000048","CMP-000067","CMP-000052","CMP-000326","CMP-000056","CMP-000057","CMP-000058","CMP-000049","CMP-000281","CMP-000316","CMP-000082","CMP-000317","CMP-000165","CMP-000191","CMP-000274","CMP-000330","CMP-000120","CMP-000143","CMP-000148","CMP-000232","CMP-000206","CMP-000329","CMP-000269","CMP-000040","CMP-000263","CMP-000266","CMP-000267","CMP-000039","CMP-000303","CMP-000009","CMP-000037","CMP-000270","CMP-000282","CMP-000221","CMP-000367","CMP-000368","CMP-000079","CMP-000145","CMP-000176","CMP-000310","CMP-000065","CMP-000366","CMP-000066","CMP-000369","CMP-000060","CMP-000061","CMP-000085","CMP-000086","CMP-000293","CMP-000364","CMP-000365","CMP-000227"],"localization_notes":["LO06","LO12"],"content_basis":"Editorial engineering reference; supplier lists from Batch-1 register"},{"id":"SUB-015","entity_type":"subsystem","slug":"safety","name":"Safety subsystem","architecture":"Safety PLC/relays, interlocks, EMO, enclosures, laser safety, gas detection and fume extraction.","functions":["Protect people and equipment"],"inputs":["Interlock and sensor signals"],"outputs":["Safe-state commands"],"critical_parameters":["Safety integrity level","Response time"],"failure_modes":["Interlock bypass","Sensor failure"],"interfaces":["All subsystems","Facility alarms"],"integration_requirements":["SEMI S2 / S8 compliance","Laser class enclosures"],"cost_drivers":["Hazard class"],"component_ids":["CMPN-000046","CMPN-000053"],"potential_supplier_ids":["CMP-000166"],"typical_equipment_ids":["EQP-A01","EQP-A01.01","EQP-A01.02","EQP-A01.03","EQP-A01.04","EQP-A01.05","EQP-A01.06","EQP-A01.07","EQP-A01.08","EQP-A02","EQP-A03","EQP-A04","EQP-A05","EQP-A06","EQP-A07","EQP-A08","EQP-A08.01","EQP-A08.02","EQP-A08.03","EQP-A08.04","EQP-A08.05","EQP-A08.06","EQP-A09","EQP-A09.01","EQP-A09.02","EQP-A09.03","EQP-A09.04","EQP-A09.05","EQP-A09.06","EQP-A09.07","EQP-A09.08","EQP-A09.09","EQP-A09.10","EQP-A09.11","EQP-A10","EQP-A11","EQP-A12","EQP-A13","EQP-A14","EQP-A15","EQP-A16","EQP-A17","EQP-A18","EQP-A19","EQP-A20","EQP-A21","EQP-A22","EQP-A23","EQP-A24","EQP-A25","EQP-A26","EQP-A27","EQP-A28","EQP-A29","EQP-A30","EQP-A31","EQP-A32","EQP-A33","EQP-A34","EQP-A35","EQP-A36","EQP-A37","EQP-A38","EQP-A39","EQP-A40","EQP-A41","EQP-A42","EQP-A43","EQP-A44","EQP-A45","EQP-B01","EQP-B02","EQP-B03","EQP-B04","EQP-B05","EQP-B06","EQP-B07","EQP-B08","EQP-B09","EQP-B10","EQP-C01","EQP-C01.01","EQP-C01.02","EQP-C01.03","EQP-C01.04","EQP-C01.05","EQP-C02","EQP-C03","EQP-C04","EQP-C05","EQP-C06","EQP-C07","EQP-C08","EQP-C09","EQP-C10","EQP-C11","EQP-C12","EQP-C13","EQP-C14","EQP-C15","EQP-C16","EQP-C17","EQP-C18","EQP-C19","EQP-C20","EQP-C21","EQP-C22","EQP-C23","EQP-C24","EQP-C25","EQP-C26","EQP-C27","EQP-C28","EQP-C29","EQP-C30","EQP-C31","EQP-C32","EQP-C33","EQP-C34","EQP-C35","EQP-C36","EQP-C37","EQP-C38","EQP-C39","EQP-C40","EQP-C41","EQP-C42","EQP-D01","EQP-D02","EQP-D03","EQP-D04","EQP-D05","EQP-D06","EQP-D07","EQP-D08","EQP-D09","EQP-D10","EQP-D11","EQP-D12","EQP-D13","EQP-D14","EQP-D15","EQP-D16","EQP-D17","EQP-D18","EQP-D19","EQP-D20","EQP-D21","EQP-D22","EQP-D23","EQP-E09","EQP-F01","EQP-F05","EQP-F06","EQP-F07","EQP-G01","EQP-G02","EQP-G03","EQP-G04","EQP-I05","EQP-I06","EQP-I07","EQP-I08","EQP-I10","EQP-K04"],"typical_oem_ids":["CMP-000016","CMP-000108","CMP-000111","CMP-000181","CMP-000208","CMP-000259","CMP-000360","CMP-000001","CMP-000027","CMP-000182","CMP-000020","CMP-000032","CMP-000107","CMP-000110","CMP-000013","CMP-000231","CMP-000209","CMP-000210","CMP-000234","CMP-000051","CMP-000212","CMP-000224","CMP-000252","CMP-000007","CMP-000211","CMP-000251","CMP-000004","CMP-000106","CMP-000237","CMP-000273","CMP-000104","CMP-000229","CMP-000240","CMP-000242","CMP-000264","CMP-000322","CMP-000354","CMP-000080","CMP-000081","CMP-000254","CMP-000337","CMP-000265","CMP-000298","CMP-000003","CMP-000071","CMP-000216","CMP-000219","CMP-000271","CMP-000323","CMP-000358","CMP-000002","CMP-000029","CMP-000054","CMP-000101","CMP-000102","CMP-000248","CMP-000335","CMP-000244","CMP-000220","CMP-000005","CMP-000022","CMP-000214","CMP-000028","CMP-000069","CMP-000218","CMP-000272","CMP-000103","CMP-000217","CMP-000241","CMP-000238","CMP-000030","CMP-000070","CMP-000213","CMP-000247","CMP-000255","CMP-000334","CMP-000336","CMP-000275","CMP-000286","CMP-000287","CMP-000288","CMP-000285","CMP-000006","CMP-000184","CMP-000194","CMP-000357","CMP-000283","CMP-000284","CMP-000015","CMP-000243","CMP-000338","CMP-000245","CMP-000014","CMP-000077","CMP-000119","CMP-000141","CMP-000174","CMP-000175","CMP-000177","CMP-000225","CMP-000226","CMP-000332","CMP-000023","CMP-000105","CMP-000203","CMP-000235","CMP-000236","CMP-000302","CMP-000315","CMP-000018","CMP-000262","CMP-000299","CMP-000021","CMP-000257","CMP-000041","CMP-000078","CMP-000083","CMP-000087","CMP-000088","CMP-000017","CMP-000019","CMP-000031","CMP-000180","CMP-000250","CMP-000258","CMP-000261","CMP-000341","CMP-000249","CMP-000324","CMP-000325","CMP-000008","CMP-000253","CMP-000260","CMP-000033","CMP-000034","CMP-000035","CMP-000036","CMP-000038","CMP-000304","CMP-000305","CMP-000306","CMP-000144","CMP-000363","CMP-000062","CMP-000063","CMP-000256","CMP-000320","CMP-000064","CMP-000321","CMP-000339","CMP-000168","CMP-000169","CMP-000193","CMP-000294","CMP-000295","CMP-000089","CMP-000172","CMP-000173","CMP-000196","CMP-000307","CMP-000308","CMP-000353","CMP-000370","CMP-000362","CMP-000296","CMP-000024","CMP-000292","CMP-000290","CMP-000291","CMP-000025","CMP-000309","CMP-000026","CMP-000010","CMP-000012","CMP-000053","CMP-000045","CMP-000118","CMP-000121","CMP-000142","CMP-000195","CMP-000327","CMP-000011","CMP-000117","CMP-000055","CMP-000059","CMP-000116","CMP-000230","CMP-000268","CMP-000279","CMP-000280","CMP-000328","CMP-000043","CMP-000044","CMP-000046","CMP-000050","CMP-000222","CMP-000223","CMP-000246","CMP-000319","CMP-000233","CMP-000276","CMP-000277","CMP-000278","CMP-000318","CMP-000047","CMP-000048","CMP-000067","CMP-000052","CMP-000326","CMP-000056","CMP-000057","CMP-000058","CMP-000049","CMP-000281","CMP-000316","CMP-000082","CMP-000317","CMP-000165","CMP-000191","CMP-000274","CMP-000330","CMP-000120","CMP-000143","CMP-000148","CMP-000232","CMP-000206","CMP-000329","CMP-000269","CMP-000040","CMP-000263","CMP-000266","CMP-000267","CMP-000039","CMP-000303","CMP-000009","CMP-000037","CMP-000270","CMP-000282","CMP-000221","CMP-000367","CMP-000368","CMP-000079","CMP-000145","CMP-000176","CMP-000310","CMP-000227"],"localization_notes":[],"content_basis":"Editorial engineering reference; supplier lists from Batch-1 register"},{"id":"SUB-016","entity_type":"subsystem","slug":"software","name":"Software subsystem","architecture":"Tool control software, recipe management, GUI, data collection and host communication.","functions":["Operate, log and integrate the tool with the factory"],"inputs":["Operator / host commands"],"outputs":["Tool actions","Reports"],"critical_parameters":["Recipe capacity","Data rates"],"failure_modes":["Bugs","Integration faults"],"interfaces":["SECS/GEM, GEM300, EDA/Interface A"],"integration_requirements":["Fab host integration"],"cost_drivers":["Development effort"],"component_ids":["CMPN-000055"],"potential_supplier_ids":["CMP-000151"],"typical_equipment_ids":["EQP-A01","EQP-A01.01","EQP-A01.02","EQP-A01.03","EQP-A01.04","EQP-A01.05","EQP-A01.06","EQP-A01.07","EQP-A01.08","EQP-A02","EQP-A03","EQP-A04","EQP-A05","EQP-A06","EQP-A07","EQP-A08","EQP-A08.01","EQP-A08.02","EQP-A08.03","EQP-A08.04","EQP-A08.05","EQP-A08.06","EQP-A09","EQP-A09.01","EQP-A09.02","EQP-A09.03","EQP-A09.04","EQP-A09.05","EQP-A09.06","EQP-A09.07","EQP-A09.08","EQP-A09.09","EQP-A09.10","EQP-A09.11","EQP-A10","EQP-A11","EQP-A12","EQP-A13","EQP-A14","EQP-A15","EQP-A16","EQP-A17","EQP-A18","EQP-A19","EQP-A20","EQP-A21","EQP-A22","EQP-A23","EQP-A24","EQP-A25","EQP-A26","EQP-A27","EQP-A28","EQP-A29","EQP-A30","EQP-A31","EQP-A32","EQP-A33","EQP-A34","EQP-A35","EQP-A36","EQP-A37","EQP-A38","EQP-A39","EQP-A40","EQP-A41","EQP-A42","EQP-A43","EQP-A44","EQP-A45","EQP-B01","EQP-B02","EQP-B03","EQP-B04","EQP-B05","EQP-B06","EQP-B07","EQP-B08","EQP-B09","EQP-B10","EQP-C01","EQP-C01.01","EQP-C01.02","EQP-C01.03","EQP-C01.04","EQP-C01.05","EQP-C02","EQP-C03","EQP-C04","EQP-C05","EQP-C06","EQP-C07","EQP-C08","EQP-C09","EQP-C10","EQP-C11","EQP-C12","EQP-C13","EQP-C14","EQP-C15","EQP-C16","EQP-C17","EQP-C18","EQP-C19","EQP-C20","EQP-C21","EQP-C22","EQP-C23","EQP-C24","EQP-C25","EQP-C26","EQP-C27","EQP-C28","EQP-C29","EQP-C30","EQP-C31","EQP-C32","EQP-C33","EQP-C34","EQP-C35","EQP-C36","EQP-C37","EQP-C38","EQP-C39","EQP-C40","EQP-C41","EQP-C42","EQP-D01","EQP-D02","EQP-D03","EQP-D04","EQP-D05","EQP-D06","EQP-D07","EQP-D08","EQP-D09","EQP-D10","EQP-D11","EQP-D12","EQP-D13","EQP-D14","EQP-D15","EQP-D16","EQP-D17","EQP-D18","EQP-D19","EQP-D20","EQP-D21","EQP-D22","EQP-D23","EQP-E09","EQP-F01","EQP-F05","EQP-F06","EQP-F07","EQP-G01","EQP-G02","EQP-G03","EQP-G04","EQP-I05","EQP-I06","EQP-I07","EQP-I08","EQP-I10","EQP-J01","EQP-J02","EQP-J03","EQP-J04","EQP-J05","EQP-J06","EQP-J07","EQP-J08","EQP-J09","EQP-J10","EQP-J11","EQP-J12","EQP-J13","EQP-J14","EQP-J15","EQP-K04"],"typical_oem_ids":["CMP-000016","CMP-000108","CMP-000111","CMP-000181","CMP-000208","CMP-000259","CMP-000360","CMP-000001","CMP-000027","CMP-000182","CMP-000020","CMP-000032","CMP-000107","CMP-000110","CMP-000013","CMP-000231","CMP-000209","CMP-000210","CMP-000234","CMP-000051","CMP-000212","CMP-000224","CMP-000252","CMP-000007","CMP-000211","CMP-000251","CMP-000004","CMP-000106","CMP-000237","CMP-000273","CMP-000104","CMP-000229","CMP-000240","CMP-000242","CMP-000264","CMP-000322","CMP-000354","CMP-000080","CMP-000081","CMP-000254","CMP-000337","CMP-000265","CMP-000298","CMP-000003","CMP-000071","CMP-000216","CMP-000219","CMP-000271","CMP-000323","CMP-000358","CMP-000002","CMP-000029","CMP-000054","CMP-000101","CMP-000102","CMP-000248","CMP-000335","CMP-000244","CMP-000220","CMP-000005","CMP-000022","CMP-000214","CMP-000028","CMP-000069","CMP-000218","CMP-000272","CMP-000103","CMP-000217","CMP-000241","CMP-000238","CMP-000030","CMP-000070","CMP-000213","CMP-000247","CMP-000255","CMP-000334","CMP-000336","CMP-000275","CMP-000286","CMP-000287","CMP-000288","CMP-000285","CMP-000006","CMP-000184","CMP-000194","CMP-000357","CMP-000283","CMP-000284","CMP-000015","CMP-000243","CMP-000338","CMP-000245","CMP-000014","CMP-000077","CMP-000119","CMP-000141","CMP-000174","CMP-000175","CMP-000177","CMP-000225","CMP-000226","CMP-000332","CMP-000023","CMP-000105","CMP-000203","CMP-000235","CMP-000236","CMP-000302","CMP-000315","CMP-000018","CMP-000262","CMP-000299","CMP-000021","CMP-000257","CMP-000041","CMP-000078","CMP-000083","CMP-000087","CMP-000088","CMP-000017","CMP-000019","CMP-000031","CMP-000180","CMP-000250","CMP-000258","CMP-000261","CMP-000341","CMP-000249","CMP-000324","CMP-000325","CMP-000008","CMP-000253","CMP-000260","CMP-000033","CMP-000034","CMP-000035","CMP-000036","CMP-000038","CMP-000304","CMP-000305","CMP-000306","CMP-000144","CMP-000363","CMP-000062","CMP-000063","CMP-000256","CMP-000320","CMP-000064","CMP-000321","CMP-000339","CMP-000168","CMP-000169","CMP-000193","CMP-000294","CMP-000295","CMP-000089","CMP-000172","CMP-000173","CMP-000196","CMP-000307","CMP-000308","CMP-000353","CMP-000370","CMP-000362","CMP-000296","CMP-000024","CMP-000292","CMP-000290","CMP-000291","CMP-000025","CMP-000309","CMP-000026","CMP-000010","CMP-000012","CMP-000053","CMP-000045","CMP-000118","CMP-000121","CMP-000142","CMP-000195","CMP-000327","CMP-000011","CMP-000117","CMP-000055","CMP-000059","CMP-000116","CMP-000230","CMP-000268","CMP-000279","CMP-000280","CMP-000328","CMP-000043","CMP-000044","CMP-000046","CMP-000050","CMP-000222","CMP-000223","CMP-000246","CMP-000319","CMP-000233","CMP-000276","CMP-000277","CMP-000278","CMP-000318","CMP-000047","CMP-000048","CMP-000067","CMP-000052","CMP-000326","CMP-000056","CMP-000057","CMP-000058","CMP-000049","CMP-000281","CMP-000316","CMP-000082","CMP-000317","CMP-000165","CMP-000191","CMP-000274","CMP-000330","CMP-000120","CMP-000143","CMP-000148","CMP-000232","CMP-000206","CMP-000329","CMP-000269","CMP-000040","CMP-000263","CMP-000266","CMP-000267","CMP-000039","CMP-000303","CMP-000009","CMP-000037","CMP-000270","CMP-000282","CMP-000221","CMP-000367","CMP-000368","CMP-000079","CMP-000145","CMP-000176","CMP-000310","CMP-000065","CMP-000366","CMP-000066","CMP-000369","CMP-000060","CMP-000061","CMP-000085","CMP-000086","CMP-000293","CMP-000364","CMP-000365","CMP-000227"],"localization_notes":[],"content_basis":"Editorial engineering reference; supplier lists from Batch-1 register"}],"components":[{"id":"CMPN-000001","entity_type":"component","slug":"servo-motor","name":"Servo motor","category":"Motion","subsystem_id":"SUB-003","legacy_bom_codes":["BOM14"],"capable_supplier_ids":[],"documented_supply_links":[],"gap":true,"gap_note":"No supplier with documented capability captured","product_model_ids":[],"india_supplier_ids":[],"source_ids":["SRC-000000"],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000002","entity_type":"component","slug":"servo-drive","name":"Servo drive / motion controller","category":"Motion","subsystem_id":"SUB-003","legacy_bom_codes":["BOM13"],"capable_supplier_ids":["CMP-000160"],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":["MDL-000143"],"india_supplier_ids":[],"source_ids":["SRC-000274","SRC-000275"],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000003","entity_type":"component","slug":"linear-motor","name":"Linear motor","category":"Motion","subsystem_id":"SUB-003","legacy_bom_codes":["BOM04"],"capable_supplier_ids":["CMP-000158","CMP-000161"],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":["MDL-000144"],"india_supplier_ids":[],"source_ids":["SRC-000271","SRC-000272","SRC-000276"],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000004","entity_type":"component","slug":"linear-stage","name":"Linear / air-bearing stage","category":"Motion","subsystem_id":"SUB-003","legacy_bom_codes":["BOM03"],"capable_supplier_ids":["CMP-000158","CMP-000159","CMP-000161"],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":["MDL-000141","MDL-000142"],"india_supplier_ids":[],"source_ids":["SRC-000271","SRC-000272","SRC-000273","SRC-000274","SRC-000276"],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000005","entity_type":"component","slug":"ball-screw","name":"Ball screw","category":"Motion","subsystem_id":"SUB-003","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000006","entity_type":"component","slug":"encoder","name":"Encoder / interferometer","category":"Motion","subsystem_id":"SUB-003","legacy_bom_codes":["BOM05"],"capable_supplier_ids":["CMP-000162"],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":["MDL-000145"],"india_supplier_ids":[],"source_ids":["SRC-000277"],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000007","entity_type":"component","slug":"bearing","name":"Bearing / guide rail","category":"Motion","subsystem_id":"SUB-003","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000008","entity_type":"component","slug":"actuator","name":"Actuator","category":"Motion","subsystem_id":"SUB-003","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000009","entity_type":"component","slug":"piezo-actuator","name":"Piezo actuator","category":"Motion","subsystem_id":"SUB-003","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000010","entity_type":"component","slug":"laser-source","name":"Laser source","category":"Optical","subsystem_id":"SUB-001","legacy_bom_codes":["BOM01"],"capable_supplier_ids":["CMP-000133","CMP-000134","CMP-000135","CMP-000145","CMP-000146","CMP-000147","CMP-000148","CMP-000149","CMP-000150","CMP-000151","CMP-000178"],"documented_supply_links":["SR001","SR002","SR003","SR004","SR005","SR006","SR007"],"gap":false,"gap_note":null,"product_model_ids":["MDL-000005","MDL-000026","MDL-000069","MDL-000122","MDL-000123","MDL-000124","MDL-000125","MDL-000126","MDL-000128","MDL-000129","MDL-000130"],"india_supplier_ids":[],"source_ids":["SRC-000053","SRC-000054","SRC-000102","SRC-000226","SRC-000069","SRC-000093","SRC-000096","SRC-000223","SRC-000267","SRC-000268","SRC-000266","SRC-000265","SRC-000094","SRC-000095","SRC-000159","SRC-000160","SRC-000161","SRC-000162","SRC-000163","SRC-000164","SRC-000269","SRC-000270","SRC-000260","SRC-000261","SRC-000230","SRC-000247","SRC-000262","SRC-000263","SRC-000259","SRC-000264","SRC-000254","SRC-000255","SRC-INT1","SRC-000166"],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000011","entity_type":"component","slug":"light-source-litho","name":"Lithography light source","category":"Optical","subsystem_id":"SUB-001","legacy_bom_codes":["LIGHT_SOURCE"],"capable_supplier_ids":["CMP-000032"],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":["SRC-000348"],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000012","entity_type":"component","slug":"beam-expander","name":"Beam expander","category":"Optical","subsystem_id":"SUB-002","legacy_bom_codes":["BOM07"],"capable_supplier_ids":["CMP-000154"],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":["SRC-000282"],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000013","entity_type":"component","slug":"mirror","name":"Mirror","category":"Optical","subsystem_id":"SUB-002","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000014","entity_type":"component","slug":"lens","name":"Lens / projection optics","category":"Optical","subsystem_id":"SUB-002","legacy_bom_codes":["OPTICS"],"capable_supplier_ids":["CMP-000027"],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":["SRC-000327"],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000015","entity_type":"component","slug":"f-theta-lens","name":"F-theta lens","category":"Optical","subsystem_id":"SUB-002","legacy_bom_codes":["BOM06"],"capable_supplier_ids":["CMP-000154","CMP-000155"],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":["MDL-000137","MDL-000138"],"india_supplier_ids":[],"source_ids":["SRC-000282","SRC-000283"],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000016","entity_type":"component","slug":"galvo-scanner","name":"Galvo scanner / scan head","category":"Optical","subsystem_id":"SUB-002","legacy_bom_codes":["BOM02"],"capable_supplier_ids":["CMP-000136","CMP-000146","CMP-000151","CMP-000152","CMP-000153"],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":["MDL-000127","MDL-000131","MDL-000133","MDL-000135","MDL-000136"],"india_supplier_ids":[],"source_ids":["SRC-000257","SRC-000258","SRC-000164","SRC-000269","SRC-000270","SRC-000254","SRC-000255","SRC-INT1","SRC-000251","SRC-000252","SRC-000253","SRC-000256"],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000017","entity_type":"component","slug":"beam-shaper","name":"Beam shaper / DOE","category":"Optical","subsystem_id":"SUB-002","legacy_bom_codes":["BOM20"],"capable_supplier_ids":["CMP-000152","CMP-000156"],"documented_supply_links":["SR014"],"gap":false,"gap_note":null,"product_model_ids":["MDL-000134","MDL-000139"],"india_supplier_ids":[],"source_ids":["SRC-000060","SRC-000251","SRC-000252","SRC-000253","SRC-000293"],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000018","entity_type":"component","slug":"aom","name":"Acousto-optic modulator (AOM)","category":"Optical","subsystem_id":"SUB-002","legacy_bom_codes":["BOM08"],"capable_supplier_ids":["CMP-000157"],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":["MDL-000140"],"india_supplier_ids":[],"source_ids":["SRC-000292"],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000019","entity_type":"component","slug":"isolator","name":"Optical isolator","category":"Optical","subsystem_id":"SUB-002","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000020","entity_type":"component","slug":"fiber","name":"Optical fiber / beam delivery","category":"Optical","subsystem_id":"SUB-002","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000021","entity_type":"component","slug":"photodetector","name":"Photodiode / optical detector","category":"Optical","subsystem_id":"SUB-002","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000022","entity_type":"component","slug":"camera","name":"Camera / ID reader","category":"Optical","subsystem_id":"SUB-009","legacy_bom_codes":["BOM09"],"capable_supplier_ids":["CMP-000137","CMP-000163","CMP-000164","CMP-000165"],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":["MDL-000146","MDL-000147","MDL-000148"],"india_supplier_ids":[],"source_ids":["SRC-000281","SRC-000278","SRC-000279","SRC-000280","SRC-INT1"],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000023","entity_type":"component","slug":"imaging-system","name":"Imaging system","category":"Optical","subsystem_id":"SUB-009","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000024","entity_type":"component","slug":"autofocus","name":"Autofocus / height sensor","category":"Optical","subsystem_id":"SUB-009","legacy_bom_codes":["BOM21"],"capable_supplier_ids":[],"documented_supply_links":[],"gap":true,"gap_note":"No supplier with documented capability captured","product_model_ids":[],"india_supplier_ids":[],"source_ids":["SRC-000000"],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000025","entity_type":"component","slug":"dry-pump","name":"Dry pump","category":"Vacuum","subsystem_id":"SUB-004","legacy_bom_codes":["BOM15"],"capable_supplier_ids":["CMP-000168","CMP-000169"],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":["SRC-000286","SRC-000287","SRC-000288","SRC-000289"],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000026","entity_type":"component","slug":"turbo-pump","name":"Turbo-molecular pump","category":"Vacuum","subsystem_id":"SUB-004","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000027","entity_type":"component","slug":"cryo-pump","name":"Cryo pump","category":"Vacuum","subsystem_id":"SUB-004","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000028","entity_type":"component","slug":"vacuum-gauge","name":"Vacuum gauge","category":"Vacuum","subsystem_id":"SUB-004","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000029","entity_type":"component","slug":"vacuum-valve","name":"Vacuum valve","category":"Vacuum","subsystem_id":"SUB-004","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000030","entity_type":"component","slug":"pressure-controller","name":"Pressure / vacuum controller","category":"Vacuum","subsystem_id":"SUB-004","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000031","entity_type":"component","slug":"rf-generator","name":"RF generator","category":"Plasma / RF","subsystem_id":"SUB-005","legacy_bom_codes":["SUB-RF"],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":["MDL-000153","MDL-000154"],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000032","entity_type":"component","slug":"rf-match","name":"RF match network","category":"Plasma / RF","subsystem_id":"SUB-005","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000033","entity_type":"component","slug":"electrode","name":"Electrode / showerhead","category":"Plasma / RF","subsystem_id":"SUB-005","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000034","entity_type":"component","slug":"esc","name":"Electrostatic chuck (ESC)","category":"Plasma / RF","subsystem_id":"SUB-005","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000035","entity_type":"component","slug":"oes","name":"Plasma sensor / OES","category":"Plasma / RF","subsystem_id":"SUB-005","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000036","entity_type":"component","slug":"heater","name":"Heater / lamp","category":"Thermal","subsystem_id":"SUB-012","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000037","entity_type":"component","slug":"thermocouple","name":"Thermocouple / RTD","category":"Thermal","subsystem_id":"SUB-012","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000038","entity_type":"component","slug":"chiller","name":"Chiller","category":"Thermal","subsystem_id":"SUB-011","legacy_bom_codes":["BOM16"],"capable_supplier_ids":["CMP-000138"],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":["MDL-000149"],"india_supplier_ids":[],"source_ids":["SRC-000284"],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000039","entity_type":"component","slug":"temp-controller","name":"Temperature controller","category":"Thermal","subsystem_id":"SUB-012","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000040","entity_type":"component","slug":"mfc","name":"Mass-flow controller (MFC)","category":"Gas / chemical","subsystem_id":"SUB-006","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000041","entity_type":"component","slug":"gas-cabinet","name":"Gas cabinet / VMB","category":"Gas / chemical","subsystem_id":"SUB-006","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000042","entity_type":"component","slug":"gas-valve","name":"Process valve / regulator","category":"Gas / chemical","subsystem_id":"SUB-006","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000043","entity_type":"component","slug":"gas-purifier","name":"Gas purifier / filter","category":"Gas / chemical","subsystem_id":"SUB-006","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000044","entity_type":"component","slug":"chemical-pump","name":"Chemical pump","category":"Gas / chemical","subsystem_id":"SUB-007","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000045","entity_type":"component","slug":"chemical-delivery","name":"Chemical delivery system","category":"Gas / chemical","subsystem_id":"SUB-007","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000046","entity_type":"component","slug":"fume-extraction","name":"Fume extraction","category":"Gas / chemical","subsystem_id":"SUB-015","legacy_bom_codes":["BOM17"],"capable_supplier_ids":["CMP-000166"],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":["MDL-000150"],"india_supplier_ids":[],"source_ids":["SRC-000285"],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000047","entity_type":"component","slug":"plc","name":"PLC","category":"Automation","subsystem_id":"SUB-014","legacy_bom_codes":["BOM11"],"capable_supplier_ids":[],"documented_supply_links":[],"gap":true,"gap_note":"No supplier with documented capability captured","product_model_ids":[],"india_supplier_ids":[],"source_ids":["SRC-000000"],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000048","entity_type":"component","slug":"ipc","name":"Industrial PC","category":"Automation","subsystem_id":"SUB-014","legacy_bom_codes":["BOM12"],"capable_supplier_ids":[],"documented_supply_links":[],"gap":true,"gap_note":"No supplier with documented capability captured","product_model_ids":[],"india_supplier_ids":[],"source_ids":["SRC-000000"],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000049","entity_type":"component","slug":"hmi","name":"HMI","category":"Automation","subsystem_id":"SUB-014","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000050","entity_type":"component","slug":"wafer-robot","name":"Wafer robot / EFEM","category":"Automation","subsystem_id":"SUB-008","legacy_bom_codes":["BOM22"],"capable_supplier_ids":["CMP-000062","CMP-000063","CMP-000064","CMP-000144","CMP-000194"],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":["CMP-000194"],"source_ids":["SRC-000214","SRC-000294","SRC-000295","SRC-000296","SRC-000297","SRC-000229","SRC-000246","SRC-000037","SRC-000207"],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000051","entity_type":"component","slug":"vision-controller","name":"Vision controller","category":"Automation","subsystem_id":"SUB-009","legacy_bom_codes":["BOM10"],"capable_supplier_ids":["CMP-000137","CMP-000163"],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":["SRC-000281","SRC-000278","SRC-000279"],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000052","entity_type":"component","slug":"motion-controller","name":"Motion controller","category":"Automation","subsystem_id":"SUB-003","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000053","entity_type":"component","slug":"safety-plc","name":"Safety PLC / safety system","category":"Automation","subsystem_id":"SUB-015","legacy_bom_codes":["BOM18"],"capable_supplier_ids":[],"documented_supply_links":[],"gap":true,"gap_note":"No supplier with documented capability captured","product_model_ids":[],"india_supplier_ids":[],"source_ids":["SRC-000000"],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000054","entity_type":"component","slug":"network-module","name":"Industrial network module","category":"Automation","subsystem_id":"SUB-014","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000055","entity_type":"component","slug":"tool-software","name":"Tool / scan-control software","category":"Automation","subsystem_id":"SUB-016","legacy_bom_codes":["BOM19"],"capable_supplier_ids":["CMP-000151"],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":["MDL-000132"],"india_supplier_ids":[],"source_ids":["SRC-000254","SRC-000255","SRC-INT1"],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000056","entity_type":"component","slug":"power-supply","name":"Power supply / SMPS","category":"Electrical","subsystem_id":"SUB-013","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000057","entity_type":"component","slug":"ups","name":"UPS","category":"Electrical","subsystem_id":"SUB-013","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000058","entity_type":"component","slug":"transformer","name":"Transformer","category":"Electrical","subsystem_id":"SUB-013","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000059","entity_type":"component","slug":"contactor-relay","name":"Contactor / relay","category":"Electrical","subsystem_id":"SUB-013","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000060","entity_type":"component","slug":"circuit-protection","name":"Circuit protection","category":"Electrical","subsystem_id":"SUB-013","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"},{"id":"CMPN-000061","entity_type":"component","slug":"cable-connector","name":"Cable / connector","category":"Electrical","subsystem_id":"SUB-013","legacy_bom_codes":[],"capable_supplier_ids":[],"documented_supply_links":[],"gap":false,"gap_note":null,"product_model_ids":[],"india_supplier_ids":[],"source_ids":[],"specification":null,"operating_range":null,"interface":null,"obsolescence_status":null,"content_basis":"Component class: editorial; supplier links: Batch-1 supplier register (source-backed capability, not proof of supply to a named OEM)"}],"suppliers":[{"company_id":"CMP-000001","name":"ASML Holding","country":"Netherlands","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000002","name":"Applied Materials","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000003","name":"Lam Research","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000004","name":"Tokyo Electron (TEL)","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000005","name":"KLA Corporation","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000006","name":"ASM International (ASMI)","country":"Netherlands","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000007","name":"SCREEN Holdings","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000008","name":"Advantest","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Test & probe","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000009","name":"Teradyne","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Test & probe","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000010","name":"DISCO Corporation","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000011","name":"Hamamatsu Photonics","country":"Japan","supplier_types":["Laser Supplier","Component Supplier"],"company_type":"Laser source","component_class_ids":["CMPN-000010"],"subsystem_ids":["SUB-001"],"documented_links":["SR001","SR002"],"capability_links":[]},{"company_id":"CMP-000012","name":"Tokyo Seimitsu (ACCRETECH)","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000013","name":"Canon Inc.","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000014","name":"Veeco Instruments","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000015","name":"Axcelis Technologies","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000016","name":"Onto Innovation","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000017","name":"Nova Ltd.","country":"Israel","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000018","name":"Camtek","country":"Israel","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000019","name":"Semilab","country":"Hungary","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000020","name":"Nikon Corporation","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000021","name":"Hitachi High-Tech","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000022","name":"Kokusai Electric","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000023","name":"Ebara Corporation","country":"Japan","supplier_types":["Vacuum Supplier","Subsystem Supplier"],"company_type":"Vacuum/abatement","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000024","name":"Lasertec","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000025","name":"NuFlare Technology","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000026","name":"Mycronic","country":"Sweden","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000027","name":"Carl Zeiss SMT","country":"Germany","supplier_types":["Optics Supplier","Component Supplier"],"company_type":"Critical component (optics)","component_class_ids":["CMPN-000014"],"subsystem_ids":["SUB-002"],"documented_links":[],"capability_links":["SR013"]},{"company_id":"CMP-000028","name":"AIXTRON","country":"Germany","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000029","name":"Oxford Instruments Plasma Technology","country":"United Kingdom","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000030","name":"Beneq","country":"Finland","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000031","name":"Thermo Fisher Scientific","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000032","name":"Gigaphoton","country":"Japan","supplier_types":["Laser Supplier","Component Supplier"],"company_type":"Laser source","component_class_ids":["CMPN-000011"],"subsystem_ids":["SUB-001"],"documented_links":[],"capability_links":["SR015"]},{"company_id":"CMP-000033","name":"Technoprobe","country":"Italy","supplier_types":["Equipment OEM"],"company_type":"Test & probe","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000034","name":"FormFactor","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Test & probe","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000035","name":"MPI Corporation","country":"Taiwan","supplier_types":["Equipment OEM"],"company_type":"Test & probe","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000036","name":"Cohu","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Test & probe","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000037","name":"Chroma ATE","country":"Taiwan","supplier_types":["Equipment OEM"],"company_type":"Test & probe","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000038","name":"Techwing","country":"South Korea","supplier_types":["Equipment OEM"],"company_type":"Test & probe","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000039","name":"TSE Co.","country":"South Korea","supplier_types":["Equipment OEM"],"company_type":"Test & probe","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000040","name":"Aehr Test Systems","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Test & probe","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000041","name":"ViTrox","country":"Malaysia","supplier_types":["Equipment OEM"],"company_type":"Test & probe","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000042","name":"Pentamaster","country":"Malaysia","supplier_types":["Automation Supplier","Robotics Supplier"],"company_type":"Automation/AMHS","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000043","name":"BE Semiconductor Industries (BESI)","country":"Netherlands","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000044","name":"ASMPT","country":"Hong Kong","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000045","name":"ASMPT ALSI (Advanced Laser Separation International)","country":"Netherlands","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":["CMPN-000017"],"subsystem_ids":["SUB-002"],"documented_links":["SR014"],"capability_links":[]},{"company_id":"CMP-000046","name":"Kulicke & Soffa","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000047","name":"Hanmi Semiconductor","country":"South Korea","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000048","name":"Hanwha Semitech","country":"South Korea","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000049","name":"TOWA Corporation","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000050","name":"Yamaha Robotics Holdings","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000051","name":"EV Group (EVG)","country":"Austria","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000052","name":"SUSS MicroTec","country":"Germany","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000053","name":"Advanced Dicing Technologies (ADT)","country":"Israel","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000054","name":"Plasma-Therm","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000055","name":"Panasonic Connect","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000056","name":"PacTech","country":"Germany","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000057","name":"Protec","country":"South Korea","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000058","name":"Laserssel","country":"South Korea","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000059","name":"Lintec","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000060","name":"Nitto Denko","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000061","name":"Tazmo","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000062","name":"Hirata Corporation","country":"Japan","supplier_types":["Automation Supplier","Robotics Supplier"],"company_type":"Automation/AMHS","component_class_ids":["CMPN-000050"],"subsystem_ids":["SUB-008"],"documented_links":[],"capability_links":["SR062"]},{"company_id":"CMP-000063","name":"RORZE Corporation","country":"Japan","supplier_types":["Automation Supplier","Robotics Supplier"],"company_type":"Automation/AMHS","component_class_ids":["CMPN-000050"],"subsystem_ids":["SUB-008"],"documented_links":[],"capability_links":["SR063"]},{"company_id":"CMP-000064","name":"Brooks Automation","country":"United States","supplier_types":["Automation Supplier","Robotics Supplier"],"company_type":"Automation/AMHS","component_class_ids":["CMPN-000050"],"subsystem_ids":["SUB-008"],"documented_links":[],"capability_links":["SR064"]},{"company_id":"CMP-000065","name":"Daifuku","country":"Japan","supplier_types":["Automation Supplier","Robotics Supplier"],"company_type":"Automation/AMHS","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000066","name":"Murata Machinery (Muratec)","country":"Japan","supplier_types":["Automation Supplier","Robotics Supplier"],"company_type":"Automation/AMHS","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000067","name":"SEMES","country":"South Korea","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000068","name":"SFA Engineering","country":"South Korea","supplier_types":["Automation Supplier","Robotics Supplier"],"company_type":"Automation/AMHS","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000069","name":"Wonik IPS","country":"South Korea","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000070","name":"Jusung Engineering","country":"South Korea","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000071","name":"PSK","country":"South Korea","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000072","name":"HPSP","country":"South Korea","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000073","name":"Eugene Technology","country":"South Korea","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000074","name":"Park Systems","country":"South Korea","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000075","name":"Top Engineering","country":"South Korea","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000076","name":"DIT","country":"South Korea","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000077","name":"EO Technics","country":"South Korea","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":["CMPN-000010"],"subsystem_ids":["SUB-001"],"documented_links":["SR004"],"capability_links":[]},{"company_id":"CMP-000078","name":"Philoptics","country":"South Korea","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000079","name":"AP Systems","country":"South Korea","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000080","name":"Grand Process Technology (GPTC)","country":"Taiwan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000081","name":"Scientech","country":"Taiwan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000082","name":"All Ring Tech","country":"Taiwan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000083","name":"Gallant Precision Machining (GPM)","country":"Taiwan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000084","name":"C Sun Manufacturing","country":"Taiwan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000085","name":"Gudeng Precision","country":"Taiwan","supplier_types":["Automation Supplier","Robotics Supplier"],"company_type":"Automation/AMHS","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000086","name":"Mirle Automation","country":"Taiwan","supplier_types":["Automation Supplier","Robotics Supplier"],"company_type":"Automation/AMHS","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000087","name":"Utechzone","country":"Taiwan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000088","name":"VisEra Technologies","country":"Taiwan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000089","name":"Marketech International","country":"Taiwan","supplier_types":["Integrator","Service Provider"],"company_type":"Facility/integration","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000090","name":"United Integrated Services (UIS)","country":"Taiwan","supplier_types":["Integrator","Service Provider"],"company_type":"Facility/integration","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000091","name":"Foxsemicon Integrated Technology","country":"Taiwan","supplier_types":["Subsystem Supplier"],"company_type":"Subsystem supplier","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000092","name":"Feedback Technology","country":"Taiwan","supplier_types":["Subsystem Supplier"],"company_type":"Subsystem supplier","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000093","name":"Topco Scientific","country":"Taiwan","supplier_types":["Distributor","Service Provider"],"company_type":"Distributor/service","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000101","name":"NAURA Technology Group","country":"China","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000102","name":"AMEC (Advanced Micro-Fabrication Equipment)","country":"China","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000103","name":"Piotech","country":"China","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000104","name":"ACM Research","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000105","name":"Hwatsing Technology","country":"China","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000106","name":"Kingsemi","country":"China","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000107","name":"SMEE (Shanghai Micro Electronics Equipment)","country":"China","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000108","name":"AMIES","country":"China","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000109","name":"SiCarrier","country":"China","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000110","name":"Yuliangsheng","country":"China","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000111","name":"Aishengna","country":"China","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000112","name":"Skyverse","country":"China","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000113","name":"Hangzhou Changchuan Technology","country":"China","supplier_types":["Equipment OEM"],"company_type":"Test & probe","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000114","name":"Accotest","country":"China","supplier_types":["Equipment OEM"],"company_type":"Test & probe","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000115","name":"Wuhan Jingce Electronic","country":"China","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000116","name":"JSG","country":"China","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000117","name":"Han's Laser Technology","country":"China","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000118","name":"HGTECH (Huagong Tech)","country":"China","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000119","name":"Suzhou Delphi Laser","country":"China","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000120","name":"Wuhan DR Laser Technology","country":"China","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000121","name":"Suzhou Maxwell Technologies","country":"China","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000122","name":"Chengdu LasTop Tech","country":"China","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000123","name":"KMEPS","country":"China","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000124","name":"HSET","country":"China","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000125","name":"Shenzhen Teyan Semiconductor Equipment","country":"China","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000126","name":"Dolphin Laser","country":"China","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000127","name":"CHN.GIE","country":"China","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000128","name":"CASIC (laser equipment unit)","country":"China","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000129","name":"Lumi Laser","country":"China","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000130","name":"Suzhou Quick Laser Technology","country":"China","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000131","name":"Intech Technologies","country":null,"supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000132","name":"HiPA Photonics","country":"China","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000139","name":"Dynatex International","country":null,"supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000140","name":"Loadpoint","country":null,"supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000133","name":"Wuhan Raycus Fiber Laser Technologies","country":"China","supplier_types":["Laser Supplier","Component Supplier"],"company_type":"Laser source","component_class_ids":["CMPN-000010"],"subsystem_ids":["SUB-001"],"documented_links":[],"capability_links":["SR016"]},{"company_id":"CMP-000134","name":"Shenzhen JPT Opto-electronics","country":"China","supplier_types":["Laser Supplier","Component Supplier"],"company_type":"Laser source","component_class_ids":["CMPN-000010"],"subsystem_ids":["SUB-001"],"documented_links":[],"capability_links":["SR017"]},{"company_id":"CMP-000135","name":"Wuhan Huaray Precision Laser","country":"China","supplier_types":["Laser Supplier","Component Supplier"],"company_type":"Laser source","component_class_ids":["CMPN-000010"],"subsystem_ids":["SUB-001"],"documented_links":[],"capability_links":["SR018"]},{"company_id":"CMP-000136","name":"Sino-Galvo","country":"China","supplier_types":["Optics Supplier","Component Supplier"],"company_type":"Optics/galvo","component_class_ids":["CMPN-000016"],"subsystem_ids":["SUB-002"],"documented_links":[],"capability_links":["SR027"]},{"company_id":"CMP-000137","name":"Hangzhou Hikrobot","country":"China","supplier_types":["Component Supplier"],"company_type":"Vision","component_class_ids":["CMPN-000022","CMPN-000051"],"subsystem_ids":["SUB-009"],"documented_links":[],"capability_links":["SR042","SR046"]},{"company_id":"CMP-000138","name":"TEYU S&A Chiller","country":"China","supplier_types":["Component Supplier"],"company_type":"Thermal/fume","component_class_ids":["CMPN-000038"],"subsystem_ids":["SUB-011"],"documented_links":[],"capability_links":["SR054"]},{"company_id":"CMP-000141","name":"3D-Micromac","country":"Germany","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000142","name":"Synova","country":"Switzerland","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000143","name":"LPKF Laser & Electronics","country":"Germany","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000144","name":"InnoLas Semiconductor","country":"Germany","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":["CMPN-000050"],"subsystem_ids":["SUB-008"],"documented_links":[],"capability_links":["SR065"]},{"company_id":"CMP-000145","name":"Coherent Corp.","country":"United States","supplier_types":["Laser Supplier","Component Supplier"],"company_type":"Laser source","component_class_ids":["CMPN-000010"],"subsystem_ids":["SUB-001"],"documented_links":["SR003","SR005"],"capability_links":["SR019"]},{"company_id":"CMP-000146","name":"IPG Photonics","country":"United States","supplier_types":["Laser Supplier","Component Supplier"],"company_type":"Laser source","component_class_ids":["CMPN-000010","CMPN-000016"],"subsystem_ids":["SUB-001","SUB-002"],"documented_links":["SR007"],"capability_links":["SR020","SR028"]},{"company_id":"CMP-000147","name":"TRUMPF","country":"Germany","supplier_types":["Laser Supplier","Component Supplier"],"company_type":"Laser source","component_class_ids":["CMPN-000010"],"subsystem_ids":["SUB-001"],"documented_links":["SR006"],"capability_links":["SR021"]},{"company_id":"CMP-000148","name":"MKS Instruments","country":"United States","supplier_types":["Laser Supplier","Component Supplier"],"company_type":"Laser source","component_class_ids":["CMPN-000010"],"subsystem_ids":["SUB-001"],"documented_links":[],"capability_links":["SR022"]},{"company_id":"CMP-000149","name":"Light Conversion","country":"Lithuania","supplier_types":["Laser Supplier","Component Supplier"],"company_type":"Laser source","component_class_ids":["CMPN-000010"],"subsystem_ids":["SUB-001"],"documented_links":[],"capability_links":["SR023"]},{"company_id":"CMP-000150","name":"Amplitude Laser","country":"France","supplier_types":["Laser Supplier","Component Supplier"],"company_type":"Laser source","component_class_ids":["CMPN-000010"],"subsystem_ids":["SUB-001"],"documented_links":[],"capability_links":["SR024"]},{"company_id":"CMP-000151","name":"Novanta (Cambridge Technology / Synrad)","country":"United States","supplier_types":["Optics Supplier","Component Supplier"],"company_type":"Optics/galvo","component_class_ids":["CMPN-000016","CMPN-000055","CMPN-000010"],"subsystem_ids":["SUB-001","SUB-002","SUB-016"],"documented_links":[],"capability_links":["SR025","SR029","SR058"]},{"company_id":"CMP-000152","name":"SCANLAB","country":"Germany","supplier_types":["Optics Supplier","Component Supplier"],"company_type":"Optics/galvo","component_class_ids":["CMPN-000016","CMPN-000017"],"subsystem_ids":["SUB-002"],"documented_links":[],"capability_links":["SR030","SR059"]},{"company_id":"CMP-000153","name":"RAYLASE","country":"Germany","supplier_types":["Optics Supplier","Component Supplier"],"company_type":"Optics/galvo","component_class_ids":["CMPN-000016"],"subsystem_ids":["SUB-002"],"documented_links":[],"capability_links":["SR031"]},{"company_id":"CMP-000154","name":"Sill Optics","country":"Germany","supplier_types":["Optics Supplier","Component Supplier"],"company_type":"Optics/galvo","component_class_ids":["CMPN-000015","CMPN-000012"],"subsystem_ids":["SUB-002"],"documented_links":[],"capability_links":["SR038","SR040"]},{"company_id":"CMP-000155","name":"Wavelength Opto-Electronic","country":"Singapore","supplier_types":["Optics Supplier","Component Supplier"],"company_type":"Optics/galvo","component_class_ids":["CMPN-000015"],"subsystem_ids":["SUB-002"],"documented_links":[],"capability_links":["SR039"]},{"company_id":"CMP-000156","name":"Holo/Or","country":"Israel","supplier_types":["Optics Supplier","Component Supplier"],"company_type":"Optics/galvo","component_class_ids":["CMPN-000017"],"subsystem_ids":["SUB-002"],"documented_links":[],"capability_links":["SR060"]},{"company_id":"CMP-000157","name":"Gooch & Housego","country":"United Kingdom","supplier_types":["Optics Supplier","Component Supplier"],"company_type":"Optics/galvo","component_class_ids":["CMPN-000018"],"subsystem_ids":["SUB-002"],"documented_links":[],"capability_links":["SR041"]},{"company_id":"CMP-000158","name":"Aerotech","country":"United States","supplier_types":["Motion Supplier","Component Supplier"],"company_type":"Motion","component_class_ids":["CMPN-000004","CMPN-000003"],"subsystem_ids":["SUB-003"],"documented_links":[],"capability_links":["SR032","SR035"]},{"company_id":"CMP-000159","name":"Physik Instrumente (PI)","country":"Germany","supplier_types":["Motion Supplier","Component Supplier"],"company_type":"Motion","component_class_ids":["CMPN-000004"],"subsystem_ids":["SUB-003"],"documented_links":[],"capability_links":["SR033"]},{"company_id":"CMP-000160","name":"ACS Motion Control","country":"Israel","supplier_types":["Motion Supplier","Component Supplier"],"company_type":"Motion","component_class_ids":["CMPN-000002"],"subsystem_ids":["SUB-003"],"documented_links":[],"capability_links":["SR050"]},{"company_id":"CMP-000161","name":"ETEL (HEIDENHAIN group)","country":"Switzerland","supplier_types":["Motion Supplier","Component Supplier"],"company_type":"Motion","component_class_ids":["CMPN-000003","CMPN-000004"],"subsystem_ids":["SUB-003"],"documented_links":[],"capability_links":["SR034","SR036"]},{"company_id":"CMP-000162","name":"Renishaw","country":"United Kingdom","supplier_types":["Motion Supplier","Component Supplier"],"company_type":"Motion","component_class_ids":["CMPN-000006"],"subsystem_ids":["SUB-003"],"documented_links":[],"capability_links":["SR037"]},{"company_id":"CMP-000163","name":"Cognex","country":"United States","supplier_types":["Component Supplier"],"company_type":"Vision","component_class_ids":["CMPN-000022","CMPN-000051"],"subsystem_ids":["SUB-009"],"documented_links":[],"capability_links":["SR043","SR047"]},{"company_id":"CMP-000164","name":"Basler","country":"Germany","supplier_types":["Component Supplier"],"company_type":"Vision","component_class_ids":["CMPN-000022"],"subsystem_ids":["SUB-009"],"documented_links":[],"capability_links":["SR044"]},{"company_id":"CMP-000165","name":"Keyence","country":"Japan","supplier_types":["Component Supplier"],"company_type":"Vision","component_class_ids":["CMPN-000022"],"subsystem_ids":["SUB-009"],"documented_links":[],"capability_links":["SR045"]},{"company_id":"CMP-000166","name":"ULT AG","country":"Germany","supplier_types":["Component Supplier"],"company_type":"Thermal/fume","component_class_ids":["CMPN-000046"],"subsystem_ids":["SUB-015"],"documented_links":[],"capability_links":["SR055"]},{"company_id":"CMP-000168","name":"Edwards Vacuum","country":"United Kingdom","supplier_types":["Vacuum Supplier","Subsystem Supplier"],"company_type":"Vacuum/abatement","component_class_ids":["CMPN-000025"],"subsystem_ids":["SUB-004"],"documented_links":[],"capability_links":["SR052"]},{"company_id":"CMP-000169","name":"Pfeiffer Vacuum+Fab Solutions","country":"Germany","supplier_types":["Vacuum Supplier","Subsystem Supplier"],"company_type":"Vacuum/abatement","component_class_ids":["CMPN-000025"],"subsystem_ids":["SUB-004"],"documented_links":[],"capability_links":["SR053"]},{"company_id":"CMP-000170","name":"Advanced Energy","country":"United States","supplier_types":["RF Supplier","Subsystem Supplier"],"company_type":"RF power","component_class_ids":["CMPN-000031"],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000171","name":"Comet PCT","country":"Switzerland","supplier_types":["RF Supplier","Subsystem Supplier"],"company_type":"RF power","component_class_ids":["CMPN-000031"],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000172","name":"Ultra Clean Holdings (UCT)","country":"United States","supplier_types":["Gas Supplier","Subsystem Supplier"],"company_type":"Gas/chemical delivery","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000173","name":"Ichor Systems","country":"United States","supplier_types":["Gas Supplier","Subsystem Supplier"],"company_type":"Gas/chemical delivery","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000174","name":"Sumitomo Heavy Industries (Mechatronics)","country":"Japan","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000175","name":"JSW Aktina System","country":"Japan","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000176","name":"The Japan Steel Works (JSW)","country":"Japan","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000177","name":"LASSE (Laser Systems & Solutions of Europe)","country":"France","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000178","name":"NKT Photonics","country":"Denmark","supplier_types":["Laser Supplier","Component Supplier"],"company_type":"Laser source","component_class_ids":["CMPN-000010"],"subsystem_ids":["SUB-001"],"documented_links":[],"capability_links":["SR026"]},{"company_id":"CMP-000180","name":"Nearfield Instruments","country":"Netherlands","supplier_types":["Equipment OEM"],"company_type":"Startup","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000181","name":"Substrate","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Startup","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000182","name":"xLight","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Startup","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000183","name":"Invisix","country":null,"supplier_types":["Equipment OEM"],"company_type":"Startup","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000184","name":"Raana Semiconductors","country":"India","supplier_types":["Equipment OEM"],"company_type":"Startup","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000191","name":"Titan Engineering & Automation Ltd (TEAL)","country":"India","supplier_types":["Automation Supplier","Robotics Supplier"],"company_type":"Automation/AMHS","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000192","name":"ASM Technologies","country":"India","supplier_types":["Service Provider"],"company_type":"Engineering services","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000193","name":"Hind High Vacuum (HHV)","country":"India","supplier_types":["Vacuum Supplier","Subsystem Supplier"],"company_type":"Vacuum/abatement","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000194","name":"ASM Technologies-HHV JV","country":"India","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":["CMPN-000050"],"subsystem_ids":["SUB-008"],"documented_links":[],"capability_links":["SR066"]},{"company_id":"CMP-000195","name":"SLTL (Sahajanand Laser Technology)","country":"India","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000196","name":"INOX India","country":"India","supplier_types":["Integrator","Service Provider"],"company_type":"Facility/integration","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000197","name":"Tessolve","country":"India","supplier_types":["Service Provider"],"company_type":"Engineering services","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000198","name":"ATS India","country":"India","supplier_types":["Distributor","Service Provider"],"company_type":"Distributor/service","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000199","name":"Linde India","country":"India","supplier_types":["Materials Supplier","Gas Supplier"],"company_type":"Materials/gases","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000200","name":"Aequs","country":"India","supplier_types":["Subsystem Supplier"],"company_type":"Subsystem supplier","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000201","name":"HCLTech (ATE lab)","country":"India","supplier_types":["Service Provider"],"company_type":"Engineering services","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000361","name":"Atlas Copco (Compressors)","country":"Sweden","supplier_types":["Integrator","Service Provider"],"company_type":"Facility/integration","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000362","name":"DAS Environmental Expert","country":"Germany","supplier_types":["Vacuum Supplier","Subsystem Supplier"],"company_type":"Vacuum/abatement","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000363","name":"Yaskawa Electric (Semiconductor robotics)","country":"Japan","supplier_types":["Automation Supplier","Robotics Supplier"],"company_type":"Automation/AMHS","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000364","name":"Cimetrix (PDF Solutions)","country":"United States","supplier_types":["Automation Supplier","Robotics Supplier"],"company_type":"Automation/AMHS","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000365","name":"INFICON","country":"Switzerland","supplier_types":["Subsystem Supplier"],"company_type":"Subsystem supplier","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000366","name":"SYNUS Tech","country":"South Korea","supplier_types":["Automation Supplier","Robotics Supplier"],"company_type":"Automation/AMHS","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000367","name":"V Technology","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000368","name":"Charm Engineering","country":"South Korea","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000369","name":"Omron (Industrial Automation)","country":"Japan","supplier_types":["Automation Supplier","Robotics Supplier"],"company_type":"Automation/AMHS","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000370","name":"Merck Electronics (EMD Electronics)","country":"Germany","supplier_types":["Gas Supplier","Subsystem Supplier"],"company_type":"Gas/chemical delivery","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000202","name":"PVA TePla","country":"Germany","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000203","name":"Okamoto Machine Tool Works","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000204","name":"Organo Corporation","country":"Japan","supplier_types":["Integrator","Service Provider"],"company_type":"Facility/integration","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000205","name":"Kurita Water Industries","country":"Japan","supplier_types":["Integrator","Service Provider"],"company_type":"Facility/integration","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000206","name":"Nordson Corporation","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000207","name":"SpeedFam","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000208","name":"Lace Lithography","country":"Norway","supplier_types":["Equipment OEM"],"company_type":"Startup","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000209","name":"Multibeam Corporation","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000210","name":"Raith","country":"Germany","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000211","name":"Heidelberg Instruments","country":"Germany","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000212","name":"Obducat","country":"Sweden","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000213","name":"Forge Nano","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Startup","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000214","name":"Angstrom Engineering","country":"Canada","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000215","name":"CVD Equipment Corporation","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000216","name":"Trymax Semiconductor Equipment","country":"Netherlands","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000217","name":"SVCS Process Innovation","country":"Czech Republic","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000218","name":"Annealsys","country":"France","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000219","name":"Samco Inc.","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000220","name":"SENTECH Instruments","country":"Germany","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000221","name":"Yield Engineering Systems (YES)","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000222","name":"Palomar Technologies","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000223","name":"Finetech","country":"Germany","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000224","name":"SET (Smart Equipment Technology)","country":"France","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000225","name":"Oxford Lasers","country":"United Kingdom","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000226","name":"Workshop of Photonics (WOP)","country":"Lithuania","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000227","name":"Halo Industries","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Startup","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000228","name":"LightMachinery","country":"Canada","supplier_types":["Laser Supplier","Component Supplier"],"company_type":"Laser source","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000229","name":"Shibaura Mechatronics","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000230","name":"Takatori Corporation","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000231","name":"Ushio Inc.","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000232","name":"Mitsuboshi Diamond Industrial","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000233","name":"Toray Engineering","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000234","name":"JEOL","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000235","name":"Revasum","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000236","name":"Amtech Systems","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000237","name":"Sono-Tek","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000238","name":"Tystar","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000239","name":"Linton Crystal Technologies","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000240","name":"Modutek","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000241","name":"Evatec","country":"Switzerland","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000242","name":"Siconnex","country":"Austria","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000243","name":"Ion Beam Services (IBS)","country":"France","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000244","name":"scia Systems","country":"Germany","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000245","name":"centrotherm international","country":"Germany","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000246","name":"PINK GmbH Thermosysteme","country":"Germany","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000247","name":"ATLANT 3D","country":"Denmark","supplier_types":["Equipment OEM"],"company_type":"Startup","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000248","name":"AlixLabs","country":"Sweden","supplier_types":["Equipment OEM"],"company_type":"Startup","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000249","name":"UNISERS","country":"Switzerland","supplier_types":["Equipment OEM"],"company_type":"Startup","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000250","name":"XwinSys Technology Development","country":"Israel","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000251","name":"Nanoscribe","country":"Germany","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000252","name":"SCIL Nanoimprint Solutions","country":"Netherlands","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000253","name":"ficonTEC","country":"Germany","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000254","name":"Semsysco","country":"Austria","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000255","name":"Kurt J. Lesker Company","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000256","name":"Kensington Laboratories","country":"United States","supplier_types":["Automation Supplier","Robotics Supplier"],"company_type":"Automation/AMHS","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000257","name":"Nanotronics","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000258","name":"Sigray","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000259","name":"Inversion Semiconductor","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Startup","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000260","name":"Xallent","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Startup","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000261","name":"AUROS Technology","country":"South Korea","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000262","name":"NEXTIN","country":"South Korea","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000263","name":"Exicon","country":"South Korea","supplier_types":["Equipment OEM"],"company_type":"Test & probe","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000264","name":"KCTech","country":"South Korea","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000265","name":"TES Co., Ltd.","country":"South Korea","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000266","name":"MIRAE Corporation","country":"South Korea","supplier_types":["Equipment OEM"],"company_type":"Test & probe","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000267","name":"UniTest","country":"South Korea","supplier_types":["Equipment OEM"],"company_type":"Test & probe","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000268","name":"Mi Equipment","country":"Malaysia","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000269","name":"AEM Holdings","country":"Singapore","supplier_types":["Equipment OEM"],"company_type":"Test & probe","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000270","name":"Aemulus","country":"Malaysia","supplier_types":["Equipment OEM"],"company_type":"Test & probe","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000271","name":"E&R Engineering","country":"Taiwan","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000272","name":"Jiangsu Leadmicro Nano-Technology","country":"China","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000273","name":"Holmarc Opto-Mechatronics","country":"India","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000274","name":"Scantech Laser","country":"India","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000275","name":"Excel Instruments","country":"India","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000276","name":"Hesse Mechatronics","country":"Germany","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000277","name":"West-Bond","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000278","name":"TPT Wire Bonder","country":"Germany","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000279","name":"Mühlbauer","country":"Germany","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000280","name":"ITEC","country":"Netherlands","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000281","name":"Boschman Technologies","country":"Netherlands","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000282","name":"inTEST Corporation","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Test & probe","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000283","name":"Riber","country":"France","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000284","name":"SVT Associates","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000285","name":"Dr. Eberl MBE-Komponenten","country":"Germany","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000286","name":"AJA International","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000287","name":"Semicore Equipment","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000288","name":"Torr International","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000289","name":"Corning (Tropel)","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000290","name":"Canatu","country":"Finland","supplier_types":["Optics Supplier","Component Supplier"],"company_type":"Critical component (optics)","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000291","name":"aweXome Ray","country":"South Korea","supplier_types":["Equipment OEM"],"company_type":"Startup","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000292","name":"Bruker (photomask repair & cleaning)","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000293","name":"Critical Manufacturing","country":"Portugal","supplier_types":["Automation Supplier","Robotics Supplier"],"company_type":"Automation/AMHS","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000294","name":"Kashiyama Industries","country":"Japan","supplier_types":["Vacuum Supplier","Subsystem Supplier"],"company_type":"Vacuum/abatement","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000295","name":"Leybold","country":"Germany","supplier_types":["Vacuum Supplier","Subsystem Supplier"],"company_type":"Vacuum/abatement","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000296","name":"Kanken Techno","country":"Japan","supplier_types":["Vacuum Supplier","Subsystem Supplier"],"company_type":"Vacuum/abatement","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000297","name":"Mirapro","country":"Japan","supplier_types":["Component Supplier"],"company_type":"Thermal/fume","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000298","name":"memsstar","country":"United Kingdom","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000299","name":"UnitySC","country":"France","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000300","name":"Kateeva","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Startup","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000301","name":"Lapmaster Wolters","country":"Germany","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000302","name":"Logitech","country":"United Kingdom","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000303","name":"TESEC Corporation","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Test & probe","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000304","name":"MICRONICS JAPAN","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Test & probe","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000305","name":"Japan Electronic Materials (JEM)","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Test & probe","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000306","name":"UIGREEN","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Test & probe","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000307","name":"HORIBA (HORIBA STEC)","country":"Japan","supplier_types":["Gas Supplier","Subsystem Supplier"],"company_type":"Gas/chemical delivery","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000308","name":"Fujikin","country":"Japan","supplier_types":["Gas Supplier","Subsystem Supplier"],"company_type":"Gas/chemical delivery","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000309","name":"IMS Nanofabrication","country":"Austria","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000310","name":"Uniqarta","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Startup","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000311","name":"SUMCO","country":"Japan","supplier_types":["Materials Supplier","Gas Supplier"],"company_type":"Materials/gases","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000312","name":"Siltronic","country":"Germany","supplier_types":["Materials Supplier","Gas Supplier"],"company_type":"Materials/gases","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000313","name":"SK siltron","country":"South Korea","supplier_types":["Materials Supplier","Gas Supplier"],"company_type":"Materials/gases","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000314","name":"FUJIFILM (semiconductor materials)","country":"Japan","supplier_types":["Materials Supplier","Gas Supplier"],"company_type":"Materials/gases","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000315","name":"Entegris","country":"United States","supplier_types":["Materials Supplier","Gas Supplier"],"company_type":"Materials/gases","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000316","name":"Musashi Engineering","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000317","name":"VERMES Microdispensing","country":"Germany","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000318","name":"F&K Delvotec","country":"Germany","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000319","name":"HYBOND","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000320","name":"SINFONIA TECHNOLOGY","country":"Japan","supplier_types":["Automation Supplier","Robotics Supplier"],"company_type":"Automation/AMHS","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000321","name":"Kawasaki Robotics","country":"Japan","supplier_types":["Automation Supplier","Robotics Supplier"],"company_type":"Automation/AMHS","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000322","name":"Akrion Systems (NAURA Akrion)","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000323","name":"Trion Technology","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000324","name":"Particle Measuring Systems","country":"United States","supplier_types":["Subsystem Supplier"],"company_type":"Subsystem supplier","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000325","name":"Lighthouse Worldwide Solutions","country":"United States","supplier_types":["Subsystem Supplier"],"company_type":"Subsystem supplier","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000326","name":"Brewer Science","country":"United States","supplier_types":["Materials Supplier","Gas Supplier"],"company_type":"Materials/gases","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000327","name":"Keteca Singapore","country":"Singapore","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000328","name":"MIT Semiconductor (Manufacturing Integration Technology)","country":"Singapore","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000329","name":"SRM Integration (Malaysia)","country":"Malaysia","supplier_types":["Equipment OEM"],"company_type":"Test & probe","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000330","name":"Micro Modular System (MMS)","country":"Malaysia","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000331","name":"DeepLASE Technologies","country":"India","supplier_types":["Equipment OEM"],"company_type":"Startup","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000332","name":"Suresh Indu Lasers","country":"India","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000333","name":"Teledyne Vision Solutions","country":"United States","supplier_types":["Component Supplier"],"company_type":"Vision","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000334","name":"ULVAC","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000335","name":"CANON ANELVA","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000336","name":"VON ARDENNE","country":"Germany","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000337","name":"SCHMID Group","country":"Germany","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000338","name":"Nissin Ion Equipment","country":"Japan","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000339","name":"Ferrotec","country":"Japan","supplier_types":["Subsystem Supplier"],"company_type":"Subsystem supplier","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000340","name":"HIWIN","country":"Taiwan","supplier_types":["Motion Supplier","Component Supplier"],"company_type":"Motion","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000341","name":"Freiberg Instruments","country":"Germany","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000342","name":"Tokyo Ohka Kogyo (TOK)","country":"Japan","supplier_types":["Materials Supplier","Gas Supplier"],"company_type":"Materials/gases","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000343","name":"JSR","country":"Japan","supplier_types":["Materials Supplier","Gas Supplier"],"company_type":"Materials/gases","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000344","name":"Shin-Etsu Chemical","country":"Japan","supplier_types":["Materials Supplier","Gas Supplier"],"company_type":"Materials/gases","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000345","name":"Dongjin Semichem","country":"South Korea","supplier_types":["Materials Supplier","Gas Supplier"],"company_type":"Materials/gases","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000346","name":"Soulbrain","country":"South Korea","supplier_types":["Materials Supplier","Gas Supplier"],"company_type":"Materials/gases","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000347","name":"Fujimi Incorporated","country":"Japan","supplier_types":["Materials Supplier","Gas Supplier"],"company_type":"Materials/gases","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000348","name":"Resonac","country":"Japan","supplier_types":["Materials Supplier","Gas Supplier"],"company_type":"Materials/gases","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000349","name":"Linde (Electronics)","country":"United Kingdom","supplier_types":["Materials Supplier","Gas Supplier"],"company_type":"Materials/gases","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000350","name":"Air Liquide (Electronics)","country":"France","supplier_types":["Materials Supplier","Gas Supplier"],"company_type":"Materials/gases","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000351","name":"Taiyo Nippon Sanso","country":"Japan","supplier_types":["Materials Supplier","Gas Supplier"],"company_type":"Materials/gases","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000352","name":"Kanto Denka Kogyo","country":"Japan","supplier_types":["Materials Supplier","Gas Supplier"],"company_type":"Materials/gases","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000353","name":"Applied Energy Systems (SEMI-GAS)","country":"United States","supplier_types":["Gas Supplier","Subsystem Supplier"],"company_type":"Gas/chemical delivery","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000354","name":"ZEUS","country":"South Korea","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000355","name":"Global Standard Technology (GST)","country":"South Korea","supplier_types":["Vacuum Supplier","Subsystem Supplier"],"company_type":"Vacuum/abatement","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000356","name":"UNISEM (Korea)","country":"South Korea","supplier_types":["Vacuum Supplier","Subsystem Supplier"],"company_type":"Vacuum/abatement","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000357","name":"Zhejiang Jingsheng Mechanical & Electrical (JSG)","country":"China","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000358","name":"Mattson Technology","country":"United States","supplier_types":["Equipment OEM"],"company_type":"Equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000359","name":"Hymson Laser Intelligent Equipment","country":"China","supplier_types":["Equipment OEM","Laser Supplier"],"company_type":"Laser equipment OEM","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]},{"company_id":"CMP-000360","name":"Beijing U-Precision Tech","country":"China","supplier_types":["Motion Supplier","Component Supplier"],"company_type":"Motion","component_class_ids":[],"subsystem_ids":[],"documented_links":[],"capability_links":[]}],"fabs":[{"id":"FAB-000001","legacy_id":"CU001","entity_type":"fab","name":"TSMC","facility_type":"Foundry","country":"Taiwan","country_id":"CTY-TW","sites":[{"name":"CoPoS pilot line (evaluation)","basis":"Key sites field (customer register)","source_ids":["SRC-000141","SRC-000136","SRC-000179","SRC-000178"]},{"name":"US fabs","basis":"Key sites field (customer register)","source_ids":["SRC-000141","SRC-000136","SRC-000179","SRC-000178"]},{"name":"Taiwan","basis":"Customer link CR027","source_ids":["SRC-000177"]},{"name":"United States","basis":"Customer link CR028","source_ids":["SRC-000178"]},{"name":"CoPoS pilot line · Taiwan","basis":"Customer link CR046","source_ids":["SRC-000179"]}],"equipment_supplier_ids":["CMP-000082","CMP-000090","CMP-000089","CMP-000003","CMP-000005","CMP-000057","CMP-000081","CMP-000080","CMP-000087","CMP-000088","CMP-000083","CMP-000010","CMP-000059","CMP-000060","CMP-000061","CMP-000085","CMP-000086","CMP-000002","CMP-000004","CMP-000007","CMP-000018"],"model_ids":["MDL-000054"],"customer_link_ids":["REL-CR-027","REL-CR-028","REL-CR-029","REL-CR-037","REL-CR-038","REL-CR-043","REL-CR-046","REL-CR-047","REL-CR-048","REL-CR-049","REL-CR-050","REL-CR-051","REL-CR-052","REL-CR-053","REL-CR-054","REL-CR-055","REL-CR-056","REL-CR-057","REL-CR-058","REL-CR-059","REL-CR-060","REL-CR-061"],"confirmed_links":2,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000141","SRC-000136","SRC-000179","SRC-000178"],"also_listed_as":null,"facility_ids":["FAC-000014","FAC-000015","FAC-000016","FAC-000017"]},{"id":"FAB-000002","legacy_id":"CU002","entity_type":"fab","name":"Samsung Electronics","facility_type":"IDM (memory/foundry)","country":"South Korea","country_id":"CTY-KR","sites":[{"name":"South Korea","basis":"Customer link CR010","source_ids":["SRC-000048"]}],"equipment_supplier_ids":["CMP-000067","CMP-000047","CMP-000003","CMP-000038"],"model_ids":["MDL-000092"],"customer_link_ids":["REL-CR-010","REL-CR-023","REL-CR-035","REL-CR-041"],"confirmed_links":1,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000136","SRC-000302"],"also_listed_as":null,"facility_ids":["FAC-000019"]},{"id":"FAB-000003","legacy_id":"CU003","entity_type":"fab","name":"Intel","facility_type":"IDM","country":"United States","country_id":"CTY-US","sites":[],"equipment_supplier_ids":[],"model_ids":[],"customer_link_ids":[],"confirmed_links":0,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000120"],"also_listed_as":null,"facility_ids":["FAC-000020","FAC-000021"]},{"id":"FAB-000004","legacy_id":"CU004","entity_type":"fab","name":"Micron Technology","facility_type":"Memory","country":"United States","country_id":"CTY-US","sites":[{"name":"Sanand ATMP (India)","basis":"Key sites field (customer register)","source_ids":["SRC-000136","SRC-000044","SRC-000302","SRC-000205"]}],"equipment_supplier_ids":["CMP-000047","CMP-000003","CMP-000038"],"model_ids":["MDL-000092"],"customer_link_ids":["REL-CR-007","REL-CR-034","REL-CR-042"],"confirmed_links":2,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000136","SRC-000044","SRC-000302","SRC-000205"],"also_listed_as":null,"facility_ids":["FAC-000004","FAC-000023"]},{"id":"FAB-000005","legacy_id":"CU005","entity_type":"fab","name":"SK hynix","facility_type":"Memory","country":"South Korea","country_id":"CTY-KR","sites":[{"name":"M16 Icheon","basis":"Key sites field (customer register)","source_ids":["SRC-000133","SRC-000041","SRC-000302","SRC-000136"]},{"name":"Cheongju P&T","basis":"Key sites field (customer register)","source_ids":["SRC-000133","SRC-000041","SRC-000302","SRC-000136"]},{"name":"M16 fab · Icheon, South Korea","basis":"Customer link CR001","source_ids":["SRC-000133"]},{"name":"Cheongju P&T · Cheongju, South Korea","basis":"Customer link CR005","source_ids":["SRC-000041","SRC-000042","SRC-000045"]},{"name":"South Korea","basis":"Customer link CR006","source_ids":["SRC-000041"]}],"equipment_supplier_ids":["CMP-000001","CMP-000047","CMP-000048","CMP-000003","CMP-000038","CMP-000262"],"model_ids":["MDL-000093","MDL-000079","MDL-000080","MDL-000081","MDL-000092","MDL-000405"],"customer_link_ids":["REL-CR-001","REL-CR-005","REL-CR-006","REL-CR-008","REL-CR-009","REL-CR-036","REL-CR-040","REL-CR-073"],"confirmed_links":5,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000133","SRC-000041","SRC-000302","SRC-000136"],"also_listed_as":null,"facility_ids":["FAC-000024","FAC-000025"]},{"id":"FAB-000006","legacy_id":"CU006","entity_type":"fab","name":"UMC","facility_type":"Foundry","country":"Taiwan","country_id":"CTY-TW","sites":[],"equipment_supplier_ids":[],"model_ids":[],"customer_link_ids":[],"confirmed_links":0,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000000"],"also_listed_as":null,"facility_ids":[]},{"id":"FAB-000007","legacy_id":"CU007","entity_type":"fab","name":"GlobalFoundries","facility_type":"Foundry","country":"United States","country_id":"CTY-US","sites":[],"equipment_supplier_ids":[],"model_ids":[],"customer_link_ids":[],"confirmed_links":0,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000000"],"also_listed_as":null,"facility_ids":[]},{"id":"FAB-000008","legacy_id":"CU008","entity_type":"fab","name":"SMIC","facility_type":"Foundry","country":"China","country_id":"CTY-CN","sites":[{"name":"China","basis":"Customer link CR020","source_ids":["SRC-000183"]}],"equipment_supplier_ids":["CMP-000110"],"model_ids":[],"customer_link_ids":["REL-CR-020"],"confirmed_links":0,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000183"],"also_listed_as":null,"facility_ids":[]},{"id":"FAB-000009","legacy_id":"CU009","entity_type":"fab","name":"Texas Instruments","facility_type":"IDM","country":"United States","country_id":"CTY-US","sites":[],"equipment_supplier_ids":[],"model_ids":[],"customer_link_ids":[],"confirmed_links":0,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000000"],"also_listed_as":null,"facility_ids":[]},{"id":"FAB-000010","legacy_id":"CU010","entity_type":"fab","name":"Infineon Technologies","facility_type":"IDM","country":"Germany","country_id":"CTY-DE","sites":[],"equipment_supplier_ids":[],"model_ids":[],"customer_link_ids":[],"confirmed_links":0,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000129"],"also_listed_as":null,"facility_ids":[]},{"id":"FAB-000011","legacy_id":"CU011","entity_type":"fab","name":"STMicroelectronics","facility_type":"IDM","country":"Switzerland","country_id":"CTY-CH","sites":[],"equipment_supplier_ids":["CMP-000202"],"model_ids":[],"customer_link_ids":["REL-CR-074"],"confirmed_links":1,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000000"],"also_listed_as":null,"facility_ids":[]},{"id":"FAB-000012","legacy_id":"CU012","entity_type":"fab","name":"NXP Semiconductors","facility_type":"IDM","country":"Netherlands","country_id":"CTY-NL","sites":[],"equipment_supplier_ids":[],"model_ids":[],"customer_link_ids":[],"confirmed_links":0,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000000"],"also_listed_as":null,"facility_ids":[]},{"id":"FAB-000013","legacy_id":"CU013","entity_type":"fab","name":"Renesas Electronics","facility_type":"IDM","country":"Japan","country_id":"CTY-JP","sites":[],"equipment_supplier_ids":[],"model_ids":[],"customer_link_ids":[],"confirmed_links":0,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000000"],"also_listed_as":null,"facility_ids":[]},{"id":"FAB-000014","legacy_id":"CU014","entity_type":"fab","name":"Sony Semiconductor Solutions","facility_type":"IDM","country":"Japan","country_id":"CTY-JP","sites":[],"equipment_supplier_ids":[],"model_ids":[],"customer_link_ids":[],"confirmed_links":0,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000000"],"also_listed_as":null,"facility_ids":[]},{"id":"FAB-000019","legacy_id":"CU019","entity_type":"fab","name":"Tata Electronics","facility_type":"Foundry + OSAT","country":"India","country_id":"CTY-IN","sites":[{"name":"Dholera fab (Gujarat, 50k wpm, 28-110 nm)","basis":"Key sites field (customer register)","source_ids":["SRC-000023","SRC-000024","SRC-000025","SRC-000026","SRC-000305","SRC-000212"]},{"name":"Jagiroad OSAT (Assam, USD 3B+)","basis":"Key sites field (customer register)","source_ids":["SRC-000023","SRC-000024","SRC-000025","SRC-000026","SRC-000305","SRC-000212"]},{"name":"Vemgal (Karnataka, since Dec 2023)","basis":"Key sites field (customer register)","source_ids":["SRC-000023","SRC-000024","SRC-000025","SRC-000026","SRC-000305","SRC-000212"]},{"name":"Dholera fab · Dholera, India","basis":"Customer link CR003","source_ids":["SRC-000024","SRC-000023","SRC-000026"]},{"name":"Fab + OSAT · Dholera & Jagiroad, India","basis":"Customer link CR004","source_ids":["SRC-000025","SRC-000023"]},{"name":"OSAT/fab · India","basis":"Customer link CR024","source_ids":["SRC-000027"]}],"equipment_supplier_ids":["CMP-000001","CMP-000004","CMP-000196"],"model_ids":[],"customer_link_ids":["REL-CR-003","REL-CR-004","REL-CR-024","REL-CR-031"],"confirmed_links":3,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000023","SRC-000024","SRC-000025","SRC-000026","SRC-000305","SRC-000212"],"also_listed_as":"OSAT-000019","facility_ids":["FAC-000001"]},{"id":"FAB-000023","legacy_id":"CU023","entity_type":"fab","name":"Rapidus","facility_type":"Foundry","country":"Japan","country_id":"CTY-JP","sites":[{"name":"IIM-1 (Hokkaido)","basis":"Key sites field (customer register)","source_ids":["SRC-000190"]},{"name":"IIM-1 · Hokkaido, Japan","basis":"Customer link CR002","source_ids":["SRC-000190"]}],"equipment_supplier_ids":["CMP-000001"],"model_ids":["MDL-000094"],"customer_link_ids":["REL-CR-002"],"confirmed_links":1,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000190"],"also_listed_as":null,"facility_ids":["FAC-000018"]},{"id":"FAB-000024","legacy_id":"CU024","entity_type":"fab","name":"Texas Institute for Electronics (TIE)","facility_type":"Research foundry / consortium","country":"United States","country_id":"CTY-US","sites":[{"name":"Texas, US","basis":"Customer link CR011","source_ids":["SRC-000192","SRC-000193"]}],"equipment_supplier_ids":["CMP-000013"],"model_ids":["MDL-000097"],"customer_link_ids":["REL-CR-011"],"confirmed_links":1,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000192"],"also_listed_as":null,"facility_ids":[]},{"id":"FAB-000025","legacy_id":"CU025","entity_type":"fab","name":"Visionox","facility_type":"Display","country":"China","country_id":"CTY-CN","sites":[{"name":"V5 Gen 8.6 (Hefei)","basis":"Key sites field (customer register)","source_ids":["SRC-000227"]},{"name":"V5 Gen 8.6 · Hefei, China","basis":"Customer link CR030","source_ids":["SRC-000227"]}],"equipment_supplier_ids":["CMP-000079"],"model_ids":["MDL-000053"],"customer_link_ids":["REL-CR-030"],"confirmed_links":0,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000227"],"also_listed_as":null,"facility_ids":[]},{"id":"FAB-000026","legacy_id":"CU026","entity_type":"fab","name":"Absolics","facility_type":"Glass substrate","country":"United States","country_id":"CTY-US","sites":[],"equipment_supplier_ids":["CMP-000078"],"model_ids":[],"customer_link_ids":["REL-CR-018"],"confirmed_links":0,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000120"],"also_listed_as":null,"facility_ids":[]},{"id":"FAB-000028","legacy_id":"CU028","entity_type":"fab","name":"Nexperia","facility_type":"IDM","country":"Netherlands","country_id":"CTY-NL","sites":[],"equipment_supplier_ids":[],"model_ids":[],"customer_link_ids":[],"confirmed_links":0,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000209"],"also_listed_as":null,"facility_ids":[]},{"id":"FAB-000030","legacy_id":"CU030","entity_type":"fab","name":"LPKF Vitrion (glass foundry service)","facility_type":"Service foundry","country":"Germany","country_id":"CTY-DE","sites":[{"name":"Vitrion cleanroom · Germany","basis":"Customer link CR045","source_ids":["SRC-000081"]}],"equipment_supplier_ids":["CMP-000016"],"model_ids":["MDL-000110"],"customer_link_ids":["REL-CR-045"],"confirmed_links":1,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000081"],"also_listed_as":null,"facility_ids":[]},{"id":"FAB-000032","legacy_id":"CU032","entity_type":"fab","name":"SkyWater Technology","facility_type":"Foundry","country":"United States","country_id":"CTY-US","sites":[],"equipment_supplier_ids":["CMP-000209"],"model_ids":["MDL-000299"],"customer_link_ids":["REL-CR-062"],"confirmed_links":1,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000585"],"also_listed_as":null,"facility_ids":[]}],"osats":[{"id":"OSAT-000015","legacy_id":"CU015","entity_type":"osat","name":"ASE Technology Holding","facility_type":"OSAT","country":"Taiwan","country_id":"CTY-TW","sites":[{"name":"Taiwan","basis":"Customer link CR025","source_ids":["SRC-000177"]}],"equipment_supplier_ids":["CMP-000080","CMP-000081"],"model_ids":[],"customer_link_ids":["REL-CR-025","REL-CR-026"],"confirmed_links":0,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000177"],"also_listed_as":null,"facility_ids":[]},{"id":"OSAT-000016","legacy_id":"CU016","entity_type":"osat","name":"Amkor Technology","facility_type":"OSAT","country":"United States","country_id":"CTY-US","sites":[],"equipment_supplier_ids":[],"model_ids":[],"customer_link_ids":[],"confirmed_links":0,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000000"],"also_listed_as":null,"facility_ids":["FAC-000022"]},{"id":"OSAT-000017","legacy_id":"CU017","entity_type":"osat","name":"JCET Group","facility_type":"OSAT","country":"China","country_id":"CTY-CN","sites":[],"equipment_supplier_ids":[],"model_ids":[],"customer_link_ids":[],"confirmed_links":0,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000000"],"also_listed_as":null,"facility_ids":[]},{"id":"OSAT-000018","legacy_id":"CU018","entity_type":"osat","name":"Powertech Technology","facility_type":"OSAT","country":"Taiwan","country_id":"CTY-TW","sites":[],"equipment_supplier_ids":["CMP-000221"],"model_ids":["MDL-000329"],"customer_link_ids":["REL-CR-063"],"confirmed_links":1,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000000"],"also_listed_as":null,"facility_ids":[]},{"id":"OSAT-000019","legacy_id":"CU019","entity_type":"osat","name":"Tata Electronics","facility_type":"Foundry + OSAT","country":"India","country_id":"CTY-IN","sites":[{"name":"Dholera fab (Gujarat, 50k wpm, 28-110 nm)","basis":"Key sites field (customer register)","source_ids":["SRC-000023","SRC-000024","SRC-000025","SRC-000026","SRC-000305","SRC-000212"]},{"name":"Jagiroad OSAT (Assam, USD 3B+)","basis":"Key sites field (customer register)","source_ids":["SRC-000023","SRC-000024","SRC-000025","SRC-000026","SRC-000305","SRC-000212"]},{"name":"Vemgal (Karnataka, since Dec 2023)","basis":"Key sites field (customer register)","source_ids":["SRC-000023","SRC-000024","SRC-000025","SRC-000026","SRC-000305","SRC-000212"]},{"name":"Dholera fab · Dholera, India","basis":"Customer link CR003","source_ids":["SRC-000024","SRC-000023","SRC-000026"]},{"name":"Fab + OSAT · Dholera & Jagiroad, India","basis":"Customer link CR004","source_ids":["SRC-000025","SRC-000023"]},{"name":"OSAT/fab · India","basis":"Customer link CR024","source_ids":["SRC-000027"]}],"equipment_supplier_ids":["CMP-000001","CMP-000004","CMP-000196"],"model_ids":[],"customer_link_ids":["REL-CR-003","REL-CR-004","REL-CR-024","REL-CR-031"],"confirmed_links":3,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000023","SRC-000024","SRC-000025","SRC-000026","SRC-000305","SRC-000212"],"also_listed_as":"FAB-000019","facility_ids":["FAC-000002"]},{"id":"OSAT-000020","legacy_id":"CU020","entity_type":"osat","name":"CG Semi (CG Power)","facility_type":"OSAT","country":"India","country_id":"CTY-IN","sites":[{"name":"Sanand (Gujarat)","basis":"Key sites field (customer register)","source_ids":["SRC-000306","SRC-000308","SRC-000021"]}],"equipment_supplier_ids":[],"model_ids":[],"customer_link_ids":[],"confirmed_links":0,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000306","SRC-000308","SRC-000021"],"also_listed_as":null,"facility_ids":["FAC-000003"]},{"id":"OSAT-000021","legacy_id":"CU021","entity_type":"osat","name":"Kaynes Semicon","facility_type":"OSAT","country":"India","country_id":"CTY-IN","sites":[{"name":"Sanand (Gujarat)","basis":"Key sites field (customer register)","source_ids":["SRC-000019","SRC-000206","SRC-000201"]},{"name":"6.33M chips/day (Tier 4)","basis":"Key sites field (customer register)","source_ids":["SRC-000019","SRC-000206","SRC-000201"]}],"equipment_supplier_ids":[],"model_ids":[],"customer_link_ids":[],"confirmed_links":0,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000019","SRC-000206","SRC-000201"],"also_listed_as":null,"facility_ids":["FAC-000005"]},{"id":"OSAT-000022","legacy_id":"CU022","entity_type":"osat","name":"Micron India (Sanand ATMP)","facility_type":"ATMP","country":"India","country_id":"CTY-IN","sites":[{"name":"Sanand (Gujarat)","basis":"Key sites field (customer register)","source_ids":["SRC-000019","SRC-000205","SRC-000021"]},{"name":"volume production Feb 2026 (Tier 4)","basis":"Key sites field (customer register)","source_ids":["SRC-000019","SRC-000205","SRC-000021"]},{"name":"ATMP/OSAT · Sanand, India","basis":"Customer link CR032","source_ids":["SRC-000205"]}],"equipment_supplier_ids":["CMP-000199"],"model_ids":[],"customer_link_ids":["REL-CR-032"],"confirmed_links":0,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000019","SRC-000205","SRC-000021"],"also_listed_as":null,"facility_ids":["FAC-000004"]},{"id":"OSAT-000029","legacy_id":"CU029","entity_type":"osat","name":"CDIL (Continental Device India)","facility_type":"ATMP","country":"India","country_id":"CTY-IN","sites":[{"name":"Mohali (Punjab)","basis":"Key sites field (customer register)","source_ids":["SRC-000210","SRC-000019"]}],"equipment_supplier_ids":[],"model_ids":[],"customer_link_ids":[],"confirmed_links":0,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000210","SRC-000019"],"also_listed_as":null,"facility_ids":["FAC-000009"]}],"customers":[{"id":"CUS-000027","legacy_id":"CU027","entity_type":"customer","name":"Apple","facility_type":"Systems","country":"United States","country_id":"CTY-US","sites":[],"equipment_supplier_ids":[],"model_ids":[],"customer_link_ids":[],"confirmed_links":0,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000228"],"also_listed_as":null},{"id":"CUS-000031","legacy_id":"CU031","entity_type":"customer","name":"Chemtronics","facility_type":"Materials / substrates","country":"South Korea","country_id":"CTY-KR","sites":[],"equipment_supplier_ids":["CMP-000143"],"model_ids":[],"customer_link_ids":["REL-CR-019"],"confirmed_links":0,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000120"],"also_listed_as":null},{"id":"CUS-000900","legacy_id":"CU900","entity_type":"customer","name":"Undisclosed customer","facility_type":"Undisclosed","country":null,"country_id":null,"sites":[{"name":"China","basis":"Customer link CR021","source_ids":["SRC-000187"]},{"name":"US; Japan","basis":"Customer link CR044","source_ids":["SRC-000326"]}],"equipment_supplier_ids":["CMP-000014","CMP-000016","CMP-000002","CMP-000141","CMP-000078","CMP-000107","CMP-000070","CMP-000040","CMP-000032","CMP-000221","CMP-000212","CMP-000269"],"model_ids":["MDL-000056","MDL-000112","MDL-000082","MDL-000027","MDL-000050","MDL-000107","MDL-000090","MDL-000072","MDL-000328","MDL-000329","MDL-000306","MDL-000305","MDL-000414"],"customer_link_ids":["REL-CR-012","REL-CR-013","REL-CR-014","REL-CR-015","REL-CR-016","REL-CR-017","REL-CR-021","REL-CR-022","REL-CR-033","REL-CR-039","REL-CR-044","REL-CR-064","REL-CR-065","REL-CR-066","REL-CR-067","REL-CR-068","REL-CR-069"],"confirmed_links":15,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000000"],"also_listed_as":null},{"id":"CUS-000033","legacy_id":"CU033","entity_type":"customer","name":"VLC Photonics","facility_type":"Photonics design / test services","country":null,"country_id":null,"sites":[],"equipment_supplier_ids":["CMP-000253"],"model_ids":["MDL-000391"],"customer_link_ids":["REL-CR-070"],"confirmed_links":1,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000702"],"also_listed_as":null},{"id":"CUS-000034","legacy_id":"CU034","entity_type":"customer","name":"Bay Photonics","facility_type":"Photonics assembly & packaging","country":"United Kingdom","country_id":"CTY-GB","sites":[],"equipment_supplier_ids":["CMP-000222"],"model_ids":["MDL-000330"],"customer_link_ids":["REL-CR-071"],"confirmed_links":1,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000703"],"also_listed_as":null},{"id":"CUS-000035","legacy_id":"CU035","entity_type":"customer","name":"Electronics and Photonics Innovation Center (EPIC)","facility_type":"Research / packaging centre","country":null,"country_id":null,"sites":[],"equipment_supplier_ids":["CMP-000222"],"model_ids":["MDL-000330"],"customer_link_ids":["REL-CR-072"],"confirmed_links":1,"capacity":null,"process_node":null,"wafer_size":null,"investment":null,"status":null,"field_note":"Facility capacity, node, wafer size and investment are not captured in Batch 1 unless stated in a site description.","source_ids":["SRC-000704"],"also_listed_as":null}],"facilities":[{"id":"FAC-000001","entity_type":"facility","name":"Tata Electronics–PSMC semiconductor fab, Dholera","facility_type":"Fab (front-end)","operator":"Tata Electronics","operator_ids":["FAB-000019"],"partners":["Powerchip Semiconductor Manufacturing Corp. (PSMC), Taiwan — technology partner"],"country":"India","country_id":"CTY-IN","region":"Asia-Pacific","state":"Gujarat","city":"Dholera","coordinates":{"lat":22.25,"lon":72.19,"basis":"Approximate town centroid (not the site boundary)"},"scheme":"India Semiconductor Mission (ISM) — fab scheme","approval_date":"2024-02-29","status":"FOUNDATION_LAID","status_class":"UNDER_CONSTRUCTION","status_date":"2024-03-13","status_history":[{"date":"2024-02-29","status":"APPROVED","source_ids":["SRC-000963"]},{"date":"2024-03-13","status":"FOUNDATION_LAID","source_ids":["SRC-000961","SRC-000962"]}],"investment":[{"value":91000,"currency":"INR","unit":"crore","label":"over ₹91,000 crore","inr_crore":91000,"source_ids":["SRC-000961"]}],"investment_conflict":false,"capacity":"Not captured from a reviewed source in this batch (an earlier record lists 50,000 wafer starts per month)","technology":"Not captured in this batch (earlier record: 28–110 nm)","wafer_size":null,"products":"Logic / mixed-signal foundry (scope per approval coverage)","jobs":null,"verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM","evidence_depth":"SEARCH_SUMMARY","notes":"India's first commercial fab per the PMO release. First-chip timing in news coverage is a target, not recorded as a milestone. Batch 11 (2026-10-05): facts from titles and search-result summaries of the cited government releases and news reports; pages not read directly. Unknown fields are left empty, not estimated.","source_ids":["SRC-000963","SRC-000961","SRC-000962"],"batch":"Batch 11","dates":{"first_added":"2026-10-05","last_verified":"2026-10-05"},"program_ids":["PG01"]},{"id":"FAC-000002","entity_type":"facility","name":"Tata Semiconductor Assembly & Test (TSAT), Jagiroad","facility_type":"OSAT / ATMP","operator":"Tata Electronics","operator_ids":["OSAT-000019"],"partners":[],"country":"India","country_id":"CTY-IN","region":"Asia-Pacific","state":"Assam","city":"Jagiroad (Morigaon district)","coordinates":{"lat":26.12,"lon":92.2,"basis":"Approximate town centroid (not the site boundary)"},"scheme":"ISM — ATMP / OSAT scheme","approval_date":"2024-02-29","status":"FOUNDATION_LAID","status_class":"UNDER_CONSTRUCTION","status_date":"2024-03-13","status_history":[{"date":"2024-02-29","status":"APPROVED","source_ids":["SRC-000963"]},{"date":"2024-03-13","status":"FOUNDATION_LAID","source_ids":["SRC-000961","SRC-000962"]}],"investment":[{"value":27000,"currency":"INR","unit":"crore","label":"about ₹27,000 crore","inr_crore":27000,"source_ids":["SRC-000961"]}],"investment_conflict":false,"capacity":null,"technology":null,"wafer_size":null,"products":"Assembly, test, marking and packaging","jobs":null,"verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM","evidence_depth":"SEARCH_SUMMARY","notes":"Batch 11 (2026-10-05): facts from titles and search-result summaries of the cited government releases and news reports; pages not read directly. Unknown fields are left empty, not estimated.","source_ids":["SRC-000963","SRC-000961","SRC-000962"],"batch":"Batch 11","dates":{"first_added":"2026-10-05","last_verified":"2026-10-05"},"program_ids":["PG01"]},{"id":"FAC-000003","entity_type":"facility","name":"CG Semi OSAT (G1 / G2), Sanand","facility_type":"OSAT","operator":"CG Semi (CG Power)","operator_ids":["OSAT-000020"],"partners":["Renesas Electronics (Japan) — technology partner","Stars Microelectronics (Thailand) — technology partner"],"country":"India","country_id":"CTY-IN","region":"Asia-Pacific","state":"Gujarat","city":"Sanand","coordinates":{"lat":22.99,"lon":72.38,"basis":"Approximate town centroid (not the site boundary)"},"scheme":"ISM — ATMP / OSAT scheme","approval_date":"2024-02-29","status":"PILOT_PRODUCTION","status_class":"PILOT","status_date":"2025-08-28","status_history":[{"date":"2024-02-29","status":"APPROVED","source_ids":["SRC-000961"]},{"date":"2024-03-13","status":"FOUNDATION_LAID","source_ids":["SRC-000961","SRC-000962"]},{"date":"2025-08-28","status":"PILOT_PRODUCTION","source_ids":["SRC-000968"]}],"investment":[{"value":7500,"currency":"INR","unit":"crore","label":"about ₹7,500 crore","inr_crore":7500,"source_ids":["SRC-000961"]},{"value":7600,"currency":"INR","unit":"crore","label":"over ₹7,600 crore over five years (G1 + G2)","inr_crore":7600,"source_ids":["SRC-000968"]}],"investment_conflict":true,"capacity":"G1 peak about 0.5 million units per day (per pilot-line coverage)","technology":null,"wafer_size":null,"products":"End-to-end OSAT","jobs":null,"verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM","evidence_depth":"SEARCH_SUMMARY","notes":"Batch 11 (2026-10-05): facts from titles and search-result summaries of the cited government releases and news reports; pages not read directly. Unknown fields are left empty, not estimated.","source_ids":["SRC-000961","SRC-000968"],"batch":"Batch 11","dates":{"first_added":"2026-10-05","last_verified":"2026-10-05"},"program_ids":["PG01"]},{"id":"FAC-000004","entity_type":"facility","name":"Micron ATMP, Sanand","facility_type":"ATMP (memory assembly & test)","operator":"Micron Technology","operator_ids":["OSAT-000022","FAB-000004"],"partners":[],"country":"India","country_id":"CTY-IN","region":"Asia-Pacific","state":"Gujarat","city":"Sanand","coordinates":{"lat":22.99,"lon":72.38,"basis":"Approximate town centroid (not the site boundary)"},"scheme":"Modified ATMP scheme (ISM) with Gujarat state incentives","approval_date":"2023-06","status":"OPERATIONAL","status_class":"PRODUCTION","status_date":"2026-02-28","status_history":[{"date":"2023-06-22","status":"ANNOUNCED","source_ids":["SRC-000966"]},{"date":"2026-02-28","status":"OPERATIONAL","source_ids":["SRC-000967"]}],"investment":[{"value":2.75,"currency":"USD","unit":"billion","label":"US$2.75 billion total (Micron plus central and state support)","inr_crore":null,"source_ids":["SRC-000966"]}],"investment_conflict":false,"capacity":"Phase 1: 500,000 sq ft cleanroom (per coverage)","technology":"DRAM and NAND assembly and test","wafer_size":null,"products":"DRAM and NAND packages","jobs":"Up to 5,000 direct jobs planned (company statement per coverage)","verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM","evidence_depth":"SEARCH_SUMMARY","notes":"Batch 11 (2026-10-05): facts from titles and search-result summaries of the cited government releases and news reports; pages not read directly. Unknown fields are left empty, not estimated.","source_ids":["SRC-000966","SRC-000967"],"batch":"Batch 11","dates":{"first_added":"2026-10-05","last_verified":"2026-10-05"},"program_ids":["PG01"]},{"id":"FAC-000005","entity_type":"facility","name":"Kaynes Semicon OSAT, Sanand","facility_type":"OSAT","operator":"Kaynes Semicon","operator_ids":["OSAT-000021"],"partners":[],"country":"India","country_id":"CTY-IN","region":"Asia-Pacific","state":"Gujarat","city":"Sanand","coordinates":{"lat":22.99,"lon":72.38,"basis":"Approximate town centroid (not the site boundary)"},"scheme":"ISM — ATMP / OSAT scheme","approval_date":"2024-09-02","status":"APPROVED","status_class":"PLANNED","status_date":"2024-09-02","status_history":[{"date":"2024-09-02","status":"APPROVED","source_ids":["SRC-000960"]}],"investment":[{"value":3307,"currency":"INR","unit":"crore","label":"₹3,307 crore","inr_crore":3307,"source_ids":["SRC-000960"]}],"investment_conflict":false,"capacity":"About 6 million chips per day (approval coverage; an earlier record lists 6.33 million)","technology":null,"wafer_size":null,"products":"Chips for industrial, automotive, EV, consumer, telecom and mobile applications","jobs":null,"verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM","evidence_depth":"SEARCH_SUMMARY","notes":"Batch 11 (2026-10-05): facts from titles and search-result summaries of the cited government releases and news reports; pages not read directly. Unknown fields are left empty, not estimated.","source_ids":["SRC-000960"],"batch":"Batch 11","dates":{"first_added":"2026-10-05","last_verified":"2026-10-05"},"program_ids":["PG01"]},{"id":"FAC-000006","entity_type":"facility","name":"HCL–Foxconn semiconductor unit, near Jewar airport","facility_type":"Semiconductor unit (display driver chips)","operator":"HCL Group and Foxconn joint venture","operator_ids":[],"partners":["HCL Group (India)","Foxconn (Taiwan)"],"country":"India","country_id":"CTY-IN","region":"Asia-Pacific","state":"Uttar Pradesh","city":"Jewar (YEIDA area)","coordinates":{"lat":28.13,"lon":77.56,"basis":"Approximate town centroid (not the site boundary)"},"scheme":"India Semiconductor Mission (ISM)","approval_date":"2025-05-14","status":"APPROVED","status_class":"PLANNED","status_date":"2025-05-14","status_history":[{"date":"2025-05-14","status":"APPROVED","source_ids":["SRC-000964","SRC-000965"]}],"investment":[{"value":3706,"currency":"INR","unit":"crore","label":"₹3,706 crore","inr_crore":3706,"source_ids":["SRC-000965"]}],"investment_conflict":false,"capacity":"Designed for 20,000 wafers per month; design output 36 million units per month","technology":null,"wafer_size":null,"products":"Display driver chips (mobile phones, laptops, automobiles, PCs)","jobs":"About 3,500","verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM","evidence_depth":"SEARCH_SUMMARY","notes":"Batch 11 (2026-10-05): facts from titles and search-result summaries of the cited government releases and news reports; pages not read directly. Unknown fields are left empty, not estimated.","source_ids":["SRC-000964","SRC-000965"],"batch":"Batch 11","dates":{"first_added":"2026-10-05","last_verified":"2026-10-05"},"program_ids":["PG01"]},{"id":"FAC-000007","entity_type":"facility","name":"SiCSem silicon-carbide compound fab, Info Valley Bhubaneswar","facility_type":"Compound semiconductor fab + packaging","operator":"SiCSem Private Limited","operator_ids":[],"partners":["Clas-SiC Wafer Fab Ltd. (UK) — technology partner"],"country":"India","country_id":"CTY-IN","region":"Asia-Pacific","state":"Odisha","city":"Bhubaneswar (Info Valley)","coordinates":{"lat":20.3,"lon":85.82,"basis":"Approximate town centroid (not the site boundary)"},"scheme":"India Semiconductor Mission (ISM)","approval_date":"2025-08-12","status":"APPROVED","status_class":"PLANNED","status_date":"2025-08-12","status_history":[{"date":"2025-08-12","status":"APPROVED","source_ids":["SRC-000958"]}],"investment":[],"investment_conflict":false,"capacity":"60,000 wafers per year; packaging 96 million units per year","technology":"Silicon carbide (SiC)","wafer_size":null,"products":"SiC compound semiconductors","jobs":null,"verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM","evidence_depth":"SEARCH_SUMMARY","notes":"Described in the release as the first commercial compound fab in India. Per-unit investment not captured (the four units total about ₹4,600 crore). Batch 11 (2026-10-05): facts from titles and search-result summaries of the cited government releases and news reports; pages not read directly. Unknown fields are left empty, not estimated.","source_ids":["SRC-000958"],"batch":"Batch 11","dates":{"first_added":"2026-10-05","last_verified":"2026-10-05"},"program_ids":["PG01"]},{"id":"FAC-000008","entity_type":"facility","name":"3D Glass Solutions advanced packaging & glass substrate unit, Info Valley Bhubaneswar","facility_type":"Advanced packaging / glass substrate","operator":"3D Glass Solutions Inc. (3DGS)","operator_ids":[],"partners":[],"country":"India","country_id":"CTY-IN","region":"Asia-Pacific","state":"Odisha","city":"Bhubaneswar (Info Valley)","coordinates":{"lat":20.3,"lon":85.82,"basis":"Approximate town centroid (not the site boundary)"},"scheme":"India Semiconductor Mission (ISM)","approval_date":"2025-08-12","status":"APPROVED","status_class":"PLANNED","status_date":"2025-08-12","status_history":[{"date":"2025-08-12","status":"APPROVED","source_ids":["SRC-000958"]}],"investment":[],"investment_conflict":false,"capacity":null,"technology":"Embedded glass substrate, advanced packaging","wafer_size":null,"products":"Advanced packaging and glass substrates","jobs":null,"verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM","evidence_depth":"SEARCH_SUMMARY","notes":"Per-unit investment not captured. Batch 11 (2026-10-05): facts from titles and search-result summaries of the cited government releases and news reports; pages not read directly. Unknown fields are left empty, not estimated.","source_ids":["SRC-000958"],"batch":"Batch 11","dates":{"first_added":"2026-10-05","last_verified":"2026-10-05"},"program_ids":["PG01"]},{"id":"FAC-000009","entity_type":"facility","name":"CDIL discrete power device expansion, Mohali","facility_type":"Discrete semiconductor manufacturing","operator":"Continental Device India (CDIL)","operator_ids":["OSAT-000029"],"partners":[],"country":"India","country_id":"CTY-IN","region":"Asia-Pacific","state":"Punjab","city":"Mohali","coordinates":{"lat":30.7,"lon":76.72,"basis":"Approximate town centroid (not the site boundary)"},"scheme":"India Semiconductor Mission (ISM)","approval_date":"2025-08-12","status":"APPROVED","status_class":"PLANNED","status_date":"2025-08-12","status_history":[{"date":"2025-08-12","status":"APPROVED","source_ids":["SRC-000958"]}],"investment":[],"investment_conflict":false,"capacity":"158.38 million units per year (per search summary of a consumer-tech report; not confirmed against the official release)","technology":"Silicon and SiC discretes","wafer_size":null,"products":"High-power MOSFETs, IGBTs, Schottky bypass diodes, transistors","jobs":null,"verification":"PARTIALLY_VERIFIED","confidence":"LOW","evidence_depth":"SEARCH_SUMMARY","notes":"Capacity and product list come from secondary coverage summaries; the official release confirms the approval and location. Batch 11 (2026-10-05): facts from titles and search-result summaries of the cited government releases and news reports; pages not read directly. Unknown fields are left empty, not estimated.","source_ids":["SRC-000958","SRC-000971","SRC-000972"],"batch":"Batch 11","dates":{"first_added":"2026-10-05","last_verified":"2026-10-05"},"program_ids":["PG01"]},{"id":"FAC-000010","entity_type":"facility","name":"ASIP Technologies OSAT, Visakhapatnam","facility_type":"OSAT / advanced packaging","operator":"ASIP Technologies","operator_ids":[],"partners":["APACT (South Korea) — technology partner"],"country":"India","country_id":"CTY-IN","region":"Asia-Pacific","state":"Andhra Pradesh","city":"Visakhapatnam","coordinates":{"lat":17.69,"lon":83.22,"basis":"Approximate town centroid (not the site boundary)"},"scheme":"India Semiconductor Mission (ISM)","approval_date":"2025-08-12","status":"FOUNDATION_LAID","status_class":"UNDER_CONSTRUCTION","status_date":"2026-08","status_history":[{"date":"2025-08-12","status":"APPROVED","source_ids":["SRC-000958"]},{"date":"2026-08","status":"FOUNDATION_LAID","source_ids":["SRC-000969","SRC-000970"]}],"investment":[{"value":460,"currency":"INR","unit":"crore","label":"over ₹460 crore (initial phase, per coverage)","inr_crore":460,"source_ids":["SRC-000969"]},{"value":260,"currency":"USD","unit":"million","label":"US$260 million (headline figure)","inr_crore":null,"source_ids":["SRC-000969"]}],"investment_conflict":true,"capacity":"About 96 million chips per year (per coverage)","technology":"Flip-chip BGA packaging (per coverage)","wafer_size":null,"products":"Packages for AI, HPC, data-centre and communications chips (per coverage)","jobs":"More than 1,000 direct (per coverage)","verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM","evidence_depth":"SEARCH_SUMMARY","notes":"The two investment figures likely cover different scopes (initial phase vs. overall); recorded as a conflict rather than reconciled. Batch 11 (2026-10-05): facts from titles and search-result summaries of the cited government releases and news reports; pages not read directly. Unknown fields are left empty, not estimated.","source_ids":["SRC-000958","SRC-000969","SRC-000970"],"batch":"Batch 11","dates":{"first_added":"2026-10-05","last_verified":"2026-10-05"},"program_ids":["PG01"]},{"id":"FAC-000011","entity_type":"facility","name":"Crystal Matrix compound semiconductor fab + ATMP, Dholera","facility_type":"Compound semiconductor fab + ATMP","operator":"Crystal Matrix Limited","operator_ids":[],"partners":[],"country":"India","country_id":"CTY-IN","region":"Asia-Pacific","state":"Gujarat","city":"Dholera","coordinates":{"lat":22.25,"lon":72.19,"basis":"Approximate town centroid (not the site boundary)"},"scheme":"India Semiconductor Mission (ISM)","approval_date":"2026-05-06","status":"APPROVED","status_class":"PLANNED","status_date":"2026-05-06","status_history":[{"date":"2026-05-06","status":"APPROVED","source_ids":["SRC-000959","SRC-000973"]}],"investment":[],"investment_conflict":false,"capacity":"72,000 m² per year of mini/micro-LED display panels; 24,000 sets per year of RGB GaN epitaxy wafers","technology":"GaN epitaxy (6-inch), mini/micro-LED","wafer_size":"150 mm (6-inch) GaN epitaxy","products":"Mini/micro-LED display modules; GaN foundry services","jobs":null,"verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM","evidence_depth":"SEARCH_SUMMARY","notes":"Per-unit investment not captured (combined ₹3,936 crore with Suchi Semicon). Batch 11 (2026-10-05): facts from titles and search-result summaries of the cited government releases and news reports; pages not read directly. Unknown fields are left empty, not estimated.","source_ids":["SRC-000959","SRC-000973"],"batch":"Batch 11","dates":{"first_added":"2026-10-05","last_verified":"2026-10-05"},"program_ids":["PG01"]},{"id":"FAC-000012","entity_type":"facility","name":"Suchi Semicon OSAT, Surat","facility_type":"OSAT (discretes)","operator":"Suchi Semicon Private Limited","operator_ids":[],"partners":[],"country":"India","country_id":"CTY-IN","region":"Asia-Pacific","state":"Gujarat","city":"Surat","coordinates":{"lat":21.17,"lon":72.83,"basis":"Approximate town centroid (not the site boundary)"},"scheme":"India Semiconductor Mission (ISM)","approval_date":"2026-05-06","status":"APPROVED","status_class":"PLANNED","status_date":"2026-05-06","status_history":[{"date":"2026-05-06","status":"APPROVED","source_ids":["SRC-000959"]}],"investment":[{"value":868,"currency":"INR","unit":"crore","label":"₹868 crore","inr_crore":868,"source_ids":["SRC-000959"]}],"investment_conflict":false,"capacity":"1,033.2 million chips per year","technology":null,"wafer_size":null,"products":"Discrete semiconductors for power electronics, analog ICs and industrial systems","jobs":null,"verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM","evidence_depth":"SEARCH_SUMMARY","notes":"Batch 11 (2026-10-05): facts from titles and search-result summaries of the cited government releases and news reports; pages not read directly. Unknown fields are left empty, not estimated.","source_ids":["SRC-000959"],"batch":"Batch 11","dates":{"first_added":"2026-10-05","last_verified":"2026-10-05"},"program_ids":["PG01"]},{"id":"FAC-000013","entity_type":"facility","name":"YES equipment manufacturing facility, Sulur (Coimbatore)","facility_type":"Equipment manufacturing","operator":"Yield Engineering Systems (YES)","operator_ids":["CMP-000221"],"partners":[],"country":"India","country_id":"CTY-IN","region":"Asia-Pacific","state":"Tamil Nadu","city":"Sulur, Coimbatore","coordinates":{"lat":11.02,"lon":77.13,"basis":"Approximate town centroid (not the site boundary)"},"scheme":"Not stated in reviewed sources","approval_date":null,"status":"OPERATIONAL","status_class":"PRODUCTION","status_date":"2024-09","status_history":[{"date":"2024-09","status":"OPERATIONAL","source_ids":["SRC-000974"]},{"date":"2025-03-27","status":"FIRST_SHIPMENT","source_ids":["SRC-000952"]}],"investment":[],"investment_conflict":false,"capacity":null,"technology":"VertaCure, VeroTherm and VeroFlex systems for wafer- and panel-level packaging","wafer_size":null,"products":"Semiconductor process equipment","jobs":null,"verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM","evidence_depth":"SEARCH_SUMMARY","notes":"First commercial VeroTherm formic-acid reflow tool shipped from this site to a global chipmaker (March 2025). Batch 11 (2026-10-05): facts from titles and search-result summaries of the cited government releases and news reports; pages not read directly. Unknown fields are left empty, not estimated.","source_ids":["SRC-000952","SRC-000974"],"batch":"Batch 11","dates":{"first_added":"2026-10-05","last_verified":"2026-10-05"},"program_ids":[]},{"id":"FAC-000014","entity_type":"facility","name":"TSMC Arizona Fab 21 (phase 1), Phoenix","facility_type":"Fab (front-end)","operator":"TSMC Arizona (TSMC)","operator_ids":["FAB-000001"],"partners":[],"country":"United States","country_id":"CTY-US","region":"North America","state":"Arizona","city":"Phoenix","coordinates":{"lat":33.45,"lon":-112.07,"basis":"Approximate town centroid (not the site boundary)"},"scheme":"US CHIPS and Science Act support (per coverage)","approval_date":null,"status":"PRODUCTION","status_class":"PRODUCTION","status_date":"2025-01","status_history":[{"date":"2025-01","status":"PRODUCTION","source_ids":["SRC-000977"]}],"investment":[],"investment_conflict":false,"capacity":null,"technology":"N4 (4 nm-class) per coverage","wafer_size":"300 mm","products":"Logic (customers reported in coverage are not recorded as confirmed links)","jobs":null,"verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM","evidence_depth":"SEARCH_SUMMARY","notes":"Later phases (N3 and beyond) are plans in coverage and are not recorded as milestones. Batch 12 (2026-10-05): facts from titles and search-result summaries of the cited government releases and news reports; pages not read directly. Unknown fields are left empty, not estimated.","source_ids":["SRC-000977"],"batch":"Batch 12","dates":{"first_added":"2026-10-05","last_verified":"2026-10-05"},"program_ids":["PG03"]},{"id":"FAC-000015","entity_type":"facility","name":"JASM Fab 1 (TSMC), Kikuyo, Kumamoto","facility_type":"Fab (front-end)","operator":"Japan Advanced Semiconductor Manufacturing (TSMC majority)","operator_ids":["FAB-000001"],"partners":["Sony Semiconductor Solutions (shareholder per coverage)","Denso (shareholder per coverage)"],"country":"Japan","country_id":"CTY-JP","region":"Asia-Pacific","state":"Kumamoto","city":"Kikuyo","coordinates":{"lat":32.86,"lon":130.79,"basis":"Approximate town centroid (not the site boundary)"},"scheme":null,"approval_date":null,"status":"PRODUCTION","status_class":"PRODUCTION","status_date":"2024-12-27","status_history":[{"date":"2024-12-27","status":"PRODUCTION","source_ids":["SRC-000978"]}],"investment":[],"investment_conflict":false,"capacity":"Planned about 55,000 wafers per month (per coverage)","technology":"12/16 nm and 22/28 nm (per coverage)","wafer_size":"300 mm","products":"Logic, image-sensor and automotive chips (per coverage)","jobs":null,"verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM","evidence_depth":"SEARCH_SUMMARY","notes":"Batch 12 (2026-10-05): facts from titles and search-result summaries of the cited government releases and news reports; pages not read directly. Unknown fields are left empty, not estimated.","source_ids":["SRC-000978"],"batch":"Batch 12","dates":{"first_added":"2026-10-05","last_verified":"2026-10-05"},"program_ids":[]},{"id":"FAC-000016","entity_type":"facility","name":"JASM Fab 2 (TSMC), Kumamoto","facility_type":"Fab (front-end)","operator":"Japan Advanced Semiconductor Manufacturing (TSMC majority)","operator_ids":["FAB-000001"],"partners":[],"country":"Japan","country_id":"CTY-JP","region":"Asia-Pacific","state":"Kumamoto","city":"Kumamoto prefecture","coordinates":{"lat":32.86,"lon":130.79,"basis":"Approximate town centroid (not the site boundary)"},"scheme":null,"approval_date":null,"status":"ANNOUNCED","status_class":"ANNOUNCED","status_date":"2024-02","status_history":[{"date":"2024-02","status":"ANNOUNCED","source_ids":["SRC-000979"]}],"investment":[],"investment_conflict":false,"capacity":null,"technology":"6/7 nm planned (per coverage)","wafer_size":"300 mm","products":null,"jobs":null,"verification":"PARTIALLY_VERIFIED","confidence":"LOW","evidence_depth":"SEARCH_SUMMARY","notes":"Construction start and production targets in coverage are plans; no later milestone is captured. Batch 12 (2026-10-05): facts from titles and search-result summaries of the cited government releases and news reports; pages not read directly. Unknown fields are left empty, not estimated.","source_ids":["SRC-000979"],"batch":"Batch 12","dates":{"first_added":"2026-10-05","last_verified":"2026-10-05"},"program_ids":[]},{"id":"FAC-000017","entity_type":"facility","name":"ESMC fab, Dresden","facility_type":"Fab (front-end)","operator":"European Semiconductor Manufacturing Company (TSMC 70 %, Bosch, Infineon, NXP 10 % each, per coverage)","operator_ids":["FAB-000001"],"partners":["Bosch","Infineon Technologies","NXP Semiconductors"],"country":"Germany","country_id":"CTY-DE","region":"Europe","state":"Saxony","city":"Dresden","coordinates":{"lat":51.05,"lon":13.74,"basis":"Approximate town centroid (not the site boundary)"},"scheme":"EU Chips Act state aid (per coverage)","approval_date":null,"status":"UNDER_CONSTRUCTION","status_class":"UNDER_CONSTRUCTION","status_date":"2025-11-20","status_history":[{"date":"2024-08-20","status":"FOUNDATION_LAID","source_ids":["SRC-000980"]},{"date":"2025-11-20","status":"UNDER_CONSTRUCTION","source_ids":["SRC-000981"]}],"investment":[{"value":10,"currency":"EUR","unit":"billion","label":"€10 billion","inr_crore":null,"source_ids":["SRC-000980"]}],"investment_conflict":false,"capacity":"40,000 wafers per month (300 mm) planned (per coverage)","technology":"FinFET (28/22 nm and 16/12 nm class, per coverage)","wafer_size":"300 mm","products":"Automotive and industrial chips (per coverage)","jobs":null,"verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM","evidence_depth":"SEARCH_SUMMARY","notes":"Equipment move-in was expected in 2H 2026 per the Nov 2025 report; not recorded as a milestone until a source reports it. Batch 12 (2026-10-05): facts from titles and search-result summaries of the cited government releases and news reports; pages not read directly. Unknown fields are left empty, not estimated.","source_ids":["SRC-000980","SRC-000981"],"batch":"Batch 12","dates":{"first_added":"2026-10-05","last_verified":"2026-10-05"},"program_ids":["PG04"]},{"id":"FAC-000018","entity_type":"facility","name":"Rapidus IIM-1, Chitose","facility_type":"Fab (pilot line)","operator":"Rapidus","operator_ids":["FAB-000023"],"partners":["IBM (2 nm GAA process partner, per coverage)"],"country":"Japan","country_id":"CTY-JP","region":"Asia-Pacific","state":"Hokkaido","city":"Chitose","coordinates":{"lat":42.82,"lon":141.65,"basis":"Approximate town centroid (not the site boundary)"},"scheme":"Japanese government (METI/NEDO) support (per coverage)","approval_date":null,"status":"PILOT_PRODUCTION","status_class":"PILOT","status_date":"2025-07-18","status_history":[{"date":"2025-07-18","status":"PILOT_PRODUCTION","source_ids":["SRC-000982"]}],"investment":[],"investment_conflict":false,"capacity":null,"technology":"2 nm gate-all-around","wafer_size":"300 mm","products":"Prototype logic","jobs":null,"verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM","evidence_depth":"SEARCH_SUMMARY","notes":"Mass production is targeted for 2027 in coverage (a plan, not a milestone). Batch 12 (2026-10-05): facts from titles and search-result summaries of the cited government releases and news reports; pages not read directly. Unknown fields are left empty, not estimated.","source_ids":["SRC-000982"],"batch":"Batch 12","dates":{"first_added":"2026-10-05","last_verified":"2026-10-05"},"program_ids":["PG06"]},{"id":"FAC-000019","entity_type":"facility","name":"Samsung Taylor Fab 1, Texas","facility_type":"Fab (front-end)","operator":"Samsung Electronics","operator_ids":["FAB-000002"],"partners":[],"country":"United States","country_id":"CTY-US","region":"North America","state":"Texas","city":"Taylor","coordinates":{"lat":30.57,"lon":-97.41,"basis":"Approximate town centroid (not the site boundary)"},"scheme":"US CHIPS and Science Act support (per coverage)","approval_date":null,"status":"UNDER_CONSTRUCTION","status_class":"UNDER_CONSTRUCTION","status_date":"2026-07-31","status_history":[{"date":"2026-07-31","status":"UNDER_CONSTRUCTION","source_ids":["SRC-000983"]}],"investment":[{"value":37,"currency":"USD","unit":"billion","label":"US$37 billion (headline, per report title)","inr_crore":null,"source_ids":["SRC-000984"]}],"investment_conflict":false,"capacity":null,"technology":"2 nm-class (SF2P) reported","wafer_size":"300 mm","products":null,"jobs":null,"verification":"PARTIALLY_VERIFIED","confidence":"LOW","evidence_depth":"SEARCH_SUMMARY","notes":"Operational readiness is targeted for late 2026 in coverage; a temporary certificate of occupancy for part of Fab 1 was reported (undated in the captured source). The status stays under construction until production is reported. Batch 12 (2026-10-05): facts from titles and search-result summaries of the cited government releases and news reports; pages not read directly. Unknown fields are left empty, not estimated.","source_ids":["SRC-000983","SRC-000984"],"batch":"Batch 12","dates":{"first_added":"2026-10-05","last_verified":"2026-10-05"},"program_ids":["PG03"]},{"id":"FAC-000020","entity_type":"facility","name":"Intel Ohio One, New Albany","facility_type":"Fab (front-end)","operator":"Intel","operator_ids":["FAB-000003"],"partners":[],"country":"United States","country_id":"CTY-US","region":"North America","state":"Ohio","city":"New Albany (Licking County)","coordinates":{"lat":40.08,"lon":-82.78,"basis":"Approximate town centroid (not the site boundary)"},"scheme":null,"approval_date":null,"status":"UNDER_CONSTRUCTION","status_class":"UNDER_CONSTRUCTION","status_date":"2025-02-28","status_history":[{"date":"2025-02-28","status":"UNDER_CONSTRUCTION","source_ids":["SRC-000985","SRC-000986"]},{"date":"2025-02-28","status":"SCHEDULE_CHANGE","source_ids":["SRC-000985","SRC-000986"]}],"investment":[{"value":28,"currency":"USD","unit":"billion","label":"US$28 billion (two fabs, per report title)","inr_crore":null,"source_ids":["SRC-000985"]}],"investment_conflict":false,"capacity":null,"technology":null,"wafer_size":"300 mm","products":null,"jobs":null,"verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM","evidence_depth":"SEARCH_SUMMARY","notes":"Schedule change (Feb 2025): first fab completion moved to 2030 with operations by 2031; second fab 2031/2032 (per coverage). Originally announced in 2022 for 2025. Batch 12 (2026-10-05): facts from titles and search-result summaries of the cited government releases and news reports; pages not read directly. Unknown fields are left empty, not estimated.","source_ids":["SRC-000985","SRC-000986"],"batch":"Batch 12","dates":{"first_added":"2026-10-05","last_verified":"2026-10-05"},"program_ids":[]},{"id":"FAC-000021","entity_type":"facility","name":"Intel Magdeburg fab project (cancelled)","facility_type":"Fab (front-end)","operator":"Intel","operator_ids":["FAB-000003"],"partners":[],"country":"Germany","country_id":"CTY-DE","region":"Europe","state":"Saxony-Anhalt","city":"Magdeburg","coordinates":{"lat":52.13,"lon":11.63,"basis":"Approximate town centroid (not the site boundary)"},"scheme":"German state aid pledged (about €10 billion, per coverage)","approval_date":null,"status":"CANCELLED","status_class":"CANCELLED","status_date":"2025-07","status_history":[{"date":"2025-07","status":"CANCELLED","source_ids":["SRC-000987","SRC-000988"]}],"investment":[{"value":30,"currency":"EUR","unit":"billion","label":"€30 billion planned (per coverage)","inr_crore":null,"source_ids":["SRC-000987"]}],"investment_conflict":false,"capacity":null,"technology":null,"wafer_size":"300 mm","products":null,"jobs":"About 3,000 direct jobs planned (per coverage)","verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM","evidence_depth":"SEARCH_SUMMARY","notes":"Put on hold in Sept 2024 and cancelled in July 2025 (with a planned assembly and test site near Wrocław, Poland), per coverage. Kept as a record: cancelled projects are history, not deleted. Batch 13 (2026-10-05): facts from titles and search-result summaries of the cited government releases and news reports; pages not read directly. Unknown fields are left empty, not estimated.","source_ids":["SRC-000987","SRC-000988"],"batch":"Batch 13","dates":{"first_added":"2026-10-05","last_verified":"2026-10-05"},"program_ids":["PG04"]},{"id":"FAC-000022","entity_type":"facility","name":"Amkor advanced packaging and test campus, Peoria","facility_type":"OSAT / advanced packaging","operator":"Amkor Technology","operator_ids":["OSAT-000016"],"partners":[],"country":"United States","country_id":"CTY-US","region":"North America","state":"Arizona","city":"Peoria","coordinates":{"lat":33.58,"lon":-112.24,"basis":"Approximate town centroid (not the site boundary)"},"scheme":"US CHIPS and Science Act support (per coverage)","approval_date":null,"status":"FOUNDATION_LAID","status_class":"UNDER_CONSTRUCTION","status_date":"2025-10-06","status_history":[{"date":"2025-10-06","status":"FOUNDATION_LAID","source_ids":["SRC-000989","SRC-000990"]}],"investment":[{"value":7,"currency":"USD","unit":"billion","label":"US$7 billion (two phases, per report titles)","inr_crore":null,"source_ids":["SRC-000989"]}],"investment_conflict":false,"capacity":"Over 750,000 sq ft of cleanroom across two phases (per coverage)","technology":"Advanced packaging and test","wafer_size":null,"products":"Advanced packages (customers named in coverage are not recorded as confirmed links)","jobs":"Up to 3,000 (per coverage)","verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM","evidence_depth":"SEARCH_SUMMARY","notes":"First facility completion targeted mid-2027 and production early 2028 (plans, per coverage). Batch 13 (2026-10-05): facts from titles and search-result summaries of the cited government releases and news reports; pages not read directly. Unknown fields are left empty, not estimated.","source_ids":["SRC-000989","SRC-000990"],"batch":"Batch 13","dates":{"first_added":"2026-10-05","last_verified":"2026-10-05"},"program_ids":["PG03"]},{"id":"FAC-000023","entity_type":"facility","name":"Micron ID1 fab, Boise","facility_type":"Fab (memory)","operator":"Micron Technology","operator_ids":["FAB-000004"],"partners":[],"country":"United States","country_id":"CTY-US","region":"North America","state":"Idaho","city":"Boise","coordinates":{"lat":43.53,"lon":-116.15,"basis":"Approximate town centroid (not the site boundary)"},"scheme":"US CHIPS and Science Act direct funding (up to $6.1 billion across Idaho and New York, per filing summary)","approval_date":null,"status":"UNDER_CONSTRUCTION","status_class":"UNDER_CONSTRUCTION","status_date":"2023-10-23","status_history":[{"date":"2023-10-23","status":"UNDER_CONSTRUCTION","source_ids":["SRC-000991"]}],"investment":[],"investment_conflict":false,"capacity":null,"technology":"Leading-edge DRAM","wafer_size":"300 mm","products":"DRAM","jobs":null,"verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM","evidence_depth":"SEARCH_SUMMARY","notes":"Equipment move-in in 2026 and first wafer output in mid-calendar 2027 are company plans (per 10-Q summary), not recorded as milestones until reported. Batch 13 (2026-10-05): facts from titles and search-result summaries of the cited government releases and news reports; pages not read directly. Unknown fields are left empty, not estimated.","source_ids":["SRC-000991","SRC-000992"],"batch":"Batch 13","dates":{"first_added":"2026-10-05","last_verified":"2026-10-05"},"program_ids":["PG03"]},{"id":"FAC-000024","entity_type":"facility","name":"SK hynix Yongin cluster fab 1 (Y1)","facility_type":"Fab (memory)","operator":"SK hynix","operator_ids":["FAB-000005"],"partners":[],"country":"South Korea","country_id":"CTY-KR","region":"Asia-Pacific","state":"Gyeonggi","city":"Yongin","coordinates":{"lat":37.24,"lon":127.18,"basis":"Approximate town centroid (not the site boundary)"},"scheme":null,"approval_date":null,"status":"UNDER_CONSTRUCTION","status_class":"UNDER_CONSTRUCTION","status_date":"2026-02-25","status_history":[{"date":"2026-02-25","status":"UNDER_CONSTRUCTION","source_ids":["SRC-000993"]}],"investment":[{"value":15,"currency":"USD","unit":"billion","label":"Additional US$15 billion (KRW 21.6 trillion) announced Feb 2026","inr_crore":null,"source_ids":["SRC-000993"]}],"investment_conflict":false,"capacity":null,"technology":"DRAM / HBM","wafer_size":"300 mm","products":"Memory","jobs":null,"verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM","evidence_depth":"SEARCH_SUMMARY","notes":"First cleanroom opening targeted for Feb 2027 (plan, per coverage). The figure above is an additional commitment, not the total cost. Batch 13 (2026-10-05): facts from titles and search-result summaries of the cited government releases and news reports; pages not read directly. Unknown fields are left empty, not estimated.","source_ids":["SRC-000993"],"batch":"Batch 13","dates":{"first_added":"2026-10-05","last_verified":"2026-10-05"},"program_ids":[]},{"id":"FAC-000025","entity_type":"facility","name":"SK hynix HBM advanced packaging plant, West Lafayette","facility_type":"Advanced packaging (HBM)","operator":"SK hynix","operator_ids":["FAB-000005"],"partners":["Purdue Research Park (site)"],"country":"United States","country_id":"CTY-US","region":"North America","state":"Indiana","city":"West Lafayette","coordinates":{"lat":40.43,"lon":-86.91,"basis":"Approximate town centroid (not the site boundary)"},"scheme":"US CHIPS and Science Act support (per coverage)","approval_date":null,"status":"FOUNDATION_LAID","status_class":"UNDER_CONSTRUCTION","status_date":"2026-04-22","status_history":[{"date":"2026-04-22","status":"FOUNDATION_LAID","source_ids":["SRC-000994"]}],"investment":[{"value":4,"currency":"USD","unit":"billion","label":"About US$4 billion (per report titles)","inr_crore":null,"source_ids":["SRC-000995"]}],"investment_conflict":false,"capacity":null,"technology":"HBM stacking, packaging and test","wafer_size":null,"products":"HBM","jobs":"Up to 800 by 2030 (per coverage)","verification":"PARTIALLY_VERIFIED","confidence":"MEDIUM","evidence_depth":"SEARCH_SUMMARY","notes":"Mass production slated for 2H 2028 (plan, per coverage). Batch 13 (2026-10-05): facts from titles and search-result summaries of the cited government releases and news reports; pages not read directly. Unknown fields are left empty, not estimated.","source_ids":["SRC-000994","SRC-000995"],"batch":"Batch 13","dates":{"first_added":"2026-10-05","last_verified":"2026-10-05"},"program_ids":["PG03"]}],"countries":[{"id":"CTY-US","entity_type":"country","iso2":"US","name":"United States","region":"North America","lat":39.8,"lon":-98.6,"centroid_note":"Approximate country centroid for map clustering only","company_ids":["CMP-000002","CMP-000003","CMP-000005","CMP-000009","CMP-000014","CMP-000015","CMP-000016","CMP-000031","CMP-000034","CMP-000036","CMP-000040","CMP-000046","CMP-000054","CMP-000064","CMP-000104","CMP-000145","CMP-000146","CMP-000148","CMP-000151","CMP-000158","CMP-000163","CMP-000170","CMP-000172","CMP-000173","CMP-000181","CMP-000182","CMP-000364","CMP-000206","CMP-000209","CMP-000213","CMP-000215","CMP-000221","CMP-000222","CMP-000227","CMP-000235","CMP-000236","CMP-000237","CMP-000238","CMP-000239","CMP-000240","CMP-000255","CMP-000256","CMP-000257","CMP-000258","CMP-000259","CMP-000260","CMP-000277","CMP-000282","CMP-000284","CMP-000286","CMP-000287","CMP-000288","CMP-000289","CMP-000292","CMP-000300","CMP-000310","CMP-000315","CMP-000319","CMP-000322","CMP-000323","CMP-000324","CMP-000325","CMP-000326","CMP-000333","CMP-000353","CMP-000358"],"equipment_oem_ids":["CMP-000002","CMP-000003","CMP-000005","CMP-000009","CMP-000014","CMP-000015","CMP-000016","CMP-000031","CMP-000034","CMP-000036","CMP-000040","CMP-000046","CMP-000054","CMP-000104","CMP-000181","CMP-000182","CMP-000206","CMP-000209","CMP-000213","CMP-000215","CMP-000221","CMP-000222","CMP-000227","CMP-000235","CMP-000236","CMP-000237","CMP-000238","CMP-000239","CMP-000240","CMP-000255","CMP-000257","CMP-000258","CMP-000259","CMP-000260","CMP-000277","CMP-000282","CMP-000284","CMP-000286","CMP-000287","CMP-000288","CMP-000289","CMP-000292","CMP-000300","CMP-000310","CMP-000319","CMP-000322","CMP-000323","CMP-000358"],"subsystem_supplier_ids":["CMP-000170","CMP-000172","CMP-000173","CMP-000324","CMP-000325","CMP-000353"],"component_supplier_ids":["CMP-000145","CMP-000146","CMP-000148","CMP-000151","CMP-000158","CMP-000163","CMP-000333"],"materials_supplier_ids":["CMP-000315","CMP-000326"],"fab_ids":["FAB-000003","FAB-000004","FAB-000007","FAB-000009","FAB-000024","FAB-000026","FAB-000032"],"osat_ids":["OSAT-000016"],"india_partnership_company_ids":["CMP-000002","CMP-000003","CMP-000005","CMP-000009"],"verified_company_count":26,"batch1_search_status":"TARGETED","legacy_notes":"OEM majors, subsystems, laser/optics, motion, test","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-CA","entity_type":"country","iso2":"CA","name":"Canada","region":"North America","lat":56.1,"lon":-106.3,"centroid_note":"Approximate country centroid for map clustering only","company_ids":["CMP-000214","CMP-000228"],"equipment_oem_ids":["CMP-000214"],"subsystem_supplier_ids":[],"component_supplier_ids":["CMP-000228"],"materials_supplier_ids":[],"fab_ids":[],"osat_ids":[],"india_partnership_company_ids":[],"verified_company_count":0,"batch1_search_status":"NOT_SEARCHED","legacy_notes":"Batch 2","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-MX","entity_type":"country","iso2":"MX","name":"Mexico","region":"North America","lat":23.6,"lon":-102.6,"centroid_note":"Approximate country centroid for map clustering only","company_ids":[],"equipment_oem_ids":[],"subsystem_supplier_ids":[],"component_supplier_ids":[],"materials_supplier_ids":[],"fab_ids":[],"osat_ids":[],"india_partnership_company_ids":[],"verified_company_count":0,"batch1_search_status":"NOT_SEARCHED","legacy_notes":"Batch 2 (OSAT/EMS near-shoring)","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-DE","entity_type":"country","iso2":"DE","name":"Germany","region":"Europe","lat":51.2,"lon":10.4,"centroid_note":"Approximate country centroid for map clustering only","company_ids":["CMP-000027","CMP-000028","CMP-000052","CMP-000056","CMP-000141","CMP-000143","CMP-000144","CMP-000147","CMP-000152","CMP-000153","CMP-000154","CMP-000159","CMP-000164","CMP-000166","CMP-000169","CMP-000362","CMP-000370","CMP-000202","CMP-000210","CMP-000211","CMP-000220","CMP-000223","CMP-000244","CMP-000245","CMP-000246","CMP-000251","CMP-000253","CMP-000276","CMP-000278","CMP-000279","CMP-000285","CMP-000295","CMP-000301","CMP-000312","CMP-000317","CMP-000318","CMP-000336","CMP-000337","CMP-000341"],"equipment_oem_ids":["CMP-000028","CMP-000052","CMP-000056","CMP-000141","CMP-000143","CMP-000144","CMP-000202","CMP-000210","CMP-000211","CMP-000220","CMP-000223","CMP-000244","CMP-000245","CMP-000246","CMP-000251","CMP-000253","CMP-000276","CMP-000278","CMP-000279","CMP-000285","CMP-000301","CMP-000317","CMP-000318","CMP-000336","CMP-000337","CMP-000341"],"subsystem_supplier_ids":["CMP-000169","CMP-000362","CMP-000370","CMP-000295"],"component_supplier_ids":["CMP-000027","CMP-000147","CMP-000152","CMP-000153","CMP-000154","CMP-000159","CMP-000164","CMP-000166"],"materials_supplier_ids":["CMP-000312"],"fab_ids":["FAB-000010","FAB-000030"],"osat_ids":[],"india_partnership_company_ids":[],"verified_company_count":14,"batch1_search_status":"TARGETED","legacy_notes":"Laser (TRUMPF, 3D-Micromac, LPKF, InnoLas), optics, galvo, motion, MOCVD, vacuum","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-NL","entity_type":"country","iso2":"NL","name":"Netherlands","region":"Europe","lat":52.1,"lon":5.3,"centroid_note":"Approximate country centroid for map clustering only","company_ids":["CMP-000001","CMP-000006","CMP-000043","CMP-000045","CMP-000180","CMP-000216","CMP-000252","CMP-000280","CMP-000281"],"equipment_oem_ids":["CMP-000001","CMP-000006","CMP-000043","CMP-000045","CMP-000180","CMP-000216","CMP-000252","CMP-000280","CMP-000281"],"subsystem_supplier_ids":[],"component_supplier_ids":[],"materials_supplier_ids":[],"fab_ids":["FAB-000012","FAB-000028"],"osat_ids":[],"india_partnership_company_ids":["CMP-000001"],"verified_company_count":4,"batch1_search_status":"TARGETED","legacy_notes":"ASML, ASMI, BESI, ASMPT ALSI","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-CH","entity_type":"country","iso2":"CH","name":"Switzerland","region":"Europe","lat":46.8,"lon":8.2,"centroid_note":"Approximate country centroid for map clustering only","company_ids":["CMP-000142","CMP-000161","CMP-000171","CMP-000365","CMP-000241","CMP-000249"],"equipment_oem_ids":["CMP-000142","CMP-000241","CMP-000249"],"subsystem_supplier_ids":["CMP-000171","CMP-000365"],"component_supplier_ids":["CMP-000161"],"materials_supplier_ids":[],"fab_ids":["FAB-000011"],"osat_ids":[],"india_partnership_company_ids":[],"verified_company_count":3,"batch1_search_status":"INCIDENTAL","legacy_notes":"Synova, Comet PCT, ETEL (HEIDENHAIN)","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-GB","entity_type":"country","iso2":"GB","name":"United Kingdom","region":"Europe","lat":54,"lon":-2.5,"centroid_note":"Approximate country centroid for map clustering only","company_ids":["CMP-000029","CMP-000157","CMP-000162","CMP-000168","CMP-000225","CMP-000298","CMP-000302","CMP-000349"],"equipment_oem_ids":["CMP-000029","CMP-000225","CMP-000298","CMP-000302"],"subsystem_supplier_ids":["CMP-000168"],"component_supplier_ids":["CMP-000157","CMP-000162"],"materials_supplier_ids":["CMP-000349"],"fab_ids":[],"osat_ids":[],"india_partnership_company_ids":[],"verified_company_count":3,"batch1_search_status":"INCIDENTAL","legacy_notes":"Edwards, Renishaw, Oxford Instruments, Gooch & Housego","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-FR","entity_type":"country","iso2":"FR","name":"France","region":"Europe","lat":46.6,"lon":2.2,"centroid_note":"Approximate country centroid for map clustering only","company_ids":["CMP-000150","CMP-000177","CMP-000218","CMP-000224","CMP-000243","CMP-000283","CMP-000299","CMP-000350"],"equipment_oem_ids":["CMP-000177","CMP-000218","CMP-000224","CMP-000243","CMP-000283","CMP-000299"],"subsystem_supplier_ids":[],"component_supplier_ids":["CMP-000150"],"materials_supplier_ids":["CMP-000350"],"fab_ids":[],"osat_ids":[],"india_partnership_company_ids":[],"verified_company_count":2,"batch1_search_status":"INCIDENTAL","legacy_notes":"Amplitude","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-IT","entity_type":"country","iso2":"IT","name":"Italy","region":"Europe","lat":42.8,"lon":12.6,"centroid_note":"Approximate country centroid for map clustering only","company_ids":["CMP-000033"],"equipment_oem_ids":["CMP-000033"],"subsystem_supplier_ids":[],"component_supplier_ids":[],"materials_supplier_ids":[],"fab_ids":[],"osat_ids":[],"india_partnership_company_ids":[],"verified_company_count":1,"batch1_search_status":"INCIDENTAL","legacy_notes":"Technoprobe","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-BE","entity_type":"country","iso2":"BE","name":"Belgium","region":"Europe","lat":50.6,"lon":4.6,"centroid_note":"Approximate country centroid for map clustering only","company_ids":[],"equipment_oem_ids":[],"subsystem_supplier_ids":[],"component_supplier_ids":[],"materials_supplier_ids":[],"fab_ids":[],"osat_ids":[],"india_partnership_company_ids":[],"verified_company_count":0,"batch1_search_status":"NOT_SEARCHED","legacy_notes":"Batch 2 (imec ecosystem)","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-AT","entity_type":"country","iso2":"AT","name":"Austria","region":"Europe","lat":47.6,"lon":14.1,"centroid_note":"Approximate country centroid for map clustering only","company_ids":["CMP-000051","CMP-000242","CMP-000254","CMP-000309"],"equipment_oem_ids":["CMP-000051","CMP-000242","CMP-000254","CMP-000309"],"subsystem_supplier_ids":[],"component_supplier_ids":[],"materials_supplier_ids":[],"fab_ids":[],"osat_ids":[],"india_partnership_company_ids":[],"verified_company_count":1,"batch1_search_status":"INCIDENTAL","legacy_notes":"EV Group","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-FI","entity_type":"country","iso2":"FI","name":"Finland","region":"Europe","lat":64,"lon":26,"centroid_note":"Approximate country centroid for map clustering only","company_ids":["CMP-000030","CMP-000290"],"equipment_oem_ids":["CMP-000030"],"subsystem_supplier_ids":[],"component_supplier_ids":["CMP-000290"],"materials_supplier_ids":[],"fab_ids":[],"osat_ids":[],"india_partnership_company_ids":[],"verified_company_count":1,"batch1_search_status":"INCIDENTAL","legacy_notes":"Beneq","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-SE","entity_type":"country","iso2":"SE","name":"Sweden","region":"Europe","lat":62,"lon":15,"centroid_note":"Approximate country centroid for map clustering only","company_ids":["CMP-000026","CMP-000361","CMP-000212","CMP-000248"],"equipment_oem_ids":["CMP-000026","CMP-000212","CMP-000248"],"subsystem_supplier_ids":[],"component_supplier_ids":[],"materials_supplier_ids":[],"fab_ids":[],"osat_ids":[],"india_partnership_company_ids":[],"verified_company_count":1,"batch1_search_status":"INCIDENTAL","legacy_notes":"Mycronic","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-DK","entity_type":"country","iso2":"DK","name":"Denmark","region":"Europe","lat":56,"lon":9.5,"centroid_note":"Approximate country centroid for map clustering only","company_ids":["CMP-000178","CMP-000247"],"equipment_oem_ids":["CMP-000247"],"subsystem_supplier_ids":[],"component_supplier_ids":["CMP-000178"],"materials_supplier_ids":[],"fab_ids":[],"osat_ids":[],"india_partnership_company_ids":[],"verified_company_count":1,"batch1_search_status":"INCIDENTAL","legacy_notes":"NKT Photonics (Hamamatsu group)","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-NO","entity_type":"country","iso2":"NO","name":"Norway","region":"Europe","lat":61,"lon":8.5,"centroid_note":"Approximate country centroid for map clustering only","company_ids":["CMP-000208"],"equipment_oem_ids":["CMP-000208"],"subsystem_supplier_ids":[],"component_supplier_ids":[],"materials_supplier_ids":[],"fab_ids":[],"osat_ids":[],"india_partnership_company_ids":[],"verified_company_count":0,"batch1_search_status":"NOT_IN_BRIEF","legacy_notes":null,"listed_in_brief":false,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-ES","entity_type":"country","iso2":"ES","name":"Spain","region":"Europe","lat":40.3,"lon":-3.7,"centroid_note":"Approximate country centroid for map clustering only","company_ids":[],"equipment_oem_ids":[],"subsystem_supplier_ids":[],"component_supplier_ids":[],"materials_supplier_ids":[],"fab_ids":[],"osat_ids":[],"india_partnership_company_ids":[],"verified_company_count":0,"batch1_search_status":"NOT_SEARCHED","legacy_notes":"Batch 2","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-PT","entity_type":"country","iso2":"PT","name":"Portugal","region":"Europe","lat":39.6,"lon":-8,"centroid_note":"Approximate country centroid for map clustering only","company_ids":["CMP-000293"],"equipment_oem_ids":[],"subsystem_supplier_ids":[],"component_supplier_ids":[],"materials_supplier_ids":[],"fab_ids":[],"osat_ids":[],"india_partnership_company_ids":[],"verified_company_count":0,"batch1_search_status":"NOT_IN_BRIEF","legacy_notes":null,"listed_in_brief":false,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-IE","entity_type":"country","iso2":"IE","name":"Ireland","region":"Europe","lat":53.2,"lon":-8.2,"centroid_note":"Approximate country centroid for map clustering only","company_ids":[],"equipment_oem_ids":[],"subsystem_supplier_ids":[],"component_supplier_ids":[],"materials_supplier_ids":[],"fab_ids":[],"osat_ids":[],"india_partnership_company_ids":[],"verified_company_count":0,"batch1_search_status":"NOT_SEARCHED","legacy_notes":"Batch 2","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-CZ","entity_type":"country","iso2":"CZ","name":"Czech Republic","region":"Europe","lat":49.8,"lon":15.5,"centroid_note":"Approximate country centroid for map clustering only","company_ids":["CMP-000217"],"equipment_oem_ids":["CMP-000217"],"subsystem_supplier_ids":[],"component_supplier_ids":[],"materials_supplier_ids":[],"fab_ids":[],"osat_ids":[],"india_partnership_company_ids":[],"verified_company_count":0,"batch1_search_status":"NOT_SEARCHED","legacy_notes":"Batch 2 (Thermo Fisher Brno site not verified)","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-PL","entity_type":"country","iso2":"PL","name":"Poland","region":"Europe","lat":52,"lon":19.4,"centroid_note":"Approximate country centroid for map clustering only","company_ids":[],"equipment_oem_ids":[],"subsystem_supplier_ids":[],"component_supplier_ids":[],"materials_supplier_ids":[],"fab_ids":[],"osat_ids":[],"india_partnership_company_ids":[],"verified_company_count":0,"batch1_search_status":"NOT_SEARCHED","legacy_notes":"Batch 2","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-HU","entity_type":"country","iso2":"HU","name":"Hungary","region":"Europe","lat":47.2,"lon":19.5,"centroid_note":"Approximate country centroid for map clustering only","company_ids":["CMP-000019"],"equipment_oem_ids":["CMP-000019"],"subsystem_supplier_ids":[],"component_supplier_ids":[],"materials_supplier_ids":[],"fab_ids":[],"osat_ids":[],"india_partnership_company_ids":[],"verified_company_count":0,"batch1_search_status":"INCIDENTAL","legacy_notes":"Semilab","listed_in_brief":false,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-LT","entity_type":"country","iso2":"LT","name":"Lithuania","region":"Europe","lat":55.2,"lon":23.9,"centroid_note":"Approximate country centroid for map clustering only","company_ids":["CMP-000149","CMP-000226"],"equipment_oem_ids":["CMP-000226"],"subsystem_supplier_ids":[],"component_supplier_ids":["CMP-000149"],"materials_supplier_ids":[],"fab_ids":[],"osat_ids":[],"india_partnership_company_ids":[],"verified_company_count":1,"batch1_search_status":"INCIDENTAL","legacy_notes":"Light Conversion","listed_in_brief":false,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-IL","entity_type":"country","iso2":"IL","name":"Israel","region":"Middle East","lat":31.4,"lon":35,"centroid_note":"Approximate country centroid for map clustering only","company_ids":["CMP-000017","CMP-000018","CMP-000053","CMP-000156","CMP-000160","CMP-000250"],"equipment_oem_ids":["CMP-000017","CMP-000018","CMP-000053","CMP-000250"],"subsystem_supplier_ids":[],"component_supplier_ids":["CMP-000156","CMP-000160"],"materials_supplier_ids":[],"fab_ids":[],"osat_ids":[],"india_partnership_company_ids":[],"verified_company_count":5,"batch1_search_status":"INCIDENTAL","legacy_notes":"Nova, Camtek, ADT, ACS Motion Control, Holo/Or","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-ME","entity_type":"country","iso2":"ME","name":"Middle East (UAE/Saudi Arabia/other)","region":"Middle East","lat":24,"lon":45,"centroid_note":"Approximate country centroid for map clustering only","company_ids":[],"equipment_oem_ids":[],"subsystem_supplier_ids":[],"component_supplier_ids":[],"materials_supplier_ids":[],"fab_ids":[],"osat_ids":[],"india_partnership_company_ids":[],"verified_company_count":0,"batch1_search_status":"NOT_SEARCHED","legacy_notes":"Batch 2","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-JP","entity_type":"country","iso2":"JP","name":"Japan","region":"Asia-Pacific","lat":36.2,"lon":138.3,"centroid_note":"Approximate country centroid for map clustering only","company_ids":["CMP-000004","CMP-000007","CMP-000008","CMP-000010","CMP-000011","CMP-000012","CMP-000013","CMP-000020","CMP-000021","CMP-000022","CMP-000023","CMP-000024","CMP-000025","CMP-000032","CMP-000049","CMP-000050","CMP-000055","CMP-000059","CMP-000060","CMP-000061","CMP-000062","CMP-000063","CMP-000065","CMP-000066","CMP-000165","CMP-000174","CMP-000175","CMP-000176","CMP-000363","CMP-000367","CMP-000369","CMP-000203","CMP-000204","CMP-000205","CMP-000207","CMP-000219","CMP-000229","CMP-000230","CMP-000231","CMP-000232","CMP-000233","CMP-000234","CMP-000294","CMP-000296","CMP-000297","CMP-000303","CMP-000304","CMP-000305","CMP-000306","CMP-000307","CMP-000308","CMP-000311","CMP-000314","CMP-000316","CMP-000320","CMP-000321","CMP-000334","CMP-000335","CMP-000338","CMP-000339","CMP-000342","CMP-000343","CMP-000344","CMP-000347","CMP-000348","CMP-000351","CMP-000352"],"equipment_oem_ids":["CMP-000004","CMP-000007","CMP-000008","CMP-000010","CMP-000012","CMP-000013","CMP-000020","CMP-000021","CMP-000022","CMP-000024","CMP-000025","CMP-000049","CMP-000050","CMP-000055","CMP-000059","CMP-000060","CMP-000061","CMP-000174","CMP-000175","CMP-000176","CMP-000367","CMP-000203","CMP-000207","CMP-000219","CMP-000229","CMP-000230","CMP-000231","CMP-000232","CMP-000233","CMP-000234","CMP-000303","CMP-000304","CMP-000305","CMP-000306","CMP-000316","CMP-000334","CMP-000335","CMP-000338"],"subsystem_supplier_ids":["CMP-000023","CMP-000294","CMP-000296","CMP-000307","CMP-000308","CMP-000339"],"component_supplier_ids":["CMP-000011","CMP-000032","CMP-000165","CMP-000297"],"materials_supplier_ids":["CMP-000311","CMP-000314","CMP-000342","CMP-000343","CMP-000344","CMP-000347","CMP-000348","CMP-000351","CMP-000352"],"fab_ids":["FAB-000013","FAB-000014","FAB-000023"],"osat_ids":[],"india_partnership_company_ids":["CMP-000004","CMP-000062","CMP-000065","CMP-000066"],"verified_company_count":27,"batch1_search_status":"TARGETED","legacy_notes":"Front-end majors, dicing/grinding, laser annealing, back-end, AMHS","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-KR","entity_type":"country","iso2":"KR","name":"South Korea","region":"Asia-Pacific","lat":36.5,"lon":127.9,"centroid_note":"Approximate country centroid for map clustering only","company_ids":["CMP-000038","CMP-000039","CMP-000047","CMP-000048","CMP-000057","CMP-000058","CMP-000067","CMP-000068","CMP-000069","CMP-000070","CMP-000071","CMP-000072","CMP-000073","CMP-000074","CMP-000075","CMP-000076","CMP-000077","CMP-000078","CMP-000079","CMP-000366","CMP-000368","CMP-000261","CMP-000262","CMP-000263","CMP-000264","CMP-000265","CMP-000266","CMP-000267","CMP-000291","CMP-000313","CMP-000345","CMP-000346","CMP-000354","CMP-000355","CMP-000356"],"equipment_oem_ids":["CMP-000038","CMP-000039","CMP-000047","CMP-000048","CMP-000057","CMP-000058","CMP-000067","CMP-000069","CMP-000070","CMP-000071","CMP-000072","CMP-000073","CMP-000074","CMP-000075","CMP-000076","CMP-000077","CMP-000078","CMP-000079","CMP-000368","CMP-000261","CMP-000262","CMP-000263","CMP-000264","CMP-000265","CMP-000266","CMP-000267","CMP-000291","CMP-000354"],"subsystem_supplier_ids":["CMP-000355","CMP-000356"],"component_supplier_ids":[],"materials_supplier_ids":["CMP-000313","CMP-000345","CMP-000346"],"fab_ids":["FAB-000002","FAB-000005"],"osat_ids":[],"india_partnership_company_ids":[],"verified_company_count":11,"batch1_search_status":"TARGETED","legacy_notes":"HBM TC bonders, laser (EO Technics, Philoptics, AP Systems), test handlers","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-TW","entity_type":"country","iso2":"TW","name":"Taiwan","region":"Asia-Pacific","lat":23.7,"lon":121,"centroid_note":"Approximate country centroid for map clustering only","company_ids":["CMP-000035","CMP-000037","CMP-000080","CMP-000081","CMP-000082","CMP-000083","CMP-000084","CMP-000085","CMP-000086","CMP-000087","CMP-000088","CMP-000089","CMP-000090","CMP-000091","CMP-000092","CMP-000093","CMP-000271","CMP-000340"],"equipment_oem_ids":["CMP-000035","CMP-000037","CMP-000080","CMP-000081","CMP-000082","CMP-000083","CMP-000084","CMP-000087","CMP-000088","CMP-000271"],"subsystem_supplier_ids":["CMP-000091","CMP-000092"],"component_supplier_ids":["CMP-000340"],"materials_supplier_ids":[],"fab_ids":["FAB-000001","FAB-000006"],"osat_ids":["OSAT-000015","OSAT-000018"],"india_partnership_company_ids":[],"verified_company_count":15,"batch1_search_status":"TARGETED","legacy_notes":"CoWoS/CoPoS local vendors, test (Chroma, MPI), facility (UIS, Marketech)","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-CN","entity_type":"country","iso2":"CN","name":"China","region":"Asia-Pacific","lat":35,"lon":104.2,"centroid_note":"Approximate country centroid for map clustering only","company_ids":["CMP-000101","CMP-000102","CMP-000103","CMP-000105","CMP-000106","CMP-000107","CMP-000108","CMP-000109","CMP-000110","CMP-000111","CMP-000112","CMP-000113","CMP-000114","CMP-000115","CMP-000116","CMP-000117","CMP-000118","CMP-000119","CMP-000120","CMP-000121","CMP-000122","CMP-000123","CMP-000124","CMP-000125","CMP-000126","CMP-000127","CMP-000128","CMP-000129","CMP-000130","CMP-000132","CMP-000133","CMP-000134","CMP-000135","CMP-000136","CMP-000137","CMP-000138","CMP-000272","CMP-000357","CMP-000359","CMP-000360"],"equipment_oem_ids":["CMP-000101","CMP-000102","CMP-000103","CMP-000105","CMP-000106","CMP-000107","CMP-000108","CMP-000109","CMP-000110","CMP-000111","CMP-000112","CMP-000113","CMP-000114","CMP-000115","CMP-000116","CMP-000117","CMP-000118","CMP-000119","CMP-000120","CMP-000121","CMP-000122","CMP-000123","CMP-000124","CMP-000125","CMP-000126","CMP-000127","CMP-000128","CMP-000129","CMP-000130","CMP-000132","CMP-000272","CMP-000357","CMP-000359"],"subsystem_supplier_ids":[],"component_supplier_ids":["CMP-000133","CMP-000134","CMP-000135","CMP-000136","CMP-000137","CMP-000138","CMP-000360"],"materials_supplier_ids":[],"fab_ids":["FAB-000008","FAB-000025"],"osat_ids":["OSAT-000017"],"india_partnership_company_ids":[],"verified_company_count":17,"batch1_search_status":"TARGETED","legacy_notes":"Naura, AMEC, Piotech, Hwatsing, ACM, SMEE/AMIES/SiCarrier, laser (Han's, HGTECH, Delphi, DR Laser), laser sources","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-HK","entity_type":"country","iso2":"HK","name":"Hong Kong","region":"Asia-Pacific","lat":22.3,"lon":114.2,"centroid_note":"Approximate country centroid for map clustering only","company_ids":["CMP-000044"],"equipment_oem_ids":["CMP-000044"],"subsystem_supplier_ids":[],"component_supplier_ids":[],"materials_supplier_ids":[],"fab_ids":[],"osat_ids":[],"india_partnership_company_ids":["CMP-000044"],"verified_company_count":1,"batch1_search_status":"INCIDENTAL","legacy_notes":"ASMPT (HKEX listing)","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-SG","entity_type":"country","iso2":"SG","name":"Singapore","region":"Asia-Pacific","lat":1.35,"lon":103.8,"centroid_note":"Approximate country centroid for map clustering only","company_ids":["CMP-000155","CMP-000269","CMP-000327","CMP-000328"],"equipment_oem_ids":["CMP-000269","CMP-000327","CMP-000328"],"subsystem_supplier_ids":[],"component_supplier_ids":["CMP-000155"],"materials_supplier_ids":[],"fab_ids":[],"osat_ids":[],"india_partnership_company_ids":[],"verified_company_count":1,"batch1_search_status":"INCIDENTAL","legacy_notes":"Wavelength Opto-Electronic","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-IN","entity_type":"country","iso2":"IN","name":"India","region":"Asia-Pacific","lat":22,"lon":79,"centroid_note":"Approximate country centroid for map clustering only","company_ids":["CMP-000184","CMP-000191","CMP-000192","CMP-000193","CMP-000194","CMP-000195","CMP-000196","CMP-000197","CMP-000198","CMP-000199","CMP-000200","CMP-000201","CMP-000273","CMP-000274","CMP-000275","CMP-000331","CMP-000332"],"equipment_oem_ids":["CMP-000184","CMP-000194","CMP-000195","CMP-000273","CMP-000274","CMP-000275","CMP-000331","CMP-000332"],"subsystem_supplier_ids":["CMP-000193","CMP-000200"],"component_supplier_ids":[],"materials_supplier_ids":["CMP-000199"],"fab_ids":["FAB-000019"],"osat_ids":["OSAT-000019","OSAT-000020","OSAT-000021","OSAT-000022","OSAT-000029"],"india_partnership_company_ids":[],"verified_company_count":7,"batch1_search_status":"TARGETED","legacy_notes":"ISM projects, OEM India presence, Indian equipment/automation/laser firms","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-MY","entity_type":"country","iso2":"MY","name":"Malaysia","region":"Asia-Pacific","lat":4.2,"lon":102,"centroid_note":"Approximate country centroid for map clustering only","company_ids":["CMP-000041","CMP-000042","CMP-000268","CMP-000270","CMP-000329","CMP-000330"],"equipment_oem_ids":["CMP-000041","CMP-000268","CMP-000270","CMP-000329","CMP-000330"],"subsystem_supplier_ids":[],"component_supplier_ids":[],"materials_supplier_ids":[],"fab_ids":[],"osat_ids":[],"india_partnership_company_ids":[],"verified_company_count":1,"batch1_search_status":"INCIDENTAL","legacy_notes":"ViTrox, Pentamaster","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-VN","entity_type":"country","iso2":"VN","name":"Vietnam","region":"Asia-Pacific","lat":16,"lon":107.8,"centroid_note":"Approximate country centroid for map clustering only","company_ids":[],"equipment_oem_ids":[],"subsystem_supplier_ids":[],"component_supplier_ids":[],"materials_supplier_ids":[],"fab_ids":[],"osat_ids":[],"india_partnership_company_ids":[],"verified_company_count":0,"batch1_search_status":"NOT_SEARCHED","legacy_notes":"Batch 2","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-TH","entity_type":"country","iso2":"TH","name":"Thailand","region":"Asia-Pacific","lat":15.9,"lon":100.9,"centroid_note":"Approximate country centroid for map clustering only","company_ids":[],"equipment_oem_ids":[],"subsystem_supplier_ids":[],"component_supplier_ids":[],"materials_supplier_ids":[],"fab_ids":[],"osat_ids":[],"india_partnership_company_ids":[],"verified_company_count":0,"batch1_search_status":"NOT_SEARCHED","legacy_notes":"Batch 2","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-PH","entity_type":"country","iso2":"PH","name":"Philippines","region":"Asia-Pacific","lat":12.9,"lon":121.8,"centroid_note":"Approximate country centroid for map clustering only","company_ids":[],"equipment_oem_ids":[],"subsystem_supplier_ids":[],"component_supplier_ids":[],"materials_supplier_ids":[],"fab_ids":[],"osat_ids":[],"india_partnership_company_ids":[],"verified_company_count":0,"batch1_search_status":"NOT_SEARCHED","legacy_notes":"Batch 2","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-AU","entity_type":"country","iso2":"AU","name":"Australia","region":"Asia-Pacific","lat":-25.3,"lon":133.8,"centroid_note":"Approximate country centroid for map clustering only","company_ids":[],"equipment_oem_ids":[],"subsystem_supplier_ids":[],"component_supplier_ids":[],"materials_supplier_ids":[],"fab_ids":[],"osat_ids":[],"india_partnership_company_ids":[],"verified_company_count":0,"batch1_search_status":"NOT_SEARCHED","legacy_notes":"Batch 2","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"},{"id":"CTY-NZ","entity_type":"country","iso2":"NZ","name":"New Zealand","region":"Asia-Pacific","lat":-41,"lon":174,"centroid_note":"Approximate country centroid for map clustering only","company_ids":[],"equipment_oem_ids":[],"subsystem_supplier_ids":[],"component_supplier_ids":[],"materials_supplier_ids":[],"fab_ids":[],"osat_ids":[],"india_partnership_company_ids":[],"verified_company_count":0,"batch1_search_status":"NOT_SEARCHED","legacy_notes":"Batch 2","listed_in_brief":true,"technology_strengths":null,"export_dependencies":null,"strengths_note":"Not assessed in Batch 1 — no source-backed assessment captured"}],"deals":[{"id":"DEAL-000001","legacy_id":"PA001","event_type":"Merger","party_a":"Axcelis Technologies","party_a_id":"CMP-000015","party_b":"Veeco Instruments","party_b_id":"CMP-000014","date":"2025-09-30","value_disclosed":"All-stock, ratio 0.3575; ~USD 4.4B (Tier 4)","technology":"Ion implant + laser annealing/MOCVD/ion beam","status":"PENDING (regulatory approval)","confidence":"HIGH","source_ids":["SRC-000121","SRC-000122","SRC-000123"],"claim_type":"Reported event"},{"id":"DEAL-000002","legacy_id":"PA002","event_type":"Acquisition","party_a":"Applied Materials","party_a_id":"CMP-000002","party_b":"NEXX (ASMPT business unit)","party_b_id":null,"date":"2026-Q2 FY26","value_disclosed":"USD 120M cash","technology":"Electroplating / packaging deposition","status":"ANNOUNCED","confidence":"HIGH","source_ids":["SRC-000124","SRC-000125"],"claim_type":"Reported event"},{"id":"DEAL-000003","legacy_id":"PA003","event_type":"Strategic investment","party_a":"Applied Materials","party_a_id":"CMP-000002","party_b":"BE Semiconductor Industries (BESI)","party_b_id":"CMP-000043","date":"2025-04","value_disclosed":"9% stake","technology":"Hybrid bonding","status":"DISCLOSED","confidence":"MEDIUM","source_ids":["SRC-000046","SRC-000049"],"claim_type":"Reported event"},{"id":"DEAL-000004","legacy_id":"PA004","event_type":"Joint development","party_a":"Applied Materials","party_a_id":"CMP-000002","party_b":"BE Semiconductor Industries (BESI)","party_b_id":"CMP-000043","date":null,"value_disclosed":null,"technology":"Kinex integrated hybrid bonding","status":"ACTIVE","confidence":"LOW","source_ids":["SRC-000046","SRC-000051"],"claim_type":"Reported event"},{"id":"DEAL-000005","legacy_id":"PA005","event_type":"Strategic investment","party_a":"NAURA Technology Group","party_a_id":"CMP-000101","party_b":"Kingsemi","party_b_id":"CMP-000106","date":"2026","value_disclosed":"RMB 1.69B for 9.5% (target 17.9% and control)","technology":"Coating / bonding","status":"ANNOUNCED","confidence":"MEDIUM","source_ids":["SRC-000126","SRC-000127"],"claim_type":"Reported event"},{"id":"DEAL-000006","legacy_id":"PA006","event_type":"Acquisition","party_a":"Teradyne","party_a_id":"CMP-000009","party_b":"Quantifi Photonics (NZ)","party_b_id":null,"date":"2025","value_disclosed":"USD 127.2M","technology":"Photonic IC test","status":"COMPLETED (per 10-K summary)","confidence":"MEDIUM","source_ids":["SRC-000128","SRC-000129"],"claim_type":"Reported event"},{"id":"DEAL-000007","legacy_id":"PA007","event_type":"Acquisition","party_a":"Teradyne","party_a_id":"CMP-000009","party_b":"Infineon AET unit","party_b_id":null,"date":"2025","value_disclosed":"EUR 17.6M","technology":"Automated test (power)","status":"COMPLETED (per 10-K summary)","confidence":"MEDIUM","source_ids":["SRC-000129","SRC-000010"],"claim_type":"Reported event"},{"id":"DEAL-000008","legacy_id":"PA008","event_type":"Joint venture","party_a":"Teradyne","party_a_id":"CMP-000009","party_b":"N/A (partner not captured)","party_b_id":null,"date":"2025","value_disclosed":"USD 157M for 75%","technology":null,"status":"DISCLOSED (Tier 3)","confidence":"LOW","source_ids":["SRC-000129"],"claim_type":"Reported event"},{"id":"DEAL-000009","legacy_id":"PA009","event_type":"Acquisition (product lines)","party_a":"Onto Innovation","party_a_id":"CMP-000016","party_b":"Semilab","party_b_id":"CMP-000019","date":"2025","value_disclosed":"USD 432.31M + 641,771 shares","technology":"Metrology","status":"COMPLETED","confidence":"LOW","source_ids":["SRC-000130","SRC-000131"],"claim_type":"Reported event"},{"id":"DEAL-000010","legacy_id":"PA010","event_type":"Acquisition","party_a":"Nova Ltd.","party_a_id":"CMP-000017","party_b":"Sentronics Metrology","party_b_id":null,"date":null,"value_disclosed":"~USD 60M cash","technology":"Wafer metrology","status":"COMPLETED","confidence":"HIGH","source_ids":["SRC-000132"],"claim_type":"Reported event"},{"id":"DEAL-000011","legacy_id":"PA011","event_type":"Acquisition (asset deal)","party_a":"3D-Micromac","party_a_id":"CMP-000141","party_b":"Jenoptik (TLS-Dicing)","party_b_id":null,"date":"2014-01-01","value_disclosed":null,"technology":"Thermal laser separation dicing: expertise, patents, results","status":"COMPLETED","confidence":"LOW","source_ids":["SRC-000072"],"claim_type":"Reported event"},{"id":"DEAL-000012","legacy_id":"PA012","event_type":"Licensing / alliance","party_a":"Hamamatsu Photonics","party_a_id":"CMP-000011","party_b":"DISCO Corporation","party_b_id":"CMP-000010","date":"N/A (review dated 2016-06-10)","value_disclosed":null,"technology":"Stealth Dicing (SD) technology","status":"ACTIVE","confidence":"HIGH","source_ids":["SRC-000053"],"claim_type":"Reported event"},{"id":"DEAL-000013","legacy_id":"PA013","event_type":"Technology licensing (Build-License-Transfer)","party_a":"PSMC","party_a_id":null,"party_b":"Tata Electronics","party_b_id":"FAB-000019","date":null,"value_disclosed":null,"technology":"Foundry process technology 28/40/55/90/110 nm","status":"ACTIVE","confidence":"HIGH","source_ids":["SRC-000023","SRC-000026"],"claim_type":"Reported event"},{"id":"DEAL-000014","legacy_id":"PA014","event_type":"Strategic partnership (MoU)","party_a":"ASML Holding","party_a_id":"CMP-000001","party_b":"Tata Electronics","party_b_id":"FAB-000019","date":"2026-05","value_disclosed":null,"technology":"Lithography deployment & support","status":"SIGNED","confidence":"HIGH","source_ids":["SRC-000024","SRC-000023"],"claim_type":"Reported event"},{"id":"DEAL-000015","legacy_id":"PA015","event_type":"Strategic partnership (MoU)","party_a":"Tokyo Electron (TEL)","party_a_id":"CMP-000004","party_b":"Tata Electronics","party_b_id":"FAB-000019","date":"2024-09-10","value_disclosed":null,"technology":"Equipment & infrastructure for Dholera fab and Jagiroad OSAT","status":"SIGNED","confidence":"HIGH","source_ids":["SRC-000025","SRC-000023"],"claim_type":"Reported event"},{"id":"DEAL-000016","legacy_id":"PA016","event_type":"Joint venture (50:50)","party_a":"ASM Technologies","party_a_id":"CMP-000192","party_b":"Hind High Vacuum (HHV)","party_b_id":"CMP-000193","date":"2022-02-01","value_disclosed":null,"technology":"Design-led engineering & manufacturing of tools, sub-systems, components","status":"FORMED","confidence":"MEDIUM","source_ids":["SRC-000037"],"claim_type":"Reported event"},{"id":"DEAL-000017","legacy_id":"PA017","event_type":"Partnership (PACE programme)","party_a":"Onto Innovation","party_a_id":"CMP-000016","party_b":"LPKF Laser & Electronics","party_b_id":"CMP-000143","date":"2024","value_disclosed":null,"technology":"Glass substrate process (Firefly at Vitrion)","status":"ACTIVE","confidence":"MEDIUM","source_ids":["SRC-000081"],"claim_type":"Reported event"},{"id":"DEAL-000018","legacy_id":"PA018","event_type":"Partner network","party_a":"LPKF Laser & Electronics","party_a_id":"CMP-000143","party_b":"Glass substrate supply-chain partners","party_b_id":null,"date":"2024-09-04","value_disclosed":null,"technology":"Glass substrate supply chain","status":"INITIATED","confidence":"MEDIUM","source_ids":["SRC-000085"],"claim_type":"Reported event"},{"id":"DEAL-000019","legacy_id":"PA019","event_type":"Manufacturing investment (India)","party_a":"Lam Research","party_a_id":"CMP-000003","party_b":"India","party_b_id":null,"date":"2026-09-16","value_disclosed":"INR 10,000 crore","technology":"First silicon component manufacturing facility in India","status":"ANNOUNCED","confidence":"MEDIUM","source_ids":["SRC-000032","SRC-000033"],"claim_type":"Reported event"},{"id":"DEAL-000020","legacy_id":"PA020","event_type":"Investment (India)","party_a":"Applied Materials","party_a_id":"CMP-000002","party_b":"India","party_b_id":null,"date":"2026-09-17","value_disclosed":"USD 5B (no year breakdown)","technology":"R&D, research park, supply chain","status":"ANNOUNCED","confidence":"MEDIUM","source_ids":["SRC-000035","SRC-000036"],"claim_type":"Reported event"},{"id":"DEAL-000021","legacy_id":"PA021","event_type":"R&D facility (India)","party_a":"KLA Corporation","party_a_id":"CMP-000005","party_b":"India (Chennai)","party_b_id":null,"date":"2026-01","value_disclosed":"Rs 300 crore / USD 33M","technology":"R&D and innovation hub","status":"OPENED","confidence":"HIGH","source_ids":["SRC-000202","SRC-000203","SRC-000204"],"claim_type":"Reported event"},{"id":"DEAL-000022","legacy_id":"PA022","event_type":"Group company","party_a":"Hamamatsu Photonics","party_a_id":"CMP-000011","party_b":"NKT Photonics","party_b_id":"CMP-000178","date":null,"value_disclosed":null,"technology":"Fiber/ultrafast lasers","status":"IN GROUP","confidence":"HIGH","source_ids":["SRC-000166"],"claim_type":"Reported event"},{"id":"DEAL-000023","legacy_id":"PA023","event_type":"Spin-off","party_a":"SMEE (Shanghai Micro Electronics Equipment)","party_a_id":"CMP-000107","party_b":"AMIES","party_b_id":"CMP-000108","date":null,"value_disclosed":null,"technology":"Lithography","status":"COMPLETED","confidence":"LOW","source_ids":["SRC-000183"],"claim_type":"Reported event"},{"id":"DEAL-000024","legacy_id":"PA024","event_type":"Consolidation","party_a":"Aishengna","party_a_id":"CMP-000111","party_b":"Chinese lithography assets","party_b_id":null,"date":"2026","value_disclosed":null,"technology":"Lithography","status":"REPORTED","confidence":"LOW","source_ids":["SRC-000187"],"claim_type":"Reported event"},{"id":"DEAL-000025","legacy_id":"PA025","event_type":"Acquisition (claim)","party_a":"Hwatsing Technology","party_a_id":"CMP-000105","party_b":"Xinyu Semiconductor","party_b_id":null,"date":null,"value_disclosed":null,"technology":null,"status":"UNVERIFIED","confidence":"UNVERIFIED","source_ids":["SRC-000017"],"claim_type":"Unverified report"},{"id":"DEAL-000026","legacy_id":"PA026","event_type":"Takeover interest (rumour)","party_a":"Lam Research","party_a_id":"CMP-000003","party_b":"BE Semiconductor Industries (BESI)","party_b_id":"CMP-000043","date":null,"value_disclosed":null,"technology":"Hybrid bonding","status":"UNVERIFIED","confidence":"UNVERIFIED","source_ids":["SRC-000051"],"claim_type":"Unverified report"},{"id":"DEAL-000027","legacy_id":"PA027","event_type":"Acquisition","party_a":"Veeco Instruments","party_a_id":"CMP-000014","party_b":"Epiluvac","party_b_id":null,"date":"2023-02","value_disclosed":null,"technology":"SiC epitaxy","status":"UNVERIFIED (Tier 4 only)","confidence":"UNVERIFIED","source_ids":["SRC-000123"],"claim_type":"Unverified report"},{"id":"DEAL-000028","legacy_id":"PA028","event_type":"MoU","party_a":"Tata Electronics","party_a_id":"FAB-000019","party_b":"Nexperia","party_b_id":"FAB-000028","date":"2026-09","value_disclosed":null,"technology":"Fab + ATMP cooperation","status":"SIGNED","confidence":"LOW","source_ids":["SRC-000209"],"claim_type":"Reported event"},{"id":"DEAL-000029","legacy_id":"PA029","event_type":"MoU","party_a":"Tata Electronics","party_a_id":"FAB-000019","party_b":"Fujifilm","party_b_id":null,"date":"2026-09","value_disclosed":"INR 800 crore (materials plant, Dholera)","technology":"Semiconductor materials","status":"SIGNED","confidence":"LOW","source_ids":["SRC-000209"],"claim_type":"Reported event"},{"id":"DEAL-000030","legacy_id":"PA030","event_type":"MoU","party_a":"Tata Electronics","party_a_id":"FAB-000019","party_b":"Enomoto","party_b_id":null,"date":"2026-09","value_disclosed":null,"technology":"Packaging materials (Jagiroad)","status":"SIGNED","confidence":"LOW","source_ids":["SRC-000209"],"claim_type":"Reported event"},{"id":"DEAL-000031","legacy_id":"PA031","event_type":"MoU","party_a":"Tata Electronics","party_a_id":"FAB-000019","party_b":"JSR","party_b_id":null,"date":"2026-09","value_disclosed":null,"technology":"Photoresists","status":"SIGNED","confidence":"LOW","source_ids":["SRC-000210"],"claim_type":"Reported event"},{"id":"DEAL-000032","legacy_id":"PA032","event_type":"Technology partnership","party_a":"CDIL (Continental Device India)","party_a_id":"OSAT-000029","party_b":"Shinjin","party_b_id":null,"date":"2026-09-17","value_disclosed":null,"technology":"TO-247 power discrete package","status":"SIGNED","confidence":"LOW","source_ids":["SRC-000210"],"claim_type":"Reported event"},{"id":"DEAL-000033","legacy_id":"PA033","event_type":"MoU (training)","party_a":"ASMPT","party_a_id":"CMP-000044","party_b":"Kaynes Semicon","party_b_id":"OSAT-000021","date":"2024-12-12","value_disclosed":null,"technology":"Semiconductor training, workforce development (with Perceptives Solutions)","status":"SIGNED","confidence":"HIGH","source_ids":["SRC-000201"],"claim_type":"Reported event"},{"id":"DEAL-000034","legacy_id":"PA034","event_type":"Exclusive distribution","party_a":"Hirata Corporation","party_a_id":"CMP-000062","party_b":"ATS India","party_b_id":"CMP-000198","date":"2026-09-16","value_disclosed":null,"technology":"Wafer-handling robots, EFEMs, PLP load ports","status":"SIGNED","confidence":"LOW","source_ids":["SRC-000214"],"claim_type":"Reported event"},{"id":"DEAL-000035","legacy_id":"PA035","event_type":"Funding (seed)","party_a":"Raana Semiconductors","party_a_id":"CMP-000184","party_b":"Equirus Innovatex; Artha; IvyCap; PointOne; CIIE; Garimella Laxminarayana","party_b_id":null,"date":"2026-01-20","value_disclosed":"USD 3M","technology":"CZ crystal growth equipment","status":"CLOSED","confidence":"LOW","source_ids":["SRC-000211"],"claim_type":"Reported event"},{"id":"DEAL-000036","legacy_id":"PA036","event_type":"Exclusivity ended","party_a":"Protec","party_a_id":"CMP-000057","party_b":"Previous exclusive customer","party_b_id":null,"date":"2023-05","value_disclosed":null,"technology":"Laser-assisted bonding","status":"ENDED","confidence":"LOW","source_ids":["SRC-000228"],"claim_type":"Reported event"},{"id":"DEAL-000037","legacy_id":"PA037","event_type":"Funding (Series D)","party_a":"Nearfield Instruments","party_a_id":"CMP-000180","party_b":"Fidelity; Temasek; QIA; Walden Catalyst","party_b_id":null,"date":null,"value_disclosed":"Up to USD 380M; post-money USD 1.6B","technology":"AFM metrology","status":"REPORTED (Tier 3)","confidence":"LOW","source_ids":["SRC-000167"],"claim_type":"Reported event"},{"id":"DEAL-000038","legacy_id":"PA038","event_type":"Funding","party_a":"Substrate","party_a_id":"CMP-000181","party_b":"Founders Fund; General Catalyst; Allen & Co.; Long Journey; Valor; In-Q-Tel","party_b_id":null,"date":null,"value_disclosed":"USD 100M at USD 1B valuation","technology":"Lithography","status":"CLOSED","confidence":"LOW","source_ids":["SRC-000169"],"claim_type":"Reported event"},{"id":"DEAL-000039","legacy_id":"PA039","event_type":"Funding + government LOI","party_a":"xLight","party_a_id":"CMP-000182","party_b":"Playground Global (lead); US CHIPS","party_b_id":null,"date":null,"value_disclosed":"USD 40M VC; USD 150M CHIPS LOI (equity); USD 350M round in talks","technology":"FEL EUV source","status":"LOI / TALKS","confidence":"MEDIUM","source_ids":["SRC-000171","SRC-000172"],"claim_type":"Reported event"},{"id":"DEAL-000040","legacy_id":"PA040","event_type":"Funding","party_a":"Invisix","party_a_id":"CMP-000183","party_b":"N/A","party_b_id":null,"date":null,"value_disclosed":"EUR 20M","technology":null,"status":"REPORTED","confidence":"LOW","source_ids":["SRC-000172"],"claim_type":"Reported event"},{"id":"DEAL-000041","legacy_id":"PA041","event_type":"Distribution","party_a":"Sumitomo Heavy Industries (Mechatronics)","party_a_id":"CMP-000174","party_b":"TRUMPF","party_b_id":"CMP-000147","date":null,"value_disclosed":null,"technology":"TRUMPF TruFiber / TruPulse nano lasers","status":"ACTIVE","confidence":"HIGH","source_ids":["SRC-000223"],"claim_type":"Reported event"},{"id":"DEAL-000042","legacy_id":"PA042","event_type":"Distribution","party_a":"Sumitomo Heavy Industries (Mechatronics)","party_a_id":"CMP-000174","party_b":"IPG Photonics","party_b_id":"CMP-000146","date":null,"value_disclosed":null,"technology":"IPG fiber lasers","status":"ACTIVE","confidence":"HIGH","source_ids":["SRC-000223"],"claim_type":"Reported event"},{"id":"DEAL-000043","legacy_id":"PA043","event_type":"Group rename","party_a":"Pfeiffer Vacuum+Fab Solutions","party_a_id":"CMP-000169","party_b":"Busch Group","party_b_id":null,"date":"2024-10","value_disclosed":null,"technology":"Vacuum","status":"COMPLETED","confidence":"HIGH","source_ids":["SRC-000288","SRC-000289"],"claim_type":"Reported event"},{"id":"DEAL-000044","legacy_id":"PA044","event_type":"Distribution (India)","party_a":"Murata Machinery (Muratec)","party_a_id":"CMP-000066","party_b":"Murata Machinery India Pvt Ltd","party_b_id":null,"date":null,"value_disclosed":null,"technology":"OHT AMHS","status":"LISTED (Tier 3)","confidence":"LOW","source_ids":["SRC-000301"],"claim_type":"Reported event"}],"relationships":[{"id":"REL-000001","type":"manufactures","from":"CMP-000010","to":"MDL-000001","basis":"source","source_ids":["SRC-000054","SRC-000053"],"confidence":"HIGH"},{"id":"REL-000002","type":"part_of","from":"MDL-000001","to":"PRD-000001","basis":"derived"},{"id":"REL-000003","type":"classified_as","from":"MDL-000001","to":"EQP-C01.03","basis":"source","source_ids":["SRC-000054","SRC-000053"]},{"id":"REL-000004","type":"used_in","from":"MDL-000001","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000005","type":"uses_technology","from":"MDL-000001","to":"TEC-060","basis":"source","source_ids":["SRC-000054","SRC-000053"],"via":"source-stated laser type"},{"id":"REL-000006","type":"uses_technology","from":"MDL-000001","to":"TEC-061","basis":"source","source_ids":["SRC-000054","SRC-000053"],"via":"source-stated laser type"},{"id":"REL-000007","type":"uses_technology","from":"MDL-000001","to":"TEC-075","basis":"source","source_ids":["SRC-000054","SRC-000053"],"via":"source-stated laser type"},{"id":"REL-000008","type":"supports_application","from":"MDL-000001","to":"APP-005","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000054","SRC-000053"]},{"id":"REL-000009","type":"supports_application","from":"MDL-000001","to":"APP-014","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000054","SRC-000053"]},{"id":"REL-000010","type":"supports_application","from":"MDL-000001","to":"APP-016","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000054","SRC-000053"]},{"id":"REL-000011","type":"manufactures","from":"CMP-000010","to":"MDL-000002","basis":"source","source_ids":["SRC-000054"],"confidence":"HIGH"},{"id":"REL-000012","type":"part_of","from":"MDL-000002","to":"PRD-000001","basis":"derived"},{"id":"REL-000013","type":"classified_as","from":"MDL-000002","to":"EQP-C01.03","basis":"source","source_ids":["SRC-000054"]},{"id":"REL-000014","type":"used_in","from":"MDL-000002","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000015","type":"uses_technology","from":"MDL-000002","to":"TEC-060","basis":"source","source_ids":["SRC-000054"],"via":"source-stated laser type"},{"id":"REL-000016","type":"uses_technology","from":"MDL-000002","to":"TEC-061","basis":"source","source_ids":["SRC-000054"],"via":"source-stated laser type"},{"id":"REL-000017","type":"uses_technology","from":"MDL-000002","to":"TEC-075","basis":"source","source_ids":["SRC-000054"],"via":"source-stated laser type"},{"id":"REL-000018","type":"manufactures","from":"CMP-000010","to":"MDL-000003","basis":"source","source_ids":["SRC-000220"],"confidence":"LOW"},{"id":"REL-000019","type":"part_of","from":"MDL-000003","to":"PRD-000002","basis":"derived"},{"id":"REL-000020","type":"classified_as","from":"MDL-000003","to":"EQP-F01","basis":"source","source_ids":["SRC-000220"]},{"id":"REL-000021","type":"used_in","from":"MDL-000003","to":"PRS-003","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000022","type":"uses_technology","from":"MDL-000003","to":"TEC-065","basis":"source","source_ids":["SRC-000220"],"via":"source-stated laser type"},{"id":"REL-000023","type":"uses_technology","from":"MDL-000003","to":"TEC-072","basis":"source","source_ids":["SRC-000220"],"via":"source-stated laser type"},{"id":"REL-000024","type":"supports_material","from":"MDL-000003","to":"MAT-003","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000220"]},{"id":"REL-000025","type":"supports_application","from":"MDL-000003","to":"APP-010","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000220"]},{"id":"REL-000026","type":"supports_application","from":"MDL-000003","to":"APP-011","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000220"]},{"id":"REL-000027","type":"manufactures","from":"CMP-000010","to":"MDL-000004","basis":"source","source_ids":["SRC-000221","SRC-000222"],"confidence":"MEDIUM"},{"id":"REL-000028","type":"part_of","from":"MDL-000004","to":"PRD-000003","basis":"derived"},{"id":"REL-000029","type":"classified_as","from":"MDL-000004","to":"EQP-F01","basis":"source","source_ids":["SRC-000221","SRC-000222"]},{"id":"REL-000030","type":"used_in","from":"MDL-000004","to":"PRS-003","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000031","type":"uses_technology","from":"MDL-000004","to":"TEC-065","basis":"source","source_ids":["SRC-000221","SRC-000222"],"via":"source-stated laser type"},{"id":"REL-000032","type":"uses_technology","from":"MDL-000004","to":"TEC-072","basis":"source","source_ids":["SRC-000221","SRC-000222"],"via":"source-stated laser type"},{"id":"REL-000033","type":"supports_material","from":"MDL-000004","to":"MAT-003","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000221","SRC-000222"]},{"id":"REL-000034","type":"supports_material","from":"MDL-000004","to":"MAT-004","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000221","SRC-000222"]},{"id":"REL-000035","type":"supports_application","from":"MDL-000004","to":"APP-010","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000221","SRC-000222"]},{"id":"REL-000036","type":"supports_application","from":"MDL-000004","to":"APP-011","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000221","SRC-000222"]},{"id":"REL-000037","type":"supports_application","from":"MDL-000004","to":"APP-012","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000221","SRC-000222"]},{"id":"REL-000038","type":"manufactures","from":"CMP-000011","to":"MDL-000005","basis":"source","source_ids":["SRC-000054","SRC-000055","SRC-000056","SRC-000053","SRC-000102"],"confidence":"HIGH"},{"id":"REL-000039","type":"part_of","from":"MDL-000005","to":"PRD-000004","basis":"derived"},{"id":"REL-000040","type":"classified_as","from":"MDL-000005","to":"CMPN-000010","basis":"source","source_ids":["SRC-000054","SRC-000055","SRC-000056","SRC-000053","SRC-000102"]},{"id":"REL-000041","type":"uses_technology","from":"MDL-000005","to":"TEC-061","basis":"source","source_ids":["SRC-000054","SRC-000055","SRC-000056","SRC-000053","SRC-000102"],"via":"source-stated laser type"},{"id":"REL-000042","type":"uses_technology","from":"MDL-000005","to":"TEC-075","basis":"source","source_ids":["SRC-000054","SRC-000055","SRC-000056","SRC-000053","SRC-000102"],"via":"source-stated laser type"},{"id":"REL-000043","type":"manufactures","from":"CMP-000012","to":"MDL-000006","basis":"source","source_ids":["SRC-000097","SRC-000101"],"confidence":"HIGH"},{"id":"REL-000044","type":"part_of","from":"MDL-000006","to":"PRD-000005","basis":"derived"},{"id":"REL-000045","type":"classified_as","from":"MDL-000006","to":"EQP-C01.03","basis":"source","source_ids":["SRC-000097","SRC-000101"]},{"id":"REL-000046","type":"used_in","from":"MDL-000006","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000047","type":"uses_technology","from":"MDL-000006","to":"TEC-060","basis":"source","source_ids":["SRC-000097","SRC-000101"],"via":"source-stated laser type"},{"id":"REL-000048","type":"uses_technology","from":"MDL-000006","to":"TEC-061","basis":"source","source_ids":["SRC-000097","SRC-000101"],"via":"source-stated laser type"},{"id":"REL-000049","type":"uses_technology","from":"MDL-000006","to":"TEC-075","basis":"source","source_ids":["SRC-000097","SRC-000101"],"via":"source-stated laser type"},{"id":"REL-000050","type":"manufactures","from":"CMP-000012","to":"MDL-000007","basis":"source","source_ids":["SRC-000098"],"confidence":"HIGH"},{"id":"REL-000051","type":"part_of","from":"MDL-000007","to":"PRD-000005","basis":"derived"},{"id":"REL-000052","type":"classified_as","from":"MDL-000007","to":"EQP-C01.03","basis":"source","source_ids":["SRC-000098"]},{"id":"REL-000053","type":"used_in","from":"MDL-000007","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000054","type":"uses_technology","from":"MDL-000007","to":"TEC-060","basis":"source","source_ids":["SRC-000098"],"via":"source-stated laser type"},{"id":"REL-000055","type":"uses_technology","from":"MDL-000007","to":"TEC-061","basis":"source","source_ids":["SRC-000098"],"via":"source-stated laser type"},{"id":"REL-000056","type":"uses_technology","from":"MDL-000007","to":"TEC-075","basis":"source","source_ids":["SRC-000098"],"via":"source-stated laser type"},{"id":"REL-000057","type":"manufactures","from":"CMP-000012","to":"MDL-000008","basis":"source","source_ids":["SRC-000099"],"confidence":"HIGH"},{"id":"REL-000058","type":"part_of","from":"MDL-000008","to":"PRD-000006","basis":"derived"},{"id":"REL-000059","type":"classified_as","from":"MDL-000008","to":"EQP-C01.02","basis":"source","source_ids":["SRC-000099"]},{"id":"REL-000060","type":"used_in","from":"MDL-000008","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000061","type":"uses_technology","from":"MDL-000008","to":"TEC-060","basis":"source","source_ids":["SRC-000099"],"via":"source-stated laser type"},{"id":"REL-000062","type":"uses_technology","from":"MDL-000008","to":"TEC-062","basis":"source","source_ids":["SRC-000099"],"via":"source-stated laser type"},{"id":"REL-000063","type":"uses_technology","from":"MDL-000008","to":"TEC-064","basis":"source","source_ids":["SRC-000099"],"via":"source-stated laser type"},{"id":"REL-000064","type":"uses_technology","from":"MDL-000008","to":"TEC-073","basis":"source","source_ids":["SRC-000099"],"via":"source-stated laser type"},{"id":"REL-000065","type":"uses_technology","from":"MDL-000008","to":"TEC-081","basis":"source","source_ids":["SRC-000099"],"via":"source-stated laser type"},{"id":"REL-000066","type":"manufactures","from":"CMP-000012","to":"MDL-000009","basis":"source","source_ids":["SRC-000100"],"confidence":"HIGH"},{"id":"REL-000067","type":"part_of","from":"MDL-000009","to":"PRD-000007","basis":"derived"},{"id":"REL-000068","type":"classified_as","from":"MDL-000009","to":"EQP-C01.03","basis":"source","source_ids":["SRC-000100"]},{"id":"REL-000069","type":"used_in","from":"MDL-000009","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000070","type":"uses_technology","from":"MDL-000009","to":"TEC-060","basis":"source","source_ids":["SRC-000100"],"via":"source-stated laser type"},{"id":"REL-000071","type":"uses_technology","from":"MDL-000009","to":"TEC-061","basis":"source","source_ids":["SRC-000100"],"via":"source-stated laser type"},{"id":"REL-000072","type":"manufactures","from":"CMP-000012","to":"MDL-000010","basis":"source","source_ids":["SRC-000102"],"confidence":"LOW"},{"id":"REL-000073","type":"part_of","from":"MDL-000010","to":"PRD-000008","basis":"derived"},{"id":"REL-000074","type":"classified_as","from":"MDL-000010","to":"EQP-C01.03","basis":"source","source_ids":["SRC-000102"]},{"id":"REL-000075","type":"used_in","from":"MDL-000010","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000076","type":"uses_technology","from":"MDL-000010","to":"TEC-060","basis":"source","source_ids":["SRC-000102"],"via":"source-stated laser type"},{"id":"REL-000077","type":"uses_technology","from":"MDL-000010","to":"TEC-061","basis":"source","source_ids":["SRC-000102"],"via":"source-stated laser type"},{"id":"REL-000078","type":"manufactures","from":"CMP-000012","to":"MDL-000011","basis":"source","source_ids":["SRC-000103"],"confidence":"LOW"},{"id":"REL-000079","type":"part_of","from":"MDL-000011","to":"PRD-000009","basis":"derived"},{"id":"REL-000080","type":"classified_as","from":"MDL-000011","to":"EQP-C01.03","basis":"source","source_ids":["SRC-000103"]},{"id":"REL-000081","type":"used_in","from":"MDL-000011","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000082","type":"uses_technology","from":"MDL-000011","to":"TEC-060","basis":"source","source_ids":["SRC-000103"],"via":"source-stated laser type"},{"id":"REL-000083","type":"uses_technology","from":"MDL-000011","to":"TEC-061","basis":"derived","via":"equipment category"},{"id":"REL-000084","type":"manufactures","from":"CMP-000012","to":"MDL-000012","basis":"source","source_ids":["SRC-000105"],"confidence":"HIGH"},{"id":"REL-000085","type":"part_of","from":"MDL-000012","to":"PRD-000010","basis":"derived"},{"id":"REL-000086","type":"classified_as","from":"MDL-000012","to":"EQP-C01.01","basis":"source","source_ids":["SRC-000105"]},{"id":"REL-000087","type":"used_in","from":"MDL-000012","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000088","type":"uses_technology","from":"MDL-000012","to":"TEC-037","basis":"derived","via":"equipment category"},{"id":"REL-000089","type":"manufactures","from":"CMP-000012","to":"MDL-000013","basis":"source","source_ids":["SRC-000106"],"confidence":"HIGH"},{"id":"REL-000090","type":"part_of","from":"MDL-000013","to":"PRD-000011","basis":"derived"},{"id":"REL-000091","type":"classified_as","from":"MDL-000013","to":"EQP-C01.01","basis":"source","source_ids":["SRC-000106"]},{"id":"REL-000092","type":"used_in","from":"MDL-000013","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000093","type":"uses_technology","from":"MDL-000013","to":"TEC-037","basis":"derived","via":"equipment category"},{"id":"REL-000094","type":"manufactures","from":"CMP-000012","to":"MDL-000014","basis":"source","source_ids":["SRC-000104"],"confidence":"HIGH"},{"id":"REL-000095","type":"part_of","from":"MDL-000014","to":"PRD-000012","basis":"derived"},{"id":"REL-000096","type":"classified_as","from":"MDL-000014","to":"EQP-C01.01","basis":"source","source_ids":["SRC-000104"]},{"id":"REL-000097","type":"used_in","from":"MDL-000014","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000098","type":"uses_technology","from":"MDL-000014","to":"TEC-037","basis":"derived","via":"equipment category"},{"id":"REL-000099","type":"manufactures","from":"CMP-000045","to":"MDL-000015","basis":"source","source_ids":["SRC-000059","SRC-000063","SRC-000057"],"confidence":"HIGH"},{"id":"REL-000100","type":"part_of","from":"MDL-000015","to":"PRD-000013","basis":"derived"},{"id":"REL-000101","type":"classified_as","from":"MDL-000015","to":"EQP-C01.02","basis":"source","source_ids":["SRC-000059","SRC-000063","SRC-000057"]},{"id":"REL-000102","type":"used_in","from":"MDL-000015","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000103","type":"uses_technology","from":"MDL-000015","to":"TEC-064","basis":"source","source_ids":["SRC-000059","SRC-000063","SRC-000057"],"via":"source-stated laser type"},{"id":"REL-000104","type":"uses_technology","from":"MDL-000015","to":"TEC-073","basis":"source","source_ids":["SRC-000059","SRC-000063","SRC-000057"],"via":"source-stated laser type"},{"id":"REL-000105","type":"uses_technology","from":"MDL-000015","to":"TEC-076","basis":"source","source_ids":["SRC-000059","SRC-000063","SRC-000057"],"via":"source-stated laser type"},{"id":"REL-000106","type":"uses_technology","from":"MDL-000015","to":"TEC-077","basis":"source","source_ids":["SRC-000059","SRC-000063","SRC-000057"],"via":"source-stated laser type"},{"id":"REL-000107","type":"uses_technology","from":"MDL-000015","to":"TEC-060","basis":"derived","via":"equipment category"},{"id":"REL-000108","type":"manufactures","from":"CMP-000045","to":"MDL-000016","basis":"source","source_ids":["SRC-000059","SRC-000062","SRC-000057"],"confidence":"HIGH"},{"id":"REL-000109","type":"part_of","from":"MDL-000016","to":"PRD-000013","basis":"derived"},{"id":"REL-000110","type":"classified_as","from":"MDL-000016","to":"EQP-C01.02","basis":"source","source_ids":["SRC-000059","SRC-000062","SRC-000057"]},{"id":"REL-000111","type":"used_in","from":"MDL-000016","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000112","type":"uses_technology","from":"MDL-000016","to":"TEC-064","basis":"source","source_ids":["SRC-000059","SRC-000062","SRC-000057"],"via":"source-stated laser type"},{"id":"REL-000113","type":"uses_technology","from":"MDL-000016","to":"TEC-073","basis":"source","source_ids":["SRC-000059","SRC-000062","SRC-000057"],"via":"source-stated laser type"},{"id":"REL-000114","type":"uses_technology","from":"MDL-000016","to":"TEC-060","basis":"derived","via":"equipment category"},{"id":"REL-000115","type":"manufactures","from":"CMP-000045","to":"MDL-000017","basis":"source","source_ids":["SRC-000059","SRC-000060","SRC-000064"],"confidence":"HIGH"},{"id":"REL-000116","type":"part_of","from":"MDL-000017","to":"PRD-000014","basis":"derived"},{"id":"REL-000117","type":"classified_as","from":"MDL-000017","to":"EQP-C01.02","basis":"source","source_ids":["SRC-000059","SRC-000060","SRC-000064"]},{"id":"REL-000118","type":"used_in","from":"MDL-000017","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000119","type":"uses_technology","from":"MDL-000017","to":"TEC-060","basis":"source","source_ids":["SRC-000059","SRC-000060","SRC-000064"],"via":"source-stated laser type"},{"id":"REL-000120","type":"uses_technology","from":"MDL-000017","to":"TEC-073","basis":"source","source_ids":["SRC-000059","SRC-000060","SRC-000064"],"via":"source-stated laser type"},{"id":"REL-000121","type":"supports_application","from":"MDL-000017","to":"APP-010","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000059","SRC-000060","SRC-000064"]},{"id":"REL-000122","type":"manufactures","from":"CMP-000045","to":"MDL-000018","basis":"source","source_ids":["SRC-000059"],"confidence":"HIGH"},{"id":"REL-000123","type":"part_of","from":"MDL-000018","to":"PRD-000014","basis":"derived"},{"id":"REL-000124","type":"classified_as","from":"MDL-000018","to":"EQP-C01.02","basis":"source","source_ids":["SRC-000059"]},{"id":"REL-000125","type":"used_in","from":"MDL-000018","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000126","type":"uses_technology","from":"MDL-000018","to":"TEC-060","basis":"source","source_ids":["SRC-000059"],"via":"source-stated laser type"},{"id":"REL-000127","type":"uses_technology","from":"MDL-000018","to":"TEC-075","basis":"source","source_ids":["SRC-000059"],"via":"source-stated laser type"},{"id":"REL-000128","type":"manufactures","from":"CMP-000045","to":"MDL-000019","basis":"source","source_ids":["SRC-000061"],"confidence":"HIGH"},{"id":"REL-000129","type":"part_of","from":"MDL-000019","to":"PRD-000015","basis":"derived"},{"id":"REL-000130","type":"classified_as","from":"MDL-000019","to":"EQP-C01.02","basis":"source","source_ids":["SRC-000061"]},{"id":"REL-000131","type":"used_in","from":"MDL-000019","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000132","type":"uses_technology","from":"MDL-000019","to":"TEC-060","basis":"source","source_ids":["SRC-000061"],"via":"source-stated laser type"},{"id":"REL-000133","type":"uses_technology","from":"MDL-000019","to":"TEC-064","basis":"source","source_ids":["SRC-000061"],"via":"source-stated laser type"},{"id":"REL-000134","type":"manufactures","from":"CMP-000077","to":"MDL-000020","basis":"source","source_ids":["SRC-000065"],"confidence":"HIGH"},{"id":"REL-000135","type":"part_of","from":"MDL-000020","to":"PRD-000016","basis":"derived"},{"id":"REL-000136","type":"classified_as","from":"MDL-000020","to":"EQP-C01.02","basis":"source","source_ids":["SRC-000065"]},{"id":"REL-000137","type":"used_in","from":"MDL-000020","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000138","type":"uses_technology","from":"MDL-000020","to":"TEC-064","basis":"source","source_ids":["SRC-000065"],"via":"source-stated laser type"},{"id":"REL-000139","type":"uses_technology","from":"MDL-000020","to":"TEC-062","basis":"source","source_ids":["SRC-000065"],"via":"source-stated laser type"},{"id":"REL-000140","type":"uses_technology","from":"MDL-000020","to":"TEC-060","basis":"derived","via":"equipment category"},{"id":"REL-000141","type":"manufactures","from":"CMP-000077","to":"MDL-000021","basis":"source","source_ids":["SRC-000065"],"confidence":"HIGH"},{"id":"REL-000142","type":"part_of","from":"MDL-000021","to":"PRD-000017","basis":"derived"},{"id":"REL-000143","type":"classified_as","from":"MDL-000021","to":"EQP-C01.02","basis":"source","source_ids":["SRC-000065"]},{"id":"REL-000144","type":"used_in","from":"MDL-000021","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000145","type":"uses_technology","from":"MDL-000021","to":"TEC-060","basis":"source","source_ids":["SRC-000065"],"via":"source-stated laser type"},{"id":"REL-000146","type":"manufactures","from":"CMP-000077","to":"MDL-000022","basis":"source","source_ids":["SRC-000065","SRC-000066"],"confidence":"HIGH"},{"id":"REL-000147","type":"part_of","from":"MDL-000022","to":"PRD-000018","basis":"derived"},{"id":"REL-000148","type":"classified_as","from":"MDL-000022","to":"EQP-C26","basis":"source","source_ids":["SRC-000065","SRC-000066"]},{"id":"REL-000149","type":"used_in","from":"MDL-000022","to":"PRS-038","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000150","type":"uses_technology","from":"MDL-000022","to":"TEC-059","basis":"source","source_ids":["SRC-000065","SRC-000066"],"via":"source-stated laser type"},{"id":"REL-000151","type":"manufactures","from":"CMP-000077","to":"MDL-000023","basis":"source","source_ids":["SRC-000066"],"confidence":"LOW"},{"id":"REL-000152","type":"part_of","from":"MDL-000023","to":"PRD-000019","basis":"derived"},{"id":"REL-000153","type":"classified_as","from":"MDL-000023","to":"EQP-C26","basis":"source","source_ids":["SRC-000066"]},{"id":"REL-000154","type":"used_in","from":"MDL-000023","to":"PRS-038","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000155","type":"uses_technology","from":"MDL-000023","to":"TEC-059","basis":"source","source_ids":["SRC-000066"],"via":"source-stated laser type"},{"id":"REL-000156","type":"manufactures","from":"CMP-000077","to":"MDL-000024","basis":"source","source_ids":["SRC-000066","SRC-000068"],"confidence":"MEDIUM"},{"id":"REL-000157","type":"part_of","from":"MDL-000024","to":"PRD-000020","basis":"derived"},{"id":"REL-000158","type":"classified_as","from":"MDL-000024","to":"EQP-A14","basis":"source","source_ids":["SRC-000066","SRC-000068"]},{"id":"REL-000159","type":"used_in","from":"MDL-000024","to":"PRS-023","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000160","type":"uses_technology","from":"MDL-000024","to":"TEC-067","basis":"source","source_ids":["SRC-000066","SRC-000068"],"via":"source-stated laser type"},{"id":"REL-000161","type":"uses_technology","from":"MDL-000024","to":"TEC-074","basis":"source","source_ids":["SRC-000066","SRC-000068"],"via":"source-stated laser type"},{"id":"REL-000162","type":"supports_application","from":"MDL-000024","to":"APP-010","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000066","SRC-000068"]},{"id":"REL-000163","type":"manufactures","from":"CMP-000077","to":"MDL-000025","basis":"source","source_ids":["SRC-000068","SRC-000065"],"confidence":"LOW"},{"id":"REL-000164","type":"part_of","from":"MDL-000025","to":"PRD-000021","basis":"derived"},{"id":"REL-000165","type":"classified_as","from":"MDL-000025","to":"EQP-C18","basis":"source","source_ids":["SRC-000068","SRC-000065"]},{"id":"REL-000166","type":"used_in","from":"MDL-000025","to":"PRS-051","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000167","type":"used_in","from":"MDL-000025","to":"PRS-052","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000168","type":"uses_technology","from":"MDL-000025","to":"TEC-069","basis":"source","source_ids":["SRC-000068","SRC-000065"],"via":"source-stated laser type"},{"id":"REL-000169","type":"uses_technology","from":"MDL-000025","to":"TEC-073","basis":"source","source_ids":["SRC-000068","SRC-000065"],"via":"source-stated laser type"},{"id":"REL-000170","type":"uses_technology","from":"MDL-000025","to":"TEC-044","basis":"derived","via":"equipment category"},{"id":"REL-000171","type":"manufactures","from":"CMP-000077","to":"MDL-000026","basis":"source","source_ids":["SRC-000069"],"confidence":"UNVERIFIED"},{"id":"REL-000172","type":"part_of","from":"MDL-000026","to":"PRD-000022","basis":"derived"},{"id":"REL-000173","type":"classified_as","from":"MDL-000026","to":"CMPN-000010","basis":"source","source_ids":["SRC-000069"]},{"id":"REL-000174","type":"uses_technology","from":"MDL-000026","to":"TEC-080","basis":"source","source_ids":["SRC-000069"],"via":"source-stated laser type"},{"id":"REL-000175","type":"manufactures","from":"CMP-000141","to":"MDL-000027","basis":"source","source_ids":["SRC-000070","SRC-000073","SRC-000074","SRC-000075","SRC-000072"],"confidence":"HIGH"},{"id":"REL-000176","type":"part_of","from":"MDL-000027","to":"PRD-000023","basis":"derived"},{"id":"REL-000177","type":"classified_as","from":"MDL-000027","to":"EQP-C01.02","basis":"source","source_ids":["SRC-000070","SRC-000073","SRC-000074","SRC-000075","SRC-000072"]},{"id":"REL-000178","type":"used_in","from":"MDL-000027","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000179","type":"uses_technology","from":"MDL-000027","to":"TEC-060","basis":"source","source_ids":["SRC-000070","SRC-000073","SRC-000074","SRC-000075","SRC-000072"],"via":"source-stated laser type"},{"id":"REL-000180","type":"uses_technology","from":"MDL-000027","to":"TEC-065","basis":"source","source_ids":["SRC-000070","SRC-000073","SRC-000074","SRC-000075","SRC-000072"],"via":"source-stated laser type"},{"id":"REL-000181","type":"supports_material","from":"MDL-000027","to":"MAT-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000070","SRC-000073","SRC-000074","SRC-000075","SRC-000072"]},{"id":"REL-000182","type":"supports_material","from":"MDL-000027","to":"MAT-003","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000070","SRC-000073","SRC-000074","SRC-000075","SRC-000072"]},{"id":"REL-000183","type":"supports_material","from":"MDL-000027","to":"MAT-005","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000070","SRC-000073","SRC-000074","SRC-000075","SRC-000072"]},{"id":"REL-000184","type":"supports_material","from":"MDL-000027","to":"MAT-008","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000070","SRC-000073","SRC-000074","SRC-000075","SRC-000072"]},{"id":"REL-000185","type":"supports_application","from":"MDL-000027","to":"APP-011","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000070","SRC-000073","SRC-000074","SRC-000075","SRC-000072"]},{"id":"REL-000186","type":"manufactures","from":"CMP-000141","to":"MDL-000028","basis":"source","source_ids":["SRC-000071"],"confidence":"HIGH"},{"id":"REL-000187","type":"part_of","from":"MDL-000028","to":"PRD-000024","basis":"derived"},{"id":"REL-000188","type":"classified_as","from":"MDL-000028","to":"EQP-A14","basis":"source","source_ids":["SRC-000071"]},{"id":"REL-000189","type":"used_in","from":"MDL-000028","to":"PRS-023","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000190","type":"uses_technology","from":"MDL-000028","to":"TEC-067","basis":"source","source_ids":["SRC-000071"],"via":"source-stated laser type"},{"id":"REL-000191","type":"uses_technology","from":"MDL-000028","to":"TEC-073","basis":"source","source_ids":["SRC-000071"],"via":"source-stated laser type"},{"id":"REL-000192","type":"uses_technology","from":"MDL-000028","to":"TEC-081","basis":"source","source_ids":["SRC-000071"],"via":"source-stated laser type"},{"id":"REL-000193","type":"manufactures","from":"CMP-000141","to":"MDL-000029","basis":"source","source_ids":["SRC-000071"],"confidence":"HIGH"},{"id":"REL-000194","type":"part_of","from":"MDL-000029","to":"PRD-000024","basis":"derived"},{"id":"REL-000195","type":"classified_as","from":"MDL-000029","to":"EQP-A14","basis":"source","source_ids":["SRC-000071"]},{"id":"REL-000196","type":"used_in","from":"MDL-000029","to":"PRS-023","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000197","type":"uses_technology","from":"MDL-000029","to":"TEC-067","basis":"source","source_ids":["SRC-000071"],"via":"source-stated laser type"},{"id":"REL-000198","type":"supports_application","from":"MDL-000029","to":"APP-015","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000071"]},{"id":"REL-000199","type":"manufactures","from":"CMP-000142","to":"MDL-000030","basis":"source","source_ids":["SRC-000076","SRC-000077"],"confidence":"HIGH"},{"id":"REL-000200","type":"part_of","from":"MDL-000030","to":"PRD-000025","basis":"derived"},{"id":"REL-000201","type":"classified_as","from":"MDL-000030","to":"EQP-C01.02","basis":"source","source_ids":["SRC-000076","SRC-000077"]},{"id":"REL-000202","type":"used_in","from":"MDL-000030","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000203","type":"uses_technology","from":"MDL-000030","to":"TEC-060","basis":"source","source_ids":["SRC-000076","SRC-000077"],"via":"source-stated laser type"},{"id":"REL-000204","type":"uses_technology","from":"MDL-000030","to":"TEC-074","basis":"source","source_ids":["SRC-000076","SRC-000077"],"via":"source-stated laser type"},{"id":"REL-000205","type":"uses_technology","from":"MDL-000030","to":"TEC-075","basis":"source","source_ids":["SRC-000076","SRC-000077"],"via":"source-stated laser type"},{"id":"REL-000206","type":"uses_technology","from":"MDL-000030","to":"TEC-081","basis":"source","source_ids":["SRC-000076","SRC-000077"],"via":"source-stated laser type"},{"id":"REL-000207","type":"manufactures","from":"CMP-000142","to":"MDL-000031","basis":"source","source_ids":["SRC-000078"],"confidence":"HIGH"},{"id":"REL-000208","type":"part_of","from":"MDL-000031","to":"PRD-000026","basis":"derived"},{"id":"REL-000209","type":"classified_as","from":"MDL-000031","to":"EQP-C01.02","basis":"source","source_ids":["SRC-000078"]},{"id":"REL-000210","type":"used_in","from":"MDL-000031","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000211","type":"uses_technology","from":"MDL-000031","to":"TEC-060","basis":"source","source_ids":["SRC-000078"],"via":"source-stated laser type"},{"id":"REL-000212","type":"uses_technology","from":"MDL-000031","to":"TEC-065","basis":"source","source_ids":["SRC-000078"],"via":"source-stated laser type"},{"id":"REL-000213","type":"manufactures","from":"CMP-000142","to":"MDL-000032","basis":"source","source_ids":["SRC-000079"],"confidence":"HIGH"},{"id":"REL-000214","type":"part_of","from":"MDL-000032","to":"PRD-000027","basis":"derived"},{"id":"REL-000215","type":"classified_as","from":"MDL-000032","to":"EQP-F07","basis":"source","source_ids":["SRC-000079"]},{"id":"REL-000216","type":"used_in","from":"MDL-000032","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000217","type":"uses_technology","from":"MDL-000032","to":"TEC-065","basis":"source","source_ids":["SRC-000079"],"via":"source-stated laser type"},{"id":"REL-000218","type":"supports_material","from":"MDL-000032","to":"MAT-003","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000079"]},{"id":"REL-000219","type":"supports_application","from":"MDL-000032","to":"APP-010","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000079"]},{"id":"REL-000220","type":"supports_application","from":"MDL-000032","to":"APP-011","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000079"]},{"id":"REL-000221","type":"manufactures","from":"CMP-000142","to":"MDL-000033","basis":"source","source_ids":["SRC-000080"],"confidence":"MEDIUM"},{"id":"REL-000222","type":"part_of","from":"MDL-000033","to":"PRD-000028","basis":"derived"},{"id":"REL-000223","type":"classified_as","from":"MDL-000033","to":"EQP-F07","basis":"source","source_ids":["SRC-000080"]},{"id":"REL-000224","type":"used_in","from":"MDL-000033","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000225","type":"uses_technology","from":"MDL-000033","to":"TEC-065","basis":"source","source_ids":["SRC-000080"],"via":"source-stated laser type"},{"id":"REL-000226","type":"supports_material","from":"MDL-000033","to":"MAT-003","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000080"]},{"id":"REL-000227","type":"supports_application","from":"MDL-000033","to":"APP-010","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000080"]},{"id":"REL-000228","type":"supports_application","from":"MDL-000033","to":"APP-011","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000080"]},{"id":"REL-000229","type":"manufactures","from":"CMP-000143","to":"MDL-000034","basis":"source","source_ids":["SRC-000083","SRC-000086"],"confidence":"HIGH"},{"id":"REL-000230","type":"part_of","from":"MDL-000034","to":"PRD-000029","basis":"derived"},{"id":"REL-000231","type":"classified_as","from":"MDL-000034","to":"EQP-D14","basis":"source","source_ids":["SRC-000083","SRC-000086"]},{"id":"REL-000232","type":"used_in","from":"MDL-000034","to":"PRS-044","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000233","type":"used_in","from":"MDL-000034","to":"PRS-053","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000234","type":"uses_technology","from":"MDL-000034","to":"TEC-063","basis":"source","source_ids":["SRC-000083","SRC-000086"],"via":"source-stated laser type"},{"id":"REL-000235","type":"uses_technology","from":"MDL-000034","to":"TEC-072","basis":"source","source_ids":["SRC-000083","SRC-000086"],"via":"source-stated laser type"},{"id":"REL-000236","type":"uses_technology","from":"MDL-000034","to":"TEC-054","basis":"derived","via":"equipment category"},{"id":"REL-000237","type":"supports_material","from":"MDL-000034","to":"MAT-010","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000083","SRC-000086"]},{"id":"REL-000238","type":"supports_application","from":"MDL-000034","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000083","SRC-000086"]},{"id":"REL-000239","type":"manufactures","from":"CMP-000143","to":"MDL-000035","basis":"source","source_ids":["SRC-000082","SRC-000084"],"confidence":"HIGH"},{"id":"REL-000240","type":"part_of","from":"MDL-000035","to":"PRD-000030","basis":"derived"},{"id":"REL-000241","type":"classified_as","from":"MDL-000035","to":"EQP-D18","basis":"source","source_ids":["SRC-000082","SRC-000084"]},{"id":"REL-000242","type":"used_in","from":"MDL-000035","to":"PRS-044","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000243","type":"used_in","from":"MDL-000035","to":"PRS-048","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000244","type":"uses_technology","from":"MDL-000035","to":"TEC-063","basis":"source","source_ids":["SRC-000082","SRC-000084"],"via":"source-stated laser type"},{"id":"REL-000245","type":"uses_technology","from":"MDL-000035","to":"TEC-072","basis":"source","source_ids":["SRC-000082","SRC-000084"],"via":"source-stated laser type"},{"id":"REL-000246","type":"uses_technology","from":"MDL-000035","to":"TEC-049","basis":"derived","via":"equipment category"},{"id":"REL-000247","type":"supports_material","from":"MDL-000035","to":"MAT-010","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000082","SRC-000084"]},{"id":"REL-000248","type":"supports_application","from":"MDL-000035","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000082","SRC-000084"]},{"id":"REL-000249","type":"manufactures","from":"CMP-000143","to":"MDL-000036","basis":"source","source_ids":["SRC-000082"],"confidence":"HIGH"},{"id":"REL-000250","type":"part_of","from":"MDL-000036","to":"PRD-000031","basis":"derived"},{"id":"REL-000251","type":"classified_as","from":"MDL-000036","to":"EQP-C31","basis":"source","source_ids":["SRC-000082"]},{"id":"REL-000252","type":"uses_technology","from":"MDL-000036","to":"TEC-066","basis":"source","source_ids":["SRC-000082"],"via":"source-stated laser type"},{"id":"REL-000253","type":"supports_material","from":"MDL-000036","to":"MAT-010","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000082"]},{"id":"REL-000254","type":"manufactures","from":"CMP-000144","to":"MDL-000037","basis":"source","source_ids":["SRC-000229"],"confidence":"HIGH"},{"id":"REL-000255","type":"part_of","from":"MDL-000037","to":"PRD-000032","basis":"derived"},{"id":"REL-000256","type":"classified_as","from":"MDL-000037","to":"EQP-C26","basis":"source","source_ids":["SRC-000229"]},{"id":"REL-000257","type":"used_in","from":"MDL-000037","to":"PRS-038","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000258","type":"uses_technology","from":"MDL-000037","to":"TEC-059","basis":"source","source_ids":["SRC-000229"],"via":"source-stated laser type"},{"id":"REL-000259","type":"manufactures","from":"CMP-000144","to":"MDL-000038","basis":"source","source_ids":["SRC-000229"],"confidence":"HIGH"},{"id":"REL-000260","type":"part_of","from":"MDL-000038","to":"PRD-000033","basis":"derived"},{"id":"REL-000261","type":"classified_as","from":"MDL-000038","to":"EQP-C26","basis":"source","source_ids":["SRC-000229"]},{"id":"REL-000262","type":"used_in","from":"MDL-000038","to":"PRS-038","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000263","type":"uses_technology","from":"MDL-000038","to":"TEC-059","basis":"source","source_ids":["SRC-000229"],"via":"source-stated laser type"},{"id":"REL-000264","type":"manufactures","from":"CMP-000144","to":"MDL-000039","basis":"source","source_ids":["SRC-000229"],"confidence":"HIGH"},{"id":"REL-000265","type":"part_of","from":"MDL-000039","to":"PRD-000034","basis":"derived"},{"id":"REL-000266","type":"classified_as","from":"MDL-000039","to":"EQP-C26","basis":"source","source_ids":["SRC-000229"]},{"id":"REL-000267","type":"used_in","from":"MDL-000039","to":"PRS-038","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000268","type":"uses_technology","from":"MDL-000039","to":"TEC-059","basis":"source","source_ids":["SRC-000229"],"via":"source-stated laser type"},{"id":"REL-000269","type":"manufactures","from":"CMP-000144","to":"MDL-000040","basis":"source","source_ids":["SRC-000229"],"confidence":"HIGH"},{"id":"REL-000270","type":"part_of","from":"MDL-000040","to":"PRD-000035","basis":"derived"},{"id":"REL-000271","type":"classified_as","from":"MDL-000040","to":"EQP-A34","basis":"source","source_ids":["SRC-000229"]},{"id":"REL-000272","type":"used_in","from":"MDL-000040","to":"PRS-057","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000273","type":"manufactures","from":"CMP-000117","to":"MDL-000041","basis":"source","source_ids":["SRC-000109"],"confidence":"HIGH"},{"id":"REL-000274","type":"part_of","from":"MDL-000041","to":"PRD-000036","basis":"derived"},{"id":"REL-000275","type":"classified_as","from":"MDL-000041","to":"EQP-C01.03","basis":"source","source_ids":["SRC-000109"]},{"id":"REL-000276","type":"used_in","from":"MDL-000041","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000277","type":"uses_technology","from":"MDL-000041","to":"TEC-060","basis":"source","source_ids":["SRC-000109"],"via":"source-stated laser type"},{"id":"REL-000278","type":"uses_technology","from":"MDL-000041","to":"TEC-061","basis":"source","source_ids":["SRC-000109"],"via":"source-stated laser type"},{"id":"REL-000279","type":"supports_material","from":"MDL-000041","to":"MAT-003","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000109"]},{"id":"REL-000280","type":"supports_application","from":"MDL-000041","to":"APP-011","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000109"]},{"id":"REL-000281","type":"manufactures","from":"CMP-000118","to":"MDL-000042","basis":"source","source_ids":["SRC-000107"],"confidence":"HIGH"},{"id":"REL-000282","type":"part_of","from":"MDL-000042","to":"PRD-000037","basis":"derived"},{"id":"REL-000283","type":"classified_as","from":"MDL-000042","to":"EQP-C01.03","basis":"source","source_ids":["SRC-000107"]},{"id":"REL-000284","type":"used_in","from":"MDL-000042","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000285","type":"uses_technology","from":"MDL-000042","to":"TEC-060","basis":"source","source_ids":["SRC-000107"],"via":"source-stated laser type"},{"id":"REL-000286","type":"uses_technology","from":"MDL-000042","to":"TEC-061","basis":"source","source_ids":["SRC-000107"],"via":"source-stated laser type"},{"id":"REL-000287","type":"manufactures","from":"CMP-000119","to":"MDL-000043","basis":"source","source_ids":["SRC-000217"],"confidence":"HIGH"},{"id":"REL-000288","type":"part_of","from":"MDL-000043","to":"PRD-000038","basis":"derived"},{"id":"REL-000289","type":"classified_as","from":"MDL-000043","to":"EQP-D14","basis":"source","source_ids":["SRC-000217"]},{"id":"REL-000290","type":"used_in","from":"MDL-000043","to":"PRS-044","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000291","type":"used_in","from":"MDL-000043","to":"PRS-053","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000292","type":"uses_technology","from":"MDL-000043","to":"TEC-063","basis":"source","source_ids":["SRC-000217"],"via":"source-stated laser type"},{"id":"REL-000293","type":"uses_technology","from":"MDL-000043","to":"TEC-072","basis":"source","source_ids":["SRC-000217"],"via":"source-stated laser type"},{"id":"REL-000294","type":"uses_technology","from":"MDL-000043","to":"TEC-054","basis":"derived","via":"equipment category"},{"id":"REL-000295","type":"supports_material","from":"MDL-000043","to":"MAT-010","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000217"]},{"id":"REL-000296","type":"supports_application","from":"MDL-000043","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000217"]},{"id":"REL-000297","type":"manufactures","from":"CMP-000119","to":"MDL-000044","basis":"source","source_ids":["SRC-000217"],"confidence":"HIGH"},{"id":"REL-000298","type":"part_of","from":"MDL-000044","to":"PRD-000039","basis":"derived"},{"id":"REL-000299","type":"classified_as","from":"MDL-000044","to":"EQP-C01.02","basis":"source","source_ids":["SRC-000217"]},{"id":"REL-000300","type":"used_in","from":"MDL-000044","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000301","type":"uses_technology","from":"MDL-000044","to":"TEC-060","basis":"source","source_ids":["SRC-000217"],"via":"source-stated laser type"},{"id":"REL-000302","type":"supports_material","from":"MDL-000044","to":"MAT-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000217"]},{"id":"REL-000303","type":"supports_material","from":"MDL-000044","to":"MAT-003","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000217"]},{"id":"REL-000304","type":"supports_material","from":"MDL-000044","to":"MAT-005","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000217"]},{"id":"REL-000305","type":"supports_material","from":"MDL-000044","to":"MAT-010","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000217"]},{"id":"REL-000306","type":"supports_material","from":"MDL-000044","to":"MAT-011","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000217"]},{"id":"REL-000307","type":"supports_application","from":"MDL-000044","to":"APP-011","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000217"]},{"id":"REL-000308","type":"manufactures","from":"CMP-000119","to":"MDL-000045","basis":"source","source_ids":["SRC-000217"],"confidence":"HIGH"},{"id":"REL-000309","type":"part_of","from":"MDL-000045","to":"PRD-000040","basis":"derived"},{"id":"REL-000310","type":"classified_as","from":"MDL-000045","to":"EQP-F01","basis":"source","source_ids":["SRC-000217"]},{"id":"REL-000311","type":"used_in","from":"MDL-000045","to":"PRS-003","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000312","type":"uses_technology","from":"MDL-000045","to":"TEC-065","basis":"source","source_ids":["SRC-000217"],"via":"source-stated laser type"},{"id":"REL-000313","type":"uses_technology","from":"MDL-000045","to":"TEC-072","basis":"source","source_ids":["SRC-000217"],"via":"source-stated laser type"},{"id":"REL-000314","type":"supports_material","from":"MDL-000045","to":"MAT-003","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000217"]},{"id":"REL-000315","type":"supports_application","from":"MDL-000045","to":"APP-010","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000217"]},{"id":"REL-000316","type":"supports_application","from":"MDL-000045","to":"APP-011","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000217"]},{"id":"REL-000317","type":"manufactures","from":"CMP-000119","to":"MDL-000046","basis":"source","source_ids":["SRC-000217"],"confidence":"HIGH"},{"id":"REL-000318","type":"part_of","from":"MDL-000046","to":"PRD-000041","basis":"derived"},{"id":"REL-000319","type":"classified_as","from":"MDL-000046","to":"EQP-A14","basis":"source","source_ids":["SRC-000217"]},{"id":"REL-000320","type":"used_in","from":"MDL-000046","to":"PRS-023","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000321","type":"uses_technology","from":"MDL-000046","to":"TEC-067","basis":"source","source_ids":["SRC-000217"],"via":"source-stated laser type"},{"id":"REL-000322","type":"manufactures","from":"CMP-000119","to":"MDL-000047","basis":"source","source_ids":["SRC-000217"],"confidence":"HIGH"},{"id":"REL-000323","type":"part_of","from":"MDL-000047","to":"PRD-000042","basis":"derived"},{"id":"REL-000324","type":"classified_as","from":"MDL-000047","to":"EQP-C18","basis":"source","source_ids":["SRC-000217"]},{"id":"REL-000325","type":"used_in","from":"MDL-000047","to":"PRS-051","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000326","type":"used_in","from":"MDL-000047","to":"PRS-052","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000327","type":"uses_technology","from":"MDL-000047","to":"TEC-069","basis":"source","source_ids":["SRC-000217"],"via":"source-stated laser type"},{"id":"REL-000328","type":"uses_technology","from":"MDL-000047","to":"TEC-044","basis":"derived","via":"equipment category"},{"id":"REL-000329","type":"manufactures","from":"CMP-000120","to":"MDL-000048","basis":"source","source_ids":["SRC-000218"],"confidence":"LOW"},{"id":"REL-000330","type":"part_of","from":"MDL-000048","to":"PRD-000043","basis":"derived"},{"id":"REL-000331","type":"classified_as","from":"MDL-000048","to":"EQP-D14","basis":"source","source_ids":["SRC-000218"]},{"id":"REL-000332","type":"used_in","from":"MDL-000048","to":"PRS-044","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000333","type":"used_in","from":"MDL-000048","to":"PRS-053","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000334","type":"uses_technology","from":"MDL-000048","to":"TEC-063","basis":"source","source_ids":["SRC-000218"],"via":"source-stated laser type"},{"id":"REL-000335","type":"uses_technology","from":"MDL-000048","to":"TEC-054","basis":"derived","via":"equipment category"},{"id":"REL-000336","type":"supports_application","from":"MDL-000048","to":"APP-017","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000218"]},{"id":"REL-000337","type":"supports_application","from":"MDL-000048","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000218"]},{"id":"REL-000338","type":"manufactures","from":"CMP-000121","to":"MDL-000049","basis":"source","source_ids":["SRC-000219"],"confidence":"LOW"},{"id":"REL-000339","type":"part_of","from":"MDL-000049","to":"PRD-000044","basis":"derived"},{"id":"REL-000340","type":"classified_as","from":"MDL-000049","to":"EQP-C01.02","basis":"source","source_ids":["SRC-000219"]},{"id":"REL-000341","type":"used_in","from":"MDL-000049","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000342","type":"uses_technology","from":"MDL-000049","to":"TEC-064","basis":"source","source_ids":["SRC-000219"],"via":"source-stated laser type"},{"id":"REL-000343","type":"uses_technology","from":"MDL-000049","to":"TEC-065","basis":"source","source_ids":["SRC-000219"],"via":"source-stated laser type"},{"id":"REL-000344","type":"uses_technology","from":"MDL-000049","to":"TEC-060","basis":"derived","via":"equipment category"},{"id":"REL-000345","type":"manufactures","from":"CMP-000078","to":"MDL-000050","basis":"source","source_ids":["SRC-000117","SRC-000116","SRC-000119"],"confidence":"MEDIUM"},{"id":"REL-000346","type":"part_of","from":"MDL-000050","to":"PRD-000045","basis":"derived"},{"id":"REL-000347","type":"classified_as","from":"MDL-000050","to":"EQP-D14","basis":"source","source_ids":["SRC-000117","SRC-000116","SRC-000119"]},{"id":"REL-000348","type":"used_in","from":"MDL-000050","to":"PRS-044","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000349","type":"used_in","from":"MDL-000050","to":"PRS-053","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000350","type":"uses_technology","from":"MDL-000050","to":"TEC-063","basis":"source","source_ids":["SRC-000117","SRC-000116","SRC-000119"],"via":"source-stated laser type"},{"id":"REL-000351","type":"uses_technology","from":"MDL-000050","to":"TEC-054","basis":"derived","via":"equipment category"},{"id":"REL-000352","type":"supports_material","from":"MDL-000050","to":"MAT-010","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000117","SRC-000116","SRC-000119"]},{"id":"REL-000353","type":"supports_application","from":"MDL-000050","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000117","SRC-000116","SRC-000119"]},{"id":"REL-000354","type":"manufactures","from":"CMP-000078","to":"MDL-000051","basis":"source","source_ids":["SRC-000118"],"confidence":"LOW"},{"id":"REL-000355","type":"part_of","from":"MDL-000051","to":"PRD-000046","basis":"derived"},{"id":"REL-000356","type":"classified_as","from":"MDL-000051","to":"EQP-A23","basis":"source","source_ids":["SRC-000118"]},{"id":"REL-000357","type":"used_in","from":"MDL-000051","to":"PRS-027","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000358","type":"uses_technology","from":"MDL-000051","to":"TEC-031","basis":"derived","via":"equipment category"},{"id":"REL-000359","type":"manufactures","from":"CMP-000079","to":"MDL-000052","basis":"source","source_ids":["SRC-000226"],"confidence":"HIGH"},{"id":"REL-000360","type":"part_of","from":"MDL-000052","to":"PRD-000047","basis":"derived"},{"id":"REL-000361","type":"classified_as","from":"MDL-000052","to":"EQP-I07","basis":"source","source_ids":["SRC-000226"]},{"id":"REL-000362","type":"used_in","from":"MDL-000052","to":"PRS-055","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000363","type":"uses_technology","from":"MDL-000052","to":"TEC-067","basis":"source","source_ids":["SRC-000226"],"via":"source-stated laser type"},{"id":"REL-000364","type":"uses_technology","from":"MDL-000052","to":"TEC-081","basis":"source","source_ids":["SRC-000226"],"via":"source-stated laser type"},{"id":"REL-000365","type":"supports_application","from":"MDL-000052","to":"APP-016","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000226"]},{"id":"REL-000366","type":"supports_application","from":"MDL-000052","to":"APP-017","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000226"]},{"id":"REL-000367","type":"manufactures","from":"CMP-000079","to":"MDL-000053","basis":"source","source_ids":["SRC-000227","SRC-000248"],"confidence":"MEDIUM"},{"id":"REL-000368","type":"part_of","from":"MDL-000053","to":"PRD-000048","basis":"derived"},{"id":"REL-000369","type":"classified_as","from":"MDL-000053","to":"EQP-I07","basis":"source","source_ids":["SRC-000227","SRC-000248"]},{"id":"REL-000370","type":"used_in","from":"MDL-000053","to":"PRS-055","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000371","type":"uses_technology","from":"MDL-000053","to":"TEC-067","basis":"source","source_ids":["SRC-000227","SRC-000248"],"via":"source-stated laser type"},{"id":"REL-000372","type":"uses_technology","from":"MDL-000053","to":"TEC-068","basis":"source","source_ids":["SRC-000227","SRC-000248"],"via":"source-stated laser type"},{"id":"REL-000373","type":"uses_technology","from":"MDL-000053","to":"TEC-082","basis":"source","source_ids":["SRC-000227","SRC-000248"],"via":"source-stated laser type"},{"id":"REL-000374","type":"supports_application","from":"MDL-000053","to":"APP-016","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000227","SRC-000248"]},{"id":"REL-000375","type":"supports_application","from":"MDL-000053","to":"APP-017","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000227","SRC-000248"]},{"id":"REL-000376","type":"manufactures","from":"CMP-000057","to":"MDL-000054","basis":"source","source_ids":["SRC-000228"],"confidence":"LOW"},{"id":"REL-000377","type":"part_of","from":"MDL-000054","to":"PRD-000049","basis":"derived"},{"id":"REL-000378","type":"classified_as","from":"MDL-000054","to":"EQP-C19","basis":"source","source_ids":["SRC-000228"]},{"id":"REL-000379","type":"used_in","from":"MDL-000054","to":"PRS-035","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000380","type":"uses_technology","from":"MDL-000054","to":"TEC-066","basis":"source","source_ids":["SRC-000228"],"via":"source-stated laser type"},{"id":"REL-000381","type":"manufactures","from":"CMP-000056","to":"MDL-000055","basis":"source","source_ids":["SRC-000244"],"confidence":"LOW"},{"id":"REL-000382","type":"part_of","from":"MDL-000055","to":"PRD-000050","basis":"derived"},{"id":"REL-000383","type":"classified_as","from":"MDL-000055","to":"EQP-C19","basis":"source","source_ids":["SRC-000244"]},{"id":"REL-000384","type":"used_in","from":"MDL-000055","to":"PRS-035","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000385","type":"uses_technology","from":"MDL-000055","to":"TEC-066","basis":"source","source_ids":["SRC-000244"],"via":"source-stated laser type"},{"id":"REL-000386","type":"manufactures","from":"CMP-000014","to":"MDL-000056","basis":"source","source_ids":["SRC-000087","SRC-000088"],"confidence":"HIGH"},{"id":"REL-000387","type":"part_of","from":"MDL-000056","to":"PRD-000051","basis":"derived"},{"id":"REL-000388","type":"classified_as","from":"MDL-000056","to":"EQP-A14","basis":"source","source_ids":["SRC-000087","SRC-000088"]},{"id":"REL-000389","type":"used_in","from":"MDL-000056","to":"PRS-023","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000390","type":"uses_technology","from":"MDL-000056","to":"TEC-067","basis":"source","source_ids":["SRC-000087","SRC-000088"],"via":"source-stated laser type"},{"id":"REL-000391","type":"uses_technology","from":"MDL-000056","to":"TEC-075","basis":"source","source_ids":["SRC-000087","SRC-000088"],"via":"source-stated laser type"},{"id":"REL-000392","type":"supports_application","from":"MDL-000056","to":"APP-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000087","SRC-000088"]},{"id":"REL-000393","type":"manufactures","from":"CMP-000014","to":"MDL-000057","basis":"source","source_ids":["SRC-000089","SRC-000090"],"confidence":"HIGH"},{"id":"REL-000394","type":"part_of","from":"MDL-000057","to":"PRD-000051","basis":"derived"},{"id":"REL-000395","type":"classified_as","from":"MDL-000057","to":"EQP-A14","basis":"source","source_ids":["SRC-000089","SRC-000090"]},{"id":"REL-000396","type":"used_in","from":"MDL-000057","to":"PRS-023","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000397","type":"uses_technology","from":"MDL-000057","to":"TEC-067","basis":"source","source_ids":["SRC-000089","SRC-000090"],"via":"source-stated laser type"},{"id":"REL-000398","type":"supports_application","from":"MDL-000057","to":"APP-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000089","SRC-000090"]},{"id":"REL-000399","type":"supports_application","from":"MDL-000057","to":"APP-005","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000089","SRC-000090"]},{"id":"REL-000400","type":"manufactures","from":"CMP-000014","to":"MDL-000058","basis":"source","source_ids":["SRC-000088"],"confidence":"MEDIUM"},{"id":"REL-000401","type":"part_of","from":"MDL-000058","to":"PRD-000052","basis":"derived"},{"id":"REL-000402","type":"classified_as","from":"MDL-000058","to":"EQP-A13","basis":"source","source_ids":["SRC-000088"]},{"id":"REL-000403","type":"used_in","from":"MDL-000058","to":"PRS-023","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000404","type":"uses_technology","from":"MDL-000058","to":"TEC-067","basis":"source","source_ids":["SRC-000088"],"via":"source-stated laser type"},{"id":"REL-000405","type":"uses_technology","from":"MDL-000058","to":"TEC-028","basis":"derived","via":"equipment category"},{"id":"REL-000406","type":"supports_application","from":"MDL-000058","to":"APP-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000088"]},{"id":"REL-000407","type":"manufactures","from":"CMP-000174","to":"MDL-000059","basis":"source","source_ids":["SRC-000223","SRC-000092"],"confidence":"HIGH"},{"id":"REL-000408","type":"part_of","from":"MDL-000059","to":"PRD-000053","basis":"derived"},{"id":"REL-000409","type":"classified_as","from":"MDL-000059","to":"EQP-A14","basis":"source","source_ids":["SRC-000223","SRC-000092"]},{"id":"REL-000410","type":"used_in","from":"MDL-000059","to":"PRS-023","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000411","type":"uses_technology","from":"MDL-000059","to":"TEC-067","basis":"source","source_ids":["SRC-000223","SRC-000092"],"via":"source-stated laser type"},{"id":"REL-000412","type":"uses_technology","from":"MDL-000059","to":"TEC-074","basis":"source","source_ids":["SRC-000223","SRC-000092"],"via":"source-stated laser type"},{"id":"REL-000413","type":"supports_application","from":"MDL-000059","to":"APP-010","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000223","SRC-000092"]},{"id":"REL-000414","type":"manufactures","from":"CMP-000174","to":"MDL-000060","basis":"source","source_ids":["SRC-000223"],"confidence":"HIGH"},{"id":"REL-000415","type":"part_of","from":"MDL-000060","to":"PRD-000053","basis":"derived"},{"id":"REL-000416","type":"classified_as","from":"MDL-000060","to":"EQP-A14","basis":"source","source_ids":["SRC-000223"]},{"id":"REL-000417","type":"used_in","from":"MDL-000060","to":"PRS-023","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000418","type":"uses_technology","from":"MDL-000060","to":"TEC-067","basis":"source","source_ids":["SRC-000223"],"via":"source-stated laser type"},{"id":"REL-000419","type":"uses_technology","from":"MDL-000060","to":"TEC-073","basis":"source","source_ids":["SRC-000223"],"via":"source-stated laser type"},{"id":"REL-000420","type":"supports_material","from":"MDL-000060","to":"MAT-003","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000223"]},{"id":"REL-000421","type":"supports_application","from":"MDL-000060","to":"APP-011","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000223"]},{"id":"REL-000422","type":"manufactures","from":"CMP-000175","to":"MDL-000061","basis":"source","source_ids":["SRC-000224"],"confidence":"HIGH"},{"id":"REL-000423","type":"part_of","from":"MDL-000061","to":"PRD-000054","basis":"derived"},{"id":"REL-000424","type":"classified_as","from":"MDL-000061","to":"EQP-A14","basis":"source","source_ids":["SRC-000224"]},{"id":"REL-000425","type":"used_in","from":"MDL-000061","to":"PRS-023","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000426","type":"uses_technology","from":"MDL-000061","to":"TEC-067","basis":"source","source_ids":["SRC-000224"],"via":"source-stated laser type"},{"id":"REL-000427","type":"manufactures","from":"CMP-000175","to":"MDL-000062","basis":"source","source_ids":["SRC-000224"],"confidence":"HIGH"},{"id":"REL-000428","type":"part_of","from":"MDL-000062","to":"PRD-000055","basis":"derived"},{"id":"REL-000429","type":"classified_as","from":"MDL-000062","to":"EQP-I07","basis":"source","source_ids":["SRC-000224"]},{"id":"REL-000430","type":"used_in","from":"MDL-000062","to":"PRS-055","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000431","type":"uses_technology","from":"MDL-000062","to":"TEC-067","basis":"source","source_ids":["SRC-000224"],"via":"source-stated laser type"},{"id":"REL-000432","type":"uses_technology","from":"MDL-000062","to":"TEC-082","basis":"source","source_ids":["SRC-000224"],"via":"source-stated laser type"},{"id":"REL-000433","type":"supports_application","from":"MDL-000062","to":"APP-016","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000224"]},{"id":"REL-000434","type":"supports_application","from":"MDL-000062","to":"APP-017","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000224"]},{"id":"REL-000435","type":"manufactures","from":"CMP-000175","to":"MDL-000063","basis":"source","source_ids":["SRC-000224"],"confidence":"HIGH"},{"id":"REL-000436","type":"part_of","from":"MDL-000063","to":"PRD-000056","basis":"derived"},{"id":"REL-000437","type":"classified_as","from":"MDL-000063","to":"EQP-I06","basis":"source","source_ids":["SRC-000224"]},{"id":"REL-000438","type":"used_in","from":"MDL-000063","to":"PRS-054","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000439","type":"uses_technology","from":"MDL-000063","to":"TEC-068","basis":"source","source_ids":["SRC-000224"],"via":"source-stated laser type"},{"id":"REL-000440","type":"supports_application","from":"MDL-000063","to":"APP-016","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000224"]},{"id":"REL-000441","type":"supports_application","from":"MDL-000063","to":"APP-017","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000224"]},{"id":"REL-000442","type":"manufactures","from":"CMP-000177","to":"MDL-000064","basis":"source","source_ids":["SRC-000091"],"confidence":"LOW"},{"id":"REL-000443","type":"part_of","from":"MDL-000064","to":"PRD-000057","basis":"derived"},{"id":"REL-000444","type":"classified_as","from":"MDL-000064","to":"EQP-A14","basis":"source","source_ids":["SRC-000091"]},{"id":"REL-000445","type":"used_in","from":"MDL-000064","to":"PRS-023","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000446","type":"uses_technology","from":"MDL-000064","to":"TEC-067","basis":"source","source_ids":["SRC-000091"],"via":"source-stated laser type"},{"id":"REL-000447","type":"uses_technology","from":"MDL-000064","to":"TEC-073","basis":"source","source_ids":["SRC-000091"],"via":"source-stated laser type"},{"id":"REL-000448","type":"supports_material","from":"MDL-000064","to":"MAT-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000091"]},{"id":"REL-000449","type":"supports_material","from":"MDL-000064","to":"MAT-003","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000091"]},{"id":"REL-000450","type":"supports_application","from":"MDL-000064","to":"APP-010","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000091"]},{"id":"REL-000451","type":"supports_application","from":"MDL-000064","to":"APP-011","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000091"]},{"id":"REL-000452","type":"manufactures","from":"CMP-000177","to":"MDL-000065","basis":"source","source_ids":["SRC-000092"],"confidence":"UNVERIFIED"},{"id":"REL-000453","type":"part_of","from":"MDL-000065","to":"PRD-000058","basis":"derived"},{"id":"REL-000454","type":"classified_as","from":"MDL-000065","to":"EQP-A14","basis":"source","source_ids":["SRC-000092"]},{"id":"REL-000455","type":"used_in","from":"MDL-000065","to":"PRS-023","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000456","type":"uses_technology","from":"MDL-000065","to":"TEC-067","basis":"source","source_ids":["SRC-000092"],"via":"source-stated laser type"},{"id":"REL-000457","type":"manufactures","from":"CMP-000145","to":"MDL-000066","basis":"source","source_ids":["SRC-000093"],"confidence":"HIGH"},{"id":"REL-000458","type":"part_of","from":"MDL-000066","to":"PRD-000059","basis":"derived"},{"id":"REL-000459","type":"classified_as","from":"MDL-000066","to":"EQP-I06","basis":"source","source_ids":["SRC-000093"]},{"id":"REL-000460","type":"used_in","from":"MDL-000066","to":"PRS-054","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000461","type":"uses_technology","from":"MDL-000066","to":"TEC-068","basis":"source","source_ids":["SRC-000093"],"via":"source-stated laser type"},{"id":"REL-000462","type":"uses_technology","from":"MDL-000066","to":"TEC-082","basis":"source","source_ids":["SRC-000093"],"via":"source-stated laser type"},{"id":"REL-000463","type":"uses_technology","from":"MDL-000066","to":"TEC-073","basis":"source","source_ids":["SRC-000093"],"via":"source-stated laser type"},{"id":"REL-000464","type":"supports_material","from":"MDL-000066","to":"MAT-010","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000093"]},{"id":"REL-000465","type":"supports_application","from":"MDL-000066","to":"APP-016","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000093"]},{"id":"REL-000466","type":"supports_application","from":"MDL-000066","to":"APP-017","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000093"]},{"id":"REL-000467","type":"manufactures","from":"CMP-000145","to":"MDL-000067","basis":"source","source_ids":["SRC-000096","SRC-000094"],"confidence":"HIGH"},{"id":"REL-000468","type":"part_of","from":"MDL-000067","to":"PRD-000060","basis":"derived"},{"id":"REL-000469","type":"classified_as","from":"MDL-000067","to":"EQP-I07","basis":"source","source_ids":["SRC-000096","SRC-000094"]},{"id":"REL-000470","type":"used_in","from":"MDL-000067","to":"PRS-055","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000471","type":"uses_technology","from":"MDL-000067","to":"TEC-067","basis":"source","source_ids":["SRC-000096","SRC-000094"],"via":"source-stated laser type"},{"id":"REL-000472","type":"uses_technology","from":"MDL-000067","to":"TEC-082","basis":"source","source_ids":["SRC-000096","SRC-000094"],"via":"source-stated laser type"},{"id":"REL-000473","type":"supports_application","from":"MDL-000067","to":"APP-016","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000096","SRC-000094"]},{"id":"REL-000474","type":"supports_application","from":"MDL-000067","to":"APP-017","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000096","SRC-000094"]},{"id":"REL-000475","type":"manufactures","from":"CMP-000145","to":"MDL-000068","basis":"source","source_ids":["SRC-000095"],"confidence":"MEDIUM"},{"id":"REL-000476","type":"part_of","from":"MDL-000068","to":"PRD-000061","basis":"derived"},{"id":"REL-000477","type":"classified_as","from":"MDL-000068","to":"EQP-I08","basis":"source","source_ids":["SRC-000095"]},{"id":"REL-000478","type":"used_in","from":"MDL-000068","to":"PRS-056","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000479","type":"uses_technology","from":"MDL-000068","to":"TEC-068","basis":"source","source_ids":["SRC-000095"],"via":"source-stated laser type"},{"id":"REL-000480","type":"uses_technology","from":"MDL-000068","to":"TEC-070","basis":"source","source_ids":["SRC-000095"],"via":"source-stated laser type"},{"id":"REL-000481","type":"uses_technology","from":"MDL-000068","to":"TEC-071","basis":"source","source_ids":["SRC-000095"],"via":"source-stated laser type"},{"id":"REL-000482","type":"uses_technology","from":"MDL-000068","to":"TEC-082","basis":"source","source_ids":["SRC-000095"],"via":"source-stated laser type"},{"id":"REL-000483","type":"supports_application","from":"MDL-000068","to":"APP-016","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000095"]},{"id":"REL-000484","type":"supports_application","from":"MDL-000068","to":"APP-017","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000095"]},{"id":"REL-000485","type":"manufactures","from":"CMP-000145","to":"MDL-000069","basis":"source","source_ids":["SRC-000226"],"confidence":"HIGH"},{"id":"REL-000486","type":"part_of","from":"MDL-000069","to":"PRD-000062","basis":"derived"},{"id":"REL-000487","type":"classified_as","from":"MDL-000069","to":"CMPN-000010","basis":"source","source_ids":["SRC-000226"]},{"id":"REL-000488","type":"uses_technology","from":"MDL-000069","to":"TEC-081","basis":"source","source_ids":["SRC-000226"],"via":"source-stated laser type"},{"id":"REL-000489","type":"supports_application","from":"MDL-000069","to":"APP-017","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000226"]},{"id":"REL-000490","type":"manufactures","from":"CMP-000148","to":"MDL-000070","basis":"source","source_ids":["SRC-000230"],"confidence":"LOW"},{"id":"REL-000491","type":"part_of","from":"MDL-000070","to":"PRD-000063","basis":"derived"},{"id":"REL-000492","type":"classified_as","from":"MDL-000070","to":"EQP-C28","basis":"source","source_ids":["SRC-000230"]},{"id":"REL-000493","type":"used_in","from":"MDL-000070","to":"PRS-044","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000494","type":"used_in","from":"MDL-000070","to":"PRS-053","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000495","type":"uses_technology","from":"MDL-000070","to":"TEC-063","basis":"source","source_ids":["SRC-000230"],"via":"source-stated laser type"},{"id":"REL-000496","type":"uses_technology","from":"MDL-000070","to":"TEC-079","basis":"source","source_ids":["SRC-000230"],"via":"source-stated laser type"},{"id":"REL-000497","type":"supports_material","from":"MDL-000070","to":"MAT-038","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000230"]},{"id":"REL-000498","type":"manufactures","from":"CMP-000148","to":"MDL-000071","basis":"source","source_ids":["SRC-000247"],"confidence":"HIGH"},{"id":"REL-000499","type":"part_of","from":"MDL-000071","to":"PRD-000064","basis":"derived"},{"id":"REL-000500","type":"classified_as","from":"MDL-000071","to":"EQP-C28","basis":"source","source_ids":["SRC-000247"]},{"id":"REL-000501","type":"used_in","from":"MDL-000071","to":"PRS-044","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000502","type":"used_in","from":"MDL-000071","to":"PRS-053","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000503","type":"uses_technology","from":"MDL-000071","to":"TEC-063","basis":"source","source_ids":["SRC-000247"],"via":"source-stated laser type"},{"id":"REL-000504","type":"uses_technology","from":"MDL-000071","to":"TEC-073","basis":"source","source_ids":["SRC-000247"],"via":"source-stated laser type"},{"id":"REL-000505","type":"manufactures","from":"CMP-000032","to":"MDL-000072","basis":"source","source_ids":["SRC-000326"],"confidence":"HIGH"},{"id":"REL-000506","type":"part_of","from":"MDL-000072","to":"PRD-000065","basis":"derived"},{"id":"REL-000507","type":"classified_as","from":"MDL-000072","to":"EQP-C28","basis":"source","source_ids":["SRC-000326"]},{"id":"REL-000508","type":"used_in","from":"MDL-000072","to":"PRS-044","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000509","type":"used_in","from":"MDL-000072","to":"PRS-053","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000510","type":"uses_technology","from":"MDL-000072","to":"TEC-063","basis":"source","source_ids":["SRC-000326"],"via":"source-stated laser type"},{"id":"REL-000511","type":"uses_technology","from":"MDL-000072","to":"TEC-082","basis":"source","source_ids":["SRC-000326"],"via":"source-stated laser type"},{"id":"REL-000512","type":"supports_application","from":"MDL-000072","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000326"]},{"id":"REL-000513","type":"manufactures","from":"CMP-000054","to":"MDL-000073","basis":"source","source_ids":["SRC-000231"],"confidence":"HIGH"},{"id":"REL-000514","type":"part_of","from":"MDL-000073","to":"PRD-000066","basis":"derived"},{"id":"REL-000515","type":"classified_as","from":"MDL-000073","to":"EQP-C01.04","basis":"source","source_ids":["SRC-000231"]},{"id":"REL-000516","type":"used_in","from":"MDL-000073","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000517","type":"uses_technology","from":"MDL-000073","to":"TEC-014","basis":"derived","via":"equipment category"},{"id":"REL-000518","type":"manufactures","from":"CMP-000055","to":"MDL-000074","basis":"source","source_ids":["SRC-000234"],"confidence":"HIGH"},{"id":"REL-000519","type":"part_of","from":"MDL-000074","to":"PRD-000067","basis":"derived"},{"id":"REL-000520","type":"classified_as","from":"MDL-000074","to":"EQP-C01.04","basis":"source","source_ids":["SRC-000234"]},{"id":"REL-000521","type":"used_in","from":"MDL-000074","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000522","type":"uses_technology","from":"MDL-000074","to":"TEC-014","basis":"derived","via":"equipment category"},{"id":"REL-000523","type":"manufactures","from":"CMP-000005","to":"MDL-000075","basis":"source","source_ids":["SRC-000235"],"confidence":"HIGH"},{"id":"REL-000524","type":"part_of","from":"MDL-000075","to":"PRD-000068","basis":"derived"},{"id":"REL-000525","type":"classified_as","from":"MDL-000075","to":"EQP-C01.04","basis":"source","source_ids":["SRC-000235"]},{"id":"REL-000526","type":"used_in","from":"MDL-000075","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000527","type":"uses_technology","from":"MDL-000075","to":"TEC-014","basis":"derived","via":"equipment category"},{"id":"REL-000528","type":"manufactures","from":"CMP-000051","to":"MDL-000076","basis":"source","source_ids":["SRC-000232","SRC-000243"],"confidence":"HIGH"},{"id":"REL-000529","type":"part_of","from":"MDL-000076","to":"PRD-000069","basis":"derived"},{"id":"REL-000530","type":"classified_as","from":"MDL-000076","to":"EQP-C18","basis":"source","source_ids":["SRC-000232","SRC-000243"]},{"id":"REL-000531","type":"used_in","from":"MDL-000076","to":"PRS-051","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000532","type":"used_in","from":"MDL-000076","to":"PRS-052","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000533","type":"uses_technology","from":"MDL-000076","to":"TEC-069","basis":"source","source_ids":["SRC-000232","SRC-000243"],"via":"source-stated laser type"},{"id":"REL-000534","type":"uses_technology","from":"MDL-000076","to":"TEC-075","basis":"source","source_ids":["SRC-000232","SRC-000243"],"via":"source-stated laser type"},{"id":"REL-000535","type":"uses_technology","from":"MDL-000076","to":"TEC-044","basis":"derived","via":"equipment category"},{"id":"REL-000536","type":"manufactures","from":"CMP-000051","to":"MDL-000077","basis":"source","source_ids":["SRC-000232"],"confidence":"HIGH"},{"id":"REL-000537","type":"part_of","from":"MDL-000077","to":"PRD-000070","basis":"derived"},{"id":"REL-000538","type":"classified_as","from":"MDL-000077","to":"EQP-C18","basis":"source","source_ids":["SRC-000232"]},{"id":"REL-000539","type":"used_in","from":"MDL-000077","to":"PRS-051","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000540","type":"used_in","from":"MDL-000077","to":"PRS-052","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000541","type":"uses_technology","from":"MDL-000077","to":"TEC-044","basis":"derived","via":"equipment category"},{"id":"REL-000542","type":"manufactures","from":"CMP-000052","to":"MDL-000078","basis":"source","source_ids":["SRC-000233"],"confidence":"LOW"},{"id":"REL-000543","type":"part_of","from":"MDL-000078","to":"PRD-000071","basis":"derived"},{"id":"REL-000544","type":"classified_as","from":"MDL-000078","to":"EQP-C18","basis":"source","source_ids":["SRC-000233"]},{"id":"REL-000545","type":"used_in","from":"MDL-000078","to":"PRS-051","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000546","type":"used_in","from":"MDL-000078","to":"PRS-052","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000547","type":"uses_technology","from":"MDL-000078","to":"TEC-069","basis":"source","source_ids":["SRC-000233"],"via":"source-stated laser type"},{"id":"REL-000548","type":"uses_technology","from":"MDL-000078","to":"TEC-082","basis":"source","source_ids":["SRC-000233"],"via":"source-stated laser type"},{"id":"REL-000549","type":"uses_technology","from":"MDL-000078","to":"TEC-044","basis":"derived","via":"equipment category"},{"id":"REL-000550","type":"supports_application","from":"MDL-000078","to":"APP-014","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000233"]},{"id":"REL-000551","type":"supports_application","from":"MDL-000078","to":"APP-015","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000233"]},{"id":"REL-000552","type":"supports_application","from":"MDL-000078","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000233"]},{"id":"REL-000553","type":"manufactures","from":"CMP-000047","to":"MDL-000079","basis":"source","source_ids":["SRC-000041","SRC-000042"],"confidence":"MEDIUM"},{"id":"REL-000554","type":"part_of","from":"MDL-000079","to":"PRD-000072","basis":"derived"},{"id":"REL-000555","type":"classified_as","from":"MDL-000079","to":"EQP-C16","basis":"source","source_ids":["SRC-000041","SRC-000042"]},{"id":"REL-000556","type":"used_in","from":"MDL-000079","to":"PRS-035","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000557","type":"used_in","from":"MDL-000079","to":"PRS-049","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000558","type":"used_in","from":"MDL-000079","to":"PRS-050","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000559","type":"uses_technology","from":"MDL-000079","to":"TEC-042","basis":"derived","via":"equipment category"},{"id":"REL-000560","type":"supports_application","from":"MDL-000079","to":"APP-008","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000041","SRC-000042"]},{"id":"REL-000561","type":"manufactures","from":"CMP-000048","to":"MDL-000080","basis":"source","source_ids":["SRC-000043"],"confidence":"LOW"},{"id":"REL-000562","type":"part_of","from":"MDL-000080","to":"PRD-000073","basis":"derived"},{"id":"REL-000563","type":"classified_as","from":"MDL-000080","to":"EQP-C16","basis":"source","source_ids":["SRC-000043"]},{"id":"REL-000564","type":"used_in","from":"MDL-000080","to":"PRS-035","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000565","type":"used_in","from":"MDL-000080","to":"PRS-049","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000566","type":"used_in","from":"MDL-000080","to":"PRS-050","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000567","type":"uses_technology","from":"MDL-000080","to":"TEC-042","basis":"derived","via":"equipment category"},{"id":"REL-000568","type":"supports_application","from":"MDL-000080","to":"APP-008","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000043"]},{"id":"REL-000569","type":"manufactures","from":"CMP-000048","to":"MDL-000081","basis":"source","source_ids":["SRC-000040","SRC-000048"],"confidence":"UNVERIFIED"},{"id":"REL-000570","type":"part_of","from":"MDL-000081","to":"PRD-000074","basis":"derived"},{"id":"REL-000571","type":"classified_as","from":"MDL-000081","to":"EQP-C17","basis":"source","source_ids":["SRC-000040","SRC-000048"]},{"id":"REL-000572","type":"used_in","from":"MDL-000081","to":"PRS-049","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000573","type":"used_in","from":"MDL-000081","to":"PRS-050","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000574","type":"used_in","from":"MDL-000081","to":"PRS-051","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000575","type":"uses_technology","from":"MDL-000081","to":"TEC-043","basis":"derived","via":"equipment category"},{"id":"REL-000576","type":"supports_application","from":"MDL-000081","to":"APP-008","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000040","SRC-000048"]},{"id":"REL-000577","type":"supports_application","from":"MDL-000081","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000040","SRC-000048"]},{"id":"REL-000578","type":"manufactures","from":"CMP-000002","to":"MDL-000082","basis":"source","source_ids":["SRC-000046","SRC-000051"],"confidence":"LOW"},{"id":"REL-000579","type":"part_of","from":"MDL-000082","to":"PRD-000075","basis":"derived"},{"id":"REL-000580","type":"classified_as","from":"MDL-000082","to":"EQP-C17","basis":"source","source_ids":["SRC-000046","SRC-000051"]},{"id":"REL-000581","type":"used_in","from":"MDL-000082","to":"PRS-049","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000582","type":"used_in","from":"MDL-000082","to":"PRS-050","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000583","type":"used_in","from":"MDL-000082","to":"PRS-051","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000584","type":"uses_technology","from":"MDL-000082","to":"TEC-043","basis":"derived","via":"equipment category"},{"id":"REL-000585","type":"supports_application","from":"MDL-000082","to":"APP-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000046","SRC-000051"]},{"id":"REL-000586","type":"supports_application","from":"MDL-000082","to":"APP-008","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000046","SRC-000051"]},{"id":"REL-000587","type":"supports_application","from":"MDL-000082","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000046","SRC-000051"]},{"id":"REL-000588","type":"manufactures","from":"CMP-000026","to":"MDL-000083","basis":"source","source_ids":["SRC-000340"],"confidence":"HIGH"},{"id":"REL-000589","type":"part_of","from":"MDL-000083","to":"PRD-000076","basis":"derived"},{"id":"REL-000590","type":"classified_as","from":"MDL-000083","to":"EQP-C10","basis":"source","source_ids":["SRC-000340"]},{"id":"REL-000591","type":"used_in","from":"MDL-000083","to":"PRS-033","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000592","type":"uses_technology","from":"MDL-000083","to":"TEC-039","basis":"derived","via":"equipment category"},{"id":"REL-000593","type":"supports_application","from":"MDL-000083","to":"APP-018","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000340"]},{"id":"REL-000594","type":"manufactures","from":"CMP-000026","to":"MDL-000084","basis":"source","source_ids":["SRC-000341"],"confidence":"HIGH"},{"id":"REL-000595","type":"part_of","from":"MDL-000084","to":"PRD-000077","basis":"derived"},{"id":"REL-000596","type":"classified_as","from":"MDL-000084","to":"EQP-C11","basis":"source","source_ids":["SRC-000341"]},{"id":"REL-000597","type":"used_in","from":"MDL-000084","to":"PRS-035","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000598","type":"used_in","from":"MDL-000084","to":"PRS-050","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000599","type":"uses_technology","from":"MDL-000084","to":"TEC-041","basis":"derived","via":"equipment category"},{"id":"REL-000600","type":"supports_application","from":"MDL-000084","to":"APP-018","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000341"]},{"id":"REL-000601","type":"manufactures","from":"CMP-000049","to":"MDL-000085","basis":"source","source_ids":["SRC-000237"],"confidence":"HIGH"},{"id":"REL-000602","type":"part_of","from":"MDL-000085","to":"PRD-000078","basis":"derived"},{"id":"REL-000603","type":"classified_as","from":"MDL-000085","to":"EQP-C20","basis":"source","source_ids":["SRC-000237"]},{"id":"REL-000604","type":"used_in","from":"MDL-000085","to":"PRS-036","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000605","type":"used_in","from":"MDL-000085","to":"PRS-047","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000606","type":"uses_technology","from":"MDL-000085","to":"TEC-045","basis":"derived","via":"equipment category"},{"id":"REL-000607","type":"manufactures","from":"CMP-000049","to":"MDL-000086","basis":"source","source_ids":["SRC-000237"],"confidence":"HIGH"},{"id":"REL-000608","type":"part_of","from":"MDL-000086","to":"PRD-000079","basis":"derived"},{"id":"REL-000609","type":"classified_as","from":"MDL-000086","to":"EQP-C32","basis":"source","source_ids":["SRC-000237"]},{"id":"REL-000610","type":"used_in","from":"MDL-000086","to":"PRS-039","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000611","type":"manufactures","from":"CMP-000050","to":"MDL-000087","basis":"source","source_ids":["SRC-000240"],"confidence":"HIGH"},{"id":"REL-000612","type":"part_of","from":"MDL-000087","to":"PRD-000080","basis":"derived"},{"id":"REL-000613","type":"classified_as","from":"MDL-000087","to":"EQP-C12","basis":"source","source_ids":["SRC-000240"]},{"id":"REL-000614","type":"used_in","from":"MDL-000087","to":"PRS-034","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000615","type":"uses_technology","from":"MDL-000087","to":"TEC-040","basis":"derived","via":"equipment category"},{"id":"REL-000616","type":"manufactures","from":"CMP-000050","to":"MDL-000088","basis":"source","source_ids":["SRC-000240"],"confidence":"HIGH"},{"id":"REL-000617","type":"part_of","from":"MDL-000088","to":"PRD-000081","basis":"derived"},{"id":"REL-000618","type":"classified_as","from":"MDL-000088","to":"EQP-C11","basis":"source","source_ids":["SRC-000240"]},{"id":"REL-000619","type":"used_in","from":"MDL-000088","to":"PRS-035","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000620","type":"used_in","from":"MDL-000088","to":"PRS-050","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000621","type":"uses_technology","from":"MDL-000088","to":"TEC-041","basis":"derived","via":"equipment category"},{"id":"REL-000622","type":"manufactures","from":"CMP-000053","to":"MDL-000089","basis":"source","source_ids":["SRC-000236"],"confidence":"HIGH"},{"id":"REL-000623","type":"part_of","from":"MDL-000089","to":"PRD-000082","basis":"derived"},{"id":"REL-000624","type":"classified_as","from":"MDL-000089","to":"EQP-C01.01","basis":"source","source_ids":["SRC-000236"]},{"id":"REL-000625","type":"used_in","from":"MDL-000089","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000626","type":"uses_technology","from":"MDL-000089","to":"TEC-037","basis":"derived","via":"equipment category"},{"id":"REL-000627","type":"manufactures","from":"CMP-000040","to":"MDL-000090","basis":"source","source_ids":["SRC-000241","SRC-000242"],"confidence":"HIGH"},{"id":"REL-000628","type":"part_of","from":"MDL-000090","to":"PRD-000083","basis":"derived"},{"id":"REL-000629","type":"classified_as","from":"MDL-000090","to":"EQP-C38","basis":"source","source_ids":["SRC-000241","SRC-000242"]},{"id":"REL-000630","type":"used_in","from":"MDL-000090","to":"PRS-042","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000631","type":"uses_technology","from":"MDL-000090","to":"TEC-057","basis":"derived","via":"equipment category"},{"id":"REL-000632","type":"supports_material","from":"MDL-000090","to":"MAT-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000241","SRC-000242"]},{"id":"REL-000633","type":"supports_material","from":"MDL-000090","to":"MAT-003","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000241","SRC-000242"]},{"id":"REL-000634","type":"supports_application","from":"MDL-000090","to":"APP-003","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000241","SRC-000242"]},{"id":"REL-000635","type":"supports_application","from":"MDL-000090","to":"APP-008","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000241","SRC-000242"]},{"id":"REL-000636","type":"supports_application","from":"MDL-000090","to":"APP-011","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000241","SRC-000242"]},{"id":"REL-000637","type":"supports_application","from":"MDL-000090","to":"APP-018","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000241","SRC-000242"]},{"id":"REL-000638","type":"manufactures","from":"CMP-000040","to":"MDL-000091","basis":"source","source_ids":["SRC-000241"],"confidence":"HIGH"},{"id":"REL-000639","type":"part_of","from":"MDL-000091","to":"PRD-000084","basis":"derived"},{"id":"REL-000640","type":"classified_as","from":"MDL-000091","to":"EQP-C38","basis":"source","source_ids":["SRC-000241"]},{"id":"REL-000641","type":"used_in","from":"MDL-000091","to":"PRS-042","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000642","type":"uses_technology","from":"MDL-000091","to":"TEC-057","basis":"derived","via":"equipment category"},{"id":"REL-000643","type":"supports_application","from":"MDL-000091","to":"APP-003","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000241"]},{"id":"REL-000644","type":"manufactures","from":"CMP-000038","to":"MDL-000092","basis":"source","source_ids":["SRC-000302"],"confidence":"LOW"},{"id":"REL-000645","type":"part_of","from":"MDL-000092","to":"PRD-000085","basis":"derived"},{"id":"REL-000646","type":"classified_as","from":"MDL-000092","to":"EQP-A33","basis":"source","source_ids":["SRC-000302"]},{"id":"REL-000647","type":"used_in","from":"MDL-000092","to":"PRS-029","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000648","type":"uses_technology","from":"MDL-000092","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-000649","type":"supports_application","from":"MDL-000092","to":"APP-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000302"]},{"id":"REL-000650","type":"supports_application","from":"MDL-000092","to":"APP-008","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000302"]},{"id":"REL-000651","type":"manufactures","from":"CMP-000001","to":"MDL-000093","basis":"source","source_ids":["SRC-000133","SRC-000198"],"confidence":"HIGH"},{"id":"REL-000652","type":"part_of","from":"MDL-000093","to":"PRD-000086","basis":"derived"},{"id":"REL-000653","type":"classified_as","from":"MDL-000093","to":"EQP-A01.01","basis":"source","source_ids":["SRC-000133","SRC-000198"]},{"id":"REL-000654","type":"used_in","from":"MDL-000093","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000655","type":"uses_technology","from":"MDL-000093","to":"TEC-001","basis":"derived","via":"equipment category"},{"id":"REL-000656","type":"supports_application","from":"MDL-000093","to":"APP-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000133","SRC-000198"]},{"id":"REL-000657","type":"supports_application","from":"MDL-000093","to":"APP-006","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000133","SRC-000198"]},{"id":"REL-000658","type":"manufactures","from":"CMP-000001","to":"MDL-000094","basis":"source","source_ids":["SRC-000190","SRC-000191"],"confidence":"HIGH"},{"id":"REL-000659","type":"part_of","from":"MDL-000094","to":"PRD-000087","basis":"derived"},{"id":"REL-000660","type":"classified_as","from":"MDL-000094","to":"EQP-A01.01","basis":"source","source_ids":["SRC-000190","SRC-000191"]},{"id":"REL-000661","type":"used_in","from":"MDL-000094","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000662","type":"uses_technology","from":"MDL-000094","to":"TEC-001","basis":"derived","via":"equipment category"},{"id":"REL-000663","type":"manufactures","from":"CMP-000020","to":"MDL-000095","basis":"source","source_ids":["SRC-000317","SRC-000349"],"confidence":"HIGH"},{"id":"REL-000664","type":"part_of","from":"MDL-000095","to":"PRD-000088","basis":"derived"},{"id":"REL-000665","type":"classified_as","from":"MDL-000095","to":"EQP-A01.03","basis":"source","source_ids":["SRC-000317","SRC-000349"]},{"id":"REL-000666","type":"used_in","from":"MDL-000095","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000667","type":"uses_technology","from":"MDL-000095","to":"TEC-003","basis":"derived","via":"equipment category"},{"id":"REL-000668","type":"supports_application","from":"MDL-000095","to":"APP-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000317","SRC-000349"]},{"id":"REL-000669","type":"supports_application","from":"MDL-000095","to":"APP-005","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000317","SRC-000349"]},{"id":"REL-000670","type":"manufactures","from":"CMP-000020","to":"MDL-000096","basis":"source","source_ids":["SRC-000318"],"confidence":"HIGH"},{"id":"REL-000671","type":"part_of","from":"MDL-000096","to":"PRD-000088","basis":"derived"},{"id":"REL-000672","type":"classified_as","from":"MDL-000096","to":"EQP-A01.03","basis":"source","source_ids":["SRC-000318"]},{"id":"REL-000673","type":"used_in","from":"MDL-000096","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000674","type":"uses_technology","from":"MDL-000096","to":"TEC-003","basis":"derived","via":"equipment category"},{"id":"REL-000675","type":"manufactures","from":"CMP-000013","to":"MDL-000097","basis":"source","source_ids":["SRC-000192","SRC-000193"],"confidence":"HIGH"},{"id":"REL-000676","type":"part_of","from":"MDL-000097","to":"PRD-000089","basis":"derived"},{"id":"REL-000677","type":"classified_as","from":"MDL-000097","to":"EQP-A01.07","basis":"source","source_ids":["SRC-000192","SRC-000193"]},{"id":"REL-000678","type":"used_in","from":"MDL-000097","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000679","type":"uses_technology","from":"MDL-000097","to":"TEC-007","basis":"derived","via":"equipment category"},{"id":"REL-000680","type":"manufactures","from":"CMP-000107","to":"MDL-000098","basis":"source","source_ids":["SRC-000187"],"confidence":"LOW"},{"id":"REL-000681","type":"part_of","from":"MDL-000098","to":"PRD-000090","basis":"derived"},{"id":"REL-000682","type":"classified_as","from":"MDL-000098","to":"EQP-A01.03","basis":"source","source_ids":["SRC-000187"]},{"id":"REL-000683","type":"used_in","from":"MDL-000098","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000684","type":"uses_technology","from":"MDL-000098","to":"TEC-003","basis":"derived","via":"equipment category"},{"id":"REL-000685","type":"manufactures","from":"CMP-000107","to":"MDL-000099","basis":"source","source_ids":["SRC-000187","SRC-000189"],"confidence":"LOW"},{"id":"REL-000686","type":"part_of","from":"MDL-000099","to":"PRD-000091","basis":"derived"},{"id":"REL-000687","type":"classified_as","from":"MDL-000099","to":"EQP-A01.03","basis":"source","source_ids":["SRC-000187","SRC-000189"]},{"id":"REL-000688","type":"used_in","from":"MDL-000099","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000689","type":"uses_technology","from":"MDL-000099","to":"TEC-003","basis":"derived","via":"equipment category"},{"id":"REL-000690","type":"manufactures","from":"CMP-000024","to":"MDL-000100","basis":"source","source_ids":["SRC-000322","SRC-000345"],"confidence":"HIGH"},{"id":"REL-000691","type":"part_of","from":"MDL-000100","to":"PRD-000092","basis":"derived"},{"id":"REL-000692","type":"classified_as","from":"MDL-000100","to":"EQP-B02","basis":"source","source_ids":["SRC-000322","SRC-000345"]},{"id":"REL-000693","type":"used_in","from":"MDL-000100","to":"PRS-028","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000694","type":"manufactures","from":"CMP-000025","to":"MDL-000101","basis":"source","source_ids":["SRC-000323"],"confidence":"HIGH"},{"id":"REL-000695","type":"part_of","from":"MDL-000101","to":"PRD-000093","basis":"derived"},{"id":"REL-000696","type":"classified_as","from":"MDL-000101","to":"EQP-B07","basis":"source","source_ids":["SRC-000323"]},{"id":"REL-000697","type":"used_in","from":"MDL-000101","to":"PRS-028","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000698","type":"uses_technology","from":"MDL-000101","to":"TEC-006","basis":"derived","via":"equipment category"},{"id":"REL-000699","type":"manufactures","from":"CMP-000032","to":"MDL-000102","basis":"source","source_ids":["SRC-000348"],"confidence":"HIGH"},{"id":"REL-000700","type":"part_of","from":"MDL-000102","to":"PRD-000094","basis":"derived"},{"id":"REL-000701","type":"classified_as","from":"MDL-000102","to":"EQP-A01.02","basis":"source","source_ids":["SRC-000348"]},{"id":"REL-000702","type":"used_in","from":"MDL-000102","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000703","type":"uses_technology","from":"MDL-000102","to":"TEC-082","basis":"source","source_ids":["SRC-000348"],"via":"source-stated laser type"},{"id":"REL-000704","type":"uses_technology","from":"MDL-000102","to":"TEC-002","basis":"derived","via":"equipment category"},{"id":"REL-000705","type":"manufactures","from":"CMP-000002","to":"MDL-000103","basis":"source","source_ids":["SRC-000124"],"confidence":"HIGH"},{"id":"REL-000706","type":"part_of","from":"MDL-000103","to":"PRD-000095","basis":"derived"},{"id":"REL-000707","type":"classified_as","from":"MDL-000103","to":"EQP-A09.02","basis":"source","source_ids":["SRC-000124"]},{"id":"REL-000708","type":"used_in","from":"MDL-000103","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000709","type":"used_in","from":"MDL-000103","to":"PRS-014","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000710","type":"uses_technology","from":"MDL-000103","to":"TEC-016","basis":"derived","via":"equipment category"},{"id":"REL-000711","type":"supports_application","from":"MDL-000103","to":"APP-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000124"]},{"id":"REL-000712","type":"manufactures","from":"CMP-000002","to":"MDL-000104","basis":"source","source_ids":["SRC-000124"],"confidence":"HIGH"},{"id":"REL-000713","type":"part_of","from":"MDL-000104","to":"PRD-000096","basis":"derived"},{"id":"REL-000714","type":"classified_as","from":"MDL-000104","to":"EQP-A09.06","basis":"source","source_ids":["SRC-000124"]},{"id":"REL-000715","type":"used_in","from":"MDL-000104","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000716","type":"used_in","from":"MDL-000104","to":"PRS-015","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000717","type":"uses_technology","from":"MDL-000104","to":"TEC-019","basis":"derived","via":"equipment category"},{"id":"REL-000718","type":"supports_application","from":"MDL-000104","to":"APP-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000124"]},{"id":"REL-000719","type":"supports_application","from":"MDL-000104","to":"APP-005","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000124"]},{"id":"REL-000720","type":"manufactures","from":"CMP-000101","to":"MDL-000105","basis":"source","source_ids":["SRC-000009"],"confidence":"LOW"},{"id":"REL-000721","type":"part_of","from":"MDL-000105","to":"PRD-000097","basis":"derived"},{"id":"REL-000722","type":"classified_as","from":"MDL-000105","to":"EQP-A08.02","basis":"source","source_ids":["SRC-000009"]},{"id":"REL-000723","type":"used_in","from":"MDL-000105","to":"PRS-020","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000724","type":"uses_technology","from":"MDL-000105","to":"TEC-009","basis":"derived","via":"equipment category"},{"id":"REL-000725","type":"supports_application","from":"MDL-000105","to":"APP-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000009"]},{"id":"REL-000726","type":"supports_application","from":"MDL-000105","to":"APP-005","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000009"]},{"id":"REL-000727","type":"manufactures","from":"CMP-000069","to":"MDL-000106","basis":"source","source_ids":["SRC-000174"],"confidence":"LOW"},{"id":"REL-000728","type":"part_of","from":"MDL-000106","to":"PRD-000098","basis":"derived"},{"id":"REL-000729","type":"classified_as","from":"MDL-000106","to":"EQP-A09.06","basis":"source","source_ids":["SRC-000174"]},{"id":"REL-000730","type":"used_in","from":"MDL-000106","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000731","type":"used_in","from":"MDL-000106","to":"PRS-015","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000732","type":"uses_technology","from":"MDL-000106","to":"TEC-019","basis":"derived","via":"equipment category"},{"id":"REL-000733","type":"supports_application","from":"MDL-000106","to":"APP-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000174"]},{"id":"REL-000734","type":"supports_application","from":"MDL-000106","to":"APP-005","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000174"]},{"id":"REL-000735","type":"supports_application","from":"MDL-000106","to":"APP-007","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000174"]},{"id":"REL-000736","type":"manufactures","from":"CMP-000070","to":"MDL-000107","basis":"source","source_ids":["SRC-000175"],"confidence":"LOW"},{"id":"REL-000737","type":"part_of","from":"MDL-000107","to":"PRD-000099","basis":"derived"},{"id":"REL-000738","type":"classified_as","from":"MDL-000107","to":"EQP-A09.06","basis":"source","source_ids":["SRC-000175"]},{"id":"REL-000739","type":"used_in","from":"MDL-000107","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000740","type":"used_in","from":"MDL-000107","to":"PRS-015","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000741","type":"uses_technology","from":"MDL-000107","to":"TEC-019","basis":"derived","via":"equipment category"},{"id":"REL-000742","type":"manufactures","from":"CMP-000103","to":"MDL-000108","basis":"source","source_ids":["SRC-000314"],"confidence":"LOW"},{"id":"REL-000743","type":"part_of","from":"MDL-000108","to":"PRD-000100","basis":"derived"},{"id":"REL-000744","type":"classified_as","from":"MDL-000108","to":"EQP-A09.02","basis":"source","source_ids":["SRC-000314"]},{"id":"REL-000745","type":"used_in","from":"MDL-000108","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000746","type":"used_in","from":"MDL-000108","to":"PRS-014","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000747","type":"uses_technology","from":"MDL-000108","to":"TEC-016","basis":"derived","via":"equipment category"},{"id":"REL-000748","type":"supports_application","from":"MDL-000108","to":"APP-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000314"]},{"id":"REL-000749","type":"supports_application","from":"MDL-000108","to":"APP-005","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000314"]},{"id":"REL-000750","type":"manufactures","from":"CMP-000103","to":"MDL-000109","basis":"source","source_ids":["SRC-000314","SRC-000009"],"confidence":"MEDIUM"},{"id":"REL-000751","type":"part_of","from":"MDL-000109","to":"PRD-000101","basis":"derived"},{"id":"REL-000752","type":"classified_as","from":"MDL-000109","to":"EQP-C17","basis":"source","source_ids":["SRC-000314","SRC-000009"]},{"id":"REL-000753","type":"used_in","from":"MDL-000109","to":"PRS-049","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000754","type":"used_in","from":"MDL-000109","to":"PRS-050","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000755","type":"used_in","from":"MDL-000109","to":"PRS-051","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000756","type":"uses_technology","from":"MDL-000109","to":"TEC-043","basis":"derived","via":"equipment category"},{"id":"REL-000757","type":"supports_application","from":"MDL-000109","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000314","SRC-000009"]},{"id":"REL-000758","type":"manufactures","from":"CMP-000016","to":"MDL-000110","basis":"source","source_ids":["SRC-000081"],"confidence":"HIGH"},{"id":"REL-000759","type":"part_of","from":"MDL-000110","to":"PRD-000102","basis":"derived"},{"id":"REL-000760","type":"classified_as","from":"MDL-000110","to":"EQP-A01","basis":"source","source_ids":["SRC-000081"]},{"id":"REL-000761","type":"used_in","from":"MDL-000110","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000762","type":"supports_material","from":"MDL-000110","to":"MAT-010","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000081"]},{"id":"REL-000763","type":"supports_application","from":"MDL-000110","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000081"]},{"id":"REL-000764","type":"manufactures","from":"CMP-000016","to":"MDL-000111","basis":"source","source_ids":["SRC-000196"],"confidence":"HIGH"},{"id":"REL-000765","type":"part_of","from":"MDL-000111","to":"PRD-000103","basis":"derived"},{"id":"REL-000766","type":"classified_as","from":"MDL-000111","to":"EQP-A28","basis":"source","source_ids":["SRC-000196"]},{"id":"REL-000767","type":"used_in","from":"MDL-000111","to":"PRS-026","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000768","type":"uses_technology","from":"MDL-000111","to":"TEC-035","basis":"derived","via":"equipment category"},{"id":"REL-000769","type":"supports_application","from":"MDL-000111","to":"APP-008","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000196"]},{"id":"REL-000770","type":"supports_application","from":"MDL-000111","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000196"]},{"id":"REL-000771","type":"manufactures","from":"CMP-000016","to":"MDL-000112","basis":"source","source_ids":["SRC-000154"],"confidence":"HIGH"},{"id":"REL-000772","type":"part_of","from":"MDL-000112","to":"PRD-000104","basis":"derived"},{"id":"REL-000773","type":"classified_as","from":"MDL-000112","to":"EQP-A25","basis":"source","source_ids":["SRC-000154"]},{"id":"REL-000774","type":"used_in","from":"MDL-000112","to":"PRS-026","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000775","type":"uses_technology","from":"MDL-000112","to":"TEC-035","basis":"derived","via":"equipment category"},{"id":"REL-000776","type":"supports_application","from":"MDL-000112","to":"APP-008","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000154"]},{"id":"REL-000777","type":"manufactures","from":"CMP-000028","to":"MDL-000113","basis":"source","source_ids":["SRC-000328","SRC-000344"],"confidence":"HIGH"},{"id":"REL-000778","type":"part_of","from":"MDL-000113","to":"PRD-000105","basis":"derived"},{"id":"REL-000779","type":"classified_as","from":"MDL-000113","to":"EQP-A09.01","basis":"source","source_ids":["SRC-000328","SRC-000344"]},{"id":"REL-000780","type":"used_in","from":"MDL-000113","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000781","type":"used_in","from":"MDL-000113","to":"PRS-014","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000782","type":"uses_technology","from":"MDL-000113","to":"TEC-015","basis":"derived","via":"equipment category"},{"id":"REL-000783","type":"supports_material","from":"MDL-000113","to":"MAT-003","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000328","SRC-000344"]},{"id":"REL-000784","type":"supports_material","from":"MDL-000113","to":"MAT-004","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000328","SRC-000344"]},{"id":"REL-000785","type":"supports_application","from":"MDL-000113","to":"APP-011","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000328","SRC-000344"]},{"id":"REL-000786","type":"supports_application","from":"MDL-000113","to":"APP-012","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000328","SRC-000344"]},{"id":"REL-000787","type":"supports_application","from":"MDL-000113","to":"APP-013","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000328","SRC-000344"]},{"id":"REL-000788","type":"manufactures","from":"CMP-000063","to":"MDL-000114","basis":"source","source_ids":["SRC-000294"],"confidence":"HIGH"},{"id":"REL-000789","type":"part_of","from":"MDL-000114","to":"PRD-000106","basis":"derived"},{"id":"REL-000790","type":"classified_as","from":"MDL-000114","to":"EQP-A37","basis":"source","source_ids":["SRC-000294"]},{"id":"REL-000791","type":"used_in","from":"MDL-000114","to":"PRS-058","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000792","type":"manufactures","from":"CMP-000066","to":"MDL-000115","basis":"source","source_ids":["SRC-000300","SRC-000301"],"confidence":"HIGH"},{"id":"REL-000793","type":"part_of","from":"MDL-000115","to":"PRD-000107","basis":"derived"},{"id":"REL-000794","type":"classified_as","from":"MDL-000115","to":"EQP-J02","basis":"source","source_ids":["SRC-000300","SRC-000301"]},{"id":"REL-000795","type":"used_in","from":"MDL-000115","to":"PRS-057","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000796","type":"manufactures","from":"CMP-000184","to":"MDL-000116","basis":"source","source_ids":["SRC-000211"],"confidence":"LOW"},{"id":"REL-000797","type":"part_of","from":"MDL-000116","to":"PRD-000108","basis":"derived"},{"id":"REL-000798","type":"classified_as","from":"MDL-000116","to":"EQP-K01","basis":"source","source_ids":["SRC-000211"]},{"id":"REL-000799","type":"used_in","from":"MDL-000116","to":"PRS-001","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000800","type":"supports_material","from":"MDL-000116","to":"MAT-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000211"]},{"id":"REL-000801","type":"manufactures","from":"CMP-000194","to":"MDL-000117","basis":"source","source_ids":["SRC-000207"],"confidence":"UNVERIFIED"},{"id":"REL-000802","type":"part_of","from":"MDL-000117","to":"PRD-000109","basis":"derived"},{"id":"REL-000803","type":"classified_as","from":"MDL-000117","to":"EQP-K01","basis":"source","source_ids":["SRC-000207"]},{"id":"REL-000804","type":"used_in","from":"MDL-000117","to":"PRS-001","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000805","type":"supports_material","from":"MDL-000117","to":"MAT-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000207"]},{"id":"REL-000806","type":"manufactures","from":"CMP-000195","to":"MDL-000118","basis":"source","source_ids":["SRC-000208"],"confidence":"HIGH"},{"id":"REL-000807","type":"part_of","from":"MDL-000118","to":"PRD-000110","basis":"derived"},{"id":"REL-000808","type":"classified_as","from":"MDL-000118","to":"EQP-C01.02","basis":"source","source_ids":["SRC-000208"]},{"id":"REL-000809","type":"used_in","from":"MDL-000118","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000810","type":"uses_technology","from":"MDL-000118","to":"TEC-060","basis":"source","source_ids":["SRC-000208"],"via":"source-stated laser type"},{"id":"REL-000811","type":"manufactures","from":"CMP-000180","to":"MDL-000119","basis":"source","source_ids":["SRC-000168"],"confidence":"UNVERIFIED"},{"id":"REL-000812","type":"part_of","from":"MDL-000119","to":"PRD-000111","basis":"derived"},{"id":"REL-000813","type":"classified_as","from":"MDL-000119","to":"EQP-A30","basis":"source","source_ids":["SRC-000168"]},{"id":"REL-000814","type":"used_in","from":"MDL-000119","to":"PRS-008","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000815","type":"used_in","from":"MDL-000119","to":"PRS-026","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000816","type":"uses_technology","from":"MDL-000119","to":"TEC-035","basis":"derived","via":"equipment category"},{"id":"REL-000817","type":"manufactures","from":"CMP-000182","to":"MDL-000120","basis":"source","source_ids":["SRC-000171","SRC-000172"],"confidence":"MEDIUM"},{"id":"REL-000818","type":"part_of","from":"MDL-000120","to":"PRD-000112","basis":"derived"},{"id":"REL-000819","type":"classified_as","from":"MDL-000120","to":"EQP-A01.01","basis":"source","source_ids":["SRC-000171","SRC-000172"]},{"id":"REL-000820","type":"used_in","from":"MDL-000120","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000821","type":"uses_technology","from":"MDL-000120","to":"TEC-001","basis":"derived","via":"equipment category"},{"id":"REL-000822","type":"manufactures","from":"CMP-000181","to":"MDL-000121","basis":"source","source_ids":["SRC-000169","SRC-000170"],"confidence":"MEDIUM"},{"id":"REL-000823","type":"part_of","from":"MDL-000121","to":"PRD-000113","basis":"derived"},{"id":"REL-000824","type":"classified_as","from":"MDL-000121","to":"EQP-A01","basis":"source","source_ids":["SRC-000169","SRC-000170"]},{"id":"REL-000825","type":"used_in","from":"MDL-000121","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000826","type":"manufactures","from":"CMP-000149","to":"MDL-000122","basis":"source","source_ids":["SRC-000259"],"confidence":"HIGH"},{"id":"REL-000827","type":"part_of","from":"MDL-000122","to":"PRD-000114","basis":"derived"},{"id":"REL-000828","type":"classified_as","from":"MDL-000122","to":"CMPN-000010","basis":"source","source_ids":["SRC-000259"]},{"id":"REL-000829","type":"uses_technology","from":"MDL-000122","to":"TEC-076","basis":"source","source_ids":["SRC-000259"],"via":"source-stated laser type"},{"id":"REL-000830","type":"uses_technology","from":"MDL-000122","to":"TEC-078","basis":"source","source_ids":["SRC-000259"],"via":"source-stated laser type"},{"id":"REL-000831","type":"manufactures","from":"CMP-000150","to":"MDL-000123","basis":"source","source_ids":["SRC-000264"],"confidence":"HIGH"},{"id":"REL-000832","type":"part_of","from":"MDL-000123","to":"PRD-000115","basis":"derived"},{"id":"REL-000833","type":"classified_as","from":"MDL-000123","to":"CMPN-000010","basis":"source","source_ids":["SRC-000264"]},{"id":"REL-000834","type":"uses_technology","from":"MDL-000123","to":"TEC-076","basis":"source","source_ids":["SRC-000264"],"via":"source-stated laser type"},{"id":"REL-000835","type":"uses_technology","from":"MDL-000123","to":"TEC-078","basis":"source","source_ids":["SRC-000264"],"via":"source-stated laser type"},{"id":"REL-000836","type":"manufactures","from":"CMP-000147","to":"MDL-000124","basis":"source","source_ids":["SRC-000260","SRC-000342","SRC-000343"],"confidence":"HIGH"},{"id":"REL-000837","type":"part_of","from":"MDL-000124","to":"PRD-000116","basis":"derived"},{"id":"REL-000838","type":"classified_as","from":"MDL-000124","to":"CMPN-000010","basis":"source","source_ids":["SRC-000260","SRC-000342","SRC-000343"]},{"id":"REL-000839","type":"uses_technology","from":"MDL-000124","to":"TEC-076","basis":"source","source_ids":["SRC-000260","SRC-000342","SRC-000343"],"via":"source-stated laser type"},{"id":"REL-000840","type":"uses_technology","from":"MDL-000124","to":"TEC-059","basis":"source","source_ids":["SRC-000260","SRC-000342","SRC-000343"],"via":"source-stated laser type"},{"id":"REL-000841","type":"manufactures","from":"CMP-000148","to":"MDL-000125","basis":"source","source_ids":["SRC-000262","SRC-000263"],"confidence":"HIGH"},{"id":"REL-000842","type":"part_of","from":"MDL-000125","to":"PRD-000117","basis":"derived"},{"id":"REL-000843","type":"classified_as","from":"MDL-000125","to":"CMPN-000010","basis":"source","source_ids":["SRC-000262","SRC-000263"]},{"id":"REL-000844","type":"uses_technology","from":"MDL-000125","to":"TEC-076","basis":"source","source_ids":["SRC-000262","SRC-000263"],"via":"source-stated laser type"},{"id":"REL-000845","type":"uses_technology","from":"MDL-000125","to":"TEC-077","basis":"source","source_ids":["SRC-000262","SRC-000263"],"via":"source-stated laser type"},{"id":"REL-000846","type":"uses_technology","from":"MDL-000125","to":"TEC-073","basis":"source","source_ids":["SRC-000262","SRC-000263"],"via":"source-stated laser type"},{"id":"REL-000847","type":"uses_technology","from":"MDL-000125","to":"TEC-074","basis":"source","source_ids":["SRC-000262","SRC-000263"],"via":"source-stated laser type"},{"id":"REL-000848","type":"manufactures","from":"CMP-000146","to":"MDL-000126","basis":"source","source_ids":["SRC-000269"],"confidence":"HIGH"},{"id":"REL-000849","type":"part_of","from":"MDL-000126","to":"PRD-000118","basis":"derived"},{"id":"REL-000850","type":"classified_as","from":"MDL-000126","to":"CMPN-000010","basis":"source","source_ids":["SRC-000269"]},{"id":"REL-000851","type":"uses_technology","from":"MDL-000126","to":"TEC-080","basis":"source","source_ids":["SRC-000269"],"via":"source-stated laser type"},{"id":"REL-000852","type":"uses_technology","from":"MDL-000126","to":"TEC-075","basis":"source","source_ids":["SRC-000269"],"via":"source-stated laser type"},{"id":"REL-000853","type":"manufactures","from":"CMP-000146","to":"MDL-000127","basis":"source","source_ids":["SRC-000270"],"confidence":"HIGH"},{"id":"REL-000854","type":"part_of","from":"MDL-000127","to":"PRD-000119","basis":"derived"},{"id":"REL-000855","type":"classified_as","from":"MDL-000127","to":"CMPN-000016","basis":"source","source_ids":["SRC-000270"]},{"id":"REL-000856","type":"uses_technology","from":"MDL-000127","to":"TEC-059","basis":"source","source_ids":["SRC-000270"],"via":"source-stated laser type"},{"id":"REL-000857","type":"uses_technology","from":"MDL-000127","to":"TEC-073","basis":"source","source_ids":["SRC-000270"],"via":"source-stated laser type"},{"id":"REL-000858","type":"manufactures","from":"CMP-000133","to":"MDL-000128","basis":"source","source_ids":["SRC-000267"],"confidence":"HIGH"},{"id":"REL-000859","type":"part_of","from":"MDL-000128","to":"PRD-000120","basis":"derived"},{"id":"REL-000860","type":"classified_as","from":"MDL-000128","to":"CMPN-000010","basis":"source","source_ids":["SRC-000267"]},{"id":"REL-000861","type":"uses_technology","from":"MDL-000128","to":"TEC-080","basis":"source","source_ids":["SRC-000267"],"via":"source-stated laser type"},{"id":"REL-000862","type":"manufactures","from":"CMP-000134","to":"MDL-000129","basis":"source","source_ids":["SRC-000266"],"confidence":"HIGH"},{"id":"REL-000863","type":"part_of","from":"MDL-000129","to":"PRD-000121","basis":"derived"},{"id":"REL-000864","type":"classified_as","from":"MDL-000129","to":"CMPN-000010","basis":"source","source_ids":["SRC-000266"]},{"id":"REL-000865","type":"uses_technology","from":"MDL-000129","to":"TEC-080","basis":"source","source_ids":["SRC-000266"],"via":"source-stated laser type"},{"id":"REL-000866","type":"uses_technology","from":"MDL-000129","to":"TEC-059","basis":"source","source_ids":["SRC-000266"],"via":"source-stated laser type"},{"id":"REL-000867","type":"manufactures","from":"CMP-000135","to":"MDL-000130","basis":"source","source_ids":["SRC-000265"],"confidence":"HIGH"},{"id":"REL-000868","type":"part_of","from":"MDL-000130","to":"PRD-000122","basis":"derived"},{"id":"REL-000869","type":"classified_as","from":"MDL-000130","to":"CMPN-000010","basis":"source","source_ids":["SRC-000265"]},{"id":"REL-000870","type":"uses_technology","from":"MDL-000130","to":"TEC-073","basis":"source","source_ids":["SRC-000265"],"via":"source-stated laser type"},{"id":"REL-000871","type":"uses_technology","from":"MDL-000130","to":"TEC-077","basis":"source","source_ids":["SRC-000265"],"via":"source-stated laser type"},{"id":"REL-000872","type":"uses_technology","from":"MDL-000130","to":"TEC-078","basis":"source","source_ids":["SRC-000265"],"via":"source-stated laser type"},{"id":"REL-000873","type":"uses_technology","from":"MDL-000130","to":"TEC-081","basis":"source","source_ids":["SRC-000265"],"via":"source-stated laser type"},{"id":"REL-000874","type":"manufactures","from":"CMP-000151","to":"MDL-000131","basis":"source","source_ids":["SRC-000254"],"confidence":"HIGH"},{"id":"REL-000875","type":"part_of","from":"MDL-000131","to":"PRD-000123","basis":"derived"},{"id":"REL-000876","type":"classified_as","from":"MDL-000131","to":"CMPN-000016","basis":"source","source_ids":["SRC-000254"]},{"id":"REL-000877","type":"manufactures","from":"CMP-000151","to":"MDL-000132","basis":"source","source_ids":["SRC-000255"],"confidence":"HIGH"},{"id":"REL-000878","type":"part_of","from":"MDL-000132","to":"PRD-000124","basis":"derived"},{"id":"REL-000879","type":"classified_as","from":"MDL-000132","to":"CMPN-000055","basis":"source","source_ids":["SRC-000255"]},{"id":"REL-000880","type":"manufactures","from":"CMP-000152","to":"MDL-000133","basis":"source","source_ids":["SRC-000251","SRC-000252"],"confidence":"HIGH"},{"id":"REL-000881","type":"part_of","from":"MDL-000133","to":"PRD-000125","basis":"derived"},{"id":"REL-000882","type":"classified_as","from":"MDL-000133","to":"CMPN-000016","basis":"source","source_ids":["SRC-000251","SRC-000252"]},{"id":"REL-000883","type":"manufactures","from":"CMP-000152","to":"MDL-000134","basis":"source","source_ids":["SRC-000253"],"confidence":"HIGH"},{"id":"REL-000884","type":"part_of","from":"MDL-000134","to":"PRD-000126","basis":"derived"},{"id":"REL-000885","type":"classified_as","from":"MDL-000134","to":"CMPN-000017","basis":"source","source_ids":["SRC-000253"]},{"id":"REL-000886","type":"manufactures","from":"CMP-000153","to":"MDL-000135","basis":"source","source_ids":["SRC-000256"],"confidence":"HIGH"},{"id":"REL-000887","type":"part_of","from":"MDL-000135","to":"PRD-000127","basis":"derived"},{"id":"REL-000888","type":"classified_as","from":"MDL-000135","to":"CMPN-000016","basis":"source","source_ids":["SRC-000256"]},{"id":"REL-000889","type":"manufactures","from":"CMP-000136","to":"MDL-000136","basis":"source","source_ids":["SRC-000257","SRC-000258"],"confidence":"HIGH"},{"id":"REL-000890","type":"part_of","from":"MDL-000136","to":"PRD-000128","basis":"derived"},{"id":"REL-000891","type":"classified_as","from":"MDL-000136","to":"CMPN-000016","basis":"source","source_ids":["SRC-000257","SRC-000258"]},{"id":"REL-000892","type":"manufactures","from":"CMP-000154","to":"MDL-000137","basis":"source","source_ids":["SRC-000282"],"confidence":"MEDIUM"},{"id":"REL-000893","type":"part_of","from":"MDL-000137","to":"PRD-000129","basis":"derived"},{"id":"REL-000894","type":"classified_as","from":"MDL-000137","to":"CMPN-000015","basis":"source","source_ids":["SRC-000282"]},{"id":"REL-000895","type":"manufactures","from":"CMP-000155","to":"MDL-000138","basis":"source","source_ids":["SRC-000283"],"confidence":"HIGH"},{"id":"REL-000896","type":"part_of","from":"MDL-000138","to":"PRD-000130","basis":"derived"},{"id":"REL-000897","type":"classified_as","from":"MDL-000138","to":"CMPN-000015","basis":"source","source_ids":["SRC-000283"]},{"id":"REL-000898","type":"manufactures","from":"CMP-000156","to":"MDL-000139","basis":"source","source_ids":["SRC-000293"],"confidence":"HIGH"},{"id":"REL-000899","type":"part_of","from":"MDL-000139","to":"PRD-000131","basis":"derived"},{"id":"REL-000900","type":"classified_as","from":"MDL-000139","to":"CMPN-000017","basis":"source","source_ids":["SRC-000293"]},{"id":"REL-000901","type":"manufactures","from":"CMP-000157","to":"MDL-000140","basis":"source","source_ids":["SRC-000292"],"confidence":"LOW"},{"id":"REL-000902","type":"part_of","from":"MDL-000140","to":"PRD-000132","basis":"derived"},{"id":"REL-000903","type":"classified_as","from":"MDL-000140","to":"CMPN-000018","basis":"source","source_ids":["SRC-000292"]},{"id":"REL-000904","type":"manufactures","from":"CMP-000158","to":"MDL-000141","basis":"source","source_ids":["SRC-000271","SRC-000272"],"confidence":"HIGH"},{"id":"REL-000905","type":"part_of","from":"MDL-000141","to":"PRD-000133","basis":"derived"},{"id":"REL-000906","type":"classified_as","from":"MDL-000141","to":"CMPN-000004","basis":"source","source_ids":["SRC-000271","SRC-000272"]},{"id":"REL-000907","type":"manufactures","from":"CMP-000159","to":"MDL-000142","basis":"source","source_ids":["SRC-000273"],"confidence":"HIGH"},{"id":"REL-000908","type":"part_of","from":"MDL-000142","to":"PRD-000134","basis":"derived"},{"id":"REL-000909","type":"classified_as","from":"MDL-000142","to":"CMPN-000004","basis":"source","source_ids":["SRC-000273"]},{"id":"REL-000910","type":"manufactures","from":"CMP-000160","to":"MDL-000143","basis":"source","source_ids":["SRC-000275"],"confidence":"HIGH"},{"id":"REL-000911","type":"part_of","from":"MDL-000143","to":"PRD-000135","basis":"derived"},{"id":"REL-000912","type":"classified_as","from":"MDL-000143","to":"CMPN-000002","basis":"source","source_ids":["SRC-000275"]},{"id":"REL-000913","type":"manufactures","from":"CMP-000161","to":"MDL-000144","basis":"source","source_ids":["SRC-000276"],"confidence":"HIGH"},{"id":"REL-000914","type":"part_of","from":"MDL-000144","to":"PRD-000136","basis":"derived"},{"id":"REL-000915","type":"classified_as","from":"MDL-000144","to":"CMPN-000003","basis":"source","source_ids":["SRC-000276"]},{"id":"REL-000916","type":"manufactures","from":"CMP-000162","to":"MDL-000145","basis":"source","source_ids":["SRC-000277"],"confidence":"HIGH"},{"id":"REL-000917","type":"part_of","from":"MDL-000145","to":"PRD-000137","basis":"derived"},{"id":"REL-000918","type":"classified_as","from":"MDL-000145","to":"CMPN-000006","basis":"source","source_ids":["SRC-000277"]},{"id":"REL-000919","type":"manufactures","from":"CMP-000163","to":"MDL-000146","basis":"source","source_ids":["SRC-000278","SRC-000279"],"confidence":"HIGH"},{"id":"REL-000920","type":"part_of","from":"MDL-000146","to":"PRD-000138","basis":"derived"},{"id":"REL-000921","type":"classified_as","from":"MDL-000146","to":"CMPN-000022","basis":"source","source_ids":["SRC-000278","SRC-000279"]},{"id":"REL-000922","type":"manufactures","from":"CMP-000164","to":"MDL-000147","basis":"source","source_ids":["SRC-000280"],"confidence":"HIGH"},{"id":"REL-000923","type":"part_of","from":"MDL-000147","to":"PRD-000139","basis":"derived"},{"id":"REL-000924","type":"classified_as","from":"MDL-000147","to":"CMPN-000022","basis":"source","source_ids":["SRC-000280"]},{"id":"REL-000925","type":"manufactures","from":"CMP-000137","to":"MDL-000148","basis":"source","source_ids":["SRC-000281"],"confidence":"HIGH"},{"id":"REL-000926","type":"part_of","from":"MDL-000148","to":"PRD-000140","basis":"derived"},{"id":"REL-000927","type":"classified_as","from":"MDL-000148","to":"CMPN-000022","basis":"source","source_ids":["SRC-000281"]},{"id":"REL-000928","type":"manufactures","from":"CMP-000138","to":"MDL-000149","basis":"source","source_ids":["SRC-000284"],"confidence":"HIGH"},{"id":"REL-000929","type":"part_of","from":"MDL-000149","to":"PRD-000141","basis":"derived"},{"id":"REL-000930","type":"classified_as","from":"MDL-000149","to":"CMPN-000038","basis":"source","source_ids":["SRC-000284"]},{"id":"REL-000931","type":"manufactures","from":"CMP-000166","to":"MDL-000150","basis":"source","source_ids":["SRC-000285"],"confidence":"HIGH"},{"id":"REL-000932","type":"part_of","from":"MDL-000150","to":"PRD-000142","basis":"derived"},{"id":"REL-000933","type":"classified_as","from":"MDL-000150","to":"CMPN-000046","basis":"source","source_ids":["SRC-000285"]},{"id":"REL-000934","type":"manufactures","from":"CMP-000168","to":"MDL-000151","basis":"source","source_ids":["SRC-000286"],"confidence":"HIGH"},{"id":"REL-000935","type":"part_of","from":"MDL-000151","to":"PRD-000143","basis":"derived"},{"id":"REL-000936","type":"classified_as","from":"MDL-000151","to":"EQP-A45","basis":"source","source_ids":["SRC-000286"]},{"id":"REL-000937","type":"used_in","from":"MDL-000151","to":"PRS-059","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000938","type":"manufactures","from":"CMP-000023","to":"MDL-000152","basis":"source","source_ids":["SRC-000346"],"confidence":"HIGH"},{"id":"REL-000939","type":"part_of","from":"MDL-000152","to":"PRD-000144","basis":"derived"},{"id":"REL-000940","type":"classified_as","from":"MDL-000152","to":"EQP-A42","basis":"source","source_ids":["SRC-000346"]},{"id":"REL-000941","type":"used_in","from":"MDL-000152","to":"PRS-059","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000942","type":"manufactures","from":"CMP-000170","to":"MDL-000153","basis":"source","source_ids":["SRC-000290"],"confidence":"HIGH"},{"id":"REL-000943","type":"part_of","from":"MDL-000153","to":"PRD-000145","basis":"derived"},{"id":"REL-000944","type":"classified_as","from":"MDL-000153","to":"CMPN-000031","basis":"source","source_ids":["SRC-000290"]},{"id":"REL-000945","type":"supports_application","from":"MDL-000153","to":"APP-013","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000290"]},{"id":"REL-000946","type":"manufactures","from":"CMP-000171","to":"MDL-000154","basis":"source","source_ids":["SRC-000291"],"confidence":"HIGH"},{"id":"REL-000947","type":"part_of","from":"MDL-000154","to":"PRD-000146","basis":"derived"},{"id":"REL-000948","type":"classified_as","from":"MDL-000154","to":"CMPN-000031","basis":"source","source_ids":["SRC-000291"]},{"id":"REL-000949","type":"supports_application","from":"MDL-000154","to":"APP-013","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000291"]},{"id":"REL-000950","type":"manufactures","from":"CMP-000003","to":"MDL-000532","basis":"source","source_ids":["SRC-000926"],"confidence":"MEDIUM"},{"id":"REL-000951","type":"part_of","from":"MDL-000532","to":"PRD-000147","basis":"derived"},{"id":"REL-000952","type":"classified_as","from":"MDL-000532","to":"EQP-A09.04","basis":"source","source_ids":["SRC-000926"]},{"id":"REL-000953","type":"used_in","from":"MDL-000532","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000954","type":"used_in","from":"MDL-000532","to":"PRS-014","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000955","type":"uses_technology","from":"MDL-000532","to":"TEC-018","basis":"derived","via":"equipment category"},{"id":"REL-000956","type":"manufactures","from":"CMP-000003","to":"MDL-000533","basis":"source","source_ids":["SRC-000927"],"confidence":"MEDIUM"},{"id":"REL-000957","type":"part_of","from":"MDL-000533","to":"PRD-000148","basis":"derived"},{"id":"REL-000958","type":"classified_as","from":"MDL-000533","to":"EQP-A17","basis":"source","source_ids":["SRC-000927"]},{"id":"REL-000959","type":"used_in","from":"MDL-000533","to":"PRS-025","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000960","type":"manufactures","from":"CMP-000003","to":"MDL-000534","basis":"source","source_ids":["SRC-000928"],"confidence":"MEDIUM"},{"id":"REL-000961","type":"part_of","from":"MDL-000534","to":"PRD-000149","basis":"derived"},{"id":"REL-000962","type":"classified_as","from":"MDL-000534","to":"EQP-A09.06","basis":"source","source_ids":["SRC-000928"]},{"id":"REL-000963","type":"used_in","from":"MDL-000534","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000964","type":"used_in","from":"MDL-000534","to":"PRS-015","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000965","type":"uses_technology","from":"MDL-000534","to":"TEC-019","basis":"derived","via":"equipment category"},{"id":"REL-000966","type":"manufactures","from":"CMP-000003","to":"MDL-000535","basis":"source","source_ids":["SRC-000929"],"confidence":"MEDIUM"},{"id":"REL-000967","type":"part_of","from":"MDL-000535","to":"PRD-000150","basis":"derived"},{"id":"REL-000968","type":"classified_as","from":"MDL-000535","to":"EQP-A09.02","basis":"source","source_ids":["SRC-000929"]},{"id":"REL-000969","type":"used_in","from":"MDL-000535","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000970","type":"used_in","from":"MDL-000535","to":"PRS-014","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000971","type":"uses_technology","from":"MDL-000535","to":"TEC-016","basis":"derived","via":"equipment category"},{"id":"REL-000972","type":"supports_application","from":"MDL-000535","to":"APP-007","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000929"]},{"id":"REL-000973","type":"manufactures","from":"CMP-000003","to":"MDL-000536","basis":"source","source_ids":["SRC-000930"],"confidence":"MEDIUM"},{"id":"REL-000974","type":"part_of","from":"MDL-000536","to":"PRD-000151","basis":"derived"},{"id":"REL-000975","type":"classified_as","from":"MDL-000536","to":"EQP-A08.02","basis":"source","source_ids":["SRC-000930"]},{"id":"REL-000976","type":"used_in","from":"MDL-000536","to":"PRS-020","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000977","type":"uses_technology","from":"MDL-000536","to":"TEC-009","basis":"derived","via":"equipment category"},{"id":"REL-000978","type":"manufactures","from":"CMP-000003","to":"MDL-000537","basis":"source","source_ids":["SRC-000931"],"confidence":"MEDIUM"},{"id":"REL-000979","type":"part_of","from":"MDL-000537","to":"PRD-000152","basis":"derived"},{"id":"REL-000980","type":"classified_as","from":"MDL-000537","to":"EQP-A08","basis":"source","source_ids":["SRC-000931"]},{"id":"REL-000981","type":"used_in","from":"MDL-000537","to":"PRS-020","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000982","type":"manufactures","from":"CMP-000002","to":"MDL-000538","basis":"source","source_ids":["SRC-000932"],"confidence":"MEDIUM"},{"id":"REL-000983","type":"part_of","from":"MDL-000538","to":"PRD-000153","basis":"derived"},{"id":"REL-000984","type":"classified_as","from":"MDL-000538","to":"EQP-A08.01","basis":"source","source_ids":["SRC-000932"]},{"id":"REL-000985","type":"used_in","from":"MDL-000538","to":"PRS-020","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000986","type":"uses_technology","from":"MDL-000538","to":"TEC-009","basis":"derived","via":"equipment category"},{"id":"REL-000987","type":"supports_application","from":"MDL-000538","to":"APP-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000932"]},{"id":"REL-000988","type":"supports_application","from":"MDL-000538","to":"APP-006","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000932"]},{"id":"REL-000989","type":"supports_application","from":"MDL-000538","to":"APP-007","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000932"]},{"id":"REL-000990","type":"manufactures","from":"CMP-000002","to":"MDL-000539","basis":"source","source_ids":["SRC-000933"],"confidence":"LOW"},{"id":"REL-000991","type":"part_of","from":"MDL-000539","to":"PRD-000154","basis":"derived"},{"id":"REL-000992","type":"classified_as","from":"MDL-000539","to":"EQP-A09.05","basis":"source","source_ids":["SRC-000933"]},{"id":"REL-000993","type":"used_in","from":"MDL-000539","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000994","type":"used_in","from":"MDL-000539","to":"PRS-014","basis":"derived","via":"equipment category → process reference"},{"id":"REL-000995","type":"uses_technology","from":"MDL-000539","to":"TEC-018","basis":"derived","via":"equipment category"},{"id":"REL-000996","type":"manufactures","from":"CMP-000002","to":"MDL-000540","basis":"source","source_ids":["SRC-000934"],"confidence":"LOW"},{"id":"REL-000997","type":"part_of","from":"MDL-000540","to":"PRD-000155","basis":"derived"},{"id":"REL-000998","type":"classified_as","from":"MDL-000540","to":"EQP-A24","basis":"source","source_ids":["SRC-000934"]},{"id":"REL-000999","type":"used_in","from":"MDL-000540","to":"PRS-027","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001000","type":"uses_technology","from":"MDL-000540","to":"TEC-032","basis":"derived","via":"equipment category"},{"id":"REL-001001","type":"manufactures","from":"CMP-000001","to":"MDL-000541","basis":"source","source_ids":["SRC-000935"],"confidence":"MEDIUM"},{"id":"REL-001002","type":"part_of","from":"MDL-000541","to":"PRD-000156","basis":"derived"},{"id":"REL-001003","type":"classified_as","from":"MDL-000541","to":"EQP-A01.03","basis":"source","source_ids":["SRC-000935"]},{"id":"REL-001004","type":"used_in","from":"MDL-000541","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001005","type":"uses_technology","from":"MDL-000541","to":"TEC-003","basis":"derived","via":"equipment category"},{"id":"REL-001006","type":"manufactures","from":"CMP-000001","to":"MDL-000542","basis":"source","source_ids":["SRC-000936"],"confidence":"MEDIUM"},{"id":"REL-001007","type":"part_of","from":"MDL-000542","to":"PRD-000156","basis":"derived"},{"id":"REL-001008","type":"classified_as","from":"MDL-000542","to":"EQP-A01.03","basis":"source","source_ids":["SRC-000936"]},{"id":"REL-001009","type":"used_in","from":"MDL-000542","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001010","type":"uses_technology","from":"MDL-000542","to":"TEC-003","basis":"derived","via":"equipment category"},{"id":"REL-001011","type":"manufactures","from":"CMP-000001","to":"MDL-000543","basis":"source","source_ids":["SRC-000937"],"confidence":"MEDIUM"},{"id":"REL-001012","type":"part_of","from":"MDL-000543","to":"PRD-000156","basis":"derived"},{"id":"REL-001013","type":"classified_as","from":"MDL-000543","to":"EQP-A01.03","basis":"source","source_ids":["SRC-000937"]},{"id":"REL-001014","type":"used_in","from":"MDL-000543","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001015","type":"uses_technology","from":"MDL-000543","to":"TEC-003","basis":"derived","via":"equipment category"},{"id":"REL-001016","type":"manufactures","from":"CMP-000001","to":"MDL-000544","basis":"source","source_ids":["SRC-000938"],"confidence":"MEDIUM"},{"id":"REL-001017","type":"part_of","from":"MDL-000544","to":"PRD-000157","basis":"derived"},{"id":"REL-001018","type":"classified_as","from":"MDL-000544","to":"EQP-A24","basis":"source","source_ids":["SRC-000938"]},{"id":"REL-001019","type":"used_in","from":"MDL-000544","to":"PRS-027","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001020","type":"uses_technology","from":"MDL-000544","to":"TEC-032","basis":"derived","via":"equipment category"},{"id":"REL-001021","type":"manufactures","from":"CMP-000001","to":"MDL-000545","basis":"source","source_ids":["SRC-000939"],"confidence":"MEDIUM"},{"id":"REL-001022","type":"part_of","from":"MDL-000545","to":"PRD-000157","basis":"derived"},{"id":"REL-001023","type":"classified_as","from":"MDL-000545","to":"EQP-A24","basis":"source","source_ids":["SRC-000939"]},{"id":"REL-001024","type":"used_in","from":"MDL-000545","to":"PRS-027","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001025","type":"uses_technology","from":"MDL-000545","to":"TEC-032","basis":"derived","via":"equipment category"},{"id":"REL-001026","type":"manufactures","from":"CMP-000001","to":"MDL-000546","basis":"source","source_ids":["SRC-000940"],"confidence":"MEDIUM"},{"id":"REL-001027","type":"part_of","from":"MDL-000546","to":"PRD-000157","basis":"derived"},{"id":"REL-001028","type":"classified_as","from":"MDL-000546","to":"EQP-A24","basis":"source","source_ids":["SRC-000940"]},{"id":"REL-001029","type":"used_in","from":"MDL-000546","to":"PRS-027","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001030","type":"uses_technology","from":"MDL-000546","to":"TEC-032","basis":"derived","via":"equipment category"},{"id":"REL-001031","type":"manufactures","from":"CMP-000001","to":"MDL-000547","basis":"source","source_ids":["SRC-000941"],"confidence":"MEDIUM"},{"id":"REL-001032","type":"part_of","from":"MDL-000547","to":"PRD-000157","basis":"derived"},{"id":"REL-001033","type":"classified_as","from":"MDL-000547","to":"EQP-A24","basis":"source","source_ids":["SRC-000941"]},{"id":"REL-001034","type":"used_in","from":"MDL-000547","to":"PRS-027","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001035","type":"uses_technology","from":"MDL-000547","to":"TEC-032","basis":"derived","via":"equipment category"},{"id":"REL-001036","type":"manufactures","from":"CMP-000004","to":"MDL-000548","basis":"source","source_ids":["SRC-000942"],"confidence":"MEDIUM"},{"id":"REL-001037","type":"part_of","from":"MDL-000548","to":"PRD-000158","basis":"derived"},{"id":"REL-001038","type":"classified_as","from":"MDL-000548","to":"EQP-A09","basis":"source","source_ids":["SRC-000942"]},{"id":"REL-001039","type":"used_in","from":"MDL-000548","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001040","type":"supports_application","from":"MDL-000548","to":"APP-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000942"]},{"id":"REL-001041","type":"supports_application","from":"MDL-000548","to":"APP-005","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000942"]},{"id":"REL-001042","type":"manufactures","from":"CMP-000004","to":"MDL-000549","basis":"source","source_ids":["SRC-000943"],"confidence":"MEDIUM"},{"id":"REL-001043","type":"part_of","from":"MDL-000549","to":"PRD-000159","basis":"derived"},{"id":"REL-001044","type":"classified_as","from":"MDL-000549","to":"EQP-A08","basis":"source","source_ids":["SRC-000943"]},{"id":"REL-001045","type":"used_in","from":"MDL-000549","to":"PRS-020","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001046","type":"supports_application","from":"MDL-000549","to":"APP-010","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000943"]},{"id":"REL-001047","type":"manufactures","from":"CMP-000004","to":"MDL-000550","basis":"source","source_ids":["SRC-000944"],"confidence":"MEDIUM"},{"id":"REL-001048","type":"part_of","from":"MDL-000550","to":"PRD-000160","basis":"derived"},{"id":"REL-001049","type":"classified_as","from":"MDL-000550","to":"EQP-A08","basis":"source","source_ids":["SRC-000944"]},{"id":"REL-001050","type":"used_in","from":"MDL-000550","to":"PRS-020","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001051","type":"manufactures","from":"CMP-000022","to":"MDL-000551","basis":"source","source_ids":["SRC-000320"],"confidence":"LOW"},{"id":"REL-001052","type":"part_of","from":"MDL-000551","to":"PRD-000161","basis":"derived"},{"id":"REL-001053","type":"classified_as","from":"MDL-000551","to":"EQP-A09.06","basis":"source","source_ids":["SRC-000320"]},{"id":"REL-001054","type":"used_in","from":"MDL-000551","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001055","type":"used_in","from":"MDL-000551","to":"PRS-015","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001056","type":"uses_technology","from":"MDL-000551","to":"TEC-019","basis":"derived","via":"equipment category"},{"id":"REL-001057","type":"manufactures","from":"CMP-000022","to":"MDL-000552","basis":"source","source_ids":["SRC-000320"],"confidence":"LOW"},{"id":"REL-001058","type":"part_of","from":"MDL-000552","to":"PRD-000161","basis":"derived"},{"id":"REL-001059","type":"classified_as","from":"MDL-000552","to":"EQP-A09","basis":"source","source_ids":["SRC-000320"]},{"id":"REL-001060","type":"used_in","from":"MDL-000552","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001061","type":"manufactures","from":"CMP-000022","to":"MDL-000553","basis":"source","source_ids":["SRC-000320"],"confidence":"LOW"},{"id":"REL-001062","type":"part_of","from":"MDL-000553","to":"PRD-000162","basis":"derived"},{"id":"REL-001063","type":"classified_as","from":"MDL-000553","to":"EQP-A13","basis":"source","source_ids":["SRC-000320"]},{"id":"REL-001064","type":"used_in","from":"MDL-000553","to":"PRS-023","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001065","type":"uses_technology","from":"MDL-000553","to":"TEC-028","basis":"derived","via":"equipment category"},{"id":"REL-001066","type":"manufactures","from":"CMP-000025","to":"MDL-000554","basis":"source","source_ids":["SRC-000945"],"confidence":"MEDIUM"},{"id":"REL-001067","type":"part_of","from":"MDL-000554","to":"PRD-000163","basis":"derived"},{"id":"REL-001068","type":"classified_as","from":"MDL-000554","to":"EQP-B07","basis":"source","source_ids":["SRC-000945"]},{"id":"REL-001069","type":"used_in","from":"MDL-000554","to":"PRS-028","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001070","type":"uses_technology","from":"MDL-000554","to":"TEC-006","basis":"derived","via":"equipment category"},{"id":"REL-001071","type":"manufactures","from":"CMP-000027","to":"MDL-000555","basis":"source","source_ids":["SRC-000946"],"confidence":"MEDIUM"},{"id":"REL-001072","type":"part_of","from":"MDL-000555","to":"PRD-000164","basis":"derived"},{"id":"REL-001073","type":"classified_as","from":"MDL-000555","to":"EQP-B09","basis":"source","source_ids":["SRC-000946"]},{"id":"REL-001074","type":"used_in","from":"MDL-000555","to":"PRS-028","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001075","type":"manufactures","from":"CMP-000051","to":"MDL-000556","basis":"source","source_ids":["SRC-000947"],"confidence":"MEDIUM"},{"id":"REL-001076","type":"part_of","from":"MDL-000556","to":"PRD-000165","basis":"derived"},{"id":"REL-001077","type":"classified_as","from":"MDL-000556","to":"EQP-D21","basis":"source","source_ids":["SRC-000947"]},{"id":"REL-001078","type":"used_in","from":"MDL-000556","to":"PRS-049","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001079","type":"uses_technology","from":"MDL-000556","to":"TEC-050","basis":"derived","via":"equipment category"},{"id":"REL-001080","type":"supports_application","from":"MDL-000556","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000947"]},{"id":"REL-001081","type":"manufactures","from":"CMP-000051","to":"MDL-000557","basis":"source","source_ids":["SRC-000948"],"confidence":"LOW"},{"id":"REL-001082","type":"part_of","from":"MDL-000557","to":"PRD-000165","basis":"derived"},{"id":"REL-001083","type":"classified_as","from":"MDL-000557","to":"EQP-D22","basis":"source","source_ids":["SRC-000948"]},{"id":"REL-001084","type":"used_in","from":"MDL-000557","to":"PRS-049","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001085","type":"uses_technology","from":"MDL-000557","to":"TEC-044","basis":"derived","via":"equipment category"},{"id":"REL-001086","type":"supports_application","from":"MDL-000557","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000948"]},{"id":"REL-001087","type":"manufactures","from":"CMP-000043","to":"MDL-000558","basis":"source","source_ids":["SRC-000949"],"confidence":"MEDIUM"},{"id":"REL-001088","type":"part_of","from":"MDL-000558","to":"PRD-000166","basis":"derived"},{"id":"REL-001089","type":"classified_as","from":"MDL-000558","to":"EQP-D21","basis":"source","source_ids":["SRC-000949"]},{"id":"REL-001090","type":"used_in","from":"MDL-000558","to":"PRS-049","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001091","type":"uses_technology","from":"MDL-000558","to":"TEC-050","basis":"derived","via":"equipment category"},{"id":"REL-001092","type":"supports_application","from":"MDL-000558","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000949"]},{"id":"REL-001093","type":"manufactures","from":"CMP-000052","to":"MDL-000559","basis":"source","source_ids":["SRC-000950"],"confidence":"MEDIUM"},{"id":"REL-001094","type":"part_of","from":"MDL-000559","to":"PRD-000167","basis":"derived"},{"id":"REL-001095","type":"classified_as","from":"MDL-000559","to":"EQP-D12","basis":"source","source_ids":["SRC-000950"]},{"id":"REL-001096","type":"used_in","from":"MDL-000559","to":"PRS-051","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001097","type":"uses_technology","from":"MDL-000559","to":"TEC-043","basis":"derived","via":"equipment category"},{"id":"REL-001098","type":"supports_application","from":"MDL-000559","to":"APP-017","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000950"]},{"id":"REL-001099","type":"supports_application","from":"MDL-000559","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000950"]},{"id":"REL-001100","type":"manufactures","from":"CMP-000046","to":"MDL-000560","basis":"source","source_ids":["SRC-000951"],"confidence":"MEDIUM"},{"id":"REL-001101","type":"part_of","from":"MDL-000560","to":"PRD-000168","basis":"derived"},{"id":"REL-001102","type":"classified_as","from":"MDL-000560","to":"EQP-I01","basis":"source","source_ids":["SRC-000951"]},{"id":"REL-001103","type":"supports_application","from":"MDL-000560","to":"APP-016","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000951"]},{"id":"REL-001104","type":"supports_application","from":"MDL-000560","to":"APP-017","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000951"]},{"id":"REL-001105","type":"manufactures","from":"CMP-000221","to":"MDL-000561","basis":"source","source_ids":["SRC-000952"],"confidence":"MEDIUM"},{"id":"REL-001106","type":"part_of","from":"MDL-000561","to":"PRD-000169","basis":"derived"},{"id":"REL-001107","type":"classified_as","from":"MDL-000561","to":"EQP-D20","basis":"source","source_ids":["SRC-000952"]},{"id":"REL-001108","type":"used_in","from":"MDL-000561","to":"PRS-046","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001109","type":"uses_technology","from":"MDL-000561","to":"TEC-046","basis":"derived","via":"equipment category"},{"id":"REL-001110","type":"supports_application","from":"MDL-000561","to":"APP-008","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000952"]},{"id":"REL-001111","type":"supports_application","from":"MDL-000561","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000952"]},{"id":"REL-001112","type":"manufactures","from":"CMP-000370","to":"MDL-000562","basis":"source","source_ids":["SRC-000953"],"confidence":"MEDIUM"},{"id":"REL-001113","type":"part_of","from":"MDL-000562","to":"PRD-000170","basis":"derived"},{"id":"REL-001114","type":"classified_as","from":"MDL-000562","to":"EQP-L05","basis":"source","source_ids":["SRC-000953"]},{"id":"REL-001115","type":"used_in","from":"MDL-000562","to":"PRS-060","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001116","type":"manufactures","from":"CMP-000370","to":"MDL-000563","basis":"source","source_ids":["SRC-000954"],"confidence":"MEDIUM"},{"id":"REL-001117","type":"part_of","from":"MDL-000563","to":"PRD-000170","basis":"derived"},{"id":"REL-001118","type":"classified_as","from":"MDL-000563","to":"EQP-A44","basis":"source","source_ids":["SRC-000954"]},{"id":"REL-001119","type":"used_in","from":"MDL-000563","to":"PRS-060","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001120","type":"manufactures","from":"CMP-000350","to":"MDL-000564","basis":"source","source_ids":["SRC-000955"],"confidence":"MEDIUM"},{"id":"REL-001121","type":"part_of","from":"MDL-000564","to":"PRD-000171","basis":"derived"},{"id":"REL-001122","type":"classified_as","from":"MDL-000564","to":"EQP-L05","basis":"source","source_ids":["SRC-000955"]},{"id":"REL-001123","type":"used_in","from":"MDL-000564","to":"PRS-060","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001124","type":"manufactures","from":"CMP-000365","to":"MDL-000565","basis":"source","source_ids":["SRC-000918"],"confidence":"MEDIUM"},{"id":"REL-001125","type":"part_of","from":"MDL-000565","to":"PRD-000172","basis":"derived"},{"id":"REL-001126","type":"classified_as","from":"MDL-000565","to":"EQP-J15","basis":"source","source_ids":["SRC-000918"]},{"id":"REL-001127","type":"used_in","from":"MDL-000565","to":"PRS-058","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001128","type":"supports_application","from":"MDL-000565","to":"APP-015","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000918"]},{"id":"REL-001129","type":"manufactures","from":"CMP-000364","to":"MDL-000566","basis":"source","source_ids":["SRC-000917"],"confidence":"LOW"},{"id":"REL-001130","type":"part_of","from":"MDL-000566","to":"PRD-000173","basis":"derived"},{"id":"REL-001131","type":"classified_as","from":"MDL-000566","to":"EQP-J10","basis":"source","source_ids":["SRC-000917"]},{"id":"REL-001132","type":"used_in","from":"MDL-000566","to":"PRS-058","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001133","type":"manufactures","from":"CMP-000363","to":"MDL-000567","basis":"source","source_ids":["SRC-000956"],"confidence":"MEDIUM"},{"id":"REL-001134","type":"part_of","from":"MDL-000567","to":"PRD-000174","basis":"derived"},{"id":"REL-001135","type":"classified_as","from":"MDL-000567","to":"EQP-A34","basis":"source","source_ids":["SRC-000956"]},{"id":"REL-001136","type":"used_in","from":"MDL-000567","to":"PRS-057","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001137","type":"manufactures","from":"CMP-000362","to":"MDL-000568","basis":"source","source_ids":["SRC-000957"],"confidence":"LOW"},{"id":"REL-001138","type":"part_of","from":"MDL-000568","to":"PRD-000175","basis":"derived"},{"id":"REL-001139","type":"classified_as","from":"MDL-000568","to":"EQP-A45","basis":"source","source_ids":["SRC-000957"]},{"id":"REL-001140","type":"used_in","from":"MDL-000568","to":"PRS-059","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001141","type":"manufactures","from":"CMP-000007","to":"MDL-000155","basis":"source","source_ids":["SRC-000355"],"confidence":"MEDIUM"},{"id":"REL-001142","type":"part_of","from":"MDL-000155","to":"PRD-000176","basis":"derived"},{"id":"REL-001143","type":"classified_as","from":"MDL-000155","to":"EQP-A04","basis":"source","source_ids":["SRC-000355"]},{"id":"REL-001144","type":"used_in","from":"MDL-000155","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001145","type":"uses_technology","from":"MDL-000155","to":"TEC-030","basis":"derived","via":"equipment category"},{"id":"REL-001146","type":"manufactures","from":"CMP-000007","to":"MDL-000156","basis":"source","source_ids":["SRC-000356"],"confidence":"MEDIUM"},{"id":"REL-001147","type":"part_of","from":"MDL-000156","to":"PRD-000176","basis":"derived"},{"id":"REL-001148","type":"classified_as","from":"MDL-000156","to":"EQP-A04","basis":"source","source_ids":["SRC-000356"]},{"id":"REL-001149","type":"used_in","from":"MDL-000156","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001150","type":"uses_technology","from":"MDL-000156","to":"TEC-030","basis":"derived","via":"equipment category"},{"id":"REL-001151","type":"manufactures","from":"CMP-000007","to":"MDL-000157","basis":"source","source_ids":["SRC-000357"],"confidence":"MEDIUM"},{"id":"REL-001152","type":"part_of","from":"MDL-000157","to":"PRD-000177","basis":"derived"},{"id":"REL-001153","type":"classified_as","from":"MDL-000157","to":"EQP-A20","basis":"source","source_ids":["SRC-000357"]},{"id":"REL-001154","type":"used_in","from":"MDL-000157","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001155","type":"uses_technology","from":"MDL-000157","to":"TEC-030","basis":"derived","via":"equipment category"},{"id":"REL-001156","type":"manufactures","from":"CMP-000007","to":"MDL-000158","basis":"source","source_ids":["SRC-000358"],"confidence":"MEDIUM"},{"id":"REL-001157","type":"part_of","from":"MDL-000158","to":"PRD-000177","basis":"derived"},{"id":"REL-001158","type":"classified_as","from":"MDL-000158","to":"EQP-A20","basis":"source","source_ids":["SRC-000358"]},{"id":"REL-001159","type":"used_in","from":"MDL-000158","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001160","type":"uses_technology","from":"MDL-000158","to":"TEC-030","basis":"derived","via":"equipment category"},{"id":"REL-001161","type":"manufactures","from":"CMP-000007","to":"MDL-000159","basis":"source","source_ids":["SRC-000359"],"confidence":"MEDIUM"},{"id":"REL-001162","type":"part_of","from":"MDL-000159","to":"PRD-000178","basis":"derived"},{"id":"REL-001163","type":"classified_as","from":"MDL-000159","to":"EQP-A05","basis":"source","source_ids":["SRC-000359"]},{"id":"REL-001164","type":"used_in","from":"MDL-000159","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001165","type":"used_in","from":"MDL-000159","to":"PRS-021","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001166","type":"uses_technology","from":"MDL-000159","to":"TEC-030","basis":"derived","via":"equipment category"},{"id":"REL-001167","type":"manufactures","from":"CMP-000007","to":"MDL-000160","basis":"source","source_ids":["SRC-000360"],"confidence":"MEDIUM"},{"id":"REL-001168","type":"part_of","from":"MDL-000160","to":"PRD-000179","basis":"derived"},{"id":"REL-001169","type":"classified_as","from":"MDL-000160","to":"EQP-A03","basis":"source","source_ids":["SRC-000360"]},{"id":"REL-001170","type":"used_in","from":"MDL-000160","to":"PRS-017","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001171","type":"used_in","from":"MDL-000160","to":"PRS-019","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001172","type":"manufactures","from":"CMP-000007","to":"MDL-000161","basis":"source","source_ids":["SRC-000361"],"confidence":"MEDIUM"},{"id":"REL-001173","type":"part_of","from":"MDL-000161","to":"PRD-000179","basis":"derived"},{"id":"REL-001174","type":"classified_as","from":"MDL-000161","to":"EQP-A03","basis":"source","source_ids":["SRC-000361"]},{"id":"REL-001175","type":"used_in","from":"MDL-000161","to":"PRS-017","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001176","type":"used_in","from":"MDL-000161","to":"PRS-019","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001177","type":"supports_application","from":"MDL-000161","to":"APP-013","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000361"]},{"id":"REL-001178","type":"manufactures","from":"CMP-000007","to":"MDL-000162","basis":"source","source_ids":["SRC-000362"],"confidence":"MEDIUM"},{"id":"REL-001179","type":"part_of","from":"MDL-000162","to":"PRD-000180","basis":"derived"},{"id":"REL-001180","type":"classified_as","from":"MDL-000162","to":"EQP-A13","basis":"source","source_ids":["SRC-000362"]},{"id":"REL-001181","type":"used_in","from":"MDL-000162","to":"PRS-023","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001182","type":"uses_technology","from":"MDL-000162","to":"TEC-028","basis":"derived","via":"equipment category"},{"id":"REL-001183","type":"manufactures","from":"CMP-000007","to":"MDL-000163","basis":"source","source_ids":["SRC-000363"],"confidence":"MEDIUM"},{"id":"REL-001184","type":"part_of","from":"MDL-000163","to":"PRD-000181","basis":"derived"},{"id":"REL-001185","type":"classified_as","from":"MDL-000163","to":"EQP-A01.08","basis":"source","source_ids":["SRC-000363"]},{"id":"REL-001186","type":"used_in","from":"MDL-000163","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001187","type":"used_in","from":"MDL-000163","to":"PRS-045","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001188","type":"used_in","from":"MDL-000163","to":"PRS-047","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001189","type":"uses_technology","from":"MDL-000163","to":"TEC-008","basis":"derived","via":"equipment category"},{"id":"REL-001190","type":"supports_application","from":"MDL-000163","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000363"]},{"id":"REL-001191","type":"manufactures","from":"CMP-000104","to":"MDL-000164","basis":"source","source_ids":["SRC-000364"],"confidence":"MEDIUM"},{"id":"REL-001192","type":"part_of","from":"MDL-000164","to":"PRD-000182","basis":"derived"},{"id":"REL-001193","type":"classified_as","from":"MDL-000164","to":"EQP-A04","basis":"source","source_ids":["SRC-000364"]},{"id":"REL-001194","type":"used_in","from":"MDL-000164","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001195","type":"uses_technology","from":"MDL-000164","to":"TEC-030","basis":"derived","via":"equipment category"},{"id":"REL-001196","type":"manufactures","from":"CMP-000104","to":"MDL-000165","basis":"source","source_ids":["SRC-000365"],"confidence":"MEDIUM"},{"id":"REL-001197","type":"part_of","from":"MDL-000165","to":"PRD-000183","basis":"derived"},{"id":"REL-001198","type":"classified_as","from":"MDL-000165","to":"EQP-A04","basis":"source","source_ids":["SRC-000365"]},{"id":"REL-001199","type":"used_in","from":"MDL-000165","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001200","type":"uses_technology","from":"MDL-000165","to":"TEC-030","basis":"derived","via":"equipment category"},{"id":"REL-001201","type":"manufactures","from":"CMP-000104","to":"MDL-000166","basis":"source","source_ids":["SRC-000366"],"confidence":"MEDIUM"},{"id":"REL-001202","type":"part_of","from":"MDL-000166","to":"PRD-000184","basis":"derived"},{"id":"REL-001203","type":"classified_as","from":"MDL-000166","to":"EQP-A20","basis":"source","source_ids":["SRC-000366"]},{"id":"REL-001204","type":"used_in","from":"MDL-000166","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001205","type":"uses_technology","from":"MDL-000166","to":"TEC-030","basis":"derived","via":"equipment category"},{"id":"REL-001206","type":"manufactures","from":"CMP-000104","to":"MDL-000167","basis":"source","source_ids":["SRC-000367"],"confidence":"MEDIUM"},{"id":"REL-001207","type":"part_of","from":"MDL-000167","to":"PRD-000185","basis":"derived"},{"id":"REL-001208","type":"classified_as","from":"MDL-000167","to":"EQP-A04","basis":"source","source_ids":["SRC-000367"]},{"id":"REL-001209","type":"used_in","from":"MDL-000167","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001210","type":"uses_technology","from":"MDL-000167","to":"TEC-030","basis":"derived","via":"equipment category"},{"id":"REL-001211","type":"supports_material","from":"MDL-000167","to":"MAT-003","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000367"]},{"id":"REL-001212","type":"supports_application","from":"MDL-000167","to":"APP-011","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000367"]},{"id":"REL-001213","type":"manufactures","from":"CMP-000104","to":"MDL-000168","basis":"source","source_ids":["SRC-000368"],"confidence":"MEDIUM"},{"id":"REL-001214","type":"part_of","from":"MDL-000168","to":"PRD-000186","basis":"derived"},{"id":"REL-001215","type":"classified_as","from":"MDL-000168","to":"EQP-A11","basis":"source","source_ids":["SRC-000368"]},{"id":"REL-001216","type":"used_in","from":"MDL-000168","to":"PRS-011","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001217","type":"used_in","from":"MDL-000168","to":"PRS-012","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001218","type":"uses_technology","from":"MDL-000168","to":"TEC-027","basis":"derived","via":"equipment category"},{"id":"REL-001219","type":"manufactures","from":"CMP-000104","to":"MDL-000169","basis":"source","source_ids":["SRC-000369"],"confidence":"MEDIUM"},{"id":"REL-001220","type":"part_of","from":"MDL-000169","to":"PRD-000187","basis":"derived"},{"id":"REL-001221","type":"classified_as","from":"MDL-000169","to":"EQP-A18","basis":"source","source_ids":["SRC-000369"]},{"id":"REL-001222","type":"used_in","from":"MDL-000169","to":"PRS-025","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001223","type":"used_in","from":"MDL-000169","to":"PRS-043","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001224","type":"used_in","from":"MDL-000169","to":"PRS-045","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001225","type":"used_in","from":"MDL-000169","to":"PRS-046","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001226","type":"used_in","from":"MDL-000169","to":"PRS-047","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001227","type":"uses_technology","from":"MDL-000169","to":"TEC-025","basis":"derived","via":"equipment category"},{"id":"REL-001228","type":"supports_application","from":"MDL-000169","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000369"]},{"id":"REL-001229","type":"manufactures","from":"CMP-000104","to":"MDL-000170","basis":"source","source_ids":["SRC-000370"],"confidence":"MEDIUM"},{"id":"REL-001230","type":"part_of","from":"MDL-000170","to":"PRD-000188","basis":"derived"},{"id":"REL-001231","type":"classified_as","from":"MDL-000170","to":"EQP-A18","basis":"source","source_ids":["SRC-000370"]},{"id":"REL-001232","type":"used_in","from":"MDL-000170","to":"PRS-025","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001233","type":"used_in","from":"MDL-000170","to":"PRS-043","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001234","type":"used_in","from":"MDL-000170","to":"PRS-045","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001235","type":"used_in","from":"MDL-000170","to":"PRS-046","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001236","type":"used_in","from":"MDL-000170","to":"PRS-047","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001237","type":"uses_technology","from":"MDL-000170","to":"TEC-025","basis":"derived","via":"equipment category"},{"id":"REL-001238","type":"supports_application","from":"MDL-000170","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000370"]},{"id":"REL-001239","type":"manufactures","from":"CMP-000002","to":"MDL-000171","basis":"source","source_ids":["SRC-000371"],"confidence":"MEDIUM"},{"id":"REL-001240","type":"part_of","from":"MDL-000171","to":"PRD-000189","basis":"derived"},{"id":"REL-001241","type":"classified_as","from":"MDL-000171","to":"EQP-A09.07","basis":"source","source_ids":["SRC-000371"]},{"id":"REL-001242","type":"used_in","from":"MDL-000171","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001243","type":"used_in","from":"MDL-000171","to":"PRS-016","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001244","type":"uses_technology","from":"MDL-000171","to":"TEC-020","basis":"derived","via":"equipment category"},{"id":"REL-001245","type":"manufactures","from":"CMP-000002","to":"MDL-000172","basis":"source","source_ids":["SRC-000372"],"confidence":"MEDIUM"},{"id":"REL-001246","type":"part_of","from":"MDL-000172","to":"PRD-000189","basis":"derived"},{"id":"REL-001247","type":"classified_as","from":"MDL-000172","to":"EQP-A09.07","basis":"source","source_ids":["SRC-000372"]},{"id":"REL-001248","type":"used_in","from":"MDL-000172","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001249","type":"used_in","from":"MDL-000172","to":"PRS-016","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001250","type":"uses_technology","from":"MDL-000172","to":"TEC-020","basis":"derived","via":"equipment category"},{"id":"REL-001251","type":"manufactures","from":"CMP-000002","to":"MDL-000173","basis":"source","source_ids":["SRC-000373"],"confidence":"MEDIUM"},{"id":"REL-001252","type":"part_of","from":"MDL-000173","to":"PRD-000190","basis":"derived"},{"id":"REL-001253","type":"classified_as","from":"MDL-000173","to":"EQP-A19","basis":"source","source_ids":["SRC-000373"]},{"id":"REL-001254","type":"used_in","from":"MDL-000173","to":"PRS-024","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001255","type":"uses_technology","from":"MDL-000173","to":"TEC-029","basis":"derived","via":"equipment category"},{"id":"REL-001256","type":"manufactures","from":"CMP-000002","to":"MDL-000174","basis":"source","source_ids":["SRC-000374"],"confidence":"MEDIUM"},{"id":"REL-001257","type":"part_of","from":"MDL-000174","to":"PRD-000190","basis":"derived"},{"id":"REL-001258","type":"classified_as","from":"MDL-000174","to":"EQP-A19","basis":"source","source_ids":["SRC-000374"]},{"id":"REL-001259","type":"used_in","from":"MDL-000174","to":"PRS-024","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001260","type":"uses_technology","from":"MDL-000174","to":"TEC-029","basis":"derived","via":"equipment category"},{"id":"REL-001261","type":"manufactures","from":"CMP-000002","to":"MDL-000175","basis":"source","source_ids":["SRC-000375"],"confidence":"MEDIUM"},{"id":"REL-001262","type":"part_of","from":"MDL-000175","to":"PRD-000191","basis":"derived"},{"id":"REL-001263","type":"classified_as","from":"MDL-000175","to":"EQP-A10","basis":"source","source_ids":["SRC-000375"]},{"id":"REL-001264","type":"used_in","from":"MDL-000175","to":"PRS-022","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001265","type":"uses_technology","from":"MDL-000175","to":"TEC-026","basis":"derived","via":"equipment category"},{"id":"REL-001266","type":"manufactures","from":"CMP-000002","to":"MDL-000176","basis":"source","source_ids":["SRC-000376"],"confidence":"MEDIUM"},{"id":"REL-001267","type":"part_of","from":"MDL-000176","to":"PRD-000191","basis":"derived"},{"id":"REL-001268","type":"classified_as","from":"MDL-000176","to":"EQP-A10","basis":"source","source_ids":["SRC-000376"]},{"id":"REL-001269","type":"used_in","from":"MDL-000176","to":"PRS-022","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001270","type":"uses_technology","from":"MDL-000176","to":"TEC-026","basis":"derived","via":"equipment category"},{"id":"REL-001271","type":"manufactures","from":"CMP-000002","to":"MDL-000177","basis":"source","source_ids":["SRC-000377"],"confidence":"MEDIUM"},{"id":"REL-001272","type":"part_of","from":"MDL-000177","to":"PRD-000191","basis":"derived"},{"id":"REL-001273","type":"classified_as","from":"MDL-000177","to":"EQP-A10","basis":"source","source_ids":["SRC-000377"]},{"id":"REL-001274","type":"used_in","from":"MDL-000177","to":"PRS-022","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001275","type":"uses_technology","from":"MDL-000177","to":"TEC-026","basis":"derived","via":"equipment category"},{"id":"REL-001276","type":"manufactures","from":"CMP-000002","to":"MDL-000178","basis":"source","source_ids":["SRC-000378"],"confidence":"MEDIUM"},{"id":"REL-001277","type":"part_of","from":"MDL-000178","to":"PRD-000191","basis":"derived"},{"id":"REL-001278","type":"classified_as","from":"MDL-000178","to":"EQP-A10","basis":"source","source_ids":["SRC-000378"]},{"id":"REL-001279","type":"used_in","from":"MDL-000178","to":"PRS-022","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001280","type":"uses_technology","from":"MDL-000178","to":"TEC-026","basis":"derived","via":"equipment category"},{"id":"REL-001281","type":"manufactures","from":"CMP-000015","to":"MDL-000179","basis":"source","source_ids":["SRC-000379"],"confidence":"MEDIUM"},{"id":"REL-001282","type":"part_of","from":"MDL-000179","to":"PRD-000192","basis":"derived"},{"id":"REL-001283","type":"classified_as","from":"MDL-000179","to":"EQP-A10","basis":"source","source_ids":["SRC-000379"]},{"id":"REL-001284","type":"used_in","from":"MDL-000179","to":"PRS-022","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001285","type":"uses_technology","from":"MDL-000179","to":"TEC-026","basis":"derived","via":"equipment category"},{"id":"REL-001286","type":"manufactures","from":"CMP-000015","to":"MDL-000180","basis":"source","source_ids":["SRC-000380"],"confidence":"MEDIUM"},{"id":"REL-001287","type":"part_of","from":"MDL-000180","to":"PRD-000192","basis":"derived"},{"id":"REL-001288","type":"classified_as","from":"MDL-000180","to":"EQP-A10","basis":"source","source_ids":["SRC-000380"]},{"id":"REL-001289","type":"used_in","from":"MDL-000180","to":"PRS-022","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001290","type":"uses_technology","from":"MDL-000180","to":"TEC-026","basis":"derived","via":"equipment category"},{"id":"REL-001291","type":"manufactures","from":"CMP-000015","to":"MDL-000181","basis":"source","source_ids":["SRC-000381"],"confidence":"MEDIUM"},{"id":"REL-001292","type":"part_of","from":"MDL-000181","to":"PRD-000192","basis":"derived"},{"id":"REL-001293","type":"classified_as","from":"MDL-000181","to":"EQP-A10","basis":"source","source_ids":["SRC-000381"]},{"id":"REL-001294","type":"used_in","from":"MDL-000181","to":"PRS-022","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001295","type":"uses_technology","from":"MDL-000181","to":"TEC-026","basis":"derived","via":"equipment category"},{"id":"REL-001296","type":"manufactures","from":"CMP-000015","to":"MDL-000182","basis":"source","source_ids":["SRC-000382"],"confidence":"MEDIUM"},{"id":"REL-001297","type":"part_of","from":"MDL-000182","to":"PRD-000192","basis":"derived"},{"id":"REL-001298","type":"classified_as","from":"MDL-000182","to":"EQP-A10","basis":"source","source_ids":["SRC-000382"]},{"id":"REL-001299","type":"used_in","from":"MDL-000182","to":"PRS-022","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001300","type":"uses_technology","from":"MDL-000182","to":"TEC-026","basis":"derived","via":"equipment category"},{"id":"REL-001301","type":"manufactures","from":"CMP-000003","to":"MDL-000183","basis":"source","source_ids":["SRC-000383"],"confidence":"MEDIUM"},{"id":"REL-001302","type":"part_of","from":"MDL-000183","to":"PRD-000193","basis":"derived"},{"id":"REL-001303","type":"classified_as","from":"MDL-000183","to":"EQP-A18","basis":"source","source_ids":["SRC-000383"]},{"id":"REL-001304","type":"used_in","from":"MDL-000183","to":"PRS-025","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001305","type":"used_in","from":"MDL-000183","to":"PRS-043","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001306","type":"used_in","from":"MDL-000183","to":"PRS-045","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001307","type":"used_in","from":"MDL-000183","to":"PRS-046","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001308","type":"used_in","from":"MDL-000183","to":"PRS-047","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001309","type":"uses_technology","from":"MDL-000183","to":"TEC-025","basis":"derived","via":"equipment category"},{"id":"REL-001310","type":"supports_application","from":"MDL-000183","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000383"]},{"id":"REL-001311","type":"manufactures","from":"CMP-000003","to":"MDL-000184","basis":"source","source_ids":["SRC-000384"],"confidence":"MEDIUM"},{"id":"REL-001312","type":"part_of","from":"MDL-000184","to":"PRD-000194","basis":"derived"},{"id":"REL-001313","type":"classified_as","from":"MDL-000184","to":"EQP-A07","basis":"source","source_ids":["SRC-000384"]},{"id":"REL-001314","type":"used_in","from":"MDL-000184","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001315","type":"used_in","from":"MDL-000184","to":"PRS-021","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001316","type":"manufactures","from":"CMP-000071","to":"MDL-000185","basis":"source","source_ids":["SRC-000385"],"confidence":"MEDIUM"},{"id":"REL-001317","type":"part_of","from":"MDL-000185","to":"PRD-000195","basis":"derived"},{"id":"REL-001318","type":"classified_as","from":"MDL-000185","to":"EQP-A07","basis":"source","source_ids":["SRC-000385"]},{"id":"REL-001319","type":"used_in","from":"MDL-000185","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001320","type":"used_in","from":"MDL-000185","to":"PRS-021","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001321","type":"manufactures","from":"CMP-000004","to":"MDL-000186","basis":"source","source_ids":["SRC-000386"],"confidence":"MEDIUM"},{"id":"REL-001322","type":"part_of","from":"MDL-000186","to":"PRD-000196","basis":"derived"},{"id":"REL-001323","type":"classified_as","from":"MDL-000186","to":"EQP-A02","basis":"source","source_ids":["SRC-000386"]},{"id":"REL-001324","type":"used_in","from":"MDL-000186","to":"PRS-017","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001325","type":"used_in","from":"MDL-000186","to":"PRS-019","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001326","type":"manufactures","from":"CMP-000004","to":"MDL-000187","basis":"source","source_ids":["SRC-000387"],"confidence":"MEDIUM"},{"id":"REL-001327","type":"part_of","from":"MDL-000187","to":"PRD-000197","basis":"derived"},{"id":"REL-001328","type":"classified_as","from":"MDL-000187","to":"EQP-A02","basis":"source","source_ids":["SRC-000387"]},{"id":"REL-001329","type":"used_in","from":"MDL-000187","to":"PRS-017","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001330","type":"used_in","from":"MDL-000187","to":"PRS-019","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001331","type":"manufactures","from":"CMP-000004","to":"MDL-000188","basis":"source","source_ids":["SRC-000388"],"confidence":"MEDIUM"},{"id":"REL-001332","type":"part_of","from":"MDL-000188","to":"PRD-000198","basis":"derived"},{"id":"REL-001333","type":"classified_as","from":"MDL-000188","to":"EQP-A02","basis":"source","source_ids":["SRC-000388"]},{"id":"REL-001334","type":"used_in","from":"MDL-000188","to":"PRS-017","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001335","type":"used_in","from":"MDL-000188","to":"PRS-019","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001336","type":"manufactures","from":"CMP-000004","to":"MDL-000189","basis":"source","source_ids":["SRC-000389"],"confidence":"MEDIUM"},{"id":"REL-001337","type":"part_of","from":"MDL-000189","to":"PRD-000199","basis":"derived"},{"id":"REL-001338","type":"classified_as","from":"MDL-000189","to":"EQP-A11","basis":"source","source_ids":["SRC-000389"]},{"id":"REL-001339","type":"used_in","from":"MDL-000189","to":"PRS-011","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001340","type":"used_in","from":"MDL-000189","to":"PRS-012","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001341","type":"uses_technology","from":"MDL-000189","to":"TEC-027","basis":"derived","via":"equipment category"},{"id":"REL-001342","type":"manufactures","from":"CMP-000004","to":"MDL-000190","basis":"source","source_ids":["SRC-000390"],"confidence":"MEDIUM"},{"id":"REL-001343","type":"part_of","from":"MDL-000190","to":"PRD-000200","basis":"derived"},{"id":"REL-001344","type":"classified_as","from":"MDL-000190","to":"EQP-A04","basis":"source","source_ids":["SRC-000390"]},{"id":"REL-001345","type":"used_in","from":"MDL-000190","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001346","type":"uses_technology","from":"MDL-000190","to":"TEC-030","basis":"derived","via":"equipment category"},{"id":"REL-001347","type":"manufactures","from":"CMP-000004","to":"MDL-000191","basis":"source","source_ids":["SRC-000391"],"confidence":"MEDIUM"},{"id":"REL-001348","type":"part_of","from":"MDL-000191","to":"PRD-000200","basis":"derived"},{"id":"REL-001349","type":"classified_as","from":"MDL-000191","to":"EQP-A04","basis":"source","source_ids":["SRC-000391"]},{"id":"REL-001350","type":"used_in","from":"MDL-000191","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001351","type":"uses_technology","from":"MDL-000191","to":"TEC-030","basis":"derived","via":"equipment category"},{"id":"REL-001352","type":"manufactures","from":"CMP-000004","to":"MDL-000192","basis":"source","source_ids":["SRC-000392"],"confidence":"MEDIUM"},{"id":"REL-001353","type":"part_of","from":"MDL-000192","to":"PRD-000200","basis":"derived"},{"id":"REL-001354","type":"classified_as","from":"MDL-000192","to":"EQP-A04","basis":"source","source_ids":["SRC-000392"]},{"id":"REL-001355","type":"used_in","from":"MDL-000192","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001356","type":"uses_technology","from":"MDL-000192","to":"TEC-030","basis":"derived","via":"equipment category"},{"id":"REL-001357","type":"manufactures","from":"CMP-000004","to":"MDL-000193","basis":"source","source_ids":["SRC-000393"],"confidence":"MEDIUM"},{"id":"REL-001358","type":"part_of","from":"MDL-000193","to":"PRD-000201","basis":"derived"},{"id":"REL-001359","type":"classified_as","from":"MDL-000193","to":"EQP-A06","basis":"source","source_ids":["SRC-000393"]},{"id":"REL-001360","type":"used_in","from":"MDL-000193","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001361","type":"manufactures","from":"CMP-000004","to":"MDL-000194","basis":"source","source_ids":["SRC-000394"],"confidence":"MEDIUM"},{"id":"REL-001362","type":"part_of","from":"MDL-000194","to":"PRD-000202","basis":"derived"},{"id":"REL-001363","type":"classified_as","from":"MDL-000194","to":"EQP-A15","basis":"source","source_ids":["SRC-000394"]},{"id":"REL-001364","type":"uses_technology","from":"MDL-000194","to":"TEC-068","basis":"source","source_ids":["SRC-000394"],"via":"source-stated laser type"},{"id":"REL-001365","type":"uses_technology","from":"MDL-000194","to":"TEC-072","basis":"derived","via":"equipment category"},{"id":"REL-001366","type":"supports_application","from":"MDL-000194","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000394"]},{"id":"REL-001367","type":"manufactures","from":"CMP-000004","to":"MDL-000195","basis":"source","source_ids":["SRC-000395"],"confidence":"MEDIUM"},{"id":"REL-001368","type":"part_of","from":"MDL-000195","to":"PRD-000202","basis":"derived"},{"id":"REL-001369","type":"classified_as","from":"MDL-000195","to":"EQP-A15","basis":"source","source_ids":["SRC-000395"]},{"id":"REL-001370","type":"uses_technology","from":"MDL-000195","to":"TEC-072","basis":"derived","via":"equipment category"},{"id":"REL-001371","type":"supports_application","from":"MDL-000195","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000395"]},{"id":"REL-001372","type":"manufactures","from":"CMP-000004","to":"MDL-000196","basis":"source","source_ids":["SRC-000396"],"confidence":"MEDIUM"},{"id":"REL-001373","type":"part_of","from":"MDL-000196","to":"PRD-000203","basis":"derived"},{"id":"REL-001374","type":"classified_as","from":"MDL-000196","to":"EQP-C18","basis":"source","source_ids":["SRC-000396"]},{"id":"REL-001375","type":"used_in","from":"MDL-000196","to":"PRS-051","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001376","type":"used_in","from":"MDL-000196","to":"PRS-052","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001377","type":"uses_technology","from":"MDL-000196","to":"TEC-044","basis":"derived","via":"equipment category"},{"id":"REL-001378","type":"supports_application","from":"MDL-000196","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000396"]},{"id":"REL-001379","type":"manufactures","from":"CMP-000023","to":"MDL-000197","basis":"source","source_ids":["SRC-000397"],"confidence":"MEDIUM"},{"id":"REL-001380","type":"part_of","from":"MDL-000197","to":"PRD-000204","basis":"derived"},{"id":"REL-001381","type":"classified_as","from":"MDL-000197","to":"EQP-A19","basis":"source","source_ids":["SRC-000397"]},{"id":"REL-001382","type":"used_in","from":"MDL-000197","to":"PRS-024","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001383","type":"uses_technology","from":"MDL-000197","to":"TEC-029","basis":"derived","via":"equipment category"},{"id":"REL-001384","type":"manufactures","from":"CMP-000023","to":"MDL-000198","basis":"source","source_ids":["SRC-000398"],"confidence":"MEDIUM"},{"id":"REL-001385","type":"part_of","from":"MDL-000198","to":"PRD-000204","basis":"derived"},{"id":"REL-001386","type":"classified_as","from":"MDL-000198","to":"EQP-A19","basis":"source","source_ids":["SRC-000398"]},{"id":"REL-001387","type":"used_in","from":"MDL-000198","to":"PRS-024","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001388","type":"uses_technology","from":"MDL-000198","to":"TEC-029","basis":"derived","via":"equipment category"},{"id":"REL-001389","type":"manufactures","from":"CMP-000023","to":"MDL-000199","basis":"source","source_ids":["SRC-000399"],"confidence":"MEDIUM"},{"id":"REL-001390","type":"part_of","from":"MDL-000199","to":"PRD-000205","basis":"derived"},{"id":"REL-001391","type":"classified_as","from":"MDL-000199","to":"EQP-A42","basis":"source","source_ids":["SRC-000399"]},{"id":"REL-001392","type":"used_in","from":"MDL-000199","to":"PRS-059","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001393","type":"manufactures","from":"CMP-000023","to":"MDL-000200","basis":"source","source_ids":["SRC-000400"],"confidence":"MEDIUM"},{"id":"REL-001394","type":"part_of","from":"MDL-000200","to":"PRD-000206","basis":"derived"},{"id":"REL-001395","type":"classified_as","from":"MDL-000200","to":"EQP-A45","basis":"source","source_ids":["SRC-000400"]},{"id":"REL-001396","type":"used_in","from":"MDL-000200","to":"PRS-059","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001397","type":"manufactures","from":"CMP-000010","to":"MDL-000201","basis":"source","source_ids":["SRC-000401"],"confidence":"MEDIUM"},{"id":"REL-001398","type":"part_of","from":"MDL-000201","to":"PRD-000207","basis":"derived"},{"id":"REL-001399","type":"classified_as","from":"MDL-000201","to":"EQP-C04","basis":"source","source_ids":["SRC-000401"]},{"id":"REL-001400","type":"used_in","from":"MDL-000201","to":"PRS-030","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001401","type":"manufactures","from":"CMP-000010","to":"MDL-000202","basis":"source","source_ids":["SRC-000402"],"confidence":"MEDIUM"},{"id":"REL-001402","type":"part_of","from":"MDL-000202","to":"PRD-000207","basis":"derived"},{"id":"REL-001403","type":"classified_as","from":"MDL-000202","to":"EQP-C04","basis":"source","source_ids":["SRC-000402"]},{"id":"REL-001404","type":"used_in","from":"MDL-000202","to":"PRS-030","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001405","type":"manufactures","from":"CMP-000010","to":"MDL-000203","basis":"source","source_ids":["SRC-000403"],"confidence":"MEDIUM"},{"id":"REL-001406","type":"part_of","from":"MDL-000203","to":"PRD-000208","basis":"derived"},{"id":"REL-001407","type":"classified_as","from":"MDL-000203","to":"EQP-C03","basis":"source","source_ids":["SRC-000403"]},{"id":"REL-001408","type":"used_in","from":"MDL-000203","to":"PRS-030","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001409","type":"manufactures","from":"CMP-000010","to":"MDL-000204","basis":"source","source_ids":["SRC-000404"],"confidence":"MEDIUM"},{"id":"REL-001410","type":"part_of","from":"MDL-000204","to":"PRD-000208","basis":"derived"},{"id":"REL-001411","type":"classified_as","from":"MDL-000204","to":"EQP-C03","basis":"source","source_ids":["SRC-000404"]},{"id":"REL-001412","type":"used_in","from":"MDL-000204","to":"PRS-030","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001413","type":"manufactures","from":"CMP-000010","to":"MDL-000205","basis":"source","source_ids":["SRC-000405"],"confidence":"MEDIUM"},{"id":"REL-001414","type":"part_of","from":"MDL-000205","to":"PRD-000209","basis":"derived"},{"id":"REL-001415","type":"classified_as","from":"MDL-000205","to":"EQP-C06","basis":"source","source_ids":["SRC-000405"]},{"id":"REL-001416","type":"used_in","from":"MDL-000205","to":"PRS-031","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001417","type":"manufactures","from":"CMP-000010","to":"MDL-000206","basis":"source","source_ids":["SRC-000406"],"confidence":"MEDIUM"},{"id":"REL-001418","type":"part_of","from":"MDL-000206","to":"PRD-000209","basis":"derived"},{"id":"REL-001419","type":"classified_as","from":"MDL-000206","to":"EQP-C06","basis":"source","source_ids":["SRC-000406"]},{"id":"REL-001420","type":"used_in","from":"MDL-000206","to":"PRS-031","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001421","type":"manufactures","from":"CMP-000012","to":"MDL-000207","basis":"source","source_ids":["SRC-000407"],"confidence":"MEDIUM"},{"id":"REL-001422","type":"part_of","from":"MDL-000207","to":"PRD-000210","basis":"derived"},{"id":"REL-001423","type":"classified_as","from":"MDL-000207","to":"EQP-C04","basis":"source","source_ids":["SRC-000407"]},{"id":"REL-001424","type":"used_in","from":"MDL-000207","to":"PRS-030","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001425","type":"manufactures","from":"CMP-000012","to":"MDL-000208","basis":"source","source_ids":["SRC-000408"],"confidence":"MEDIUM"},{"id":"REL-001426","type":"part_of","from":"MDL-000208","to":"PRD-000211","basis":"derived"},{"id":"REL-001427","type":"classified_as","from":"MDL-000208","to":"EQP-C03","basis":"source","source_ids":["SRC-000408"]},{"id":"REL-001428","type":"used_in","from":"MDL-000208","to":"PRS-030","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001429","type":"manufactures","from":"CMP-000012","to":"MDL-000209","basis":"source","source_ids":["SRC-000409"],"confidence":"MEDIUM"},{"id":"REL-001430","type":"part_of","from":"MDL-000209","to":"PRD-000211","basis":"derived"},{"id":"REL-001431","type":"classified_as","from":"MDL-000209","to":"EQP-C02","basis":"source","source_ids":["SRC-000409"]},{"id":"REL-001432","type":"used_in","from":"MDL-000209","to":"PRS-030","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001433","type":"manufactures","from":"CMP-000012","to":"MDL-000210","basis":"source","source_ids":["SRC-000410"],"confidence":"MEDIUM"},{"id":"REL-001434","type":"part_of","from":"MDL-000210","to":"PRD-000212","basis":"derived"},{"id":"REL-001435","type":"classified_as","from":"MDL-000210","to":"EQP-K06","basis":"source","source_ids":["SRC-000410"]},{"id":"REL-001436","type":"used_in","from":"MDL-000210","to":"PRS-005","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001437","type":"manufactures","from":"CMP-000012","to":"MDL-000211","basis":"source","source_ids":["SRC-000411"],"confidence":"MEDIUM"},{"id":"REL-001438","type":"part_of","from":"MDL-000211","to":"PRD-000212","basis":"derived"},{"id":"REL-001439","type":"classified_as","from":"MDL-000211","to":"EQP-K06","basis":"source","source_ids":["SRC-000411"]},{"id":"REL-001440","type":"used_in","from":"MDL-000211","to":"PRS-005","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001441","type":"manufactures","from":"CMP-000059","to":"MDL-000212","basis":"source","source_ids":["SRC-000412"],"confidence":"MEDIUM"},{"id":"REL-001442","type":"part_of","from":"MDL-000212","to":"PRD-000213","basis":"derived"},{"id":"REL-001443","type":"classified_as","from":"MDL-000212","to":"EQP-C03","basis":"source","source_ids":["SRC-000412"]},{"id":"REL-001444","type":"used_in","from":"MDL-000212","to":"PRS-030","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001445","type":"manufactures","from":"CMP-000008","to":"MDL-000213","basis":"source","source_ids":["SRC-000413"],"confidence":"MEDIUM"},{"id":"REL-001446","type":"part_of","from":"MDL-000213","to":"PRD-000214","basis":"derived"},{"id":"REL-001447","type":"classified_as","from":"MDL-000213","to":"EQP-C40","basis":"source","source_ids":["SRC-000413"]},{"id":"REL-001448","type":"used_in","from":"MDL-000213","to":"PRS-041","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001449","type":"uses_technology","from":"MDL-000213","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-001450","type":"manufactures","from":"CMP-000008","to":"MDL-000214","basis":"source","source_ids":["SRC-000414"],"confidence":"MEDIUM"},{"id":"REL-001451","type":"part_of","from":"MDL-000214","to":"PRD-000214","basis":"derived"},{"id":"REL-001452","type":"classified_as","from":"MDL-000214","to":"EQP-C40","basis":"source","source_ids":["SRC-000414"]},{"id":"REL-001453","type":"used_in","from":"MDL-000214","to":"PRS-041","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001454","type":"uses_technology","from":"MDL-000214","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-001455","type":"manufactures","from":"CMP-000008","to":"MDL-000215","basis":"source","source_ids":["SRC-000415"],"confidence":"MEDIUM"},{"id":"REL-001456","type":"part_of","from":"MDL-000215","to":"PRD-000214","basis":"derived"},{"id":"REL-001457","type":"classified_as","from":"MDL-000215","to":"EQP-C40","basis":"source","source_ids":["SRC-000415"]},{"id":"REL-001458","type":"used_in","from":"MDL-000215","to":"PRS-041","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001459","type":"uses_technology","from":"MDL-000215","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-001460","type":"supports_application","from":"MDL-000215","to":"APP-009","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000415"]},{"id":"REL-001461","type":"manufactures","from":"CMP-000009","to":"MDL-000216","basis":"source","source_ids":["SRC-000416"],"confidence":"MEDIUM"},{"id":"REL-001462","type":"part_of","from":"MDL-000216","to":"PRD-000215","basis":"derived"},{"id":"REL-001463","type":"classified_as","from":"MDL-000216","to":"EQP-C40","basis":"source","source_ids":["SRC-000416"]},{"id":"REL-001464","type":"used_in","from":"MDL-000216","to":"PRS-041","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001465","type":"uses_technology","from":"MDL-000216","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-001466","type":"manufactures","from":"CMP-000009","to":"MDL-000217","basis":"source","source_ids":["SRC-000417"],"confidence":"MEDIUM"},{"id":"REL-001467","type":"part_of","from":"MDL-000217","to":"PRD-000215","basis":"derived"},{"id":"REL-001468","type":"classified_as","from":"MDL-000217","to":"EQP-C40","basis":"source","source_ids":["SRC-000417"]},{"id":"REL-001469","type":"used_in","from":"MDL-000217","to":"PRS-041","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001470","type":"uses_technology","from":"MDL-000217","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-001471","type":"manufactures","from":"CMP-000009","to":"MDL-000218","basis":"source","source_ids":["SRC-000418"],"confidence":"MEDIUM"},{"id":"REL-001472","type":"part_of","from":"MDL-000218","to":"PRD-000216","basis":"derived"},{"id":"REL-001473","type":"classified_as","from":"MDL-000218","to":"EQP-C40","basis":"source","source_ids":["SRC-000418"]},{"id":"REL-001474","type":"used_in","from":"MDL-000218","to":"PRS-041","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001475","type":"uses_technology","from":"MDL-000218","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-001476","type":"manufactures","from":"CMP-000037","to":"MDL-000219","basis":"source","source_ids":["SRC-000419"],"confidence":"MEDIUM"},{"id":"REL-001477","type":"part_of","from":"MDL-000219","to":"PRD-000217","basis":"derived"},{"id":"REL-001478","type":"classified_as","from":"MDL-000219","to":"EQP-C40","basis":"source","source_ids":["SRC-000419"]},{"id":"REL-001479","type":"used_in","from":"MDL-000219","to":"PRS-041","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001480","type":"uses_technology","from":"MDL-000219","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-001481","type":"supports_application","from":"MDL-000219","to":"APP-009","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000419"]},{"id":"REL-001482","type":"manufactures","from":"CMP-000005","to":"MDL-000220","basis":"source","source_ids":["SRC-000420"],"confidence":"MEDIUM"},{"id":"REL-001483","type":"part_of","from":"MDL-000220","to":"PRD-000218","basis":"derived"},{"id":"REL-001484","type":"classified_as","from":"MDL-000220","to":"EQP-A21","basis":"source","source_ids":["SRC-000420"]},{"id":"REL-001485","type":"used_in","from":"MDL-000220","to":"PRS-027","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001486","type":"uses_technology","from":"MDL-000220","to":"TEC-031","basis":"derived","via":"equipment category"},{"id":"REL-001487","type":"manufactures","from":"CMP-000005","to":"MDL-000221","basis":"source","source_ids":["SRC-000421"],"confidence":"MEDIUM"},{"id":"REL-001488","type":"part_of","from":"MDL-000221","to":"PRD-000218","basis":"derived"},{"id":"REL-001489","type":"classified_as","from":"MDL-000221","to":"EQP-A21","basis":"source","source_ids":["SRC-000421"]},{"id":"REL-001490","type":"used_in","from":"MDL-000221","to":"PRS-027","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001491","type":"uses_technology","from":"MDL-000221","to":"TEC-031","basis":"derived","via":"equipment category"},{"id":"REL-001492","type":"supports_application","from":"MDL-000221","to":"APP-020","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000421"]},{"id":"REL-001493","type":"manufactures","from":"CMP-000005","to":"MDL-000222","basis":"source","source_ids":["SRC-000422"],"confidence":"MEDIUM"},{"id":"REL-001494","type":"part_of","from":"MDL-000222","to":"PRD-000219","basis":"derived"},{"id":"REL-001495","type":"classified_as","from":"MDL-000222","to":"EQP-A30","basis":"source","source_ids":["SRC-000422"]},{"id":"REL-001496","type":"used_in","from":"MDL-000222","to":"PRS-008","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001497","type":"used_in","from":"MDL-000222","to":"PRS-026","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001498","type":"uses_technology","from":"MDL-000222","to":"TEC-035","basis":"derived","via":"equipment category"},{"id":"REL-001499","type":"manufactures","from":"CMP-000005","to":"MDL-000223","basis":"source","source_ids":["SRC-000423"],"confidence":"MEDIUM"},{"id":"REL-001500","type":"part_of","from":"MDL-000223","to":"PRD-000220","basis":"derived"},{"id":"REL-001501","type":"classified_as","from":"MDL-000223","to":"EQP-A22","basis":"source","source_ids":["SRC-000423"]},{"id":"REL-001502","type":"used_in","from":"MDL-000223","to":"PRS-027","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001503","type":"uses_technology","from":"MDL-000223","to":"TEC-031","basis":"derived","via":"equipment category"},{"id":"REL-001504","type":"manufactures","from":"CMP-000005","to":"MDL-000224","basis":"source","source_ids":["SRC-000424"],"confidence":"MEDIUM"},{"id":"REL-001505","type":"part_of","from":"MDL-000224","to":"PRD-000221","basis":"derived"},{"id":"REL-001506","type":"classified_as","from":"MDL-000224","to":"EQP-C34","basis":"source","source_ids":["SRC-000424"]},{"id":"REL-001507","type":"used_in","from":"MDL-000224","to":"PRS-040","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001508","type":"manufactures","from":"CMP-000005","to":"MDL-000225","basis":"source","source_ids":["SRC-000425"],"confidence":"MEDIUM"},{"id":"REL-001509","type":"part_of","from":"MDL-000225","to":"PRD-000221","basis":"derived"},{"id":"REL-001510","type":"classified_as","from":"MDL-000225","to":"EQP-C34","basis":"source","source_ids":["SRC-000425"]},{"id":"REL-001511","type":"used_in","from":"MDL-000225","to":"PRS-040","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001512","type":"manufactures","from":"CMP-000005","to":"MDL-000226","basis":"source","source_ids":["SRC-000426"],"confidence":"MEDIUM"},{"id":"REL-001513","type":"part_of","from":"MDL-000226","to":"PRD-000221","basis":"derived"},{"id":"REL-001514","type":"classified_as","from":"MDL-000226","to":"EQP-C34","basis":"source","source_ids":["SRC-000426"]},{"id":"REL-001515","type":"used_in","from":"MDL-000226","to":"PRS-040","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001516","type":"manufactures","from":"CMP-000005","to":"MDL-000227","basis":"source","source_ids":["SRC-000427"],"confidence":"MEDIUM"},{"id":"REL-001517","type":"part_of","from":"MDL-000227","to":"PRD-000221","basis":"derived"},{"id":"REL-001518","type":"classified_as","from":"MDL-000227","to":"EQP-C34","basis":"source","source_ids":["SRC-000427"]},{"id":"REL-001519","type":"used_in","from":"MDL-000227","to":"PRS-040","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001520","type":"manufactures","from":"CMP-000005","to":"MDL-000228","basis":"source","source_ids":["SRC-000427"],"confidence":"MEDIUM"},{"id":"REL-001521","type":"part_of","from":"MDL-000228","to":"PRD-000222","basis":"derived"},{"id":"REL-001522","type":"classified_as","from":"MDL-000228","to":"EQP-A21","basis":"source","source_ids":["SRC-000427"]},{"id":"REL-001523","type":"used_in","from":"MDL-000228","to":"PRS-027","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001524","type":"uses_technology","from":"MDL-000228","to":"TEC-031","basis":"derived","via":"equipment category"},{"id":"REL-001525","type":"manufactures","from":"CMP-000005","to":"MDL-000229","basis":"source","source_ids":["SRC-000428"],"confidence":"MEDIUM"},{"id":"REL-001526","type":"part_of","from":"MDL-000229","to":"PRD-000223","basis":"derived"},{"id":"REL-001527","type":"classified_as","from":"MDL-000229","to":"EQP-A08.05","basis":"source","source_ids":["SRC-000428"]},{"id":"REL-001528","type":"used_in","from":"MDL-000229","to":"PRS-020","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001529","type":"used_in","from":"MDL-000229","to":"PRS-043","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001530","type":"uses_technology","from":"MDL-000229","to":"TEC-012","basis":"derived","via":"equipment category"},{"id":"REL-001531","type":"supports_material","from":"MDL-000229","to":"MAT-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000428"]},{"id":"REL-001532","type":"supports_application","from":"MDL-000229","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000428"]},{"id":"REL-001533","type":"manufactures","from":"CMP-000021","to":"MDL-000230","basis":"source","source_ids":["SRC-000429"],"confidence":"MEDIUM"},{"id":"REL-001534","type":"part_of","from":"MDL-000230","to":"PRD-000224","basis":"derived"},{"id":"REL-001535","type":"classified_as","from":"MDL-000230","to":"EQP-A22","basis":"source","source_ids":["SRC-000429"]},{"id":"REL-001536","type":"used_in","from":"MDL-000230","to":"PRS-027","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001537","type":"uses_technology","from":"MDL-000230","to":"TEC-031","basis":"derived","via":"equipment category"},{"id":"REL-001538","type":"manufactures","from":"CMP-000021","to":"MDL-000231","basis":"source","source_ids":["SRC-000430"],"confidence":"MEDIUM"},{"id":"REL-001539","type":"part_of","from":"MDL-000231","to":"PRD-000224","basis":"derived"},{"id":"REL-001540","type":"classified_as","from":"MDL-000231","to":"EQP-A22","basis":"source","source_ids":["SRC-000430"]},{"id":"REL-001541","type":"used_in","from":"MDL-000231","to":"PRS-027","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001542","type":"uses_technology","from":"MDL-000231","to":"TEC-031","basis":"derived","via":"equipment category"},{"id":"REL-001543","type":"manufactures","from":"CMP-000021","to":"MDL-000232","basis":"source","source_ids":["SRC-000431"],"confidence":"MEDIUM"},{"id":"REL-001544","type":"part_of","from":"MDL-000232","to":"PRD-000225","basis":"derived"},{"id":"REL-001545","type":"classified_as","from":"MDL-000232","to":"EQP-A26","basis":"source","source_ids":["SRC-000431"]},{"id":"REL-001546","type":"used_in","from":"MDL-000232","to":"PRS-026","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001547","type":"uses_technology","from":"MDL-000232","to":"TEC-034","basis":"derived","via":"equipment category"},{"id":"REL-001548","type":"manufactures","from":"CMP-000021","to":"MDL-000233","basis":"source","source_ids":["SRC-000432"],"confidence":"MEDIUM"},{"id":"REL-001549","type":"part_of","from":"MDL-000233","to":"PRD-000225","basis":"derived"},{"id":"REL-001550","type":"classified_as","from":"MDL-000233","to":"EQP-A26","basis":"source","source_ids":["SRC-000432"]},{"id":"REL-001551","type":"used_in","from":"MDL-000233","to":"PRS-026","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001552","type":"uses_technology","from":"MDL-000233","to":"TEC-034","basis":"derived","via":"equipment category"},{"id":"REL-001553","type":"manufactures","from":"CMP-000021","to":"MDL-000234","basis":"source","source_ids":["SRC-000433"],"confidence":"MEDIUM"},{"id":"REL-001554","type":"part_of","from":"MDL-000234","to":"PRD-000225","basis":"derived"},{"id":"REL-001555","type":"classified_as","from":"MDL-000234","to":"EQP-A26","basis":"source","source_ids":["SRC-000433"]},{"id":"REL-001556","type":"used_in","from":"MDL-000234","to":"PRS-026","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001557","type":"uses_technology","from":"MDL-000234","to":"TEC-034","basis":"derived","via":"equipment category"},{"id":"REL-001558","type":"manufactures","from":"CMP-000021","to":"MDL-000235","basis":"source","source_ids":["SRC-000434"],"confidence":"MEDIUM"},{"id":"REL-001559","type":"part_of","from":"MDL-000235","to":"PRD-000226","basis":"derived"},{"id":"REL-001560","type":"classified_as","from":"MDL-000235","to":"EQP-A24","basis":"source","source_ids":["SRC-000434"]},{"id":"REL-001561","type":"used_in","from":"MDL-000235","to":"PRS-027","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001562","type":"uses_technology","from":"MDL-000235","to":"TEC-032","basis":"derived","via":"equipment category"},{"id":"REL-001563","type":"manufactures","from":"CMP-000016","to":"MDL-000236","basis":"source","source_ids":["SRC-000435"],"confidence":"MEDIUM"},{"id":"REL-001564","type":"part_of","from":"MDL-000236","to":"PRD-000227","basis":"derived"},{"id":"REL-001565","type":"classified_as","from":"MDL-000236","to":"EQP-A21","basis":"source","source_ids":["SRC-000435"]},{"id":"REL-001566","type":"used_in","from":"MDL-000236","to":"PRS-027","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001567","type":"uses_technology","from":"MDL-000236","to":"TEC-031","basis":"derived","via":"equipment category"},{"id":"REL-001568","type":"supports_application","from":"MDL-000236","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000435"]},{"id":"REL-001569","type":"manufactures","from":"CMP-000016","to":"MDL-000237","basis":"source","source_ids":["SRC-000436"],"confidence":"MEDIUM"},{"id":"REL-001570","type":"part_of","from":"MDL-000237","to":"PRD-000228","basis":"derived"},{"id":"REL-001571","type":"classified_as","from":"MDL-000237","to":"EQP-C36","basis":"source","source_ids":["SRC-000436"]},{"id":"REL-001572","type":"used_in","from":"MDL-000237","to":"PRS-040","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001573","type":"uses_technology","from":"MDL-000237","to":"TEC-031","basis":"derived","via":"equipment category"},{"id":"REL-001574","type":"manufactures","from":"CMP-000016","to":"MDL-000238","basis":"source","source_ids":["SRC-000437"],"confidence":"MEDIUM"},{"id":"REL-001575","type":"part_of","from":"MDL-000238","to":"PRD-000229","basis":"derived"},{"id":"REL-001576","type":"classified_as","from":"MDL-000238","to":"EQP-A01","basis":"source","source_ids":["SRC-000437"]},{"id":"REL-001577","type":"used_in","from":"MDL-000238","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001578","type":"supports_application","from":"MDL-000238","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000437"]},{"id":"REL-001579","type":"manufactures","from":"CMP-000016","to":"MDL-000239","basis":"source","source_ids":["SRC-000438"],"confidence":"MEDIUM"},{"id":"REL-001580","type":"part_of","from":"MDL-000239","to":"PRD-000229","basis":"derived"},{"id":"REL-001581","type":"classified_as","from":"MDL-000239","to":"EQP-A01","basis":"source","source_ids":["SRC-000438"]},{"id":"REL-001582","type":"used_in","from":"MDL-000239","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001583","type":"supports_application","from":"MDL-000239","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000438"]},{"id":"REL-001584","type":"manufactures","from":"CMP-000018","to":"MDL-000240","basis":"source","source_ids":["SRC-000439"],"confidence":"MEDIUM"},{"id":"REL-001585","type":"part_of","from":"MDL-000240","to":"PRD-000230","basis":"derived"},{"id":"REL-001586","type":"classified_as","from":"MDL-000240","to":"EQP-A21","basis":"source","source_ids":["SRC-000439"]},{"id":"REL-001587","type":"used_in","from":"MDL-000240","to":"PRS-027","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001588","type":"uses_technology","from":"MDL-000240","to":"TEC-031","basis":"derived","via":"equipment category"},{"id":"REL-001589","type":"supports_application","from":"MDL-000240","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000439"]},{"id":"REL-001590","type":"manufactures","from":"CMP-000018","to":"MDL-000241","basis":"source","source_ids":["SRC-000440"],"confidence":"MEDIUM"},{"id":"REL-001591","type":"part_of","from":"MDL-000241","to":"PRD-000230","basis":"derived"},{"id":"REL-001592","type":"classified_as","from":"MDL-000241","to":"EQP-A21","basis":"source","source_ids":["SRC-000440"]},{"id":"REL-001593","type":"used_in","from":"MDL-000241","to":"PRS-027","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001594","type":"uses_technology","from":"MDL-000241","to":"TEC-031","basis":"derived","via":"equipment category"},{"id":"REL-001595","type":"supports_application","from":"MDL-000241","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000440"]},{"id":"REL-001596","type":"manufactures","from":"CMP-000018","to":"MDL-000242","basis":"source","source_ids":["SRC-000441"],"confidence":"MEDIUM"},{"id":"REL-001597","type":"part_of","from":"MDL-000242","to":"PRD-000230","basis":"derived"},{"id":"REL-001598","type":"classified_as","from":"MDL-000242","to":"EQP-A21","basis":"source","source_ids":["SRC-000441"]},{"id":"REL-001599","type":"used_in","from":"MDL-000242","to":"PRS-027","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001600","type":"uses_technology","from":"MDL-000242","to":"TEC-031","basis":"derived","via":"equipment category"},{"id":"REL-001601","type":"manufactures","from":"CMP-000018","to":"MDL-000243","basis":"source","source_ids":["SRC-000442"],"confidence":"MEDIUM"},{"id":"REL-001602","type":"part_of","from":"MDL-000243","to":"PRD-000231","basis":"derived"},{"id":"REL-001603","type":"classified_as","from":"MDL-000243","to":"EQP-A30","basis":"source","source_ids":["SRC-000442"]},{"id":"REL-001604","type":"used_in","from":"MDL-000243","to":"PRS-008","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001605","type":"used_in","from":"MDL-000243","to":"PRS-026","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001606","type":"uses_technology","from":"MDL-000243","to":"TEC-035","basis":"derived","via":"equipment category"},{"id":"REL-001607","type":"manufactures","from":"CMP-000018","to":"MDL-000244","basis":"source","source_ids":["SRC-000443"],"confidence":"MEDIUM"},{"id":"REL-001608","type":"part_of","from":"MDL-000244","to":"PRD-000232","basis":"derived"},{"id":"REL-001609","type":"classified_as","from":"MDL-000244","to":"EQP-A21","basis":"source","source_ids":["SRC-000443"]},{"id":"REL-001610","type":"used_in","from":"MDL-000244","to":"PRS-027","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001611","type":"uses_technology","from":"MDL-000244","to":"TEC-031","basis":"derived","via":"equipment category"},{"id":"REL-001612","type":"manufactures","from":"CMP-000041","to":"MDL-000245","basis":"source","source_ids":["SRC-000444"],"confidence":"MEDIUM"},{"id":"REL-001613","type":"part_of","from":"MDL-000245","to":"PRD-000233","basis":"derived"},{"id":"REL-001614","type":"classified_as","from":"MDL-000245","to":"EQP-C34","basis":"source","source_ids":["SRC-000444"]},{"id":"REL-001615","type":"used_in","from":"MDL-000245","to":"PRS-040","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001616","type":"manufactures","from":"CMP-000041","to":"MDL-000246","basis":"source","source_ids":["SRC-000445"],"confidence":"MEDIUM"},{"id":"REL-001617","type":"part_of","from":"MDL-000246","to":"PRD-000233","basis":"derived"},{"id":"REL-001618","type":"classified_as","from":"MDL-000246","to":"EQP-C34","basis":"source","source_ids":["SRC-000445"]},{"id":"REL-001619","type":"used_in","from":"MDL-000246","to":"PRS-040","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001620","type":"manufactures","from":"CMP-000206","to":"MDL-000247","basis":"source","source_ids":["SRC-000446"],"confidence":"MEDIUM"},{"id":"REL-001621","type":"part_of","from":"MDL-000247","to":"PRD-000234","basis":"derived"},{"id":"REL-001622","type":"classified_as","from":"MDL-000247","to":"EQP-C35","basis":"source","source_ids":["SRC-000446"]},{"id":"REL-001623","type":"used_in","from":"MDL-000247","to":"PRS-040","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001624","type":"uses_technology","from":"MDL-000247","to":"TEC-033","basis":"derived","via":"equipment category"},{"id":"REL-001625","type":"manufactures","from":"CMP-000206","to":"MDL-000248","basis":"source","source_ids":["SRC-000447"],"confidence":"MEDIUM"},{"id":"REL-001626","type":"part_of","from":"MDL-000248","to":"PRD-000234","basis":"derived"},{"id":"REL-001627","type":"classified_as","from":"MDL-000248","to":"EQP-C35","basis":"source","source_ids":["SRC-000447"]},{"id":"REL-001628","type":"used_in","from":"MDL-000248","to":"PRS-040","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001629","type":"uses_technology","from":"MDL-000248","to":"TEC-033","basis":"derived","via":"equipment category"},{"id":"REL-001630","type":"manufactures","from":"CMP-000024","to":"MDL-000249","basis":"source","source_ids":["SRC-000448"],"confidence":"MEDIUM"},{"id":"REL-001631","type":"part_of","from":"MDL-000249","to":"PRD-000235","basis":"derived"},{"id":"REL-001632","type":"classified_as","from":"MDL-000249","to":"EQP-B02","basis":"source","source_ids":["SRC-000448"]},{"id":"REL-001633","type":"used_in","from":"MDL-000249","to":"PRS-028","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001634","type":"manufactures","from":"CMP-000024","to":"MDL-000250","basis":"source","source_ids":["SRC-000322"],"confidence":"MEDIUM"},{"id":"REL-001635","type":"part_of","from":"MDL-000250","to":"PRD-000235","basis":"derived"},{"id":"REL-001636","type":"classified_as","from":"MDL-000250","to":"EQP-B02","basis":"source","source_ids":["SRC-000322"]},{"id":"REL-001637","type":"used_in","from":"MDL-000250","to":"PRS-028","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001638","type":"manufactures","from":"CMP-000024","to":"MDL-000251","basis":"source","source_ids":["SRC-000449"],"confidence":"MEDIUM"},{"id":"REL-001639","type":"part_of","from":"MDL-000251","to":"PRD-000236","basis":"derived"},{"id":"REL-001640","type":"classified_as","from":"MDL-000251","to":"EQP-B03","basis":"source","source_ids":["SRC-000449"]},{"id":"REL-001641","type":"used_in","from":"MDL-000251","to":"PRS-028","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001642","type":"manufactures","from":"CMP-000024","to":"MDL-000252","basis":"source","source_ids":["SRC-000450"],"confidence":"MEDIUM"},{"id":"REL-001643","type":"part_of","from":"MDL-000252","to":"PRD-000236","basis":"derived"},{"id":"REL-001644","type":"classified_as","from":"MDL-000252","to":"EQP-B03","basis":"source","source_ids":["SRC-000450"]},{"id":"REL-001645","type":"used_in","from":"MDL-000252","to":"PRS-028","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001646","type":"manufactures","from":"CMP-000024","to":"MDL-000253","basis":"source","source_ids":["SRC-000451"],"confidence":"MEDIUM"},{"id":"REL-001647","type":"part_of","from":"MDL-000253","to":"PRD-000236","basis":"derived"},{"id":"REL-001648","type":"classified_as","from":"MDL-000253","to":"EQP-B03","basis":"source","source_ids":["SRC-000451"]},{"id":"REL-001649","type":"used_in","from":"MDL-000253","to":"PRS-028","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001650","type":"manufactures","from":"CMP-000026","to":"MDL-000254","basis":"source","source_ids":["SRC-000452"],"confidence":"MEDIUM"},{"id":"REL-001651","type":"part_of","from":"MDL-000254","to":"PRD-000237","basis":"derived"},{"id":"REL-001652","type":"classified_as","from":"MDL-000254","to":"EQP-B08","basis":"source","source_ids":["SRC-000452"]},{"id":"REL-001653","type":"used_in","from":"MDL-000254","to":"PRS-028","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001654","type":"uses_technology","from":"MDL-000254","to":"TEC-008","basis":"derived","via":"equipment category"},{"id":"REL-001655","type":"manufactures","from":"CMP-000026","to":"MDL-000255","basis":"source","source_ids":["SRC-000453"],"confidence":"MEDIUM"},{"id":"REL-001656","type":"part_of","from":"MDL-000255","to":"PRD-000238","basis":"derived"},{"id":"REL-001657","type":"classified_as","from":"MDL-000255","to":"EQP-B09","basis":"source","source_ids":["SRC-000453"]},{"id":"REL-001658","type":"used_in","from":"MDL-000255","to":"PRS-028","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001659","type":"manufactures","from":"CMP-000038","to":"MDL-000256","basis":"source","source_ids":["SRC-000454"],"confidence":"MEDIUM"},{"id":"REL-001660","type":"part_of","from":"MDL-000256","to":"PRD-000239","basis":"derived"},{"id":"REL-001661","type":"classified_as","from":"MDL-000256","to":"EQP-C39","basis":"source","source_ids":["SRC-000454"]},{"id":"REL-001662","type":"used_in","from":"MDL-000256","to":"PRS-041","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001663","type":"uses_technology","from":"MDL-000256","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-001664","type":"supports_application","from":"MDL-000256","to":"APP-005","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000454"]},{"id":"REL-001665","type":"manufactures","from":"CMP-000038","to":"MDL-000257","basis":"source","source_ids":["SRC-000455"],"confidence":"MEDIUM"},{"id":"REL-001666","type":"part_of","from":"MDL-000257","to":"PRD-000240","basis":"derived"},{"id":"REL-001667","type":"classified_as","from":"MDL-000257","to":"EQP-C39","basis":"source","source_ids":["SRC-000455"]},{"id":"REL-001668","type":"used_in","from":"MDL-000257","to":"PRS-041","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001669","type":"uses_technology","from":"MDL-000257","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-001670","type":"supports_application","from":"MDL-000257","to":"APP-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000455"]},{"id":"REL-001671","type":"manufactures","from":"CMP-000038","to":"MDL-000258","basis":"source","source_ids":["SRC-000456"],"confidence":"MEDIUM"},{"id":"REL-001672","type":"part_of","from":"MDL-000258","to":"PRD-000241","basis":"derived"},{"id":"REL-001673","type":"classified_as","from":"MDL-000258","to":"EQP-C39","basis":"source","source_ids":["SRC-000456"]},{"id":"REL-001674","type":"used_in","from":"MDL-000258","to":"PRS-041","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001675","type":"uses_technology","from":"MDL-000258","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-001676","type":"manufactures","from":"CMP-000038","to":"MDL-000259","basis":"source","source_ids":["SRC-000457"],"confidence":"MEDIUM"},{"id":"REL-001677","type":"part_of","from":"MDL-000259","to":"PRD-000242","basis":"derived"},{"id":"REL-001678","type":"classified_as","from":"MDL-000259","to":"EQP-C39","basis":"source","source_ids":["SRC-000457"]},{"id":"REL-001679","type":"used_in","from":"MDL-000259","to":"PRS-041","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001680","type":"uses_technology","from":"MDL-000259","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-001681","type":"manufactures","from":"CMP-000036","to":"MDL-000260","basis":"source","source_ids":["SRC-000458"],"confidence":"MEDIUM"},{"id":"REL-001682","type":"part_of","from":"MDL-000260","to":"PRD-000243","basis":"derived"},{"id":"REL-001683","type":"classified_as","from":"MDL-000260","to":"EQP-C39","basis":"source","source_ids":["SRC-000458"]},{"id":"REL-001684","type":"used_in","from":"MDL-000260","to":"PRS-041","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001685","type":"uses_technology","from":"MDL-000260","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-001686","type":"manufactures","from":"CMP-000036","to":"MDL-000261","basis":"source","source_ids":["SRC-000459"],"confidence":"MEDIUM"},{"id":"REL-001687","type":"part_of","from":"MDL-000261","to":"PRD-000243","basis":"derived"},{"id":"REL-001688","type":"classified_as","from":"MDL-000261","to":"EQP-C39","basis":"source","source_ids":["SRC-000459"]},{"id":"REL-001689","type":"used_in","from":"MDL-000261","to":"PRS-041","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001690","type":"uses_technology","from":"MDL-000261","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-001691","type":"manufactures","from":"CMP-000036","to":"MDL-000262","basis":"source","source_ids":["SRC-000460"],"confidence":"MEDIUM"},{"id":"REL-001692","type":"part_of","from":"MDL-000262","to":"PRD-000243","basis":"derived"},{"id":"REL-001693","type":"classified_as","from":"MDL-000262","to":"EQP-C39","basis":"source","source_ids":["SRC-000460"]},{"id":"REL-001694","type":"used_in","from":"MDL-000262","to":"PRS-041","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001695","type":"uses_technology","from":"MDL-000262","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-001696","type":"manufactures","from":"CMP-000036","to":"MDL-000263","basis":"source","source_ids":["SRC-000461"],"confidence":"MEDIUM"},{"id":"REL-001697","type":"part_of","from":"MDL-000263","to":"PRD-000244","basis":"derived"},{"id":"REL-001698","type":"classified_as","from":"MDL-000263","to":"EQP-C39","basis":"source","source_ids":["SRC-000461"]},{"id":"REL-001699","type":"used_in","from":"MDL-000263","to":"PRS-041","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001700","type":"uses_technology","from":"MDL-000263","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-001701","type":"manufactures","from":"CMP-000013","to":"MDL-000264","basis":"source","source_ids":["SRC-000462"],"confidence":"MEDIUM"},{"id":"REL-001702","type":"part_of","from":"MDL-000264","to":"PRD-000245","basis":"derived"},{"id":"REL-001703","type":"classified_as","from":"MDL-000264","to":"EQP-A01.05","basis":"source","source_ids":["SRC-000462"]},{"id":"REL-001704","type":"used_in","from":"MDL-000264","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001705","type":"used_in","from":"MDL-000264","to":"PRS-045","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001706","type":"used_in","from":"MDL-000264","to":"PRS-046","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001707","type":"used_in","from":"MDL-000264","to":"PRS-047","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001708","type":"uses_technology","from":"MDL-000264","to":"TEC-005","basis":"derived","via":"equipment category"},{"id":"REL-001709","type":"supports_application","from":"MDL-000264","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000462"]},{"id":"REL-001710","type":"manufactures","from":"CMP-000173","to":"MDL-000265","basis":"source","source_ids":["SRC-000336"],"confidence":"MEDIUM"},{"id":"REL-001711","type":"part_of","from":"MDL-000265","to":"PRD-000246","basis":"derived"},{"id":"REL-001712","type":"classified_as","from":"MDL-000265","to":"EQP-A43","basis":"source","source_ids":["SRC-000336"]},{"id":"REL-001713","type":"used_in","from":"MDL-000265","to":"PRS-060","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001714","type":"manufactures","from":"CMP-000173","to":"MDL-000266","basis":"source","source_ids":["SRC-000463"],"confidence":"MEDIUM"},{"id":"REL-001715","type":"part_of","from":"MDL-000266","to":"PRD-000247","basis":"derived"},{"id":"REL-001716","type":"classified_as","from":"MDL-000266","to":"EQP-A44","basis":"source","source_ids":["SRC-000463"]},{"id":"REL-001717","type":"used_in","from":"MDL-000266","to":"PRS-060","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001718","type":"manufactures","from":"CMP-000172","to":"MDL-000267","basis":"source","source_ids":["SRC-000335"],"confidence":"MEDIUM"},{"id":"REL-001719","type":"part_of","from":"MDL-000267","to":"PRD-000248","basis":"derived"},{"id":"REL-001720","type":"classified_as","from":"MDL-000267","to":"EQP-A43","basis":"source","source_ids":["SRC-000335"]},{"id":"REL-001721","type":"used_in","from":"MDL-000267","to":"PRS-060","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001722","type":"manufactures","from":"CMP-000064","to":"MDL-000268","basis":"source","source_ids":["SRC-000464"],"confidence":"MEDIUM"},{"id":"REL-001723","type":"part_of","from":"MDL-000268","to":"PRD-000249","basis":"derived"},{"id":"REL-001724","type":"classified_as","from":"MDL-000268","to":"EQP-A39","basis":"source","source_ids":["SRC-000464"]},{"id":"REL-001725","type":"used_in","from":"MDL-000268","to":"PRS-058","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001726","type":"manufactures","from":"CMP-000062","to":"MDL-000269","basis":"source","source_ids":["SRC-000465"],"confidence":"MEDIUM"},{"id":"REL-001727","type":"part_of","from":"MDL-000269","to":"PRD-000250","basis":"derived"},{"id":"REL-001728","type":"classified_as","from":"MDL-000269","to":"EQP-A40","basis":"source","source_ids":["SRC-000465"]},{"id":"REL-001729","type":"used_in","from":"MDL-000269","to":"PRS-058","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001730","type":"manufactures","from":"CMP-000065","to":"MDL-000270","basis":"source","source_ids":["SRC-000298"],"confidence":"MEDIUM"},{"id":"REL-001731","type":"part_of","from":"MDL-000270","to":"PRD-000251","basis":"derived"},{"id":"REL-001732","type":"classified_as","from":"MDL-000270","to":"EQP-J01","basis":"source","source_ids":["SRC-000298"]},{"id":"REL-001733","type":"used_in","from":"MDL-000270","to":"PRS-057","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001734","type":"manufactures","from":"CMP-000066","to":"MDL-000271","basis":"source","source_ids":["SRC-000300"],"confidence":"MEDIUM"},{"id":"REL-001735","type":"part_of","from":"MDL-000271","to":"PRD-000252","basis":"derived"},{"id":"REL-001736","type":"classified_as","from":"MDL-000271","to":"EQP-J02","basis":"source","source_ids":["SRC-000300"]},{"id":"REL-001737","type":"used_in","from":"MDL-000271","to":"PRS-057","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001738","type":"manufactures","from":"CMP-000066","to":"MDL-000272","basis":"source","source_ids":["SRC-000466"],"confidence":"MEDIUM"},{"id":"REL-001739","type":"part_of","from":"MDL-000272","to":"PRD-000253","basis":"derived"},{"id":"REL-001740","type":"classified_as","from":"MDL-000272","to":"EQP-J07","basis":"source","source_ids":["SRC-000466"]},{"id":"REL-001741","type":"used_in","from":"MDL-000272","to":"PRS-057","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001742","type":"manufactures","from":"CMP-000202","to":"MDL-000273","basis":"source","source_ids":["SRC-000467"],"confidence":"MEDIUM"},{"id":"REL-001743","type":"part_of","from":"MDL-000273","to":"PRD-000254","basis":"derived"},{"id":"REL-001744","type":"classified_as","from":"MDL-000273","to":"EQP-K01","basis":"source","source_ids":["SRC-000467"]},{"id":"REL-001745","type":"used_in","from":"MDL-000273","to":"PRS-001","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001746","type":"supports_material","from":"MDL-000273","to":"MAT-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000467"]},{"id":"REL-001747","type":"manufactures","from":"CMP-000202","to":"MDL-000274","basis":"source","source_ids":["SRC-000468"],"confidence":"MEDIUM"},{"id":"REL-001748","type":"part_of","from":"MDL-000274","to":"PRD-000255","basis":"derived"},{"id":"REL-001749","type":"classified_as","from":"MDL-000274","to":"EQP-K01","basis":"source","source_ids":["SRC-000468"]},{"id":"REL-001750","type":"used_in","from":"MDL-000274","to":"PRS-001","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001751","type":"supports_material","from":"MDL-000274","to":"MAT-003","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000468"]},{"id":"REL-001752","type":"manufactures","from":"CMP-000202","to":"MDL-000275","basis":"source","source_ids":["SRC-000469"],"confidence":"MEDIUM"},{"id":"REL-001753","type":"part_of","from":"MDL-000275","to":"PRD-000256","basis":"derived"},{"id":"REL-001754","type":"classified_as","from":"MDL-000275","to":"EQP-K01","basis":"source","source_ids":["SRC-000469"]},{"id":"REL-001755","type":"used_in","from":"MDL-000275","to":"PRS-001","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001756","type":"supports_material","from":"MDL-000275","to":"MAT-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000469"]},{"id":"REL-001757","type":"manufactures","from":"CMP-000203","to":"MDL-000276","basis":"source","source_ids":["SRC-000470"],"confidence":"MEDIUM"},{"id":"REL-001758","type":"part_of","from":"MDL-000276","to":"PRD-000257","basis":"derived"},{"id":"REL-001759","type":"classified_as","from":"MDL-000276","to":"EQP-K07","basis":"source","source_ids":["SRC-000470"]},{"id":"REL-001760","type":"used_in","from":"MDL-000276","to":"PRS-006","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001761","type":"manufactures","from":"CMP-000203","to":"MDL-000277","basis":"source","source_ids":["SRC-000471"],"confidence":"MEDIUM"},{"id":"REL-001762","type":"part_of","from":"MDL-000277","to":"PRD-000257","basis":"derived"},{"id":"REL-001763","type":"classified_as","from":"MDL-000277","to":"EQP-K07","basis":"source","source_ids":["SRC-000471"]},{"id":"REL-001764","type":"used_in","from":"MDL-000277","to":"PRS-006","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001765","type":"manufactures","from":"CMP-000203","to":"MDL-000278","basis":"source","source_ids":["SRC-000472"],"confidence":"MEDIUM"},{"id":"REL-001766","type":"part_of","from":"MDL-000278","to":"PRD-000258","basis":"derived"},{"id":"REL-001767","type":"classified_as","from":"MDL-000278","to":"EQP-K07","basis":"source","source_ids":["SRC-000472"]},{"id":"REL-001768","type":"used_in","from":"MDL-000278","to":"PRS-006","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001769","type":"manufactures","from":"CMP-000203","to":"MDL-000279","basis":"source","source_ids":["SRC-000473"],"confidence":"MEDIUM"},{"id":"REL-001770","type":"part_of","from":"MDL-000279","to":"PRD-000259","basis":"derived"},{"id":"REL-001771","type":"classified_as","from":"MDL-000279","to":"EQP-A19","basis":"source","source_ids":["SRC-000473"]},{"id":"REL-001772","type":"used_in","from":"MDL-000279","to":"PRS-024","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001773","type":"uses_technology","from":"MDL-000279","to":"TEC-029","basis":"derived","via":"equipment category"},{"id":"REL-001774","type":"manufactures","from":"CMP-000203","to":"MDL-000280","basis":"source","source_ids":["SRC-000474"],"confidence":"MEDIUM"},{"id":"REL-001775","type":"part_of","from":"MDL-000280","to":"PRD-000260","basis":"derived"},{"id":"REL-001776","type":"classified_as","from":"MDL-000280","to":"EQP-C03","basis":"source","source_ids":["SRC-000474"]},{"id":"REL-001777","type":"used_in","from":"MDL-000280","to":"PRS-030","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001778","type":"manufactures","from":"CMP-000204","to":"MDL-000281","basis":"source","source_ids":["SRC-000475"],"confidence":"MEDIUM"},{"id":"REL-001779","type":"part_of","from":"MDL-000281","to":"PRD-000261","basis":"derived"},{"id":"REL-001780","type":"classified_as","from":"MDL-000281","to":"EQP-L08","basis":"source","source_ids":["SRC-000475"]},{"id":"REL-001781","type":"used_in","from":"MDL-000281","to":"PRS-061","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001782","type":"manufactures","from":"CMP-000205","to":"MDL-000282","basis":"source","source_ids":["SRC-000476"],"confidence":"MEDIUM"},{"id":"REL-001783","type":"part_of","from":"MDL-000282","to":"PRD-000262","basis":"derived"},{"id":"REL-001784","type":"classified_as","from":"MDL-000282","to":"EQP-L08","basis":"source","source_ids":["SRC-000476"]},{"id":"REL-001785","type":"used_in","from":"MDL-000282","to":"PRS-061","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001786","type":"manufactures","from":"CMP-000006","to":"MDL-000283","basis":"source","source_ids":["SRC-000478"],"confidence":"MEDIUM"},{"id":"REL-001787","type":"part_of","from":"MDL-000283","to":"PRD-000263","basis":"derived"},{"id":"REL-001788","type":"classified_as","from":"MDL-000283","to":"EQP-A09.10","basis":"source","source_ids":["SRC-000478"]},{"id":"REL-001789","type":"used_in","from":"MDL-000283","to":"PRS-009","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001790","type":"used_in","from":"MDL-000283","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001791","type":"uses_technology","from":"MDL-000283","to":"TEC-022","basis":"derived","via":"equipment category"},{"id":"REL-001792","type":"supports_material","from":"MDL-000283","to":"MAT-003","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000478"]},{"id":"REL-001793","type":"supports_application","from":"MDL-000283","to":"APP-010","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000478"]},{"id":"REL-001794","type":"supports_application","from":"MDL-000283","to":"APP-011","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000478"]},{"id":"REL-001795","type":"manufactures","from":"CMP-000006","to":"MDL-000284","basis":"source","source_ids":["SRC-000479"],"confidence":"MEDIUM"},{"id":"REL-001796","type":"part_of","from":"MDL-000284","to":"PRD-000263","basis":"derived"},{"id":"REL-001797","type":"classified_as","from":"MDL-000284","to":"EQP-A09.10","basis":"source","source_ids":["SRC-000479"]},{"id":"REL-001798","type":"used_in","from":"MDL-000284","to":"PRS-009","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001799","type":"used_in","from":"MDL-000284","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001800","type":"uses_technology","from":"MDL-000284","to":"TEC-022","basis":"derived","via":"equipment category"},{"id":"REL-001801","type":"supports_material","from":"MDL-000284","to":"MAT-003","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000479"]},{"id":"REL-001802","type":"supports_application","from":"MDL-000284","to":"APP-010","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000479"]},{"id":"REL-001803","type":"supports_application","from":"MDL-000284","to":"APP-011","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000479"]},{"id":"REL-001804","type":"manufactures","from":"CMP-000006","to":"MDL-000285","basis":"source","source_ids":["SRC-000480"],"confidence":"MEDIUM"},{"id":"REL-001805","type":"part_of","from":"MDL-000285","to":"PRD-000264","basis":"derived"},{"id":"REL-001806","type":"classified_as","from":"MDL-000285","to":"EQP-A09.10","basis":"source","source_ids":["SRC-000480"]},{"id":"REL-001807","type":"used_in","from":"MDL-000285","to":"PRS-009","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001808","type":"used_in","from":"MDL-000285","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001809","type":"uses_technology","from":"MDL-000285","to":"TEC-022","basis":"derived","via":"equipment category"},{"id":"REL-001810","type":"supports_material","from":"MDL-000285","to":"MAT-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000480"]},{"id":"REL-001811","type":"manufactures","from":"CMP-000002","to":"MDL-000286","basis":"source","source_ids":["SRC-000481"],"confidence":"MEDIUM"},{"id":"REL-001812","type":"part_of","from":"MDL-000286","to":"PRD-000265","basis":"derived"},{"id":"REL-001813","type":"classified_as","from":"MDL-000286","to":"EQP-A09.10","basis":"source","source_ids":["SRC-000481"]},{"id":"REL-001814","type":"used_in","from":"MDL-000286","to":"PRS-009","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001815","type":"used_in","from":"MDL-000286","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001816","type":"uses_technology","from":"MDL-000286","to":"TEC-022","basis":"derived","via":"equipment category"},{"id":"REL-001817","type":"supports_application","from":"MDL-000286","to":"APP-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000481"]},{"id":"REL-001818","type":"supports_application","from":"MDL-000286","to":"APP-005","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000481"]},{"id":"REL-001819","type":"manufactures","from":"CMP-000002","to":"MDL-000287","basis":"source","source_ids":["SRC-000482"],"confidence":"MEDIUM"},{"id":"REL-001820","type":"part_of","from":"MDL-000287","to":"PRD-000265","basis":"derived"},{"id":"REL-001821","type":"classified_as","from":"MDL-000287","to":"EQP-A09.10","basis":"source","source_ids":["SRC-000482"]},{"id":"REL-001822","type":"used_in","from":"MDL-000287","to":"PRS-009","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001823","type":"used_in","from":"MDL-000287","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001824","type":"uses_technology","from":"MDL-000287","to":"TEC-022","basis":"derived","via":"equipment category"},{"id":"REL-001825","type":"supports_material","from":"MDL-000287","to":"MAT-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000482"]},{"id":"REL-001826","type":"manufactures","from":"CMP-000002","to":"MDL-000288","basis":"source","source_ids":["SRC-000483"],"confidence":"MEDIUM"},{"id":"REL-001827","type":"part_of","from":"MDL-000288","to":"PRD-000265","basis":"derived"},{"id":"REL-001828","type":"classified_as","from":"MDL-000288","to":"EQP-A09.10","basis":"source","source_ids":["SRC-000483"]},{"id":"REL-001829","type":"used_in","from":"MDL-000288","to":"PRS-009","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001830","type":"used_in","from":"MDL-000288","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001831","type":"uses_technology","from":"MDL-000288","to":"TEC-022","basis":"derived","via":"equipment category"},{"id":"REL-001832","type":"supports_material","from":"MDL-000288","to":"MAT-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000483"]},{"id":"REL-001833","type":"manufactures","from":"CMP-000014","to":"MDL-000289","basis":"source","source_ids":["SRC-000484"],"confidence":"MEDIUM"},{"id":"REL-001834","type":"part_of","from":"MDL-000289","to":"PRD-000266","basis":"derived"},{"id":"REL-001835","type":"classified_as","from":"MDL-000289","to":"EQP-G01","basis":"source","source_ids":["SRC-000484"]},{"id":"REL-001836","type":"used_in","from":"MDL-000289","to":"PRS-009","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001837","type":"uses_technology","from":"MDL-000289","to":"TEC-023","basis":"derived","via":"equipment category"},{"id":"REL-001838","type":"supports_material","from":"MDL-000289","to":"MAT-004","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000484"]},{"id":"REL-001839","type":"supports_application","from":"MDL-000289","to":"APP-012","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000484"]},{"id":"REL-001840","type":"supports_application","from":"MDL-000289","to":"APP-013","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000484"]},{"id":"REL-001841","type":"supports_application","from":"MDL-000289","to":"APP-018","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000484"]},{"id":"REL-001842","type":"manufactures","from":"CMP-000014","to":"MDL-000290","basis":"source","source_ids":["SRC-000485"],"confidence":"MEDIUM"},{"id":"REL-001843","type":"part_of","from":"MDL-000290","to":"PRD-000266","basis":"derived"},{"id":"REL-001844","type":"classified_as","from":"MDL-000290","to":"EQP-G01","basis":"source","source_ids":["SRC-000485"]},{"id":"REL-001845","type":"used_in","from":"MDL-000290","to":"PRS-009","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001846","type":"uses_technology","from":"MDL-000290","to":"TEC-023","basis":"derived","via":"equipment category"},{"id":"REL-001847","type":"supports_material","from":"MDL-000290","to":"MAT-004","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000485"]},{"id":"REL-001848","type":"supports_application","from":"MDL-000290","to":"APP-012","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000485"]},{"id":"REL-001849","type":"supports_application","from":"MDL-000290","to":"APP-018","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000485"]},{"id":"REL-001850","type":"manufactures","from":"CMP-000028","to":"MDL-000291","basis":"source","source_ids":["SRC-000344"],"confidence":"MEDIUM"},{"id":"REL-001851","type":"part_of","from":"MDL-000291","to":"PRD-000267","basis":"derived"},{"id":"REL-001852","type":"classified_as","from":"MDL-000291","to":"EQP-G01","basis":"source","source_ids":["SRC-000344"]},{"id":"REL-001853","type":"used_in","from":"MDL-000291","to":"PRS-009","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001854","type":"uses_technology","from":"MDL-000291","to":"TEC-023","basis":"derived","via":"equipment category"},{"id":"REL-001855","type":"supports_material","from":"MDL-000291","to":"MAT-004","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000344"]},{"id":"REL-001856","type":"supports_application","from":"MDL-000291","to":"APP-012","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000344"]},{"id":"REL-001857","type":"supports_application","from":"MDL-000291","to":"APP-013","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000344"]},{"id":"REL-001858","type":"manufactures","from":"CMP-000028","to":"MDL-000292","basis":"source","source_ids":["SRC-000486"],"confidence":"MEDIUM"},{"id":"REL-001859","type":"part_of","from":"MDL-000292","to":"PRD-000267","basis":"derived"},{"id":"REL-001860","type":"classified_as","from":"MDL-000292","to":"EQP-G02","basis":"source","source_ids":["SRC-000486"]},{"id":"REL-001861","type":"used_in","from":"MDL-000292","to":"PRS-009","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001862","type":"supports_material","from":"MDL-000292","to":"MAT-003","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000486"]},{"id":"REL-001863","type":"supports_application","from":"MDL-000292","to":"APP-010","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000486"]},{"id":"REL-001864","type":"supports_application","from":"MDL-000292","to":"APP-011","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000486"]},{"id":"REL-001865","type":"manufactures","from":"CMP-000028","to":"MDL-000293","basis":"source","source_ids":["SRC-000487"],"confidence":"MEDIUM"},{"id":"REL-001866","type":"part_of","from":"MDL-000293","to":"PRD-000267","basis":"derived"},{"id":"REL-001867","type":"classified_as","from":"MDL-000293","to":"EQP-G03","basis":"source","source_ids":["SRC-000487"]},{"id":"REL-001868","type":"used_in","from":"MDL-000293","to":"PRS-009","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001869","type":"uses_technology","from":"MDL-000293","to":"TEC-023","basis":"derived","via":"equipment category"},{"id":"REL-001870","type":"manufactures","from":"CMP-000207","to":"MDL-000294","basis":"source","source_ids":["SRC-000477"],"confidence":"MEDIUM"},{"id":"REL-001871","type":"part_of","from":"MDL-000294","to":"PRD-000268","basis":"derived"},{"id":"REL-001872","type":"classified_as","from":"MDL-000294","to":"EQP-K05","basis":"source","source_ids":["SRC-000477"]},{"id":"REL-001873","type":"used_in","from":"MDL-000294","to":"PRS-004","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001874","type":"manufactures","from":"CMP-000007","to":"MDL-000295","basis":"source","source_ids":["SRC-000488"],"confidence":"MEDIUM"},{"id":"REL-001875","type":"part_of","from":"MDL-000295","to":"PRD-000176","basis":"derived"},{"id":"REL-001876","type":"classified_as","from":"MDL-000295","to":"EQP-A04","basis":"source","source_ids":["SRC-000488"]},{"id":"REL-001877","type":"used_in","from":"MDL-000295","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001878","type":"uses_technology","from":"MDL-000295","to":"TEC-030","basis":"derived","via":"equipment category"},{"id":"REL-001879","type":"manufactures","from":"CMP-000007","to":"MDL-000296","basis":"source","source_ids":["SRC-000489"],"confidence":"MEDIUM"},{"id":"REL-001880","type":"part_of","from":"MDL-000296","to":"PRD-000269","basis":"derived"},{"id":"REL-001881","type":"classified_as","from":"MDL-000296","to":"EQP-A20","basis":"source","source_ids":["SRC-000489"]},{"id":"REL-001882","type":"used_in","from":"MDL-000296","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001883","type":"uses_technology","from":"MDL-000296","to":"TEC-030","basis":"derived","via":"equipment category"},{"id":"REL-001884","type":"manufactures","from":"CMP-000012","to":"MDL-000297","basis":"source","source_ids":["SRC-000490"],"confidence":"MEDIUM"},{"id":"REL-001885","type":"part_of","from":"MDL-000297","to":"PRD-000212","basis":"derived"},{"id":"REL-001886","type":"classified_as","from":"MDL-000297","to":"EQP-K06","basis":"source","source_ids":["SRC-000490"]},{"id":"REL-001887","type":"used_in","from":"MDL-000297","to":"PRS-005","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001888","type":"manufactures","from":"CMP-000207","to":"MDL-000298","basis":"source","source_ids":["SRC-000491"],"confidence":"MEDIUM"},{"id":"REL-001889","type":"part_of","from":"MDL-000298","to":"PRD-000270","basis":"derived"},{"id":"REL-001890","type":"classified_as","from":"MDL-000298","to":"EQP-K06","basis":"source","source_ids":["SRC-000491"]},{"id":"REL-001891","type":"used_in","from":"MDL-000298","to":"PRS-005","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001892","type":"manufactures","from":"CMP-000209","to":"MDL-000299","basis":"source","source_ids":["SRC-000585"],"confidence":"MEDIUM"},{"id":"REL-001893","type":"part_of","from":"MDL-000299","to":"PRD-000271","basis":"derived"},{"id":"REL-001894","type":"classified_as","from":"MDL-000299","to":"EQP-A01.06","basis":"source","source_ids":["SRC-000585"]},{"id":"REL-001895","type":"used_in","from":"MDL-000299","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001896","type":"uses_technology","from":"MDL-000299","to":"TEC-006","basis":"derived","via":"equipment category"},{"id":"REL-001897","type":"manufactures","from":"CMP-000210","to":"MDL-000300","basis":"source","source_ids":["SRC-000586"],"confidence":"MEDIUM"},{"id":"REL-001898","type":"part_of","from":"MDL-000300","to":"PRD-000272","basis":"derived"},{"id":"REL-001899","type":"classified_as","from":"MDL-000300","to":"EQP-A01.06","basis":"source","source_ids":["SRC-000586"]},{"id":"REL-001900","type":"used_in","from":"MDL-000300","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001901","type":"uses_technology","from":"MDL-000300","to":"TEC-006","basis":"derived","via":"equipment category"},{"id":"REL-001902","type":"supports_application","from":"MDL-000300","to":"APP-018","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000586"]},{"id":"REL-001903","type":"manufactures","from":"CMP-000210","to":"MDL-000301","basis":"source","source_ids":["SRC-000587"],"confidence":"MEDIUM"},{"id":"REL-001904","type":"part_of","from":"MDL-000301","to":"PRD-000273","basis":"derived"},{"id":"REL-001905","type":"classified_as","from":"MDL-000301","to":"EQP-A01.06","basis":"source","source_ids":["SRC-000587"]},{"id":"REL-001906","type":"used_in","from":"MDL-000301","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001907","type":"uses_technology","from":"MDL-000301","to":"TEC-006","basis":"derived","via":"equipment category"},{"id":"REL-001908","type":"manufactures","from":"CMP-000211","to":"MDL-000302","basis":"source","source_ids":["SRC-000588"],"confidence":"MEDIUM"},{"id":"REL-001909","type":"part_of","from":"MDL-000302","to":"PRD-000274","basis":"derived"},{"id":"REL-001910","type":"classified_as","from":"MDL-000302","to":"EQP-A01.08","basis":"source","source_ids":["SRC-000588"]},{"id":"REL-001911","type":"used_in","from":"MDL-000302","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001912","type":"used_in","from":"MDL-000302","to":"PRS-045","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001913","type":"used_in","from":"MDL-000302","to":"PRS-047","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001914","type":"uses_technology","from":"MDL-000302","to":"TEC-008","basis":"derived","via":"equipment category"},{"id":"REL-001915","type":"manufactures","from":"CMP-000211","to":"MDL-000303","basis":"source","source_ids":["SRC-000589"],"confidence":"MEDIUM"},{"id":"REL-001916","type":"part_of","from":"MDL-000303","to":"PRD-000274","basis":"derived"},{"id":"REL-001917","type":"classified_as","from":"MDL-000303","to":"EQP-A01.08","basis":"source","source_ids":["SRC-000589"]},{"id":"REL-001918","type":"used_in","from":"MDL-000303","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001919","type":"used_in","from":"MDL-000303","to":"PRS-045","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001920","type":"used_in","from":"MDL-000303","to":"PRS-047","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001921","type":"uses_technology","from":"MDL-000303","to":"TEC-008","basis":"derived","via":"equipment category"},{"id":"REL-001922","type":"manufactures","from":"CMP-000211","to":"MDL-000304","basis":"source","source_ids":["SRC-000590"],"confidence":"MEDIUM"},{"id":"REL-001923","type":"part_of","from":"MDL-000304","to":"PRD-000274","basis":"derived"},{"id":"REL-001924","type":"classified_as","from":"MDL-000304","to":"EQP-A01.08","basis":"source","source_ids":["SRC-000590"]},{"id":"REL-001925","type":"used_in","from":"MDL-000304","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001926","type":"used_in","from":"MDL-000304","to":"PRS-045","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001927","type":"used_in","from":"MDL-000304","to":"PRS-047","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001928","type":"uses_technology","from":"MDL-000304","to":"TEC-008","basis":"derived","via":"equipment category"},{"id":"REL-001929","type":"manufactures","from":"CMP-000212","to":"MDL-000305","basis":"source","source_ids":["SRC-000591"],"confidence":"MEDIUM"},{"id":"REL-001930","type":"part_of","from":"MDL-000305","to":"PRD-000275","basis":"derived"},{"id":"REL-001931","type":"classified_as","from":"MDL-000305","to":"EQP-A01.07","basis":"source","source_ids":["SRC-000591"]},{"id":"REL-001932","type":"used_in","from":"MDL-000305","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001933","type":"uses_technology","from":"MDL-000305","to":"TEC-007","basis":"derived","via":"equipment category"},{"id":"REL-001934","type":"supports_application","from":"MDL-000305","to":"APP-014","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000591"]},{"id":"REL-001935","type":"supports_application","from":"MDL-000305","to":"APP-016","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000591"]},{"id":"REL-001936","type":"manufactures","from":"CMP-000212","to":"MDL-000306","basis":"source","source_ids":["SRC-000592"],"confidence":"MEDIUM"},{"id":"REL-001937","type":"part_of","from":"MDL-000306","to":"PRD-000275","basis":"derived"},{"id":"REL-001938","type":"classified_as","from":"MDL-000306","to":"EQP-A01.07","basis":"source","source_ids":["SRC-000592"]},{"id":"REL-001939","type":"used_in","from":"MDL-000306","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001940","type":"uses_technology","from":"MDL-000306","to":"TEC-007","basis":"derived","via":"equipment category"},{"id":"REL-001941","type":"manufactures","from":"CMP-000213","to":"MDL-000307","basis":"source","source_ids":["SRC-000593"],"confidence":"MEDIUM"},{"id":"REL-001942","type":"part_of","from":"MDL-000307","to":"PRD-000276","basis":"derived"},{"id":"REL-001943","type":"classified_as","from":"MDL-000307","to":"EQP-A09.06","basis":"source","source_ids":["SRC-000593"]},{"id":"REL-001944","type":"used_in","from":"MDL-000307","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001945","type":"used_in","from":"MDL-000307","to":"PRS-015","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001946","type":"uses_technology","from":"MDL-000307","to":"TEC-019","basis":"derived","via":"equipment category"},{"id":"REL-001947","type":"manufactures","from":"CMP-000214","to":"MDL-000308","basis":"source","source_ids":["SRC-000594"],"confidence":"MEDIUM"},{"id":"REL-001948","type":"part_of","from":"MDL-000308","to":"PRD-000277","basis":"derived"},{"id":"REL-001949","type":"classified_as","from":"MDL-000308","to":"EQP-A09.06","basis":"source","source_ids":["SRC-000594"]},{"id":"REL-001950","type":"used_in","from":"MDL-000308","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001951","type":"used_in","from":"MDL-000308","to":"PRS-015","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001952","type":"uses_technology","from":"MDL-000308","to":"TEC-019","basis":"derived","via":"equipment category"},{"id":"REL-001953","type":"manufactures","from":"CMP-000214","to":"MDL-000309","basis":"source","source_ids":["SRC-000595"],"confidence":"MEDIUM"},{"id":"REL-001954","type":"part_of","from":"MDL-000309","to":"PRD-000278","basis":"derived"},{"id":"REL-001955","type":"classified_as","from":"MDL-000309","to":"EQP-A09.07","basis":"source","source_ids":["SRC-000595"]},{"id":"REL-001956","type":"used_in","from":"MDL-000309","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001957","type":"used_in","from":"MDL-000309","to":"PRS-016","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001958","type":"uses_technology","from":"MDL-000309","to":"TEC-020","basis":"derived","via":"equipment category"},{"id":"REL-001959","type":"manufactures","from":"CMP-000214","to":"MDL-000310","basis":"source","source_ids":["SRC-000596"],"confidence":"MEDIUM"},{"id":"REL-001960","type":"part_of","from":"MDL-000310","to":"PRD-000279","basis":"derived"},{"id":"REL-001961","type":"classified_as","from":"MDL-000310","to":"EQP-A09","basis":"source","source_ids":["SRC-000596"]},{"id":"REL-001962","type":"used_in","from":"MDL-000310","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001963","type":"manufactures","from":"CMP-000215","to":"MDL-000311","basis":"source","source_ids":["SRC-000597"],"confidence":"MEDIUM"},{"id":"REL-001964","type":"part_of","from":"MDL-000311","to":"PRD-000280","basis":"derived"},{"id":"REL-001965","type":"classified_as","from":"MDL-000311","to":"EQP-K01","basis":"source","source_ids":["SRC-000597"]},{"id":"REL-001966","type":"used_in","from":"MDL-000311","to":"PRS-001","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001967","type":"supports_material","from":"MDL-000311","to":"MAT-003","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000597"]},{"id":"REL-001968","type":"manufactures","from":"CMP-000216","to":"MDL-000312","basis":"source","source_ids":["SRC-000598"],"confidence":"MEDIUM"},{"id":"REL-001969","type":"part_of","from":"MDL-000312","to":"PRD-000281","basis":"derived"},{"id":"REL-001970","type":"classified_as","from":"MDL-000312","to":"EQP-A07","basis":"source","source_ids":["SRC-000598"]},{"id":"REL-001971","type":"used_in","from":"MDL-000312","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001972","type":"used_in","from":"MDL-000312","to":"PRS-021","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001973","type":"manufactures","from":"CMP-000216","to":"MDL-000313","basis":"source","source_ids":["SRC-000599"],"confidence":"MEDIUM"},{"id":"REL-001974","type":"part_of","from":"MDL-000313","to":"PRD-000281","basis":"derived"},{"id":"REL-001975","type":"classified_as","from":"MDL-000313","to":"EQP-A07","basis":"source","source_ids":["SRC-000599"]},{"id":"REL-001976","type":"used_in","from":"MDL-000313","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001977","type":"used_in","from":"MDL-000313","to":"PRS-021","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001978","type":"manufactures","from":"CMP-000217","to":"MDL-000314","basis":"source","source_ids":["SRC-000600"],"confidence":"MEDIUM"},{"id":"REL-001979","type":"part_of","from":"MDL-000314","to":"PRD-000282","basis":"derived"},{"id":"REL-001980","type":"classified_as","from":"MDL-000314","to":"EQP-A11","basis":"source","source_ids":["SRC-000600"]},{"id":"REL-001981","type":"used_in","from":"MDL-000314","to":"PRS-011","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001982","type":"used_in","from":"MDL-000314","to":"PRS-012","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001983","type":"uses_technology","from":"MDL-000314","to":"TEC-027","basis":"derived","via":"equipment category"},{"id":"REL-001984","type":"manufactures","from":"CMP-000217","to":"MDL-000315","basis":"source","source_ids":["SRC-000601"],"confidence":"MEDIUM"},{"id":"REL-001985","type":"part_of","from":"MDL-000315","to":"PRD-000283","basis":"derived"},{"id":"REL-001986","type":"classified_as","from":"MDL-000315","to":"EQP-A11","basis":"source","source_ids":["SRC-000601"]},{"id":"REL-001987","type":"used_in","from":"MDL-000315","to":"PRS-011","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001988","type":"used_in","from":"MDL-000315","to":"PRS-012","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001989","type":"uses_technology","from":"MDL-000315","to":"TEC-027","basis":"derived","via":"equipment category"},{"id":"REL-001990","type":"manufactures","from":"CMP-000217","to":"MDL-000316","basis":"source","source_ids":["SRC-000602"],"confidence":"MEDIUM"},{"id":"REL-001991","type":"part_of","from":"MDL-000316","to":"PRD-000282","basis":"derived"},{"id":"REL-001992","type":"classified_as","from":"MDL-000316","to":"EQP-A09.03","basis":"source","source_ids":["SRC-000602"]},{"id":"REL-001993","type":"used_in","from":"MDL-000316","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001994","type":"used_in","from":"MDL-000316","to":"PRS-014","basis":"derived","via":"equipment category → process reference"},{"id":"REL-001995","type":"uses_technology","from":"MDL-000316","to":"TEC-017","basis":"derived","via":"equipment category"},{"id":"REL-001996","type":"manufactures","from":"CMP-000218","to":"MDL-000317","basis":"source","source_ids":["SRC-000603"],"confidence":"MEDIUM"},{"id":"REL-001997","type":"part_of","from":"MDL-000317","to":"PRD-000284","basis":"derived"},{"id":"REL-001998","type":"classified_as","from":"MDL-000317","to":"EQP-A12","basis":"source","source_ids":["SRC-000603"]},{"id":"REL-001999","type":"used_in","from":"MDL-000317","to":"PRS-023","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002000","type":"uses_technology","from":"MDL-000317","to":"TEC-028","basis":"derived","via":"equipment category"},{"id":"REL-002001","type":"manufactures","from":"CMP-000218","to":"MDL-000318","basis":"source","source_ids":["SRC-000604"],"confidence":"MEDIUM"},{"id":"REL-002002","type":"part_of","from":"MDL-000318","to":"PRD-000284","basis":"derived"},{"id":"REL-002003","type":"classified_as","from":"MDL-000318","to":"EQP-A12","basis":"source","source_ids":["SRC-000604"]},{"id":"REL-002004","type":"used_in","from":"MDL-000318","to":"PRS-023","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002005","type":"uses_technology","from":"MDL-000318","to":"TEC-028","basis":"derived","via":"equipment category"},{"id":"REL-002006","type":"manufactures","from":"CMP-000218","to":"MDL-000319","basis":"source","source_ids":["SRC-000605"],"confidence":"MEDIUM"},{"id":"REL-002007","type":"part_of","from":"MDL-000319","to":"PRD-000285","basis":"derived"},{"id":"REL-002008","type":"classified_as","from":"MDL-000319","to":"EQP-A09.01","basis":"source","source_ids":["SRC-000605"]},{"id":"REL-002009","type":"used_in","from":"MDL-000319","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002010","type":"used_in","from":"MDL-000319","to":"PRS-014","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002011","type":"uses_technology","from":"MDL-000319","to":"TEC-015","basis":"derived","via":"equipment category"},{"id":"REL-002012","type":"manufactures","from":"CMP-000219","to":"MDL-000320","basis":"source","source_ids":["SRC-000606"],"confidence":"MEDIUM"},{"id":"REL-002013","type":"part_of","from":"MDL-000320","to":"PRD-000286","basis":"derived"},{"id":"REL-002014","type":"classified_as","from":"MDL-000320","to":"EQP-A08.03","basis":"source","source_ids":["SRC-000606"]},{"id":"REL-002015","type":"used_in","from":"MDL-000320","to":"PRS-020","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002016","type":"uses_technology","from":"MDL-000320","to":"TEC-010","basis":"derived","via":"equipment category"},{"id":"REL-002017","type":"manufactures","from":"CMP-000219","to":"MDL-000321","basis":"source","source_ids":["SRC-000607"],"confidence":"MEDIUM"},{"id":"REL-002018","type":"part_of","from":"MDL-000321","to":"PRD-000287","basis":"derived"},{"id":"REL-002019","type":"classified_as","from":"MDL-000321","to":"EQP-A08.04","basis":"source","source_ids":["SRC-000607"]},{"id":"REL-002020","type":"used_in","from":"MDL-000321","to":"PRS-020","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002021","type":"uses_technology","from":"MDL-000321","to":"TEC-011","basis":"derived","via":"equipment category"},{"id":"REL-002022","type":"supports_material","from":"MDL-000321","to":"MAT-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000607"]},{"id":"REL-002023","type":"manufactures","from":"CMP-000219","to":"MDL-000322","basis":"source","source_ids":["SRC-000608"],"confidence":"MEDIUM"},{"id":"REL-002024","type":"part_of","from":"MDL-000322","to":"PRD-000287","basis":"derived"},{"id":"REL-002025","type":"classified_as","from":"MDL-000322","to":"EQP-A08.04","basis":"source","source_ids":["SRC-000608"]},{"id":"REL-002026","type":"used_in","from":"MDL-000322","to":"PRS-020","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002027","type":"uses_technology","from":"MDL-000322","to":"TEC-011","basis":"derived","via":"equipment category"},{"id":"REL-002028","type":"supports_material","from":"MDL-000322","to":"MAT-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000608"]},{"id":"REL-002029","type":"manufactures","from":"CMP-000219","to":"MDL-000323","basis":"source","source_ids":["SRC-000609"],"confidence":"MEDIUM"},{"id":"REL-002030","type":"part_of","from":"MDL-000323","to":"PRD-000287","basis":"derived"},{"id":"REL-002031","type":"classified_as","from":"MDL-000323","to":"EQP-A08.04","basis":"source","source_ids":["SRC-000609"]},{"id":"REL-002032","type":"used_in","from":"MDL-000323","to":"PRS-020","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002033","type":"uses_technology","from":"MDL-000323","to":"TEC-011","basis":"derived","via":"equipment category"},{"id":"REL-002034","type":"manufactures","from":"CMP-000219","to":"MDL-000324","basis":"source","source_ids":["SRC-000610"],"confidence":"MEDIUM"},{"id":"REL-002035","type":"part_of","from":"MDL-000324","to":"PRD-000287","basis":"derived"},{"id":"REL-002036","type":"classified_as","from":"MDL-000324","to":"EQP-A08.04","basis":"source","source_ids":["SRC-000610"]},{"id":"REL-002037","type":"used_in","from":"MDL-000324","to":"PRS-020","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002038","type":"uses_technology","from":"MDL-000324","to":"TEC-011","basis":"derived","via":"equipment category"},{"id":"REL-002039","type":"manufactures","from":"CMP-000219","to":"MDL-000325","basis":"source","source_ids":["SRC-000611"],"confidence":"MEDIUM"},{"id":"REL-002040","type":"part_of","from":"MDL-000325","to":"PRD-000288","basis":"derived"},{"id":"REL-002041","type":"classified_as","from":"MDL-000325","to":"EQP-G03","basis":"source","source_ids":["SRC-000611"]},{"id":"REL-002042","type":"used_in","from":"MDL-000325","to":"PRS-009","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002043","type":"uses_technology","from":"MDL-000325","to":"TEC-023","basis":"derived","via":"equipment category"},{"id":"REL-002044","type":"manufactures","from":"CMP-000220","to":"MDL-000326","basis":"source","source_ids":["SRC-000612"],"confidence":"MEDIUM"},{"id":"REL-002045","type":"part_of","from":"MDL-000326","to":"PRD-000289","basis":"derived"},{"id":"REL-002046","type":"classified_as","from":"MDL-000326","to":"EQP-A09.02","basis":"source","source_ids":["SRC-000612"]},{"id":"REL-002047","type":"used_in","from":"MDL-000326","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002048","type":"used_in","from":"MDL-000326","to":"PRS-014","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002049","type":"uses_technology","from":"MDL-000326","to":"TEC-016","basis":"derived","via":"equipment category"},{"id":"REL-002050","type":"manufactures","from":"CMP-000220","to":"MDL-000327","basis":"source","source_ids":["SRC-000509"],"confidence":"MEDIUM"},{"id":"REL-002051","type":"part_of","from":"MDL-000327","to":"PRD-000289","basis":"derived"},{"id":"REL-002052","type":"classified_as","from":"MDL-000327","to":"EQP-A08.02","basis":"source","source_ids":["SRC-000509"]},{"id":"REL-002053","type":"used_in","from":"MDL-000327","to":"PRS-020","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002054","type":"uses_technology","from":"MDL-000327","to":"TEC-009","basis":"derived","via":"equipment category"},{"id":"REL-002055","type":"manufactures","from":"CMP-000221","to":"MDL-000328","basis":"source","source_ids":["SRC-000613"],"confidence":"MEDIUM"},{"id":"REL-002056","type":"part_of","from":"MDL-000328","to":"PRD-000290","basis":"derived"},{"id":"REL-002057","type":"classified_as","from":"MDL-000328","to":"EQP-D20","basis":"source","source_ids":["SRC-000613"]},{"id":"REL-002058","type":"used_in","from":"MDL-000328","to":"PRS-046","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002059","type":"uses_technology","from":"MDL-000328","to":"TEC-046","basis":"derived","via":"equipment category"},{"id":"REL-002060","type":"manufactures","from":"CMP-000221","to":"MDL-000329","basis":"source","source_ids":["SRC-000614"],"confidence":"MEDIUM"},{"id":"REL-002061","type":"part_of","from":"MDL-000329","to":"PRD-000290","basis":"derived"},{"id":"REL-002062","type":"classified_as","from":"MDL-000329","to":"EQP-D20","basis":"source","source_ids":["SRC-000614"]},{"id":"REL-002063","type":"used_in","from":"MDL-000329","to":"PRS-046","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002064","type":"uses_technology","from":"MDL-000329","to":"TEC-046","basis":"derived","via":"equipment category"},{"id":"REL-002065","type":"supports_application","from":"MDL-000329","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000614"]},{"id":"REL-002066","type":"manufactures","from":"CMP-000222","to":"MDL-000330","basis":"source","source_ids":["SRC-000615"],"confidence":"MEDIUM"},{"id":"REL-002067","type":"part_of","from":"MDL-000330","to":"PRD-000291","basis":"derived"},{"id":"REL-002068","type":"classified_as","from":"MDL-000330","to":"EQP-C10","basis":"source","source_ids":["SRC-000615"]},{"id":"REL-002069","type":"used_in","from":"MDL-000330","to":"PRS-033","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002070","type":"uses_technology","from":"MDL-000330","to":"TEC-039","basis":"derived","via":"equipment category"},{"id":"REL-002071","type":"supports_application","from":"MDL-000330","to":"APP-018","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000615"]},{"id":"REL-002072","type":"manufactures","from":"CMP-000223","to":"MDL-000331","basis":"source","source_ids":["SRC-000616"],"confidence":"MEDIUM"},{"id":"REL-002073","type":"part_of","from":"MDL-000331","to":"PRD-000292","basis":"derived"},{"id":"REL-002074","type":"classified_as","from":"MDL-000331","to":"EQP-C11","basis":"source","source_ids":["SRC-000616"]},{"id":"REL-002075","type":"used_in","from":"MDL-000331","to":"PRS-035","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002076","type":"used_in","from":"MDL-000331","to":"PRS-050","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002077","type":"uses_technology","from":"MDL-000331","to":"TEC-041","basis":"derived","via":"equipment category"},{"id":"REL-002078","type":"manufactures","from":"CMP-000223","to":"MDL-000332","basis":"source","source_ids":["SRC-000617"],"confidence":"MEDIUM"},{"id":"REL-002079","type":"part_of","from":"MDL-000332","to":"PRD-000292","basis":"derived"},{"id":"REL-002080","type":"classified_as","from":"MDL-000332","to":"EQP-C11","basis":"source","source_ids":["SRC-000617"]},{"id":"REL-002081","type":"used_in","from":"MDL-000332","to":"PRS-035","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002082","type":"used_in","from":"MDL-000332","to":"PRS-050","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002083","type":"uses_technology","from":"MDL-000332","to":"TEC-041","basis":"derived","via":"equipment category"},{"id":"REL-002084","type":"manufactures","from":"CMP-000223","to":"MDL-000333","basis":"source","source_ids":["SRC-000618"],"confidence":"MEDIUM"},{"id":"REL-002085","type":"part_of","from":"MDL-000333","to":"PRD-000292","basis":"derived"},{"id":"REL-002086","type":"classified_as","from":"MDL-000333","to":"EQP-C10","basis":"source","source_ids":["SRC-000618"]},{"id":"REL-002087","type":"used_in","from":"MDL-000333","to":"PRS-033","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002088","type":"uses_technology","from":"MDL-000333","to":"TEC-039","basis":"derived","via":"equipment category"},{"id":"REL-002089","type":"manufactures","from":"CMP-000224","to":"MDL-000334","basis":"source","source_ids":["SRC-000619"],"confidence":"MEDIUM"},{"id":"REL-002090","type":"part_of","from":"MDL-000334","to":"PRD-000293","basis":"derived"},{"id":"REL-002091","type":"classified_as","from":"MDL-000334","to":"EQP-C11","basis":"source","source_ids":["SRC-000619"]},{"id":"REL-002092","type":"used_in","from":"MDL-000334","to":"PRS-035","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002093","type":"used_in","from":"MDL-000334","to":"PRS-050","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002094","type":"uses_technology","from":"MDL-000334","to":"TEC-041","basis":"derived","via":"equipment category"},{"id":"REL-002095","type":"manufactures","from":"CMP-000224","to":"MDL-000335","basis":"source","source_ids":["SRC-000620"],"confidence":"MEDIUM"},{"id":"REL-002096","type":"part_of","from":"MDL-000335","to":"PRD-000293","basis":"derived"},{"id":"REL-002097","type":"classified_as","from":"MDL-000335","to":"EQP-C11","basis":"source","source_ids":["SRC-000620"]},{"id":"REL-002098","type":"used_in","from":"MDL-000335","to":"PRS-035","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002099","type":"used_in","from":"MDL-000335","to":"PRS-050","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002100","type":"uses_technology","from":"MDL-000335","to":"TEC-041","basis":"derived","via":"equipment category"},{"id":"REL-002101","type":"manufactures","from":"CMP-000224","to":"MDL-000336","basis":"source","source_ids":["SRC-000621"],"confidence":"MEDIUM"},{"id":"REL-002102","type":"part_of","from":"MDL-000336","to":"PRD-000294","basis":"derived"},{"id":"REL-002103","type":"classified_as","from":"MDL-000336","to":"EQP-C17","basis":"source","source_ids":["SRC-000621"]},{"id":"REL-002104","type":"used_in","from":"MDL-000336","to":"PRS-049","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002105","type":"used_in","from":"MDL-000336","to":"PRS-050","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002106","type":"used_in","from":"MDL-000336","to":"PRS-051","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002107","type":"uses_technology","from":"MDL-000336","to":"TEC-043","basis":"derived","via":"equipment category"},{"id":"REL-002108","type":"supports_application","from":"MDL-000336","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000621"]},{"id":"REL-002109","type":"manufactures","from":"CMP-000225","to":"MDL-000337","basis":"source","source_ids":["SRC-000622"],"confidence":"MEDIUM"},{"id":"REL-002110","type":"part_of","from":"MDL-000337","to":"PRD-000295","basis":"derived"},{"id":"REL-002111","type":"classified_as","from":"MDL-000337","to":"EQP-A15","basis":"source","source_ids":["SRC-000622"]},{"id":"REL-002112","type":"uses_technology","from":"MDL-000337","to":"TEC-072","basis":"source","source_ids":["SRC-000622"],"via":"source-stated laser type"},{"id":"REL-002113","type":"manufactures","from":"CMP-000226","to":"MDL-000338","basis":"source","source_ids":["SRC-000623"],"confidence":"MEDIUM"},{"id":"REL-002114","type":"part_of","from":"MDL-000338","to":"PRD-000296","basis":"derived"},{"id":"REL-002115","type":"classified_as","from":"MDL-000338","to":"EQP-A15","basis":"source","source_ids":["SRC-000623"]},{"id":"REL-002116","type":"uses_technology","from":"MDL-000338","to":"TEC-072","basis":"source","source_ids":["SRC-000623"],"via":"source-stated laser type"},{"id":"REL-002117","type":"uses_technology","from":"MDL-000338","to":"TEC-078","basis":"source","source_ids":["SRC-000623"],"via":"source-stated laser type"},{"id":"REL-002118","type":"manufactures","from":"CMP-000226","to":"MDL-000339","basis":"source","source_ids":["SRC-000624"],"confidence":"MEDIUM"},{"id":"REL-002119","type":"part_of","from":"MDL-000339","to":"PRD-000296","basis":"derived"},{"id":"REL-002120","type":"classified_as","from":"MDL-000339","to":"EQP-C29","basis":"source","source_ids":["SRC-000624"]},{"id":"REL-002121","type":"used_in","from":"MDL-000339","to":"PRS-039","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002122","type":"uses_technology","from":"MDL-000339","to":"TEC-065","basis":"source","source_ids":["SRC-000624"],"via":"source-stated laser type"},{"id":"REL-002123","type":"uses_technology","from":"MDL-000339","to":"TEC-078","basis":"source","source_ids":["SRC-000624"],"via":"source-stated laser type"},{"id":"REL-002124","type":"supports_material","from":"MDL-000339","to":"MAT-009","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000624"]},{"id":"REL-002125","type":"supports_material","from":"MDL-000339","to":"MAT-010","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000624"]},{"id":"REL-002126","type":"manufactures","from":"CMP-000226","to":"MDL-000340","basis":"source","source_ids":["SRC-000625"],"confidence":"MEDIUM"},{"id":"REL-002127","type":"part_of","from":"MDL-000340","to":"PRD-000296","basis":"derived"},{"id":"REL-002128","type":"classified_as","from":"MDL-000340","to":"EQP-A15","basis":"source","source_ids":["SRC-000625"]},{"id":"REL-002129","type":"uses_technology","from":"MDL-000340","to":"TEC-072","basis":"source","source_ids":["SRC-000625"],"via":"source-stated laser type"},{"id":"REL-002130","type":"uses_technology","from":"MDL-000340","to":"TEC-078","basis":"source","source_ids":["SRC-000625"],"via":"source-stated laser type"},{"id":"REL-002131","type":"manufactures","from":"CMP-000226","to":"MDL-000341","basis":"source","source_ids":["SRC-000626"],"confidence":"MEDIUM"},{"id":"REL-002132","type":"part_of","from":"MDL-000341","to":"PRD-000296","basis":"derived"},{"id":"REL-002133","type":"classified_as","from":"MDL-000341","to":"EQP-A15","basis":"source","source_ids":["SRC-000626"]},{"id":"REL-002134","type":"uses_technology","from":"MDL-000341","to":"TEC-072","basis":"source","source_ids":["SRC-000626"],"via":"source-stated laser type"},{"id":"REL-002135","type":"manufactures","from":"CMP-000228","to":"MDL-000342","basis":"source","source_ids":["SRC-000627"],"confidence":"MEDIUM"},{"id":"REL-002136","type":"part_of","from":"MDL-000342","to":"PRD-000297","basis":"derived"},{"id":"REL-002137","type":"used_in","from":"MDL-000342","to":"PRS-057","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002138","type":"uses_technology","from":"MDL-000342","to":"TEC-082","basis":"source","source_ids":["SRC-000627"],"via":"source-stated laser type"},{"id":"REL-002139","type":"manufactures","from":"CMP-000228","to":"MDL-000343","basis":"source","source_ids":["SRC-000628"],"confidence":"MEDIUM"},{"id":"REL-002140","type":"part_of","from":"MDL-000343","to":"PRD-000297","basis":"derived"},{"id":"REL-002141","type":"used_in","from":"MDL-000343","to":"PRS-057","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002142","type":"uses_technology","from":"MDL-000343","to":"TEC-082","basis":"source","source_ids":["SRC-000628"],"via":"source-stated laser type"},{"id":"REL-002143","type":"manufactures","from":"CMP-000229","to":"MDL-000344","basis":"source","source_ids":["SRC-000629"],"confidence":"MEDIUM"},{"id":"REL-002144","type":"part_of","from":"MDL-000344","to":"PRD-000298","basis":"derived"},{"id":"REL-002145","type":"classified_as","from":"MDL-000344","to":"EQP-D06","basis":"source","source_ids":["SRC-000629"]},{"id":"REL-002146","type":"used_in","from":"MDL-000344","to":"PRS-047","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002147","type":"uses_technology","from":"MDL-000344","to":"TEC-047","basis":"derived","via":"equipment category"},{"id":"REL-002148","type":"manufactures","from":"CMP-000229","to":"MDL-000345","basis":"source","source_ids":["SRC-000630"],"confidence":"MEDIUM"},{"id":"REL-002149","type":"part_of","from":"MDL-000345","to":"PRD-000298","basis":"derived"},{"id":"REL-002150","type":"classified_as","from":"MDL-000345","to":"EQP-C17","basis":"source","source_ids":["SRC-000630"]},{"id":"REL-002151","type":"used_in","from":"MDL-000345","to":"PRS-049","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002152","type":"used_in","from":"MDL-000345","to":"PRS-050","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002153","type":"used_in","from":"MDL-000345","to":"PRS-051","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002154","type":"uses_technology","from":"MDL-000345","to":"TEC-043","basis":"derived","via":"equipment category"},{"id":"REL-002155","type":"supports_application","from":"MDL-000345","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000630"]},{"id":"REL-002156","type":"manufactures","from":"CMP-000229","to":"MDL-000346","basis":"source","source_ids":["SRC-000631"],"confidence":"MEDIUM"},{"id":"REL-002157","type":"part_of","from":"MDL-000346","to":"PRD-000298","basis":"derived"},{"id":"REL-002158","type":"classified_as","from":"MDL-000346","to":"EQP-D19","basis":"source","source_ids":["SRC-000631"]},{"id":"REL-002159","type":"used_in","from":"MDL-000346","to":"PRS-053","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002160","type":"uses_technology","from":"MDL-000346","to":"TEC-048","basis":"derived","via":"equipment category"},{"id":"REL-002161","type":"manufactures","from":"CMP-000229","to":"MDL-000347","basis":"source","source_ids":["SRC-000632"],"confidence":"MEDIUM"},{"id":"REL-002162","type":"part_of","from":"MDL-000347","to":"PRD-000298","basis":"derived"},{"id":"REL-002163","type":"classified_as","from":"MDL-000347","to":"EQP-C11","basis":"source","source_ids":["SRC-000632"]},{"id":"REL-002164","type":"used_in","from":"MDL-000347","to":"PRS-035","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002165","type":"used_in","from":"MDL-000347","to":"PRS-050","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002166","type":"uses_technology","from":"MDL-000347","to":"TEC-041","basis":"derived","via":"equipment category"},{"id":"REL-002167","type":"manufactures","from":"CMP-000230","to":"MDL-000348","basis":"source","source_ids":["SRC-000633"],"confidence":"MEDIUM"},{"id":"REL-002168","type":"part_of","from":"MDL-000348","to":"PRD-000299","basis":"derived"},{"id":"REL-002169","type":"classified_as","from":"MDL-000348","to":"EQP-C06","basis":"source","source_ids":["SRC-000633"]},{"id":"REL-002170","type":"used_in","from":"MDL-000348","to":"PRS-031","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002171","type":"manufactures","from":"CMP-000230","to":"MDL-000349","basis":"source","source_ids":["SRC-000634"],"confidence":"MEDIUM"},{"id":"REL-002172","type":"part_of","from":"MDL-000349","to":"PRD-000299","basis":"derived"},{"id":"REL-002173","type":"classified_as","from":"MDL-000349","to":"EQP-C06","basis":"source","source_ids":["SRC-000634"]},{"id":"REL-002174","type":"used_in","from":"MDL-000349","to":"PRS-031","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002175","type":"manufactures","from":"CMP-000230","to":"MDL-000350","basis":"source","source_ids":["SRC-000635"],"confidence":"MEDIUM"},{"id":"REL-002176","type":"part_of","from":"MDL-000350","to":"PRD-000299","basis":"derived"},{"id":"REL-002177","type":"classified_as","from":"MDL-000350","to":"EQP-C06","basis":"source","source_ids":["SRC-000635"]},{"id":"REL-002178","type":"used_in","from":"MDL-000350","to":"PRS-031","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002179","type":"manufactures","from":"CMP-000230","to":"MDL-000351","basis":"source","source_ids":["SRC-000636"],"confidence":"MEDIUM"},{"id":"REL-002180","type":"part_of","from":"MDL-000351","to":"PRD-000300","basis":"derived"},{"id":"REL-002181","type":"classified_as","from":"MDL-000351","to":"EQP-C07","basis":"source","source_ids":["SRC-000636"]},{"id":"REL-002182","type":"used_in","from":"MDL-000351","to":"PRS-031","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002183","type":"manufactures","from":"CMP-000231","to":"MDL-000352","basis":"source","source_ids":["SRC-000522"],"confidence":"MEDIUM"},{"id":"REL-002184","type":"part_of","from":"MDL-000352","to":"PRD-000301","basis":"derived"},{"id":"REL-002185","type":"classified_as","from":"MDL-000352","to":"EQP-A01.05","basis":"source","source_ids":["SRC-000522"]},{"id":"REL-002186","type":"used_in","from":"MDL-000352","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002187","type":"used_in","from":"MDL-000352","to":"PRS-045","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002188","type":"used_in","from":"MDL-000352","to":"PRS-046","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002189","type":"used_in","from":"MDL-000352","to":"PRS-047","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002190","type":"uses_technology","from":"MDL-000352","to":"TEC-005","basis":"derived","via":"equipment category"},{"id":"REL-002191","type":"supports_application","from":"MDL-000352","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000522"]},{"id":"REL-002192","type":"manufactures","from":"CMP-000231","to":"MDL-000353","basis":"source","source_ids":["SRC-000637"],"confidence":"MEDIUM"},{"id":"REL-002193","type":"part_of","from":"MDL-000353","to":"PRD-000301","basis":"derived"},{"id":"REL-002194","type":"classified_as","from":"MDL-000353","to":"EQP-A01.05","basis":"source","source_ids":["SRC-000637"]},{"id":"REL-002195","type":"used_in","from":"MDL-000353","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002196","type":"used_in","from":"MDL-000353","to":"PRS-045","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002197","type":"used_in","from":"MDL-000353","to":"PRS-046","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002198","type":"used_in","from":"MDL-000353","to":"PRS-047","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002199","type":"uses_technology","from":"MDL-000353","to":"TEC-005","basis":"derived","via":"equipment category"},{"id":"REL-002200","type":"supports_application","from":"MDL-000353","to":"APP-010","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000637"]},{"id":"REL-002201","type":"supports_application","from":"MDL-000353","to":"APP-014","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000637"]},{"id":"REL-002202","type":"supports_application","from":"MDL-000353","to":"APP-016","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000637"]},{"id":"REL-002203","type":"manufactures","from":"CMP-000231","to":"MDL-000354","basis":"source","source_ids":["SRC-000638"],"confidence":"MEDIUM"},{"id":"REL-002204","type":"part_of","from":"MDL-000354","to":"PRD-000301","basis":"derived"},{"id":"REL-002205","type":"classified_as","from":"MDL-000354","to":"EQP-D16","basis":"source","source_ids":["SRC-000638"]},{"id":"REL-002206","type":"used_in","from":"MDL-000354","to":"PRS-048","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002207","type":"uses_technology","from":"MDL-000354","to":"TEC-049","basis":"derived","via":"equipment category"},{"id":"REL-002208","type":"supports_application","from":"MDL-000354","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000638"]},{"id":"REL-002209","type":"manufactures","from":"CMP-000231","to":"MDL-000355","basis":"source","source_ids":["SRC-000639"],"confidence":"MEDIUM"},{"id":"REL-002210","type":"part_of","from":"MDL-000355","to":"PRD-000301","basis":"derived"},{"id":"REL-002211","type":"classified_as","from":"MDL-000355","to":"EQP-D15","basis":"source","source_ids":["SRC-000639"]},{"id":"REL-002212","type":"used_in","from":"MDL-000355","to":"PRS-045","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002213","type":"uses_technology","from":"MDL-000355","to":"TEC-055","basis":"derived","via":"equipment category"},{"id":"REL-002214","type":"manufactures","from":"CMP-000232","to":"MDL-000356","basis":"source","source_ids":["SRC-000523"],"confidence":"MEDIUM"},{"id":"REL-002215","type":"part_of","from":"MDL-000356","to":"PRD-000302","basis":"derived"},{"id":"REL-002216","type":"classified_as","from":"MDL-000356","to":"EQP-C32","basis":"source","source_ids":["SRC-000523"]},{"id":"REL-002217","type":"used_in","from":"MDL-000356","to":"PRS-039","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002218","type":"supports_material","from":"MDL-000356","to":"MAT-003","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000523"]},{"id":"REL-002219","type":"supports_application","from":"MDL-000356","to":"APP-011","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000523"]},{"id":"REL-002220","type":"manufactures","from":"CMP-000232","to":"MDL-000357","basis":"source","source_ids":["SRC-000640"],"confidence":"MEDIUM"},{"id":"REL-002221","type":"part_of","from":"MDL-000357","to":"PRD-000302","basis":"derived"},{"id":"REL-002222","type":"classified_as","from":"MDL-000357","to":"EQP-C32","basis":"source","source_ids":["SRC-000640"]},{"id":"REL-002223","type":"used_in","from":"MDL-000357","to":"PRS-039","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002224","type":"manufactures","from":"CMP-000233","to":"MDL-000358","basis":"source","source_ids":["SRC-000641"],"confidence":"MEDIUM"},{"id":"REL-002225","type":"part_of","from":"MDL-000358","to":"PRD-000303","basis":"derived"},{"id":"REL-002226","type":"classified_as","from":"MDL-000358","to":"EQP-C11","basis":"source","source_ids":["SRC-000641"]},{"id":"REL-002227","type":"used_in","from":"MDL-000358","to":"PRS-035","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002228","type":"used_in","from":"MDL-000358","to":"PRS-050","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002229","type":"uses_technology","from":"MDL-000358","to":"TEC-041","basis":"derived","via":"equipment category"},{"id":"REL-002230","type":"manufactures","from":"CMP-000233","to":"MDL-000359","basis":"source","source_ids":["SRC-000642"],"confidence":"MEDIUM"},{"id":"REL-002231","type":"part_of","from":"MDL-000359","to":"PRD-000303","basis":"derived"},{"id":"REL-002232","type":"classified_as","from":"MDL-000359","to":"EQP-C11","basis":"source","source_ids":["SRC-000642"]},{"id":"REL-002233","type":"used_in","from":"MDL-000359","to":"PRS-035","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002234","type":"used_in","from":"MDL-000359","to":"PRS-050","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002235","type":"uses_technology","from":"MDL-000359","to":"TEC-041","basis":"derived","via":"equipment category"},{"id":"REL-002236","type":"manufactures","from":"CMP-000233","to":"MDL-000360","basis":"source","source_ids":["SRC-000643"],"confidence":"MEDIUM"},{"id":"REL-002237","type":"part_of","from":"MDL-000360","to":"PRD-000303","basis":"derived"},{"id":"REL-002238","type":"classified_as","from":"MDL-000360","to":"EQP-D19","basis":"source","source_ids":["SRC-000643"]},{"id":"REL-002239","type":"used_in","from":"MDL-000360","to":"PRS-053","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002240","type":"uses_technology","from":"MDL-000360","to":"TEC-048","basis":"derived","via":"equipment category"},{"id":"REL-002241","type":"supports_material","from":"MDL-000360","to":"MAT-010","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000643"]},{"id":"REL-002242","type":"manufactures","from":"CMP-000233","to":"MDL-000361","basis":"source","source_ids":["SRC-000644"],"confidence":"MEDIUM"},{"id":"REL-002243","type":"part_of","from":"MDL-000361","to":"PRD-000304","basis":"derived"},{"id":"REL-002244","type":"classified_as","from":"MDL-000361","to":"EQP-C36","basis":"source","source_ids":["SRC-000644"]},{"id":"REL-002245","type":"used_in","from":"MDL-000361","to":"PRS-040","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002246","type":"uses_technology","from":"MDL-000361","to":"TEC-031","basis":"derived","via":"equipment category"},{"id":"REL-002247","type":"supports_application","from":"MDL-000361","to":"APP-017","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000644"]},{"id":"REL-002248","type":"manufactures","from":"CMP-000234","to":"MDL-000362","basis":"source","source_ids":["SRC-000645"],"confidence":"MEDIUM"},{"id":"REL-002249","type":"part_of","from":"MDL-000362","to":"PRD-000305","basis":"derived"},{"id":"REL-002250","type":"classified_as","from":"MDL-000362","to":"EQP-A01.06","basis":"source","source_ids":["SRC-000645"]},{"id":"REL-002251","type":"used_in","from":"MDL-000362","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002252","type":"uses_technology","from":"MDL-000362","to":"TEC-006","basis":"derived","via":"equipment category"},{"id":"REL-002253","type":"manufactures","from":"CMP-000234","to":"MDL-000363","basis":"source","source_ids":["SRC-000646"],"confidence":"MEDIUM"},{"id":"REL-002254","type":"part_of","from":"MDL-000363","to":"PRD-000305","basis":"derived"},{"id":"REL-002255","type":"classified_as","from":"MDL-000363","to":"EQP-A01.06","basis":"source","source_ids":["SRC-000646"]},{"id":"REL-002256","type":"used_in","from":"MDL-000363","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002257","type":"uses_technology","from":"MDL-000363","to":"TEC-006","basis":"derived","via":"equipment category"},{"id":"REL-002258","type":"manufactures","from":"CMP-000234","to":"MDL-000364","basis":"source","source_ids":["SRC-000647"],"confidence":"MEDIUM"},{"id":"REL-002259","type":"part_of","from":"MDL-000364","to":"PRD-000305","basis":"derived"},{"id":"REL-002260","type":"classified_as","from":"MDL-000364","to":"EQP-B07","basis":"source","source_ids":["SRC-000647"]},{"id":"REL-002261","type":"used_in","from":"MDL-000364","to":"PRS-028","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002262","type":"uses_technology","from":"MDL-000364","to":"TEC-006","basis":"derived","via":"equipment category"},{"id":"REL-002263","type":"manufactures","from":"CMP-000234","to":"MDL-000365","basis":"source","source_ids":["SRC-000648"],"confidence":"MEDIUM"},{"id":"REL-002264","type":"part_of","from":"MDL-000365","to":"PRD-000305","basis":"derived"},{"id":"REL-002265","type":"classified_as","from":"MDL-000365","to":"EQP-B07","basis":"source","source_ids":["SRC-000648"]},{"id":"REL-002266","type":"used_in","from":"MDL-000365","to":"PRS-028","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002267","type":"uses_technology","from":"MDL-000365","to":"TEC-006","basis":"derived","via":"equipment category"},{"id":"REL-002268","type":"manufactures","from":"CMP-000235","to":"MDL-000366","basis":"source","source_ids":["SRC-000649"],"confidence":"LOW"},{"id":"REL-002269","type":"part_of","from":"MDL-000366","to":"PRD-000306","basis":"derived"},{"id":"REL-002270","type":"classified_as","from":"MDL-000366","to":"EQP-A19","basis":"source","source_ids":["SRC-000649"]},{"id":"REL-002271","type":"used_in","from":"MDL-000366","to":"PRS-024","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002272","type":"uses_technology","from":"MDL-000366","to":"TEC-029","basis":"derived","via":"equipment category"},{"id":"REL-002273","type":"supports_material","from":"MDL-000366","to":"MAT-003","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000649"]},{"id":"REL-002274","type":"supports_application","from":"MDL-000366","to":"APP-011","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000649"]},{"id":"REL-002275","type":"manufactures","from":"CMP-000235","to":"MDL-000367","basis":"source","source_ids":["SRC-000649"],"confidence":"LOW"},{"id":"REL-002276","type":"part_of","from":"MDL-000367","to":"PRD-000306","basis":"derived"},{"id":"REL-002277","type":"classified_as","from":"MDL-000367","to":"EQP-C02","basis":"source","source_ids":["SRC-000649"]},{"id":"REL-002278","type":"used_in","from":"MDL-000367","to":"PRS-030","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002279","type":"supports_material","from":"MDL-000367","to":"MAT-003","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000649"]},{"id":"REL-002280","type":"supports_application","from":"MDL-000367","to":"APP-011","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000649"]},{"id":"REL-002281","type":"manufactures","from":"CMP-000236","to":"MDL-000368","basis":"source","source_ids":["SRC-000650"],"confidence":"MEDIUM"},{"id":"REL-002282","type":"part_of","from":"MDL-000368","to":"PRD-000307","basis":"derived"},{"id":"REL-002283","type":"classified_as","from":"MDL-000368","to":"EQP-E03","basis":"source","source_ids":["SRC-000650"]},{"id":"REL-002284","type":"supports_application","from":"MDL-000368","to":"APP-003","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000650"]},{"id":"REL-002285","type":"supports_application","from":"MDL-000368","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000650"]},{"id":"REL-002286","type":"manufactures","from":"CMP-000237","to":"MDL-000369","basis":"source","source_ids":["SRC-000651"],"confidence":"LOW"},{"id":"REL-002287","type":"part_of","from":"MDL-000369","to":"PRD-000308","basis":"derived"},{"id":"REL-002288","type":"classified_as","from":"MDL-000369","to":"EQP-A02","basis":"source","source_ids":["SRC-000651"]},{"id":"REL-002289","type":"used_in","from":"MDL-000369","to":"PRS-017","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002290","type":"used_in","from":"MDL-000369","to":"PRS-019","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002291","type":"supports_application","from":"MDL-000369","to":"APP-014","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000651"]},{"id":"REL-002292","type":"manufactures","from":"CMP-000238","to":"MDL-000370","basis":"source","source_ids":["SRC-000652"],"confidence":"MEDIUM"},{"id":"REL-002293","type":"part_of","from":"MDL-000370","to":"PRD-000309","basis":"derived"},{"id":"REL-002294","type":"classified_as","from":"MDL-000370","to":"EQP-A11","basis":"source","source_ids":["SRC-000652"]},{"id":"REL-002295","type":"used_in","from":"MDL-000370","to":"PRS-011","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002296","type":"used_in","from":"MDL-000370","to":"PRS-012","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002297","type":"uses_technology","from":"MDL-000370","to":"TEC-027","basis":"derived","via":"equipment category"},{"id":"REL-002298","type":"manufactures","from":"CMP-000238","to":"MDL-000371","basis":"source","source_ids":["SRC-000653"],"confidence":"MEDIUM"},{"id":"REL-002299","type":"part_of","from":"MDL-000371","to":"PRD-000309","basis":"derived"},{"id":"REL-002300","type":"classified_as","from":"MDL-000371","to":"EQP-A11","basis":"source","source_ids":["SRC-000653"]},{"id":"REL-002301","type":"used_in","from":"MDL-000371","to":"PRS-011","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002302","type":"used_in","from":"MDL-000371","to":"PRS-012","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002303","type":"uses_technology","from":"MDL-000371","to":"TEC-027","basis":"derived","via":"equipment category"},{"id":"REL-002304","type":"manufactures","from":"CMP-000239","to":"MDL-000372","basis":"source","source_ids":["SRC-000654"],"confidence":"MEDIUM"},{"id":"REL-002305","type":"part_of","from":"MDL-000372","to":"PRD-000310","basis":"derived"},{"id":"REL-002306","type":"classified_as","from":"MDL-000372","to":"EQP-K01","basis":"source","source_ids":["SRC-000654"]},{"id":"REL-002307","type":"used_in","from":"MDL-000372","to":"PRS-001","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002308","type":"supports_material","from":"MDL-000372","to":"MAT-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000654"]},{"id":"REL-002309","type":"manufactures","from":"CMP-000239","to":"MDL-000373","basis":"source","source_ids":["SRC-000655"],"confidence":"MEDIUM"},{"id":"REL-002310","type":"part_of","from":"MDL-000373","to":"PRD-000311","basis":"derived"},{"id":"REL-002311","type":"classified_as","from":"MDL-000373","to":"EQP-K02","basis":"source","source_ids":["SRC-000655"]},{"id":"REL-002312","type":"used_in","from":"MDL-000373","to":"PRS-002","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002313","type":"supports_material","from":"MDL-000373","to":"MAT-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000655"]},{"id":"REL-002314","type":"manufactures","from":"CMP-000240","to":"MDL-000374","basis":"source","source_ids":["SRC-000656"],"confidence":"MEDIUM"},{"id":"REL-002315","type":"part_of","from":"MDL-000374","to":"PRD-000312","basis":"derived"},{"id":"REL-002316","type":"classified_as","from":"MDL-000374","to":"EQP-A05","basis":"source","source_ids":["SRC-000656"]},{"id":"REL-002317","type":"used_in","from":"MDL-000374","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002318","type":"used_in","from":"MDL-000374","to":"PRS-021","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002319","type":"uses_technology","from":"MDL-000374","to":"TEC-030","basis":"derived","via":"equipment category"},{"id":"REL-002320","type":"manufactures","from":"CMP-000240","to":"MDL-000375","basis":"source","source_ids":["SRC-000657"],"confidence":"MEDIUM"},{"id":"REL-002321","type":"part_of","from":"MDL-000375","to":"PRD-000312","basis":"derived"},{"id":"REL-002322","type":"classified_as","from":"MDL-000375","to":"EQP-A05","basis":"source","source_ids":["SRC-000657"]},{"id":"REL-002323","type":"used_in","from":"MDL-000375","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002324","type":"used_in","from":"MDL-000375","to":"PRS-021","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002325","type":"uses_technology","from":"MDL-000375","to":"TEC-030","basis":"derived","via":"equipment category"},{"id":"REL-002326","type":"manufactures","from":"CMP-000240","to":"MDL-000376","basis":"source","source_ids":["SRC-000658"],"confidence":"MEDIUM"},{"id":"REL-002327","type":"part_of","from":"MDL-000376","to":"PRD-000312","basis":"derived"},{"id":"REL-002328","type":"classified_as","from":"MDL-000376","to":"EQP-A05","basis":"source","source_ids":["SRC-000658"]},{"id":"REL-002329","type":"used_in","from":"MDL-000376","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002330","type":"used_in","from":"MDL-000376","to":"PRS-021","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002331","type":"uses_technology","from":"MDL-000376","to":"TEC-030","basis":"derived","via":"equipment category"},{"id":"REL-002332","type":"manufactures","from":"CMP-000241","to":"MDL-000377","basis":"source","source_ids":["SRC-000659"],"confidence":"MEDIUM"},{"id":"REL-002333","type":"part_of","from":"MDL-000377","to":"PRD-000313","basis":"derived"},{"id":"REL-002334","type":"classified_as","from":"MDL-000377","to":"EQP-A09.07","basis":"source","source_ids":["SRC-000659"]},{"id":"REL-002335","type":"used_in","from":"MDL-000377","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002336","type":"used_in","from":"MDL-000377","to":"PRS-016","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002337","type":"uses_technology","from":"MDL-000377","to":"TEC-020","basis":"derived","via":"equipment category"},{"id":"REL-002338","type":"supports_application","from":"MDL-000377","to":"APP-018","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000659"]},{"id":"REL-002339","type":"manufactures","from":"CMP-000241","to":"MDL-000378","basis":"source","source_ids":["SRC-000660"],"confidence":"MEDIUM"},{"id":"REL-002340","type":"part_of","from":"MDL-000378","to":"PRD-000313","basis":"derived"},{"id":"REL-002341","type":"classified_as","from":"MDL-000378","to":"EQP-A09.07","basis":"source","source_ids":["SRC-000660"]},{"id":"REL-002342","type":"used_in","from":"MDL-000378","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002343","type":"used_in","from":"MDL-000378","to":"PRS-016","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002344","type":"uses_technology","from":"MDL-000378","to":"TEC-020","basis":"derived","via":"equipment category"},{"id":"REL-002345","type":"manufactures","from":"CMP-000241","to":"MDL-000379","basis":"source","source_ids":["SRC-000661"],"confidence":"MEDIUM"},{"id":"REL-002346","type":"part_of","from":"MDL-000379","to":"PRD-000313","basis":"derived"},{"id":"REL-002347","type":"classified_as","from":"MDL-000379","to":"EQP-A09.06","basis":"source","source_ids":["SRC-000661"]},{"id":"REL-002348","type":"used_in","from":"MDL-000379","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002349","type":"used_in","from":"MDL-000379","to":"PRS-015","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002350","type":"uses_technology","from":"MDL-000379","to":"TEC-019","basis":"derived","via":"equipment category"},{"id":"REL-002351","type":"manufactures","from":"CMP-000242","to":"MDL-000380","basis":"source","source_ids":["SRC-000662"],"confidence":"MEDIUM"},{"id":"REL-002352","type":"part_of","from":"MDL-000380","to":"PRD-000314","basis":"derived"},{"id":"REL-002353","type":"classified_as","from":"MDL-000380","to":"EQP-A05","basis":"source","source_ids":["SRC-000662"]},{"id":"REL-002354","type":"used_in","from":"MDL-000380","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002355","type":"used_in","from":"MDL-000380","to":"PRS-021","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002356","type":"uses_technology","from":"MDL-000380","to":"TEC-030","basis":"derived","via":"equipment category"},{"id":"REL-002357","type":"manufactures","from":"CMP-000242","to":"MDL-000381","basis":"source","source_ids":["SRC-000663"],"confidence":"MEDIUM"},{"id":"REL-002358","type":"part_of","from":"MDL-000381","to":"PRD-000314","basis":"derived"},{"id":"REL-002359","type":"classified_as","from":"MDL-000381","to":"EQP-A05","basis":"source","source_ids":["SRC-000663"]},{"id":"REL-002360","type":"used_in","from":"MDL-000381","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002361","type":"used_in","from":"MDL-000381","to":"PRS-021","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002362","type":"uses_technology","from":"MDL-000381","to":"TEC-030","basis":"derived","via":"equipment category"},{"id":"REL-002363","type":"manufactures","from":"CMP-000242","to":"MDL-000382","basis":"source","source_ids":["SRC-000664"],"confidence":"MEDIUM"},{"id":"REL-002364","type":"part_of","from":"MDL-000382","to":"PRD-000314","basis":"derived"},{"id":"REL-002365","type":"classified_as","from":"MDL-000382","to":"EQP-A05","basis":"source","source_ids":["SRC-000664"]},{"id":"REL-002366","type":"used_in","from":"MDL-000382","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002367","type":"used_in","from":"MDL-000382","to":"PRS-021","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002368","type":"uses_technology","from":"MDL-000382","to":"TEC-030","basis":"derived","via":"equipment category"},{"id":"REL-002369","type":"manufactures","from":"CMP-000242","to":"MDL-000383","basis":"source","source_ids":["SRC-000665"],"confidence":"MEDIUM"},{"id":"REL-002370","type":"part_of","from":"MDL-000383","to":"PRD-000314","basis":"derived"},{"id":"REL-002371","type":"classified_as","from":"MDL-000383","to":"EQP-A05","basis":"source","source_ids":["SRC-000665"]},{"id":"REL-002372","type":"used_in","from":"MDL-000383","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002373","type":"used_in","from":"MDL-000383","to":"PRS-021","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002374","type":"uses_technology","from":"MDL-000383","to":"TEC-030","basis":"derived","via":"equipment category"},{"id":"REL-002375","type":"manufactures","from":"CMP-000243","to":"MDL-000384","basis":"source","source_ids":["SRC-000535"],"confidence":"LOW"},{"id":"REL-002376","type":"part_of","from":"MDL-000384","to":"PRD-000315","basis":"derived"},{"id":"REL-002377","type":"classified_as","from":"MDL-000384","to":"EQP-A10","basis":"source","source_ids":["SRC-000535"]},{"id":"REL-002378","type":"used_in","from":"MDL-000384","to":"PRS-022","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002379","type":"uses_technology","from":"MDL-000384","to":"TEC-026","basis":"derived","via":"equipment category"},{"id":"REL-002380","type":"manufactures","from":"CMP-000244","to":"MDL-000385","basis":"source","source_ids":["SRC-000666"],"confidence":"MEDIUM"},{"id":"REL-002381","type":"part_of","from":"MDL-000385","to":"PRD-000316","basis":"derived"},{"id":"REL-002382","type":"classified_as","from":"MDL-000385","to":"EQP-A08.01","basis":"source","source_ids":["SRC-000666"]},{"id":"REL-002383","type":"used_in","from":"MDL-000385","to":"PRS-020","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002384","type":"uses_technology","from":"MDL-000385","to":"TEC-009","basis":"derived","via":"equipment category"},{"id":"REL-002385","type":"manufactures","from":"CMP-000245","to":"MDL-000386","basis":"source","source_ids":["SRC-000667"],"confidence":"MEDIUM"},{"id":"REL-002386","type":"part_of","from":"MDL-000386","to":"PRD-000317","basis":"derived"},{"id":"REL-002387","type":"classified_as","from":"MDL-000386","to":"EQP-A11","basis":"source","source_ids":["SRC-000667"]},{"id":"REL-002388","type":"used_in","from":"MDL-000386","to":"PRS-011","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002389","type":"used_in","from":"MDL-000386","to":"PRS-012","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002390","type":"uses_technology","from":"MDL-000386","to":"TEC-027","basis":"derived","via":"equipment category"},{"id":"REL-002391","type":"manufactures","from":"CMP-000246","to":"MDL-000387","basis":"source","source_ids":["SRC-000668"],"confidence":"MEDIUM"},{"id":"REL-002392","type":"part_of","from":"MDL-000387","to":"PRD-000318","basis":"derived"},{"id":"REL-002393","type":"classified_as","from":"MDL-000387","to":"EQP-F08","basis":"source","source_ids":["SRC-000668"]},{"id":"REL-002394","type":"manufactures","from":"CMP-000251","to":"MDL-000388","basis":"source","source_ids":["SRC-000669"],"confidence":"MEDIUM"},{"id":"REL-002395","type":"part_of","from":"MDL-000388","to":"PRD-000319","basis":"derived"},{"id":"REL-002396","type":"classified_as","from":"MDL-000388","to":"EQP-A01.08","basis":"source","source_ids":["SRC-000669"]},{"id":"REL-002397","type":"used_in","from":"MDL-000388","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002398","type":"used_in","from":"MDL-000388","to":"PRS-045","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002399","type":"used_in","from":"MDL-000388","to":"PRS-047","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002400","type":"uses_technology","from":"MDL-000388","to":"TEC-008","basis":"derived","via":"equipment category"},{"id":"REL-002401","type":"supports_application","from":"MDL-000388","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000669"]},{"id":"REL-002402","type":"manufactures","from":"CMP-000251","to":"MDL-000389","basis":"source","source_ids":["SRC-000670"],"confidence":"MEDIUM"},{"id":"REL-002403","type":"part_of","from":"MDL-000389","to":"PRD-000319","basis":"derived"},{"id":"REL-002404","type":"classified_as","from":"MDL-000389","to":"EQP-A01.08","basis":"source","source_ids":["SRC-000670"]},{"id":"REL-002405","type":"used_in","from":"MDL-000389","to":"PRS-018","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002406","type":"used_in","from":"MDL-000389","to":"PRS-045","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002407","type":"used_in","from":"MDL-000389","to":"PRS-047","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002408","type":"uses_technology","from":"MDL-000389","to":"TEC-008","basis":"derived","via":"equipment category"},{"id":"REL-002409","type":"manufactures","from":"CMP-000253","to":"MDL-000390","basis":"source","source_ids":["SRC-000671"],"confidence":"MEDIUM"},{"id":"REL-002410","type":"part_of","from":"MDL-000390","to":"PRD-000320","basis":"derived"},{"id":"REL-002411","type":"classified_as","from":"MDL-000390","to":"EQP-A32","basis":"source","source_ids":["SRC-000671"]},{"id":"REL-002412","type":"used_in","from":"MDL-000390","to":"PRS-029","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002413","type":"uses_technology","from":"MDL-000390","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-002414","type":"supports_material","from":"MDL-000390","to":"MAT-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000671"]},{"id":"REL-002415","type":"supports_application","from":"MDL-000390","to":"APP-018","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000671"]},{"id":"REL-002416","type":"manufactures","from":"CMP-000253","to":"MDL-000391","basis":"source","source_ids":["SRC-000672"],"confidence":"MEDIUM"},{"id":"REL-002417","type":"part_of","from":"MDL-000391","to":"PRD-000320","basis":"derived"},{"id":"REL-002418","type":"classified_as","from":"MDL-000391","to":"EQP-A32","basis":"source","source_ids":["SRC-000672"]},{"id":"REL-002419","type":"used_in","from":"MDL-000391","to":"PRS-029","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002420","type":"uses_technology","from":"MDL-000391","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-002421","type":"supports_application","from":"MDL-000391","to":"APP-018","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000672"]},{"id":"REL-002422","type":"manufactures","from":"CMP-000254","to":"MDL-000392","basis":"source","source_ids":["SRC-000673"],"confidence":"MEDIUM"},{"id":"REL-002423","type":"part_of","from":"MDL-000392","to":"PRD-000321","basis":"derived"},{"id":"REL-002424","type":"classified_as","from":"MDL-000392","to":"EQP-D19","basis":"source","source_ids":["SRC-000673"]},{"id":"REL-002425","type":"used_in","from":"MDL-000392","to":"PRS-053","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002426","type":"uses_technology","from":"MDL-000392","to":"TEC-048","basis":"derived","via":"equipment category"},{"id":"REL-002427","type":"manufactures","from":"CMP-000255","to":"MDL-000393","basis":"source","source_ids":["SRC-000674"],"confidence":"MEDIUM"},{"id":"REL-002428","type":"part_of","from":"MDL-000393","to":"PRD-000322","basis":"derived"},{"id":"REL-002429","type":"classified_as","from":"MDL-000393","to":"EQP-A09.07","basis":"source","source_ids":["SRC-000674"]},{"id":"REL-002430","type":"used_in","from":"MDL-000393","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002431","type":"used_in","from":"MDL-000393","to":"PRS-016","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002432","type":"uses_technology","from":"MDL-000393","to":"TEC-020","basis":"derived","via":"equipment category"},{"id":"REL-002433","type":"manufactures","from":"CMP-000255","to":"MDL-000394","basis":"source","source_ids":["SRC-000675"],"confidence":"MEDIUM"},{"id":"REL-002434","type":"part_of","from":"MDL-000394","to":"PRD-000323","basis":"derived"},{"id":"REL-002435","type":"classified_as","from":"MDL-000394","to":"EQP-A09.07","basis":"source","source_ids":["SRC-000675"]},{"id":"REL-002436","type":"used_in","from":"MDL-000394","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002437","type":"used_in","from":"MDL-000394","to":"PRS-016","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002438","type":"uses_technology","from":"MDL-000394","to":"TEC-020","basis":"derived","via":"equipment category"},{"id":"REL-002439","type":"manufactures","from":"CMP-000256","to":"MDL-000395","basis":"source","source_ids":["SRC-000676"],"confidence":"MEDIUM"},{"id":"REL-002440","type":"part_of","from":"MDL-000395","to":"PRD-000324","basis":"derived"},{"id":"REL-002441","type":"classified_as","from":"MDL-000395","to":"EQP-A38","basis":"source","source_ids":["SRC-000676"]},{"id":"REL-002442","type":"used_in","from":"MDL-000395","to":"PRS-058","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002443","type":"manufactures","from":"CMP-000256","to":"MDL-000396","basis":"source","source_ids":["SRC-000677"],"confidence":"LOW"},{"id":"REL-002444","type":"part_of","from":"MDL-000396","to":"PRD-000325","basis":"derived"},{"id":"REL-002445","type":"classified_as","from":"MDL-000396","to":"EQP-A37","basis":"source","source_ids":["SRC-000677"]},{"id":"REL-002446","type":"used_in","from":"MDL-000396","to":"PRS-058","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002447","type":"manufactures","from":"CMP-000257","to":"MDL-000397","basis":"source","source_ids":["SRC-000678"],"confidence":"MEDIUM"},{"id":"REL-002448","type":"part_of","from":"MDL-000397","to":"PRD-000326","basis":"derived"},{"id":"REL-002449","type":"classified_as","from":"MDL-000397","to":"EQP-A23","basis":"source","source_ids":["SRC-000678"]},{"id":"REL-002450","type":"used_in","from":"MDL-000397","to":"PRS-027","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002451","type":"uses_technology","from":"MDL-000397","to":"TEC-031","basis":"derived","via":"equipment category"},{"id":"REL-002452","type":"supports_application","from":"MDL-000397","to":"APP-003","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000678"]},{"id":"REL-002453","type":"manufactures","from":"CMP-000257","to":"MDL-000398","basis":"source","source_ids":["SRC-000679"],"confidence":"MEDIUM"},{"id":"REL-002454","type":"part_of","from":"MDL-000398","to":"PRD-000326","basis":"derived"},{"id":"REL-002455","type":"classified_as","from":"MDL-000398","to":"EQP-A23","basis":"source","source_ids":["SRC-000679"]},{"id":"REL-002456","type":"used_in","from":"MDL-000398","to":"PRS-027","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002457","type":"uses_technology","from":"MDL-000398","to":"TEC-031","basis":"derived","via":"equipment category"},{"id":"REL-002458","type":"manufactures","from":"CMP-000258","to":"MDL-000399","basis":"source","source_ids":["SRC-000680"],"confidence":"MEDIUM"},{"id":"REL-002459","type":"part_of","from":"MDL-000399","to":"PRD-000327","basis":"derived"},{"id":"REL-002460","type":"classified_as","from":"MDL-000399","to":"EQP-C35","basis":"source","source_ids":["SRC-000680"]},{"id":"REL-002461","type":"used_in","from":"MDL-000399","to":"PRS-040","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002462","type":"uses_technology","from":"MDL-000399","to":"TEC-033","basis":"derived","via":"equipment category"},{"id":"REL-002463","type":"manufactures","from":"CMP-000258","to":"MDL-000400","basis":"source","source_ids":["SRC-000681"],"confidence":"MEDIUM"},{"id":"REL-002464","type":"part_of","from":"MDL-000400","to":"PRD-000327","basis":"derived"},{"id":"REL-002465","type":"classified_as","from":"MDL-000400","to":"EQP-C35","basis":"source","source_ids":["SRC-000681"]},{"id":"REL-002466","type":"used_in","from":"MDL-000400","to":"PRS-040","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002467","type":"uses_technology","from":"MDL-000400","to":"TEC-033","basis":"derived","via":"equipment category"},{"id":"REL-002468","type":"manufactures","from":"CMP-000258","to":"MDL-000401","basis":"source","source_ids":["SRC-000682"],"confidence":"MEDIUM"},{"id":"REL-002469","type":"part_of","from":"MDL-000401","to":"PRD-000328","basis":"derived"},{"id":"REL-002470","type":"classified_as","from":"MDL-000401","to":"EQP-A25","basis":"source","source_ids":["SRC-000682"]},{"id":"REL-002471","type":"used_in","from":"MDL-000401","to":"PRS-026","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002472","type":"uses_technology","from":"MDL-000401","to":"TEC-035","basis":"derived","via":"equipment category"},{"id":"REL-002473","type":"manufactures","from":"CMP-000261","to":"MDL-000402","basis":"source","source_ids":["SRC-000683"],"confidence":"MEDIUM"},{"id":"REL-002474","type":"part_of","from":"MDL-000402","to":"PRD-000329","basis":"derived"},{"id":"REL-002475","type":"classified_as","from":"MDL-000402","to":"EQP-A27","basis":"source","source_ids":["SRC-000683"]},{"id":"REL-002476","type":"used_in","from":"MDL-000402","to":"PRS-026","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002477","type":"uses_technology","from":"MDL-000402","to":"TEC-035","basis":"derived","via":"equipment category"},{"id":"REL-002478","type":"manufactures","from":"CMP-000261","to":"MDL-000403","basis":"source","source_ids":["SRC-000561"],"confidence":"LOW"},{"id":"REL-002479","type":"part_of","from":"MDL-000403","to":"PRD-000329","basis":"derived"},{"id":"REL-002480","type":"classified_as","from":"MDL-000403","to":"EQP-A27","basis":"source","source_ids":["SRC-000561"]},{"id":"REL-002481","type":"used_in","from":"MDL-000403","to":"PRS-026","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002482","type":"uses_technology","from":"MDL-000403","to":"TEC-035","basis":"derived","via":"equipment category"},{"id":"REL-002483","type":"manufactures","from":"CMP-000261","to":"MDL-000404","basis":"source","source_ids":["SRC-000684"],"confidence":"MEDIUM"},{"id":"REL-002484","type":"part_of","from":"MDL-000404","to":"PRD-000330","basis":"derived"},{"id":"REL-002485","type":"classified_as","from":"MDL-000404","to":"EQP-A30","basis":"source","source_ids":["SRC-000684"]},{"id":"REL-002486","type":"used_in","from":"MDL-000404","to":"PRS-008","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002487","type":"used_in","from":"MDL-000404","to":"PRS-026","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002488","type":"uses_technology","from":"MDL-000404","to":"TEC-035","basis":"derived","via":"equipment category"},{"id":"REL-002489","type":"manufactures","from":"CMP-000262","to":"MDL-000405","basis":"source","source_ids":["SRC-000685"],"confidence":"MEDIUM"},{"id":"REL-002490","type":"part_of","from":"MDL-000405","to":"PRD-000331","basis":"derived"},{"id":"REL-002491","type":"classified_as","from":"MDL-000405","to":"EQP-A22","basis":"source","source_ids":["SRC-000685"]},{"id":"REL-002492","type":"used_in","from":"MDL-000405","to":"PRS-027","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002493","type":"uses_technology","from":"MDL-000405","to":"TEC-031","basis":"derived","via":"equipment category"},{"id":"REL-002494","type":"manufactures","from":"CMP-000263","to":"MDL-000406","basis":"source","source_ids":["SRC-000686"],"confidence":"MEDIUM"},{"id":"REL-002495","type":"part_of","from":"MDL-000406","to":"PRD-000332","basis":"derived"},{"id":"REL-002496","type":"classified_as","from":"MDL-000406","to":"EQP-C40","basis":"source","source_ids":["SRC-000686"]},{"id":"REL-002497","type":"used_in","from":"MDL-000406","to":"PRS-041","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002498","type":"uses_technology","from":"MDL-000406","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-002499","type":"supports_application","from":"MDL-000406","to":"APP-005","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000686"]},{"id":"REL-002500","type":"manufactures","from":"CMP-000263","to":"MDL-000407","basis":"source","source_ids":["SRC-000687"],"confidence":"MEDIUM"},{"id":"REL-002501","type":"part_of","from":"MDL-000407","to":"PRD-000332","basis":"derived"},{"id":"REL-002502","type":"classified_as","from":"MDL-000407","to":"EQP-C41","basis":"source","source_ids":["SRC-000687"]},{"id":"REL-002503","type":"used_in","from":"MDL-000407","to":"PRS-041","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002504","type":"uses_technology","from":"MDL-000407","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-002505","type":"manufactures","from":"CMP-000263","to":"MDL-000408","basis":"source","source_ids":["SRC-000688"],"confidence":"MEDIUM"},{"id":"REL-002506","type":"part_of","from":"MDL-000408","to":"PRD-000332","basis":"derived"},{"id":"REL-002507","type":"classified_as","from":"MDL-000408","to":"EQP-C40","basis":"source","source_ids":["SRC-000688"]},{"id":"REL-002508","type":"used_in","from":"MDL-000408","to":"PRS-041","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002509","type":"uses_technology","from":"MDL-000408","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-002510","type":"supports_application","from":"MDL-000408","to":"APP-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000688"]},{"id":"REL-002511","type":"manufactures","from":"CMP-000263","to":"MDL-000409","basis":"source","source_ids":["SRC-000689"],"confidence":"MEDIUM"},{"id":"REL-002512","type":"part_of","from":"MDL-000409","to":"PRD-000332","basis":"derived"},{"id":"REL-002513","type":"classified_as","from":"MDL-000409","to":"EQP-C38","basis":"source","source_ids":["SRC-000689"]},{"id":"REL-002514","type":"used_in","from":"MDL-000409","to":"PRS-042","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002515","type":"uses_technology","from":"MDL-000409","to":"TEC-057","basis":"derived","via":"equipment category"},{"id":"REL-002516","type":"manufactures","from":"CMP-000265","to":"MDL-000410","basis":"source","source_ids":["SRC-000690"],"confidence":"MEDIUM"},{"id":"REL-002517","type":"part_of","from":"MDL-000410","to":"PRD-000333","basis":"derived"},{"id":"REL-002518","type":"classified_as","from":"MDL-000410","to":"EQP-A09.02","basis":"source","source_ids":["SRC-000690"]},{"id":"REL-002519","type":"used_in","from":"MDL-000410","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002520","type":"used_in","from":"MDL-000410","to":"PRS-014","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002521","type":"uses_technology","from":"MDL-000410","to":"TEC-016","basis":"derived","via":"equipment category"},{"id":"REL-002522","type":"supports_application","from":"MDL-000410","to":"APP-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000690"]},{"id":"REL-002523","type":"supports_application","from":"MDL-000410","to":"APP-006","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000690"]},{"id":"REL-002524","type":"supports_application","from":"MDL-000410","to":"APP-007","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000690"]},{"id":"REL-002525","type":"manufactures","from":"CMP-000266","to":"MDL-000411","basis":"source","source_ids":["SRC-000691"],"confidence":"MEDIUM"},{"id":"REL-002526","type":"part_of","from":"MDL-000411","to":"PRD-000334","basis":"derived"},{"id":"REL-002527","type":"classified_as","from":"MDL-000411","to":"EQP-C39","basis":"source","source_ids":["SRC-000691"]},{"id":"REL-002528","type":"used_in","from":"MDL-000411","to":"PRS-041","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002529","type":"uses_technology","from":"MDL-000411","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-002530","type":"supports_application","from":"MDL-000411","to":"APP-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000691"]},{"id":"REL-002531","type":"manufactures","from":"CMP-000266","to":"MDL-000412","basis":"source","source_ids":["SRC-000692"],"confidence":"MEDIUM"},{"id":"REL-002532","type":"part_of","from":"MDL-000412","to":"PRD-000334","basis":"derived"},{"id":"REL-002533","type":"classified_as","from":"MDL-000412","to":"EQP-C39","basis":"source","source_ids":["SRC-000692"]},{"id":"REL-002534","type":"used_in","from":"MDL-000412","to":"PRS-041","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002535","type":"uses_technology","from":"MDL-000412","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-002536","type":"supports_application","from":"MDL-000412","to":"APP-005","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000692"]},{"id":"REL-002537","type":"manufactures","from":"CMP-000266","to":"MDL-000413","basis":"source","source_ids":["SRC-000693"],"confidence":"MEDIUM"},{"id":"REL-002538","type":"part_of","from":"MDL-000413","to":"PRD-000334","basis":"derived"},{"id":"REL-002539","type":"classified_as","from":"MDL-000413","to":"EQP-C38","basis":"source","source_ids":["SRC-000693"]},{"id":"REL-002540","type":"used_in","from":"MDL-000413","to":"PRS-042","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002541","type":"uses_technology","from":"MDL-000413","to":"TEC-057","basis":"derived","via":"equipment category"},{"id":"REL-002542","type":"manufactures","from":"CMP-000269","to":"MDL-000414","basis":"source","source_ids":["SRC-000694"],"confidence":"MEDIUM"},{"id":"REL-002543","type":"part_of","from":"MDL-000414","to":"PRD-000335","basis":"derived"},{"id":"REL-002544","type":"classified_as","from":"MDL-000414","to":"EQP-C37","basis":"source","source_ids":["SRC-000694"]},{"id":"REL-002545","type":"used_in","from":"MDL-000414","to":"PRS-041","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002546","type":"uses_technology","from":"MDL-000414","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-002547","type":"manufactures","from":"CMP-000270","to":"MDL-000415","basis":"source","source_ids":["SRC-000695"],"confidence":"MEDIUM"},{"id":"REL-002548","type":"part_of","from":"MDL-000415","to":"PRD-000336","basis":"derived"},{"id":"REL-002549","type":"classified_as","from":"MDL-000415","to":"EQP-C40","basis":"source","source_ids":["SRC-000695"]},{"id":"REL-002550","type":"used_in","from":"MDL-000415","to":"PRS-041","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002551","type":"uses_technology","from":"MDL-000415","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-002552","type":"supports_application","from":"MDL-000415","to":"APP-009","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000695"]},{"id":"REL-002553","type":"manufactures","from":"CMP-000270","to":"MDL-000416","basis":"source","source_ids":["SRC-000696"],"confidence":"MEDIUM"},{"id":"REL-002554","type":"part_of","from":"MDL-000416","to":"PRD-000336","basis":"derived"},{"id":"REL-002555","type":"classified_as","from":"MDL-000416","to":"EQP-C40","basis":"source","source_ids":["SRC-000696"]},{"id":"REL-002556","type":"used_in","from":"MDL-000416","to":"PRS-041","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002557","type":"uses_technology","from":"MDL-000416","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-002558","type":"manufactures","from":"CMP-000270","to":"MDL-000417","basis":"source","source_ids":["SRC-000697"],"confidence":"MEDIUM"},{"id":"REL-002559","type":"part_of","from":"MDL-000417","to":"PRD-000336","basis":"derived"},{"id":"REL-002560","type":"classified_as","from":"MDL-000417","to":"EQP-C40","basis":"source","source_ids":["SRC-000697"]},{"id":"REL-002561","type":"used_in","from":"MDL-000417","to":"PRS-041","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002562","type":"uses_technology","from":"MDL-000417","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-002563","type":"supports_application","from":"MDL-000417","to":"APP-004","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000697"]},{"id":"REL-002564","type":"manufactures","from":"CMP-000270","to":"MDL-000418","basis":"source","source_ids":["SRC-000698"],"confidence":"MEDIUM"},{"id":"REL-002565","type":"part_of","from":"MDL-000418","to":"PRD-000336","basis":"derived"},{"id":"REL-002566","type":"classified_as","from":"MDL-000418","to":"EQP-C40","basis":"source","source_ids":["SRC-000698"]},{"id":"REL-002567","type":"used_in","from":"MDL-000418","to":"PRS-041","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002568","type":"uses_technology","from":"MDL-000418","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-002569","type":"supports_application","from":"MDL-000418","to":"APP-013","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000698"]},{"id":"REL-002570","type":"manufactures","from":"CMP-000273","to":"MDL-000419","basis":"source","source_ids":["SRC-000699"],"confidence":"MEDIUM"},{"id":"REL-002571","type":"part_of","from":"MDL-000419","to":"PRD-000337","basis":"derived"},{"id":"REL-002572","type":"classified_as","from":"MDL-000419","to":"EQP-A02","basis":"source","source_ids":["SRC-000699"]},{"id":"REL-002573","type":"used_in","from":"MDL-000419","to":"PRS-017","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002574","type":"used_in","from":"MDL-000419","to":"PRS-019","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002575","type":"manufactures","from":"CMP-000273","to":"MDL-000420","basis":"source","source_ids":["SRC-000700"],"confidence":"MEDIUM"},{"id":"REL-002576","type":"part_of","from":"MDL-000420","to":"PRD-000337","basis":"derived"},{"id":"REL-002577","type":"classified_as","from":"MDL-000420","to":"EQP-A02","basis":"source","source_ids":["SRC-000700"]},{"id":"REL-002578","type":"used_in","from":"MDL-000420","to":"PRS-017","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002579","type":"used_in","from":"MDL-000420","to":"PRS-019","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002580","type":"manufactures","from":"CMP-000274","to":"MDL-000421","basis":"source","source_ids":["SRC-000701"],"confidence":"LOW"},{"id":"REL-002581","type":"part_of","from":"MDL-000421","to":"PRD-000338","basis":"derived"},{"id":"REL-002582","type":"classified_as","from":"MDL-000421","to":"EQP-C26","basis":"source","source_ids":["SRC-000701"]},{"id":"REL-002583","type":"used_in","from":"MDL-000421","to":"PRS-038","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002584","type":"uses_technology","from":"MDL-000421","to":"TEC-059","basis":"source","source_ids":["SRC-000701"],"via":"source-stated laser type"},{"id":"REL-002585","type":"uses_technology","from":"MDL-000421","to":"TEC-080","basis":"source","source_ids":["SRC-000701"],"via":"source-stated laser type"},{"id":"REL-002586","type":"manufactures","from":"CMP-000276","to":"MDL-000422","basis":"source","source_ids":["SRC-000739"],"confidence":"MEDIUM"},{"id":"REL-002587","type":"part_of","from":"MDL-000422","to":"PRD-000339","basis":"derived"},{"id":"REL-002588","type":"classified_as","from":"MDL-000422","to":"EQP-C14","basis":"source","source_ids":["SRC-000739"]},{"id":"REL-002589","type":"used_in","from":"MDL-000422","to":"PRS-034","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002590","type":"uses_technology","from":"MDL-000422","to":"TEC-040","basis":"derived","via":"equipment category"},{"id":"REL-002591","type":"supports_application","from":"MDL-000422","to":"APP-010","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000739"]},{"id":"REL-002592","type":"manufactures","from":"CMP-000276","to":"MDL-000423","basis":"source","source_ids":["SRC-000740"],"confidence":"MEDIUM"},{"id":"REL-002593","type":"part_of","from":"MDL-000423","to":"PRD-000340","basis":"derived"},{"id":"REL-002594","type":"classified_as","from":"MDL-000423","to":"EQP-C14","basis":"source","source_ids":["SRC-000740"]},{"id":"REL-002595","type":"used_in","from":"MDL-000423","to":"PRS-034","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002596","type":"uses_technology","from":"MDL-000423","to":"TEC-040","basis":"derived","via":"equipment category"},{"id":"REL-002597","type":"supports_application","from":"MDL-000423","to":"APP-015","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000740"]},{"id":"REL-002598","type":"manufactures","from":"CMP-000276","to":"MDL-000424","basis":"source","source_ids":["SRC-000741"],"confidence":"MEDIUM"},{"id":"REL-002599","type":"part_of","from":"MDL-000424","to":"PRD-000340","basis":"derived"},{"id":"REL-002600","type":"classified_as","from":"MDL-000424","to":"EQP-C14","basis":"source","source_ids":["SRC-000741"]},{"id":"REL-002601","type":"used_in","from":"MDL-000424","to":"PRS-034","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002602","type":"uses_technology","from":"MDL-000424","to":"TEC-040","basis":"derived","via":"equipment category"},{"id":"REL-002603","type":"manufactures","from":"CMP-000277","to":"MDL-000425","basis":"source","source_ids":["SRC-000742"],"confidence":"MEDIUM"},{"id":"REL-002604","type":"part_of","from":"MDL-000425","to":"PRD-000341","basis":"derived"},{"id":"REL-002605","type":"classified_as","from":"MDL-000425","to":"EQP-C13","basis":"source","source_ids":["SRC-000742"]},{"id":"REL-002606","type":"used_in","from":"MDL-000425","to":"PRS-034","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002607","type":"uses_technology","from":"MDL-000425","to":"TEC-040","basis":"derived","via":"equipment category"},{"id":"REL-002608","type":"manufactures","from":"CMP-000277","to":"MDL-000426","basis":"source","source_ids":["SRC-000743"],"confidence":"MEDIUM"},{"id":"REL-002609","type":"part_of","from":"MDL-000426","to":"PRD-000341","basis":"derived"},{"id":"REL-002610","type":"classified_as","from":"MDL-000426","to":"EQP-C14","basis":"source","source_ids":["SRC-000743"]},{"id":"REL-002611","type":"used_in","from":"MDL-000426","to":"PRS-034","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002612","type":"uses_technology","from":"MDL-000426","to":"TEC-040","basis":"derived","via":"equipment category"},{"id":"REL-002613","type":"manufactures","from":"CMP-000277","to":"MDL-000427","basis":"source","source_ids":["SRC-000744"],"confidence":"MEDIUM"},{"id":"REL-002614","type":"part_of","from":"MDL-000427","to":"PRD-000341","basis":"derived"},{"id":"REL-002615","type":"classified_as","from":"MDL-000427","to":"EQP-C12","basis":"source","source_ids":["SRC-000744"]},{"id":"REL-002616","type":"used_in","from":"MDL-000427","to":"PRS-034","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002617","type":"uses_technology","from":"MDL-000427","to":"TEC-040","basis":"derived","via":"equipment category"},{"id":"REL-002618","type":"manufactures","from":"CMP-000278","to":"MDL-000428","basis":"source","source_ids":["SRC-000745"],"confidence":"MEDIUM"},{"id":"REL-002619","type":"part_of","from":"MDL-000428","to":"PRD-000342","basis":"derived"},{"id":"REL-002620","type":"classified_as","from":"MDL-000428","to":"EQP-C12","basis":"source","source_ids":["SRC-000745"]},{"id":"REL-002621","type":"used_in","from":"MDL-000428","to":"PRS-034","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002622","type":"uses_technology","from":"MDL-000428","to":"TEC-040","basis":"derived","via":"equipment category"},{"id":"REL-002623","type":"manufactures","from":"CMP-000278","to":"MDL-000429","basis":"source","source_ids":["SRC-000746"],"confidence":"MEDIUM"},{"id":"REL-002624","type":"part_of","from":"MDL-000429","to":"PRD-000342","basis":"derived"},{"id":"REL-002625","type":"classified_as","from":"MDL-000429","to":"EQP-C12","basis":"source","source_ids":["SRC-000746"]},{"id":"REL-002626","type":"used_in","from":"MDL-000429","to":"PRS-034","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002627","type":"uses_technology","from":"MDL-000429","to":"TEC-040","basis":"derived","via":"equipment category"},{"id":"REL-002628","type":"manufactures","from":"CMP-000278","to":"MDL-000430","basis":"source","source_ids":["SRC-000747"],"confidence":"MEDIUM"},{"id":"REL-002629","type":"part_of","from":"MDL-000430","to":"PRD-000342","basis":"derived"},{"id":"REL-002630","type":"classified_as","from":"MDL-000430","to":"EQP-C12","basis":"source","source_ids":["SRC-000747"]},{"id":"REL-002631","type":"used_in","from":"MDL-000430","to":"PRS-034","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002632","type":"uses_technology","from":"MDL-000430","to":"TEC-040","basis":"derived","via":"equipment category"},{"id":"REL-002633","type":"manufactures","from":"CMP-000279","to":"MDL-000431","basis":"source","source_ids":["SRC-000748"],"confidence":"MEDIUM"},{"id":"REL-002634","type":"part_of","from":"MDL-000431","to":"PRD-000343","basis":"derived"},{"id":"REL-002635","type":"classified_as","from":"MDL-000431","to":"EQP-C08","basis":"source","source_ids":["SRC-000748"]},{"id":"REL-002636","type":"used_in","from":"MDL-000431","to":"PRS-033","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002637","type":"manufactures","from":"CMP-000279","to":"MDL-000432","basis":"source","source_ids":["SRC-000749"],"confidence":"MEDIUM"},{"id":"REL-002638","type":"part_of","from":"MDL-000432","to":"PRD-000343","basis":"derived"},{"id":"REL-002639","type":"classified_as","from":"MDL-000432","to":"EQP-C08","basis":"source","source_ids":["SRC-000749"]},{"id":"REL-002640","type":"used_in","from":"MDL-000432","to":"PRS-033","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002641","type":"manufactures","from":"CMP-000280","to":"MDL-000433","basis":"source","source_ids":["SRC-000750"],"confidence":"MEDIUM"},{"id":"REL-002642","type":"part_of","from":"MDL-000433","to":"PRD-000344","basis":"derived"},{"id":"REL-002643","type":"classified_as","from":"MDL-000433","to":"EQP-C10","basis":"source","source_ids":["SRC-000750"]},{"id":"REL-002644","type":"used_in","from":"MDL-000433","to":"PRS-033","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002645","type":"uses_technology","from":"MDL-000433","to":"TEC-039","basis":"derived","via":"equipment category"},{"id":"REL-002646","type":"manufactures","from":"CMP-000280","to":"MDL-000434","basis":"source","source_ids":["SRC-000751"],"confidence":"MEDIUM"},{"id":"REL-002647","type":"part_of","from":"MDL-000434","to":"PRD-000344","basis":"derived"},{"id":"REL-002648","type":"classified_as","from":"MDL-000434","to":"EQP-C10","basis":"source","source_ids":["SRC-000751"]},{"id":"REL-002649","type":"used_in","from":"MDL-000434","to":"PRS-033","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002650","type":"uses_technology","from":"MDL-000434","to":"TEC-039","basis":"derived","via":"equipment category"},{"id":"REL-002651","type":"manufactures","from":"CMP-000280","to":"MDL-000435","basis":"source","source_ids":["SRC-000752"],"confidence":"MEDIUM"},{"id":"REL-002652","type":"part_of","from":"MDL-000435","to":"PRD-000344","basis":"derived"},{"id":"REL-002653","type":"classified_as","from":"MDL-000435","to":"EQP-C10","basis":"source","source_ids":["SRC-000752"]},{"id":"REL-002654","type":"used_in","from":"MDL-000435","to":"PRS-033","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002655","type":"uses_technology","from":"MDL-000435","to":"TEC-039","basis":"derived","via":"equipment category"},{"id":"REL-002656","type":"manufactures","from":"CMP-000280","to":"MDL-000436","basis":"source","source_ids":["SRC-000753"],"confidence":"MEDIUM"},{"id":"REL-002657","type":"part_of","from":"MDL-000436","to":"PRD-000344","basis":"derived"},{"id":"REL-002658","type":"classified_as","from":"MDL-000436","to":"EQP-C08","basis":"source","source_ids":["SRC-000753"]},{"id":"REL-002659","type":"used_in","from":"MDL-000436","to":"PRS-033","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002660","type":"manufactures","from":"CMP-000280","to":"MDL-000437","basis":"source","source_ids":["SRC-000754"],"confidence":"MEDIUM"},{"id":"REL-002661","type":"part_of","from":"MDL-000437","to":"PRD-000344","basis":"derived"},{"id":"REL-002662","type":"classified_as","from":"MDL-000437","to":"EQP-C11","basis":"source","source_ids":["SRC-000754"]},{"id":"REL-002663","type":"used_in","from":"MDL-000437","to":"PRS-035","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002664","type":"used_in","from":"MDL-000437","to":"PRS-050","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002665","type":"uses_technology","from":"MDL-000437","to":"TEC-041","basis":"derived","via":"equipment category"},{"id":"REL-002666","type":"manufactures","from":"CMP-000281","to":"MDL-000438","basis":"source","source_ids":["SRC-000755"],"confidence":"MEDIUM"},{"id":"REL-002667","type":"part_of","from":"MDL-000438","to":"PRD-000345","basis":"derived"},{"id":"REL-002668","type":"classified_as","from":"MDL-000438","to":"EQP-C21","basis":"source","source_ids":["SRC-000755"]},{"id":"REL-002669","type":"used_in","from":"MDL-000438","to":"PRS-036","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002670","type":"uses_technology","from":"MDL-000438","to":"TEC-045","basis":"derived","via":"equipment category"},{"id":"REL-002671","type":"manufactures","from":"CMP-000281","to":"MDL-000439","basis":"source","source_ids":["SRC-000756"],"confidence":"MEDIUM"},{"id":"REL-002672","type":"part_of","from":"MDL-000439","to":"PRD-000346","basis":"derived"},{"id":"REL-002673","type":"classified_as","from":"MDL-000439","to":"EQP-F08","basis":"source","source_ids":["SRC-000756"]},{"id":"REL-002674","type":"manufactures","from":"CMP-000282","to":"MDL-000440","basis":"source","source_ids":["SRC-000757"],"confidence":"MEDIUM"},{"id":"REL-002675","type":"part_of","from":"MDL-000440","to":"PRD-000347","basis":"derived"},{"id":"REL-002676","type":"classified_as","from":"MDL-000440","to":"EQP-C42","basis":"source","source_ids":["SRC-000757"]},{"id":"REL-002677","type":"used_in","from":"MDL-000440","to":"PRS-041","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002678","type":"uses_technology","from":"MDL-000440","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-002679","type":"manufactures","from":"CMP-000283","to":"MDL-000441","basis":"source","source_ids":["SRC-000719"],"confidence":"MEDIUM"},{"id":"REL-002680","type":"part_of","from":"MDL-000441","to":"PRD-000348","basis":"derived"},{"id":"REL-002681","type":"classified_as","from":"MDL-000441","to":"EQP-A09.11","basis":"source","source_ids":["SRC-000719"]},{"id":"REL-002682","type":"used_in","from":"MDL-000441","to":"PRS-009","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002683","type":"used_in","from":"MDL-000441","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002684","type":"uses_technology","from":"MDL-000441","to":"TEC-024","basis":"derived","via":"equipment category"},{"id":"REL-002685","type":"manufactures","from":"CMP-000284","to":"MDL-000442","basis":"source","source_ids":["SRC-000720"],"confidence":"MEDIUM"},{"id":"REL-002686","type":"part_of","from":"MDL-000442","to":"PRD-000349","basis":"derived"},{"id":"REL-002687","type":"classified_as","from":"MDL-000442","to":"EQP-A09.11","basis":"source","source_ids":["SRC-000720"]},{"id":"REL-002688","type":"used_in","from":"MDL-000442","to":"PRS-009","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002689","type":"used_in","from":"MDL-000442","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002690","type":"uses_technology","from":"MDL-000442","to":"TEC-024","basis":"derived","via":"equipment category"},{"id":"REL-002691","type":"manufactures","from":"CMP-000289","to":"MDL-000443","basis":"source","source_ids":["SRC-000758"],"confidence":"MEDIUM"},{"id":"REL-002692","type":"part_of","from":"MDL-000443","to":"PRD-000350","basis":"derived"},{"id":"REL-002693","type":"classified_as","from":"MDL-000443","to":"EQP-K09","basis":"source","source_ids":["SRC-000758"]},{"id":"REL-002694","type":"used_in","from":"MDL-000443","to":"PRS-008","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002695","type":"manufactures","from":"CMP-000289","to":"MDL-000444","basis":"source","source_ids":["SRC-000759"],"confidence":"MEDIUM"},{"id":"REL-002696","type":"part_of","from":"MDL-000444","to":"PRD-000350","basis":"derived"},{"id":"REL-002697","type":"classified_as","from":"MDL-000444","to":"EQP-K09","basis":"source","source_ids":["SRC-000759"]},{"id":"REL-002698","type":"used_in","from":"MDL-000444","to":"PRS-008","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002699","type":"manufactures","from":"CMP-000292","to":"MDL-000445","basis":"source","source_ids":["SRC-000728"],"confidence":"MEDIUM"},{"id":"REL-002700","type":"part_of","from":"MDL-000445","to":"PRD-000351","basis":"derived"},{"id":"REL-002701","type":"classified_as","from":"MDL-000445","to":"EQP-B04","basis":"source","source_ids":["SRC-000728"]},{"id":"REL-002702","type":"used_in","from":"MDL-000445","to":"PRS-028","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002703","type":"manufactures","from":"CMP-000293","to":"MDL-000446","basis":"source","source_ids":["SRC-000730"],"confidence":"MEDIUM"},{"id":"REL-002704","type":"part_of","from":"MDL-000446","to":"PRD-000352","basis":"derived"},{"id":"REL-002705","type":"classified_as","from":"MDL-000446","to":"EQP-J09","basis":"source","source_ids":["SRC-000730"]},{"id":"REL-002706","type":"used_in","from":"MDL-000446","to":"PRS-058","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002707","type":"manufactures","from":"CMP-000294","to":"MDL-000447","basis":"source","source_ids":["SRC-000760"],"confidence":"MEDIUM"},{"id":"REL-002708","type":"part_of","from":"MDL-000447","to":"PRD-000353","basis":"derived"},{"id":"REL-002709","type":"classified_as","from":"MDL-000447","to":"EQP-L01","basis":"source","source_ids":["SRC-000760"]},{"id":"REL-002710","type":"used_in","from":"MDL-000447","to":"PRS-059","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002711","type":"supports_application","from":"MDL-000447","to":"APP-017","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000760"]},{"id":"REL-002712","type":"manufactures","from":"CMP-000294","to":"MDL-000448","basis":"source","source_ids":["SRC-000761"],"confidence":"MEDIUM"},{"id":"REL-002713","type":"part_of","from":"MDL-000448","to":"PRD-000353","basis":"derived"},{"id":"REL-002714","type":"classified_as","from":"MDL-000448","to":"EQP-L01","basis":"source","source_ids":["SRC-000761"]},{"id":"REL-002715","type":"used_in","from":"MDL-000448","to":"PRS-059","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002716","type":"manufactures","from":"CMP-000295","to":"MDL-000449","basis":"source","source_ids":["SRC-000762"],"confidence":"MEDIUM"},{"id":"REL-002717","type":"part_of","from":"MDL-000449","to":"PRD-000354","basis":"derived"},{"id":"REL-002718","type":"classified_as","from":"MDL-000449","to":"EQP-L01","basis":"source","source_ids":["SRC-000762"]},{"id":"REL-002719","type":"used_in","from":"MDL-000449","to":"PRS-059","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002720","type":"manufactures","from":"CMP-000296","to":"MDL-000450","basis":"source","source_ids":["SRC-000733"],"confidence":"MEDIUM"},{"id":"REL-002721","type":"part_of","from":"MDL-000450","to":"PRD-000355","basis":"derived"},{"id":"REL-002722","type":"classified_as","from":"MDL-000450","to":"EQP-L02","basis":"source","source_ids":["SRC-000733"]},{"id":"REL-002723","type":"used_in","from":"MDL-000450","to":"PRS-059","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002724","type":"manufactures","from":"CMP-000298","to":"MDL-000451","basis":"source","source_ids":["SRC-000735"],"confidence":"LOW"},{"id":"REL-002725","type":"part_of","from":"MDL-000451","to":"PRD-000356","basis":"derived"},{"id":"REL-002726","type":"classified_as","from":"MDL-000451","to":"EQP-H02","basis":"source","source_ids":["SRC-000735"]},{"id":"REL-002727","type":"uses_technology","from":"MDL-000451","to":"TEC-012","basis":"derived","via":"equipment category"},{"id":"REL-002728","type":"supports_application","from":"MDL-000451","to":"APP-014","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000735"]},{"id":"REL-002729","type":"manufactures","from":"CMP-000299","to":"MDL-000452","basis":"source","source_ids":["SRC-000763"],"confidence":"LOW"},{"id":"REL-002730","type":"part_of","from":"MDL-000452","to":"PRD-000357","basis":"derived"},{"id":"REL-002731","type":"classified_as","from":"MDL-000452","to":"EQP-A22","basis":"source","source_ids":["SRC-000763"]},{"id":"REL-002732","type":"used_in","from":"MDL-000452","to":"PRS-027","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002733","type":"uses_technology","from":"MDL-000452","to":"TEC-031","basis":"derived","via":"equipment category"},{"id":"REL-002734","type":"manufactures","from":"CMP-000300","to":"MDL-000453","basis":"source","source_ids":["SRC-000764"],"confidence":"MEDIUM"},{"id":"REL-002735","type":"part_of","from":"MDL-000453","to":"PRD-000358","basis":"derived"},{"id":"REL-002736","type":"classified_as","from":"MDL-000453","to":"EQP-I02","basis":"source","source_ids":["SRC-000764"]},{"id":"REL-002737","type":"supports_application","from":"MDL-000453","to":"APP-017","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000764"]},{"id":"REL-002738","type":"manufactures","from":"CMP-000300","to":"MDL-000454","basis":"source","source_ids":["SRC-000765"],"confidence":"MEDIUM"},{"id":"REL-002739","type":"part_of","from":"MDL-000454","to":"PRD-000358","basis":"derived"},{"id":"REL-002740","type":"classified_as","from":"MDL-000454","to":"EQP-I02","basis":"source","source_ids":["SRC-000765"]},{"id":"REL-002741","type":"supports_application","from":"MDL-000454","to":"APP-017","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000765"]},{"id":"REL-002742","type":"manufactures","from":"CMP-000301","to":"MDL-000455","basis":"source","source_ids":["SRC-000785"],"confidence":"LOW"},{"id":"REL-002743","type":"part_of","from":"MDL-000455","to":"PRD-000359","basis":"derived"},{"id":"REL-002744","type":"classified_as","from":"MDL-000455","to":"EQP-K07","basis":"source","source_ids":["SRC-000785"]},{"id":"REL-002745","type":"used_in","from":"MDL-000455","to":"PRS-006","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002746","type":"manufactures","from":"CMP-000301","to":"MDL-000456","basis":"source","source_ids":["SRC-000786"],"confidence":"MEDIUM"},{"id":"REL-002747","type":"part_of","from":"MDL-000456","to":"PRD-000359","basis":"derived"},{"id":"REL-002748","type":"classified_as","from":"MDL-000456","to":"EQP-K05","basis":"source","source_ids":["SRC-000786"]},{"id":"REL-002749","type":"used_in","from":"MDL-000456","to":"PRS-004","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002750","type":"manufactures","from":"CMP-000301","to":"MDL-000457","basis":"source","source_ids":["SRC-000787"],"confidence":"MEDIUM"},{"id":"REL-002751","type":"part_of","from":"MDL-000457","to":"PRD-000359","basis":"derived"},{"id":"REL-002752","type":"classified_as","from":"MDL-000457","to":"EQP-K05","basis":"source","source_ids":["SRC-000787"]},{"id":"REL-002753","type":"used_in","from":"MDL-000457","to":"PRS-004","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002754","type":"manufactures","from":"CMP-000301","to":"MDL-000458","basis":"source","source_ids":["SRC-000788"],"confidence":"MEDIUM"},{"id":"REL-002755","type":"part_of","from":"MDL-000458","to":"PRD-000359","basis":"derived"},{"id":"REL-002756","type":"classified_as","from":"MDL-000458","to":"EQP-K05","basis":"source","source_ids":["SRC-000788"]},{"id":"REL-002757","type":"used_in","from":"MDL-000458","to":"PRS-004","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002758","type":"manufactures","from":"CMP-000301","to":"MDL-000459","basis":"source","source_ids":["SRC-000789"],"confidence":"MEDIUM"},{"id":"REL-002759","type":"part_of","from":"MDL-000459","to":"PRD-000359","basis":"derived"},{"id":"REL-002760","type":"classified_as","from":"MDL-000459","to":"EQP-K05","basis":"source","source_ids":["SRC-000789"]},{"id":"REL-002761","type":"used_in","from":"MDL-000459","to":"PRS-004","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002762","type":"manufactures","from":"CMP-000302","to":"MDL-000460","basis":"source","source_ids":["SRC-000790"],"confidence":"MEDIUM"},{"id":"REL-002763","type":"part_of","from":"MDL-000460","to":"PRD-000360","basis":"derived"},{"id":"REL-002764","type":"classified_as","from":"MDL-000460","to":"EQP-K05","basis":"source","source_ids":["SRC-000790"]},{"id":"REL-002765","type":"used_in","from":"MDL-000460","to":"PRS-004","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002766","type":"manufactures","from":"CMP-000302","to":"MDL-000461","basis":"source","source_ids":["SRC-000791"],"confidence":"MEDIUM"},{"id":"REL-002767","type":"part_of","from":"MDL-000461","to":"PRD-000361","basis":"derived"},{"id":"REL-002768","type":"classified_as","from":"MDL-000461","to":"EQP-A19","basis":"source","source_ids":["SRC-000791"]},{"id":"REL-002769","type":"used_in","from":"MDL-000461","to":"PRS-024","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002770","type":"uses_technology","from":"MDL-000461","to":"TEC-029","basis":"derived","via":"equipment category"},{"id":"REL-002771","type":"supports_material","from":"MDL-000461","to":"MAT-003","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000791"]},{"id":"REL-002772","type":"supports_material","from":"MDL-000461","to":"MAT-004","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000791"]},{"id":"REL-002773","type":"supports_application","from":"MDL-000461","to":"APP-012","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000791"]},{"id":"REL-002774","type":"manufactures","from":"CMP-000302","to":"MDL-000462","basis":"source","source_ids":["SRC-000792"],"confidence":"MEDIUM"},{"id":"REL-002775","type":"part_of","from":"MDL-000462","to":"PRD-000361","basis":"derived"},{"id":"REL-002776","type":"classified_as","from":"MDL-000462","to":"EQP-A19","basis":"source","source_ids":["SRC-000792"]},{"id":"REL-002777","type":"used_in","from":"MDL-000462","to":"PRS-024","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002778","type":"uses_technology","from":"MDL-000462","to":"TEC-029","basis":"derived","via":"equipment category"},{"id":"REL-002779","type":"manufactures","from":"CMP-000303","to":"MDL-000463","basis":"source","source_ids":["SRC-000793"],"confidence":"MEDIUM"},{"id":"REL-002780","type":"part_of","from":"MDL-000463","to":"PRD-000362","basis":"derived"},{"id":"REL-002781","type":"classified_as","from":"MDL-000463","to":"EQP-C39","basis":"source","source_ids":["SRC-000793"]},{"id":"REL-002782","type":"used_in","from":"MDL-000463","to":"PRS-041","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002783","type":"uses_technology","from":"MDL-000463","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-002784","type":"manufactures","from":"CMP-000303","to":"MDL-000464","basis":"source","source_ids":["SRC-000794"],"confidence":"MEDIUM"},{"id":"REL-002785","type":"part_of","from":"MDL-000464","to":"PRD-000363","basis":"derived"},{"id":"REL-002786","type":"classified_as","from":"MDL-000464","to":"EQP-C40","basis":"source","source_ids":["SRC-000794"]},{"id":"REL-002787","type":"used_in","from":"MDL-000464","to":"PRS-041","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002788","type":"uses_technology","from":"MDL-000464","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-002789","type":"supports_application","from":"MDL-000464","to":"APP-010","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000794"]},{"id":"REL-002790","type":"manufactures","from":"CMP-000303","to":"MDL-000465","basis":"source","source_ids":["SRC-000795"],"confidence":"MEDIUM"},{"id":"REL-002791","type":"part_of","from":"MDL-000465","to":"PRD-000363","basis":"derived"},{"id":"REL-002792","type":"classified_as","from":"MDL-000465","to":"EQP-C40","basis":"source","source_ids":["SRC-000795"]},{"id":"REL-002793","type":"used_in","from":"MDL-000465","to":"PRS-041","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002794","type":"uses_technology","from":"MDL-000465","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-002795","type":"supports_application","from":"MDL-000465","to":"APP-010","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000795"]},{"id":"REL-002796","type":"manufactures","from":"CMP-000304","to":"MDL-000466","basis":"source","source_ids":["SRC-000796"],"confidence":"MEDIUM"},{"id":"REL-002797","type":"part_of","from":"MDL-000466","to":"PRD-000364","basis":"derived"},{"id":"REL-002798","type":"classified_as","from":"MDL-000466","to":"EQP-A33","basis":"source","source_ids":["SRC-000796"]},{"id":"REL-002799","type":"used_in","from":"MDL-000466","to":"PRS-029","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002800","type":"uses_technology","from":"MDL-000466","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-002801","type":"manufactures","from":"CMP-000304","to":"MDL-000467","basis":"source","source_ids":["SRC-000797"],"confidence":"MEDIUM"},{"id":"REL-002802","type":"part_of","from":"MDL-000467","to":"PRD-000365","basis":"derived"},{"id":"REL-002803","type":"classified_as","from":"MDL-000467","to":"EQP-A33","basis":"source","source_ids":["SRC-000797"]},{"id":"REL-002804","type":"used_in","from":"MDL-000467","to":"PRS-029","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002805","type":"uses_technology","from":"MDL-000467","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-002806","type":"manufactures","from":"CMP-000305","to":"MDL-000468","basis":"source","source_ids":["SRC-000772"],"confidence":"MEDIUM"},{"id":"REL-002807","type":"part_of","from":"MDL-000468","to":"PRD-000366","basis":"derived"},{"id":"REL-002808","type":"classified_as","from":"MDL-000468","to":"EQP-A33","basis":"source","source_ids":["SRC-000772"]},{"id":"REL-002809","type":"used_in","from":"MDL-000468","to":"PRS-029","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002810","type":"uses_technology","from":"MDL-000468","to":"TEC-056","basis":"derived","via":"equipment category"},{"id":"REL-002811","type":"supports_application","from":"MDL-000468","to":"APP-015","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000772"]},{"id":"REL-002812","type":"manufactures","from":"CMP-000307","to":"MDL-000469","basis":"source","source_ids":["SRC-000798"],"confidence":"MEDIUM"},{"id":"REL-002813","type":"part_of","from":"MDL-000469","to":"PRD-000367","basis":"derived"},{"id":"REL-002814","type":"classified_as","from":"MDL-000469","to":"EQP-A43","basis":"source","source_ids":["SRC-000798"]},{"id":"REL-002815","type":"used_in","from":"MDL-000469","to":"PRS-060","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002816","type":"manufactures","from":"CMP-000307","to":"MDL-000470","basis":"source","source_ids":["SRC-000799"],"confidence":"MEDIUM"},{"id":"REL-002817","type":"part_of","from":"MDL-000470","to":"PRD-000367","basis":"derived"},{"id":"REL-002818","type":"classified_as","from":"MDL-000470","to":"EQP-A43","basis":"source","source_ids":["SRC-000799"]},{"id":"REL-002819","type":"used_in","from":"MDL-000470","to":"PRS-060","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002820","type":"manufactures","from":"CMP-000307","to":"MDL-000471","basis":"source","source_ids":["SRC-000800"],"confidence":"MEDIUM"},{"id":"REL-002821","type":"part_of","from":"MDL-000471","to":"PRD-000367","basis":"derived"},{"id":"REL-002822","type":"classified_as","from":"MDL-000471","to":"EQP-A43","basis":"source","source_ids":["SRC-000800"]},{"id":"REL-002823","type":"used_in","from":"MDL-000471","to":"PRS-060","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002824","type":"manufactures","from":"CMP-000307","to":"MDL-000472","basis":"source","source_ids":["SRC-000801"],"confidence":"MEDIUM"},{"id":"REL-002825","type":"part_of","from":"MDL-000472","to":"PRD-000367","basis":"derived"},{"id":"REL-002826","type":"classified_as","from":"MDL-000472","to":"EQP-A43","basis":"source","source_ids":["SRC-000801"]},{"id":"REL-002827","type":"used_in","from":"MDL-000472","to":"PRS-060","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002828","type":"manufactures","from":"CMP-000308","to":"MDL-000473","basis":"source","source_ids":["SRC-000802"],"confidence":"MEDIUM"},{"id":"REL-002829","type":"part_of","from":"MDL-000473","to":"PRD-000368","basis":"derived"},{"id":"REL-002830","type":"classified_as","from":"MDL-000473","to":"EQP-A43","basis":"source","source_ids":["SRC-000802"]},{"id":"REL-002831","type":"used_in","from":"MDL-000473","to":"PRS-060","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002832","type":"manufactures","from":"CMP-000025","to":"MDL-000474","basis":"source","source_ids":["SRC-000803"],"confidence":"MEDIUM"},{"id":"REL-002833","type":"part_of","from":"MDL-000474","to":"PRD-000369","basis":"derived"},{"id":"REL-002834","type":"classified_as","from":"MDL-000474","to":"EQP-B07","basis":"source","source_ids":["SRC-000803"]},{"id":"REL-002835","type":"used_in","from":"MDL-000474","to":"PRS-028","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002836","type":"uses_technology","from":"MDL-000474","to":"TEC-006","basis":"derived","via":"equipment category"},{"id":"REL-002837","type":"manufactures","from":"CMP-000025","to":"MDL-000475","basis":"source","source_ids":["SRC-000804"],"confidence":"MEDIUM"},{"id":"REL-002838","type":"part_of","from":"MDL-000475","to":"PRD-000369","basis":"derived"},{"id":"REL-002839","type":"classified_as","from":"MDL-000475","to":"EQP-B07","basis":"source","source_ids":["SRC-000804"]},{"id":"REL-002840","type":"used_in","from":"MDL-000475","to":"PRS-028","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002841","type":"uses_technology","from":"MDL-000475","to":"TEC-006","basis":"derived","via":"equipment category"},{"id":"REL-002842","type":"manufactures","from":"CMP-000025","to":"MDL-000476","basis":"source","source_ids":["SRC-000805"],"confidence":"MEDIUM"},{"id":"REL-002843","type":"part_of","from":"MDL-000476","to":"PRD-000369","basis":"derived"},{"id":"REL-002844","type":"classified_as","from":"MDL-000476","to":"EQP-B07","basis":"source","source_ids":["SRC-000805"]},{"id":"REL-002845","type":"used_in","from":"MDL-000476","to":"PRS-028","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002846","type":"uses_technology","from":"MDL-000476","to":"TEC-006","basis":"derived","via":"equipment category"},{"id":"REL-002847","type":"manufactures","from":"CMP-000309","to":"MDL-000477","basis":"source","source_ids":["SRC-000806"],"confidence":"MEDIUM"},{"id":"REL-002848","type":"part_of","from":"MDL-000477","to":"PRD-000370","basis":"derived"},{"id":"REL-002849","type":"classified_as","from":"MDL-000477","to":"EQP-B07","basis":"source","source_ids":["SRC-000806"]},{"id":"REL-002850","type":"used_in","from":"MDL-000477","to":"PRS-028","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002851","type":"uses_technology","from":"MDL-000477","to":"TEC-006","basis":"derived","via":"equipment category"},{"id":"REL-002852","type":"manufactures","from":"CMP-000141","to":"MDL-000478","basis":"source","source_ids":["SRC-000807"],"confidence":"MEDIUM"},{"id":"REL-002853","type":"part_of","from":"MDL-000478","to":"PRD-000371","basis":"derived"},{"id":"REL-002854","type":"classified_as","from":"MDL-000478","to":"EQP-I08","basis":"source","source_ids":["SRC-000807"]},{"id":"REL-002855","type":"used_in","from":"MDL-000478","to":"PRS-056","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002856","type":"supports_application","from":"MDL-000478","to":"APP-016","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000807"]},{"id":"REL-002857","type":"supports_application","from":"MDL-000478","to":"APP-017","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000807"]},{"id":"REL-002858","type":"manufactures","from":"CMP-000044","to":"MDL-000479","basis":"source","source_ids":["SRC-000808"],"confidence":"MEDIUM"},{"id":"REL-002859","type":"part_of","from":"MDL-000479","to":"PRD-000372","basis":"derived"},{"id":"REL-002860","type":"classified_as","from":"MDL-000479","to":"EQP-I08","basis":"source","source_ids":["SRC-000808"]},{"id":"REL-002861","type":"used_in","from":"MDL-000479","to":"PRS-056","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002862","type":"supports_application","from":"MDL-000479","to":"APP-016","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000808"]},{"id":"REL-002863","type":"supports_application","from":"MDL-000479","to":"APP-017","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000808"]},{"id":"REL-002864","type":"manufactures","from":"CMP-000310","to":"MDL-000480","basis":"source","source_ids":["SRC-000778"],"confidence":"LOW"},{"id":"REL-002865","type":"part_of","from":"MDL-000480","to":"PRD-000373","basis":"derived"},{"id":"REL-002866","type":"classified_as","from":"MDL-000480","to":"EQP-I08","basis":"source","source_ids":["SRC-000778"]},{"id":"REL-002867","type":"used_in","from":"MDL-000480","to":"PRS-056","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002868","type":"supports_application","from":"MDL-000480","to":"APP-016","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000778"]},{"id":"REL-002869","type":"supports_application","from":"MDL-000480","to":"APP-017","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000778"]},{"id":"REL-002870","type":"manufactures","from":"CMP-000316","to":"MDL-000481","basis":"source","source_ids":["SRC-000822"],"confidence":"MEDIUM"},{"id":"REL-002871","type":"part_of","from":"MDL-000481","to":"PRD-000374","basis":"derived"},{"id":"REL-002872","type":"classified_as","from":"MDL-000481","to":"EQP-C24","basis":"source","source_ids":["SRC-000822"]},{"id":"REL-002873","type":"used_in","from":"MDL-000481","to":"PRS-036","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002874","type":"manufactures","from":"CMP-000316","to":"MDL-000482","basis":"source","source_ids":["SRC-000823"],"confidence":"MEDIUM"},{"id":"REL-002875","type":"part_of","from":"MDL-000482","to":"PRD-000374","basis":"derived"},{"id":"REL-002876","type":"classified_as","from":"MDL-000482","to":"EQP-C25","basis":"source","source_ids":["SRC-000823"]},{"id":"REL-002877","type":"used_in","from":"MDL-000482","to":"PRS-036","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002878","type":"supports_application","from":"MDL-000482","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000823"]},{"id":"REL-002879","type":"manufactures","from":"CMP-000317","to":"MDL-000483","basis":"source","source_ids":["SRC-000824"],"confidence":"MEDIUM"},{"id":"REL-002880","type":"part_of","from":"MDL-000483","to":"PRD-000375","basis":"derived"},{"id":"REL-002881","type":"classified_as","from":"MDL-000483","to":"EQP-C25","basis":"source","source_ids":["SRC-000824"]},{"id":"REL-002882","type":"used_in","from":"MDL-000483","to":"PRS-036","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002883","type":"manufactures","from":"CMP-000318","to":"MDL-000484","basis":"source","source_ids":["SRC-000825"],"confidence":"MEDIUM"},{"id":"REL-002884","type":"part_of","from":"MDL-000484","to":"PRD-000376","basis":"derived"},{"id":"REL-002885","type":"classified_as","from":"MDL-000484","to":"EQP-C14","basis":"source","source_ids":["SRC-000825"]},{"id":"REL-002886","type":"used_in","from":"MDL-000484","to":"PRS-034","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002887","type":"uses_technology","from":"MDL-000484","to":"TEC-040","basis":"derived","via":"equipment category"},{"id":"REL-002888","type":"manufactures","from":"CMP-000318","to":"MDL-000485","basis":"source","source_ids":["SRC-000826"],"confidence":"MEDIUM"},{"id":"REL-002889","type":"part_of","from":"MDL-000485","to":"PRD-000376","basis":"derived"},{"id":"REL-002890","type":"classified_as","from":"MDL-000485","to":"EQP-C14","basis":"source","source_ids":["SRC-000826"]},{"id":"REL-002891","type":"used_in","from":"MDL-000485","to":"PRS-034","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002892","type":"uses_technology","from":"MDL-000485","to":"TEC-040","basis":"derived","via":"equipment category"},{"id":"REL-002893","type":"manufactures","from":"CMP-000318","to":"MDL-000486","basis":"source","source_ids":["SRC-000827"],"confidence":"MEDIUM"},{"id":"REL-002894","type":"part_of","from":"MDL-000486","to":"PRD-000376","basis":"derived"},{"id":"REL-002895","type":"classified_as","from":"MDL-000486","to":"EQP-C14","basis":"source","source_ids":["SRC-000827"]},{"id":"REL-002896","type":"used_in","from":"MDL-000486","to":"PRS-034","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002897","type":"uses_technology","from":"MDL-000486","to":"TEC-040","basis":"derived","via":"equipment category"},{"id":"REL-002898","type":"manufactures","from":"CMP-000318","to":"MDL-000487","basis":"source","source_ids":["SRC-000828"],"confidence":"MEDIUM"},{"id":"REL-002899","type":"part_of","from":"MDL-000487","to":"PRD-000377","basis":"derived"},{"id":"REL-002900","type":"classified_as","from":"MDL-000487","to":"EQP-C13","basis":"source","source_ids":["SRC-000828"]},{"id":"REL-002901","type":"used_in","from":"MDL-000487","to":"PRS-034","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002902","type":"uses_technology","from":"MDL-000487","to":"TEC-040","basis":"derived","via":"equipment category"},{"id":"REL-002903","type":"manufactures","from":"CMP-000318","to":"MDL-000488","basis":"source","source_ids":["SRC-000829"],"confidence":"MEDIUM"},{"id":"REL-002904","type":"part_of","from":"MDL-000488","to":"PRD-000378","basis":"derived"},{"id":"REL-002905","type":"classified_as","from":"MDL-000488","to":"EQP-C31","basis":"source","source_ids":["SRC-000829"]},{"id":"REL-002906","type":"uses_technology","from":"MDL-000488","to":"TEC-066","basis":"derived","via":"equipment category"},{"id":"REL-002907","type":"manufactures","from":"CMP-000319","to":"MDL-000489","basis":"source","source_ids":["SRC-000830"],"confidence":"MEDIUM"},{"id":"REL-002908","type":"part_of","from":"MDL-000489","to":"PRD-000379","basis":"derived"},{"id":"REL-002909","type":"classified_as","from":"MDL-000489","to":"EQP-C10","basis":"source","source_ids":["SRC-000830"]},{"id":"REL-002910","type":"used_in","from":"MDL-000489","to":"PRS-033","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002911","type":"uses_technology","from":"MDL-000489","to":"TEC-039","basis":"derived","via":"equipment category"},{"id":"REL-002912","type":"supports_material","from":"MDL-000489","to":"MAT-010","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000830"]},{"id":"REL-002913","type":"manufactures","from":"CMP-000319","to":"MDL-000490","basis":"source","source_ids":["SRC-000831"],"confidence":"MEDIUM"},{"id":"REL-002914","type":"part_of","from":"MDL-000490","to":"PRD-000379","basis":"derived"},{"id":"REL-002915","type":"classified_as","from":"MDL-000490","to":"EQP-C10","basis":"source","source_ids":["SRC-000831"]},{"id":"REL-002916","type":"used_in","from":"MDL-000490","to":"PRS-033","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002917","type":"uses_technology","from":"MDL-000490","to":"TEC-039","basis":"derived","via":"equipment category"},{"id":"REL-002918","type":"supports_material","from":"MDL-000490","to":"MAT-010","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000831"]},{"id":"REL-002919","type":"manufactures","from":"CMP-000319","to":"MDL-000491","basis":"source","source_ids":["SRC-000832"],"confidence":"MEDIUM"},{"id":"REL-002920","type":"part_of","from":"MDL-000491","to":"PRD-000379","basis":"derived"},{"id":"REL-002921","type":"classified_as","from":"MDL-000491","to":"EQP-C10","basis":"source","source_ids":["SRC-000832"]},{"id":"REL-002922","type":"used_in","from":"MDL-000491","to":"PRS-033","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002923","type":"uses_technology","from":"MDL-000491","to":"TEC-039","basis":"derived","via":"equipment category"},{"id":"REL-002924","type":"manufactures","from":"CMP-000320","to":"MDL-000492","basis":"source","source_ids":["SRC-000833"],"confidence":"MEDIUM"},{"id":"REL-002925","type":"part_of","from":"MDL-000492","to":"PRD-000380","basis":"derived"},{"id":"REL-002926","type":"classified_as","from":"MDL-000492","to":"EQP-J11","basis":"source","source_ids":["SRC-000833"]},{"id":"REL-002927","type":"used_in","from":"MDL-000492","to":"PRS-058","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002928","type":"manufactures","from":"CMP-000320","to":"MDL-000493","basis":"source","source_ids":["SRC-000834"],"confidence":"MEDIUM"},{"id":"REL-002929","type":"part_of","from":"MDL-000493","to":"PRD-000380","basis":"derived"},{"id":"REL-002930","type":"classified_as","from":"MDL-000493","to":"EQP-J11","basis":"source","source_ids":["SRC-000834"]},{"id":"REL-002931","type":"used_in","from":"MDL-000493","to":"PRS-058","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002932","type":"manufactures","from":"CMP-000320","to":"MDL-000494","basis":"source","source_ids":["SRC-000835"],"confidence":"MEDIUM"},{"id":"REL-002933","type":"part_of","from":"MDL-000494","to":"PRD-000381","basis":"derived"},{"id":"REL-002934","type":"classified_as","from":"MDL-000494","to":"EQP-J12","basis":"source","source_ids":["SRC-000835"]},{"id":"REL-002935","type":"used_in","from":"MDL-000494","to":"PRS-058","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002936","type":"manufactures","from":"CMP-000320","to":"MDL-000495","basis":"source","source_ids":["SRC-000836"],"confidence":"MEDIUM"},{"id":"REL-002937","type":"part_of","from":"MDL-000495","to":"PRD-000381","basis":"derived"},{"id":"REL-002938","type":"classified_as","from":"MDL-000495","to":"EQP-J12","basis":"source","source_ids":["SRC-000836"]},{"id":"REL-002939","type":"used_in","from":"MDL-000495","to":"PRS-058","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002940","type":"manufactures","from":"CMP-000321","to":"MDL-000496","basis":"source","source_ids":["SRC-000814"],"confidence":"MEDIUM"},{"id":"REL-002941","type":"part_of","from":"MDL-000496","to":"PRD-000382","basis":"derived"},{"id":"REL-002942","type":"classified_as","from":"MDL-000496","to":"EQP-J06","basis":"source","source_ids":["SRC-000814"]},{"id":"REL-002943","type":"used_in","from":"MDL-000496","to":"PRS-058","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002944","type":"manufactures","from":"CMP-000322","to":"MDL-000497","basis":"source","source_ids":["SRC-000837"],"confidence":"LOW"},{"id":"REL-002945","type":"part_of","from":"MDL-000497","to":"PRD-000383","basis":"derived"},{"id":"REL-002946","type":"classified_as","from":"MDL-000497","to":"EQP-A05","basis":"source","source_ids":["SRC-000837"]},{"id":"REL-002947","type":"used_in","from":"MDL-000497","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002948","type":"used_in","from":"MDL-000497","to":"PRS-021","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002949","type":"uses_technology","from":"MDL-000497","to":"TEC-030","basis":"derived","via":"equipment category"},{"id":"REL-002950","type":"manufactures","from":"CMP-000323","to":"MDL-000498","basis":"source","source_ids":["SRC-000838"],"confidence":"MEDIUM"},{"id":"REL-002951","type":"part_of","from":"MDL-000498","to":"PRD-000384","basis":"derived"},{"id":"REL-002952","type":"classified_as","from":"MDL-000498","to":"EQP-A08.04","basis":"source","source_ids":["SRC-000838"]},{"id":"REL-002953","type":"used_in","from":"MDL-000498","to":"PRS-020","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002954","type":"uses_technology","from":"MDL-000498","to":"TEC-011","basis":"derived","via":"equipment category"},{"id":"REL-002955","type":"manufactures","from":"CMP-000323","to":"MDL-000499","basis":"source","source_ids":["SRC-000839"],"confidence":"MEDIUM"},{"id":"REL-002956","type":"part_of","from":"MDL-000499","to":"PRD-000384","basis":"derived"},{"id":"REL-002957","type":"classified_as","from":"MDL-000499","to":"EQP-A08.03","basis":"source","source_ids":["SRC-000839"]},{"id":"REL-002958","type":"used_in","from":"MDL-000499","to":"PRS-020","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002959","type":"uses_technology","from":"MDL-000499","to":"TEC-010","basis":"derived","via":"equipment category"},{"id":"REL-002960","type":"manufactures","from":"CMP-000323","to":"MDL-000500","basis":"source","source_ids":["SRC-000840"],"confidence":"MEDIUM"},{"id":"REL-002961","type":"part_of","from":"MDL-000500","to":"PRD-000384","basis":"derived"},{"id":"REL-002962","type":"classified_as","from":"MDL-000500","to":"EQP-A08.05","basis":"source","source_ids":["SRC-000840"]},{"id":"REL-002963","type":"used_in","from":"MDL-000500","to":"PRS-020","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002964","type":"used_in","from":"MDL-000500","to":"PRS-043","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002965","type":"uses_technology","from":"MDL-000500","to":"TEC-012","basis":"derived","via":"equipment category"},{"id":"REL-002966","type":"manufactures","from":"CMP-000323","to":"MDL-000501","basis":"source","source_ids":["SRC-000841"],"confidence":"MEDIUM"},{"id":"REL-002967","type":"part_of","from":"MDL-000501","to":"PRD-000385","basis":"derived"},{"id":"REL-002968","type":"classified_as","from":"MDL-000501","to":"EQP-A07","basis":"source","source_ids":["SRC-000841"]},{"id":"REL-002969","type":"used_in","from":"MDL-000501","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002970","type":"used_in","from":"MDL-000501","to":"PRS-021","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002971","type":"manufactures","from":"CMP-000143","to":"MDL-000502","basis":"source","source_ids":["SRC-000842"],"confidence":"MEDIUM"},{"id":"REL-002972","type":"part_of","from":"MDL-000502","to":"PRD-000386","basis":"derived"},{"id":"REL-002973","type":"classified_as","from":"MDL-000502","to":"EQP-D14","basis":"source","source_ids":["SRC-000842"]},{"id":"REL-002974","type":"used_in","from":"MDL-000502","to":"PRS-044","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002975","type":"used_in","from":"MDL-000502","to":"PRS-053","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002976","type":"uses_technology","from":"MDL-000502","to":"TEC-054","basis":"derived","via":"equipment category"},{"id":"REL-002977","type":"supports_material","from":"MDL-000502","to":"MAT-010","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000842"]},{"id":"REL-002978","type":"supports_application","from":"MDL-000502","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000842"]},{"id":"REL-002979","type":"manufactures","from":"CMP-000055","to":"MDL-000503","basis":"source","source_ids":["SRC-000843"],"confidence":"LOW"},{"id":"REL-002980","type":"part_of","from":"MDL-000503","to":"PRD-000387","basis":"derived"},{"id":"REL-002981","type":"classified_as","from":"MDL-000503","to":"EQP-C01.04","basis":"source","source_ids":["SRC-000843"]},{"id":"REL-002982","type":"used_in","from":"MDL-000503","to":"PRS-032","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002983","type":"uses_technology","from":"MDL-000503","to":"TEC-014","basis":"derived","via":"equipment category"},{"id":"REL-002984","type":"manufactures","from":"CMP-000326","to":"MDL-000504","basis":"source","source_ids":["SRC-000820"],"confidence":"MEDIUM"},{"id":"REL-002985","type":"part_of","from":"MDL-000504","to":"PRD-000388","basis":"derived"},{"id":"REL-002986","type":"classified_as","from":"MDL-000504","to":"EQP-C18","basis":"source","source_ids":["SRC-000820"]},{"id":"REL-002987","type":"used_in","from":"MDL-000504","to":"PRS-051","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002988","type":"used_in","from":"MDL-000504","to":"PRS-052","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002989","type":"uses_technology","from":"MDL-000504","to":"TEC-044","basis":"derived","via":"equipment category"},{"id":"REL-002990","type":"manufactures","from":"CMP-000046","to":"MDL-000505","basis":"source","source_ids":["SRC-000844"],"confidence":"MEDIUM"},{"id":"REL-002991","type":"part_of","from":"MDL-000505","to":"PRD-000389","basis":"derived"},{"id":"REL-002992","type":"classified_as","from":"MDL-000505","to":"EQP-C16","basis":"source","source_ids":["SRC-000844"]},{"id":"REL-002993","type":"used_in","from":"MDL-000505","to":"PRS-035","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002994","type":"used_in","from":"MDL-000505","to":"PRS-049","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002995","type":"used_in","from":"MDL-000505","to":"PRS-050","basis":"derived","via":"equipment category → process reference"},{"id":"REL-002996","type":"uses_technology","from":"MDL-000505","to":"TEC-042","basis":"derived","via":"equipment category"},{"id":"REL-002997","type":"supports_application","from":"MDL-000505","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000844"]},{"id":"REL-002998","type":"manufactures","from":"CMP-000067","to":"MDL-000506","basis":"source","source_ids":["SRC-000845"],"confidence":"MEDIUM"},{"id":"REL-002999","type":"part_of","from":"MDL-000506","to":"PRD-000390","basis":"derived"},{"id":"REL-003000","type":"classified_as","from":"MDL-000506","to":"EQP-C16","basis":"source","source_ids":["SRC-000845"]},{"id":"REL-003001","type":"used_in","from":"MDL-000506","to":"PRS-035","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003002","type":"used_in","from":"MDL-000506","to":"PRS-049","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003003","type":"used_in","from":"MDL-000506","to":"PRS-050","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003004","type":"uses_technology","from":"MDL-000506","to":"TEC-042","basis":"derived","via":"equipment category"},{"id":"REL-003005","type":"supports_application","from":"MDL-000506","to":"APP-008","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000845"]},{"id":"REL-003006","type":"manufactures","from":"CMP-000334","to":"MDL-000507","basis":"source","source_ids":["SRC-000862"],"confidence":"MEDIUM"},{"id":"REL-003007","type":"part_of","from":"MDL-000507","to":"PRD-000391","basis":"derived"},{"id":"REL-003008","type":"classified_as","from":"MDL-000507","to":"EQP-A09.08","basis":"source","source_ids":["SRC-000862"]},{"id":"REL-003009","type":"used_in","from":"MDL-000507","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003010","type":"used_in","from":"MDL-000507","to":"PRS-016","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003011","type":"uses_technology","from":"MDL-000507","to":"TEC-020","basis":"derived","via":"equipment category"},{"id":"REL-003012","type":"supports_application","from":"MDL-000507","to":"APP-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000862"]},{"id":"REL-003013","type":"supports_application","from":"MDL-000507","to":"APP-005","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000862"]},{"id":"REL-003014","type":"manufactures","from":"CMP-000334","to":"MDL-000508","basis":"source","source_ids":["SRC-000863"],"confidence":"MEDIUM"},{"id":"REL-003015","type":"part_of","from":"MDL-000508","to":"PRD-000391","basis":"derived"},{"id":"REL-003016","type":"classified_as","from":"MDL-000508","to":"EQP-A09.08","basis":"source","source_ids":["SRC-000863"]},{"id":"REL-003017","type":"used_in","from":"MDL-000508","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003018","type":"used_in","from":"MDL-000508","to":"PRS-016","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003019","type":"uses_technology","from":"MDL-000508","to":"TEC-020","basis":"derived","via":"equipment category"},{"id":"REL-003020","type":"supports_application","from":"MDL-000508","to":"APP-014","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000863"]},{"id":"REL-003021","type":"manufactures","from":"CMP-000334","to":"MDL-000509","basis":"source","source_ids":["SRC-000864"],"confidence":"MEDIUM"},{"id":"REL-003022","type":"part_of","from":"MDL-000509","to":"PRD-000391","basis":"derived"},{"id":"REL-003023","type":"classified_as","from":"MDL-000509","to":"EQP-A09.08","basis":"source","source_ids":["SRC-000864"]},{"id":"REL-003024","type":"used_in","from":"MDL-000509","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003025","type":"used_in","from":"MDL-000509","to":"PRS-016","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003026","type":"uses_technology","from":"MDL-000509","to":"TEC-020","basis":"derived","via":"equipment category"},{"id":"REL-003027","type":"supports_application","from":"MDL-000509","to":"APP-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000864"]},{"id":"REL-003028","type":"supports_application","from":"MDL-000509","to":"APP-005","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000864"]},{"id":"REL-003029","type":"manufactures","from":"CMP-000335","to":"MDL-000510","basis":"source","source_ids":["SRC-000865"],"confidence":"MEDIUM"},{"id":"REL-003030","type":"part_of","from":"MDL-000510","to":"PRD-000392","basis":"derived"},{"id":"REL-003031","type":"classified_as","from":"MDL-000510","to":"EQP-A09.08","basis":"source","source_ids":["SRC-000865"]},{"id":"REL-003032","type":"used_in","from":"MDL-000510","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003033","type":"used_in","from":"MDL-000510","to":"PRS-016","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003034","type":"uses_technology","from":"MDL-000510","to":"TEC-020","basis":"derived","via":"equipment category"},{"id":"REL-003035","type":"manufactures","from":"CMP-000335","to":"MDL-000511","basis":"source","source_ids":["SRC-000866"],"confidence":"MEDIUM"},{"id":"REL-003036","type":"part_of","from":"MDL-000511","to":"PRD-000392","basis":"derived"},{"id":"REL-003037","type":"classified_as","from":"MDL-000511","to":"EQP-A09.08","basis":"source","source_ids":["SRC-000866"]},{"id":"REL-003038","type":"used_in","from":"MDL-000511","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003039","type":"used_in","from":"MDL-000511","to":"PRS-016","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003040","type":"uses_technology","from":"MDL-000511","to":"TEC-020","basis":"derived","via":"equipment category"},{"id":"REL-003041","type":"supports_application","from":"MDL-000511","to":"APP-005","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000866"]},{"id":"REL-003042","type":"manufactures","from":"CMP-000335","to":"MDL-000512","basis":"source","source_ids":["SRC-000867"],"confidence":"MEDIUM"},{"id":"REL-003043","type":"part_of","from":"MDL-000512","to":"PRD-000392","basis":"derived"},{"id":"REL-003044","type":"classified_as","from":"MDL-000512","to":"EQP-A09.08","basis":"source","source_ids":["SRC-000867"]},{"id":"REL-003045","type":"used_in","from":"MDL-000512","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003046","type":"used_in","from":"MDL-000512","to":"PRS-016","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003047","type":"uses_technology","from":"MDL-000512","to":"TEC-020","basis":"derived","via":"equipment category"},{"id":"REL-003048","type":"manufactures","from":"CMP-000335","to":"MDL-000513","basis":"source","source_ids":["SRC-000868"],"confidence":"MEDIUM"},{"id":"REL-003049","type":"part_of","from":"MDL-000513","to":"PRD-000392","basis":"derived"},{"id":"REL-003050","type":"classified_as","from":"MDL-000513","to":"EQP-A09.08","basis":"source","source_ids":["SRC-000868"]},{"id":"REL-003051","type":"used_in","from":"MDL-000513","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003052","type":"used_in","from":"MDL-000513","to":"PRS-016","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003053","type":"uses_technology","from":"MDL-000513","to":"TEC-020","basis":"derived","via":"equipment category"},{"id":"REL-003054","type":"supports_application","from":"MDL-000513","to":"APP-005","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000868"]},{"id":"REL-003055","type":"manufactures","from":"CMP-000335","to":"MDL-000514","basis":"source","source_ids":["SRC-000869"],"confidence":"MEDIUM"},{"id":"REL-003056","type":"part_of","from":"MDL-000514","to":"PRD-000392","basis":"derived"},{"id":"REL-003057","type":"classified_as","from":"MDL-000514","to":"EQP-A09.08","basis":"source","source_ids":["SRC-000869"]},{"id":"REL-003058","type":"used_in","from":"MDL-000514","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003059","type":"used_in","from":"MDL-000514","to":"PRS-016","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003060","type":"uses_technology","from":"MDL-000514","to":"TEC-020","basis":"derived","via":"equipment category"},{"id":"REL-003061","type":"manufactures","from":"CMP-000335","to":"MDL-000515","basis":"source","source_ids":["SRC-000870"],"confidence":"MEDIUM"},{"id":"REL-003062","type":"part_of","from":"MDL-000515","to":"PRD-000392","basis":"derived"},{"id":"REL-003063","type":"classified_as","from":"MDL-000515","to":"EQP-A09.08","basis":"source","source_ids":["SRC-000870"]},{"id":"REL-003064","type":"used_in","from":"MDL-000515","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003065","type":"used_in","from":"MDL-000515","to":"PRS-016","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003066","type":"uses_technology","from":"MDL-000515","to":"TEC-020","basis":"derived","via":"equipment category"},{"id":"REL-003067","type":"manufactures","from":"CMP-000335","to":"MDL-000516","basis":"source","source_ids":["SRC-000871"],"confidence":"MEDIUM"},{"id":"REL-003068","type":"part_of","from":"MDL-000516","to":"PRD-000393","basis":"derived"},{"id":"REL-003069","type":"classified_as","from":"MDL-000516","to":"EQP-A08","basis":"source","source_ids":["SRC-000871"]},{"id":"REL-003070","type":"used_in","from":"MDL-000516","to":"PRS-020","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003071","type":"supports_application","from":"MDL-000516","to":"APP-015","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000871"]},{"id":"REL-003072","type":"manufactures","from":"CMP-000336","to":"MDL-000517","basis":"source","source_ids":["SRC-000872"],"confidence":"MEDIUM"},{"id":"REL-003073","type":"part_of","from":"MDL-000517","to":"PRD-000394","basis":"derived"},{"id":"REL-003074","type":"classified_as","from":"MDL-000517","to":"EQP-A09.08","basis":"source","source_ids":["SRC-000872"]},{"id":"REL-003075","type":"used_in","from":"MDL-000517","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003076","type":"used_in","from":"MDL-000517","to":"PRS-016","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003077","type":"uses_technology","from":"MDL-000517","to":"TEC-020","basis":"derived","via":"equipment category"},{"id":"REL-003078","type":"manufactures","from":"CMP-000337","to":"MDL-000518","basis":"source","source_ids":["SRC-000873"],"confidence":"MEDIUM"},{"id":"REL-003079","type":"part_of","from":"MDL-000518","to":"PRD-000395","basis":"derived"},{"id":"REL-003080","type":"classified_as","from":"MDL-000518","to":"EQP-A05","basis":"source","source_ids":["SRC-000873"]},{"id":"REL-003081","type":"used_in","from":"MDL-000518","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003082","type":"used_in","from":"MDL-000518","to":"PRS-021","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003083","type":"uses_technology","from":"MDL-000518","to":"TEC-030","basis":"derived","via":"equipment category"},{"id":"REL-003084","type":"supports_application","from":"MDL-000518","to":"APP-019","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000873"]},{"id":"REL-003085","type":"manufactures","from":"CMP-000337","to":"MDL-000519","basis":"source","source_ids":["SRC-000874"],"confidence":"MEDIUM"},{"id":"REL-003086","type":"part_of","from":"MDL-000519","to":"PRD-000395","basis":"derived"},{"id":"REL-003087","type":"classified_as","from":"MDL-000519","to":"EQP-D19","basis":"source","source_ids":["SRC-000874"]},{"id":"REL-003088","type":"used_in","from":"MDL-000519","to":"PRS-053","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003089","type":"uses_technology","from":"MDL-000519","to":"TEC-048","basis":"derived","via":"equipment category"},{"id":"REL-003090","type":"manufactures","from":"CMP-000338","to":"MDL-000520","basis":"source","source_ids":["SRC-000858"],"confidence":"MEDIUM"},{"id":"REL-003091","type":"part_of","from":"MDL-000520","to":"PRD-000396","basis":"derived"},{"id":"REL-003092","type":"classified_as","from":"MDL-000520","to":"EQP-A10","basis":"source","source_ids":["SRC-000858"]},{"id":"REL-003093","type":"used_in","from":"MDL-000520","to":"PRS-022","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003094","type":"uses_technology","from":"MDL-000520","to":"TEC-026","basis":"derived","via":"equipment category"},{"id":"REL-003095","type":"manufactures","from":"CMP-000087","to":"MDL-000521","basis":"source","source_ids":["SRC-000875"],"confidence":"MEDIUM"},{"id":"REL-003096","type":"part_of","from":"MDL-000521","to":"PRD-000397","basis":"derived"},{"id":"REL-003097","type":"classified_as","from":"MDL-000521","to":"EQP-A23","basis":"source","source_ids":["SRC-000875"]},{"id":"REL-003098","type":"used_in","from":"MDL-000521","to":"PRS-027","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003099","type":"uses_technology","from":"MDL-000521","to":"TEC-031","basis":"derived","via":"equipment category"},{"id":"REL-003100","type":"manufactures","from":"CMP-000087","to":"MDL-000522","basis":"source","source_ids":["SRC-000876"],"confidence":"MEDIUM"},{"id":"REL-003101","type":"part_of","from":"MDL-000522","to":"PRD-000397","basis":"derived"},{"id":"REL-003102","type":"classified_as","from":"MDL-000522","to":"EQP-A23","basis":"source","source_ids":["SRC-000876"]},{"id":"REL-003103","type":"used_in","from":"MDL-000522","to":"PRS-027","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003104","type":"uses_technology","from":"MDL-000522","to":"TEC-031","basis":"derived","via":"equipment category"},{"id":"REL-003105","type":"manufactures","from":"CMP-000341","to":"MDL-000523","basis":"source","source_ids":["SRC-000877"],"confidence":"MEDIUM"},{"id":"REL-003106","type":"part_of","from":"MDL-000523","to":"PRD-000398","basis":"derived"},{"id":"REL-003107","type":"classified_as","from":"MDL-000523","to":"EQP-A25","basis":"source","source_ids":["SRC-000877"]},{"id":"REL-003108","type":"used_in","from":"MDL-000523","to":"PRS-026","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003109","type":"uses_technology","from":"MDL-000523","to":"TEC-035","basis":"derived","via":"equipment category"},{"id":"REL-003110","type":"manufactures","from":"CMP-000341","to":"MDL-000524","basis":"source","source_ids":["SRC-000878"],"confidence":"MEDIUM"},{"id":"REL-003111","type":"part_of","from":"MDL-000524","to":"PRD-000398","basis":"derived"},{"id":"REL-003112","type":"classified_as","from":"MDL-000524","to":"EQP-A25","basis":"source","source_ids":["SRC-000878"]},{"id":"REL-003113","type":"used_in","from":"MDL-000524","to":"PRS-026","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003114","type":"uses_technology","from":"MDL-000524","to":"TEC-035","basis":"derived","via":"equipment category"},{"id":"REL-003115","type":"manufactures","from":"CMP-000357","to":"MDL-000525","basis":"source","source_ids":["SRC-000903"],"confidence":"MEDIUM"},{"id":"REL-003116","type":"part_of","from":"MDL-000525","to":"PRD-000399","basis":"derived"},{"id":"REL-003117","type":"classified_as","from":"MDL-000525","to":"EQP-A09.10","basis":"source","source_ids":["SRC-000903"]},{"id":"REL-003118","type":"used_in","from":"MDL-000525","to":"PRS-009","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003119","type":"used_in","from":"MDL-000525","to":"PRS-013","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003120","type":"uses_technology","from":"MDL-000525","to":"TEC-022","basis":"derived","via":"equipment category"},{"id":"REL-003121","type":"supports_material","from":"MDL-000525","to":"MAT-003","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000903"]},{"id":"REL-003122","type":"supports_application","from":"MDL-000525","to":"APP-011","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000903"]},{"id":"REL-003123","type":"manufactures","from":"CMP-000357","to":"MDL-000526","basis":"source","source_ids":["SRC-000904"],"confidence":"MEDIUM"},{"id":"REL-003124","type":"part_of","from":"MDL-000526","to":"PRD-000400","basis":"derived"},{"id":"REL-003125","type":"classified_as","from":"MDL-000526","to":"EQP-K01","basis":"source","source_ids":["SRC-000904"]},{"id":"REL-003126","type":"used_in","from":"MDL-000526","to":"PRS-001","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003127","type":"supports_material","from":"MDL-000526","to":"MAT-001","basis":"derived","via":"text match on source-stated fields","source_ids":["SRC-000904"]},{"id":"REL-003128","type":"manufactures","from":"CMP-000358","to":"MDL-000527","basis":"source","source_ids":["SRC-000905"],"confidence":"MEDIUM"},{"id":"REL-003129","type":"part_of","from":"MDL-000527","to":"PRD-000401","basis":"derived"},{"id":"REL-003130","type":"classified_as","from":"MDL-000527","to":"EQP-A12","basis":"source","source_ids":["SRC-000905"]},{"id":"REL-003131","type":"used_in","from":"MDL-000527","to":"PRS-023","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003132","type":"uses_technology","from":"MDL-000527","to":"TEC-028","basis":"derived","via":"equipment category"},{"id":"REL-003133","type":"manufactures","from":"CMP-000358","to":"MDL-000528","basis":"source","source_ids":["SRC-000906"],"confidence":"MEDIUM"},{"id":"REL-003134","type":"part_of","from":"MDL-000528","to":"PRD-000401","basis":"derived"},{"id":"REL-003135","type":"classified_as","from":"MDL-000528","to":"EQP-A13","basis":"source","source_ids":["SRC-000906"]},{"id":"REL-003136","type":"used_in","from":"MDL-000528","to":"PRS-023","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003137","type":"uses_technology","from":"MDL-000528","to":"TEC-028","basis":"derived","via":"equipment category"},{"id":"REL-003138","type":"manufactures","from":"CMP-000358","to":"MDL-000529","basis":"source","source_ids":["SRC-000907"],"confidence":"MEDIUM"},{"id":"REL-003139","type":"part_of","from":"MDL-000529","to":"PRD-000402","basis":"derived"},{"id":"REL-003140","type":"classified_as","from":"MDL-000529","to":"EQP-A07","basis":"source","source_ids":["SRC-000907"]},{"id":"REL-003141","type":"used_in","from":"MDL-000529","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003142","type":"used_in","from":"MDL-000529","to":"PRS-021","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003143","type":"manufactures","from":"CMP-000358","to":"MDL-000530","basis":"source","source_ids":["SRC-000908"],"confidence":"LOW"},{"id":"REL-003144","type":"part_of","from":"MDL-000530","to":"PRD-000402","basis":"derived"},{"id":"REL-003145","type":"classified_as","from":"MDL-000530","to":"EQP-A07","basis":"source","source_ids":["SRC-000908"]},{"id":"REL-003146","type":"used_in","from":"MDL-000530","to":"PRS-010","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003147","type":"used_in","from":"MDL-000530","to":"PRS-021","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003148","type":"manufactures","from":"CMP-000353","to":"MDL-000531","basis":"source","source_ids":["SRC-000909"],"confidence":"MEDIUM"},{"id":"REL-003149","type":"part_of","from":"MDL-000531","to":"PRD-000403","basis":"derived"},{"id":"REL-003150","type":"classified_as","from":"MDL-000531","to":"EQP-A43","basis":"source","source_ids":["SRC-000909"]},{"id":"REL-003151","type":"used_in","from":"MDL-000531","to":"PRS-060","basis":"derived","via":"equipment category → process reference"},{"id":"REL-003152","type":"offers","from":"CMP-000010","to":"PRD-000001","basis":"derived"},{"id":"REL-003153","type":"offers","from":"CMP-000010","to":"PRD-000002","basis":"derived"},{"id":"REL-003154","type":"offers","from":"CMP-000010","to":"PRD-000003","basis":"derived"},{"id":"REL-003155","type":"offers","from":"CMP-000011","to":"PRD-000004","basis":"derived"},{"id":"REL-003156","type":"offers","from":"CMP-000012","to":"PRD-000005","basis":"derived"},{"id":"REL-003157","type":"offers","from":"CMP-000012","to":"PRD-000006","basis":"derived"},{"id":"REL-003158","type":"offers","from":"CMP-000012","to":"PRD-000007","basis":"derived"},{"id":"REL-003159","type":"offers","from":"CMP-000012","to":"PRD-000008","basis":"derived"},{"id":"REL-003160","type":"offers","from":"CMP-000012","to":"PRD-000009","basis":"derived"},{"id":"REL-003161","type":"offers","from":"CMP-000012","to":"PRD-000010","basis":"derived"},{"id":"REL-003162","type":"offers","from":"CMP-000012","to":"PRD-000011","basis":"derived"},{"id":"REL-003163","type":"offers","from":"CMP-000012","to":"PRD-000012","basis":"derived"},{"id":"REL-003164","type":"offers","from":"CMP-000045","to":"PRD-000013","basis":"derived"},{"id":"REL-003165","type":"offers","from":"CMP-000045","to":"PRD-000014","basis":"derived"},{"id":"REL-003166","type":"offers","from":"CMP-000045","to":"PRD-000015","basis":"derived"},{"id":"REL-003167","type":"offers","from":"CMP-000077","to":"PRD-000016","basis":"derived"},{"id":"REL-003168","type":"offers","from":"CMP-000077","to":"PRD-000017","basis":"derived"},{"id":"REL-003169","type":"offers","from":"CMP-000077","to":"PRD-000018","basis":"derived"},{"id":"REL-003170","type":"offers","from":"CMP-000077","to":"PRD-000019","basis":"derived"},{"id":"REL-003171","type":"offers","from":"CMP-000077","to":"PRD-000020","basis":"derived"},{"id":"REL-003172","type":"offers","from":"CMP-000077","to":"PRD-000021","basis":"derived"},{"id":"REL-003173","type":"offers","from":"CMP-000077","to":"PRD-000022","basis":"derived"},{"id":"REL-003174","type":"offers","from":"CMP-000141","to":"PRD-000023","basis":"derived"},{"id":"REL-003175","type":"offers","from":"CMP-000141","to":"PRD-000024","basis":"derived"},{"id":"REL-003176","type":"offers","from":"CMP-000142","to":"PRD-000025","basis":"derived"},{"id":"REL-003177","type":"offers","from":"CMP-000142","to":"PRD-000026","basis":"derived"},{"id":"REL-003178","type":"offers","from":"CMP-000142","to":"PRD-000027","basis":"derived"},{"id":"REL-003179","type":"offers","from":"CMP-000142","to":"PRD-000028","basis":"derived"},{"id":"REL-003180","type":"offers","from":"CMP-000143","to":"PRD-000029","basis":"derived"},{"id":"REL-003181","type":"offers","from":"CMP-000143","to":"PRD-000030","basis":"derived"},{"id":"REL-003182","type":"offers","from":"CMP-000143","to":"PRD-000031","basis":"derived"},{"id":"REL-003183","type":"offers","from":"CMP-000144","to":"PRD-000032","basis":"derived"},{"id":"REL-003184","type":"offers","from":"CMP-000144","to":"PRD-000033","basis":"derived"},{"id":"REL-003185","type":"offers","from":"CMP-000144","to":"PRD-000034","basis":"derived"},{"id":"REL-003186","type":"offers","from":"CMP-000144","to":"PRD-000035","basis":"derived"},{"id":"REL-003187","type":"offers","from":"CMP-000117","to":"PRD-000036","basis":"derived"},{"id":"REL-003188","type":"offers","from":"CMP-000118","to":"PRD-000037","basis":"derived"},{"id":"REL-003189","type":"offers","from":"CMP-000119","to":"PRD-000038","basis":"derived"},{"id":"REL-003190","type":"offers","from":"CMP-000119","to":"PRD-000039","basis":"derived"},{"id":"REL-003191","type":"offers","from":"CMP-000119","to":"PRD-000040","basis":"derived"},{"id":"REL-003192","type":"offers","from":"CMP-000119","to":"PRD-000041","basis":"derived"},{"id":"REL-003193","type":"offers","from":"CMP-000119","to":"PRD-000042","basis":"derived"},{"id":"REL-003194","type":"offers","from":"CMP-000120","to":"PRD-000043","basis":"derived"},{"id":"REL-003195","type":"offers","from":"CMP-000121","to":"PRD-000044","basis":"derived"},{"id":"REL-003196","type":"offers","from":"CMP-000078","to":"PRD-000045","basis":"derived"},{"id":"REL-003197","type":"offers","from":"CMP-000078","to":"PRD-000046","basis":"derived"},{"id":"REL-003198","type":"offers","from":"CMP-000079","to":"PRD-000047","basis":"derived"},{"id":"REL-003199","type":"offers","from":"CMP-000079","to":"PRD-000048","basis":"derived"},{"id":"REL-003200","type":"offers","from":"CMP-000057","to":"PRD-000049","basis":"derived"},{"id":"REL-003201","type":"offers","from":"CMP-000056","to":"PRD-000050","basis":"derived"},{"id":"REL-003202","type":"offers","from":"CMP-000014","to":"PRD-000051","basis":"derived"},{"id":"REL-003203","type":"offers","from":"CMP-000014","to":"PRD-000052","basis":"derived"},{"id":"REL-003204","type":"offers","from":"CMP-000174","to":"PRD-000053","basis":"derived"},{"id":"REL-003205","type":"offers","from":"CMP-000175","to":"PRD-000054","basis":"derived"},{"id":"REL-003206","type":"offers","from":"CMP-000175","to":"PRD-000055","basis":"derived"},{"id":"REL-003207","type":"offers","from":"CMP-000175","to":"PRD-000056","basis":"derived"},{"id":"REL-003208","type":"offers","from":"CMP-000177","to":"PRD-000057","basis":"derived"},{"id":"REL-003209","type":"offers","from":"CMP-000177","to":"PRD-000058","basis":"derived"},{"id":"REL-003210","type":"offers","from":"CMP-000145","to":"PRD-000059","basis":"derived"},{"id":"REL-003211","type":"offers","from":"CMP-000145","to":"PRD-000060","basis":"derived"},{"id":"REL-003212","type":"offers","from":"CMP-000145","to":"PRD-000061","basis":"derived"},{"id":"REL-003213","type":"offers","from":"CMP-000145","to":"PRD-000062","basis":"derived"},{"id":"REL-003214","type":"offers","from":"CMP-000148","to":"PRD-000063","basis":"derived"},{"id":"REL-003215","type":"offers","from":"CMP-000148","to":"PRD-000064","basis":"derived"},{"id":"REL-003216","type":"offers","from":"CMP-000032","to":"PRD-000065","basis":"derived"},{"id":"REL-003217","type":"offers","from":"CMP-000054","to":"PRD-000066","basis":"derived"},{"id":"REL-003218","type":"offers","from":"CMP-000055","to":"PRD-000067","basis":"derived"},{"id":"REL-003219","type":"offers","from":"CMP-000005","to":"PRD-000068","basis":"derived"},{"id":"REL-003220","type":"offers","from":"CMP-000051","to":"PRD-000069","basis":"derived"},{"id":"REL-003221","type":"offers","from":"CMP-000051","to":"PRD-000070","basis":"derived"},{"id":"REL-003222","type":"offers","from":"CMP-000052","to":"PRD-000071","basis":"derived"},{"id":"REL-003223","type":"offers","from":"CMP-000047","to":"PRD-000072","basis":"derived"},{"id":"REL-003224","type":"offers","from":"CMP-000048","to":"PRD-000073","basis":"derived"},{"id":"REL-003225","type":"offers","from":"CMP-000048","to":"PRD-000074","basis":"derived"},{"id":"REL-003226","type":"offers","from":"CMP-000002","to":"PRD-000075","basis":"derived"},{"id":"REL-003227","type":"offers","from":"CMP-000026","to":"PRD-000076","basis":"derived"},{"id":"REL-003228","type":"offers","from":"CMP-000026","to":"PRD-000077","basis":"derived"},{"id":"REL-003229","type":"offers","from":"CMP-000049","to":"PRD-000078","basis":"derived"},{"id":"REL-003230","type":"offers","from":"CMP-000049","to":"PRD-000079","basis":"derived"},{"id":"REL-003231","type":"offers","from":"CMP-000050","to":"PRD-000080","basis":"derived"},{"id":"REL-003232","type":"offers","from":"CMP-000050","to":"PRD-000081","basis":"derived"},{"id":"REL-003233","type":"offers","from":"CMP-000053","to":"PRD-000082","basis":"derived"},{"id":"REL-003234","type":"offers","from":"CMP-000040","to":"PRD-000083","basis":"derived"},{"id":"REL-003235","type":"offers","from":"CMP-000040","to":"PRD-000084","basis":"derived"},{"id":"REL-003236","type":"offers","from":"CMP-000038","to":"PRD-000085","basis":"derived"},{"id":"REL-003237","type":"offers","from":"CMP-000001","to":"PRD-000086","basis":"derived"},{"id":"REL-003238","type":"offers","from":"CMP-000001","to":"PRD-000087","basis":"derived"},{"id":"REL-003239","type":"offers","from":"CMP-000020","to":"PRD-000088","basis":"derived"},{"id":"REL-003240","type":"offers","from":"CMP-000013","to":"PRD-000089","basis":"derived"},{"id":"REL-003241","type":"offers","from":"CMP-000107","to":"PRD-000090","basis":"derived"},{"id":"REL-003242","type":"offers","from":"CMP-000107","to":"PRD-000091","basis":"derived"},{"id":"REL-003243","type":"offers","from":"CMP-000024","to":"PRD-000092","basis":"derived"},{"id":"REL-003244","type":"offers","from":"CMP-000025","to":"PRD-000093","basis":"derived"},{"id":"REL-003245","type":"offers","from":"CMP-000032","to":"PRD-000094","basis":"derived"},{"id":"REL-003246","type":"offers","from":"CMP-000002","to":"PRD-000095","basis":"derived"},{"id":"REL-003247","type":"offers","from":"CMP-000002","to":"PRD-000096","basis":"derived"},{"id":"REL-003248","type":"offers","from":"CMP-000101","to":"PRD-000097","basis":"derived"},{"id":"REL-003249","type":"offers","from":"CMP-000069","to":"PRD-000098","basis":"derived"},{"id":"REL-003250","type":"offers","from":"CMP-000070","to":"PRD-000099","basis":"derived"},{"id":"REL-003251","type":"offers","from":"CMP-000103","to":"PRD-000100","basis":"derived"},{"id":"REL-003252","type":"offers","from":"CMP-000103","to":"PRD-000101","basis":"derived"},{"id":"REL-003253","type":"offers","from":"CMP-000016","to":"PRD-000102","basis":"derived"},{"id":"REL-003254","type":"offers","from":"CMP-000016","to":"PRD-000103","basis":"derived"},{"id":"REL-003255","type":"offers","from":"CMP-000016","to":"PRD-000104","basis":"derived"},{"id":"REL-003256","type":"offers","from":"CMP-000028","to":"PRD-000105","basis":"derived"},{"id":"REL-003257","type":"offers","from":"CMP-000063","to":"PRD-000106","basis":"derived"},{"id":"REL-003258","type":"offers","from":"CMP-000066","to":"PRD-000107","basis":"derived"},{"id":"REL-003259","type":"offers","from":"CMP-000184","to":"PRD-000108","basis":"derived"},{"id":"REL-003260","type":"offers","from":"CMP-000194","to":"PRD-000109","basis":"derived"},{"id":"REL-003261","type":"offers","from":"CMP-000195","to":"PRD-000110","basis":"derived"},{"id":"REL-003262","type":"offers","from":"CMP-000180","to":"PRD-000111","basis":"derived"},{"id":"REL-003263","type":"offers","from":"CMP-000182","to":"PRD-000112","basis":"derived"},{"id":"REL-003264","type":"offers","from":"CMP-000181","to":"PRD-000113","basis":"derived"},{"id":"REL-003265","type":"offers","from":"CMP-000149","to":"PRD-000114","basis":"derived"},{"id":"REL-003266","type":"offers","from":"CMP-000150","to":"PRD-000115","basis":"derived"},{"id":"REL-003267","type":"offers","from":"CMP-000147","to":"PRD-000116","basis":"derived"},{"id":"REL-003268","type":"offers","from":"CMP-000148","to":"PRD-000117","basis":"derived"},{"id":"REL-003269","type":"offers","from":"CMP-000146","to":"PRD-000118","basis":"derived"},{"id":"REL-003270","type":"offers","from":"CMP-000146","to":"PRD-000119","basis":"derived"},{"id":"REL-003271","type":"offers","from":"CMP-000133","to":"PRD-000120","basis":"derived"},{"id":"REL-003272","type":"offers","from":"CMP-000134","to":"PRD-000121","basis":"derived"},{"id":"REL-003273","type":"offers","from":"CMP-000135","to":"PRD-000122","basis":"derived"},{"id":"REL-003274","type":"offers","from":"CMP-000151","to":"PRD-000123","basis":"derived"},{"id":"REL-003275","type":"offers","from":"CMP-000151","to":"PRD-000124","basis":"derived"},{"id":"REL-003276","type":"offers","from":"CMP-000152","to":"PRD-000125","basis":"derived"},{"id":"REL-003277","type":"offers","from":"CMP-000152","to":"PRD-000126","basis":"derived"},{"id":"REL-003278","type":"offers","from":"CMP-000153","to":"PRD-000127","basis":"derived"},{"id":"REL-003279","type":"offers","from":"CMP-000136","to":"PRD-000128","basis":"derived"},{"id":"REL-003280","type":"offers","from":"CMP-000154","to":"PRD-000129","basis":"derived"},{"id":"REL-003281","type":"offers","from":"CMP-000155","to":"PRD-000130","basis":"derived"},{"id":"REL-003282","type":"offers","from":"CMP-000156","to":"PRD-000131","basis":"derived"},{"id":"REL-003283","type":"offers","from":"CMP-000157","to":"PRD-000132","basis":"derived"},{"id":"REL-003284","type":"offers","from":"CMP-000158","to":"PRD-000133","basis":"derived"},{"id":"REL-003285","type":"offers","from":"CMP-000159","to":"PRD-000134","basis":"derived"},{"id":"REL-003286","type":"offers","from":"CMP-000160","to":"PRD-000135","basis":"derived"},{"id":"REL-003287","type":"offers","from":"CMP-000161","to":"PRD-000136","basis":"derived"},{"id":"REL-003288","type":"offers","from":"CMP-000162","to":"PRD-000137","basis":"derived"},{"id":"REL-003289","type":"offers","from":"CMP-000163","to":"PRD-000138","basis":"derived"},{"id":"REL-003290","type":"offers","from":"CMP-000164","to":"PRD-000139","basis":"derived"},{"id":"REL-003291","type":"offers","from":"CMP-000137","to":"PRD-000140","basis":"derived"},{"id":"REL-003292","type":"offers","from":"CMP-000138","to":"PRD-000141","basis":"derived"},{"id":"REL-003293","type":"offers","from":"CMP-000166","to":"PRD-000142","basis":"derived"},{"id":"REL-003294","type":"offers","from":"CMP-000168","to":"PRD-000143","basis":"derived"},{"id":"REL-003295","type":"offers","from":"CMP-000023","to":"PRD-000144","basis":"derived"},{"id":"REL-003296","type":"offers","from":"CMP-000170","to":"PRD-000145","basis":"derived"},{"id":"REL-003297","type":"offers","from":"CMP-000171","to":"PRD-000146","basis":"derived"},{"id":"REL-003298","type":"offers","from":"CMP-000003","to":"PRD-000147","basis":"derived"},{"id":"REL-003299","type":"offers","from":"CMP-000003","to":"PRD-000148","basis":"derived"},{"id":"REL-003300","type":"offers","from":"CMP-000003","to":"PRD-000149","basis":"derived"},{"id":"REL-003301","type":"offers","from":"CMP-000003","to":"PRD-000150","basis":"derived"},{"id":"REL-003302","type":"offers","from":"CMP-000003","to":"PRD-000151","basis":"derived"},{"id":"REL-003303","type":"offers","from":"CMP-000003","to":"PRD-000152","basis":"derived"},{"id":"REL-003304","type":"offers","from":"CMP-000002","to":"PRD-000153","basis":"derived"},{"id":"REL-003305","type":"offers","from":"CMP-000002","to":"PRD-000154","basis":"derived"},{"id":"REL-003306","type":"offers","from":"CMP-000002","to":"PRD-000155","basis":"derived"},{"id":"REL-003307","type":"offers","from":"CMP-000001","to":"PRD-000156","basis":"derived"},{"id":"REL-003308","type":"offers","from":"CMP-000001","to":"PRD-000157","basis":"derived"},{"id":"REL-003309","type":"offers","from":"CMP-000004","to":"PRD-000158","basis":"derived"},{"id":"REL-003310","type":"offers","from":"CMP-000004","to":"PRD-000159","basis":"derived"},{"id":"REL-003311","type":"offers","from":"CMP-000004","to":"PRD-000160","basis":"derived"},{"id":"REL-003312","type":"offers","from":"CMP-000022","to":"PRD-000161","basis":"derived"},{"id":"REL-003313","type":"offers","from":"CMP-000022","to":"PRD-000162","basis":"derived"},{"id":"REL-003314","type":"offers","from":"CMP-000025","to":"PRD-000163","basis":"derived"},{"id":"REL-003315","type":"offers","from":"CMP-000027","to":"PRD-000164","basis":"derived"},{"id":"REL-003316","type":"offers","from":"CMP-000051","to":"PRD-000165","basis":"derived"},{"id":"REL-003317","type":"offers","from":"CMP-000043","to":"PRD-000166","basis":"derived"},{"id":"REL-003318","type":"offers","from":"CMP-000052","to":"PRD-000167","basis":"derived"},{"id":"REL-003319","type":"offers","from":"CMP-000046","to":"PRD-000168","basis":"derived"},{"id":"REL-003320","type":"offers","from":"CMP-000221","to":"PRD-000169","basis":"derived"},{"id":"REL-003321","type":"offers","from":"CMP-000370","to":"PRD-000170","basis":"derived"},{"id":"REL-003322","type":"offers","from":"CMP-000350","to":"PRD-000171","basis":"derived"},{"id":"REL-003323","type":"offers","from":"CMP-000365","to":"PRD-000172","basis":"derived"},{"id":"REL-003324","type":"offers","from":"CMP-000364","to":"PRD-000173","basis":"derived"},{"id":"REL-003325","type":"offers","from":"CMP-000363","to":"PRD-000174","basis":"derived"},{"id":"REL-003326","type":"offers","from":"CMP-000362","to":"PRD-000175","basis":"derived"},{"id":"REL-003327","type":"offers","from":"CMP-000007","to":"PRD-000176","basis":"derived"},{"id":"REL-003328","type":"offers","from":"CMP-000007","to":"PRD-000177","basis":"derived"},{"id":"REL-003329","type":"offers","from":"CMP-000007","to":"PRD-000178","basis":"derived"},{"id":"REL-003330","type":"offers","from":"CMP-000007","to":"PRD-000179","basis":"derived"},{"id":"REL-003331","type":"offers","from":"CMP-000007","to":"PRD-000180","basis":"derived"},{"id":"REL-003332","type":"offers","from":"CMP-000007","to":"PRD-000181","basis":"derived"},{"id":"REL-003333","type":"offers","from":"CMP-000104","to":"PRD-000182","basis":"derived"},{"id":"REL-003334","type":"offers","from":"CMP-000104","to":"PRD-000183","basis":"derived"},{"id":"REL-003335","type":"offers","from":"CMP-000104","to":"PRD-000184","basis":"derived"},{"id":"REL-003336","type":"offers","from":"CMP-000104","to":"PRD-000185","basis":"derived"},{"id":"REL-003337","type":"offers","from":"CMP-000104","to":"PRD-000186","basis":"derived"},{"id":"REL-003338","type":"offers","from":"CMP-000104","to":"PRD-000187","basis":"derived"},{"id":"REL-003339","type":"offers","from":"CMP-000104","to":"PRD-000188","basis":"derived"},{"id":"REL-003340","type":"offers","from":"CMP-000002","to":"PRD-000189","basis":"derived"},{"id":"REL-003341","type":"offers","from":"CMP-000002","to":"PRD-000190","basis":"derived"},{"id":"REL-003342","type":"offers","from":"CMP-000002","to":"PRD-000191","basis":"derived"},{"id":"REL-003343","type":"offers","from":"CMP-000015","to":"PRD-000192","basis":"derived"},{"id":"REL-003344","type":"offers","from":"CMP-000003","to":"PRD-000193","basis":"derived"},{"id":"REL-003345","type":"offers","from":"CMP-000003","to":"PRD-000194","basis":"derived"},{"id":"REL-003346","type":"offers","from":"CMP-000071","to":"PRD-000195","basis":"derived"},{"id":"REL-003347","type":"offers","from":"CMP-000004","to":"PRD-000196","basis":"derived"},{"id":"REL-003348","type":"offers","from":"CMP-000004","to":"PRD-000197","basis":"derived"},{"id":"REL-003349","type":"offers","from":"CMP-000004","to":"PRD-000198","basis":"derived"},{"id":"REL-003350","type":"offers","from":"CMP-000004","to":"PRD-000199","basis":"derived"},{"id":"REL-003351","type":"offers","from":"CMP-000004","to":"PRD-000200","basis":"derived"},{"id":"REL-003352","type":"offers","from":"CMP-000004","to":"PRD-000201","basis":"derived"},{"id":"REL-003353","type":"offers","from":"CMP-000004","to":"PRD-000202","basis":"derived"},{"id":"REL-003354","type":"offers","from":"CMP-000004","to":"PRD-000203","basis":"derived"},{"id":"REL-003355","type":"offers","from":"CMP-000023","to":"PRD-000204","basis":"derived"},{"id":"REL-003356","type":"offers","from":"CMP-000023","to":"PRD-000205","basis":"derived"},{"id":"REL-003357","type":"offers","from":"CMP-000023","to":"PRD-000206","basis":"derived"},{"id":"REL-003358","type":"offers","from":"CMP-000010","to":"PRD-000207","basis":"derived"},{"id":"REL-003359","type":"offers","from":"CMP-000010","to":"PRD-000208","basis":"derived"},{"id":"REL-003360","type":"offers","from":"CMP-000010","to":"PRD-000209","basis":"derived"},{"id":"REL-003361","type":"offers","from":"CMP-000012","to":"PRD-000210","basis":"derived"},{"id":"REL-003362","type":"offers","from":"CMP-000012","to":"PRD-000211","basis":"derived"},{"id":"REL-003363","type":"offers","from":"CMP-000012","to":"PRD-000212","basis":"derived"},{"id":"REL-003364","type":"offers","from":"CMP-000059","to":"PRD-000213","basis":"derived"},{"id":"REL-003365","type":"offers","from":"CMP-000008","to":"PRD-000214","basis":"derived"},{"id":"REL-003366","type":"offers","from":"CMP-000009","to":"PRD-000215","basis":"derived"},{"id":"REL-003367","type":"offers","from":"CMP-000009","to":"PRD-000216","basis":"derived"},{"id":"REL-003368","type":"offers","from":"CMP-000037","to":"PRD-000217","basis":"derived"},{"id":"REL-003369","type":"offers","from":"CMP-000005","to":"PRD-000218","basis":"derived"},{"id":"REL-003370","type":"offers","from":"CMP-000005","to":"PRD-000219","basis":"derived"},{"id":"REL-003371","type":"offers","from":"CMP-000005","to":"PRD-000220","basis":"derived"},{"id":"REL-003372","type":"offers","from":"CMP-000005","to":"PRD-000221","basis":"derived"},{"id":"REL-003373","type":"offers","from":"CMP-000005","to":"PRD-000222","basis":"derived"},{"id":"REL-003374","type":"offers","from":"CMP-000005","to":"PRD-000223","basis":"derived"},{"id":"REL-003375","type":"offers","from":"CMP-000021","to":"PRD-000224","basis":"derived"},{"id":"REL-003376","type":"offers","from":"CMP-000021","to":"PRD-000225","basis":"derived"},{"id":"REL-003377","type":"offers","from":"CMP-000021","to":"PRD-000226","basis":"derived"},{"id":"REL-003378","type":"offers","from":"CMP-000016","to":"PRD-000227","basis":"derived"},{"id":"REL-003379","type":"offers","from":"CMP-000016","to":"PRD-000228","basis":"derived"},{"id":"REL-003380","type":"offers","from":"CMP-000016","to":"PRD-000229","basis":"derived"},{"id":"REL-003381","type":"offers","from":"CMP-000018","to":"PRD-000230","basis":"derived"},{"id":"REL-003382","type":"offers","from":"CMP-000018","to":"PRD-000231","basis":"derived"},{"id":"REL-003383","type":"offers","from":"CMP-000018","to":"PRD-000232","basis":"derived"},{"id":"REL-003384","type":"offers","from":"CMP-000041","to":"PRD-000233","basis":"derived"},{"id":"REL-003385","type":"offers","from":"CMP-000206","to":"PRD-000234","basis":"derived"},{"id":"REL-003386","type":"offers","from":"CMP-000024","to":"PRD-000235","basis":"derived"},{"id":"REL-003387","type":"offers","from":"CMP-000024","to":"PRD-000236","basis":"derived"},{"id":"REL-003388","type":"offers","from":"CMP-000026","to":"PRD-000237","basis":"derived"},{"id":"REL-003389","type":"offers","from":"CMP-000026","to":"PRD-000238","basis":"derived"},{"id":"REL-003390","type":"offers","from":"CMP-000038","to":"PRD-000239","basis":"derived"},{"id":"REL-003391","type":"offers","from":"CMP-000038","to":"PRD-000240","basis":"derived"},{"id":"REL-003392","type":"offers","from":"CMP-000038","to":"PRD-000241","basis":"derived"},{"id":"REL-003393","type":"offers","from":"CMP-000038","to":"PRD-000242","basis":"derived"},{"id":"REL-003394","type":"offers","from":"CMP-000036","to":"PRD-000243","basis":"derived"},{"id":"REL-003395","type":"offers","from":"CMP-000036","to":"PRD-000244","basis":"derived"},{"id":"REL-003396","type":"offers","from":"CMP-000013","to":"PRD-000245","basis":"derived"},{"id":"REL-003397","type":"offers","from":"CMP-000173","to":"PRD-000246","basis":"derived"},{"id":"REL-003398","type":"offers","from":"CMP-000173","to":"PRD-000247","basis":"derived"},{"id":"REL-003399","type":"offers","from":"CMP-000172","to":"PRD-000248","basis":"derived"},{"id":"REL-003400","type":"offers","from":"CMP-000064","to":"PRD-000249","basis":"derived"},{"id":"REL-003401","type":"offers","from":"CMP-000062","to":"PRD-000250","basis":"derived"},{"id":"REL-003402","type":"offers","from":"CMP-000065","to":"PRD-000251","basis":"derived"},{"id":"REL-003403","type":"offers","from":"CMP-000066","to":"PRD-000252","basis":"derived"},{"id":"REL-003404","type":"offers","from":"CMP-000066","to":"PRD-000253","basis":"derived"},{"id":"REL-003405","type":"offers","from":"CMP-000202","to":"PRD-000254","basis":"derived"},{"id":"REL-003406","type":"offers","from":"CMP-000202","to":"PRD-000255","basis":"derived"},{"id":"REL-003407","type":"offers","from":"CMP-000202","to":"PRD-000256","basis":"derived"},{"id":"REL-003408","type":"offers","from":"CMP-000203","to":"PRD-000257","basis":"derived"},{"id":"REL-003409","type":"offers","from":"CMP-000203","to":"PRD-000258","basis":"derived"},{"id":"REL-003410","type":"offers","from":"CMP-000203","to":"PRD-000259","basis":"derived"},{"id":"REL-003411","type":"offers","from":"CMP-000203","to":"PRD-000260","basis":"derived"},{"id":"REL-003412","type":"offers","from":"CMP-000204","to":"PRD-000261","basis":"derived"},{"id":"REL-003413","type":"offers","from":"CMP-000205","to":"PRD-000262","basis":"derived"},{"id":"REL-003414","type":"offers","from":"CMP-000006","to":"PRD-000263","basis":"derived"},{"id":"REL-003415","type":"offers","from":"CMP-000006","to":"PRD-000264","basis":"derived"},{"id":"REL-003416","type":"offers","from":"CMP-000002","to":"PRD-000265","basis":"derived"},{"id":"REL-003417","type":"offers","from":"CMP-000014","to":"PRD-000266","basis":"derived"},{"id":"REL-003418","type":"offers","from":"CMP-000028","to":"PRD-000267","basis":"derived"},{"id":"REL-003419","type":"offers","from":"CMP-000207","to":"PRD-000268","basis":"derived"},{"id":"REL-003420","type":"offers","from":"CMP-000007","to":"PRD-000269","basis":"derived"},{"id":"REL-003421","type":"offers","from":"CMP-000207","to":"PRD-000270","basis":"derived"},{"id":"REL-003422","type":"offers","from":"CMP-000209","to":"PRD-000271","basis":"derived"},{"id":"REL-003423","type":"offers","from":"CMP-000210","to":"PRD-000272","basis":"derived"},{"id":"REL-003424","type":"offers","from":"CMP-000210","to":"PRD-000273","basis":"derived"},{"id":"REL-003425","type":"offers","from":"CMP-000211","to":"PRD-000274","basis":"derived"},{"id":"REL-003426","type":"offers","from":"CMP-000212","to":"PRD-000275","basis":"derived"},{"id":"REL-003427","type":"offers","from":"CMP-000213","to":"PRD-000276","basis":"derived"},{"id":"REL-003428","type":"offers","from":"CMP-000214","to":"PRD-000277","basis":"derived"},{"id":"REL-003429","type":"offers","from":"CMP-000214","to":"PRD-000278","basis":"derived"},{"id":"REL-003430","type":"offers","from":"CMP-000214","to":"PRD-000279","basis":"derived"},{"id":"REL-003431","type":"offers","from":"CMP-000215","to":"PRD-000280","basis":"derived"},{"id":"REL-003432","type":"offers","from":"CMP-000216","to":"PRD-000281","basis":"derived"},{"id":"REL-003433","type":"offers","from":"CMP-000217","to":"PRD-000282","basis":"derived"},{"id":"REL-003434","type":"offers","from":"CMP-000217","to":"PRD-000283","basis":"derived"},{"id":"REL-003435","type":"offers","from":"CMP-000218","to":"PRD-000284","basis":"derived"},{"id":"REL-003436","type":"offers","from":"CMP-000218","to":"PRD-000285","basis":"derived"},{"id":"REL-003437","type":"offers","from":"CMP-000219","to":"PRD-000286","basis":"derived"},{"id":"REL-003438","type":"offers","from":"CMP-000219","to":"PRD-000287","basis":"derived"},{"id":"REL-003439","type":"offers","from":"CMP-000219","to":"PRD-000288","basis":"derived"},{"id":"REL-003440","type":"offers","from":"CMP-000220","to":"PRD-000289","basis":"derived"},{"id":"REL-003441","type":"offers","from":"CMP-000221","to":"PRD-000290","basis":"derived"},{"id":"REL-003442","type":"offers","from":"CMP-000222","to":"PRD-000291","basis":"derived"},{"id":"REL-003443","type":"offers","from":"CMP-000223","to":"PRD-000292","basis":"derived"},{"id":"REL-003444","type":"offers","from":"CMP-000224","to":"PRD-000293","basis":"derived"},{"id":"REL-003445","type":"offers","from":"CMP-000224","to":"PRD-000294","basis":"derived"},{"id":"REL-003446","type":"offers","from":"CMP-000225","to":"PRD-000295","basis":"derived"},{"id":"REL-003447","type":"offers","from":"CMP-000226","to":"PRD-000296","basis":"derived"},{"id":"REL-003448","type":"offers","from":"CMP-000228","to":"PRD-000297","basis":"derived"},{"id":"REL-003449","type":"offers","from":"CMP-000229","to":"PRD-000298","basis":"derived"},{"id":"REL-003450","type":"offers","from":"CMP-000230","to":"PRD-000299","basis":"derived"},{"id":"REL-003451","type":"offers","from":"CMP-000230","to":"PRD-000300","basis":"derived"},{"id":"REL-003452","type":"offers","from":"CMP-000231","to":"PRD-000301","basis":"derived"},{"id":"REL-003453","type":"offers","from":"CMP-000232","to":"PRD-000302","basis":"derived"},{"id":"REL-003454","type":"offers","from":"CMP-000233","to":"PRD-000303","basis":"derived"},{"id":"REL-003455","type":"offers","from":"CMP-000233","to":"PRD-000304","basis":"derived"},{"id":"REL-003456","type":"offers","from":"CMP-000234","to":"PRD-000305","basis":"derived"},{"id":"REL-003457","type":"offers","from":"CMP-000235","to":"PRD-000306","basis":"derived"},{"id":"REL-003458","type":"offers","from":"CMP-000236","to":"PRD-000307","basis":"derived"},{"id":"REL-003459","type":"offers","from":"CMP-000237","to":"PRD-000308","basis":"derived"},{"id":"REL-003460","type":"offers","from":"CMP-000238","to":"PRD-000309","basis":"derived"},{"id":"REL-003461","type":"offers","from":"CMP-000239","to":"PRD-000310","basis":"derived"},{"id":"REL-003462","type":"offers","from":"CMP-000239","to":"PRD-000311","basis":"derived"},{"id":"REL-003463","type":"offers","from":"CMP-000240","to":"PRD-000312","basis":"derived"},{"id":"REL-003464","type":"offers","from":"CMP-000241","to":"PRD-000313","basis":"derived"},{"id":"REL-003465","type":"offers","from":"CMP-000242","to":"PRD-000314","basis":"derived"},{"id":"REL-003466","type":"offers","from":"CMP-000243","to":"PRD-000315","basis":"derived"},{"id":"REL-003467","type":"offers","from":"CMP-000244","to":"PRD-000316","basis":"derived"},{"id":"REL-003468","type":"offers","from":"CMP-000245","to":"PRD-000317","basis":"derived"},{"id":"REL-003469","type":"offers","from":"CMP-000246","to":"PRD-000318","basis":"derived"},{"id":"REL-003470","type":"offers","from":"CMP-000251","to":"PRD-000319","basis":"derived"},{"id":"REL-003471","type":"offers","from":"CMP-000253","to":"PRD-000320","basis":"derived"},{"id":"REL-003472","type":"offers","from":"CMP-000254","to":"PRD-000321","basis":"derived"},{"id":"REL-003473","type":"offers","from":"CMP-000255","to":"PRD-000322","basis":"derived"},{"id":"REL-003474","type":"offers","from":"CMP-000255","to":"PRD-000323","basis":"derived"},{"id":"REL-003475","type":"offers","from":"CMP-000256","to":"PRD-000324","basis":"derived"},{"id":"REL-003476","type":"offers","from":"CMP-000256","to":"PRD-000325","basis":"derived"},{"id":"REL-003477","type":"offers","from":"CMP-000257","to":"PRD-000326","basis":"derived"},{"id":"REL-003478","type":"offers","from":"CMP-000258","to":"PRD-000327","basis":"derived"},{"id":"REL-003479","type":"offers","from":"CMP-000258","to":"PRD-000328","basis":"derived"},{"id":"REL-003480","type":"offers","from":"CMP-000261","to":"PRD-000329","basis":"derived"},{"id":"REL-003481","type":"offers","from":"CMP-000261","to":"PRD-000330","basis":"derived"},{"id":"REL-003482","type":"offers","from":"CMP-000262","to":"PRD-000331","basis":"derived"},{"id":"REL-003483","type":"offers","from":"CMP-000263","to":"PRD-000332","basis":"derived"},{"id":"REL-003484","type":"offers","from":"CMP-000265","to":"PRD-000333","basis":"derived"},{"id":"REL-003485","type":"offers","from":"CMP-000266","to":"PRD-000334","basis":"derived"},{"id":"REL-003486","type":"offers","from":"CMP-000269","to":"PRD-000335","basis":"derived"},{"id":"REL-003487","type":"offers","from":"CMP-000270","to":"PRD-000336","basis":"derived"},{"id":"REL-003488","type":"offers","from":"CMP-000273","to":"PRD-000337","basis":"derived"},{"id":"REL-003489","type":"offers","from":"CMP-000274","to":"PRD-000338","basis":"derived"},{"id":"REL-003490","type":"offers","from":"CMP-000276","to":"PRD-000339","basis":"derived"},{"id":"REL-003491","type":"offers","from":"CMP-000276","to":"PRD-000340","basis":"derived"},{"id":"REL-003492","type":"offers","from":"CMP-000277","to":"PRD-000341","basis":"derived"},{"id":"REL-003493","type":"offers","from":"CMP-000278","to":"PRD-000342","basis":"derived"},{"id":"REL-003494","type":"offers","from":"CMP-000279","to":"PRD-000343","basis":"derived"},{"id":"REL-003495","type":"offers","from":"CMP-000280","to":"PRD-000344","basis":"derived"},{"id":"REL-003496","type":"offers","from":"CMP-000281","to":"PRD-000345","basis":"derived"},{"id":"REL-003497","type":"offers","from":"CMP-000281","to":"PRD-000346","basis":"derived"},{"id":"REL-003498","type":"offers","from":"CMP-000282","to":"PRD-000347","basis":"derived"},{"id":"REL-003499","type":"offers","from":"CMP-000283","to":"PRD-000348","basis":"derived"},{"id":"REL-003500","type":"offers","from":"CMP-000284","to":"PRD-000349","basis":"derived"},{"id":"REL-003501","type":"offers","from":"CMP-000289","to":"PRD-000350","basis":"derived"},{"id":"REL-003502","type":"offers","from":"CMP-000292","to":"PRD-000351","basis":"derived"},{"id":"REL-003503","type":"offers","from":"CMP-000293","to":"PRD-000352","basis":"derived"},{"id":"REL-003504","type":"offers","from":"CMP-000294","to":"PRD-000353","basis":"derived"},{"id":"REL-003505","type":"offers","from":"CMP-000295","to":"PRD-000354","basis":"derived"},{"id":"REL-003506","type":"offers","from":"CMP-000296","to":"PRD-000355","basis":"derived"},{"id":"REL-003507","type":"offers","from":"CMP-000298","to":"PRD-000356","basis":"derived"},{"id":"REL-003508","type":"offers","from":"CMP-000299","to":"PRD-000357","basis":"derived"},{"id":"REL-003509","type":"offers","from":"CMP-000300","to":"PRD-000358","basis":"derived"},{"id":"REL-003510","type":"offers","from":"CMP-000301","to":"PRD-000359","basis":"derived"},{"id":"REL-003511","type":"offers","from":"CMP-000302","to":"PRD-000360","basis":"derived"},{"id":"REL-003512","type":"offers","from":"CMP-000302","to":"PRD-000361","basis":"derived"},{"id":"REL-003513","type":"offers","from":"CMP-000303","to":"PRD-000362","basis":"derived"},{"id":"REL-003514","type":"offers","from":"CMP-000303","to":"PRD-000363","basis":"derived"},{"id":"REL-003515","type":"offers","from":"CMP-000304","to":"PRD-000364","basis":"derived"},{"id":"REL-003516","type":"offers","from":"CMP-000304","to":"PRD-000365","basis":"derived"},{"id":"REL-003517","type":"offers","from":"CMP-000305","to":"PRD-000366","basis":"derived"},{"id":"REL-003518","type":"offers","from":"CMP-000307","to":"PRD-000367","basis":"derived"},{"id":"REL-003519","type":"offers","from":"CMP-000308","to":"PRD-000368","basis":"derived"},{"id":"REL-003520","type":"offers","from":"CMP-000025","to":"PRD-000369","basis":"derived"},{"id":"REL-003521","type":"offers","from":"CMP-000309","to":"PRD-000370","basis":"derived"},{"id":"REL-003522","type":"offers","from":"CMP-000141","to":"PRD-000371","basis":"derived"},{"id":"REL-003523","type":"offers","from":"CMP-000044","to":"PRD-000372","basis":"derived"},{"id":"REL-003524","type":"offers","from":"CMP-000310","to":"PRD-000373","basis":"derived"},{"id":"REL-003525","type":"offers","from":"CMP-000316","to":"PRD-000374","basis":"derived"},{"id":"REL-003526","type":"offers","from":"CMP-000317","to":"PRD-000375","basis":"derived"},{"id":"REL-003527","type":"offers","from":"CMP-000318","to":"PRD-000376","basis":"derived"},{"id":"REL-003528","type":"offers","from":"CMP-000318","to":"PRD-000377","basis":"derived"},{"id":"REL-003529","type":"offers","from":"CMP-000318","to":"PRD-000378","basis":"derived"},{"id":"REL-003530","type":"offers","from":"CMP-000319","to":"PRD-000379","basis":"derived"},{"id":"REL-003531","type":"offers","from":"CMP-000320","to":"PRD-000380","basis":"derived"},{"id":"REL-003532","type":"offers","from":"CMP-000320","to":"PRD-000381","basis":"derived"},{"id":"REL-003533","type":"offers","from":"CMP-000321","to":"PRD-000382","basis":"derived"},{"id":"REL-003534","type":"offers","from":"CMP-000322","to":"PRD-000383","basis":"derived"},{"id":"REL-003535","type":"offers","from":"CMP-000323","to":"PRD-000384","basis":"derived"},{"id":"REL-003536","type":"offers","from":"CMP-000323","to":"PRD-000385","basis":"derived"},{"id":"REL-003537","type":"offers","from":"CMP-000143","to":"PRD-000386","basis":"derived"},{"id":"REL-003538","type":"offers","from":"CMP-000055","to":"PRD-000387","basis":"derived"},{"id":"REL-003539","type":"offers","from":"CMP-000326","to":"PRD-000388","basis":"derived"},{"id":"REL-003540","type":"offers","from":"CMP-000046","to":"PRD-000389","basis":"derived"},{"id":"REL-003541","type":"offers","from":"CMP-000067","to":"PRD-000390","basis":"derived"},{"id":"REL-003542","type":"offers","from":"CMP-000334","to":"PRD-000391","basis":"derived"},{"id":"REL-003543","type":"offers","from":"CMP-000335","to":"PRD-000392","basis":"derived"},{"id":"REL-003544","type":"offers","from":"CMP-000335","to":"PRD-000393","basis":"derived"},{"id":"REL-003545","type":"offers","from":"CMP-000336","to":"PRD-000394","basis":"derived"},{"id":"REL-003546","type":"offers","from":"CMP-000337","to":"PRD-000395","basis":"derived"},{"id":"REL-003547","type":"offers","from":"CMP-000338","to":"PRD-000396","basis":"derived"},{"id":"REL-003548","type":"offers","from":"CMP-000087","to":"PRD-000397","basis":"derived"},{"id":"REL-003549","type":"offers","from":"CMP-000341","to":"PRD-000398","basis":"derived"},{"id":"REL-003550","type":"offers","from":"CMP-000357","to":"PRD-000399","basis":"derived"},{"id":"REL-003551","type":"offers","from":"CMP-000357","to":"PRD-000400","basis":"derived"},{"id":"REL-003552","type":"offers","from":"CMP-000358","to":"PRD-000401","basis":"derived"},{"id":"REL-003553","type":"offers","from":"CMP-000358","to":"PRD-000402","basis":"derived"},{"id":"REL-003554","type":"offers","from":"CMP-000353","to":"PRD-000403","basis":"derived"},{"id":"REL-003555","type":"offers_equipment","from":"CMP-000001","to":"EQP-A01.01","basis":"source","source_ids":["SRC-000004","SRC-000024","SRC-000133","SRC-000142","SRC-000143","SRC-000190","SRC-000026"],"confidence":"HIGH"},{"id":"REL-003556","type":"offers_equipment","from":"CMP-000001","to":"EQP-A01.02","basis":"source","source_ids":["SRC-000004","SRC-000024","SRC-000133","SRC-000142","SRC-000143","SRC-000190","SRC-000026"],"confidence":"HIGH"},{"id":"REL-003557","type":"offers_equipment","from":"CMP-000001","to":"EQP-A01.03","basis":"source","source_ids":["SRC-000004","SRC-000024","SRC-000133","SRC-000142","SRC-000143","SRC-000190","SRC-000026"],"confidence":"HIGH"},{"id":"REL-003558","type":"offers_equipment","from":"CMP-000001","to":"EQP-A24","basis":"source","source_ids":["SRC-000004","SRC-000024","SRC-000133","SRC-000142","SRC-000143","SRC-000190","SRC-000026"],"confidence":"HIGH"},{"id":"REL-003559","type":"located_in","from":"CMP-000001","to":"CTY-NL","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003560","type":"present_in","from":"CMP-000001","to":"CTY-IN","basis":"source","source_ids":["SRC-000024","SRC-000023"],"confidence":"HIGH","detail":{"type":"Partnership (MoU)","facility":"Tata Electronics Dholera fab","location":"Dholera, Gujarat","status":"SIGNED 2026-05"}},{"id":"REL-003561","type":"offers_equipment","from":"CMP-000002","to":"EQP-A09","basis":"source","source_ids":["SRC-000004","SRC-000124","SRC-000138","SRC-000139","SRC-000035","SRC-000036","SRC-000046"],"confidence":"HIGH"},{"id":"REL-003562","type":"offers_equipment","from":"CMP-000002","to":"EQP-A09.02","basis":"source","source_ids":["SRC-000004","SRC-000124","SRC-000138","SRC-000139","SRC-000035","SRC-000036","SRC-000046"],"confidence":"HIGH"},{"id":"REL-003563","type":"offers_equipment","from":"CMP-000002","to":"EQP-A09.06","basis":"source","source_ids":["SRC-000004","SRC-000124","SRC-000138","SRC-000139","SRC-000035","SRC-000036","SRC-000046"],"confidence":"HIGH"},{"id":"REL-003564","type":"offers_equipment","from":"CMP-000002","to":"EQP-A08","basis":"source","source_ids":["SRC-000004","SRC-000124","SRC-000138","SRC-000139","SRC-000035","SRC-000036","SRC-000046"],"confidence":"HIGH"},{"id":"REL-003565","type":"offers_equipment","from":"CMP-000002","to":"EQP-C17","basis":"source","source_ids":["SRC-000004","SRC-000124","SRC-000138","SRC-000139","SRC-000035","SRC-000036","SRC-000046"],"confidence":"HIGH"},{"id":"REL-003566","type":"offers_equipment","from":"CMP-000002","to":"EQP-A08.01","basis":"source","source_ids":["SRC-000004","SRC-000124","SRC-000138","SRC-000139","SRC-000035","SRC-000036","SRC-000046"],"confidence":"HIGH"},{"id":"REL-003567","type":"offers_equipment","from":"CMP-000002","to":"EQP-A09.05","basis":"source","source_ids":["SRC-000004","SRC-000124","SRC-000138","SRC-000139","SRC-000035","SRC-000036","SRC-000046"],"confidence":"HIGH"},{"id":"REL-003568","type":"offers_equipment","from":"CMP-000002","to":"EQP-A24","basis":"source","source_ids":["SRC-000004","SRC-000124","SRC-000138","SRC-000139","SRC-000035","SRC-000036","SRC-000046"],"confidence":"HIGH"},{"id":"REL-003569","type":"offers_equipment","from":"CMP-000002","to":"EQP-A09.07","basis":"source","source_ids":["SRC-000004","SRC-000124","SRC-000138","SRC-000139","SRC-000035","SRC-000036","SRC-000046"],"confidence":"HIGH"},{"id":"REL-003570","type":"offers_equipment","from":"CMP-000002","to":"EQP-A19","basis":"source","source_ids":["SRC-000004","SRC-000124","SRC-000138","SRC-000139","SRC-000035","SRC-000036","SRC-000046"],"confidence":"HIGH"},{"id":"REL-003571","type":"offers_equipment","from":"CMP-000002","to":"EQP-A10","basis":"source","source_ids":["SRC-000004","SRC-000124","SRC-000138","SRC-000139","SRC-000035","SRC-000036","SRC-000046"],"confidence":"HIGH"},{"id":"REL-003572","type":"offers_equipment","from":"CMP-000002","to":"EQP-A09.10","basis":"source","source_ids":["SRC-000004","SRC-000124","SRC-000138","SRC-000139","SRC-000035","SRC-000036","SRC-000046"],"confidence":"HIGH"},{"id":"REL-003573","type":"located_in","from":"CMP-000002","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003574","type":"present_in","from":"CMP-000002","to":"CTY-IN","basis":"source","source_ids":["SRC-000035","SRC-000036","SRC-000337"],"confidence":"MEDIUM","detail":{"type":"R&D / Engineering","facility":">7,000 employees; 140-acre research park","location":null,"status":"OPERATING + ANNOUNCED"}},{"id":"REL-003575","type":"offers_equipment","from":"CMP-000003","to":"EQP-A08","basis":"source","source_ids":["SRC-000004","SRC-000136","SRC-000137","SRC-000032","SRC-000033","SRC-000215"],"confidence":"HIGH"},{"id":"REL-003576","type":"offers_equipment","from":"CMP-000003","to":"EQP-A09","basis":"source","source_ids":["SRC-000004","SRC-000136","SRC-000137","SRC-000032","SRC-000033","SRC-000215"],"confidence":"HIGH"},{"id":"REL-003577","type":"offers_equipment","from":"CMP-000003","to":"EQP-A09.04","basis":"source","source_ids":["SRC-000004","SRC-000136","SRC-000137","SRC-000032","SRC-000033","SRC-000215"],"confidence":"HIGH"},{"id":"REL-003578","type":"offers_equipment","from":"CMP-000003","to":"EQP-A17","basis":"source","source_ids":["SRC-000004","SRC-000136","SRC-000137","SRC-000032","SRC-000033","SRC-000215"],"confidence":"HIGH"},{"id":"REL-003579","type":"offers_equipment","from":"CMP-000003","to":"EQP-A09.06","basis":"source","source_ids":["SRC-000004","SRC-000136","SRC-000137","SRC-000032","SRC-000033","SRC-000215"],"confidence":"HIGH"},{"id":"REL-003580","type":"offers_equipment","from":"CMP-000003","to":"EQP-A09.02","basis":"source","source_ids":["SRC-000004","SRC-000136","SRC-000137","SRC-000032","SRC-000033","SRC-000215"],"confidence":"HIGH"},{"id":"REL-003581","type":"offers_equipment","from":"CMP-000003","to":"EQP-A08.02","basis":"source","source_ids":["SRC-000004","SRC-000136","SRC-000137","SRC-000032","SRC-000033","SRC-000215"],"confidence":"HIGH"},{"id":"REL-003582","type":"offers_equipment","from":"CMP-000003","to":"EQP-A18","basis":"source","source_ids":["SRC-000004","SRC-000136","SRC-000137","SRC-000032","SRC-000033","SRC-000215"],"confidence":"HIGH"},{"id":"REL-003583","type":"offers_equipment","from":"CMP-000003","to":"EQP-A07","basis":"source","source_ids":["SRC-000004","SRC-000136","SRC-000137","SRC-000032","SRC-000033","SRC-000215"],"confidence":"HIGH"},{"id":"REL-003584","type":"located_in","from":"CMP-000003","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003585","type":"present_in","from":"CMP-000003","to":"CTY-IN","basis":"source","source_ids":["SRC-000033","SRC-000215"],"confidence":"LOW","detail":{"type":"R&D / Engineering","facility":"Engineering operation + advanced semiconductor R&D laboratory","location":"Bengaluru","status":"OPERATING"}},{"id":"REL-003586","type":"present_in","from":"CMP-000003","to":"CTY-IN","basis":"source","source_ids":["SRC-000032","SRC-000033"],"confidence":"MEDIUM","detail":{"type":"Manufacturing (planned)","facility":"First silicon component manufacturing facility","location":null,"status":"ANNOUNCED"}},{"id":"REL-003587","type":"offers_equipment","from":"CMP-000004","to":"EQP-A","basis":"source","source_ids":["SRC-000004","SRC-000134","SRC-000135","SRC-000025","SRC-000023"],"confidence":"HIGH"},{"id":"REL-003588","type":"offers_equipment","from":"CMP-000004","to":"EQP-A09","basis":"source","source_ids":["SRC-000004","SRC-000134","SRC-000135","SRC-000025","SRC-000023"],"confidence":"HIGH"},{"id":"REL-003589","type":"offers_equipment","from":"CMP-000004","to":"EQP-A08","basis":"source","source_ids":["SRC-000004","SRC-000134","SRC-000135","SRC-000025","SRC-000023"],"confidence":"HIGH"},{"id":"REL-003590","type":"offers_equipment","from":"CMP-000004","to":"EQP-A02","basis":"source","source_ids":["SRC-000004","SRC-000134","SRC-000135","SRC-000025","SRC-000023"],"confidence":"HIGH"},{"id":"REL-003591","type":"offers_equipment","from":"CMP-000004","to":"EQP-A11","basis":"source","source_ids":["SRC-000004","SRC-000134","SRC-000135","SRC-000025","SRC-000023"],"confidence":"HIGH"},{"id":"REL-003592","type":"offers_equipment","from":"CMP-000004","to":"EQP-A04","basis":"source","source_ids":["SRC-000004","SRC-000134","SRC-000135","SRC-000025","SRC-000023"],"confidence":"HIGH"},{"id":"REL-003593","type":"offers_equipment","from":"CMP-000004","to":"EQP-A06","basis":"source","source_ids":["SRC-000004","SRC-000134","SRC-000135","SRC-000025","SRC-000023"],"confidence":"HIGH"},{"id":"REL-003594","type":"offers_equipment","from":"CMP-000004","to":"EQP-A15","basis":"source","source_ids":["SRC-000004","SRC-000134","SRC-000135","SRC-000025","SRC-000023"],"confidence":"HIGH"},{"id":"REL-003595","type":"offers_equipment","from":"CMP-000004","to":"EQP-C18","basis":"source","source_ids":["SRC-000004","SRC-000134","SRC-000135","SRC-000025","SRC-000023"],"confidence":"HIGH"},{"id":"REL-003596","type":"located_in","from":"CMP-000004","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003597","type":"present_in","from":"CMP-000004","to":"CTY-IN","basis":"source","source_ids":["SRC-000025"],"confidence":"HIGH","detail":{"type":"Partnership (MoU)","facility":"Tata Electronics Dholera fab + Jagiroad OSAT","location":"Gujarat; Assam","status":"SIGNED 2024-09-10"}},{"id":"REL-003598","type":"offers_equipment","from":"CMP-000005","to":"EQP-A21","basis":"source","source_ids":["SRC-000004","SRC-000140","SRC-000141","SRC-000202","SRC-000203","SRC-000204","SRC-000235"],"confidence":"HIGH"},{"id":"REL-003599","type":"offers_equipment","from":"CMP-000005","to":"EQP-A22","basis":"source","source_ids":["SRC-000004","SRC-000140","SRC-000141","SRC-000202","SRC-000203","SRC-000204","SRC-000235"],"confidence":"HIGH"},{"id":"REL-003600","type":"offers_equipment","from":"CMP-000005","to":"EQP-A25","basis":"source","source_ids":["SRC-000004","SRC-000140","SRC-000141","SRC-000202","SRC-000203","SRC-000204","SRC-000235"],"confidence":"HIGH"},{"id":"REL-003601","type":"offers_equipment","from":"CMP-000005","to":"EQP-C01.04","basis":"source","source_ids":["SRC-000004","SRC-000140","SRC-000141","SRC-000202","SRC-000203","SRC-000204","SRC-000235"],"confidence":"HIGH"},{"id":"REL-003602","type":"offers_equipment","from":"CMP-000005","to":"EQP-A30","basis":"source","source_ids":["SRC-000004","SRC-000140","SRC-000141","SRC-000202","SRC-000203","SRC-000204","SRC-000235"],"confidence":"HIGH"},{"id":"REL-003603","type":"offers_equipment","from":"CMP-000005","to":"EQP-C34","basis":"source","source_ids":["SRC-000004","SRC-000140","SRC-000141","SRC-000202","SRC-000203","SRC-000204","SRC-000235"],"confidence":"HIGH"},{"id":"REL-003604","type":"offers_equipment","from":"CMP-000005","to":"EQP-A08.05","basis":"source","source_ids":["SRC-000004","SRC-000140","SRC-000141","SRC-000202","SRC-000203","SRC-000204","SRC-000235"],"confidence":"HIGH"},{"id":"REL-003605","type":"located_in","from":"CMP-000005","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003606","type":"present_in","from":"CMP-000005","to":"CTY-IN","basis":"source","source_ids":["SRC-000202","SRC-000203","SRC-000204"],"confidence":"HIGH","detail":{"type":"R&D","facility":"Chennai R&D and innovation hub","location":"Chennai","status":"OPENED 2026-01"}},{"id":"REL-003607","type":"offers_equipment","from":"CMP-000006","to":"EQP-A","basis":"source","source_ids":["SRC-000153"],"confidence":"HIGH"},{"id":"REL-003608","type":"offers_equipment","from":"CMP-000006","to":"EQP-A09.10","basis":"source","source_ids":["SRC-000153"],"confidence":"HIGH"},{"id":"REL-003609","type":"located_in","from":"CMP-000006","to":"CTY-NL","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003610","type":"offers_equipment","from":"CMP-000007","to":"EQP-A","basis":"source","source_ids":["SRC-000146","SRC-000147","SRC-000091","SRC-000092"],"confidence":"MEDIUM"},{"id":"REL-003611","type":"offers_equipment","from":"CMP-000007","to":"EQP-A14","basis":"source","source_ids":["SRC-000146","SRC-000147","SRC-000091","SRC-000092"],"confidence":"MEDIUM"},{"id":"REL-003612","type":"offers_equipment","from":"CMP-000007","to":"EQP-A04","basis":"source","source_ids":["SRC-000146","SRC-000147","SRC-000091","SRC-000092"],"confidence":"MEDIUM"},{"id":"REL-003613","type":"offers_equipment","from":"CMP-000007","to":"EQP-A20","basis":"source","source_ids":["SRC-000146","SRC-000147","SRC-000091","SRC-000092"],"confidence":"MEDIUM"},{"id":"REL-003614","type":"offers_equipment","from":"CMP-000007","to":"EQP-A05","basis":"source","source_ids":["SRC-000146","SRC-000147","SRC-000091","SRC-000092"],"confidence":"MEDIUM"},{"id":"REL-003615","type":"offers_equipment","from":"CMP-000007","to":"EQP-A03","basis":"source","source_ids":["SRC-000146","SRC-000147","SRC-000091","SRC-000092"],"confidence":"MEDIUM"},{"id":"REL-003616","type":"offers_equipment","from":"CMP-000007","to":"EQP-A13","basis":"source","source_ids":["SRC-000146","SRC-000147","SRC-000091","SRC-000092"],"confidence":"MEDIUM"},{"id":"REL-003617","type":"offers_equipment","from":"CMP-000007","to":"EQP-A01.08","basis":"source","source_ids":["SRC-000146","SRC-000147","SRC-000091","SRC-000092"],"confidence":"MEDIUM"},{"id":"REL-003618","type":"located_in","from":"CMP-000007","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003619","type":"offers_equipment","from":"CMP-000008","to":"EQP-C40","basis":"source","source_ids":["SRC-000144","SRC-000302"],"confidence":"HIGH"},{"id":"REL-003620","type":"offers_equipment","from":"CMP-000008","to":"EQP-A32","basis":"source","source_ids":["SRC-000144","SRC-000302"],"confidence":"HIGH"},{"id":"REL-003621","type":"located_in","from":"CMP-000008","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003622","type":"offers_equipment","from":"CMP-000009","to":"EQP-C40","basis":"source","source_ids":["SRC-000151","SRC-000152","SRC-000128","SRC-000129","SRC-000214","SRC-000302"],"confidence":"HIGH"},{"id":"REL-003623","type":"located_in","from":"CMP-000009","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003624","type":"present_in","from":"CMP-000009","to":"CTY-IN","basis":"source","source_ids":["SRC-000214"],"confidence":"LOW","detail":{"type":"Office","facility":"New Bengaluru office","location":"Bengaluru","status":"OPENED (2026)"}},{"id":"REL-003625","type":"offers_equipment","from":"CMP-000010","to":"EQP-C01.01","basis":"source","source_ids":["SRC-000052","SRC-000053","SRC-000054","SRC-000145","SRC-000220","SRC-000221","SRC-000222","SRC-000179"],"confidence":"HIGH"},{"id":"REL-003626","type":"offers_equipment","from":"CMP-000010","to":"EQP-C01.02","basis":"source","source_ids":["SRC-000052","SRC-000053","SRC-000054","SRC-000145","SRC-000220","SRC-000221","SRC-000222","SRC-000179"],"confidence":"HIGH"},{"id":"REL-003627","type":"offers_equipment","from":"CMP-000010","to":"EQP-C01.03","basis":"source","source_ids":["SRC-000052","SRC-000053","SRC-000054","SRC-000145","SRC-000220","SRC-000221","SRC-000222","SRC-000179"],"confidence":"HIGH"},{"id":"REL-003628","type":"offers_equipment","from":"CMP-000010","to":"EQP-F01","basis":"source","source_ids":["SRC-000052","SRC-000053","SRC-000054","SRC-000145","SRC-000220","SRC-000221","SRC-000222","SRC-000179"],"confidence":"HIGH"},{"id":"REL-003629","type":"offers_equipment","from":"CMP-000010","to":"EQP-C04","basis":"source","source_ids":["SRC-000052","SRC-000053","SRC-000054","SRC-000145","SRC-000220","SRC-000221","SRC-000222","SRC-000179"],"confidence":"HIGH"},{"id":"REL-003630","type":"offers_equipment","from":"CMP-000010","to":"EQP-C03","basis":"source","source_ids":["SRC-000052","SRC-000053","SRC-000054","SRC-000145","SRC-000220","SRC-000221","SRC-000222","SRC-000179"],"confidence":"HIGH"},{"id":"REL-003631","type":"offers_equipment","from":"CMP-000010","to":"EQP-C06","basis":"source","source_ids":["SRC-000052","SRC-000053","SRC-000054","SRC-000145","SRC-000220","SRC-000221","SRC-000222","SRC-000179"],"confidence":"HIGH"},{"id":"REL-003632","type":"located_in","from":"CMP-000010","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003633","type":"offers_equipment","from":"CMP-000011","to":"EQP-C01.03","basis":"source","source_ids":["SRC-000053","SRC-000054","SRC-000055","SRC-000056","SRC-000165","SRC-000166","SRC-000194"],"confidence":"HIGH"},{"id":"REL-003634","type":"located_in","from":"CMP-000011","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003635","type":"offers_equipment","from":"CMP-000012","to":"EQP-C01.01","basis":"source","source_ids":["SRC-000097","SRC-000098","SRC-000099","SRC-000100","SRC-000101","SRC-000102","SRC-000103","SRC-000104","SRC-000105","SRC-000106"],"confidence":"HIGH"},{"id":"REL-003636","type":"offers_equipment","from":"CMP-000012","to":"EQP-C01.02","basis":"source","source_ids":["SRC-000097","SRC-000098","SRC-000099","SRC-000100","SRC-000101","SRC-000102","SRC-000103","SRC-000104","SRC-000105","SRC-000106"],"confidence":"HIGH"},{"id":"REL-003637","type":"offers_equipment","from":"CMP-000012","to":"EQP-C01.03","basis":"source","source_ids":["SRC-000097","SRC-000098","SRC-000099","SRC-000100","SRC-000101","SRC-000102","SRC-000103","SRC-000104","SRC-000105","SRC-000106"],"confidence":"HIGH"},{"id":"REL-003638","type":"offers_equipment","from":"CMP-000012","to":"EQP-C04","basis":"source","source_ids":["SRC-000097","SRC-000098","SRC-000099","SRC-000100","SRC-000101","SRC-000102","SRC-000103","SRC-000104","SRC-000105","SRC-000106"],"confidence":"HIGH"},{"id":"REL-003639","type":"offers_equipment","from":"CMP-000012","to":"EQP-C03","basis":"source","source_ids":["SRC-000097","SRC-000098","SRC-000099","SRC-000100","SRC-000101","SRC-000102","SRC-000103","SRC-000104","SRC-000105","SRC-000106"],"confidence":"HIGH"},{"id":"REL-003640","type":"offers_equipment","from":"CMP-000012","to":"EQP-C02","basis":"source","source_ids":["SRC-000097","SRC-000098","SRC-000099","SRC-000100","SRC-000101","SRC-000102","SRC-000103","SRC-000104","SRC-000105","SRC-000106"],"confidence":"HIGH"},{"id":"REL-003641","type":"offers_equipment","from":"CMP-000012","to":"EQP-K06","basis":"source","source_ids":["SRC-000097","SRC-000098","SRC-000099","SRC-000100","SRC-000101","SRC-000102","SRC-000103","SRC-000104","SRC-000105","SRC-000106"],"confidence":"HIGH"},{"id":"REL-003642","type":"located_in","from":"CMP-000012","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003643","type":"offers_equipment","from":"CMP-000013","to":"EQP-A01.07","basis":"source","source_ids":["SRC-000192","SRC-000193"],"confidence":"HIGH"},{"id":"REL-003644","type":"offers_equipment","from":"CMP-000013","to":"EQP-A01.05","basis":"source","source_ids":["SRC-000192","SRC-000193"],"confidence":"HIGH"},{"id":"REL-003645","type":"located_in","from":"CMP-000013","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003646","type":"offers_equipment","from":"CMP-000014","to":"EQP-A14","basis":"source","source_ids":["SRC-000087","SRC-000088","SRC-000089","SRC-000090","SRC-000121","SRC-000122","SRC-000123"],"confidence":"HIGH"},{"id":"REL-003647","type":"offers_equipment","from":"CMP-000014","to":"EQP-A13","basis":"source","source_ids":["SRC-000087","SRC-000088","SRC-000089","SRC-000090","SRC-000121","SRC-000122","SRC-000123"],"confidence":"HIGH"},{"id":"REL-003648","type":"offers_equipment","from":"CMP-000014","to":"EQP-G01","basis":"source","source_ids":["SRC-000087","SRC-000088","SRC-000089","SRC-000090","SRC-000121","SRC-000122","SRC-000123"],"confidence":"HIGH"},{"id":"REL-003649","type":"located_in","from":"CMP-000014","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003650","type":"offers_equipment","from":"CMP-000015","to":"EQP-A10","basis":"source","source_ids":["SRC-000121","SRC-000122"],"confidence":"HIGH"},{"id":"REL-003651","type":"located_in","from":"CMP-000015","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003652","type":"offers_equipment","from":"CMP-000016","to":"EQP-A25","basis":"source","source_ids":["SRC-000154","SRC-000155","SRC-000081","SRC-000130","SRC-000131","SRC-000196"],"confidence":"HIGH"},{"id":"REL-003653","type":"offers_equipment","from":"CMP-000016","to":"EQP-A21","basis":"source","source_ids":["SRC-000154","SRC-000155","SRC-000081","SRC-000130","SRC-000131","SRC-000196"],"confidence":"HIGH"},{"id":"REL-003654","type":"offers_equipment","from":"CMP-000016","to":"EQP-A01","basis":"source","source_ids":["SRC-000154","SRC-000155","SRC-000081","SRC-000130","SRC-000131","SRC-000196"],"confidence":"HIGH"},{"id":"REL-003655","type":"offers_equipment","from":"CMP-000016","to":"EQP-A28","basis":"source","source_ids":["SRC-000154","SRC-000155","SRC-000081","SRC-000130","SRC-000131","SRC-000196"],"confidence":"HIGH"},{"id":"REL-003656","type":"offers_equipment","from":"CMP-000016","to":"EQP-C36","basis":"source","source_ids":["SRC-000154","SRC-000155","SRC-000081","SRC-000130","SRC-000131","SRC-000196"],"confidence":"HIGH"},{"id":"REL-003657","type":"located_in","from":"CMP-000016","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003658","type":"offers_equipment","from":"CMP-000017","to":"EQP-A25","basis":"source","source_ids":["SRC-000156","SRC-000132"],"confidence":"HIGH"},{"id":"REL-003659","type":"offers_equipment","from":"CMP-000017","to":"EQP-A28","basis":"source","source_ids":["SRC-000156","SRC-000132"],"confidence":"HIGH"},{"id":"REL-003660","type":"located_in","from":"CMP-000017","to":"CTY-IL","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003661","type":"offers_equipment","from":"CMP-000018","to":"EQP-A21","basis":"source","source_ids":["SRC-000157","SRC-000179"],"confidence":"HIGH"},{"id":"REL-003662","type":"offers_equipment","from":"CMP-000018","to":"EQP-A23","basis":"source","source_ids":["SRC-000157","SRC-000179"],"confidence":"HIGH"},{"id":"REL-003663","type":"offers_equipment","from":"CMP-000018","to":"EQP-A30","basis":"source","source_ids":["SRC-000157","SRC-000179"],"confidence":"HIGH"},{"id":"REL-003664","type":"located_in","from":"CMP-000018","to":"CTY-IL","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003665","type":"offers_equipment","from":"CMP-000019","to":"EQP-A25","basis":"source","source_ids":["SRC-000130","SRC-000131"],"confidence":"LOW"},{"id":"REL-003666","type":"located_in","from":"CMP-000019","to":"CTY-HU","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003667","type":"offers_equipment","from":"CMP-000020","to":"EQP-A01.03","basis":"source","source_ids":["SRC-000317","SRC-000318"],"confidence":"HIGH"},{"id":"REL-003668","type":"offers_equipment","from":"CMP-000020","to":"EQP-A01.02","basis":"source","source_ids":["SRC-000317","SRC-000318"],"confidence":"HIGH"},{"id":"REL-003669","type":"located_in","from":"CMP-000020","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003670","type":"offers_equipment","from":"CMP-000021","to":"EQP-A26","basis":"source","source_ids":["SRC-000319"],"confidence":"HIGH"},{"id":"REL-003671","type":"offers_equipment","from":"CMP-000021","to":"EQP-A22","basis":"source","source_ids":["SRC-000319"],"confidence":"HIGH"},{"id":"REL-003672","type":"offers_equipment","from":"CMP-000021","to":"EQP-A24","basis":"source","source_ids":["SRC-000319"],"confidence":"HIGH"},{"id":"REL-003673","type":"located_in","from":"CMP-000021","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003674","type":"offers_equipment","from":"CMP-000022","to":"EQP-A09","basis":"source","source_ids":["SRC-000320","SRC-000339"],"confidence":"HIGH"},{"id":"REL-003675","type":"offers_equipment","from":"CMP-000022","to":"EQP-A09.06","basis":"source","source_ids":["SRC-000320","SRC-000339"],"confidence":"HIGH"},{"id":"REL-003676","type":"offers_equipment","from":"CMP-000022","to":"EQP-A13","basis":"source","source_ids":["SRC-000320","SRC-000339"],"confidence":"HIGH"},{"id":"REL-003677","type":"located_in","from":"CMP-000022","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003678","type":"offers_equipment","from":"CMP-000023","to":"EQP-A42","basis":"source","source_ids":["SRC-000321"],"confidence":"HIGH"},{"id":"REL-003679","type":"offers_equipment","from":"CMP-000023","to":"EQP-A45","basis":"source","source_ids":["SRC-000321"],"confidence":"HIGH"},{"id":"REL-003680","type":"offers_equipment","from":"CMP-000023","to":"EQP-A19","basis":"source","source_ids":["SRC-000321"],"confidence":"HIGH"},{"id":"REL-003681","type":"located_in","from":"CMP-000023","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003682","type":"offers_equipment","from":"CMP-000024","to":"EQP-B02","basis":"source","source_ids":["SRC-000322"],"confidence":"HIGH"},{"id":"REL-003683","type":"offers_equipment","from":"CMP-000024","to":"EQP-B03","basis":"source","source_ids":["SRC-000322"],"confidence":"HIGH"},{"id":"REL-003684","type":"located_in","from":"CMP-000024","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003685","type":"offers_equipment","from":"CMP-000025","to":"EQP-B07","basis":"source","source_ids":["SRC-000323"],"confidence":"HIGH"},{"id":"REL-003686","type":"located_in","from":"CMP-000025","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003687","type":"offers_equipment","from":"CMP-000026","to":"EQP-B08","basis":"source","source_ids":["SRC-000324","SRC-000325"],"confidence":"HIGH"},{"id":"REL-003688","type":"offers_equipment","from":"CMP-000026","to":"EQP-C10","basis":"source","source_ids":["SRC-000324","SRC-000325"],"confidence":"HIGH"},{"id":"REL-003689","type":"offers_equipment","from":"CMP-000026","to":"EQP-C11","basis":"source","source_ids":["SRC-000324","SRC-000325"],"confidence":"HIGH"},{"id":"REL-003690","type":"offers_equipment","from":"CMP-000026","to":"EQP-B09","basis":"source","source_ids":["SRC-000324","SRC-000325"],"confidence":"HIGH"},{"id":"REL-003691","type":"located_in","from":"CMP-000026","to":"CTY-SE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003692","type":"offers_equipment","from":"CMP-000027","to":"EQP-A01.01","basis":"source","source_ids":["SRC-000327"],"confidence":"HIGH"},{"id":"REL-003693","type":"offers_equipment","from":"CMP-000027","to":"EQP-B09","basis":"source","source_ids":["SRC-000327"],"confidence":"HIGH"},{"id":"REL-003694","type":"located_in","from":"CMP-000027","to":"CTY-DE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003695","type":"offers_equipment","from":"CMP-000028","to":"EQP-A09.01","basis":"source","source_ids":["SRC-000328"],"confidence":"HIGH"},{"id":"REL-003696","type":"offers_equipment","from":"CMP-000028","to":"EQP-G01","basis":"source","source_ids":["SRC-000328"],"confidence":"HIGH"},{"id":"REL-003697","type":"offers_equipment","from":"CMP-000028","to":"EQP-G02","basis":"source","source_ids":["SRC-000328"],"confidence":"HIGH"},{"id":"REL-003698","type":"offers_equipment","from":"CMP-000028","to":"EQP-G03","basis":"source","source_ids":["SRC-000328"],"confidence":"HIGH"},{"id":"REL-003699","type":"located_in","from":"CMP-000028","to":"CTY-DE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003700","type":"offers_equipment","from":"CMP-000029","to":"EQP-A08","basis":"source","source_ids":["SRC-000330"],"confidence":"HIGH"},{"id":"REL-003701","type":"offers_equipment","from":"CMP-000029","to":"EQP-A09","basis":"source","source_ids":["SRC-000330"],"confidence":"HIGH"},{"id":"REL-003702","type":"located_in","from":"CMP-000029","to":"CTY-GB","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003703","type":"offers_equipment","from":"CMP-000030","to":"EQP-A09.06","basis":"source","source_ids":["SRC-000333"],"confidence":"LOW"},{"id":"REL-003704","type":"located_in","from":"CMP-000030","to":"CTY-FI","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003705","type":"offers_equipment","from":"CMP-000031","to":"EQP-A25","basis":"source","source_ids":["SRC-000334"],"confidence":"HIGH"},{"id":"REL-003706","type":"located_in","from":"CMP-000031","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003707","type":"offers_equipment","from":"CMP-000032","to":"EQP-A01.02","basis":"source","source_ids":["SRC-000326"],"confidence":"HIGH"},{"id":"REL-003708","type":"offers_equipment","from":"CMP-000032","to":"EQP-C28","basis":"source","source_ids":["SRC-000326"],"confidence":"HIGH"},{"id":"REL-003709","type":"located_in","from":"CMP-000032","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003710","type":"offers_equipment","from":"CMP-000033","to":"EQP-A33","basis":"source","source_ids":["SRC-000329"],"confidence":"HIGH"},{"id":"REL-003711","type":"located_in","from":"CMP-000033","to":"CTY-IT","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003712","type":"offers_equipment","from":"CMP-000034","to":"EQP-A33","basis":"source","source_ids":["SRC-000310"],"confidence":"HIGH"},{"id":"REL-003713","type":"located_in","from":"CMP-000034","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003714","type":"offers_equipment","from":"CMP-000035","to":"EQP-A33","basis":"source","source_ids":["SRC-000311"],"confidence":"HIGH"},{"id":"REL-003715","type":"located_in","from":"CMP-000035","to":"CTY-TW","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003716","type":"offers_equipment","from":"CMP-000036","to":"EQP-A33","basis":"source","source_ids":["SRC-000312"],"confidence":"HIGH"},{"id":"REL-003717","type":"offers_equipment","from":"CMP-000036","to":"EQP-C39","basis":"source","source_ids":["SRC-000312"],"confidence":"HIGH"},{"id":"REL-003718","type":"located_in","from":"CMP-000036","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003719","type":"offers_equipment","from":"CMP-000037","to":"EQP-C40","basis":"source","source_ids":["SRC-000309"],"confidence":"HIGH"},{"id":"REL-003720","type":"located_in","from":"CMP-000037","to":"CTY-TW","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003721","type":"offers_equipment","from":"CMP-000038","to":"EQP-C39","basis":"source","source_ids":["SRC-000302","SRC-000304"],"confidence":"HIGH"},{"id":"REL-003722","type":"offers_equipment","from":"CMP-000038","to":"EQP-A33","basis":"source","source_ids":["SRC-000302","SRC-000304"],"confidence":"HIGH"},{"id":"REL-003723","type":"located_in","from":"CMP-000038","to":"CTY-KR","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003724","type":"offers_equipment","from":"CMP-000039","to":"EQP-C39","basis":"source","source_ids":["SRC-000303"],"confidence":"LOW"},{"id":"REL-003725","type":"located_in","from":"CMP-000039","to":"CTY-KR","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003726","type":"offers_equipment","from":"CMP-000040","to":"EQP-C38","basis":"source","source_ids":["SRC-000241","SRC-000242"],"confidence":"HIGH"},{"id":"REL-003727","type":"located_in","from":"CMP-000040","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003728","type":"offers_equipment","from":"CMP-000041","to":"EQP-C36","basis":"source","source_ids":["SRC-000331"],"confidence":"HIGH"},{"id":"REL-003729","type":"offers_equipment","from":"CMP-000041","to":"EQP-A23","basis":"source","source_ids":["SRC-000331"],"confidence":"HIGH"},{"id":"REL-003730","type":"offers_equipment","from":"CMP-000041","to":"EQP-C34","basis":"source","source_ids":["SRC-000331"],"confidence":"HIGH"},{"id":"REL-003731","type":"located_in","from":"CMP-000041","to":"CTY-MY","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003732","type":"located_in","from":"CMP-000042","to":"CTY-MY","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003733","type":"offers_equipment","from":"CMP-000043","to":"EQP-C10","basis":"source","source_ids":["SRC-000046","SRC-000047","SRC-000148","SRC-000051"],"confidence":"HIGH"},{"id":"REL-003734","type":"offers_equipment","from":"CMP-000043","to":"EQP-C16","basis":"source","source_ids":["SRC-000046","SRC-000047","SRC-000148","SRC-000051"],"confidence":"HIGH"},{"id":"REL-003735","type":"offers_equipment","from":"CMP-000043","to":"EQP-C17","basis":"source","source_ids":["SRC-000046","SRC-000047","SRC-000148","SRC-000051"],"confidence":"HIGH"},{"id":"REL-003736","type":"offers_equipment","from":"CMP-000043","to":"EQP-D21","basis":"source","source_ids":["SRC-000046","SRC-000047","SRC-000148","SRC-000051"],"confidence":"HIGH"},{"id":"REL-003737","type":"located_in","from":"CMP-000043","to":"CTY-NL","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003738","type":"offers_equipment","from":"CMP-000044","to":"EQP-C10","basis":"source","source_ids":["SRC-000149","SRC-000050","SRC-000201","SRC-000060"],"confidence":"HIGH"},{"id":"REL-003739","type":"offers_equipment","from":"CMP-000044","to":"EQP-C16","basis":"source","source_ids":["SRC-000149","SRC-000050","SRC-000201","SRC-000060"],"confidence":"HIGH"},{"id":"REL-003740","type":"offers_equipment","from":"CMP-000044","to":"EQP-C17","basis":"source","source_ids":["SRC-000149","SRC-000050","SRC-000201","SRC-000060"],"confidence":"HIGH"},{"id":"REL-003741","type":"offers_equipment","from":"CMP-000044","to":"EQP-I08","basis":"source","source_ids":["SRC-000149","SRC-000050","SRC-000201","SRC-000060"],"confidence":"HIGH"},{"id":"REL-003742","type":"located_in","from":"CMP-000044","to":"CTY-HK","basis":"analyst","note":"From a directory / list source","source_ids":[]},{"id":"REL-003743","type":"present_in","from":"CMP-000044","to":"CTY-IN","basis":"source","source_ids":["SRC-000201"],"confidence":"HIGH","detail":{"type":"Partnership (training MoU)","facility":"With Kaynes Semicon and Perceptives Solutions","location":null,"status":"SIGNED 2024-12-12"}},{"id":"REL-003744","type":"offers_equipment","from":"CMP-000045","to":"EQP-C01.02","basis":"source","source_ids":["SRC-000057","SRC-000058","SRC-000059","SRC-000060","SRC-000061","SRC-000062","SRC-000063","SRC-000064"],"confidence":"HIGH"},{"id":"REL-003745","type":"offers_equipment","from":"CMP-000045","to":"EQP-C30","basis":"source","source_ids":["SRC-000057","SRC-000058","SRC-000059","SRC-000060","SRC-000061","SRC-000062","SRC-000063","SRC-000064"],"confidence":"HIGH"},{"id":"REL-003746","type":"located_in","from":"CMP-000045","to":"CTY-NL","basis":"source","note":"Source-stated","source_ids":["SRC-000057","SRC-000058","SRC-000059","SRC-000060","SRC-000061","SRC-000062","SRC-000063","SRC-000064"]},{"id":"REL-003747","type":"offers_equipment","from":"CMP-000046","to":"EQP-C12","basis":"source","source_ids":["SRC-000150"],"confidence":"HIGH"},{"id":"REL-003748","type":"offers_equipment","from":"CMP-000046","to":"EQP-C10","basis":"source","source_ids":["SRC-000150"],"confidence":"HIGH"},{"id":"REL-003749","type":"offers_equipment","from":"CMP-000046","to":"EQP-C16","basis":"source","source_ids":["SRC-000150"],"confidence":"HIGH"},{"id":"REL-003750","type":"offers_equipment","from":"CMP-000046","to":"EQP-I01","basis":"source","source_ids":["SRC-000150"],"confidence":"HIGH"},{"id":"REL-003751","type":"located_in","from":"CMP-000046","to":"CTY-US","basis":"analyst","note":"From a directory / list source","source_ids":[]},{"id":"REL-003752","type":"offers_equipment","from":"CMP-000047","to":"EQP-C16","basis":"source","source_ids":["SRC-000040","SRC-000041","SRC-000042","SRC-000044","SRC-000045","SRC-000173"],"confidence":"MEDIUM"},{"id":"REL-003753","type":"located_in","from":"CMP-000047","to":"CTY-KR","basis":"source","note":"Source-stated","source_ids":["SRC-000040","SRC-000041","SRC-000042","SRC-000044","SRC-000045","SRC-000173"]},{"id":"REL-003754","type":"offers_equipment","from":"CMP-000048","to":"EQP-C16","basis":"source","source_ids":["SRC-000043","SRC-000040"],"confidence":"MEDIUM"},{"id":"REL-003755","type":"offers_equipment","from":"CMP-000048","to":"EQP-C17","basis":"source","source_ids":["SRC-000043","SRC-000040"],"confidence":"MEDIUM"},{"id":"REL-003756","type":"located_in","from":"CMP-000048","to":"CTY-KR","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003757","type":"offers_equipment","from":"CMP-000049","to":"EQP-C20","basis":"source","source_ids":["SRC-000237","SRC-000238"],"confidence":"HIGH"},{"id":"REL-003758","type":"offers_equipment","from":"CMP-000049","to":"EQP-C32","basis":"source","source_ids":["SRC-000237","SRC-000238"],"confidence":"HIGH"},{"id":"REL-003759","type":"located_in","from":"CMP-000049","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003760","type":"offers_equipment","from":"CMP-000050","to":"EQP-C10","basis":"source","source_ids":["SRC-000239","SRC-000240"],"confidence":"HIGH"},{"id":"REL-003761","type":"offers_equipment","from":"CMP-000050","to":"EQP-C11","basis":"source","source_ids":["SRC-000239","SRC-000240"],"confidence":"HIGH"},{"id":"REL-003762","type":"offers_equipment","from":"CMP-000050","to":"EQP-C12","basis":"source","source_ids":["SRC-000239","SRC-000240"],"confidence":"HIGH"},{"id":"REL-003763","type":"offers_equipment","from":"CMP-000050","to":"EQP-C20","basis":"source","source_ids":["SRC-000239","SRC-000240"],"confidence":"HIGH"},{"id":"REL-003764","type":"located_in","from":"CMP-000050","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003765","type":"offers_equipment","from":"CMP-000051","to":"EQP-C18","basis":"source","source_ids":["SRC-000232","SRC-000243"],"confidence":"HIGH"},{"id":"REL-003766","type":"offers_equipment","from":"CMP-000051","to":"EQP-C17","basis":"source","source_ids":["SRC-000232","SRC-000243"],"confidence":"HIGH"},{"id":"REL-003767","type":"offers_equipment","from":"CMP-000051","to":"EQP-A01.07","basis":"source","source_ids":["SRC-000232","SRC-000243"],"confidence":"HIGH"},{"id":"REL-003768","type":"offers_equipment","from":"CMP-000051","to":"EQP-D21","basis":"source","source_ids":["SRC-000232","SRC-000243"],"confidence":"HIGH"},{"id":"REL-003769","type":"offers_equipment","from":"CMP-000051","to":"EQP-D22","basis":"source","source_ids":["SRC-000232","SRC-000243"],"confidence":"HIGH"},{"id":"REL-003770","type":"located_in","from":"CMP-000051","to":"CTY-AT","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003771","type":"offers_equipment","from":"CMP-000052","to":"EQP-C18","basis":"source","source_ids":["SRC-000233"],"confidence":"LOW"},{"id":"REL-003772","type":"offers_equipment","from":"CMP-000052","to":"EQP-D12","basis":"source","source_ids":["SRC-000233"],"confidence":"LOW"},{"id":"REL-003773","type":"located_in","from":"CMP-000052","to":"CTY-DE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003774","type":"offers_equipment","from":"CMP-000053","to":"EQP-C01.01","basis":"source","source_ids":["SRC-000236"],"confidence":"HIGH"},{"id":"REL-003775","type":"located_in","from":"CMP-000053","to":"CTY-IL","basis":"source","note":"Source-stated","source_ids":["SRC-000236"]},{"id":"REL-003776","type":"offers_equipment","from":"CMP-000054","to":"EQP-C01.04","basis":"source","source_ids":["SRC-000231"],"confidence":"HIGH"},{"id":"REL-003777","type":"offers_equipment","from":"CMP-000054","to":"EQP-A08","basis":"source","source_ids":["SRC-000231"],"confidence":"HIGH"},{"id":"REL-003778","type":"located_in","from":"CMP-000054","to":"CTY-US","basis":"source","note":"Source-stated","source_ids":["SRC-000231"]},{"id":"REL-003779","type":"offers_equipment","from":"CMP-000055","to":"EQP-C01.04","basis":"source","source_ids":["SRC-000234"],"confidence":"HIGH"},{"id":"REL-003780","type":"located_in","from":"CMP-000055","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003781","type":"offers_equipment","from":"CMP-000056","to":"EQP-C19","basis":"source","source_ids":["SRC-000244"],"confidence":"LOW"},{"id":"REL-003782","type":"located_in","from":"CMP-000056","to":"CTY-DE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003783","type":"offers_equipment","from":"CMP-000057","to":"EQP-C19","basis":"source","source_ids":["SRC-000228"],"confidence":"LOW"},{"id":"REL-003784","type":"located_in","from":"CMP-000057","to":"CTY-KR","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003785","type":"offers_equipment","from":"CMP-000058","to":"EQP-C19","basis":"source","source_ids":["SRC-000228"],"confidence":"LOW"},{"id":"REL-003786","type":"located_in","from":"CMP-000058","to":"CTY-KR","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003787","type":"offers_equipment","from":"CMP-000059","to":"EQP-J07","basis":"source","source_ids":["SRC-000179"],"confidence":"LOW"},{"id":"REL-003788","type":"offers_equipment","from":"CMP-000059","to":"EQP-C03","basis":"source","source_ids":["SRC-000179"],"confidence":"LOW"},{"id":"REL-003789","type":"located_in","from":"CMP-000059","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003790","type":"offers_equipment","from":"CMP-000060","to":"EQP-J07","basis":"source","source_ids":["SRC-000179"],"confidence":"LOW"},{"id":"REL-003791","type":"located_in","from":"CMP-000060","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003792","type":"offers_equipment","from":"CMP-000061","to":"EQP-J07","basis":"source","source_ids":["SRC-000179"],"confidence":"LOW"},{"id":"REL-003793","type":"located_in","from":"CMP-000061","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003794","type":"offers_equipment","from":"CMP-000062","to":"EQP-A38","basis":"source","source_ids":["SRC-000214"],"confidence":"LOW"},{"id":"REL-003795","type":"offers_equipment","from":"CMP-000062","to":"EQP-A37","basis":"source","source_ids":["SRC-000214"],"confidence":"LOW"},{"id":"REL-003796","type":"offers_equipment","from":"CMP-000062","to":"EQP-A40","basis":"source","source_ids":["SRC-000214"],"confidence":"LOW"},{"id":"REL-003797","type":"located_in","from":"CMP-000062","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003798","type":"present_in","from":"CMP-000062","to":"CTY-IN","basis":"source","source_ids":["SRC-000214"],"confidence":"LOW","detail":{"type":"Distributor","facility":"ATS India (exclusive distribution partner)","location":null,"status":"SIGNED 2026-09"}},{"id":"REL-003799","type":"offers_equipment","from":"CMP-000063","to":"EQP-A37","basis":"source","source_ids":["SRC-000294","SRC-000295"],"confidence":"HIGH"},{"id":"REL-003800","type":"offers_equipment","from":"CMP-000063","to":"EQP-A38","basis":"source","source_ids":["SRC-000294","SRC-000295"],"confidence":"HIGH"},{"id":"REL-003801","type":"offers_equipment","from":"CMP-000063","to":"EQP-A39","basis":"source","source_ids":["SRC-000294","SRC-000295"],"confidence":"HIGH"},{"id":"REL-003802","type":"located_in","from":"CMP-000063","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003803","type":"offers_equipment","from":"CMP-000064","to":"EQP-A38","basis":"source","source_ids":["SRC-000296","SRC-000297"],"confidence":"HIGH"},{"id":"REL-003804","type":"offers_equipment","from":"CMP-000064","to":"EQP-A39","basis":"source","source_ids":["SRC-000296","SRC-000297"],"confidence":"HIGH"},{"id":"REL-003805","type":"located_in","from":"CMP-000064","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003806","type":"offers_equipment","from":"CMP-000065","to":"EQP-J01","basis":"source","source_ids":["SRC-000298","SRC-000299"],"confidence":"HIGH"},{"id":"REL-003807","type":"located_in","from":"CMP-000065","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003808","type":"present_in","from":"CMP-000065","to":"CTY-IN","basis":"source","source_ids":["SRC-000299"],"confidence":"LOW","detail":{"type":"Trade-show presence","facility":"SEMICON India 2025 exhibitor","location":"India","status":"EXHIBITED"}},{"id":"REL-003809","type":"offers_equipment","from":"CMP-000066","to":"EQP-J02","basis":"source","source_ids":["SRC-000300","SRC-000301"],"confidence":"HIGH"},{"id":"REL-003810","type":"offers_equipment","from":"CMP-000066","to":"EQP-J03","basis":"source","source_ids":["SRC-000300","SRC-000301"],"confidence":"HIGH"},{"id":"REL-003811","type":"offers_equipment","from":"CMP-000066","to":"EQP-J07","basis":"source","source_ids":["SRC-000300","SRC-000301"],"confidence":"HIGH"},{"id":"REL-003812","type":"located_in","from":"CMP-000066","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003813","type":"present_in","from":"CMP-000066","to":"CTY-IN","basis":"source","source_ids":["SRC-000301"],"confidence":"LOW","detail":{"type":"Sales entity","facility":"Murata Machinery India Pvt Ltd","location":"Coimbatore","status":"LISTED (Tier 3)"}},{"id":"REL-003814","type":"offers_equipment","from":"CMP-000067","to":"EQP-A","basis":"source","source_ids":["SRC-000173","SRC-000043","SRC-000040"],"confidence":"MEDIUM"},{"id":"REL-003815","type":"offers_equipment","from":"CMP-000067","to":"EQP-C16","basis":"source","source_ids":["SRC-000173","SRC-000043","SRC-000040"],"confidence":"MEDIUM"},{"id":"REL-003816","type":"located_in","from":"CMP-000067","to":"CTY-KR","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003817","type":"located_in","from":"CMP-000068","to":"CTY-KR","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003818","type":"offers_equipment","from":"CMP-000069","to":"EQP-A09.06","basis":"source","source_ids":["SRC-000173","SRC-000174"],"confidence":"MEDIUM"},{"id":"REL-003819","type":"offers_equipment","from":"CMP-000069","to":"EQP-A09.01","basis":"source","source_ids":["SRC-000173","SRC-000174"],"confidence":"MEDIUM"},{"id":"REL-003820","type":"located_in","from":"CMP-000069","to":"CTY-KR","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003821","type":"offers_equipment","from":"CMP-000070","to":"EQP-A09.06","basis":"source","source_ids":["SRC-000175","SRC-000176"],"confidence":"MEDIUM"},{"id":"REL-003822","type":"located_in","from":"CMP-000070","to":"CTY-KR","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003823","type":"offers_equipment","from":"CMP-000071","to":"EQP-A07","basis":"source","source_ids":["SRC-000173","SRC-000176"],"confidence":"LOW"},{"id":"REL-003824","type":"located_in","from":"CMP-000071","to":"CTY-KR","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003825","type":"located_in","from":"CMP-000072","to":"CTY-KR","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003826","type":"located_in","from":"CMP-000073","to":"CTY-KR","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003827","type":"located_in","from":"CMP-000074","to":"CTY-KR","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003828","type":"located_in","from":"CMP-000075","to":"CTY-KR","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003829","type":"located_in","from":"CMP-000076","to":"CTY-KR","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003830","type":"offers_equipment","from":"CMP-000077","to":"EQP-C26","basis":"source","source_ids":["SRC-000065","SRC-000066","SRC-000067","SRC-000068","SRC-000069","SRC-000158"],"confidence":"HIGH"},{"id":"REL-003831","type":"offers_equipment","from":"CMP-000077","to":"EQP-C01.02","basis":"source","source_ids":["SRC-000065","SRC-000066","SRC-000067","SRC-000068","SRC-000069","SRC-000158"],"confidence":"HIGH"},{"id":"REL-003832","type":"offers_equipment","from":"CMP-000077","to":"EQP-C28","basis":"source","source_ids":["SRC-000065","SRC-000066","SRC-000067","SRC-000068","SRC-000069","SRC-000158"],"confidence":"HIGH"},{"id":"REL-003833","type":"offers_equipment","from":"CMP-000077","to":"EQP-A14","basis":"source","source_ids":["SRC-000065","SRC-000066","SRC-000067","SRC-000068","SRC-000069","SRC-000158"],"confidence":"HIGH"},{"id":"REL-003834","type":"offers_equipment","from":"CMP-000077","to":"EQP-C11","basis":"source","source_ids":["SRC-000065","SRC-000066","SRC-000067","SRC-000068","SRC-000069","SRC-000158"],"confidence":"HIGH"},{"id":"REL-003835","type":"offers_equipment","from":"CMP-000077","to":"EQP-I06","basis":"source","source_ids":["SRC-000065","SRC-000066","SRC-000067","SRC-000068","SRC-000069","SRC-000158"],"confidence":"HIGH"},{"id":"REL-003836","type":"offers_equipment","from":"CMP-000077","to":"EQP-C18","basis":"source","source_ids":["SRC-000065","SRC-000066","SRC-000067","SRC-000068","SRC-000069","SRC-000158"],"confidence":"HIGH"},{"id":"REL-003837","type":"located_in","from":"CMP-000077","to":"CTY-KR","basis":"source","note":"Source-stated","source_ids":["SRC-000065","SRC-000066","SRC-000067","SRC-000068","SRC-000069","SRC-000158"]},{"id":"REL-003838","type":"offers_equipment","from":"CMP-000078","to":"EQP-D14","basis":"source","source_ids":["SRC-000115","SRC-000116","SRC-000117","SRC-000118","SRC-000119","SRC-000120"],"confidence":"MEDIUM"},{"id":"REL-003839","type":"offers_equipment","from":"CMP-000078","to":"EQP-C28","basis":"source","source_ids":["SRC-000115","SRC-000116","SRC-000117","SRC-000118","SRC-000119","SRC-000120"],"confidence":"MEDIUM"},{"id":"REL-003840","type":"offers_equipment","from":"CMP-000078","to":"EQP-C32","basis":"source","source_ids":["SRC-000115","SRC-000116","SRC-000117","SRC-000118","SRC-000119","SRC-000120"],"confidence":"MEDIUM"},{"id":"REL-003841","type":"offers_equipment","from":"CMP-000078","to":"EQP-A23","basis":"source","source_ids":["SRC-000115","SRC-000116","SRC-000117","SRC-000118","SRC-000119","SRC-000120"],"confidence":"MEDIUM"},{"id":"REL-003842","type":"located_in","from":"CMP-000078","to":"CTY-KR","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003843","type":"offers_equipment","from":"CMP-000079","to":"EQP-I07","basis":"source","source_ids":["SRC-000226","SRC-000227","SRC-000248","SRC-000249","SRC-000250"],"confidence":"HIGH"},{"id":"REL-003844","type":"offers_equipment","from":"CMP-000079","to":"EQP-I06","basis":"source","source_ids":["SRC-000226","SRC-000227","SRC-000248","SRC-000249","SRC-000250"],"confidence":"HIGH"},{"id":"REL-003845","type":"located_in","from":"CMP-000079","to":"CTY-KR","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003846","type":"offers_equipment","from":"CMP-000080","to":"EQP-A05","basis":"source","source_ids":["SRC-000177","SRC-000179","SRC-000180","SRC-000181"],"confidence":"MEDIUM"},{"id":"REL-003847","type":"located_in","from":"CMP-000080","to":"CTY-TW","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003848","type":"offers_equipment","from":"CMP-000081","to":"EQP-A05","basis":"source","source_ids":["SRC-000177","SRC-000179","SRC-000180"],"confidence":"MEDIUM"},{"id":"REL-003849","type":"located_in","from":"CMP-000081","to":"CTY-TW","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003850","type":"offers_equipment","from":"CMP-000082","to":"EQP-C25","basis":"source","source_ids":["SRC-000177","SRC-000180","SRC-000182"],"confidence":"MEDIUM"},{"id":"REL-003851","type":"located_in","from":"CMP-000082","to":"CTY-TW","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003852","type":"offers_equipment","from":"CMP-000083","to":"EQP-A23","basis":"source","source_ids":["SRC-000177","SRC-000179"],"confidence":"MEDIUM"},{"id":"REL-003853","type":"located_in","from":"CMP-000083","to":"CTY-TW","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003854","type":"located_in","from":"CMP-000084","to":"CTY-TW","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003855","type":"offers_equipment","from":"CMP-000085","to":"EQP-J07","basis":"source","source_ids":["SRC-000179","SRC-000182"],"confidence":"MEDIUM"},{"id":"REL-003856","type":"located_in","from":"CMP-000085","to":"CTY-TW","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003857","type":"offers_equipment","from":"CMP-000086","to":"EQP-J07","basis":"source","source_ids":["SRC-000179"],"confidence":"LOW"},{"id":"REL-003858","type":"located_in","from":"CMP-000086","to":"CTY-TW","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003859","type":"offers_equipment","from":"CMP-000087","to":"EQP-A23","basis":"source","source_ids":["SRC-000179"],"confidence":"LOW"},{"id":"REL-003860","type":"located_in","from":"CMP-000087","to":"CTY-TW","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003861","type":"offers_equipment","from":"CMP-000088","to":"EQP-A23","basis":"source","source_ids":["SRC-000179"],"confidence":"LOW"},{"id":"REL-003862","type":"located_in","from":"CMP-000088","to":"CTY-TW","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003863","type":"offers_equipment","from":"CMP-000089","to":"EQP-A43","basis":"source","source_ids":["SRC-000178"],"confidence":"LOW"},{"id":"REL-003864","type":"offers_equipment","from":"CMP-000089","to":"EQP-A44","basis":"source","source_ids":["SRC-000178"],"confidence":"LOW"},{"id":"REL-003865","type":"located_in","from":"CMP-000089","to":"CTY-TW","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003866","type":"located_in","from":"CMP-000090","to":"CTY-TW","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003867","type":"located_in","from":"CMP-000091","to":"CTY-TW","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003868","type":"located_in","from":"CMP-000092","to":"CTY-TW","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003869","type":"located_in","from":"CMP-000093","to":"CTY-TW","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003870","type":"offers_equipment","from":"CMP-000101","to":"EQP-A08","basis":"source","source_ids":["SRC-000009","SRC-000010","SRC-000011","SRC-000012","SRC-000013","SRC-000016","SRC-000126","SRC-000127"],"confidence":"MEDIUM"},{"id":"REL-003871","type":"offers_equipment","from":"CMP-000101","to":"EQP-A09","basis":"source","source_ids":["SRC-000009","SRC-000010","SRC-000011","SRC-000012","SRC-000013","SRC-000016","SRC-000126","SRC-000127"],"confidence":"MEDIUM"},{"id":"REL-003872","type":"offers_equipment","from":"CMP-000101","to":"EQP-A08.02","basis":"source","source_ids":["SRC-000009","SRC-000010","SRC-000011","SRC-000012","SRC-000013","SRC-000016","SRC-000126","SRC-000127"],"confidence":"MEDIUM"},{"id":"REL-003873","type":"located_in","from":"CMP-000101","to":"CTY-CN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003874","type":"offers_equipment","from":"CMP-000102","to":"EQP-A08","basis":"source","source_ids":["SRC-000009","SRC-000011","SRC-000016"],"confidence":"MEDIUM"},{"id":"REL-003875","type":"offers_equipment","from":"CMP-000102","to":"EQP-A09.01","basis":"source","source_ids":["SRC-000009","SRC-000011","SRC-000016"],"confidence":"MEDIUM"},{"id":"REL-003876","type":"located_in","from":"CMP-000102","to":"CTY-CN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003877","type":"offers_equipment","from":"CMP-000103","to":"EQP-A09.02","basis":"source","source_ids":["SRC-000009","SRC-000314"],"confidence":"MEDIUM"},{"id":"REL-003878","type":"offers_equipment","from":"CMP-000103","to":"EQP-A09.06","basis":"source","source_ids":["SRC-000009","SRC-000314"],"confidence":"MEDIUM"},{"id":"REL-003879","type":"offers_equipment","from":"CMP-000103","to":"EQP-C17","basis":"source","source_ids":["SRC-000009","SRC-000314"],"confidence":"MEDIUM"},{"id":"REL-003880","type":"located_in","from":"CMP-000103","to":"CTY-CN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003881","type":"offers_equipment","from":"CMP-000104","to":"EQP-A04","basis":"source","source_ids":["SRC-000009","SRC-000015","SRC-000313"],"confidence":"HIGH"},{"id":"REL-003882","type":"offers_equipment","from":"CMP-000104","to":"EQP-A18","basis":"source","source_ids":["SRC-000009","SRC-000015","SRC-000313"],"confidence":"HIGH"},{"id":"REL-003883","type":"offers_equipment","from":"CMP-000104","to":"EQP-A11","basis":"source","source_ids":["SRC-000009","SRC-000015","SRC-000313"],"confidence":"HIGH"},{"id":"REL-003884","type":"offers_equipment","from":"CMP-000104","to":"EQP-A03","basis":"source","source_ids":["SRC-000009","SRC-000015","SRC-000313"],"confidence":"HIGH"},{"id":"REL-003885","type":"offers_equipment","from":"CMP-000104","to":"EQP-A09.02","basis":"source","source_ids":["SRC-000009","SRC-000015","SRC-000313"],"confidence":"HIGH"},{"id":"REL-003886","type":"offers_equipment","from":"CMP-000104","to":"EQP-A20","basis":"source","source_ids":["SRC-000009","SRC-000015","SRC-000313"],"confidence":"HIGH"},{"id":"REL-003887","type":"located_in","from":"CMP-000104","to":"CTY-US","basis":"analyst","note":"From a directory / list source","source_ids":[]},{"id":"REL-003888","type":"offers_equipment","from":"CMP-000105","to":"EQP-A19","basis":"source","source_ids":["SRC-000009","SRC-000014","SRC-000015","SRC-000315","SRC-000316","SRC-000017"],"confidence":"MEDIUM"},{"id":"REL-003889","type":"offers_equipment","from":"CMP-000105","to":"EQP-C04","basis":"source","source_ids":["SRC-000009","SRC-000014","SRC-000015","SRC-000315","SRC-000316","SRC-000017"],"confidence":"MEDIUM"},{"id":"REL-003890","type":"located_in","from":"CMP-000105","to":"CTY-CN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003891","type":"offers_equipment","from":"CMP-000106","to":"EQP-A02","basis":"source","source_ids":["SRC-000009","SRC-000126","SRC-000127"],"confidence":"MEDIUM"},{"id":"REL-003892","type":"offers_equipment","from":"CMP-000106","to":"EQP-C18","basis":"source","source_ids":["SRC-000009","SRC-000126","SRC-000127"],"confidence":"MEDIUM"},{"id":"REL-003893","type":"located_in","from":"CMP-000106","to":"CTY-CN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003894","type":"offers_equipment","from":"CMP-000107","to":"EQP-A01.03","basis":"source","source_ids":["SRC-000011","SRC-000187","SRC-000188","SRC-000189"],"confidence":"MEDIUM"},{"id":"REL-003895","type":"offers_equipment","from":"CMP-000107","to":"EQP-A01.04","basis":"source","source_ids":["SRC-000011","SRC-000187","SRC-000188","SRC-000189"],"confidence":"MEDIUM"},{"id":"REL-003896","type":"located_in","from":"CMP-000107","to":"CTY-CN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003897","type":"offers_equipment","from":"CMP-000108","to":"EQP-A01","basis":"source","source_ids":["SRC-000183","SRC-000188"],"confidence":"MEDIUM"},{"id":"REL-003898","type":"located_in","from":"CMP-000108","to":"CTY-CN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003899","type":"offers_equipment","from":"CMP-000109","to":"EQP-A","basis":"source","source_ids":["SRC-000184","SRC-000185","SRC-000187"],"confidence":"MEDIUM"},{"id":"REL-003900","type":"located_in","from":"CMP-000109","to":"CTY-CN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003901","type":"offers_equipment","from":"CMP-000110","to":"EQP-A01.03","basis":"source","source_ids":["SRC-000183"],"confidence":"LOW"},{"id":"REL-003902","type":"located_in","from":"CMP-000110","to":"CTY-CN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003903","type":"offers_equipment","from":"CMP-000111","to":"EQP-A01","basis":"source","source_ids":["SRC-000187"],"confidence":"LOW"},{"id":"REL-003904","type":"located_in","from":"CMP-000111","to":"CTY-CN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003905","type":"located_in","from":"CMP-000112","to":"CTY-CN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003906","type":"located_in","from":"CMP-000113","to":"CTY-CN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003907","type":"located_in","from":"CMP-000114","to":"CTY-CN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003908","type":"located_in","from":"CMP-000115","to":"CTY-CN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003909","type":"offers_equipment","from":"CMP-000116","to":"EQP-C04","basis":"source","source_ids":["SRC-000009"],"confidence":"LOW"},{"id":"REL-003910","type":"located_in","from":"CMP-000116","to":"CTY-CN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003911","type":"offers_equipment","from":"CMP-000117","to":"EQP-C01.03","basis":"source","source_ids":["SRC-000108","SRC-000109"],"confidence":"HIGH"},{"id":"REL-003912","type":"offers_equipment","from":"CMP-000117","to":"EQP-F07","basis":"source","source_ids":["SRC-000108","SRC-000109"],"confidence":"HIGH"},{"id":"REL-003913","type":"located_in","from":"CMP-000117","to":"CTY-CN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003914","type":"offers_equipment","from":"CMP-000118","to":"EQP-C01.03","basis":"source","source_ids":["SRC-000107"],"confidence":"HIGH"},{"id":"REL-003915","type":"offers_equipment","from":"CMP-000118","to":"EQP-C01.02","basis":"source","source_ids":["SRC-000107"],"confidence":"HIGH"},{"id":"REL-003916","type":"located_in","from":"CMP-000118","to":"CTY-CN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003917","type":"offers_equipment","from":"CMP-000119","to":"EQP-C01.02","basis":"source","source_ids":["SRC-000217","SRC-000245","SRC-000111"],"confidence":"HIGH"},{"id":"REL-003918","type":"offers_equipment","from":"CMP-000119","to":"EQP-C01.03","basis":"source","source_ids":["SRC-000217","SRC-000245","SRC-000111"],"confidence":"HIGH"},{"id":"REL-003919","type":"offers_equipment","from":"CMP-000119","to":"EQP-C28","basis":"source","source_ids":["SRC-000217","SRC-000245","SRC-000111"],"confidence":"HIGH"},{"id":"REL-003920","type":"offers_equipment","from":"CMP-000119","to":"EQP-D14","basis":"source","source_ids":["SRC-000217","SRC-000245","SRC-000111"],"confidence":"HIGH"},{"id":"REL-003921","type":"offers_equipment","from":"CMP-000119","to":"EQP-A14","basis":"source","source_ids":["SRC-000217","SRC-000245","SRC-000111"],"confidence":"HIGH"},{"id":"REL-003922","type":"offers_equipment","from":"CMP-000119","to":"EQP-C26","basis":"source","source_ids":["SRC-000217","SRC-000245","SRC-000111"],"confidence":"HIGH"},{"id":"REL-003923","type":"offers_equipment","from":"CMP-000119","to":"EQP-C18","basis":"source","source_ids":["SRC-000217","SRC-000245","SRC-000111"],"confidence":"HIGH"},{"id":"REL-003924","type":"offers_equipment","from":"CMP-000119","to":"EQP-F01","basis":"source","source_ids":["SRC-000217","SRC-000245","SRC-000111"],"confidence":"HIGH"},{"id":"REL-003925","type":"located_in","from":"CMP-000119","to":"CTY-CN","basis":"analyst","note":"Inferred from the company name","source_ids":[]},{"id":"REL-003926","type":"offers_equipment","from":"CMP-000120","to":"EQP-D14","basis":"source","source_ids":["SRC-000218","SRC-000246","SRC-000111"],"confidence":"LOW"},{"id":"REL-003927","type":"offers_equipment","from":"CMP-000120","to":"EQP-C28","basis":"source","source_ids":["SRC-000218","SRC-000246","SRC-000111"],"confidence":"LOW"},{"id":"REL-003928","type":"located_in","from":"CMP-000120","to":"CTY-CN","basis":"analyst","note":"Inferred from the company name","source_ids":[]},{"id":"REL-003929","type":"offers_equipment","from":"CMP-000121","to":"EQP-C01.02","basis":"source","source_ids":["SRC-000219","SRC-000246"],"confidence":"LOW"},{"id":"REL-003930","type":"located_in","from":"CMP-000121","to":"CTY-CN","basis":"analyst","note":"Inferred from the company name","source_ids":[]},{"id":"REL-003931","type":"located_in","from":"CMP-000122","to":"CTY-CN","basis":"analyst","note":"Inferred from the company name","source_ids":[]},{"id":"REL-003932","type":"located_in","from":"CMP-000123","to":"CTY-CN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003933","type":"located_in","from":"CMP-000124","to":"CTY-CN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003934","type":"located_in","from":"CMP-000125","to":"CTY-CN","basis":"analyst","note":"Inferred from the company name","source_ids":[]},{"id":"REL-003935","type":"located_in","from":"CMP-000126","to":"CTY-CN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003936","type":"located_in","from":"CMP-000127","to":"CTY-CN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003937","type":"located_in","from":"CMP-000128","to":"CTY-CN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003938","type":"located_in","from":"CMP-000129","to":"CTY-CN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003939","type":"located_in","from":"CMP-000130","to":"CTY-CN","basis":"analyst","note":"Inferred from the company name","source_ids":[]},{"id":"REL-003940","type":"located_in","from":"CMP-000132","to":"CTY-CN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003941","type":"located_in","from":"CMP-000133","to":"CTY-CN","basis":"analyst","note":"Inferred from the company name","source_ids":[]},{"id":"REL-003942","type":"located_in","from":"CMP-000134","to":"CTY-CN","basis":"analyst","note":"Inferred from the company name","source_ids":[]},{"id":"REL-003943","type":"located_in","from":"CMP-000135","to":"CTY-CN","basis":"analyst","note":"Inferred from the company name","source_ids":[]},{"id":"REL-003944","type":"located_in","from":"CMP-000136","to":"CTY-CN","basis":"analyst","note":"Inferred from the company name","source_ids":[]},{"id":"REL-003945","type":"located_in","from":"CMP-000137","to":"CTY-CN","basis":"analyst","note":"Inferred from the company name","source_ids":[]},{"id":"REL-003946","type":"located_in","from":"CMP-000138","to":"CTY-CN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003947","type":"offers_equipment","from":"CMP-000141","to":"EQP-C01.02","basis":"source","source_ids":["SRC-000070","SRC-000071","SRC-000072","SRC-000073","SRC-000074","SRC-000075"],"confidence":"HIGH"},{"id":"REL-003948","type":"offers_equipment","from":"CMP-000141","to":"EQP-A14","basis":"source","source_ids":["SRC-000070","SRC-000071","SRC-000072","SRC-000073","SRC-000074","SRC-000075"],"confidence":"HIGH"},{"id":"REL-003949","type":"offers_equipment","from":"CMP-000141","to":"EQP-F07","basis":"source","source_ids":["SRC-000070","SRC-000071","SRC-000072","SRC-000073","SRC-000074","SRC-000075"],"confidence":"HIGH"},{"id":"REL-003950","type":"offers_equipment","from":"CMP-000141","to":"EQP-I08","basis":"source","source_ids":["SRC-000070","SRC-000071","SRC-000072","SRC-000073","SRC-000074","SRC-000075"],"confidence":"HIGH"},{"id":"REL-003951","type":"located_in","from":"CMP-000141","to":"CTY-DE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003952","type":"offers_equipment","from":"CMP-000142","to":"EQP-C01.02","basis":"source","source_ids":["SRC-000076","SRC-000077","SRC-000078","SRC-000079","SRC-000080"],"confidence":"HIGH"},{"id":"REL-003953","type":"offers_equipment","from":"CMP-000142","to":"EQP-C29","basis":"source","source_ids":["SRC-000076","SRC-000077","SRC-000078","SRC-000079","SRC-000080"],"confidence":"HIGH"},{"id":"REL-003954","type":"offers_equipment","from":"CMP-000142","to":"EQP-F07","basis":"source","source_ids":["SRC-000076","SRC-000077","SRC-000078","SRC-000079","SRC-000080"],"confidence":"HIGH"},{"id":"REL-003955","type":"located_in","from":"CMP-000142","to":"CTY-CH","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003956","type":"offers_equipment","from":"CMP-000143","to":"EQP-D14","basis":"source","source_ids":["SRC-000081","SRC-000082","SRC-000083","SRC-000084","SRC-000085","SRC-000086"],"confidence":"HIGH"},{"id":"REL-003957","type":"offers_equipment","from":"CMP-000143","to":"EQP-D18","basis":"source","source_ids":["SRC-000081","SRC-000082","SRC-000083","SRC-000084","SRC-000085","SRC-000086"],"confidence":"HIGH"},{"id":"REL-003958","type":"offers_equipment","from":"CMP-000143","to":"EQP-C28","basis":"source","source_ids":["SRC-000081","SRC-000082","SRC-000083","SRC-000084","SRC-000085","SRC-000086"],"confidence":"HIGH"},{"id":"REL-003959","type":"offers_equipment","from":"CMP-000143","to":"EQP-C31","basis":"source","source_ids":["SRC-000081","SRC-000082","SRC-000083","SRC-000084","SRC-000085","SRC-000086"],"confidence":"HIGH"},{"id":"REL-003960","type":"located_in","from":"CMP-000143","to":"CTY-DE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003961","type":"offers_equipment","from":"CMP-000144","to":"EQP-C26","basis":"source","source_ids":["SRC-000229","SRC-000246"],"confidence":"HIGH"},{"id":"REL-003962","type":"offers_equipment","from":"CMP-000144","to":"EQP-A34","basis":"source","source_ids":["SRC-000229","SRC-000246"],"confidence":"HIGH"},{"id":"REL-003963","type":"located_in","from":"CMP-000144","to":"CTY-DE","basis":"source","note":"Source-stated","source_ids":["SRC-000229","SRC-000246"]},{"id":"REL-003964","type":"offers_equipment","from":"CMP-000145","to":"EQP-I06","basis":"source","source_ids":["SRC-000093","SRC-000094","SRC-000095","SRC-000096","SRC-000159","SRC-000160","SRC-000161","SRC-000162","SRC-000163","SRC-000226"],"confidence":"HIGH"},{"id":"REL-003965","type":"offers_equipment","from":"CMP-000145","to":"EQP-I07","basis":"source","source_ids":["SRC-000093","SRC-000094","SRC-000095","SRC-000096","SRC-000159","SRC-000160","SRC-000161","SRC-000162","SRC-000163","SRC-000226"],"confidence":"HIGH"},{"id":"REL-003966","type":"offers_equipment","from":"CMP-000145","to":"EQP-I08","basis":"source","source_ids":["SRC-000093","SRC-000094","SRC-000095","SRC-000096","SRC-000159","SRC-000160","SRC-000161","SRC-000162","SRC-000163","SRC-000226"],"confidence":"HIGH"},{"id":"REL-003967","type":"located_in","from":"CMP-000145","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003968","type":"located_in","from":"CMP-000146","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003969","type":"located_in","from":"CMP-000147","to":"CTY-DE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003970","type":"offers_equipment","from":"CMP-000148","to":"EQP-C28","basis":"source","source_ids":["SRC-000230","SRC-000247","SRC-000262","SRC-000263"],"confidence":"HIGH"},{"id":"REL-003971","type":"located_in","from":"CMP-000148","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003972","type":"located_in","from":"CMP-000149","to":"CTY-LT","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003973","type":"located_in","from":"CMP-000150","to":"CTY-FR","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003974","type":"located_in","from":"CMP-000151","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003975","type":"located_in","from":"CMP-000152","to":"CTY-DE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003976","type":"located_in","from":"CMP-000153","to":"CTY-DE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003977","type":"located_in","from":"CMP-000154","to":"CTY-DE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003978","type":"located_in","from":"CMP-000155","to":"CTY-SG","basis":"source","note":"Source-stated","source_ids":["SRC-000283"]},{"id":"REL-003979","type":"located_in","from":"CMP-000156","to":"CTY-IL","basis":"analyst","note":"Inferred from the company name","source_ids":[]},{"id":"REL-003980","type":"located_in","from":"CMP-000157","to":"CTY-GB","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003981","type":"located_in","from":"CMP-000158","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003982","type":"located_in","from":"CMP-000159","to":"CTY-DE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003983","type":"located_in","from":"CMP-000160","to":"CTY-IL","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003984","type":"located_in","from":"CMP-000161","to":"CTY-CH","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003985","type":"located_in","from":"CMP-000162","to":"CTY-GB","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003986","type":"located_in","from":"CMP-000163","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003987","type":"located_in","from":"CMP-000164","to":"CTY-DE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003988","type":"offers_equipment","from":"CMP-000165","to":"EQP-C26","basis":"source","source_ids":["SRC-INT1"],"confidence":"LOW"},{"id":"REL-003989","type":"located_in","from":"CMP-000165","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003990","type":"located_in","from":"CMP-000166","to":"CTY-DE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003991","type":"offers_equipment","from":"CMP-000168","to":"EQP-A42","basis":"source","source_ids":["SRC-000286","SRC-000287"],"confidence":"HIGH"},{"id":"REL-003992","type":"offers_equipment","from":"CMP-000168","to":"EQP-A45","basis":"source","source_ids":["SRC-000286","SRC-000287"],"confidence":"HIGH"},{"id":"REL-003993","type":"located_in","from":"CMP-000168","to":"CTY-GB","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003994","type":"offers_equipment","from":"CMP-000169","to":"EQP-A42","basis":"source","source_ids":["SRC-000288","SRC-000289"],"confidence":"HIGH"},{"id":"REL-003995","type":"located_in","from":"CMP-000169","to":"CTY-DE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003996","type":"located_in","from":"CMP-000170","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003997","type":"located_in","from":"CMP-000171","to":"CTY-CH","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-003998","type":"offers_equipment","from":"CMP-000172","to":"EQP-A43","basis":"source","source_ids":["SRC-000335"],"confidence":"HIGH"},{"id":"REL-003999","type":"offers_equipment","from":"CMP-000172","to":"EQP-A44","basis":"source","source_ids":["SRC-000335"],"confidence":"HIGH"},{"id":"REL-004000","type":"located_in","from":"CMP-000172","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004001","type":"offers_equipment","from":"CMP-000173","to":"EQP-A43","basis":"source","source_ids":["SRC-000336"],"confidence":"HIGH"},{"id":"REL-004002","type":"offers_equipment","from":"CMP-000173","to":"EQP-A44","basis":"source","source_ids":["SRC-000336"],"confidence":"HIGH"},{"id":"REL-004003","type":"located_in","from":"CMP-000173","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004004","type":"offers_equipment","from":"CMP-000174","to":"EQP-A14","basis":"source","source_ids":["SRC-000223","SRC-000092"],"confidence":"HIGH"},{"id":"REL-004005","type":"offers_equipment","from":"CMP-000174","to":"EQP-F05","basis":"source","source_ids":["SRC-000223","SRC-000092"],"confidence":"HIGH"},{"id":"REL-004006","type":"located_in","from":"CMP-000174","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004007","type":"offers_equipment","from":"CMP-000175","to":"EQP-A14","basis":"source","source_ids":["SRC-000224"],"confidence":"HIGH"},{"id":"REL-004008","type":"offers_equipment","from":"CMP-000175","to":"EQP-I07","basis":"source","source_ids":["SRC-000224"],"confidence":"HIGH"},{"id":"REL-004009","type":"offers_equipment","from":"CMP-000175","to":"EQP-I06","basis":"source","source_ids":["SRC-000224"],"confidence":"HIGH"},{"id":"REL-004010","type":"offers_equipment","from":"CMP-000175","to":"EQP-F05","basis":"source","source_ids":["SRC-000224"],"confidence":"HIGH"},{"id":"REL-004011","type":"located_in","from":"CMP-000175","to":"CTY-JP","basis":"source","note":"Source-stated","source_ids":["SRC-000224"]},{"id":"REL-004012","type":"offers_equipment","from":"CMP-000176","to":"EQP-I07","basis":"source","source_ids":["SRC-000225"],"confidence":"HIGH"},{"id":"REL-004013","type":"located_in","from":"CMP-000176","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004014","type":"offers_equipment","from":"CMP-000177","to":"EQP-A14","basis":"source","source_ids":["SRC-000091","SRC-000092"],"confidence":"LOW"},{"id":"REL-004015","type":"offers_equipment","from":"CMP-000177","to":"EQP-F05","basis":"source","source_ids":["SRC-000091","SRC-000092"],"confidence":"LOW"},{"id":"REL-004016","type":"located_in","from":"CMP-000177","to":"CTY-FR","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004017","type":"located_in","from":"CMP-000178","to":"CTY-DK","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004018","type":"offers_equipment","from":"CMP-000180","to":"EQP-A25","basis":"source","source_ids":["SRC-000167","SRC-000168"],"confidence":"LOW"},{"id":"REL-004019","type":"offers_equipment","from":"CMP-000180","to":"EQP-A30","basis":"source","source_ids":["SRC-000167","SRC-000168"],"confidence":"LOW"},{"id":"REL-004020","type":"located_in","from":"CMP-000180","to":"CTY-NL","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004021","type":"offers_equipment","from":"CMP-000181","to":"EQP-A01","basis":"source","source_ids":["SRC-000169","SRC-000170"],"confidence":"MEDIUM"},{"id":"REL-004022","type":"located_in","from":"CMP-000181","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004023","type":"offers_equipment","from":"CMP-000182","to":"EQP-A01.01","basis":"source","source_ids":["SRC-000171","SRC-000172"],"confidence":"MEDIUM"},{"id":"REL-004024","type":"located_in","from":"CMP-000182","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004025","type":"offers_equipment","from":"CMP-000184","to":"EQP-A09.10","basis":"source","source_ids":["SRC-000211","SRC-000207"],"confidence":"LOW"},{"id":"REL-004026","type":"offers_equipment","from":"CMP-000184","to":"EQP-K01","basis":"source","source_ids":["SRC-000211","SRC-000207"],"confidence":"LOW"},{"id":"REL-004027","type":"located_in","from":"CMP-000184","to":"CTY-IN","basis":"source","note":"Source-stated","source_ids":["SRC-000211","SRC-000207"]},{"id":"REL-004028","type":"present_in","from":"CMP-000184","to":"CTY-IN","basis":"source","source_ids":["SRC-000211"],"confidence":"LOW","detail":{"type":"HQ / Development","facility":"Raana Semiconductors","location":null,"status":"COMMERCIALIZING (orders INR 12 crore FY26)"}},{"id":"REL-004029","type":"offers_equipment","from":"CMP-000191","to":"EQP-C26","basis":"source","source_ids":["SRC-000200","SRC-INT1"],"confidence":"HIGH"},{"id":"REL-004030","type":"offers_equipment","from":"CMP-000191","to":"EQP-C31","basis":"source","source_ids":["SRC-000200","SRC-INT1"],"confidence":"HIGH"},{"id":"REL-004031","type":"offers_equipment","from":"CMP-000191","to":"EQP-J08","basis":"source","source_ids":["SRC-000200","SRC-INT1"],"confidence":"HIGH"},{"id":"REL-004032","type":"located_in","from":"CMP-000191","to":"CTY-IN","basis":"source","note":"Source-stated","source_ids":["SRC-000200","SRC-INT1"]},{"id":"REL-004033","type":"present_in","from":"CMP-000191","to":"CTY-IN","basis":"source","source_ids":["SRC-000200","SRC-INT1"],"confidence":"HIGH","detail":{"type":"HQ / Manufacturing","facility":"TEAL Hosur","location":"Hosur, Tamil Nadu","status":"OPERATING"}},{"id":"REL-004034","type":"located_in","from":"CMP-000192","to":"CTY-IN","basis":"source","note":"Source-stated","source_ids":["SRC-000213","SRC-000037","SRC-000207"]},{"id":"REL-004035","type":"present_in","from":"CMP-000192","to":"CTY-IN","basis":"source","source_ids":["SRC-000213"],"confidence":"LOW","detail":{"type":"HQ / Engineering","facility":"ASM Technologies","location":"Bengaluru","status":"OPERATING"}},{"id":"REL-004036","type":"offers_equipment","from":"CMP-000193","to":"EQP-A42","basis":"source","source_ids":["SRC-000038","SRC-000037","SRC-000207"],"confidence":"HIGH"},{"id":"REL-004037","type":"located_in","from":"CMP-000193","to":"CTY-IN","basis":"source","note":"Source-stated","source_ids":["SRC-000038","SRC-000037","SRC-000207"]},{"id":"REL-004038","type":"present_in","from":"CMP-000193","to":"CTY-IN","basis":"source","source_ids":["SRC-000038"],"confidence":"LOW","detail":{"type":"HQ / Manufacturing","facility":"HHV - three plants","location":"Bengaluru","status":"OPERATING"}},{"id":"REL-004039","type":"offers_equipment","from":"CMP-000194","to":"EQP-A09.10","basis":"source","source_ids":["SRC-000037","SRC-000207"],"confidence":"HIGH"},{"id":"REL-004040","type":"offers_equipment","from":"CMP-000194","to":"EQP-A34","basis":"source","source_ids":["SRC-000037","SRC-000207"],"confidence":"HIGH"},{"id":"REL-004041","type":"offers_equipment","from":"CMP-000194","to":"EQP-K01","basis":"source","source_ids":["SRC-000037","SRC-000207"],"confidence":"HIGH"},{"id":"REL-004042","type":"located_in","from":"CMP-000194","to":"CTY-IN","basis":"source","note":"Source-stated","source_ids":["SRC-000037","SRC-000207"]},{"id":"REL-004043","type":"present_in","from":"CMP-000194","to":"CTY-IN","basis":"source","source_ids":["SRC-000037","SRC-000207"],"confidence":"HIGH","detail":{"type":"Manufacturing (JV)","facility":"ASM Technologies-HHV JV","location":null,"status":"FORMED 2022"}},{"id":"REL-004044","type":"offers_equipment","from":"CMP-000195","to":"EQP-C01.02","basis":"source","source_ids":["SRC-000208"],"confidence":"HIGH"},{"id":"REL-004045","type":"located_in","from":"CMP-000195","to":"CTY-IN","basis":"source","note":"Source-stated","source_ids":["SRC-000208"]},{"id":"REL-004046","type":"present_in","from":"CMP-000195","to":"CTY-IN","basis":"source","source_ids":["SRC-000208"],"confidence":"HIGH","detail":{"type":"HQ / Manufacturing","facility":"SLTL","location":"Gandhinagar, Gujarat","status":"OPERATING"}},{"id":"REL-004047","type":"offers_equipment","from":"CMP-000196","to":"EQP-A43","basis":"source","source_ids":["SRC-000212"],"confidence":"LOW"},{"id":"REL-004048","type":"located_in","from":"CMP-000196","to":"CTY-IN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004049","type":"present_in","from":"CMP-000196","to":"CTY-IN","basis":"source","source_ids":["SRC-000212"],"confidence":"LOW","detail":{"type":"Service / Manufacturing","facility":"INOX India","location":null,"status":"FIRST ORDER 2026-09"}},{"id":"REL-004050","type":"located_in","from":"CMP-000197","to":"CTY-IN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004051","type":"present_in","from":"CMP-000197","to":"CTY-IN","basis":"source","source_ids":["SRC-000216"],"confidence":"HIGH","detail":{"type":"Services","facility":"Tessolve","location":null,"status":"OPERATING (title-level)"}},{"id":"REL-004052","type":"located_in","from":"CMP-000198","to":"CTY-IN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004053","type":"present_in","from":"CMP-000198","to":"CTY-IN","basis":"source","source_ids":["SRC-000214"],"confidence":"LOW","detail":{"type":"HQ India","facility":null,"location":null,"status":"PARTIALLY_VERIFIED"}},{"id":"REL-004054","type":"located_in","from":"CMP-000199","to":"CTY-IN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004055","type":"present_in","from":"CMP-000199","to":"CTY-IN","basis":"source","source_ids":["SRC-000205"],"confidence":"UNVERIFIED","detail":{"type":"Manufacturing (gases)","facility":"Sanand specialty gas facility","location":"Sanand, Gujarat","status":"REPORTED (Tier 4)"}},{"id":"REL-004056","type":"located_in","from":"CMP-000200","to":"CTY-IN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004057","type":"present_in","from":"CMP-000200","to":"CTY-IN","basis":"source","source_ids":["SRC-000039"],"confidence":"UNVERIFIED","detail":{"type":"HQ India","facility":null,"location":null,"status":"UNVERIFIED"}},{"id":"REL-004058","type":"located_in","from":"CMP-000201","to":"CTY-IN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004059","type":"present_in","from":"CMP-000201","to":"CTY-IN","basis":"source","source_ids":["SRC-000207"],"confidence":"UNVERIFIED","detail":{"type":"Lab","facility":"HCLTech ATE lab","location":null,"status":"REPORTED (Tier 4)"}},{"id":"REL-004060","type":"offers_equipment","from":"CMP-000361","to":"EQP-L09","basis":"source","source_ids":["SRC-000910","SRC-000911"],"confidence":"MEDIUM"},{"id":"REL-004061","type":"located_in","from":"CMP-000361","to":"CTY-SE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004062","type":"offers_equipment","from":"CMP-000362","to":"EQP-L02","basis":"source","source_ids":["SRC-000912","SRC-000913"],"confidence":"MEDIUM"},{"id":"REL-004063","type":"offers_equipment","from":"CMP-000362","to":"EQP-A45","basis":"source","source_ids":["SRC-000912","SRC-000913"],"confidence":"MEDIUM"},{"id":"REL-004064","type":"located_in","from":"CMP-000362","to":"CTY-DE","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004065","type":"offers_equipment","from":"CMP-000363","to":"EQP-A38","basis":"source","source_ids":["SRC-000914","SRC-000915"],"confidence":"MEDIUM"},{"id":"REL-004066","type":"offers_equipment","from":"CMP-000363","to":"EQP-A39","basis":"source","source_ids":["SRC-000914","SRC-000915"],"confidence":"MEDIUM"},{"id":"REL-004067","type":"offers_equipment","from":"CMP-000363","to":"EQP-A37","basis":"source","source_ids":["SRC-000914","SRC-000915"],"confidence":"MEDIUM"},{"id":"REL-004068","type":"offers_equipment","from":"CMP-000363","to":"EQP-A34","basis":"source","source_ids":["SRC-000914","SRC-000915"],"confidence":"MEDIUM"},{"id":"REL-004069","type":"located_in","from":"CMP-000363","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004070","type":"offers_equipment","from":"CMP-000364","to":"EQP-J10","basis":"source","source_ids":["SRC-000916","SRC-000917"],"confidence":"MEDIUM"},{"id":"REL-004071","type":"located_in","from":"CMP-000364","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004072","type":"offers_equipment","from":"CMP-000365","to":"EQP-J15","basis":"source","source_ids":["SRC-000918","SRC-000919"],"confidence":"MEDIUM"},{"id":"REL-004073","type":"located_in","from":"CMP-000365","to":"CTY-CH","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004074","type":"offers_equipment","from":"CMP-000366","to":"EQP-J01","basis":"source","source_ids":["SRC-000920"],"confidence":"LOW"},{"id":"REL-004075","type":"offers_equipment","from":"CMP-000366","to":"EQP-J02","basis":"source","source_ids":["SRC-000920"],"confidence":"LOW"},{"id":"REL-004076","type":"located_in","from":"CMP-000366","to":"CTY-KR","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004077","type":"offers_equipment","from":"CMP-000367","to":"EQP-I04","basis":"source","source_ids":["SRC-000921"],"confidence":"LOW"},{"id":"REL-004078","type":"offers_equipment","from":"CMP-000367","to":"EQP-I05","basis":"source","source_ids":["SRC-000921"],"confidence":"LOW"},{"id":"REL-004079","type":"located_in","from":"CMP-000367","to":"CTY-JP","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004080","type":"offers_equipment","from":"CMP-000368","to":"EQP-I05","basis":"source","source_ids":["SRC-000922"],"confidence":"LOW"},{"id":"REL-004081","type":"offers_equipment","from":"CMP-000368","to":"EQP-I01","basis":"source","source_ids":["SRC-000922"],"confidence":"LOW"},{"id":"REL-004082","type":"located_in","from":"CMP-000368","to":"CTY-KR","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004083","type":"offers_equipment","from":"CMP-000369","to":"EQP-J04","basis":"source","source_ids":["SRC-000923","SRC-000924"],"confidence":"MEDIUM"},{"id":"REL-004084","type":"located_in","from":"CMP-000369","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004085","type":"offers_equipment","from":"CMP-000370","to":"EQP-L05","basis":"source","source_ids":["SRC-000925"],"confidence":"MEDIUM"},{"id":"REL-004086","type":"offers_equipment","from":"CMP-000370","to":"EQP-A44","basis":"source","source_ids":["SRC-000925"],"confidence":"MEDIUM"},{"id":"REL-004087","type":"located_in","from":"CMP-000370","to":"CTY-DE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004088","type":"offers_equipment","from":"CMP-000202","to":"EQP-K01","basis":"source","source_ids":["SRC-000350"],"confidence":"MEDIUM"},{"id":"REL-004089","type":"located_in","from":"CMP-000202","to":"CTY-DE","basis":"source","note":"Source-stated","source_ids":["SRC-000350"]},{"id":"REL-004090","type":"offers_equipment","from":"CMP-000203","to":"EQP-K07","basis":"source","source_ids":["SRC-000351"],"confidence":"MEDIUM"},{"id":"REL-004091","type":"offers_equipment","from":"CMP-000203","to":"EQP-A19","basis":"source","source_ids":["SRC-000351"],"confidence":"MEDIUM"},{"id":"REL-004092","type":"offers_equipment","from":"CMP-000203","to":"EQP-C03","basis":"source","source_ids":["SRC-000351"],"confidence":"MEDIUM"},{"id":"REL-004093","type":"located_in","from":"CMP-000203","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004094","type":"offers_equipment","from":"CMP-000204","to":"EQP-L08","basis":"source","source_ids":["SRC-000352"],"confidence":"MEDIUM"},{"id":"REL-004095","type":"located_in","from":"CMP-000204","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004096","type":"offers_equipment","from":"CMP-000205","to":"EQP-L08","basis":"source","source_ids":["SRC-000353"],"confidence":"MEDIUM"},{"id":"REL-004097","type":"located_in","from":"CMP-000205","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004098","type":"offers_equipment","from":"CMP-000206","to":"EQP-C35","basis":"source","source_ids":["SRC-000354"],"confidence":"MEDIUM"},{"id":"REL-004099","type":"located_in","from":"CMP-000206","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004100","type":"offers_equipment","from":"CMP-000207","to":"EQP-K05","basis":"source","source_ids":["SRC-000477"],"confidence":"MEDIUM"},{"id":"REL-004101","type":"offers_equipment","from":"CMP-000207","to":"EQP-K07","basis":"source","source_ids":["SRC-000477"],"confidence":"MEDIUM"},{"id":"REL-004102","type":"offers_equipment","from":"CMP-000207","to":"EQP-K06","basis":"source","source_ids":["SRC-000477"],"confidence":"MEDIUM"},{"id":"REL-004103","type":"located_in","from":"CMP-000207","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004104","type":"offers_equipment","from":"CMP-000208","to":"EQP-A01","basis":"source","source_ids":["SRC-000492","SRC-000493","SRC-000494"],"confidence":"MEDIUM"},{"id":"REL-004105","type":"located_in","from":"CMP-000208","to":"CTY-NO","basis":"source","note":"Source-stated","source_ids":["SRC-000492","SRC-000493","SRC-000494"]},{"id":"REL-004106","type":"offers_equipment","from":"CMP-000209","to":"EQP-A01.06","basis":"source","source_ids":["SRC-000495","SRC-000496"],"confidence":"MEDIUM"},{"id":"REL-004107","type":"offers_equipment","from":"CMP-000209","to":"EQP-A01.08","basis":"source","source_ids":["SRC-000495","SRC-000496"],"confidence":"MEDIUM"},{"id":"REL-004108","type":"located_in","from":"CMP-000209","to":"CTY-US","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004109","type":"offers_equipment","from":"CMP-000210","to":"EQP-A01.06","basis":"source","source_ids":["SRC-000497"],"confidence":"MEDIUM"},{"id":"REL-004110","type":"located_in","from":"CMP-000210","to":"CTY-DE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004111","type":"offers_equipment","from":"CMP-000211","to":"EQP-A01.08","basis":"source","source_ids":["SRC-000498"],"confidence":"MEDIUM"},{"id":"REL-004112","type":"located_in","from":"CMP-000211","to":"CTY-DE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004113","type":"offers_equipment","from":"CMP-000212","to":"EQP-A01.07","basis":"source","source_ids":["SRC-000499"],"confidence":"MEDIUM"},{"id":"REL-004114","type":"located_in","from":"CMP-000212","to":"CTY-SE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004115","type":"offers_equipment","from":"CMP-000213","to":"EQP-A09.06","basis":"source","source_ids":["SRC-000500","SRC-000501"],"confidence":"MEDIUM"},{"id":"REL-004116","type":"located_in","from":"CMP-000213","to":"CTY-US","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004117","type":"offers_equipment","from":"CMP-000214","to":"EQP-A09.06","basis":"source","source_ids":["SRC-000502"],"confidence":"MEDIUM"},{"id":"REL-004118","type":"offers_equipment","from":"CMP-000214","to":"EQP-A09.07","basis":"source","source_ids":["SRC-000502"],"confidence":"MEDIUM"},{"id":"REL-004119","type":"offers_equipment","from":"CMP-000214","to":"EQP-A09","basis":"source","source_ids":["SRC-000502"],"confidence":"MEDIUM"},{"id":"REL-004120","type":"located_in","from":"CMP-000214","to":"CTY-CA","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004121","type":"offers_equipment","from":"CMP-000215","to":"EQP-K01","basis":"source","source_ids":["SRC-000503","SRC-000504"],"confidence":"MEDIUM"},{"id":"REL-004122","type":"located_in","from":"CMP-000215","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004123","type":"offers_equipment","from":"CMP-000216","to":"EQP-A07","basis":"source","source_ids":["SRC-000505"],"confidence":"MEDIUM"},{"id":"REL-004124","type":"located_in","from":"CMP-000216","to":"CTY-NL","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004125","type":"offers_equipment","from":"CMP-000217","to":"EQP-A11","basis":"source","source_ids":["SRC-000506"],"confidence":"MEDIUM"},{"id":"REL-004126","type":"offers_equipment","from":"CMP-000217","to":"EQP-A09.03","basis":"source","source_ids":["SRC-000506"],"confidence":"MEDIUM"},{"id":"REL-004127","type":"offers_equipment","from":"CMP-000217","to":"EQP-A09.02","basis":"source","source_ids":["SRC-000506"],"confidence":"MEDIUM"},{"id":"REL-004128","type":"located_in","from":"CMP-000217","to":"CTY-CZ","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004129","type":"offers_equipment","from":"CMP-000218","to":"EQP-A12","basis":"source","source_ids":["SRC-000507"],"confidence":"MEDIUM"},{"id":"REL-004130","type":"offers_equipment","from":"CMP-000218","to":"EQP-A09.01","basis":"source","source_ids":["SRC-000507"],"confidence":"MEDIUM"},{"id":"REL-004131","type":"offers_equipment","from":"CMP-000218","to":"EQP-A09.06","basis":"source","source_ids":["SRC-000507"],"confidence":"MEDIUM"},{"id":"REL-004132","type":"located_in","from":"CMP-000218","to":"CTY-FR","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004133","type":"offers_equipment","from":"CMP-000219","to":"EQP-A08.03","basis":"source","source_ids":["SRC-000508"],"confidence":"MEDIUM"},{"id":"REL-004134","type":"offers_equipment","from":"CMP-000219","to":"EQP-A08.04","basis":"source","source_ids":["SRC-000508"],"confidence":"MEDIUM"},{"id":"REL-004135","type":"offers_equipment","from":"CMP-000219","to":"EQP-A08.05","basis":"source","source_ids":["SRC-000508"],"confidence":"MEDIUM"},{"id":"REL-004136","type":"offers_equipment","from":"CMP-000219","to":"EQP-A09.02","basis":"source","source_ids":["SRC-000508"],"confidence":"MEDIUM"},{"id":"REL-004137","type":"offers_equipment","from":"CMP-000219","to":"EQP-A09.06","basis":"source","source_ids":["SRC-000508"],"confidence":"MEDIUM"},{"id":"REL-004138","type":"offers_equipment","from":"CMP-000219","to":"EQP-A07","basis":"source","source_ids":["SRC-000508"],"confidence":"MEDIUM"},{"id":"REL-004139","type":"offers_equipment","from":"CMP-000219","to":"EQP-G03","basis":"source","source_ids":["SRC-000508"],"confidence":"MEDIUM"},{"id":"REL-004140","type":"located_in","from":"CMP-000219","to":"CTY-JP","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004141","type":"offers_equipment","from":"CMP-000220","to":"EQP-A08.02","basis":"source","source_ids":["SRC-000509"],"confidence":"MEDIUM"},{"id":"REL-004142","type":"offers_equipment","from":"CMP-000220","to":"EQP-A09.02","basis":"source","source_ids":["SRC-000509"],"confidence":"MEDIUM"},{"id":"REL-004143","type":"offers_equipment","from":"CMP-000220","to":"EQP-A09.06","basis":"source","source_ids":["SRC-000509"],"confidence":"MEDIUM"},{"id":"REL-004144","type":"offers_equipment","from":"CMP-000220","to":"EQP-A28","basis":"source","source_ids":["SRC-000509"],"confidence":"MEDIUM"},{"id":"REL-004145","type":"located_in","from":"CMP-000220","to":"CTY-DE","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004146","type":"offers_equipment","from":"CMP-000221","to":"EQP-D20","basis":"source","source_ids":["SRC-000510"],"confidence":"MEDIUM"},{"id":"REL-004147","type":"offers_equipment","from":"CMP-000221","to":"EQP-D05","basis":"source","source_ids":["SRC-000510"],"confidence":"MEDIUM"},{"id":"REL-004148","type":"located_in","from":"CMP-000221","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004149","type":"offers_equipment","from":"CMP-000222","to":"EQP-C10","basis":"source","source_ids":["SRC-000511"],"confidence":"MEDIUM"},{"id":"REL-004150","type":"offers_equipment","from":"CMP-000222","to":"EQP-C12","basis":"source","source_ids":["SRC-000511"],"confidence":"MEDIUM"},{"id":"REL-004151","type":"offers_equipment","from":"CMP-000222","to":"EQP-C14","basis":"source","source_ids":["SRC-000511"],"confidence":"MEDIUM"},{"id":"REL-004152","type":"located_in","from":"CMP-000222","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004153","type":"offers_equipment","from":"CMP-000223","to":"EQP-C10","basis":"source","source_ids":["SRC-000512"],"confidence":"MEDIUM"},{"id":"REL-004154","type":"offers_equipment","from":"CMP-000223","to":"EQP-C11","basis":"source","source_ids":["SRC-000512"],"confidence":"MEDIUM"},{"id":"REL-004155","type":"offers_equipment","from":"CMP-000223","to":"EQP-C16","basis":"source","source_ids":["SRC-000512"],"confidence":"MEDIUM"},{"id":"REL-004156","type":"located_in","from":"CMP-000223","to":"CTY-DE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004157","type":"offers_equipment","from":"CMP-000224","to":"EQP-C11","basis":"source","source_ids":["SRC-000513"],"confidence":"MEDIUM"},{"id":"REL-004158","type":"offers_equipment","from":"CMP-000224","to":"EQP-C17","basis":"source","source_ids":["SRC-000513"],"confidence":"MEDIUM"},{"id":"REL-004159","type":"offers_equipment","from":"CMP-000224","to":"EQP-A01.07","basis":"source","source_ids":["SRC-000513"],"confidence":"MEDIUM"},{"id":"REL-004160","type":"located_in","from":"CMP-000224","to":"CTY-FR","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004161","type":"offers_equipment","from":"CMP-000225","to":"EQP-A15","basis":"source","source_ids":["SRC-000514","SRC-000515"],"confidence":"MEDIUM"},{"id":"REL-004162","type":"located_in","from":"CMP-000225","to":"CTY-GB","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004163","type":"offers_equipment","from":"CMP-000226","to":"EQP-A15","basis":"source","source_ids":["SRC-000516"],"confidence":"MEDIUM"},{"id":"REL-004164","type":"offers_equipment","from":"CMP-000226","to":"EQP-C29","basis":"source","source_ids":["SRC-000516"],"confidence":"MEDIUM"},{"id":"REL-004165","type":"located_in","from":"CMP-000226","to":"CTY-LT","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004166","type":"offers_equipment","from":"CMP-000227","to":"EQP-K04","basis":"source","source_ids":["SRC-000517","SRC-000518"],"confidence":"MEDIUM"},{"id":"REL-004167","type":"located_in","from":"CMP-000227","to":"CTY-US","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004168","type":"located_in","from":"CMP-000228","to":"CTY-CA","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004169","type":"offers_equipment","from":"CMP-000229","to":"EQP-C11","basis":"source","source_ids":["SRC-000520"],"confidence":"MEDIUM"},{"id":"REL-004170","type":"offers_equipment","from":"CMP-000229","to":"EQP-C17","basis":"source","source_ids":["SRC-000520"],"confidence":"MEDIUM"},{"id":"REL-004171","type":"offers_equipment","from":"CMP-000229","to":"EQP-D19","basis":"source","source_ids":["SRC-000520"],"confidence":"MEDIUM"},{"id":"REL-004172","type":"offers_equipment","from":"CMP-000229","to":"EQP-A04","basis":"source","source_ids":["SRC-000520"],"confidence":"MEDIUM"},{"id":"REL-004173","type":"offers_equipment","from":"CMP-000229","to":"EQP-A08.06","basis":"source","source_ids":["SRC-000520"],"confidence":"MEDIUM"},{"id":"REL-004174","type":"offers_equipment","from":"CMP-000229","to":"EQP-D06","basis":"source","source_ids":["SRC-000520"],"confidence":"MEDIUM"},{"id":"REL-004175","type":"located_in","from":"CMP-000229","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004176","type":"offers_equipment","from":"CMP-000230","to":"EQP-C06","basis":"source","source_ids":["SRC-000521"],"confidence":"MEDIUM"},{"id":"REL-004177","type":"offers_equipment","from":"CMP-000230","to":"EQP-C07","basis":"source","source_ids":["SRC-000521"],"confidence":"MEDIUM"},{"id":"REL-004178","type":"offers_equipment","from":"CMP-000230","to":"EQP-K03","basis":"source","source_ids":["SRC-000521"],"confidence":"MEDIUM"},{"id":"REL-004179","type":"located_in","from":"CMP-000230","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004180","type":"offers_equipment","from":"CMP-000231","to":"EQP-A01.05","basis":"source","source_ids":["SRC-000522"],"confidence":"MEDIUM"},{"id":"REL-004181","type":"offers_equipment","from":"CMP-000231","to":"EQP-D15","basis":"source","source_ids":["SRC-000522"],"confidence":"MEDIUM"},{"id":"REL-004182","type":"offers_equipment","from":"CMP-000231","to":"EQP-D19","basis":"source","source_ids":["SRC-000522"],"confidence":"MEDIUM"},{"id":"REL-004183","type":"offers_equipment","from":"CMP-000231","to":"EQP-D16","basis":"source","source_ids":["SRC-000522"],"confidence":"MEDIUM"},{"id":"REL-004184","type":"located_in","from":"CMP-000231","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004185","type":"offers_equipment","from":"CMP-000232","to":"EQP-C32","basis":"source","source_ids":["SRC-000523"],"confidence":"MEDIUM"},{"id":"REL-004186","type":"offers_equipment","from":"CMP-000232","to":"EQP-F07","basis":"source","source_ids":["SRC-000523"],"confidence":"MEDIUM"},{"id":"REL-004187","type":"located_in","from":"CMP-000232","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004188","type":"offers_equipment","from":"CMP-000233","to":"EQP-C11","basis":"source","source_ids":["SRC-000524"],"confidence":"MEDIUM"},{"id":"REL-004189","type":"offers_equipment","from":"CMP-000233","to":"EQP-C16","basis":"source","source_ids":["SRC-000524"],"confidence":"MEDIUM"},{"id":"REL-004190","type":"offers_equipment","from":"CMP-000233","to":"EQP-D19","basis":"source","source_ids":["SRC-000524"],"confidence":"MEDIUM"},{"id":"REL-004191","type":"offers_equipment","from":"CMP-000233","to":"EQP-C36","basis":"source","source_ids":["SRC-000524"],"confidence":"MEDIUM"},{"id":"REL-004192","type":"located_in","from":"CMP-000233","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004193","type":"offers_equipment","from":"CMP-000234","to":"EQP-A01.06","basis":"source","source_ids":["SRC-000525"],"confidence":"MEDIUM"},{"id":"REL-004194","type":"offers_equipment","from":"CMP-000234","to":"EQP-B07","basis":"source","source_ids":["SRC-000525"],"confidence":"MEDIUM"},{"id":"REL-004195","type":"located_in","from":"CMP-000234","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004196","type":"offers_equipment","from":"CMP-000235","to":"EQP-F01","basis":"source","source_ids":["SRC-000526","SRC-000527"],"confidence":"MEDIUM"},{"id":"REL-004197","type":"offers_equipment","from":"CMP-000235","to":"EQP-A19","basis":"source","source_ids":["SRC-000526","SRC-000527"],"confidence":"MEDIUM"},{"id":"REL-004198","type":"offers_equipment","from":"CMP-000235","to":"EQP-C02","basis":"source","source_ids":["SRC-000526","SRC-000527"],"confidence":"MEDIUM"},{"id":"REL-004199","type":"located_in","from":"CMP-000235","to":"CTY-US","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004200","type":"offers_equipment","from":"CMP-000236","to":"EQP-E03","basis":"source","source_ids":["SRC-000528"],"confidence":"MEDIUM"},{"id":"REL-004201","type":"offers_equipment","from":"CMP-000236","to":"EQP-K05","basis":"source","source_ids":["SRC-000528"],"confidence":"MEDIUM"},{"id":"REL-004202","type":"offers_equipment","from":"CMP-000236","to":"EQP-A19","basis":"source","source_ids":["SRC-000528"],"confidence":"MEDIUM"},{"id":"REL-004203","type":"located_in","from":"CMP-000236","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004204","type":"offers_equipment","from":"CMP-000237","to":"EQP-A02","basis":"source","source_ids":["SRC-000529"],"confidence":"MEDIUM"},{"id":"REL-004205","type":"located_in","from":"CMP-000237","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004206","type":"offers_equipment","from":"CMP-000238","to":"EQP-A11","basis":"source","source_ids":["SRC-000530"],"confidence":"MEDIUM"},{"id":"REL-004207","type":"offers_equipment","from":"CMP-000238","to":"EQP-A16","basis":"source","source_ids":["SRC-000530"],"confidence":"MEDIUM"},{"id":"REL-004208","type":"offers_equipment","from":"CMP-000238","to":"EQP-A09.03","basis":"source","source_ids":["SRC-000530"],"confidence":"MEDIUM"},{"id":"REL-004209","type":"located_in","from":"CMP-000238","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004210","type":"offers_equipment","from":"CMP-000239","to":"EQP-K01","basis":"source","source_ids":["SRC-000531"],"confidence":"MEDIUM"},{"id":"REL-004211","type":"offers_equipment","from":"CMP-000239","to":"EQP-K02","basis":"source","source_ids":["SRC-000531"],"confidence":"MEDIUM"},{"id":"REL-004212","type":"located_in","from":"CMP-000239","to":"CTY-US","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004213","type":"offers_equipment","from":"CMP-000240","to":"EQP-A05","basis":"source","source_ids":["SRC-000532"],"confidence":"MEDIUM"},{"id":"REL-004214","type":"offers_equipment","from":"CMP-000240","to":"EQP-A04","basis":"source","source_ids":["SRC-000532"],"confidence":"MEDIUM"},{"id":"REL-004215","type":"located_in","from":"CMP-000240","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004216","type":"offers_equipment","from":"CMP-000241","to":"EQP-A09.07","basis":"source","source_ids":["SRC-000533"],"confidence":"MEDIUM"},{"id":"REL-004217","type":"offers_equipment","from":"CMP-000241","to":"EQP-A09.08","basis":"source","source_ids":["SRC-000533"],"confidence":"MEDIUM"},{"id":"REL-004218","type":"offers_equipment","from":"CMP-000241","to":"EQP-A09.06","basis":"source","source_ids":["SRC-000533"],"confidence":"MEDIUM"},{"id":"REL-004219","type":"offers_equipment","from":"CMP-000241","to":"EQP-A09.02","basis":"source","source_ids":["SRC-000533"],"confidence":"MEDIUM"},{"id":"REL-004220","type":"located_in","from":"CMP-000241","to":"CTY-CH","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004221","type":"offers_equipment","from":"CMP-000242","to":"EQP-A05","basis":"source","source_ids":["SRC-000534"],"confidence":"MEDIUM"},{"id":"REL-004222","type":"offers_equipment","from":"CMP-000242","to":"EQP-A04","basis":"source","source_ids":["SRC-000534"],"confidence":"MEDIUM"},{"id":"REL-004223","type":"located_in","from":"CMP-000242","to":"CTY-AT","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004224","type":"offers_equipment","from":"CMP-000243","to":"EQP-A10","basis":"source","source_ids":["SRC-000535"],"confidence":"MEDIUM"},{"id":"REL-004225","type":"located_in","from":"CMP-000243","to":"CTY-FR","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004226","type":"offers_equipment","from":"CMP-000244","to":"EQP-A08.01","basis":"source","source_ids":["SRC-000536"],"confidence":"MEDIUM"},{"id":"REL-004227","type":"offers_equipment","from":"CMP-000244","to":"EQP-A09.08","basis":"source","source_ids":["SRC-000536"],"confidence":"MEDIUM"},{"id":"REL-004228","type":"located_in","from":"CMP-000244","to":"CTY-DE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004229","type":"offers_equipment","from":"CMP-000245","to":"EQP-A11","basis":"source","source_ids":["SRC-000537"],"confidence":"MEDIUM"},{"id":"REL-004230","type":"offers_equipment","from":"CMP-000245","to":"EQP-A13","basis":"source","source_ids":["SRC-000537"],"confidence":"MEDIUM"},{"id":"REL-004231","type":"offers_equipment","from":"CMP-000245","to":"EQP-F05","basis":"source","source_ids":["SRC-000537"],"confidence":"MEDIUM"},{"id":"REL-004232","type":"located_in","from":"CMP-000245","to":"CTY-DE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004233","type":"offers_equipment","from":"CMP-000246","to":"EQP-F08","basis":"source","source_ids":["SRC-000538"],"confidence":"MEDIUM"},{"id":"REL-004234","type":"offers_equipment","from":"CMP-000246","to":"EQP-C10","basis":"source","source_ids":["SRC-000538"],"confidence":"MEDIUM"},{"id":"REL-004235","type":"located_in","from":"CMP-000246","to":"CTY-DE","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004236","type":"offers_equipment","from":"CMP-000247","to":"EQP-A09.06","basis":"source","source_ids":["SRC-000539","SRC-000540"],"confidence":"MEDIUM"},{"id":"REL-004237","type":"located_in","from":"CMP-000247","to":"CTY-DK","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004238","type":"offers_equipment","from":"CMP-000248","to":"EQP-A08","basis":"source","source_ids":["SRC-000541","SRC-000542","SRC-000543"],"confidence":"MEDIUM"},{"id":"REL-004239","type":"located_in","from":"CMP-000248","to":"CTY-SE","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004240","type":"offers_equipment","from":"CMP-000249","to":"EQP-A31","basis":"source","source_ids":["SRC-000544","SRC-000545"],"confidence":"MEDIUM"},{"id":"REL-004241","type":"located_in","from":"CMP-000249","to":"CTY-CH","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004242","type":"offers_equipment","from":"CMP-000250","to":"EQP-A25","basis":"source","source_ids":["SRC-000546","SRC-000547"],"confidence":"MEDIUM"},{"id":"REL-004243","type":"located_in","from":"CMP-000250","to":"CTY-IL","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004244","type":"offers_equipment","from":"CMP-000251","to":"EQP-A01.08","basis":"source","source_ids":["SRC-000548"],"confidence":"MEDIUM"},{"id":"REL-004245","type":"located_in","from":"CMP-000251","to":"CTY-DE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004246","type":"offers_equipment","from":"CMP-000252","to":"EQP-A01.07","basis":"source","source_ids":["SRC-000549","SRC-000550"],"confidence":"LOW"},{"id":"REL-004247","type":"located_in","from":"CMP-000252","to":"CTY-NL","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004248","type":"offers_equipment","from":"CMP-000253","to":"EQP-A32","basis":"source","source_ids":["SRC-000551"],"confidence":"MEDIUM"},{"id":"REL-004249","type":"offers_equipment","from":"CMP-000253","to":"EQP-C10","basis":"source","source_ids":["SRC-000551"],"confidence":"MEDIUM"},{"id":"REL-004250","type":"located_in","from":"CMP-000253","to":"CTY-DE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004251","type":"offers_equipment","from":"CMP-000254","to":"EQP-A18","basis":"source","source_ids":["SRC-000552"],"confidence":"MEDIUM"},{"id":"REL-004252","type":"offers_equipment","from":"CMP-000254","to":"EQP-D19","basis":"source","source_ids":["SRC-000552"],"confidence":"MEDIUM"},{"id":"REL-004253","type":"offers_equipment","from":"CMP-000254","to":"EQP-A05","basis":"source","source_ids":["SRC-000552"],"confidence":"MEDIUM"},{"id":"REL-004254","type":"located_in","from":"CMP-000254","to":"CTY-AT","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004255","type":"offers_equipment","from":"CMP-000255","to":"EQP-A09.07","basis":"source","source_ids":["SRC-000553"],"confidence":"MEDIUM"},{"id":"REL-004256","type":"offers_equipment","from":"CMP-000255","to":"EQP-A09.09","basis":"source","source_ids":["SRC-000553"],"confidence":"MEDIUM"},{"id":"REL-004257","type":"offers_equipment","from":"CMP-000255","to":"EQP-A42","basis":"source","source_ids":["SRC-000553"],"confidence":"MEDIUM"},{"id":"REL-004258","type":"located_in","from":"CMP-000255","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004259","type":"offers_equipment","from":"CMP-000256","to":"EQP-A38","basis":"source","source_ids":["SRC-000554"],"confidence":"MEDIUM"},{"id":"REL-004260","type":"offers_equipment","from":"CMP-000256","to":"EQP-A37","basis":"source","source_ids":["SRC-000554"],"confidence":"MEDIUM"},{"id":"REL-004261","type":"located_in","from":"CMP-000256","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004262","type":"offers_equipment","from":"CMP-000257","to":"EQP-A23","basis":"source","source_ids":["SRC-000555"],"confidence":"MEDIUM"},{"id":"REL-004263","type":"offers_equipment","from":"CMP-000257","to":"EQP-A22","basis":"source","source_ids":["SRC-000555"],"confidence":"MEDIUM"},{"id":"REL-004264","type":"located_in","from":"CMP-000257","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004265","type":"offers_equipment","from":"CMP-000258","to":"EQP-C35","basis":"source","source_ids":["SRC-000556","SRC-000557"],"confidence":"MEDIUM"},{"id":"REL-004266","type":"offers_equipment","from":"CMP-000258","to":"EQP-A25","basis":"source","source_ids":["SRC-000556","SRC-000557"],"confidence":"MEDIUM"},{"id":"REL-004267","type":"located_in","from":"CMP-000258","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004268","type":"offers_equipment","from":"CMP-000259","to":"EQP-A01","basis":"source","source_ids":["SRC-000558","SRC-000559"],"confidence":"LOW"},{"id":"REL-004269","type":"located_in","from":"CMP-000259","to":"CTY-US","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004270","type":"offers_equipment","from":"CMP-000260","to":"EQP-A32","basis":"source","source_ids":["SRC-000560"],"confidence":"LOW"},{"id":"REL-004271","type":"located_in","from":"CMP-000260","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004272","type":"offers_equipment","from":"CMP-000261","to":"EQP-A27","basis":"source","source_ids":["SRC-000561","SRC-000562"],"confidence":"MEDIUM"},{"id":"REL-004273","type":"offers_equipment","from":"CMP-000261","to":"EQP-A30","basis":"source","source_ids":["SRC-000561","SRC-000562"],"confidence":"MEDIUM"},{"id":"REL-004274","type":"offers_equipment","from":"CMP-000261","to":"EQP-A25","basis":"source","source_ids":["SRC-000561","SRC-000562"],"confidence":"MEDIUM"},{"id":"REL-004275","type":"located_in","from":"CMP-000261","to":"CTY-KR","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004276","type":"offers_equipment","from":"CMP-000262","to":"EQP-A22","basis":"source","source_ids":["SRC-000563","SRC-000564"],"confidence":"MEDIUM"},{"id":"REL-004277","type":"offers_equipment","from":"CMP-000262","to":"EQP-A21","basis":"source","source_ids":["SRC-000563","SRC-000564"],"confidence":"MEDIUM"},{"id":"REL-004278","type":"located_in","from":"CMP-000262","to":"CTY-KR","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004279","type":"offers_equipment","from":"CMP-000263","to":"EQP-C40","basis":"source","source_ids":["SRC-000565","SRC-000566"],"confidence":"MEDIUM"},{"id":"REL-004280","type":"offers_equipment","from":"CMP-000263","to":"EQP-C38","basis":"source","source_ids":["SRC-000565","SRC-000566"],"confidence":"MEDIUM"},{"id":"REL-004281","type":"offers_equipment","from":"CMP-000263","to":"EQP-C41","basis":"source","source_ids":["SRC-000565","SRC-000566"],"confidence":"MEDIUM"},{"id":"REL-004282","type":"located_in","from":"CMP-000263","to":"CTY-KR","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004283","type":"offers_equipment","from":"CMP-000264","to":"EQP-A19","basis":"source","source_ids":["SRC-000567","SRC-000568"],"confidence":"LOW"},{"id":"REL-004284","type":"offers_equipment","from":"CMP-000264","to":"EQP-A04","basis":"source","source_ids":["SRC-000567","SRC-000568"],"confidence":"LOW"},{"id":"REL-004285","type":"located_in","from":"CMP-000264","to":"CTY-KR","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004286","type":"offers_equipment","from":"CMP-000265","to":"EQP-A09.02","basis":"source","source_ids":["SRC-000569","SRC-000570"],"confidence":"MEDIUM"},{"id":"REL-004287","type":"offers_equipment","from":"CMP-000265","to":"EQP-A06","basis":"source","source_ids":["SRC-000569","SRC-000570"],"confidence":"MEDIUM"},{"id":"REL-004288","type":"located_in","from":"CMP-000265","to":"CTY-KR","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004289","type":"offers_equipment","from":"CMP-000266","to":"EQP-C39","basis":"source","source_ids":["SRC-000571"],"confidence":"MEDIUM"},{"id":"REL-004290","type":"offers_equipment","from":"CMP-000266","to":"EQP-C38","basis":"source","source_ids":["SRC-000571"],"confidence":"MEDIUM"},{"id":"REL-004291","type":"located_in","from":"CMP-000266","to":"CTY-KR","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004292","type":"offers_equipment","from":"CMP-000267","to":"EQP-C38","basis":"source","source_ids":["SRC-000572","SRC-000573"],"confidence":"LOW"},{"id":"REL-004293","type":"offers_equipment","from":"CMP-000267","to":"EQP-C40","basis":"source","source_ids":["SRC-000572","SRC-000573"],"confidence":"LOW"},{"id":"REL-004294","type":"located_in","from":"CMP-000267","to":"CTY-KR","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004295","type":"offers_equipment","from":"CMP-000268","to":"EQP-C08","basis":"source","source_ids":["SRC-000574","SRC-000575"],"confidence":"LOW"},{"id":"REL-004296","type":"offers_equipment","from":"CMP-000268","to":"EQP-C39","basis":"source","source_ids":["SRC-000574","SRC-000575"],"confidence":"LOW"},{"id":"REL-004297","type":"offers_equipment","from":"CMP-000268","to":"EQP-C36","basis":"source","source_ids":["SRC-000574","SRC-000575"],"confidence":"LOW"},{"id":"REL-004298","type":"located_in","from":"CMP-000268","to":"CTY-MY","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004299","type":"offers_equipment","from":"CMP-000269","to":"EQP-C37","basis":"source","source_ids":["SRC-000576"],"confidence":"MEDIUM"},{"id":"REL-004300","type":"offers_equipment","from":"CMP-000269","to":"EQP-C39","basis":"source","source_ids":["SRC-000576"],"confidence":"MEDIUM"},{"id":"REL-004301","type":"offers_equipment","from":"CMP-000269","to":"EQP-C38","basis":"source","source_ids":["SRC-000576"],"confidence":"MEDIUM"},{"id":"REL-004302","type":"located_in","from":"CMP-000269","to":"CTY-SG","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004303","type":"offers_equipment","from":"CMP-000270","to":"EQP-C40","basis":"source","source_ids":["SRC-000577"],"confidence":"MEDIUM"},{"id":"REL-004304","type":"located_in","from":"CMP-000270","to":"CTY-MY","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004305","type":"offers_equipment","from":"CMP-000271","to":"EQP-C26","basis":"source","source_ids":["SRC-000578","SRC-000579"],"confidence":"MEDIUM"},{"id":"REL-004306","type":"offers_equipment","from":"CMP-000271","to":"EQP-C28","basis":"source","source_ids":["SRC-000578","SRC-000579"],"confidence":"MEDIUM"},{"id":"REL-004307","type":"offers_equipment","from":"CMP-000271","to":"EQP-C01.04","basis":"source","source_ids":["SRC-000578","SRC-000579"],"confidence":"MEDIUM"},{"id":"REL-004308","type":"offers_equipment","from":"CMP-000271","to":"EQP-A07","basis":"source","source_ids":["SRC-000578","SRC-000579"],"confidence":"MEDIUM"},{"id":"REL-004309","type":"located_in","from":"CMP-000271","to":"CTY-TW","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004310","type":"offers_equipment","from":"CMP-000272","to":"EQP-A09.06","basis":"source","source_ids":["SRC-000580"],"confidence":"LOW"},{"id":"REL-004311","type":"offers_equipment","from":"CMP-000272","to":"EQP-A09.01","basis":"source","source_ids":["SRC-000580"],"confidence":"LOW"},{"id":"REL-004312","type":"located_in","from":"CMP-000272","to":"CTY-CN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004313","type":"offers_equipment","from":"CMP-000273","to":"EQP-A02","basis":"source","source_ids":["SRC-000581"],"confidence":"MEDIUM"},{"id":"REL-004314","type":"located_in","from":"CMP-000273","to":"CTY-IN","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004315","type":"offers_equipment","from":"CMP-000274","to":"EQP-C26","basis":"source","source_ids":["SRC-000582"],"confidence":"LOW"},{"id":"REL-004316","type":"located_in","from":"CMP-000274","to":"CTY-IN","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004317","type":"offers_equipment","from":"CMP-000275","to":"EQP-A09.08","basis":"source","source_ids":["SRC-000583","SRC-000584"],"confidence":"LOW"},{"id":"REL-004318","type":"offers_equipment","from":"CMP-000275","to":"EQP-A09.09","basis":"source","source_ids":["SRC-000583","SRC-000584"],"confidence":"LOW"},{"id":"REL-004319","type":"located_in","from":"CMP-000275","to":"CTY-IN","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004320","type":"offers_equipment","from":"CMP-000276","to":"EQP-C14","basis":"source","source_ids":["SRC-000712"],"confidence":"MEDIUM"},{"id":"REL-004321","type":"offers_equipment","from":"CMP-000276","to":"EQP-C12","basis":"source","source_ids":["SRC-000712"],"confidence":"MEDIUM"},{"id":"REL-004322","type":"located_in","from":"CMP-000276","to":"CTY-DE","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004323","type":"offers_equipment","from":"CMP-000277","to":"EQP-C12","basis":"source","source_ids":["SRC-000713"],"confidence":"MEDIUM"},{"id":"REL-004324","type":"offers_equipment","from":"CMP-000277","to":"EQP-C13","basis":"source","source_ids":["SRC-000713"],"confidence":"MEDIUM"},{"id":"REL-004325","type":"offers_equipment","from":"CMP-000277","to":"EQP-C14","basis":"source","source_ids":["SRC-000713"],"confidence":"MEDIUM"},{"id":"REL-004326","type":"located_in","from":"CMP-000277","to":"CTY-US","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004327","type":"offers_equipment","from":"CMP-000278","to":"EQP-C12","basis":"source","source_ids":["SRC-000714"],"confidence":"MEDIUM"},{"id":"REL-004328","type":"offers_equipment","from":"CMP-000278","to":"EQP-C14","basis":"source","source_ids":["SRC-000714"],"confidence":"MEDIUM"},{"id":"REL-004329","type":"located_in","from":"CMP-000278","to":"CTY-DE","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004330","type":"offers_equipment","from":"CMP-000279","to":"EQP-C08","basis":"source","source_ids":["SRC-000715"],"confidence":"MEDIUM"},{"id":"REL-004331","type":"offers_equipment","from":"CMP-000279","to":"EQP-C09","basis":"source","source_ids":["SRC-000715"],"confidence":"MEDIUM"},{"id":"REL-004332","type":"offers_equipment","from":"CMP-000279","to":"EQP-C10","basis":"source","source_ids":["SRC-000715"],"confidence":"MEDIUM"},{"id":"REL-004333","type":"located_in","from":"CMP-000279","to":"CTY-DE","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004334","type":"offers_equipment","from":"CMP-000280","to":"EQP-C10","basis":"source","source_ids":["SRC-000716"],"confidence":"MEDIUM"},{"id":"REL-004335","type":"offers_equipment","from":"CMP-000280","to":"EQP-C08","basis":"source","source_ids":["SRC-000716"],"confidence":"MEDIUM"},{"id":"REL-004336","type":"offers_equipment","from":"CMP-000280","to":"EQP-C11","basis":"source","source_ids":["SRC-000716"],"confidence":"MEDIUM"},{"id":"REL-004337","type":"located_in","from":"CMP-000280","to":"CTY-NL","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004338","type":"offers_equipment","from":"CMP-000281","to":"EQP-C21","basis":"source","source_ids":["SRC-000717"],"confidence":"MEDIUM"},{"id":"REL-004339","type":"offers_equipment","from":"CMP-000281","to":"EQP-C23","basis":"source","source_ids":["SRC-000717"],"confidence":"MEDIUM"},{"id":"REL-004340","type":"offers_equipment","from":"CMP-000281","to":"EQP-F08","basis":"source","source_ids":["SRC-000717"],"confidence":"MEDIUM"},{"id":"REL-004341","type":"located_in","from":"CMP-000281","to":"CTY-NL","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004342","type":"offers_equipment","from":"CMP-000282","to":"EQP-C42","basis":"source","source_ids":["SRC-000718"],"confidence":"MEDIUM"},{"id":"REL-004343","type":"located_in","from":"CMP-000282","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004344","type":"offers_equipment","from":"CMP-000283","to":"EQP-A09.11","basis":"source","source_ids":["SRC-000719"],"confidence":"MEDIUM"},{"id":"REL-004345","type":"located_in","from":"CMP-000283","to":"CTY-FR","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004346","type":"offers_equipment","from":"CMP-000284","to":"EQP-A09.11","basis":"source","source_ids":["SRC-000720"],"confidence":"MEDIUM"},{"id":"REL-004347","type":"located_in","from":"CMP-000284","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004348","type":"offers_equipment","from":"CMP-000285","to":"EQP-A09.11","basis":"source","source_ids":["SRC-000721"],"confidence":"LOW"},{"id":"REL-004349","type":"offers_equipment","from":"CMP-000285","to":"EQP-A09.09","basis":"source","source_ids":["SRC-000721"],"confidence":"LOW"},{"id":"REL-004350","type":"located_in","from":"CMP-000285","to":"CTY-DE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004351","type":"offers_equipment","from":"CMP-000286","to":"EQP-A09.08","basis":"source","source_ids":["SRC-000722"],"confidence":"MEDIUM"},{"id":"REL-004352","type":"offers_equipment","from":"CMP-000286","to":"EQP-A09.09","basis":"source","source_ids":["SRC-000722"],"confidence":"MEDIUM"},{"id":"REL-004353","type":"located_in","from":"CMP-000286","to":"CTY-US","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004354","type":"offers_equipment","from":"CMP-000287","to":"EQP-A09.08","basis":"source","source_ids":["SRC-000723"],"confidence":"MEDIUM"},{"id":"REL-004355","type":"offers_equipment","from":"CMP-000287","to":"EQP-A09.09","basis":"source","source_ids":["SRC-000723"],"confidence":"MEDIUM"},{"id":"REL-004356","type":"located_in","from":"CMP-000287","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004357","type":"offers_equipment","from":"CMP-000288","to":"EQP-A09.08","basis":"source","source_ids":["SRC-000724"],"confidence":"LOW"},{"id":"REL-004358","type":"offers_equipment","from":"CMP-000288","to":"EQP-A09.09","basis":"source","source_ids":["SRC-000724"],"confidence":"LOW"},{"id":"REL-004359","type":"located_in","from":"CMP-000288","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004360","type":"offers_equipment","from":"CMP-000289","to":"EQP-K09","basis":"source","source_ids":["SRC-000725"],"confidence":"MEDIUM"},{"id":"REL-004361","type":"located_in","from":"CMP-000289","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004362","type":"offers_equipment","from":"CMP-000290","to":"EQP-B06","basis":"source","source_ids":["SRC-000726"],"confidence":"MEDIUM"},{"id":"REL-004363","type":"located_in","from":"CMP-000290","to":"CTY-FI","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004364","type":"offers_equipment","from":"CMP-000291","to":"EQP-B06","basis":"source","source_ids":["SRC-000727"],"confidence":"LOW"},{"id":"REL-004365","type":"located_in","from":"CMP-000291","to":"CTY-KR","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004366","type":"offers_equipment","from":"CMP-000292","to":"EQP-B05","basis":"source","source_ids":["SRC-000728"],"confidence":"MEDIUM"},{"id":"REL-004367","type":"offers_equipment","from":"CMP-000292","to":"EQP-B04","basis":"source","source_ids":["SRC-000728"],"confidence":"MEDIUM"},{"id":"REL-004368","type":"located_in","from":"CMP-000292","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004369","type":"offers_equipment","from":"CMP-000293","to":"EQP-J09","basis":"source","source_ids":["SRC-000729","SRC-000730"],"confidence":"MEDIUM"},{"id":"REL-004370","type":"offers_equipment","from":"CMP-000293","to":"EQP-J14","basis":"source","source_ids":["SRC-000729","SRC-000730"],"confidence":"MEDIUM"},{"id":"REL-004371","type":"located_in","from":"CMP-000293","to":"CTY-PT","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004372","type":"offers_equipment","from":"CMP-000294","to":"EQP-L01","basis":"source","source_ids":["SRC-000731"],"confidence":"MEDIUM"},{"id":"REL-004373","type":"offers_equipment","from":"CMP-000294","to":"EQP-A42","basis":"source","source_ids":["SRC-000731"],"confidence":"MEDIUM"},{"id":"REL-004374","type":"located_in","from":"CMP-000294","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004375","type":"offers_equipment","from":"CMP-000295","to":"EQP-L01","basis":"source","source_ids":["SRC-000732"],"confidence":"MEDIUM"},{"id":"REL-004376","type":"offers_equipment","from":"CMP-000295","to":"EQP-A42","basis":"source","source_ids":["SRC-000732"],"confidence":"MEDIUM"},{"id":"REL-004377","type":"located_in","from":"CMP-000295","to":"CTY-DE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004378","type":"offers_equipment","from":"CMP-000296","to":"EQP-L02","basis":"source","source_ids":["SRC-000733"],"confidence":"MEDIUM"},{"id":"REL-004379","type":"offers_equipment","from":"CMP-000296","to":"EQP-A45","basis":"source","source_ids":["SRC-000733"],"confidence":"MEDIUM"},{"id":"REL-004380","type":"located_in","from":"CMP-000296","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004381","type":"offers_equipment","from":"CMP-000297","to":"EQP-L03","basis":"source","source_ids":["SRC-000734"],"confidence":"LOW"},{"id":"REL-004382","type":"located_in","from":"CMP-000297","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004383","type":"offers_equipment","from":"CMP-000298","to":"EQP-H02","basis":"source","source_ids":["SRC-000735","SRC-000736"],"confidence":"LOW"},{"id":"REL-004384","type":"offers_equipment","from":"CMP-000298","to":"EQP-H05","basis":"source","source_ids":["SRC-000735","SRC-000736"],"confidence":"LOW"},{"id":"REL-004385","type":"offers_equipment","from":"CMP-000298","to":"EQP-A06","basis":"source","source_ids":["SRC-000735","SRC-000736"],"confidence":"LOW"},{"id":"REL-004386","type":"located_in","from":"CMP-000298","to":"CTY-GB","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004387","type":"offers_equipment","from":"CMP-000299","to":"EQP-A21","basis":"source","source_ids":["SRC-000737"],"confidence":"MEDIUM"},{"id":"REL-004388","type":"offers_equipment","from":"CMP-000299","to":"EQP-A25","basis":"source","source_ids":["SRC-000737"],"confidence":"MEDIUM"},{"id":"REL-004389","type":"offers_equipment","from":"CMP-000299","to":"EQP-A30","basis":"source","source_ids":["SRC-000737"],"confidence":"MEDIUM"},{"id":"REL-004390","type":"offers_equipment","from":"CMP-000299","to":"EQP-D13","basis":"source","source_ids":["SRC-000737"],"confidence":"MEDIUM"},{"id":"REL-004391","type":"offers_equipment","from":"CMP-000299","to":"EQP-A22","basis":"source","source_ids":["SRC-000737"],"confidence":"MEDIUM"},{"id":"REL-004392","type":"located_in","from":"CMP-000299","to":"CTY-FR","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004393","type":"offers_equipment","from":"CMP-000300","to":"EQP-I02","basis":"source","source_ids":["SRC-000738"],"confidence":"MEDIUM"},{"id":"REL-004394","type":"located_in","from":"CMP-000300","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004395","type":"offers_equipment","from":"CMP-000301","to":"EQP-K05","basis":"source","source_ids":["SRC-000766","SRC-000767"],"confidence":"MEDIUM"},{"id":"REL-004396","type":"offers_equipment","from":"CMP-000301","to":"EQP-K07","basis":"source","source_ids":["SRC-000766","SRC-000767"],"confidence":"MEDIUM"},{"id":"REL-004397","type":"offers_equipment","from":"CMP-000301","to":"EQP-K06","basis":"source","source_ids":["SRC-000766","SRC-000767"],"confidence":"MEDIUM"},{"id":"REL-004398","type":"located_in","from":"CMP-000301","to":"CTY-DE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004399","type":"offers_equipment","from":"CMP-000302","to":"EQP-K05","basis":"source","source_ids":["SRC-000768"],"confidence":"MEDIUM"},{"id":"REL-004400","type":"offers_equipment","from":"CMP-000302","to":"EQP-A19","basis":"source","source_ids":["SRC-000768"],"confidence":"MEDIUM"},{"id":"REL-004401","type":"located_in","from":"CMP-000302","to":"CTY-GB","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004402","type":"offers_equipment","from":"CMP-000303","to":"EQP-C39","basis":"source","source_ids":["SRC-000769","SRC-000770"],"confidence":"MEDIUM"},{"id":"REL-004403","type":"offers_equipment","from":"CMP-000303","to":"EQP-C40","basis":"source","source_ids":["SRC-000769","SRC-000770"],"confidence":"MEDIUM"},{"id":"REL-004404","type":"located_in","from":"CMP-000303","to":"CTY-JP","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004405","type":"offers_equipment","from":"CMP-000304","to":"EQP-A33","basis":"source","source_ids":["SRC-000771"],"confidence":"MEDIUM"},{"id":"REL-004406","type":"located_in","from":"CMP-000304","to":"CTY-JP","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004407","type":"offers_equipment","from":"CMP-000305","to":"EQP-A33","basis":"source","source_ids":["SRC-000772"],"confidence":"MEDIUM"},{"id":"REL-004408","type":"located_in","from":"CMP-000305","to":"CTY-JP","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004409","type":"offers_equipment","from":"CMP-000306","to":"EQP-A33","basis":"source","source_ids":["SRC-000773"],"confidence":"LOW"},{"id":"REL-004410","type":"located_in","from":"CMP-000306","to":"CTY-JP","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004411","type":"offers_equipment","from":"CMP-000307","to":"EQP-A43","basis":"source","source_ids":["SRC-000774"],"confidence":"MEDIUM"},{"id":"REL-004412","type":"offers_equipment","from":"CMP-000307","to":"EQP-L04","basis":"source","source_ids":["SRC-000774"],"confidence":"MEDIUM"},{"id":"REL-004413","type":"located_in","from":"CMP-000307","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004414","type":"offers_equipment","from":"CMP-000308","to":"EQP-A43","basis":"source","source_ids":["SRC-000775"],"confidence":"MEDIUM"},{"id":"REL-004415","type":"offers_equipment","from":"CMP-000308","to":"EQP-L04","basis":"source","source_ids":["SRC-000775"],"confidence":"MEDIUM"},{"id":"REL-004416","type":"located_in","from":"CMP-000308","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004417","type":"offers_equipment","from":"CMP-000309","to":"EQP-B07","basis":"source","source_ids":["SRC-000776","SRC-000777"],"confidence":"MEDIUM"},{"id":"REL-004418","type":"located_in","from":"CMP-000309","to":"CTY-AT","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004419","type":"offers_equipment","from":"CMP-000310","to":"EQP-I08","basis":"source","source_ids":["SRC-000778"],"confidence":"LOW"},{"id":"REL-004420","type":"located_in","from":"CMP-000310","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004421","type":"located_in","from":"CMP-000311","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004422","type":"located_in","from":"CMP-000312","to":"CTY-DE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004423","type":"located_in","from":"CMP-000313","to":"CTY-KR","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004424","type":"located_in","from":"CMP-000314","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004425","type":"offers_equipment","from":"CMP-000315","to":"EQP-A36","basis":"source","source_ids":["SRC-000784"],"confidence":"MEDIUM"},{"id":"REL-004426","type":"offers_equipment","from":"CMP-000315","to":"EQP-A19","basis":"source","source_ids":["SRC-000784"],"confidence":"MEDIUM"},{"id":"REL-004427","type":"located_in","from":"CMP-000315","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004428","type":"offers_equipment","from":"CMP-000316","to":"EQP-C25","basis":"source","source_ids":["SRC-000809"],"confidence":"MEDIUM"},{"id":"REL-004429","type":"offers_equipment","from":"CMP-000316","to":"EQP-C24","basis":"source","source_ids":["SRC-000809"],"confidence":"MEDIUM"},{"id":"REL-004430","type":"located_in","from":"CMP-000316","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004431","type":"offers_equipment","from":"CMP-000317","to":"EQP-C25","basis":"source","source_ids":["SRC-000810"],"confidence":"MEDIUM"},{"id":"REL-004432","type":"located_in","from":"CMP-000317","to":"CTY-DE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004433","type":"offers_equipment","from":"CMP-000318","to":"EQP-C12","basis":"source","source_ids":["SRC-000811"],"confidence":"MEDIUM"},{"id":"REL-004434","type":"offers_equipment","from":"CMP-000318","to":"EQP-C13","basis":"source","source_ids":["SRC-000811"],"confidence":"MEDIUM"},{"id":"REL-004435","type":"offers_equipment","from":"CMP-000318","to":"EQP-C14","basis":"source","source_ids":["SRC-000811"],"confidence":"MEDIUM"},{"id":"REL-004436","type":"offers_equipment","from":"CMP-000318","to":"EQP-C31","basis":"source","source_ids":["SRC-000811"],"confidence":"MEDIUM"},{"id":"REL-004437","type":"located_in","from":"CMP-000318","to":"CTY-DE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004438","type":"offers_equipment","from":"CMP-000319","to":"EQP-C10","basis":"source","source_ids":["SRC-000812"],"confidence":"MEDIUM"},{"id":"REL-004439","type":"offers_equipment","from":"CMP-000319","to":"EQP-C15","basis":"source","source_ids":["SRC-000812"],"confidence":"MEDIUM"},{"id":"REL-004440","type":"located_in","from":"CMP-000319","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004441","type":"offers_equipment","from":"CMP-000320","to":"EQP-J11","basis":"source","source_ids":["SRC-000813"],"confidence":"MEDIUM"},{"id":"REL-004442","type":"offers_equipment","from":"CMP-000320","to":"EQP-J12","basis":"source","source_ids":["SRC-000813"],"confidence":"MEDIUM"},{"id":"REL-004443","type":"offers_equipment","from":"CMP-000320","to":"EQP-A37","basis":"source","source_ids":["SRC-000813"],"confidence":"MEDIUM"},{"id":"REL-004444","type":"offers_equipment","from":"CMP-000320","to":"EQP-A40","basis":"source","source_ids":["SRC-000813"],"confidence":"MEDIUM"},{"id":"REL-004445","type":"located_in","from":"CMP-000320","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004446","type":"offers_equipment","from":"CMP-000321","to":"EQP-A38","basis":"source","source_ids":["SRC-000814"],"confidence":"MEDIUM"},{"id":"REL-004447","type":"offers_equipment","from":"CMP-000321","to":"EQP-J06","basis":"source","source_ids":["SRC-000814"],"confidence":"MEDIUM"},{"id":"REL-004448","type":"located_in","from":"CMP-000321","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004449","type":"offers_equipment","from":"CMP-000322","to":"EQP-A05","basis":"source","source_ids":["SRC-000815"],"confidence":"LOW"},{"id":"REL-004450","type":"offers_equipment","from":"CMP-000322","to":"EQP-A04","basis":"source","source_ids":["SRC-000815"],"confidence":"LOW"},{"id":"REL-004451","type":"located_in","from":"CMP-000322","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004452","type":"offers_equipment","from":"CMP-000323","to":"EQP-A08.03","basis":"source","source_ids":["SRC-000816"],"confidence":"MEDIUM"},{"id":"REL-004453","type":"offers_equipment","from":"CMP-000323","to":"EQP-A08.04","basis":"source","source_ids":["SRC-000816"],"confidence":"MEDIUM"},{"id":"REL-004454","type":"offers_equipment","from":"CMP-000323","to":"EQP-A08.05","basis":"source","source_ids":["SRC-000816"],"confidence":"MEDIUM"},{"id":"REL-004455","type":"offers_equipment","from":"CMP-000323","to":"EQP-A07","basis":"source","source_ids":["SRC-000816"],"confidence":"MEDIUM"},{"id":"REL-004456","type":"located_in","from":"CMP-000323","to":"CTY-US","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004457","type":"offers_equipment","from":"CMP-000324","to":"EQP-L10","basis":"source","source_ids":["SRC-000817"],"confidence":"LOW"},{"id":"REL-004458","type":"offers_equipment","from":"CMP-000324","to":"EQP-A31","basis":"source","source_ids":["SRC-000817"],"confidence":"LOW"},{"id":"REL-004459","type":"located_in","from":"CMP-000324","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004460","type":"offers_equipment","from":"CMP-000325","to":"EQP-L10","basis":"source","source_ids":["SRC-000818","SRC-000819"],"confidence":"LOW"},{"id":"REL-004461","type":"offers_equipment","from":"CMP-000325","to":"EQP-A31","basis":"source","source_ids":["SRC-000818","SRC-000819"],"confidence":"LOW"},{"id":"REL-004462","type":"located_in","from":"CMP-000325","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004463","type":"offers_equipment","from":"CMP-000326","to":"EQP-C18","basis":"source","source_ids":["SRC-000820","SRC-000821"],"confidence":"MEDIUM"},{"id":"REL-004464","type":"located_in","from":"CMP-000326","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004465","type":"offers_equipment","from":"CMP-000327","to":"EQP-C01.02","basis":"source","source_ids":["SRC-000846"],"confidence":"LOW"},{"id":"REL-004466","type":"offers_equipment","from":"CMP-000327","to":"EQP-C35","basis":"source","source_ids":["SRC-000846"],"confidence":"LOW"},{"id":"REL-004467","type":"located_in","from":"CMP-000327","to":"CTY-SG","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004468","type":"offers_equipment","from":"CMP-000328","to":"EQP-C08","basis":"source","source_ids":["SRC-000847"],"confidence":"LOW"},{"id":"REL-004469","type":"offers_equipment","from":"CMP-000328","to":"EQP-C34","basis":"source","source_ids":["SRC-000847"],"confidence":"LOW"},{"id":"REL-004470","type":"located_in","from":"CMP-000328","to":"CTY-SG","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004471","type":"offers_equipment","from":"CMP-000329","to":"EQP-C39","basis":"source","source_ids":["SRC-000848"],"confidence":"MEDIUM"},{"id":"REL-004472","type":"offers_equipment","from":"CMP-000329","to":"EQP-C36","basis":"source","source_ids":["SRC-000848"],"confidence":"MEDIUM"},{"id":"REL-004473","type":"located_in","from":"CMP-000329","to":"CTY-MY","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004474","type":"offers_equipment","from":"CMP-000330","to":"EQP-C26","basis":"source","source_ids":["SRC-000849"],"confidence":"LOW"},{"id":"REL-004475","type":"offers_equipment","from":"CMP-000330","to":"EQP-C39","basis":"source","source_ids":["SRC-000849"],"confidence":"LOW"},{"id":"REL-004476","type":"located_in","from":"CMP-000330","to":"CTY-MY","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004477","type":"located_in","from":"CMP-000331","to":"CTY-IN","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004478","type":"offers_equipment","from":"CMP-000332","to":"EQP-A15","basis":"source","source_ids":["SRC-000852"],"confidence":"LOW"},{"id":"REL-004479","type":"offers_equipment","from":"CMP-000332","to":"EQP-C26","basis":"source","source_ids":["SRC-000852"],"confidence":"LOW"},{"id":"REL-004480","type":"located_in","from":"CMP-000332","to":"CTY-IN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004481","type":"located_in","from":"CMP-000333","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004482","type":"offers_equipment","from":"CMP-000334","to":"EQP-A09.08","basis":"source","source_ids":["SRC-000854"],"confidence":"MEDIUM"},{"id":"REL-004483","type":"offers_equipment","from":"CMP-000334","to":"EQP-A09.07","basis":"source","source_ids":["SRC-000854"],"confidence":"MEDIUM"},{"id":"REL-004484","type":"located_in","from":"CMP-000334","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004485","type":"offers_equipment","from":"CMP-000335","to":"EQP-A09.08","basis":"source","source_ids":["SRC-000855"],"confidence":"MEDIUM"},{"id":"REL-004486","type":"offers_equipment","from":"CMP-000335","to":"EQP-A08","basis":"source","source_ids":["SRC-000855"],"confidence":"MEDIUM"},{"id":"REL-004487","type":"located_in","from":"CMP-000335","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004488","type":"offers_equipment","from":"CMP-000336","to":"EQP-A09.08","basis":"source","source_ids":["SRC-000856"],"confidence":"MEDIUM"},{"id":"REL-004489","type":"offers_equipment","from":"CMP-000336","to":"EQP-A09.07","basis":"source","source_ids":["SRC-000856"],"confidence":"MEDIUM"},{"id":"REL-004490","type":"located_in","from":"CMP-000336","to":"CTY-DE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004491","type":"offers_equipment","from":"CMP-000337","to":"EQP-A05","basis":"source","source_ids":["SRC-000857"],"confidence":"MEDIUM"},{"id":"REL-004492","type":"offers_equipment","from":"CMP-000337","to":"EQP-A18","basis":"source","source_ids":["SRC-000857"],"confidence":"MEDIUM"},{"id":"REL-004493","type":"offers_equipment","from":"CMP-000337","to":"EQP-D19","basis":"source","source_ids":["SRC-000857"],"confidence":"MEDIUM"},{"id":"REL-004494","type":"located_in","from":"CMP-000337","to":"CTY-DE","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004495","type":"offers_equipment","from":"CMP-000338","to":"EQP-A10","basis":"source","source_ids":["SRC-000858"],"confidence":"MEDIUM"},{"id":"REL-004496","type":"located_in","from":"CMP-000338","to":"CTY-JP","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004497","type":"offers_equipment","from":"CMP-000339","to":"EQP-A41","basis":"source","source_ids":["SRC-000859"],"confidence":"MEDIUM"},{"id":"REL-004498","type":"located_in","from":"CMP-000339","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004499","type":"located_in","from":"CMP-000340","to":"CTY-TW","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004500","type":"offers_equipment","from":"CMP-000341","to":"EQP-A25","basis":"source","source_ids":["SRC-000861"],"confidence":"MEDIUM"},{"id":"REL-004501","type":"located_in","from":"CMP-000341","to":"CTY-DE","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004502","type":"located_in","from":"CMP-000342","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004503","type":"located_in","from":"CMP-000343","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004504","type":"located_in","from":"CMP-000344","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004505","type":"located_in","from":"CMP-000345","to":"CTY-KR","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004506","type":"located_in","from":"CMP-000346","to":"CTY-KR","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004507","type":"located_in","from":"CMP-000347","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004508","type":"located_in","from":"CMP-000348","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004509","type":"located_in","from":"CMP-000349","to":"CTY-GB","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004510","type":"offers_equipment","from":"CMP-000350","to":"EQP-L05","basis":"source","source_ids":["SRC-000891","SRC-000892"],"confidence":"MEDIUM"},{"id":"REL-004511","type":"located_in","from":"CMP-000350","to":"CTY-FR","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004512","type":"offers_equipment","from":"CMP-000351","to":"EQP-L04","basis":"source","source_ids":["SRC-000893"],"confidence":"MEDIUM"},{"id":"REL-004513","type":"located_in","from":"CMP-000351","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004514","type":"located_in","from":"CMP-000352","to":"CTY-JP","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004515","type":"offers_equipment","from":"CMP-000353","to":"EQP-A43","basis":"source","source_ids":["SRC-000895"],"confidence":"MEDIUM"},{"id":"REL-004516","type":"offers_equipment","from":"CMP-000353","to":"EQP-L04","basis":"source","source_ids":["SRC-000895"],"confidence":"MEDIUM"},{"id":"REL-004517","type":"located_in","from":"CMP-000353","to":"CTY-US","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004518","type":"offers_equipment","from":"CMP-000354","to":"EQP-A04","basis":"source","source_ids":["SRC-000896"],"confidence":"MEDIUM"},{"id":"REL-004519","type":"offers_equipment","from":"CMP-000354","to":"EQP-A05","basis":"source","source_ids":["SRC-000896"],"confidence":"MEDIUM"},{"id":"REL-004520","type":"offers_equipment","from":"CMP-000354","to":"EQP-A08.06","basis":"source","source_ids":["SRC-000896"],"confidence":"MEDIUM"},{"id":"REL-004521","type":"located_in","from":"CMP-000354","to":"CTY-KR","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004522","type":"offers_equipment","from":"CMP-000355","to":"EQP-L02","basis":"source","source_ids":["SRC-000897"],"confidence":"MEDIUM"},{"id":"REL-004523","type":"offers_equipment","from":"CMP-000355","to":"EQP-L03","basis":"source","source_ids":["SRC-000897"],"confidence":"MEDIUM"},{"id":"REL-004524","type":"located_in","from":"CMP-000355","to":"CTY-KR","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004525","type":"offers_equipment","from":"CMP-000356","to":"EQP-L02","basis":"source","source_ids":["SRC-000898"],"confidence":"MEDIUM"},{"id":"REL-004526","type":"offers_equipment","from":"CMP-000356","to":"EQP-L03","basis":"source","source_ids":["SRC-000898"],"confidence":"MEDIUM"},{"id":"REL-004527","type":"located_in","from":"CMP-000356","to":"CTY-KR","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004528","type":"offers_equipment","from":"CMP-000357","to":"EQP-K01","basis":"source","source_ids":["SRC-000899"],"confidence":"MEDIUM"},{"id":"REL-004529","type":"offers_equipment","from":"CMP-000357","to":"EQP-A09.10","basis":"source","source_ids":["SRC-000899"],"confidence":"MEDIUM"},{"id":"REL-004530","type":"offers_equipment","from":"CMP-000357","to":"EQP-K03","basis":"source","source_ids":["SRC-000899"],"confidence":"MEDIUM"},{"id":"REL-004531","type":"located_in","from":"CMP-000357","to":"CTY-CN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-004532","type":"offers_equipment","from":"CMP-000358","to":"EQP-A12","basis":"source","source_ids":["SRC-000900"],"confidence":"MEDIUM"},{"id":"REL-004533","type":"offers_equipment","from":"CMP-000358","to":"EQP-A13","basis":"source","source_ids":["SRC-000900"],"confidence":"MEDIUM"},{"id":"REL-004534","type":"offers_equipment","from":"CMP-000358","to":"EQP-A07","basis":"source","source_ids":["SRC-000900"],"confidence":"MEDIUM"},{"id":"REL-004535","type":"located_in","from":"CMP-000358","to":"CTY-US","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004536","type":"located_in","from":"CMP-000359","to":"CTY-CN","basis":"analyst","note":"Search-result summary of a cited source (page not read)","source_ids":[]},{"id":"REL-004537","type":"offers_equipment","from":"CMP-000360","to":"EQP-A01","basis":"source","source_ids":["SRC-000902"],"confidence":"LOW"},{"id":"REL-004538","type":"located_in","from":"CMP-000360","to":"CTY-CN","basis":"analyst","note":"Analyst knowledge — not source-traced","source_ids":[]},{"id":"REL-SP-001","type":"supplies","from":"CMP-000011","to":"CMP-000010","basis":"source","legacy_id":"SR001","source_ids":["SRC-000053","SRC-000054"],"confidence":"HIGH","status":"DOCUMENTED_SUPPLY","detail":{"equipment":"Stealth dicing laser saws (DFL7341/DFL7362)","oem":"DISCO Corporation","subsystem":"Laser Source","component":"SD engine (laser + optics module)","component_class_id":"CMPN-000010","evidence":"Models equipped with SD engine developed by Hamamatsu; comprehensive SD licence"}},{"id":"REL-SP-002","type":"supplies","from":"CMP-000011","to":"CMP-000012","basis":"source","legacy_id":"SR002","source_ids":["SRC-000102"],"confidence":"LOW","status":"DOCUMENTED_SUPPLY","detail":{"equipment":"ML200PLUS laser dicing (legacy)","oem":"Tokyo Seimitsu (ACCRETECH)","subsystem":"Laser Source","component":"SD engine","component_class_id":"CMPN-000010","evidence":"Archived datasheet (Tier 3)"}},{"id":"REL-SP-003","type":"supplies","from":"CMP-000145","to":"CMP-000079","basis":"source","legacy_id":"SR003","source_ids":["SRC-000226"],"confidence":"HIGH","status":"DOCUMENTED_SUPPLY","detail":{"equipment":"Gen 8.6 SLA (OLED)","oem":"AP Systems","subsystem":"Laser Source","component":"PYTHON DPSS laser","component_class_id":"CMPN-000010","evidence":"Coherent success story"}},{"id":"REL-SP-004","type":"integrates","from":"CMP-000077","to":"CMP-000077","basis":"source","legacy_id":"SR004","source_ids":["SRC-000069"],"confidence":"UNVERIFIED","status":"IN_HOUSE","detail":{"equipment":"EO Technics laser markers","oem":"EO Technics","subsystem":"Laser Source","component":"EF20P-QSF Q-switched fiber laser","component_class_id":"CMPN-000010","evidence":"In-house fiber lasers (Tier 4)"}},{"id":"REL-SP-005","type":"integrates","from":"CMP-000145","to":"CMP-000145","basis":"source","legacy_id":"SR005","source_ids":["SRC-000093","SRC-000096"],"confidence":"HIGH","status":"IN_HOUSE","detail":{"equipment":"UVblade / LineBeam / UVtransfer","oem":"Coherent Corp.","subsystem":"Laser Source","component":"308 nm excimer","component_class_id":"CMPN-000010","evidence":"Coherent systems use Coherent excimer sources"}},{"id":"REL-SP-006","type":"distributes","from":"CMP-000147","to":"CMP-000174","basis":"source","legacy_id":"SR006","source_ids":["SRC-000223"],"confidence":"HIGH","status":"DISTRIBUTION","detail":{"equipment":"SHI laser systems business","oem":"Sumitomo Heavy Industries (Mechatronics)","subsystem":"Laser Source","component":"TruFiber / TruPulse nano","component_class_id":"CMPN-000010","evidence":"SHI distributes TRUMPF lasers"}},{"id":"REL-SP-007","type":"distributes","from":"CMP-000146","to":"CMP-000174","basis":"source","legacy_id":"SR007","source_ids":["SRC-000223"],"confidence":"HIGH","status":"DISTRIBUTION","detail":{"equipment":"SHI laser systems business","oem":"Sumitomo Heavy Industries (Mechatronics)","subsystem":"Laser Source","component":"IPG fiber lasers","component_class_id":"CMPN-000010","evidence":"SHI distributes IPG lasers"}},{"id":"REL-SP-013","type":"capable_of_supplying","from":"CMP-000027","to":"CMPN-000014","basis":"source","legacy_id":"SR013","source_ids":["SRC-000327"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"EUV / High-NA scanners","oem":"ASML Holding","subsystem":"Lithography optics","component":"EUV projection optics","component_class_id":"CMPN-000014","evidence":"ZEISS SMT EUV/High-NA optics (title-level; ASML supply not stated in Batch-1 evidence)"}},{"id":"REL-SP-014","type":"integrates","from":"CMP-000045","to":"CMP-000045","basis":"source","legacy_id":"SR014","source_ids":["SRC-000060"],"confidence":"HIGH","status":"IN_HOUSE","detail":{"equipment":"LASER1205","oem":"ASMPT ALSI (Advanced Laser Separation International)","subsystem":"Beam Shaping / DOE","component":"Patented V-shaped DOE","component_class_id":"CMPN-000017","evidence":"Patented V-DOE technology"}},{"id":"REL-SP-015","type":"capable_of_supplying","from":"CMP-000032","to":"CMPN-000011","basis":"source","legacy_id":"SR015","source_ids":["SRC-000348"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"DUV scanners","oem":"ASML Holding","subsystem":"Lithography light source","component":"ArF excimer light source","component_class_id":"CMPN-000011","evidence":"Gigaphoton ArF sources (qualification by ASML reported in older Tier-2 article not captured)"}},{"id":"REL-SP-016","type":"capable_of_supplying","from":"CMP-000133","to":"CMPN-000010","basis":"source","legacy_id":"SR016","source_ids":["SRC-000267","SRC-000268"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Laser Source","component":"Fiber lasers","component_class_id":"CMPN-000010","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-017","type":"capable_of_supplying","from":"CMP-000134","to":"CMPN-000010","basis":"source","legacy_id":"SR017","source_ids":["SRC-000266"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Laser Source","component":"MOPA pulsed fiber laser","component_class_id":"CMPN-000010","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-018","type":"capable_of_supplying","from":"CMP-000135","to":"CMPN-000010","basis":"source","legacy_id":"SR018","source_ids":["SRC-000265"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Laser Source","component":"UV lasers (fs / ps / ns)","component_class_id":"CMPN-000010","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-019","type":"capable_of_supplying","from":"CMP-000145","to":"CMPN-000010","basis":"source","legacy_id":"SR019","source_ids":["SRC-000093","SRC-000094","SRC-000095","SRC-000096","SRC-000159","SRC-000160","SRC-000161","SRC-000162","SRC-000163","SRC-000226"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Laser Source","component":"DPSS laser source PYTHON","component_class_id":"CMPN-000010","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-020","type":"capable_of_supplying","from":"CMP-000146","to":"CMPN-000010","basis":"source","legacy_id":"SR020","source_ids":["SRC-000164","SRC-000269","SRC-000270"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Laser Source","component":"Nanosecond pulsed fiber laser","component_class_id":"CMPN-000010","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-021","type":"capable_of_supplying","from":"CMP-000147","to":"CMPN-000010","basis":"source","legacy_id":"SR021","source_ids":["SRC-000260","SRC-000261","SRC-000223"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Laser Source","component":"Ultrashort-pulse laser TruMicro Series 2000 / TruMicro Mark","component_class_id":"CMPN-000010","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-022","type":"capable_of_supplying","from":"CMP-000148","to":"CMPN-000010","basis":"source","legacy_id":"SR022","source_ids":["SRC-000230","SRC-000247","SRC-000262","SRC-000263"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Laser Source","component":"Picosecond laser IceFyre (UV / GR50 green)","component_class_id":"CMPN-000010","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-023","type":"capable_of_supplying","from":"CMP-000149","to":"CMPN-000010","basis":"source","legacy_id":"SR023","source_ids":["SRC-000259"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Laser Source","component":"Femtosecond laser PHAROS","component_class_id":"CMPN-000010","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-024","type":"capable_of_supplying","from":"CMP-000150","to":"CMPN-000010","basis":"source","legacy_id":"SR024","source_ids":["SRC-000264"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Laser Source","component":"Femtosecond laser Satsuma X","component_class_id":"CMPN-000010","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-025","type":"capable_of_supplying","from":"CMP-000151","to":"CMPN-000010","basis":"source","legacy_id":"SR025","source_ids":["SRC-000254","SRC-000255","SRC-INT1"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Laser Source","component":"Laser Source","component_class_id":"CMPN-000010","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-026","type":"capable_of_supplying","from":"CMP-000178","to":"CMPN-000010","basis":"source","legacy_id":"SR026","source_ids":["SRC-000166"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Laser Source","component":"Laser Source","component_class_id":"CMPN-000010","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-027","type":"capable_of_supplying","from":"CMP-000136","to":"CMPN-000016","basis":"source","legacy_id":"SR027","source_ids":["SRC-000257","SRC-000258"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Galvo","component":"Galvo scanners","component_class_id":"CMPN-000016","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-028","type":"capable_of_supplying","from":"CMP-000146","to":"CMPN-000016","basis":"source","legacy_id":"SR028","source_ids":["SRC-000164","SRC-000269","SRC-000270"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Galvo","component":"UV laser marking module (integrated source + scan head)","component_class_id":"CMPN-000016","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-029","type":"capable_of_supplying","from":"CMP-000151","to":"CMPN-000016","basis":"source","legacy_id":"SR029","source_ids":["SRC-000254","SRC-000255","SRC-INT1"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Galvo","component":"Galvanometer scanners 62xxK / 83xxK series","component_class_id":"CMPN-000016","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-030","type":"capable_of_supplying","from":"CMP-000152","to":"CMPN-000016","basis":"source","legacy_id":"SR030","source_ids":["SRC-000251","SRC-000252","SRC-000253"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Galvo","component":"Scan heads (micromachining, multi-head)","component_class_id":"CMPN-000016","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-031","type":"capable_of_supplying","from":"CMP-000153","to":"CMPN-000016","basis":"source","legacy_id":"SR031","source_ids":["SRC-000256"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Galvo","component":"2-axis deflection units","component_class_id":"CMPN-000016","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-032","type":"capable_of_supplying","from":"CMP-000158","to":"CMPN-000004","basis":"source","legacy_id":"SR032","source_ids":["SRC-000271","SRC-000272"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Motion Stage","component":"Precision stages for wafer dicing / inspection","component_class_id":"CMPN-000004","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-033","type":"capable_of_supplying","from":"CMP-000159","to":"CMPN-000004","basis":"source","legacy_id":"SR033","source_ids":["SRC-000273","SRC-000274"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Motion Stage","component":"Air-bearing linear stage A-110 PIglide LC","component_class_id":"CMPN-000004","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-034","type":"capable_of_supplying","from":"CMP-000161","to":"CMPN-000004","basis":"source","legacy_id":"SR034","source_ids":["SRC-000276"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Motion Stage","component":"Motion Stage","component_class_id":"CMPN-000004","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-035","type":"capable_of_supplying","from":"CMP-000158","to":"CMPN-000003","basis":"source","legacy_id":"SR035","source_ids":["SRC-000271","SRC-000272"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Linear Motor","component":"Linear Motor","component_class_id":"CMPN-000003","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-036","type":"capable_of_supplying","from":"CMP-000161","to":"CMPN-000003","basis":"source","legacy_id":"SR036","source_ids":["SRC-000276"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Linear Motor","component":"Linear axis / linear motors TBS linear axis; IL+ motors","component_class_id":"CMPN-000003","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-037","type":"capable_of_supplying","from":"CMP-000162","to":"CMPN-000006","basis":"source","legacy_id":"SR037","source_ids":["SRC-000277"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Encoder","component":"Interferometric laser encoders RLE","component_class_id":"CMPN-000006","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-038","type":"capable_of_supplying","from":"CMP-000154","to":"CMPN-000015","basis":"source","legacy_id":"SR038","source_ids":["SRC-000282"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"F-theta Lens","component":"F-theta lenses & beam expanders","component_class_id":"CMPN-000015","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-039","type":"capable_of_supplying","from":"CMP-000155","to":"CMPN-000015","basis":"source","legacy_id":"SR039","source_ids":["SRC-000283"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"F-theta Lens","component":"F-theta scan lenses Ronar-Smith","component_class_id":"CMPN-000015","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-040","type":"capable_of_supplying","from":"CMP-000154","to":"CMPN-000012","basis":"source","legacy_id":"SR040","source_ids":["SRC-000282"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Beam Expander","component":"Beam Expander","component_class_id":"CMPN-000012","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-041","type":"capable_of_supplying","from":"CMP-000157","to":"CMPN-000018","basis":"source","legacy_id":"SR041","source_ids":["SRC-000292"],"confidence":"LOW","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"AOM","component":"Acousto-optic modulators","component_class_id":"CMPN-000018","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-042","type":"capable_of_supplying","from":"CMP-000137","to":"CMPN-000022","basis":"source","legacy_id":"SR042","source_ids":["SRC-000281"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Camera","component":"Industrial cameras & vision","component_class_id":"CMPN-000022","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-043","type":"capable_of_supplying","from":"CMP-000163","to":"CMPN-000022","basis":"source","legacy_id":"SR043","source_ids":["SRC-000278","SRC-000279"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Camera","component":"Wafer ID reader In-Sight 1740","component_class_id":"CMPN-000022","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-044","type":"capable_of_supplying","from":"CMP-000164","to":"CMPN-000022","basis":"source","legacy_id":"SR044","source_ids":["SRC-000280"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Camera","component":"Industrial cameras","component_class_id":"CMPN-000022","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-045","type":"capable_of_supplying","from":"CMP-000165","to":"CMPN-000022","basis":"source","legacy_id":"SR045","source_ids":["SRC-INT1"],"confidence":"LOW","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Camera","component":"Camera","component_class_id":"CMPN-000022","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-046","type":"capable_of_supplying","from":"CMP-000137","to":"CMPN-000051","basis":"source","legacy_id":"SR046","source_ids":["SRC-000281"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Vision Controller","component":"Vision Controller","component_class_id":"CMPN-000051","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-047","type":"capable_of_supplying","from":"CMP-000163","to":"CMPN-000051","basis":"source","legacy_id":"SR047","source_ids":["SRC-000278","SRC-000279"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Vision Controller","component":"Vision Controller","component_class_id":"CMPN-000051","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-050","type":"capable_of_supplying","from":"CMP-000160","to":"CMPN-000002","basis":"source","legacy_id":"SR050","source_ids":["SRC-000274","SRC-000275"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Servo Drive","component":"Motion controllers & drives","component_class_id":"CMPN-000002","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-052","type":"capable_of_supplying","from":"CMP-000168","to":"CMPN-000025","basis":"source","legacy_id":"SR052","source_ids":["SRC-000286","SRC-000287"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Vacuum System","component":"Vacuum System","component_class_id":"CMPN-000025","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-053","type":"capable_of_supplying","from":"CMP-000169","to":"CMPN-000025","basis":"source","legacy_id":"SR053","source_ids":["SRC-000288","SRC-000289"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Vacuum System","component":"Vacuum System","component_class_id":"CMPN-000025","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-054","type":"capable_of_supplying","from":"CMP-000138","to":"CMPN-000038","basis":"source","legacy_id":"SR054","source_ids":["SRC-000284"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Chiller","component":"Industrial chillers","component_class_id":"CMPN-000038","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-055","type":"capable_of_supplying","from":"CMP-000166","to":"CMPN-000046","basis":"source","legacy_id":"SR055","source_ids":["SRC-000285"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Fume Extraction","component":"Laser fume extraction","component_class_id":"CMPN-000046","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-058","type":"capable_of_supplying","from":"CMP-000151","to":"CMPN-000055","basis":"source","legacy_id":"SR058","source_ids":["SRC-000254","SRC-000255","SRC-INT1"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Software","component":"Scan controller ScanMaster Controller","component_class_id":"CMPN-000055","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-059","type":"capable_of_supplying","from":"CMP-000152","to":"CMPN-000017","basis":"source","legacy_id":"SR059","source_ids":["SRC-000251","SRC-000252","SRC-000253"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Beam Shaping / DOE","component":"Diffractive optical elements","component_class_id":"CMPN-000017","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-060","type":"capable_of_supplying","from":"CMP-000156","to":"CMPN-000017","basis":"source","legacy_id":"SR060","source_ids":["SRC-000293"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Beam Shaping / DOE","component":"Diffractive beam shapers","component_class_id":"CMPN-000017","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-062","type":"capable_of_supplying","from":"CMP-000062","to":"CMPN-000050","basis":"source","legacy_id":"SR062","source_ids":["SRC-000214"],"confidence":"LOW","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Wafer Handling / EFEM","component":"Wafer Handling / EFEM","component_class_id":"CMPN-000050","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-063","type":"capable_of_supplying","from":"CMP-000063","to":"CMPN-000050","basis":"source","legacy_id":"SR063","source_ids":["SRC-000294","SRC-000295"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Wafer Handling / EFEM","component":"Wafer Handling / EFEM","component_class_id":"CMPN-000050","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-064","type":"capable_of_supplying","from":"CMP-000064","to":"CMPN-000050","basis":"source","legacy_id":"SR064","source_ids":["SRC-000296","SRC-000297"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Wafer Handling / EFEM","component":"Wafer Handling / EFEM","component_class_id":"CMPN-000050","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-065","type":"capable_of_supplying","from":"CMP-000144","to":"CMPN-000050","basis":"source","legacy_id":"SR065","source_ids":["SRC-000229","SRC-000246"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Wafer Handling / EFEM","component":"Wafer Handling / EFEM","component_class_id":"CMPN-000050","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-SP-066","type":"capable_of_supplying","from":"CMP-000194","to":"CMPN-000050","basis":"source","legacy_id":"SR066","source_ids":["SRC-000037","SRC-000207"],"confidence":"HIGH","status":"CAPABLE_SUPPLIER","detail":{"equipment":"Laser dicing system (reference BOM, Part 7)","oem":"Generic (category-level)","subsystem":"Wafer Handling / EFEM","component":"Wafer Handling / EFEM","component_class_id":"CMPN-000050","evidence":"Company documented to supply this component class (no supply to a named OEM)"}},{"id":"REL-CR-001","type":"supplies_equipment_to","from":"CMP-000001","to":"FAB-000005","basis":"source","legacy_id":"CR001","status":"CONFIRMED","confidence":"HIGH","source_ids":["SRC-000133"],"date":"2025-09-03","detail":{"customer":"SK hynix","model_id":"MDL-000093","product":"High-NA EUV scanner TWINSCAN EXE:5200B","site":"M16 fab","location":"Icheon, South Korea","process_step":"PS02","application":"DRAM mass production","stage":"Installed","evidence":"Industry's first High NA EUV system for mass production assembled at M16"}},{"id":"REL-CR-002","type":"supplies_equipment_to","from":"CMP-000001","to":"FAB-000023","basis":"source","legacy_id":"CR002","status":"CONFIRMED","confidence":"HIGH","source_ids":["SRC-000190"],"date":"2024-12","detail":{"customer":"Rapidus","model_id":"MDL-000094","product":"EUV scanner NXE:3800E","site":"IIM-1","location":"Hokkaido, Japan","process_step":"PS02","application":"Leading-edge logic","stage":"Installed","evidence":"NXE:3800E installed December 2024"}},{"id":"REL-CR-003","type":"supplies_equipment_to","from":"CMP-000001","to":"FAB-000019","basis":"source","legacy_id":"CR003","status":"CONFIRMED","confidence":"HIGH","source_ids":["SRC-000024","SRC-000023","SRC-000026"],"date":"2026-05","detail":{"customer":"Tata Electronics","model_id":null,"product":null,"site":"Dholera fab","location":"Dholera, India","process_step":"PS02","application":"28-110 nm foundry","stage":"Agreement (MoU) - tools not yet installed","evidence":"Strategic partnership to deploy ASML lithography tools"}},{"id":"REL-CR-004","type":"supplies_equipment_to","from":"CMP-000004","to":"FAB-000019","basis":"source","legacy_id":"CR004","status":"CONFIRMED","confidence":"HIGH","source_ids":["SRC-000025","SRC-000023"],"date":"2024-09-10","detail":{"customer":"Tata Electronics","model_id":null,"product":null,"site":"Fab + OSAT","location":"Dholera & Jagiroad, India","process_step":"PS01","application":"Fab and OSAT","stage":"Agreement (MoU) - tools not yet installed","evidence":"Strategic equipment partnership / MoU"}},{"id":"REL-CR-005","type":"supplies_equipment_to","from":"CMP-000047","to":"FAB-000005","basis":"source","legacy_id":"CR005","status":"CONFIRMED","confidence":"MEDIUM","source_ids":["SRC-000041","SRC-000042","SRC-000045"],"date":"2026-06-10","detail":{"customer":"SK hynix","model_id":"MDL-000079","product":"HBM TC bonder TC Bonder 4.5 Griffin","site":"Cheongju P&T","location":"Cheongju, South Korea","process_step":"PS15","application":"HBM4 stacking","stage":"Order (KRW 44.2B)","evidence":"44.2 billion won contract to supply TC Bonder 4.5 Griffin (regulatory filing cited)"}},{"id":"REL-CR-006","type":"supplies_equipment_to","from":"CMP-000047","to":"FAB-000005","basis":"source","legacy_id":"CR006","status":"CONFIRMED","confidence":"LOW","source_ids":["SRC-000041"],"date":"2026-01","detail":{"customer":"SK hynix","model_id":"MDL-000079","product":"HBM TC bonder TC Bonder 4.5 Griffin","site":null,"location":"South Korea","process_step":"PS15","application":"HBM","stage":"Order (KRW 9.6B)","evidence":"Prior KRW 9.6B deal January 2026"}},{"id":"REL-CR-007","type":"supplies_equipment_to","from":"CMP-000047","to":"FAB-000004","basis":"source","legacy_id":"CR007","status":"CONFIRMED","confidence":"LOW","source_ids":["SRC-000044"],"date":"2024-04","detail":{"customer":"Micron Technology","model_id":null,"product":null,"site":null,"location":null,"process_step":"PS15","application":"HBM","stage":"Order (KRW 22.6B)","evidence":"Agreed 22.6 billion won deal with Micron to supply TC bonders"}},{"id":"REL-CR-008","type":"supplies_equipment_to","from":"CMP-000048","to":"FAB-000005","basis":"source","legacy_id":"CR008","status":"PROBABLE","confidence":"LOW","source_ids":["SRC-000043"],"date":"2025-05-20","detail":{"customer":"SK hynix","model_id":"MDL-000080","product":"TC bonder","site":null,"location":"South Korea","process_step":"PS15","application":"HBM","stage":"Order (reported)","evidence":"SK hynix placed TCB orders with Hanwha Semitech and Hanmi (no filing cited)"}},{"id":"REL-CR-009","type":"supplies_equipment_to","from":"CMP-000048","to":"FAB-000005","basis":"source","legacy_id":"CR009","status":"UNVERIFIED","confidence":"LOW","source_ids":["SRC-000040","SRC-000048"],"date":"2026-09","detail":{"customer":"SK hynix","model_id":"MDL-000081","product":"Hybrid bonder","site":null,"location":"South Korea","process_step":"PS15","application":"HBM hybrid bonding","stage":"Evaluation (reported)","evidence":"Hanwha hybrid bonding tool into SK hynix for evaluation (Tier 3/4)"}},{"id":"REL-CR-010","type":"supplies_equipment_to","from":"CMP-000067","to":"FAB-000002","basis":"source","legacy_id":"CR010","status":"UNVERIFIED","confidence":"UNVERIFIED","source_ids":["SRC-000048"],"date":"2026-09","detail":{"customer":"Samsung Electronics","model_id":null,"product":null,"site":null,"location":"South Korea","process_step":"PS15","application":"Hybrid bonding","stage":"Evaluation (reported)","evidence":"SEMES tool went into Samsung (Tier 4)"}},{"id":"REL-CR-011","type":"supplies_equipment_to","from":"CMP-000013","to":"FAB-000024","basis":"source","legacy_id":"CR011","status":"CONFIRMED","confidence":"HIGH","source_ids":["SRC-000192","SRC-000193"],"date":"2024-10-01","detail":{"customer":"Texas Institute for Electronics","model_id":"MDL-000097","product":"Nanoimprint lithography FPA-1200NZ2C","site":null,"location":"Texas, US","process_step":"PS02","application":"NIL R&D/production","stage":"Shipped","evidence":"Shipped FPA-1200NZ2C"}},{"id":"REL-CR-012","type":"supplies_equipment_to","from":"CMP-000014","to":"CUS-000900","basis":"source","legacy_id":"CR012","status":"CONFIRMED","confidence":"MEDIUM","source_ids":["SRC-000088"],"date":"2024-05-07","detail":{"customer":"Undisclosed leading-edge semiconductor company (2 nm GAA HVM)","model_id":"MDL-000056","product":"Laser spike anneal LSA201","site":null,"location":null,"process_step":"PSX1","application":"2 nm GAA logic","stage":"Order (multi-system)","evidence":"Order includes LSA201 and NSA500"}},{"id":"REL-CR-013","type":"supplies_equipment_to","from":"CMP-000016","to":"CUS-000900","basis":"source","legacy_id":"CR013","status":"CONFIRMED","confidence":"HIGH","source_ids":["SRC-000154"],"date":"2026-02-19","detail":{"customer":"Undisclosed HBM manufacturer","model_id":"MDL-000112","product":"HBM process control Dragonfly","site":null,"location":null,"process_step":"PS08","application":"HBM process control","stage":"Volume purchase agreement >$240M","evidence":"HBM VPA"}},{"id":"REL-CR-014","type":"supplies_equipment_to","from":"CMP-000002","to":"CUS-000900","basis":"source","legacy_id":"CR014","status":"UNVERIFIED","confidence":"UNVERIFIED","source_ids":["SRC-000048"],"date":"2026-09","detail":{"customer":"Undisclosed leading logic customer (6 AMAT-Besi lines)","model_id":"MDL-000082","product":"Die-to-wafer hybrid bonding system Kinex (with BESI)","site":null,"location":null,"process_step":"PS15","application":"Hybrid bonding","stage":"Reported","evidence":"Tier-4 claim only"}},{"id":"REL-CR-015","type":"supplies_equipment_to","from":"CMP-000141","to":"CUS-000900","basis":"source","legacy_id":"CR015","status":"CONFIRMED","confidence":"LOW","source_ids":["SRC-000073"],"date":"2016-07-06","detail":{"customer":"Undisclosed major industrial high-power diode manufacturer","model_id":"MDL-000027","product":"Wafer dicing system (TLS) microDICE","site":null,"location":null,"process_step":"PS13","application":"High-power diodes","stage":"Volume production adoption","evidence":"microDICE adopted for volume production"}},{"id":"REL-CR-016","type":"supplies_equipment_to","from":"CMP-000078","to":"CUS-000900","basis":"source","legacy_id":"CR016","status":"CONFIRMED","confidence":"LOW","source_ids":["SRC-000115"],"date":"2024-05","detail":{"customer":"Undisclosed chipmaker (glass substrate trial line)","model_id":null,"product":null,"site":null,"location":null,"process_step":"PSX5","application":"Glass core substrate","stage":"Supplied","evidence":"Supplied laser equipment to a chipmaker's trial line"}},{"id":"REL-CR-017","type":"supplies_equipment_to","from":"CMP-000078","to":"CUS-000900","basis":"source","legacy_id":"CR017","status":"CONFIRMED","confidence":"LOW","source_ids":["SRC-000117"],"date":"2026-09-29","detail":{"customer":"Undisclosed new global customer","model_id":"MDL-000050","product":"TGV equipment for glass substrates","site":null,"location":null,"process_step":"PSX5","application":"TGV for 2 mm glass, 510x515 mm panels","stage":"Order","evidence":"Wins order for TGV equipment"}},{"id":"REL-CR-018","type":"supplies_equipment_to","from":"CMP-000078","to":"FAB-000026","basis":"source","legacy_id":"CR018","status":"UNVERIFIED","confidence":"UNVERIFIED","source_ids":["SRC-000120"],"date":"2026-04","detail":{"customer":"Absolics / Samsung","model_id":null,"product":null,"site":null,"location":null,"process_step":"PSX5","application":"Glass substrate","stage":"Claimed","evidence":"Tier-4 mapping claim"}},{"id":"REL-CR-019","type":"supplies_equipment_to","from":"CMP-000143","to":"CUS-000031","basis":"source","legacy_id":"CR019","status":"UNVERIFIED","confidence":"UNVERIFIED","source_ids":["SRC-000120"],"date":"2026-04","detail":{"customer":"Chemtronics / Intel","model_id":null,"product":null,"site":null,"location":null,"process_step":"PSX5","application":"Glass substrate","stage":"Claimed","evidence":"Tier-4 mapping claim"}},{"id":"REL-CR-020","type":"supplies_equipment_to","from":"CMP-000110","to":"FAB-000008","basis":"source","legacy_id":"CR020","status":"PROBABLE","confidence":"LOW","source_ids":["SRC-000183"],"date":"2025-10-21","detail":{"customer":"SMIC","model_id":null,"product":null,"site":null,"location":"China","process_step":"PS02","application":"28 nm DUV","stage":"Testing (reported)","evidence":"Yuliangsheng 28 nm DUV testing at SMIC per SCMP/FT"}},{"id":"REL-CR-021","type":"supplies_equipment_to","from":"CMP-000107","to":"CUS-000900","basis":"source","legacy_id":"CR021","status":"CONFIRMED","confidence":"LOW","source_ids":["SRC-000187"],"date":"2026-08","detail":{"customer":"Undisclosed government-procurement buyer","model_id":null,"product":null,"site":null,"location":"China","process_step":"PS02","application":"KrF 110 nm","stage":"Contract (RMB 110M)","evidence":"SMEE KrF 110 nm contract"}},{"id":"REL-CR-022","type":"supplies_equipment_to","from":"CMP-000070","to":"CUS-000900","basis":"source","legacy_id":"CR022","status":"PROBABLE","confidence":"LOW","source_ids":["SRC-000175"],"date":"2026-06-11","detail":{"customer":"Undisclosed global chipmaker","model_id":"MDL-000107","product":"Atomic layer growth ALG","site":null,"location":null,"process_step":"PS05","application":"ALG","stage":"Supplied (reported)","evidence":"Known to have recently supplied next-generation ALG equipment"}},{"id":"REL-CR-023","type":"supplies_equipment_to","from":"CMP-000047","to":"FAB-000002","basis":"source","legacy_id":"CR023","status":"UNVERIFIED","confidence":"LOW","source_ids":["SRC-000043"],"date":"2025-05-20","detail":{"customer":"Samsung Electronics","model_id":null,"product":null,"site":null,"location":null,"process_step":"PS15","application":"HBM TCB","stage":"Talks (headline)","evidence":"Headline: Hanmi exclusive talks with Samsung (article not read)"}},{"id":"REL-CR-025","type":"supplies_equipment_to","from":"CMP-000080","to":"OSAT-000015","basis":"source","legacy_id":"CR025","status":"PROBABLE","confidence":"LOW","source_ids":["SRC-000177"],"date":"2026-04-08","detail":{"customer":"ASE Technology; TSMC","model_id":null,"product":null,"site":null,"location":"Taiwan","process_step":"PS07","application":"Wet process","stage":"Customer (reported)","evidence":"Two firms count ASE and TSMC among major customers"}},{"id":"REL-CR-026","type":"supplies_equipment_to","from":"CMP-000081","to":"OSAT-000015","basis":"source","legacy_id":"CR026","status":"PROBABLE","confidence":"LOW","source_ids":["SRC-000177"],"date":"2026-04-08","detail":{"customer":"ASE Technology; TSMC","model_id":null,"product":null,"site":null,"location":"Taiwan","process_step":"PS07","application":"Wet process","stage":"Customer (reported)","evidence":"Two firms count ASE and TSMC among major customers"}},{"id":"REL-CR-027","type":"supplies_equipment_to","from":"CMP-000082","to":"FAB-000001","basis":"source","legacy_id":"CR027","status":"PROBABLE","confidence":"LOW","source_ids":["SRC-000177"],"date":"2026-04-08","detail":{"customer":"TSMC","model_id":null,"product":null,"site":null,"location":"Taiwan","process_step":"PS14","application":"Dispensing / wafer-level","stage":"Supplier (reported)","evidence":"All Ring supplies precision dispensing systems and wafer-level equipment"}},{"id":"REL-CR-028","type":"supplies_equipment_to","from":"CMP-000090","to":"FAB-000001","basis":"source","legacy_id":"CR028","status":"PROBABLE","confidence":"LOW","source_ids":["SRC-000178"],"date":"2025-03-06","detail":{"customer":"TSMC (US)","model_id":null,"product":null,"site":null,"location":"United States","process_step":"PSX4","application":"Fab facility","stage":"Revenue share (broker report)","evidence":"UIS derived 50-60% of revenue from TSMC (per Yuanta via Taipei Times)"}},{"id":"REL-CR-029","type":"supplies_equipment_to","from":"CMP-000089","to":"FAB-000001","basis":"source","legacy_id":"CR029","status":"PROBABLE","confidence":"LOW","source_ids":["SRC-000178"],"date":"2025-03-06","detail":{"customer":"TSMC (US)","model_id":null,"product":null,"site":null,"location":"United States","process_step":"PSX4","application":"Fab facility","stage":"Revenue share (broker report)","evidence":"Marketech derived 20-30% of revenue from TSMC (per Yuanta via Taipei Times)"}},{"id":"REL-CR-030","type":"supplies_equipment_to","from":"CMP-000079","to":"FAB-000025","basis":"source","legacy_id":"CR030","status":"PROBABLE","confidence":"LOW","source_ids":["SRC-000227"],"date":"2025-11-21","detail":{"customer":"Visionox","model_id":"MDL-000053","product":"Excimer laser annealing (ELA) / LLO Gen 8.6","site":"V5 Gen 8.6","location":"Hefei, China","process_step":"PSX6","application":"OLED ELA + LLO","stage":"Sole ELA supplier (reported)","evidence":"AP Systems sole supplier of ELA, also LLO"}},{"id":"REL-CR-031","type":"supplies_equipment_to","from":"CMP-000196","to":"FAB-000019","basis":"source","legacy_id":"CR031","status":"CONFIRMED","confidence":"LOW","source_ids":["SRC-000212"],"date":"2026-09-23","detail":{"customer":"Tata Electronics","model_id":null,"product":null,"site":"Dholera fab","location":"Dholera, India","process_step":"PSX4","application":"UHP piping orbital welding","stage":"Order (value undisclosed)","evidence":"First orbital welding order for Tata Dholera fab (company statement)"}},{"id":"REL-CR-032","type":"supplies_equipment_to","from":"CMP-000199","to":"OSAT-000022","basis":"source","legacy_id":"CR032","status":"UNVERIFIED","confidence":"UNVERIFIED","source_ids":["SRC-000205"],"date":"2026","detail":{"customer":"Micron India; Kaynes Semicon","model_id":null,"product":null,"site":"ATMP/OSAT","location":"Sanand, India","process_step":"PSX4","application":"Specialty gases","stage":"Supplier (tracker)","evidence":"Linde India Sanand specialty-gas facility (Tier 4)"}},{"id":"REL-CR-033","type":"supplies_equipment_to","from":"CMP-000040","to":"CUS-000900","basis":"source","legacy_id":"CR033","status":"CONFIRMED","confidence":"HIGH","source_ids":["SRC-000242"],"date":"2026-08","detail":{"customer":"Undisclosed AI-processor customer","model_id":"MDL-000090","product":"Wafer-level burn-in FOX-XP / FOX-NP / FOX-CP","site":null,"location":null,"process_step":"PS16","application":"AI processor wafer-level burn-in","stage":"Order ($22M follow-on)","evidence":"Follow-on order"}},{"id":"REL-CR-034","type":"supplies_equipment_to","from":"CMP-000003","to":"FAB-000004","basis":"source","legacy_id":"CR034","status":"CONFIRMED","confidence":"HIGH","source_ids":["SRC-000136"],"date":"2026-08","detail":{"customer":"Micron Technology","model_id":null,"product":null,"site":null,"location":null,"process_step":"PS04","application":"Etch/deposition","stage":"Most significant customer FY24-FY26","evidence":"10-K: most significant customers included Micron, Samsung, SK hynix, TSMC"}},{"id":"REL-CR-035","type":"supplies_equipment_to","from":"CMP-000003","to":"FAB-000002","basis":"source","legacy_id":"CR035","status":"CONFIRMED","confidence":"HIGH","source_ids":["SRC-000136"],"date":"2026-08","detail":{"customer":"Samsung Electronics","model_id":null,"product":null,"site":null,"location":null,"process_step":"PS04","application":"Etch/deposition","stage":"Most significant customer FY24-FY26","evidence":"10-K significant-customer disclosure"}},{"id":"REL-CR-036","type":"supplies_equipment_to","from":"CMP-000003","to":"FAB-000005","basis":"source","legacy_id":"CR036","status":"CONFIRMED","confidence":"HIGH","source_ids":["SRC-000136"],"date":"2026-08","detail":{"customer":"SK hynix","model_id":null,"product":null,"site":null,"location":null,"process_step":"PS04","application":"Etch/deposition","stage":"Most significant customer FY24-FY26","evidence":"10-K significant-customer disclosure"}},{"id":"REL-CR-037","type":"supplies_equipment_to","from":"CMP-000003","to":"FAB-000001","basis":"source","legacy_id":"CR037","status":"CONFIRMED","confidence":"HIGH","source_ids":["SRC-000136"],"date":"2026-08","detail":{"customer":"TSMC","model_id":null,"product":null,"site":null,"location":null,"process_step":"PS04","application":"Etch/deposition","stage":"Most significant customer FY24-FY26","evidence":"10-K significant-customer disclosure"}},{"id":"REL-CR-038","type":"supplies_equipment_to","from":"CMP-000005","to":"FAB-000001","basis":"source","legacy_id":"CR038","status":"CONFIRMED","confidence":"HIGH","source_ids":["SRC-000141"],"date":"2026-09","detail":{"customer":"TSMC","model_id":null,"product":null,"site":null,"location":null,"process_step":"PS09","application":"Process control","stage":">10% of revenue FY24-FY26","evidence":"Annual report 10% customer disclosure"}},{"id":"REL-CR-039","type":"supplies_equipment_to","from":"CMP-000002","to":"CUS-000900","basis":"source","legacy_id":"CR039","status":"CONFIRMED","confidence":"HIGH","source_ids":["SRC-000139"],"date":"2026-01","detail":{"customer":"Two undisclosed customers (19% and 15% of FY2025 revenue)","model_id":null,"product":null,"site":null,"location":null,"process_step":"PS05","application":"WFE","stage":">10% customers","evidence":"Two customers accounted for approximately 19% and 15% of net revenue"}},{"id":"REL-CR-040","type":"supplies_equipment_to","from":"CMP-000038","to":"FAB-000005","basis":"source","legacy_id":"CR040","status":"CONFIRMED","confidence":"LOW","source_ids":["SRC-000302"],"date":"2026-06-17","detail":{"customer":"SK hynix","model_id":"MDL-000092","product":"HBM Cube Prober Cube Prober","site":null,"location":"South Korea","process_step":"PS12","application":"HBM die test","stage":"Initial supply order after qualification","evidence":"We have secured the initial supply order (company quote)"}},{"id":"REL-CR-041","type":"supplies_equipment_to","from":"CMP-000038","to":"FAB-000002","basis":"source","legacy_id":"CR041","status":"PROBABLE","confidence":"LOW","source_ids":["SRC-000302"],"date":"2026-06-17","detail":{"customer":"Samsung Electronics","model_id":"MDL-000092","product":"HBM Cube Prober Cube Prober","site":null,"location":"South Korea","process_step":"PS12","application":"HBM die test","stage":"Receiving systems (reported)","evidence":"Samsung already receiving Cube Prober systems"}},{"id":"REL-CR-042","type":"supplies_equipment_to","from":"CMP-000038","to":"FAB-000004","basis":"source","legacy_id":"CR042","status":"PROBABLE","confidence":"LOW","source_ids":["SRC-000302"],"date":"2026-06-17","detail":{"customer":"Micron Technology","model_id":"MDL-000092","product":"HBM Cube Prober Cube Prober","site":null,"location":null,"process_step":"PS12","application":"HBM die test","stage":"Qualification units delivered","evidence":"Evaluation underway"}},{"id":"REL-CR-043","type":"supplies_equipment_to","from":"CMP-000057","to":"FAB-000001","basis":"source","legacy_id":"CR043","status":"UNVERIFIED","confidence":"LOW","source_ids":["SRC-000228"],"date":"2023","detail":{"customer":"TSMC; Apple","model_id":"MDL-000054","product":"Laser-assisted bonder","site":null,"location":null,"process_step":"PS15","application":"Laser-assisted bonding","stage":"Interest only","evidence":"Interest reported after exclusivity expiry"}},{"id":"REL-CR-044","type":"supplies_equipment_to","from":"CMP-000032","to":"CUS-000900","basis":"source","legacy_id":"CR044","status":"CONFIRMED","confidence":"HIGH","source_ids":["SRC-000326"],"date":"2024-11-07","detail":{"customer":"Undisclosed US customer (micro-via) and Japanese company (advanced packaging)","model_id":"MDL-000072","product":"Excimer laser for micro-via processing","site":null,"location":"US; Japan","process_step":"PSX5","application":"Micro-via / advanced packaging","stage":"Delivered / installed","evidence":"Company releases"}},{"id":"REL-CR-045","type":"supplies_equipment_to","from":"CMP-000016","to":"FAB-000030","basis":"source","legacy_id":"CR045","status":"CONFIRMED","confidence":"HIGH","source_ids":["SRC-000081"],"date":"2025-04","detail":{"customer":"LPKF Vitrion","model_id":"MDL-000110","product":"Panel-level lithography Firefly","site":"Vitrion cleanroom","location":"Germany","process_step":"PS02","application":"Glass substrate lithography","stage":"Installed","evidence":"Installing Firefly into the Vitrion cleanroom"}},{"id":"REL-CR-046","type":"supplies_equipment_to","from":"CMP-000081","to":"FAB-000001","basis":"source","legacy_id":"CR046","status":"PROBABLE","confidence":"LOW","source_ids":["SRC-000179"],"date":"2026-06-16","detail":{"customer":"TSMC","model_id":null,"product":null,"site":"CoPoS pilot line","location":"Taiwan","process_step":"PS07","application":"Chip-on-panel-on-substrate","stage":"Evaluation (dual-track)","evidence":"Wet process track vs AMAT/TEL/SCREEN"}},{"id":"REL-CR-047","type":"supplies_equipment_to","from":"CMP-000080","to":"FAB-000001","basis":"source","legacy_id":"CR047","status":"PROBABLE","confidence":"LOW","source_ids":["SRC-000179"],"date":"2026-06-16","detail":{"customer":"TSMC","model_id":null,"product":null,"site":"CoPoS pilot line","location":"Taiwan","process_step":"PS07","application":"Chip-on-panel-on-substrate","stage":"Evaluation (dual-track)","evidence":"Wet process track vs AMAT/TEL/SCREEN"}},{"id":"REL-CR-048","type":"supplies_equipment_to","from":"CMP-000087","to":"FAB-000001","basis":"source","legacy_id":"CR048","status":"PROBABLE","confidence":"LOW","source_ids":["SRC-000179"],"date":"2026-06-16","detail":{"customer":"TSMC","model_id":null,"product":null,"site":"CoPoS pilot line","location":"Taiwan","process_step":"PS09","application":"Chip-on-panel-on-substrate","stage":"Evaluation (dual-track)","evidence":"Inspection track vs KLA/Camtek"}},{"id":"REL-CR-049","type":"supplies_equipment_to","from":"CMP-000088","to":"FAB-000001","basis":"source","legacy_id":"CR049","status":"PROBABLE","confidence":"LOW","source_ids":["SRC-000179"],"date":"2026-06-16","detail":{"customer":"TSMC","model_id":null,"product":null,"site":"CoPoS pilot line","location":"Taiwan","process_step":"PS09","application":"Chip-on-panel-on-substrate","stage":"Evaluation (dual-track)","evidence":"Inspection track vs KLA/Camtek"}},{"id":"REL-CR-050","type":"supplies_equipment_to","from":"CMP-000083","to":"FAB-000001","basis":"source","legacy_id":"CR050","status":"PROBABLE","confidence":"LOW","source_ids":["SRC-000179"],"date":"2026-06-16","detail":{"customer":"TSMC","model_id":null,"product":null,"site":"CoPoS pilot line","location":"Taiwan","process_step":"PS09","application":"Chip-on-panel-on-substrate","stage":"Evaluation (dual-track)","evidence":"Inspection track vs KLA/Camtek"}},{"id":"REL-CR-051","type":"supplies_equipment_to","from":"CMP-000010","to":"FAB-000001","basis":"source","legacy_id":"CR051","status":"PROBABLE","confidence":"LOW","source_ids":["SRC-000179"],"date":"2026-06-16","detail":{"customer":"TSMC","model_id":null,"product":null,"site":"CoPoS pilot line","location":"Taiwan","process_step":"PSX4","application":"Chip-on-panel-on-substrate","stage":"Evaluation (dual-track)","evidence":"Panel handling & automation"}},{"id":"REL-CR-052","type":"supplies_equipment_to","from":"CMP-000059","to":"FAB-000001","basis":"source","legacy_id":"CR052","status":"PROBABLE","confidence":"LOW","source_ids":["SRC-000179"],"date":"2026-06-16","detail":{"customer":"TSMC","model_id":null,"product":null,"site":"CoPoS pilot line","location":"Taiwan","process_step":"PSX4","application":"Chip-on-panel-on-substrate","stage":"Evaluation (dual-track)","evidence":"Panel handling & automation"}},{"id":"REL-CR-053","type":"supplies_equipment_to","from":"CMP-000060","to":"FAB-000001","basis":"source","legacy_id":"CR053","status":"PROBABLE","confidence":"LOW","source_ids":["SRC-000179"],"date":"2026-06-16","detail":{"customer":"TSMC","model_id":null,"product":null,"site":"CoPoS pilot line","location":"Taiwan","process_step":"PSX4","application":"Chip-on-panel-on-substrate","stage":"Evaluation (dual-track)","evidence":"Panel handling & automation"}},{"id":"REL-CR-054","type":"supplies_equipment_to","from":"CMP-000061","to":"FAB-000001","basis":"source","legacy_id":"CR054","status":"PROBABLE","confidence":"LOW","source_ids":["SRC-000179"],"date":"2026-06-16","detail":{"customer":"TSMC","model_id":null,"product":null,"site":"CoPoS pilot line","location":"Taiwan","process_step":"PSX4","application":"Chip-on-panel-on-substrate","stage":"Evaluation (dual-track)","evidence":"Panel handling & automation"}},{"id":"REL-CR-055","type":"supplies_equipment_to","from":"CMP-000085","to":"FAB-000001","basis":"source","legacy_id":"CR055","status":"PROBABLE","confidence":"LOW","source_ids":["SRC-000179"],"date":"2026-06-16","detail":{"customer":"TSMC","model_id":null,"product":null,"site":"CoPoS pilot line","location":"Taiwan","process_step":"PSX4","application":"Chip-on-panel-on-substrate","stage":"Evaluation (dual-track)","evidence":"Panel handling & automation"}},{"id":"REL-CR-056","type":"supplies_equipment_to","from":"CMP-000086","to":"FAB-000001","basis":"source","legacy_id":"CR056","status":"PROBABLE","confidence":"LOW","source_ids":["SRC-000179"],"date":"2026-06-16","detail":{"customer":"TSMC","model_id":null,"product":null,"site":"CoPoS pilot line","location":"Taiwan","process_step":"PSX4","application":"Chip-on-panel-on-substrate","stage":"Evaluation (dual-track)","evidence":"Panel handling & automation"}},{"id":"REL-CR-057","type":"supplies_equipment_to","from":"CMP-000002","to":"FAB-000001","basis":"source","legacy_id":"CR057","status":"PROBABLE","confidence":"LOW","source_ids":["SRC-000179"],"date":"2026-06-16","detail":{"customer":"TSMC","model_id":null,"product":null,"site":"CoPoS pilot line","location":"Taiwan","process_step":"PS07","application":"Chip-on-panel-on-substrate","stage":"Evaluation (dual-track)","evidence":"Incumbent in wet track"}},{"id":"REL-CR-058","type":"supplies_equipment_to","from":"CMP-000004","to":"FAB-000001","basis":"source","legacy_id":"CR058","status":"PROBABLE","confidence":"LOW","source_ids":["SRC-000179"],"date":"2026-06-16","detail":{"customer":"TSMC","model_id":null,"product":null,"site":"CoPoS pilot line","location":"Taiwan","process_step":"PS07","application":"Chip-on-panel-on-substrate","stage":"Evaluation (dual-track)","evidence":"Incumbent in wet track"}},{"id":"REL-CR-059","type":"supplies_equipment_to","from":"CMP-000007","to":"FAB-000001","basis":"source","legacy_id":"CR059","status":"PROBABLE","confidence":"LOW","source_ids":["SRC-000179"],"date":"2026-06-16","detail":{"customer":"TSMC","model_id":null,"product":null,"site":"CoPoS pilot line","location":"Taiwan","process_step":"PS07","application":"Chip-on-panel-on-substrate","stage":"Evaluation (dual-track)","evidence":"Incumbent in wet track"}},{"id":"REL-CR-060","type":"supplies_equipment_to","from":"CMP-000005","to":"FAB-000001","basis":"source","legacy_id":"CR060","status":"PROBABLE","confidence":"LOW","source_ids":["SRC-000179"],"date":"2026-06-16","detail":{"customer":"TSMC","model_id":null,"product":null,"site":"CoPoS pilot line","location":"Taiwan","process_step":"PS09","application":"Chip-on-panel-on-substrate","stage":"Evaluation (dual-track)","evidence":"Incumbent in inspection track"}},{"id":"REL-CR-061","type":"supplies_equipment_to","from":"CMP-000018","to":"FAB-000001","basis":"source","legacy_id":"CR061","status":"PROBABLE","confidence":"LOW","source_ids":["SRC-000179"],"date":"2026-06-16","detail":{"customer":"TSMC","model_id":null,"product":null,"site":"CoPoS pilot line","location":"Taiwan","process_step":"PS09","application":"Chip-on-panel-on-substrate","stage":"Evaluation (dual-track)","evidence":"Incumbent in inspection track"}},{"id":"REL-CR-062","type":"supplies_equipment_to","from":"CMP-000209","to":"FAB-000032","basis":"source","legacy_id":"CR062","status":"CONFIRMED","confidence":"MEDIUM","source_ids":["SRC-000585"],"date":"2024","detail":{"customer":"SkyWater Technology","model_id":"MDL-000299","product":"Multicolumn E-Beam Lithography (MEBL) MEBL system","site":null,"location":null,"process_step":"PS02","application":"Direct-write lithography for production","stage":"Delivered for volume production (2024)","evidence":"Customer press release title: SkyWater announces capabilities with Multibeam's multicolumn e-beam lithography system"}},{"id":"REL-CR-063","type":"supplies_equipment_to","from":"CMP-000221","to":"OSAT-000018","basis":"source","legacy_id":"CR063","status":"CONFIRMED","confidence":"MEDIUM","source_ids":["SRC-000705"],"date":null,"detail":{"customer":"Powertech Technology","model_id":"MDL-000329","product":"VertaCure VertaCure XP","site":null,"location":null,"process_step":"PSX5","application":"Advanced packaging polyimide cure","stage":"Volume purchase order","evidence":"Supplier press-release title: YES secures VertaCure XP volume purchase order from Powertech Technology Inc."}},{"id":"REL-CR-064","type":"supplies_equipment_to","from":"CMP-000221","to":"CUS-000900","basis":"source","legacy_id":"CR064","status":"CONFIRMED","confidence":"MEDIUM","source_ids":["SRC-000706"],"date":null,"detail":{"customer":"Undisclosed major foundry","model_id":"MDL-000328","product":"VertaCure VertaCure","site":null,"location":null,"process_step":"PSX5","application":"Polyimide cure for FO-WLP / passivation","stage":"Repeat volume order","evidence":"Supplier press-release title: repeat, volume VertaCure order from a major foundry (unnamed)"}},{"id":"REL-CR-065","type":"supplies_equipment_to","from":"CMP-000221","to":"CUS-000900","basis":"source","legacy_id":"CR065","status":"CONFIRMED","confidence":"MEDIUM","source_ids":["SRC-000707"],"date":null,"detail":{"customer":"Undisclosed leading Korean OSAT","model_id":"MDL-000329","product":"VertaCure VertaCure XP","site":null,"location":null,"process_step":"PSX5","application":"Advanced packaging polyimide cure","stage":"Purchase","evidence":"Supplier press-release title: leading Korean OSAT purchases VertaCure XP (unnamed)"}},{"id":"REL-CR-066","type":"supplies_equipment_to","from":"CMP-000212","to":"CUS-000900","basis":"source","legacy_id":"CR066","status":"CONFIRMED","confidence":"MEDIUM","source_ids":["SRC-000592"],"date":null,"detail":{"customer":"Undisclosed customer in Asia","model_id":"MDL-000306","product":"SINDRE SINDRE 400 Integra","site":null,"location":null,"process_step":"PS02","application":"High-volume NIL","stage":"Order (SEK 14.5M)","evidence":"Supplier press-release title: order for a SINDRE 400 Integra from a customer in Asia valued at SEK 14.5 million"}},{"id":"REL-CR-067","type":"supplies_equipment_to","from":"CMP-000212","to":"CUS-000900","basis":"source","legacy_id":"CR067","status":"CONFIRMED","confidence":"MEDIUM","source_ids":["SRC-000708"],"date":null,"detail":{"customer":"Undisclosed LED manufacturer","model_id":"MDL-000305","product":"SINDRE SINDRE","site":null,"location":null,"process_step":"PS02","application":"High-volume NIL (optics, LED, MEMS)","stage":"Order (Sindre 400, LED mass production)","evidence":"Supplier press-release title: Sindre 400 NIL-system order for mass production of LEDs (customer unnamed)"}},{"id":"REL-CR-068","type":"supplies_equipment_to","from":"CMP-000269","to":"CUS-000900","basis":"source","legacy_id":"CR068","status":"CONFIRMED","confidence":"MEDIUM","source_ids":["SRC-000709"],"date":null,"detail":{"customer":"Undisclosed major memory IDM","model_id":"MDL-000414","product":"AMPS AMPS SLT platform","site":null,"location":null,"process_step":"PS16","application":"SLT for advanced computing devices","stage":"Selected as SLT provider","evidence":"Supplier press-release title: major memory IDM selects AEM as its SLT provider (unnamed)"}},{"id":"REL-CR-069","type":"supplies_equipment_to","from":"CMP-000269","to":"CUS-000900","basis":"source","legacy_id":"CR069","status":"CONFIRMED","confidence":"MEDIUM","source_ids":["SRC-000710"],"date":null,"detail":{"customer":"Undisclosed major fabless provider (AI devices)","model_id":null,"product":null,"site":null,"location":null,"process_step":null,"application":null,"stage":"Plan-of-record for SLT thermal control","evidence":"Supplier press-release title: thermal control solutions selected as plan-of-record by a major fabless provider (unnamed)"}},{"id":"REL-CR-070","type":"supplies_equipment_to","from":"CMP-000253","to":"CUS-000033","basis":"source","legacy_id":"CR070","status":"CONFIRMED","confidence":"MEDIUM","source_ids":["SRC-000702"],"date":null,"detail":{"customer":"VLC Photonics","model_id":"MDL-000391","product":"Electro-optical wafer-level test Wafer-level test cell","site":null,"location":null,"process_step":"PS12","application":"Photonic IC wafer test alongside ATE","stage":"System received","evidence":"Supplier press-release title: VLC Photonics receives new wafer-level test system from ficonTEC"}},{"id":"REL-CR-071","type":"supplies_equipment_to","from":"CMP-000222","to":"CUS-000034","basis":"source","legacy_id":"CR071","status":"CONFIRMED","confidence":"MEDIUM","source_ids":["SRC-000703"],"date":null,"detail":{"customer":"Bay Photonics","model_id":"MDL-000330","product":"3880 die bonder 3880-II","site":null,"location":null,"process_step":"PS15","application":"Photonics, microelectronics die attach","stage":"In use (3880 die bonder)","evidence":"Supplier press-release title: Bay Photonics targets fine-pitch flip-chip photonics placement utilising the Palomar 3880 die bonder"}},{"id":"REL-CR-072","type":"supplies_equipment_to","from":"CMP-000222","to":"CUS-000035","basis":"source","legacy_id":"CR072","status":"CONFIRMED","confidence":"MEDIUM","source_ids":["SRC-000704"],"date":null,"detail":{"customer":"Electronics and Photonics Innovation Center (EPIC)","model_id":"MDL-000330","product":"3880 die bonder 3880-II","site":null,"location":null,"process_step":"PS15","application":"Photonics, microelectronics die attach","stage":"Purchase (3880 die bonder)","evidence":"Supplier press-release title: EPIC purchases Palomar 3880 die bonder for expanded packaging research"}},{"id":"REL-CR-073","type":"supplies_equipment_to","from":"CMP-000262","to":"FAB-000005","basis":"source","legacy_id":"CR073","status":"PROBABLE","confidence":"LOW","source_ids":["SRC-000711"],"date":"2016-08-09","detail":{"customer":"SK hynix","model_id":"MDL-000405","product":"AEGIS AEGIS","site":null,"location":null,"process_step":"PS09","application":"Front-end defect inspection","stage":"Supplier (reported, since 2016)","evidence":"Industry media report (ETNews, 9 Aug 2016) that Nextin began supplying AEGIS to SK hynix — search summary; article not read"}},{"id":"REL-CR-074","type":"supplies_equipment_to","from":"CMP-000202","to":"FAB-000011","basis":"source","legacy_id":"CR074","status":"CONFIRMED","confidence":"MEDIUM","source_ids":["SRC-000350"],"date":"2022-04","detail":{"customer":"STMicroelectronics","model_id":null,"product":null,"site":null,"location":null,"process_step":null,"application":null,"stage":"Order (SiC crystal growing systems)","evidence":"Supplier press release (Apr 2022): silicon carbide crystal growing systems to STMicroelectronics — URL/title only; page not read"}},{"id":"REL-PA-001","type":"merger_with","from":"CMP-000015","to":"CMP-000014","basis":"source","legacy_id":"PA001","status":"PENDING (regulatory approval)","confidence":"HIGH","source_ids":["SRC-000121","SRC-000122","SRC-000123"],"date":"2025-09-30","detail":{"event":"Merger","value":"All-stock, ratio 0.3575; ~USD 4.4B (Tier 4)"}},{"id":"REL-PA-003","type":"invested_in","from":"CMP-000002","to":"CMP-000043","basis":"source","legacy_id":"PA003","status":"DISCLOSED","confidence":"MEDIUM","source_ids":["SRC-000046","SRC-000049"],"date":"2025-04","detail":{"event":"Strategic investment","value":"9% stake"}},{"id":"REL-PA-004","type":"partner_of","from":"CMP-000002","to":"CMP-000043","basis":"source","legacy_id":"PA004","status":"ACTIVE","confidence":"LOW","source_ids":["SRC-000046","SRC-000051"],"date":null,"detail":{"event":"Joint development","value":null}},{"id":"REL-PA-005","type":"invested_in","from":"CMP-000101","to":"CMP-000106","basis":"source","legacy_id":"PA005","status":"ANNOUNCED","confidence":"MEDIUM","source_ids":["SRC-000126","SRC-000127"],"date":"2026","detail":{"event":"Strategic investment","value":"RMB 1.69B for 9.5% (target 17.9% and control)"}},{"id":"REL-PA-009","type":"acquired","from":"CMP-000016","to":"CMP-000019","basis":"source","legacy_id":"PA009","status":"COMPLETED","confidence":"LOW","source_ids":["SRC-000130","SRC-000131"],"date":"2025","detail":{"event":"Acquisition (product lines)","value":"USD 432.31M + 641,771 shares"}},{"id":"REL-PA-012","type":"partner_of","from":"CMP-000011","to":"CMP-000010","basis":"source","legacy_id":"PA012","status":"ACTIVE","confidence":"HIGH","source_ids":["SRC-000053"],"date":"N/A (review dated 2016-06-10)","detail":{"event":"Licensing / alliance","value":null}},{"id":"REL-PA-014","type":"partner_of","from":"CMP-000001","to":"FAB-000019","basis":"source","legacy_id":"PA014","status":"SIGNED","confidence":"HIGH","source_ids":["SRC-000024","SRC-000023"],"date":"2026-05","detail":{"event":"Strategic partnership (MoU)","value":null}},{"id":"REL-PA-015","type":"partner_of","from":"CMP-000004","to":"FAB-000019","basis":"source","legacy_id":"PA015","status":"SIGNED","confidence":"HIGH","source_ids":["SRC-000025","SRC-000023"],"date":"2024-09-10","detail":{"event":"Strategic partnership (MoU)","value":null}},{"id":"REL-PA-016","type":"joint_venture_with","from":"CMP-000192","to":"CMP-000193","basis":"source","legacy_id":"PA016","status":"FORMED","confidence":"MEDIUM","source_ids":["SRC-000037"],"date":"2022-02-01","detail":{"event":"Joint venture (50:50)","value":null}},{"id":"REL-PA-017","type":"partner_of","from":"CMP-000016","to":"CMP-000143","basis":"source","legacy_id":"PA017","status":"ACTIVE","confidence":"MEDIUM","source_ids":["SRC-000081"],"date":"2024","detail":{"event":"Partnership (PACE programme)","value":null}},{"id":"REL-PA-022","type":"corporate_group","from":"CMP-000011","to":"CMP-000178","basis":"source","legacy_id":"PA022","status":"IN GROUP","confidence":"HIGH","source_ids":["SRC-000166"],"date":null,"detail":{"event":"Group company","value":null}},{"id":"REL-PA-023","type":"spun_off","from":"CMP-000107","to":"CMP-000108","basis":"source","legacy_id":"PA023","status":"COMPLETED","confidence":"LOW","source_ids":["SRC-000183"],"date":null,"detail":{"event":"Spin-off","value":null}},{"id":"REL-PA-026","type":"partner_of","from":"CMP-000003","to":"CMP-000043","basis":"source","legacy_id":"PA026","status":"UNVERIFIED","confidence":"UNVERIFIED","source_ids":["SRC-000051"],"date":null,"detail":{"event":"Takeover interest (rumour)","value":null}},{"id":"REL-PA-028","type":"partner_of","from":"FAB-000019","to":"FAB-000028","basis":"source","legacy_id":"PA028","status":"SIGNED","confidence":"LOW","source_ids":["SRC-000209"],"date":"2026-09","detail":{"event":"MoU","value":null}},{"id":"REL-PA-033","type":"partner_of","from":"CMP-000044","to":"OSAT-000021","basis":"source","legacy_id":"PA033","status":"SIGNED","confidence":"HIGH","source_ids":["SRC-000201"],"date":"2024-12-12","detail":{"event":"MoU (training)","value":null}},{"id":"REL-PA-034","type":"distributes_for","from":"CMP-000062","to":"CMP-000198","basis":"source","legacy_id":"PA034","status":"SIGNED","confidence":"LOW","source_ids":["SRC-000214"],"date":"2026-09-16","detail":{"event":"Exclusive distribution","value":null}},{"id":"REL-PA-041","type":"distributes_for","from":"CMP-000174","to":"CMP-000147","basis":"source","legacy_id":"PA041","status":"ACTIVE","confidence":"HIGH","source_ids":["SRC-000223"],"date":null,"detail":{"event":"Distribution","value":null}},{"id":"REL-PA-042","type":"distributes_for","from":"CMP-000174","to":"CMP-000146","basis":"source","legacy_id":"PA042","status":"ACTIVE","confidence":"HIGH","source_ids":["SRC-000223"],"date":null,"detail":{"event":"Distribution","value":null}},{"id":"REL-RL-006","type":"subsidiary_of","from":"CMP-000045","to":"CMP-000044","basis":"source","legacy_id":"RL006","source_ids":["SRC-000058"],"confidence":"HIGH","detail":{"evidence":"ASMPT ALSI; spin-off from Philips Semiconductors in 2001"}},{"id":"REL-RL-008","type":"subsidiary_of","from":"CMP-000178","to":"CMP-000011","basis":"source","legacy_id":"RL008","source_ids":["SRC-000166"],"confidence":"HIGH","detail":{"evidence":"NKT Photonics within Hamamatsu group"}},{"id":"REL-RL-015","type":"related_to","from":"CMP-000007","to":"CMP-000177","basis":"source","legacy_id":"RL015","source_ids":["SRC-000091","SRC-000092"],"confidence":"LOW","detail":{"evidence":"LASSE LT-3100 presented as SCREEN laser annealing"}},{"id":"REL-RL-016","type":"related_to","from":"CMP-000176","to":"CMP-000175","basis":"source","legacy_id":"RL016","source_ids":["SRC-000224","SRC-000225"],"confidence":"HIGH","detail":{"evidence":"JSW lists ELA; JSW Aktina sells YIELDSCAN ELA; parent relationship not stated on page"}},{"id":"REL-RL-017","type":"related_to","from":"CMP-000101","to":"CMP-000106","basis":"source","legacy_id":"RL017","source_ids":["SRC-000127"],"confidence":"LOW","detail":{"evidence":"Naura acquiring 9.5% stake, targeting control"}},{"id":"REL-RL-018","type":"related_to","from":"CMP-000107","to":"CMP-000108","basis":"source","legacy_id":"RL018","source_ids":["SRC-000183"],"confidence":"LOW","detail":{"evidence":"AMIES spin-off of SMEE"}},{"id":"REL-RL-019","type":"subsidiary_of","from":"CMP-000160","to":"CMP-000159","basis":"source","legacy_id":"RL019","source_ids":["SRC-000274"],"confidence":"HIGH","detail":{"evidence":"ACS Motion Control presented within The PI Group"}},{"id":"REL-RL-024","type":"unresolved_relationship","from":"CMP-000134","to":"CMP-000132","basis":"source","legacy_id":"RL024","source_ids":["SRC-000114"],"confidence":"UNVERIFIED","detail":{"evidence":"jpt-hipa.com domain carries 'Shenzhen JPT Opto-electronics' - possible BRAND"}},{"id":"REL-RL-030","type":"related_to","from":"CMP-000192","to":"CMP-000193","basis":"source","legacy_id":"RL030","source_ids":["SRC-000037"],"confidence":"HIGH","detail":{"evidence":"50:50 JV partners"}},{"id":"REL-RL-031","type":"related_to","from":"CMP-000053","to":"CMP-000046","basis":"source","legacy_id":"RL031","source_ids":["SRC-000236"],"confidence":"HIGH","detail":{"evidence":"ADT formerly the Kulicke & Soffa dicing business"}},{"id":"REL-RL-032","type":"unresolved_relationship","from":"CMP-000109","to":"CMP-000112","basis":"source","legacy_id":"RL032","source_ids":["SRC-000188","SRC-000012"],"confidence":"MEDIUM","detail":{"evidence":"S0188 describes Skyverse as SiCarrier materials subsidiary - CONFLICT with other reporting"}},{"id":"REL-004539","type":"used_in","from":"EQP-K01","to":"PRS-001","basis":"reference"},{"id":"REL-004540","type":"used_in","from":"EQP-K02","to":"PRS-002","basis":"reference"},{"id":"REL-004541","type":"used_in","from":"EQP-K03","to":"PRS-003","basis":"reference"},{"id":"REL-004542","type":"used_in","from":"EQP-K04","to":"PRS-003","basis":"reference"},{"id":"REL-004543","type":"used_in","from":"EQP-F01","to":"PRS-003","basis":"reference"},{"id":"REL-004544","type":"used_in","from":"EQP-K05","to":"PRS-004","basis":"reference"},{"id":"REL-004545","type":"used_in","from":"EQP-K06","to":"PRS-005","basis":"reference"},{"id":"REL-004546","type":"used_in","from":"EQP-K07","to":"PRS-006","basis":"reference"},{"id":"REL-004547","type":"used_in","from":"EQP-C05","to":"PRS-006","basis":"reference"},{"id":"REL-004548","type":"used_in","from":"EQP-K08","to":"PRS-007","basis":"reference"},{"id":"REL-004549","type":"used_in","from":"EQP-K09","to":"PRS-008","basis":"reference"},{"id":"REL-004550","type":"used_in","from":"EQP-A30","to":"PRS-008","basis":"reference"},{"id":"REL-004551","type":"used_in","from":"EQP-A09.10","to":"PRS-009","basis":"reference"},{"id":"REL-004552","type":"used_in","from":"EQP-A09.11","to":"PRS-009","basis":"reference"},{"id":"REL-004553","type":"used_in","from":"EQP-F03","to":"PRS-009","basis":"reference"},{"id":"REL-004554","type":"used_in","from":"EQP-G01","to":"PRS-009","basis":"reference"},{"id":"REL-004555","type":"used_in","from":"EQP-G02","to":"PRS-009","basis":"reference"},{"id":"REL-004556","type":"used_in","from":"EQP-G03","to":"PRS-009","basis":"reference"},{"id":"REL-004557","type":"used_in","from":"EQP-G04","to":"PRS-009","basis":"reference"},{"id":"REL-004558","type":"used_in","from":"EQP-G05","to":"PRS-009","basis":"reference"},{"id":"REL-004559","type":"used_in","from":"EQP-G06","to":"PRS-009","basis":"reference"},{"id":"REL-004560","type":"used_in","from":"EQP-G07","to":"PRS-009","basis":"reference"},{"id":"REL-004561","type":"used_in","from":"EQP-A04","to":"PRS-010","basis":"reference"},{"id":"REL-004562","type":"used_in","from":"EQP-A05","to":"PRS-010","basis":"reference"},{"id":"REL-004563","type":"used_in","from":"EQP-A06","to":"PRS-010","basis":"reference"},{"id":"REL-004564","type":"used_in","from":"EQP-A07","to":"PRS-010","basis":"reference"},{"id":"REL-004565","type":"used_in","from":"EQP-A20","to":"PRS-010","basis":"reference"},{"id":"REL-004566","type":"used_in","from":"EQP-A16","to":"PRS-011","basis":"reference"},{"id":"REL-004567","type":"used_in","from":"EQP-A11","to":"PRS-011","basis":"reference"},{"id":"REL-004568","type":"used_in","from":"EQP-A11","to":"PRS-012","basis":"reference"},{"id":"REL-004569","type":"used_in","from":"EQP-A09","to":"PRS-013","basis":"reference"},{"id":"REL-004570","type":"used_in","from":"EQP-A09.01","to":"PRS-013","basis":"reference"},{"id":"REL-004571","type":"used_in","from":"EQP-A09.02","to":"PRS-013","basis":"reference"},{"id":"REL-004572","type":"used_in","from":"EQP-A09.03","to":"PRS-013","basis":"reference"},{"id":"REL-004573","type":"used_in","from":"EQP-A09.04","to":"PRS-013","basis":"reference"},{"id":"REL-004574","type":"used_in","from":"EQP-A09.05","to":"PRS-013","basis":"reference"},{"id":"REL-004575","type":"used_in","from":"EQP-A09.06","to":"PRS-013","basis":"reference"},{"id":"REL-004576","type":"used_in","from":"EQP-A09.07","to":"PRS-013","basis":"reference"},{"id":"REL-004577","type":"used_in","from":"EQP-A09.08","to":"PRS-013","basis":"reference"},{"id":"REL-004578","type":"used_in","from":"EQP-A09.09","to":"PRS-013","basis":"reference"},{"id":"REL-004579","type":"used_in","from":"EQP-A09.10","to":"PRS-013","basis":"reference"},{"id":"REL-004580","type":"used_in","from":"EQP-A09.11","to":"PRS-013","basis":"reference"},{"id":"REL-004581","type":"part_of","from":"PRS-014","to":"PRS-013","basis":"reference"},{"id":"REL-004582","type":"used_in","from":"EQP-A09.01","to":"PRS-014","basis":"reference"},{"id":"REL-004583","type":"used_in","from":"EQP-A09.02","to":"PRS-014","basis":"reference"},{"id":"REL-004584","type":"used_in","from":"EQP-A09.03","to":"PRS-014","basis":"reference"},{"id":"REL-004585","type":"used_in","from":"EQP-A09.04","to":"PRS-014","basis":"reference"},{"id":"REL-004586","type":"used_in","from":"EQP-A09.05","to":"PRS-014","basis":"reference"},{"id":"REL-004587","type":"part_of","from":"PRS-015","to":"PRS-013","basis":"reference"},{"id":"REL-004588","type":"used_in","from":"EQP-A09.06","to":"PRS-015","basis":"reference"},{"id":"REL-004589","type":"part_of","from":"PRS-016","to":"PRS-013","basis":"reference"},{"id":"REL-004590","type":"used_in","from":"EQP-A09.07","to":"PRS-016","basis":"reference"},{"id":"REL-004591","type":"used_in","from":"EQP-A09.08","to":"PRS-016","basis":"reference"},{"id":"REL-004592","type":"used_in","from":"EQP-A09.09","to":"PRS-016","basis":"reference"},{"id":"REL-004593","type":"used_in","from":"EQP-A02","to":"PRS-017","basis":"reference"},{"id":"REL-004594","type":"used_in","from":"EQP-A03","to":"PRS-017","basis":"reference"},{"id":"REL-004595","type":"used_in","from":"EQP-A01","to":"PRS-018","basis":"reference"},{"id":"REL-004596","type":"used_in","from":"EQP-A01.01","to":"PRS-018","basis":"reference"},{"id":"REL-004597","type":"used_in","from":"EQP-A01.02","to":"PRS-018","basis":"reference"},{"id":"REL-004598","type":"used_in","from":"EQP-A01.03","to":"PRS-018","basis":"reference"},{"id":"REL-004599","type":"used_in","from":"EQP-A01.04","to":"PRS-018","basis":"reference"},{"id":"REL-004600","type":"used_in","from":"EQP-A01.05","to":"PRS-018","basis":"reference"},{"id":"REL-004601","type":"used_in","from":"EQP-A01.06","to":"PRS-018","basis":"reference"},{"id":"REL-004602","type":"used_in","from":"EQP-A01.07","to":"PRS-018","basis":"reference"},{"id":"REL-004603","type":"used_in","from":"EQP-A01.08","to":"PRS-018","basis":"reference"},{"id":"REL-004604","type":"used_in","from":"EQP-A02","to":"PRS-019","basis":"reference"},{"id":"REL-004605","type":"used_in","from":"EQP-A03","to":"PRS-019","basis":"reference"},{"id":"REL-004606","type":"used_in","from":"EQP-A08","to":"PRS-020","basis":"reference"},{"id":"REL-004607","type":"used_in","from":"EQP-A08.01","to":"PRS-020","basis":"reference"},{"id":"REL-004608","type":"used_in","from":"EQP-A08.02","to":"PRS-020","basis":"reference"},{"id":"REL-004609","type":"used_in","from":"EQP-A08.03","to":"PRS-020","basis":"reference"},{"id":"REL-004610","type":"used_in","from":"EQP-A08.04","to":"PRS-020","basis":"reference"},{"id":"REL-004611","type":"used_in","from":"EQP-A08.05","to":"PRS-020","basis":"reference"},{"id":"REL-004612","type":"used_in","from":"EQP-A08.06","to":"PRS-020","basis":"reference"},{"id":"REL-004613","type":"used_in","from":"EQP-A07","to":"PRS-021","basis":"reference"},{"id":"REL-004614","type":"used_in","from":"EQP-A05","to":"PRS-021","basis":"reference"},{"id":"REL-004615","type":"used_in","from":"EQP-A10","to":"PRS-022","basis":"reference"},{"id":"REL-004616","type":"used_in","from":"EQP-F04","to":"PRS-022","basis":"reference"},{"id":"REL-004617","type":"used_in","from":"EQP-A12","to":"PRS-023","basis":"reference"},{"id":"REL-004618","type":"used_in","from":"EQP-A13","to":"PRS-023","basis":"reference"},{"id":"REL-004619","type":"used_in","from":"EQP-A14","to":"PRS-023","basis":"reference"},{"id":"REL-004620","type":"used_in","from":"EQP-F05","to":"PRS-023","basis":"reference"},{"id":"REL-004621","type":"used_in","from":"EQP-A19","to":"PRS-024","basis":"reference"},{"id":"REL-004622","type":"used_in","from":"EQP-A17","to":"PRS-025","basis":"reference"},{"id":"REL-004623","type":"used_in","from":"EQP-A18","to":"PRS-025","basis":"reference"},{"id":"REL-004624","type":"used_in","from":"EQP-A25","to":"PRS-026","basis":"reference"},{"id":"REL-004625","type":"used_in","from":"EQP-A26","to":"PRS-026","basis":"reference"},{"id":"REL-004626","type":"used_in","from":"EQP-A27","to":"PRS-026","basis":"reference"},{"id":"REL-004627","type":"used_in","from":"EQP-A28","to":"PRS-026","basis":"reference"},{"id":"REL-004628","type":"used_in","from":"EQP-A29","to":"PRS-026","basis":"reference"},{"id":"REL-004629","type":"used_in","from":"EQP-A30","to":"PRS-026","basis":"reference"},{"id":"REL-004630","type":"used_in","from":"EQP-A21","to":"PRS-027","basis":"reference"},{"id":"REL-004631","type":"used_in","from":"EQP-A22","to":"PRS-027","basis":"reference"},{"id":"REL-004632","type":"used_in","from":"EQP-A23","to":"PRS-027","basis":"reference"},{"id":"REL-004633","type":"used_in","from":"EQP-A24","to":"PRS-027","basis":"reference"},{"id":"REL-004634","type":"used_in","from":"EQP-A31","to":"PRS-027","basis":"reference"},{"id":"REL-004635","type":"used_in","from":"EQP-B01","to":"PRS-028","basis":"reference"},{"id":"REL-004636","type":"used_in","from":"EQP-B02","to":"PRS-028","basis":"reference"},{"id":"REL-004637","type":"used_in","from":"EQP-B03","to":"PRS-028","basis":"reference"},{"id":"REL-004638","type":"used_in","from":"EQP-B04","to":"PRS-028","basis":"reference"},{"id":"REL-004639","type":"used_in","from":"EQP-B05","to":"PRS-028","basis":"reference"},{"id":"REL-004640","type":"used_in","from":"EQP-B06","to":"PRS-028","basis":"reference"},{"id":"REL-004641","type":"used_in","from":"EQP-B07","to":"PRS-028","basis":"reference"},{"id":"REL-004642","type":"used_in","from":"EQP-B08","to":"PRS-028","basis":"reference"},{"id":"REL-004643","type":"used_in","from":"EQP-B09","to":"PRS-028","basis":"reference"},{"id":"REL-004644","type":"used_in","from":"EQP-B10","to":"PRS-028","basis":"reference"},{"id":"REL-004645","type":"used_in","from":"EQP-A32","to":"PRS-029","basis":"reference"},{"id":"REL-004646","type":"used_in","from":"EQP-A33","to":"PRS-029","basis":"reference"},{"id":"REL-004647","type":"used_in","from":"EQP-C02","to":"PRS-030","basis":"reference"},{"id":"REL-004648","type":"used_in","from":"EQP-C03","to":"PRS-030","basis":"reference"},{"id":"REL-004649","type":"used_in","from":"EQP-C04","to":"PRS-030","basis":"reference"},{"id":"REL-004650","type":"used_in","from":"EQP-C05","to":"PRS-030","basis":"reference"},{"id":"REL-004651","type":"used_in","from":"EQP-C06","to":"PRS-031","basis":"reference"},{"id":"REL-004652","type":"used_in","from":"EQP-C07","to":"PRS-031","basis":"reference"},{"id":"REL-004653","type":"used_in","from":"EQP-C01","to":"PRS-032","basis":"reference"},{"id":"REL-004654","type":"used_in","from":"EQP-C01.01","to":"PRS-032","basis":"reference"},{"id":"REL-004655","type":"used_in","from":"EQP-C01.02","to":"PRS-032","basis":"reference"},{"id":"REL-004656","type":"used_in","from":"EQP-C01.03","to":"PRS-032","basis":"reference"},{"id":"REL-004657","type":"used_in","from":"EQP-C01.04","to":"PRS-032","basis":"reference"},{"id":"REL-004658","type":"used_in","from":"EQP-C01.05","to":"PRS-032","basis":"reference"},{"id":"REL-004659","type":"used_in","from":"EQP-E10","to":"PRS-032","basis":"reference"},{"id":"REL-004660","type":"used_in","from":"EQP-F07","to":"PRS-032","basis":"reference"},{"id":"REL-004661","type":"used_in","from":"EQP-C08","to":"PRS-033","basis":"reference"},{"id":"REL-004662","type":"used_in","from":"EQP-C09","to":"PRS-033","basis":"reference"},{"id":"REL-004663","type":"used_in","from":"EQP-C10","to":"PRS-033","basis":"reference"},{"id":"REL-004664","type":"used_in","from":"EQP-E11","to":"PRS-033","basis":"reference"},{"id":"REL-004665","type":"used_in","from":"EQP-C12","to":"PRS-034","basis":"reference"},{"id":"REL-004666","type":"used_in","from":"EQP-C13","to":"PRS-034","basis":"reference"},{"id":"REL-004667","type":"used_in","from":"EQP-C14","to":"PRS-034","basis":"reference"},{"id":"REL-004668","type":"used_in","from":"EQP-C15","to":"PRS-034","basis":"reference"},{"id":"REL-004669","type":"used_in","from":"EQP-E12","to":"PRS-034","basis":"reference"},{"id":"REL-004670","type":"used_in","from":"EQP-C11","to":"PRS-035","basis":"reference"},{"id":"REL-004671","type":"used_in","from":"EQP-E13","to":"PRS-035","basis":"reference"},{"id":"REL-004672","type":"used_in","from":"EQP-C16","to":"PRS-035","basis":"reference"},{"id":"REL-004673","type":"used_in","from":"EQP-C19","to":"PRS-035","basis":"reference"},{"id":"REL-004674","type":"used_in","from":"EQP-C20","to":"PRS-036","basis":"reference"},{"id":"REL-004675","type":"used_in","from":"EQP-C21","to":"PRS-036","basis":"reference"},{"id":"REL-004676","type":"used_in","from":"EQP-C22","to":"PRS-036","basis":"reference"},{"id":"REL-004677","type":"used_in","from":"EQP-C23","to":"PRS-036","basis":"reference"},{"id":"REL-004678","type":"used_in","from":"EQP-C24","to":"PRS-036","basis":"reference"},{"id":"REL-004679","type":"used_in","from":"EQP-C25","to":"PRS-036","basis":"reference"},{"id":"REL-004680","type":"used_in","from":"EQP-E14","to":"PRS-036","basis":"reference"},{"id":"REL-004681","type":"used_in","from":"EQP-C26","to":"PRS-038","basis":"reference"},{"id":"REL-004682","type":"used_in","from":"EQP-C27","to":"PRS-038","basis":"reference"},{"id":"REL-004683","type":"used_in","from":"EQP-E09","to":"PRS-038","basis":"reference"},{"id":"REL-004684","type":"used_in","from":"EQP-C32","to":"PRS-039","basis":"reference"},{"id":"REL-004685","type":"used_in","from":"EQP-C29","to":"PRS-039","basis":"reference"},{"id":"REL-004686","type":"used_in","from":"EQP-C30","to":"PRS-039","basis":"reference"},{"id":"REL-004687","type":"used_in","from":"EQP-C34","to":"PRS-040","basis":"reference"},{"id":"REL-004688","type":"used_in","from":"EQP-C35","to":"PRS-040","basis":"reference"},{"id":"REL-004689","type":"used_in","from":"EQP-C36","to":"PRS-040","basis":"reference"},{"id":"REL-004690","type":"used_in","from":"EQP-E06","to":"PRS-040","basis":"reference"},{"id":"REL-004691","type":"used_in","from":"EQP-C37","to":"PRS-041","basis":"reference"},{"id":"REL-004692","type":"used_in","from":"EQP-C39","to":"PRS-041","basis":"reference"},{"id":"REL-004693","type":"used_in","from":"EQP-C40","to":"PRS-041","basis":"reference"},{"id":"REL-004694","type":"used_in","from":"EQP-C41","to":"PRS-041","basis":"reference"},{"id":"REL-004695","type":"used_in","from":"EQP-C42","to":"PRS-041","basis":"reference"},{"id":"REL-004696","type":"used_in","from":"EQP-E02","to":"PRS-041","basis":"reference"},{"id":"REL-004697","type":"used_in","from":"EQP-E07","to":"PRS-041","basis":"reference"},{"id":"REL-004698","type":"used_in","from":"EQP-E08","to":"PRS-041","basis":"reference"},{"id":"REL-004699","type":"used_in","from":"EQP-C38","to":"PRS-042","basis":"reference"},{"id":"REL-004700","type":"used_in","from":"EQP-E04","to":"PRS-042","basis":"reference"},{"id":"REL-004701","type":"used_in","from":"EQP-E05","to":"PRS-042","basis":"reference"},{"id":"REL-004702","type":"used_in","from":"EQP-D13","to":"PRS-043","basis":"reference"},{"id":"REL-004703","type":"used_in","from":"EQP-A08.05","to":"PRS-043","basis":"reference"},{"id":"REL-004704","type":"used_in","from":"EQP-A18","to":"PRS-043","basis":"reference"},{"id":"REL-004705","type":"used_in","from":"EQP-D14","to":"PRS-044","basis":"reference"},{"id":"REL-004706","type":"used_in","from":"EQP-D18","to":"PRS-044","basis":"reference"},{"id":"REL-004707","type":"used_in","from":"EQP-C28","to":"PRS-044","basis":"reference"},{"id":"REL-004708","type":"used_in","from":"EQP-D15","to":"PRS-045","basis":"reference"},{"id":"REL-004709","type":"used_in","from":"EQP-A18","to":"PRS-045","basis":"reference"},{"id":"REL-004710","type":"used_in","from":"EQP-A01.05","to":"PRS-045","basis":"reference"},{"id":"REL-004711","type":"used_in","from":"EQP-A01.08","to":"PRS-045","basis":"reference"},{"id":"REL-004712","type":"used_in","from":"EQP-D08","to":"PRS-046","basis":"reference"},{"id":"REL-004713","type":"used_in","from":"EQP-D20","to":"PRS-046","basis":"reference"},{"id":"REL-004714","type":"used_in","from":"EQP-A18","to":"PRS-046","basis":"reference"},{"id":"REL-004715","type":"used_in","from":"EQP-A01.05","to":"PRS-046","basis":"reference"},{"id":"REL-004716","type":"used_in","from":"EQP-D05","to":"PRS-047","basis":"reference"},{"id":"REL-004717","type":"used_in","from":"EQP-D06","to":"PRS-047","basis":"reference"},{"id":"REL-004718","type":"used_in","from":"EQP-D07","to":"PRS-047","basis":"reference"},{"id":"REL-004719","type":"used_in","from":"EQP-D10","to":"PRS-047","basis":"reference"},{"id":"REL-004720","type":"used_in","from":"EQP-C20","to":"PRS-047","basis":"reference"},{"id":"REL-004721","type":"used_in","from":"EQP-A18","to":"PRS-047","basis":"reference"},{"id":"REL-004722","type":"used_in","from":"EQP-A01.05","to":"PRS-047","basis":"reference"},{"id":"REL-004723","type":"used_in","from":"EQP-A01.08","to":"PRS-047","basis":"reference"},{"id":"REL-004724","type":"used_in","from":"EQP-D01","to":"PRS-048","basis":"reference"},{"id":"REL-004725","type":"used_in","from":"EQP-D09","to":"PRS-048","basis":"reference"},{"id":"REL-004726","type":"used_in","from":"EQP-D11","to":"PRS-048","basis":"reference"},{"id":"REL-004727","type":"used_in","from":"EQP-D16","to":"PRS-048","basis":"reference"},{"id":"REL-004728","type":"used_in","from":"EQP-D17","to":"PRS-048","basis":"reference"},{"id":"REL-004729","type":"used_in","from":"EQP-D18","to":"PRS-048","basis":"reference"},{"id":"REL-004730","type":"used_in","from":"EQP-D02","to":"PRS-049","basis":"reference"},{"id":"REL-004731","type":"used_in","from":"EQP-D03","to":"PRS-049","basis":"reference"},{"id":"REL-004732","type":"used_in","from":"EQP-D21","to":"PRS-049","basis":"reference"},{"id":"REL-004733","type":"used_in","from":"EQP-D22","to":"PRS-049","basis":"reference"},{"id":"REL-004734","type":"used_in","from":"EQP-D23","to":"PRS-049","basis":"reference"},{"id":"REL-004735","type":"used_in","from":"EQP-C16","to":"PRS-049","basis":"reference"},{"id":"REL-004736","type":"used_in","from":"EQP-C17","to":"PRS-049","basis":"reference"},{"id":"REL-004737","type":"used_in","from":"EQP-D04","to":"PRS-050","basis":"reference"},{"id":"REL-004738","type":"used_in","from":"EQP-C11","to":"PRS-050","basis":"reference"},{"id":"REL-004739","type":"used_in","from":"EQP-C16","to":"PRS-050","basis":"reference"},{"id":"REL-004740","type":"used_in","from":"EQP-C17","to":"PRS-050","basis":"reference"},{"id":"REL-004741","type":"used_in","from":"EQP-C17","to":"PRS-051","basis":"reference"},{"id":"REL-004742","type":"used_in","from":"EQP-D12","to":"PRS-051","basis":"reference"},{"id":"REL-004743","type":"used_in","from":"EQP-C18","to":"PRS-051","basis":"reference"},{"id":"REL-004744","type":"used_in","from":"EQP-C18","to":"PRS-052","basis":"reference"},{"id":"REL-004745","type":"used_in","from":"EQP-D19","to":"PRS-053","basis":"reference"},{"id":"REL-004746","type":"used_in","from":"EQP-C28","to":"PRS-053","basis":"reference"},{"id":"REL-004747","type":"used_in","from":"EQP-D14","to":"PRS-053","basis":"reference"},{"id":"REL-004748","type":"used_in","from":"EQP-I06","to":"PRS-054","basis":"reference"},{"id":"REL-004749","type":"used_in","from":"EQP-I07","to":"PRS-055","basis":"reference"},{"id":"REL-004750","type":"used_in","from":"EQP-I08","to":"PRS-056","basis":"reference"},{"id":"REL-004751","type":"used_in","from":"EQP-I09","to":"PRS-056","basis":"reference"},{"id":"REL-004752","type":"used_in","from":"EQP-I05","to":"PRS-056","basis":"reference"},{"id":"REL-004753","type":"used_in","from":"EQP-I10","to":"PRS-056","basis":"reference"},{"id":"REL-004754","type":"used_in","from":"EQP-J01","to":"PRS-057","basis":"reference"},{"id":"REL-004755","type":"used_in","from":"EQP-J02","to":"PRS-057","basis":"reference"},{"id":"REL-004756","type":"used_in","from":"EQP-J03","to":"PRS-057","basis":"reference"},{"id":"REL-004757","type":"used_in","from":"EQP-J04","to":"PRS-057","basis":"reference"},{"id":"REL-004758","type":"used_in","from":"EQP-J05","to":"PRS-057","basis":"reference"},{"id":"REL-004759","type":"used_in","from":"EQP-J07","to":"PRS-057","basis":"reference"},{"id":"REL-004760","type":"used_in","from":"EQP-A34","to":"PRS-057","basis":"reference"},{"id":"REL-004761","type":"used_in","from":"EQP-A35","to":"PRS-057","basis":"reference"},{"id":"REL-004762","type":"used_in","from":"EQP-A36","to":"PRS-057","basis":"reference"},{"id":"REL-004763","type":"used_in","from":"EQP-A37","to":"PRS-058","basis":"reference"},{"id":"REL-004764","type":"used_in","from":"EQP-A38","to":"PRS-058","basis":"reference"},{"id":"REL-004765","type":"used_in","from":"EQP-A39","to":"PRS-058","basis":"reference"},{"id":"REL-004766","type":"used_in","from":"EQP-A40","to":"PRS-058","basis":"reference"},{"id":"REL-004767","type":"used_in","from":"EQP-J06","to":"PRS-058","basis":"reference"},{"id":"REL-004768","type":"used_in","from":"EQP-J08","to":"PRS-058","basis":"reference"},{"id":"REL-004769","type":"used_in","from":"EQP-J09","to":"PRS-058","basis":"reference"},{"id":"REL-004770","type":"used_in","from":"EQP-J10","to":"PRS-058","basis":"reference"},{"id":"REL-004771","type":"used_in","from":"EQP-J11","to":"PRS-058","basis":"reference"},{"id":"REL-004772","type":"used_in","from":"EQP-J12","to":"PRS-058","basis":"reference"},{"id":"REL-004773","type":"used_in","from":"EQP-J13","to":"PRS-058","basis":"reference"},{"id":"REL-004774","type":"used_in","from":"EQP-J14","to":"PRS-058","basis":"reference"},{"id":"REL-004775","type":"used_in","from":"EQP-J15","to":"PRS-058","basis":"reference"},{"id":"REL-004776","type":"used_in","from":"EQP-A41","to":"PRS-059","basis":"reference"},{"id":"REL-004777","type":"used_in","from":"EQP-A42","to":"PRS-059","basis":"reference"},{"id":"REL-004778","type":"used_in","from":"EQP-A45","to":"PRS-059","basis":"reference"},{"id":"REL-004779","type":"used_in","from":"EQP-L01","to":"PRS-059","basis":"reference"},{"id":"REL-004780","type":"used_in","from":"EQP-L02","to":"PRS-059","basis":"reference"},{"id":"REL-004781","type":"used_in","from":"EQP-L06","to":"PRS-059","basis":"reference"},{"id":"REL-004782","type":"used_in","from":"EQP-A43","to":"PRS-060","basis":"reference"},{"id":"REL-004783","type":"used_in","from":"EQP-A44","to":"PRS-060","basis":"reference"},{"id":"REL-004784","type":"used_in","from":"EQP-L04","to":"PRS-060","basis":"reference"},{"id":"REL-004785","type":"used_in","from":"EQP-L05","to":"PRS-060","basis":"reference"},{"id":"REL-004786","type":"used_in","from":"EQP-L03","to":"PRS-061","basis":"reference"},{"id":"REL-004787","type":"used_in","from":"EQP-L07","to":"PRS-061","basis":"reference"},{"id":"REL-004788","type":"used_in","from":"EQP-L08","to":"PRS-061","basis":"reference"},{"id":"REL-004789","type":"used_in","from":"EQP-L09","to":"PRS-061","basis":"reference"},{"id":"REL-004790","type":"used_in","from":"EQP-L10","to":"PRS-061","basis":"reference"},{"id":"REL-004791","type":"used_in","from":"EQP-L11","to":"PRS-061","basis":"reference"},{"id":"REL-004792","type":"used_in","from":"EQP-L12","to":"PRS-061","basis":"reference"},{"id":"REL-004793","type":"contains","from":"SUB-001","to":"CMPN-000010","basis":"reference"},{"id":"REL-004794","type":"contains","from":"SUB-001","to":"CMPN-000011","basis":"reference"},{"id":"REL-004795","type":"contains","from":"SUB-002","to":"CMPN-000012","basis":"reference"},{"id":"REL-004796","type":"contains","from":"SUB-002","to":"CMPN-000013","basis":"reference"},{"id":"REL-004797","type":"contains","from":"SUB-002","to":"CMPN-000014","basis":"reference"},{"id":"REL-004798","type":"contains","from":"SUB-002","to":"CMPN-000015","basis":"reference"},{"id":"REL-004799","type":"contains","from":"SUB-002","to":"CMPN-000016","basis":"reference"},{"id":"REL-004800","type":"contains","from":"SUB-002","to":"CMPN-000017","basis":"reference"},{"id":"REL-004801","type":"contains","from":"SUB-002","to":"CMPN-000018","basis":"reference"},{"id":"REL-004802","type":"contains","from":"SUB-002","to":"CMPN-000019","basis":"reference"},{"id":"REL-004803","type":"contains","from":"SUB-002","to":"CMPN-000020","basis":"reference"},{"id":"REL-004804","type":"contains","from":"SUB-002","to":"CMPN-000021","basis":"reference"},{"id":"REL-004805","type":"contains","from":"SUB-003","to":"CMPN-000001","basis":"reference"},{"id":"REL-004806","type":"contains","from":"SUB-003","to":"CMPN-000002","basis":"reference"},{"id":"REL-004807","type":"contains","from":"SUB-003","to":"CMPN-000003","basis":"reference"},{"id":"REL-004808","type":"contains","from":"SUB-003","to":"CMPN-000004","basis":"reference"},{"id":"REL-004809","type":"contains","from":"SUB-003","to":"CMPN-000005","basis":"reference"},{"id":"REL-004810","type":"contains","from":"SUB-003","to":"CMPN-000006","basis":"reference"},{"id":"REL-004811","type":"contains","from":"SUB-003","to":"CMPN-000007","basis":"reference"},{"id":"REL-004812","type":"contains","from":"SUB-003","to":"CMPN-000008","basis":"reference"},{"id":"REL-004813","type":"contains","from":"SUB-003","to":"CMPN-000009","basis":"reference"},{"id":"REL-004814","type":"contains","from":"SUB-003","to":"CMPN-000052","basis":"reference"},{"id":"REL-004815","type":"contains","from":"SUB-004","to":"CMPN-000025","basis":"reference"},{"id":"REL-004816","type":"contains","from":"SUB-004","to":"CMPN-000026","basis":"reference"},{"id":"REL-004817","type":"contains","from":"SUB-004","to":"CMPN-000027","basis":"reference"},{"id":"REL-004818","type":"contains","from":"SUB-004","to":"CMPN-000028","basis":"reference"},{"id":"REL-004819","type":"contains","from":"SUB-004","to":"CMPN-000029","basis":"reference"},{"id":"REL-004820","type":"contains","from":"SUB-004","to":"CMPN-000030","basis":"reference"},{"id":"REL-004821","type":"contains","from":"SUB-005","to":"CMPN-000031","basis":"reference"},{"id":"REL-004822","type":"contains","from":"SUB-005","to":"CMPN-000032","basis":"reference"},{"id":"REL-004823","type":"contains","from":"SUB-005","to":"CMPN-000033","basis":"reference"},{"id":"REL-004824","type":"contains","from":"SUB-005","to":"CMPN-000034","basis":"reference"},{"id":"REL-004825","type":"contains","from":"SUB-005","to":"CMPN-000035","basis":"reference"},{"id":"REL-004826","type":"contains","from":"SUB-006","to":"CMPN-000040","basis":"reference"},{"id":"REL-004827","type":"contains","from":"SUB-006","to":"CMPN-000041","basis":"reference"},{"id":"REL-004828","type":"contains","from":"SUB-006","to":"CMPN-000042","basis":"reference"},{"id":"REL-004829","type":"contains","from":"SUB-006","to":"CMPN-000043","basis":"reference"},{"id":"REL-004830","type":"contains","from":"SUB-007","to":"CMPN-000044","basis":"reference"},{"id":"REL-004831","type":"contains","from":"SUB-007","to":"CMPN-000045","basis":"reference"},{"id":"REL-004832","type":"contains","from":"SUB-008","to":"CMPN-000050","basis":"reference"},{"id":"REL-004833","type":"contains","from":"SUB-009","to":"CMPN-000022","basis":"reference"},{"id":"REL-004834","type":"contains","from":"SUB-009","to":"CMPN-000023","basis":"reference"},{"id":"REL-004835","type":"contains","from":"SUB-009","to":"CMPN-000024","basis":"reference"},{"id":"REL-004836","type":"contains","from":"SUB-009","to":"CMPN-000051","basis":"reference"},{"id":"REL-004837","type":"contains","from":"SUB-011","to":"CMPN-000038","basis":"reference"},{"id":"REL-004838","type":"contains","from":"SUB-012","to":"CMPN-000036","basis":"reference"},{"id":"REL-004839","type":"contains","from":"SUB-012","to":"CMPN-000037","basis":"reference"},{"id":"REL-004840","type":"contains","from":"SUB-012","to":"CMPN-000039","basis":"reference"},{"id":"REL-004841","type":"contains","from":"SUB-013","to":"CMPN-000056","basis":"reference"},{"id":"REL-004842","type":"contains","from":"SUB-013","to":"CMPN-000057","basis":"reference"},{"id":"REL-004843","type":"contains","from":"SUB-013","to":"CMPN-000058","basis":"reference"},{"id":"REL-004844","type":"contains","from":"SUB-013","to":"CMPN-000059","basis":"reference"},{"id":"REL-004845","type":"contains","from":"SUB-013","to":"CMPN-000060","basis":"reference"},{"id":"REL-004846","type":"contains","from":"SUB-013","to":"CMPN-000061","basis":"reference"},{"id":"REL-004847","type":"contains","from":"SUB-014","to":"CMPN-000047","basis":"reference"},{"id":"REL-004848","type":"contains","from":"SUB-014","to":"CMPN-000048","basis":"reference"},{"id":"REL-004849","type":"contains","from":"SUB-014","to":"CMPN-000049","basis":"reference"},{"id":"REL-004850","type":"contains","from":"SUB-014","to":"CMPN-000054","basis":"reference"},{"id":"REL-004851","type":"contains","from":"SUB-015","to":"CMPN-000046","basis":"reference"},{"id":"REL-004852","type":"contains","from":"SUB-015","to":"CMPN-000053","basis":"reference"},{"id":"REL-004853","type":"contains","from":"SUB-016","to":"CMPN-000055","basis":"reference"},{"id":"REL-004854","type":"contains","from":"EQP-A01","to":"SUB-002","basis":"reference"},{"id":"REL-004855","type":"contains","from":"EQP-A01","to":"SUB-003","basis":"reference"},{"id":"REL-004856","type":"contains","from":"EQP-A01","to":"SUB-008","basis":"reference"},{"id":"REL-004857","type":"contains","from":"EQP-A01","to":"SUB-011","basis":"reference"},{"id":"REL-004858","type":"contains","from":"EQP-A01","to":"SUB-013","basis":"reference"},{"id":"REL-004859","type":"contains","from":"EQP-A01","to":"SUB-014","basis":"reference"},{"id":"REL-004860","type":"contains","from":"EQP-A01","to":"SUB-015","basis":"reference"},{"id":"REL-004861","type":"contains","from":"EQP-A01","to":"SUB-016","basis":"reference"},{"id":"REL-004862","type":"contains","from":"EQP-A01.01","to":"SUB-001","basis":"reference"},{"id":"REL-004863","type":"contains","from":"EQP-A01.01","to":"SUB-002","basis":"reference"},{"id":"REL-004864","type":"contains","from":"EQP-A01.01","to":"SUB-003","basis":"reference"},{"id":"REL-004865","type":"contains","from":"EQP-A01.01","to":"SUB-004","basis":"reference"},{"id":"REL-004866","type":"contains","from":"EQP-A01.01","to":"SUB-008","basis":"reference"},{"id":"REL-004867","type":"contains","from":"EQP-A01.01","to":"SUB-011","basis":"reference"},{"id":"REL-004868","type":"contains","from":"EQP-A01.01","to":"SUB-013","basis":"reference"},{"id":"REL-004869","type":"contains","from":"EQP-A01.01","to":"SUB-014","basis":"reference"},{"id":"REL-004870","type":"contains","from":"EQP-A01.01","to":"SUB-015","basis":"reference"},{"id":"REL-004871","type":"contains","from":"EQP-A01.01","to":"SUB-016","basis":"reference"},{"id":"REL-004872","type":"contains","from":"EQP-A01.02","to":"SUB-001","basis":"reference"},{"id":"REL-004873","type":"contains","from":"EQP-A01.02","to":"SUB-002","basis":"reference"},{"id":"REL-004874","type":"contains","from":"EQP-A01.02","to":"SUB-003","basis":"reference"},{"id":"REL-004875","type":"contains","from":"EQP-A01.02","to":"SUB-008","basis":"reference"},{"id":"REL-004876","type":"contains","from":"EQP-A01.02","to":"SUB-011","basis":"reference"},{"id":"REL-004877","type":"contains","from":"EQP-A01.02","to":"SUB-013","basis":"reference"},{"id":"REL-004878","type":"contains","from":"EQP-A01.02","to":"SUB-014","basis":"reference"},{"id":"REL-004879","type":"contains","from":"EQP-A01.02","to":"SUB-015","basis":"reference"},{"id":"REL-004880","type":"contains","from":"EQP-A01.02","to":"SUB-016","basis":"reference"},{"id":"REL-004881","type":"contains","from":"EQP-A01.03","to":"SUB-001","basis":"reference"},{"id":"REL-004882","type":"contains","from":"EQP-A01.03","to":"SUB-002","basis":"reference"},{"id":"REL-004883","type":"contains","from":"EQP-A01.03","to":"SUB-003","basis":"reference"},{"id":"REL-004884","type":"contains","from":"EQP-A01.03","to":"SUB-008","basis":"reference"},{"id":"REL-004885","type":"contains","from":"EQP-A01.03","to":"SUB-011","basis":"reference"},{"id":"REL-004886","type":"contains","from":"EQP-A01.03","to":"SUB-013","basis":"reference"},{"id":"REL-004887","type":"contains","from":"EQP-A01.03","to":"SUB-014","basis":"reference"},{"id":"REL-004888","type":"contains","from":"EQP-A01.03","to":"SUB-015","basis":"reference"},{"id":"REL-004889","type":"contains","from":"EQP-A01.03","to":"SUB-016","basis":"reference"},{"id":"REL-004890","type":"contains","from":"EQP-A01.04","to":"SUB-001","basis":"reference"},{"id":"REL-004891","type":"contains","from":"EQP-A01.04","to":"SUB-002","basis":"reference"},{"id":"REL-004892","type":"contains","from":"EQP-A01.04","to":"SUB-003","basis":"reference"},{"id":"REL-004893","type":"contains","from":"EQP-A01.04","to":"SUB-008","basis":"reference"},{"id":"REL-004894","type":"contains","from":"EQP-A01.04","to":"SUB-011","basis":"reference"},{"id":"REL-004895","type":"contains","from":"EQP-A01.04","to":"SUB-013","basis":"reference"},{"id":"REL-004896","type":"contains","from":"EQP-A01.04","to":"SUB-014","basis":"reference"},{"id":"REL-004897","type":"contains","from":"EQP-A01.04","to":"SUB-015","basis":"reference"},{"id":"REL-004898","type":"contains","from":"EQP-A01.04","to":"SUB-016","basis":"reference"},{"id":"REL-004899","type":"contains","from":"EQP-A01.05","to":"SUB-002","basis":"reference"},{"id":"REL-004900","type":"contains","from":"EQP-A01.05","to":"SUB-003","basis":"reference"},{"id":"REL-004901","type":"contains","from":"EQP-A01.05","to":"SUB-008","basis":"reference"},{"id":"REL-004902","type":"contains","from":"EQP-A01.05","to":"SUB-011","basis":"reference"},{"id":"REL-004903","type":"contains","from":"EQP-A01.05","to":"SUB-013","basis":"reference"},{"id":"REL-004904","type":"contains","from":"EQP-A01.05","to":"SUB-014","basis":"reference"},{"id":"REL-004905","type":"contains","from":"EQP-A01.05","to":"SUB-015","basis":"reference"},{"id":"REL-004906","type":"contains","from":"EQP-A01.05","to":"SUB-016","basis":"reference"},{"id":"REL-004907","type":"contains","from":"EQP-A01.06","to":"SUB-002","basis":"reference"},{"id":"REL-004908","type":"contains","from":"EQP-A01.06","to":"SUB-003","basis":"reference"},{"id":"REL-004909","type":"contains","from":"EQP-A01.06","to":"SUB-008","basis":"reference"},{"id":"REL-004910","type":"contains","from":"EQP-A01.06","to":"SUB-011","basis":"reference"},{"id":"REL-004911","type":"contains","from":"EQP-A01.06","to":"SUB-013","basis":"reference"},{"id":"REL-004912","type":"contains","from":"EQP-A01.06","to":"SUB-014","basis":"reference"},{"id":"REL-004913","type":"contains","from":"EQP-A01.06","to":"SUB-015","basis":"reference"},{"id":"REL-004914","type":"contains","from":"EQP-A01.06","to":"SUB-016","basis":"reference"},{"id":"REL-004915","type":"contains","from":"EQP-A01.07","to":"SUB-002","basis":"reference"},{"id":"REL-004916","type":"contains","from":"EQP-A01.07","to":"SUB-003","basis":"reference"},{"id":"REL-004917","type":"contains","from":"EQP-A01.07","to":"SUB-008","basis":"reference"},{"id":"REL-004918","type":"contains","from":"EQP-A01.07","to":"SUB-011","basis":"reference"},{"id":"REL-004919","type":"contains","from":"EQP-A01.07","to":"SUB-013","basis":"reference"},{"id":"REL-004920","type":"contains","from":"EQP-A01.07","to":"SUB-014","basis":"reference"},{"id":"REL-004921","type":"contains","from":"EQP-A01.07","to":"SUB-015","basis":"reference"},{"id":"REL-004922","type":"contains","from":"EQP-A01.07","to":"SUB-016","basis":"reference"},{"id":"REL-004923","type":"contains","from":"EQP-A01.08","to":"SUB-001","basis":"reference"},{"id":"REL-004924","type":"contains","from":"EQP-A01.08","to":"SUB-002","basis":"reference"},{"id":"REL-004925","type":"contains","from":"EQP-A01.08","to":"SUB-003","basis":"reference"},{"id":"REL-004926","type":"contains","from":"EQP-A01.08","to":"SUB-008","basis":"reference"},{"id":"REL-004927","type":"contains","from":"EQP-A01.08","to":"SUB-009","basis":"reference"},{"id":"REL-004928","type":"contains","from":"EQP-A01.08","to":"SUB-011","basis":"reference"},{"id":"REL-004929","type":"contains","from":"EQP-A01.08","to":"SUB-013","basis":"reference"},{"id":"REL-004930","type":"contains","from":"EQP-A01.08","to":"SUB-014","basis":"reference"},{"id":"REL-004931","type":"contains","from":"EQP-A01.08","to":"SUB-015","basis":"reference"},{"id":"REL-004932","type":"contains","from":"EQP-A01.08","to":"SUB-016","basis":"reference"},{"id":"REL-004933","type":"contains","from":"EQP-A02","to":"SUB-007","basis":"reference"},{"id":"REL-004934","type":"contains","from":"EQP-A02","to":"SUB-008","basis":"reference"},{"id":"REL-004935","type":"contains","from":"EQP-A02","to":"SUB-013","basis":"reference"},{"id":"REL-004936","type":"contains","from":"EQP-A02","to":"SUB-014","basis":"reference"},{"id":"REL-004937","type":"contains","from":"EQP-A02","to":"SUB-015","basis":"reference"},{"id":"REL-004938","type":"contains","from":"EQP-A02","to":"SUB-016","basis":"reference"},{"id":"REL-004939","type":"contains","from":"EQP-A03","to":"SUB-007","basis":"reference"},{"id":"REL-004940","type":"contains","from":"EQP-A03","to":"SUB-008","basis":"reference"},{"id":"REL-004941","type":"contains","from":"EQP-A03","to":"SUB-013","basis":"reference"},{"id":"REL-004942","type":"contains","from":"EQP-A03","to":"SUB-014","basis":"reference"},{"id":"REL-004943","type":"contains","from":"EQP-A03","to":"SUB-015","basis":"reference"},{"id":"REL-004944","type":"contains","from":"EQP-A03","to":"SUB-016","basis":"reference"},{"id":"REL-004945","type":"contains","from":"EQP-A04","to":"SUB-007","basis":"reference"},{"id":"REL-004946","type":"contains","from":"EQP-A04","to":"SUB-008","basis":"reference"},{"id":"REL-004947","type":"contains","from":"EQP-A04","to":"SUB-013","basis":"reference"},{"id":"REL-004948","type":"contains","from":"EQP-A04","to":"SUB-014","basis":"reference"},{"id":"REL-004949","type":"contains","from":"EQP-A04","to":"SUB-015","basis":"reference"},{"id":"REL-004950","type":"contains","from":"EQP-A04","to":"SUB-016","basis":"reference"},{"id":"REL-004951","type":"contains","from":"EQP-A05","to":"SUB-007","basis":"reference"},{"id":"REL-004952","type":"contains","from":"EQP-A05","to":"SUB-008","basis":"reference"},{"id":"REL-004953","type":"contains","from":"EQP-A05","to":"SUB-013","basis":"reference"},{"id":"REL-004954","type":"contains","from":"EQP-A05","to":"SUB-014","basis":"reference"},{"id":"REL-004955","type":"contains","from":"EQP-A05","to":"SUB-015","basis":"reference"},{"id":"REL-004956","type":"contains","from":"EQP-A05","to":"SUB-016","basis":"reference"},{"id":"REL-004957","type":"contains","from":"EQP-A06","to":"SUB-008","basis":"reference"},{"id":"REL-004958","type":"contains","from":"EQP-A06","to":"SUB-013","basis":"reference"},{"id":"REL-004959","type":"contains","from":"EQP-A06","to":"SUB-014","basis":"reference"},{"id":"REL-004960","type":"contains","from":"EQP-A06","to":"SUB-015","basis":"reference"},{"id":"REL-004961","type":"contains","from":"EQP-A06","to":"SUB-016","basis":"reference"},{"id":"REL-004962","type":"contains","from":"EQP-A07","to":"SUB-005","basis":"reference"},{"id":"REL-004963","type":"contains","from":"EQP-A07","to":"SUB-008","basis":"reference"},{"id":"REL-004964","type":"contains","from":"EQP-A07","to":"SUB-013","basis":"reference"},{"id":"REL-004965","type":"contains","from":"EQP-A07","to":"SUB-014","basis":"reference"},{"id":"REL-004966","type":"contains","from":"EQP-A07","to":"SUB-015","basis":"reference"},{"id":"REL-004967","type":"contains","from":"EQP-A07","to":"SUB-016","basis":"reference"},{"id":"REL-004968","type":"contains","from":"EQP-A08","to":"SUB-004","basis":"reference"},{"id":"REL-004969","type":"contains","from":"EQP-A08","to":"SUB-005","basis":"reference"},{"id":"REL-004970","type":"contains","from":"EQP-A08","to":"SUB-006","basis":"reference"},{"id":"REL-004971","type":"contains","from":"EQP-A08","to":"SUB-008","basis":"reference"},{"id":"REL-004972","type":"contains","from":"EQP-A08","to":"SUB-011","basis":"reference"},{"id":"REL-004973","type":"contains","from":"EQP-A08","to":"SUB-013","basis":"reference"},{"id":"REL-004974","type":"contains","from":"EQP-A08","to":"SUB-014","basis":"reference"},{"id":"REL-004975","type":"contains","from":"EQP-A08","to":"SUB-015","basis":"reference"},{"id":"REL-004976","type":"contains","from":"EQP-A08","to":"SUB-016","basis":"reference"},{"id":"REL-004977","type":"contains","from":"EQP-A08.01","to":"SUB-004","basis":"reference"},{"id":"REL-004978","type":"contains","from":"EQP-A08.01","to":"SUB-005","basis":"reference"},{"id":"REL-004979","type":"contains","from":"EQP-A08.01","to":"SUB-006","basis":"reference"},{"id":"REL-004980","type":"contains","from":"EQP-A08.01","to":"SUB-008","basis":"reference"},{"id":"REL-004981","type":"contains","from":"EQP-A08.01","to":"SUB-011","basis":"reference"},{"id":"REL-004982","type":"contains","from":"EQP-A08.01","to":"SUB-013","basis":"reference"},{"id":"REL-004983","type":"contains","from":"EQP-A08.01","to":"SUB-014","basis":"reference"},{"id":"REL-004984","type":"contains","from":"EQP-A08.01","to":"SUB-015","basis":"reference"},{"id":"REL-004985","type":"contains","from":"EQP-A08.01","to":"SUB-016","basis":"reference"},{"id":"REL-004986","type":"contains","from":"EQP-A08.02","to":"SUB-004","basis":"reference"},{"id":"REL-004987","type":"contains","from":"EQP-A08.02","to":"SUB-005","basis":"reference"},{"id":"REL-004988","type":"contains","from":"EQP-A08.02","to":"SUB-006","basis":"reference"},{"id":"REL-004989","type":"contains","from":"EQP-A08.02","to":"SUB-008","basis":"reference"},{"id":"REL-004990","type":"contains","from":"EQP-A08.02","to":"SUB-011","basis":"reference"},{"id":"REL-004991","type":"contains","from":"EQP-A08.02","to":"SUB-013","basis":"reference"},{"id":"REL-004992","type":"contains","from":"EQP-A08.02","to":"SUB-014","basis":"reference"},{"id":"REL-004993","type":"contains","from":"EQP-A08.02","to":"SUB-015","basis":"reference"},{"id":"REL-004994","type":"contains","from":"EQP-A08.02","to":"SUB-016","basis":"reference"},{"id":"REL-004995","type":"contains","from":"EQP-A08.03","to":"SUB-004","basis":"reference"},{"id":"REL-004996","type":"contains","from":"EQP-A08.03","to":"SUB-005","basis":"reference"},{"id":"REL-004997","type":"contains","from":"EQP-A08.03","to":"SUB-006","basis":"reference"},{"id":"REL-004998","type":"contains","from":"EQP-A08.03","to":"SUB-008","basis":"reference"},{"id":"REL-004999","type":"contains","from":"EQP-A08.03","to":"SUB-011","basis":"reference"},{"id":"REL-005000","type":"contains","from":"EQP-A08.03","to":"SUB-013","basis":"reference"},{"id":"REL-005001","type":"contains","from":"EQP-A08.03","to":"SUB-014","basis":"reference"},{"id":"REL-005002","type":"contains","from":"EQP-A08.03","to":"SUB-015","basis":"reference"},{"id":"REL-005003","type":"contains","from":"EQP-A08.03","to":"SUB-016","basis":"reference"},{"id":"REL-005004","type":"contains","from":"EQP-A08.04","to":"SUB-004","basis":"reference"},{"id":"REL-005005","type":"contains","from":"EQP-A08.04","to":"SUB-005","basis":"reference"},{"id":"REL-005006","type":"contains","from":"EQP-A08.04","to":"SUB-006","basis":"reference"},{"id":"REL-005007","type":"contains","from":"EQP-A08.04","to":"SUB-008","basis":"reference"},{"id":"REL-005008","type":"contains","from":"EQP-A08.04","to":"SUB-011","basis":"reference"},{"id":"REL-005009","type":"contains","from":"EQP-A08.04","to":"SUB-013","basis":"reference"},{"id":"REL-005010","type":"contains","from":"EQP-A08.04","to":"SUB-014","basis":"reference"},{"id":"REL-005011","type":"contains","from":"EQP-A08.04","to":"SUB-015","basis":"reference"},{"id":"REL-005012","type":"contains","from":"EQP-A08.04","to":"SUB-016","basis":"reference"},{"id":"REL-005013","type":"contains","from":"EQP-A08.05","to":"SUB-004","basis":"reference"},{"id":"REL-005014","type":"contains","from":"EQP-A08.05","to":"SUB-005","basis":"reference"},{"id":"REL-005015","type":"contains","from":"EQP-A08.05","to":"SUB-006","basis":"reference"},{"id":"REL-005016","type":"contains","from":"EQP-A08.05","to":"SUB-008","basis":"reference"},{"id":"REL-005017","type":"contains","from":"EQP-A08.05","to":"SUB-011","basis":"reference"},{"id":"REL-005018","type":"contains","from":"EQP-A08.05","to":"SUB-013","basis":"reference"},{"id":"REL-005019","type":"contains","from":"EQP-A08.05","to":"SUB-014","basis":"reference"},{"id":"REL-005020","type":"contains","from":"EQP-A08.05","to":"SUB-015","basis":"reference"},{"id":"REL-005021","type":"contains","from":"EQP-A08.05","to":"SUB-016","basis":"reference"},{"id":"REL-005022","type":"contains","from":"EQP-A08.06","to":"SUB-004","basis":"reference"},{"id":"REL-005023","type":"contains","from":"EQP-A08.06","to":"SUB-005","basis":"reference"},{"id":"REL-005024","type":"contains","from":"EQP-A08.06","to":"SUB-006","basis":"reference"},{"id":"REL-005025","type":"contains","from":"EQP-A08.06","to":"SUB-008","basis":"reference"},{"id":"REL-005026","type":"contains","from":"EQP-A08.06","to":"SUB-011","basis":"reference"},{"id":"REL-005027","type":"contains","from":"EQP-A08.06","to":"SUB-013","basis":"reference"},{"id":"REL-005028","type":"contains","from":"EQP-A08.06","to":"SUB-014","basis":"reference"},{"id":"REL-005029","type":"contains","from":"EQP-A08.06","to":"SUB-015","basis":"reference"},{"id":"REL-005030","type":"contains","from":"EQP-A08.06","to":"SUB-016","basis":"reference"},{"id":"REL-005031","type":"contains","from":"EQP-A09","to":"SUB-004","basis":"reference"},{"id":"REL-005032","type":"contains","from":"EQP-A09","to":"SUB-006","basis":"reference"},{"id":"REL-005033","type":"contains","from":"EQP-A09","to":"SUB-008","basis":"reference"},{"id":"REL-005034","type":"contains","from":"EQP-A09","to":"SUB-011","basis":"reference"},{"id":"REL-005035","type":"contains","from":"EQP-A09","to":"SUB-013","basis":"reference"},{"id":"REL-005036","type":"contains","from":"EQP-A09","to":"SUB-014","basis":"reference"},{"id":"REL-005037","type":"contains","from":"EQP-A09","to":"SUB-015","basis":"reference"},{"id":"REL-005038","type":"contains","from":"EQP-A09","to":"SUB-016","basis":"reference"},{"id":"REL-005039","type":"contains","from":"EQP-A09.01","to":"SUB-004","basis":"reference"},{"id":"REL-005040","type":"contains","from":"EQP-A09.01","to":"SUB-006","basis":"reference"},{"id":"REL-005041","type":"contains","from":"EQP-A09.01","to":"SUB-008","basis":"reference"},{"id":"REL-005042","type":"contains","from":"EQP-A09.01","to":"SUB-011","basis":"reference"},{"id":"REL-005043","type":"contains","from":"EQP-A09.01","to":"SUB-013","basis":"reference"},{"id":"REL-005044","type":"contains","from":"EQP-A09.01","to":"SUB-014","basis":"reference"},{"id":"REL-005045","type":"contains","from":"EQP-A09.01","to":"SUB-015","basis":"reference"},{"id":"REL-005046","type":"contains","from":"EQP-A09.01","to":"SUB-016","basis":"reference"},{"id":"REL-005047","type":"contains","from":"EQP-A09.02","to":"SUB-004","basis":"reference"},{"id":"REL-005048","type":"contains","from":"EQP-A09.02","to":"SUB-005","basis":"reference"},{"id":"REL-005049","type":"contains","from":"EQP-A09.02","to":"SUB-006","basis":"reference"},{"id":"REL-005050","type":"contains","from":"EQP-A09.02","to":"SUB-008","basis":"reference"},{"id":"REL-005051","type":"contains","from":"EQP-A09.02","to":"SUB-011","basis":"reference"},{"id":"REL-005052","type":"contains","from":"EQP-A09.02","to":"SUB-013","basis":"reference"},{"id":"REL-005053","type":"contains","from":"EQP-A09.02","to":"SUB-014","basis":"reference"},{"id":"REL-005054","type":"contains","from":"EQP-A09.02","to":"SUB-015","basis":"reference"},{"id":"REL-005055","type":"contains","from":"EQP-A09.02","to":"SUB-016","basis":"reference"},{"id":"REL-005056","type":"contains","from":"EQP-A09.03","to":"SUB-004","basis":"reference"},{"id":"REL-005057","type":"contains","from":"EQP-A09.03","to":"SUB-006","basis":"reference"},{"id":"REL-005058","type":"contains","from":"EQP-A09.03","to":"SUB-008","basis":"reference"},{"id":"REL-005059","type":"contains","from":"EQP-A09.03","to":"SUB-011","basis":"reference"},{"id":"REL-005060","type":"contains","from":"EQP-A09.03","to":"SUB-013","basis":"reference"},{"id":"REL-005061","type":"contains","from":"EQP-A09.03","to":"SUB-014","basis":"reference"},{"id":"REL-005062","type":"contains","from":"EQP-A09.03","to":"SUB-015","basis":"reference"},{"id":"REL-005063","type":"contains","from":"EQP-A09.03","to":"SUB-016","basis":"reference"},{"id":"REL-005064","type":"contains","from":"EQP-A09.04","to":"SUB-004","basis":"reference"},{"id":"REL-005065","type":"contains","from":"EQP-A09.04","to":"SUB-005","basis":"reference"},{"id":"REL-005066","type":"contains","from":"EQP-A09.04","to":"SUB-006","basis":"reference"},{"id":"REL-005067","type":"contains","from":"EQP-A09.04","to":"SUB-008","basis":"reference"},{"id":"REL-005068","type":"contains","from":"EQP-A09.04","to":"SUB-011","basis":"reference"},{"id":"REL-005069","type":"contains","from":"EQP-A09.04","to":"SUB-013","basis":"reference"},{"id":"REL-005070","type":"contains","from":"EQP-A09.04","to":"SUB-014","basis":"reference"},{"id":"REL-005071","type":"contains","from":"EQP-A09.04","to":"SUB-015","basis":"reference"},{"id":"REL-005072","type":"contains","from":"EQP-A09.04","to":"SUB-016","basis":"reference"},{"id":"REL-005073","type":"contains","from":"EQP-A09.05","to":"SUB-004","basis":"reference"},{"id":"REL-005074","type":"contains","from":"EQP-A09.05","to":"SUB-006","basis":"reference"},{"id":"REL-005075","type":"contains","from":"EQP-A09.05","to":"SUB-008","basis":"reference"},{"id":"REL-005076","type":"contains","from":"EQP-A09.05","to":"SUB-011","basis":"reference"},{"id":"REL-005077","type":"contains","from":"EQP-A09.05","to":"SUB-013","basis":"reference"},{"id":"REL-005078","type":"contains","from":"EQP-A09.05","to":"SUB-014","basis":"reference"},{"id":"REL-005079","type":"contains","from":"EQP-A09.05","to":"SUB-015","basis":"reference"},{"id":"REL-005080","type":"contains","from":"EQP-A09.05","to":"SUB-016","basis":"reference"},{"id":"REL-005081","type":"contains","from":"EQP-A09.06","to":"SUB-004","basis":"reference"},{"id":"REL-005082","type":"contains","from":"EQP-A09.06","to":"SUB-005","basis":"reference"},{"id":"REL-005083","type":"contains","from":"EQP-A09.06","to":"SUB-006","basis":"reference"},{"id":"REL-005084","type":"contains","from":"EQP-A09.06","to":"SUB-008","basis":"reference"},{"id":"REL-005085","type":"contains","from":"EQP-A09.06","to":"SUB-011","basis":"reference"},{"id":"REL-005086","type":"contains","from":"EQP-A09.06","to":"SUB-013","basis":"reference"},{"id":"REL-005087","type":"contains","from":"EQP-A09.06","to":"SUB-014","basis":"reference"},{"id":"REL-005088","type":"contains","from":"EQP-A09.06","to":"SUB-015","basis":"reference"},{"id":"REL-005089","type":"contains","from":"EQP-A09.06","to":"SUB-016","basis":"reference"},{"id":"REL-005090","type":"contains","from":"EQP-A09.07","to":"SUB-004","basis":"reference"},{"id":"REL-005091","type":"contains","from":"EQP-A09.07","to":"SUB-005","basis":"reference"},{"id":"REL-005092","type":"contains","from":"EQP-A09.07","to":"SUB-006","basis":"reference"},{"id":"REL-005093","type":"contains","from":"EQP-A09.07","to":"SUB-008","basis":"reference"},{"id":"REL-005094","type":"contains","from":"EQP-A09.07","to":"SUB-011","basis":"reference"},{"id":"REL-005095","type":"contains","from":"EQP-A09.07","to":"SUB-013","basis":"reference"},{"id":"REL-005096","type":"contains","from":"EQP-A09.07","to":"SUB-014","basis":"reference"},{"id":"REL-005097","type":"contains","from":"EQP-A09.07","to":"SUB-015","basis":"reference"},{"id":"REL-005098","type":"contains","from":"EQP-A09.07","to":"SUB-016","basis":"reference"},{"id":"REL-005099","type":"contains","from":"EQP-A09.08","to":"SUB-004","basis":"reference"},{"id":"REL-005100","type":"contains","from":"EQP-A09.08","to":"SUB-005","basis":"reference"},{"id":"REL-005101","type":"contains","from":"EQP-A09.08","to":"SUB-006","basis":"reference"},{"id":"REL-005102","type":"contains","from":"EQP-A09.08","to":"SUB-008","basis":"reference"},{"id":"REL-005103","type":"contains","from":"EQP-A09.08","to":"SUB-011","basis":"reference"},{"id":"REL-005104","type":"contains","from":"EQP-A09.08","to":"SUB-013","basis":"reference"},{"id":"REL-005105","type":"contains","from":"EQP-A09.08","to":"SUB-014","basis":"reference"},{"id":"REL-005106","type":"contains","from":"EQP-A09.08","to":"SUB-015","basis":"reference"},{"id":"REL-005107","type":"contains","from":"EQP-A09.08","to":"SUB-016","basis":"reference"},{"id":"REL-005108","type":"contains","from":"EQP-A09.09","to":"SUB-004","basis":"reference"},{"id":"REL-005109","type":"contains","from":"EQP-A09.09","to":"SUB-006","basis":"reference"},{"id":"REL-005110","type":"contains","from":"EQP-A09.09","to":"SUB-008","basis":"reference"},{"id":"REL-005111","type":"contains","from":"EQP-A09.09","to":"SUB-011","basis":"reference"},{"id":"REL-005112","type":"contains","from":"EQP-A09.09","to":"SUB-013","basis":"reference"},{"id":"REL-005113","type":"contains","from":"EQP-A09.09","to":"SUB-014","basis":"reference"},{"id":"REL-005114","type":"contains","from":"EQP-A09.09","to":"SUB-015","basis":"reference"},{"id":"REL-005115","type":"contains","from":"EQP-A09.09","to":"SUB-016","basis":"reference"},{"id":"REL-005116","type":"contains","from":"EQP-A09.10","to":"SUB-004","basis":"reference"},{"id":"REL-005117","type":"contains","from":"EQP-A09.10","to":"SUB-006","basis":"reference"},{"id":"REL-005118","type":"contains","from":"EQP-A09.10","to":"SUB-008","basis":"reference"},{"id":"REL-005119","type":"contains","from":"EQP-A09.10","to":"SUB-011","basis":"reference"},{"id":"REL-005120","type":"contains","from":"EQP-A09.10","to":"SUB-013","basis":"reference"},{"id":"REL-005121","type":"contains","from":"EQP-A09.10","to":"SUB-014","basis":"reference"},{"id":"REL-005122","type":"contains","from":"EQP-A09.10","to":"SUB-015","basis":"reference"},{"id":"REL-005123","type":"contains","from":"EQP-A09.10","to":"SUB-016","basis":"reference"},{"id":"REL-005124","type":"contains","from":"EQP-A09.11","to":"SUB-004","basis":"reference"},{"id":"REL-005125","type":"contains","from":"EQP-A09.11","to":"SUB-006","basis":"reference"},{"id":"REL-005126","type":"contains","from":"EQP-A09.11","to":"SUB-008","basis":"reference"},{"id":"REL-005127","type":"contains","from":"EQP-A09.11","to":"SUB-011","basis":"reference"},{"id":"REL-005128","type":"contains","from":"EQP-A09.11","to":"SUB-013","basis":"reference"},{"id":"REL-005129","type":"contains","from":"EQP-A09.11","to":"SUB-014","basis":"reference"},{"id":"REL-005130","type":"contains","from":"EQP-A09.11","to":"SUB-015","basis":"reference"},{"id":"REL-005131","type":"contains","from":"EQP-A09.11","to":"SUB-016","basis":"reference"},{"id":"REL-005132","type":"contains","from":"EQP-A10","to":"SUB-004","basis":"reference"},{"id":"REL-005133","type":"contains","from":"EQP-A10","to":"SUB-006","basis":"reference"},{"id":"REL-005134","type":"contains","from":"EQP-A10","to":"SUB-008","basis":"reference"},{"id":"REL-005135","type":"contains","from":"EQP-A10","to":"SUB-011","basis":"reference"},{"id":"REL-005136","type":"contains","from":"EQP-A10","to":"SUB-013","basis":"reference"},{"id":"REL-005137","type":"contains","from":"EQP-A10","to":"SUB-014","basis":"reference"},{"id":"REL-005138","type":"contains","from":"EQP-A10","to":"SUB-015","basis":"reference"},{"id":"REL-005139","type":"contains","from":"EQP-A10","to":"SUB-016","basis":"reference"},{"id":"REL-005140","type":"contains","from":"EQP-A11","to":"SUB-006","basis":"reference"},{"id":"REL-005141","type":"contains","from":"EQP-A11","to":"SUB-008","basis":"reference"},{"id":"REL-005142","type":"contains","from":"EQP-A11","to":"SUB-012","basis":"reference"},{"id":"REL-005143","type":"contains","from":"EQP-A11","to":"SUB-013","basis":"reference"},{"id":"REL-005144","type":"contains","from":"EQP-A11","to":"SUB-014","basis":"reference"},{"id":"REL-005145","type":"contains","from":"EQP-A11","to":"SUB-015","basis":"reference"},{"id":"REL-005146","type":"contains","from":"EQP-A11","to":"SUB-016","basis":"reference"},{"id":"REL-005147","type":"contains","from":"EQP-A12","to":"SUB-006","basis":"reference"},{"id":"REL-005148","type":"contains","from":"EQP-A12","to":"SUB-008","basis":"reference"},{"id":"REL-005149","type":"contains","from":"EQP-A12","to":"SUB-012","basis":"reference"},{"id":"REL-005150","type":"contains","from":"EQP-A12","to":"SUB-013","basis":"reference"},{"id":"REL-005151","type":"contains","from":"EQP-A12","to":"SUB-014","basis":"reference"},{"id":"REL-005152","type":"contains","from":"EQP-A12","to":"SUB-015","basis":"reference"},{"id":"REL-005153","type":"contains","from":"EQP-A12","to":"SUB-016","basis":"reference"},{"id":"REL-005154","type":"contains","from":"EQP-A13","to":"SUB-008","basis":"reference"},{"id":"REL-005155","type":"contains","from":"EQP-A13","to":"SUB-012","basis":"reference"},{"id":"REL-005156","type":"contains","from":"EQP-A13","to":"SUB-013","basis":"reference"},{"id":"REL-005157","type":"contains","from":"EQP-A13","to":"SUB-014","basis":"reference"},{"id":"REL-005158","type":"contains","from":"EQP-A13","to":"SUB-015","basis":"reference"},{"id":"REL-005159","type":"contains","from":"EQP-A13","to":"SUB-016","basis":"reference"},{"id":"REL-005160","type":"contains","from":"EQP-A14","to":"SUB-001","basis":"reference"},{"id":"REL-005161","type":"contains","from":"EQP-A14","to":"SUB-002","basis":"reference"},{"id":"REL-005162","type":"contains","from":"EQP-A14","to":"SUB-003","basis":"reference"},{"id":"REL-005163","type":"contains","from":"EQP-A14","to":"SUB-008","basis":"reference"},{"id":"REL-005164","type":"contains","from":"EQP-A14","to":"SUB-009","basis":"reference"},{"id":"REL-005165","type":"contains","from":"EQP-A14","to":"SUB-011","basis":"reference"},{"id":"REL-005166","type":"contains","from":"EQP-A14","to":"SUB-013","basis":"reference"},{"id":"REL-005167","type":"contains","from":"EQP-A14","to":"SUB-014","basis":"reference"},{"id":"REL-005168","type":"contains","from":"EQP-A14","to":"SUB-015","basis":"reference"},{"id":"REL-005169","type":"contains","from":"EQP-A14","to":"SUB-016","basis":"reference"},{"id":"REL-005170","type":"contains","from":"EQP-A15","to":"SUB-001","basis":"reference"},{"id":"REL-005171","type":"contains","from":"EQP-A15","to":"SUB-002","basis":"reference"},{"id":"REL-005172","type":"contains","from":"EQP-A15","to":"SUB-003","basis":"reference"},{"id":"REL-005173","type":"contains","from":"EQP-A15","to":"SUB-008","basis":"reference"},{"id":"REL-005174","type":"contains","from":"EQP-A15","to":"SUB-009","basis":"reference"},{"id":"REL-005175","type":"contains","from":"EQP-A15","to":"SUB-011","basis":"reference"},{"id":"REL-005176","type":"contains","from":"EQP-A15","to":"SUB-013","basis":"reference"},{"id":"REL-005177","type":"contains","from":"EQP-A15","to":"SUB-014","basis":"reference"},{"id":"REL-005178","type":"contains","from":"EQP-A15","to":"SUB-015","basis":"reference"},{"id":"REL-005179","type":"contains","from":"EQP-A15","to":"SUB-016","basis":"reference"},{"id":"REL-005180","type":"contains","from":"EQP-A16","to":"SUB-006","basis":"reference"},{"id":"REL-005181","type":"contains","from":"EQP-A16","to":"SUB-008","basis":"reference"},{"id":"REL-005182","type":"contains","from":"EQP-A16","to":"SUB-012","basis":"reference"},{"id":"REL-005183","type":"contains","from":"EQP-A16","to":"SUB-013","basis":"reference"},{"id":"REL-005184","type":"contains","from":"EQP-A16","to":"SUB-014","basis":"reference"},{"id":"REL-005185","type":"contains","from":"EQP-A16","to":"SUB-015","basis":"reference"},{"id":"REL-005186","type":"contains","from":"EQP-A16","to":"SUB-016","basis":"reference"},{"id":"REL-005187","type":"contains","from":"EQP-A17","to":"SUB-008","basis":"reference"},{"id":"REL-005188","type":"contains","from":"EQP-A17","to":"SUB-013","basis":"reference"},{"id":"REL-005189","type":"contains","from":"EQP-A17","to":"SUB-014","basis":"reference"},{"id":"REL-005190","type":"contains","from":"EQP-A17","to":"SUB-015","basis":"reference"},{"id":"REL-005191","type":"contains","from":"EQP-A17","to":"SUB-016","basis":"reference"},{"id":"REL-005192","type":"contains","from":"EQP-A18","to":"SUB-007","basis":"reference"},{"id":"REL-005193","type":"contains","from":"EQP-A18","to":"SUB-008","basis":"reference"},{"id":"REL-005194","type":"contains","from":"EQP-A18","to":"SUB-013","basis":"reference"},{"id":"REL-005195","type":"contains","from":"EQP-A18","to":"SUB-014","basis":"reference"},{"id":"REL-005196","type":"contains","from":"EQP-A18","to":"SUB-015","basis":"reference"},{"id":"REL-005197","type":"contains","from":"EQP-A18","to":"SUB-016","basis":"reference"},{"id":"REL-005198","type":"contains","from":"EQP-A19","to":"SUB-007","basis":"reference"},{"id":"REL-005199","type":"contains","from":"EQP-A19","to":"SUB-008","basis":"reference"},{"id":"REL-005200","type":"contains","from":"EQP-A19","to":"SUB-013","basis":"reference"},{"id":"REL-005201","type":"contains","from":"EQP-A19","to":"SUB-014","basis":"reference"},{"id":"REL-005202","type":"contains","from":"EQP-A19","to":"SUB-015","basis":"reference"},{"id":"REL-005203","type":"contains","from":"EQP-A19","to":"SUB-016","basis":"reference"},{"id":"REL-005204","type":"contains","from":"EQP-A20","to":"SUB-008","basis":"reference"},{"id":"REL-005205","type":"contains","from":"EQP-A20","to":"SUB-013","basis":"reference"},{"id":"REL-005206","type":"contains","from":"EQP-A20","to":"SUB-014","basis":"reference"},{"id":"REL-005207","type":"contains","from":"EQP-A20","to":"SUB-015","basis":"reference"},{"id":"REL-005208","type":"contains","from":"EQP-A20","to":"SUB-016","basis":"reference"},{"id":"REL-005209","type":"contains","from":"EQP-A21","to":"SUB-002","basis":"reference"},{"id":"REL-005210","type":"contains","from":"EQP-A21","to":"SUB-008","basis":"reference"},{"id":"REL-005211","type":"contains","from":"EQP-A21","to":"SUB-009","basis":"reference"},{"id":"REL-005212","type":"contains","from":"EQP-A21","to":"SUB-013","basis":"reference"},{"id":"REL-005213","type":"contains","from":"EQP-A21","to":"SUB-014","basis":"reference"},{"id":"REL-005214","type":"contains","from":"EQP-A21","to":"SUB-015","basis":"reference"},{"id":"REL-005215","type":"contains","from":"EQP-A21","to":"SUB-016","basis":"reference"},{"id":"REL-005216","type":"contains","from":"EQP-A22","to":"SUB-002","basis":"reference"},{"id":"REL-005217","type":"contains","from":"EQP-A22","to":"SUB-008","basis":"reference"},{"id":"REL-005218","type":"contains","from":"EQP-A22","to":"SUB-009","basis":"reference"},{"id":"REL-005219","type":"contains","from":"EQP-A22","to":"SUB-013","basis":"reference"},{"id":"REL-005220","type":"contains","from":"EQP-A22","to":"SUB-014","basis":"reference"},{"id":"REL-005221","type":"contains","from":"EQP-A22","to":"SUB-015","basis":"reference"},{"id":"REL-005222","type":"contains","from":"EQP-A22","to":"SUB-016","basis":"reference"},{"id":"REL-005223","type":"contains","from":"EQP-A23","to":"SUB-001","basis":"reference"},{"id":"REL-005224","type":"contains","from":"EQP-A23","to":"SUB-002","basis":"reference"},{"id":"REL-005225","type":"contains","from":"EQP-A23","to":"SUB-003","basis":"reference"},{"id":"REL-005226","type":"contains","from":"EQP-A23","to":"SUB-008","basis":"reference"},{"id":"REL-005227","type":"contains","from":"EQP-A23","to":"SUB-009","basis":"reference"},{"id":"REL-005228","type":"contains","from":"EQP-A23","to":"SUB-011","basis":"reference"},{"id":"REL-005229","type":"contains","from":"EQP-A23","to":"SUB-013","basis":"reference"},{"id":"REL-005230","type":"contains","from":"EQP-A23","to":"SUB-014","basis":"reference"},{"id":"REL-005231","type":"contains","from":"EQP-A23","to":"SUB-015","basis":"reference"},{"id":"REL-005232","type":"contains","from":"EQP-A23","to":"SUB-016","basis":"reference"},{"id":"REL-005233","type":"contains","from":"EQP-A24","to":"SUB-004","basis":"reference"},{"id":"REL-005234","type":"contains","from":"EQP-A24","to":"SUB-008","basis":"reference"},{"id":"REL-005235","type":"contains","from":"EQP-A24","to":"SUB-013","basis":"reference"},{"id":"REL-005236","type":"contains","from":"EQP-A24","to":"SUB-014","basis":"reference"},{"id":"REL-005237","type":"contains","from":"EQP-A24","to":"SUB-015","basis":"reference"},{"id":"REL-005238","type":"contains","from":"EQP-A24","to":"SUB-016","basis":"reference"},{"id":"REL-005239","type":"contains","from":"EQP-A25","to":"SUB-008","basis":"reference"},{"id":"REL-005240","type":"contains","from":"EQP-A25","to":"SUB-010","basis":"reference"},{"id":"REL-005241","type":"contains","from":"EQP-A25","to":"SUB-013","basis":"reference"},{"id":"REL-005242","type":"contains","from":"EQP-A25","to":"SUB-014","basis":"reference"},{"id":"REL-005243","type":"contains","from":"EQP-A25","to":"SUB-015","basis":"reference"},{"id":"REL-005244","type":"contains","from":"EQP-A25","to":"SUB-016","basis":"reference"},{"id":"REL-005245","type":"contains","from":"EQP-A26","to":"SUB-004","basis":"reference"},{"id":"REL-005246","type":"contains","from":"EQP-A26","to":"SUB-008","basis":"reference"},{"id":"REL-005247","type":"contains","from":"EQP-A26","to":"SUB-010","basis":"reference"},{"id":"REL-005248","type":"contains","from":"EQP-A26","to":"SUB-013","basis":"reference"},{"id":"REL-005249","type":"contains","from":"EQP-A26","to":"SUB-014","basis":"reference"},{"id":"REL-005250","type":"contains","from":"EQP-A26","to":"SUB-015","basis":"reference"},{"id":"REL-005251","type":"contains","from":"EQP-A26","to":"SUB-016","basis":"reference"},{"id":"REL-005252","type":"contains","from":"EQP-A27","to":"SUB-008","basis":"reference"},{"id":"REL-005253","type":"contains","from":"EQP-A27","to":"SUB-010","basis":"reference"},{"id":"REL-005254","type":"contains","from":"EQP-A27","to":"SUB-013","basis":"reference"},{"id":"REL-005255","type":"contains","from":"EQP-A27","to":"SUB-014","basis":"reference"},{"id":"REL-005256","type":"contains","from":"EQP-A27","to":"SUB-015","basis":"reference"},{"id":"REL-005257","type":"contains","from":"EQP-A27","to":"SUB-016","basis":"reference"},{"id":"REL-005258","type":"contains","from":"EQP-A28","to":"SUB-008","basis":"reference"},{"id":"REL-005259","type":"contains","from":"EQP-A28","to":"SUB-010","basis":"reference"},{"id":"REL-005260","type":"contains","from":"EQP-A28","to":"SUB-013","basis":"reference"},{"id":"REL-005261","type":"contains","from":"EQP-A28","to":"SUB-014","basis":"reference"},{"id":"REL-005262","type":"contains","from":"EQP-A28","to":"SUB-015","basis":"reference"},{"id":"REL-005263","type":"contains","from":"EQP-A28","to":"SUB-016","basis":"reference"},{"id":"REL-005264","type":"contains","from":"EQP-A30","to":"SUB-008","basis":"reference"},{"id":"REL-005265","type":"contains","from":"EQP-A30","to":"SUB-010","basis":"reference"},{"id":"REL-005266","type":"contains","from":"EQP-A30","to":"SUB-013","basis":"reference"},{"id":"REL-005267","type":"contains","from":"EQP-A30","to":"SUB-014","basis":"reference"},{"id":"REL-005268","type":"contains","from":"EQP-A30","to":"SUB-015","basis":"reference"},{"id":"REL-005269","type":"contains","from":"EQP-A30","to":"SUB-016","basis":"reference"},{"id":"REL-005270","type":"contains","from":"EQP-A31","to":"SUB-001","basis":"reference"},{"id":"REL-005271","type":"contains","from":"EQP-A31","to":"SUB-002","basis":"reference"},{"id":"REL-005272","type":"contains","from":"EQP-A31","to":"SUB-003","basis":"reference"},{"id":"REL-005273","type":"contains","from":"EQP-A31","to":"SUB-008","basis":"reference"},{"id":"REL-005274","type":"contains","from":"EQP-A31","to":"SUB-009","basis":"reference"},{"id":"REL-005275","type":"contains","from":"EQP-A31","to":"SUB-011","basis":"reference"},{"id":"REL-005276","type":"contains","from":"EQP-A31","to":"SUB-013","basis":"reference"},{"id":"REL-005277","type":"contains","from":"EQP-A31","to":"SUB-014","basis":"reference"},{"id":"REL-005278","type":"contains","from":"EQP-A31","to":"SUB-015","basis":"reference"},{"id":"REL-005279","type":"contains","from":"EQP-A31","to":"SUB-016","basis":"reference"},{"id":"REL-005280","type":"contains","from":"EQP-A32","to":"SUB-008","basis":"reference"},{"id":"REL-005281","type":"contains","from":"EQP-A32","to":"SUB-013","basis":"reference"},{"id":"REL-005282","type":"contains","from":"EQP-A32","to":"SUB-014","basis":"reference"},{"id":"REL-005283","type":"contains","from":"EQP-A32","to":"SUB-015","basis":"reference"},{"id":"REL-005284","type":"contains","from":"EQP-A32","to":"SUB-016","basis":"reference"},{"id":"REL-005285","type":"contains","from":"EQP-A33","to":"SUB-003","basis":"reference"},{"id":"REL-005286","type":"contains","from":"EQP-A33","to":"SUB-008","basis":"reference"},{"id":"REL-005287","type":"contains","from":"EQP-A33","to":"SUB-013","basis":"reference"},{"id":"REL-005288","type":"contains","from":"EQP-A33","to":"SUB-014","basis":"reference"},{"id":"REL-005289","type":"contains","from":"EQP-A33","to":"SUB-015","basis":"reference"},{"id":"REL-005290","type":"contains","from":"EQP-A33","to":"SUB-016","basis":"reference"},{"id":"REL-005291","type":"contains","from":"EQP-A34","to":"SUB-008","basis":"reference"},{"id":"REL-005292","type":"contains","from":"EQP-A34","to":"SUB-013","basis":"reference"},{"id":"REL-005293","type":"contains","from":"EQP-A34","to":"SUB-014","basis":"reference"},{"id":"REL-005294","type":"contains","from":"EQP-A34","to":"SUB-015","basis":"reference"},{"id":"REL-005295","type":"contains","from":"EQP-A34","to":"SUB-016","basis":"reference"},{"id":"REL-005296","type":"contains","from":"EQP-A36","to":"SUB-008","basis":"reference"},{"id":"REL-005297","type":"contains","from":"EQP-A36","to":"SUB-013","basis":"reference"},{"id":"REL-005298","type":"contains","from":"EQP-A36","to":"SUB-014","basis":"reference"},{"id":"REL-005299","type":"contains","from":"EQP-A36","to":"SUB-015","basis":"reference"},{"id":"REL-005300","type":"contains","from":"EQP-A36","to":"SUB-016","basis":"reference"},{"id":"REL-005301","type":"contains","from":"EQP-A37","to":"SUB-008","basis":"reference"},{"id":"REL-005302","type":"contains","from":"EQP-A37","to":"SUB-013","basis":"reference"},{"id":"REL-005303","type":"contains","from":"EQP-A37","to":"SUB-014","basis":"reference"},{"id":"REL-005304","type":"contains","from":"EQP-A37","to":"SUB-015","basis":"reference"},{"id":"REL-005305","type":"contains","from":"EQP-A37","to":"SUB-016","basis":"reference"},{"id":"REL-005306","type":"contains","from":"EQP-A38","to":"SUB-008","basis":"reference"},{"id":"REL-005307","type":"contains","from":"EQP-A38","to":"SUB-013","basis":"reference"},{"id":"REL-005308","type":"contains","from":"EQP-A38","to":"SUB-014","basis":"reference"},{"id":"REL-005309","type":"contains","from":"EQP-A38","to":"SUB-015","basis":"reference"},{"id":"REL-005310","type":"contains","from":"EQP-A38","to":"SUB-016","basis":"reference"},{"id":"REL-005311","type":"contains","from":"EQP-A39","to":"SUB-004","basis":"reference"},{"id":"REL-005312","type":"contains","from":"EQP-A39","to":"SUB-008","basis":"reference"},{"id":"REL-005313","type":"contains","from":"EQP-A39","to":"SUB-013","basis":"reference"},{"id":"REL-005314","type":"contains","from":"EQP-A39","to":"SUB-014","basis":"reference"},{"id":"REL-005315","type":"contains","from":"EQP-A39","to":"SUB-015","basis":"reference"},{"id":"REL-005316","type":"contains","from":"EQP-A39","to":"SUB-016","basis":"reference"},{"id":"REL-005317","type":"contains","from":"EQP-A40","to":"SUB-008","basis":"reference"},{"id":"REL-005318","type":"contains","from":"EQP-A40","to":"SUB-013","basis":"reference"},{"id":"REL-005319","type":"contains","from":"EQP-A40","to":"SUB-014","basis":"reference"},{"id":"REL-005320","type":"contains","from":"EQP-A40","to":"SUB-015","basis":"reference"},{"id":"REL-005321","type":"contains","from":"EQP-A40","to":"SUB-016","basis":"reference"},{"id":"REL-005322","type":"contains","from":"EQP-A41","to":"SUB-004","basis":"reference"},{"id":"REL-005323","type":"contains","from":"EQP-A41","to":"SUB-008","basis":"reference"},{"id":"REL-005324","type":"contains","from":"EQP-A41","to":"SUB-013","basis":"reference"},{"id":"REL-005325","type":"contains","from":"EQP-A41","to":"SUB-014","basis":"reference"},{"id":"REL-005326","type":"contains","from":"EQP-A41","to":"SUB-015","basis":"reference"},{"id":"REL-005327","type":"contains","from":"EQP-A41","to":"SUB-016","basis":"reference"},{"id":"REL-005328","type":"contains","from":"EQP-A42","to":"SUB-004","basis":"reference"},{"id":"REL-005329","type":"contains","from":"EQP-A42","to":"SUB-008","basis":"reference"},{"id":"REL-005330","type":"contains","from":"EQP-A42","to":"SUB-013","basis":"reference"},{"id":"REL-005331","type":"contains","from":"EQP-A42","to":"SUB-014","basis":"reference"},{"id":"REL-005332","type":"contains","from":"EQP-A42","to":"SUB-015","basis":"reference"},{"id":"REL-005333","type":"contains","from":"EQP-A42","to":"SUB-016","basis":"reference"},{"id":"REL-005334","type":"contains","from":"EQP-A43","to":"SUB-006","basis":"reference"},{"id":"REL-005335","type":"contains","from":"EQP-A43","to":"SUB-008","basis":"reference"},{"id":"REL-005336","type":"contains","from":"EQP-A43","to":"SUB-013","basis":"reference"},{"id":"REL-005337","type":"contains","from":"EQP-A43","to":"SUB-014","basis":"reference"},{"id":"REL-005338","type":"contains","from":"EQP-A43","to":"SUB-015","basis":"reference"},{"id":"REL-005339","type":"contains","from":"EQP-A43","to":"SUB-016","basis":"reference"},{"id":"REL-005340","type":"contains","from":"EQP-A44","to":"SUB-007","basis":"reference"},{"id":"REL-005341","type":"contains","from":"EQP-A44","to":"SUB-008","basis":"reference"},{"id":"REL-005342","type":"contains","from":"EQP-A44","to":"SUB-013","basis":"reference"},{"id":"REL-005343","type":"contains","from":"EQP-A44","to":"SUB-014","basis":"reference"},{"id":"REL-005344","type":"contains","from":"EQP-A44","to":"SUB-015","basis":"reference"},{"id":"REL-005345","type":"contains","from":"EQP-A44","to":"SUB-016","basis":"reference"},{"id":"REL-005346","type":"contains","from":"EQP-A45","to":"SUB-008","basis":"reference"},{"id":"REL-005347","type":"contains","from":"EQP-A45","to":"SUB-013","basis":"reference"},{"id":"REL-005348","type":"contains","from":"EQP-A45","to":"SUB-014","basis":"reference"},{"id":"REL-005349","type":"contains","from":"EQP-A45","to":"SUB-015","basis":"reference"},{"id":"REL-005350","type":"contains","from":"EQP-A45","to":"SUB-016","basis":"reference"},{"id":"REL-005351","type":"contains","from":"EQP-B02","to":"SUB-002","basis":"reference"},{"id":"REL-005352","type":"contains","from":"EQP-B02","to":"SUB-008","basis":"reference"},{"id":"REL-005353","type":"contains","from":"EQP-B02","to":"SUB-013","basis":"reference"},{"id":"REL-005354","type":"contains","from":"EQP-B02","to":"SUB-014","basis":"reference"},{"id":"REL-005355","type":"contains","from":"EQP-B02","to":"SUB-015","basis":"reference"},{"id":"REL-005356","type":"contains","from":"EQP-B02","to":"SUB-016","basis":"reference"},{"id":"REL-005357","type":"contains","from":"EQP-B03","to":"SUB-002","basis":"reference"},{"id":"REL-005358","type":"contains","from":"EQP-B03","to":"SUB-008","basis":"reference"},{"id":"REL-005359","type":"contains","from":"EQP-B03","to":"SUB-013","basis":"reference"},{"id":"REL-005360","type":"contains","from":"EQP-B03","to":"SUB-014","basis":"reference"},{"id":"REL-005361","type":"contains","from":"EQP-B03","to":"SUB-015","basis":"reference"},{"id":"REL-005362","type":"contains","from":"EQP-B03","to":"SUB-016","basis":"reference"},{"id":"REL-005363","type":"contains","from":"EQP-B04","to":"SUB-002","basis":"reference"},{"id":"REL-005364","type":"contains","from":"EQP-B04","to":"SUB-008","basis":"reference"},{"id":"REL-005365","type":"contains","from":"EQP-B04","to":"SUB-013","basis":"reference"},{"id":"REL-005366","type":"contains","from":"EQP-B04","to":"SUB-014","basis":"reference"},{"id":"REL-005367","type":"contains","from":"EQP-B04","to":"SUB-015","basis":"reference"},{"id":"REL-005368","type":"contains","from":"EQP-B04","to":"SUB-016","basis":"reference"},{"id":"REL-005369","type":"contains","from":"EQP-B05","to":"SUB-001","basis":"reference"},{"id":"REL-005370","type":"contains","from":"EQP-B05","to":"SUB-002","basis":"reference"},{"id":"REL-005371","type":"contains","from":"EQP-B05","to":"SUB-003","basis":"reference"},{"id":"REL-005372","type":"contains","from":"EQP-B05","to":"SUB-008","basis":"reference"},{"id":"REL-005373","type":"contains","from":"EQP-B05","to":"SUB-009","basis":"reference"},{"id":"REL-005374","type":"contains","from":"EQP-B05","to":"SUB-011","basis":"reference"},{"id":"REL-005375","type":"contains","from":"EQP-B05","to":"SUB-013","basis":"reference"},{"id":"REL-005376","type":"contains","from":"EQP-B05","to":"SUB-014","basis":"reference"},{"id":"REL-005377","type":"contains","from":"EQP-B05","to":"SUB-015","basis":"reference"},{"id":"REL-005378","type":"contains","from":"EQP-B05","to":"SUB-016","basis":"reference"},{"id":"REL-005379","type":"contains","from":"EQP-B06","to":"SUB-002","basis":"reference"},{"id":"REL-005380","type":"contains","from":"EQP-B06","to":"SUB-008","basis":"reference"},{"id":"REL-005381","type":"contains","from":"EQP-B06","to":"SUB-013","basis":"reference"},{"id":"REL-005382","type":"contains","from":"EQP-B06","to":"SUB-014","basis":"reference"},{"id":"REL-005383","type":"contains","from":"EQP-B06","to":"SUB-015","basis":"reference"},{"id":"REL-005384","type":"contains","from":"EQP-B06","to":"SUB-016","basis":"reference"},{"id":"REL-005385","type":"contains","from":"EQP-B07","to":"SUB-002","basis":"reference"},{"id":"REL-005386","type":"contains","from":"EQP-B07","to":"SUB-003","basis":"reference"},{"id":"REL-005387","type":"contains","from":"EQP-B07","to":"SUB-004","basis":"reference"},{"id":"REL-005388","type":"contains","from":"EQP-B07","to":"SUB-008","basis":"reference"},{"id":"REL-005389","type":"contains","from":"EQP-B07","to":"SUB-013","basis":"reference"},{"id":"REL-005390","type":"contains","from":"EQP-B07","to":"SUB-014","basis":"reference"},{"id":"REL-005391","type":"contains","from":"EQP-B07","to":"SUB-015","basis":"reference"},{"id":"REL-005392","type":"contains","from":"EQP-B07","to":"SUB-016","basis":"reference"},{"id":"REL-005393","type":"contains","from":"EQP-B08","to":"SUB-001","basis":"reference"},{"id":"REL-005394","type":"contains","from":"EQP-B08","to":"SUB-002","basis":"reference"},{"id":"REL-005395","type":"contains","from":"EQP-B08","to":"SUB-003","basis":"reference"},{"id":"REL-005396","type":"contains","from":"EQP-B08","to":"SUB-008","basis":"reference"},{"id":"REL-005397","type":"contains","from":"EQP-B08","to":"SUB-009","basis":"reference"},{"id":"REL-005398","type":"contains","from":"EQP-B08","to":"SUB-011","basis":"reference"},{"id":"REL-005399","type":"contains","from":"EQP-B08","to":"SUB-013","basis":"reference"},{"id":"REL-005400","type":"contains","from":"EQP-B08","to":"SUB-014","basis":"reference"},{"id":"REL-005401","type":"contains","from":"EQP-B08","to":"SUB-015","basis":"reference"},{"id":"REL-005402","type":"contains","from":"EQP-B08","to":"SUB-016","basis":"reference"},{"id":"REL-005403","type":"contains","from":"EQP-B09","to":"SUB-002","basis":"reference"},{"id":"REL-005404","type":"contains","from":"EQP-B09","to":"SUB-008","basis":"reference"},{"id":"REL-005405","type":"contains","from":"EQP-B09","to":"SUB-010","basis":"reference"},{"id":"REL-005406","type":"contains","from":"EQP-B09","to":"SUB-013","basis":"reference"},{"id":"REL-005407","type":"contains","from":"EQP-B09","to":"SUB-014","basis":"reference"},{"id":"REL-005408","type":"contains","from":"EQP-B09","to":"SUB-015","basis":"reference"},{"id":"REL-005409","type":"contains","from":"EQP-B09","to":"SUB-016","basis":"reference"},{"id":"REL-005410","type":"contains","from":"EQP-C01.01","to":"SUB-003","basis":"reference"},{"id":"REL-005411","type":"contains","from":"EQP-C01.01","to":"SUB-008","basis":"reference"},{"id":"REL-005412","type":"contains","from":"EQP-C01.01","to":"SUB-009","basis":"reference"},{"id":"REL-005413","type":"contains","from":"EQP-C01.01","to":"SUB-013","basis":"reference"},{"id":"REL-005414","type":"contains","from":"EQP-C01.01","to":"SUB-014","basis":"reference"},{"id":"REL-005415","type":"contains","from":"EQP-C01.01","to":"SUB-015","basis":"reference"},{"id":"REL-005416","type":"contains","from":"EQP-C01.01","to":"SUB-016","basis":"reference"},{"id":"REL-005417","type":"contains","from":"EQP-C01.02","to":"SUB-001","basis":"reference"},{"id":"REL-005418","type":"contains","from":"EQP-C01.02","to":"SUB-002","basis":"reference"},{"id":"REL-005419","type":"contains","from":"EQP-C01.02","to":"SUB-003","basis":"reference"},{"id":"REL-005420","type":"contains","from":"EQP-C01.02","to":"SUB-008","basis":"reference"},{"id":"REL-005421","type":"contains","from":"EQP-C01.02","to":"SUB-009","basis":"reference"},{"id":"REL-005422","type":"contains","from":"EQP-C01.02","to":"SUB-011","basis":"reference"},{"id":"REL-005423","type":"contains","from":"EQP-C01.02","to":"SUB-013","basis":"reference"},{"id":"REL-005424","type":"contains","from":"EQP-C01.02","to":"SUB-014","basis":"reference"},{"id":"REL-005425","type":"contains","from":"EQP-C01.02","to":"SUB-015","basis":"reference"},{"id":"REL-005426","type":"contains","from":"EQP-C01.02","to":"SUB-016","basis":"reference"},{"id":"REL-005427","type":"contains","from":"EQP-C01.03","to":"SUB-001","basis":"reference"},{"id":"REL-005428","type":"contains","from":"EQP-C01.03","to":"SUB-002","basis":"reference"},{"id":"REL-005429","type":"contains","from":"EQP-C01.03","to":"SUB-003","basis":"reference"},{"id":"REL-005430","type":"contains","from":"EQP-C01.03","to":"SUB-008","basis":"reference"},{"id":"REL-005431","type":"contains","from":"EQP-C01.03","to":"SUB-009","basis":"reference"},{"id":"REL-005432","type":"contains","from":"EQP-C01.03","to":"SUB-011","basis":"reference"},{"id":"REL-005433","type":"contains","from":"EQP-C01.03","to":"SUB-013","basis":"reference"},{"id":"REL-005434","type":"contains","from":"EQP-C01.03","to":"SUB-014","basis":"reference"},{"id":"REL-005435","type":"contains","from":"EQP-C01.03","to":"SUB-015","basis":"reference"},{"id":"REL-005436","type":"contains","from":"EQP-C01.03","to":"SUB-016","basis":"reference"},{"id":"REL-005437","type":"contains","from":"EQP-C01.04","to":"SUB-003","basis":"reference"},{"id":"REL-005438","type":"contains","from":"EQP-C01.04","to":"SUB-005","basis":"reference"},{"id":"REL-005439","type":"contains","from":"EQP-C01.04","to":"SUB-008","basis":"reference"},{"id":"REL-005440","type":"contains","from":"EQP-C01.04","to":"SUB-009","basis":"reference"},{"id":"REL-005441","type":"contains","from":"EQP-C01.04","to":"SUB-013","basis":"reference"},{"id":"REL-005442","type":"contains","from":"EQP-C01.04","to":"SUB-014","basis":"reference"},{"id":"REL-005443","type":"contains","from":"EQP-C01.04","to":"SUB-015","basis":"reference"},{"id":"REL-005444","type":"contains","from":"EQP-C01.04","to":"SUB-016","basis":"reference"},{"id":"REL-005445","type":"contains","from":"EQP-C02","to":"SUB-013","basis":"reference"},{"id":"REL-005446","type":"contains","from":"EQP-C02","to":"SUB-014","basis":"reference"},{"id":"REL-005447","type":"contains","from":"EQP-C02","to":"SUB-015","basis":"reference"},{"id":"REL-005448","type":"contains","from":"EQP-C02","to":"SUB-016","basis":"reference"},{"id":"REL-005449","type":"contains","from":"EQP-C03","to":"SUB-013","basis":"reference"},{"id":"REL-005450","type":"contains","from":"EQP-C03","to":"SUB-014","basis":"reference"},{"id":"REL-005451","type":"contains","from":"EQP-C03","to":"SUB-015","basis":"reference"},{"id":"REL-005452","type":"contains","from":"EQP-C03","to":"SUB-016","basis":"reference"},{"id":"REL-005453","type":"contains","from":"EQP-C04","to":"SUB-008","basis":"reference"},{"id":"REL-005454","type":"contains","from":"EQP-C04","to":"SUB-013","basis":"reference"},{"id":"REL-005455","type":"contains","from":"EQP-C04","to":"SUB-014","basis":"reference"},{"id":"REL-005456","type":"contains","from":"EQP-C04","to":"SUB-015","basis":"reference"},{"id":"REL-005457","type":"contains","from":"EQP-C04","to":"SUB-016","basis":"reference"},{"id":"REL-005458","type":"contains","from":"EQP-C06","to":"SUB-001","basis":"reference"},{"id":"REL-005459","type":"contains","from":"EQP-C06","to":"SUB-002","basis":"reference"},{"id":"REL-005460","type":"contains","from":"EQP-C06","to":"SUB-003","basis":"reference"},{"id":"REL-005461","type":"contains","from":"EQP-C06","to":"SUB-008","basis":"reference"},{"id":"REL-005462","type":"contains","from":"EQP-C06","to":"SUB-009","basis":"reference"},{"id":"REL-005463","type":"contains","from":"EQP-C06","to":"SUB-011","basis":"reference"},{"id":"REL-005464","type":"contains","from":"EQP-C06","to":"SUB-013","basis":"reference"},{"id":"REL-005465","type":"contains","from":"EQP-C06","to":"SUB-014","basis":"reference"},{"id":"REL-005466","type":"contains","from":"EQP-C06","to":"SUB-015","basis":"reference"},{"id":"REL-005467","type":"contains","from":"EQP-C06","to":"SUB-016","basis":"reference"},{"id":"REL-005468","type":"contains","from":"EQP-C07","to":"SUB-013","basis":"reference"},{"id":"REL-005469","type":"contains","from":"EQP-C07","to":"SUB-014","basis":"reference"},{"id":"REL-005470","type":"contains","from":"EQP-C07","to":"SUB-015","basis":"reference"},{"id":"REL-005471","type":"contains","from":"EQP-C07","to":"SUB-016","basis":"reference"},{"id":"REL-005472","type":"contains","from":"EQP-C08","to":"SUB-013","basis":"reference"},{"id":"REL-005473","type":"contains","from":"EQP-C08","to":"SUB-014","basis":"reference"},{"id":"REL-005474","type":"contains","from":"EQP-C08","to":"SUB-015","basis":"reference"},{"id":"REL-005475","type":"contains","from":"EQP-C08","to":"SUB-016","basis":"reference"},{"id":"REL-005476","type":"contains","from":"EQP-C09","to":"SUB-013","basis":"reference"},{"id":"REL-005477","type":"contains","from":"EQP-C09","to":"SUB-014","basis":"reference"},{"id":"REL-005478","type":"contains","from":"EQP-C09","to":"SUB-015","basis":"reference"},{"id":"REL-005479","type":"contains","from":"EQP-C09","to":"SUB-016","basis":"reference"},{"id":"REL-005480","type":"contains","from":"EQP-C10","to":"SUB-003","basis":"reference"},{"id":"REL-005481","type":"contains","from":"EQP-C10","to":"SUB-009","basis":"reference"},{"id":"REL-005482","type":"contains","from":"EQP-C10","to":"SUB-013","basis":"reference"},{"id":"REL-005483","type":"contains","from":"EQP-C10","to":"SUB-014","basis":"reference"},{"id":"REL-005484","type":"contains","from":"EQP-C10","to":"SUB-015","basis":"reference"},{"id":"REL-005485","type":"contains","from":"EQP-C10","to":"SUB-016","basis":"reference"},{"id":"REL-005486","type":"contains","from":"EQP-C11","to":"SUB-003","basis":"reference"},{"id":"REL-005487","type":"contains","from":"EQP-C11","to":"SUB-009","basis":"reference"},{"id":"REL-005488","type":"contains","from":"EQP-C11","to":"SUB-013","basis":"reference"},{"id":"REL-005489","type":"contains","from":"EQP-C11","to":"SUB-014","basis":"reference"},{"id":"REL-005490","type":"contains","from":"EQP-C11","to":"SUB-015","basis":"reference"},{"id":"REL-005491","type":"contains","from":"EQP-C11","to":"SUB-016","basis":"reference"},{"id":"REL-005492","type":"contains","from":"EQP-C12","to":"SUB-003","basis":"reference"},{"id":"REL-005493","type":"contains","from":"EQP-C12","to":"SUB-009","basis":"reference"},{"id":"REL-005494","type":"contains","from":"EQP-C12","to":"SUB-013","basis":"reference"},{"id":"REL-005495","type":"contains","from":"EQP-C12","to":"SUB-014","basis":"reference"},{"id":"REL-005496","type":"contains","from":"EQP-C12","to":"SUB-015","basis":"reference"},{"id":"REL-005497","type":"contains","from":"EQP-C12","to":"SUB-016","basis":"reference"},{"id":"REL-005498","type":"contains","from":"EQP-C13","to":"SUB-013","basis":"reference"},{"id":"REL-005499","type":"contains","from":"EQP-C13","to":"SUB-014","basis":"reference"},{"id":"REL-005500","type":"contains","from":"EQP-C13","to":"SUB-015","basis":"reference"},{"id":"REL-005501","type":"contains","from":"EQP-C13","to":"SUB-016","basis":"reference"},{"id":"REL-005502","type":"contains","from":"EQP-C14","to":"SUB-013","basis":"reference"},{"id":"REL-005503","type":"contains","from":"EQP-C14","to":"SUB-014","basis":"reference"},{"id":"REL-005504","type":"contains","from":"EQP-C14","to":"SUB-015","basis":"reference"},{"id":"REL-005505","type":"contains","from":"EQP-C14","to":"SUB-016","basis":"reference"},{"id":"REL-005506","type":"contains","from":"EQP-C15","to":"SUB-013","basis":"reference"},{"id":"REL-005507","type":"contains","from":"EQP-C15","to":"SUB-014","basis":"reference"},{"id":"REL-005508","type":"contains","from":"EQP-C15","to":"SUB-015","basis":"reference"},{"id":"REL-005509","type":"contains","from":"EQP-C15","to":"SUB-016","basis":"reference"},{"id":"REL-005510","type":"contains","from":"EQP-C16","to":"SUB-001","basis":"reference"},{"id":"REL-005511","type":"contains","from":"EQP-C16","to":"SUB-002","basis":"reference"},{"id":"REL-005512","type":"contains","from":"EQP-C16","to":"SUB-003","basis":"reference"},{"id":"REL-005513","type":"contains","from":"EQP-C16","to":"SUB-008","basis":"reference"},{"id":"REL-005514","type":"contains","from":"EQP-C16","to":"SUB-009","basis":"reference"},{"id":"REL-005515","type":"contains","from":"EQP-C16","to":"SUB-011","basis":"reference"},{"id":"REL-005516","type":"contains","from":"EQP-C16","to":"SUB-012","basis":"reference"},{"id":"REL-005517","type":"contains","from":"EQP-C16","to":"SUB-013","basis":"reference"},{"id":"REL-005518","type":"contains","from":"EQP-C16","to":"SUB-014","basis":"reference"},{"id":"REL-005519","type":"contains","from":"EQP-C16","to":"SUB-015","basis":"reference"},{"id":"REL-005520","type":"contains","from":"EQP-C16","to":"SUB-016","basis":"reference"},{"id":"REL-005521","type":"contains","from":"EQP-C17","to":"SUB-003","basis":"reference"},{"id":"REL-005522","type":"contains","from":"EQP-C17","to":"SUB-004","basis":"reference"},{"id":"REL-005523","type":"contains","from":"EQP-C17","to":"SUB-008","basis":"reference"},{"id":"REL-005524","type":"contains","from":"EQP-C17","to":"SUB-009","basis":"reference"},{"id":"REL-005525","type":"contains","from":"EQP-C17","to":"SUB-013","basis":"reference"},{"id":"REL-005526","type":"contains","from":"EQP-C17","to":"SUB-014","basis":"reference"},{"id":"REL-005527","type":"contains","from":"EQP-C17","to":"SUB-015","basis":"reference"},{"id":"REL-005528","type":"contains","from":"EQP-C17","to":"SUB-016","basis":"reference"},{"id":"REL-005529","type":"contains","from":"EQP-C18","to":"SUB-001","basis":"reference"},{"id":"REL-005530","type":"contains","from":"EQP-C18","to":"SUB-002","basis":"reference"},{"id":"REL-005531","type":"contains","from":"EQP-C18","to":"SUB-003","basis":"reference"},{"id":"REL-005532","type":"contains","from":"EQP-C18","to":"SUB-004","basis":"reference"},{"id":"REL-005533","type":"contains","from":"EQP-C18","to":"SUB-008","basis":"reference"},{"id":"REL-005534","type":"contains","from":"EQP-C18","to":"SUB-009","basis":"reference"},{"id":"REL-005535","type":"contains","from":"EQP-C18","to":"SUB-011","basis":"reference"},{"id":"REL-005536","type":"contains","from":"EQP-C18","to":"SUB-013","basis":"reference"},{"id":"REL-005537","type":"contains","from":"EQP-C18","to":"SUB-014","basis":"reference"},{"id":"REL-005538","type":"contains","from":"EQP-C18","to":"SUB-015","basis":"reference"},{"id":"REL-005539","type":"contains","from":"EQP-C18","to":"SUB-016","basis":"reference"},{"id":"REL-005540","type":"contains","from":"EQP-C19","to":"SUB-001","basis":"reference"},{"id":"REL-005541","type":"contains","from":"EQP-C19","to":"SUB-002","basis":"reference"},{"id":"REL-005542","type":"contains","from":"EQP-C19","to":"SUB-003","basis":"reference"},{"id":"REL-005543","type":"contains","from":"EQP-C19","to":"SUB-008","basis":"reference"},{"id":"REL-005544","type":"contains","from":"EQP-C19","to":"SUB-009","basis":"reference"},{"id":"REL-005545","type":"contains","from":"EQP-C19","to":"SUB-011","basis":"reference"},{"id":"REL-005546","type":"contains","from":"EQP-C19","to":"SUB-013","basis":"reference"},{"id":"REL-005547","type":"contains","from":"EQP-C19","to":"SUB-014","basis":"reference"},{"id":"REL-005548","type":"contains","from":"EQP-C19","to":"SUB-015","basis":"reference"},{"id":"REL-005549","type":"contains","from":"EQP-C19","to":"SUB-016","basis":"reference"},{"id":"REL-005550","type":"contains","from":"EQP-C20","to":"SUB-012","basis":"reference"},{"id":"REL-005551","type":"contains","from":"EQP-C20","to":"SUB-013","basis":"reference"},{"id":"REL-005552","type":"contains","from":"EQP-C20","to":"SUB-014","basis":"reference"},{"id":"REL-005553","type":"contains","from":"EQP-C20","to":"SUB-015","basis":"reference"},{"id":"REL-005554","type":"contains","from":"EQP-C20","to":"SUB-016","basis":"reference"},{"id":"REL-005555","type":"contains","from":"EQP-C21","to":"SUB-013","basis":"reference"},{"id":"REL-005556","type":"contains","from":"EQP-C21","to":"SUB-014","basis":"reference"},{"id":"REL-005557","type":"contains","from":"EQP-C21","to":"SUB-015","basis":"reference"},{"id":"REL-005558","type":"contains","from":"EQP-C21","to":"SUB-016","basis":"reference"},{"id":"REL-005559","type":"contains","from":"EQP-C23","to":"SUB-013","basis":"reference"},{"id":"REL-005560","type":"contains","from":"EQP-C23","to":"SUB-014","basis":"reference"},{"id":"REL-005561","type":"contains","from":"EQP-C23","to":"SUB-015","basis":"reference"},{"id":"REL-005562","type":"contains","from":"EQP-C23","to":"SUB-016","basis":"reference"},{"id":"REL-005563","type":"contains","from":"EQP-C24","to":"SUB-013","basis":"reference"},{"id":"REL-005564","type":"contains","from":"EQP-C24","to":"SUB-014","basis":"reference"},{"id":"REL-005565","type":"contains","from":"EQP-C24","to":"SUB-015","basis":"reference"},{"id":"REL-005566","type":"contains","from":"EQP-C24","to":"SUB-016","basis":"reference"},{"id":"REL-005567","type":"contains","from":"EQP-C25","to":"SUB-007","basis":"reference"},{"id":"REL-005568","type":"contains","from":"EQP-C25","to":"SUB-013","basis":"reference"},{"id":"REL-005569","type":"contains","from":"EQP-C25","to":"SUB-014","basis":"reference"},{"id":"REL-005570","type":"contains","from":"EQP-C25","to":"SUB-015","basis":"reference"},{"id":"REL-005571","type":"contains","from":"EQP-C25","to":"SUB-016","basis":"reference"},{"id":"REL-005572","type":"contains","from":"EQP-C26","to":"SUB-001","basis":"reference"},{"id":"REL-005573","type":"contains","from":"EQP-C26","to":"SUB-002","basis":"reference"},{"id":"REL-005574","type":"contains","from":"EQP-C26","to":"SUB-003","basis":"reference"},{"id":"REL-005575","type":"contains","from":"EQP-C26","to":"SUB-008","basis":"reference"},{"id":"REL-005576","type":"contains","from":"EQP-C26","to":"SUB-009","basis":"reference"},{"id":"REL-005577","type":"contains","from":"EQP-C26","to":"SUB-011","basis":"reference"},{"id":"REL-005578","type":"contains","from":"EQP-C26","to":"SUB-013","basis":"reference"},{"id":"REL-005579","type":"contains","from":"EQP-C26","to":"SUB-014","basis":"reference"},{"id":"REL-005580","type":"contains","from":"EQP-C26","to":"SUB-015","basis":"reference"},{"id":"REL-005581","type":"contains","from":"EQP-C26","to":"SUB-016","basis":"reference"},{"id":"REL-005582","type":"contains","from":"EQP-C28","to":"SUB-001","basis":"reference"},{"id":"REL-005583","type":"contains","from":"EQP-C28","to":"SUB-002","basis":"reference"},{"id":"REL-005584","type":"contains","from":"EQP-C28","to":"SUB-003","basis":"reference"},{"id":"REL-005585","type":"contains","from":"EQP-C28","to":"SUB-008","basis":"reference"},{"id":"REL-005586","type":"contains","from":"EQP-C28","to":"SUB-009","basis":"reference"},{"id":"REL-005587","type":"contains","from":"EQP-C28","to":"SUB-011","basis":"reference"},{"id":"REL-005588","type":"contains","from":"EQP-C28","to":"SUB-013","basis":"reference"},{"id":"REL-005589","type":"contains","from":"EQP-C28","to":"SUB-014","basis":"reference"},{"id":"REL-005590","type":"contains","from":"EQP-C28","to":"SUB-015","basis":"reference"},{"id":"REL-005591","type":"contains","from":"EQP-C28","to":"SUB-016","basis":"reference"},{"id":"REL-005592","type":"contains","from":"EQP-C29","to":"SUB-001","basis":"reference"},{"id":"REL-005593","type":"contains","from":"EQP-C29","to":"SUB-002","basis":"reference"},{"id":"REL-005594","type":"contains","from":"EQP-C29","to":"SUB-003","basis":"reference"},{"id":"REL-005595","type":"contains","from":"EQP-C29","to":"SUB-008","basis":"reference"},{"id":"REL-005596","type":"contains","from":"EQP-C29","to":"SUB-009","basis":"reference"},{"id":"REL-005597","type":"contains","from":"EQP-C29","to":"SUB-011","basis":"reference"},{"id":"REL-005598","type":"contains","from":"EQP-C29","to":"SUB-013","basis":"reference"},{"id":"REL-005599","type":"contains","from":"EQP-C29","to":"SUB-014","basis":"reference"},{"id":"REL-005600","type":"contains","from":"EQP-C29","to":"SUB-015","basis":"reference"},{"id":"REL-005601","type":"contains","from":"EQP-C29","to":"SUB-016","basis":"reference"},{"id":"REL-005602","type":"contains","from":"EQP-C30","to":"SUB-001","basis":"reference"},{"id":"REL-005603","type":"contains","from":"EQP-C30","to":"SUB-002","basis":"reference"},{"id":"REL-005604","type":"contains","from":"EQP-C30","to":"SUB-003","basis":"reference"},{"id":"REL-005605","type":"contains","from":"EQP-C30","to":"SUB-008","basis":"reference"},{"id":"REL-005606","type":"contains","from":"EQP-C30","to":"SUB-009","basis":"reference"},{"id":"REL-005607","type":"contains","from":"EQP-C30","to":"SUB-011","basis":"reference"},{"id":"REL-005608","type":"contains","from":"EQP-C30","to":"SUB-013","basis":"reference"},{"id":"REL-005609","type":"contains","from":"EQP-C30","to":"SUB-014","basis":"reference"},{"id":"REL-005610","type":"contains","from":"EQP-C30","to":"SUB-015","basis":"reference"},{"id":"REL-005611","type":"contains","from":"EQP-C30","to":"SUB-016","basis":"reference"},{"id":"REL-005612","type":"contains","from":"EQP-C31","to":"SUB-001","basis":"reference"},{"id":"REL-005613","type":"contains","from":"EQP-C31","to":"SUB-002","basis":"reference"},{"id":"REL-005614","type":"contains","from":"EQP-C31","to":"SUB-003","basis":"reference"},{"id":"REL-005615","type":"contains","from":"EQP-C31","to":"SUB-008","basis":"reference"},{"id":"REL-005616","type":"contains","from":"EQP-C31","to":"SUB-009","basis":"reference"},{"id":"REL-005617","type":"contains","from":"EQP-C31","to":"SUB-011","basis":"reference"},{"id":"REL-005618","type":"contains","from":"EQP-C31","to":"SUB-013","basis":"reference"},{"id":"REL-005619","type":"contains","from":"EQP-C31","to":"SUB-014","basis":"reference"},{"id":"REL-005620","type":"contains","from":"EQP-C31","to":"SUB-015","basis":"reference"},{"id":"REL-005621","type":"contains","from":"EQP-C31","to":"SUB-016","basis":"reference"},{"id":"REL-005622","type":"contains","from":"EQP-C32","to":"SUB-001","basis":"reference"},{"id":"REL-005623","type":"contains","from":"EQP-C32","to":"SUB-002","basis":"reference"},{"id":"REL-005624","type":"contains","from":"EQP-C32","to":"SUB-003","basis":"reference"},{"id":"REL-005625","type":"contains","from":"EQP-C32","to":"SUB-008","basis":"reference"},{"id":"REL-005626","type":"contains","from":"EQP-C32","to":"SUB-009","basis":"reference"},{"id":"REL-005627","type":"contains","from":"EQP-C32","to":"SUB-011","basis":"reference"},{"id":"REL-005628","type":"contains","from":"EQP-C32","to":"SUB-013","basis":"reference"},{"id":"REL-005629","type":"contains","from":"EQP-C32","to":"SUB-014","basis":"reference"},{"id":"REL-005630","type":"contains","from":"EQP-C32","to":"SUB-015","basis":"reference"},{"id":"REL-005631","type":"contains","from":"EQP-C32","to":"SUB-016","basis":"reference"},{"id":"REL-005632","type":"contains","from":"EQP-C34","to":"SUB-013","basis":"reference"},{"id":"REL-005633","type":"contains","from":"EQP-C34","to":"SUB-014","basis":"reference"},{"id":"REL-005634","type":"contains","from":"EQP-C34","to":"SUB-015","basis":"reference"},{"id":"REL-005635","type":"contains","from":"EQP-C34","to":"SUB-016","basis":"reference"},{"id":"REL-005636","type":"contains","from":"EQP-C35","to":"SUB-013","basis":"reference"},{"id":"REL-005637","type":"contains","from":"EQP-C35","to":"SUB-014","basis":"reference"},{"id":"REL-005638","type":"contains","from":"EQP-C35","to":"SUB-015","basis":"reference"},{"id":"REL-005639","type":"contains","from":"EQP-C35","to":"SUB-016","basis":"reference"},{"id":"REL-005640","type":"contains","from":"EQP-C36","to":"SUB-009","basis":"reference"},{"id":"REL-005641","type":"contains","from":"EQP-C36","to":"SUB-013","basis":"reference"},{"id":"REL-005642","type":"contains","from":"EQP-C36","to":"SUB-014","basis":"reference"},{"id":"REL-005643","type":"contains","from":"EQP-C36","to":"SUB-015","basis":"reference"},{"id":"REL-005644","type":"contains","from":"EQP-C36","to":"SUB-016","basis":"reference"},{"id":"REL-005645","type":"contains","from":"EQP-C37","to":"SUB-013","basis":"reference"},{"id":"REL-005646","type":"contains","from":"EQP-C37","to":"SUB-014","basis":"reference"},{"id":"REL-005647","type":"contains","from":"EQP-C37","to":"SUB-015","basis":"reference"},{"id":"REL-005648","type":"contains","from":"EQP-C37","to":"SUB-016","basis":"reference"},{"id":"REL-005649","type":"contains","from":"EQP-C38","to":"SUB-012","basis":"reference"},{"id":"REL-005650","type":"contains","from":"EQP-C38","to":"SUB-013","basis":"reference"},{"id":"REL-005651","type":"contains","from":"EQP-C38","to":"SUB-014","basis":"reference"},{"id":"REL-005652","type":"contains","from":"EQP-C38","to":"SUB-015","basis":"reference"},{"id":"REL-005653","type":"contains","from":"EQP-C38","to":"SUB-016","basis":"reference"},{"id":"REL-005654","type":"contains","from":"EQP-C39","to":"SUB-013","basis":"reference"},{"id":"REL-005655","type":"contains","from":"EQP-C39","to":"SUB-014","basis":"reference"},{"id":"REL-005656","type":"contains","from":"EQP-C39","to":"SUB-015","basis":"reference"},{"id":"REL-005657","type":"contains","from":"EQP-C39","to":"SUB-016","basis":"reference"},{"id":"REL-005658","type":"contains","from":"EQP-C40","to":"SUB-013","basis":"reference"},{"id":"REL-005659","type":"contains","from":"EQP-C40","to":"SUB-014","basis":"reference"},{"id":"REL-005660","type":"contains","from":"EQP-C40","to":"SUB-015","basis":"reference"},{"id":"REL-005661","type":"contains","from":"EQP-C40","to":"SUB-016","basis":"reference"},{"id":"REL-005662","type":"contains","from":"EQP-C41","to":"SUB-013","basis":"reference"},{"id":"REL-005663","type":"contains","from":"EQP-C41","to":"SUB-014","basis":"reference"},{"id":"REL-005664","type":"contains","from":"EQP-C41","to":"SUB-015","basis":"reference"},{"id":"REL-005665","type":"contains","from":"EQP-C41","to":"SUB-016","basis":"reference"},{"id":"REL-005666","type":"contains","from":"EQP-C42","to":"SUB-013","basis":"reference"},{"id":"REL-005667","type":"contains","from":"EQP-C42","to":"SUB-014","basis":"reference"},{"id":"REL-005668","type":"contains","from":"EQP-C42","to":"SUB-015","basis":"reference"},{"id":"REL-005669","type":"contains","from":"EQP-C42","to":"SUB-016","basis":"reference"},{"id":"REL-005670","type":"contains","from":"EQP-D05","to":"SUB-013","basis":"reference"},{"id":"REL-005671","type":"contains","from":"EQP-D05","to":"SUB-014","basis":"reference"},{"id":"REL-005672","type":"contains","from":"EQP-D05","to":"SUB-015","basis":"reference"},{"id":"REL-005673","type":"contains","from":"EQP-D05","to":"SUB-016","basis":"reference"},{"id":"REL-005674","type":"contains","from":"EQP-D06","to":"SUB-013","basis":"reference"},{"id":"REL-005675","type":"contains","from":"EQP-D06","to":"SUB-014","basis":"reference"},{"id":"REL-005676","type":"contains","from":"EQP-D06","to":"SUB-015","basis":"reference"},{"id":"REL-005677","type":"contains","from":"EQP-D06","to":"SUB-016","basis":"reference"},{"id":"REL-005678","type":"contains","from":"EQP-D12","to":"SUB-013","basis":"reference"},{"id":"REL-005679","type":"contains","from":"EQP-D12","to":"SUB-014","basis":"reference"},{"id":"REL-005680","type":"contains","from":"EQP-D12","to":"SUB-015","basis":"reference"},{"id":"REL-005681","type":"contains","from":"EQP-D12","to":"SUB-016","basis":"reference"},{"id":"REL-005682","type":"contains","from":"EQP-D13","to":"SUB-013","basis":"reference"},{"id":"REL-005683","type":"contains","from":"EQP-D13","to":"SUB-014","basis":"reference"},{"id":"REL-005684","type":"contains","from":"EQP-D13","to":"SUB-015","basis":"reference"},{"id":"REL-005685","type":"contains","from":"EQP-D13","to":"SUB-016","basis":"reference"},{"id":"REL-005686","type":"contains","from":"EQP-D14","to":"SUB-001","basis":"reference"},{"id":"REL-005687","type":"contains","from":"EQP-D14","to":"SUB-002","basis":"reference"},{"id":"REL-005688","type":"contains","from":"EQP-D14","to":"SUB-003","basis":"reference"},{"id":"REL-005689","type":"contains","from":"EQP-D14","to":"SUB-008","basis":"reference"},{"id":"REL-005690","type":"contains","from":"EQP-D14","to":"SUB-009","basis":"reference"},{"id":"REL-005691","type":"contains","from":"EQP-D14","to":"SUB-011","basis":"reference"},{"id":"REL-005692","type":"contains","from":"EQP-D14","to":"SUB-013","basis":"reference"},{"id":"REL-005693","type":"contains","from":"EQP-D14","to":"SUB-014","basis":"reference"},{"id":"REL-005694","type":"contains","from":"EQP-D14","to":"SUB-015","basis":"reference"},{"id":"REL-005695","type":"contains","from":"EQP-D14","to":"SUB-016","basis":"reference"},{"id":"REL-005696","type":"contains","from":"EQP-D15","to":"SUB-013","basis":"reference"},{"id":"REL-005697","type":"contains","from":"EQP-D15","to":"SUB-014","basis":"reference"},{"id":"REL-005698","type":"contains","from":"EQP-D15","to":"SUB-015","basis":"reference"},{"id":"REL-005699","type":"contains","from":"EQP-D15","to":"SUB-016","basis":"reference"},{"id":"REL-005700","type":"contains","from":"EQP-D16","to":"SUB-013","basis":"reference"},{"id":"REL-005701","type":"contains","from":"EQP-D16","to":"SUB-014","basis":"reference"},{"id":"REL-005702","type":"contains","from":"EQP-D16","to":"SUB-015","basis":"reference"},{"id":"REL-005703","type":"contains","from":"EQP-D16","to":"SUB-016","basis":"reference"},{"id":"REL-005704","type":"contains","from":"EQP-D18","to":"SUB-013","basis":"reference"},{"id":"REL-005705","type":"contains","from":"EQP-D18","to":"SUB-014","basis":"reference"},{"id":"REL-005706","type":"contains","from":"EQP-D18","to":"SUB-015","basis":"reference"},{"id":"REL-005707","type":"contains","from":"EQP-D18","to":"SUB-016","basis":"reference"},{"id":"REL-005708","type":"contains","from":"EQP-D19","to":"SUB-013","basis":"reference"},{"id":"REL-005709","type":"contains","from":"EQP-D19","to":"SUB-014","basis":"reference"},{"id":"REL-005710","type":"contains","from":"EQP-D19","to":"SUB-015","basis":"reference"},{"id":"REL-005711","type":"contains","from":"EQP-D19","to":"SUB-016","basis":"reference"},{"id":"REL-005712","type":"contains","from":"EQP-D20","to":"SUB-013","basis":"reference"},{"id":"REL-005713","type":"contains","from":"EQP-D20","to":"SUB-014","basis":"reference"},{"id":"REL-005714","type":"contains","from":"EQP-D20","to":"SUB-015","basis":"reference"},{"id":"REL-005715","type":"contains","from":"EQP-D20","to":"SUB-016","basis":"reference"},{"id":"REL-005716","type":"contains","from":"EQP-D21","to":"SUB-013","basis":"reference"},{"id":"REL-005717","type":"contains","from":"EQP-D21","to":"SUB-014","basis":"reference"},{"id":"REL-005718","type":"contains","from":"EQP-D21","to":"SUB-015","basis":"reference"},{"id":"REL-005719","type":"contains","from":"EQP-D21","to":"SUB-016","basis":"reference"},{"id":"REL-005720","type":"contains","from":"EQP-D22","to":"SUB-013","basis":"reference"},{"id":"REL-005721","type":"contains","from":"EQP-D22","to":"SUB-014","basis":"reference"},{"id":"REL-005722","type":"contains","from":"EQP-D22","to":"SUB-015","basis":"reference"},{"id":"REL-005723","type":"contains","from":"EQP-D22","to":"SUB-016","basis":"reference"},{"id":"REL-005724","type":"contains","from":"EQP-F01","to":"SUB-001","basis":"reference"},{"id":"REL-005725","type":"contains","from":"EQP-F01","to":"SUB-002","basis":"reference"},{"id":"REL-005726","type":"contains","from":"EQP-F01","to":"SUB-003","basis":"reference"},{"id":"REL-005727","type":"contains","from":"EQP-F01","to":"SUB-008","basis":"reference"},{"id":"REL-005728","type":"contains","from":"EQP-F01","to":"SUB-009","basis":"reference"},{"id":"REL-005729","type":"contains","from":"EQP-F01","to":"SUB-011","basis":"reference"},{"id":"REL-005730","type":"contains","from":"EQP-F01","to":"SUB-013","basis":"reference"},{"id":"REL-005731","type":"contains","from":"EQP-F01","to":"SUB-014","basis":"reference"},{"id":"REL-005732","type":"contains","from":"EQP-F01","to":"SUB-015","basis":"reference"},{"id":"REL-005733","type":"contains","from":"EQP-F01","to":"SUB-016","basis":"reference"},{"id":"REL-005734","type":"contains","from":"EQP-F05","to":"SUB-001","basis":"reference"},{"id":"REL-005735","type":"contains","from":"EQP-F05","to":"SUB-002","basis":"reference"},{"id":"REL-005736","type":"contains","from":"EQP-F05","to":"SUB-003","basis":"reference"},{"id":"REL-005737","type":"contains","from":"EQP-F05","to":"SUB-008","basis":"reference"},{"id":"REL-005738","type":"contains","from":"EQP-F05","to":"SUB-009","basis":"reference"},{"id":"REL-005739","type":"contains","from":"EQP-F05","to":"SUB-011","basis":"reference"},{"id":"REL-005740","type":"contains","from":"EQP-F05","to":"SUB-013","basis":"reference"},{"id":"REL-005741","type":"contains","from":"EQP-F05","to":"SUB-014","basis":"reference"},{"id":"REL-005742","type":"contains","from":"EQP-F05","to":"SUB-015","basis":"reference"},{"id":"REL-005743","type":"contains","from":"EQP-F05","to":"SUB-016","basis":"reference"},{"id":"REL-005744","type":"contains","from":"EQP-F07","to":"SUB-001","basis":"reference"},{"id":"REL-005745","type":"contains","from":"EQP-F07","to":"SUB-002","basis":"reference"},{"id":"REL-005746","type":"contains","from":"EQP-F07","to":"SUB-003","basis":"reference"},{"id":"REL-005747","type":"contains","from":"EQP-F07","to":"SUB-008","basis":"reference"},{"id":"REL-005748","type":"contains","from":"EQP-F07","to":"SUB-009","basis":"reference"},{"id":"REL-005749","type":"contains","from":"EQP-F07","to":"SUB-011","basis":"reference"},{"id":"REL-005750","type":"contains","from":"EQP-F07","to":"SUB-013","basis":"reference"},{"id":"REL-005751","type":"contains","from":"EQP-F07","to":"SUB-014","basis":"reference"},{"id":"REL-005752","type":"contains","from":"EQP-F07","to":"SUB-015","basis":"reference"},{"id":"REL-005753","type":"contains","from":"EQP-F07","to":"SUB-016","basis":"reference"},{"id":"REL-005754","type":"contains","from":"EQP-G01","to":"SUB-001","basis":"reference"},{"id":"REL-005755","type":"contains","from":"EQP-G01","to":"SUB-002","basis":"reference"},{"id":"REL-005756","type":"contains","from":"EQP-G01","to":"SUB-003","basis":"reference"},{"id":"REL-005757","type":"contains","from":"EQP-G01","to":"SUB-006","basis":"reference"},{"id":"REL-005758","type":"contains","from":"EQP-G01","to":"SUB-008","basis":"reference"},{"id":"REL-005759","type":"contains","from":"EQP-G01","to":"SUB-009","basis":"reference"},{"id":"REL-005760","type":"contains","from":"EQP-G01","to":"SUB-011","basis":"reference"},{"id":"REL-005761","type":"contains","from":"EQP-G01","to":"SUB-013","basis":"reference"},{"id":"REL-005762","type":"contains","from":"EQP-G01","to":"SUB-014","basis":"reference"},{"id":"REL-005763","type":"contains","from":"EQP-G01","to":"SUB-015","basis":"reference"},{"id":"REL-005764","type":"contains","from":"EQP-G01","to":"SUB-016","basis":"reference"},{"id":"REL-005765","type":"contains","from":"EQP-G02","to":"SUB-001","basis":"reference"},{"id":"REL-005766","type":"contains","from":"EQP-G02","to":"SUB-002","basis":"reference"},{"id":"REL-005767","type":"contains","from":"EQP-G02","to":"SUB-003","basis":"reference"},{"id":"REL-005768","type":"contains","from":"EQP-G02","to":"SUB-006","basis":"reference"},{"id":"REL-005769","type":"contains","from":"EQP-G02","to":"SUB-008","basis":"reference"},{"id":"REL-005770","type":"contains","from":"EQP-G02","to":"SUB-009","basis":"reference"},{"id":"REL-005771","type":"contains","from":"EQP-G02","to":"SUB-011","basis":"reference"},{"id":"REL-005772","type":"contains","from":"EQP-G02","to":"SUB-013","basis":"reference"},{"id":"REL-005773","type":"contains","from":"EQP-G02","to":"SUB-014","basis":"reference"},{"id":"REL-005774","type":"contains","from":"EQP-G02","to":"SUB-015","basis":"reference"},{"id":"REL-005775","type":"contains","from":"EQP-G02","to":"SUB-016","basis":"reference"},{"id":"REL-005776","type":"contains","from":"EQP-G03","to":"SUB-001","basis":"reference"},{"id":"REL-005777","type":"contains","from":"EQP-G03","to":"SUB-002","basis":"reference"},{"id":"REL-005778","type":"contains","from":"EQP-G03","to":"SUB-003","basis":"reference"},{"id":"REL-005779","type":"contains","from":"EQP-G03","to":"SUB-006","basis":"reference"},{"id":"REL-005780","type":"contains","from":"EQP-G03","to":"SUB-008","basis":"reference"},{"id":"REL-005781","type":"contains","from":"EQP-G03","to":"SUB-009","basis":"reference"},{"id":"REL-005782","type":"contains","from":"EQP-G03","to":"SUB-011","basis":"reference"},{"id":"REL-005783","type":"contains","from":"EQP-G03","to":"SUB-013","basis":"reference"},{"id":"REL-005784","type":"contains","from":"EQP-G03","to":"SUB-014","basis":"reference"},{"id":"REL-005785","type":"contains","from":"EQP-G03","to":"SUB-015","basis":"reference"},{"id":"REL-005786","type":"contains","from":"EQP-G03","to":"SUB-016","basis":"reference"},{"id":"REL-005787","type":"contains","from":"EQP-I05","to":"SUB-001","basis":"reference"},{"id":"REL-005788","type":"contains","from":"EQP-I05","to":"SUB-002","basis":"reference"},{"id":"REL-005789","type":"contains","from":"EQP-I05","to":"SUB-003","basis":"reference"},{"id":"REL-005790","type":"contains","from":"EQP-I05","to":"SUB-008","basis":"reference"},{"id":"REL-005791","type":"contains","from":"EQP-I05","to":"SUB-009","basis":"reference"},{"id":"REL-005792","type":"contains","from":"EQP-I05","to":"SUB-011","basis":"reference"},{"id":"REL-005793","type":"contains","from":"EQP-I05","to":"SUB-013","basis":"reference"},{"id":"REL-005794","type":"contains","from":"EQP-I05","to":"SUB-014","basis":"reference"},{"id":"REL-005795","type":"contains","from":"EQP-I05","to":"SUB-015","basis":"reference"},{"id":"REL-005796","type":"contains","from":"EQP-I05","to":"SUB-016","basis":"reference"},{"id":"REL-005797","type":"contains","from":"EQP-I06","to":"SUB-001","basis":"reference"},{"id":"REL-005798","type":"contains","from":"EQP-I06","to":"SUB-002","basis":"reference"},{"id":"REL-005799","type":"contains","from":"EQP-I06","to":"SUB-003","basis":"reference"},{"id":"REL-005800","type":"contains","from":"EQP-I06","to":"SUB-008","basis":"reference"},{"id":"REL-005801","type":"contains","from":"EQP-I06","to":"SUB-009","basis":"reference"},{"id":"REL-005802","type":"contains","from":"EQP-I06","to":"SUB-011","basis":"reference"},{"id":"REL-005803","type":"contains","from":"EQP-I06","to":"SUB-013","basis":"reference"},{"id":"REL-005804","type":"contains","from":"EQP-I06","to":"SUB-014","basis":"reference"},{"id":"REL-005805","type":"contains","from":"EQP-I06","to":"SUB-015","basis":"reference"},{"id":"REL-005806","type":"contains","from":"EQP-I06","to":"SUB-016","basis":"reference"},{"id":"REL-005807","type":"contains","from":"EQP-I07","to":"SUB-001","basis":"reference"},{"id":"REL-005808","type":"contains","from":"EQP-I07","to":"SUB-002","basis":"reference"},{"id":"REL-005809","type":"contains","from":"EQP-I07","to":"SUB-003","basis":"reference"},{"id":"REL-005810","type":"contains","from":"EQP-I07","to":"SUB-008","basis":"reference"},{"id":"REL-005811","type":"contains","from":"EQP-I07","to":"SUB-009","basis":"reference"},{"id":"REL-005812","type":"contains","from":"EQP-I07","to":"SUB-011","basis":"reference"},{"id":"REL-005813","type":"contains","from":"EQP-I07","to":"SUB-013","basis":"reference"},{"id":"REL-005814","type":"contains","from":"EQP-I07","to":"SUB-014","basis":"reference"},{"id":"REL-005815","type":"contains","from":"EQP-I07","to":"SUB-015","basis":"reference"},{"id":"REL-005816","type":"contains","from":"EQP-I07","to":"SUB-016","basis":"reference"},{"id":"REL-005817","type":"contains","from":"EQP-I08","to":"SUB-001","basis":"reference"},{"id":"REL-005818","type":"contains","from":"EQP-I08","to":"SUB-002","basis":"reference"},{"id":"REL-005819","type":"contains","from":"EQP-I08","to":"SUB-003","basis":"reference"},{"id":"REL-005820","type":"contains","from":"EQP-I08","to":"SUB-008","basis":"reference"},{"id":"REL-005821","type":"contains","from":"EQP-I08","to":"SUB-009","basis":"reference"},{"id":"REL-005822","type":"contains","from":"EQP-I08","to":"SUB-011","basis":"reference"},{"id":"REL-005823","type":"contains","from":"EQP-I08","to":"SUB-013","basis":"reference"},{"id":"REL-005824","type":"contains","from":"EQP-I08","to":"SUB-014","basis":"reference"},{"id":"REL-005825","type":"contains","from":"EQP-I08","to":"SUB-015","basis":"reference"},{"id":"REL-005826","type":"contains","from":"EQP-I08","to":"SUB-016","basis":"reference"},{"id":"REL-005827","type":"contains","from":"EQP-J01","to":"SUB-008","basis":"reference"},{"id":"REL-005828","type":"contains","from":"EQP-J01","to":"SUB-013","basis":"reference"},{"id":"REL-005829","type":"contains","from":"EQP-J01","to":"SUB-014","basis":"reference"},{"id":"REL-005830","type":"contains","from":"EQP-J01","to":"SUB-016","basis":"reference"},{"id":"REL-005831","type":"contains","from":"EQP-J02","to":"SUB-008","basis":"reference"},{"id":"REL-005832","type":"contains","from":"EQP-J02","to":"SUB-013","basis":"reference"},{"id":"REL-005833","type":"contains","from":"EQP-J02","to":"SUB-014","basis":"reference"},{"id":"REL-005834","type":"contains","from":"EQP-J02","to":"SUB-016","basis":"reference"},{"id":"REL-005835","type":"contains","from":"EQP-J03","to":"SUB-008","basis":"reference"},{"id":"REL-005836","type":"contains","from":"EQP-J03","to":"SUB-013","basis":"reference"},{"id":"REL-005837","type":"contains","from":"EQP-J03","to":"SUB-014","basis":"reference"},{"id":"REL-005838","type":"contains","from":"EQP-J03","to":"SUB-016","basis":"reference"},{"id":"REL-005839","type":"contains","from":"EQP-J04","to":"SUB-008","basis":"reference"},{"id":"REL-005840","type":"contains","from":"EQP-J04","to":"SUB-013","basis":"reference"},{"id":"REL-005841","type":"contains","from":"EQP-J04","to":"SUB-014","basis":"reference"},{"id":"REL-005842","type":"contains","from":"EQP-J04","to":"SUB-016","basis":"reference"},{"id":"REL-005843","type":"contains","from":"EQP-J06","to":"SUB-008","basis":"reference"},{"id":"REL-005844","type":"contains","from":"EQP-J06","to":"SUB-013","basis":"reference"},{"id":"REL-005845","type":"contains","from":"EQP-J06","to":"SUB-014","basis":"reference"},{"id":"REL-005846","type":"contains","from":"EQP-J06","to":"SUB-016","basis":"reference"},{"id":"REL-005847","type":"contains","from":"EQP-J07","to":"SUB-008","basis":"reference"},{"id":"REL-005848","type":"contains","from":"EQP-J07","to":"SUB-013","basis":"reference"},{"id":"REL-005849","type":"contains","from":"EQP-J07","to":"SUB-014","basis":"reference"},{"id":"REL-005850","type":"contains","from":"EQP-J07","to":"SUB-016","basis":"reference"},{"id":"REL-005851","type":"contains","from":"EQP-J08","to":"SUB-008","basis":"reference"},{"id":"REL-005852","type":"contains","from":"EQP-J08","to":"SUB-013","basis":"reference"},{"id":"REL-005853","type":"contains","from":"EQP-J08","to":"SUB-014","basis":"reference"},{"id":"REL-005854","type":"contains","from":"EQP-J08","to":"SUB-016","basis":"reference"},{"id":"REL-005855","type":"contains","from":"EQP-J09","to":"SUB-008","basis":"reference"},{"id":"REL-005856","type":"contains","from":"EQP-J09","to":"SUB-013","basis":"reference"},{"id":"REL-005857","type":"contains","from":"EQP-J09","to":"SUB-014","basis":"reference"},{"id":"REL-005858","type":"contains","from":"EQP-J09","to":"SUB-016","basis":"reference"},{"id":"REL-005859","type":"contains","from":"EQP-J10","to":"SUB-008","basis":"reference"},{"id":"REL-005860","type":"contains","from":"EQP-J10","to":"SUB-013","basis":"reference"},{"id":"REL-005861","type":"contains","from":"EQP-J10","to":"SUB-014","basis":"reference"},{"id":"REL-005862","type":"contains","from":"EQP-J10","to":"SUB-016","basis":"reference"},{"id":"REL-005863","type":"contains","from":"EQP-J11","to":"SUB-008","basis":"reference"},{"id":"REL-005864","type":"contains","from":"EQP-J11","to":"SUB-013","basis":"reference"},{"id":"REL-005865","type":"contains","from":"EQP-J11","to":"SUB-014","basis":"reference"},{"id":"REL-005866","type":"contains","from":"EQP-J11","to":"SUB-016","basis":"reference"},{"id":"REL-005867","type":"contains","from":"EQP-J12","to":"SUB-008","basis":"reference"},{"id":"REL-005868","type":"contains","from":"EQP-J12","to":"SUB-013","basis":"reference"},{"id":"REL-005869","type":"contains","from":"EQP-J12","to":"SUB-014","basis":"reference"},{"id":"REL-005870","type":"contains","from":"EQP-J12","to":"SUB-016","basis":"reference"},{"id":"REL-005871","type":"contains","from":"EQP-J14","to":"SUB-008","basis":"reference"},{"id":"REL-005872","type":"contains","from":"EQP-J14","to":"SUB-013","basis":"reference"},{"id":"REL-005873","type":"contains","from":"EQP-J14","to":"SUB-014","basis":"reference"},{"id":"REL-005874","type":"contains","from":"EQP-J14","to":"SUB-016","basis":"reference"},{"id":"REL-005875","type":"contains","from":"EQP-J15","to":"SUB-008","basis":"reference"},{"id":"REL-005876","type":"contains","from":"EQP-J15","to":"SUB-013","basis":"reference"},{"id":"REL-005877","type":"contains","from":"EQP-J15","to":"SUB-014","basis":"reference"},{"id":"REL-005878","type":"contains","from":"EQP-J15","to":"SUB-016","basis":"reference"},{"id":"REL-005879","type":"contains","from":"EQP-K04","to":"SUB-001","basis":"reference"},{"id":"REL-005880","type":"contains","from":"EQP-K04","to":"SUB-002","basis":"reference"},{"id":"REL-005881","type":"contains","from":"EQP-K04","to":"SUB-003","basis":"reference"},{"id":"REL-005882","type":"contains","from":"EQP-K04","to":"SUB-008","basis":"reference"},{"id":"REL-005883","type":"contains","from":"EQP-K04","to":"SUB-009","basis":"reference"},{"id":"REL-005884","type":"contains","from":"EQP-K04","to":"SUB-011","basis":"reference"},{"id":"REL-005885","type":"contains","from":"EQP-K04","to":"SUB-013","basis":"reference"},{"id":"REL-005886","type":"contains","from":"EQP-K04","to":"SUB-014","basis":"reference"},{"id":"REL-005887","type":"contains","from":"EQP-K04","to":"SUB-015","basis":"reference"},{"id":"REL-005888","type":"contains","from":"EQP-K04","to":"SUB-016","basis":"reference"},{"id":"REL-005889","type":"used_in","from":"TEC-001","to":"PRS-018","basis":"reference"},{"id":"REL-005890","type":"used_in","from":"TEC-002","to":"PRS-018","basis":"reference"},{"id":"REL-005891","type":"used_in","from":"TEC-003","to":"PRS-018","basis":"reference"},{"id":"REL-005892","type":"used_in","from":"TEC-004","to":"PRS-018","basis":"reference"},{"id":"REL-005893","type":"used_in","from":"TEC-005","to":"PRS-018","basis":"reference"},{"id":"REL-005894","type":"used_in","from":"TEC-006","to":"PRS-018","basis":"reference"},{"id":"REL-005895","type":"used_in","from":"TEC-006","to":"PRS-028","basis":"reference"},{"id":"REL-005896","type":"used_in","from":"TEC-007","to":"PRS-018","basis":"reference"},{"id":"REL-005897","type":"used_in","from":"TEC-008","to":"PRS-018","basis":"reference"},{"id":"REL-005898","type":"used_in","from":"TEC-008","to":"PRS-028","basis":"reference"},{"id":"REL-005899","type":"used_in","from":"TEC-009","to":"PRS-020","basis":"reference"},{"id":"REL-005900","type":"used_in","from":"TEC-010","to":"PRS-020","basis":"reference"},{"id":"REL-005901","type":"used_in","from":"TEC-011","to":"PRS-020","basis":"reference"},{"id":"REL-005902","type":"used_in","from":"TEC-012","to":"PRS-020","basis":"reference"},{"id":"REL-005903","type":"used_in","from":"TEC-012","to":"PRS-043","basis":"reference"},{"id":"REL-005904","type":"used_in","from":"TEC-013","to":"PRS-020","basis":"reference"},{"id":"REL-005905","type":"used_in","from":"TEC-014","to":"PRS-032","basis":"reference"},{"id":"REL-005906","type":"used_in","from":"TEC-015","to":"PRS-013","basis":"reference"},{"id":"REL-005907","type":"used_in","from":"TEC-015","to":"PRS-014","basis":"reference"},{"id":"REL-005908","type":"used_in","from":"TEC-016","to":"PRS-013","basis":"reference"},{"id":"REL-005909","type":"used_in","from":"TEC-016","to":"PRS-014","basis":"reference"},{"id":"REL-005910","type":"used_in","from":"TEC-017","to":"PRS-013","basis":"reference"},{"id":"REL-005911","type":"used_in","from":"TEC-017","to":"PRS-014","basis":"reference"},{"id":"REL-005912","type":"used_in","from":"TEC-018","to":"PRS-013","basis":"reference"},{"id":"REL-005913","type":"used_in","from":"TEC-018","to":"PRS-014","basis":"reference"},{"id":"REL-005914","type":"used_in","from":"TEC-019","to":"PRS-013","basis":"reference"},{"id":"REL-005915","type":"used_in","from":"TEC-019","to":"PRS-015","basis":"reference"},{"id":"REL-005916","type":"used_in","from":"TEC-020","to":"PRS-013","basis":"reference"},{"id":"REL-005917","type":"used_in","from":"TEC-020","to":"PRS-016","basis":"reference"},{"id":"REL-005918","type":"used_in","from":"TEC-020","to":"PRS-025","basis":"reference"},{"id":"REL-005919","type":"used_in","from":"TEC-021","to":"PRS-013","basis":"reference"},{"id":"REL-005920","type":"used_in","from":"TEC-021","to":"PRS-016","basis":"reference"},{"id":"REL-005921","type":"used_in","from":"TEC-022","to":"PRS-009","basis":"reference"},{"id":"REL-005922","type":"used_in","from":"TEC-023","to":"PRS-009","basis":"reference"},{"id":"REL-005923","type":"used_in","from":"TEC-024","to":"PRS-009","basis":"reference"},{"id":"REL-005924","type":"used_in","from":"TEC-025","to":"PRS-025","basis":"reference"},{"id":"REL-005925","type":"used_in","from":"TEC-025","to":"PRS-043","basis":"reference"},{"id":"REL-005926","type":"used_in","from":"TEC-026","to":"PRS-022","basis":"reference"},{"id":"REL-005927","type":"used_in","from":"TEC-027","to":"PRS-011","basis":"reference"},{"id":"REL-005928","type":"used_in","from":"TEC-027","to":"PRS-012","basis":"reference"},{"id":"REL-005929","type":"used_in","from":"TEC-027","to":"PRS-023","basis":"reference"},{"id":"REL-005930","type":"used_in","from":"TEC-028","to":"PRS-023","basis":"reference"},{"id":"REL-005931","type":"used_in","from":"TEC-029","to":"PRS-024","basis":"reference"},{"id":"REL-005932","type":"used_in","from":"TEC-030","to":"PRS-010","basis":"reference"},{"id":"REL-005933","type":"used_in","from":"TEC-031","to":"PRS-027","basis":"reference"},{"id":"REL-005934","type":"used_in","from":"TEC-031","to":"PRS-040","basis":"reference"},{"id":"REL-005935","type":"used_in","from":"TEC-032","to":"PRS-027","basis":"reference"},{"id":"REL-005936","type":"used_in","from":"TEC-033","to":"PRS-040","basis":"reference"},{"id":"REL-005937","type":"used_in","from":"TEC-034","to":"PRS-026","basis":"reference"},{"id":"REL-005938","type":"used_in","from":"TEC-035","to":"PRS-026","basis":"reference"},{"id":"REL-005939","type":"used_in","from":"TEC-036","to":"PRS-026","basis":"reference"},{"id":"REL-005940","type":"used_in","from":"TEC-037","to":"PRS-032","basis":"reference"},{"id":"REL-005941","type":"used_in","from":"TEC-037","to":"PRS-039","basis":"reference"},{"id":"REL-005942","type":"used_in","from":"TEC-038","to":"PRS-032","basis":"reference"},{"id":"REL-005943","type":"used_in","from":"TEC-039","to":"PRS-033","basis":"reference"},{"id":"REL-005944","type":"used_in","from":"TEC-040","to":"PRS-034","basis":"reference"},{"id":"REL-005945","type":"used_in","from":"TEC-041","to":"PRS-035","basis":"reference"},{"id":"REL-005946","type":"used_in","from":"TEC-042","to":"PRS-035","basis":"reference"},{"id":"REL-005947","type":"used_in","from":"TEC-042","to":"PRS-049","basis":"reference"},{"id":"REL-005948","type":"used_in","from":"TEC-043","to":"PRS-049","basis":"reference"},{"id":"REL-005949","type":"used_in","from":"TEC-043","to":"PRS-051","basis":"reference"},{"id":"REL-005950","type":"used_in","from":"TEC-044","to":"PRS-051","basis":"reference"},{"id":"REL-005951","type":"used_in","from":"TEC-044","to":"PRS-052","basis":"reference"},{"id":"REL-005952","type":"used_in","from":"TEC-045","to":"PRS-036","basis":"reference"},{"id":"REL-005953","type":"used_in","from":"TEC-046","to":"PRS-046","basis":"reference"},{"id":"REL-005954","type":"used_in","from":"TEC-047","to":"PRS-047","basis":"reference"},{"id":"REL-005955","type":"used_in","from":"TEC-048","to":"PRS-047","basis":"reference"},{"id":"REL-005956","type":"used_in","from":"TEC-048","to":"PRS-053","basis":"reference"},{"id":"REL-005957","type":"used_in","from":"TEC-049","to":"PRS-048","basis":"reference"},{"id":"REL-005958","type":"used_in","from":"TEC-050","to":"PRS-049","basis":"reference"},{"id":"REL-005959","type":"used_in","from":"TEC-051","to":"PRS-049","basis":"reference"},{"id":"REL-005960","type":"used_in","from":"TEC-052","to":"PRS-050","basis":"reference"},{"id":"REL-005961","type":"used_in","from":"TEC-053","to":"PRS-043","basis":"reference"},{"id":"REL-005962","type":"used_in","from":"TEC-054","to":"PRS-044","basis":"reference"},{"id":"REL-005963","type":"used_in","from":"TEC-055","to":"PRS-045","basis":"reference"},{"id":"REL-005964","type":"used_in","from":"TEC-056","to":"PRS-029","basis":"reference"},{"id":"REL-005965","type":"used_in","from":"TEC-056","to":"PRS-041","basis":"reference"},{"id":"REL-005966","type":"used_in","from":"TEC-057","to":"PRS-042","basis":"reference"},{"id":"REL-005967","type":"used_in","from":"TEC-058","to":"PRS-003","basis":"reference"},{"id":"REL-005968","type":"used_in","from":"TEC-059","to":"PRS-038","basis":"reference"},{"id":"REL-005969","type":"used_in","from":"TEC-060","to":"PRS-032","basis":"reference"},{"id":"REL-005970","type":"used_in","from":"TEC-061","to":"PRS-032","basis":"reference"},{"id":"REL-005971","type":"used_in","from":"TEC-063","to":"PRS-044","basis":"reference"},{"id":"REL-005972","type":"used_in","from":"TEC-063","to":"PRS-053","basis":"reference"},{"id":"REL-005973","type":"used_in","from":"TEC-064","to":"PRS-032","basis":"reference"},{"id":"REL-005974","type":"used_in","from":"TEC-065","to":"PRS-003","basis":"reference"},{"id":"REL-005975","type":"used_in","from":"TEC-065","to":"PRS-039","basis":"reference"},{"id":"REL-005976","type":"used_in","from":"TEC-067","to":"PRS-023","basis":"reference"},{"id":"REL-005977","type":"used_in","from":"TEC-067","to":"PRS-055","basis":"reference"},{"id":"REL-005978","type":"used_in","from":"TEC-068","to":"PRS-054","basis":"reference"},{"id":"REL-005979","type":"used_in","from":"TEC-069","to":"PRS-052","basis":"reference"},{"id":"REL-005980","type":"used_in","from":"TEC-070","to":"PRS-056","basis":"reference"},{"id":"REL-005981","type":"used_in","from":"TEC-082","to":"PRS-054","basis":"reference"},{"id":"REL-005982","type":"used_in","from":"TEC-082","to":"PRS-055","basis":"reference"},{"id":"REL-005983","type":"located_in","from":"FAC-000001","to":"CTY-IN","basis":"source","source_ids":["SRC-000963","SRC-000961","SRC-000962"],"detail":{"state":"Gujarat","city":"Dholera"}},{"id":"REL-005984","type":"operates","from":"FAB-000019","to":"FAC-000001","basis":"source","source_ids":["SRC-000963","SRC-000961","SRC-000962"],"confidence":"MEDIUM"},{"id":"REL-005985","type":"located_in","from":"FAC-000002","to":"CTY-IN","basis":"source","source_ids":["SRC-000963","SRC-000961","SRC-000962"],"detail":{"state":"Assam","city":"Jagiroad (Morigaon district)"}},{"id":"REL-005986","type":"operates","from":"OSAT-000019","to":"FAC-000002","basis":"source","source_ids":["SRC-000963","SRC-000961","SRC-000962"],"confidence":"MEDIUM"},{"id":"REL-005987","type":"located_in","from":"FAC-000003","to":"CTY-IN","basis":"source","source_ids":["SRC-000961","SRC-000968"],"detail":{"state":"Gujarat","city":"Sanand"}},{"id":"REL-005988","type":"operates","from":"OSAT-000020","to":"FAC-000003","basis":"source","source_ids":["SRC-000961","SRC-000968"],"confidence":"MEDIUM"},{"id":"REL-005989","type":"located_in","from":"FAC-000004","to":"CTY-IN","basis":"source","source_ids":["SRC-000966","SRC-000967"],"detail":{"state":"Gujarat","city":"Sanand"}},{"id":"REL-005990","type":"operates","from":"OSAT-000022","to":"FAC-000004","basis":"source","source_ids":["SRC-000966","SRC-000967"],"confidence":"MEDIUM"},{"id":"REL-005991","type":"operates","from":"FAB-000004","to":"FAC-000004","basis":"source","source_ids":["SRC-000966","SRC-000967"],"confidence":"MEDIUM"},{"id":"REL-005992","type":"located_in","from":"FAC-000005","to":"CTY-IN","basis":"source","source_ids":["SRC-000960"],"detail":{"state":"Gujarat","city":"Sanand"}},{"id":"REL-005993","type":"operates","from":"OSAT-000021","to":"FAC-000005","basis":"source","source_ids":["SRC-000960"],"confidence":"MEDIUM"},{"id":"REL-005994","type":"located_in","from":"FAC-000006","to":"CTY-IN","basis":"source","source_ids":["SRC-000964","SRC-000965"],"detail":{"state":"Uttar Pradesh","city":"Jewar (YEIDA area)"}},{"id":"REL-005995","type":"located_in","from":"FAC-000007","to":"CTY-IN","basis":"source","source_ids":["SRC-000958"],"detail":{"state":"Odisha","city":"Bhubaneswar (Info Valley)"}},{"id":"REL-005996","type":"located_in","from":"FAC-000008","to":"CTY-IN","basis":"source","source_ids":["SRC-000958"],"detail":{"state":"Odisha","city":"Bhubaneswar (Info Valley)"}},{"id":"REL-005997","type":"located_in","from":"FAC-000009","to":"CTY-IN","basis":"source","source_ids":["SRC-000958","SRC-000971","SRC-000972"],"detail":{"state":"Punjab","city":"Mohali"}},{"id":"REL-005998","type":"operates","from":"OSAT-000029","to":"FAC-000009","basis":"source","source_ids":["SRC-000958","SRC-000971","SRC-000972"],"confidence":"LOW"},{"id":"REL-005999","type":"located_in","from":"FAC-000010","to":"CTY-IN","basis":"source","source_ids":["SRC-000958","SRC-000969","SRC-000970"],"detail":{"state":"Andhra Pradesh","city":"Visakhapatnam"}},{"id":"REL-006000","type":"located_in","from":"FAC-000011","to":"CTY-IN","basis":"source","source_ids":["SRC-000959","SRC-000973"],"detail":{"state":"Gujarat","city":"Dholera"}},{"id":"REL-006001","type":"located_in","from":"FAC-000012","to":"CTY-IN","basis":"source","source_ids":["SRC-000959"],"detail":{"state":"Gujarat","city":"Surat"}},{"id":"REL-006002","type":"located_in","from":"FAC-000013","to":"CTY-IN","basis":"source","source_ids":["SRC-000952","SRC-000974"],"detail":{"state":"Tamil Nadu","city":"Sulur, Coimbatore"}},{"id":"REL-006003","type":"operates","from":"CMP-000221","to":"FAC-000013","basis":"source","source_ids":["SRC-000952","SRC-000974"],"confidence":"MEDIUM"},{"id":"REL-006004","type":"located_in","from":"FAC-000014","to":"CTY-US","basis":"source","source_ids":["SRC-000977"],"detail":{"state":"Arizona","city":"Phoenix"}},{"id":"REL-006005","type":"operates","from":"FAB-000001","to":"FAC-000014","basis":"source","source_ids":["SRC-000977"],"confidence":"MEDIUM"},{"id":"REL-006006","type":"located_in","from":"FAC-000015","to":"CTY-JP","basis":"source","source_ids":["SRC-000978"],"detail":{"state":"Kumamoto","city":"Kikuyo"}},{"id":"REL-006007","type":"operates","from":"FAB-000001","to":"FAC-000015","basis":"source","source_ids":["SRC-000978"],"confidence":"MEDIUM"},{"id":"REL-006008","type":"located_in","from":"FAC-000016","to":"CTY-JP","basis":"source","source_ids":["SRC-000979"],"detail":{"state":"Kumamoto","city":"Kumamoto prefecture"}},{"id":"REL-006009","type":"operates","from":"FAB-000001","to":"FAC-000016","basis":"source","source_ids":["SRC-000979"],"confidence":"LOW"},{"id":"REL-006010","type":"located_in","from":"FAC-000017","to":"CTY-DE","basis":"source","source_ids":["SRC-000980","SRC-000981"],"detail":{"state":"Saxony","city":"Dresden"}},{"id":"REL-006011","type":"operates","from":"FAB-000001","to":"FAC-000017","basis":"source","source_ids":["SRC-000980","SRC-000981"],"confidence":"MEDIUM"},{"id":"REL-006012","type":"located_in","from":"FAC-000018","to":"CTY-JP","basis":"source","source_ids":["SRC-000982"],"detail":{"state":"Hokkaido","city":"Chitose"}},{"id":"REL-006013","type":"operates","from":"FAB-000023","to":"FAC-000018","basis":"source","source_ids":["SRC-000982"],"confidence":"MEDIUM"},{"id":"REL-006014","type":"located_in","from":"FAC-000019","to":"CTY-US","basis":"source","source_ids":["SRC-000983","SRC-000984"],"detail":{"state":"Texas","city":"Taylor"}},{"id":"REL-006015","type":"operates","from":"FAB-000002","to":"FAC-000019","basis":"source","source_ids":["SRC-000983","SRC-000984"],"confidence":"LOW"},{"id":"REL-006016","type":"located_in","from":"FAC-000020","to":"CTY-US","basis":"source","source_ids":["SRC-000985","SRC-000986"],"detail":{"state":"Ohio","city":"New Albany (Licking County)"}},{"id":"REL-006017","type":"operates","from":"FAB-000003","to":"FAC-000020","basis":"source","source_ids":["SRC-000985","SRC-000986"],"confidence":"MEDIUM"},{"id":"REL-006018","type":"located_in","from":"FAC-000021","to":"CTY-DE","basis":"source","source_ids":["SRC-000987","SRC-000988"],"detail":{"state":"Saxony-Anhalt","city":"Magdeburg"}},{"id":"REL-006019","type":"operates","from":"FAB-000003","to":"FAC-000021","basis":"source","source_ids":["SRC-000987","SRC-000988"],"confidence":"MEDIUM"},{"id":"REL-006020","type":"located_in","from":"FAC-000022","to":"CTY-US","basis":"source","source_ids":["SRC-000989","SRC-000990"],"detail":{"state":"Arizona","city":"Peoria"}},{"id":"REL-006021","type":"operates","from":"OSAT-000016","to":"FAC-000022","basis":"source","source_ids":["SRC-000989","SRC-000990"],"confidence":"MEDIUM"},{"id":"REL-006022","type":"located_in","from":"FAC-000023","to":"CTY-US","basis":"source","source_ids":["SRC-000991","SRC-000992"],"detail":{"state":"Idaho","city":"Boise"}},{"id":"REL-006023","type":"operates","from":"FAB-000004","to":"FAC-000023","basis":"source","source_ids":["SRC-000991","SRC-000992"],"confidence":"MEDIUM"},{"id":"REL-006024","type":"located_in","from":"FAC-000024","to":"CTY-KR","basis":"source","source_ids":["SRC-000993"],"detail":{"state":"Gyeonggi","city":"Yongin"}},{"id":"REL-006025","type":"operates","from":"FAB-000005","to":"FAC-000024","basis":"source","source_ids":["SRC-000993"],"confidence":"MEDIUM"},{"id":"REL-006026","type":"located_in","from":"FAC-000025","to":"CTY-US","basis":"source","source_ids":["SRC-000994","SRC-000995"],"detail":{"state":"Indiana","city":"West Lafayette"}},{"id":"REL-006027","type":"operates","from":"FAB-000005","to":"FAC-000025","basis":"source","source_ids":["SRC-000994","SRC-000995"],"confidence":"MEDIUM"}],"sources":[{"id":"SRC-000000","legacy_id":"S0000","entity_type":"source","title":"User brief: Global Semiconductor Equipment Company Database (45 parts)","publisher":"TEAL (user)","source_type":"Internal (user-provided)","source_url":null,"internal":true,"tier":"BRIEF","tier_label":"Internal brief","publication_date":"2026-09-29","evidence_date":"2026-09-29","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Build a comprehensive GLOBAL SEMICONDUCTOR EQUIPMENT COMPANY DATABASE.","notes":"Defines taxonomy structure, fields, rules","used_by":5,"verification_status":"captured"},{"id":"SRC-INT1","legacy_id":"SINT1","entity_type":"source","title":"TEAL internal context","publisher":"TEAL (user)","source_type":"Internal (user-provided)","source_url":null,"internal":true,"tier":"INT","tier_label":"Internal note","publication_date":"2026-09","evidence_date":"2026-09","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Withheld in public edition (TEAL internal)","notes":"Withheld in public edition (TEAL internal)","used_by":19,"verification_status":"captured"},{"id":"SRC-000001","legacy_id":"S0001","entity_type":"source","title":"SEMI Reports Global Semiconductor Equipment Billings Reached $135 Billion in 2025, Up 15% Year-on-Year","publisher":"SEMI","source_type":"Trade association","source_url":"https://www.semi.org/en/SEMI-Reports-Global-Semiconductor-Equipment-Billings-Reached-135-Billion-in-2025","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-04-07","evidence_date":"2026-04-07","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Worldwide sales of semiconductor manufacturing equipment increased 15% to $135.1 billion in 2025 from $117.1 billion in 2024","notes":"Regional: Japan $9.5B (+22%), Europe $2.9B (-41%), North America $10.9B (-20%), RoW $5.2B (+25%); test +55%, A&P +21%","used_by":0,"verification_status":"captured"},{"id":"SRC-000002","legacy_id":"S0002","entity_type":"source","title":"SEMI Reports Global Total Semiconductor Equipment Sales Forecast to Reach $125.5 Billion in 2025","publisher":"SEMI","source_type":"Trade association","source_url":"https://www.semi.org/en/semi-press-release/semi-reports-global-total-semiconductor-equipment-sales-forecast-to-reach-125.5-billion-dollars-in-2025","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-07-22","evidence_date":"2025-07-22","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"forecast to set a new industry record of $125.5 billion in 2025","notes":"A&P equipment forecast $5.4B 2025","used_by":0,"verification_status":"captured"},{"id":"SRC-000003","legacy_id":"S0003","entity_type":"source","title":"SEMI: Chip manufacturing equipment to hit record high in 2025","publisher":"Electronics360 / GlobalSpec","source_type":"Industry publication","source_url":"https://electronics360.globalspec.com/article/23198/semi-chip-manufacturing-equipment-to-hit-record-high-in-2025","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-12-19","evidence_date":"2025-12-19","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"projected $145 billion in 2026 and $156 billion in 2027","notes":"SEMI year-end forecast","used_by":0,"verification_status":"captured"},{"id":"SRC-000004","legacy_id":"S0004","entity_type":"source","title":"Top IC Manufacturing Equipment Suppliers in 2025","publisher":"TechInsights","source_type":"Industry publication","source_url":"https://www.techinsights.com/blog/top-ic-manufacturing-equipment-suppliers-2025","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-07","evidence_date":"2026-07","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"ASML extended its position as the market leader, generating $27.5 billion in revenue","notes":"Top-5 = ASML, AMAT, Lam, TEL, KLA","used_by":5,"verification_status":"captured"},{"id":"SRC-000005","legacy_id":"S0005","entity_type":"source","title":"CINNO: Top 10 semiconductor equipment companies exceeded US$64 billion in 1H 2025","publisher":"Webull (relaying CINNO Research)","source_type":"Blog/aggregator","source_url":"https://www.webull.com/news/13521455135785984","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":"2025-09","evidence_date":"2025-09","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"total revenue of the top 10 global semiconductor equipment companies in the semiconductor business exceeded 64 billion US dollars","notes":"Naura 7th in 1H25","used_by":0,"verification_status":"captured"},{"id":"SRC-000006","legacy_id":"S0006","entity_type":"source","title":"Top 10 Semiconductor Equipment Companies","publisher":"VerityRank","source_type":"Blog/aggregator","source_url":"https://www.verityrank.com/semiconductor-equipment-companies","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"ASMI generated a record EUR 3.17 billion in 2025 revenue","notes":"Corroboration only","used_by":0,"verification_status":"unverified_source"},{"id":"SRC-000007","legacy_id":"S0007","entity_type":"source","title":"Gartner Says Worldwide Semiconductor Revenue Grew 21% in 2025","publisher":"Gartner","source_type":"Industry publication","source_url":"https://www.gartner.com/en/newsroom/press-releases/2026-01-12-gartner-says-worldwide-semiconductor-revenue-grew-21-percent-in-2025","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-01-12","evidence_date":"2026-01-12","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"SK Hynix moved into the No. 3 position and totaled $61 billion revenue in 2025","notes":"Customer-side context","used_by":0,"verification_status":"captured"},{"id":"SRC-000008","legacy_id":"S0008","entity_type":"source","title":"Chinese chip tool makers hit record 2025 revenues","publisher":"eeNews Europe","source_type":"Industry publication","source_url":"https://www.eenewseurope.com/en/chinese-chip-tool-makers-record-2025-revenues/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-04","evidence_date":"2026-04","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Naura, AMEC, ACM Research and Piotech all benefited","notes":null,"used_by":0,"verification_status":"captured"},{"id":"SRC-000009","legacy_id":"S0009","entity_type":"source","title":"China Memory Expansion Lifts Domestic Equipment Suppliers: AMEC, Wuhan Jingce, Hwatsing, ACM in Focus","publisher":"TrendForce","source_type":"Industry publication","source_url":"https://www.trendforce.com/news/2026/04/21/news-china-memory-expansion-lifts-domestic-equipment-suppliers-amec-wuhan-jingce-hwatsing-acm-in-focus/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-04-21","evidence_date":"2026-04-21","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"AMEC ... reporting 2025 revenue of RMB 12.38 billion, up 36.6% year on year","notes":"Also: Hwatsing (thinning), ACM (plating), Kingsemi (coating, bonding), Piotech (bonding), JSG (thinning); Naura Accura LX CCP etch","used_by":11,"verification_status":"captured"},{"id":"SRC-000010","legacy_id":"S0010","entity_type":"source","title":"Chinese fabs import record volumes of US chipmaking equipment via Singapore and Malaysia","publisher":"Tom's Hardware (citing Nikkei Asia)","source_type":"Industry publication","source_url":"https://www.tomshardware.com/tech-industry/chinese-chip-tool-makers-booked-record-2025-revenues","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-04","evidence_date":"2026-04","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Naura ... reported 27.14 billion yuan in revenue over just the first three quarters of 2025","notes":null,"used_by":3,"verification_status":"captured"},{"id":"SRC-000011","legacy_id":"S0011","entity_type":"source","title":"Three Chinese firms enter world semiconductor industry top 20","publisher":"China Daily via Shanghai Stock Exchange","source_type":"Industry publication","source_url":"https://english.sse.com.cn/news/newsrelease/voice/c/c_20260204_10808424.shtml","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-02-04","evidence_date":"2026-02-04","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"Naura ... jumped from eighth place in 2022 to fifth in 2025","notes":"Global Net ranking: AMEC 13th, SMEE 20th","used_by":3,"verification_status":"captured"},{"id":"SRC-000012","legacy_id":"S0012","entity_type":"source","title":"China's chip equipment rally faces earnings test as memory boom fuels bets on local tools","publisher":"South China Morning Post","source_type":"Industry publication","source_url":"https://www.scmp.com/tech/tech-trends/article/3359705/chinas-chip-equipment-rally-faces-earnings-test-memory-boom-fuels-bets-local-tools","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-07","evidence_date":"2026-07","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"A group of 14 major Chinese chip equipment firms tracked by Soochow Securities recorded combined revenues of 90 billion yuan (US$13.1 billion) in 2025","notes":"Names Hangzhou Changchuan, Accotest, Skyverse, Wuhan Jingce; Naura 2025 revenue +30.85%","used_by":7,"verification_status":"captured"},{"id":"SRC-000013","legacy_id":"S0013","entity_type":"source","title":"Naura Technology (Wikipedia)","publisher":"Wikipedia","source_type":"Wiki","source_url":"https://en.wikipedia.org/wiki/Naura_Technology","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"Founded: September 2001","notes":"Profile corroboration only","used_by":1,"verification_status":"unverified_source"},{"id":"SRC-000014","legacy_id":"S0014","entity_type":"source","title":"Hwatsing Technology (Wikipedia)","publisher":"Wikipedia","source_type":"Wiki","source_url":"https://en.wikipedia.org/wiki/Hwatsing_Technology","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"Chinese Chipmaking Tool Giant Hwatsing to Invest USD237 Million in New Plant","notes":null,"used_by":1,"verification_status":"unverified_source"},{"id":"SRC-000015","legacy_id":"S0015","entity_type":"source","title":"China narrows semiconductor equipment gap","publisher":"China Daily HK","source_type":"Industry publication","source_url":"https://www.chinadailyhk.com/hk/article/628318","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-02-04","evidence_date":"2026-02-04","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"Expanding the list to the top 30 would include two more Chinese firms — ACM Research and Hwatsing Technology.","notes":null,"used_by":2,"verification_status":"captured"},{"id":"SRC-000016","legacy_id":"S0016","entity_type":"source","title":"China's Chip-Equipment Makers Push Deeper Into Advanced Production","publisher":"TokenHeart","source_type":"Blog/aggregator","source_url":"https://www.tokenheart.ai/article/chinese-chipmaking-equipment-awaits-major-breakthrough","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":"2026-09","evidence_date":"2026-09","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"The company reported 2025 revenue of RMB 39.35 billion, up 30.85% year on year.","notes":"Naura; corroborated on growth by S0012","used_by":5,"verification_status":"unverified_source"},{"id":"SRC-000017","legacy_id":"S0017","entity_type":"source","title":"Semiconductor Manufacturing Equipment Market to Reach US$ 224.44 Billion by 2033","publisher":"Astute Analytica (PR)","source_type":"Market research","source_url":"https://www.globenewswire.com/news-release/2025/10/30/3177622/0/en/Semiconductor-Manufacturing-Equipment-Market-to-Reach-US-224-44-Billion-by-2033-Astute-Analytica.html","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":"2025-10-30","evidence_date":"2025-10-30","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"Hwatsing ... acquired Xinyu Semiconductor","notes":"Uncorroborated deal claim","used_by":2,"verification_status":"captured"},{"id":"SRC-000018","legacy_id":"S0018","entity_type":"source","title":"Semiconductor Industry in India: Incentives and Key Players","publisher":"India Briefing (Dezan Shira)","source_type":"Industry publication","source_url":"https://www.india-briefing.com/news/setting-up-a-semiconductor-fabrication-plant-in-india-what-foreign-investors-should-know-22009.html/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-09","evidence_date":"2026-09","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"As of 18 May 2026, the central government has approved 13 semiconductor projects across seven states under ISM and SPECS.","notes":"Suchi Semicon OSAT Surat INR 39.36B","used_by":0,"verification_status":"captured"},{"id":"SRC-000019","legacy_id":"S0019","entity_type":"source","title":"India Semiconductor Mission (official portal)","publisher":"MeitY / ISM","source_type":"Government source","source_url":"https://ism.gov.in/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-07","evidence_date":"2026-07","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"The Union Cabinet has approved two new semiconductor projects under India Semiconductor Mission (ISM): CRYSTAL MATRIX ... and SUCHI SEMICON","notes":"Also: Kaynes Semicon and Micron ATMP commercial production; CDIL launch at SEMICON India 2026","used_by":0,"verification_status":"captured"},{"id":"SRC-000020","legacy_id":"S0020","entity_type":"source","title":"India's semiconductor push: 12 projects worth Rs 1.64 lakh crore approved, three now operational","publisher":"TechObserver (citing Lok Sabha reply)","source_type":"Industry publication","source_url":"https://techobserver.in/news/egov/india-semiconductor-mission-projects-talent-semicon-2-328117/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-08","evidence_date":"2026-08","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"The Union Cabinet approved Semicon 2.0 on 15 July 2026 with an outlay of Rs 1.275 lakh crore.","notes":"Six pillars incl. machines and materials","used_by":0,"verification_status":"captured"},{"id":"SRC-000021","legacy_id":"S0021","entity_type":"source","title":"ISM Approved Projects 2026","publisher":"Fidus","source_type":"Blog/aggregator","source_url":"https://fidus.one/india-semiconductor-mission/projects","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":"2026-07","evidence_date":"2026-07","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Micron Technology — Sanand ATMP USD 2.75B","notes":"Project dates (Micron 28 Feb 2026; Kaynes 31 Mar 2026; CG Semi 4 Jul 2026)","used_by":0,"verification_status":"unverified_source"},{"id":"SRC-000022","legacy_id":"S0022","entity_type":"source","title":"Semiconductor Plants in India 2026: Complete List","publisher":"Adda247","source_type":"Blog/aggregator","source_url":"https://currentaffairs.adda247.com/semiconductor-plants-in-india-2026-complete-list-locations-and-manufacturing-details/","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":"2026-08","evidence_date":"2026-08","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"HCL-Foxconn JV | Jewar, Uttar Pradesh | Rs 3,706 crore | Display Driver ICs","notes":"Project investment list; use only where ISM corroborates","used_by":0,"verification_status":"unverified_source"},{"id":"SRC-000023","legacy_id":"S0023","entity_type":"source","title":"Building India's Semiconductor Backbone (Tata Electronics partners)","publisher":"Tata Sons","source_type":"Official website","source_url":"https://www.tata.com/newsroom/business/tata-electronics-business-partners","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-05","evidence_date":"2026-05","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"With Tokyo Electron, Tata Electronics established a strategic equipment partnership","notes":"PSMC Build-License-Transfer; ASML MoU May 2026","used_by":7,"verification_status":"captured"},{"id":"SRC-000024","legacy_id":"S0024","entity_type":"source","title":"Tata Electronics and ASML Announce Strategic Partnership","publisher":"ASML","source_type":"Press release (company)","source_url":"https://www.asml.com/en/news/press-releases/2026/tata-electronics-and-asml-announce-strategic-partnership","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-05","evidence_date":"2026-05","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"The collaboration between Tata Electronics and ASML will focus on deploying ASML's holistic suite of advanced lithography tools and solutions for the Dholera fab.","notes":null,"used_by":4,"verification_status":"captured"},{"id":"SRC-000025","legacy_id":"S0025","entity_type":"source","title":"Tata Electronics and Tokyo Electron (TEL) Announce Strategic Partnership","publisher":"Tata Electronics","source_type":"Press release (company)","source_url":"https://www.tataelectronics.com/w/tata-electronics-and-tokyo-electron-limited-tel-announce-strategic-partnership-to-grow-semiconductor-ecosystem-in-india","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2024-09-10","evidence_date":"2024-09-10","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"VERY_STALE","freshness":"Stale","excerpt":"The two companies will collaborate to accelerate semiconductor equipment infrastructure for India's first Fab being built by Tata Electronics in Dholera, Gujarat, and for its assembly and test facility in Jagiroad, Assam.","notes":null,"used_by":4,"verification_status":"captured"},{"id":"SRC-000026","legacy_id":"S0026","entity_type":"source","title":"ASML to equip India's first commercial chip fab","publisher":"Tom's Hardware","source_type":"Industry publication","source_url":"https://www.tomshardware.com/tech-industry/asml-partners-with-tata-electronics-to-equip-indias-first-commercial-semiconductor-fab","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-05","evidence_date":"2026-05","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"At full capacity, the plant is designed to produce 50,000 wafers per month","notes":"PSMC nodes 28/40/55/90/110 nm","used_by":3,"verification_status":"captured"},{"id":"SRC-000027","legacy_id":"S0027","entity_type":"source","title":"Inside Tata Electronics' Semiconductor Strategy and Partnerships","publisher":"ExpertLancing","source_type":"Blog/aggregator","source_url":"https://expertlancing.com/advisory-industry-reports/tata-electronics-semiconductor-ecosystem/","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":"2026-07","evidence_date":"2026-07","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"South Korea's JT Corp for the OSAT and fab projects [DigiTimes]","notes":"Talks only","used_by":1,"verification_status":"unverified_source"},{"id":"SRC-000028","legacy_id":"S0028","entity_type":"source","title":"Semicon 2026 Day 1: Rs 1 lakh crore investment commitments, 16 MoUs","publisher":"ANI","source_type":"Industry publication","source_url":"https://aninews.in/news/business/semicon-2026-day-1-rs-1-lakh-crore-investment-commitments-16-mous-and-announcements-push-india-semiconductor-ecosystem-deeper20260917230455/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-09-17","evidence_date":"2026-09-17","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Semicon 2.0 will also seek to build a domestic ecosystem for semiconductor manufacturing machines, equipment and materials.","notes":null,"used_by":0,"verification_status":"captured"},{"id":"SRC-000029","legacy_id":"S0029","entity_type":"source","title":"India roundup: Semicon India 2026 puts commercial production and supplier investment in focus","publisher":"DIGITIMES Asia","source_type":"Industry publication","source_url":"https://www.digitimes.com/news/a20260918VL211/semicon-2026-production-commercial-investment.html","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-09-18","evidence_date":"2026-09-18","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Lam Research, Applied Materials, and Fujifilm announced India plans worth a combined INR144 billion (US$1.50 billion)","notes":"Tata Electronics 16 MoUs incl. Nexperia","used_by":0,"verification_status":"captured"},{"id":"SRC-000030","legacy_id":"S0030","entity_type":"source","title":"SEMICON INDIA 2026: India Starts Packaging Chips as Ecosystem Takes Shape","publisher":"EE Times","source_type":"Industry publication","source_url":"https://www.eetimes.com/semicon-india-2026-india-starts-packaging-chips-as-ecosystem-takes-shape/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-09","evidence_date":"2026-09","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"India now has five chip assembly and packaging plants in commercial production","notes":"ISM 2.0 $13.5B","used_by":0,"verification_status":"captured"},{"id":"SRC-000031","legacy_id":"S0031","entity_type":"source","title":"SEMICON India 2026: From Silicon to Systems","publisher":"IBEF","source_type":"Government source","source_url":"https://www.ibef.org/news/semicon-india-2026-from-silicon-to-systems-india-s-semiconductor-journey-on-display","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-09","evidence_date":"2026-09","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"SEMICON India 2026, held from September 17-19, 2026, at Yashobhoomi in New Delhi","notes":null,"used_by":0,"verification_status":"captured"},{"id":"SRC-000032","legacy_id":"S0032","entity_type":"source","title":"Lam Research plans Rs 10,000 crore India investment","publisher":"ANI","source_type":"Industry publication","source_url":"https://www.aninews.in/news/business/lam-research-plans-rs-10000-crore-india-investment-for-silicon-component-manufacturing-rampd-expansion20260916162109/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-09-16","evidence_date":"2026-09-16","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"to establish its first silicon component manufacturing facility in the country","notes":null,"used_by":3,"verification_status":"captured"},{"id":"SRC-000033","legacy_id":"S0033","entity_type":"source","title":"Lam Research To Invest Rs 10,000 Cr In India","publisher":"BW Businessworld","source_type":"Industry publication","source_url":"https://www.businessworld.in/article/lam-research-to-invest-rs-10-000-cr-in-india-plans-first-silicon-manufacturing-facility-624014","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-09-16","evidence_date":"2026-09-16","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Lam already has a large engineering operation and an advanced semiconductor R&D laboratory in Bengaluru.","notes":null,"used_by":4,"verification_status":"captured"},{"id":"SRC-000034","legacy_id":"S0034","entity_type":"source","title":"Lam Research Commits $1.2 Billion Investment In India","publisher":"Benzinga (citing Reuters)","source_type":"Industry publication","source_url":"https://www.benzinga.com/government/regulations/25/02/43664402/lam-research-commits-1-2-billion-investment-in-india-eyes-63-billion-semiconductor-growth-market","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":"2025-02","evidence_date":"2025-02","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"committed over 100 billion rupees ($1.2 billion) in India's southern Karnataka state","notes":null,"used_by":0,"verification_status":"captured"},{"id":"SRC-000035","legacy_id":"S0035","entity_type":"source","title":"Applied Materials plans $5 billion India investment over decade","publisher":"Investing.com","source_type":"Industry publication","source_url":"https://www.investing.com/news/stock-market-news/applied-materials-plans-5-billion-india-investment-over-decade-93CH-4904990","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-09-17","evidence_date":"2026-09-17","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Its India workforce has grown fourfold over the past decade to more than 7,000 employees","notes":"140-acre research park; India supply chain x10","used_by":3,"verification_status":"captured"},{"id":"SRC-000036","legacy_id":"S0036","entity_type":"source","title":"Applied Materials commits $5B to expand India semiconductor footprint","publisher":"TNGlobal","source_type":"Industry publication","source_url":"https://technode.global/2026/09/18/applied-materials-5b-india-semiconductor-investment/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-09-18","evidence_date":"2026-09-18","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"The company has not provided a year-by-year breakdown of the $5 billion commitment.","notes":null,"used_by":3,"verification_status":"captured"},{"id":"SRC-000037","legacy_id":"S0037","entity_type":"source","title":"ASM Technologies and Hind High Vacuum form a Joint Venture for Semiconductor Equipment Manufacturing","publisher":"ASM Technologies Ltd","source_type":"Press release (company)","source_url":"https://asmltd.com/wp-content/uploads/2025/05/HHV-PR.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2022-02-01","evidence_date":"2022-02-01","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"VERY_STALE","freshness":"Stale","excerpt":"The new entity will undertake design led engineering and manufacturing of tools, sub-systems, sub-system components and components for the semiconductor and solar industries.","notes":"50:50 JV","used_by":7,"verification_status":"captured"},{"id":"SRC-000038","legacy_id":"S0038","entity_type":"source","title":"Building a widespread photonics ecosystem in India (HHV interview)","publisher":"Messe Muenchen / World of Photonics","source_type":"Industry publication","source_url":"https://world-of-photonics.com/en/photonics-industry-portal/detail/building-a-widespread-photonics-ecosystem-in-india.html","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-03","evidence_date":"2026-03","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"With around 750 employees worldwide, the Indian Hind High Vacuum (HHV) Group develops and manufactures vacuum furnaces, high-precision optical components as well as customized systems for chemical and physical thin-film deposition","notes":"Three plants in Bangalore","used_by":2,"verification_status":"captured"},{"id":"SRC-000039","legacy_id":"S0039","entity_type":"source","title":"Aequs Limited - Precision Engineering","publisher":"Aequs","source_type":"Official website","source_url":"https://www.aequs.com/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"Aequs Limited (Formerly known as Aequs Private Limited)","notes":"Semiconductor activity NOT established by this source","used_by":1,"verification_status":"captured"},{"id":"SRC-000040","legacy_id":"S0040","entity_type":"source","title":"Breaking the 'Iron Law' of Chip Equipment","publisher":"36Kr (citing TechInsights, The Elec)","source_type":"Blog/aggregator","source_url":"https://eu.36kr.com/en/p/3862257619293193","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":"2026-06","evidence_date":"2026-06","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Hanmi accounted for 71.2% of the HBM TC Bonder market in terms of revenue, leading SEMES, ASMPT, Yamaha Robotics, and Hanwha Semitech.","notes":"Hanwha supplied D2W hybrid bonding cluster to SK hynix (claim)","used_by":5,"verification_status":"captured"},{"id":"SRC-000041","legacy_id":"S0041","entity_type":"source","title":"Hanmi Semiconductor Wins First HBM4 TC Bonder Order From SK hynix","publisher":"The Elec","source_type":"Industry publication","source_url":"https://www.thelec.net/news/articleView.html?idxno=11132","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-06-10","evidence_date":"2026-06-10","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"signed a 44.2 billion won contract with SK hynix to supply its TC Bonder 4.5 Griffin equipment","notes":"Delivery to Cheongju P&T; prior KRW 9.6B deal Jan 2026","used_by":5,"verification_status":"captured"},{"id":"SRC-000042","legacy_id":"S0042","entity_type":"source","title":"SK hynix orders new equipment worth $28.7 mil. for next-gen HBM4","publisher":"The Korea Times","source_type":"Industry publication","source_url":"https://www.koreatimes.co.kr/business/tech-science/20260608/sk-hynix-orders-new-equipment-worth-287-mil-for-next-gen-hbm4","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-06-08","evidence_date":"2026-06-08","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"SK hynix has ordered new high-bandwidth memory (HBM) production equipment from Hanmi Semiconductor in a deal worth 44.2 billion won","notes":"Regulatory filing cited","used_by":3,"verification_status":"captured"},{"id":"SRC-000043","legacy_id":"S0043","entity_type":"source","title":"SK Hynix places orders for HBM equipment with Hanwha Semitech and Hanmi Semiconductor amid patent disputes","publisher":"DIGITIMES Asia","source_type":"Industry publication","source_url":"https://www.digitimes.com/news/a20250520PD216/sk-hynix-hbm-equipment-hanmi-hanwha-patent.html","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-05-20","evidence_date":"2025-05-20","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"SK Hynix has placed significant orders for thermal compression bonding (TCB) equipment with two domestic suppliers, Hanwha Semitech and Hanmi Semiconductor","notes":"Headlines: Semes eyes HBM TCB; Hanmi exclusive talks with Samsung (not read)","used_by":5,"verification_status":"captured"},{"id":"SRC-000044","legacy_id":"S0044","entity_type":"source","title":"Hanmi Semiconductor eyes $1.5 billion sales in 2026","publisher":"KED Global","source_type":"Industry publication","source_url":"https://www.kedglobal.com/korean-chipmakers/newsView/ked202407050007","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2024-07-05","evidence_date":"2024-07-05","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"VERY_STALE","freshness":"Stale","excerpt":"In April, Hanmi Semiconductor agreed to sign a 22.6 billion won deal with Micron Technology Inc. to supply TC bonders.","notes":"Six factories in Incheon","used_by":2,"verification_status":"captured"},{"id":"SRC-000045","legacy_id":"S0045","entity_type":"source","title":"SK hynix Reportedly Places 44.2bn Won TC Bonder Order with Hanmi","publisher":"TrendForce","source_type":"Industry publication","source_url":"https://www.trendforce.com/news/2026/06/09/news-sk-hynix-reportedly-places-44-2bn-won-tc-bonder-order-with-hanmi-accelerating-hbm4-ramp-up/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-06-09","evidence_date":"2026-06-09","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"the contract value represents around 7.7% of Hanmi Semiconductor's 2025 revenue","notes":null,"used_by":3,"verification_status":"captured"},{"id":"SRC-000046","legacy_id":"S0046","entity_type":"source","title":"BESI at the center of the Packaging Power Shift","publisher":"3D InCites (IMAPS)","source_type":"Industry publication","source_url":"https://www.3dincites.com/2026/03/besi-at-the-center-of-the-packaging-power-shift/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-03","evidence_date":"2026-03","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"Die attach still represented around 80% of its 2025 revenue ... more than 150 cumulative orders, 18 customers","notes":"AMAT 9% stake; Kinex; Yole: TCB >$750M, HB >$150M (2025)","used_by":5,"verification_status":"captured"},{"id":"SRC-000047","legacy_id":"S0047","entity_type":"source","title":"Besi sees orders double on hybrid-bonding demand","publisher":"Bits&Chips","source_type":"Industry publication","source_url":"https://bits-chips.com/article/besi-sees-orders-double-on-hybrid-bonding-demand/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-04","evidence_date":"2026-04","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Orders reached 269.7 million euros, more than doubling year-on-year","notes":"Q1-2026; 20 HB customers","used_by":2,"verification_status":"captured"},{"id":"SRC-000048","legacy_id":"S0048","entity_type":"source","title":"[Investment Map] 22 Listed Companies in the Hybrid Bonding Value Chain","publisher":"PhotonCap","source_type":"Blog/aggregator","source_url":"https://photoncap.net/p/investment-map-22-listed-companies","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":"2026-09","evidence_date":"2026-09","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Hanwha Semitech's tool went into SK hynix for evaluation, Semes's tool went into Samsung, and China's Naura unveiled a D2W bonder in March.","notes":"Besi Q2-26 orders EUR 292.9M; 6 AMAT-Besi lines at a leading logic customer","used_by":5,"verification_status":"unverified_source"},{"id":"SRC-000049","legacy_id":"S0049","entity_type":"source","title":"HBM TSV Technology and Equipment Market","publisher":"Mordor Intelligence","source_type":"Market research","source_url":"https://www.mordorintelligence.com/industry-reports/hbm-through-silicon-via-tsv-technology-and-equipment-market","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":"2026-09","evidence_date":"2026-09","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"In April 2025, the company announced a 9% stake in BESI","notes":"AMAT-SK hynix EPIC collaboration claim","used_by":1,"verification_status":"captured"},{"id":"SRC-000050","legacy_id":"S0050","entity_type":"source","title":"A revolutionary cycle in bonding equipment","publisher":"AllWeatherFinance","source_type":"Blog/aggregator","source_url":"https://allweatherfinance.com/a-revolutionary-cycle-in-bonding-equipment-hbms-massive-capacity-expansion-and-the-platformization-of-hybrid-bonding-technology-open-up-a-second-growth-curve/","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":"2026-09","evidence_date":"2026-09","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"ASMPT's new orders in the first half of 2026 reached US$1.631 billion","notes":null,"used_by":2,"verification_status":"unverified_source"},{"id":"SRC-000051","legacy_id":"S0051","entity_type":"source","title":"Hybrid Bonding in 2026","publisher":"NineScrolls","source_type":"Blog/aggregator","source_url":"https://ninescrolls.com/news/hybrid-bonding-in-2026-tsmc-ships-6-m-while-its-newest-disclosed-customer/","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":"2026-09","evidence_date":"2026-09","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Applied Materials and Besi cite roughly 1,600 die placements per hour on the Kinex platform","notes":"Rumour of Lam/AMAT takeover interest in Besi","used_by":4,"verification_status":"unverified_source"},{"id":"SRC-000052","legacy_id":"S0052","entity_type":"source","title":"DISCO Product Information","publisher":"DISCO Corporation","source_type":"Official website","source_url":"https://www.disco.co.jp/eg/products/index.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":false,"access_mode":"not_accessible","access_note":"Access blocked or not accessible at capture; not bypassed","age_class":"UNDATED","freshness":"Unknown","excerpt":"Dicing Saws, Laser Saws, Grinders, Polishers, Wafer Mounter, Inspection systems, Die Separator, Surface Planer, WaterJet Saw","notes":"Model list rendered client-side; families captured, models not","used_by":1,"verification_status":"not_accessible"},{"id":"SRC-000053","legacy_id":"S0053","entity_type":"source","title":"DISCO Technical Review: Stealth laser dicing engine lineup","publisher":"DISCO Corporation","source_type":"Product datasheet","source_url":"https://www.disco.co.jp/eg/solution/technical_review/doc/TR16-04_Stealth%20laser%20dicing%20engine%20lineup_20160610.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2016-06-10","evidence_date":"2016-06-10","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"VERY_STALE","freshness":"Stale","excerpt":"DISCO is the official alliance partner of Hamamatsu Photonics, and we have been given a comprehensive license for the SD technology patent portfolio","notes":"Si transmission onset ~1,000 nm","used_by":6,"verification_status":"captured"},{"id":"SRC-000054","legacy_id":"S0054","entity_type":"source","title":"Stealth Dicing Process (DISCO)","publisher":"DISCO Corporation","source_type":"Product page","source_url":"https://www.disco.co.jp/eg/solution/library/laser/stealth.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"Equipment models that support Stealth Dicing are equipped with an SD engine, which has a modularized laser and optical system developed by Hamamatsu Photonics for DISCO.","notes":"Models: DFL7341, DFL7362","used_by":6,"verification_status":"captured"},{"id":"SRC-000055","legacy_id":"S0055","entity_type":"source","title":"Stealth Dicing Processing Method","publisher":"Hamamatsu Photonics","source_type":"Official website","source_url":"https://sd.hamamatsu.com/jp/en/SD_outline/SD_process.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"Stealth Dicing processing consists of 2 steps.","notes":null,"used_by":2,"verification_status":"captured"},{"id":"SRC-000056","legacy_id":"S0056","entity_type":"source","title":"Stealth Dicing technology","publisher":"Hamamatsu Photonics","source_type":"Product page","source_url":"https://www.hamamatsu.com/us/en/product/semiconductor-manufacturing-support-systems/stealth-dicing-technology.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"focuses a laser beam of a wavelength that permeates through materials","notes":"LBA optics; SDBG for <50 um","used_by":2,"verification_status":"captured"},{"id":"SRC-000057","legacy_id":"S0057","entity_type":"source","title":"ALSI LASER1205","publisher":"ASMPT ALSI","source_type":"Product page","source_url":"https://alsi.semi.asmpt.com/en/products-and-solutions/laser1205-machine/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"Positional accuracy and reproducibility of <1.5 um","notes":"HAZ <2 um; <12 um kerf on 100 um Si; up to 50% faster","used_by":3,"verification_status":"captured"},{"id":"SRC-000058","legacy_id":"S0058","entity_type":"source","title":"About ASMPT ALSI","publisher":"ASMPT ALSI","source_type":"Official website","source_url":"https://alsi.semi.asmpt.com/en/about-alsi/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"Founded in 2001 as a spin-off from Philips Semiconductors","notes":">100 professionals, Beuningen NL","used_by":2,"verification_status":"captured"},{"id":"SRC-000059","legacy_id":"S0059","entity_type":"source","title":"ALSI LASER1205 platform (spec table)","publisher":"ASMPT","source_type":"Product datasheet","source_url":"https://semi.asmpt.com/en/products/ap/alsi/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"Wave length 343 nm / 355 nm / 355 nm / 1064 nm","notes":"Grooving UV-USP / Grooving UV / Dicing UVP / Dicing IR","used_by":5,"verification_status":"captured"},{"id":"SRC-000060","legacy_id":"S0060","entity_type":"source","title":"ALSI LASER1205 - Shaping the Future of Power Electronics","publisher":"ASMPT","source_type":"Product page","source_url":"https://www.asmpt.com/en/innovation/laser-grooving/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"patented V-shaped Diffractive Optical Element (V-DOE) technology","notes":"Die strength 450-500 MPa; 10-250 um wafers","used_by":4,"verification_status":"captured"},{"id":"SRC-000061","legacy_id":"S0061","entity_type":"source","title":"ALSI LASER1206","publisher":"ASMPT ALSI","source_type":"Product page","source_url":"https://alsi.semi.asmpt.com/en/products-and-solutions/laser1206-machine/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"Dicing & Grooving capability for High volume manufacturing.","notes":null,"used_by":2,"verification_status":"captured"},{"id":"SRC-000062","legacy_id":"S0062","entity_type":"source","title":"LASER1205 Grooving UV","publisher":"ASMPT ALSI","source_type":"Product page","source_url":"https://alsi.semi.asmpt.com/en/products/grooving-uv/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"Dedicated to HP Grooving UV wavelength 355nm; pulse length ns range","notes":"Width 10-150 um; burr <3 um; HAZ <2 um","used_by":2,"verification_status":"captured"},{"id":"SRC-000063","legacy_id":"S0063","entity_type":"source","title":"LASER1205 Grooving UV USP","publisher":"ASMPT ALSI","source_type":"Product page","source_url":"https://alsi.semi.asmpt.com/en/products/grooving-uv-usp/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"Process for HP Grooving UV USP wavelength 343nm pulse length 0.5 .. 10 ps","notes":"Burr <1 um","used_by":2,"verification_status":"captured"},{"id":"SRC-000064","legacy_id":"S0064","entity_type":"source","title":"ASMPT introduces ALSI LASER1205","publisher":"Semiconductor Today","source_type":"Industry publication","source_url":"https://www.semiconductor-today.com/news_items/2024/sep/asmpt-180924.shtml","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2024-09-18","evidence_date":"2024-09-18","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"VERY_STALE","freshness":"Stale","excerpt":"The ALSI Laser1205 can process wafers with thicknesses ranging from 10 to 250 microns with a positioning accuracy of less than 1.5 microns.","notes":null,"used_by":2,"verification_status":"captured"},{"id":"SRC-000065","legacy_id":"S0065","entity_type":"source","title":"EO Technics Products - Semiconductor equipment","publisher":"EO Technics","source_type":"Product page","source_url":"http://www.eotechnics.com/en/products/equipment3.php","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"LMC3200G removes the low-k material and metal pattern layers on the wafer sawlane.","notes":"Markers (strip/tray/wafer), LMC3200G/D, PKG cutting, BMC204P, annealing, debonding","used_by":5,"verification_status":"captured"},{"id":"SRC-000066","legacy_id":"S0066","entity_type":"source","title":"SEMICON Taiwan 2026 eBooth: EO Technics","publisher":"SEMI (exhibitor listing)","source_type":"Industry directory","source_url":"https://expo.semi.org/taiwan2026/public/eBooth.aspx?IndexInList=213&ListByBooth=true&BoothID=655489&Nav=False","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026","evidence_date":"2026","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"Wafer Laser Annealing, Wafer Grooving / Dicing and Drilling equipment, WLCSP Wafer Back Side Marker","notes":"Also LLO, laser cleaner, PCB via drillers","used_by":4,"verification_status":"captured"},{"id":"SRC-000067","legacy_id":"S0067","entity_type":"source","title":"EO Technics Co Ltd (039030) profile","publisher":"Investing.com","source_type":"Industry directory","source_url":"https://www.investing.com/equities/eo-technics-co-ltd-company-profile","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"EO Technics Co., Ltd. was founded in 1989 and is headquartered in Anyang-si, South Korea.","notes":null,"used_by":1,"verification_status":"captured"},{"id":"SRC-000068","legacy_id":"S0068","entity_type":"source","title":"Laser Marking, Dicing, Drilling, Debond (EO Technics line)","publisher":"CWI Tech Sales","source_type":"Distributor","source_url":"https://www.cwitechsales.com/laser-marking-dicing-drilling","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"The Laser Debonding system uses a Nanosecond UV Laser with a Flat Top Beam Mode.","notes":"Laser annealing IGBT thin 50-150 um, green","used_by":3,"verification_status":"captured"},{"id":"SRC-000069","legacy_id":"S0069","entity_type":"source","title":"EO Technics Co., Ltd. (Korea) listing","publisher":"AikeLabs","source_type":"Trade portal","source_url":"https://www.aikelabs.com/company/219","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"EF20P-QSF : Maximun 20W output, Q-switched pulsed fiber laser with 1mJ pulse energy.","notes":"In-house fiber lasers","used_by":3,"verification_status":"unverified_source"},{"id":"SRC-000070","legacy_id":"S0070","entity_type":"source","title":"microDICE - Wafer Dicing System using TLS-Dicing","publisher":"3D-Micromac AG","source_type":"Product page","source_url":"https://3d-micromac.com/laser-micromachining/laser-micromachining-systems/microdice/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025-10","evidence_date":"2025-10","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"separate brittle semiconductor materials, such as silicon (Si), silicon carbide (SiC), germanium (Ge) and gallium arsenide (GaAs)","notes":null,"used_by":2,"verification_status":"captured"},{"id":"SRC-000071","legacy_id":"S0071","entity_type":"source","title":"Markets - Semiconductor Industry (3D-Micromac)","publisher":"3D-Micromac AG","source_type":"Product page","source_url":"https://3d-micromac.com/laser-micromachining/machine-solutions-for-innovators-and-growth-markets/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025-06","evidence_date":"2025-06","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"the microPRO XS laser annealing system for OCF and the microVEGA xMR laser annealing system for magnetic sensors","notes":"microPRO XS OCF uses UV DPSS laser","used_by":3,"verification_status":"captured"},{"id":"SRC-000072","legacy_id":"S0072","entity_type":"source","title":"3D-Micromac acquires Jenoptik's thermal laser separation dicing technology","publisher":"Semiconductor Today","source_type":"Industry publication","source_url":"https://www.semiconductor-today.com/news_items/2014/JAN/3D-MICROMAC_160114.shtml","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2014-01-16","evidence_date":"2014-01-16","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"VERY_STALE","freshness":"Stale","excerpt":"Jenoptik ... has transferred expertise, patents and results relating to thermal laser separation (TLS-Dicing) technology ... to 3D-Micromac","notes":"Asset deal effective 1 Jan 2014","used_by":3,"verification_status":"captured"},{"id":"SRC-000073","legacy_id":"S0073","entity_type":"source","title":"3D-Micromac microDICE adopted for volume production of high-power diodes","publisher":"Semiconductor Today","source_type":"Industry publication","source_url":"https://www.semiconductor-today.com/news_items/2016/jul/3dmicromac_060716.shtml","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2016-07-06","evidence_date":"2016-07-06","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"VERY_STALE","freshness":"Stale","excerpt":"adopted by a major industrial manufacturer for volume production of high-power diodes","notes":"Customer unnamed","used_by":3,"verification_status":"captured"},{"id":"SRC-000074","legacy_id":"S0074","entity_type":"source","title":"microDICE System for Separation of SiC Wafer Using TLS","publisher":"3D-Micromac at Fraunhofer ENAS seminar","source_type":"Conference presentation","source_url":"https://www.enas.fraunhofer.de/content/dam/enas/Dokumente/Deutsch/News_Events/ChemnitzerSeminare/Seminar_25_SP_2017/08_ChemSem2016_3D-Micromac_TLS-Dicing_Neubert_web.pdf","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2016","evidence_date":"2016","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"VERY_STALE","freshness":"Stale","excerpt":"Dicing speed 200 mm/s","notes":null,"used_by":2,"verification_status":"captured"},{"id":"SRC-000075","legacy_id":"S0075","entity_type":"source","title":"Laser micro-machining machine microDICE","publisher":"DirectIndustry","source_type":"Trade portal","source_url":"https://www.directindustry.com/prod/3d-micromac/product-32719-1571304.html","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"Positioning accuracy: 0.001 mm, 0.0018 mm","notes":null,"used_by":2,"verification_status":"captured"},{"id":"SRC-000076","legacy_id":"S0076","entity_type":"source","title":"LDS 300 M - SYNOVA","publisher":"Synova SA","source_type":"Product page","source_url":"https://www.synova.ch/product/lds-300-m/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025-07","evidence_date":"2025-07","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"Cutting speed of up to 200 mm/s for thin wafers (< 50 um)","notes":"Tolerance +/-3 um; fiber laser integrated","used_by":2,"verification_status":"captured"},{"id":"SRC-000077","legacy_id":"S0077","entity_type":"source","title":"Synova LDS 300 M Laser MicroJet machine","publisher":"Mantech Geometrics","source_type":"Distributor","source_url":"https://www.mantechgeometrics.co.uk/products/listings/34","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"Laser Type Diode pumped solid state Nd: YAG, pulsed; Wavelength 532/ 1064","notes":"300x300 mm; +/-3 um; +/-1 um repeatability; 2-axis","used_by":2,"verification_status":"captured"},{"id":"SRC-000078","legacy_id":"S0078","entity_type":"source","title":"LDGS 300 A - Synova SA","publisher":"Synova SA","source_type":"Product page","source_url":"https://www.synova.ch/products/all-synova-systems/item/58-ldgs-300a.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"The LDGS 300A is a fully automatic laser dicing and edge grinding system.","notes":null,"used_by":2,"verification_status":"captured"},{"id":"SRC-000079","legacy_id":"S0079","entity_type":"source","title":"New Application Video: Wafer Downsizing, Notch and Flat (LCS 303)","publisher":"Synova SA","source_type":"Official website","source_url":"https://www.synova.ch/products/semiconductor-dicing-systems/item/593-new-application-video-wafer-downsizing,-notch-and-flat.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2024-12","evidence_date":"2024-12","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"Discover the capabilities of our LCS 303 3-axis laser cutting system while processing a SiC wafer","notes":null,"used_by":2,"verification_status":"captured"},{"id":"SRC-000080","legacy_id":"S0080","entity_type":"source","title":"The Latest Breakthrough in Silicon Carbide Wafer Edge Profiling","publisher":"Synova SA (PR Newswire)","source_type":"Press release (company)","source_url":"https://www.prnewswire.com/news-releases/the-latest-breakthrough-in-silicon-carbide-wafer-edge-profiling-302168257.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2024-06-11","evidence_date":"2024-06-11","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"VERY_STALE","freshness":"Stale","excerpt":"The LCS 305 5-axis system offers excellent profiling results, eliminates chipping, and increases fracture strength.","notes":null,"used_by":2,"verification_status":"captured"},{"id":"SRC-000081","legacy_id":"S0081","entity_type":"source","title":"Onto Innovation and LPKF are set to accelerate mass production of glass core substrates","publisher":"LPKF Laser & Electronics SE","source_type":"Press release (company)","source_url":"https://www.lpkf.com/en/news-press/press-releases-teaser/onto-innovation-and-lpkf-are-set-to-accelerate-mass-production-of-glass-core-substrates-for-semiconductors","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025-04","evidence_date":"2025-04","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"installing Onto's state-of-the-art Firefly system into the cleanroom facility at Vitrion","notes":"LPKF joined Onto PACE in 2024","used_by":6,"verification_status":"captured"},{"id":"SRC-000082","legacy_id":"S0082","entity_type":"source","title":"LPKF NEXAR: Glass Substrate Systems for Advanced Packaging","publisher":"LPKF Laser & Electronics SE","source_type":"Product page","source_url":"https://lide.lpkf.com/en/systems/system-overview","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026","evidence_date":"2026","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"Via diameters down to 5 um, aspect ratios up to 1:50","notes":"Panels 515x510 mm; +/-5 um; NG <5 ppm; 0.2-1.1 mm glass; NEXAR BOND 250 mm/s","used_by":3,"verification_status":"captured"},{"id":"SRC-000083","legacy_id":"S0083","entity_type":"source","title":"LPKF Vitrion S 5000","publisher":"LPKF Laser & Electronics (USA)","source_type":"Product page","source_url":"https://www.lpkfusa.com/industries-technologies/thin-glass-precision-processing-lide/lpkf-vitrion-s-5000","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"Glass wafer thickness: 0.3 to 3 mm","notes":"100/150/200/300 mm; 2 FOUPs; SECS/GEM; 1800x2200x3000 mm","used_by":3,"verification_status":"captured"},{"id":"SRC-000084","legacy_id":"S0084","entity_type":"source","title":"LPKF Sees Mass Production of Glass Substrates Beginning in 2027","publisher":"The Elec","source_type":"Industry publication","source_url":"https://www.thelec.net/news/articleView.html?idxno=6674","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-04","evidence_date":"2026-04","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"2027 remains the expected inflection point for commercialization","notes":"TGV, LIDE, ABF ablation, glass welding; CPO waveguides in development","used_by":2,"verification_status":"captured"},{"id":"SRC-000085","legacy_id":"S0085","entity_type":"source","title":"LPKF builds partner network to innovate glass substrate production","publisher":"LPKF Laser & Electronics SE","source_type":"Press release (company)","source_url":"https://www.lpkf.com/en/news-press/press-releases-teaser/lpkf-builds-partner-network-to-innovate-glass-substrate-production-for-semiconductor-packaging","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2024-09-04","evidence_date":"2024-09-04","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"VERY_STALE","freshness":"Stale","excerpt":"LPKF Laser & Electronics SE has initiated a cooperation program to build a robust glass-focused supply chain by the end of 2024.","notes":null,"used_by":2,"verification_status":"captured"},{"id":"SRC-000086","legacy_id":"S0086","entity_type":"source","title":"LPKF is ready for increasing demand for glass substrates","publisher":"LPKF Laser & Electronics SE","source_type":"Press release (company)","source_url":"https://www.lpkf.com/en/news-press/press-releases-teaser/lpkf-is-ready-for-increasing-demand-for-glass-substrates-in-the-semiconductor-industry","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2024-05-13","evidence_date":"2024-05-13","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"VERY_STALE","freshness":"Stale","excerpt":"Glass substrates from 100um up to 1.1mm can be processed quickly, precisely, and without damage","notes":"Vitrion foundry service","used_by":2,"verification_status":"captured"},{"id":"SRC-000087","legacy_id":"S0087","entity_type":"source","title":"LSA 201 Ambient Control Laser Spike Anneal System","publisher":"Veeco Instruments","source_type":"Product page","source_url":"https://www.veeco.com/products/lsa-201-ambient-control-laser-spike-anneal-system/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025-06","evidence_date":"2025-06","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"includes a patented micro chamber design which enables full-wafer ambient control in a scanning laser system","notes":"Long wavelength, Brewster angle, p-polarized","used_by":2,"verification_status":"captured"},{"id":"SRC-000088","legacy_id":"S0088","entity_type":"source","title":"Leading Edge Semiconductor Company Places Multi-System Laser Annealing Order Including First Nanosecond Annealing System","publisher":"Veeco Instruments","source_type":"Press release (company)","source_url":"https://www.veeco.com/company/news/leading-edge-semiconductor-company-places-multi-system-laser-annealing-order-including-first-nanosecond-annealing-system/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2024-05-07","evidence_date":"2024-05-07","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"VERY_STALE","freshness":"Stale","excerpt":"The order includes LSA201 Laser Spike Annealing Systems in addition to an NSA500 Nanosecond Annealing System.","notes":"2nm GAA HVM","used_by":4,"verification_status":"captured"},{"id":"SRC-000089","legacy_id":"S0089","entity_type":"source","title":"Laser Processing Systems - Veeco","publisher":"Veeco Instruments","source_type":"Product page","source_url":"https://www.veeco.com/technologies-and-products/laser-processing-systems/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"Veeco delivers revolutionary Low-Cost-of-Ownership, HVM production-proven thermal annealing solutions","notes":"LSA101, LSA201","used_by":2,"verification_status":"captured"},{"id":"SRC-000090","legacy_id":"S0090","entity_type":"source","title":"Veeco Ships First Laser Annealing System from New San Jose Manufacturing Facility","publisher":"3D InCites (Veeco PR)","source_type":"Press release (company)","source_url":"https://www.3dincites.com/2021/11/veeco-ships-first-laser-annealing-system/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2021-11-22","evidence_date":"2021-11-22","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"VERY_STALE","freshness":"Stale","excerpt":"shipped the first LSA101 Laser Spike Annealing System from their new San Jose, California facility","notes":null,"used_by":2,"verification_status":"captured"},{"id":"SRC-000091","legacy_id":"S0091","entity_type":"source","title":"SCREEN Laser Annealing Technology for Next-Generation Si and SiC Power Devices","publisher":"SCREEN Semiconductor Solutions (SEMI conference)","source_type":"Conference presentation","source_url":"https://www.semi.org/sites/semi.org/files/2022-11/09%20Louis%20Thuries.pdf","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2022-11","evidence_date":"2022-11","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"VERY_STALE","freshness":"Stale","excerpt":"LASSE LT-3100","notes":"UV laser annealing for Si IGBT and SiC backside contact","used_by":4,"verification_status":"captured"},{"id":"SRC-000092","legacy_id":"S0092","entity_type":"source","title":"Top 10 Leading Companies in Laser Annealing Equipment Market in 2026","publisher":"Semiconductor Insight","source_type":"Blog/aggregator","source_url":"https://semiconductorinsight.com/blog/top-10-leading-companies-in-laser-annealing-equipment/","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":"2026-09","evidence_date":"2026-09","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Sumitomo Heavy Industries has shipped more than 150 laser annealing systems worldwide since its first delivery in 2004","notes":"SWA Green/Hybrid; SCREEN LT-3100, QA-3000","used_by":6,"verification_status":"unverified_source"},{"id":"SRC-000093","legacy_id":"S0093","entity_type":"source","title":"UVblade - Laser Lift-Off (LLO) Separation Processing","publisher":"Coherent Corp.","source_type":"Product page","source_url":"https://www.coherent.com/machines-systems/uv-lasers/uv-blade","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"UVblade uses 308 nm UV photons to gently detach delicate polymer-based displays from their rigid glass carriers","notes":"Models 380/750/1250; homogeneity 1.8% (2 sigma); DOF +/-200 um","used_by":4,"verification_status":"captured"},{"id":"SRC-000094","legacy_id":"S0094","entity_type":"source","title":"Display Manufacturing (Coherent)","publisher":"Coherent Corp.","source_type":"Product page","source_url":"https://www.coherent.com/microelectronics-micromachining/displays","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2022","evidence_date":"2022","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"VERY_STALE","freshness":"Stale","excerpt":"LineBeam UV laser systems enable mass manufacturing of low-temperature polysilicon (LTPS) backplanes","notes":null,"used_by":3,"verification_status":"captured"},{"id":"SRC-000095","legacy_id":"S0095","entity_type":"source","title":"What are MicroLED displays? (UVtransfer)","publisher":"Coherent Corp.","source_type":"Official website","source_url":"https://www.coherent.com/news/blog/microled-displays-new","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2021","evidence_date":"2021","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"VERY_STALE","freshness":"Stale","excerpt":"UVtransfer ... performs three separate processes - Laser Lift-Off (LLO), Laser-induced Forward Transfer (LIFT), and Repair/Trimming","notes":null,"used_by":3,"verification_status":"captured"},{"id":"SRC-000096","legacy_id":"S0096","entity_type":"source","title":"LineBeam systems (Coherent product search)","publisher":"Coherent Corp.","source_type":"Product page","source_url":"http://lasers.coherent.com/lasers/line-beam-750","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"LineBeam 750 LineBeam 1000 LineBeam 1300 LineBeam 1500 Wavelength (nm) 308","notes":">1 kW laser power; line beams up to 750 mm used worldwide","used_by":4,"verification_status":"captured"},{"id":"SRC-000097","legacy_id":"S0097","entity_type":"source","title":"ML2200 - Fully automatic dicing machine with IR Laser","publisher":"Tokyo Seimitsu (ACCRETECH)","source_type":"Product datasheet","source_url":"https://www.accretech.com/en/product/semicon/semi/dicer_semi/ml2200.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"Fully automatic dicing machine with IR Laser for phi200mm wafer","notes":"X 0.1-1,100 mm/s; pos. 0.002 mm/210 mm; 1,640x1,340x1,800 mm; 2,000 kg","used_by":3,"verification_status":"captured"},{"id":"SRC-000098","legacy_id":"S0098","entity_type":"source","title":"ML3200 - Fully automatic dicing machine with IR laser","publisher":"Tokyo Seimitsu (ACCRETECH)","source_type":"Product datasheet","source_url":"https://www.accretech.com/en/product/semicon/semi/dicer_semi/ml3200.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"High-speed dicing of 800 mm/sec or greater is available through the high-output laser combination.","notes":"Phi300; X 0.1-2,100 mm/s; 1,712x2,960x1,800 mm; 3,000 kg; class-100 option","used_by":2,"verification_status":"captured"},{"id":"SRC-000099","legacy_id":"S0099","entity_type":"source","title":"AL3000 - Fully automatic dicing machine with UV laser","publisher":"Tokyo Seimitsu (ACCRETECH)","source_type":"Product datasheet","source_url":"https://www.accretech.com/en/product/semicon/semi/dicer_semi/al3000.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"Laser oscillator: Semiconductor laser excitation Q-switch solid state laser; Wavelength 355 nm","notes":"Phi305 max; stroke 310x310 mm; X 1,000 mm/s; Y 300 mm/s","used_by":2,"verification_status":"captured"},{"id":"SRC-000100","legacy_id":"S0100","entity_type":"source","title":"Laser Dicing - ACCRETECH (Europe)","publisher":"Accretech Europe","source_type":"Product page","source_url":"https://www.accretech.eu/en/products/semiconductor/wafer-dicing-machines/laser-dicing/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025-08","evidence_date":"2025-08","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"The laser is focused below the wafer surface and breaks up the crystalline structure.","notes":"ML301 EXWH <=300 mm; 85% less power, 100% less water claim","used_by":2,"verification_status":"captured"},{"id":"SRC-000101","legacy_id":"S0101","entity_type":"source","title":"Fully Automatic IR Laser Dicing Machine ML2200","publisher":"Accretech Europe","source_type":"Product page","source_url":"https://www.accretech.eu/en/products/semiconductor/wafer-dicing-machines/ml2200/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025-10","evidence_date":"2025-10","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"By reducing the dicing cut width from 90 um to just 20 um, you can increase chip yield by up to 20%.","notes":null,"used_by":2,"verification_status":"captured"},{"id":"SRC-000102","legacy_id":"S0102","entity_type":"source","title":"ML200PLUS Mahoh Dicing Machine datasheet (archived)","publisher":"Tokyo Seimitsu (archived copy)","source_type":"Product datasheet","source_url":"https://datasheet.datasheetarchive.com/originals/crawler/accretech.jp/b03d98a1932df8d94f37d69078fb3618.pdf","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"The ML200PLUS makes high speed dicing (300mm/s) of thin wafers possible.","notes":"Hamamatsu SD engine; 30 um wafers; legacy model","used_by":4,"verification_status":"captured"},{"id":"SRC-000103","legacy_id":"S0103","entity_type":"source","title":"Used Accretech wafer dicing listings","publisher":"Machinio","source_type":"Trade portal","source_url":"https://www.machinio.com/tokyo-seimitsu/wafer-dicing","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"ACCRETECH ML300Plus II WH 12-inch laser dicing machine with wafer handling system","notes":"Secondary-market evidence","used_by":2,"verification_status":"captured"},{"id":"SRC-000104","legacy_id":"S0104","entity_type":"source","title":"SS10 dicing machine","publisher":"Tokyo Seimitsu (ACCRETECH)","source_type":"Product datasheet","source_url":"https://www.accretech.com/en/product/semicon/semi/dicer_semi/ss10.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"Compact design, phi150mm wafer compatible dicing machine","notes":"1.8 kW spindle","used_by":2,"verification_status":"captured"},{"id":"SRC-000105","legacy_id":"S0105","entity_type":"source","title":"AD2000T/S dicing machine","publisher":"Tokyo Seimitsu (ACCRETECH)","source_type":"Product datasheet","source_url":"https://www.accretech.com/en/product/semicon/semi/dicer_semi/ad2000ts.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"X axis speed: 1,000 mm/sec, Y axis speed: 300 mm/sec, Z axis speed: 80 mm/sec","notes":null,"used_by":2,"verification_status":"captured"},{"id":"SRC-000106","legacy_id":"S0106","entity_type":"source","title":"AD3000T-HC PLUS dicing machine","publisher":"Tokyo Seimitsu (ACCRETECH)","source_type":"Product datasheet","source_url":"https://www.accretech.com/en/product/semicon/semi/dicer_semi/ad3000t-hc_plus.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"Fully automatic dicing machine for phi300mm wafers","notes":"Twin spindle; FOUP and frame handling","used_by":2,"verification_status":"captured"},{"id":"SRC-000107","legacy_id":"S0107","entity_type":"source","title":"Breaking Cutting Barriers: HGTECH Leads a New Era in High-End Wafer Laser Dicing","publisher":"HGTECH","source_type":"Official website","source_url":"https://www.hglaserglobal.com/laser-dicing-wafer.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025-02-13","evidence_date":"2025-02-13","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"In August 2023, HGTECH independently developed a new generation of fully automatic wafer laser modification dicing equipment, also known as laser stealth dicing equipment.","notes":"Wafer laser dicing launched Jun 2023; chipping <5 um claim","used_by":2,"verification_status":"captured"},{"id":"SRC-000108","legacy_id":"S0108","entity_type":"source","title":"Han's Laser (Wikipedia)","publisher":"Wikipedia","source_type":"Wiki","source_url":"https://en.wikipedia.org/wiki/Han%27s_Laser","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"Revenue: CN¥14.09 billion (2023)","notes":"SZSE 002008; founded 1996; 16,970 employees (2023)","used_by":2,"verification_status":"unverified_source"},{"id":"SRC-000109","legacy_id":"S0109","entity_type":"source","title":"Breaking Through SiC Wafer Dicing Challenges with Di-Sync Laser Stealth Technology","publisher":"Han's Laser (US)","source_type":"Official website","source_url":"https://www.hanslaserus.com/knowledge/breaking-through-sic-wafer-dicing-challenges-with-di-sync-laser-stealth-technology/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025-08","evidence_date":"2025-08","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"Processing Efficiency: Slow (~40 min per wafer) vs Fast (average <15 min per wafer)","notes":"Single laser head; 3 units vs 5","used_by":2,"verification_status":"captured"},{"id":"SRC-000110","legacy_id":"S0110","entity_type":"source","title":"World's Top 10 Companies in Dicing Equipment Market 2025","publisher":"Spherical Insights","source_type":"Market research","source_url":"https://www.sphericalinsights.com/blogs/world-s-top-10-companies-in-dicing-equipment-market-2025-industry-intelligence-report-by-spherical-insights-2026-2035","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":"2026-07","evidence_date":"2026-07","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Tokyo Seimitsu, ASMPT, Han's Laser, Synova, Advanced Dicing Technologies, 3D-Micromac, Dynatex, Loadpoint","notes":"CONFLICT: misattributes HGTECH profile to Synova; list use only","used_by":2,"verification_status":"unverified_source"},{"id":"SRC-000111","legacy_id":"S0111","entity_type":"source","title":"Low-K Laser Grooving Machine market","publisher":"Data Insights Reports","source_type":"Market research","source_url":"https://www.datainsightsreports.com/reports/low-k-laser-ritzmaschine-514443","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"Wuhan DR Laser Technology ... Delphi Laser ... Chengdu LasTop Tech ... KMEPS","notes":"Discovery list only","used_by":4,"verification_status":"unverified_source"},{"id":"SRC-000112","legacy_id":"S0112","entity_type":"source","title":"Laser Grooving Equipment for Semiconductor Market","publisher":"24MarketReports","source_type":"Market research","source_url":"https://www.24marketreports.com/semiconductor-and-electronics/global-laser-grooving-equipment-for-semiconductor-forecast-2023-2035-504","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"DISCO, Suzhou Maxwell Technologies, HSET, EO Technics, Delphi Laser, Shenzhen Teyan Semiconductor Equipment, Synova and ASMPT","notes":"Discovery list; 'ASML' in list is an error","used_by":2,"verification_status":"unverified_source"},{"id":"SRC-000113","legacy_id":"S0113","entity_type":"source","title":"Lumi Laser (market list)","publisher":"CB Insights page","source_type":"Industry directory","source_url":"https://www.cbinsights.com/company/lumi-laser/","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"DISCO, Han's Laser, Dolphin Laser, HGTECH, CHN.GIE, CASIC, Lumi Laser, Maxwell, Suzhou Quick Laser Technology","notes":"Discovery list only","used_by":5,"verification_status":"unverified_source"},{"id":"SRC-000114","legacy_id":"S0114","entity_type":"source","title":"Automatic Wafer Laser Grooving Equipment Market","publisher":"Data Insights Market","source_type":"Market research","source_url":"https://www.datainsightsmarket.com/reports/automatic-wafer-laser-grooving-equipment-624462","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":"2025-11","evidence_date":"2025-11","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"DISCO Corporation, EO Technics, Intech Technologies, HiPA Photonics","notes":"Discovery list only","used_by":3,"verification_status":"unverified_source"},{"id":"SRC-000115","legacy_id":"S0115","entity_type":"source","title":"Philoptics supplies laser equipment to chipmaker for glass substrate","publisher":"The Elec","source_type":"Industry publication","source_url":"https://www.thelec.net/news/articleView.html?idxno=4811","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2024-05","evidence_date":"2024-05","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"VERY_STALE","freshness":"Stale","excerpt":"it has supplied a piece of laser equipment to a chipmaker's trial line for use in the production of a glass substrate","notes":"Two-thirds of revenue from battery equipment","used_by":2,"verification_status":"captured"},{"id":"SRC-000116","legacy_id":"S0116","entity_type":"source","title":"Philoptics Unveils 'TGV Technology'","publisher":"The Asia Business Daily","source_type":"Industry publication","source_url":"https://www.asiae.co.kr/en/article/2024090319261754360","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2024-09-03","evidence_date":"2024-09-03","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"VERY_STALE","freshness":"Stale","excerpt":"Philoptics can process holes around 10um","notes":"TGV, DI exposure, ABF drilling, singulation","used_by":2,"verification_status":"captured"},{"id":"SRC-000117","legacy_id":"S0117","entity_type":"source","title":"Philoptics Wins Order for TGV Equipment for 2mm Glass Substrates","publisher":"The Elec","source_type":"Industry publication","source_url":"https://www.thelec.net/news/articleView.html?idxno=14249","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-09-29","evidence_date":"2026-09-29","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"designed for production-size glass panels of up to 510 mm by 515 mm","notes":"New global customer (unnamed); 0 ppm","used_by":3,"verification_status":"captured"},{"id":"SRC-000118","legacy_id":"S0118","entity_type":"source","title":"Philoptics develop TGV hole inspection kit","publisher":"The Elec","source_type":"Industry publication","source_url":"https://www.thelec.net/news/articleView.html?idxno=5254","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-05","evidence_date":"2025-05","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"With the launch of the inspection kit, Philoptics now has five equipment aimed at semiconductor glass substrates.","notes":null,"used_by":2,"verification_status":"captured"},{"id":"SRC-000119","legacy_id":"S0119","entity_type":"source","title":"Philoptics Shows Zero-Defect Glass Drilling on 2mm Substrates","publisher":"Seoul Economic Daily","source_type":"Industry publication","source_url":"https://en.sedaily.com/finance/2026/09/10/philoptics-shows-zero-defect-glass-drilling-on-2mm","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-09-10","evidence_date":"2026-09-10","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Philoptics (161580.KQ) is accelerating work on through-glass via (TGV) laser drilling technology","notes":"KPCA Show 2026","used_by":2,"verification_status":"captured"},{"id":"SRC-000120","legacy_id":"S0120","entity_type":"source","title":"Mapping LPKF's Positioning in the Glass Substrate Supply Chain","publisher":"VLM Kapital","source_type":"Blog/aggregator","source_url":"https://vlmkapital.com/company/lpkf/mapping","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":"2026-04","evidence_date":"2026-04","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Absolics is very well known by Korean reporting to have an exclusive contract with F&S Electron for the TGV process, and Philoptics is an exclusive supplier to them.","notes":"Unverified customer mapping (Intel, Chemtronics, Samsung)","used_by":3,"verification_status":"unverified_source"},{"id":"SRC-000121","legacy_id":"S0121","entity_type":"source","title":"Axcelis Stockholders Approve Merger with Veeco (8-K Ex.99.1)","publisher":"Axcelis Technologies (SEC)","source_type":"Regulatory filing","source_url":"https://www.sec.gov/Archives/edgar/data/1113232/000110465926011577/tm265450d1_ex99-1.htm","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-02-06","evidence_date":"2026-02-06","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"Axcelis and Veeco continue to expect that the Merger will be completed in the second half of 2026.","notes":"Pending SAMR (China) approval","used_by":3,"verification_status":"captured"},{"id":"SRC-000122","legacy_id":"S0122","entity_type":"source","title":"Axcelis 10-Q for quarter ended 30 Jun 2026 (Note 19 Merger)","publisher":"Axcelis Technologies (SEC)","source_type":"Regulatory filing","source_url":"https://www.sec.gov/Archives/edgar/data/0001113232/000110465926091999/acls-20260630x10q.htm","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-08","evidence_date":"2026-08","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"will be converted into the right to receive 0.3575 newly issued shares of Company common stock","notes":"Agreement dated 30 Sep 2025; outside date extendable to 30 Jun 2027","used_by":3,"verification_status":"captured"},{"id":"SRC-000123","legacy_id":"S0123","entity_type":"source","title":"Veeco (Wikipedia)","publisher":"Wikipedia","source_type":"Wiki","source_url":"https://en.wikipedia.org/wiki/Veeco","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"merge in an all-stock transaction valued at approximately $4.4 billion","notes":"Epiluvac acquisition Feb 2023","used_by":4,"verification_status":"unverified_source"},{"id":"SRC-000124","legacy_id":"S0124","entity_type":"source","title":"Applied Materials Q2 FY2026 results (8-K Ex.99.1)","publisher":"Applied Materials (SEC)","source_type":"Regulatory filing","source_url":"https://www.sec.gov/Archives/edgar/data/0000006951/000162828026035071/exhibit991q22026earningsre.htm","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-05","evidence_date":"2026-05","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Entered into an agreement with ASMPT Limited to acquire its NEXX business","notes":"Precision Selective Nitride PECVD; Trillium ALD","used_by":5,"verification_status":"captured"},{"id":"SRC-000125","legacy_id":"S0125","entity_type":"source","title":"Applied Materials To Acquire NEXX For $120 Million","publisher":"Semiecosystem (Mark LaPedus)","source_type":"Industry publication","source_url":"https://marklapedus.substack.com/p/applied-materials-to-acquire-nexx","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-05-04","evidence_date":"2026-05-04","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Applied Materials has entered into a definitive agreement to acquire the NEXX business unit from ASMPT Ltd. for $120 million in cash.","notes":"Per ASMPT filing","used_by":2,"verification_status":"captured"},{"id":"SRC-000126","legacy_id":"S0126","entity_type":"source","title":"Naura to acquire stake in Kingsemi for CNY1.69 billion","publisher":"DIGITIMES Asia","source_type":"Industry publication","source_url":"https://www.digitimes.com/news/a20250311PD240/naura-technology-ic-manufacturing-equipment-acquisition.html","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-03-11","evidence_date":"2025-03-11","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"Naura Technology recently announced plans to acquire a stake in its local counterpart, Kingsemi, for a total of nearly CNY1.69 billion","notes":null,"used_by":3,"verification_status":"captured"},{"id":"SRC-000127","legacy_id":"S0127","entity_type":"source","title":"Naura Tech Acquires Stake in Kingsemi amid Local Industry Integration","publisher":"TrendForce","source_type":"Industry publication","source_url":"https://www.trendforce.com/news/2025/03/13/news-chinas-chip-equipment-giant-naura-tech-acquires-stake-in-kingsemi-amid-local-industry-integration/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-03-13","evidence_date":"2025-03-13","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"acquire a 9.5% stake in local photolithography coating equipment maker Kingsemi for RMB 1.69 billion","notes":"Target 17.9% and control","used_by":4,"verification_status":"captured"},{"id":"SRC-000128","legacy_id":"S0128","entity_type":"source","title":"Teradyne to acquire photonic integrated circuit test firm Quantifi","publisher":"Semiconductor Today","source_type":"Industry publication","source_url":"https://www.semiconductor-today.com/news_items/2025/mar/teradyne-quantifi-120325.shtml","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-03-12","evidence_date":"2025-03-12","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"Teradyne Inc ... has entered into a definitive agreement to acquire privately held Quantifi Photonics Ltd of Auckland, New Zealand","notes":null,"used_by":3,"verification_status":"captured"},{"id":"SRC-000129","legacy_id":"S0129","entity_type":"source","title":"Teradyne 10-K summary","publisher":"StockTitan (summary of SEC 10-K)","source_type":"Blog/aggregator","source_url":"https://www.stocktitan.net/sec-filings/TER/10-k-teradyne-inc-files-annual-report-0f7699f4f250.html","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":"2026-02","evidence_date":"2026-02","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"acquisitions of Quantifi Photonics for $127.2 million and Infineon's AET unit for 17.6 million euros","notes":"JV $157M for 75%","used_by":5,"verification_status":"captured"},{"id":"SRC-000130","legacy_id":"S0130","entity_type":"source","title":"Onto Innovation Completes Acquisition of Materials Analysis Product Lines from Semilab International","publisher":"PrivSource","source_type":"Industry directory","source_url":"https://www.privsource.com/acquisitions/deal/onto-innovation-completes-acquisition-of-materials-analysis-product-lines-from-semilab-international-8WSlBj","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":"2026-02-19","evidence_date":"2026-02-19","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"completed November 17, 2025","notes":null,"used_by":3,"verification_status":"captured"},{"id":"SRC-000131","legacy_id":"S0131","entity_type":"source","title":"Onto Innovation 8-K: closes Semilab USA acquisition","publisher":"StockTitan (summary of SEC 8-K)","source_type":"Blog/aggregator","source_url":"https://www.stocktitan.net/sec-filings/ONTO/8-k-onto-innovation-inc-reports-material-event-8cdcd0ee7be2.html","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":"2025-11-17","evidence_date":"2025-11-17","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"paying $432,310,000 in cash plus 641,771 shares of common stock","notes":null,"used_by":3,"verification_status":"captured"},{"id":"SRC-000132","legacy_id":"S0132","entity_type":"source","title":"Nova Completes Acquisition of Sentronics","publisher":"Nova Ltd","source_type":"Press release (company)","source_url":"https://www.novami.com/investors/press-releases/nova-completes-acquisition-of-sentronics/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025-02-03","evidence_date":"2025-02-03","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"The transaction is valued at approximately $60 million, paid in cash.","notes":null,"used_by":3,"verification_status":"captured"},{"id":"SRC-000133","legacy_id":"S0133","entity_type":"source","title":"SK hynix Introduces Industry's First Commercial High NA EUV","publisher":"SK hynix","source_type":"Press release (company)","source_url":"https://news.skhynix.com/sk-hynix-introduces-industrys-first-commercial-high-na-euv/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025-09-03","evidence_date":"2025-09-03","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"assembled the industry's first High NA EUV lithography system for mass production at the M16 fabrication plant in Icheon","notes":"TWINSCAN EXE:5200B; NA 0.55","used_by":3,"verification_status":"captured"},{"id":"SRC-000134","legacy_id":"S0134","entity_type":"source","title":"Tokyo Electron Consolidated Financial Results for the Year Ended March 31, 2026","publisher":"Tokyo Electron (TSE filing)","source_type":"Annual report","source_url":"https://www.tel.com/ir/irta3a00000006g5-att/fy26q4tanshin-e.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-04-30","evidence_date":"2026-04-30","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Net sales 2,443,533 million yen","notes":"Op. income 624,936; NI 574,454 (JPY m)","used_by":4,"verification_status":"captured"},{"id":"SRC-000135","legacy_id":"S0135","entity_type":"source","title":"Tokyo Electron Q4 FY2026 earnings call transcript","publisher":"Yahoo Finance","source_type":"Investor presentation/results","source_url":"https://finance.yahoo.com/quote/TOELF/earnings/TOELF-Q4-2026-earnings_call-552866.html","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-05","evidence_date":"2026-05","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"On the full year basis in the fiscal year ended March 2026, proportion of sales in China was 34.1%.","notes":"DRAM 31%, NV memory 10%, non-memory 59%","used_by":2,"verification_status":"captured"},{"id":"SRC-000136","legacy_id":"S0136","entity_type":"source","title":"Lam Research 10-K fiscal year ended June 28, 2026","publisher":"Lam Research (SEC)","source_type":"Regulatory filing","source_url":"https://www.sec.gov/Archives/edgar/data/0000707549/000070754926000037/lrcx-20260628.htm","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-08","evidence_date":"2026-08","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Fiscal year 2026 revenue increased 26.0% compared to fiscal year 2025","notes":null,"used_by":5,"verification_status":"captured"},{"id":"SRC-000137","legacy_id":"S0137","entity_type":"source","title":"Lam Research Annual Report to Stockholders FY2026","publisher":"Lam Research (SEC)","source_type":"Annual report","source_url":"https://www.sec.gov/Archives/edgar/data/0000707549/000114036126037568/ef20082688_ars.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-09","evidence_date":"2026-09","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Revenue in fiscal year 2026 grew 26% year over year to a record $23.2 billion","notes":"Installed base >100,000 chambers","used_by":2,"verification_status":"captured"},{"id":"SRC-000138","legacy_id":"S0138","entity_type":"source","title":"Applied Materials Q4 and FY2025 Results (8-K Ex.99.1)","publisher":"Applied Materials (SEC)","source_type":"Regulatory filing","source_url":"https://www.sec.gov/Archives/edgar/data/6951/000162828025051998/exhibit991q42025earningsre.htm","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025-11-13","evidence_date":"2025-11-13","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"Record annual revenue $28.37 billion, up 4 percent year over year","notes":"FY ended 26 Oct 2025","used_by":2,"verification_status":"captured"},{"id":"SRC-000139","legacy_id":"S0139","entity_type":"source","title":"Applied Materials Annual Report FY2025","publisher":"Applied Materials (SEC)","source_type":"Annual report","source_url":"https://www.sec.gov/Archives/edgar/data/6951/000119312526027318/d54380dars.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-01","evidence_date":"2026-01","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"Semiconductor Systems $ 20,798 ... Applied Global Services 6,385","notes":"Op. income 8,289; NI 6,998 (USD m)","used_by":6,"verification_status":"captured"},{"id":"SRC-000140","legacy_id":"S0140","entity_type":"source","title":"KLA Corporation Reports Fiscal 2026 Fourth Quarter and Full Year Results","publisher":"KLA Corporation","source_type":"Investor presentation/results","source_url":"https://ir.kla.com/news-events/press-releases/detail/518/kla-corporation-reports-fiscal-2026-fourth-quarter-and-full","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-07-28","evidence_date":"2026-07-28","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Total revenues ... 13,579,476 (twelve months ended June 30, 2026, USD thousands)","notes":"Semiconductor Process Control 12,244,733","used_by":3,"verification_status":"captured"},{"id":"SRC-000141","legacy_id":"S0141","entity_type":"source","title":"KLA 2026 Annual Report","publisher":"KLA Corporation","source_type":"Annual report","source_url":"https://d1io3yog0oux5.cloudfront.net/_42d21a5ab5ca507394aee7b9106cc480/klatencor/db/1117/10668/annual_report/KLAC_2026_Annual_Report_(bookmarked).pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-09","evidence_date":"2026-09","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Our revenue from sales of products and provision of services to customers in China was 30%, 33% and 43% for fiscal years 2026, 2025 and 2024","notes":"International 87% of revenue","used_by":4,"verification_status":"captured"},{"id":"SRC-000142","legacy_id":"S0142","entity_type":"source","title":"ASML reports EUR 32.7 billion total net sales and EUR 9.6 billion net income in 2025","publisher":"ASML (SEC 6-K)","source_type":"Regulatory filing","source_url":"https://www.sec.gov/Archives/edgar/data/937966/000162828026003701/pressreleasefinancialresul.htm","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-01-28","evidence_date":"2026-01-28","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"2025 total net sales of EUR 32.7 billion, gross margin of 52.8%, net income of EUR 9.6 billion","notes":"Backlog EUR 38.8B","used_by":3,"verification_status":"captured"},{"id":"SRC-000143","legacy_id":"S0143","entity_type":"source","title":"ASML Q1 2026 results","publisher":"ASML (SEC 6-K)","source_type":"Regulatory filing","source_url":"https://www.sec.gov/Archives/edgar/data/0000937966/000162828026025147/pressreleasefinancialresul.htm","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-04-15","evidence_date":"2026-04-15","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"ASML now expects 2026 total net sales to be between EUR 36 billion and EUR 40 billion","notes":null,"used_by":2,"verification_status":"captured"},{"id":"SRC-000144","legacy_id":"S0144","entity_type":"source","title":"Advantest FY2025 Consolidated Financial Results (year ended March 31, 2026)","publisher":"Advantest","source_type":"Annual report","source_url":"https://www.advantest.com/en/news/2026/a81o6o0000000hgw-att/E_FR_FY2025_FN.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-04-27","evidence_date":"2026-04-27","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"net sales were (Y) 1,128.6 billion (44.7% increase","notes":"Op. income 499.1; NI 375.4 (JPY bn)","used_by":4,"verification_status":"captured"},{"id":"SRC-000145","legacy_id":"S0145","entity_type":"source","title":"DISCO Financial Summary FY ending March 2026","publisher":"JapanIR (summary of TSE filing)","source_type":"Blog/aggregator","source_url":"https://japanir.jp/en/company/company-6146/ir/6146-20260422-01_wp_financial_summary/","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":"2026-04-22","evidence_date":"2026-04-22","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Net Sales: 436.8 billion yen (11.1% Year-over-Year increase)","notes":"Op. income 184.9; NI 135.5 (JPY bn)","used_by":4,"verification_status":"captured"},{"id":"SRC-000146","legacy_id":"S0146","entity_type":"source","title":"SCREEN Holdings FY2026/03 slides","publisher":"Investing.com","source_type":"Investor presentation/results","source_url":"https://www.investing.com/news/company-news/screen-holdings-fy202603-slides-q4-recovery-signals-strong-growth-93CH-4744035","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-05-13","evidence_date":"2026-05-13","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"net sales declining 3.1% year-over-year to JPY605.7 billion and operating income falling 9.7% to JPY122.5 billion","notes":null,"used_by":3,"verification_status":"captured"},{"id":"SRC-000147","legacy_id":"S0147","entity_type":"source","title":"SCREEN Holdings (7735) segment breakdown","publisher":"note.com","source_type":"Blog/aggregator","source_url":"https://note.com/yama_shukatsu/n/n6a2fcad7ce68?hl=en","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":"2026-05","evidence_date":"2026-05","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"SPE (Semiconductor Production Equipment): Sales 485.982 billion yen","notes":"Segment detail; corroboration pending","used_by":2,"verification_status":"unverified_source"},{"id":"SRC-000148","legacy_id":"S0148","entity_type":"source","title":"BE Semiconductor Industries N.V. Announces Q4-25 and Full Year 2025 Results","publisher":"BESI","source_type":"Press release (company)","source_url":"https://www.besi.com/investor-relations/press-releases/details/be-semiconductor-industries-nv-announces-q4-25-and-full-year-2025-results/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-02-19","evidence_date":"2026-02-19","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"FY-25 Revenue of EUR 591.3 Million and Net Income of EUR 131.6 Million","notes":"Orders EUR 685.0M","used_by":4,"verification_status":"captured"},{"id":"SRC-000149","legacy_id":"S0149","entity_type":"source","title":"ASMPT Limited Announcement of 2025 Audited Results","publisher":"ASMPT (HKEX announcement)","source_type":"Annual report","source_url":"https://doc.irasia.com/listco/hk/asmpt/annual/2025/res.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-03","evidence_date":"2026-03","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"full-year revenue of HK$13.74 billion (US$1.76 billion), an increase of 10.0%","notes":"Continuing operations; group incl. discontinued HK$14.52B","used_by":3,"verification_status":"captured"},{"id":"SRC-000150","legacy_id":"S0150","entity_type":"source","title":"Kulicke & Soffa Reports Fourth Quarter 2025 Results","publisher":"Kulicke & Soffa","source_type":"Press release (company)","source_url":"https://investor.kns.com/2025-11-19-Kulicke-Soffa-Reports-Fourth-Quarter-2025-Results?asPDF=1","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025-11-19","evidence_date":"2025-11-19","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"Net revenue of $654.1 million.","notes":"FY ended 4 Oct 2025","used_by":3,"verification_status":"captured"},{"id":"SRC-000151","legacy_id":"S0151","entity_type":"source","title":"Teradyne 2025 Annual Report to Shareholders","publisher":"Teradyne (SEC)","source_type":"Annual report","source_url":"https://www.sec.gov/Archives/edgar/data/97210/000119312526127510/2025_ter-ars.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-03","evidence_date":"2026-03","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"In 2025, we achieved total revenue of $3.2 billion, a 13% increase year-over-year.","notes":null,"used_by":2,"verification_status":"captured"},{"id":"SRC-000152","legacy_id":"S0152","entity_type":"source","title":"Teradyne Reports Fourth Quarter and Full Year 2025 Results","publisher":"TradingView News","source_type":"Blog/aggregator","source_url":"https://www.tradingview.com/news/tradingview:81ca497a94506:0-teradyne-reports-fourth-quarter-and-full-year-2025-results/","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":"2026-02","evidence_date":"2026-02","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"For the full year 2025, revenue reached $3.19 billion, up 13% from 2024","notes":null,"used_by":1,"verification_status":"captured"},{"id":"SRC-000153","legacy_id":"S0153","entity_type":"source","title":"ASM reports Q4 and full-year 2025 results","publisher":"ASM International","source_type":"Press release (company)","source_url":"https://www.asm.com/media/yvxbavwe/20260303-asm-reports-q4-and-full-year-2025-results.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-03-03","evidence_date":"2026-03-03","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"Revenue ... 2,932.7 (2024) 3,173.2 (2025) EUR million","notes":null,"used_by":2,"verification_status":"captured"},{"id":"SRC-000154","legacy_id":"S0154","entity_type":"source","title":"Onto Innovation Reports 2025 Fourth Quarter and Full Year Results","publisher":"Onto Innovation (SEC)","source_type":"Regulatory filing","source_url":"https://www.sec.gov/Archives/edgar/data/704532/000119312526059380/onto-ex99_1.htm","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-02-19","evidence_date":"2026-02-19","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"Record quarterly revenue of $267 million in the fourth quarter and full year revenue of $1.005 billion.","notes":"HBM VPA >$240M (Dragonfly)","used_by":4,"verification_status":"captured"},{"id":"SRC-000155","legacy_id":"S0155","entity_type":"source","title":"Onto Innovation Reports 2025 Results (summary)","publisher":"TradingView News","source_type":"Blog/aggregator","source_url":"https://www.tradingview.com/news/tradingview:0c8567170769b:0-onto-innovation-reports-2025-fourth-quarter-and-full-year-results/","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":"2026-02","evidence_date":"2026-02","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"Full year 2025 net income: $136.8 million","notes":null,"used_by":2,"verification_status":"captured"},{"id":"SRC-000156","legacy_id":"S0156","entity_type":"source","title":"Nova Reports Fourth Quarter and Record Full Year 2025 Results","publisher":"Nova Ltd","source_type":"Press release (company)","source_url":"https://www.novami.com/investors/press-releases/nova-reports-fourth-quarter-and-record-full-year-2025-results/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-02","evidence_date":"2026-02","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"Record annual revenue of $880.6 million up 31% YoY","notes":"GAAP NI $259.2M","used_by":3,"verification_status":"captured"},{"id":"SRC-000157","legacy_id":"S0157","entity_type":"source","title":"Camtek Announces Record Results for the Fourth Quarter & Full Year 2025","publisher":"Camtek","source_type":"Press release (company)","source_url":"https://www.camtek.com/news-and-events/camtek-announces-record-results-for-the-fourth-quarter-full-year-2025/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-02-18","evidence_date":"2026-02-18","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"Record revenues of $496.1 million, a 16% YoY increase","notes":null,"used_by":2,"verification_status":"captured"},{"id":"SRC-000158","legacy_id":"S0158","entity_type":"source","title":"EO Technics (KOSDAQ:039030) Financials","publisher":"StockAnalysis (DART-derived)","source_type":"Blog/aggregator","source_url":"https://stockanalysis.com/quote/kosdaq/039030/financials/","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":"2026-08","evidence_date":"2026-08","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Revenue 380,891 (FY 2025, KRW million)","notes":"Op. income 80,753; NI 57,213","used_by":4,"verification_status":"captured"},{"id":"SRC-000159","legacy_id":"S0159","entity_type":"source","title":"Coherent Corp. Reports Fourth Quarter and Full Year Fiscal 2025 Results","publisher":"Coherent Corp. (SEC)","source_type":"Regulatory filing","source_url":"https://www.sec.gov/Archives/edgar/data/820318/000119312525179833/d22249dex991.htm","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025-08-13","evidence_date":"2025-08-13","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"FY25 REVENUE OF $5.81B, INCREASED 23% Y/Y","notes":null,"used_by":3,"verification_status":"captured"},{"id":"SRC-000160","legacy_id":"S0160","entity_type":"source","title":"Coherent Corp. Reports Fourth Quarter and Full Year Fiscal 2026 Results","publisher":"Coherent Corp. (SEC)","source_type":"Regulatory filing","source_url":"https://www.sec.gov/Archives/edgar/data/0000820318/000119312526346860/d128030dex991.htm","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-08-12","evidence_date":"2026-08-12","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Q4 REVENUE OF $2.05B, INCREASED 34% Y/Y","notes":"Q1-Q3 FY26: $1.58B/$1.69B/$1.81B (S0161-S0163)","used_by":4,"verification_status":"captured"},{"id":"SRC-000161","legacy_id":"S0161","entity_type":"source","title":"Coherent Q1 FY2026 results","publisher":"Coherent Corp. (SEC)","source_type":"Regulatory filing","source_url":"https://www.sec.gov/Archives/edgar/data/820318/000119312525266951/d27982dex991.htm","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025-11-05","evidence_date":"2025-11-05","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"Q1 REVENUE OF $1.58B","notes":null,"used_by":4,"verification_status":"captured"},{"id":"SRC-000162","legacy_id":"S0162","entity_type":"source","title":"Coherent Q2 FY2026 results","publisher":"Coherent Corp. (SEC)","source_type":"Regulatory filing","source_url":"https://www.sec.gov/Archives/edgar/data/820318/000119312526037556/d101115dex991.htm","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-02-04","evidence_date":"2026-02-04","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"Q2 REVENUE OF $1.69B","notes":null,"used_by":4,"verification_status":"captured"},{"id":"SRC-000163","legacy_id":"S0163","entity_type":"source","title":"Coherent Q3 FY2026 results","publisher":"Coherent Corp. (SEC)","source_type":"Regulatory filing","source_url":"https://www.sec.gov/Archives/edgar/data/0000820318/000119312526208972/d57080dex991.htm","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-05-06","evidence_date":"2026-05-06","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Q3 REVENUE OF $1.81B","notes":null,"used_by":4,"verification_status":"captured"},{"id":"SRC-000164","legacy_id":"S0164","entity_type":"source","title":"IPG Photonics (Wikipedia)","publisher":"Wikipedia","source_type":"Wiki","source_url":"https://en.wikipedia.org/wiki/IPG_Photonics","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"Revenue: US$1.00 billion (2025)","notes":"Cites 2025 10-K; 4,840 employees","used_by":4,"verification_status":"unverified_source"},{"id":"SRC-000165","legacy_id":"S0165","entity_type":"source","title":"Hamamatsu Photonics Consolidated Financial Results FY ended Sep 30, 2025","publisher":"Hamamatsu Photonics","source_type":"Annual report","source_url":"https://www.hamamatsu.com/content/dam/hamamatsu-photonics/sites/documents/01_HQ/ir/financial-information/quarterly-financial-reports/h_ir_fr2025-year.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025-11","evidence_date":"2025-11","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"we closed the fiscal year 2025 with net sales of JPY 212,051 million","notes":null,"used_by":2,"verification_status":"captured"},{"id":"SRC-000166","legacy_id":"S0166","entity_type":"source","title":"Hamamatsu FY2025 Financial Presentation","publisher":"Hamamatsu Photonics","source_type":"Investor presentation/results","source_url":"https://www.hamamatsu.com/content/dam/hamamatsu-photonics/sites/documents/01_HQ/ir/financial-information/results-briefing/h_ir_251107_se_en.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025-11-07","evidence_date":"2025-11-07","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"NKT Photonics Target market : Security","notes":"NKT Photonics within Hamamatsu group","used_by":5,"verification_status":"captured"},{"id":"SRC-000167","legacy_id":"S0167","entity_type":"source","title":"Semiconductor Equipment: Unveiling New Opportunities (Nearfield Series D)","publisher":"36Kr","source_type":"Blog/aggregator","source_url":"https://eu.36kr.com/en/p/3872193293800707","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":"2026-06","evidence_date":"2026-06","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Nearfield Instruments ... Series D financing of up to $380 million, and its post-investment valuation soared to $1.6 billion.","notes":"Investors: Fidelity, Temasek, QIA, Walden Catalyst","used_by":3,"verification_status":"captured"},{"id":"SRC-000168","legacy_id":"S0168","entity_type":"source","title":"Nearfield Instruments (Wikipedia)","publisher":"Wikipedia","source_type":"Wiki","source_url":"https://en.wikipedia.org/wiki/Nearfield_Instruments","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"It was founded in January 2016 as a subsidiary of Netherlands Organisation for Applied Scientific Research.","notes":"AUDIRA; Series C $147.6M (2024)","used_by":2,"verification_status":"unverified_source"},{"id":"SRC-000169","legacy_id":"S0169","entity_type":"source","title":"US startup Substrate raises $100m for development of lithography tools","publisher":"DatacenterDynamics","source_type":"Industry publication","source_url":"https://www.datacenterdynamics.com/en/news/us-startup-substrate-raises-100m-for-development-of-lithography-tools-to-challenge-asml/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-10-29","evidence_date":"2025-10-29","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"The company also announced it raised $100 million in a funding round, which valued it at $1 billion.","notes":"Founders Fund, General Catalyst, Allen & Co., Long Journey, Valor, In-Q-Tel","used_by":4,"verification_status":"captured"},{"id":"SRC-000170","legacy_id":"S0170","entity_type":"source","title":"Silicon Valley startup bets on x-ray lithography","publisher":"TechSpot","source_type":"Industry publication","source_url":"https://www.techspot.com/news/110055-silicon-valley-start-up-bets-x-ray-lithography.html","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-10","evidence_date":"2025-10","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"Founded in 2022 by brothers James and Oliver Proud","notes":"Production target 2028","used_by":2,"verification_status":"captured"},{"id":"SRC-000171","legacy_id":"S0171","entity_type":"source","title":"xLight Signs Letter Of Intent To Obtain CHIPS Funding","publisher":"Semiecosystem (Mark LaPedus)","source_type":"Industry publication","source_url":"https://marklapedus.substack.com/p/xlight-signs-letter-of-intent-to","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-12","evidence_date":"2025-12","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"xLight recently raised $40 million in venture capital funding. The round was led by Playground Global","notes":"USD 150M CHIPS LOI (equity)","used_by":3,"verification_status":"captured"},{"id":"SRC-000172","legacy_id":"S0172","entity_type":"source","title":"xLight's $350m bet to break ASML's chip monopoly","publisher":"The Next Web","source_type":"Industry publication","source_url":"https://thenextweb.com/news/xlight-euv-350m-asml-euclyd","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-06-24","evidence_date":"2026-06-24","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"in talks to raise $350m ... Boardman Bay Capital Management and Bain Capital are lining up to lead the round","notes":"Also Invisix (ASML spinout) EUR 20M","used_by":5,"verification_status":"captured"},{"id":"SRC-000173","legacy_id":"S0173","entity_type":"source","title":"Korean Chip, Display Equipment Makers Post Surge in Operating Profit","publisher":"The Elec","source_type":"Industry publication","source_url":"https://www.thelec.net/news/articleView.html?idxno=6280","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-04","evidence_date":"2026-04","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"nine companies recorded annual revenue exceeding 500 billion won last year: SEMES (2.4575 trillion won), SFA Engineering (1.6309 trillion won), Wonik IPS (909.7 billion won), Top Engineering (798.4 billion won)","notes":"Op. margins: HPSP 51.76%, Hanmi 45.68%, Park Systems 22%, PSK 21.8%, DIT 20.58%","used_by":19,"verification_status":"captured"},{"id":"SRC-000174","legacy_id":"S0174","entity_type":"source","title":"Wonik IPS Co., Ltd. (240810.KQ)","publisher":"Yahoo Finance","source_type":"Industry directory","source_url":"https://finance.yahoo.com/quote/240810.KQ/","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":"2026-05","evidence_date":"2026-05","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"WIDAS ... NOA ALD and CVD systems; GEMINI HQ ... HyEta Spatial ALD systems ... Quanta systems for 3D NAND","notes":null,"used_by":2,"verification_status":"captured"},{"id":"SRC-000175","legacy_id":"S0175","entity_type":"source","title":"Semiconductor Equipment Stocks Surge: Jusung Up 24%, Wonik IPS 20%","publisher":"Seoul Economic Daily","source_type":"Industry publication","source_url":"https://en.sedaily.com/markets/2026/06/11/semiconductor-equipment-stocks-surge-jusung-up-24-percent","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-06-11","evidence_date":"2026-06-11","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"The company is known to have recently supplied its next-generation atomic layer growth (ALG) equipment to a global semiconductor manufacturer.","notes":"Jusung","used_by":3,"verification_status":"captured"},{"id":"SRC-000176","legacy_id":"S0176","entity_type":"source","title":"Top Semiconductors & Semiconductor Equipment stocks in Korea","publisher":"Stockopedia","source_type":"Industry directory","source_url":"https://www.stockopedia.com/directory/shares/korea-republic-of-kr/sector/semiconductors-semiconductor-equipment-571010/","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":"2026","evidence_date":"2026","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"036930 Jusung Engineering; 240810 Wonik IPS; 319660 PSK; 403870 HPSP; 084370 Eugene Technology","notes":"Tickers","used_by":4,"verification_status":"captured"},{"id":"SRC-000177","legacy_id":"S0177","entity_type":"source","title":"EDITORIAL: Local tech firms have rare window","publisher":"Taipei Times","source_type":"Industry publication","source_url":"https://www.taipeitimes.com/News/editorials/archives/2026/04/08/2003855206","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-04-08","evidence_date":"2026-04-08","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"The two firms count ASE Technology Holding Co ... and TSMC among their major customers. All Ring supplies precision dispensing systems and wafer-level underfill dispensing machines used in CoWoS.","notes":"GPTC, Scientech, All Ring, Gallant Micro Machining","used_by":8,"verification_status":"captured"},{"id":"SRC-000178","legacy_id":"S0178","entity_type":"source","title":"TSMC investment to benefit gear vendors: report","publisher":"Taipei Times (citing Yuanta)","source_type":"Industry publication","source_url":"https://www.taipeitimes.com/News/biz/archives/2025/03/06/2003832936","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-03-06","evidence_date":"2025-03-06","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"United Integrated Services Co and Marketech International Corp ... derived 50 to 60 percent and 20 to 30 percent respectively of their revenue from TSMC's US fabs","notes":"Foxsemicon, Feedback Technology (OEM)","used_by":6,"verification_status":"captured"},{"id":"SRC-000179","legacy_id":"S0179","entity_type":"source","title":"TSMC Reportedly Runs Dual-Track Evaluation on CoPoS Pilot Line","publisher":"TrendForce (citing Commercial Times)","source_type":"Industry publication","source_url":"https://www.trendforce.com/news/2026/06/16/news-tsmc-reportedly-runs-dual-track-evaluation-on-copos-pilot-line-sparking-global-vs-local-vendor-competition/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-06-16","evidence_date":"2026-06-16","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"DISCO, Lintec, Nitto, Yamada and Tazmo as key players in panel handling and automation, alongside Taiwan's Gudeng and Mirle","notes":"Scientech/GPTC vs AMAT/TEL/SCREEN; Utechzone/VisEra/GPM vs KLA/Camtek","used_by":30,"verification_status":"captured"},{"id":"SRC-000180","legacy_id":"S0180","entity_type":"source","title":"KGI Industry Report Taiwan - Semiconductor sector","publisher":"KGI Securities","source_type":"Investor presentation/results","source_url":"https://www.kgi.com.hk/en/-/media/files/kgishk/research-reports/tw-reports/2024/01/semiconductor-sector_19022025.pdf","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-02-19","evidence_date":"2025-02-19","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"Grand Process Technology (GPTC; 3131 TT ...), All Ring Tech (6187 TT ...), C Sun Manufacturing (2467 TT ...), and Scientech (3583 TT ...)","notes":"Tickers","used_by":4,"verification_status":"captured"},{"id":"SRC-000181","legacy_id":"S0181","entity_type":"source","title":"Grand Process Technology Corporation (SEMI member directory)","publisher":"SEMI","source_type":"Industry directory","source_url":"https://www.semi.org/en/resources/member-directory/grand-process-technology-corporation","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"Founded in 1993, HongSo Group ... flagship company GPTC (Grand Process Technology Corp.)","notes":"TSE listed 2011","used_by":1,"verification_status":"captured"},{"id":"SRC-000182","legacy_id":"S0182","entity_type":"source","title":"TSMC Suppliers from Taiwan Team Up to Survive in the United States","publisher":"CommonWealth Magazine","source_type":"Industry publication","source_url":"https://english.cw.com.tw/article/article.action?id=4041","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-04-02","evidence_date":"2025-04-02","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"Topco now serves as a platform for over 10 Taiwanese equipment manufacturers, including Hong Plastic Technology and All Ring Tech.","notes":"TSS Holdings incl. Gudeng Precision","used_by":3,"verification_status":"captured"},{"id":"SRC-000183","legacy_id":"S0183","entity_type":"source","title":"AMIES Rises in China's Lithography Push","publisher":"TrendForce","source_type":"Industry publication","source_url":"https://www.trendforce.com/news/2025/10/21/news-amies-rises-in-chinas-lithography-push-reportedly-capturing-90-of-domestic-market/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-10-21","evidence_date":"2025-10-21","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"AMIES ... is a spin-off of Shanghai Micro Electronics Equipment (SMEE)","notes":"Yuliangsheng 28nm DUV at SMIC (testing, per SCMP/FT)","used_by":5,"verification_status":"captured"},{"id":"SRC-000184","legacy_id":"S0184","entity_type":"source","title":"Semicon China 2025 - The Rise of SiCarrier","publisher":"TechNode","source_type":"Industry publication","source_url":"https://technode.com/2025/04/03/semicon-china-2025-the-rise-of-sicarrier/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-04-03","evidence_date":"2025-04-03","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"it showed off almost every other type of equipment in the semiconductor fabrication process","notes":null,"used_by":1,"verification_status":"captured"},{"id":"SRC-000185","legacy_id":"S0185","entity_type":"source","title":"China's new chip tool champion SiCarrier offers self-reliance hope","publisher":"South China Morning Post","source_type":"Industry publication","source_url":"https://www.scmp.com/tech/tech-war/article/3304410/chinas-new-chip-tool-champion-sicarrier-offers-self-reliance-hope-amid-us-restrictions","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-03-28","evidence_date":"2025-03-28","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"SiCarrier's products for diffusion, etching and thin film already support mass production","notes":"~30 new products at Semicon China 2025","used_by":1,"verification_status":"captured"},{"id":"SRC-000186","legacy_id":"S0186","entity_type":"source","title":"SMIC testing first homegrown immersion DUV litho tool","publisher":"Tom's Hardware (citing FT)","source_type":"Industry publication","source_url":"https://www.tomshardware.com/tech-industry/semiconductors/chinas-largest-foundry-testing-first-domestic-immersion-duv-lithography-tool-smic-takes-significant-step-on-road-to-wafer-fab-equipment-self-sufficiency","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-09","evidence_date":"2025-09","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"The system was developed by Shanghai Yuliangsheng Technology Co., which is linked to Huawei's SiCarrier","notes":null,"used_by":0,"verification_status":"captured"},{"id":"SRC-000187","legacy_id":"S0187","entity_type":"source","title":"Chinese chipmaking tool roadmaps examined","publisher":"Tom's Hardware","source_type":"Industry publication","source_url":"https://www.tomshardware.com/tech-industry/semiconductors/chinese-chipmaking-tool-roadmap-examined","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-08","evidence_date":"2026-08","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"SMEE's most advanced shipping product remains the SSA600 series, a 90nm-class dry ArF scanner","notes":"SSA/800 never deployed; SMEE KrF 110nm RMB 110M contract; Aishengna; SiCarrier RMB 65B valuation","used_by":8,"verification_status":"captured"},{"id":"SRC-000188","legacy_id":"S0188","entity_type":"source","title":"Chinese companies unveil a swathe of chipmaking innovations at tradeshow","publisher":"Tom's Hardware (citing Digitimes)","source_type":"Industry publication","source_url":"https://www.tomshardware.com/tech-industry/semiconductors/chinese-companies-unveil-a-swathe-of-breakthrough-chipmaking-innovations-at-tradeshow-chipmaking-lithography-tools-software-design-tools-and-resists-all-on-display-as-the-nation-pursues-self-sufficiency","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-10","evidence_date":"2025-10","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"Amies was formed in early 2025, but it has already shipped over 500 lithography steppers.","notes":"CONFLICT: calls Skyverse a SiCarrier materials subsidiary","used_by":4,"verification_status":"captured"},{"id":"SRC-000189","legacy_id":"S0189","entity_type":"source","title":"China Reaches 35% Semiconductor Equipment Self-Sufficiency","publisher":"TokenRing (syndicated)","source_type":"Blog/aggregator","source_url":"https://investor.wedbush.com/wedbush/article/tokenring-2026-1-21-china-reaches-35-semiconductor-equipment-self-sufficiency-amid-advanced-lithography-breakthroughs","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":"2026-01-21","evidence_date":"2026-01-21","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"SMEE has finally scaled its SSA800 series","notes":"CONFLICT with S0187 (SSA/800 never deployed) - treated as unverified","used_by":2,"verification_status":"unverified_source"},{"id":"SRC-000190","legacy_id":"S0190","entity_type":"source","title":"R&D and Manufacturing Base IIM","publisher":"Rapidus Corporation","source_type":"Official website","source_url":"https://www.rapidus.inc/en/iim/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025","evidence_date":"2025","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"Japan's first volume-production-ready EUV (Extreme Ultraviolet) lithography system (ASML NXE:3800E) was installed in December 2024.","notes":null,"used_by":3,"verification_status":"captured"},{"id":"SRC-000191","legacy_id":"S0191","entity_type":"source","title":"Rapidus gets EUV machine","publisher":"Electronics Weekly","source_type":"Industry publication","source_url":"https://www.electronicsweekly.com/news/business/rapidus-gets-euv-machine-2024-12/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2024-12","evidence_date":"2024-12","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"an NXE:3800E tool which operates at a wavelength of 13.5nm and can process 220 wafers an hour","notes":null,"used_by":1,"verification_status":"captured"},{"id":"SRC-000192","legacy_id":"S0192","entity_type":"source","title":"Canon Inc. Delivers FPA-1200NZ2C Nanoimprint Lithography System to the Texas Institute for Electronics","publisher":"Canon U.S.A. (GlobeNewswire)","source_type":"Press release (company)","source_url":"https://finance.yahoo.com/news/canon-inc-delivers-fpa-1200nz2c-133000372.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2024-10-01","evidence_date":"2024-10-01","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"Canon Inc. announced that it shipped its most advanced lithography platform, the FPA-1200NZ2C nanoimprint lithography (NIL) system","notes":null,"used_by":3,"verification_status":"captured"},{"id":"SRC-000193","legacy_id":"S0193","entity_type":"source","title":"Canon delivers 5nm-capable nano-imprint lithography machine","publisher":"eeNews Europe","source_type":"Industry publication","source_url":"https://www.eenewseurope.com/en/canon-delivers-5nm-capable-nano-imprint-lithography-machine/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2024-10","evidence_date":"2024-10","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"Canon's FPA-1200NZ2C NIL system for 300mm wafers enables patterning with a minimum linewidth of 14nm","notes":null,"used_by":3,"verification_status":"captured"},{"id":"SRC-000194","legacy_id":"S0194","entity_type":"source","title":"US6992026B2 - Laser processing method and laser processing apparatus","publisher":"Google Patents","source_type":"Patent","source_url":"https://patents.google.com/patent/US6992026B2/en","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2006-01-31","evidence_date":"2006-01-31","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"VERY_STALE","freshness":"Stale","excerpt":"form a modified region caused by multiphoton absorption within the object along a cutting line","notes":"Hamamatsu; priority 2000-09-13; expired (adjusted expiry 2021-12-27); family has litigation","used_by":2,"verification_status":"captured"},{"id":"SRC-000195","legacy_id":"S0195","entity_type":"source","title":"US6902987B1 - Method for low temperature bonding and bonded structure","publisher":"Google Patents","source_type":"Patent","source_url":"https://patents.google.com/patent/US6902987B1/en","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2005-06-07","evidence_date":"2005-06-07","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"VERY_STALE","freshness":"Stale","excerpt":"A method for bonding at low or room temperature includes steps of surface cleaning and activation by cleaning or etching.","notes":"Ziptronix -> Adeia Semiconductor Bonding Technologies; expired; family has litigation","used_by":1,"verification_status":"captured"},{"id":"SRC-000196","legacy_id":"S0196","entity_type":"source","title":"Onto Innovation Q1 2025 results (8-K Ex.99.1)","publisher":"Onto Innovation (SEC)","source_type":"Regulatory filing","source_url":"https://www.sec.gov/Archives/edgar/data/704532/000095017025066927/onto-ex99_1.htm","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025-05","evidence_date":"2025-05","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"Iris film metrology revenue increased over 25% quarter-over-quarter","notes":"3D bump metrology shipments","used_by":2,"verification_status":"captured"},{"id":"SRC-000197","legacy_id":"S0197","entity_type":"source","title":"Top Ten Semiconductor Vendors 2025 (Gartner)","publisher":"Electronics Weekly","source_type":"Industry publication","source_url":"https://www.electronicsweekly.com/blogs/mannerisms/ten-best/top-ten-semiconductor-vendors-2025-2026-03/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-03","evidence_date":"2026-03","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"NVIDIA 125,703 ... Micron Technology 41,487","notes":"Customer-side context","used_by":0,"verification_status":"captured"},{"id":"SRC-000198","legacy_id":"S0198","entity_type":"source","title":"SK Hynix Installs ASML's High-NA EUV Scanner","publisher":"All About Industries","source_type":"Industry publication","source_url":"https://www.all-about-industries.com/sk-hynix-installs-as-first-memory-manufacturer-asmls-high-na-euv-scanner-a-ea7f580853b8de5f46856e2e9b19e848/","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":"2025-09","evidence_date":"2025-09","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"Industry media estimate the unit price of a High-NA scanner to be around 600 billion won (450 million US dollars).","notes":"ESTIMATE; ~175 wph target figure","used_by":1,"verification_status":"captured"},{"id":"SRC-000199","legacy_id":"S0199","entity_type":"source","title":"Yearly average currency exchange rates","publisher":"US Internal Revenue Service","source_type":"Government source","source_url":"https://www.irs.gov/individuals/international-taxpayers/yearly-average-currency-exchange-rates","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-01","evidence_date":"2026-01","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"Euro Zone Euro 0.886 (2025); Japan Yen 149.632; South Korea Won 1421.779; China Yuan 7.129; India Rupee 87.133","notes":"FX basis for USD conversion (units per USD, 2025 and 2024 averages)","used_by":0,"verification_status":"captured"},{"id":"SRC-000200","legacy_id":"S0200","entity_type":"source","title":"About | TEAL","publisher":"Titan Engineering & Automation Ltd","source_type":"Official website","source_url":"https://www.titanteal.com/about-us","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"a wholly owned subsidiary of Titan Company Limited, A TATA Enterprise","notes":"Hosur, Tamil Nadu; automation solutions + aerospace & defence","used_by":3,"verification_status":"captured"},{"id":"SRC-000201","legacy_id":"S0201","entity_type":"source","title":"ASMPT, Kaynes Semicon and Perceptives Solutions Forge Strategic Partnership","publisher":"ASMPT","source_type":"Press release (company)","source_url":"https://semi.asmpt.com/en/news-center/press-releases/asmpt-kaynes-semicon-and-perceptives-solutions/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2024-12-12","evidence_date":"2024-12-12","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"Two MOUs focusing on semiconductor training, knowledge sharing, and workforce development","notes":"Does not state equipment supply","used_by":3,"verification_status":"captured"},{"id":"SRC-000202","legacy_id":"S0202","entity_type":"source","title":"US Chip Equipment Maker KLA Opens Rs 300 Cr Chennai R&D Centre","publisher":"BW Businessworld","source_type":"Industry publication","source_url":"https://www.businessworld.in/article/us-chip-equipment-maker-kla-opens-rs-300-cr-chennai-r-d-centre-586334","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-01","evidence_date":"2026-01","accessed_date":"2026-09-29","accessible":false,"access_mode":"not_accessible","access_note":"Access blocked or not accessible at capture; not bypassed","age_class":"AGING","freshness":"Needs Review","excerpt":"(headline) KLA Opens Rs 300 Cr Chennai R&D Centre","notes":"HTTP 403 on fetch; headline only","used_by":3,"verification_status":"not_accessible"},{"id":"SRC-000203","legacy_id":"S0203","entity_type":"source","title":"KLA Corporation opens $33 million R&D facility in India","publisher":"Evertiq","source_type":"Industry publication","source_url":"https://evertiq.com/news/2026-01-08-kla-corporation-opens-33-million-rd-facility-in-india","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-01-08","evidence_date":"2026-01-08","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"(headline) KLA Corporation opens $33 million R&D facility in India","notes":"Headline corroborates S0202","used_by":3,"verification_status":"captured"},{"id":"SRC-000204","legacy_id":"S0204","entity_type":"source","title":"KLA Expands Chennai R&D and Innovation Hub","publisher":"KLA Corporation","source_type":"Official website","source_url":"https://www.kla.com/advance/innovation/kla-expands-chennai-rd-and-innovation-hub","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-01","evidence_date":"2026-01","accessed_date":"2026-09-29","accessible":false,"access_mode":"not_accessible","access_note":"Access blocked or not accessible at capture; not bypassed","age_class":"AGING","freshness":"Needs Review","excerpt":"(title) KLA Expands Chennai R&D and Innovation Hub","notes":"Bot-protection page; title only","used_by":3,"verification_status":"not_accessible"},{"id":"SRC-000205","legacy_id":"S0205","entity_type":"source","title":"Micron ATMP Facility - India Semiconductor Manufacturing Tracker","publisher":"Pranay Kotasthane (independent tracker)","source_type":"Blog/aggregator","source_url":"https://fabs.pranaykotas.com/facilities/micron-sanand.html","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":"2026","evidence_date":"2026","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"Linde India operates a Sanand Specialty Gas Facility providing high-purity specialty gases","notes":"Volume production 26 Feb 2026; Rs 22,516 cr; no tool vendors named","used_by":3,"verification_status":"unverified_source"},{"id":"SRC-000206","legacy_id":"S0206","entity_type":"source","title":"Kaynes Semicon OSAT Facility - India Semiconductor Manufacturing Tracker","publisher":"Pranay Kotasthane (independent tracker)","source_type":"Blog/aggregator","source_url":"https://fabs.pranaykotas.com/facilities/kaynes-sanand.html","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":"2026","evidence_date":"2026","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"Capacity: 6.33 million chips daily","notes":"Unit 2 targeted Dec 2026; no tool vendors named","used_by":0,"verification_status":"unverified_source"},{"id":"SRC-000207","legacy_id":"S0207","entity_type":"source","title":"India's Semiconductor Value Chain: Made, Assembled, Imported","publisher":"Cofacto (Substack)","source_type":"Blog/aggregator","source_url":"https://cofacto.substack.com/p/indias-semiconductor-value-chain","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":"2026-09","evidence_date":"2026-09","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Equipment is ~100% imported; the $2.04 billion market has no domestic production.","notes":"Names ASM-HHV crystal puller prototype & wafer handling; Raana; INOX India; HCLTech ATE lab","used_by":9,"verification_status":"unverified_source"},{"id":"SRC-000208","legacy_id":"S0208","entity_type":"source","title":"SLTL Group - Laser Cutting Machine Manufacturer India","publisher":"Sahajanand Laser Technology Ltd","source_type":"Official website","source_url":"https://www.sltl.com/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"Wafer Dicing System; Solar Cell Cutting System","notes":"Gandhinagar, Gujarat; in-house R&D centre","used_by":3,"verification_status":"captured"},{"id":"SRC-000209","legacy_id":"S0209","entity_type":"source","title":"Tata Electronics Signs Seven MoUs to Strengthen India's Semiconductor Value Chain","publisher":"ELE Times","source_type":"Industry publication","source_url":"https://www.eletimes.ai/tata-electronics-signs-seven-mous-to-strengthen-indias-semiconductor-value-chain","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-09","evidence_date":"2026-09","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Fujifilm ... Plans Rs 800 crore investment for a materials plant in Dholera","notes":"Nexperia (fab + ATMP), Enomoto (packaging materials, Jagiroad)","used_by":4,"verification_status":"captured"},{"id":"SRC-000210","legacy_id":"S0210","entity_type":"source","title":"SEMICON India sees flurry of MoUs as chip supply chain expands","publisher":"YourStory","source_type":"Industry publication","source_url":"https://yourstory.com/2026/09/semicon-india-sees-flurry-of-mous-as-chip-supply-chain-expands","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-09-17","evidence_date":"2026-09-17","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"develop the TO-247 power discrete package using assembly and packaging technology developed at CDIL's ATMP facility in Mohali","notes":"CDIL-Shinjin; Tata-JSR (photoresists)","used_by":2,"verification_status":"captured"},{"id":"SRC-000211","legacy_id":"S0211","entity_type":"source","title":"Raana Semiconductors Bags $3 Mn To Develop Silicon Crystal Growth Equipment","publisher":"Inc42","source_type":"Industry publication","source_url":"https://inc42.com/buzz/raana-semiconductors-bags-3-mn-to-develop-silicon-crystal-growth-equipment/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-01-20","evidence_date":"2026-01-20","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"Czochralski (CZ) monocrystalline silicon ingot growth equipment for 10-12 inch diameter silicon ingots","notes":"Founded 2015; founder Rajasekar Elavarasan; confirmed orders INR 12 Cr FY26","used_by":5,"verification_status":"captured"},{"id":"SRC-000212","legacy_id":"S0212","entity_type":"source","title":"INOX India Wins First Orbital Welding Order for Tata Electronics' Dholera Fab","publisher":"Electronics For You","source_type":"Industry publication","source_url":"https://www.electronicsforyou.biz/industry-buzz/inox-india-wins-first-orbital-welding-order-for-tata-electronics-dholera-fab/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-09-23","evidence_date":"2026-09-23","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"This is the first order of its kind.","notes":"Orbital welding for UHP piping; value undisclosed","used_by":3,"verification_status":"captured"},{"id":"SRC-000213","legacy_id":"S0213","entity_type":"source","title":"ASM Technologies LTD (SEMI member directory)","publisher":"SEMI","source_type":"Industry directory","source_url":"https://www.semi.org/en/resources/member-directory/asm-technologies-ltd","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"Engineering Services and Product R&D ... semiconductor equipment design, vacuum technologies, robotics, and motion control systems","notes":"Bangalore","used_by":2,"verification_status":"captured"},{"id":"SRC-000214","legacy_id":"S0214","entity_type":"source","title":"India's chip push goes global: Semiconductor heavyweights deepen footprint ahead of SEMICON 2026","publisher":"BusinessToday","source_type":"Industry publication","source_url":"https://www.businesstoday.in/technology/news/story/indias-chip-push-goes-global-semiconductor-heavyweights-deepen-footprint-ahead-of-semicon-2026-555970-2026-09-16","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-09-16","evidence_date":"2026-09-16","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Hirata Corporation (Japan) ... ATS India as exclusive distribution partner ... wafer-handling robots, EFEMs, panel-level packaging load ports","notes":"Teradyne new Bengaluru office","used_by":7,"verification_status":"captured"},{"id":"SRC-000215","legacy_id":"S0215","entity_type":"source","title":"Lam Research To Expand India Supplier Base For Semiconductor Manufacturing","publisher":"BW Businessworld","source_type":"Industry publication","source_url":"https://www.businessworld.in/article/lam-research-to-expand-india-supplier-base-for-semiconductor-manufacturing-624168","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-09","evidence_date":"2026-09","accessed_date":"2026-09-29","accessible":false,"access_mode":"not_accessible","access_note":"Access blocked or not accessible at capture; not bypassed","age_class":"CURRENT","freshness":"Recent","excerpt":"(headline) Lam Research To Expand India Supplier Base","notes":"HTTP 403","used_by":2,"verification_status":"not_accessible"},{"id":"SRC-000216","legacy_id":"S0216","entity_type":"source","title":"Tessolve - Semiconductor Solutions Company","publisher":"Tessolve","source_type":"Official website","source_url":"https://www.tessolve.com/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Globally Top Semiconductor Solutions Company | Tessolve","notes":"Test lab & test engineering services (title-level evidence)","used_by":2,"verification_status":"captured"},{"id":"SRC-000217","legacy_id":"S0217","entity_type":"source","title":"Suzhou Delphi Laser Co., Ltd. - Laser Etching / Wafer Dicing Equipment","publisher":"Suzhou Delphi Laser","source_type":"Official website","source_url":"https://en.delphilaser.com/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025","evidence_date":"2025","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"Wafer-Level Laser Micro-Drilling System (TGV) (Model AWD20)","notes":"688170; founded 2005; wafer dicing (Si, SiC, GaAs, LT, LN, glass), grooving, SiC ingot slicing, laser annealing, marking, TMV drilling, laser debonding","used_by":6,"verification_status":"captured"},{"id":"SRC-000218","legacy_id":"S0218","entity_type":"source","title":"Wuhan DR Laser Technology Corp. (300776.SZ): TGV laser micro-hole equipment ...","publisher":"Moomoo News","source_type":"Blog/aggregator","source_url":"https://www.moomoo.com/news/post/39556632/wuhan-dr-laser-technology-corp-300776-sz-tgv-laser-micro","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":false,"access_mode":"not_accessible","access_note":"Access blocked or not accessible at capture; not bypassed","age_class":"UNDATED","freshness":"Unknown","excerpt":"(headline) TGV laser micro-hole equipment can be applied in related areas such as semiconductor chip packaging and display chip packaging","notes":"HTTP 403 on fetch; headline only","used_by":2,"verification_status":"not_accessible"},{"id":"SRC-000219","legacy_id":"S0219","entity_type":"source","title":"Suzhou Maxwell Technologies (SHE:300751) Company Profile","publisher":"StockAnalysis","source_type":"Industry directory","source_url":"https://stockanalysis.com/quote/she/300751/company/","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":"2026","evidence_date":"2026","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"They also produce laser-based equipment for wafer processing, including cutting and grooving tools.","notes":"Founded 2010; 4,370 employees; OLED and mini/micro-LED equipment","used_by":2,"verification_status":"captured"},{"id":"SRC-000220","legacy_id":"S0220","entity_type":"source","title":"Disco develops DAL7440 KABRA laser saw for 8-inch SiC wafers","publisher":"Semiconductor Today","source_type":"Industry publication","source_url":"https://www.semiconductor-today.com/news_items/2018/jan/disco_090118.shtml","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2018-01-09","evidence_date":"2018-01-09","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"VERY_STALE","freshness":"Stale","excerpt":"A separating layer that absorbs light is formed into a flat shape at the desired depth, enabling peeling and formation of wafers","notes":"Max ingot thickness 40 mm","used_by":2,"verification_status":"captured"},{"id":"SRC-000221","legacy_id":"S0221","entity_type":"source","title":"KABRA!zen Developed - DISCO Corporation","publisher":"DISCO Corporation","source_type":"Press release (company)","source_url":"https://www.disco.co.jp/eg/news/press/20171211.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2017-12-11","evidence_date":"2017-12-11","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"VERY_STALE","freshness":"Stale","excerpt":"(title) KABRA!zen Developed","notes":"Title-level; full automation of KABRA slicing (per S0222)","used_by":2,"verification_status":"captured"},{"id":"SRC-000222","legacy_id":"S0222","entity_type":"source","title":"Development of a KABRA Process Optimized for GaN","publisher":"DISCO Corporation","source_type":"Press release (company)","source_url":"https://www.disco.co.jp/eg/news/corp/kabra_gan.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2023-07","evidence_date":"2023-07","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"VERY_STALE","freshness":"Stale","excerpt":"(title) Development of a KABRA Process Optimized for the ...","notes":"Title-level (GaN KABRA)","used_by":2,"verification_status":"captured"},{"id":"SRC-000223","legacy_id":"S0223","entity_type":"source","title":"Laser System | Products | Sumitomo Heavy Industries Mechatronics Division","publisher":"Sumitomo Heavy Industries","source_type":"Product page","source_url":"https://www.shi-mechatronics.jp/solutions/en/products/laser/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"SWA Green/Hybrid Laser series: High-performance laser annealing equipment that supports deep activation and double-pulse processes","notes":"SWA UV series for SiC ohmic contact; also distributes TRUMPF TruFiber/TruPulse nano and IPG fiber lasers","used_by":9,"verification_status":"captured"},{"id":"SRC-000224","legacy_id":"S0224","entity_type":"source","title":"Products | JSW Aktina System Co., Ltd.","publisher":"JSW Aktina System","source_type":"Product page","source_url":"https://www.jsw-aktina.co.jp/en/product/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"Laser Annealing System for Silicidation (YIELDSCAN); YIELDSCAN SLA; YIELDSCAN MLA; YIELDSCAN ELA; YIELDSCAN LLO; YIELDEdGE FLC; YIELDvia ELD","notes":"Yokohama; parent relationship to JSW not stated on page","used_by":5,"verification_status":"captured"},{"id":"SRC-000225","legacy_id":"S0225","entity_type":"source","title":"Business & Products (Excimer Laser Anneal) | The Japan Steel Works","publisher":"The Japan Steel Works","source_type":"Product page","source_url":"https://www.jsw.co.jp/en/product/fpd/excimer_laser_anneal/ela_01.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Excimer laser anneal - Business & Products | The Japan Steel Works, LTD.","notes":"Title-level: JSW lists ELA under its products (links JSW to JSW Aktina line)","used_by":2,"verification_status":"captured"},{"id":"SRC-000226","legacy_id":"S0226","entity_type":"source","title":"AP Systems success story (PYTHON DPSS laser in Gen 8.6 SLA)","publisher":"Coherent Corp.","source_type":"Official website","source_url":"https://www.coherent.com/news/success-stories/ap-systems","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"PYTHON solid-state laser ... AP Systems G8.6 SLA line for OLED; replaces VYPER excimer","notes":"DOCUMENTED_SUPPLY laser source -> OEM (display SLA)","used_by":6,"verification_status":"captured"},{"id":"SRC-000227","legacy_id":"S0227","entity_type":"source","title":"AP Systems sole ELA supplier for Visionox V5 Gen 8.6 line","publisher":"The Elec","source_type":"Industry publication","source_url":"https://www.thelec.net/news/articleView.html?idxno=5497","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-11-21","evidence_date":"2025-11-21","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"AP Systems ... sole supplier of ELA ... also LLO ... Visionox V5 Gen 8.6, Hefei (RMB 55B fab)","notes":"Display (adjacent industry, PSX6)","used_by":3,"verification_status":"captured"},{"id":"SRC-000228","legacy_id":"S0228","entity_type":"source","title":"Protec laser-assisted bonder: exclusivity expired","publisher":"The Elec","source_type":"Industry publication","source_url":"https://www.thelec.net/news/articleView.html?idxno=4555","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2023","evidence_date":"2023","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"VERY_STALE","freshness":"Stale","excerpt":"exclusivity expired mid-May 2023 ... TSMC and Apple interest ... LAB ~5% of revenue; competitor Laserssel","notes":"Customer interest only -> PROBABLE/UNVERIFIED","used_by":5,"verification_status":"captured"},{"id":"SRC-000229","legacy_id":"S0229","entity_type":"source","title":"Systems | InnoLas Semiconductor","publisher":"InnoLas Semiconductor GmbH","source_type":"Product page","source_url":"https://innolas-semiconductor.com/en/systems/?lang=en","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"IL 600/1000/2000/3000; IL C3000/C3000 HT; IL 4000/C4000 (ISO 3 minienvironment, FOUP, 300/450 mm); sorters IL 2600/C3200/C3600/C3800/C4600","notes":"Laser wafer marking & sorting; 2 inch-200 mm and 300 mm; beam expanders 355/532/1064 nm; Krailling, Bavaria","used_by":6,"verification_status":"captured"},{"id":"SRC-000230","legacy_id":"S0230","entity_type":"source","title":"MKS Introduces ESI Geode A CO2 Laser System for ABF IC Substrate Manufacturing","publisher":"I-Connect007","source_type":"Industry publication","source_url":"https://iconnect007.com/article/136549/mks-introduces-esi-geode-a-co2-laser-system-for-high-precision-and-highspeed-abf-ic-substrate-manufacturing/136552/smt","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2023-05-31","evidence_date":"2023-05-31","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"VERY_STALE","freshness":"Stale","excerpt":"reduces floor space by 21%, weight by 72%, power consumption by up to 65%","notes":"CO2 via drilling of ABF build-up for FCBGA substrates","used_by":4,"verification_status":"captured"},{"id":"SRC-000231","legacy_id":"S0231","entity_type":"source","title":"Singulator (MDS-100 / MDS-300) plasma dicing","publisher":"Plasma-Therm LLC","source_type":"Product page","source_url":"https://www.plasmatherm.com/product/singulator/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"4/6/8 inch on frames and 12 inch; ICP; streets down to 10 um","notes":"CAUTION: page states etch speed 'up to 3,000 mm/s' - implausible as etch rate, recorded verbatim, flagged CONFLICT_REVIEW; St. Petersburg FL","used_by":2,"verification_status":"captured"},{"id":"SRC-000232","legacy_id":"S0232","entity_type":"source","title":"Temporary Bonding and Debonding Systems | EV Group","publisher":"EV Group","source_type":"Product page","source_url":"https://www.evgroup.com/products/bonding/temporary-bonding-and-debonding-systems","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"EVG805; EVG850 TB; EVG850 DB; EVG880 LayerRelease (IR laser release)","notes":"St. Florian am Inn, Austria","used_by":3,"verification_status":"captured"},{"id":"SRC-000233","legacy_id":"S0233","entity_type":"source","title":"SUSS MicroTec Launches ELD300 Excimer Laser Debonder for 3D Integration","publisher":"3D InCites","source_type":"Industry publication","source_url":"https://www.3dincites.com/2014/07/suss-microtec-launches-eld300-excimer-laser-debonder-3d-integration/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2014-07-08","evidence_date":"2014-07-08","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"VERY_STALE","freshness":"Stale","excerpt":"ELD300 ... 308 nm excimer ... 200/300 mm ... 3D-IC, 2.5D, MEMS, CIS, power","notes":"Launch article is >2 years old (VERY_STALE for status); XBC300 Gen2 platform","used_by":2,"verification_status":"captured"},{"id":"SRC-000234","legacy_id":"S0234","entity_type":"source","title":"APX300-DM Plasma Dicer","publisher":"Panasonic Connect North America","source_type":"Product page","source_url":"https://connect.na.panasonic.com/smart-factory/electronics-assembly/microelectronics/apx300-dm-plasma-dicer","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"ICP plasma dicing; 100/150/200 mm; streets 20 um; 1,350 x 2,230 x 2,000 mm; 21.00 kVA; 4 gas lines","notes":null,"used_by":2,"verification_status":"captured"},{"id":"SRC-000235","legacy_id":"S0235","entity_type":"source","title":"Mosaic plasma dicing (SPTS, a KLA company)","publisher":"KLA / SPTS","source_type":"Product page","source_url":"https://www.spts.com/product/mosaic-system-plasma-dicing","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":false,"access_mode":"not_accessible","access_note":"Access blocked or not accessible at capture; not bypassed","age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Mosaic plasma dicing","notes":"Redirects to KLA etch page (bot protection); title only","used_by":3,"verification_status":"not_accessible"},{"id":"SRC-000236","legacy_id":"S0236","entity_type":"source","title":"About | ADT Advanced Dicing Technologies","publisher":"Advanced Dicing Technologies Ltd","source_type":"Official website","source_url":"https://www.adt-co.com/about/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"founded 1977 (formerly Kulicke & Soffa dicing); dicing saws 8030, 7304, 80Ai; blades; two plants in Yokneam","notes":"Also SEMI member directory + Productronica 2025 exhibitor listing","used_by":3,"verification_status":"captured"},{"id":"SRC-000237","legacy_id":"S0237","entity_type":"source","title":"TOWA FY2025 financial results presentation","publisher":"TOWA Corporation","source_type":"Investor presentation","source_url":"https://www.towajapan.co.jp/en/wp-content/uploads/sites/3/2026/05/2025FY_end_presentation_eng.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-05","evidence_date":"2026-05","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"sales 543.6; operating income 69.1; semiconductor 403.9; forecast 640.0 (+17.7%) - units as rendered by fetch summary","notes":"CONFLICT: summary rendered '543.6 bn yen' - unit is most likely 100M yen (oku-en) => JPY 54.36B; fiscal period FYE Mar-2026 to be confirmed; products PMC 2030-D, CPM 1080 (compression molding), FMS 4040 (singulation)","used_by":6,"verification_status":"captured"},{"id":"SRC-000238","legacy_id":"S0238","entity_type":"source","title":"Japan's chipmaker TOWA guides for 17% sales rise in FY3/27","publisher":"Investing.com","source_type":"Industry publication","source_url":"https://www.investing.com/news/earnings/japans-chipmaker-towa-guides-for-17-sales-rise-in-fy327-93CH-4675662","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-05","evidence_date":"2026-05","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"(headline) guides for 17% sales rise in FY3/27","notes":"Corroborates +17.7% forecast in S0237; implies S0237 period = FY3/26","used_by":3,"verification_status":"captured"},{"id":"SRC-000239","legacy_id":"S0239","entity_type":"source","title":"Products by manufacturer | Yamaha Robotics","publisher":"Yamaha Robotics Holdings","source_type":"Product page","source_url":"https://www.yamaha-robotics.com/en/products/manufacturer","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"SHINKAWA; APIC YAMADA; PFA - die bonders, bump/flip-chip bonders, wire bonders, molding, lead processing","notes":"Brands of Yamaha Robotics Holdings","used_by":4,"verification_status":"captured"},{"id":"SRC-000240","legacy_id":"S0240","entity_type":"source","title":"UTC-5000Super wire bonder","publisher":"Yamaha Robotics Holdings","source_type":"Product page","source_url":"https://www.yamaha-robotics.com/en/products/process/utc-5000super","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) UTC-5000Super","notes":"Also UTC-5100, UTC-5000NeoCu Super, FPB-1ws NeoForce; UTC-RZ1 news 2024-12","used_by":3,"verification_status":"captured"},{"id":"SRC-000241","legacy_id":"S0241","entity_type":"source","title":"Aehr Test Systems Reports Fiscal 2026 Q4 and Full Year Results","publisher":"Aehr Test Systems","source_type":"Press release (company)","source_url":"https://www.aehr.com/2026/07/aehr-test-systems-reports-fiscal-2026-fourth-quarter-and-full-year-financial-results-with-record-quarterly-bookings-and-100-million-effective-backlog/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-07","evidence_date":"2026-07","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"fiscal 2026 revenue $50.0M; GAAP net loss $(7.1)M; Q4 bookings $60.7M; effective backlog $100.6M","notes":"FYE 2026-05-29; FOX-XP/NP/CP, Sonoma; AI, SiC, HBM, silicon photonics; customers unnamed","used_by":7,"verification_status":"captured"},{"id":"SRC-000242","legacy_id":"S0242","entity_type":"source","title":"Aehr Receives $22 Million Follow-On Order for AI Processor Wafer Level Burn-In Systems","publisher":"Aehr Test Systems","source_type":"Press release (company)","source_url":"https://www.aehr.com/2026/08/aehr-receives-22-million-follow-on-order-for-ai-processor-wafer-level-burn-in-systems/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-08","evidence_date":"2026-08","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"(headline) $22 Million Follow-On Order ... AI Processor Wafer Level Burn-In","notes":"Customer unnamed","used_by":3,"verification_status":"captured"},{"id":"SRC-000243","legacy_id":"S0243","entity_type":"source","title":"EV Group unveils low-temperature laser debonding solution for FOWLP","publisher":"EV Group","source_type":"Press release (company)","source_url":"https://www.evgroup.com/company/news/detail/ev-group-unveils-breakthrough-low-temperature-laser-debonding-solution-for-fan-out-wafer-level-packaging-1556569869","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) low-temperature laser debonding solution for fan-out wafer-level packaging","notes":"Title-level","used_by":2,"verification_status":"captured"},{"id":"SRC-000244","legacy_id":"S0244","entity_type":"source","title":"Laser Assisted Bonding Equipment by PacTech","publisher":"Inseto (distributor)","source_type":"Distributor","source_url":"https://www.inseto.com/equipment/wafer-solder-bumping-equipment-and-services-by-pactech/laser-assisted-bonding-equipment/","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Laser Assisted Bonding Equipment - PacTech","notes":"Tier 3 - distributor listing","used_by":2,"verification_status":"captured"},{"id":"SRC-000245","legacy_id":"S0245","entity_type":"source","title":"Suzhou Delphi Laser Co., Ltd. (buyer's guide)","publisher":"Laser Focus World","source_type":"Industry directory","source_url":"https://www.laserfocusworld.com/directory/laser-sources/lasers-solid-state/company/14048852/suzhou-delphi-laser-co-ltd","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Suzhou Delphi Laser Co., Ltd.","notes":"Title-level corroboration of S0217","used_by":1,"verification_status":"captured"},{"id":"SRC-000246","legacy_id":"S0246","entity_type":"source","title":"Semiconductor Wafer Laser Grooving Equipment Market Size","publisher":"OpenPR","source_type":"Market report / blog","source_url":"https://www.openpr.com/news/3829266/semiconductor-wafer-laser-grooving-equipment-market-size","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":"2025","evidence_date":"2025","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"lists InnoLas, ASYS, DR Laser, Suzhou Maxwell among vendors","notes":"Discovery only; never used as confirmation","used_by":4,"verification_status":"unverified_source"},{"id":"SRC-000247","legacy_id":"S0247","entity_type":"source","title":"HDI and IC Substrate | ESI (MKS)","publisher":"MKS Instruments (ESI)","source_type":"Product page","source_url":"https://www.esi.com/solutions/rigid-pcb-processing/hdi-and-ic-substrate/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) HDI and IC substrate laser via drilling","notes":"Geode X UV (esi.com/f/geode-x-uv-laser-via-drilling-system); Geode G2 CO2","used_by":3,"verification_status":"captured"},{"id":"SRC-000248","legacy_id":"S0248","entity_type":"source","title":"AP Systems ELA market leader","publisher":"BusinessKorea","source_type":"Industry publication","source_url":"https://www.businesskorea.co.kr/news/articleView.html?idxno=47262","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(headline) AP Systems ... ELA","notes":"Title-level","used_by":2,"verification_status":"captured"},{"id":"SRC-000249","legacy_id":"S0249","entity_type":"source","title":"AP Systems company introduction","publisher":"AP Systems","source_type":"Official website","source_url":"https://www.apsystems.co.kr/eng/company/introduce.asp","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":false,"access_mode":"not_accessible","access_note":"Access blocked or not accessible at capture; not bypassed","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"http<->https redirect loop; KOSDAQ 265520 per Tier-4 aggregator (not relied on)","used_by":1,"verification_status":"not_accessible"},{"id":"SRC-000250","legacy_id":"S0250","entity_type":"source","title":"AP Systems to show Gen 8.6 IT OLED equipment at K-Display 2026","publisher":"The Elec","source_type":"Industry publication","source_url":"https://www.thelec.net/news/articleView.html?idxno=12425","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-08","evidence_date":"2026-08","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"(headline) Gen 8.6 IT OLED equipment at K-Display 2026","notes":"Title-level","used_by":1,"verification_status":"captured"},{"id":"SRC-000251","legacy_id":"S0251","entity_type":"source","title":"Galvanometer Scanners | Scanlab","publisher":"SCANLAB GmbH","source_type":"Official website","source_url":"https://www.scanlab.de/en/service/glossary/galvanometer-scanners","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Galvanometer Scanners | Scanlab","notes":"Title-level evidence","used_by":4,"verification_status":"captured"},{"id":"SRC-000252","legacy_id":"S0252","entity_type":"source","title":"New Laser Scan Systems for Micromachining and a Multi-head Setup for Greater Productivity","publisher":"SCANLAB GmbH","source_type":"Press release (company)","source_url":"https://www.scanlab.de/en/news-events/press-releases/new-laser-scan-systems-micromachining-and-multi-head-setup-greater","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) New Laser Scan Systems for Micromachining and a Multi-head Setup for Greater Productivity","notes":"Title-level evidence","used_by":4,"verification_status":"captured"},{"id":"SRC-000253","legacy_id":"S0253","entity_type":"source","title":"Diffractive Optical Elements | Scanlab","publisher":"SCANLAB GmbH","source_type":"Product page","source_url":"https://www.scanlab.de/en/products/scan-components/diffractive-optical-elements","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Diffractive Optical Elements | Scanlab","notes":"Title-level evidence","used_by":4,"verification_status":"captured"},{"id":"SRC-000254","legacy_id":"S0254","entity_type":"source","title":"62xxK & 83xxK Galvanometer Scanners | Novanta","publisher":"Novanta Photonics (Cambridge Technology)","source_type":"Product page","source_url":"https://novantaphotonics.com/product/62xxk-and-83xxk-series-galvanometers/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) 62xxK & 83xxK Galvanometer Scanners | Novanta","notes":"Title-level evidence","used_by":6,"verification_status":"captured"},{"id":"SRC-000255","legacy_id":"S0255","entity_type":"source","title":"ScanMaster Controller | Novanta Laser Solutions","publisher":"Novanta Photonics","source_type":"Product page","source_url":"https://novantaphotonics.com/product/scanmaster-controller","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) ScanMaster Controller | Novanta Laser Solutions","notes":"Title-level evidence","used_by":5,"verification_status":"captured"},{"id":"SRC-000256","legacy_id":"S0256","entity_type":"source","title":"2-AXIS DEFLECTION UNITS - RAYLASE","publisher":"RAYLASE GmbH","source_type":"Product page","source_url":"https://www.raylase.de/en/products/2-axis-deflection-unit.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) 2-AXIS DEFLECTION UNITS - RAYLASE","notes":"Title-level evidence","used_by":3,"verification_status":"captured"},{"id":"SRC-000257","legacy_id":"S0257","entity_type":"source","title":"Sino-Galvo - Providing core component solutions for laser applications","publisher":"Sino-Galvo","source_type":"Official website","source_url":"https://www.sino-galvo.com/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Sino-Galvo - Providing core component solutions for laser applications","notes":"Title-level evidence","used_by":4,"verification_status":"captured"},{"id":"SRC-000258","legacy_id":"S0258","entity_type":"source","title":"About - Sino-Galvo (Jiangsu) Technology Co., Ltd.","publisher":"Sino-Galvo (Jiangsu) Technology","source_type":"Official website","source_url":"https://www.jhckj.com/en_about.php","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) About - Sino-Galvo (Jiangsu) Technology Co., Ltd.","notes":"Beijing and Jiangsu Sino-Galvo entities both observed -> RELATED","used_by":4,"verification_status":"captured"},{"id":"SRC-000259","legacy_id":"S0259","entity_type":"source","title":"PHAROS Femtosecond Lasers - LIGHT CONVERSION","publisher":"Light Conversion (UAB Sviesos konversija)","source_type":"Product page","source_url":"https://lightcon.com/products/pharos-femtosecond-lasers/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) PHAROS Femtosecond Lasers - LIGHT CONVERSION","notes":"Title-level evidence","used_by":3,"verification_status":"captured"},{"id":"SRC-000260","legacy_id":"S0260","entity_type":"source","title":"Ultrashort pulse lasers from TRUMPF","publisher":"TRUMPF","source_type":"Product page","source_url":"https://www.trumpf.com/en_US/products/lasers/beam-sources/ultrashort-pulse-laser/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Ultrashort pulse lasers from TRUMPF","notes":"TruMicro Series 2000 / 9000 / Mark pages also indexed","used_by":3,"verification_status":"captured"},{"id":"SRC-000261","legacy_id":"S0261","entity_type":"source","title":"Electronics | TRUMPF","publisher":"TRUMPF","source_type":"Official website","source_url":"https://www.trumpf.com/en_US/solutions/industries/electronics/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Electronics | TRUMPF","notes":"Title-level evidence","used_by":2,"verification_status":"captured"},{"id":"SRC-000262","legacy_id":"S0262","entity_type":"source","title":"IceFyre redefines picosecond micromachining lasers (datasheet)","publisher":"MKS Instruments (Spectra-Physics)","source_type":"Datasheet","source_url":"https://www.spectra-physics.com/medias/sys_master/resources/he1/h2f/9954705408030/IceFyre-Datasheet/IceFyre-Datasheet.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) IceFyre redefines picosecond micromachining lasers (datasheet)","notes":"Title-level evidence","used_by":4,"verification_status":"captured"},{"id":"SRC-000263","legacy_id":"S0263","entity_type":"source","title":"MKS Unveils New Spectra-Physics IceFyre GR50","publisher":"MKS Instruments (Spectra-Physics)","source_type":"Press release (company)","source_url":"https://www.spectra-physics.com/en/news/mks-unveils-new-spectra-physics-icefyre-gr50","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) MKS Unveils New Spectra-Physics IceFyre GR50","notes":"Title-level evidence","used_by":4,"verification_status":"captured"},{"id":"SRC-000264","legacy_id":"S0264","entity_type":"source","title":"Satsuma X powerful and versatile 50 W femtosecond laser - Amplitude","publisher":"Amplitude Laser","source_type":"Product page","source_url":"https://amplitude-laser.com/products/femtosecond-lasers/lasers-for-industry/satsuma-x/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Satsuma X powerful and versatile 50 W femtosecond laser - Amplitude","notes":"Title-level evidence","used_by":3,"verification_status":"captured"},{"id":"SRC-000265","legacy_id":"S0265","entity_type":"source","title":"Femtosecond|Picosecond|Nanosecond UV Laser - Huaray Products","publisher":"Wuhan Huaray Precision Laser","source_type":"Product page","source_url":"https://en.huaraylaser.com/products_list/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Femtosecond|Picosecond|Nanosecond UV Laser - Huaray Products","notes":"Second domain huaray-laser.com also carries 'About Us - Wuhan Huaray Precision Laser Co., Ltd.' - official domain not confirmed (CONFLICT_REVIEW)","used_by":3,"verification_status":"captured"},{"id":"SRC-000266","legacy_id":"S0266","entity_type":"source","title":"MOPA Fiber Laser | JPT MOPA Laser Source - JPT Laser","publisher":"Shenzhen JPT Opto-electronics","source_type":"Product page","source_url":"https://en.jptoe.com/products/lasers/mopa-fiber-lasers","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) MOPA Fiber Laser | JPT MOPA Laser Source - JPT Laser","notes":"Title-level evidence","used_by":3,"verification_status":"captured"},{"id":"SRC-000267","legacy_id":"S0267","entity_type":"source","title":"Company - Wuhan Raycus Fiber Laser Technologies Co., Ltd.","publisher":"Wuhan Raycus Fiber Laser Technologies","source_type":"Official website","source_url":"https://en.raycuslaser.com/about/company.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Company - Wuhan Raycus Fiber Laser Technologies Co., Ltd.","notes":"Title-level evidence","used_by":3,"verification_status":"captured"},{"id":"SRC-000268","legacy_id":"S0268","entity_type":"source","title":"Wuhan Raycus Fiber Laser Technologies (SHE:300747) Company Profile","publisher":"StockAnalysis","source_type":"Industry directory","source_url":"https://stockanalysis.com/quote/she/300747/company/","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Wuhan Raycus Fiber Laser Technologies (SHE:300747) Company Profile","notes":"Title-level evidence","used_by":2,"verification_status":"captured"},{"id":"SRC-000269","legacy_id":"S0269","entity_type":"source","title":"Nanosecond Pulsed Fiber Laser | IPG Photonics","publisher":"IPG Photonics","source_type":"Product page","source_url":"https://www.ipgphotonics.com/en/products/lasers/nanosecond-fiber-lasers","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Nanosecond Pulsed Fiber Laser | IPG Photonics","notes":"Title-level evidence","used_by":4,"verification_status":"captured"},{"id":"SRC-000270","legacy_id":"S0270","entity_type":"source","title":"UV Laser Marking Module | IPG Photonics","publisher":"IPG Photonics","source_type":"Product page","source_url":"https://www.ipgphotonics.com/en/products/beam-delivery/scanning-heads/scanning-heads/uv-marking-module","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) UV Laser Marking Module | IPG Photonics","notes":"Title-level evidence","used_by":4,"verification_status":"captured"},{"id":"SRC-000271","legacy_id":"S0271","entity_type":"source","title":"Precise Wafer Dicing Solutions | Aerotech","publisher":"Aerotech Inc.","source_type":"Product page","source_url":"https://www.aerotech.com/industries-and-applications/semiconductor/wafer-dicing.aspx","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Precise Wafer Dicing Solutions | Aerotech","notes":"Title-level evidence","used_by":4,"verification_status":"captured"},{"id":"SRC-000272","legacy_id":"S0272","entity_type":"source","title":"Wafer Inspection & Metrology Equipment | Aerotech","publisher":"Aerotech Inc.","source_type":"Product page","source_url":"https://www.aerotech.com/industries/wafer-inspection-and-metrology/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Wafer Inspection & Metrology Equipment | Aerotech","notes":"Title-level evidence","used_by":4,"verification_status":"captured"},{"id":"SRC-000273","legacy_id":"S0273","entity_type":"source","title":"A-110 PIglide LC Linear Stage with Air Bearings","publisher":"Physik Instrumente (PI)","source_type":"Product page","source_url":"https://www.physikinstrumente.com/en/products/linear-stages/stages-with-magnetic-direct-drive-linear-motor/a-110-piglide-lc-linear-stage-with-air-bearings-900711","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) A-110 PIglide LC Linear Stage with Air Bearings","notes":"Title-level evidence","used_by":3,"verification_status":"captured"},{"id":"SRC-000274","legacy_id":"S0274","entity_type":"source","title":"About ACS Motion Control (The PI Group)","publisher":"Physik Instrumente (PI)","source_type":"Official website","source_url":"https://www.pi-usa.us/en/about/the-pi-group/acs-motion-control","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) About ACS Motion Control (The PI Group)","notes":"ACS Motion Control listed as member of the PI Group -> SUBSIDIARY/RELATED","used_by":5,"verification_status":"captured"},{"id":"SRC-000275","legacy_id":"S0275","entity_type":"source","title":"Semiconductor Manufacturing | ACS Motion Control","publisher":"ACS Motion Control","source_type":"Official website","source_url":"https://acsmotioncontrol.com/markets/semiconductor-manufacturing/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Semiconductor Manufacturing | ACS Motion Control","notes":"Title-level evidence","used_by":3,"verification_status":"captured"},{"id":"SRC-000276","legacy_id":"S0276","entity_type":"source","title":"New ETEL TBS linear axis for semiconductor market - HEIDENHAIN","publisher":"HEIDENHAIN (ETEL)","source_type":"Press release (company)","source_url":"https://www.heidenhain.us/resources-and-news/new-etel-tbs-linear-axis-for-semiconductor-market/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) New ETEL TBS linear axis for semiconductor market - HEIDENHAIN","notes":"ETEL presented as HEIDENHAIN group brand","used_by":5,"verification_status":"captured"},{"id":"SRC-000277","legacy_id":"S0277","entity_type":"source","title":"Renishaw launches next-generation RLE interferometric laser encoders for advanced motion control in semiconductor manufacturing","publisher":"Renishaw plc","source_type":"Press release (company)","source_url":"https://www.renishaw.com/en/renishaw-launches-next-generation-rle-interferometric-laser-encoders-for-advanced-motion-control-in-semiconductor-manufacturing--50149","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Renishaw launches next-generation RLE interferometric laser encoders for advanced motion control in semiconductor manufacturing","notes":"Title-level evidence","used_by":3,"verification_status":"captured"},{"id":"SRC-000278","legacy_id":"S0278","entity_type":"source","title":"In-Sight 1740 Wafer Identification Reader | Cognex","publisher":"Cognex Corporation","source_type":"Product page","source_url":"https://www.cognex.com/en/products/2d-machine-vision-systems/in-sight-1740","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) In-Sight 1740 Wafer Identification Reader | Cognex","notes":"Title-level evidence","used_by":4,"verification_status":"captured"},{"id":"SRC-000279","legacy_id":"S0279","entity_type":"source","title":"Cognex Launches New Wafer Reader to Help Semiconductor Manufacturers Scale Production","publisher":"Cognex Corporation","source_type":"Press release (company)","source_url":"https://investor.cognex.com/news/news-details/2026/Cognex-Launches-New-Wafer-Reader-to-Help-Semiconductor-Manufacturers-Scale-Production/default.aspx","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026","evidence_date":"2026","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"(title) Cognex Launches New Wafer Reader to Help Semiconductor Manufacturers Scale Production","notes":"Title-level evidence","used_by":4,"verification_status":"captured"},{"id":"SRC-000280","legacy_id":"S0280","entity_type":"source","title":"Semiconductor Inspection, Defect Detection, and QA | Basler","publisher":"Basler AG","source_type":"Official website","source_url":"https://www.baslerweb.com/en-us/industry-solutions/semicon-industry/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Semiconductor Inspection, Defect Detection, and QA | Basler","notes":"Title-level evidence","used_by":3,"verification_status":"captured"},{"id":"SRC-000281","legacy_id":"S0281","entity_type":"source","title":"Hikrobot - Machine Vision Products","publisher":"Hangzhou Hikrobot","source_type":"Product page","source_url":"https://www.hikrobotics.com/en/machinevision/visionproduct/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Hikrobot - Machine Vision Products","notes":"Title-level evidence","used_by":4,"verification_status":"captured"},{"id":"SRC-000282","legacy_id":"S0282","entity_type":"source","title":"F-THETA LENSES - BEAM EXPANDERS - ASPHERIC LENSES (Laser Optics catalog 06/2023)","publisher":"Sill Optics GmbH","source_type":"Datasheet","source_url":"https://www.silloptics.de/fileadmin/user_upload/pdf/Katalog/Laser_Optics_06_2023.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2023-06","evidence_date":"2023-06","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"VERY_STALE","freshness":"Stale","excerpt":"(title) F-THETA LENSES - BEAM EXPANDERS - ASPHERIC LENSES (Laser Optics catalog 06/2023)","notes":"Title-level evidence","used_by":4,"verification_status":"captured"},{"id":"SRC-000283","legacy_id":"S0283","entity_type":"source","title":"Ronar-Smith F-Theta Lenses | Over 400 F-Theta Scan Lenses","publisher":"Wavelength Opto-Electronic","source_type":"Product page","source_url":"https://wavelength-oe.com/f-theta-lenses/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Ronar-Smith F-Theta Lenses | Over 400 F-Theta Scan Lenses","notes":"Singapore-registered (LinkedIn sg); Nanjing entity on DirectIndustry","used_by":3,"verification_status":"captured"},{"id":"SRC-000284","legacy_id":"S0284","entity_type":"source","title":"Industrial Chiller Manufacturer | Laser & Process Cooling - TEYU Chiller","publisher":"TEYU S&A Chiller","source_type":"Official website","source_url":"https://www.teyuchiller.com/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Industrial Chiller Manufacturer | Laser & Process Cooling - TEYU Chiller","notes":"Title-level evidence","used_by":3,"verification_status":"captured"},{"id":"SRC-000285","legacy_id":"S0285","entity_type":"source","title":"Fume extraction and air drying in electronics manufacturing (electronics & semiconductor production)","publisher":"ULT AG","source_type":"Official website","source_url":"https://www.ult-airtec.com/is/electronics-and-semiconductor-production","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Fume extraction and air drying in electronics manufacturing (electronics & semiconductor production)","notes":"Title-level evidence","used_by":3,"verification_status":"captured"},{"id":"SRC-000286","legacy_id":"S0286","entity_type":"source","title":"Atlas (abatement) - Edwards Vacuum","publisher":"Edwards Vacuum","source_type":"Product page","source_url":"https://www.edwardsvacuum.com/en-us/semiconductor/our-products/abatement/atlas","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Atlas (abatement) - Edwards Vacuum","notes":"Title-level evidence","used_by":3,"verification_status":"captured"},{"id":"SRC-000287","legacy_id":"S0287","entity_type":"source","title":"Edwards Vacuum (Wikipedia)","publisher":"Wikipedia","source_type":"Blog/aggregator","source_url":"https://en.wikipedia.org/wiki/Edwards_Vacuum","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Edwards Vacuum (Wikipedia)","notes":"Discovery only: parent Atlas Copco (Vacuum Technique) - corroborate with atlascopcogroup.com history page","used_by":3,"verification_status":"unverified_source"},{"id":"SRC-000288","legacy_id":"S0288","entity_type":"source","title":"Pfeiffer Vacuum Becomes Pfeiffer Vacuum+Fab Solutions | Busch Global","publisher":"Busch Group","source_type":"Press release (company)","source_url":"https://www.buschvacuum.com/global/en/news-media/pfeiffer-vacuum-becomes-pfeiffer-vacuum-fab-solutions.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2024-10","evidence_date":"2024-10","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"(title) Pfeiffer Vacuum Becomes Pfeiffer Vacuum+Fab Solutions | Busch Global","notes":"Pfeiffer Vacuum part of Busch Group","used_by":4,"verification_status":"captured"},{"id":"SRC-000289","legacy_id":"S0289","entity_type":"source","title":"Pfeiffer Vacuum becomes Pfeiffer Vacuum+Fab Solutions","publisher":"Semiconductor Today","source_type":"Industry publication","source_url":"https://www.semiconductor-today.com/news_items/2024/oct/pfeiffer-251024.shtml","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2024-10-25","evidence_date":"2024-10-25","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"(title) Pfeiffer Vacuum becomes Pfeiffer Vacuum+Fab Solutions","notes":"Title-level evidence","used_by":4,"verification_status":"captured"},{"id":"SRC-000290","legacy_id":"S0290","entity_type":"source","title":"RF Plasma Generators | Advanced Energy","publisher":"Advanced Energy Industries","source_type":"Product page","source_url":"https://www.advancedenergy.com/en-us/products/plasma-power-products/rf-plasma-generators/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) RF Plasma Generators | Advanced Energy","notes":"Title-level evidence","used_by":2,"verification_status":"captured"},{"id":"SRC-000291","legacy_id":"S0291","entity_type":"source","title":"Semiconductor - Comet PCT","publisher":"Comet Plasma Control Technologies (Comet AG)","source_type":"Product page","source_url":"https://pct.comet.tech/en/products/solutions/semiconductor","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Semiconductor - Comet PCT","notes":"Title-level evidence","used_by":2,"verification_status":"captured"},{"id":"SRC-000292","legacy_id":"S0292","entity_type":"source","title":"Acousto-Optic Modulators | Gooch & Housego","publisher":"Photonics.com","source_type":"Industry directory","source_url":"https://www.photonics.com/Product.aspx?PRID=56132","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Acousto-Optic Modulators | Gooch & Housego","notes":"Title-level evidence","used_by":3,"verification_status":"captured"},{"id":"SRC-000293","legacy_id":"S0293","entity_type":"source","title":"Beam Shaping Solutions for Single & Multi Mode Lasers by Holo/Or","publisher":"Holo/Or Ltd","source_type":"Product page","source_url":"https://www.holoor.co.il/beam-shaping/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Beam Shaping Solutions for Single & Multi Mode Lasers by Holo/Or","notes":"Title-level evidence","used_by":3,"verification_status":"captured"},{"id":"SRC-000294","legacy_id":"S0294","entity_type":"source","title":"EFEM/SORTER - RORZE","publisher":"RORZE Corporation","source_type":"Product page","source_url":"https://www.rorze.com/en/products_category/efemsorter/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) EFEM/SORTER - RORZE","notes":"Title-level evidence","used_by":3,"verification_status":"captured"},{"id":"SRC-000295","legacy_id":"S0295","entity_type":"source","title":"Kawasaki Jukogyo Kabushiki Kaisha v. Rorze Corporation (N.D. Cal. 2025)","publisher":"FindLaw (court opinion)","source_type":"Regulatory filing","source_url":"https://caselaw.findlaw.com/court/us-dis-crt-n-d-cal/117272525.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025","evidence_date":"2025","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"(title) Kawasaki Jukogyo Kabushiki Kaisha v. Rorze Corporation (N.D. Cal. 2025)","notes":"Court record: wafer-robot patent dispute; patent numbers not captured in Batch 1","used_by":3,"verification_status":"captured"},{"id":"SRC-000296","legacy_id":"S0296","entity_type":"source","title":"Semiconductor Automation | Brooks Automation","publisher":"Brooks Automation","source_type":"Official website","source_url":"https://www.brooks.com/semiconductor-automation/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Semiconductor Automation | Brooks Automation","notes":"Title-level evidence","used_by":2,"verification_status":"captured"},{"id":"SRC-000297","legacy_id":"S0297","entity_type":"source","title":"Brooks Automation US, LLC - Exhibitor - SEMICON West 2026","publisher":"SEMI (SEMICON West)","source_type":"Conference/exhibition","source_url":"https://portal2026.semiconwest.org/co/brooks-automation-us-llc","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026","evidence_date":"2026","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"(title) Brooks Automation US, LLC - Exhibitor - SEMICON West 2026","notes":"Title-level evidence","used_by":2,"verification_status":"captured"},{"id":"SRC-000298","legacy_id":"S0298","entity_type":"source","title":"Cleanroom | Solutions | DAIFUKU","publisher":"Daifuku Co., Ltd.","source_type":"Product page","source_url":"https://www.daifuku.com/solution/cleanroom/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Cleanroom | Solutions | DAIFUKU","notes":"Title-level evidence","used_by":1,"verification_status":"captured"},{"id":"SRC-000299","legacy_id":"S0299","entity_type":"source","title":"Daifuku Co., Ltd. - SEMICON India 2025 eBooth","publisher":"SEMI (SEMICON India)","source_type":"Conference/exhibition","source_url":"https://expo.semi.org/india2025/Public/eBooth.aspx?IndexInList=64&ListByBooth=true&BoothID=643684&Nav=False","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025","evidence_date":"2025","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"(title) Daifuku Co., Ltd. - SEMICON India 2025 eBooth","notes":"Title-level evidence","used_by":2,"verification_status":"captured"},{"id":"SRC-000300","legacy_id":"S0300","entity_type":"source","title":"OHT | AMHS for Semiconductor Fab | CLEAN FA | MURATEC, Murata Machinery","publisher":"Murata Machinery, Ltd.","source_type":"Product page","source_url":"https://www.muratec.com/cfa/products/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) OHT | AMHS for Semiconductor Fab | CLEAN FA | MURATEC, Murata Machinery","notes":"Title-level evidence","used_by":2,"verification_status":"captured"},{"id":"SRC-000301","legacy_id":"S0301","entity_type":"source","title":"Muratec OHT 300mm AMHS for Semiconductor Fab - Murata Machinery India Private Limited, Coimbatore","publisher":"IndiaMART","source_type":"Trade portal","source_url":"https://www.indiamart.com/proddetail/muratec-oht-300mm-amhs-for-semiconductor-fab-20285048773.html","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Muratec OHT 300mm AMHS for Semiconductor Fab - Murata Machinery India Private Limited, Coimbatore","notes":"Title-level evidence","used_by":4,"verification_status":"captured"},{"id":"SRC-000302","legacy_id":"S0302","entity_type":"source","title":"Techwing Wins First SK hynix Order for HBM Cube Prober","publisher":"The Elec","source_type":"Industry publication","source_url":"https://www.thelec.net/news/articleView.html?idxno=11441","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-06-17","evidence_date":"2026-06-17","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"Following successful qualification, we have secured the initial supply order, officially validating our technology.","notes":"Cube Prober: 256 chips in parallel, -40C to 150C; Samsung already receiving systems; Micron qualification units delivered","used_by":7,"verification_status":"captured"},{"id":"SRC-000303","legacy_id":"S0303","entity_type":"source","title":"TSE Develops Next-Generation HBM Test Handler That Doubles Inspection Throughput","publisher":"The Elec","source_type":"Industry publication","source_url":"https://www.thelec.net/news/articleView.html?idxno=11502","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026","evidence_date":"2026","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"(title) TSE Develops Next-Generation HBM Test Handler That Doubles Inspection Throughput","notes":"Title-level evidence","used_by":1,"verification_status":"captured"},{"id":"SRC-000304","legacy_id":"S0304","entity_type":"source","title":"TechWing IR Book - Leader in providing semiconductor test and inspection solutions","publisher":"TechWing (KRX KIND)","source_type":"Investor presentation","source_url":"https://kind.krx.co.kr/external/dst/irReference/17957/TechWing%20IR%20Book.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) TechWing IR Book - Leader in providing semiconductor test and inspection solutions","notes":"Title-level evidence","used_by":1,"verification_status":"captured"},{"id":"SRC-000305","legacy_id":"S0305","entity_type":"source","title":"Semiconductor Assembly and Test - Tata Electronics","publisher":"Tata Electronics Pvt Ltd","source_type":"Official website","source_url":"https://www.tataelectronics.com/semiconductor-assembly-and-test","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"Jagiroad, Assam ... USD 3 Bn+ investment ... Wire Bond; Integrated System Packaging (ISP); Flip Chip; Wafer-Level Packaging","notes":"Vemgal, Karnataka operational since Dec 2023; 171-acre Jagiroad campus","used_by":0,"verification_status":"captured"},{"id":"SRC-000306","legacy_id":"S0306","entity_type":"source","title":"Made in India chips soon: CG Power opens first semiconductor OSAT plant in Sanand","publisher":"BusinessToday","source_type":"Industry publication","source_url":"https://www.businesstoday.in/tech-today/news/story/cg-semi-launches-indias-first-osat-facility-sanand-7600-crore-investment-491522-2025-08-28","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-08-28","evidence_date":"2025-08-28","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"(title) Made in India chips soon: CG Power opens first semiconductor OSAT plant in Sanand","notes":"URL slug: Rs 7,600 crore investment","used_by":0,"verification_status":"captured"},{"id":"SRC-000307","legacy_id":"S0307","entity_type":"source","title":"OSAT Project by CG Semi - Gujarat State Electronics Mission","publisher":"Government of Gujarat","source_type":"Government source","source_url":"https://gsem.gujarat.gov.in/Home/OSATProjectbyCGSemi","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":false,"access_mode":"not_accessible","access_note":"Access blocked or not accessible at capture; not bypassed","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"robots.txt fetch timeout; not bypassed","used_by":0,"verification_status":"not_accessible"},{"id":"SRC-000308","legacy_id":"S0308","entity_type":"source","title":"CG Semi Starts Overseas Shipments from Gujarat OSAT Facility","publisher":"Electronics For You","source_type":"Industry publication","source_url":"https://www.electronicsforyou.biz/industry-buzz/cg-semi-starts-overseas-shipments-from-gujarat-osat-facility/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026","evidence_date":"2026","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"(title) CG Semi Starts Overseas Shipments from Gujarat OSAT Facility","notes":"Title-level evidence","used_by":0,"verification_status":"captured"},{"id":"SRC-000309","legacy_id":"S0309","entity_type":"source","title":"Chroma ATE's SoC/Analog Test System Wins 2025 Taiwan Excellence Award","publisher":"Chroma ATE Inc.","source_type":"Press release (company)","source_url":"https://www.chromaate.com/en/newsroom/news946","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025","evidence_date":"2025","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"(title) Chroma ATE's SoC/Analog Test System Wins 2025 Taiwan Excellence Award","notes":"Title-level evidence","used_by":1,"verification_status":"captured"},{"id":"SRC-000310","legacy_id":"S0310","entity_type":"source","title":"Probe Cards - Design and Manufacturing | FormFactor, Inc.","publisher":"FormFactor Inc.","source_type":"Product page","source_url":"https://www.formfactor.com/products/probe-cards/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Probe Cards - Design and Manufacturing | FormFactor, Inc.","notes":"Title-level evidence","used_by":1,"verification_status":"captured"},{"id":"SRC-000311","legacy_id":"S0311","entity_type":"source","title":"MPI Probe Card - Leading the Way in Semiconductor Testing","publisher":"MPI Corporation","source_type":"Product page","source_url":"https://www.mpi-corporation.com/probecard/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) MPI Probe Card - Leading the Way in Semiconductor Testing","notes":"Title-level evidence","used_by":1,"verification_status":"captured"},{"id":"SRC-000312","legacy_id":"S0312","entity_type":"source","title":"Probe Card | Cohu","publisher":"Cohu Inc.","source_type":"Product page","source_url":"https://www.cohu.com/interface-solutions/probe-card/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Probe Card | Cohu","notes":"Title-level evidence","used_by":1,"verification_status":"captured"},{"id":"SRC-000313","legacy_id":"S0313","entity_type":"source","title":"ACM Research Reports Fourth Quarter and Fiscal Year 2025 Results","publisher":"ACM Research","source_type":"Press release (company)","source_url":"https://ir.acmr.com/news-releases/news-release-details/acm-research-reports-fourth-quarter-and-fiscal-year-2025-results","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-02-26","evidence_date":"2026-02-26","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"We delivered record annual revenue of $901 million, up 15% year over year","notes":"FY2025 revenue $901.3M; GAAP NI attributable $94.1M; GM 44.4%; R&D $145.0M; 2026 outlook $1.08-1.175B; cleaning, ECP, furnace, track, PECVD, WLP/PLP","used_by":5,"verification_status":"captured"},{"id":"SRC-000314","legacy_id":"S0314","entity_type":"source","title":"Piotech: 2025 net profit RMB 927M, +34.67%","publisher":"Yicai","source_type":"Industry publication","source_url":"https://www.yicai.com/news/103155699.html","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-04","evidence_date":"2026-04","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"2025年实现营业收入65.19亿元，同比增长58.87% ... 归母净利润9.27亿元","notes":"PECVD revenue ~RMB 5.142B (+75.27%); ALD ~RMB 0.301B; hybrid bonding RMB 0.136B","used_by":8,"verification_status":"captured"},{"id":"SRC-000315","legacy_id":"S0315","entity_type":"source","title":"Hwatsing 2025 net profit attributable +5.9% to RMB 1.08B","publisher":"Sina Finance","source_type":"Industry publication","source_url":"https://finance.sina.com.cn/stock/zqgd/2026-04-23/doc-inhvmvzq3871681.shtml","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-04-23","evidence_date":"2026-04-23","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"(headline) 华海清科2025年归母净利润增长5.9%至10.8亿元","notes":null,"used_by":2,"verification_status":"captured"},{"id":"SRC-000316","legacy_id":"S0316","entity_type":"source","title":"Hwatsing: 2025 revenue RMB 4.648B, +36.46%","publisher":"Securities Market Weekly (AI flash)","source_type":"Industry publication","source_url":"https://static.weeklyonstock.com/26/0422/AB2621395322843.html","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":"2026-04-22","evidence_date":"2026-04-22","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"(headline) 华海清科：2025年营业收入46.48亿元 同比增长36.46%","notes":"Tier 3 (AI-generated flash) - revenue figure needs Tier-1 annual report confirmation","used_by":2,"verification_status":"captured"},{"id":"SRC-000317","legacy_id":"S0317","entity_type":"source","title":"Nikon Releases the NSR-S636E ArF Immersion Scanner","publisher":"Nikon Corporation","source_type":"Press release (company)","source_url":"https://www.nikon.com/company/news/2023/1206_01.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2023-12-06","evidence_date":"2023-12-06","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"VERY_STALE","freshness":"Stale","excerpt":"(title) Nikon Releases the NSR-S636E ArF Immersion Scanner","notes":"Title-level evidence","used_by":2,"verification_status":"captured"},{"id":"SRC-000318","legacy_id":"S0318","entity_type":"source","title":"NSR-S625E (ArF immersion scanner)","publisher":"Nikon Precision","source_type":"Product page","source_url":"https://www.nikonprecision.com/products-and-technology/immersion-and-multiple-patterning/nsr-s625e-2/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) NSR-S625E (ArF immersion scanner)","notes":"Title-level evidence","used_by":2,"verification_status":"captured"},{"id":"SRC-000319","legacy_id":"S0319","entity_type":"source","title":"Semiconductor Manufacturing Equipment : Hitachi High-Tech","publisher":"Hitachi High-Tech Corporation","source_type":"Product page","source_url":"https://www.hitachi-hightech.com/us/en/products/semiconductor-manufacturing/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Semiconductor Manufacturing Equipment : Hitachi High-Tech","notes":"CD-SEM & Defect Inspection page also indexed","used_by":1,"verification_status":"captured"},{"id":"SRC-000320","legacy_id":"S0320","entity_type":"source","title":"Products & Services | KOKUSAI ELECTRIC CORPORATION","publisher":"Kokusai Electric Corporation","source_type":"Product page","source_url":"https://www.kokusai-electric.com/en/products","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Products & Services | KOKUSAI ELECTRIC CORPORATION","notes":"Title-level evidence","used_by":1,"verification_status":"captured"},{"id":"SRC-000321","legacy_id":"S0321","entity_type":"source","title":"Semiconductor manufacturing equipment market | EBARA CORPORATION","publisher":"Ebara Corporation","source_type":"Product page","source_url":"https://www.ebara.com/global-en/precision/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Semiconductor manufacturing equipment market | EBARA CORPORATION","notes":"Dry vacuum pump page; 2025-12-17 new dry pump + plasma abatement release","used_by":1,"verification_status":"captured"},{"id":"SRC-000322","legacy_id":"S0322","entity_type":"source","title":"ACTIS A300 Series | Lasertec Corporation","publisher":"Lasertec Corporation","source_type":"Product page","source_url":"https://www.lasertec.co.jp/en/products/semiconductor/actis_a300.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) ACTIS A300 Series | Lasertec Corporation","notes":"ACTIS A200HiT release 2025-10-31","used_by":2,"verification_status":"captured"},{"id":"SRC-000323","legacy_id":"S0323","entity_type":"source","title":"Multi-EB Mask Writer MBM-2000PLUS | NuFlare Technology","publisher":"NuFlare Technology Inc.","source_type":"Product page","source_url":"https://www.nuflare.co.jp/english/products/beam/mbm_2000plus/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Multi-EB Mask Writer MBM-2000PLUS | NuFlare Technology","notes":"Title-level evidence","used_by":2,"verification_status":"captured"},{"id":"SRC-000324","legacy_id":"S0324","entity_type":"source","title":"Die bonding solutions - MRSI Systems (Mycronic)","publisher":"Mycronic AB","source_type":"Product page","source_url":"https://www.mycronic.com/product-areas/die-bonding/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Die bonding solutions - MRSI Systems (Mycronic)","notes":"Photomask equipment product area also indexed","used_by":2,"verification_status":"captured"},{"id":"SRC-000325","legacy_id":"S0325","entity_type":"source","title":"Mycronic receives order for three mask writers","publisher":"Mycronic AB","source_type":"Press release (company)","source_url":"https://www.mycronic.com/news-events/our-press-releases/mycronic-receives-order-for-three-mask-writers/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Mycronic receives order for three mask writers","notes":"Title-level evidence","used_by":1,"verification_status":"captured"},{"id":"SRC-000326","legacy_id":"S0326","entity_type":"source","title":"Gigaphoton Delivers Excimer Laser to the United States for Micro Via Processing","publisher":"Gigaphoton Inc.","source_type":"Press release (company)","source_url":"https://www.gigaphoton.com/news/9221","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2024-11-07","evidence_date":"2024-11-07","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"STALE","freshness":"Stale","excerpt":"(title) Gigaphoton Delivers Excimer Laser to the United States for Micro Via Processing","notes":"Also: excimer laser for advanced packaging installed at Japanese company (news/9722); GT62A ArF source","used_by":3,"verification_status":"captured"},{"id":"SRC-000327","legacy_id":"S0327","entity_type":"source","title":"High-NA-EUV lithography: New technology for global microchip production","publisher":"Carl Zeiss SMT","source_type":"Press release (company)","source_url":"https://www.zeiss.com/semiconductor-manufacturing-technology/news-and-events/smt-press-releases/2024/high-na-euv-lithography.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2024","evidence_date":"2024","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"VERY_STALE","freshness":"Stale","excerpt":"(title) High-NA-EUV lithography: New technology for global microchip production","notes":"Title-level evidence","used_by":2,"verification_status":"captured"},{"id":"SRC-000328","legacy_id":"S0328","entity_type":"source","title":"AIX G5+ C: Deposition System for Compound Semiconductors","publisher":"AIXTRON SE","source_type":"Product page","source_url":"https://www.aixtron.com/en/products/compound-semiconductors-mocvd/aix-g5-c","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) AIX G5+ C: Deposition System for Compound Semiconductors","notes":"G10-GaN and G10-SiC product pages also indexed","used_by":2,"verification_status":"captured"},{"id":"SRC-000329","legacy_id":"S0329","entity_type":"source","title":"Technoprobe | World leader in advanced probing solutions","publisher":"Technoprobe S.p.A.","source_type":"Official website","source_url":"https://www.technoprobe.com/company/who-we-are/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Technoprobe | World leader in advanced probing solutions","notes":"Self-description; Euronext Milan listing per Euronext press release","used_by":1,"verification_status":"captured"},{"id":"SRC-000330","legacy_id":"S0330","entity_type":"source","title":"Process Solutions for Device Manufacturing - Oxford Instruments","publisher":"Oxford Instruments Plasma Technology","source_type":"Product page","source_url":"https://plasma.oxinst.com/home/production","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Process Solutions for Device Manufacturing - Oxford Instruments","notes":"Title-level evidence","used_by":1,"verification_status":"captured"},{"id":"SRC-000331","legacy_id":"S0331","entity_type":"source","title":"ViTrox Corporation Berhad: Global AI Machine Vision Inspection Leader","publisher":"ViTrox Corporation Berhad","source_type":"Official website","source_url":"https://www.vitrox.com/company/background.php","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) ViTrox Corporation Berhad: Global AI Machine Vision Inspection Leader","notes":"Self-description; Wi8i G2 wafer vision inspection handler (SEMI press)","used_by":1,"verification_status":"captured"},{"id":"SRC-000332","legacy_id":"S0332","entity_type":"source","title":"Pentamaster Corporation Berhad","publisher":"Pentamaster Corporation Berhad","source_type":"Official website","source_url":"https://pentamaster.com/pentamaster-corporation-berhad/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Pentamaster Corporation Berhad","notes":"SEMICON SEA 2026 exhibitor (Pentamaster Technology (M) Sdn Bhd)","used_by":1,"verification_status":"captured"},{"id":"SRC-000333","legacy_id":"S0333","entity_type":"source","title":"Beneq launches Transform XP second-generation ALD platform","publisher":"Semiconductor Today","source_type":"Industry publication","source_url":"https://www.semiconductor-today.com/news_items/2025/nov/beneq2-241125.shtml","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-11-24","evidence_date":"2025-11-24","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"(title) Beneq launches Transform XP second-generation ALD platform","notes":"Title-level evidence","used_by":1,"verification_status":"captured"},{"id":"SRC-000334","legacy_id":"S0334","entity_type":"source","title":"Semiconductor Analysis | Semiconductor Metrology | Thermo Fisher Scientific","publisher":"Thermo Fisher Scientific","source_type":"Official website","source_url":"https://www.thermofisher.com/us/en/home/semiconductors.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Semiconductor Analysis | Semiconductor Metrology | Thermo Fisher Scientific","notes":"Brno (Czech Republic) site not confirmed in Batch 1","used_by":1,"verification_status":"captured"},{"id":"SRC-000335","legacy_id":"S0335","entity_type":"source","title":"Ultra Clean Holdings - Products (chemical and gas delivery)","publisher":"Ultra Clean Holdings","source_type":"Product page","source_url":"https://www.uct.com/products/chemical-and-gas-delivery/default.aspx","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Ultra Clean Holdings - Products (chemical and gas delivery)","notes":"Title-level evidence","used_by":1,"verification_status":"captured"},{"id":"SRC-000336","legacy_id":"S0336","entity_type":"source","title":"Semiconductor Gas Delivery Systems and Components | Ichor","publisher":"Ichor Systems","source_type":"Product page","source_url":"https://www.ichorsystems.com/gas-delivery-systems","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) Semiconductor Gas Delivery Systems and Components | Ichor","notes":"Title-level evidence","used_by":1,"verification_status":"captured"},{"id":"SRC-000337","legacy_id":"S0337","entity_type":"source","title":"Applied Materials, Lam Research Pledge Billions for India Chip Industry","publisher":"MarketScreener","source_type":"Industry publication","source_url":"https://www.marketscreener.com/news/applied-materials-lam-research-pledge-billions-for-india-chip-industry-ce785bd3da8df723","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-09","evidence_date":"2026-09","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"CURRENT","freshness":"Recent","excerpt":"(title) Applied Materials, Lam Research Pledge Billions for India Chip Industry","notes":"Title-level evidence","used_by":1,"verification_status":"captured"},{"id":"SRC-000338","legacy_id":"S0338","entity_type":"source","title":"Tata Electronics Begins Production at $2.83 Billion India Chip Plant Targeting 48 Million Chips Daily","publisher":"Techloy","source_type":"Blog/aggregator","source_url":"https://www.techloy.com/tata-electronics-begins-production-at-2-83-billion-india-chip-plant-targeting-48-million-chips-daily/","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":"2026","evidence_date":"2026","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"(title) Tata Electronics Begins Production at $2.83 Billion India Chip Plant Targeting 48 Million Chips Daily","notes":"Tier 4 - conflicts with Tata page ('USD 3 Bn+'); not used as confirmation","used_by":0,"verification_status":"unverified_source"},{"id":"SRC-000339","legacy_id":"S0339","entity_type":"source","title":"KOKUSAI ELECTRIC's Strengths","publisher":"Kokusai Electric Corporation","source_type":"Official website","source_url":"https://www.kokusai-electric.com/en/company/strength","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) KOKUSAI ELECTRIC's Strengths","notes":"Title-level evidence","used_by":1,"verification_status":"captured"},{"id":"SRC-000340","legacy_id":"S0340","entity_type":"source","title":"MRSI Systems MRSI-705 - 5-Micron Die Bonder","publisher":"Mycronic AB","source_type":"Product page","source_url":"https://www.mycronic.com/product-areas/die-bonding/products/high-precision-flip-chip-die-bonders/5-micron-die-bonders/mrsi-705/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) MRSI Systems MRSI-705 - 5-Micron Die Bonder","notes":"Title-level evidence","used_by":1,"verification_status":"captured"},{"id":"SRC-000341","legacy_id":"S0341","entity_type":"source","title":"MRSI-H Family, Flexible, High Speed, High Precision Die Bonders (1.5-micron)","publisher":"Mycronic AB","source_type":"Product page","source_url":"https://www.mycronic.com/product-areas/die-bonding/products/high-precision-flip-chip-die-bonders/1.5-micron-die-bonders/mrsi-h/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) MRSI-H Family, Flexible, High Speed, High Precision Die Bonders (1.5-micron)","notes":"Title-level evidence","used_by":1,"verification_status":"captured"},{"id":"SRC-000342","legacy_id":"S0342","entity_type":"source","title":"TruMicro Series 2000 | TRUMPF","publisher":"TRUMPF","source_type":"Product page","source_url":"https://www.trumpf.com/en_US/products/lasers/beam-sources/ultrashort-pulse-laser/trumicro-series-2000/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) TruMicro Series 2000 | TRUMPF","notes":"Title-level evidence","used_by":1,"verification_status":"captured"},{"id":"SRC-000343","legacy_id":"S0343","entity_type":"source","title":"TruMicro Mark - ultrashort pulse all-rounder for cold marking and microprocessing","publisher":"TRUMPF","source_type":"Product page","source_url":"https://www.trumpf.com/en_INT/products/lasers/beam-sources/ultrashort-pulse-laser/trumicro-mark/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) TruMicro Mark - ultrashort pulse all-rounder for cold marking and microprocessing","notes":"Title-level evidence","used_by":1,"verification_status":"captured"},{"id":"SRC-000344","legacy_id":"S0344","entity_type":"source","title":"G10-GaN | AIXTRON","publisher":"AIXTRON SE","source_type":"Product page","source_url":"https://www.aixtron.com/en/products/compound-semiconductors-mocvd/g10-gan","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) G10-GaN | AIXTRON","notes":"Title-level evidence","used_by":1,"verification_status":"captured"},{"id":"SRC-000345","legacy_id":"S0345","entity_type":"source","title":"Lasertec Releases ACTIS A200HiT Series Actinic EUV Patterned Mask Inspection System","publisher":"Lasertec Corporation","source_type":"Press release (company)","source_url":"https://www.lasertec.co.jp/en/news/2025/20251031_3912.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025-10-31","evidence_date":"2025-10-31","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"(title) Lasertec Releases ACTIS A200HiT Series Actinic EUV Patterned Mask Inspection System","notes":"Title-level evidence","used_by":1,"verification_status":"captured"},{"id":"SRC-000346","legacy_id":"S0346","entity_type":"source","title":"EBARA Launches New Dry Vacuum Pump and Plasma Abatement System","publisher":"Ebara Corporation","source_type":"Press release (company)","source_url":"https://www.ebara.com/global-en/newsroom/2025/20251217-01/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025-12-17","evidence_date":"2025-12-17","accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"AGING","freshness":"Needs Review","excerpt":"(title) EBARA Launches New Dry Vacuum Pump and Plasma Abatement System","notes":"Title-level evidence","used_by":1,"verification_status":"captured"},{"id":"SRC-000347","legacy_id":"S0347","entity_type":"source","title":"CD-SEM & Defect Inspection : Hitachi High-Tech","publisher":"Hitachi High-Tech Corporation","source_type":"Product page","source_url":"https://www.hitachi-hightech.com/us/en/products/semiconductor-manufacturing/cd-sem/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) CD-SEM & Defect Inspection : Hitachi High-Tech","notes":"Title-level evidence","used_by":0,"verification_status":"captured"},{"id":"SRC-000348","legacy_id":"S0348","entity_type":"source","title":"GT62A | Gigaphoton","publisher":"Gigaphoton Inc.","source_type":"Product page","source_url":"https://www.gigaphoton.com/products/8004","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) GT62A | Gigaphoton","notes":"Title-level evidence","used_by":2,"verification_status":"captured"},{"id":"SRC-000349","legacy_id":"S0349","entity_type":"source","title":"NSR-S636E ArF immersion scanner","publisher":"Nikon Precision","source_type":"Product page","source_url":"https://www.nikonprecision.com/products-and-technology/immersion-and-multiple-patterning/nsr-s636e/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-29","accessible":true,"access_mode":"read","access_note":null,"age_class":"UNDATED","freshness":"Unknown","excerpt":"(title) NSR-S636E ArF immersion scanner","notes":"Title-level evidence","used_by":1,"verification_status":"captured"},{"id":"SRC-000910","legacy_id":"S0910","entity_type":"source","title":"A clean dry air system is key for semiconductor production (FABs) — Atlas Copco","publisher":"Atlas Copco","source_type":"Company website","source_url":"https://www.atlascopco.com/en-us/compressors/air-compressor-blog/build-cda-clean-dry-air-system-semiconductor","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000911","legacy_id":"S0911","entity_type":"source","title":"Clean dry air for semiconductors (Atlas Copco India)","publisher":"Atlas Copco","source_type":"Product page","source_url":"https://www.atlascopco.com/en-in/compressors/r-e","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000912","legacy_id":"S0912","entity_type":"source","title":"Semiconductor industry (DAS Environmental Experts)","publisher":"DAS Environmental Expert","source_type":"Company website","source_url":"https://www.das-ee.com/industries/semiconductor-industry/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000913","legacy_id":"S0913","entity_type":"source","title":"Our Portfolio for Waste Gas Treatment at the Point of Use (DAS)","publisher":"DAS Environmental Expert","source_type":"Product page","source_url":"https://www.das-ee.com/waste-gas-treatment/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000914","legacy_id":"S0914","entity_type":"source","title":"Semistar Series Wafer Handling Robots (Yaskawa)","publisher":"Yaskawa","source_type":"Product page","source_url":"https://yaskawa.co.il/en/product/semistar_series_wafer-handling-robots","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000915","legacy_id":"S0915","entity_type":"source","title":"Semiconductor (Yaskawa Europe)","publisher":"Yaskawa","source_type":"Company website","source_url":"https://www.yaskawa.de/semiconductor_i19766","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000916","legacy_id":"S0916","entity_type":"source","title":"Proven connectivity excellence (PDF Solutions / Cimetrix)","publisher":"PDF Solutions","source_type":"Company website","source_url":"https://www.pdf.com/proven-connectivity-excellence/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000917","legacy_id":"S0917","entity_type":"source","title":"Software to Implement GEM (SECS/GEM) Communication (Cimetrix)","publisher":"Cimetrix","source_type":"Product page","source_url":"https://cimetrix.com/CIMConnect","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000918","legacy_id":"S0918","entity_type":"source","title":"New FabGuard Integrates and Analyzes Process Data to Maximize Productivity","publisher":"INFICON","source_type":"Press release (company)","source_url":"https://www.inficon.com/en/news/new-fabguard-integrates-and-analyzes-process-data-to-maximize-productivity","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000919","legacy_id":"S0919","entity_type":"source","title":"FDC Semiconductor Software (INFICON)","publisher":"INFICON","source_type":"Product page","source_url":"https://www.inficon.com/en/fdc-semiconductor-software-1","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000920","legacy_id":"S0920","entity_type":"source","title":"Synus Tech (SEMI member directory)","publisher":"SEMI","source_type":"Trade association directory","source_url":"https://www.semi.org/en/resources/member-directory/synus-tech","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000921","legacy_id":"S0921","entity_type":"source","title":"V TECHNOLOGY CO., LTD (SEMI member directory)","publisher":"SEMI","source_type":"Trade association directory","source_url":"https://www.semi.org/en/resources/member-directory/v-technology-co-ltd","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000922","legacy_id":"S0922","entity_type":"source","title":"Korean Equipment Maker Charm Engineering to Adds Micro LED Business","publisher":"LEDinside","source_type":"Industry news","source_url":"https://ledinside.com/news/2026/06/korean_equipment_maker_charm_engineering_microled_business","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":"2026-06","evidence_date":"2026-06","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"CURRENT","freshness":"Recent","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000923","legacy_id":"S0923","entity_type":"source","title":"Wafer transportation system — front end (OMRON Industrial Automation)","publisher":"Omron","source_type":"Company website","source_url":"https://industrial.omron.eu/en/industries/semiconductor-manufacturing/front-end-semiconductor-manufacturing/wafer-transportation-front-end/wafer-transportation-system-front-end","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000924","legacy_id":"S0924","entity_type":"source","title":"Transportation system — back end (OMRON Industrial Automation)","publisher":"Omron","source_type":"Company website","source_url":"https://industrial.omron.eu/en/industries/semiconductor-manufacturing/back-end-semiconductor-manufacturing/transportation-system-back-end","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000925","legacy_id":"S0925","entity_type":"source","title":"Delivery Systems (EMD Electronics)","publisher":"EMD Electronics","source_type":"Company website","source_url":"https://www.emdgroup.com/en/expertise/electronics/technologies/delivery-systems-and-services/delivery-systems.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000926","legacy_id":"S0926","entity_type":"source","title":"SPEED Product Family - Lam Research","publisher":"Lam Research","source_type":"Product page","source_url":"https://www.lamresearch.com/product/speed-product-family/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000927","legacy_id":"S0927","entity_type":"source","title":"ALTUS Product Family - Lam Research","publisher":"Lam Research","source_type":"Product page","source_url":"https://www.lamresearch.com/product/altus-product-family/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000928","legacy_id":"S0928","entity_type":"source","title":"Striker Product Family - Lam Research","publisher":"Lam Research","source_type":"Product page","source_url":"https://www.lamresearch.com/product/striker-product-family/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000929","legacy_id":"S0929","entity_type":"source","title":"VECTOR Product Family - Lam Research","publisher":"Lam Research","source_type":"Product page","source_url":"https://www.lamresearch.com/product/vector-product-family/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000930","legacy_id":"S0930","entity_type":"source","title":"Flex Product Family - Lam Research","publisher":"Lam Research","source_type":"Product page","source_url":"https://www.lamresearch.com/product/flex-product-family/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000931","legacy_id":"S0931","entity_type":"source","title":"Reliant Etch Products - Lam Research","publisher":"Lam Research","source_type":"Product page","source_url":"https://www.lamresearch.com/product/reliant-etch-products/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000932","legacy_id":"S0932","entity_type":"source","title":"Centris® Sym3® Etch","publisher":"Applied Materials","source_type":"Product page","source_url":"https://www.appliedmaterials.com/us/en/semiconductor/products/semiconductor-products/centris-sym3-etch.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000933","legacy_id":"S0933","entity_type":"source","title":"应用材料推出Applied Producer eHARP系统","publisher":"news.hqew.com","source_type":"Industry news","source_url":"https://news.hqew.com/info-151336","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000934","legacy_id":"S0934","entity_type":"source","title":"Applied Materials Accelerates Chip Defect Review with Next-Gen eBeam System","publisher":"Applied Materials","source_type":"Press release (company)","source_url":"https://ir.appliedmaterials.com/news-releases/news-release-details/applied-materials-accelerates-chip-defect-review-next-gen-ebeam","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025-02-19","evidence_date":"2025-02-19","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000935","legacy_id":"S0935","entity_type":"source","title":"TWINSCAN NXT:2100i","publisher":"ASML Holding","source_type":"Product page","source_url":"https://www.asml.com/en/products/duv-lithography-systems/twinscan-nxt2100i","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000936","legacy_id":"S0936","entity_type":"source","title":"TWINSCAN NXT:2150i","publisher":"ASML Holding","source_type":"Product page","source_url":"https://www.asml.com/en/products/duv-lithography-systems/twinscan-nxt-2150i","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000937","legacy_id":"S0937","entity_type":"source","title":"ASML TWINSCAN NXT:2000i DUV lithography machine","publisher":"ASML Holding","source_type":"Product page","source_url":"https://www.asml.com/en/products/duv-lithography-systems/twinscan-nxt2000i","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000938","legacy_id":"S0938","entity_type":"source","title":"HMI eScan 1100","publisher":"ASML Holding","source_type":"Product page","source_url":"https://www.asml.com/en/products/metrology-and-inspection-systems/hmi-escan-1100","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000939","legacy_id":"S0939","entity_type":"source","title":"HMI eScan 1000","publisher":"ASML Holding","source_type":"Product page","source_url":"https://www.asml.com/en/products/metrology-and-inspection-systems/hmi-escan-1000","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000940","legacy_id":"S0940","entity_type":"source","title":"hmi escan 600","publisher":"ASML Holding","source_type":"Product page","source_url":"https://www.asml.com/products/metrology-and-inspection-systems/hmi-escan-600","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000941","legacy_id":"S0941","entity_type":"source","title":"HMI eScan 430","publisher":"ASML Holding","source_type":"Product page","source_url":"https://www.asml.com/en/products/metrology-and-inspection-systems/hmi-escan-430","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000942","legacy_id":"S0942","entity_type":"source","title":"Tokyo Electron Launches Single Wafer Deposition Systems Episode™ 1 and Episode™ 2 DMR, Announces Planned Release of Episode™ 2 QMR","publisher":"Tokyo Electron (TEL)","source_type":"Press release (company)","source_url":"https://www.tel.com/news/product/2024/20240708_001.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2024-07-08","evidence_date":"2024-07-08","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000943","legacy_id":"S0943","entity_type":"source","title":"Tokyo Electron Introduces Tactras™-UDEMAE™, the Etch System for 300mm Power Devices","publisher":"Tokyo Electron (TEL)","source_type":"Press release (company)","source_url":"https://www.tel.com/news/product/2021/20211214_001.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2021-12-14","evidence_date":"2021-12-14","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000944","legacy_id":"S0944","entity_type":"source","title":"Etch Certas™ Series","publisher":"Tokyo Electron (TEL)","source_type":"Product page","source_url":"https://www.tel.com/product/certas_leaga.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000945","legacy_id":"S0945","entity_type":"source","title":"Multi-beam mask writer MBM-3000 for next-generation EUV","publisher":"remotesensing.spiedigitallibrary.org","source_type":"Conference paper (company site)","source_url":"https://remotesensing.spiedigitallibrary.org/conference-proceedings-of-spie/12751/127510X/Multi-beam-mask-writer-MBM-3000-for-next-generation-EUV/10.1117/12.2687415.full","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2023","evidence_date":"2023","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000946","legacy_id":"S0946","entity_type":"source","title":"Carl Zeiss Ships First PROVE System","publisher":"photonics.com","source_type":"Industry news","source_url":"https://www.photonics.com/Article.aspx?AID=44226","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":"2010-09","evidence_date":"2010-09","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"VERY_STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000947","legacy_id":"S0947","entity_type":"source","title":"GEMINI® FB","publisher":"EV Group (EVG)","source_type":"Product page","source_url":"https://www.evgroup.com/products/bonding/die-to-wafer-bonding-systems/gemini-fb-d2w","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000948","legacy_id":"S0948","entity_type":"source","title":"Leti Demonstrates World’s First 300 mm Wafer-to-wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group System","publisher":"EV Group (EVG)","source_type":"Press release (company)","source_url":"https://evgroup.com/company/news/detail/leti-demonstrates-world-s-first-300-mm-wafer-to-wafer-direct-hybrid-bonding-with-1-micron-pitch-on-ev-group-system-1556468468","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000949","legacy_id":"S0949","entity_type":"source","title":"datacon 8800 chameo ultra plus ac","publisher":"BE Semiconductor Industries (BESI)","source_type":"Product page","source_url":"https://www.besi.com/products-technology/product-details/product/datacon-8800-chameo-ultra-plus-ac/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000950","legacy_id":"S0950","entity_type":"source","title":"XBC300 Gen2 D2W/W2W","publisher":"SUSS MicroTec","source_type":"Product page","source_url":"https://suss.com/en/products-solutions/wafer-bonder/xbc300-gen2-d2w-w2w","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000951","legacy_id":"S0951","entity_type":"source","title":"Kulicke & Soffa and Rohinni Launch Micro and Mini LED Solution PIXALUX","publisher":"ledinside.com","source_type":"Industry news","source_url":"https://www.ledinside.com/node/view/29643","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000952","legacy_id":"S0952","entity_type":"source","title":"YES ships first VeroTherm formic acid reflow tool to chipmaker","publisher":"evertiq.com","source_type":"Industry news","source_url":"https://evertiq.com/news/2025-03-27-yes-ships-first-verotherm-formic-acid-reflow-tool-to-chipmaker","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":"2025-03-27","evidence_date":"2025-03-27","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000953","legacy_id":"S0953","entity_type":"source","title":"CHEMGUARD® GEN III BCD 100-200 Bulk Automated Chemical Delivery Systems","publisher":"Merck Electronics (EMD Electronics)","source_type":"Product page","source_url":"https://www.emdgroup.com/en/expertise/semiconductors/offering/chemguard-gen-iii-bcd-100-200.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000954","legacy_id":"S0954","entity_type":"source","title":"CHEMGUARD® GENIII 100-426 Series Automated Chemical Delivery Systems","publisher":"Merck Electronics (EMD Electronics)","source_type":"Product page","source_url":"https://www.emdgroup.com/en/expertise/semiconductors/offering/chemguard-geniii-100-426.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000955","legacy_id":"S0955","entity_type":"source","title":"Bulk chemical distribution systems (Air Liquide Electronics Systems)","publisher":"Air Liquide (Electronics)","source_type":"Product page","source_url":"https://ales.airliquide.com/bulk-chemical-distribution-systems","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000956","legacy_id":"S0956","entity_type":"source","title":"Semistar Gekko MD124D","publisher":"Yaskawa Electric (Semiconductor robotics)","source_type":"Product page","source_url":"https://yaskawa.co.il/en/product/semistar-gekko-md124d","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000957","legacy_id":"S0957","entity_type":"source","title":"World’s First Point-of-Use Abatement of Harmful Gases in Wet Bench Semiconductor Processes","publisher":"siliconsemiconductor.net","source_type":"Industry news","source_url":"https://siliconsemiconductor.net/article/78452/World's_First_Point-of-Use_Abatement_of_Harmful_Gases_in_Wet_Bench_Semiconductor_Processes","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-10","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000958","legacy_id":"S0958","entity_type":"source","title":"Cabinet approves semiconductor manufacturing units in Odisha, Punjab and Andhra Pradesh with an outlay of Rs 4,600 crore","publisher":"Prime Minister's Office (pmindia.gov.in)","source_type":"Government press release","source_url":"https://www.pmindia.gov.in/en/news_updates/cabinet-approves-semiconductor-manufacturing-units-in-odisha-punjab-and-andhra-pradesh-with-an-outlay-of-rs-4600-crore","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025-08-12","evidence_date":"2025-08-12","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-11 (facilities)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000959","legacy_id":"S0959","entity_type":"source","title":"Cabinet approves two more semiconductor manufacturing units with cumulative investment of more than Rs. 3,900 crore","publisher":"Prime Minister's Office (pmindia.gov.in)","source_type":"Government press release","source_url":"https://www.pmindia.gov.in/en/news_updates/cabinet-approves-two-more-semiconductor-manufacturing-units-with-cumulative-investment-of-more-than-rs-3900-crore/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-05-06","evidence_date":"2026-05-06","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"CURRENT","freshness":"Recent","excerpt":null,"notes":"Imported batch-11 (facilities)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000960","legacy_id":"S0960","entity_type":"source","title":"Cabinet approves one more semiconductor unit under India Semiconductor Mission (ISM)","publisher":"Prime Minister's Office (pmindia.gov.in)","source_type":"Government press release","source_url":"https://www.pmindia.gov.in/en/news_updates/cabinet-approves-one-more-semiconductor-unit-under-india-semiconductor-mission-ism/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2024-09-02","evidence_date":"2024-09-02","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-11 (facilities)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000961","legacy_id":"S0961","entity_type":"source","title":"PM to participate in 'India's Techade: Chips for Viksit Bharat' and lay the foundation stone of three semiconductor facilities worth about Rs 1.25 lakh crore on 13th March","publisher":"Prime Minister's Office (pmindia.gov.in)","source_type":"Government press release","source_url":"https://www.pmindia.gov.in/en/news_updates/pm-to-participate-in-indias-techade-chips-for-viksit-bharat-and-lay-the-foundation-stone-of-three-semiconductor-facilities-worth-about-rs-1-25-lakh-crore-on-13th-march/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2024-03-12","evidence_date":"2024-03-12","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-11 (facilities)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000962","legacy_id":"S0962","entity_type":"source","title":"PM lays stone for 3 chip-making units in Gujarat, Assam; CM Himanta thanks Modi","publisher":"The Week","source_type":"Industry news","source_url":"https://www.theweek.in/news/india/2024/03/13/pm-lays-stone-for-3-chip-making-units-in-gujarat-assam-cm-himanta-thanks-modi.amp.html","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2024-03-13","evidence_date":"2024-03-13","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-11 (facilities)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000963","legacy_id":"S0963","entity_type":"source","title":"Cabinet approves Tata's Rs 1.18 lakh crore semiconductor fab and assembly plant proposals","publisher":"Outlook Business","source_type":"Industry news","source_url":"https://www.outlookbusiness.com/amp/story/news/cabinet-approves-tatas-rs-118-lakh-crore-semiconductor-fab-and-assembly-plant-proposals","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2024-02-29","evidence_date":"2024-02-29","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-11 (facilities)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000964","legacy_id":"S0964","entity_type":"source","title":"Cabinet approves 6th semiconductor unit to be set up near Jewar airport in UP","publisher":"All India Radio (newsonair.gov.in)","source_type":"Government news service","source_url":"https://www.newsonair.gov.in/cabinet-approves-6th-semiconductor-unit-to-be-set-up-near-jewar-airport-in-up","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025-05-14","evidence_date":"2025-05-14","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-11 (facilities)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000965","legacy_id":"S0965","entity_type":"source","title":"Centre Clears INR 3,706 Crore Semiconductor Plant in UP, HCL-Foxconn JV Gets the Nod","publisher":"Entrepreneur India","source_type":"Industry news","source_url":"https://india.entrepreneur.com/news-and-trends/centre-clears-inr-3706-crore-semiconductor-plant-in-up/491665","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-05","evidence_date":"2025-05","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-11 (facilities)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000966","legacy_id":"S0966","entity_type":"source","title":"Micron Set To Break Ground For Semiconductor Testing And Assembly Plant In Gujarat: Report","publisher":"Outlook Business","source_type":"Industry news","source_url":"https://www.outlookbusiness.com/corporate/micron-set-to-break-ground-for-semiconductor-testing-and-assembly-plant-in-gujarat-report","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2023","evidence_date":"2023","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-11 (facilities)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000967","legacy_id":"S0967","entity_type":"source","title":"Inside look at Micron's newly opened Sanand plant: 10% of global output, key products and clients","publisher":"TrendForce","source_type":"Industry news","source_url":"https://trendforce.com/news/2026/03/04/news-inside-look-at-microns-newly-opened-sanand-plant-10-of-global-output-key-products-and-clients/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-03-04","evidence_date":"2026-03-04","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"CURRENT","freshness":"Recent","excerpt":null,"notes":"Imported batch-11 (facilities)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000968","legacy_id":"S0968","entity_type":"source","title":"CG Semi unveils one of India's first end-to-end OSAT facilities in Gujarat","publisher":"IANS","source_type":"Industry news","source_url":"https://ianslive.in/cg-semi-unveils-one-of-indias-first-end-to-end-osat-facilities-in-gujarat--20250828191618","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-08-28","evidence_date":"2025-08-28","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-11 (facilities)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000969","legacy_id":"S0969","entity_type":"source","title":"ASIP breaks ground on $260 million OSAT facility in India","publisher":"Evertiq","source_type":"Industry news","source_url":"https://evertiq.com/news/2026-08-04-asip-breaks-ground-on-260-million-osat-facility-in-india","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-08-04","evidence_date":"2026-08-04","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"CURRENT","freshness":"Recent","excerpt":null,"notes":"Imported batch-11 (facilities)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000970","legacy_id":"S0970","entity_type":"source","title":"Modi Places Stone for South India's First Semiconductor Facility in Vizag","publisher":"Deccan Chronicle","source_type":"Industry news","source_url":"https://www.deccanchronicle.com/southern-states/andhra-pradesh/modi-places-stone-for-south-indias-first-semiconductor-facility-in-vizag-1975838","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-08","evidence_date":"2026-08","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"CURRENT","freshness":"Recent","excerpt":null,"notes":"Imported batch-11 (facilities)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000971","legacy_id":"S0971","entity_type":"source","title":"Government approves four new semiconductor projects under ISM with Rs. 4600 crore investment","publisher":"FoneArena","source_type":"Consumer tech blog","source_url":"https://www.fonearena.com/blog/461536/government-approves-rs-4600-crore-for-ism.html","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":"2025-08","evidence_date":"2025-08","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-11 (facilities)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000972","legacy_id":"S0972","entity_type":"source","title":"India's CDIL Semiconductors unveils country's first silicon carbide device production to meet EV and solar demands","publisher":"Swarajya","source_type":"Industry news","source_url":"https://swarajyamag.com/amp/story/infrastructure/indias-cdil-semiconductors-unveils-countrys-first-silicon-carbide-device-production-to-meet-ev-and-solar-demands","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-11 (facilities)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000973","legacy_id":"S0973","entity_type":"source","title":"Cabinet greenlights Rs 3,936-crore chip projects, India enters advanced micro-LED manufacturing","publisher":"The Statesman","source_type":"Industry news","source_url":"https://www.thestatesman.com/business/cabinet-greenlights-rs-3936-crore-chip-projects-india-enters-advanced-micro-led-manufacturing-1503590325.html","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-05","evidence_date":"2026-05","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"CURRENT","freshness":"Recent","excerpt":null,"notes":"Imported batch-11 (facilities)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000974","legacy_id":"S0974","entity_type":"source","title":"YES Pioneers Semiconductor Equipment Production in India (press release)","publisher":"Silicon UK (press release wire)","source_type":"Press release (company)","source_url":"https://www.silicon.co.uk/press-release/yes-pioneers-semiconductor-equipment-production-in-india","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-03","evidence_date":"2025-03","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-11 (facilities)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000975","legacy_id":"S0975","entity_type":"source","title":"Cabinet approves Semicon 2.0 with budget outlay of Rs 1.27 lakh crore","publisher":"Business Today","source_type":"Industry news","source_url":"https://www.businesstoday.in/latest/economy/story/cabinet-approves-semicon-2-with-budget-outlay-of-rs-1-27-lakh-crore-543132-2026-07-15","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-07-15","evidence_date":"2026-07-15","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"CURRENT","freshness":"Recent","excerpt":null,"notes":"Imported batch-11 (facilities)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000976","legacy_id":"S0976","entity_type":"source","title":"Cabinet approves Semicon 2.0 with a Rs 1.275 trillion budget outlay","publisher":"Indian Infrastructure","source_type":"Industry news","source_url":"https://indianinfrastructure.com/2026/07/16/cabinet-approves-semicon-2-0-with-a-rs-1-275-trillion-budget-outlay/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-07-16","evidence_date":"2026-07-16","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"CURRENT","freshness":"Recent","excerpt":null,"notes":"Imported batch-11 (facilities)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000977","legacy_id":"S0977","entity_type":"source","title":"TSMC Arizona Fab 21 already making 4nm chips","publisher":"Arizona Technology Council","source_type":"Industry news","source_url":"https://www.aztechcouncil.org/tsmc-arizona-fab21-already-making-4nm-chips/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-01","evidence_date":"2025-01","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-12 (global facilities)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000978","legacy_id":"S0978","entity_type":"source","title":"TSMC begins mass-producing chips at newly opened fab in Japan","publisher":"SiliconANGLE","source_type":"Industry news","source_url":"https://siliconangle.com/2024/12/27/tsmc-begins-mass-producing-chips-newly-opened-fab-japan/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2024-12-27","evidence_date":"2024-12-27","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-12 (global facilities)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000979","legacy_id":"S0979","entity_type":"source","title":"TSMC to build second factory in Japan","publisher":"Silicon UK","source_type":"Industry news","source_url":"https://www.silicon.co.uk/workspace/components/tsmc-to-build-second-factory-in-japan-549063/amp","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2024-02","evidence_date":"2024-02","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-12 (global facilities)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000980","legacy_id":"S0980","entity_type":"source","title":"ESMC breaks ground on €10 billion semiconductor fab in Dresden","publisher":"Converge Digest","source_type":"Industry news","source_url":"https://convergedigest.com/esmc-breaks-ground-on-e10-billion-semiconductor-fab-in-dresden/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2024-08-20","evidence_date":"2024-08-20","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-12 (global facilities)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000981","legacy_id":"S0981","entity_type":"source","title":"TSMC Dresden fab reportedly wraps structural build, eyes equipment move-in in 2H26","publisher":"TrendForce","source_type":"Industry news","source_url":"https://www.trendforce.com/news/2025/11/20/news-tsmc-dresden-fab-reportedly-wraps-structural-build-eyes-equipment-move-in-in-2h26/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-11-20","evidence_date":"2025-11-20","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-12 (global facilities)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000982","legacy_id":"S0982","entity_type":"source","title":"Japan's Rapidus enters elite semiconductor league with 2nm prototype","publisher":"EFY (electronicsforu)","source_type":"Industry news","source_url":"https://www.electronicsforu.com/news/japans-rapidus-enters-elite-semiconductor-league-with-2nm-prototype","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-07-18","evidence_date":"2025-07-18","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-12 (global facilities)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000983","legacy_id":"S0983","entity_type":"source","title":"Samsung targets late 2026 launch for advanced Texas chip fab following delays: report","publisher":"iClarified","source_type":"Industry news","source_url":"https://www.iclarified.com/97073/samsung-targets-late-2026-launch-for-advanced-texas-chip-fab-following-delays-report/amp","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":"2026-07-31","evidence_date":"2026-07-31","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"CURRENT","freshness":"Recent","excerpt":null,"notes":"Imported batch-12 (global facilities)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000984","legacy_id":"S0984","entity_type":"source","title":"Exclusive: Samsung secures key operation approval for $37B Taylor factory","publisher":"Korea JoongAng Daily","source_type":"Industry news","source_url":"https://www.koreajoongangdaily.com/business/exclusive-samsung-secures-key-operation-approval-for-37b-taylor-factory/11942522","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-12 (global facilities)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000985","legacy_id":"S0985","entity_type":"source","title":"Intel further delays $28bn Ohio chip fabs by half a decade","publisher":"DatacenterDynamics","source_type":"Industry news","source_url":"https://www.datacenterdynamics.com/en/news/intel-further-delays-28bn-ohio-chip-fabs-by-half-a-decade","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-02-28","evidence_date":"2025-02-28","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-12 (global facilities)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000986","legacy_id":"S0986","entity_type":"source","title":"Intel delays Ohio's chip plant to 2030–2031","publisher":"Spectrum News 1","source_type":"Industry news","source_url":"https://spectrumnews1.com/oh/columbus/news/2025/02/28/intel-delays-ohio-s-chip-plant-to-2030--2031","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-02-28","evidence_date":"2025-02-28","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-12 (global facilities)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000987","legacy_id":"S0987","entity_type":"source","title":"Intel cancels plans for German chip plant amid global streamlining","publisher":"Capital FM (AFP)","source_type":"Industry news","source_url":"https://www.capitalfm.co.ke/business/2025/07/intel-cancels-plans-for-german-chip-plant-amid-global-streamlining","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-07","evidence_date":"2025-07","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-13 (facilities and policy)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000988","legacy_id":"S0988","entity_type":"source","title":"Off with the mouse: Intel cancels the mega factory in Magdeburg for good","publisher":"Igor'sLAB","source_type":"Industry news","source_url":"https://www.igorslab.de/en/off-with-the-mouse-intel-cancels-the-mega-factory-in-magdeburg-for-good/","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":"2025-07","evidence_date":"2025-07","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-13 (facilities and policy)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000989","legacy_id":"S0989","entity_type":"source","title":"Amkor breaks ground on USD 7 billion advanced semiconductor packaging facility in Arizona","publisher":"TrendForce","source_type":"Industry news","source_url":"https://www.trendforce.com/news/2025/10/14/news-amkor-breaks-ground-on-usd-7-billion-advanced-semiconductor-packaging-facility-in-arizona/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-10-14","evidence_date":"2025-10-14","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-13 (facilities and policy)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000990","legacy_id":"S0990","entity_type":"source","title":"Amkor breaks ground on $7bn semiconductor campus in Arizona","publisher":"Cleanroom Technology","source_type":"Industry news","source_url":"https://cleanroomtechnology.com/amkor-breaks-ground-on-7bn-semiconductor-campus-in","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-10","evidence_date":"2025-10","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-13 (facilities and policy)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000991","legacy_id":"S0991","entity_type":"source","title":"Micron building biggest chip fab in US history despite China ban","publisher":"CNBC","source_type":"Industry news","source_url":"https://www.cnbc.com/2023/10/23/micron-building-biggest-chip-fab-in-us-history-despite-china-ban.html","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2023-10-23","evidence_date":"2023-10-23","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-13 (facilities and policy)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000992","legacy_id":"S0992","entity_type":"source","title":"MICRON TECHNOLOGY INC - Form 10-Q - FY2026 (quarter ended 28 May 2026)","publisher":"Micron Technology (SEC EDGAR)","source_type":"Regulatory filing","source_url":"https://www.sec.gov/Archives/edgar/data/0000723125/000072312526000015/mu-20260528.htm","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-05-28","evidence_date":"2026-05-28","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"CURRENT","freshness":"Recent","excerpt":null,"notes":"Imported batch-13 (facilities and policy)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000993","legacy_id":"S0993","entity_type":"source","title":"SK hynix to invest $15 billion in Yongin semiconductor cluster","publisher":"Evertiq","source_type":"Industry news","source_url":"https://evertiq.com/design/2026-02-25-sk-hynix-to-invest-15-billion-in-yongin-semiconductor-cluster","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-02-25","evidence_date":"2026-02-25","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"CURRENT","freshness":"Recent","excerpt":null,"notes":"Imported batch-13 (facilities and policy)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000994","legacy_id":"S0994","entity_type":"source","title":"SK hynix Indiana (HBM advanced packaging plant)","publisher":"The Register","source_type":"Industry news","source_url":"https://www.theregister.com/2026/04/22/sk_hynix_indiana/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-04-22","evidence_date":"2026-04-22","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"CURRENT","freshness":"Recent","excerpt":null,"notes":"Imported batch-13 (facilities and policy)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000995","legacy_id":"S0995","entity_type":"source","title":"SK hynix to invest $4 billion in Indiana for advanced chip packaging facility","publisher":"Korea JoongAng Daily","source_type":"Industry news","source_url":"https://www.koreajoongangdaily.com/business/sk-hynix-to-invest-4-billion-in-indiana-for-advanced-chip-packaging-facility/12298469","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-13 (facilities and policy)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000996","legacy_id":"S0996","entity_type":"source","title":"President Biden signs $280bn CHIPS and Science Act, includes $52bn in semiconductor funding","publisher":"DatacenterDynamics","source_type":"Industry news","source_url":"https://datacenterdynamics.com/en/news/president-biden-signs-280bn-chips-and-science-act-includes-52bn-in-semiconductor-funding","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2022-08","evidence_date":"2022-08","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-13 (facilities and policy)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000997","legacy_id":"S0997","entity_type":"source","title":"The European Chips Act is law. 43 billion euros in investments are expected","publisher":"FASI","source_type":"Industry news","source_url":"https://fasi.eu/articles/undefined/26328-the-european-chips-act-is-law-43-billion-euros-in-investments-are-expected.html","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":"2023-09","evidence_date":"2023-09","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-13 (facilities and policy)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000998","legacy_id":"S0998","entity_type":"source","title":"Semi-conducteurs : entrée en vigueur du Chips Act européen","publisher":"Option Finance","source_type":"Industry news","source_url":"https://www.optionfinance.fr/info-financiere-en-continu/d/2023-09-21-semi-conducteurs-entree-en-vigueur-du-chips-act-europeen.html","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2023-09-21","evidence_date":"2023-09-21","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-13 (facilities and policy)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000999","legacy_id":"S0999","entity_type":"source","title":"New Export Controls on Advanced Computing and Semiconductor Manufacturing","publisher":"Sidley Austin","source_type":"Legal analysis","source_url":"https://www.sidley.com/en/insights/newsupdates/2023/10/new-export-controls-on-advanced-computing-and-semiconductor-manufacturing","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2023-10","evidence_date":"2023-10","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-13 (facilities and policy)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-001000","legacy_id":"S1000","entity_type":"source","title":"BIS updated public information page: export controls imposed on advanced computing and semiconductor manufacturing items","publisher":"US Bureau of Industry and Security","source_type":"Government press release","source_url":"https://www.bis.gov/press-release/bis-updated-public-information-page-export-controls-imposed-advanced-computing-semiconductor","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-13 (facilities and policy)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-001001","legacy_id":"S1001","entity_type":"source","title":"Japan to back chip industry with $65 bln support plan","publisher":"TrendForce","source_type":"Industry news","source_url":"https://www.trendforce.com/news/2024/11/12/news-japan-to-back-chip-industry-with-65-bln-support-plan/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2024-11-12","evidence_date":"2024-11-12","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-13 (facilities and policy)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-001002","legacy_id":"S1002","entity_type":"source","title":"'5%p Increase in Tax Credit for Semiconductor Companies' K-Chips Act Passed in National Assembly Plenary Session","publisher":"Asia Economy","source_type":"Industry news","source_url":"https://view.asiae.co.kr/en/article/2025022715351457043","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025-02-27","evidence_date":"2025-02-27","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-13 (facilities and policy)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-001003","legacy_id":"S1003","entity_type":"source","title":"South Korea announces over $23 billion for chip sector as Trump tariffs on semiconductor imports loom","publisher":"CNBC via NBC","source_type":"Industry news","source_url":"https://www.nbcsandiego.com/news/business/money-report/south-korea-announces-over-23-billion-for-chip-sector-as-trump-tariffs-on-semiconductor-imports-loom/3804061","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2025","evidence_date":"2025","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-13 (facilities and policy)","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000350","legacy_id":"S0350","entity_type":"source","title":"PVA TePla AG Im Westpark 10-12 35435 Wettenberg Germany Press Release (silicon carbide crystal growing systems to STMicroelectronics)","publisher":null,"source_type":"Press release (company)","source_url":"https://www.pvatepla.com/fileadmin/sitepackage/pdf/investor_relations/presse/2022/pm-carbide-crystal-growing-systems-to-stmicroelectronics-042022.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2022-04","evidence_date":"2022-04","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000351","legacy_id":"S0351","entity_type":"source","title":"Company | Okamoto Machine Tool Works, Ltd.","publisher":null,"source_type":"Official website","source_url":"https://www.okamoto.co.jp/en/company/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000352","legacy_id":"S0352","entity_type":"source","title":"Electronics | Organo Corporation","publisher":null,"source_type":"Official website","source_url":"https://www.organo.co.jp/english/business/electronic/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000353","legacy_id":"S0353","entity_type":"source","title":"Electronics | Kurita Industries | Kurita Group","publisher":null,"source_type":"Official website","source_url":"https://www.kurita-water.com/en/industries/electron.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000354","legacy_id":"S0354","entity_type":"source","title":"X-ray Inspection Systems | Nordson Test & Inspection","publisher":null,"source_type":"Official website","source_url":"https://www.nordson.com/en/divisions/test-and-inspection/our-technologies---manual-x-ray-inspection","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000355","legacy_id":"S0355","entity_type":"source","title":"Single Wafer Cleaner : SU-3200 | SCREEN Semiconductor Solutions Co., Ltd.","publisher":"SCREEN Holdings","source_type":"Product page","source_url":"https://www.screen.co.jp/spe/en/products/su-3200","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000356","legacy_id":"S0356","entity_type":"source","title":"Single Wafer Cleaner : SU-3300 | SCREEN Semiconductor Solutions Co., Ltd.","publisher":"SCREEN Holdings","source_type":"Product page","source_url":"https://www.screen.co.jp/spe/en/products/su-3300","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000357","legacy_id":"S0357","entity_type":"source","title":"Spin Scrubber : SS-3200 | SCREEN Semiconductor Solutions Co., Ltd.","publisher":"SCREEN Holdings","source_type":"Product page","source_url":"https://www.screen.co.jp/spe/en/products/ss-3200","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000358","legacy_id":"S0358","entity_type":"source","title":"Spin Scrubber : SS-3200 for 200mm | SCREEN Semiconductor Solutions Co., Ltd.","publisher":"SCREEN Holdings","source_type":"Product page","source_url":"https://www.screen.co.jp/spe/en/products/ss-3200-200mm","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000359","legacy_id":"S0359","entity_type":"source","title":"Wet Station : WS-620C / WS-820L | SCREEN Semiconductor Solutions Co., Ltd.","publisher":"SCREEN Holdings","source_type":"Product page","source_url":"https://www.screen.co.jp/spe/en/products/ws-620c820l","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000360","legacy_id":"S0360","entity_type":"source","title":"Coat/Develop Track : DT-3000 | SCREEN Semiconductor Solutions Co., Ltd.","publisher":"SCREEN Holdings","source_type":"Product page","source_url":"https://www.screen.co.jp/spe/en/products/dt-3000","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000361","legacy_id":"S0361","entity_type":"source","title":"Coat/Develop Track : RF-310A | SCREEN Semiconductor Solutions Co., Ltd.","publisher":"SCREEN Holdings","source_type":"Product page","source_url":"https://www.screen.co.jp/spe/en/products/rf-310a","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000362","legacy_id":"S0362","entity_type":"source","title":"Flash Lamp Annealer : LA-3100 | SCREEN Semiconductor Solutions Co., Ltd.","publisher":"SCREEN Holdings","source_type":"Product page","source_url":"https://www.screen.co.jp/spe/en/products/la-3100","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000363","legacy_id":"S0363","entity_type":"source","title":"Direct Imaging System for Advanced Packaging : DW-3000 | SCREEN Semiconductor Solutions Co., Ltd.","publisher":"SCREEN Holdings","source_type":"Product page","source_url":"https://www.screen.co.jp/spe/en/products/dw-3000","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000364","legacy_id":"S0364","entity_type":"source","title":"Ultra C SAPS | Advanced Single-Wafer Megasonic Cleaning","publisher":"ACM Research","source_type":"Product page","source_url":"https://www.acmr.com/tools-and-processes/wet-processing/ultra-c-saps-cleaning/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000365","legacy_id":"S0365","entity_type":"source","title":"High-Performance Single-Wafer Cleaning | Ultra C Tahoe","publisher":"ACM Research","source_type":"Product page","source_url":"https://www.acmr.com/tools-and-processes/wet-processing/tahoe-cleaning-system/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000366","legacy_id":"S0366","entity_type":"source","title":"Ultra C s | Advanced Single-Wafer Scrubber by ACMR","publisher":"ACM Research","source_type":"Product page","source_url":"https://www.acmr.com/tools-and-processes/wet-processing/ultra-c-s-scrubber-cleaning/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000367","legacy_id":"S0367","entity_type":"source","title":"Ultra Silicon Carbide (SiC) Wafer Cleaning Tool | ACM Research","publisher":"ACM Research","source_type":"Product page","source_url":"https://www.acmr.com/tools-and-processes/wet-processing/ultra-sic-cleaning-tool/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000368","legacy_id":"S0368","entity_type":"source","title":"Ultra Fn Furnace System | 300 mm Dry Wafer Tool","publisher":"ACM Research","source_type":"Product page","source_url":"https://www.acmr.com/tools-and-processes/thermal-deposition-processing/ultra-fn-furnace/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000369","legacy_id":"S0369","entity_type":"source","title":"Electrochemical Plating (ECP) System for Advanced Packaging","publisher":"ACM Research","source_type":"Product page","source_url":"https://www.acmr.com/electrochemical-plating/ultra-ecp-ap/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000370","legacy_id":"S0370","entity_type":"source","title":"ACM Research Strengthens its Fan-Out Panel Level Packaging Portfolio with Launch of Ultra ECP ap-p Tool - ACM Research, Inc.","publisher":"ACM Research","source_type":"Press release (company)","source_url":"https://ir.acmr.com/news-releases/news-release-details/acm-research-strengthens-its-fan-out-panel-level-packaging","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000371","legacy_id":"S0371","entity_type":"source","title":"Applied Materials Sets Industry Record with Shipment of 3,000th Endura PVD System | Applied Materials","publisher":"Applied Materials","source_type":"Press release (company)","source_url":"https://ir.appliedmaterials.com/news-releases/news-release-details/applied-materials-sets-industry-record-shipment-3000th-endura","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000372","legacy_id":"S0372","entity_type":"source","title":"Endura ALPS PVD (ALPS Co & Ni) | Applied Materials","publisher":"Applied Materials","source_type":"Product page","source_url":"https://www.appliedmaterials.com/us/en/product-library/endura-alps-pvd-alps-co-ni.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000373","legacy_id":"S0373","entity_type":"source","title":"Reflexion LK Prime CMP | Applied Materials","publisher":"Applied Materials","source_type":"Product page","source_url":"https://www.appliedmaterials.com/us/en/product-library/reflexion-lk-prime-cmp.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000374","legacy_id":"S0374","entity_type":"source","title":"Reflexion LK CMP | Applied Materials","publisher":"Applied Materials","source_type":"Product page","source_url":"https://www.appliedmaterials.com/us/en/product-library/reflexion-lk-cmp.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000375","legacy_id":"S0375","entity_type":"source","title":"VIISta Trident | Applied Materials","publisher":"Applied Materials","source_type":"Product page","source_url":"https://www.appliedmaterials.com/us/en/product-library/viista-trident.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000376","legacy_id":"S0376","entity_type":"source","title":"VIISta 900XP | Applied Materials","publisher":"Applied Materials","source_type":"Product page","source_url":"https://www.appliedmaterials.com/us/en/product-library/viista-900xp.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000377","legacy_id":"S0377","entity_type":"source","title":"VIISta 900 3D | Applied Materials","publisher":"Applied Materials","source_type":"Product page","source_url":"https://www.appliedmaterials.com/us/en/product-library/viista-900-3d.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000378","legacy_id":"S0378","entity_type":"source","title":"VIISta HCP | Applied Materials","publisher":"Applied Materials","source_type":"Product page","source_url":"https://www.appliedmaterials.com/us/en/product-library/viista-hcp.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000379","legacy_id":"S0379","entity_type":"source","title":"Purion XE Series | High Energy Ion Implantation | Axcelis","publisher":"Axcelis Technologies","source_type":"Product page","source_url":"https://www.axcelis.com/products/medium-energy/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000380","legacy_id":"S0380","entity_type":"source","title":"Introducing the PurionH200 Single Wafer High Current Implanter","publisher":"Axcelis Technologies","source_type":"Product datasheet","source_url":"https://www.axcelis.com/wp-content/uploads/2024/04/Introducing_the_PurionH200_Single_Wafer_High_Current_Implanter.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2024-04","evidence_date":"2024-04","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000381","legacy_id":"S0381","entity_type":"source","title":"Axcelis Introduces Next Generation Purion H High Current Implanter","publisher":"Axcelis Technologies","source_type":"Press release (company)","source_url":"https://investor.axcelis.com/news-releases/news-release-details/axcelis-introduces-next-generation-purion-htm-high-current","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000382","legacy_id":"S0382","entity_type":"source","title":"AXCELIS TECHNOLOGIES INC - Form 10-K - FY2025","publisher":"U.S. SEC (company filing)","source_type":"Regulatory filing","source_url":"https://www.sec.gov/Archives/edgar/data/1113232/000110465926020461/acls-20251231x10k.htm","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026","evidence_date":"2026","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"CURRENT","freshness":"Recent","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000383","legacy_id":"S0383","entity_type":"source","title":"SABRE 3D: Powering the Next Era of Advanced Packaging","publisher":"Lam Research","source_type":"Press release (company)","source_url":"https://newsroom.lamresearch.com/blog-sabre-3d-advanced-packaging-interconnects","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000384","legacy_id":"S0384","entity_type":"source","title":"GAMMA Product Family - Lam Research","publisher":"Lam Research","source_type":"Product page","source_url":"https://www.lamresearch.com/product/gamma-product-family/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000385","legacy_id":"S0385","entity_type":"source","title":"PSK - dry strip product technology page","publisher":"PSK","source_type":"Product page","source_url":"https://www.pskinc.com/producttech/dry_strip.php","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000386","legacy_id":"S0386","entity_type":"source","title":"Tokyo Electron Releases CLEAN TRACK LITHIUS Pro DICE, a 300mm Wafer Coater/Developer","publisher":"Tokyo Electron (TEL)","source_type":"Press release (company)","source_url":"https://www.tel.com/news/product/2025/20251215_002.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025-12-15","evidence_date":"2025-12-15","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"CURRENT","freshness":"Recent","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000387","legacy_id":"S0387","entity_type":"source","title":"Coater/Developer ACT Series | Products and Service(products) | Tokyo Electron Ltd.","publisher":"Tokyo Electron (TEL)","source_type":"Product page","source_url":"https://www.tel.com/product/act.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000388","legacy_id":"S0388","entity_type":"source","title":"CLEAN TRACK Mark-Vz, CLEAN TRACK Mark 7/Mark 8 | Coater/Developer Mark Series","publisher":"Tokyo Electron (TEL)","source_type":"Product page","source_url":"https://origin.tel.com/product/mark.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000389","legacy_id":"S0389","entity_type":"source","title":"Tokyo Electron Releases EVAROS, a Batch Thermal Processing System for 300 mm Wafers","publisher":"Tokyo Electron (TEL)","source_type":"Press release (company)","source_url":"https://www.tel.com/news/product/2025/20251215_001.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025-12-15","evidence_date":"2025-12-15","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"CURRENT","freshness":"Recent","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000390","legacy_id":"S0390","entity_type":"source","title":"TEL Announces the Launch of CELLESTA SCD, a Single Wafer Cleaning System","publisher":"Tokyo Electron (TEL)","source_type":"Press release (company)","source_url":"https://www.tel.com/news/product/2020/20201208_001.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2020-12-08","evidence_date":"2020-12-08","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"VERY_STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000391","legacy_id":"S0391","entity_type":"source","title":"TEL Announces the Launch of CELLESTA Pro SPM, a Single Wafer Cleaning System","publisher":"Tokyo Electron (TEL)","source_type":"Press release (company)","source_url":"https://www.tel.com/news/product/2019/20190313_001.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2019-03-13","evidence_date":"2019-03-13","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"VERY_STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000392","legacy_id":"S0392","entity_type":"source","title":"Tokyo Electron Introduces CELLESTA MS2, a Surface Preparation System","publisher":"Tokyo Electron (TEL)","source_type":"Press release (company)","source_url":"https://www.tel.com/news/product/2022/20221212_001.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2022-12-12","evidence_date":"2022-12-12","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000393","legacy_id":"S0393","entity_type":"source","title":"Cleaning ANTARES Series | Products and Service(products) | Tokyo Electron Ltd.","publisher":"Tokyo Electron (TEL)","source_type":"Product page","source_url":"https://www.tel.com/product/antares.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000394","legacy_id":"S0394","entity_type":"source","title":"Tokyo Electron Launches Ulucus LX, an Extreme Laser Lift Off System for 300mm Wafer-Bonded Devices","publisher":"Tokyo Electron (TEL)","source_type":"Press release (company)","source_url":"https://www.tel.com/news/product/2024/20241209_001.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2024-12-09","evidence_date":"2024-12-09","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000395","legacy_id":"S0395","entity_type":"source","title":"Tokyo Electron Introduces Ulucus L, a Laser Edge Trimming System for 300mm Wafer-Bonded Devices","publisher":"Tokyo Electron (TEL)","source_type":"Press release (company)","source_url":"https://www.tel.com/news/product/2022/20220608_002.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2022-06-08","evidence_date":"2022-06-08","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000396","legacy_id":"S0396","entity_type":"source","title":"3D Integration Synapse/Ulucus Series | Products and Service(products) | Tokyo Electron Ltd.","publisher":"Tokyo Electron (TEL)","source_type":"Product page","source_url":"https://www.tel.com/product/synapse-ulucus.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000397","legacy_id":"S0397","entity_type":"source","title":"model F-REX | EBARA CORPORATION","publisher":"EBARA Corporation","source_type":"Product page","source_url":"https://www.ebara.com/global-en/products/FREX/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000398","legacy_id":"S0398","entity_type":"source","title":"Model FREX300XA | EBARA CORPORATION","publisher":"EBARA Corporation","source_type":"Product page","source_url":"https://ebara.com/global-en/products/FREX300XA/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000399","legacy_id":"S0399","entity_type":"source","title":"Dry Vacuum Pumps | Semiconductor manufacturing equipment market | EBARA CORPORATION","publisher":"EBARA Corporation","source_type":"Product page","source_url":"https://www.ebara.com/global-en/precision/dry-vacuum-pump/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000400","legacy_id":"S0400","entity_type":"source","title":"Integrated dry vacuum pump/gas abatement systems | EBARA CORPORATION","publisher":"EBARA Corporation","source_type":"Product page","source_url":"https://www.ebara.com/global-en/products/DRY/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000401","legacy_id":"S0401","entity_type":"source","title":"DGP8761 | Polishers | Product Information | DISCO CORPORATION (High-efficiency grinder/polisher for Φ300 mm wafers)","publisher":"DISCO Corporation","source_type":"Product page","source_url":"https://www.disco.co.jp/eg/products/polisher_etcher/dgp8761.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000402","legacy_id":"S0402","entity_type":"source","title":"DGP8762 | Polishers | Product Information | DISCO CORPORATION","publisher":"DISCO Corporation","source_type":"Product page","source_url":"https://www.disco.co.jp/eg/products/polisher_etcher/dgp8762.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000403","legacy_id":"S0403","entity_type":"source","title":"DFG8541 | Grinders | Product Information | DISCO CORPORATION","publisher":"DISCO Corporation","source_type":"Product page","source_url":"https://www.disco.co.jp/eg/products/grinder/dfg8541.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000404","legacy_id":"S0404","entity_type":"source","title":"DFG8540 | Grinders | Product Information | DISCO CORPORATION","publisher":"DISCO Corporation","source_type":"Product page","source_url":"https://www.disco.co.jp/eg/products/grinder/dfg8540.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000405","legacy_id":"S0405","entity_type":"source","title":"DFM2800 | Wafer Mounter | Product Information | DISCO CORPORATION","publisher":"DISCO Corporation","source_type":"Product page","source_url":"https://www.disco.co.jp/eg/products/mounter/dfm2800.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000406","legacy_id":"S0406","entity_type":"source","title":"DMM9200 | Wafer Mounter | Product Information | DISCO CORPORATION","publisher":"DISCO Corporation","source_type":"Product page","source_url":"https://www.disco.co.jp/eg/products/mounter/dmm9200.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000407","legacy_id":"S0407","entity_type":"source","title":"PG3000RMII | Polish Grinder | ACCRETECH - TOKYO SEIMITSU","publisher":"Tokyo Seimitsu (ACCRETECH)","source_type":"Product page","source_url":"https://www.accretech.com/en/product/semicon/semi/polish/pg3000rmx.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000408","legacy_id":"S0408","entity_type":"source","title":"HRG3000RMⅡ｜High Rigid Grinder | ACCRETECH - TOKYO SEIMITSU","publisher":"Tokyo Seimitsu (ACCRETECH)","source_type":"Product page","source_url":"https://www.accretech.com/en/product/semicon/semi/highrigid_grinder/hrg3000rm2.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000409","legacy_id":"S0409","entity_type":"source","title":"HRG300A｜High Rigid 1-Axis Grinder | ACCRETECH - TOKYO SEIMITSU","publisher":"Tokyo Seimitsu (ACCRETECH)","source_type":"Product page","source_url":"https://www.accretech.com/en/product/semicon/semi/highrigid_grinder/hrg300a.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000410","legacy_id":"S0410","entity_type":"source","title":"Wafer Edge Grinding Machine Wafer Size φ 450 mm (W-GM-6200)","publisher":"Tokyo Seimitsu (ACCRETECH)","source_type":"Product datasheet","source_url":"https://www.accretech.com/en/assets/w-gm-6200_e.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000411","legacy_id":"S0411","entity_type":"source","title":"W-GM-4200 | Edge Shaping Products | ACCRETECH - TOKYO SEIMITSU","publisher":"Tokyo Seimitsu (ACCRETECH)","source_type":"Product page","source_url":"https://www.accretech.com/en/product/semicon/semi/edge/wgm4200.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000412","legacy_id":"S0412","entity_type":"source","title":"Release of new model back grinding tape laminator | News Release | LINTEC Corporation","publisher":"Lintec","source_type":"Press release (company)","source_url":"https://www.lintec-global.com/topics/newsrelease/2017/170428_a.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2017-04-28","evidence_date":"2017-04-28","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"VERY_STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000413","legacy_id":"S0413","entity_type":"source","title":"V93000｜SoC Test Systems｜ADVANTEST CORPORATION","publisher":"Advantest","source_type":"Product page","source_url":"https://www.advantest.com/en/products/semiconductor-test-system/soc/v93000/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000414","legacy_id":"S0414","entity_type":"source","title":"T2000｜SoC Test Systems｜ADVANTEST CORPORATION","publisher":"Advantest","source_type":"Product page","source_url":"https://www.advantest.com/en/products/semiconductor-test-system/soc/t2000/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000415","legacy_id":"S0415","entity_type":"source","title":"Advantest Unveils T2000 AiR2X Air-Cooled SoC and Power Analog Test Solution","publisher":"Advantest","source_type":"Press release (company)","source_url":"https://www.advantest.com/en/news/2025/20251211.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025-12-11","evidence_date":"2025-12-11","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"CURRENT","freshness":"Recent","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000416","legacy_id":"S0416","entity_type":"source","title":"UltraFLEXplus SoC Tester - Teradyne","publisher":"Teradyne","source_type":"Product page","source_url":"https://www.teradyne.com/products/ultraflexplus/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000417","legacy_id":"S0417","entity_type":"source","title":"UltraFLEX | Teradyne","publisher":"Teradyne","source_type":"Product page","source_url":"https://www.teradyne.com/products/ultraflex/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000418","legacy_id":"S0418","entity_type":"source","title":"J750Ex-HD Family | Teradyne","publisher":"Teradyne","source_type":"Product page","source_url":"https://www.teradyne.com/products/test-solutions/semiconductor-test/j750","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000419","legacy_id":"S0419","entity_type":"source","title":"Chroma 3680 Advanced SoC Test System","publisher":"Chroma ATE","source_type":"Product page","source_url":"https://www.chromaate.com/en/product/advanced_soc_analog_test_system_3680_36","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000420","legacy_id":"S0420","entity_type":"source","title":"KLA-Surfscan-SP7XP-Product-Brochure.pdf","publisher":"KLA Corporation","source_type":"Product datasheet","source_url":"https://www.kla.com/documents/products/brochures/KLA-Surfscan-SP7XP-Product-Brochure.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000421","legacy_id":"S0421","entity_type":"source","title":"Product Fact Sheet Surfscan SP A2/A3","publisher":"KLA Corporation","source_type":"Product datasheet","source_url":"https://www.kla.com/documents/products/brochures/KLA_Automotive_Surfscan_SP_A2_SP_A3_ProductFactSheet.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000422","legacy_id":"S0422","entity_type":"source","title":"KLA PWG5 Product Brochure","publisher":"KLA Corporation","source_type":"Product datasheet","source_url":"https://www.kla.com/documents/products/brochures/KLA-PWG5-Product-Brochure.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000423","legacy_id":"S0423","entity_type":"source","title":"KLA-Tencor Announces Voyager 1015 and Surfscan SP7 Defect Inspection Systems","publisher":"KLA Corporation","source_type":"Press release (company)","source_url":"https://ir.kla.com/news-events/press-releases/detail/78/kla-tencor-announces-voyager-1015-and-surfscan-sp7","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000424","legacy_id":"S0424","entity_type":"source","title":"Packaged IC Inspection and Metrology ICOS T890","publisher":"KLA Corporation","source_type":"Product datasheet","source_url":"https://www.kla.com/documents/KLA_Brochure_ICOS-T890.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000425","legacy_id":"S0425","entity_type":"source","title":"Packaged IC Inspection and Metrology ICOS T3 & T7 Series","publisher":"KLA Corporation","source_type":"Product datasheet","source_url":"https://www.kla.com/documents/KLA_Brochure_ICOS_T3-T7.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000426","legacy_id":"S0426","entity_type":"source","title":"KLA-Tencor Introduces the ICOS CI-T620 Packaged IC Component Inspector","publisher":"KLA Corporation","source_type":"Press release (company)","source_url":"https://ir.kla.com/news-events/press-releases/detail/245/kla-tencor-introduces-the-icos-ci-t620-packaged-ic","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000427","legacy_id":"S0427","entity_type":"source","title":"Announcing Kronos 1080 and ICOS F160 Inspection Systems: Expanding KLA-Tencor's IC Packaging Portfolio","publisher":"KLA Corporation","source_type":"Press release (company)","source_url":"https://ir.kla.com/news-events/press-releases/detail/71/announcing-kronos-1080-and-icos-f160-inspection","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000428","legacy_id":"S0428","entity_type":"source","title":"SPTS Leading the Way in Via Reveal Etch Solutions | SPTS","publisher":"KLA Corporation","source_type":"Press release (company)","source_url":"https://www.spts.com/news-events/press-releases/spts-leading-the-way-in-via-reveal-etch-solutions","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000429","legacy_id":"S0429","entity_type":"source","title":"Dark Field Wafer Defect Inspection System DI2800 : Hitachi High-Tech Corporation","publisher":"Hitachi High-Tech","source_type":"Product page","source_url":"https://www.hitachi-hightech.com/global/en/products/semiconductor-manufacturing/cd-sem/inspection-solution/di2800.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000430","legacy_id":"S0430","entity_type":"source","title":"Hitachi High-Tech Launches Dark Field Wafer Defect Inspection System DI4600 to Provide High Throughput and High-Precision Defect Detection on Patterned Wafers","publisher":"Hitachi High-Tech","source_type":"Press release (company)","source_url":"https://www.hitachi-hightech.com/us/en/news/nr20231206.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2023-12-06","evidence_date":"2023-12-06","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000431","legacy_id":"S0431","entity_type":"source","title":"Advanced CD Measurement SEM CG7300 : Hitachi High-Tech in the U.S.A.","publisher":"Hitachi High-Tech","source_type":"Product page","source_url":"https://www.hitachi-hightech.com/us/en/products/semiconductor-manufacturing/cd-sem/metrology-solution/semi-cg7300.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000432","legacy_id":"S0432","entity_type":"source","title":"High-Precision Electron Beam Metrology System GT2000 : Hitachi High-Tech Corporation","publisher":"Hitachi High-Tech","source_type":"Product page","source_url":"https://www.hitachi-hightech.com/global/en/products/semiconductor-manufacturing/cd-sem/metrology-solution/semi-gt2000.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000433","legacy_id":"S0433","entity_type":"source","title":"Advanced CD Measurement SEM CS4800 : Hitachi High-Tech in the U.S.A.","publisher":"Hitachi High-Tech","source_type":"Product page","source_url":"https://www.hitachi-hightech.com/us/en/products/semiconductor-manufacturing/cd-sem/metrology-solution/semi-cs4800.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000434","legacy_id":"S0434","entity_type":"source","title":"Hitachi High-Tech Launches New High-Speed Defect Review SEM CR7300","publisher":"Hitachi High-Tech","source_type":"Press release (company)","source_url":"https://www.hitachi-hightech.com/global/en/news/nr20201126.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2020-11-26","evidence_date":"2020-11-26","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"VERY_STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000435","legacy_id":"S0435","entity_type":"source","title":"Dragonfly G5 System - Onto Innovation","publisher":"Onto Innovation","source_type":"Product page","source_url":"https://ontoinnovation.com/products/dragonfly-g5-inspection/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000436","legacy_id":"S0436","entity_type":"source","title":"Panel Level Packaging Inspection System | Onto Innovation","publisher":"Onto Innovation","source_type":"Product page","source_url":"https://ontoinnovation.com/products/firefly-g3/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000437","legacy_id":"S0437","entity_type":"source","title":"Advanced Packaging Lithography: Panel Substrates | Onto Innovation","publisher":"Onto Innovation","source_type":"Product page","source_url":"https://ontoinnovation.com/products/jetstep-s3500/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000438","legacy_id":"S0438","entity_type":"source","title":"Panel Lithography System (AICS + OSAT Mfrs.) | Onto Innovation","publisher":"Onto Innovation","source_type":"Product page","source_url":"https://ontoinnovation.com/products/jetstep-x500/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000439","legacy_id":"S0439","entity_type":"source","title":"3D Surface Detection | Advanced Packaging | Camtek","publisher":"Camtek","source_type":"Product page","source_url":"https://www.camtek.com/products/eagle-g5/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000440","legacy_id":"S0440","entity_type":"source","title":"Wafer Bump Inspection | Advanced Packaging | Camtek","publisher":"Camtek","source_type":"Product page","source_url":"https://www.camtek.com/products/eaglet-ap-plus/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000441","legacy_id":"S0441","entity_type":"source","title":"Surface Inspection System | 2D Inspection Tool | Camtek","publisher":"Camtek","source_type":"Product page","source_url":"https://www.camtek.com/products/eaglet-i/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000442","legacy_id":"S0442","entity_type":"source","title":"Optical Surface Measurement | Panel Level Packaging","publisher":"Camtek","source_type":"Product page","source_url":"https://www.camtek.com/products/golden-eagle/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000443","legacy_id":"S0443","entity_type":"source","title":"Hawk - Camtek","publisher":"Camtek","source_type":"Product page","source_url":"https://www.camtek.com/products/hawk/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000444","legacy_id":"S0444","entity_type":"source","title":"Tray to reel based vision handler component inspector machine-TR3000i","publisher":"ViTrox","source_type":"Product page","source_url":"https://www.vitrox.com/vision-technology-machine-system/tray-base-vision-handler-reel-tr3000i-spec.php","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000445","legacy_id":"S0445","entity_type":"source","title":"TH3000i - The Revolutionary Tray to Tray IC Inspection Handler Solution for your Inspection - ViTrox","publisher":"ViTrox","source_type":"Press release (company)","source_url":"https://www.vitrox.com/news/news-24-sep-20-revolutionary-tray-to-tray-ic-inspection.php","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2020-09-24","evidence_date":"2020-09-24","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"VERY_STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000446","legacy_id":"S0446","entity_type":"source","title":"Quadra 7 Pro X-ray Inspection High Resolution","publisher":"Nordson Corporation","source_type":"Product page","source_url":"https://www.nordson.com/en/products/test-and-inspection-products/mxi-quadrapro-7--x-ray-inspection","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000447","legacy_id":"S0447","entity_type":"source","title":"MXI Quadra 5 Pro X-ray Inspection High Resolution","publisher":"Nordson Corporation","source_type":"Product page","source_url":"https://www.nordson.com/en/products/test-and-inspection-products/mxi-quadrapro-5-x-ray-inspection","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000448","legacy_id":"S0448","entity_type":"source","title":"ACTIS A150 | Lasertec Corporation","publisher":"Lasertec","source_type":"Product page","source_url":"https://www.lasertec.co.jp/en/products/semiconductor/actis_a150.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000449","legacy_id":"S0449","entity_type":"source","title":"MATRICS X9ULTRA Series | Lasertec Corporation","publisher":"Lasertec","source_type":"Product page","source_url":"https://www.lasertec.co.jp/en/products/semiconductor/matrics_x9ultra.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000450","legacy_id":"S0450","entity_type":"source","title":"MATRICS X8ULTRA Series | Lasertec Corporation","publisher":"Lasertec","source_type":"Product page","source_url":"https://www.lasertec.co.jp/en/products/semiconductor/matrics_x8ultra.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000451","legacy_id":"S0451","entity_type":"source","title":"MATRICS X810EX Series | Lasertec Corporation","publisher":"Lasertec","source_type":"Product page","source_url":"https://www.lasertec.co.jp/en/products/semiconductor/matrics_x810ex.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000452","legacy_id":"S0452","entity_type":"source","title":"Semiconductor mask writer (SLX series) | Mycronic","publisher":"Mycronic","source_type":"Product page","source_url":"https://www.mycronic.com/product-areas/photomask-equipment/Products/slx-series/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000453","legacy_id":"S0453","entity_type":"source","title":"Mycronic receives order for an MMX metrology system","publisher":"Mycronic","source_type":"Press release (company)","source_url":"https://www.mycronic.com/product-areas/photomask-equipment/press-releases/mycronic-receives-order-for-an-mmx-metrology-system/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000454","legacy_id":"S0454","entity_type":"source","title":"HOME > Products > Memory Test Handler","publisher":"Techwing","source_type":"Product page","source_url":"https://www.techwing.co.kr/eng/product/product01_01.asp?str_gubun=1&str_no=30","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000455","legacy_id":"S0455","entity_type":"source","title":"HOME > Products > Logic Test Handler","publisher":"Techwing","source_type":"Product page","source_url":"https://www.techwing.co.kr/eng/product/product01_01.asp?str_gubun=2&str_no=32","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000456","legacy_id":"S0456","entity_type":"source","title":"SLT handler","publisher":"Techwing","source_type":"Product page","source_url":"https://www.techwing.co.kr/eng/product/product01_01.asp?str_no=64","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000457","legacy_id":"S0457","entity_type":"source","title":"M5 Tri temp handler","publisher":"Techwing","source_type":"Product page","source_url":"https://www.techwing.co.kr/eng/product/product01_01.asp?str_gubun=3&str_no=50","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000458","legacy_id":"S0458","entity_type":"source","title":"Eclipse PnP Handler | Cohu","publisher":"Cohu","source_type":"Product page","source_url":"https://www.cohu.com/eclipse","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000459","legacy_id":"S0459","entity_type":"source","title":"Eclipse XT Configurable OSAT Friendly Pick-and-Place Handler","publisher":"Cohu","source_type":"Product datasheet","source_url":"https://www.cohu.com/wp-content/uploads/2019/06/EclipseXT_Product-Sheet_20230126.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2023-01-26","evidence_date":"2023-01-26","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000460","legacy_id":"S0460","entity_type":"source","title":"MATRiX PnP Test Handler | Cohu","publisher":"Cohu","source_type":"Product page","source_url":"https://www.cohu.com/matrix/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000461","legacy_id":"S0461","entity_type":"source","title":"SH5300 Strip Test Handler | Cohu","publisher":"Cohu","source_type":"Product page","source_url":"https://www.cohu.com/sh5300/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000462","legacy_id":"S0462","entity_type":"source","title":"FPA-5520iV / HR Option / LF Option / LF2 Option | Canon Global","publisher":"Canon Inc.","source_type":"Product page","source_url":"https://global.canon/en/product/indtech/semicon/fpa5520iv.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000463","legacy_id":"S0463","entity_type":"source","title":"Ichor Systems Enters into Substantial Agreement to Produce Liquid Delivery Systems","publisher":"Ichor Systems","source_type":"Press release (company)","source_url":"https://ir.ichorsystems.com/websites/ichorholdings/English/2120/us-press-release.html?airportNewsID=7994cd95-3d60-4771-94b0-aeee9ec082c5","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000464","legacy_id":"S0464","entity_type":"source","title":"Video: M2-Nano Vacuum Transport System Cluster Tool | Brooks Automation","publisher":"Brooks Automation","source_type":"Product page","source_url":"https://www.brooks.com/products/semiconductor-automation/semiconductor-automation-videos/m2-nano-vacuum-transport-system","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000465","legacy_id":"S0465","entity_type":"source","title":"300 mm KWF series | FOUP opener | Load port | Semiconductor related equipment | HIRATA Corporation","publisher":"Hirata Corporation","source_type":"Product page","source_url":"https://www.hirata.co.jp/en/products/items/archives/175","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000466","legacy_id":"S0466","entity_type":"source","title":"Cleanroom Storage Systems - Muratec","publisher":"Murata Machinery (Muratec)","source_type":"Product page","source_url":"https://www.muratec-usa.com/products/productcategories/clean-factory-automation/productlines/cleanroom-storage-systems/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000467","legacy_id":"S0467","entity_type":"source","title":"Czochralski crystal growing system CGS1218","publisher":"PVA TePla","source_type":"Product datasheet","source_url":"https://www.pvatepla.com/fileadmin/sitepackage/pdf/brochures/PVA_CGS1218.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000468","legacy_id":"S0468","entity_type":"source","title":"Physical Vapor Transport | High-Purity Single Crystals","publisher":"PVA TePla","source_type":"Product page","source_url":"https://www.pvatepla.com/products-technologies/crystal-growth/physical-vapor-transport/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000469","legacy_id":"S0469","entity_type":"source","title":"Float Zone | Monocrystalline Silicon","publisher":"PVA TePla","source_type":"Product page","source_url":"https://www.pvatepla.com/products-technologies/crystal-growth/float-zone/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000470","legacy_id":"S0470","entity_type":"source","title":"Semiconductor Manufacturing Equipment 450mm Wafer Final Polisher PNX1200/PNX1200S | Okamoto Machine Tool Works,Ltd","publisher":"Okamoto Machine Tool Works","source_type":"Product page","source_url":"https://www.okamoto.co.jp/en/products/pnx1200/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000471","legacy_id":"S0471","entity_type":"source","title":"Semiconductor-related manufacturing equipment Final polisher PNX332B | Okamoto Machine Tool Works,Ltd","publisher":"Okamoto Machine Tool Works","source_type":"Product page","source_url":"https://www.okamoto.co.jp/en/products/pnx332b/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000472","legacy_id":"S0472","entity_type":"source","title":"Semiconductor-Related Manufacturing Equipment Polishing Machine SPP Series | Okamoto Machine Tool Works,Ltd","publisher":"Okamoto Machine Tool Works","source_type":"Product page","source_url":"https://www.okamoto.co.jp/en/products/spp/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000473","legacy_id":"S0473","entity_type":"source","title":"Semiconductor-related manufacturing equipment CMP – Chemical Mechanical Polishing – SPP600S | Okamoto Machine Tool Works,Ltd","publisher":"Okamoto Machine Tool Works","source_type":"Product page","source_url":"https://www.okamoto.co.jp/en/products/spp600s/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000474","legacy_id":"S0474","entity_type":"source","title":"Sematech Selects Okamoto GDM 300 system for TSV process at UAlbany Nanocollege","publisher":"Okamoto Machine Tool Works","source_type":"Press release (company)","source_url":"https://www.okamotocorp.com/news-posts/sematech-selects-okamoto/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000475","legacy_id":"S0475","entity_type":"source","title":"Ultrapure Water Production Systems | Organo Corporation","publisher":"Organo Corporation","source_type":"Product page","source_url":"https://www.organo.co.jp/english/business/electronic/ultrapure/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000476","legacy_id":"S0476","entity_type":"source","title":"Kurita Develops Ultrapure Water Production System Using Nanosaver","publisher":"Kurita Water Industries","source_type":"Press release (company)","source_url":"https://www.kurita.co.jp/english/aboutus/press081112.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2008-11-12","evidence_date":"2008-11-12","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"VERY_STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000477","legacy_id":"S0477","entity_type":"source","title":"Double Side Polisher/Lapper | Products | SpeedFam","publisher":null,"source_type":"Product page","source_url":"https://www.speedfam.com/en/products/double_side_polisher.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000478","legacy_id":"S0478","entity_type":"source","title":"PE2O8 SiC epitaxy | ASM","publisher":"ASM International (ASMI)","source_type":"Product page","source_url":"https://www.asm.com/our-technology-products/silicon-carbide/pe2o8","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000479","legacy_id":"S0479","entity_type":"source","title":"PE106A and PE108 SiC epitaxy | ASM","publisher":"ASM International (ASMI)","source_type":"Product page","source_url":"https://www.asm.com/our-technology-products/silicon-carbide/pe106a-pe108","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000480","legacy_id":"S0480","entity_type":"source","title":"Intrepid ES Epitaxy | ASM","publisher":"ASM International (ASMI)","source_type":"Product page","source_url":"https://www.asm.com/our-technology-products/epitaxy/intrepid-es","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000481","legacy_id":"S0481","entity_type":"source","title":"Centura Xtera Epi | Applied Materials","publisher":"Applied Materials","source_type":"Product page","source_url":"https://www.appliedmaterials.com/us/en/product-library/centura-xtera-epi.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000482","legacy_id":"S0482","entity_type":"source","title":"Centura Prime Epi | Applied Materials","publisher":"Applied Materials","source_type":"Product page","source_url":"https://www.appliedmaterials.com/us/en/product-library/centura-prime-epi.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000483","legacy_id":"S0483","entity_type":"source","title":"Centura Epi 200MM | Applied Materials","publisher":"Applied Materials","source_type":"Product page","source_url":"https://www.appliedmaterials.com/us/en/product-library/centura-epi-200mm.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000484","legacy_id":"S0484","entity_type":"source","title":"Propel HVM GaN MOCVD System for Power, 5G RF and Photonics - Veeco","publisher":"Veeco Instruments","source_type":"Product page","source_url":"https://www.veeco.com/products/propel-hvm-gan-mocvd-system-for-power-5g-rf-and-photonics/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000485","legacy_id":"S0485","entity_type":"source","title":"Propel 300mm GaN MOCVD System for 5G, Photonics and CMOS - Veeco","publisher":"Veeco Instruments","source_type":"Product page","source_url":"https://www.veeco.com/products/propel-300mm-gan-mocvd-system-for-5g-photonics-and-cmos-devices/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000486","legacy_id":"S0486","entity_type":"source","title":"AIXTRON launches next Generation G10-SiC 200 mm product solution for Silicon Carbide Epitaxy","publisher":"AIXTRON","source_type":"Press release (company)","source_url":"https://www.aixtron.com/en/investors/AIXTRON%20launches%20next%20Generation%20G10-SiC%20200%20mm%20product%20solution%20for%20Silicon%20Carbide%20Epitaxy_n2074","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000487","legacy_id":"S0487","entity_type":"source","title":"g10-asp :: AIXTRON","publisher":"AIXTRON","source_type":"Product page","source_url":"https://www.aixtron.com/en/products/compound-semiconductors-mocvd/g10-asp","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000488","legacy_id":"S0488","entity_type":"source","title":"Single Wafer Cleaner : SU-3400 | SCREEN Semiconductor Solutions Co., Ltd.","publisher":"SCREEN Holdings","source_type":"Product page","source_url":"https://www.screen.co.jp/spe/en/products/su-3400","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000489","legacy_id":"S0489","entity_type":"source","title":"SCREEN Develops Industry-first SB-3300 Hybrid Type Wafer Back-side Cleaning System with Both Chemical and Brush Cleaning Functions","publisher":"SCREEN Holdings","source_type":"Press release (company)","source_url":"https://www.screen.co.jp/en/news/NR201208-2E","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000490","legacy_id":"S0490","entity_type":"source","title":"W-GM-5200 | Edge Shaping Products | ACCRETECH - TOKYO SEIMITSU","publisher":"Tokyo Seimitsu (ACCRETECH)","source_type":"Product page","source_url":"https://www.accretech.com/en/product/semicon/semi/edge/wgm5200.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000491","legacy_id":"S0491","entity_type":"source","title":"Edge Polisher | Products | SpeedFam","publisher":"SpeedFam","source_type":"Product page","source_url":"https://www.speedfam.com/en/products/edge_polisher.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-2","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000492","legacy_id":"S0492","entity_type":"source","title":"Lace Lithography uses atoms to go beyond EUVL","publisher":"eeNews Europe","source_type":"Industry news","source_url":"https://www.eenewseurope.com/en/lace-lithography-uses-atoms-to-go-beyond-euvl","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000493","legacy_id":"S0493","entity_type":"source","title":"Microsoft-backed startup raises US$40 million for advanced chipmaking equipment tech","publisher":"BNN Bloomberg (Reuters)","source_type":"Industry news","source_url":"https://www.bnnbloomberg.ca/business/2026/03/23/microsoft-backed-startup-raises-us40-million-for-advanced-chipmaking-equipment-tech/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2026-03-23","evidence_date":"2026-03-23","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"CURRENT","freshness":"Recent","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000494","legacy_id":"S0494","entity_type":"source","title":"Norwegian start-up raises $40 million for helium atom beam lithography","publisher":"3DTested","source_type":"Industry news","source_url":"https://www.3dtested.com/tech-industry/norwegian-start-up-raises-40-million-for-helium-atom-beam-lithography","internal":false,"tier":4,"tier_label":"Tier 4 · Blog, wiki, market list (unverified)","publication_date":"2026-03","evidence_date":"2026-03","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"CURRENT","freshness":"Recent","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000495","legacy_id":"S0495","entity_type":"source","title":"World's First (Multibeam Corporation home)","publisher":"Multibeam","source_type":"Company website","source_url":"https://multibeamcorp.com/homes/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000496","legacy_id":"S0496","entity_type":"source","title":"Multibeam E-Beam Lithography System (SkyWater Technology)","publisher":"SkyWater Technology","source_type":"Product page","source_url":"https://www.skywatertechnology.com/multibeam-e-beam-lithography-system/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000497","legacy_id":"S0497","entity_type":"source","title":"Electron Beam Lithography | RAITH","publisher":"Raith","source_type":"Product page","source_url":"https://raith.com/products/electron-beam-lithography/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000498","legacy_id":"S0498","entity_type":"source","title":"Maskless Laser Lithography ǀ Heidelberg Instruments","publisher":"Heidelberg Instruments","source_type":"Product page","source_url":"https://heidelberg-instruments.com/core-technologies/maskless-laser-lithography/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000499","legacy_id":"S0499","entity_type":"source","title":"Obducat´s Product Portfolio - Obducat","publisher":"Obducat","source_type":"Product page","source_url":"https://www.obducat.com/products-foundry-services/product-portfolio/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000500","legacy_id":"S0500","entity_type":"source","title":"Semiconductors - Forge Nano","publisher":"Forge Nano","source_type":"Product page","source_url":"https://www.forgenano.com/semiconductors/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000501","legacy_id":"S0501","entity_type":"source","title":"Forge Nano Secures $40M to Scale U.S. Battery Manufacturing and Commercial Semiconductor Equipment Businesses","publisher":"Forge Nano","source_type":"Press release (company)","source_url":"http://www.forgenano.com/archivesite/forge-nano-secures-40m-to-scale-u-s-battery-manufacturing-and-commercial-semiconductor-equipment-businesses/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000502","legacy_id":"S0502","entity_type":"source","title":"Platforms Overview - Angstrom Engineering","publisher":"Angstrom Engineering","source_type":"Product page","source_url":"https://angstromengineering.com/products/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000503","legacy_id":"S0503","entity_type":"source","title":"Physical Vapor Transport Systems | CVD Equipment Corporation","publisher":"CVD Equipment Corporation","source_type":"Product page","source_url":"https://cvdequipment.com/systems/production-equipment/pvt-systems/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000504","legacy_id":"S0504","entity_type":"source","title":"CVD Equipment Corporation company presentation (Jan 2024)","publisher":"CVD Equipment Corporation","source_type":"Investor relations","source_url":"https://cvdequipment.com/wp-content/uploads/2024/03/CVDE-Company-Presentation-Jan-2024.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2024-01","evidence_date":"2024-01","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000505","legacy_id":"S0505","entity_type":"source","title":"About Trymax – Trymax Semiconductor","publisher":"Trymax","source_type":"Company website","source_url":"https://trymax-semiconductor.com/about-trymax/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000506","legacy_id":"S0506","entity_type":"source","title":"About Us - SVCS Process Innovation","publisher":"SVCS","source_type":"Company website","source_url":"https://www.svcs.com/about-us/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000507","legacy_id":"S0507","entity_type":"source","title":"About Annealsys - Annealsys","publisher":"Annealsys","source_type":"Company website","source_url":"https://www.annealsys.com/about-annealsys/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000508","legacy_id":"S0508","entity_type":"source","title":"Etching｜Samco Inc.","publisher":"Samco","source_type":"Product page","source_url":"https://www.samco.co.jp/en/products/etching/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000509","legacy_id":"S0509","entity_type":"source","title":"Plasma Etcher & Plasma Deposition Tools by SENTECH","publisher":"SENTECH","source_type":"Product page","source_url":"https://www.sentech.com/en/site__228/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000510","legacy_id":"S0510","entity_type":"source","title":"YES Yield Engineering Systems, Inc. Process ...","publisher":"YES","source_type":"Company website","source_url":"https://yieldengineering.com/company/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000511","legacy_id":"S0511","entity_type":"source","title":"Automated Wire Bonding, Die Attach, and Contract Assembly Services","publisher":"Palomar Technologies","source_type":"Company website","source_url":"https://www.palomartechnologies.com/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000512","legacy_id":"S0512","entity_type":"source","title":"Home | Die Bonding Systems for R&D and Production","publisher":"Finetech","source_type":"Company website","source_url":"https://finetech.de/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000513","legacy_id":"S0513","entity_type":"source","title":"Smart Equipment Technology Die / Flip Chip Bonding Nanoimprint Lithography","publisher":"SET","source_type":"Brochure / datasheet","source_url":"https://set-sas.fr/wp-content/uploads/productlinebrochure.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000514","legacy_id":"S0514","entity_type":"source","title":"Oxford Lasers precision laser micromachining systems","publisher":"Oxford Lasers","source_type":"Product page","source_url":"https://oxfordlasers.com/products/laser-systems/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000515","legacy_id":"S0515","entity_type":"source","title":"Gold Sponsorship at SWTest 2026: Oxford Lasers Advancing Precision Microprocessing in Semiconductor Industry","publisher":"Oxford Lasers","source_type":"Press release (company)","source_url":"https://oxfordlasers.com/knowledge/laser-micromachining-systems/gold-sponsorship-at-swtest-2026-semiconductor-industry/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026","evidence_date":"2026","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"CURRENT","freshness":"Recent","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000516","legacy_id":"S0516","entity_type":"source","title":"About us – WOP | Workshop of Photonics - Femtosecond Laser Micromachining","publisher":"Workshop of Photonics","source_type":"Company website","source_url":"https://wophotonics.com/about-us/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000517","legacy_id":"S0517","entity_type":"source","title":"Halo Industries Grabs US$80 Million in Series B Funding","publisher":"Optica (OPN)","source_type":"Industry news","source_url":"https://www.optica-opn.org/home/industry/2024/july/halo_industries_grabs_us%2480_million_in_series_b_funding/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2024-07","evidence_date":"2024-07","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000518","legacy_id":"S0518","entity_type":"source","title":"Halo Industries raises $80m","publisher":"Verdict","source_type":"Industry news","source_url":"https://www.verdict.co.uk/halo-industries-raises-80m/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2024-07","evidence_date":"2024-07","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000519","legacy_id":"S0519","entity_type":"source","title":"Excimer Lasers | Precision Micromachining & UV Materials Processing | LightMachinery","publisher":"LightMachinery","source_type":"Product page","source_url":"https://lightmachinery.com/lasers/excimer-lasers/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000520","legacy_id":"S0520","entity_type":"source","title":"Semiconductor Manufacturing Equipment | SHIBAURA MECHATRONICS CORPORATION","publisher":"Shibaura Mechatronics","source_type":"Product page","source_url":"https://www.shibaura.co.jp/e/products/semicon/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000521","legacy_id":"S0521","entity_type":"source","title":"Semiconductor Equipment｜Introduction to Products｜Takatori Corporation","publisher":"Takatori","source_type":"Product page","source_url":"http://www.takatori-g.co.jp/english/products/products_semicon/index.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000522","legacy_id":"S0522","entity_type":"source","title":"Large field stepper UX-5 Series UX-7 Series | USHIO INC.","publisher":"Ushio","source_type":"Product page","source_url":"https://www.ushio.co.jp/en/products/1074.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000523","legacy_id":"S0523","entity_type":"source","title":"DIALOGIC Series | MITSUBOSHI DIAMOND INDUSTRIAL CO.,LTD.","publisher":"Mitsuboshi Diamond","source_type":"Product page","source_url":"https://www.mitsuboshidiamond.com/dialogic/en/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000524","legacy_id":"S0524","entity_type":"source","title":"Semiconductor-Production Equipment | Products and Services | Toray Engineering","publisher":"Toray Engineering","source_type":"Product page","source_url":"https://www.toray-eng.com/products/semicon/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000525","legacy_id":"S0525","entity_type":"source","title":"Electron Beam Lithography System | Products | JEOL Ltd.","publisher":"JEOL","source_type":"Product page","source_url":"https://www.jeol.com/products/semiconductor/ebx/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000526","legacy_id":"S0526","entity_type":"source","title":"Revasum | Semiconductor Grinding Technology","publisher":"Revasum","source_type":"Company website","source_url":"https://www.revasum.com/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000527","legacy_id":"S0527","entity_type":"source","title":"A GLOBAL LEADER IN SILICON CARBIDE SINGLE-WAFER PROCESSING EQUIPMENT","publisher":"Revasum","source_type":"Investor relations","source_url":"https://investors.revasum.com/DownloadFile.axd?file=%2FReport%2FComNews%2F20210301%2F02348230.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2021-03","evidence_date":"2021-03","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"VERY_STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000528","legacy_id":"S0528","entity_type":"source","title":"Business Segments :: Amtech Systems, Inc. (ASYS)","publisher":"Amtech Systems","source_type":"Company website","source_url":"https://www.amtechsystems.com/about/business-segments","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000529","legacy_id":"S0529","entity_type":"source","title":"Ultrasonic Coating Systems for Semiconductor Wafers | Photoresist & MEMS Solutions | Sono‑Tek","publisher":"Sono-Tek","source_type":"Product page","source_url":"https://www.sono-tek.com/industry/semiconductor-wafers/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000530","legacy_id":"S0530","entity_type":"source","title":"ABOUT TYSTAR | Tystar","publisher":"Tystar","source_type":"Company website","source_url":"https://tystar.com/en/company/about-tystar","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000531","legacy_id":"S0531","entity_type":"source","title":"Products Landing Page | Linton Crystal Technologies","publisher":"Linton Crystal Technologies","source_type":"Product page","source_url":"https://www.lintoncrystal.com/products","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000532","legacy_id":"S0532","entity_type":"source","title":"Wet Benches - Modutek","publisher":"Modutek","source_type":"Product page","source_url":"https://www.modutek.com/wet-benches/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000533","legacy_id":"S0533","entity_type":"source","title":"Evatec Company Profile | Thin Film Technology, Markets and Global Locations","publisher":"Evatec","source_type":"Company website","source_url":"https://evatecnet.com/about-us/company-overview/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000534","legacy_id":"S0534","entity_type":"source","title":"Semiconductor equipment manufacturer | Siconnex","publisher":"Siconnex","source_type":"Company website","source_url":"https://www.siconnex.com/us/company-2/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000535","legacy_id":"S0535","entity_type":"source","title":"Ion Beam Services - IBS : Ion implantation services and ion implanters manufacturer","publisher":"Ion Beam Services","source_type":"Company website","source_url":"https://www.ion-beam-services.com/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000536","legacy_id":"S0536","entity_type":"source","title":"Product Portfolio of Ion Beam and Plasma Processing ... (scia Systems)","publisher":"scia Systems","source_type":"Product page","source_url":"https://www.scia-systems.com/products","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000537","legacy_id":"S0537","entity_type":"source","title":"centrotherm wins its largest order to date in Semiconductor segment","publisher":"centrotherm","source_type":"Press release (company)","source_url":"http://www.centrotherm.world/presse/news/detail/article/centrotherm-gewinnt-den-bisher-groessten-auftrag-im-geschaeftssegment-halbleiter.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000538","legacy_id":"S0538","entity_type":"source","title":"Profile | PINK GmbH Thermosysteme","publisher":"PINK","source_type":"Company website","source_url":"https://www.pink.de/en/company/profile.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000539","legacy_id":"S0539","entity_type":"source","title":"Startup Atlant 3D raises funds for atomic layer manufacturing","publisher":"eeNews Europe","source_type":"Industry news","source_url":"https://www.eenewseurope.com/en/startup-atlant-3d-raises-funds-for-atomic-layer-manufacturing","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000540","legacy_id":"S0540","entity_type":"source","title":"AtomicLimits company talk: ATLANT 3D – Atomic layer processing technology","publisher":"AtomicLimits","source_type":"Industry news","source_url":"https://www.atomiclimits.com/2023/04/20/atomic-limits-company-talk-atlant-3d-atomic-layer-3d-printing/","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":"2023-04-20","evidence_date":"2023-04-20","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000541","legacy_id":"S0541","entity_type":"source","title":"AlixLabs raises €14.1M","publisher":"Silicon Canals","source_type":"Industry news","source_url":"https://siliconcanals.com/alixlabs-raises-e14-1m/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000542","legacy_id":"S0542","entity_type":"source","title":"AlixLabs secures SEK 40 million investment to advance energy-efficient semiconductor innovation","publisher":"SFNet","source_type":"Industry news","source_url":"https://www.sfnet.com/home/chapters/canada/news-detail/2023/09/05/alixlabs-secures-sek-40-million-investment-to-advance-energy-efficient-semiconductor-innovation","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":"2023-09-05","evidence_date":"2023-09-05","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000543","legacy_id":"S0543","entity_type":"source","title":"AlixLabs awarded Swedish innovation grant","publisher":"Compound Semiconductor","source_type":"Industry news","source_url":"https://compoundsemiconductor.net/article/120612/AlixLabs_awarded_Swedish_innovation_grant","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000544","legacy_id":"S0544","entity_type":"source","title":"UNISERS Raises $14M Seed Round to Bring Critical Materials Inspection to the Chip Industry","publisher":"Intel Capital","source_type":"Investor announcement","source_url":"https://www.intelcapital.com/unisers-raises-14m-seed-round-to-bring-critical-materials-inspection-to-the-chip-industry/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000545","legacy_id":"S0545","entity_type":"source","title":"Bringing Critical Materials Inspection to the Chip Industry","publisher":"M Ventures","source_type":"Investor announcement","source_url":"https://www.m-ventures.com/news/unisers-raises-14m-seed-round","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000546","legacy_id":"S0546","entity_type":"source","title":"Rigaku press release (15 Jul 2019): acquisition of XwinSys Technology Development","publisher":"Rigaku","source_type":"Press release (company)","source_url":"https://rigaku.com/press/mon-07152019-1200/127717956","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2019-07-15","evidence_date":"2019-07-15","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"VERY_STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000547","legacy_id":"S0547","entity_type":"source","title":"Rigaku Announces Acquisition of XwinSys Technology Development","publisher":"SelectScience","source_type":"Industry news","source_url":"https://zephr.selectscience.net/article/rigaku-announces-acquisition-of-xwinsys-technology-development","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":"2019-07","evidence_date":"2019-07","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"VERY_STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000548","legacy_id":"S0548","entity_type":"source","title":"Nanoscribe products | High-performance 3D printing","publisher":"Nanoscribe","source_type":"Product page","source_url":"https://www.nanoscribe.com/en/products/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000549","legacy_id":"S0549","entity_type":"source","title":"SCIL Nanoimprint Solutions (High Tech Campus Eindhoven company profile)","publisher":"High Tech Campus Eindhoven","source_type":"Trade association directory","source_url":"https://www.hightechcampus.com/companies/scil/","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000550","legacy_id":"S0550","entity_type":"source","title":"SCIL-Nanoimprint Solutions enables mass production of nanostructures","publisher":"Brainport Eindhoven","source_type":"Industry news","source_url":"https://brainporteindhoven.com/en/news/scil-nanoimprint-solutions-enables-mass-production-of-nanostructures","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000551","legacy_id":"S0551","entity_type":"source","title":"Photonics assembly and testing – From Lab to Fab – ficonTEC Service","publisher":"ficonTEC","source_type":"Company website","source_url":"https://www.ficontec.com/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000552","legacy_id":"S0552","entity_type":"source","title":"Panel Processing - Lam Research (semsysco.com)","publisher":"Semsysco / Lam Research","source_type":"Company website","source_url":"https://www.semsysco.com/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000553","legacy_id":"S0553","entity_type":"source","title":"Kurt J. Lesker Company | Custom Thin-Film Deposition Systems & Capabilities","publisher":"Kurt J. Lesker Company","source_type":"Product page","source_url":"https://www.lesker.com/process-equipment-division/thin-film-systems/custom-thin-film-deposition-systems-capabilities.cfm","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000554","legacy_id":"S0554","entity_type":"source","title":"About Kensington Laboratories & Automation","publisher":"Kensington Laboratories","source_type":"Company website","source_url":"https://kensingtonlabs.com/about-us/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000555","legacy_id":"S0555","entity_type":"source","title":"Automated Optical Inspection Solutions | Nanotronics","publisher":"Nanotronics","source_type":"Product page","source_url":"https://nanotronics.co/industry/advanced-materials/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000556","legacy_id":"S0556","entity_type":"source","title":"X-rays in Semiconductor (Sigray)","publisher":"Sigray","source_type":"Product page","source_url":"https://sigray.com/x-rays-in-semiconductor/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000557","legacy_id":"S0557","entity_type":"source","title":"Advancing Semiconductor with X-ray Precision (Sigray brochure, Jul 2025)","publisher":"Sigray","source_type":"Brochure / datasheet","source_url":"https://sigray.com/assets/Brochure_Xray_Solutions_Semiconductor_250715.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025-07","evidence_date":"2025-07","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000558","legacy_id":"S0558","entity_type":"source","title":"Inversion Semiconductor aims at brighter, faster lithography","publisher":"eeNews Europe","source_type":"Industry news","source_url":"https://www.eenewseurope.com/en/inversion-semiconductor-aims-at-brighter-faster-lithography/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000559","legacy_id":"S0559","entity_type":"source","title":"Inversion Semiconductor (Y Combinator company page)","publisher":"Y Combinator","source_type":"Trade association directory","source_url":"https://ycombinator.com/companies/inversion-semiconductor","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000560","legacy_id":"S0560","entity_type":"source","title":"CNF jump-starts startups in New York state","publisher":"Cornell Chronicle","source_type":"Industry news","source_url":"https://news.cornell.edu/stories/2020/04/cnf-jump-starts-startups-new-york-state","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2020-04","evidence_date":"2020-04","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"VERY_STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000561","legacy_id":"S0561","entity_type":"source","title":"AUROS Technology INC","publisher":"AUROS Technology","source_type":"Company website","source_url":"https://www.aurostech.com/eng/main/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000562","legacy_id":"S0562","entity_type":"source","title":"Auros Technology Inc (SEMI member directory)","publisher":"SEMI","source_type":"Trade association directory","source_url":"https://www.semi.org/en/resources/member-directory/auros-technology-inc","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000563","legacy_id":"S0563","entity_type":"source","title":"History – NEXTIN","publisher":"NEXTIN","source_type":"Company website","source_url":"http://nextinsol.com/en/history-2/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000564","legacy_id":"S0564","entity_type":"source","title":"About the company (Invest Korea profile: Nextin)","publisher":"Invest Korea (KOTRA)","source_type":"Government","source_url":"https://www.investkorea.org/ik-en/bbs/i-2487/detail.do?ntt_sn=9","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000565","legacy_id":"S0565","entity_type":"source","title":"Exicon (엑시콘) — official site","publisher":"Exicon","source_type":"Company website","source_url":"https://www.exicon.co.kr/en/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000566","legacy_id":"S0566","entity_type":"source","title":"Exicon (SEMI member directory)","publisher":"SEMI","source_type":"Trade association directory","source_url":"https://www.semi.org/en/resources/member-directory/exicon","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000567","legacy_id":"S0567","entity_type":"source","title":"KC Co., Ltd (SEMI member directory)","publisher":"SEMI","source_type":"Trade association directory","source_url":"https://www.semi.org/en/resources/member-directory/kc-co-ltd","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000568","legacy_id":"S0568","entity_type":"source","title":"KCTech | 케이씨텍","publisher":"KCTech","source_type":"Company website","source_url":"https://www.kctech.co.kr/chn/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000569","legacy_id":"S0569","entity_type":"source","title":"TES — Profile","publisher":"TES","source_type":"Company website","source_url":"http://www.hites.co.kr/eng/?page=aboutus%7Cprofile","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000570","legacy_id":"S0570","entity_type":"source","title":"TES Co., Ltd (SEMI member directory)","publisher":"SEMI","source_type":"Trade association directory","source_url":"https://www.semi.org/en/resources/member-directory/tes-co-ltd","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000571","legacy_id":"S0571","entity_type":"source","title":"MIRAE Corporation","publisher":"MIRAE","source_type":"Company website","source_url":"https://www.mirae.com/en","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000572","legacy_id":"S0572","entity_type":"source","title":"UniTest Inc (SEMI member directory)","publisher":"SEMI","source_type":"Trade association directory","source_url":"https://www.semi.org/en/resources/member-directory/unitest-inc","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000573","legacy_id":"S0573","entity_type":"source","title":"TheElec article on Uni-test burn-in testers (Chinese memory customer)","publisher":"TheElec","source_type":"Industry news","source_url":"https://thelec.net/news/articleView.html?idxno=710","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000574","legacy_id":"S0574","entity_type":"source","title":"Mi Equipment (M) Sdn Bhd (InvestPenang)","publisher":"InvestPenang","source_type":"Government","source_url":"https://investpenang.gov.my/mi-equipment-m-sdn-bhd/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000575","legacy_id":"S0575","entity_type":"source","title":"Mi Equipment (M) Sdn Bhd (SEMI member directory)","publisher":"SEMI","source_type":"Trade association directory","source_url":"https://www.semi.org/en/resources/member-directory/mi-equipment-m-sdn-bhd","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000576","legacy_id":"S0576","entity_type":"source","title":"AEM Singapore","publisher":"AEM","source_type":"Company website","source_url":"https://aem.com.sg/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000577","legacy_id":"S0577","entity_type":"source","title":"Products Archive - Aemulus Corporation Sdn Bhd","publisher":"Aemulus","source_type":"Product page","source_url":"https://aemulus.com/product/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000578","legacy_id":"S0578","entity_type":"source","title":"E&R Highlights Laser and Plasma Technologies for Advanced Packaging at SEMICON Taiwan 2025","publisher":"E&R Engineering (via PR Newswire Asia)","source_type":"Press release (company)","source_url":"https://en.prnasia.com/releases/apac/e-r-highlights-laser-and-plasma-technologies-for-advanced-packaging-at-semicon-taiwan-2025-501379.shtml","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025-09","evidence_date":"2025-09","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"CURRENT","freshness":"Recent","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000579","legacy_id":"S0579","entity_type":"source","title":"E&R to Showcase Glass Substrates and Advanced Technologies at SEMICON Taiwan 2024","publisher":"E&R Engineering (via Kyodo News PR Wire)","source_type":"Press release (company)","source_url":"https://kyodonewsprwire.jp/release/202408265367","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2024-08-26","evidence_date":"2024-08-26","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000580","legacy_id":"S0580","entity_type":"source","title":"Jiangsu Leadmicro Nano-Technology Co., Ltd (SEMI member directory)","publisher":"SEMI","source_type":"Trade association directory","source_url":"https://semi.org/en/resources/member-directory/jiangsu-leadmicro-nano-technology-co-ltd","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000581","legacy_id":"S0581","entity_type":"source","title":"Lab Equipment (Holmarc)","publisher":"Holmarc","source_type":"Product page","source_url":"https://holmarc.com/lab_equipments.php","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000582","legacy_id":"S0582","entity_type":"source","title":"About Us - Scantech Laser","publisher":"Scantech Laser","source_type":"Company website","source_url":"https://scantechlaser.com/about-us/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000583","legacy_id":"S0583","entity_type":"source","title":"Deposition Tools (IIT Jodhpur AIoT Fab facility)","publisher":"IIT Jodhpur","source_type":"Academic / research facility page","source_url":"https://iitj.ac.in/aiot-fab-facility/en/deposition-tools","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000584","legacy_id":"S0584","entity_type":"source","title":"Combinatorial Sputtering System (Excel Instrument) — IIT Ropar facilities","publisher":"IIT Ropar","source_type":"Academic / research facility page","source_url":"https://iitrpr.ac.in/mkumar/facilities.html","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000585","legacy_id":"S0585","entity_type":"source","title":"SkyWater Announces Enhanced Capabilities with Multibeam's First in Industry High Productivity Multicolumn E-Beam Lithography System (2024)","publisher":"SkyWater Technology","source_type":"Press release (customer)","source_url":"https://s27.q4cdn.com/656702482/files/doc_news/SkyWater-Announces-Enhanced-Capabilities-with-Multibeams-First-in-Industry-High-Productivity-Multicolumn-E-Beam-Lithography-System-2024.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2024","evidence_date":"2024","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000586","legacy_id":"S0586","entity_type":"source","title":"VOYAGER - e beam lithography system | RAITH","publisher":"Raith","source_type":"Product page","source_url":"https://raith.com/products/voyager/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000587","legacy_id":"S0587","entity_type":"source","title":"EBPG | RAITH","publisher":"Raith","source_type":"Product page","source_url":"https://raith.com/products/ebpg/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000588","legacy_id":"S0588","entity_type":"source","title":"MLA 150 Advanced Maskless Aligner ǀ Heidelberg Instruments","publisher":"Heidelberg Instruments","source_type":"Product page","source_url":"https://heidelberg-instruments.com/product/mla150/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000589","legacy_id":"S0589","entity_type":"source","title":"MLA 300 Industrial Maskless Aligner ǀ Heidelberg Instruments","publisher":"Heidelberg Instruments","source_type":"Product page","source_url":"https://heidelberg-instruments.com/product/mla300/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000590","legacy_id":"S0590","entity_type":"source","title":"µMLA Tabletop Maskless Aligner ǀ Heidelberg Instruments","publisher":"Heidelberg Instruments","source_type":"Product page","source_url":"https://heidelberg-instruments.com/product/%CE%BCmla/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000591","legacy_id":"S0591","entity_type":"source","title":"SINDRE - Obducat","publisher":"Obducat","source_type":"Product page","source_url":"https://www.obducat.com/products-foundry-services/sindre-2/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000592","legacy_id":"S0592","entity_type":"source","title":"Obducat receives order for a SINDRE® 400 Integra NIL-system from a customer in Asia valued at 14.5 million SEK","publisher":"Obducat","source_type":"Press release (company)","source_url":"https://www.obducat.com/mfn_news/obducat-receives-order-for-a-sindre-400-integra-nil-system-from-a-customer-in-asia-valued-at-14-5-million-sek/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000593","legacy_id":"S0593","entity_type":"source","title":"TEPHRA - 200 mm ALD Cluster Tool - Forge Nano","publisher":"Forge Nano","source_type":"Product page","source_url":"https://www.forgenano.com/archivesite/products/tephra/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000594","legacy_id":"S0594","entity_type":"source","title":"ALD ONE - Angstrom Engineering Atomic Layer Deposition System","publisher":"Angstrom Engineering","source_type":"Product page","source_url":"https://angstromengineering.com/products/atomic-layer-deposition/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000595","legacy_id":"S0595","entity_type":"source","title":"Amod Physical Vapor Deposition Platform | Amod PVD Platform","publisher":"Angstrom Engineering","source_type":"Product page","source_url":"https://angstromengineering.com/products/amod/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000596","legacy_id":"S0596","entity_type":"source","title":"Nebula Cluster - Angstrom Engineering","publisher":"Angstrom Engineering","source_type":"Product page","source_url":"https://angstromengineering.com/products/nebula-3/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000597","legacy_id":"S0597","entity_type":"source","title":"SiC Process Equipment for High Power Electronics (PVT200™ brochure)","publisher":"CVD Equipment Corporation","source_type":"Brochure / datasheet","source_url":"https://www.cvdequipment.com/DOCs/Systems/CVD/PVT200%E2%84%A2%20Brochure.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000598","legacy_id":"S0598","entity_type":"source","title":"Trymax NEO 2000 series – Trymax Semiconductor","publisher":"Trymax Semiconductor Equipment","source_type":"Product page","source_url":"https://trymax-semiconductor.com/equipment/trymax-neo-2000-series/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000599","legacy_id":"S0599","entity_type":"source","title":"Trymax NEO 3400 series - Trymax Semiconductor","publisher":"Trymax Semiconductor Equipment","source_type":"Product page","source_url":"https://www.trymax-semiconductor.com/equipment/trymax-neo-3400-series/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000600","legacy_id":"S0600","entity_type":"source","title":"Horizontal Furnaces - SVCS Process Innovation","publisher":"SVCS Process Innovation","source_type":"Product page","source_url":"https://www.svcs.com/products/horizontal-diffusion-furnace/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000601","legacy_id":"S0601","entity_type":"source","title":"Vertical Furnaces - SVCS Process Innovation","publisher":"SVCS Process Innovation","source_type":"Product page","source_url":"https://www.svcs.com/products/vtr/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000602","legacy_id":"S0602","entity_type":"source","title":"Horizontal LPCVD Furnace for High Process Performance","publisher":"SVCS Process Innovation","source_type":"Brochure / datasheet","source_url":"https://www.svcs.com/wp-content/uploads/2017/08/svcs_lpcvd_ang_print.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000603","legacy_id":"S0603","entity_type":"source","title":"RTP and RTCVD system - Annealsys","publisher":"Annealsys","source_type":"Product page","source_url":"https://www.annealsys.com/product-sheets/rtp-rtcvd-system/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000604","legacy_id":"S0604","entity_type":"source","title":"Economical 3-inch RTP system - Annealsys","publisher":"Annealsys","source_type":"Product page","source_url":"https://www.annealsys.com/product-sheets/rtp-system/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000605","legacy_id":"S0605","entity_type":"source","title":"High quality and high performance RTP and DLI-CVD / DLI-ALD systems","publisher":"Annealsys","source_type":"Company website","source_url":"https://www.annealsys.com/company/corporate/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000606","legacy_id":"S0606","entity_type":"source","title":"RIE Plasma Etching System RIE-10NR｜Samco Inc.","publisher":"Samco Inc.","source_type":"Product page","source_url":"https://www.samco.co.jp/en/products/etching/ccp_rie/RIE_Plasma_Etching_System_RIE-10NR.php","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000607","legacy_id":"S0607","entity_type":"source","title":"ICP-RIE Plasma Etching System RIE-230iP｜Samco Inc.","publisher":"Samco Inc.","source_type":"Product page","source_url":"https://www.samco.co.jp/en/products/etching/icp_rie/ICP-RIE_Plasma_Etching_System_RIE-230iP.php","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000608","legacy_id":"S0608","entity_type":"source","title":"ICP-RIE Plasma Etching System RIE-230iPC｜Samco Inc.","publisher":"Samco Inc.","source_type":"Product page","source_url":"https://www.samco.co.jp/en/products/etching/icp_rie/ICP-RIE_Plasma_Etching_System_RIE-230iPC.php","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000609","legacy_id":"S0609","entity_type":"source","title":"ICP-RIE Plasma Etching System RIE-350iPC｜Samco Inc.","publisher":"Samco Inc.","source_type":"Product page","source_url":"https://www.samco.co.jp/en/products/etching/icp_rie/ICP-RIE_Plasma_Etching_System_RIE-350iPC.php","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000610","legacy_id":"S0610","entity_type":"source","title":"ICP-RIE Plasma Etching System RIE-400iPC｜Samco Inc.","publisher":"Samco Inc.","source_type":"Product page","source_url":"https://www.samco.co.jp/en/products/etching/icp_rie/ICP-RIE_Plasma_Etching_System_RIE-400iPC.php","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000611","legacy_id":"S0611","entity_type":"source","title":"Samco Unveils New Plasma Etching Cluster Tool for Compound Semiconductor Device Fabrication｜News｜Samco Inc.","publisher":"Samco Inc.","source_type":"Press release (company)","source_url":"https://www.samco.co.jp/en/news/2022/samco_unveils_new_plasma_etching_cluster_tool_for_compound_semiconductor_device_fabrication.php","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2022","evidence_date":"2022","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000612","legacy_id":"S0612","entity_type":"source","title":"Plasma etching & PECVD clustering - SENTECH","publisher":"SENTECH Instruments","source_type":"Product page","source_url":"https://www.sentech.com/en/site__300/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000613","legacy_id":"S0613","entity_type":"source","title":"VertaCure Automated Production Vacuum Cure System","publisher":"Yield Engineering Systems (YES)","source_type":"Product page","source_url":"https://yieldengineering.com/vertacure-2/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000614","legacy_id":"S0614","entity_type":"source","title":"YES VertaCure XP Brochure (Apr 2022)","publisher":"Yield Engineering Systems (YES)","source_type":"Brochure / datasheet","source_url":"https://yieldengineering.com/wp-content/uploads/2022/04/YES-VertaCure-XP-Brochure_041922.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2022-04","evidence_date":"2022-04","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000615","legacy_id":"S0615","entity_type":"source","title":"3880-II Die Bonder","publisher":"Palomar Technologies","source_type":"Product page","source_url":"https://www.palomartechnologies.com/product/3880-ii-die-bonder","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000616","legacy_id":"S0616","entity_type":"source","title":"Sub-Micron Die Bonder for R&D and High-Precision Assembly | Finetech","publisher":"Finetech","source_type":"Product page","source_url":"https://finetech.de/products/fineplacer-femto-2/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000617","legacy_id":"S0617","entity_type":"source","title":"Sub-Micron Die Bonder for Flexible R&D and Complex Assembly | Finetech","publisher":"Finetech","source_type":"Product page","source_url":"https://finetech.de/products/fineplacer-sigma/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000618","legacy_id":"S0618","entity_type":"source","title":"Sub-Micron Table-Top Die Bonder for R&D and Prototyping | Finetech","publisher":"Finetech","source_type":"Product page","source_url":"https://finetech.de/products/fineplacer-lambda-2/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000619","legacy_id":"S0619","entity_type":"source","title":"NEWS RELEASE S.E.T. unveils the FC300: A New High Force 300 mm Device Bonder","publisher":"SET (Smart Equipment Technology)","source_type":"Press release (company)","source_url":"https://set-sas.fr/wp-content/uploads/fc300pressreleaseset.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000620","legacy_id":"S0620","entity_type":"source","title":"SET launches the NEO HB - New product in the world of Flip-Chip Bonding","publisher":"SET (Smart Equipment Technology)","source_type":"Press release (company)","source_url":"https://set-sas.fr/set-launches-the-neo-hb-new-product-in-the-world-of-flip-chip-bonding/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000621","legacy_id":"S0621","entity_type":"source","title":"Direct Bonding - SET Flip-Chip Bonders","publisher":"SET (Smart Equipment Technology)","source_type":"Product page","source_url":"https://set-sas.fr/catalog/direct-bonding/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000622","legacy_id":"S0622","entity_type":"source","title":"Oxford Lasers A Series Micromachining System","publisher":"Oxford Lasers","source_type":"Product page","source_url":"https://oxfordlasers.com/products/laser-systems/laser-systems-a-series/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000623","legacy_id":"S0623","entity_type":"source","title":"Femtosecond Laser Micromachining Workstation FemtoLAB – WOP | Workshop of Photonics","publisher":"Workshop of Photonics (WOP)","source_type":"Product page","source_url":"https://wophotonics.com/products/femtolab/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000624","legacy_id":"S0624","entity_type":"source","title":"WOP Introduces Glass & Sapphire Cutting Workstation FemtoGLASS – Workshop of Photonics","publisher":"Workshop of Photonics (WOP)","source_type":"Press release (company)","source_url":"https://wophotonics.com/news/wop-introduces-glass-sapphire-cutting-workstation-femtoglass/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000625","legacy_id":"S0625","entity_type":"source","title":"Femtosecond laser micromachining workstation FemtoFAB – Workshop of Photonics","publisher":"Workshop of Photonics (WOP)","source_type":"Product page","source_url":"https://wophotonics.com/products/femtofab/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000626","legacy_id":"S0626","entity_type":"source","title":"Laser Micromachining Workstation FemtoMPP – Workshop of Photonics","publisher":"Workshop of Photonics (WOP)","source_type":"Product page","source_url":"https://wophotonics.com/products/femtompp/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000627","legacy_id":"S0627","entity_type":"source","title":"Heavy Duty Excimer Laser | Ultra Low Gas Laser | LightMachinery","publisher":"LightMachinery","source_type":"Product page","source_url":"https://lightmachinery.com/lasers/excimer-lasers/ipex-800/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000628","legacy_id":"S0628","entity_type":"source","title":"IPEX-700 spec sheet","publisher":"LightMachinery","source_type":"Brochure / datasheet","source_url":"https://lightmachinery.com/media/1867/spec-sheet-ipex-700.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000629","legacy_id":"S0629","entity_type":"source","title":"High-End Wafer Level Package Bonder TFC-6600 | SHIBAURA MECHATRONICS CORPORATION","publisher":"Shibaura Mechatronics","source_type":"Product page","source_url":"https://www.shibaura.co.jp/e/products/semicon/spe-10.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000630","legacy_id":"S0630","entity_type":"source","title":"Hybrid Bonder TFC-6700 / TFC-6800 | SHIBAURA MECHATRONICS CORPORATION","publisher":"Shibaura Mechatronics","source_type":"Product page","source_url":"https://www.shibaura.co.jp/e/products/semicon/spe-11.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000631","legacy_id":"S0631","entity_type":"source","title":"Panel Level Package Bonder High Performance TFC-9300 / High Accuracy TFC-9310 | SHIBAURA MECHATRONICS CORPORATION","publisher":"Shibaura Mechatronics","source_type":"Product page","source_url":"https://www.shibaura.co.jp/e/products/semicon/spe-13.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000632","legacy_id":"S0632","entity_type":"source","title":"Multi-Process Bonder TFC-6500 | SHIBAURA MECHATRONICS CORPORATION","publisher":"Shibaura Mechatronics","source_type":"Product page","source_url":"https://www.shibaura.co.jp/e/products/semicon/spe-09.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000633","legacy_id":"S0633","entity_type":"source","title":"Wafer Mounter ｜Semiconductor Equipment","publisher":"Takatori Corporation","source_type":"Product page","source_url":"http://www.takatori-g.co.jp/english/products/products_semicon/detail/taiko-02.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000634","legacy_id":"S0634","entity_type":"source","title":"ATM-3100｜Semiconductor Equipment","publisher":"Takatori Corporation","source_type":"Product page","source_url":"http://www.takatori-g.co.jp/english/products/products_semicon/detail/atm-3000.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000635","legacy_id":"S0635","entity_type":"source","title":"TEAM-100｜Semiconductor Equipment","publisher":"Takatori Corporation","source_type":"Product page","source_url":"http://www.takatori-g.co.jp/english/products/products_semicon/detail/team-100.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000636","legacy_id":"S0636","entity_type":"source","title":"ATRM-2400TKUV ｜Semiconductor Equipment","publisher":"Takatori Corporation","source_type":"Product page","source_url":"https://www.takatori-g.co.jp/english/products/products_semicon/detail/atrm-2400tkuv.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000637","legacy_id":"S0637","entity_type":"source","title":"Full field projection aligner UX-4 Series | USHIO INC.","publisher":"Ushio Inc.","source_type":"Product page","source_url":"https://www.ushio.co.jp/en/products/1025.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000638","legacy_id":"S0638","entity_type":"source","title":"USHIO Exhibits Lithography Tools for Next-Generation Packaging, including 300mm Interposer Stepper UX7-3Di LIS 350 at SEMICON West 2014","publisher":"Ushio Inc.","source_type":"Press release (company)","source_url":"https://www.ushio.co.jp/en/news/1002/2014-2014/101326.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2014","evidence_date":"2014","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"VERY_STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000639","legacy_id":"S0639","entity_type":"source","title":"Announcement of the planned launch of a 1.5μm resolution stepper — Expanding the product lineup for advanced packaging","publisher":"Ushio Inc.","source_type":"Press release (company)","source_url":"https://www.ushio.co.jp/en/news/1002/2025-2025/501410.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025","evidence_date":"2025","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000640","legacy_id":"S0640","entity_type":"source","title":"New Semiconductor Wafer Singulation System “DIALOGIC Plus+” Featured in Electronic Device Industry News(JP)","publisher":"Mitsuboshi Diamond Industrial","source_type":"Press release (company)","source_url":"https://www.mitsuboshidiamond.com/eng/news/20251119-1/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025-11","evidence_date":"2025-11","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"CURRENT","freshness":"Recent","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000641","legacy_id":"S0641","entity_type":"source","title":"FC3000S | Flip Chip Bonders | Semiconductor-Production Equipment | Toray Engineering","publisher":"Toray Engineering","source_type":"Product page","source_url":"https://www.toray-eng.com/products/semicon/sem_003.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000642","legacy_id":"S0642","entity_type":"source","title":"PB3000 | Flip Chip Bonders | Semiconductor Production Equipment | Toray Engineering","publisher":"Toray Engineering","source_type":"Product page","source_url":"https://www.toray-eng.com/products/semicon/sem_012.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000643","legacy_id":"S0643","entity_type":"source","title":"Launch of UC5000 Semiconductor Packaging Equipment Compatible with Large Glass Panels ~ High-accuracy packaging in panel level packaging ~","publisher":"Toray Engineering","source_type":"Press release (company)","source_url":"https://www.toray-eng.com/news/2025/20250326.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025-03","evidence_date":"2025-03","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000644","legacy_id":"S0644","entity_type":"source","title":"Chip Inspection System GEN3000T | Semiconductor inspection equipment | Toray Engineering","publisher":"Toray Engineering","source_type":"Product page","source_url":"http://www.toray-eng.com/products/measuring/mea_003.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000645","legacy_id":"S0645","entity_type":"source","title":"JBX-A9 Series Electron Beam Lithography System | Products | JEOL Ltd.","publisher":"JEOL","source_type":"Product page","source_url":"https://www.jeol.com/products/semiconductor/ebx/JBX-A9.php","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000646","legacy_id":"S0646","entity_type":"source","title":"JBX-8100FS Series Electron Beam Lithography System | Products | JEOL Ltd.","publisher":"JEOL","source_type":"Product page","source_url":"https://www.jeol.com/products/semiconductor/ebx/JBX-8100FS.php","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000647","legacy_id":"S0647","entity_type":"source","title":"JBX-3200MVS Electron Beam Lithography System | Products | JEOL Ltd.","publisher":"JEOL","source_type":"Product page","source_url":"https://www.jeol.com/products/semiconductor/ebx/JBX-3200MV.php","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000648","legacy_id":"S0648","entity_type":"source","title":"JBX-3050MV/S Electron Beam Lithography System | Products | JEOL Ltd.","publisher":"JEOL","source_type":"Product page","source_url":"https://www.jeol.com/products/semiconductor/ebx/JBX-3050MV.php","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000649","legacy_id":"S0649","entity_type":"source","title":"Silicon Carbide Single-Wafer Process Solutions (Revasum, May 2023)","publisher":"Revasum","source_type":"Investor relations","source_url":"https://investors.revasum.com/DownloadFile.axd?file=/Report/ComNews/20230526/02669884.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2023-05","evidence_date":"2023-05","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000650","legacy_id":"S0650","entity_type":"source","title":"Amtech Systems Receives Large Repeat Order for Advanced Packaging Reflow Systems","publisher":"Amtech Systems","source_type":"Press release (company)","source_url":"https://www.amtechsystems.com/news-media/press-releases/detail/355/amtech-systems-receives-large-repeat-order-for-advanced","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000651","legacy_id":"S0651","entity_type":"source","title":"Ultrasonic Spray Photoresist Coating for MEMS Wafers | Sono-Tek","publisher":"Sono-Tek","source_type":"Product page","source_url":"https://www.sono-tek.com/industry/semiconductor-wafers/mems-semiconductor/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000652","legacy_id":"S0652","entity_type":"source","title":"TYTAN MINI SERIES | Tystar","publisher":"Tystar","source_type":"Product page","source_url":"https://tystar.com/en/products/tytan/mini-series","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000653","legacy_id":"S0653","entity_type":"source","title":"TYTAN STANDARD SERIES | Tystar","publisher":"Tystar","source_type":"Product page","source_url":"https://tystar.com/en/products/tytan/standard-series","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000654","legacy_id":"S0654","entity_type":"source","title":"KX380PV | Linton Crystal Technologies","publisher":"Linton Crystal Technologies","source_type":"Product page","source_url":"https://www.lintoncrystal.com/products/cz-growing-equipment/kx380pv","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000655","legacy_id":"S0655","entity_type":"source","title":"Crystal Processing Equipment | Linton Crystal Technologies","publisher":"Linton Crystal Technologies","source_type":"Product page","source_url":"https://www.lintoncrystal.com/products/crystal-processing-equipment","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000656","legacy_id":"S0656","entity_type":"source","title":"Automated Wet Bench and Wet Processing Systems - Modutek","publisher":"Modutek","source_type":"Product page","source_url":"https://www.modutek.com/wet-benches/automated-wet-bench-systems/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000657","legacy_id":"S0657","entity_type":"source","title":"Semi-Automated Wet Bench and Wet Processing Systems - Modutek","publisher":"Modutek","source_type":"Product page","source_url":"https://www.modutek.com/wet-benches/semi-automated-wet-processing-systems/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000658","legacy_id":"S0658","entity_type":"source","title":"Manual Wet Process Station - Modutek","publisher":"Modutek","source_type":"Product page","source_url":"https://www.modutek.com/wet-benches/manual-wet-process-station/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000659","legacy_id":"S0659","entity_type":"source","title":"CLUSTERLINE® 200","publisher":"Evatec","source_type":"Product page","source_url":"https://evatecnet.com/products/clusterline-family/clusterline-200/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000660","legacy_id":"S0660","entity_type":"source","title":"CLUSTERLINE® 300","publisher":"Evatec","source_type":"Product page","source_url":"https://evatecnet.com/products/clusterline-family/clusterline-300/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000661","legacy_id":"S0661","entity_type":"source","title":"PEALD Technology","publisher":"Evatec","source_type":"Product page","source_url":"https://evatecnet.com/technology/peald-technology/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000662","legacy_id":"S0662","entity_type":"source","title":"BATCHSPRAY® Acid | Wet Processing Systems | Siconnex","publisher":"Siconnex","source_type":"Product page","source_url":"https://www.siconnex.com/products/equipment/acid","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000663","legacy_id":"S0663","entity_type":"source","title":"BATCHSPRAY® Autoload Acid | Wet Processing Systems | Siconnex","publisher":"Siconnex","source_type":"Product page","source_url":"https://www.siconnex.com/products/equipment/acid-autoload","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000664","legacy_id":"S0664","entity_type":"source","title":"BATCHSPRAY® Solvent Processing Systems | Siconnex","publisher":"Siconnex","source_type":"Product page","source_url":"https://www.siconnex.com/en/products/batchspray-solvent/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000665","legacy_id":"S0665","entity_type":"source","title":"BATCHSPRAY® Solvent Autoload | Wet Processing Equipment | Siconnex","publisher":"Siconnex","source_type":"Product page","source_url":"https://www.siconnex.com/products/equipment/solvent-autoload","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000666","legacy_id":"S0666","entity_type":"source","title":"scia Trim 200","publisher":"scia Systems","source_type":"Product page","source_url":"https://www.scia-systems.com/products/ion-beam-trimming/scia-trim-200","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000667","legacy_id":"S0667","entity_type":"source","title":"R&D Wafer Process System: c.VERTICOO Mini","publisher":"centrotherm international","source_type":"Product page","source_url":"http://www.centrotherm.world/technologien-loesungen/halbleiter/produktionsequipment/cverticoo-mini.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000668","legacy_id":"S0668","entity_type":"source","title":"New SIN 50+ and SIN 100 Multi Drive Sintering Systems: Less Power, More Efficiency","publisher":"PINK GmbH Thermosysteme","source_type":"Press release (company)","source_url":"https://pink.de/en/products/sin50plus-sin100multidrive/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000669","legacy_id":"S0669","entity_type":"source","title":"Quantum X litho | 2.5D grayscale lithography system","publisher":"Nanoscribe","source_type":"Product page","source_url":"https://www.nanoscribe.com/en/products/quantum-x-litho/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000670","legacy_id":"S0670","entity_type":"source","title":"Quantum X align | High-precision 3D optics printer","publisher":"Nanoscribe","source_type":"Product page","source_url":"https://www.nanoscribe.com/en/products/quantum-x-align/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000671","legacy_id":"S0671","entity_type":"source","title":"ficonTEC Introduces Industry's First, ATE Agnostic, Top-Sided Electro-optical Wafer-level Tester","publisher":"ficonTEC","source_type":"Press release (company)","source_url":"https://www.ficontec.com/ficontec-introduces-industrys-first-ate-agnostic-top-sided-electro-optical-wafer-level-tester/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000672","legacy_id":"S0672","entity_type":"source","title":"ficonTEC releases innovative wafer-level test cell to complement existing ATE","publisher":"ficonTEC","source_type":"Press release (company)","source_url":"https://www.ficontec.com/ficontec-releases-innovative-wafer-level-test-cell-to-complement-existing-ate/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000673","legacy_id":"S0673","entity_type":"source","title":"Kallisto (Panel Processing) - Semsysco","publisher":"Semsysco","source_type":"Product page","source_url":"https://www.semsysco.com/products/kallisto/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000674","legacy_id":"S0674","entity_type":"source","title":"Kurt J. Lesker Company | PRO Line PVD 200 Thin Film Deposition System Platform","publisher":"Kurt J. Lesker Company","source_type":"Product page","source_url":"https://www.lesker.com/process-equipment-division/thin-film-systems/pro-line-pvd-200-deposition-platform.cfm","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000675","legacy_id":"S0675","entity_type":"source","title":"Kurt J. Lesker Company | CMS Series Thin Film Deposition System Platform","publisher":"Kurt J. Lesker Company","source_type":"Product page","source_url":"https://www.lesker.com/process-equipment-division/thin-film-systems/cms-deposition-platform.cfm","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000676","legacy_id":"S0676","entity_type":"source","title":"Wafer Handling Robot, SCARA Wafer Robot","publisher":"Kensington Laboratories","source_type":"Product page","source_url":"https://www.kensingtonlabs.com/product-cat/robots/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000677","legacy_id":"S0677","entity_type":"source","title":"Wafer Automation, Robots & Precision Products","publisher":"Kensington Laboratories","source_type":"Product page","source_url":"https://kensingtonlabs.com/products/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000678","legacy_id":"S0678","entity_type":"source","title":"nSpec PS | Nanotronics","publisher":"Nanotronics","source_type":"Product page","source_url":"https://nanotronics.co/product/nspec-ps-cabinet/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000679","legacy_id":"S0679","entity_type":"source","title":"nSpec® LS Wafer Inspection Microscope | Nanotronics","publisher":"Nanotronics","source_type":"Product page","source_url":"https://nanotronics.co/pages/nspec","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000680","legacy_id":"S0680","entity_type":"source","title":"Sigray | EclipseXRM 910","publisher":"Sigray","source_type":"Product page","source_url":"https://sigray.com/eclipsexrm-910/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000681","legacy_id":"S0681","entity_type":"source","title":"Apex Hybrid - Sigray","publisher":"Sigray","source_type":"Product page","source_url":"https://sigray.com/apex-hybrid/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000682","legacy_id":"S0682","entity_type":"source","title":"AttoMap-200 MicroXRF - Sigray","publisher":"Sigray","source_type":"Product page","source_url":"https://www.sigray.com/attomap-200/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000683","legacy_id":"S0683","entity_type":"source","title":"Package Overlay Metrology","publisher":"AUROS Technology","source_type":"Product page","source_url":"https://www.aurostech.com/new/business/package_overlay_metrology.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000684","legacy_id":"S0684","entity_type":"source","title":"WaPIS-30 - AUROS Technology INC","publisher":"AUROS Technology","source_type":"Product page","source_url":"https://www.aurostech.com/eng/business/WaPIS-30.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000685","legacy_id":"S0685","entity_type":"source","title":"AEGIS – NEXTIN","publisher":"NEXTIN","source_type":"Product page","source_url":"https://nextinsol.com/en/aegis-2/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000686","legacy_id":"S0686","entity_type":"source","title":"Memory Tester","publisher":"Exicon","source_type":"Product page","source_url":"https://www.exicon.co.kr/kr/product/product_list.php?part1_idx=1","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000687","legacy_id":"S0687","entity_type":"source","title":"SSD Tester","publisher":"Exicon","source_type":"Product page","source_url":"https://exicon.co.kr/en/product/product_list.php?part1_idx=2","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000688","legacy_id":"S0688","entity_type":"source","title":"SoC Tester","publisher":"Exicon","source_type":"Product page","source_url":"https://exicon.co.kr/en/product/product_list.php?part1_idx=3","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000689","legacy_id":"S0689","entity_type":"source","title":"Burn-In Tester","publisher":"Exicon","source_type":"Product page","source_url":"https://exicon.co.kr/en/product/product_list.php?part1_idx=4","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000690","legacy_id":"S0690","entity_type":"source","title":"Semiconductor - CHALLENGER HT Series","publisher":"TES Co., Ltd.","source_type":"Product page","source_url":"https://www.hites.co.kr/?page=business%7Cpecvd","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000691","legacy_id":"S0691","entity_type":"source","title":"Logic Test Handler - MIRAE","publisher":"MIRAE Corporation","source_type":"Product page","source_url":"http://www.mirae.com/en/sub/sub2_2_4.asp","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000692","legacy_id":"S0692","entity_type":"source","title":"Module Test Handler","publisher":"MIRAE Corporation","source_type":"Product page","source_url":"http://www.mirae.com/en/sub/sub2_2_5.asp","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000693","legacy_id":"S0693","entity_type":"source","title":"Burn–In Sorters - MIRAE","publisher":"MIRAE Corporation","source_type":"Product page","source_url":"http://www.mirae.com/en/sub/sub2_2_2.asp","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000694","legacy_id":"S0694","entity_type":"source","title":"AEM Expands System Level Test on AMPS Platform - AEM","publisher":"AEM Holdings","source_type":"Press release (company)","source_url":"https://aem.com.sg/news/aem-expands-system-level-test-on-amps-platform/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000695","legacy_id":"S0695","entity_type":"source","title":"AMB4200 - Aemulus Corporation Sdn Bhd","publisher":"Aemulus","source_type":"Product page","source_url":"https://aemulus.com/product/amb4200/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000696","legacy_id":"S0696","entity_type":"source","title":"AMB4600 - Aemulus Corporation Sdn Bhd","publisher":"Aemulus","source_type":"Product page","source_url":"https://aemulus.com/product/amb4600/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000697","legacy_id":"S0697","entity_type":"source","title":"AMB5600 - Aemulus Corporation Sdn Bhd","publisher":"Aemulus","source_type":"Product page","source_url":"https://aemulus.com/product/amb5600/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000698","legacy_id":"S0698","entity_type":"source","title":"AMB7600-SR - Aemulus Corporation Sdn Bhd","publisher":"Aemulus","source_type":"Product page","source_url":"https://aemulus.com/product/amb7600-sr/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000699","legacy_id":"S0699","entity_type":"source","title":"Spin Coating Unit","publisher":"Holmarc Opto-Mechatronics","source_type":"Product page","source_url":"https://www.holmarc.com/spin_coating_unit.php","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000700","legacy_id":"S0700","entity_type":"source","title":"Spin Coating Unit - Larger version","publisher":"Holmarc Opto-Mechatronics","source_type":"Product page","source_url":"https://www.holmarc.com/spin_coating_unit_large.php","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000701","legacy_id":"S0701","entity_type":"source","title":"20W Pulsed Fiber Laser Marking Machine - ProMark OEM - Scantech Laser","publisher":"Scantech Laser","source_type":"Product page","source_url":"https://scantechlaser.com/archives/standard-machine/20w-pulsed-fiber-laser-marking-machine-promark-oem/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000702","legacy_id":"S0702","entity_type":"source","title":"VLC Photonics receives new Wafer-level Test system from ficonTEC - ficonTEC","publisher":"ficonTEC","source_type":"Press release (company)","source_url":"https://www.ficontec.com/vlc-photonics-receives-new-wafer-level-test-system-from-ficontec/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000703","legacy_id":"S0703","entity_type":"source","title":"Bay Photonics Targets Fine Pitch Placement of Flip-Chip Photonics Devices Utilizing Palomar 3880 Die Bonder","publisher":"Palomar Technologies","source_type":"Press release (company)","source_url":"https://www.palomartechnologies.com/news-room/press-releases/bay-photonics-targets-fine-pitch-placement-of-flip-chip-photonics-devices-utilizing-palomar-3880-die-bonder","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000704","legacy_id":"S0704","entity_type":"source","title":"Electronics and Photonics Innovation Center (EPIC) Purchases Palomar 3880 Die Bonder for Expanded Packaging Research","publisher":"Palomar Technologies","source_type":"Press release (company)","source_url":"https://www.palomartechnologies.com/news-room/press-releases/electronics-and-photonics-innovation-center-epic-purchases-palomar-3880-die-bonder-for-expanded-packaging-research","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000705","legacy_id":"S0705","entity_type":"source","title":"YES Secures VertaCure™ XP Volume Purchase Order from Powertech Technology Inc. - Yield Engineering Systems","publisher":"Yield Engineering Systems (YES)","source_type":"Press release (company)","source_url":"https://yieldengineering.com/company/news/yes-secures-vertacure-xp-volume-purchase-order-from-powertech-technology-inc/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000706","legacy_id":"S0706","entity_type":"source","title":"YES Receives Repeat, Volume VertaCure Order from Major Foundry - Yield Engineering Systems","publisher":"Yield Engineering Systems (YES)","source_type":"Press release (company)","source_url":"https://yieldengineering.com/company/news/yes-receives-repeat-volume-vertacure-order-from-major-foundry/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000707","legacy_id":"S0707","entity_type":"source","title":"Leading Korean OSAT Purchases YES VertaCure™ XP for Higher Yield and Performance - Yield Engineering Systems","publisher":"Yield Engineering Systems (YES)","source_type":"Press release (company)","source_url":"https://yieldengineering.com/company/news/leading-korean-osat-purchases-yes-vertacure-xp-for-higher-yield-and-performance/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000708","legacy_id":"S0708","entity_type":"source","title":"Obducat: Obducat secures a Sindre® 400 NIL-system order to be used in mass production of LEDs - Obducat","publisher":"Obducat","source_type":"Press release (company)","source_url":"https://www.obducat.com/mfn_news/obducat-obducat-secures-a-sindre-400-nil-system-order-to-be-used-in-mass-production-of-leds/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000709","legacy_id":"S0709","entity_type":"source","title":"Major memory IDM company selects AEM as its System Level Test (SLT) provider - AEM","publisher":"AEM Holdings","source_type":"Press release (company)","source_url":"https://aem.com.sg/news/major-memory-idm-company-selects-aem-as-its-system-level-test-slt-provider/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000710","legacy_id":"S0710","entity_type":"source","title":"AEM's Advanced Thermal Control Solutions Selected as Plan-of-Record for System Level Test by Major Fabless Provider for Next-Gen AI Devices - AEM","publisher":"AEM Holdings","source_type":"Press release (company)","source_url":"https://aem.com.sg/news/aems-advanced-thermal-control-solutions-selected-as-plan-of-record-for-system-level-test-by-major-fabless-provider-for-next-gen-ai-devices/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000711","legacy_id":"S0711","entity_type":"source","title":"ETNews (English), 9 Aug 2016 — Nextin wafer inspection report","publisher":"NEXTIN","source_type":"Industry news","source_url":"https://english.etnews.com/20160809200002","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2016-08-09","evidence_date":"2016-08-09","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"VERY_STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-3","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000712","legacy_id":"S0712","entity_type":"source","title":"Heavy Wire Bonder – Hesse GmbH","publisher":"Hesse","source_type":"Product page","source_url":"https://www.hesse-mechatronics.com/en/heavy-wire-bonder/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000713","legacy_id":"S0713","entity_type":"source","title":"1551 S. Harris Court, Anaheim, CA 92806 (West-Bond 7KE specifications)","publisher":"West-Bond","source_type":"Brochure / datasheet","source_url":"https://westbond.com/wp-content/uploads/2022/05/7KE_specs.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000714","legacy_id":"S0714","entity_type":"source","title":"Service - TPT Wire Bonder GmbH","publisher":"TPT","source_type":"Company website","source_url":"https://www.tpt-wirebonder.com/service/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000715","legacy_id":"S0715","entity_type":"source","title":"Die Sorting (Mühlbauer)","publisher":"Mühlbauer","source_type":"Product page","source_url":"https://www.muehlbauer.de/products/semiconductor-related-products/die-sorting/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000716","legacy_id":"S0716","entity_type":"source","title":"Die Attach - Itec Equipment","publisher":"ITEC","source_type":"Product page","source_url":"https://www.itecequipment.com/solutions/die-attach","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000717","legacy_id":"S0717","entity_type":"source","title":"Equipment | Boschman","publisher":"Boschman","source_type":"Product page","source_url":"https://www.boschman.nl/equipment/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000718","legacy_id":"S0718","entity_type":"source","title":"About inTEST Corporation","publisher":"inTEST","source_type":"Company website","source_url":"https://intest.com/about/about","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000719","legacy_id":"S0719","entity_type":"source","title":"MBE Systems (Riber)","publisher":"Riber","source_type":"Product page","source_url":"https://riber.com/mbe-systems","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000720","legacy_id":"S0720","entity_type":"source","title":"MBE Systems (SVT Associates)","publisher":"SVT Associates","source_type":"Product page","source_url":"https://svta.com/mbe-systems.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000721","legacy_id":"S0721","entity_type":"source","title":"Dr Eberl MBE Komponenten GmbH (Compound Semiconductor buyers' guide)","publisher":"Compound Semiconductor","source_type":"Trade association directory","source_url":"https://compoundsemiconductor.net/buyers-guide/companies/181/Dr-Eberl-MBE-Komponenten-GmbH","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000722","legacy_id":"S0722","entity_type":"source","title":"AJA International, Inc. Sputtering Tools and Systems","publisher":"AJA International","source_type":"Company website","source_url":"https://ajaint.com","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000723","legacy_id":"S0723","entity_type":"source","title":"Thin Film Deposition By Sputtering: Essential Basics - Semicore Equipment Inc.","publisher":"Semicore","source_type":"Company website","source_url":"https://www.semicore.com/news/70-thin-film-deposition-sputtering","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000724","legacy_id":"S0724","entity_type":"source","title":"Torr International Services LLC (StatNano company profile)","publisher":"StatNano","source_type":"Trade association directory","source_url":"https://product.statnano.com/company/torr-international-services-llc","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000725","legacy_id":"S0725","entity_type":"source","title":"Tropel Wafer Analysis Systems | Advanced Analytic and Metrology Instruments | Corning","publisher":"Corning","source_type":"Product page","source_url":"https://www.corning.com/emea/en/products/advanced-optics/product-materials/analytic-instruments/metrology-instruments/tropel-wafer-analysis-systems.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000726","legacy_id":"S0726","entity_type":"source","title":"SPIE Photomask Technology + EUVL conference recap: Canatu carbon nanotube membranes unveiled as a versatile material platform for EUV pellicles and debris filters","publisher":"Canatu","source_type":"Press release (company)","source_url":"https://canatu.com/company/canatu-news/spie-photomask-technology-euvl-conference-recap-canatu-carbon-nanotube-membranes-unveiled-as-a-versatile-material-platform-for-euv-pellicles-and-debris-filters/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000727","legacy_id":"S0727","entity_type":"source","title":"aweXome Ray (Korea Herald article on CNT membranes for EUV pellicles)","publisher":"The Korea Herald","source_type":"Industry news","source_url":"https://www.koreaherald.com/article/10836415","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000728","legacy_id":"S0728","entity_type":"source","title":"Photomask Repair (Bruker — EL-C)","publisher":"Bruker","source_type":"Product page","source_url":"https://www.bruker.com/en/products-and-solutions/semiconductor-solutions/photomask-repair/el-c.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000729","legacy_id":"S0729","entity_type":"source","title":"Who We Are (Critical Manufacturing)","publisher":"Critical Manufacturing","source_type":"Company website","source_url":"https://www.criticalmanufacturing.com/company/who-we-are/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000730","legacy_id":"S0730","entity_type":"source","title":"Critical Manufacturing MES provides advanced capabilities for future semiconductor production","publisher":"Critical Manufacturing","source_type":"Press release (company)","source_url":"https://www.criticalmanufacturing.com/press-releases/critical-manufacturing-mes-provides-advanced-capabilities-for-future-semiconductor-production/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2021-11-02","evidence_date":"2021-11-02","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000731","legacy_id":"S0731","entity_type":"source","title":"Products | Kashiyama Industries, Ltd.","publisher":"Kashiyama","source_type":"Product page","source_url":"https://www.kashiyama.com/en/pumps/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000732","legacy_id":"S0732","entity_type":"source","title":"Industrial dry vacuum pumps - Leybold USA","publisher":"Leybold","source_type":"Product page","source_url":"https://www.leybold.com/en-us/products/vacuum-pumps/industrial-dry-vacuum-pumps","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000733","legacy_id":"S0733","entity_type":"source","title":"Wet scrubber system | Kanken Techno Co., Ltd","publisher":"Kanken Techno","source_type":"Product page","source_url":"https://www.kanken-techno.co.jp/about/products-details06.html?lang=en","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000734","legacy_id":"S0734","entity_type":"source","title":"Mirapro (chillers page)","publisher":"Mirapro","source_type":"Company website","source_url":"https://www.mirapro.co.jp/en/?p=642","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000735","legacy_id":"S0735","entity_type":"source","title":"Vapour HF etcher memsstar Orbis Alpha (University of Alberta nanoFAB)","publisher":"University of Alberta","source_type":"Academic / research facility page","source_url":"https://www.nanofab.ualberta.ca/capabilities/our-equipment/vapour-hf-etcher-memsstar-orbis-alpha/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000736","legacy_id":"S0736","entity_type":"source","title":"memsstar (Notre Dame Nanofabrication Facility equipment page)","publisher":"University of Notre Dame","source_type":"Academic / research facility page","source_url":"https://www3.nd.edu/~ndnf/facilities/equipment/equip.memsstar.html","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000737","legacy_id":"S0737","entity_type":"source","title":"The Role of Inspection and Metrology in the Future of Advanced Packaging - UnitySC","publisher":"UnitySC","source_type":"Company website","source_url":"https://unity-sc.com/role-inspection-metrology-future-advanced-packaging/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000738","legacy_id":"S0738","entity_type":"source","title":"Kateeva announced OLED inkjet printing equipment - Kateeva","publisher":"Kateeva","source_type":"Press release (company)","source_url":"https://kateeva.com/kateeva-announced-oled-inkjet-printing-equipment/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000739","legacy_id":"S0739","entity_type":"source","title":"Heavy Wire Bonder Bondjet BJ955/959","publisher":"Hesse Mechatronics","source_type":"Product page","source_url":"https://www.hesse-mechatronics.com/en/heavy-wire-bonder-x/bj955-959/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000740","legacy_id":"S0740","entity_type":"source","title":"Bondjet BJ855/BJ885 – Hesse GmbH","publisher":"Hesse Mechatronics","source_type":"Product page","source_url":"https://www.hesse-mechatronics.com/en/bondjet-bj855-bj885/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000741","legacy_id":"S0741","entity_type":"source","title":"Bondjet BJ931 – Hesse GmbH","publisher":"Hesse Mechatronics","source_type":"Product page","source_url":"https://www.hesse-mechatronics.com/en/bondjet-bj931/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000742","legacy_id":"S0742","entity_type":"source","title":"Model 7700D Series, Ball-Wedge Wire Bonders, Manual XYZ","publisher":"West-Bond","source_type":"Brochure / datasheet","source_url":"https://westbond.com/wp-content/uploads/2022/05/7700dspc.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000743","legacy_id":"S0743","entity_type":"source","title":"Specifications: Models 747630E Series, Wedge-Wedge ...","publisher":"West-Bond","source_type":"Brochure / datasheet","source_url":"https://westbond.com/wp-content/uploads/2023/09/747630E-Specifications.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000744","legacy_id":"S0744","entity_type":"source","title":"Model 7KF / 7KFH Series: Manual XYZ, Wedge-...","publisher":"West-Bond","source_type":"Brochure / datasheet","source_url":"https://westbond.com/wp-content/uploads/2022/05/7KF_specs.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000745","legacy_id":"S0745","entity_type":"source","title":"HB16 - Semi Automatic Wire Bonder","publisher":"TPT Wire Bonder","source_type":"Product page","source_url":"https://www.tpt-wirebonder.com/hb16/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000746","legacy_id":"S0746","entity_type":"source","title":"HB100 - Automatic Wire Bonder","publisher":"TPT Wire Bonder","source_type":"Product page","source_url":"https://www.tpt-wirebonder.com/hb100/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000747","legacy_id":"S0747","entity_type":"source","title":"HB05 - Manual Wire Bonder","publisher":"TPT Wire Bonder","source_type":"Product page","source_url":"https://www.tpt-wirebonder.com/hb05/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000748","legacy_id":"S0748","entity_type":"source","title":"DS Merlin","publisher":"Mühlbauer","source_type":"Product page","source_url":"https://www.muehlbauer.de/products/semiconductor-related-products/die-sorting/production-equipment/ds-merlin/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000749","legacy_id":"S0749","entity_type":"source","title":"DS Albatross","publisher":"Mühlbauer","source_type":"Product page","source_url":"https://www.muehlbauer.de/products/semiconductor-related-products/die-sorting/production-equipment/ds-albatross/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000750","legacy_id":"S0750","entity_type":"source","title":"Product ADAT3 XF DBSG - ITEC","publisher":"ITEC","source_type":"Product page","source_url":"https://www.itecequipment.com/product-adat3-xf-dbsg","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000751","legacy_id":"S0751","entity_type":"source","title":"Reel-to-reel eutectic die bonder // ITEC","publisher":"ITEC","source_type":"Product page","source_url":"https://www.itecequipment.com/product-adat3-xf-dbre","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000752","legacy_id":"S0752","entity_type":"source","title":"In-line strip die bonder // ITEC","publisher":"ITEC","source_type":"Product page","source_url":"https://www.itecequipment.com/product-adat3-xf-dbs","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000753","legacy_id":"S0753","entity_type":"source","title":"ADAT3XF DS - DIE SORTER (IN-LINE) DIE BONDER / DIE SORTER DIE ATTACH","publisher":"ITEC","source_type":"Brochure / datasheet","source_url":"https://www.itecequipment.com/dam/jcr:cf77b20e-5394-4091-afc9-fff474e46803/2023-%E2%80%93-ITEC-%E2%80%93-Datasheet-%E2%80%93-ADAT3XF-DS-%E2%80%93-WEB.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000754","legacy_id":"S0754","entity_type":"source","title":"Flip-chip die bonder // ITEC","publisher":"ITEC","source_type":"Product page","source_url":"https://www.itecequipment.com/solutions/die-attach/die-bond-die-sorter/flip-chip-die-bonder","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000755","legacy_id":"S0755","entity_type":"source","title":"Unistar Inline and Unistar Auto series | Boschman","publisher":"Boschman Technologies","source_type":"Product page","source_url":"https://www.boschman.nl/unistar-inline-and-unistar-auto-series/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000756","legacy_id":"S0756","entity_type":"source","title":"Sinterstar Mini | Boschman","publisher":"Boschman Technologies","source_type":"Product page","source_url":"https://www.boschman.nl/sinterstar-mini/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000757","legacy_id":"S0757","entity_type":"source","title":"iTS launches ATS-Series ThermoStream® Temperature Forcing Systems","publisher":"inTEST Corporation","source_type":"Press release (company)","source_url":"https://www.intestthermal.com/blog/its-launches-ats-series-thermostream-temperature-forcing-systems","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000758","legacy_id":"S0758","entity_type":"source","title":"Tropel® FlatMaster® Wafer Flatness Analysis System","publisher":"Corning (Tropel)","source_type":"Brochure / datasheet","source_url":"https://www.corning.com/media/worldwide/csm/documents/FlatMaster_Wafer_Flatness_Analysis.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000759","legacy_id":"S0759","entity_type":"source","title":"FlatMaster MSP Wafer Surface PI Sheet","publisher":"Corning (Tropel)","source_type":"Brochure / datasheet","source_url":"https://www.corning.com/media/worldwide/csm/documents/FlatMaster_MSP_Wafer_Surface_PI_Sheet.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000760","legacy_id":"S0760","entity_type":"source","title":"NeoDry E Series | Kashiyama Industries, Ltd.","publisher":"Kashiyama Industries","source_type":"Product page","source_url":"https://www.kashiyama.com/en/pumps/product/neodry/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000761","legacy_id":"S0761","entity_type":"source","title":"NeoDry G Series | Kashiyama Industries, Ltd.","publisher":"Kashiyama Industries","source_type":"Product page","source_url":"https://www.kashiyama.com/en/pumps/product/neodry-g/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000762","legacy_id":"S0762","entity_type":"source","title":"DRYVAC - Dry screw vacuum pumps Leybold","publisher":"Leybold","source_type":"Product page","source_url":"https://www.leybold.com/en-us/products/vacuum-pumps/industrial-dry-vacuum-pumps/dryvac","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000763","legacy_id":"S0763","entity_type":"source","title":"UNITYSC RECEIVES MULTIPLE ORDERS FOR WAFER THINNING INSPECTION SYSTEMS - UnitySC","publisher":"UnitySC","source_type":"Press release (company)","source_url":"https://unity-sc.com/unitysc-receives-multiple-orders-wafer-thinning-inspection-systems/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000764","legacy_id":"S0764","entity_type":"source","title":"Kateeva Introduces YIELDjet™— an Inkjet Printing Manufacturing Equipment Solution for Mass Producing Flexible and Large-Size OLEDs","publisher":"Kateeva","source_type":"Press release (company)","source_url":"https://kateeva.com/http-kateeva-pixelsmith-co-press_release-kateeva-introduces-yieldjet-an-inkjet-printing-manufacturing-equipment-solution-for-mass-producing-flexible-and-large-size-oleds/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000765","legacy_id":"S0765","entity_type":"source","title":"Kateeva Introduces The YIELDjet™ Flex—A Manufacturing Equipment Solution to Mass Produce Innovative OLED Displays","publisher":"Kateeva","source_type":"Press release (company)","source_url":"https://kateeva.com/http-kateeva-pixelsmith-co-press_release-kateeva-introduces-the-yieldjet-flex-a-manufacturing-equipment-solution-to-mass-produce-innovative-oled-displays-tor-curved-and-flexible-consumer-electronics/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-4","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000766","legacy_id":"S0766","entity_type":"source","title":"Double-Sided Processing - Peter Wolters","publisher":"Lapmaster Wolters","source_type":"Company website","source_url":"https://www.peter-wolters.com/machines/double-sided-processing","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000767","legacy_id":"S0767","entity_type":"source","title":"Lapmaster Wolters GmbH (SEMI member directory)","publisher":"SEMI","source_type":"Trade association directory","source_url":"https://www.semi.org/en/resources/member-directory/lapmaster-wolters-gmbh","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000768","legacy_id":"S0768","entity_type":"source","title":"Precision Equipment and Cutting Tools for Processing | Logitech","publisher":"Logitech","source_type":"Company website","source_url":"https://logitech.uk.com/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000769","legacy_id":"S0769","entity_type":"source","title":"Products – TESEC (株式会社テセック)","publisher":"TESEC","source_type":"Company website","source_url":"https://www.tesec.co.jp/products_en/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000770","legacy_id":"S0770","entity_type":"source","title":"Tesec Corporation (SEMI member directory)","publisher":"SEMI","source_type":"Trade association directory","source_url":"https://www.semi.org/en/resources/member-directory/tesec-corporation-0","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000771","legacy_id":"S0771","entity_type":"source","title":"Products・Service｜MICRONICS JAPAN CO.,LTD.","publisher":"MICRONICS JAPAN","source_type":"Product page","source_url":"https://www.mjc.co.jp/en/products_service/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000772","legacy_id":"S0772","entity_type":"source","title":"Probe Cards - 日本電子材料株式会社","publisher":"Japan Electronic Materials","source_type":"Product page","source_url":"https://www.jem-net.co.jp/en/products/probe","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000773","legacy_id":"S0773","entity_type":"source","title":"UIGREEN Co., Ltd (SEMI member directory)","publisher":"SEMI","source_type":"Trade association directory","source_url":"https://www.semi.org/en/resources/member-directory/uigreen-co-ltd","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000774","legacy_id":"S0774","entity_type":"source","title":"Mass Flow Controller & Module - Semiconductor Products | HORIBA","publisher":"HORIBA","source_type":"Product page","source_url":"https://www.horiba.com/int/semiconductor/products/mass-flow-controller-and-module/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000775","legacy_id":"S0775","entity_type":"source","title":"Business Activities｜About Fujikin","publisher":"Fujikin","source_type":"Company website","source_url":"https://www.fujikin.co.jp/en/company/business.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000776","legacy_id":"S0776","entity_type":"source","title":"Company - IMS Nanofabrication GmbH","publisher":"IMS Nanofabrication","source_type":"Company website","source_url":"https://www.ims.co.at/en/company/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000777","legacy_id":"S0777","entity_type":"source","title":"Multi-Beam Market Heats Up","publisher":"Semiconductor Engineering","source_type":"Industry news","source_url":"https://semiengineering.com/multi-beam-market-heats-up","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000778","legacy_id":"S0778","entity_type":"source","title":"Micro LEDforum 2018 - Uniqarta Uses Laser to Speed Up Micro LED Transfer","publisher":"LEDinside","source_type":"Industry news","source_url":"https://www.ledinside.com/node/view/29478","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2018","evidence_date":"2018","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"VERY_STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000779","legacy_id":"S0779","entity_type":"source","title":"SUMCO USA — sales products","publisher":"SUMCO","source_type":"Product page","source_url":"https://www.sumcousa.com/sales_products.htm","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000780","legacy_id":"S0780","entity_type":"source","title":"Siltronic AG (SEMI member directory)","publisher":"SEMI","source_type":"Trade association directory","source_url":"https://www.semi.org/en/resources/member-directory/siltronic-ag","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000781","legacy_id":"S0781","entity_type":"source","title":"SK siltron (SK Group company page)","publisher":"SK Group","source_type":"Company website","source_url":"https://eng.sk.com/companies/info/sk-siltron","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000782","legacy_id":"S0782","entity_type":"source","title":"SK siltron Inc (SEMI member directory)","publisher":"SEMI","source_type":"Trade association directory","source_url":"https://www.semi.org/en/resources/member-directory/sk-siltron-inc","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000783","legacy_id":"S0783","entity_type":"source","title":"Semiconductor materials — CMP (fujifilm.com; page title not returned by search)","publisher":"FUJIFILM","source_type":"Product page","source_url":"https://www.fujifilm.com/be/en/business/semiconductor-materials/cmp","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000784","legacy_id":"S0784","entity_type":"source","title":"Entegris receives large order for FOUPS from major Asian manufacturer","publisher":"Semiconductor Digest","source_type":"Industry news","source_url":"https://sst.semiconductor-digest.com/?p=40181","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000785","legacy_id":"S0785","entity_type":"source","title":"Home: Lapmaster Wolters (AC microLine 2000-F page)","publisher":"Lapmaster Wolters","source_type":"Product page","source_url":"https://www.peter-wolters.com/machine/ac-microline-2000-f","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000786","legacy_id":"S0786","entity_type":"source","title":"Peter Wolters AC microLine ® 1200-F Eco","publisher":"Lapmaster Wolters","source_type":"Product page","source_url":"https://www.peter-wolters.com/machine/ac-microline-1200-f-eco","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000787","legacy_id":"S0787","entity_type":"source","title":"Peter Wolters AC microLine® 880-F","publisher":"Lapmaster Wolters","source_type":"Product page","source_url":"https://www.peter-wolters.com/machine/ac-microline-880-f","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000788","legacy_id":"S0788","entity_type":"source","title":"AC microLine® 700 - Peter Wolters","publisher":"Lapmaster Wolters","source_type":"Product page","source_url":"http://www.peter-wolters.com/machines/double-sided-processing/ac-microline-700","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000789","legacy_id":"S0789","entity_type":"source","title":"AC microLine ® 400-D","publisher":"Lapmaster Wolters","source_type":"Product page","source_url":"https://www.peter-wolters.com/machine/ac-microline-400-d","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000790","legacy_id":"S0790","entity_type":"source","title":"PM6 Precision Lapping & Polishing System - Logitech","publisher":"Logitech","source_type":"Product page","source_url":"https://logitech.uk.com/product/pm6-precision-lapping-polishing-system/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000791","legacy_id":"S0791","entity_type":"source","title":"CMP Tribo System - Advanced CMP | Logitech","publisher":"Logitech","source_type":"Product page","source_url":"https://logitech.uk.com/product/tribo-cmp-system/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000792","legacy_id":"S0792","entity_type":"source","title":"CMP Orbis System for Precision R&D & Pilot Production | Logitech","publisher":"Logitech","source_type":"Product page","source_url":"https://logitech.uk.com/product/orbis-standing-cmp-system","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000793","legacy_id":"S0793","entity_type":"source","title":"Products - 5170-IH","publisher":"TESEC Corporation","source_type":"Product page","source_url":"https://www.tesec.co.jp/products_en/5170-ih/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000794","legacy_id":"S0794","entity_type":"source","title":"Products - 431-TT","publisher":"TESEC Corporation","source_type":"Product page","source_url":"https://www.tesec.co.jp/products_en/431-tt/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000795","legacy_id":"S0795","entity_type":"source","title":"4324-KT – 株式会社テセック","publisher":"TESEC Corporation","source_type":"Product page","source_url":"https://www.tesec.co.jp/products_en/4324-kt-4334-kt/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000796","legacy_id":"S0796","entity_type":"source","title":"Probe Card｜Products・Service｜MICRONICS JAPAN CO.,LTD.","publisher":"MICRONICS JAPAN","source_type":"Product page","source_url":"https://www.mjc.co.jp/en/products_service/probecard/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000797","legacy_id":"S0797","entity_type":"source","title":"Wafer Prober｜Products・Service｜MICRONICS JAPAN CO.,LTD.","publisher":"MICRONICS JAPAN","source_type":"Product page","source_url":"https://www.mjc.co.jp/en/products_service/wafer_prober/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000798","legacy_id":"S0798","entity_type":"source","title":"Release of the DZ-107 Ultra-thin Mass Flow Controller - HORIBA","publisher":"HORIBA (HORIBA STEC)","source_type":"Press release (company)","source_url":"https://www.horiba.com/int/company/news/detail/news/1/2025/20250114dz/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000799","legacy_id":"S0799","entity_type":"source","title":"Digital Mass Flow Controller SEC-N100 Series - HORIBA","publisher":"HORIBA (HORIBA STEC)","source_type":"Product page","source_url":"https://www.horiba.com/usa/semiconductor/products/detail/action/show/Product/sec-n100-series-1-656/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000800","legacy_id":"S0800","entity_type":"source","title":"S600 Series Digital Mass Flow Controller - HORIBA","publisher":"HORIBA (HORIBA STEC)","source_type":"Product page","source_url":"https://www.horiba.com/ind/semiconductor/products/detail/action/show/Product/6316/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000801","legacy_id":"S0801","entity_type":"source","title":"Mass Flow Controllers SEC-E Series - HORIBA","publisher":"HORIBA (HORIBA STEC)","source_type":"Product page","source_url":"https://www.horiba.com/int/semiconductor/products/detail/action/show/Product/sec-e-series-724/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000802","legacy_id":"S0802","entity_type":"source","title":"Stable integrated ultra-pure gas supply system for semiconductor manufacturing｜Monodzukuri Nippon Grand Award Awarded Products｜Fujikin Incorporated","publisher":"Fujikin","source_type":"Product page","source_url":"https://www.fujikin.co.jp/en/support/mono-japan/igs.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000803","legacy_id":"S0803","entity_type":"source","title":"EB Mask Writer EBM-9500 | Product Information | NuFlare Technology, Inc.","publisher":"NuFlare Technology","source_type":"Product page","source_url":"https://www.nuflare.co.jp/english/products/beam/ebm_9500/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000804","legacy_id":"S0804","entity_type":"source","title":"Variable EB Mask Writer EBM-8000P/H・EBM-8000P/M | Product Information | NuFlare Technology, Inc.","publisher":"NuFlare Technology","source_type":"Product page","source_url":"https://www.nuflare.co.jp/english/products/beam/ebm_8000p/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000805","legacy_id":"S0805","entity_type":"source","title":"Multi-EB Mask Writer MBM™-2000 | Product Information | NuFlare Technology, Inc.","publisher":"NuFlare Technology","source_type":"Product page","source_url":"https://www.nuflare.co.jp/english/products/beam/mbm_2000/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000806","legacy_id":"S0806","entity_type":"source","title":"2016 | Invited Paper: MBMW-101: World's 1st High-Throughput Multi-Beam Mask Writer","publisher":"IMS Nanofabrication","source_type":"Conference paper (company site)","source_url":"https://www.ims.co.at/en/invited-paper-mbmw-101-worlds-1st-high-throughput-multi-beam-mask-writer/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2016","evidence_date":"2016","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"VERY_STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000807","legacy_id":"S0807","entity_type":"source","title":"microCETI™ MANUFACTURING SYSTEM FOR COST-EFFECTIVE μLED TRANSFER","publisher":"3D-Micromac","source_type":"Brochure / datasheet","source_url":"https://3d-micromac.com/wp-content/uploads/2022/04/3D-Micromac_microCETI_Flyer_2022_EN.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2022-04","evidence_date":"2022-04","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000808","legacy_id":"S0808","entity_type":"source","title":"Embracing the “Year of Micro LED Mass Production”, ASMPT Unveils New Laser Mass Transfer Equipment","publisher":"LEDinside","source_type":"Industry news","source_url":"https://www.ledinside.com/node/view/33358","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-5","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000809","legacy_id":"S0809","entity_type":"source","title":"Fully automatic dispensing machine | Musashi Engineering, Inc.","publisher":"Musashi Engineering","source_type":"Product page","source_url":"https://en.musashi-engineering.co.jp/products/full-automatic-dispensing-machine","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000810","legacy_id":"S0810","entity_type":"source","title":"Microdispensing Technology | VERMES Microdispensing GmbH - VERMES","publisher":"VERMES","source_type":"Company website","source_url":"https://www.vermes.com/company/about-us","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000811","legacy_id":"S0811","entity_type":"source","title":"F & K Delvotec: Company - Strama Group","publisher":"F&K Delvotec","source_type":"Company website","source_url":"https://www.fkdelvotec.com/en/company","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000812","legacy_id":"S0812","entity_type":"source","title":"Die Bonding Technology Overview | HYBOND, Inc.","publisher":"HYBOND","source_type":"Product page","source_url":"https://hybond.com/die-bonders/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000813","legacy_id":"S0813","entity_type":"source","title":"300mm EFEM | SINFONIA TECHNOLOGY","publisher":"SINFONIA TECHNOLOGY","source_type":"Product page","source_url":"https://www.sinfo-t.jp/eng/semicon/efem.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000814","legacy_id":"S0814","entity_type":"source","title":"Wafer Transfer Robots | Industrial Robots by Kawasaki Robotics","publisher":"Kawasaki Robotics","source_type":"Product page","source_url":"https://kawasakirobotics.com/robots-category/wafer/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000815","legacy_id":"S0815","entity_type":"source","title":"Akrion Systems (SEMI ECS directory)","publisher":"SEMI","source_type":"Trade association directory","source_url":"https://www.semi.org/en/resources/ecs-directory/akrion-systems","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000816","legacy_id":"S0816","entity_type":"source","title":"Etch Platform - Trion Technology","publisher":"Trion Technology","source_type":"Product page","source_url":"https://triontech.com/etch-platform/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000817","legacy_id":"S0817","entity_type":"source","title":"Particle Measuring Systems Inc (SEMI member directory)","publisher":"SEMI","source_type":"Trade association directory","source_url":"https://www.semi.org/en/resources/member-directory/particle-measuring-systems-inc","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000818","legacy_id":"S0818","entity_type":"source","title":"Lighthouse Worldwide Solutions (SEMI member directory)","publisher":"SEMI","source_type":"Trade association directory","source_url":"https://www.semi.org/en/resources/member-directory/lighthouse-worldwide-solutions","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000819","legacy_id":"S0819","entity_type":"source","title":"About Lighthouse","publisher":"Lighthouse","source_type":"Company website","source_url":"https://www.golighthouse.com/en/?p=3614","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000820","legacy_id":"S0820","entity_type":"source","title":"Brewer Science unveils Apogee temporary wafer bonder","publisher":"Semiconductor Digest","source_type":"Industry news","source_url":"https://sst.semiconductor-digest.com/?p=60035","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000821","legacy_id":"S0821","entity_type":"source","title":"Wafer-Level Packaging Category (Brewer Science)","publisher":"Brewer Science","source_type":"Company website","source_url":"https://cn.brewerscience.com/product-categories/wafer-level-packaging","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000822","legacy_id":"S0822","entity_type":"source","title":"Fully automatic compact dispensing machine SMART ROBO TAD1000 | Musashi Engineering, Inc.","publisher":"Musashi Engineering","source_type":"Product page","source_url":"https://en.musashi-engineering.co.jp/products/full-automatic-dispensing-machine/semiconductor/TAD1000","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000823","legacy_id":"S0823","entity_type":"source","title":"Fully automatic high-end dispense machine FAD5700 | Musashi Engineering, Inc.","publisher":"Musashi Engineering","source_type":"Product page","source_url":"https://en.musashi-engineering.co.jp/products/full-automatic-dispensing-machine/semiconductor/FAD5700","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000824","legacy_id":"S0824","entity_type":"source","title":"MDS 3280 Microdispensing System | VERMES Piezo System","publisher":"VERMES Microdispensing","source_type":"Product page","source_url":"https://www.vermes.com/products/piezo/mds-3280","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000825","legacy_id":"S0825","entity_type":"source","title":"F & K Delvotec: M17S: Fully automatic wire bonder with one bond head - Strama Group","publisher":"F&K Delvotec","source_type":"Product page","source_url":"https://www.fkdelvotec.com/en/machines/ultrasonic-wire-bonder/m17s-fully-automatic-wire-bonder-with-one-bond-head","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000826","legacy_id":"S0826","entity_type":"source","title":"F & K Delvotec: M17D: Fully automatic wire bonder with two bond heads - Strama Group","publisher":"F&K Delvotec","source_type":"Product page","source_url":"https://www.fkdelvotec.com/en/machines/ultrasonic-wire-bonder/m17d-fully-automatic-wire-bonder-with-two-bond-heads","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000827","legacy_id":"S0827","entity_type":"source","title":"F & K Delvotec: M17XL: Fully automatic wire bonder with largest working range - Strama Group","publisher":"F&K Delvotec","source_type":"Product page","source_url":"https://www.fkdelvotec.com/en/machines/ultrasonic-wire-bonder/m17xl-fully-automatic-wire-bonder-with-largest-working-range","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000828","legacy_id":"S0828","entity_type":"source","title":"Ball-Wedge Bonder G5 62000 NOT JUST MACHINES. BUT BONDING SOLUTIONS.","publisher":"F&K Delvotec","source_type":"Brochure / datasheet","source_url":"https://www.fkdelvotec.com/fileadmin/f_k_delvotec/Broschueren/F___K_Produktbroschuere_Ball_Wedge_Bonder_englisch.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000829","legacy_id":"S0829","entity_type":"source","title":"F & K Delvotec: M17LSB XL: Combination of laser welding and wire bonding - Strama Group","publisher":"F&K Delvotec","source_type":"Product page","source_url":"https://www.fkdelvotec.com/en/machines/laser-bonder/m17lsb-xl-combination-of-laser-welding-and-wire-bonding","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000830","legacy_id":"S0830","entity_type":"source","title":"EDB-141 Epoxy and Silver-Glass Die Bonder | HYBOND, Inc.","publisher":"HYBOND","source_type":"Product page","source_url":"https://hybond.com/edb-141-epoxy-silver-glass-die-bonder/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000831","legacy_id":"S0831","entity_type":"source","title":"EDB-140B Epoxy and Silver-Glass Die Bonder | HYBOND, Inc.","publisher":"HYBOND","source_type":"Product page","source_url":"https://hybond.com/edb-140b-epoxy-silver-glass-die-bonder/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000832","legacy_id":"S0832","entity_type":"source","title":"HY-PULSE 900C Fluxless Eutectic Solder Station | HYBOND, Inc.","publisher":"HYBOND","source_type":"Product page","source_url":"https://hybond.com/hy-pulse-900c-fluxless-eutectic-solder-station/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000833","legacy_id":"S0833","entity_type":"source","title":"SINFONIA TECHNOLOGY CO., LTD. : 300mm FOUP LOADER MODULE [3LP EFEM]","publisher":"SINFONIA TECHNOLOGY","source_type":"Product page","source_url":"https://www.sinfo-t.jp/eng/semicon/3lp-efem.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000834","legacy_id":"S0834","entity_type":"source","title":"SINFONIA TECHNOLOGY CO., LTD. : 300mm FOUP LOADER MODULE [2LP EFEM]","publisher":"SINFONIA TECHNOLOGY","source_type":"Product page","source_url":"https://hibiki.sinfo-t.jp/eng/semicon/2lp-efem.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000835","legacy_id":"S0835","entity_type":"source","title":"300mm FOUP Load Port | SINFONIA TECHNOLOGY","publisher":"SINFONIA TECHNOLOGY","source_type":"Product page","source_url":"https://www.sinfo-t.jp/eng/semicon/selop8.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000836","legacy_id":"S0836","entity_type":"source","title":"200mm SMIF Load Port | SINFONIA TECHNOLOGY","publisher":"SINFONIA TECHNOLOGY","source_type":"Product page","source_url":"https://hibiki.sinfo-t.jp/eng/semicon/smif.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000837","legacy_id":"S0837","entity_type":"source","title":"akrion gama (moov.co marketplace listing)","publisher":"moov.co","source_type":"Directory / marketplace listing","source_url":"https://moov.co/marketplace/wet-stations/akrion/akrion-gama","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000838","legacy_id":"S0838","entity_type":"source","title":"Minilock - Phantom RIE ICP - Trion Technology","publisher":"Trion Technology","source_type":"Product page","source_url":"https://triontech.com/etch-platform/minilock-icp/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000839","legacy_id":"S0839","entity_type":"source","title":"Minilock - Phantom RIE - Trion Technology","publisher":"Trion Technology","source_type":"Product page","source_url":"https://triontech.com/etch-platform/minilock-rie/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000840","legacy_id":"S0840","entity_type":"source","title":"Minilock - Phantom DRIE - Trion Technology","publisher":"Trion Technology","source_type":"Product page","source_url":"https://triontech.com/etch-platform/minilock-drie/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000841","legacy_id":"S0841","entity_type":"source","title":"Apollo Stripper - Trion Technology","publisher":"Trion Technology","source_type":"Product page","source_url":"https://triontech.com/plasma-ashing/apollo/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000842","legacy_id":"S0842","entity_type":"source","title":"NEXAR LIDE: TGV & Glass Processing for R&D | LPKF","publisher":"LPKF Laser & Electronics","source_type":"Product page","source_url":"https://lide.lpkf.com/en/systems/nexar-lide","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000843","legacy_id":"S0843","entity_type":"source","title":"Products - Microelectronics (Panasonic Connect)","publisher":"Panasonic Connect (plasma dicing)","source_type":"Product page","source_url":"https://ap.connect.panasonic.com/my/en/products/microelectronics","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000844","legacy_id":"S0844","entity_type":"source","title":"Kulicke & Soffa Introduces the APAMA C2W – Chip to Wafer Thermo Compression Bonder","publisher":"businesswire.com","source_type":"Press release (company, wire)","source_url":"https://www.businesswire.com/news/home/20150901005170/en/Kulicke-Soffa-Introduces-the-APAMA-C2W-%E2%80%93-Chip-to-Wafer-Thermo-Compression-Bonder","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2015-09-01","evidence_date":"2015-09-01","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"VERY_STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000845","legacy_id":"S0845","entity_type":"source","title":"Semes, Mass Production of Next-Generation TC Bonder for HBM","publisher":"view.asiae.co.kr","source_type":"Industry news","source_url":"https://view.asiae.co.kr/en/article/2024060313461781042","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":"2024-06","evidence_date":"2024-06","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-6","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000846","legacy_id":"S0846","entity_type":"source","title":"Keteca Singapore Pte (SEMI member directory)","publisher":"SEMI","source_type":"Trade association directory","source_url":"https://www.semi.org/en/resources/member-directory/keteca-singapore-pte","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-7","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000847","legacy_id":"S0847","entity_type":"source","title":"Manufacturing Integration Technology Ltd (supplier directory)","publisher":"Plant Automation Technology","source_type":"Supplier directory","source_url":"https://www.plantautomation-technology.com/suppliers/manufacturing-integration-technology-ltd","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-7","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000848","legacy_id":"S0848","entity_type":"source","title":"SRM Integration (Malaysia) Sdn Bhd (InvestPenang)","publisher":"InvestPenang","source_type":"Government / investment-promotion agency","source_url":"https://investpenang.gov.my/srm-integration-malaysia-sdn-bhd/","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-7","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000849","legacy_id":"S0849","entity_type":"source","title":"Micro Modular System Sdn Bhd (SEMI member directory)","publisher":"SEMI","source_type":"Trade association directory","source_url":"https://www.semi.org/en/resources/member-directory/micro-modular-system-sdn-bhd","internal":false,"tier":2,"tier_label":"Tier 2 · Industry publication / association","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-7","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000850","legacy_id":"S0850","entity_type":"source","title":"IIT Delhi Spinout DeepLase Raises INR 6 Crore Seed Round Co-led by MGF Kavachh and Yali Capital","publisher":"GoPhotonics","source_type":"Industry news","source_url":"https://www.gophotonics.com/news/details/8752-iit-delhi-spinout-deeplase-raises-inr-6-crore-seed-round-co-led-by-mgf-kavachh-and-yali-capital","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-7","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000851","legacy_id":"S0851","entity_type":"source","title":"DeepLASE Technologies (YourStory company profile)","publisher":"YourStory","source_type":"Supplier directory","source_url":"https://yourstory.com/companies/deeplase-technologies","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-7","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000852","legacy_id":"S0852","entity_type":"source","title":"Suresh Indu Lasers Pvt. Ltd. (Photonics Buyers' Guide)","publisher":"Photonics.com","source_type":"Supplier directory","source_url":"https://www.photonics.com/Buyers-Guide/Suresh-Indu-Lasers-Pvt-Ltd/c28424","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-7","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000853","legacy_id":"S0853","entity_type":"source","title":"Markets & Solutions / Machine Vision / Semiconductor (Teledyne Vision Solutions)","publisher":"Teledyne","source_type":"Company website","source_url":"https://teledynevisionsolutions.com/solutions/machine-vision/semiconductors","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-7","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000854","legacy_id":"S0854","entity_type":"source","title":"Sputtering System｜Products｜ULVAC, Inc.","publisher":"ULVAC","source_type":"Product page","source_url":"https://www.ulvac.co.jp/en/products/sputtering_system/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-8","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000855","legacy_id":"S0855","entity_type":"source","title":"Equipment | CANON ANELVA CORPORATION","publisher":"CANON ANELVA","source_type":"Product page","source_url":"https://anelva.canon/en/business/equipment/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-8","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000856","legacy_id":"S0856","entity_type":"source","title":"Vacuum coating systems from the technology leader: VA","publisher":"VON ARDENNE","source_type":"Company website","source_url":"https://vonardenne.biz/en/microsites/vana","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-8","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000857","legacy_id":"S0857","entity_type":"source","title":"SCHMID Group Expands Advanced Packaging Portfolio to Power the AI Era | SCHMID Group","publisher":"SCHMID Group","source_type":"Press release (company)","source_url":"https://schmid-group.com/schmid-group-expands-advanced-packaging-portfolio-to-power-the-ai-era/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-8","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000858","legacy_id":"S0858","entity_type":"source","title":"Ion Implanter (Nissin)","publisher":"Nissin","source_type":"Product page","source_url":"https://nissin.jp/e/product/i_i/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-8","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000859","legacy_id":"S0859","entity_type":"source","title":"Markets - Corporate: Semiconductor (Ferrotec)","publisher":"Ferrotec","source_type":"Company website","source_url":"https://ferrotec.com/markets/semiconductor","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-8","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000860","legacy_id":"S0860","entity_type":"source","title":"Linear Motors | HIWIN","publisher":"HIWIN","source_type":"Product page","source_url":"https://hiwin.com/products/linear-motor-stages/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-8","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000861","legacy_id":"S0861","entity_type":"source","title":"Versatile Measurement solutions to empower and accelerate your R&D progress (Freiberg Instruments)","publisher":"Freiberg Instruments","source_type":"Company website","source_url":"https://www.freiberginstruments.com/solutions/research-and-development","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-8","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000862","legacy_id":"S0862","entity_type":"source","title":"Model：ENTRON-EX W300｜Sputtering System｜Products｜ULVAC, Inc.","publisher":"ULVAC","source_type":"Product page","source_url":"https://www.ulvac.co.jp/en/products/sputtering_system/entrontm_ex_w300/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-8","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000863","legacy_id":"S0863","entity_type":"source","title":"Model： SME｜Sputtering System｜Products｜ULVAC, Inc.","publisher":"ULVAC","source_type":"Product page","source_url":"https://www.ulvac.co.jp/en/products/sputtering_system/sme/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-8","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000864","legacy_id":"S0864","entity_type":"source","title":"entron-exx (ULVAC PVD page)","publisher":"ULVAC","source_type":"Product page","source_url":"https://www.ulvac.com/systems/PVD/PVD300mm/ENTRON-EXX-Sputtering-System","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-8","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000865","legacy_id":"S0865","entity_type":"source","title":"PVD Equipment for Semiconductor (φ300mm support) EC7800 | CANON ANELVA CORPORATION","publisher":"CANON ANELVA","source_type":"Product page","source_url":"https://anelva.canon/en/business/equipment/se_detail05.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-8","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000866","legacy_id":"S0866","entity_type":"source","title":"Sputtering Equipment HC7100 | CANON ANELVA CORPORATION","publisher":"CANON ANELVA","source_type":"Product page","source_url":"https://anelva.canon/en/business/equipment/st_detail02.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-8","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000867","legacy_id":"S0867","entity_type":"source","title":"Sputtering Equipment NC7900 | CANON ANELVA CORPORATION","publisher":"CANON ANELVA","source_type":"Product page","source_url":"https://anelva.canon/en/business/equipment/se_detail08.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-8","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000868","legacy_id":"S0868","entity_type":"source","title":"Memory Wire PVD Mass Production Equipment IC7500 | CANON ANELVA CORPORATION","publisher":"CANON ANELVA","source_type":"Product page","source_url":"https://anelva.canon/en/business/equipment/se_detail02.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-8","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000869","legacy_id":"S0869","entity_type":"source","title":"Sputtering Equipment EC7400 | CANON ANELVA CORPORATION","publisher":"CANON ANELVA","source_type":"Product page","source_url":"https://anelva.canon/en/business/equipment/el_detail06.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-8","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000870","legacy_id":"S0870","entity_type":"source","title":"Sputtering Equipment ML3000 | CANON ANELVA CORPORATION","publisher":"CANON ANELVA","source_type":"Product page","source_url":"https://anelva.canon/en/business/equipment/st_detail01.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-8","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000871","legacy_id":"S0871","entity_type":"source","title":"Etching Equipment NC8000 | CANON ANELVA CORPORATION","publisher":"CANON ANELVA","source_type":"Product page","source_url":"https://anelva.canon/en/business/equipment/se_detail09.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-8","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000872","legacy_id":"S0872","entity_type":"source","title":"XEA|nova L Inline Coating System: VON ARDENNE","publisher":"VON ARDENNE","source_type":"Product page","source_url":"https://vonardenne.biz/en/products/product-index/detail/scala","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-8","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000873","legacy_id":"S0873","entity_type":"source","title":"SCHMID Announces Successful Delivery and Installation of its InfinityLine C+ System to a Leading Japanese Advanced Packaging Customer","publisher":"SCHMID Group","source_type":"Press release (company)","source_url":"https://schmid-group.com/schmid-announces-successful-delivery-and-installation-of-its-infinityline-c-system-to-a-leading-japanese-advanced-packaging-customer/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-8","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000874","legacy_id":"S0874","entity_type":"source","title":"SCHMID Delivers First Specialized InfinityLine H+ for Panel Level Packaging with Formats up to 700×700mm to Leading U.S. Technology Company","publisher":"SCHMID Group","source_type":"Press release (company)","source_url":"https://schmid-group.com/4724/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-8","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000875","legacy_id":"S0875","entity_type":"source","title":"-Wafer-Level IR AOI (UTECHZONE)","publisher":"UTECHZONE","source_type":"Product page","source_url":"https://www.utechzone.com.tw/en/html/product/show.php?pid=331&cid=67&cid2=103","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-8","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000876","legacy_id":"S0876","entity_type":"source","title":"-Wafer-Level Lithography AOI (UTECHZONE)","publisher":"UTECHZONE","source_type":"Product page","source_url":"https://www.utechzone.com.tw/en/html/product/show.php?pid=235&cid=67&cid2=103","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-8","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000877","legacy_id":"S0877","entity_type":"source","title":"2018 01 29 Product Sheet MDPpro","publisher":"Freiberg Instruments","source_type":"Brochure / datasheet","source_url":"https://www.freiberginstruments.com/fileadmin/Product-Sheets/2018-01-29_Product_Sheet_MDPpro.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2018-01-29","evidence_date":"2018-01-29","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"VERY_STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-8","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000878","legacy_id":"S0878","entity_type":"source","title":"2022 03 22 Product Sheet MDPlinescan","publisher":"Freiberg Instruments","source_type":"Brochure / datasheet","source_url":"https://www.freiberginstruments.com/fileadmin/Product-Sheets/2022-03-22_Product_Sheet_MDPlinescan.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2022-03-22","evidence_date":"2022-03-22","accessed_date":"2026-09-30","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-8","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000879","legacy_id":"S0879","entity_type":"source","title":"Semiconductor Manufacturing Field (TOK)","publisher":"TOK","source_type":"Product page","source_url":"https://www.tok.co.jp/eng/products/semiconductor-pre","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000880","legacy_id":"S0880","entity_type":"source","title":"Corporate Profile 2025 (TOK)","publisher":"TOK","source_type":"Brochure / datasheet","source_url":"https://www.tok.co.jp/application/files/4717/5747/6720/corporateprofile_eng.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2025","evidence_date":"2025","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"AGING","freshness":"Needs Review","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000881","legacy_id":"S0881","entity_type":"source","title":"Electronic Materials Business (JSR)","publisher":"JSR","source_type":"Product page","source_url":"https://www.jsr.co.jp/jsr_e/products/em/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000882","legacy_id":"S0882","entity_type":"source","title":"JSR Agrees to Acquire EUV Pioneer Inpria Corporation","publisher":"JSR","source_type":"Press release (company)","source_url":"https://www.jsr.co.jp/jsr_e/news/2021/20210917.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2021-09-17","evidence_date":"2021-09-17","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"VERY_STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000883","legacy_id":"S0883","entity_type":"source","title":"Photoresist (Shin-Etsu Chemical)","publisher":"Shin-Etsu Chemical","source_type":"Product page","source_url":"https://www.shinetsu.co.jp/en/products/electronics-materials/photoresist/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000884","legacy_id":"S0884","entity_type":"source","title":"DONGJIN SEMICHEM — Semiconductor business","publisher":"Dongjin Semichem","source_type":"Product page","source_url":"https://www.dongjin.com/en/business/semiconductor.php","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000885","legacy_id":"S0885","entity_type":"source","title":"Semiconductor Materials (Soulbrain)","publisher":"Soulbrain","source_type":"Product page","source_url":"https://www.soulbrain.co.kr/en/m21.php","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000886","legacy_id":"S0886","entity_type":"source","title":"Product line-up (Fujimi CMP)","publisher":"Fujimi","source_type":"Product page","source_url":"https://www.fujimiinc.co.jp/english/service/cmp/lineup.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000887","legacy_id":"S0887","entity_type":"source","title":"CMP Slurry (Resonac)","publisher":"Resonac","source_type":"Product page","source_url":"https://www.resonac.com/products/75./75","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000888","legacy_id":"S0888","entity_type":"source","title":"Manufacturing Processes and Materials Used in Advanced Semiconductor Packaging (Resonac)","publisher":"Resonac","source_type":"Company website","source_url":"https://www.resonac.com/solution/column/003.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000889","legacy_id":"S0889","entity_type":"source","title":"Leading in electronic gases — Supplying the semiconductor, solar, display and LED markets (Linde brochure)","publisher":"Linde","source_type":"Brochure / datasheet","source_url":"https://assets.linde.com/-/media/celum-connect/2023/12/21/15/11/linde20electronics20brochure185963.pdf","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2023-12","evidence_date":"2023-12","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000890","legacy_id":"S0890","entity_type":"source","title":"Linde to Invest $1 Billion to Support Major US Semiconductor Facility Expansion","publisher":"Linde","source_type":"Press release (company)","source_url":"https://www.linde.com/news-and-media/2026/linde-to-invest-$1-billion-to-support-major-u,-d-,s,-d-,-semiconductor-facility-expansion","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-07","evidence_date":"2026-07","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"CURRENT","freshness":"Recent","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000891","legacy_id":"S0891","entity_type":"source","title":"Semiconductors (Air Liquide Electronics)","publisher":"Air Liquide","source_type":"Company website","source_url":"https://electronics.airliquide.com/who-we-are/our-markets/semiconductors-0","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000892","legacy_id":"S0892","entity_type":"source","title":"Air Liquide inaugurates its first Advanced Materials manufacturing plant in Taiwan, strengthening the next-gen semiconductor supply chain","publisher":"Air Liquide","source_type":"Press release (company)","source_url":"https://www.airliquide.com/group/press-releases-news/2026-03-25/air-liquide-inaugurates-its-first-advanced-materials-manufacturing-plant-taiwan-strengthening-next","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2026-03-25","evidence_date":"2026-03-25","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"CURRENT","freshness":"Recent","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000893","legacy_id":"S0893","entity_type":"source","title":"Taiyo Nippon Sanso to Exhibit at SEMICON Japan 2024 for the First Time in 13 Years — Productivity-Enhancing Solutions for Semiconductor Manufacturing","publisher":"Taiyo Nippon Sanso","source_type":"Press release (company)","source_url":"https://www.tn-sanso.co.jp/en/news/detail.html?itemid=867&dispmid=994","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":"2024","evidence_date":"2024","accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"STALE","freshness":"Stale","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000894","legacy_id":"S0894","entity_type":"source","title":"Specialty Gases (Kanto Denka Kogyo)","publisher":"Kanto Denka Kogyo","source_type":"Product page","source_url":"https://www.kantodenka.co.jp/english/product/gas/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000895","legacy_id":"S0895","entity_type":"source","title":"Semiconductor and Electronics - Applied Energy Systems, Inc.","publisher":"Applied Energy Systems","source_type":"Company website","source_url":"https://www.appliedenergysystems.com/industries/semiconductor-and-electronics/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000896","legacy_id":"S0896","entity_type":"source","title":"Wet Etching & Cleaning Solutions (Global ZEUS)","publisher":"ZEUS","source_type":"Product page","source_url":"https://www.globalzeus.com/en/sub/products/list.asp?p_cate=1010","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000897","legacy_id":"S0897","entity_type":"source","title":"GST (Global Standard Technology)","publisher":"GST","source_type":"Company website","source_url":"https://www.gst-in.com/en/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000898","legacy_id":"S0898","entity_type":"source","title":"UNISEM - History of company","publisher":"UNISEM","source_type":"Company website","source_url":"https://unisem.co.kr/?c=110%2F119&r=en","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000899","legacy_id":"S0899","entity_type":"source","title":"Jingsheng Electromechanical - About Jingsheng","publisher":"Jingsheng","source_type":"Company website","source_url":"https://www.jsjd.cc/en/about.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000900","legacy_id":"S0900","entity_type":"source","title":"Company Overview - Mattson Technology, Inc.","publisher":"Mattson Technology","source_type":"Company website","source_url":"https://mattson.com/about-us/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000901","legacy_id":"S0901","entity_type":"source","title":"Company Overview (Hymson)","publisher":"Hymson","source_type":"Company website","source_url":"https://global.hymson.com/en/about-haimu-star?tp=1","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000902","legacy_id":"S0902","entity_type":"source","title":"Renishaw case study: Beijing U-Precision Tech (motion stages, TONiC encoders)","publisher":"Renishaw","source_type":"Vendor case study","source_url":"https://www.renishaw.com/en/--45355","internal":false,"tier":3,"tier_label":"Tier 3 · Directory, distributor, aggregator","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000903","legacy_id":"S0903","entity_type":"source","title":"Jingsheng Successfully Launches the 6-inch Double-chip Silicon Carbide Epitaxial Equipment","publisher":"Zhejiang Jingsheng Mechanical & Electrical (JSG)","source_type":"Press release (company)","source_url":"https://www.jsjd.cc/en/news_detail_185.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000904","legacy_id":"S0904","entity_type":"source","title":"The 25000th Mono Silicon Furnace Is Launched! Jingsheng Stages High-end Equipment Manufacturing Acceleration","publisher":"Zhejiang Jingsheng Mechanical & Electrical (JSG)","source_type":"Press release (company)","source_url":"https://www.jsjd.cc/EN/news_detail_180.html","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000905","legacy_id":"S0905","entity_type":"source","title":"Rapid Thermal Processing - Mattson Technology, Inc.","publisher":"Mattson Technology","source_type":"Product page","source_url":"https://mattson.com/technology/rapid-thermal-processing/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000906","legacy_id":"S0906","entity_type":"source","title":"Millisecond Anneal - Mattson Technology, Inc.","publisher":"Mattson Technology","source_type":"Product page","source_url":"https://mattson.com/technology/millisecond-anneal/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000907","legacy_id":"S0907","entity_type":"source","title":"Dry Strip - Mattson Technology, Inc.","publisher":"Mattson Technology","source_type":"Product page","source_url":"https://mattson.com/technology/dry-strip/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000908","legacy_id":"S0908","entity_type":"source","title":"Aspen® - Mattson Technology, Inc.","publisher":"Mattson Technology","source_type":"Product page","source_url":"https://mattson.com/technology/aspen/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"},{"id":"SRC-000909","legacy_id":"S0909","entity_type":"source","title":"Gas Cabinets: Centurion™ for Precise UHP Gas Delivery","publisher":"Applied Energy Systems (SEMI-GAS)","source_type":"Product page","source_url":"https://www.appliedenergysystems.com/semi-gas/centurion-gas-cabinets/","internal":false,"tier":1,"tier_label":"Tier 1 · Official (company, filing, government, datasheet)","publication_date":null,"evidence_date":null,"accessed_date":"2026-10-05","accessible":false,"access_mode":"search_index","access_note":"Official URL and title confirmed via web search; page content not read directly (capture-environment egress restriction)","age_class":"UNDATED","freshness":"Unknown","excerpt":null,"notes":"Imported batch-9","used_by":1,"verification_status":"title_via_search_index"}]}